Opening / closing device, film forming device, film forming method, and method for manufacturing electronic device

Abstract

An opening / closing device according to the present invention is an opening / closing device for opening / closing an object to be opened / closed, and is characterized in that: the opening / closing device includes an opening / closing unit configured so as to be capable of converting between a shielding state for shielding an object to be opened / closed and an open state for opening the object to be opened / closed, and a driving unit for converting the opening / closing unit between the shielding state and the open state; the opening / closing unit includes a plurality of opening / closing members capable of moving relative to each other in a first direction; the driving unit drives at least one of the plurality of opening / closing members in the first direction; and the opening / closing unit switches between the shielding state and the open state.

Description

Switching device, film forming apparatus, film forming method, and method for manufacturing electronic device

[0001] The present invention relates to a film forming apparatus for forming a thin film on a film forming target by vacuum deposition, and a shutter device provided therein.

[0002] As a film formation device for forming a thin film on a substrate as a film formation target, a vacuum deposition type film formation device is known, in which the film formation material is evaporated (sublimated or vaporized) from a film formation source that receives the film formation material in a vacuum chamber, and the film formation material is attached and deposited on the surface of the substrate.

[0003] Film formation begins after heating of the film formation source has begun and the film formation rate monitor has confirmed that the film formation rate has stabilized. It is necessary to prevent the film formation material from adhering to the substrate until the film formation rate stabilizes. Furthermore, impurities may be mixed into the evaporated film formation material in the initial heating stage. Therefore, a film formation apparatus equipped with a mechanism for blocking the gap between the film formation source and the substrate with a shutter is known (see Patent Documents 1 and 2).

[0004] Although various shutter device configurations have been proposed, a configuration with high operational stability and reliability is required because a malfunction or breakdown of the shutter device significantly impacts the manufacturing process time. If a malfunction or other problem occurs in the shutter device, the chamber must be temporarily returned to atmospheric pressure, after which an operator must enter the chamber to check for the malfunction, and if necessary, perform inspection or maintenance, after which the pressure in the chamber and the deposition rate must be adjusted again. This means that the process progress will be significantly delayed.

[0005] In particular, recently, film formation sources have been enlarged in size in some cases so that films can be formed on substrates uniformly and quickly by the film formation sources. However, as the film formation sources become larger, the shutter devices also become larger, which causes a problem of an increase in the size of the film formation apparatus.

[0006] Japanese Patent Publication No. 2003-115379 Japanese Patent Publication No. 2015-128119

[0007] An object of the present invention is to provide a shutter device that can be equipped in a film deposition apparatus, which has high operational stability and reliability while also being able to accommodate larger film deposition sources, and a film deposition apparatus including the shutter device.

[0008] In order to achieve the above object, the opening and closing device of the present invention is an opening and closing device for opening and closing an object to be opened and closed, and includes an opening and closing unit configured to be able to switch between a shielding state that shields the object to be opened and a open state that opens the object to be opened and closed, and a drive unit that converts the opening and closing unit between the shielding state and the open state, wherein the opening and closing unit includes a plurality of opening and closing members that are relatively movable in a first direction, and the drive unit drives at least one of the plurality of opening and closing members in the first direction, causing the opening and closing unit to switch between the shielding state and the open state.

[0009] Other features of the invention will become apparent from the following description of exemplary embodiments thereof, given with reference to the accompanying drawings, in which:

[0010] According to the present invention, it is possible to provide a shutter device that is equipped in a film deposition apparatus and that has high operational stability and reliability while preventing the film deposition apparatus from becoming large.

[0011] FIG. 1 is a schematic cross-sectional view of a film formation apparatus according to one embodiment of the present invention. FIG. 2 is a flowchart of a film formation process according to one embodiment of the present invention. FIG. 3 is a schematic plan view showing the configuration of a shutter device according to one embodiment of the present invention (open state). FIG. 4 is a schematic plan view showing the configuration of a shutter device according to one embodiment of the present invention (closed state). FIG. 5 is a schematic plan view showing the configuration of a shutter device according to another embodiment of the present invention. FIG. 6 is a schematic plan view showing the configuration of a shutter device according to an embodiment in which the shutter is made up of multiple components. FIG. 7 is a schematic cross-sectional view showing the configuration of a shutter device according to an embodiment in which the shutter is made up of multiple components. FIG. 8 is a schematic cross-sectional view showing the configuration of a shutter device according to an embodiment in which the shutter is made up of multiple components. FIG. 9 is a schematic plan view showing the configuration of one embodiment of a film formation apparatus having multiple shutter devices. FIG. 10 is a schematic cross-sectional view showing the configuration of one embodiment of a film formation apparatus having multiple shutter devices. FIG. 11 is an explanatory diagram of an organic EL display device.

[0012] Preferred embodiments and examples of the present invention will be described below with reference to the drawings. However, the following embodiments and examples merely represent preferred configurations of the present invention as a preview (example), and the scope of the present invention is not limited to such configurations. Furthermore, in the following description, unless otherwise specified, the hardware and software configurations, processing flow, manufacturing conditions, size, material, shape, etc. of the device are not intended to limit the scope of the present invention to these alone.

[0013] 1 to 5, a film formation apparatus, a film formation process, and a shutter device as an opening / closing device provided in the film formation apparatus according to an embodiment of the present invention will be described. The film formation apparatus according to this embodiment is a film formation apparatus that forms a thin film on a substrate by vacuum deposition.

[0014] The film forming apparatus according to this embodiment is used to deposit thin films (material layers such as organic films and metal films) in a desired pattern by vacuum deposition on substrates (including substrates on which laminates are formed) in the manufacture of various semiconductor devices, semiconductor devices, electronic components, and optical components.

[0015] The substrate material can be any material selected from glass, resin, metal, etc., and the deposition material can also be any material selected from organic materials, metal materials (metals, metal oxides, etc.), etc.

[0016] More specifically, the film formation apparatus according to this embodiment is preferably used in the manufacture of electronic devices such as light-emitting elements, photoelectric conversion elements, and touch panels. Among these, the film formation apparatus according to this embodiment is particularly suitable for the manufacture of organic light-emitting elements such as organic electroluminescence (EL) elements, and organic photoelectric conversion elements such as organic thin-film solar cells. Meanwhile, electronic devices according to the present invention also include display devices (e.g., organic EL display devices) (display panels) and lighting devices (e.g., organic EL lighting devices) equipped with light-emitting elements, and sensors (e.g., organic CMOS image sensors) equipped with photoelectric conversion elements. The film formation apparatus according to this embodiment can also be used as part of a film formation system including a sputtering apparatus.

[0017] 1 is a schematic diagram showing the configuration of a film formation apparatus (1) according to an embodiment of the present invention. The film formation apparatus (1) has a vacuum chamber (film formation chamber, deposition chamber) (200) whose interior is maintained at a vacuum atmosphere or an atmosphere of an inert gas such as nitrogen gas by an exhaust system (24) and a gas supply system (25). In the present specification, the term "vacuum" refers to a state in a space filled with a gas at a pressure lower than atmospheric pressure.

[0018] A substrate (100), which is the object to be film-formed, is carried into a vacuum chamber (200) by a transfer robot (not shown) and held by a substrate holding unit (not shown) installed in the vacuum chamber (200).

[0019] The mask (220) is a metal mask having an opening pattern (221) corresponding to the thin film pattern to be formed on the substrate (100), and is placed parallel to the horizontal plane in the vacuum chamber (200). During the film formation process, the substrate (100) is placed on the surface of the mask (220), and the lower surface, which is the surface to be film-formed or processed, is covered with the mask (220).

[0020] A film formation source 300 is installed below the substrate 100 within the vacuum chamber 200. The film formation source 300 includes a film formation source container (crucible) 301 (hereinafter referred to as container 301) for receiving a film formation material (evaporation material) 400, and a heater 302 for heating the film formation material 400 contained in the container 301. The film formation material 400 in the container 301 is evaporated within the container 301 by the heat of the heater 302, and is ejected outside the container 301 through a nozzle 303, which forms an ejection area for the film formation material 400, installed at the top of the container 301. The film-forming material particles sprayed outside the container (301) are deposited on the surface of the substrate (100) placed above the film-forming source (300) through the opening pattern (221) placed in the mask (220).

[0021] The heater (302) is generally configured with one or more heating elements that generate heat by confining them to the outside of the cylindrical portion of the container (301). The heater (302) may use a metal heating resistor such as a stainless steel can as the heating element, or may be a carbon heater or the like.

[0022] Although not shown, the film formation source (300) may also include a reflector or an electric heating element for improving the heating efficiency of the heater (302), and a frame for receiving the entire components of the film formation source (300), including these. In addition, the film formation source (300) may be configured to be movable relative to the fixedly placed substrate (100) in order to perform film formation uniformly over the entire substrate (100).

[0023] The film formation apparatus (1) according to this embodiment is equipped with a film formation rate monitor as a means for detecting the amount of evaporation of the film formation material (400) ejected from the container (301) or the thickness of the thin film formed on the substrate (100). The film formation rate monitor includes a monitor unit (10) equipped with a monitor head (11) and a shielding member (chopper) (12), etc., and a monitor control unit (21).

[0024] The deposition rate monitor device causes a portion of the film formation material (400) ejected from the container (301) to adhere to a corrected oscillator provided in the corrected monitor head (11). By detecting the change (decrease) in the resonant frequency (natural frequency) of the corrected oscillator accompanying the deposition of the film formation material (400), the deposition amount (deposition amount) of the film formation material (400) per unit time can be obtained as the film formation rate (evaporation rate) corresponding to a predetermined control target temperature. By feeding back this deposition rate to the setting of the control target temperature for heating control of the heater (302), the film formation rate can be controlled arbitrarily. Therefore, by monitoring the amount of film formation material (400) ejected or the film thickness of the substrate (100) during the film formation process using the deposition rate monitor device, high-precision film formation is possible.

[0025] The control unit (arithmetic processing device) (20) of the film formation apparatus (1) in this embodiment includes a monitor control unit (21) that controls the operation of the monitor unit (10) and measures and acquires the film formation rate, a heating control unit (22) that controls the heating of the film formation source (300), and a shutter control unit (23) that controls the opening and closing of a shutter (50) in a shutter device (5) described later.

[0026] FIG. 2 is a flowchart illustrating the flow of a film formation process (film formation method) according to this embodiment, including the control of the opening and closing of the shutter (50) by the shutter device (5). Prior to the start of the film formation process (evaporation process), the shutter (50) is positioned in a shielding position (closed position) (S101) while the substrate (100), which is the object to be film-formed, is not yet loaded into the vacuum chamber (200). This shielding position is a position capable of blocking particles of the film formation material (400) evaporated from the film formation source (300) from adhering to the substrate (100) in the vacuum chamber (200). In this specification, "shielding" or "blocking" does not mean complete sealing, but rather means blocking the path of particles of the film formation material that evaporate from the film formation source (300) and scatter toward the substrate (100).

[0027] In this state, the heater (302) starts heating the container (301) and a preparatory heating is performed to monitor the film formation rate (evaporation rate) using the film formation rate monitor (S102).

[0028] Once the temperature and film formation rate of the container (301) have stabilized through preparatory heating, the substrate (100) is loaded into the vacuum chamber (200) serving as the processing chamber and held in a predetermined position (S103), the shutter (50) is moved from the shielding position (closed position) to the non-shielding position (open position) (S104), and the film formation process (evaporation process) is carried out (S105).

[0029] When the film formation process is completed, the shutter (50) is moved back to the shielding position (closed position) (S106), and the substrate (100) is removed from the vacuum chamber (200) (S107), completing the film formation process for the substrate (100).

[0030] Even after the film deposition process is completed, the heater 302 continues to heat the container 301, allowing the subsequent substrate 100 to continue the film deposition process. If the heater 302 is turned off during the loading and unloading of the substrate 100, the evaporation state of the film deposition material 400 is reset for each substrate 100 deposition process. This requires preparatory heating to stabilize the temperature and deposition rate of the container 301 each time a new film deposition process for a subsequent substrate is started, significantly increasing the manufacturing process time and potentially causing variations in the deposition rate for each substrate. Therefore, when performing film deposition processes on multiple substrates 100 consecutively, it is preferable to continuously heat the container 301 with the heater 302 to maintain a constant temperature.

[0031] The shutter 50 is positioned in the shielding position (closed position) except when a film formation process is being performed on the substrate 100. If the shutter 50 is moved to the non-shielding position (open position) while a film formation process is not being performed, the film formation material 400 evaporated from the container 301, which is maintained in a heated state by the heater 302, will adhere and deposit at various locations within the vacuum chamber 200, and the deposits may break off as particles and fall onto the substrate 100 during a subsequent film formation process, potentially causing defects in the substrate 100.

[0032] Fig. 3 is a schematic plan view showing the configuration of the shutter device (5) according to this embodiment, illustrating the appearance when the shutter (50) as an opening / closing part is in the non-shielding position (open position). Fig. 4 is a schematic plan view showing the configuration of the shutter device (5) according to this embodiment, illustrating the appearance when the shutter (50) is in the shielding position (closed position).

[0033] In Fig. 1, the state in which the shutter device (5) is in the non-shielding position (open position) shown in Fig. 3 is represented by a solid line, and the state in which the shutter device (5) is in the shielding position (closed position) shown in Fig. 4 is represented by a broken ship. Fig. 1 is a drawing of the shutter device (5) in Fig. 3 and Fig. 4 as seen from the right to the left (-X direction), and Fig. 3 and Fig. 4 are plan views of the shutter device (5) in Fig. 1 as seen from above to below (-Z direction).

[0034] In the shutter device 5, the shutter 50 slides between a shielding position (FIG. 4) that prevents the deposition material 400 evaporated from the deposition source container 301 from adhering to the substrate 100, and a non-shielding position (FIG. 3) that does not prevent the deposition material 400 from adhering to the substrate 100. In this embodiment, the shutter 50 slides in the Y direction.

[0035] When in the blocking position shown in FIG. 4 , the shutter (50) is configured to block the space between the injection area of ​​the nozzle (303) of the film formation source container (301) and the substrate (100) so as to prevent particles of the film formation material (400) evaporating from the film formation source container (301) from adhering to the substrate (100) while allowing them to adhere to the corrective oscillator of the monitor unit (10). This prevents particles of the film formation material (400) scattered toward the substrate (100) from adhering to the substrate (100) during vacuum deposition film formation when heating of the film formation source container (301) (film formation material (400)) has just begun and the film formation rate is unstable. It also prevents impurities mixed in the evaporated film formation material (400) from adhering to the substrate (100) during the initial heating period. When the deposition rate monitored by the deposition rate monitor device becomes stable and deposition can begin, the shutter (50) retracts to a non-shielding position (open position) where it does not interfere with the deposition of the evaporated deposition material (400) onto the substrate (100).

[0036] 1, 3, and 4, this embodiment is configured such that one shutter 50 shields three deposition source vessels 301 arranged in a line in the X direction. However, the present invention is not limited to this, and as will be described later, a configuration in which a plurality of such deposition source vessels 301 are arranged in the Y direction may be used. This allows the film thickness on the substrate 100 to be more uniform, and the deposition rate to be increased.

[0037] The shutter device (5) comprises a shutter (50), a movable pair (51) to which the shutter (50) is fixed, a fixed pair (support base) (52) that supports the movable pair (51), and a motor (53) as a power source for sliding the shutter (50).

[0038] In this embodiment, the shutter (50) is a circular-shaped member whose long side (longer length direction) is in the X direction parallel to the arrangement direction of the three film formation source containers (301), but the present invention is not limited to this, and it may be made up of multiple members, as described below.

[0039] The moving pair (51) receives a driving force from a motor (53) and is configured to be reciprocally movable in the Y direction relative to the fixed pair (52), in this embodiment in the Y direction.

[0040] The fixed pair (52) is fixed to the bottom surface of the chamber (200), and the mating position with respect to the film formation source vessel (301) is fixed.

[0041] The moving pair (51) moves back and forth relative to the fixed pair (52), so that the shutter (50) slides back and forth between a shielding position (closed position) and a non-shielding position (open position) relative to the film formation source container (301). In this sense, the motor (53) and a mechanism (including a reciprocating pinion mechanism, linear guide, etc., described later) that transmits the driving force from the motor (53) to the moving pair (51) or the shutter (50) installed in the moving pair (51) accomplish the driving unit in the present invention.

[0042] The motor (53) has a first pinion gear (521) fixed to a rotation shaft extending vertically upward (in the Z direction), and the first pinion gear (521) rotates when the motor (53) rotates the rotation shaft.

[0043] The moving pair (51) is provided with a first rack (511) that meshes with a first pinion gear (521). The first rack (511) extends in the sliding direction (Y direction) of the shutter (50) and is provided so as to face the first pinion gear (521) in the long side direction (X direction) of the shutter (50). The moving pair (51) receives a driving force (rotational force) from the first pinion gear (521) at the first rack (511) provided at one end in the direction (X direction) perpendicular to the moving direction relative to the fixed pair (52).

[0044] Rotating bodies (524, 525) are provided on the fixed pair (52) as a configuration for stabilizing the meshing between the first pinion gear (521) and the first rack (511) and for stabilizing the relative movement of the first rack (511) relative to the first pinion gear (521). The rotating bodies (524, 525) are all provided on the fixed pair (52) so as to be rotatable around an axis parallel to the rotation axis of the first pinion gear (521).

[0045] The rotating bodies (524, 525) have the role of applying a restricting force to the first rack (511) and the moving pair (51) so that the movement trajectory (direction in which the first rack (511) extends) of the first rack (511), which moves by receiving force from the first pinion gear (521), does not deviate from the direction following the specified sliding direction of the shutter (50).

[0046] The rotating body (524) is disposed at a position facing the first rack (511) in the X direction, on the side opposite to the side where the first rack (511) meshes with the first pinion gear (521). In other words, the first rack (511) is disposed and configured to be sandwiched between the first pinion gear (521) and the rotating body (524) in the X direction.

[0047] The force that the first rack (511) receives from the first pinion gear (521) changes in direction and magnitude according to the phase (angle) of the first pinion gear (521), and includes a force that acts in a direction that moves the first rack (511) away from the first pinion gear (521). As a result, the first rack (511) has an unstable configuration in which its attitude (tilt) relative to the first pinion gear (521) is easily changed. The rotating body (524) abuts against and rotates on the first rack (511) so as to support it from behind, thereby making it possible to maintain the attitude and mating position of the first rack (511) relative to the first pinion gear (521) in an appropriate state without interfering with the sliding movement of the moving pair (51).

[0048] The rotating body (525) is arranged opposite the rotating body (524) in the opposite direction to the operating pair (51) so as to regulate fluctuations in the relative position of the first rack (511) (operating pair (51)) with respect to the first pinion gear (521).

[0049] That is, there may be a case where the first rack (511) tries to move relatively closer to the first pinion gear (521). However, in such a case, the rotating body (525) rotates in contact with the moving pair (51) so as to restrict the movement of the moving pair (51), thereby making it possible to maintain the proper posture and relative position of the first rack (511) with respect to the first pinion gear (521) without interfering with the sliding movement of the moving pair (51).

[0050] A pair of racks (second rack (522) and third rack (523)) extending parallel to the direction in which the shutter (50) must slide is provided on the surface of the fixed pair (52). Meanwhile, a pair of pinion gears (second pinion gear (512) and third pinion gear (513)) corresponding to the pair of racks is provided on the underside of the moving pair (51) so as to be rotatable around an axis parallel to the X direction, and each pinion gear meshes with the corresponding rack. The mechanism consisting of this rack and pinion gear is disposed at one end and the other end of the moving pair (51) (shutter (50)) in the X direction, and this reciprocal pinion mechanism guides the movement of the moving pair (51) relative to the fixed pair (52) in a predetermined sliding direction.

[0051] The second pinion gear 512 and the third pinion gear 513 are connected by a shaft 514 as a connecting portion so that the rotational amounts of the second pinion gear 512 and the third pinion gear 513 are equal to each other. Both ends of the shaft 514 are journaled on the lower surface of the moving pair 51. Therefore, the second pinion gear 512, the third pinion gear 513, and the shaft 514 rotate integrally with the moving pair 51 around an axis parallel to the X direction.

[0052] In addition, wheels (515, 516, 517) are installed on the moving pair (51). The wheels (515, 516, 517) serve to support the moving pair (51) relative to the fixed pair (52) so that the weight of the moving pair (51) (shutter (50)) is not concentrated between the second rack (522) and the second pinion gear (512) and between the third rack (523) and the third pinion gear (513). Each wheel (515, 516, 517) is installed on the moving pair (51) so that it can rotate around an axis parallel to the X direction. The size of each wheel (515, 516, 517) and its installation position relative to the moving pair (51) are designed so that the height of the moving pair (51) relative to the fixed pair (52) is the same as that of the moving pair (51) so that the weight of the moving pair (51) is not concentrated on the moving pinion mechanism.

[0053] With the above configuration, the shutter control unit (23) controls the on / off and forward / reverse rotation of the motor (53), thereby moving the movable pair (51) relative to the fixed pair (52), and thereby sliding the shutter (50) relative to the film formation source container (301). That is, by driving the motor (53) and rotating the first pinion gear (521) in the direction of the arrow shown in the figure, the shutter (50) can be implemented from the non-shielding state (open state) shown in FIG. 3 to the shielding state (closed state) shown in FIG. 4. Also, by driving the motor (53) from the shielding state shown in FIG. 4 to rotate the first pinion gear (521) in the direction of the arrow shown in the figure (reverse rotation), the shutter (50) can be slid in the direction indicated by the arrow, and can be implemented in the non-shielding state shown in FIG. 3.

[0054] In this embodiment, the rotating bodies (524, 525) are on the drive side (first rack (511) side) of the moving pair (51) and attempt to regulate the left-right position of the moving pair (51) relative to the fixed pair (52) and stabilize its posture, while at the same time, the wheels (515 to 517) allow the moving pair (51) to move left-right relative to the fixed pair (52), support the weight of the moving pair (51), and guide its sliding movement.

[0055] This allows smooth synchronization of the movement amounts of the left and right reciprocating pinion mechanisms by the shaft (514), thereby realizing stable sliding movement of the movable pair (51) (shutter (50)) relative to the fixed pair (52). That is, in a configuration in which the movable pair (51) is long in the X direction perpendicular to the sliding direction of the shutter (50) and receives a driving force at one end in the X direction, it is possible to achieve with high reliability the agreement (synchronization) of the movement amount at one end in the X direction with the movement amount at the other end during sliding movement.

[0056] Furthermore, the configuration of this embodiment has a simple mechanism, which allows for cost reduction, easy maintenance, and allows stable operation to be maintained for a long period of time.

[0057] However, the present invention is not limited to this, and as shown in FIG. 5, the shutter (50) may be configured to slide using a linear guide.

[0058] The shutter device shown in Figure 5 is configured to guide the sliding movement of the shutter (50) by two linear guides (60) arranged on the left and right sides of the shutter (50) (bisected in the X direction perpendicular to the sliding direction). The linear guide (60) has a rail (61), a moving block (62) installed so as to be movable on the rail (61) by balls, and a moving pair (63) supported by the moving block (62). The shutter (50) (not shown) is supported by the left and right moving pairs (63).

[0059] The shape of the shutter (50) and its arrangement relative to the film formation source container (301) are not limited to the configuration shown in this embodiment, and any configuration that is appropriate and optimal depending on the configuration of the film formation apparatus (1) may be adopted.

[0060] Below, with reference to Figures 6 to 8, we will explain a configuration in which the film formation source (300) as the object to be opened and closed is made up of multiple rows in the Y direction (for example, three rows in Figure 6), and the shutter (50) as the opening and closing part is made up of multiple shutter members (50a, 50b) that can overlap each other (i.e., can move relatively to each other in the Y direction).

[0061] 6, the film formation source (300) has a row of a plurality of (e.g., three) film formation source containers (301) arranged in the short side direction of the substrate (100) or the long side direction of the shutter (50), i.e., in the X direction, and a plurality of such rows of film formation source containers (301) are arranged in the Y direction. This configuration allows for more uniform film formation on the substrate (100).

[0062] In such a configuration of the film formation source (300), if the shutter (50) were a single component as in the configuration shown in Figure 1, the shutter (50) would have to be longer in the Y direction to open and close the film formation source (300), which would result in the shutter device (5) and film formation device (1) becoming larger.

[0063] Furthermore, in order for the shutter (50) to cover the film formation source containers (301) in the row farthest from the shutter (50), the end of the shutter (50) opposite the film formation source (300) must move to the vicinity of the end of the fixed pair (52) on the film formation source (300) side. In this case, however, there is a risk that particles of film formation material scattered from the film formation source containers (301) in the row closer to the fixed pair (52) may escape from the space between the fixed pair (52) and the shutter (50) and deposit on the substrate (100) or other parts of the film formation apparatus (1).

[0064] In contrast, in this embodiment, the shutter (50) includes a first shutter member (50a) and a second shutter member (50b) that can be stacked vertically when viewed in the Z direction, as shown in Figures 7 and 8, and is configured so that the relative positions of the first shutter member (50a) and the second shutter member (50b) in the Y direction can be different in the shielded (closed) state and the unshielded (open) state.

[0065] That is, when the shutter (50) is viewed in the Z direction, the apparent area of ​​the shutter (50) is different between the shielded (closed) state and the unshielded (open) state. Alternatively, the apparent length of the shutter (50) in the Y direction (the length of the first shutter member (50a) in the Y direction + the length of the second shutter member (50b) in the Y direction - the length of the overlapping portion of the first shutter member (50a) and the second shutter member (50b) in the Y direction) is different between the shielded (closed) state and the unshielded (open) state.

[0066] Specifically, the first shutter member 50a and the second shutter member 50b are configured to overlap the least when the shutter 50 is in the closed (shielded) state (i.e., the shutter 50 is unfolded) and to overlap the most when the shutter 50 is in the open (unshielded) state (i.e., the shutter 50 is folded). That is, when viewed in the Z direction, the apparent area of ​​the shutter 50 is maximum in the closed (shielded) state and minimum in the open (unshielded) state. Alternatively, the apparent length of the shutter 50 in the Y direction is maximum in the closed (shielded) state and minimum in the open (unshielded) state. The operation of switching the shutter 50 between the closed (shielded) state and the open (unshielded) state will be described later with reference to FIGS. 7 and 8.

[0067] This configuration can prevent the Y-direction size of the shutter device (5) from increasing due to the film formation source (300) becoming larger in the Y direction, and can prevent acid particles of the film formation material (400) from escaping into the space between the shutter (50) and the fixed pair (52) while shielding the entire film formation source (300) consisting of multiple heat sources in the Y direction.

[0068] In this embodiment, the shutter (50) is configured with two shutter members (50a, 50b), but the present invention is not limited to this and also includes a configuration with three or more shutter members.

[0069] In addition, although FIG. 6 illustrates the two shutter members (50a, 50b) as having the same length in the long side direction (X direction), the present invention is not limited to this, and they may have different lengths in the X direction.

[0070] The structure of the shutter 50, which is made up of multiple shutter members 50a, 50b, and the transition between the closed state and the open state will be described in detail below with reference to Figures 7 and 8. Figures 7 and 8 are schematic views of the shutter 50 as viewed in the X direction, and other parts of the shutter device 5 are omitted for the sake of convenience.

[0071] The shutter (50) shown in FIG. 7 includes a first shutter member (50a) as a first opening / closing member, a second shutter member (50b) as a second opening / closing member, and a connecting member (509) connecting the first shutter member (50a) and the second shutter member (50b).

[0072] The first shutter member (50a) is installed closer to the film forming source (300) in the Y direction than the second shutter member (50b), and includes a plate-shaped first shielding plate (501) that prevents particles of film forming material from scattering from the film forming source (300), and a first rib (502) extending from the first shielding plate (501) in the Z direction.

[0073] The first shutter member (50a) is installed in a movable pair (51) and can be moved in the Y direction by a drive unit including a motor (53), a first pinion (521), a first rack (511), etc., as shown in FIG.

[0074] The second shutter member (50b) is installed between the first shutter member (50a) and the anti-adhesion plate (508) in the Y direction, and includes a plate-shaped second shielding plate (503) that prevents particles of the film-forming material from scattering from the film-forming source (300), a third rib (504) extending from the second shielding plate (503) in the Z direction, and a support base (505) that supports the second shielding plate (503).

[0075] The second shutter member (50b) is configured to be movable in the Y direction by linear guide mechanisms (506, 507). Specifically, the support base (505) of the second shutter member (50b) is mounted on a movable block (506), and the movable block (506) is movable in the Y direction on a rail (507) mounted on the fixed pair (52).

[0076] The first shutter member 50a is disposed below the second shutter member 50b in the Z direction. Specifically, the first shielding plate 501 of the first shutter member 50a is disposed below the second shielding plate 503 of the second shutter member 50b in the Z direction. With this configuration, as will be described later, the first shutter member 50a and the second shutter member 50b can be stacked vertically in the Z direction when the shutter 50 is in a non-shielding (open) state.

[0077] A connecting member 509 is installed between the first shutter member 50a and the second shutter member 50b, connecting the first shutter member 50a and the second shutter member 50b so that they can move relative to each other in the Y direction. The connecting member 509 may be, for example, an elastic member such as a spring.

[0078] In the embodiment shown in FIG. 7, the first shutter member (50a) of the first shutter member (50a) and the second shutter member (50b) is driven by a driving unit, and the second shutter member (50b) receives force from the first shutter member (50a) through a connecting member (509) and moves in accordance with the movement of the first shutter member (50a).

[0079] Specifically, when the shutter 50 is switched to the non-shielding (open) state, the first shutter member 50a is driven by a drive unit including the motor 53, the first pinion 521, the first rack 511, etc., and moves in the +Y direction. Accordingly, the second shutter member 50b receives a force in the +Y direction through the connecting member 509 and moves in the +Y direction following the movement of the first shutter member 50a. When the support base 505 or the moving block 506 of the second shutter member 50b abuts against the adhesion prevention plate 508, the second shutter member 50b cannot move further in the +Y direction and stops. If the first shutter member (50a) continues to move further in the +Y direction after the second shutter member (50b) has stopped, the connecting member (509) begins to be elastically compressed, and when the shutter (50) reaches the non-blocking (open) state, the connecting member (509) is compressed to the maximum within its elastic limit, and the first shutter member (50a) and the second shutter member (50b) overlap to the maximum (see Figure 7(a)).

[0080] When the first shutter member 50a is moved in the -Y direction by the driver to switch the shutter 50 from the non-shielding (open) state to the shielding (closed) state (see FIG. 7(b)), the second shutter member 50b remains stationary until the connecting member 509 is uncompressed or reaches an equilibrium state. After the connecting member 509 is uncompressed or reaches an equilibrium state due to the movement of the first shutter member 50a in the -Y direction, as the first shutter member 50a is moved in the -Y direction by the driver, the second shutter member 50a is pulled in the -Y direction through the connecting member 509 and moves in the -Y direction. When the moving block 506 reaches the end of the rail 507, the second shutter member 50b can no longer move in the -Y direction and stops. The first shutter member (50a) continues to move further in the -Y direction, and as a result, the length of the connecting member (509) elastically increases beyond the equilibrium state. The shutter (50) is in the shielding (closed) state when the first shutter member (50a) has moved in the -Y direction to the maximum extent possible within the elastic limit of the connecting member (509) (see FIG. 7(b)).

[0081] When the shutter (50) is in a non-shielding (open) state, the length in the Y direction from one end of the first shutter member (50a) to the opposite end of the second shutter member (50b) is defined as L1, and when the shutter (50) is in a shielding (closed) state, the length in the Y direction from one end of the first shutter member (50a) to the opposite end of the second shutter member (50b) is defined as L2. There is a relationship between these that L1 < L2.

[0082] In this embodiment, it is preferable that the elastic member as the connecting member (509) has a large elastic limit so that the difference between L1 and L2 is large.

[0083] In addition, it is preferable that the installation position in the Y direction of the first rib (502) of the first shutter member (50a) is set so that the size of L1 and the relative position between the first shutter member (50a) and the second shutter member (50b) in the shielded (closed) state can sufficiently prevent particles from the film formation source (300) from scattering on the substrate.

[0084] In the embodiment of Figure 7, a configuration is described in which an elastic member (e.g., a spring) is used as the connecting member (509), but the present invention is not limited to this, and other configurations may be used in which the length in the Y direction can be changed by movement of the first shutter member (50a) in the Y direction and force can be transmitted from the first shutter member (50a) to the second shutter member (50b).

[0085] Also, in FIG. 7, the second shutter member (50b) includes the third rib (504) and one end of the connecting member (509) is connected to the side of the third rib (504), but the present invention is not limited to this. The second shutter member (50b) does not have to include the third rib (504), and the connecting member (509) may be connected to the secondary side of the second shielding plate (503) of the second shutter member (50b).

[0086] The embodiment shown in FIG. 8 differs from the embodiment shown in FIG. 7 in that the first shutter member (50a) further includes a second rib (502b) in addition to the first shielding plate (501) and the first rib (502a), and no separate connecting member is provided to connect the first shutter member (50a) and the second shutter member (50b).

[0087] That is, in this embodiment, the first shutter member (50a) includes a first shielding plate (501), a first rib (502a) as a first abutment extending in the Z direction from the first shielding plate (501), and a second rib (502b) as a second abutment installed so as to extend in the Z direction at a different position in the Y direction from the first rib (502a) (for example, at a position just beyond the Y direction of the first shielding plate (501)). The third rib (504) (third abutment) of the second shutter member (50b) is installed so as to be located between the first rib (502a) and the second rib (502b) in the Y direction. Therefore, the first shutter member (50a) and the second shutter member (50b) are movable relative to each other in the Y direction.

[0088] In the embodiment of FIG. 8, it is the first shutter member (50a) that is driven by the drive unit.

[0089] That is, in the embodiment of Figure 8, when the shutter 50 is switched to the non-shielding (open) state, the first shutter member 50a is moved in the +Y direction by the drive unit. As the first shutter member 50a moves in the +Y direction, the gap between the first rib 502a and the third rib 504 narrows. When the side of the first rib 502a of the first shutter member 50a abuts the opposing side of the third rib 504 of the second shutter member 50b, the second shutter member 50b moves in the +Y direction following the movement of the first shutter member 50a. When the support base 505 or moving block 506 of the second shutter member 50b abuts the adhesion prevention plate 508, the second shutter member 50b stops, and the first shutter member 50a also stops. This causes the shutter (50) to be in the non-shielding (open) state (see FIG. 8(a)).

[0090] When the shutter 50 is switched to the shielding (closed) state, the first shutter member 50a is moved in the -Y direction by the drive unit. Accordingly, the first rib 502a and the third rib 504 move away from each other in the Y direction, and the second shutter member 50a remains stationary. As the first shutter member 50a moves further in the -Y direction, the side surface of the second rib 502b of the first shutter member 50a abuts against the side surface of the third rib 504 of the second shutter member 50b. From this point on, the second shutter member 50b begins to move in the -Y direction following the movement of the first shutter member 50a. When the movable block (506) on which the support base (505) of the second shutter member (50b) is installed reaches one end of the rail (507) in the Y direction, the movement of the second shutter member (50b) stops, and the movement of the first shutter member (50a) by the drive unit also stops, and the shutter (50) enters a shielding (closed) state (see (b) of Figure 8).

[0091] 8, the relationship L1<L2 also holds between the length (L1) in the Y direction from one end of the first shutter member (50a) to the opposite end of the second shutter member (50b) when the shutter (50) is in the non-shielding (open) state and the length (L2) in the Y direction from one end of the first shutter member (50a) to the opposite end of the second shutter member (50b) when the shutter (50) is in the shielding (closed) state. In this embodiment, it is preferable that the distance in the Y direction between the first rib (502a) and the second rib (502b) of the first shutter member (50a) is large so that the difference between L1 and L2 is large.

[0092] As described above, in the embodiment of FIG. 8, unlike the embodiment of FIG. 7, there is no connecting member connecting the first shutter member (50a) and the second shutter member (50b), and the second shutter member (50b) can move in accordance with the movement of the first shutter member (50a) due to the abutment between the ribs (502a, 502b) of the first shutter member (50a) and the rib (504) of the second shutter member (50b).

[0093] Although not shown in FIG. 8 , at least a portion of the contact surfaces (surfaces of the first to third ribs facing in the Y direction) between the first and second ribs 502a and 502b of the first shutter member 50a and the third rib 504 of the second shutter member 50b may be coated with a buffer material. That is, a coating layer made of a buffer material may be formed on one side of the first and second ribs 502a and 502b facing both sides of the third rib 504 in the Y direction and / or on both sides of the third rib 504 facing one side of the first and second ribs 502a and 502b in the Y direction. Materials such as fluorine-based rubber (e.g., Viton) or PEEK may be used as the coating layer. This provides a buffering effect and prevents the rib material from scattering as particles.

[0094] 8, the position of the second shutter member 50b in the non-shielding (open) state is determined by the contact of the support base 505 or the movable block 506 with the adhesion prevention plate 508. However, the present invention is not limited to this, and the first shutter member 50a driven by the drive unit may be moved to the position of the first shutter member 50a in the non-shielding (open) state. In this case, it is possible to suppress the generation of particles due to the contact between the support base 505 or the movable block 506 and the adhesion prevention plate 508.

[0095] In addition, although it has been explained that the position of the second shutter member (50b) in the shielding (closed) state is determined by whether or not the movable block (506) reaches one end of the rail (507), the present invention is not limited to this, and the first shutter member (50a), which is driven by the drive unit, may be switched to the shielding (closed) state by moving it to the position of the first shutter member (50a) in the shielding (closed) state.

[0096] In the embodiment of Figures 7 and 8, the first shutter member (50a) is driven by a drive unit, and the second shutter member (50b) is passively transmitted force by abutment between the connecting member (509) and the ribs, but the present invention is not limited to this, and the second shutter member (50b) may also be configured to directly transmit a driving force by a separate drive unit.

[0097] That is, the second shutter member (50b) and a second drive unit (including a motor, a moving block, a rail, etc.) for driving it may be installed in the moving pair (51) of the shutter device (5), and the first shutter member (50a) and the second shutter member (50b) may be driven independently so that when the shutter (50) is in a non-shielding (open) state, the first shutter member (50a) and the second shutter member (50b) overlap to the maximum, and when the shutter (50) is in a shielding (closed) state, the first shutter member (50a) and the second shutter member (50b) overlap to the minimum.

[0098] In the embodiment shown in Figures 6 to 8, a configuration in which only one shutter device (5) is installed in the chamber (200) has been described, but the present invention is not limited to this, and multiple shutter devices (5) may be installed.

[0099] For example, in the film formation apparatus (1) shown in Figure 9, when viewed in the Z direction, the first shutter device (5) and the second shutter device (5') are installed on both sides of the film formation source (300) in the Y direction. This allows for symmetrical and uniform blocking of particles of film formation material scattered from the film formation source (300). The second shutter device (5') has a configuration similar to that of the first shutter device (5), and has a shutter (50') including a first shutter member (50a') including a first shielding plate (501') and a second shutter member (50b').

[0100] Furthermore, by configuring at least one of the first shutter device (5) and the second shutter device (5') to have multiple shutter members as shown in Figures 7 and 8, it is possible to prevent the film forming apparatus (1) including multiple shutter devices (5, 5') from becoming larger.

[0101] When multiple shutter devices (5, 5') are installed in the chamber (200), they are installed so that the height in the Z direction of the shutter (50) of the first shutter device (5) is the same as the height in the Z direction of the shutter (50') of the second shutter device (5'). In this case, in order to prevent particles of the film forming material from escaping in the space between the tip of the shutter (50) and the tip of the opposing shutter (50'), it is preferable to install a sunshade (590) at the tip of the first shutter member (50a) of the shutter (50) or the first shutter member (50a') of the shutter (50'), as shown in Figure 10.

[0102] Although FIG. 10 illustrates a configuration in which both the first shutter device (5) and the second shutter device (5') have a plurality of shutter members as shown in FIG. 8, the present invention is not limited to this and may have a configuration in which a plurality of shutter members as shown in FIG. 7 are also possible, or only one of the two shutter devices (5, 5') may have a plurality of shutter members.

[0103] On the other hand, it is clear that the method of defining the X, Y and Z directions defined in this embodiment will change accordingly if the underlying device configuration changes (for example, an device configuration in which the film formation source and the film formation target face each other horizontally).

[0104] The configuration of the film forming apparatus (1) is not limited to that shown in this embodiment. For example, in an apparatus configuration in which a plurality of substrates, for example, two substrates, can be accommodated in the vacuum chamber (200), the shutter device according to this embodiment can also be suitably applied to an apparatus configuration in which one of the two substrates is being carried in or out while a film is being formed on the other substrate.

[0105] In this case, the shutter device is configured to be movable within the chamber together with the film formation source container between a position where film formation is performed on one substrate and a position where film formation is performed on the other substrate. Then, at the film formation processing position for one substrate, the shutter opens and closes as described above in accordance with the progress of the film formation processing on one substrate, while the other substrate is carried in and out (exchanged) during this time. When the film formation processing on one substrate is completed, the shutter device moves together with the film formation source container to the film formation processing position for the other substrate, and the shutter opens and closes as the film formation processing on the other substrate progresses. During this time, the one substrate is carried in and out (exchanged). By repeating the above process, continuous film formation processing can be performed efficiently on multiple substrates.

[0106] Furthermore, the opening and closing operation of the shutter is not limited to a simple two-stage change between the open and closed states, but the degree to which the shutter is open can also be adjusted. That is, the open state can be not only a simple fully open state, but also an open state in which the opening area is adjusted. Therefore, it is possible to configure the film deposition by adjusting the degree of shielding (non-shielding) by the shutter.

[0107] Next, an example of a method for manufacturing an electronic device using the film forming apparatus 1 of this embodiment will be described. Below, the configuration and manufacturing method of an organic EL display device as an example of an electronic device will be previewed (exemplified).

[0108] First, the organic EL display device will be described. Figure 11(a) shows the entire organic EL display device (60), and Figure 11(b) shows the cross-sectional structure of one pixel.

[0109] As shown in FIG. 11A, a display area (61) of an organic EL display device (60) has a plurality of pixels (62) arranged in a matrix configuration, each pixel including a plurality of light-emitting elements. As will be explained in detail later, each light-emitting element has a structure including an organic layer sandwiched between a pair of electrodes. Meanwhile, the term "pixel" as used herein refers to the smallest unit capable of displaying a desired color in the display area (61). In the organic EL display device of this embodiment, each pixel (62) is composed of a combination of a first light-emitting element (62R), a second light-emitting element (62G), and a third light-emitting element (62B), each of which emits different light. While a pixel (62) is often composed of a combination of red, green, and blue light-emitting elements, it may also be composed of a combination of yellow, cyan, and white light-emitting elements, and is not particularly limited as long as it emits at least one color.

[0110] Figure 11(b) is a partial cross-sectional schematic diagram taken along line A-B in Figure 11(a). A pixel (62) has an organic EL element on a substrate (63), which includes a first electrode (anode) (64), a hole transport layer (65), one of the light-emitting layers (66R, 66G, 66B), an electron transport layer (67), and a second electrode (cathode) (68). Of these, the hole transport layer (65), the light-emitting layers (66R, 66G, 66B), and the electron transport layer (67) correspond to organic layers. In this embodiment, the light-emitting layer (66R) is an organic EL layer that emits red light, the light-emitting layer (66G) is an organic EL layer that emits green light, and the light-emitting layer (66B) is an organic EL layer that emits blue light. The light-emitting layers (66R, 66G, 66B) are formed in patterns corresponding to the light-emitting elements (sometimes referred to as organic EL elements) that emit red, green, and blue light, respectively. The first electrodes (64) are formed separately for each light-emitting element. The hole transport layer (65), electron transport layer (67), and second electrode (68) may be formed in common for multiple light-emitting elements (66R, 66G, 66B) or may be formed for each light-emitting element. Meanwhile, an insulating layer (69) is provided between the first electrodes (64) to prevent short-circuiting between the first electrodes (64) and the second electrodes (68) due to foreign matter. Furthermore, since the organic EL layer is susceptible to deterioration due to moisture and oxygen, a protective layer (70) is provided to protect the organic EL elements from moisture and oxygen.

[0111] Next, an example of a method for manufacturing an organic EL display device will be specifically described.

[0112] First, a circuit (not shown) for driving the organic EL display device and a substrate (63) on which a first electrode (64) is formed are prepared.

[0113] An acrylic resin is formed by spin coating on the substrate (63) on which the first electrode (64) is formed, and the acrylic resin is patterned by lithography so as to form an opening in the area where the first electrode (64) is formed, thereby forming an insulating layer (69). This opening corresponds to the light-emitting area where the light-emitting element actually emits light.

[0114] The substrate (63) on which the insulating layer (69) is patterned is carried into a first film-forming device, and the substrate is held by a substrate holding unit, and a hole transport layer (65) is formed as a common layer on the first electrode (64) in the display area by vacuum deposition.

[0115] Next, the substrate (63) on which the hole transport layer (65) has been formed is carried into a second film-forming apparatus and held by a substrate holding unit. The substrate and a mask are aligned, the substrate is placed on the mask, and a red-emitting light-emitting layer (66R) is formed on the portion of the substrate (63) where the red-emitting element is to be disposed.

[0116] In the same manner as the formation of the light-emitting layer (66R), a green-emitting light-emitting layer (66G) is formed by a third film-forming device, and then a blue-emitting light-emitting layer (66B) is formed by a fourth film-forming device. After the formation of the light-emitting layers (66R, 66G, 66B) is completed, an electron transport layer (67) is formed over the entire display area (61) by a fifth film-forming device. The electron transport layer (67) is formed as a layer common to the three light-emitting layers (66R, 66G, 66B).

[0117] The substrate on which the electron transport layer (67) has been formed is transferred to a sputtering device, where a second electrode (68) is formed, and then transferred to a plasma CVD device, where a protective layer (70) is formed, thereby completing the organic EL display device (60).

[0118] If the substrate (63) with the patterned insulating layer (69) is exposed to an atmosphere containing moisture or oxygen from the time it is carried into the film-forming apparatus until the time the formation of the protective layer (70) is completed, the light-emitting layer made of organic EL material may be deteriorated by moisture or oxygen. Therefore, in the example shown, the substrate is carried into and out of the film-forming apparatus in a vacuum atmosphere or an inert gas atmosphere.

[0119] 1: Film forming device 5: Shutter device (first shutter device) 5': Second shutter device 50: Shutter (first shutter) 50': Second shutter 50a: First shutter member 50b: Second shutter member 51: Moving pair 52: Fixed pair 53: Motor (power source) 501: First shielding plate 502, 502a: First rib 502b: Second rib 503: Second shielding plate 504: Third rib 509: Connecting member 511: First rack 521: First pinion gear

Claims

1. An opening and closing device for opening and closing an object to be opened and closed, comprising: an opening and closing unit configured to be switchable between a shielded state that shields the object to be opened and an open state that opens the object to be opened; and a drive unit that switches the opening and closing unit between the shielded state and the open state, wherein the opening and closing unit includes a plurality of opening and closing members that are relatively movable in a first direction, and the drive unit drives at least one of the plurality of opening and closing members in the first direction so that the opening and closing unit switches between the shielded state and the open state.

2. The opening and closing device according to claim 1, wherein the relative positions of the multiple opening and closing members in the first direction are different between the closed state and the open state.

3. The opening and closing device according to claim 1, wherein the opening and closing section is configured so that its length in the first direction differs between the closed state and the open state.

4. The opening and closing device according to claim 3, wherein the length of the opening and closing section in the first direction in the closed state is longer than the length of the opening and closing section in the first direction in the open state.

5. The opening and closing device described in claim 1, wherein the opening and closing section includes a first opening and closing member and a second opening and closing member, the first opening and closing member is closer to the object to be opened and closed in the first direction than the second opening and closing member, and the drive section is configured to drive the first opening and closing member in the first direction.

6. The opening and closing device according to claim 5, wherein the second opening and closing member is configured to be movable in the first direction in response to the movement of the first opening and closing member by the drive unit.

7. The opening and closing device according to claim 6, wherein the opening and closing section further includes a connecting member that connects the second opening and closing member to the first opening and closing member so as to be movable relatively in the first direction.

8. The opening and closing device according to claim 7, wherein the connecting member includes an elastic member.

9. The opening and closing device described in claim 6, wherein the first opening and closing member includes a first opening and closing plate parallel to the first direction, and a first rib and a second rib each extending from the first opening and closing plate in a second direction perpendicular thereto, the second opening and closing member includes a second opening and closing plate parallel to the first direction, and a third rib extending from the second opening and closing plate in the second direction, the first rib and the second rib are provided at different positions in the first direction, and the third rib is provided between the first rib and the second rib in the first direction.

10. An opening and closing device as described in claim 9, wherein at least one of the surfaces of the first rib and the second rib facing the third rib in the first direction, and the surface of the third rib facing the first rib and the second rib in the first direction includes a coating layer.

11. The opening and closing device according to claim 10, wherein the coating layer is made of a buffer material.

12. The opening and closing device described in claim 1, wherein the opening and closing unit includes a first opening and closing member and a second opening and closing member, and the drive unit includes a first drive unit configured to drive the first opening and closing member in the first direction, and a second drive unit configured to drive the second opening and closing member in the first direction independently of the first opening and closing member.

13. A film formation apparatus comprising: a chamber for accommodating an object to be film-formed; a film formation source arranged in the chamber and configured to accommodate a film formation material and evaporate the film formation material; and an opening and closing device according to any one of claims 1 to 12 arranged in the chamber, wherein the opening and closing device blocks or opens the film formation source, which is an object to be opened and closed, from the object to be film-formed.

14. The film forming apparatus according to claim 13, comprising a plurality of said opening and closing devices within said chamber.

15. A film formation method for forming a film on a film formation target housed in a chamber using the film formation apparatus described in claim 13, comprising the steps of: moving at least one of a plurality of opening and closing members of an opening and closing device by a drive unit to switch the opening and closing members to a blocked state in which the film formation material from the film formation source is not deposited on the film formation target; and moving the at least one opening and closing member of the opening and closing device by the drive unit to switch the opening and closing members to an open state in which the film formation material from the film formation source can be deposited on the film formation target.

16. A method for manufacturing an electronic device having a film formed on a substrate, comprising forming the film on the substrate as a film-forming target by the film-forming method according to claim 15.

17. The method for producing an electronic device according to claim 16, wherein the electronic device comprises an organic electroluminescent element.

Images