Workpiece holding device, processing device, and article manufacturing method

Abstract

This workpiece holding device is provided with a workpiece holding unit that holds a workpiece, and a support member that moves up and down relative to the workpiece holding unit. The support member includes a collapsible pad having an opening end that abuts the workpiece, and a pad support part that supports the pad. The pad support part includes a first flow path and a second flow path connecting an internal space of the pad and an external space, and a check valve. The check valve is disposed in the first flow path so as to allow air to flow from the internal space toward the external space through the first flow path, and so as to prevent air from flowing from the external space toward the internal space through the first flow path.

Description

Workpiece holding device, processing device, and article manufacturing method

[0001] The present invention relates to a workpiece holding device, a processing device, and an article manufacturing method.

[0002] A processing apparatus can be configured to receive a workpiece transported by a transport device using multiple lift pins. For example, a processing apparatus can be configured to receive a workpiece supported by a hand of the transport device using multiple lift pins. However, the workpiece may become misaligned the moment the multiple lift pins contact the workpiece. Slowing down the speed at which the multiple lift pins are raised to prevent such misalignment can result in reduced productivity. While Japanese Utility Model Laid-Open Publication No. 6-29142 describes a configuration in which a wafer is held by suction, incorporating such a configuration into a processing apparatus requires a mechanism for controlling suction, which can complicate the overall configuration of the processing apparatus.

[0003] The present invention provides an advantageous technique for reducing or preventing misalignment of a workpiece when it is received.

[0004] One aspect of the present invention relates to a work holding device comprising a work holding portion that holds a workpiece and a support member that rises and falls relative to the work holding portion, wherein the support member includes a contractible pad having an open end that abuts the workpiece, and a pad support portion that supports the pad, and the pad support portion includes a first flow path and a second flow path that connect an internal space of the pad to an external space, and a check valve arranged in the first flow path so as to allow air to flow from the internal space to the external space through the first flow path and to prevent air from flowing from the external space to the internal space through the first flow path.

[0005] 1 is a cross-sectional view schematically showing an example of the configuration of a workpiece holding device according to an embodiment; a plan view schematically showing an example of the configuration of a workpiece holding device according to an embodiment; a cross-sectional view schematically showing an example of the configuration of a support member of the workpiece holding device; a plan view showing an example of the configuration of a transport hand of a transport mechanism; a diagram for explaining a process in which the workpiece holding device receives a workpiece from the transport mechanism and holds it using a workpiece holding unit .... A diagram for explaining the process in which the workpiece holding device receives a workpiece from the transport mechanism and holds it using the workpiece holding unit. A diagram for explaining the process in which the workpiece holding device receives a workpiece from the transport mechanism and holds it using the workpiece holding unit. A diagram for explaining the process in which the workpiece holding device receives a workpiece from the transport mechanism and holds it using the workpiece holding unit. A diagram for explaining the process in which the workpiece holding device receives a workpiece from the transport mechanism and holds it using the workpiece holding unit. A diagram for explaining the process in which the workpiece holding device receives a workpiece from the transport mechanism and holds it using the workpiece holding unit. A diagram showing an example of the configuration of an exposure apparatus as an example of a processing apparatus into which a workpiece holding device is incorporated.

[0006] Hereinafter, embodiments will be described in detail with reference to the accompanying drawings. Note that the following embodiments do not limit the scope of the invention claimed. Although multiple features are described in the embodiments, not all of these multiple features are necessarily essential to the invention, and multiple features may be combined arbitrarily. Furthermore, in the accompanying drawings, the same reference numerals are used to designate the same or similar components, and redundant explanations will be omitted.

[0007] In the accompanying drawings and the following description, directions in three-dimensional space are described according to an XYZ coordinate system. The X-axis, Y-axis, and Z-axis in the XYZ coordinate system are mutually orthogonal directions. The direction parallel to the X-axis can be expressed as the X-direction, the direction parallel to the Y-axis as the Y-direction, and the direction parallel to the Z-axis as the Z-direction. The Z-axis is typically a direction parallel to the vertical direction.

[0008] FIG. 1 is a cross-sectional view schematically illustrating the configuration of a workpiece holding device 100 according to an embodiment. FIG. 2 is a plan view schematically illustrating the configuration of the workpiece holding device 100. FIG. 4 is a plan view illustrating the configuration of a transport hand of a transport mechanism 7. The workpiece holding device 100 can be incorporated into an apparatus for processing a workpiece W. The workpiece holding device 100 can be configured as an apparatus for holding a workpiece W such as a substrate. The workpiece holding device 100 can include a workpiece holding unit (chuck) 6 for holding the workpiece W and one or more support members SM that move up and down relative to the workpiece holding unit 6. Typically, the workpiece holding device 100 includes multiple support members SM, but it can also include a single support member SM. In the latter case, one or more other members, such as support pins, can be used together with the support member SM. Each support member SM can be provided at the tip of a lift pin 5. The workpiece holding device 100 can further include a lift mechanism 8 for lifting and lowering the multiple lift pins 5. The workpiece holding device 100 can be controlled by a control unit CNT. The control unit CNT may be incorporated into a control unit provided in a processing device that includes the workpiece holding device 100. The control unit CNT can be configured, for example, by a PLD (abbreviation for Programmable Logic Device) such as an FPGA (abbreviation for Field Programmable Gate Array), an ASIC (abbreviation for Application Specific Integrated Circuit), a general-purpose or dedicated computer with an embedded program, or a combination of all or part of these.

[0009] The workpiece W is transported by the transport mechanism 7 to the space above the workpiece holding device 100, and can be received from the transport mechanism 7 by the plurality of lift pins 5 (the plurality of support members SM provided at the tip of each of the lift pins 5). After the transport mechanism 7 has retracted, the lift mechanism 8 lowers the plurality of lift pins 5, thereby transferring the workpiece W from the plurality of lift pins 5 (the plurality of support members SM provided at the tip of each of the lift pins 5) to the workpiece holding unit 6, and the workpiece W can be held by the workpiece holding unit 6. The workpiece W can typically be subjected to a predetermined process while held by the workpiece holding unit 6. The predetermined process can be, for example, a process of transferring a pattern to the workpiece W, a process of applying a liquid to the workpiece W, a process of forming a film on the workpiece W, an annealing process for the workpiece W, a process of inspecting the workpiece W, or the like, but can also be another process. When the workpiece W is transported from the workpiece holding portion 6 to another device or position, the workpiece W can be supported by the multiple lifting pins 5 (the multiple support members SM provided at the tip of each of them) by the lifting mechanism 8 raising the multiple lifting pins 5, and then handed over to the transport mechanism 7.

[0010] FIG. 3 is a cross-sectional view schematically illustrating the configuration of the support member SM. The support member SM may include a contractible pad 1 having an open end OP that contacts the workpiece W, and a pad support portion 11 that supports the pad 1. The pad 1 may have, for example, a bellows shape, but may also have other expansion and contraction mechanisms. The pad support portion 11 may include a first flow path FP1 and a second flow path FP2 that connect the internal space PIS of the pad 1 to the external space OS. The pad support portion 11 may also include a check valve 2 disposed in the first flow path FP1. The check valve 2 may be disposed in the first flow path FP1 to allow air to flow from the internal space PIS toward the external space OS through the first flow path FP1 and to prevent air from flowing from the external space OS toward the internal space PIS through the first flow path FP1. The pad support portion 11 may further include an orifice 3 disposed in the second flow path FP2. The orifice 3 acts to limit the flow rate of air flowing through the second flow path FP2. In other words, the orifice 3 can limit the conductance of the second flow path FP2. The function of the orifice 3 may be provided by adjusting the cross-sectional area and length of the second flow path FP2.

[0011] The support member SM may further include a connection portion CP connecting the first flow path FP1 and the second flow path FP2, and a third flow path FP3 connecting the connection portion CP and the internal space PIS of the pad 1. The connection portion CP may be understood as, for example, a portion connecting the orifice 3 and the check valve 2. As illustrated in FIG. 3 , the central axis AX1 of the first flow path FP1 and the central axis AX2 of the second flow path FP2 may coincide with each other. Also, as illustrated in FIG. 3 , the central axis of the third flow path FP3 may be perpendicular to a line including the central axis AX1 of the first flow path FP1 and the central axis AX2 of the second flow path FP2.

[0012] 5A-11A and 5B-11B, the operation of the work holding device 100 will be described by way of example through an explanation of the operation of the work holding device 100 receiving the workpiece W from the transport mechanism 7 and holding it with the work holding section 6. Note that FIGS. 5A-11A schematically show the state of the work holding device 100. Also, FIGS. 5B-11B schematically show the state of the support member SM. Also, for reference, FIGS. 5B-11B show the height H of the bottom surface of the workpiece W when the workpiece W is transported to the work holding device 100 by the transport mechanism 7.

[0013] First, as shown schematically in Figures 5A and 5B, the workpiece W is transported by the transport mechanism 7 to the space above the workpiece holding device 100 while the multiple support members SM do not protrude from the upper surface of the workpiece holding portion 6.

[0014] Next, as shown schematically in FIGS. 6A-9A and 6B-9B, the lifting mechanism 8 raises the lifting pins 5, thereby raising the multiple support members SM. As a result, first, as shown schematically in FIGS. 6A and 6B, the pads 1 of the multiple support members SM abut against the underside of the workpiece W. Next, as shown schematically in FIGS. 7A and 7B, the pins 5 continue to rise while the open end OP of the pad 1 is blocked by the workpiece W. Meanwhile, as the workpiece W tries to remain in place due to inertia, the pad 1 contracts, reducing the volume of the internal space PIS. At this time, air in the internal space PIS is discharged through the first flow path FP1 and the second flow path FP2. Next, as shown schematically in FIGS. 8A and 8B, when the pad 1 is fully contracted, the workpiece W rises. Next, as shown schematically in FIGS. 9A and 9B, the workpiece W moves upward while the open end OP of the pad 1 is blocked by the workpiece W. The lifting mechanism 8 can stop the lifting of the multiple support members SM after the pad 1 contacts the workpiece W. However, even if the lifting of the multiple support members SM is stopped, the workpiece W can still rise slightly due to inertia. If the open end OP of the pad 1 is blocked by the workpiece W and the lifting pins 5 by the lifting mechanism 8 are stopped from rising, and the workpiece W moves upward due to inertia, the pad 1 can expand and the volume of the internal space PIS of the pad 1 can increase. This can create a negative pressure in the internal space PIS of the pad 1, and a suction force can act on the workpiece W. In this state, because the internal space PIS is under negative pressure, the check valve 2 is closed, blocking the inflow of air from the external space OS into the internal space PIS.

[0015] The flow resistance of the second flow path FP2 (orifice 3) can be adjusted or configured so that the internal space PIS of the pad 1 becomes negative pressure when the internal space PIS of the pad 1 increases and the workpiece W moves upward. In other words, the flow resistance of the second flow path FP2 (orifice 3) can be adjusted so that the decrease in pressure in the internal space PIS due to the increase in the internal space PIS is greater than the increase in air flowing into the internal space PIS through the second flow path FP2. To facilitate such adjustment, a variable orifice may be used as the orifice 3 to release the vacuum in the internal space PIS.

[0016] To summarize the above, when the lifting mechanism 8 raises the support member SM, the pad 1 comes into contact with the workpiece W, and the workpiece W moves upward while the open end OP of the pad 1 is blocked by the workpiece W. Then, as the workpiece W moves upward while the open end OP of the pad 1 is blocked by the workpiece W, the volume of the internal space PIS of the pad 1 increases, which creates a negative pressure in the internal space PIS and applies a suction force to the workpiece W. Therefore, the workpiece W is prevented from separating from the pad 1.

[0017] Next, as shown schematically in FIGS. 10A and 11B , the transport mechanism 7 is retracted. Next, the lifting mechanism 8 lowers the lifting pins 5, thereby lowering the support members SM. The workpiece W is then transferred from the support members SM to the workpiece holder 6, and the pad 1 separates from the workpiece W. At this stage, the negative pressure in the internal space PIS within the support mechanisms SM has returned to atmospheric pressure due to air flowing into the internal space PIS from the second flow path FP2. Therefore, the support mechanisms SM do not suck the workpiece W, and the workpiece W is held by the workpiece holder 6. In other words, the lifting mechanism 8 raises the support members SM, causing the pad 1 to abut against the workpiece W, thereby supporting the workpiece W on the pad 1. The lifting mechanism 8 then lowers the support members SM, thereby holding the workpiece W on the workpiece holder 6. The workpiece W can typically undergo a predetermined process while held by the workpiece holder 6.

[0018] When the processing of the workpiece W is completed, the lifting mechanism 8 raises the plurality of lifting pins 5. As a result, the workpiece W is supported by the plurality of lifting pins 5 (the plurality of support members SM provided at the tip of each of the lifting pins 5), and thereafter, the workpiece W can be transferred to the transport mechanism 7.

[0019] It should be noted that instead of the lifting mechanism 8 lifting the plurality of lifting pins 5 (and the plurality of support members SM), a lifting mechanism (not shown) may lift the workpiece holder 6 .

[0020] 12 illustrates the configuration of an exposure apparatus EXP as an example of a processing apparatus incorporating a workpiece holding device 100. The exposure apparatus EXP may be equipped with a projection optical system PO that projects the pattern of the original R onto the workpiece W so that the workpiece W held by the workpiece holding device 100 is exposed. The exposure apparatus EXP may also be equipped with an original holding mechanism RS that holds the original R, and an illumination optical system IL that illuminates the original R. The exposure apparatus EXP may also be equipped with a drive mechanism WDM that drives the workpiece holding device 100.

[0021] The processing device may be configured to perform other processes. For example, the processing device may be a coating device that coats a workpiece with a liquid, a developing device that develops a workpiece onto which a pattern has been transferred by an exposure device, a film forming device that forms a film on a workpiece, an annealing device that performs an annealing process on the workpiece, or an inspection device that inspects the workpiece. The film forming device may be, for example, an imprinting device, a CVD device, a sputtering device, a planarizing device, or a deposition device (e.g., a deposition device for manufacturing OLEDs).

[0022] The article manufacturing method using the above-mentioned processing device may include a first processing step of processing a workpiece with the processing device, and a second processing step of further processing the workpiece that has undergone the first processing step to obtain an article. For example, if the processing device is configured as an exposure device, the article manufacturing method may include an exposure step of exposing a workpiece with the exposure device, a development step of developing the workpiece exposed in the exposure step, and a processing step of processing the workpiece that has undergone the development step to obtain an article.

[0023] This application claims priority based on Japanese Patent Application No. 2023-215053, filed December 20, 2023, the entire contents of which are incorporated herein by reference.

[0024] The invention is not limited to the above-described embodiments, and various changes and modifications can be made without departing from the spirit and scope of the invention. Accordingly, the following claims are appended to apprise the public of the scope of the invention.

[0025] 1: Pad, 2: Check valve, 3: Orifice, : Lifting pin, 6: Workpiece holder, 7: Transfer mechanism, 8: Lifting mechanism, 11: Pad support, 100: Workpiece holder, W: Workpiece, SM: Support member, CNT: Control unit, FP1: First flow path, FP2: Second flow path, FP3: Third flow path

Claims

1. A work holding device comprising a work holding part for holding a work, and a support member which rises and falls relative to the work holding part, wherein the support member includes a contractible pad having an open end which abuts the work, and a pad support part which supports the pad, wherein the pad support part includes: a first flow path and a second flow path which connect an internal space of the pad to an external space, and a check valve disposed in the first flow path so as to allow air to flow from the internal space to the external space through the first flow path, and to prevent air from flowing from the external space to the internal space through the first flow path.

2. The workpiece holding device according to claim 1, wherein the pad support portion further includes an orifice disposed in the second flow path.

3. The workpiece holding device according to claim 1, wherein the pad has a bellows shape.

4. The work holding device as described in claim 1, further comprising a lifting mechanism for raising and lowering the support member, wherein the lifting mechanism raises the support member, causing the pad to come into contact with the work and the work to move upward while the open end of the pad is blocked by the work, and the volume of the internal space increases as the work moves upward while the open end of the pad is blocked by the work, thereby creating negative pressure in the internal space and applying a suction force to the work.

5. The work holding device according to claim 4, characterized in that the suction force acting on the work prevents the work from separating from the pad.

6. The work holding device according to claim 4 or 5, characterized in that the lifting mechanism stops the lifting of the support member after the pad abuts against the work.

7. A work holding device as claimed in any one of claims 4 to 6, characterized in that the lifting mechanism raises the support member and the pad comes into contact with the work, thereby supporting the work by the pad, and then the lifting mechanism lowers the support member, thereby holding the work by the work holding portion.

8. A work holding device as described in any one of claims 1 to 7, characterized in that the support member further includes a connection portion connecting the first flow path and the second flow path, and a third flow path connecting the connection portion and the internal space of the pad.

9. The workpiece holding device according to claim 8, characterized in that a central axis of the first flow path and a central axis of the second flow path are aligned.

10. The work holding device according to claim 9, characterized in that the central axis of the third flow path is perpendicular to a straight line including the central axis of the first flow path and the central axis of the second flow path.

11. A processing apparatus for processing a workpiece, comprising a workpiece holding device according to any one of claims 1 to 10, arranged to hold the workpiece.

12. The processing apparatus according to claim 11, further comprising a projection optical system for projecting a pattern of an original onto the workpiece so that the workpiece held by the workpiece holding device is exposed.

13. A method for manufacturing an article, comprising: a first processing step of processing a workpiece by the processing device according to claim 11; and a second processing step of further processing the workpiece that has been subjected to the first processing step to obtain an article.

14. A method for manufacturing an article, comprising: an exposure step of exposing a workpiece using the processing device described in claim 12; a development step of developing the workpiece exposed in the exposure step; and a processing step of processing the workpiece that has undergone the development step to obtain an article.

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