Bonding device, bonding system, and bonding method

Abstract

This bonding device comprises: carrier holding units that hold carriers; a plurality of substrate holding units that hold target substrates; a plurality of conveyance units that each convey dies from the carrier held by one of the carrier holding units to the plurality of target substrates held by the plurality of substrate holding units; and a control circuit that controls the plurality of conveyance units. The dies include a first die and a second die, and the first die and the second die are different in at least one of a size and an electronic circuit. Each target substrate has a plurality of devices electrically connected to the first dies and the second dies. When bonding of a predetermined number of the first dies to one target substrate is complete, the control circuit performs control to create a command to unload the one target substrate from the bonding device while the second dies remain unbonded, and a command to load another target substrate to which the first dies have not been bonded into the bonding device.

Description

Bonding device, bonding system, and bonding method

[0001] The present disclosure relates to a bonding device, a bonding system, and a bonding method.

[0002] Patent Document 1 describes a technique for bonding individual chips to a target substrate. The chips are also called dies.

[0003] Japan Publication No. 2023-132650

[0004] One aspect of the present disclosure provides techniques for reducing footprint.

[0005] A bonding apparatus according to one aspect of the present disclosure separates dies from a carrier and bonds them to a target substrate. The bonding apparatus includes a carrier holder that holds the carrier, multiple substrate holders that hold the target substrates, multiple transport units that transport the dies from the carrier held by one of the carrier holders to multiple target substrates held by the multiple substrate holders, and a control circuit that controls the multiple transport units. The dies include a first die and a second die, and the first die and the second die differ in at least one of size and electronic circuitry. The target substrate includes multiple devices that are electrically connected to the first die and the second die. When bonding of a predetermined number of the first dies to one of the target substrates is completed, the control circuit generates control to generate a command to remove the one of the target substrates from the bonding apparatus while the second die remains unbonded, and a command to load another of the target substrates to which the first die has not been bonded into the bonding apparatus.

[0006] According to one aspect of the present disclosure, the footprint can be reduced.

[0007] FIG. 1 is a plan view showing a bonding system according to one embodiment. FIG. 2(A) is a cross-sectional view showing an example of a target substrate, and FIG. 2(B) is a cross-sectional view showing an example of a die bonded to the target substrate. FIG. 3(A) is a cross-sectional view showing an example of a plurality of first dies mounted on a first carrier, FIG. 3(B) is a cross-sectional view showing an example of a plurality of second dies mounted on a second carrier, FIG. 3(C) is a cross-sectional view showing an example of a plurality of third dies mounted on a third carrier, and FIG. 3(D) is a cross-sectional view showing an example of a plurality of fourth dies mounted on a fourth carrier. FIG. 4 is a flowchart showing a bonding method according to one embodiment. FIG. 5 is a plan view showing a bonding apparatus according to one embodiment. FIG. 6 is a cross-sectional view showing an example of the operation of the bonding apparatus. FIG. 7 is a cross-sectional view showing an example of the operation of the bonding apparatus subsequent to FIG. 6. FIG. 8(A) is a cross-sectional view showing an example of the structure of the tip of a suction head, and FIG. 8(B) is a plan view showing an example of the structure of the tip of a suction head. FIG. 9(A) is a cross-sectional view showing an example of the relative position of the first die with respect to the suction head, and FIG. 9(B) is a plan view showing an example of the relative position of the first die with respect to the suction head. FIG. 10 is a plan view showing a first example of loading and unloading a first carrier into and out of a bonding apparatus. FIG. 11 is a plan view showing a second example of loading and unloading a first carrier into and out of a bonding apparatus. FIG. 12 is a plan view showing a first example of loading and unloading a target substrate into and out of a bonding apparatus. FIG. 13 is a plan view showing a second example of loading and unloading a target substrate into and out of a bonding apparatus. FIG. 14 is a plan view showing a third example of loading and unloading a target substrate into and out of a bonding apparatus. FIG. 15 is a diagram showing an example of a time that can be reduced by bonding only one type of die set for each bonding apparatus to a target substrate when the number of bonding apparatuses is greater than the number of die types. FIG. 16 is a diagram showing an example of the type of die that each bonding apparatus bonds to a target substrate when the number of bonding apparatuses is greater than the number of die types. FIG. 17 is a diagram showing an example of the type of die that each bonding apparatus bonds to a target substrate when the number of bonding apparatuses is less than the number of die types.

[0008] Hereinafter, embodiments of the present disclosure will be described with reference to the drawings. Note that the same or corresponding components in each drawing are denoted by the same reference numerals, and descriptions thereof may be omitted. In this specification, the X-axis direction, Y-axis direction, and Z-axis direction are perpendicular to each other. The X-axis direction and Y-axis direction are horizontal directions, and the Z-axis direction is vertical. The X-axis direction includes the positive X-axis direction and the negative X-axis direction that is opposite to the positive X-axis direction. The Y-axis direction includes the positive Y-axis direction and the negative Y-axis direction that is opposite to the positive Y-axis direction. The Z-axis direction includes the positive Z-axis direction and the negative Z-axis direction that is opposite to the positive Z-axis direction.

[0009] A bonding system 1 according to one embodiment will be described with reference to FIG. 1. The bonding system 1 separates a die from a carrier and bonds it to a target substrate W. As shown in FIG. 2A, the target substrate W includes a semiconductor substrate W0 such as a silicon wafer and a plurality of devices D0 formed on the semiconductor substrate W0. The plurality of devices D0 are partitioned by a plurality of streets that intersect with each other at right angles. Each device D0 includes an electronic circuit. As shown in FIG. 2B, a die is electrically connected to each device D0. The target substrate W is then cut along the streets to separate each device D0, thereby obtaining a semiconductor device. The semiconductor device includes the device D0 and the die.

[0010] The dies are formed by dividing a semiconductor substrate on which multiple devices other than the device D0 are formed into individual devices. The electronic circuits of the dies are electrically connected to the electronic circuits of the device D0 on the target substrate W. The dies include, for example, a first die D1, a second die D2, a third die D3, and a fourth die D4. The first die D1, the second die D2, the third die D3, and the fourth die D4 differ in at least one of size and electronic circuitry. The types of dies are distinguished by at least one of size and electronic circuitry.

[0011] One or more of the first die D1, second die D2, third die D3, and fourth die D4 are each electrically connected to one device D0. Note that the type and number of dies electrically connected to one device D0 are not particularly limited. Although not shown, multiple first dies D1 may be electrically connected to one device D0. Furthermore, the number of first dies D1 and second dies D2 electrically connected to one device D0 may differ.

[0012] The carrier holds a plurality of dies. The carrier holds each die with its bonding surface facing upward. This allows activation and hydrophilization of the bonding surface of each die. A carrier is prepared for each type of die. Each carrier holds only one type of die set for that carrier, and does not hold a different type of die. The carriers include, for example, a first carrier A1, a second carrier A2, a third carrier A3, and a fourth carrier A4.

[0013] An example of a first carrier A1 will be described with reference to FIG. 3A. The first carrier A1 holds multiple first dies D1. The first carrier A1 has a carrier substrate A1a and a resin film A1b, and electrostatically attracts the first dies D1 on the side opposite the carrier substrate A1a relative to the resin film A1b. By pressing the first dies D1 against the resin film A1b, the resin film A1b can be deformed to remove gas from between the first dies D1 and the resin film A1b, and the first dies D1 can also be vacuum-attached to the resin film A1b.

[0014] The carrier substrate A1a may be conductive or insulating. The carrier substrate A1a may have through holes A1c formed therein, penetrating the carrier substrate A1a in the thickness direction. The first die D1 can be peeled off from the first carrier A1 by supplying gas to the through holes A1c or inserting pins (not shown) into the through holes A1c. The number and arrangement of the through holes A1c are not particularly limited. One or more through holes A1c may be formed for each first die D1.

[0015] The resin film A1b is preferably made of a flexible material, specifically a material with an elastic modulus of 2 GPa or less, more preferably 0.5 GPa or less. From the viewpoint of durability during modification of the bonding surface of the first die D1, the resin film A1b is preferably made of, for example, polyimide or EVA (ethylene-vinyl acetate copolymer). The thickness of the resin film A1b is, for example, 10 μm. In this embodiment, the resin film A1b is a single layer, but may be multiple layers. For example, the resin film A1b may have a polyolefin layer and an acrylic adhesive layer.

[0016] In this embodiment, the resin film A1b blocks the through-hole A1c of the carrier substrate A1a, but may have a through-hole (not shown) that communicates with the through-hole A1c. The through-hole (not shown) may penetrate the resin film A1b in the thickness direction. In this case, the die D can be directly pressed. Note that the diameter of the through-hole in the resin film A1b is preferably smaller than the diameter of the through-hole A1c of the carrier substrate A1a.

[0017] Although not shown, the first carrier A1 may include a frame and a tape covering an opening of the frame. The first dies D1 may be arranged on the tape.

[0018] 3B, the second carrier A2 holds a plurality of second dies D2. Similar to the first carrier A1, the second carrier A2 may include a carrier substrate A2a, a resin film A2b, and through-holes A2c. The structure of the second carrier A2 is similar to that of the first carrier A1, and therefore detailed description thereof will be omitted. Similarly to the first carrier A1, the second carrier A2 may include a frame and tape covering the opening of the frame.

[0019] As shown in FIG. 3C, the third carrier A3 holds a plurality of third dies D3. Similar to the first carrier A1, the third carrier A3 may include a carrier substrate A3a, a resin film A3b, and through-holes A3c. The structure of the third carrier A3 is similar to that of the first carrier A1, and therefore detailed description thereof will be omitted. Similarly to the first carrier A1, the third carrier A3 may include a frame and tape covering the opening of the frame.

[0020] As shown in FIG. 3D , the fourth carrier A4 holds a plurality of fourth dies D4. Similar to the first carrier A1, the fourth carrier A4 may have a carrier substrate A4a, a resin film A4b, and through-holes A4c. The structure of the fourth carrier A4 is similar to that of the first carrier A1, and therefore detailed description thereof will be omitted. Similarly to the first carrier A1, the fourth carrier A4 may also include a frame and tape covering the opening of the frame.

[0021] 1 , the bonding system 1 includes a loading / unloading station 2, a first processing station 3, a second processing station 5, and a control circuit 9. The loading / unloading station 2, the first processing station 3, and the second processing station 5 are arranged in a line from the negative side of the X-axis to the positive side of the X-axis, in that order. Although not shown, a plurality of second processing stations 5 may be provided, and a plurality of second processing stations 5 may be arranged in a line from the negative side of the X-axis to the positive side of the X-axis.

[0022] The carry-in / out station 2 includes a mounting table 20. Cassettes C1 to C10 are mounted on the mounting table 20. Cassette C1 accommodates a target substrate W before the first die D1 and the like are bonded thereto. Cassette C2 accommodates a target substrate W after the first die D1 and the like have been bonded thereto. Cassette C3 accommodates the first carrier A1 before the first die D1 is separated therefrom. Cassette C4 accommodates the first carrier A1 after the first die D1 has been separated therefrom. Cassette C5 accommodates the second carrier A2 before the second die D2 is separated therefrom. Cassette C6 accommodates the second carrier A2 after the second die D2 has been separated therefrom. Cassette C7 accommodates the third carrier A3 before the third die D3 is separated therefrom. Cassette C8 accommodates the third carrier A3 after the third die D3 has been separated therefrom. The cassette C9 accommodates the fourth carrier A4 before the fourth die D4 is separated from it, and the cassette C10 accommodates the fourth carrier A4 after the fourth die D4 is separated from it.

[0023] The loading / unloading station 2 includes a first transfer region 21 and a first transfer device 22. The first transfer region 21 is adjacent to the mounting table 20. The first transfer region 21 extends in the Y-axis direction. The first transfer device 22 has a transfer arm. The transfer arm holds and transfers the target substrate W and the carrier in the first transfer region 21. The number of transfer arms may be one or more. The transfer arm for the target substrate W and the transfer arm for the carrier may be provided separately. The first transfer device 22 has a drive unit (not shown) that moves or rotates the transfer arm. The transfer arm is capable of moving horizontally (in both the X-axis and Y-axis directions) and vertically (in the Z-axis direction) and rotating about the vertical axis.

[0024] The first processing station 3 includes a first storage device 30. The first storage device 30 is adjacent to the first transfer region 21. The first storage device 30 is disposed on the opposite side of the first transfer region 21 from the mounting table 20. The first storage device 30 temporarily stores target substrates W and carriers. The first storage device 30 has multiple stages arranged in the vertical direction. Each stage holds a target substrate W and a carrier. The stage for the target substrates W and the stage for the carriers may be provided separately.

[0025] The first processing station 3 includes a second transfer region 31 and a second transfer device 32. The second transfer region 31 is adjacent to the first storage device 30 and extends from the first storage device 30 in the positive direction of the X-axis. The second transfer device 32 has a transfer arm. The transfer arm holds and transfers the target substrate W and the carrier in the second transfer region 31. The number of transfer arms may be one or more. The transfer arm for the target substrate W and the transfer arm for the carrier may be provided separately. The second transfer device 32 has a drive unit (not shown) that moves or rotates the transfer arm. The transfer arm is capable of moving horizontally (in both the X-axis and Y-axis directions) and vertically (in the Z-axis direction) and rotating about the vertical axis.

[0026] The first processing station 3 includes a first activation device 33, a first hydrophilization device 34, a second activation device 35, and a second hydrophilization device 36. The first activation device 33, the first hydrophilization device 34, the second activation device 35, and the second hydrophilization device 36 are adjacent to the second transport region 31 and are provided on the positive Y-axis side or the negative Y-axis side of the second transport region 31.

[0027] The first activation device 33 activates the bonding surface of the die while the die is held by the carrier. The first activation device 33 is, for example, a plasma processing device. In the first activation device 33, oxygen gas, which is a processing gas, is excited under reduced pressure, for example, to form plasma and is ionized. The bonding surface of the die is activated by irradiating the oxygen ions onto the bonding surface of the die. The processing gas is not limited to oxygen gas, and may be, for example, nitrogen gas.

[0028] The first hydrophilizing device 34 hydrophilizes the bonding surface of the die while the die is held by the carrier. For example, the first hydrophilizing device 34 supplies pure water (e.g., deionized water) onto the die while rotating the carrier held by the spin chuck. The pure water imparts OH groups to the bonding surface of the die, which has been activated in advance. The die and the target substrate W can be bonded by utilizing hydrogen bonding between the OH groups.

[0029] The second activation device 35 activates the bonding surface Wa of the target substrate W. The second activation device 35 is, for example, a plasma processing device. In the second activation device 35, oxygen gas, which is a processing gas, is excited under reduced pressure, for example, to form plasma and is ionized. The bonding surface Wa of the target substrate W is activated by irradiating the oxygen ions onto the bonding surface Wa of the target substrate W. The processing gas is not limited to oxygen gas, and may be, for example, nitrogen gas.

[0030] The second hydrophilizing device 36 hydrophilizes the bonding surface Wa of the target substrate W. For example, the second hydrophilizing device 36 supplies pure water (e.g., deionized water) onto the target substrate W while rotating the target substrate W held by the spin chuck. The pure water provides OH groups to the bonding surface Wa of the target substrate W, which has been activated in advance. The die and the target substrate W can be bonded by utilizing hydrogen bonding between the OH groups.

[0031] The second processing station 5 includes a second storage device 50. The second storage device 50 is adjacent to the second transfer region 31. The second storage device 50 is disposed on the opposite side of the second transfer region 31 from the first storage device 30. The second storage device 50 temporarily stores target substrates W and carriers. The second storage device 50 has multiple stages arranged vertically. Each stage holds at least one of the target substrates W and the carriers. The stage for the target substrates W and the stage for the carriers may be provided separately.

[0032] The second processing station 5 includes a third transfer region 51 and a third transfer device 52. The third transfer region 51 is adjacent to the second storage device 50 and extends from the second storage device 50 in the positive direction of the X-axis. The third transfer device 52 has a transfer arm. The transfer arm holds and transfers the target substrate W and the carrier in the third transfer region 51. The number of transfer arms may be one or more. The transfer arm for the target substrate W and the transfer arm for the carrier may be provided separately. The third transfer device 52 has a drive unit (not shown) that moves or rotates the transfer arm. The transfer arm is capable of moving horizontally (in both the X-axis and Y-axis directions) and vertically (in the Z-axis direction) and rotating about the vertical axis.

[0033] The second processing station 5 includes a bonding device 60. The bonding device 60 is adjacent to the third transfer region 51 and is provided on the positive Y-axis side or the negative Y-axis side of the third transfer region 51. The bonding device 60 separates the die from the carrier and bonds the die and the target substrate W with the bonding surface of the separated die facing the bonding surface Wa of the target substrate W. Details of the bonding device 60 will be described later.

[0034] The control circuit 9 is, for example, a computer, and includes an arithmetic unit 91 such as a CPU (Central Processing Unit) and a storage unit 92 such as a memory. The storage unit 92 stores programs that control various processes executed in the bonding system 1. The control circuit 9 controls the operation of the bonding system 1 by causing the arithmetic unit 91 to execute the programs stored in the storage unit 92. A lower-level control circuit that controls the operation of each device constituting the bonding system 1 may be provided, and a higher-level control circuit that controls multiple lower-level control circuits may be provided. The control circuit 9 may be configured with the lower-level control circuit and the higher-level control circuit.

[0035] The control circuit 9 includes electronic circuits such as a CPU, a field programmable gate array (FPGA), or an application specific integrated circuit (ASIC), and performs the various control operations described in this specification by executing instruction codes stored in a memory or by being a circuit designed for a specific application.

[0036] Next, a bonding method according to one embodiment will be described with reference to Fig. 4. The process of Fig. 4 is performed under the control of the control circuit 9. First, the first transport device 22 removes carriers from the cassettes C3, C5, C7, and C9 and transports them to the first storage device 30. Next, the second transport device 32 removes carriers from the first storage device 30 and transports them to the first activation device 33.

[0037] Next, the first activation device 33 activates the bonding surface of the die while the die is held by the carrier (step S101). After that, the second transport device 32 removes the carrier from the first activation device 33 and transports it to the first hydrophilization device 34.

[0038] Next, the first hydrophilizing device 34 hydrophilizes the bonding surface of the die while the die is held by the carrier (step S102). Thereafter, the second transport device 32 removes the carrier from the first hydrophilizing device 34 and transports it to the second storage device 50. Subsequently, the third transport device 52 removes the carrier from the second storage device 50 and transports it to the bonding device 60.

[0039] In parallel with the above steps S101 and S102, the following steps S103 and S104 are performed. First, the first transfer device 22 removes the target substrate W from the cassette C1 and transfers it to the first storage device 30. Next, the second transfer device 32 removes the target substrate W from the first storage device 30 and transfers it to the second activation device 35.

[0040] Next, the second activation device 35 activates the bonding surface Wa of the target substrate W (step S103), after which the second transport device 32 removes the target substrate W from the second activation device 35 and transports it to the second hydrophilization device 36.

[0041] Next, the second hydrophilizing device 36 hydrophilizes the bonding surface Wa of the target substrate W (step S104). Thereafter, the second transfer device 32 removes the target substrate W from the second hydrophilizing device 36 and transfers it to the second storage device 50. Subsequently, the third transfer device 52 removes the target substrate W from the second storage device 50 and transfers it to the bonding device 60.

[0042] Next, the bonding device 60 separates the die from the carrier and bonds the die to the target substrate W by orienting the bonding surface of the separated die toward the bonding surface Wa of the target substrate W (step S105). Bonding of the die to the target substrate W is performed for each type of die. For one target substrate W, bonding of the first die D1 is repeatedly performed, then bonding of the second die D2 is repeatedly performed, then bonding of the third die D3 is repeatedly performed, and finally bonding of the fourth die D4 is repeatedly performed.

[0043] When a target substrate W is scheduled to be bonded with a different type of die (e.g., a second die D2) after bonding one type of die (e.g., a first die D1), the target substrate W is stored in the second storage device 50 or the first storage device 30 until it is transported again to the bonding device 60. Note that bonding of one type of die (e.g., the first die D1) to the target substrate W and bonding of another type of die (e.g., the second die D2) to the target substrate W may be performed in the same bonding device 60 or in different bonding devices 60.

[0044] After all types of dies have been bonded, the target substrate W is transported to cassette C2. First, the third transport device 52 removes the target substrate W to which all types of dies have been bonded from the bonding device 60 and transports it to the second storage device 50. Next, the second transport device 32 removes the target substrate W to which all types of dies have been bonded from the second storage device 50 and transports it to the first storage device 30. Finally, the first transport device 22 removes the target substrate W to which all types of dies have been bonded from the first storage device 30 and stores it in cassette C2.

[0045] The carriers from which the dies have been separated are stored in cassettes C4, C6, C8, and C10. First, the third transfer device 52 removes the carriers from which the dies have been separated from the bonding device 60 and transfers them to the second storage device 50. Next, the second transfer device 32 removes the carriers from which the dies have been separated from the second storage device 50 and transfers them to the first storage device 30. Finally, the first transfer device 22 removes the carriers from which the dies have been separated from the first storage device 30 and stores them in cassettes C4, C6, C8, and C10.

[0046] Next, an example of the bonding device 60 will be described with reference to Fig. 5. Below, a case will be described in which the bonding device 60 separates the first die D1 from the first carrier A1 and bonds it to the target substrate W. Note that the bonding device 60 can also separate the second die D2 from the second carrier A2 and bond it to the target substrate W, separate the third die D3 from the third carrier A3 and bond it to the target substrate W, or separate the fourth die D4 from the fourth carrier A4 and bond it to the target substrate W.

[0047] The bonding apparatus 60 includes, for example, a carrier holding unit 61, a substrate holding unit 62, a transport unit 63, and a control circuit 69. The carrier holding unit 61 holds a first carrier A1. The substrate holding unit 62 holds a target substrate W. The transport unit 63 transports a first die D1 from the first carrier A1 held by the carrier holding unit 61 to the target substrate W held by the substrate holding unit 62. The control circuit 69 may be a part of the control circuit 9.

[0048] The bonding apparatus 60 preferably has a plurality of substrate holding units 62 and a plurality of transport units 63. The plurality of transport units 63 transport the first die D1 from one first carrier A1 held by one carrier holding unit 61 to multiple target substrates W held by multiple substrate holding units 62. A transport unit 63 is provided for each substrate holding unit 62. The destination substrate holding unit 62 differs for each transport unit 63. Meanwhile, the source carrier holding unit 61 is common to the multiple transport units 63. The number of substrate holding units 62 and the number of transport units 63 may be the same or may be greater than the number of carrier holding units 61.

[0049] According to this embodiment, as described above, the carrier holding unit 61 from which the substrates are transferred is common to the plurality of transfer units 63. Therefore, compared to arranging a plurality of bonding apparatuses each having one carrier holding unit 61, one substrate holding unit 62, and one transfer unit 63, the number of carrier holding units 61 can be reduced while maintaining the number of substrate holding units 62. Therefore, the footprint (installation area) of the bonding apparatus 60 can be reduced.

[0050] The control circuit 69 preferably compares the code indicating the quality of the device D0 with the code indicating the quality of the first die D1, and selects a combination of the device D0 and the first die D1 to be electrically connected. The quality of the device and the quality of the first die D1 may be represented by the same code. In that case, the electrically connected device D0 and the first die D1 have the same code. Note that the quality of the device D0 and the quality of the first die D1 may be represented by different codes. If there is a combination table of the codes, the combination can be selected.

[0051] The control circuit 69 electrically connects the high-quality device D0 to the high-quality first die D1. The control circuit 69 also electrically connects the low-quality device D0 to the low-quality first die D1. This improves the yield of the semiconductor device. It also enables pricing to be set according to the quality of the semiconductor device. The semiconductor device is obtained by bonding all types of die to the target substrate W and then dicing the target substrate W into individual devices D0.

[0052] Providing multiple substrate holders 62 for one carrier holder 61 in the bonding apparatus 60 is particularly effective when selecting a combination by comparing the quality of the device D0 and the quality of the first die D1. The greater the number of substrate holders 62, the greater the number of target substrates W, the greater the number of devices D0, and the higher the probability of successfully combining the device D0 and the first die D1. This reduces the frequency of replacing the first carrier A1. In this embodiment, the number of substrate holders 62 is two, but may be three or more.

[0053] Although the details will be described later, when there are no more first dies D1 that can be combined with the device D0 from the viewpoint of quality even if the first dies D1 remain in the first carrier A1, the control circuit 69 generates a command to unload one first carrier A1 from the bonding device 60 and a command to load another first carrier A1 into the bonding device 60. According to this embodiment, the probability of successful combination of the device D0 and the first dies D1 is high, and the frequency of replacing the first carrier A1 can be reduced.

[0054] Next, an example of the transfer unit 63 will be described with reference to FIGS. 6 and 7 . The transfer unit 63 includes a pickup unit 64 and a mount unit 65. The pickup unit 64 separates the first die D1 from the first carrier A1 held by the carrier holding unit 61 and transfers it. The pickup unit 64 may turn the first die D1 upside down while transferring the first die D1. The bonding surface of the first die D1 can face downward. The mount unit 65 receives the first die D1 from the pickup unit 64 and bonds the received first die D1 to the target substrate W held by the substrate holding unit 62.

[0055] The pickup unit 64 includes, for example, a suction head 64a and a moving mechanism 64b. The suction head 64a picks up the first die D1. The suction head 64a picks up the joining surface of the first die D1, and therefore may pick up the first die D1 without contact to prevent contamination of the joining surface. The moving mechanism 64b moves the suction head 64a in the X-axis, Y-axis, and Z-axis directions. The moving mechanism 64b may also turn the suction head 64a upside down to turn the first die D1 upside down. The joining surface of the first die D1 can be turned upside down.

[0056] The mount unit 65 has, for example, a suction head 65a and a moving mechanism 65b. The suction head 65a suctions the first die D1 from the side opposite to the suction head 64a. The suction head 65a suctions the surface of the first die D1 opposite to the joining surface. Since it does not matter if the surface opposite to the joining surface becomes dirty, the suction head 65a may come into contact with the first die D1. This can improve the suction force and suppress misalignment.

[0057] The movement mechanism 65b moves the suction head 65a in the Z-axis direction to bond the first die D1 to the target substrate W. To improve the accuracy of the bonding position, the movement mechanism 65b may move the suction head 65a in the X-axis direction and the Y-axis direction, or may rotate the suction head 65a about the vertical axis. The amount of movement or rotation required to improve the accuracy of the bonding position is small, and the suction head 65a does not need to move much when viewed from above.

[0058] Next, an example of the bonding device 60 will be described again with reference to Figures 6 and 7. The bonding device 60 may include a pressing unit 66. The pressing unit 66 presses the first die D1 in a direction (e.g., upward) that peels it from the resin film A1b, for example, by supplying gas to the through-hole A1c of the carrier substrate A1a or by inserting a pin (not shown) into the through-hole A1c. Note that if the first die D1 can be peeled from the first carrier A1 simply by the pickup unit 64 lifting the first die D1 together with the suction head 64a, the pressing unit 66 may be omitted.

[0059] The bonding device 60 may include a carrier moving unit 67. The carrier moving unit 67 moves the first carrier A1 together with the carrier holding unit 61. The carrier moving unit 67 moves the first carrier A1, for example, in the X-axis direction and the Y-axis direction. This allows the pressing unit 66 to press the multiple first dies D1 in a desired order without the need for the pressing unit 66 to move in the X-axis direction and the Y-axis direction. Furthermore, the pickup unit 64 can receive the first die D1 at the same receiving position every time. This simplifies the operation of the pickup unit 64. The carrier moving unit 67 may also move the first carrier A1 in the Z-axis direction.

[0060] The bonding device 60 does not necessarily have to include the carrier moving unit 67. That is, the carrier holding unit 61 may be fixed. In this case, the receiving position changes for each first die D1. Therefore, the pressing unit 66 is moved in the X-axis direction and the Y-axis direction in accordance with the change in the receiving position.

[0061] The bonding device 60 may include a substrate moving unit 68. The substrate moving unit 68 moves the target substrate W together with the substrate holder 62. The substrate moving unit 68 moves the target substrate W, for example, in the X-axis direction and the Y-axis direction. This makes it possible to change the bonding position of the first die D1 relative to the target substrate W. As a result, the pickup unit 64 can deliver the first die D1 to the mount unit 65 at the same delivery position every time. This simplifies the operation of the pickup unit 64. The substrate moving unit 68 may also move the target substrate W in the Z-axis direction.

[0062] The bonding device 60 may include at least one of a first imaging unit 71, a second imaging unit 72, and a third imaging unit 73 in order to improve the accuracy of the bonding position of the first die D1 relative to the target substrate W. Note that the first imaging unit 71, the second imaging unit 72, and the third imaging unit 73 do not have to capture an image every time the first die D1 and the target substrate W are bonded, and may capture images periodically.

[0063] 6, the first imaging unit 71 captures an image of the alignment marks on the bonding surface (e.g., the bottom surface) of the first die D1 held by the suction head 65a. The number of alignment marks to be captured is, for example, two, but is not limited to this. The alignment marks may be dedicated marks or may be part of the electronic circuit of the first die D1.

[0064] The first imaging unit 71 is disposed, for example, below the suction head 65a. The first imaging unit 71 transmits the captured image to the control circuit 69. The control circuit 69 processes the image captured by the first imaging unit 71 to detect the position of the first die D1 in the first coordinate system set for the suction head 65a.

[0065] 7, the second imaging unit 72 captures an image of the alignment marks on the bonding surface Wa of the target substrate W held by the substrate holding unit 62. The number of alignment marks to be captured is, for example, two, but is not particularly limited. The alignment marks may be dedicated marks or may be part of the electronic circuit of the device D0 on the target substrate W.

[0066] The second imaging unit 72 is disposed, for example, above the substrate holding unit 62 and is provided, for example, on the suction head 65a. The second imaging unit 72 transmits the captured image to the control circuit 69. The control circuit 69 processes the image captured by the second imaging unit 72 to detect the position of the device D0 in the second coordinate system set in the substrate holding unit 62.

[0067] The control circuit 69 aligns the first die D1 held by the suction head 65a with the device D0 on the target substrate W held by the substrate holder 62, using an image captured by at least one of the first imaging unit 71 and the second imaging unit 72. The alignment is performed by controlling at least one of the movement mechanism 65b and the substrate moving unit 68. Before bonding the first die D1 and the target substrate W, the position of the first die D1 or the device D0 can be corrected, thereby improving the accuracy of the bonding position.

[0068] After the first die D1 and the device D0 are bonded together, the third imaging unit 73 simultaneously captures images of both the alignment mark on the bonding surface of the first die D1 and the alignment mark on the bonding surface Wa of the target substrate W. The third imaging unit 73 captures images of the alignment marks of the first die D1 and the target substrate W, for example, by transmitting light through the first die D1. The third imaging unit 73 is configured by, for example, an infrared camera.

[0069] When capturing an image of the alignment marks of the first die D1 and the target substrate W through the first die D1, the third imaging unit 73 is disposed, for example, above the substrate holding unit 62 and is provided, for example, on the suction head 65a. The third imaging unit 73 transmits the captured image to the control circuit 69. The control circuit 69 processes the image captured by the third imaging unit 73 to detect a deviation between the actual bonding position and the target bonding position.

[0070] The control circuit 69 uses the image captured by the third imaging unit 73 to align the first die D1 held by the suction head 65a with the target substrate W held by the substrate holder 62 in the next and subsequent bonding of the first die D1 and the target substrate W. The position of the first die D1 or the target substrate W can be corrected taking into account the behavior of the bonding device 60, and the accuracy of the bonding position can be improved.

[0071] Next, an example of the structure of the tip of the suction head 65a will be described with reference to Fig. 8. The structure of the tip of the suction head 64a is similar to the structure of the tip of the suction head 65a, so illustration and description thereof will be omitted. As shown in Fig. 8, the suction head 65a has, at its tip (for example, the lower end), an opening 651, a transparent plate 652 that covers the opening 651, a nozzle 653 attached to the transparent plate 652, and an alignment mark 654 provided on the transparent plate 652.

[0072] The nozzle 653 picks up the die D. It is preferable that a nozzle 653 is prepared for each type of die D, and that the nozzle 653 is replaceable. By replacing the nozzle 653 depending on the type of die D, the die D can be properly picked up. In this embodiment, the nozzle 653 is replaced automatically under the control of the control circuit 69, but it may also be replaced manually.

[0073] Although not shown, a second imaging unit 72 (see FIGS. 6 and 7) and a third imaging unit 73 (see FIGS. 6 and 7) may be provided inside the housing of the suction head 65a. The second imaging unit 72 and the third imaging unit 73 capture images of the target substrate W and the like through an opening 651 and a transparent plate 652 in the housing of the suction head 65a. The transparent plate 652 is, for example, a glass plate.

[0074] Next, an example of adjusting the relative position of the die D with respect to the suction head 65a will be described with reference to Fig. 9. Note that the adjustment of the relative position of the die D with respect to the suction head 64a is similar to the adjustment of the relative position of the die D with respect to the suction head 65a, and therefore illustration and description thereof will be omitted. Note that the adjustment of the relative position of the die with respect to only one of the suction heads 64a and 65a may be performed.

[0075] Adjustment of the relative position of the die D with respect to the suction head 65a includes, for example, having the first imaging unit 71 capture an image of the nozzle 653 and the die D while the nozzle 653 is suctioning the die D. The control circuit 69 processes the image captured by the first imaging unit 71 and detects the relative position of the die D with respect to the nozzle 653. This allows the control circuit 69 to correct any deviation in the relative position of the die D with respect to the nozzle 653 from the next time onwards.

[0076] When a part of the suction head 65a (for example, the nozzle 653) is replaced, the relative position of the die with respect to the suction head 65a is adjusted each time in order to maintain the accuracy of the joining position. If such adjustment is required too frequently, the production efficiency of the product decreases. Therefore, it is preferable to use the same nozzle 653 of the suction head 65a in each joining device 60 as much as possible in succession.

[0077] When the number of bonding devices 60 is equal to or greater than the number of die types, each bonding device 60 can bond only one type of die set for that bonding device 60 to the target substrate W. For example, one bonding device 60 bonds only the first die D1 to the target substrate W, and another bonding device 60 bonds only the second die D2 to the target substrate W.

[0078] However, the number of bonding devices 60 may be less than the number of types of dies. In this case, at least one bonding device 60 bonds multiple types of dies to the target substrate W.

[0079] 10 , even if first dies D1 remain in one first carrier A1, when there are no more first dies D1 that can be combined with the device D0 from the viewpoint of quality, the control circuit 69 generates a command to unload the one first carrier A1 from the bonding apparatus 60. The control circuit 69 also generates a command to load another first carrier A1 into the bonding apparatus 60. In accordance with these commands, the third transport device 52 replaces the first carrier A1 held by the carrier holding unit 61. A first die D1 that can be combined with the device D0 can be supplied to the bonding apparatus 60, and bonding of the first die D1 to the target substrate W can be continued.

[0080] The first carrier A1, from which some of the first dies D1 have been separated by the joining device 60, is transported to the second storage device 50 by the third transport device 52, then to the first storage device 30 by the second transport device 32, and finally to the cassette C4 by the first transport device 22. The cassette C4 accommodates the first carrier A1 from which some of the first dies D1 remain. The remaining first dies D1 are rearranged on the first carrier A1 outside the joining system 1 and returned to the joining system 1 again.

[0081] The first carrier A1 in which some of the first dies D1 remain may be stored in the first storage device 30 or the second storage device 50, and then transported again to the joining device 60 without being transported to the cassette C4. The control circuit 69 may monitor the availability of at least one of the second storage device 50 and the first storage device 30 using a sensor such as a camera, and, depending on the availability, select whether to transport the first carrier A1 in which some of the first dies D1 remain to the cassette C4 or to transport it again to the joining device 60 without transporting it to the cassette C4.

[0082] 11 , when all the first dies D1 have been removed from one first carrier A1, the control circuit 69 generates a command to unload the one first carrier A1 from the bonding device 60. The control circuit 69 also generates a command to load another first carrier A1 into the bonding device 60. In accordance with these commands, the third transport device 52 replaces the first carrier A1 held by the carrier holding unit 61. A first die D1 that can be combined with the device D0 can be supplied to the bonding device 60, and bonding of the first die D1 to the target substrate W can be continued.

[0083] The first carrier A1 from which all the first dies D1 have been separated by the joining device 60 is transported to the second storage device 50 by the third transport device 52, then to the first storage device 30 by the second transport device 32, and finally to the cassette C4 by the first transport device 22. The cassette C4 accommodates the first carrier A1 from which no first dies D1 have been attached. The first carrier A1 from which all the first dies D1 have been separated is not transported to the joining device 60 again.

[0084] 12 , when bonding of a predetermined number of first dies D1 to one target substrate W is completed, the control circuit 69 generates a command to unload the target substrate W from the bonding device 60 while the second die D2 remains unbonded. The control circuit 69 also generates a command to load another target substrate W to which the first die D1 has not yet been bonded into the bonding device 60. In accordance with these commands, the third transport device 52 replaces the target substrate W held by the substrate holder 62. Bonding of the first die D1 to the target substrate W can be continued.

[0085] The target substrate W, on which the first die D1 has been bonded to all of the devices D0 by the bonding apparatus 60, is transported to the second storage apparatus 50 by the third transport apparatus 52, or is then further transported to the first storage apparatus 30 by the second transport apparatus 32. The target substrate W is then stored in the second storage apparatus 50 or the first storage apparatus 30 until it is transported again to the bonding apparatus 60. Note that the bonding of the first die D1 to the target substrate W and the bonding of the second die D2 to the target substrate W may be performed by the same bonding apparatus 60 or by different bonding apparatuses 60.

[0086] 13 , when bonding of a predetermined number of second dies D2 to one target substrate W is completed, the control circuit 69 generates a command to unload the target substrate W from the bonding device 60. The control circuit 69 also generates a command to load another target substrate W, to which bonding of a predetermined number of first dies D1 has been completed but to which no second die D2 has yet been bonded, into the bonding device 60. In accordance with these commands, the third transport device 52 replaces the target substrate W held by the substrate holder 62. Bonding of the second die D2 to the target substrate W can be continued.

[0087] The target substrate W, on which the second die D2 has been bonded to all of the devices D0 by the bonding apparatus 60, is transported to the second storage apparatus 50 by the third transport apparatus 52, or is then further transported to the first storage apparatus 30 by the second transport apparatus 32. Thereafter, if bonding of a third die D3 is planned, the target substrate W is stored in the second storage apparatus 50 or the first storage apparatus 30 until it is transported again to the bonding apparatus 60. Note that the bonding of the second die D2 to the target substrate W and the bonding of the third die D3 to the target substrate W may be performed by the same bonding apparatus 60 or by different bonding apparatuses 60.

[0088] 14 , when bonding of all types of dies (e.g., a predetermined number of first dies D1, a predetermined number of second dies D2, a predetermined number of third dies D3, and a predetermined number of fourth dies D4) to one target substrate W is completed, the control circuit 69 generates a command to unload the target substrate W from the bonding device 60. The control circuit 69 also generates a command to load another target substrate W to which only one type of die (e.g., the fourth die D4) remains unbonded into the bonding device 60. In accordance with these commands, the third transport device 52 replaces the target substrate W held by the substrate holder 62. Bonding of the fourth die D4 to the target substrate W can continue.

[0089] After the bonding of all types of dies has been completed by the bonding device 60, the target substrate W is transported to the second storage device 50 by the third transport device 52, then to the first storage device 30 by the second transport device 32, and finally to the cassette C2 by the first transport device 22.

[0090] 15 shows an example of the time required for each bonding device to bond all types (e.g., four types) of dies to the target substrates W, and the time required for each bonding device to bond only one type of die set for that bonding device to the target substrates W. "T1" indicates the time required to bond the first die D1 to 25 target substrates W. "T2" indicates the time required to bond the second die D2 to 25 target substrates W. "T3" indicates the time required to bond the third die D3 to 25 target substrates W. "T4" indicates the time required to bond the fourth die D4 to 25 target substrates W. "CAL" indicates the time required to adjust the relative position of the die with respect to the suction head 65a.

[0091] As shown in the upper part of Figure 15, when each bonding apparatus 60A, 60B, 60C, and 60D bonds all types of dies (e.g., four types) to target substrates W, the nozzles 653 are replaced depending on the type of die, and the relative positions of the dies with respect to the suction heads 65a are adjusted. On the other hand, as shown in the lower part of Figure 15, when each bonding apparatus 60A, 60B, 60C, and 60D bonds only one type of die set for each bonding apparatus 60A, 60B, 60C, and 60D to target substrates W, adjustment of the relative positions of the dies with respect to the suction heads 65a is not necessary. This reduces the adjustment time for the bonding apparatuses 60A, 60B, 60C, and 60D, and reduces the time required to bond all types of dies to, for example, 100 target substrates W, by ΔT.

[0092] Therefore, when the number of bonding devices 60A, 60B, 60C, and 60D is equal to or greater than the number of die types, the control circuit 9 preferably performs the following controls (A) and (B). (A) During a desired period, the bonding devices 60A, 60B, 60C, and 60D repeatedly bond only one type of die set for each bonding device 60A, 60B, 60C, and 60D to the target substrate W while swapping the target substrate W. For example, the bonding device 60A repeatedly bonds only the first die D1 to the target substrate W while swapping the target substrate W. The bonding device 60B repeatedly bonds only the second die D2 to the target substrate W while swapping the target substrate W. The bonding device 60C repeatedly bonds only the third die D3 to the target substrate W while swapping the target substrate W. The bonding device 60D repeatedly bonds only the fourth die D4 to the target substrate W while swapping the target substrate W. (B) During the desired period, the third transport device 52 transports each target substrate W in turn to a plurality of bonding devices 60A, 60B, 60C, and 60D that bond different types of dies to the target substrates W. This reduces the adjustment time for the bonding devices 60A, 60B, 60C, and 60D, and reduces the time required to bond all types of dies to 100 target substrates W, for example, by ΔT.

[0093] Here, the desired period is, for example, the period during which all types of dies are bonded to one or more lots each consisting of a plurality of target substrates W. One lot is made up of a plurality of target substrates W (e.g., 25 substrates) housed in one cassette C1. One lot may also be made up of a plurality of target substrates W (e.g., n times 25 substrates) housed in multiple cassettes C1. Here, n is an integer of 2 or greater. There is no particular upper limit to n, but n may be 10 or less.

[0094] Preferably, the control circuit 9 simultaneously operates, during part of the desired period, a plurality of bonding devices 60A, 60B, 60C, and 60D that bond different types of dies to a target substrate W. For example, the control circuit 9 simultaneously performs the following operations (A1), (A2), (A3), and (A4): (A1) The bonding device 60A repeatedly bonds a first die D1 to a target substrate W while swapping the target substrate W; (A2) The bonding device 60B repeatedly bonds a second die D2 to a target substrate W while swapping the target substrate W; (A3) The bonding device 60C repeatedly bonds a third die D3 to a target substrate W while swapping the target substrate W; and (A4) The bonding device 60D repeatedly bonds a fourth die D4 to a target substrate W while swapping the target substrate W. Simultaneous operation of the plurality of bonding devices 60A, 60B, 60C, and 60D can improve product production efficiency.

[0095] When the control circuit 9 performs the control of (A) and (B) (the control shown in the lower part of FIG. 15 ), T3 is longer than when the control circuit 9 performs the control shown in the upper part of FIG. 15 . This is because the third die D3 is bonded after the second die D2 is bonded. Similarly, T4 is longer because the fourth die D4 is bonded after the third die D3 is bonded.

[0096] As shown in the lower part of Figure 15, an example of a case in which unnecessary waiting time occurs is when N1, N2, N3, and N4 are not completely equal. Here, N1 is the number of first dies D1 to be bonded to one target substrate W. N2 is the number N2 of second dies D2 to be bonded to one target substrate W. N3 is the number N3 of third dies D3 to be bonded to one target substrate W. N4 is the number N4 of fourth dies D4 to be bonded to one target substrate W. Incidentally, in the upper and lower parts of Figure 15, N1 and N2 are greater than N3 and N4. Therefore, in order to shorten the unnecessary waiting time shown in the lower part of Figure 15, control shown in Figure 16, which will be described later, may be performed.

[0097] 16 shows an example of the types of dies that each bonding apparatus bonds to a target substrate when the number of bonding apparatuses is greater than the number of die types. The bonding apparatuses 60Aa and 60Ab repeatedly bond only the first die D1 to the target substrate W while switching the target substrate W. The bonding apparatuses 60Ba and 60Bb repeatedly bond only the second die D2 to the target substrate W while switching the target substrate W. The bonding apparatus 60C repeatedly bonds only the third die D3 to the target substrate W while switching the target substrate W. The bonding apparatus 60D repeatedly bonds only the fourth die D4 to the target substrate W while switching the target substrate W.

[0098] The control circuit 9 determines the type of die to be bonded to the target substrate W by each bonding device based on the ratio (e.g., N1:N2:N3:N4) of the values ​​obtained by counting the number of dies to be bonded to one target substrate W for each type of die. That is, the control circuit 9 sets the ratio (e.g., n1:n2:n3:n4) of the number of bonding devices to be used based on the ratio (e.g., N1:N2:N3:N4). Here, n1 is the number of bonding devices that bond only the first die D1. n2 is the number of bonding devices that bond only the second die D2. n3 is the number of bonding devices that bond only the third die D3. n4 is the number of bonding devices that bond only the fourth die D4. This reduces the variation in the number of dies to be bonded by each bonding device, thereby reducing unnecessary waiting time. The ratio of the numbers of bonding devices to be used (for example, n1:n2:n3:n4) is set so as to reduce the variation in the number of dies bonded by each bonding device and to reduce unnecessary waiting time.

[0099] The control circuit 9 may use the ratio of the values ​​obtained by counting the number of dies to be bonded to one or more lots for each die type, instead of the ratio of the values ​​obtained by counting the number of dies to be bonded to one target substrate W for each die type. This is effective when the ratio (e.g., N1:N2:N3:N4) varies for each target substrate W. Such a case may include a case where one of multiple types of devices is selectively placed at a specific position on the device D0. For example, a case where one of the first die D1 and the second die D2 is selectively placed at a specific position on the device D0 may be included in the quality code. An instruction as to whether the first die D1 or the second die D2 is to be placed at a specific position on the device D0 may be included in the quality code.

[0100] The control circuit 9 may determine the type of die to be bonded to the target substrate W by each bonding device based on the ratio (e.g., K1:K2:K3:K4) of the values ​​obtained by counting the number of dies to be bonded for one or more lots for each type of die. K1 is the number of first dies D1 to be bonded for one or more lots. K2 is the number of second dies D2 to be bonded for one or more lots. K3 is the number of third dies D3 to be bonded for one or more lots. K4 is the number of fourth dies D4 to be bonded for one or more lots. The control circuit 9 may set the ratio (e.g., n1:n2:n3:n4) of the number of bonding devices to be used based on the above ratio (e.g., K1:K2:K3:K4). This reduces the variation in the number of dies to be bonded by each bonding device and reduces unnecessary waiting time. The ratio of the numbers of bonding devices to be used (for example, n1:n2:n3:n4) is set so as to reduce the variation in the number of dies bonded by each bonding device and to reduce unnecessary waiting time.

[0101] Fig. 17 shows an example of the types of dies bonded to the target substrate by each bonding device when the number of bonding devices is less than the number of die types. The control shown in Fig. 17 can also be applied when the number of bonding devices is equal to or greater than the number of die types. However, when the number of bonding devices is equal to or greater than the number of die types, it is preferable to perform the control shown in Fig. 15 or the control shown in Fig. 16.

[0102] When the number of bonding devices 60A, 60B is smaller than the number of die types, the control circuit 9 preferably performs the following controls (C), (D), and (E): (C) During a desired period, the bonding device 60A repeatedly bonds only the first die D1 to the target substrate W while swapping the target substrates W, and then repeatedly bonds only the third die D3 to the target substrate W while swapping the target substrates W; (D) During the desired period, the bonding device 60B repeatedly bonds only the second die D2 to the target substrate W while swapping the target substrates W, and then repeatedly bonds only the fourth die D4 to the target substrate W while swapping the target substrates W; (E) During the desired period, the third transport device 52 transports each target substrate W to the bonding device 60A, the bonding device 60B, the bonding device 60A, and the bonding device 60B in this order. This allows the adjustment time of the bonding devices 60A, 60B, 60C, and 60D to be shortened, and the time required to bond all types of dies to 50 target substrates W, for example, can be shortened by ΔT.

[0103] Preferably, during part of the desired period, the control circuit 9 simultaneously operates multiple bonding devices 60A, 60B that bond different types of dies to the target substrate W. For example, the control circuit 9 simultaneously controls the bonding device 60A to repeatedly bond only the first die D1 to the target substrate W while swapping the target substrate W, and the bonding device 60B to repeatedly bond only the second die D2 to the target substrate W while swapping the target substrate W. The control circuit 9 also simultaneously controls the bonding device 60A to repeatedly bond only the third die D3 to the target substrate W while swapping the target substrate W, and the bonding device 60B to repeatedly bond only the fourth die D4 to the target substrate W while swapping the target substrate W. Simultaneous operation of multiple bonding devices 60A, 60B can improve product production efficiency.

[0104] Although the embodiments of the joining device, joining system, and joining method according to the present disclosure have been described above, the present disclosure is not limited to the above embodiments. Various changes, modifications, substitutions, additions, deletions, and combinations are possible within the scope of the claims. These naturally fall within the technical scope of the present disclosure.

[0105] This application claims priority based on Japanese Patent Application No. 2023-213479 filed with the Japan Patent Office on December 19, 2023, the entire contents of which are incorporated herein by reference.

[0106] 60 Bonding device 61 Carrier holding section 62 Substrate holding section 63 Transport section W Target substrate D0 Device D1 First die D2 Second die D3 Third die D4 Fourth die A1 First carrier A2 Second carrier A3 Third carrier A4 Fourth carrier

Claims

1. A bonding apparatus that separates a die from a carrier and bonds it to a target substrate, comprising: a carrier holding section that holds the carrier; a plurality of substrate holding sections that hold the target substrate; a plurality of transport sections that transport the die from one of the carriers held by one of the carrier holding sections to a plurality of the target substrates held by a plurality of the substrate holding sections; and a control circuit that controls the plurality of transport sections, wherein the die has a first die and a second die, the first die and the second die differing in at least one of size and electronic circuitry, the target substrate has a plurality of devices electrically connected to the first die and the second die, and the control circuit performs control to generate, when bonding of a predetermined number of the first dies to one of the target substrates is completed, a command to remove the one of the target substrates from the bonding apparatus while the second die remains unbonded, and a command to carry another of the target substrates to which the first die is not bonded into the bonding apparatus.

2. The bonding apparatus according to claim 1, wherein the control circuit compares a code indicating the quality of the device with a code indicating the quality of the first die, and controls the selection of a combination of the device and the first die to be electrically connected.

3. The bonding apparatus of claim 2, wherein the control circuit performs control to generate a command to remove one of the carriers from the bonding apparatus and a command to carry another of the carriers holding the first die into the bonding apparatus when there are no more first dies to be combined with the device even if the first dies remain in one of the carriers.

4. The bonding apparatus according to claim 1, further comprising a control circuit for controlling a plurality of the transport units, the control circuit controlling the generation of a command to remove one of the carriers from the bonding apparatus and a command to carry another of the carriers holding the first dies into the bonding apparatus when all of the first dies have been removed from the one of the carriers.

5. The bonding apparatus of claim 1, wherein the control circuit performs control to generate, when bonding of a predetermined number of the second dies to one of the target substrates is completed, a command to remove the one of the target substrates from the bonding apparatus and a command to carry into the bonding apparatus another target substrate to which bonding of a predetermined number of the first dies has been completed and to which no second dies have been bonded.

6. A bonding system comprising the bonding apparatus according to any one of claims 1 to 5, comprising: a mounting table on which a cassette containing the carrier and a cassette containing the target substrate are placed; a first transport area for transporting the carrier and the target substrate; a first storage device for temporarily storing the carrier and the target substrate; a second transport area for transporting the carrier and the target substrate; a second storage device for temporarily storing the carrier and the target substrate; and a third transport area for transporting the carrier and the target substrate, arranged in this order; the bonding apparatus is adjacent to the third transport area; and the first transport area, the second transport area and the third transport area are each provided with a transport device for transporting the carrier and the target substrate.

7. A bonding method, comprising: separating the first die from the carrier and bonding the first die to the target substrate using a bonding apparatus according to any one of claims 1 to 5.

Images