Chip holding device, chip holding method, and manufacturing device for semiconductor device

Abstract

A chip holding device (10) is provided with: a holding tool (12) having a holding surface (18) for holding a chip (100) in a non-contact manner, and a vibration source (30) for applying ultrasonic vibration to the holding surface (18) and generating, on the holding surface (18), a holding force for holding the chip (100); a movement mechanism (40) for horizontally moving the holding surface (18) in a direction intersecting the direction of gravity; and a rocking mechanism (46) for inclining the holding surface (18) in accordance with the acceleration of the horizontal movement of the holding surface (18).

Description

Chip holding device, chip holding method, and semiconductor device manufacturing device

[0001] The present specification discloses a chip holding device that holds a chip in a non-contact manner, a chip holding method, and a semiconductor device manufacturing apparatus.

[0002] In recent years, in order to realize further miniaturization and higher density of semiconductor devices, there is a demand for chip holding devices that hold chips without contact. To meet this demand, some chip holding devices that hold semiconductor chips without contact have been proposed. This technology can prevent chip chipping and contamination.

[0003] For example, Patent Document 1 discloses a chip holding device having a chip holder that holds a chip in a non-contact manner by utilizing the ultrasonic squeeze effect. In Patent Document 1, ultrasonic vibrations are applied to the holding surface of the chip holder to form a squeeze film between the holding surface and the chip. The squeeze film exerts an ultrasonic holding force on the chip, tending to keep the chip on the surface of the squeeze film.

[0004] Japanese Patent Application Laid-Open No. 2023-045216

[0005] Such chip holding devices transport chips by moving the chip holder while holding the chip. When the chip holder moves laterally in a direction intersecting with gravity, an inertial force caused by acceleration (including negative acceleration) acts on the chip held by the chip holder. This inertial force causes the chip to temporarily shift relative to the chip holder.

[0006] Such misalignment of the chip could cause it to fall off the holding surface, and even if it did not fall off, the chip would vibrate in the plane direction for a certain period of time after movement stopped, which could cause a delay before it could proceed to the next process.

[0007] Therefore, this specification discloses a chip holding device, a chip holding method, and a semiconductor device manufacturing apparatus that hold and transport chips in a non-contact manner while suppressing positional deviation of the chips.

[0008] The chip holding device disclosed in this specification is characterized by comprising a holder having a holding surface that holds a chip non-contact, and a vibration source that applies ultrasonic vibrations to the holding surface to generate a holding force that holds the chip on the holding surface, a moving mechanism that moves the holding surface laterally in a direction intersecting the direction of gravity, and a swinging mechanism that tilts the holding surface in response to the acceleration of the lateral movement of the holding surface.

[0009] In this case, the oscillating mechanism may tilt the holding surface so that the resultant vector of the inertial force acting on the chip due to the acceleration of the lateral movement of the holding surface and the gravity acting on the chip is perpendicular to the holding surface and points from the chip toward the holding surface.

[0010] Furthermore, the device may further include a controller, wherein the swing mechanism has a power source that outputs power to tilt the holding surface, and the controller may store a speed profile of the lateral movement in advance and perform feedforward control of the power source based on the speed profile.

[0011] The swing mechanism may also include a pendulum that is connected to the holder and tilts together with the holder.

[0012] In this case, the pendulum may have a weight at its end, and the center of gravity of the pendulum may be located on the opposite side of the holding surface across the center of rotation of the holding surface.

[0013] Furthermore, a semiconductor device manufacturing apparatus may include the above-described chip holding apparatus.

[0014] The chip holding method disclosed in this specification is characterized in that, while holding a chip non-contactingly on the holding surface of a holder, the holder is moved laterally in a direction intersecting the direction of gravity, and during the lateral movement, the holding surface is tilted in accordance with the acceleration of the lateral movement so as to suppress displacement of the chip relative to the holding surface due to inertial forces.

[0015] According to the technology disclosed in this specification, by tilting the holding surface during acceleration, positional displacement due to inertial force can be suppressed by gravity. As a result, the chip can be held and transported without contact while suppressing positional displacement of the chip.

[0016] FIG. 1 is a diagram showing the configuration of a chip holding device; FIG. 2 is a schematic diagram showing the principle of holding a semiconductor chip without contact; FIG. 3 is a diagram showing the state of positional deviation of a semiconductor chip caused by inertial force; FIG. 4 is a schematic diagram showing the state of swinging of a chip holder; FIG. 5 is a diagram showing an example of a swinging mechanism; FIG. 6 is an axial view of the holding surface of another example; FIG. 7 is an image diagram showing the function of a positioning recess; FIG. 8 is an image diagram showing the function of an airflow forming groove; and FIG. 9 is a diagram showing an example of a manufacturing apparatus having a chip holding device.

[0017] The configuration of the chip holding device 10 will be described below with reference to the drawings. Fig. 1 is a diagram showing the configuration of the chip holding device 10. This chip holding device 10 is a device that holds and transports semiconductor chips 100 in a non-contact manner, and is incorporated into, for example, semiconductor device manufacturing equipment, inspection equipment, etc.

[0018] As shown in FIG. 1 , the chip holding device 10 includes a chip holder 12, a moving mechanism 40, a swinging mechanism 46, a vibration source 30, a suction source 36, and a controller 50. The chip holder 12 holds a semiconductor chip 100 in a non-contact manner. The chip holder 12 has a substantially plate-shaped holding plate 16 and a main body 14. An end face of the holding plate 16 functions as a holding surface 18 that holds the semiconductor chip 100. A suction hole 22 that communicates with a suction source 36 (described later) is formed in the center of the holding surface 18. The main body 14 extends axially from the holding plate 16. A suction path 24 that communicates between the suction hole 22 and the suction source 36 is formed in the main body 14. The main body 14 also incorporates a vibration source 30. The main body 14 may function as a horn that amplifies ultrasonic vibrations generated by the vibration source 30 and transmits the amplified vibrations to the holding surface 18.

[0019] The position and orientation of the chip holder 12 are changed as appropriate by a moving mechanism 40 and a swinging mechanism 46. The moving mechanism 40 has a power source 42 and is an actuator that moves the chip holder 12 at least in a direction intersecting the direction of gravity. In this example, the moving mechanism 40 moves the chip holder 12 in a total of three axial directions: the x-axis, the y-axis, and the z-axis. The x-axis and y-axis are horizontal axes, and the z-axis is a vertical axis. Hereinafter, movement in a direction intersecting the direction of gravity (i.e., movement in the x-axis and y-axis directions) will be referred to as "lateral movement." The power source 42 is, for example, a motor, an electromagnetic cylinder, a pneumatic cylinder, a hydraulic cylinder, or a combination thereof. The moving mechanism 40 is electrically controlled by a controller 50, which will be described later.

[0020] The swing mechanism 46 is an actuator that swings the chip holder 12 around a swing axis 20 extending horizontally, thereby tilting the holding surface 18. Although FIG. 1 shows one swing axis 20, two swing axes 20 may be provided in directions perpendicular to the horizontal movement axes of the movement mechanism 40. For example, the swing mechanism 46 may have a swing axis 20 parallel to the y-axis and a swing axis 20 parallel to the x-axis. The swing mechanism 46 has a power source 48. The power source 48 is, for example, a motor, an electromagnetic cylinder, a pneumatic cylinder, a hydraulic cylinder, or a combination thereof. The swing mechanism 46 is electrically controlled by a controller 50.

[0021] The vibration source 30 generates ultrasonic vibrations and includes, for example, an ultrasonic vibration element 32 and an AC power supply 34. The ultrasonic vibration element 32 generates longitudinal vibrations upon receiving a drive signal, which is a voltage signal. The ultrasonic vibration element 32 includes, for example, lead zirconate titanate (commonly known as PZT) that vibrates upon receiving an AC voltage, and is a bolt-tightened Langevin-type transducer (commonly known as a BLT or BL transducer) in which the PZT is sandwiched between metal blocks and tightened with screws (bolts). The AC power supply 34 applies an alternating voltage of a frequency corresponding to a predetermined resonant frequency to the ultrasonic vibration element 32.

[0022] Driving the vibration source 30 causes the holding surface 18 to ultrasonically vibrate in the axial direction. The ultrasonic vibration of the holding surface 18 generates an ultrasonic squeeze effect between the holding surface 18 and a plane (e.g., an end face of the semiconductor chip 100) closely facing the holding surface 18. This ultrasonic squeeze effect causes the semiconductor chip 100 to be held on the holding surface 18 while remaining spaced apart from the holding surface 18, as will be described later.

[0023] The suction source 36 generates negative pressure and includes, for example, an air pump, etc. The suction source 36 is in communication with the suction path 24, and when the suction source 36 is driven, negative pressure acts on the suction holes 22, generating a suction force that attracts the semiconductor chip 100 to the holding surface 18.

[0024] The controller 50 controls the driving of the electrical elements of the chip holding device 10. This controller 50 is physically a computer having a processor 52 and a memory 54. Although the controller 50 is illustrated as a single computer in FIG. 1, the controller 50 may be configured by combining multiple physically separated computers.

[0025] The controller 50 controls the driving of the vibration source 30 and the suction source 36 so that the holding surface 18 can hold the semiconductor chip 100 in a non-contact manner. This will be explained with reference to Fig. 2. Fig. 2 is a schematic diagram showing the principle of holding the semiconductor chip 100 in a non-contact manner.

[0026] As described above, when an alternating voltage is applied to the ultrasonic vibration element 32, the holding surface 18 undergoes ultrasonic vibration. When the semiconductor chip 100 is brought close to the holding surface 18 while this ultrasonic vibration is occurring, an ultrasonic squeeze effect occurs between the holding surface 18 and the semiconductor chip 100. The ultrasonic squeeze effect is an effect in which, when one of two flat plates facing each other across a minute gap is vibrated, a pressure higher than that outside the gap is generated due to the influence of viscosity within the gap. When this ultrasonic squeeze effect occurs, a squeeze film Sf is formed.

[0027] Due to the pressure difference, a force acts on the semiconductor chip 100, tending to hold it on the surface of the squeeze film Sf. The force generated by the squeeze film Sf serves as the holding force for holding the semiconductor chip 100. Hereinafter, the holding force caused by the squeeze film Sf will be referred to as the "ultrasonic holding force." The ultrasonic holding force occurs both perpendicular to and parallel to the holding surface 18 (i.e., the planar direction). That is, when the squeeze film Sf is formed, a force acts on the semiconductor chip 100, moving it away from the holding surface 18 in the thickness direction, i.e., a force in the direction of floating it from the holding surface 18. Furthermore, when the squeeze film Sf is formed, the semiconductor chip 100 tends to remain within the vibration plane. Therefore, as shown in the lower diagram of FIG. 2 , even if the semiconductor chip 100 is temporarily displaced in the planar direction due to an external force, the semiconductor chip 100 tends to move in the planar direction so that its entirety is positioned within the vibration plane, and return to a state facing the holding surface 18.

[0028] In this example, to assist this ultrasonic holding force, a suction force is also generated by negative pressure on the holding surface 18. The controller 50 controls the driving of the suction source 36 and the vibration source 30 so that the suction force, the ultrasonic holding force, and the gravity acting on the semiconductor chip 100 are balanced when the semiconductor chip 100 is floating above the holding surface 18.

[0029] The controller 50 transports the semiconductor chip 100 by moving the chip holder 12 that holds the semiconductor chip 100. As the chip holder 12 moves, the position of the semiconductor chip 100 relative to the holding surface 18 may shift. This will be explained with reference to Fig. 3. Fig. 3 is a diagram showing the state of positional shift of the semiconductor chip 100 caused by inertial force. The graph shown in Fig. 3 is a speed profile when the chip holder 12 moves horizontally.

[0030] 3, the state of the chip holder 12 transitions in the following order: stopped state S1, accelerating state S2, constant speed state S3, decelerating state S4, and stopped state S5. In the stopped state S1, the semiconductor chip 100 is directly facing the holding surface 18 due to the ultrasonic holding force. Thereafter, when the chip holder 12 moves laterally while accelerating in the horizontal direction, an inertial force Fi is generated in the semiconductor chip 100 in the direction opposite to the direction of the lateral movement (toward the right on the paper in the case of FIG. 3). In response to this inertial force Fi, the semiconductor chip 100 temporarily shifts in the planar direction relative to the holding surface 18.

[0031] Thereafter, when the constant speed state S3 is reached and the inertial force Fi disappears, the ultrasonic holding force causes the semiconductor chip 100 to return to a position directly facing the holding surface 18. Subsequently, when the deceleration state S4 is reached, the inertial force Fi acts on the semiconductor chip 100 again, causing the semiconductor chip 100 to shift in the planar direction relative to the holding surface 18. Note that the inertial force Fi in this case is in the same direction as the lateral movement direction. Then, when the chip holder 12 reaches a stopped state S5 in which it has completely stopped, the inertial force disappears and the ultrasonic holding force causes the semiconductor chip 100 to return to a position directly facing the holding surface 18.

[0032] Here, if the inertial force Fi is large, the positional deviation of the semiconductor chip 100 increases during the lateral movement, and there is a risk that the semiconductor chip 100 may fall off the chip holder 12. Therefore, there is a problem that the acceleration of the lateral movement cannot be increased, and it takes a long time for the semiconductor chip 100 to move.

[0033] Even if the semiconductor chip 100 does not fall off, misalignment of the semiconductor chip 100 can result in an increase in processing time. For example, consider a case where the semiconductor chip 100 held by the chip holder 12 is moved to a predetermined inspection position (e.g., directly above an inspection camera) for inspection. In this case, the chip holder 12 moves to the inspection position and stops. Immediately after stopping, the semiconductor chip 100 vibrates in the planar direction until the inertial force Fi is consumed. Therefore, the inspection process cannot begin until the vibration of the semiconductor chip 100 in the planar direction stops, thereby lengthening the time required for inspection. Alternatively, consider a case where the semiconductor chip 100 held by the chip holder 12 is transferred to a bonding tool. In this case, after the chip holder 12 moves to the transfer position, the semiconductor chip 100 cannot be transferred to the bonding tool until the vibration of the semiconductor chip 100 in the planar direction stops. As a result, this leads to an increase in lead time in semiconductor device manufacturing.

[0034] Therefore, in order to suppress such misalignment of the semiconductor chip 100, in this example, the holding surface 18 is tilted in accordance with the acceleration (including negative acceleration) of the lateral movement of the holding surface 18. This will be explained with reference to FIG. 4. FIG. 4 is a schematic diagram showing the swinging of the chip holder 12. The graph in FIG. 4, like the graph in FIG. 3, is a speed profile when the chip holder 12 moves horizontally. Also in FIG. 4, the state of the chip holder 12 transitions in the order of a stopped state S1, an accelerating state S2, a constant speed state S3, a decelerating state S4, and a stopped state S5.

[0035] As is clear from FIG. 4, in this example, when the chip holder 12 is in the accelerating state S2 or the decelerating state S4, the swinging mechanism 46 swings the chip holder 12 and tilts the holding surface 18 in accordance with the acceleration force.

[0036] The controller 50 adjusts the tilt angle θ at this time so that, as shown in FIG. 4 , the resultant vector Fc of the inertial force Fi acting on the semiconductor chip 100 and gravity Fg is perpendicular to the holding surface 18 and points from the semiconductor chip 100 to the holding surface 18. With this configuration, a force acting on the semiconductor chip 100 toward the holding surface 18 is applied, effectively preventing positional deviation due to the inertial force Fi. This increases the acceleration of the lateral movement of the chip holder 12, and allows the chip holder 12 to immediately proceed to the next process after the lateral movement stops. As a result, the processing time for the semiconductor chip 100 can be shortened.

[0037] Note that, when the semiconductor chip 100 is the same, the magnitude and direction of gravity Fg acting on the semiconductor chip 100 are constant. Therefore, in order to obtain a resultant vector Fc in an appropriate direction, the tilt angle θ should be increased as the inertial force Fi increases (i.e., as the absolute value of the acceleration increases).

[0038] The controller 50 may pre-store a speed profile of the chip holder 12 and a change profile of the tilt angle θ corresponding to the speed profile, and control the drive of the swing mechanism 46 in accordance with this change profile of the tilt angle θ. Alternatively, in another embodiment, the controller 50 may calculate in real time the acceleration of the lateral movement of the chip holder 12 and the tilt angle θ corresponding to the acceleration, and control the drive of the swing mechanism 46. The acceleration may be calculated, for example, based on the movement position obtained by detecting the movement position of the chip holder 12 with a sensor or the like.

[0039] In any case, by tilting the holding surface 18 in accordance with the acceleration of the chip holder 12 and, in turn, the inertial force Fi acting on the semiconductor chip 100, it is possible to effectively prevent the semiconductor chip 100 from shifting in position relative to the holding surface 18.

[0040] In the above description, the tilt of the holding surface 18 is electrically controlled by the controller 50. However, the tilt of the holding surface 18 may also be controlled by a mechanical mechanism. For example, as shown in FIG. 5 , a pendulum 60 may be connected to the chip holder 12, and the tilt of the holding surface 18 may be controlled by the pendulum 60. In this case, the pendulum 60 is attached to the opposite side of the holding surface 18 across the swing axis 20. A weight 62 is attached to the end of the pendulum 60, and the center of gravity 64 of the pendulum 60 is located below the swing axis 20. When the chip holder 12 moves laterally while accelerating, the weight 62 of the pendulum 60 swings in the direction opposite to the acceleration direction. Due to the influence of the pendulum 60, the chip holder 12 swings around the swing axis 20 in the direction opposite to the weight 62. As a result, the holding surface 18 tilts in accordance with the acceleration, preventing the semiconductor chip 100 from shifting position relative to the holding surface 18.

[0041] Furthermore, up to this point, the holding surface 18 has been described as having a substantially flat, planar shape. However, the shape of the holding surface 18 may be modified as appropriate as long as it can hold the semiconductor chip 100 without contact. For example, as shown in FIG. 6 , the holding surface 18 may be provided with a positioning recess 28 and an airflow-forming groove 26. FIG. 6 is an axial view of the holding surface 18. In FIG. 6 , the diagonally hatched areas indicate recesses that do not penetrate the holding plate 16, and the cross-hatched areas indicate holes that penetrate the holding plate 16.

[0042] The positioning recess 28 has substantially the same shape as the outer shape of the semiconductor chip 100. In the example of Fig. 6, the semiconductor chip 100 is a square with sides of approximately L1, so the shape of the inner peripheral edge of the positioning recess 28 is also a square with sides of approximately L1.

[0043] The function of the positioning recess 28 will be described with reference to Fig. 7. Fig. 7 is an image diagram showing the function of the positioning recess 28. Note that the airflow forming groove 26 is not shown in Fig. 7. When the positioning recess 28 is formed, the positioning accuracy in the surface direction of the semiconductor chip 100 is improved compared to when the positioning recess 28 is not formed. It is presumed that the principle behind this function is that the amplitude of the ultrasonic vibration changes suddenly at the boundary of the positioning recess 28.

[0044] That is, when the positioning recess 28 is present, it is estimated that the amplitude of the ultrasonic vibration generated on the holding surface 18 changes suddenly at the positioning recess 28. As a result, the ultrasonic holding force generated by the ultrasonic vibration also changes suddenly at the positioning recess 28. In such a case, as shown in FIG. 7 , if the semiconductor chip 100 is displaced in the planar direction relative to the holding surface 18, the ultrasonic holding force acting on the semiconductor chip 100 becomes unbalanced between the left and right. The semiconductor chip 100 moves in the planar direction to eliminate this force imbalance, so that the positional displacement of the semiconductor chip 100 in the planar direction is automatically corrected, i.e., self-aligned. As a result, the provision of the positioning recess 28 can improve the positioning accuracy of the semiconductor chip 100.

[0045] Next, the air flow forming groove 26 will be described. The air flow forming groove 26 is a groove connected to the suction source 36. The shape of the air flow forming groove 26 is not particularly limited as long as it is connected to the suction hole 22. In this example, the air flow forming groove 26 includes four lines extending radially or crisscrossing from the suction hole 22 and a substantially rectangular line surrounding the four lines.

[0046] The function of the air flow forming groove 26 will be described with reference to Fig. 8. Fig. 8 is an image diagram showing the function of the air flow forming groove 26. Note that the positioning recesses 28 are not shown in Fig. 8. When the air flow forming groove 26 is formed, the air flow in the surface direction between the semiconductor chip 100 and the holding surface 18 increases in speed and becomes stable.

[0047] That is, when the suction source 36 generates a suction force while the semiconductor chip 100 is levitated due to the ultrasonic squeeze effect, an airflow is generated in the levitation gap in a surface direction and toward the center. Here, without the airflow-forming groove 26, the surface-directed airflow toward the center tends to be slow and unstable due to the influence of fluid viscosity. Furthermore, the suction force acts locally only near the suction holes 22. In this case, even if the semiconductor chip 100 is misaligned in the surface direction, it is difficult for it to move in the surface direction, making it difficult for the misalignment to be corrected on its own.

[0048] On the other hand, as shown in FIG. 8 , when the airflow forming grooves 26 are formed, the gap between the semiconductor chip 100 and the holding surface 18 becomes thicker near the airflow forming grooves 26, reducing the influence of fluid viscosity acting on the entire airflow. As a result, the airflow speed in the planar direction increases, stabilizing the airflow in the planar direction. This stable airflow in the planar direction applies a force to the semiconductor chip 100 that moves the center of the semiconductor chip 100 closer to the suction holes 22 (and thus the center of the holding surface 18). This automatically positions the semiconductor chip 100 relative to the holding surface 18. Furthermore, by forming the airflow forming grooves 26, the suction force peaks generated near the suction holes 22 can be reduced, dispersing the suction force in the planar direction. This facilitates movement of the semiconductor chip 100 in the planar direction and self-correction of misalignment in the planar direction. Note that the configurations of the positioning recesses 28 and the airflow forming grooves 26 described here are merely examples and may be modified as appropriate.

[0049] Next, a description will be given of a semiconductor device manufacturing apparatus 70 having such a chip holding device 10. Fig. 9 is a diagram showing an example of a manufacturing apparatus 70 having a chip holding device 10. The manufacturing apparatus 70 in Fig. 9 is an apparatus that manufactures a semiconductor device by bonding one or more semiconductor chips 100 to a substrate 110.

[0050] This manufacturing apparatus 70 has a chip supply source 72, a pickup unit 76, and a bonding unit 80. The chip supply source 72 has semiconductor chips 100 attached to a dicing tape 74 prepared therein. The pickup unit 76 has push-up pins that push up the semiconductor chips 100 attached to the dicing tape 74 from below, and a pickup collet 78 that picks up the pushed-up semiconductor chips 100. In this example, the above-mentioned chip holding device 10 is used as this pickup collet 78.

[0051] The semiconductor chip 100 is attached to the dicing tape 74 with the surface to be bonded to the substrate 110, i.e., the bonding surface (the thick line portion in FIG. 9 ), facing upward. The chip holder 12 of the pickup collet 78 holds this bonding surface with the holding surface 18 in a non-contact manner.

[0052] When the pickup collet 78 receives the semiconductor chip 100 from the dicing tape 74, it rotates 180 degrees around a specified rotation axis. As a result, the holding surface 18 changes from a downward-facing state to an upward-facing state. To ensure that the semiconductor chip 100 can be held appropriately during this rotational movement, the controller 50 increases at least one of the ultrasonic energy and the suction force during the rotational movement compared to when the pickup collet 78 is stationary.

[0053] After rotating 180 degrees, the pickup collet 78 moves laterally to a predetermined transfer position. During this lateral movement, the controller 50 swings the pickup collet 78 in accordance with the acceleration, thereby tilting the holding surface 18.

[0054] The bonding section 80 has a stage 82 on which the substrate 110 is placed, and a bonding head 84 that holds and transports the semiconductor chip 100. The bonding head 84 has a bonding tool 86. The bonding tool 86 holds the semiconductor chip 100 by suction at its end surface and transports the semiconductor chip 100. The above-described chip holding device 10 may be used as this bonding head 84.

[0055] As shown in FIG. 9 , the bonding tool 86 receives the semiconductor chip 100 from the pickup collet 78, which is facing upward, and suction-holds the surface of the semiconductor chip 100 opposite the bonding surface. After receiving the semiconductor chip 100 from the pickup collet 78, the bonding tool 86 moves laterally to directly above the predetermined bonding position. At this time, the controller 50 may oscillate the bonding tool 86 in accordance with the acceleration of the bonding tool 86. Thereafter, the bonding tool 86 presses the semiconductor chip 100 against the substrate 110 and bonds the semiconductor chip 100 to the substrate 110. A semiconductor device is manufactured by bonding the required number of semiconductor chips 100 to one substrate 110.

[0056] As is clear from the above explanation, the pickup collet 78 and the bonding tool 86 oscillate in response to the acceleration during lateral movement. This effectively prevents the semiconductor chip 100 from shifting position relative to the holding surface 18, and effectively prevents the semiconductor chip 100 from falling off or vibrating. As a result, the acceleration of the lateral movement of the semiconductor chip 100 can be increased, and the next process can be started immediately after the lateral movement, thereby shortening the lead time for manufacturing the semiconductor device.

[0057] The configuration described above is merely an example, and other configurations may be modified as appropriate as long as the configuration described in claim 1 is included. For example, in the above description, the chip holding device 10 holds the semiconductor chip 100 using both ultrasonic holding force and suction force. However, the chip holding device 10 may not have the suction source 36 and may hold the semiconductor chip 100 using only ultrasonic holding force. Furthermore, as long as positional deviation in the surface direction of the semiconductor chip 100 can be suppressed, the resultant vector Fc does not necessarily have to be perpendicular to the holding surface 18. Furthermore, the movement direction of the chip holder does not necessarily have to be horizontal as long as it intersects with the direction of gravity.

[0058] 10 Chip holding device, 12 Chip holder, 14 Main body, 16 Holding plate, 18 Holding surface, 20 Oscillating shaft, 22 Suction hole, 24 Suction path, 26 Air flow forming groove, 28 Positioning recess, 30 Vibration source, 32 Ultrasonic vibration element, 34 AC power supply, 36 Suction source, 40 Moving mechanism, 42 Power source, 46 Oscillating mechanism, 48 Power source, 50 Controller, 52 Processor, 54 Memory, 60 Pendulum, 62 Weight, 64 Center of gravity, 70 Manufacturing apparatus, 72 Chip supply source, 74 Dicing tape, 76 Pickup unit, 78 Pickup collet, 80 Bonding unit, 82 Stage, 84 Bonding head, 86 Bonding tool, 100 Semiconductor chip, 110 Substrate.

Claims

1. A chip holding device comprising: a holder having a holding surface that holds a chip without contact and a vibration source that applies ultrasonic vibrations to the holding surface to generate a holding force that holds the chip on the holding surface; a movement mechanism that moves the holding surface laterally in a direction intersecting the direction of gravity; and a swing mechanism that tilts the holding surface in response to the acceleration of the lateral movement of the holding surface.

2. A chip holding device as described in claim 1, characterized in that the rocking mechanism tilts the holding surface so that the resultant vector of the inertial force acting on the chip due to the acceleration of the lateral movement of the holding surface and the gravity acting on the chip is perpendicular to the holding surface and points from the chip to the holding surface.

3. A chip holding device as claimed in claim 2, further comprising a controller, wherein the rocking mechanism has a power source which outputs power for tilting the holding surface, and the controller stores in advance a speed profile of the lateral movement and feed-forward controls the power source based on the speed profile.

4. A chip holding device according to claim 2, characterized in that the swing mechanism includes a pendulum connected to the holder and tilting together with the holder.

5. A chip holding device as claimed in claim 4, characterized in that the pendulum has a weight at its end, and the centre of gravity of the pendulum is located on the opposite side of the holding surface, across from the centre of rotation of the holding surface.

6. A semiconductor device manufacturing apparatus comprising the chip holding device according to any one of claims 1 to 5.

7. A chip holding method comprising: holding a chip in a non-contact manner on a holding surface of a holder, moving the holder laterally in a direction intersecting the direction of gravity, and tilting the holding surface in response to the acceleration of the lateral movement so as to suppress misalignment of the chip relative to the holding surface caused by inertial forces.

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