Supra-aural earphone

Abstract

The present description provides an earphone. In the earphone, a double-layer circuit board structure is provided in a circuit board compartment, so that a longitudinal space, perpendicular to the surface of a first circuit board, in the circuit board compartment is fully utilized, thereby meeting more circuit extension requirements without enlarging the circuit board compartment, such as the requirements for storage and playback of audio data. Furthermore, the earphone provided by the present description can use earphone housings of other types without the need of redesign and re-molding, thereby reducing the development and production costs.

Description

Earhook headphones Technical Field

[0001] This specification relates to the field of acoustic equipment, and in particular to an earhook headphone. Background Art

[0002] As people's requirements for wearable devices increase in comfort, they are increasingly moving towards miniaturization and lightweighting. At the same time, people's demands for the functionality of electronic devices are also continuously increasing, inevitably requiring the expansion of functionality through hardware circuits, which means an increase in circuit area.

[0003] As a wearable electronic device, ear-hook headphones also face the contradiction between controlling the size and mass of the body and achieving circuit expansion.

[0004] Therefore, it is necessary to provide a headset that can integrate more circuits within a limited body space.

[0005] The content of the background technology section is merely information known to the applicant personally, and does not mean that the above information has entered the public domain before the application date of this disclosure, nor does it mean that it can become the prior art of the present disclosure.

[0006] Summary of the Invention

[0007] This specification provides an earhook headset that can expand the circuit area within a limited circuit board compartment.

[0008] This specification provides an ear-hook headset, including a speaker unit for converting input into sound; and a circuit board compartment, including a accommodating space; and a first circuit board, a second circuit board and a connector, wherein the first circuit board and the second circuit board are connected in the accommodating space through the connector to form a double-layer circuit board structure to utilize the longitudinal space in the circuit board compartment perpendicular to the surface of the first circuit board.

[0009] In some implementations, the connector is a board-to-board connector, and the first circuit board and the second circuit board are arranged in parallel on both sides of the board-to-board connector to form the double-layer circuit board structure; or the connector includes a flexible circuit board, and the first circuit board and the second circuit board are foldably connected through the flexible circuit board and arranged in parallel to form the double-layer circuit board structure.

[0010] In some implementations, in the board direction of the first circuit board, a ratio of an overlapping area of ​​the first circuit board and the second circuit board to a union area of ​​the two is greater than or equal to 0.2.

[0011] In some implementations, a ratio of a maximum cross-sectional area of ​​the accommodating space to a combined area of ​​the first circuit board and the second circuit board along the surface of the first circuit board is less than or equal to 1.5.

[0012] In some implementations, the ratio of the thickness of the circuit board compartment to the thickness of the double-layer circuit board structure is less than or equal to 1.5, wherein the thickness of the double-layer circuit board structure is the maximum distance between the first circuit board and its components and the second circuit board and its components in a direction perpendicular to the surface of the first circuit board.

[0013] In some implementations, the circuit board compartment has a thickness in a range from 0.6 cm to 1 cm.

[0014] In some implementations, the length of the circuit board bin is in the range of 3 cm to 4 cm.

[0015] In some implementations, the second circuit board includes a data unit, and when the data unit and the first circuit board are working, signals are transmitted to each other through the connector, wherein the first circuit board and the second circuit board are arranged in two layers.

[0016] In some implementations, the data unit includes a data input-output circuit, which is arranged on a side of the second circuit board facing the first circuit board; and a memory, which stores audio data and is electrically connected to the data input-output circuit, and the memory is arranged on a side of the second circuit board away from the first circuit board.

[0017] In some implementations, the headset includes an MP3 module, and the MP3 module includes at least a portion of the second circuit board.

[0018] In some implementations, the headset further includes: a signal shielding component, at least partially covering the data input and output circuit to at least partially block electromagnetic radiation generated during the transmission of the audio data.

[0019] In some implementations, the headset also includes a conductive buffer pad located between the first circuit board and the signal shielding component and abutting the first circuit board and the signal shielding component to increase the electrical connection between the ground lines of the first circuit board and the second circuit board and reduce the signal loop area between the two boards.

[0020] In some embodiments, the shell of the circuit board compartment includes at least one positioning column; and at least one positioning hole and / or at least one positioning notch are provided on the first circuit board and the second circuit board, wherein the at least one positioning column is passed through the at least one positioning hole or the at least one positioning notch to fix the first circuit board and the second circuit board in the direction of their respective board surfaces.

[0021] In some implementations, at least one target positioning column among the at least one positioning column includes a column body and an enlarged column head, the column body is fixedly connected to the shell and passes through the first circuit board and the second circuit board, and the column head abuts against the first circuit board or the second circuit board away from the shell to fix the first circuit board and the second circuit board along the axis of the column body.

[0022] In some implementations, at least one accommodating cavity is provided in the shell of the circuit board compartment to accommodate at least one target component and limit the movement of the circuit board where the at least one target component is located along the board surface direction; the target component is the component with the highest height on the board surface of the circuit board where it is located in the direction perpendicular to the board surface; and the depth of the accommodating cavity is less than or equal to the height of the target component relative to the board surface of the circuit board where it is located.

[0023] In some implementations, the target component is a memory, and the memory is disposed on a side of the second circuit board away from the first circuit board.

[0024] In some implementations, the earphones further include: a buffer member, located between the first circuit board and the shell of the circuit board compartment, and abutting against the first circuit board and the shell.

[0025] In some implementations, the headset further includes at least one button, which is at least partially disposed between the first circuit board and the second circuit board, and is electrically connected to the first circuit board or the second circuit board. The shell further includes at least one button hole, and the at least one button is inserted into the at least one button hole.

[0026] In some implementations, the thickness of the button is less than or equal to the distance between the first circuit board and the second circuit board.

[0027] In some implementations, the earphones are first-model earphones, and the circuit board compartment is identical to a circuit board compartment of a second-model earphone in appearance and dimensions of the appearance, and the circuit board compartment of the second-model earphones does not include the second circuit board.

[0028] As can be seen from the above technical solution, the headphones provided herein utilize a double-layer circuit board structure within the circuit board compartment, fully utilizing the longitudinal space perpendicular to the first circuit board surface within the compartment. This allows for expanded circuitry, such as audio data storage and playback, to be accommodated without expanding the compartment. Furthermore, the headphones provided herein can utilize other headphone housing models without requiring a redesigned mold, thereby reducing development and production costs.

[0029] Other features of the headphones provided in this specification are partially listed in the following description. Based on the description, the following figures and examples will be readily apparent to those skilled in the art. The inventive aspects of the headphones provided in this specification can be fully explained through practice or use of the methods, devices, and combinations provided in the following detailed examples. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] In order to more clearly illustrate the technical solutions in the embodiments of this specification, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of this specification. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0031] FIG1 is a schematic structural diagram of an earphone provided according to some embodiments of this specification;

[0032] FIG2 shows a partial exploded view of a circuit board bin according to some embodiments of this specification;

[0033] FIG3 shows a schematic diagram of a double-layer circuit board structure provided according to some embodiments of this specification;

[0034] FIG4 shows a schematic diagram of the internal structure of a circuit board bin according to some embodiments of this specification; and

[0035] FIG5 shows a schematic diagram of a double-layer circuit board structure provided according to some embodiments of this specification. DETAILED DESCRIPTION

[0036] The following description provides specific application scenarios and requirements for this specification, with the goal of enabling those skilled in the art to make and use the contents of this specification. Various modifications to the disclosed embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be applied to other embodiments and applications without departing from the spirit and scope of this specification. Therefore, this specification is not limited to the embodiments shown, but is intended to be accorded the broadest scope consistent with the claims.

[0037] The terms used herein are for the purpose of describing specific example embodiments only and are not intended to be limiting. For example, as used herein, the singular forms "a," "an," and "the" may also include the plural forms unless the context clearly indicates otherwise. When used in this specification, the terms "comprise," "include," and / or "contain" are intended to refer to the presence of the associated integers, steps, operations, elements, and / or components, but do not preclude the presence of one or more other features, integers, steps, operations, elements, components, and / or groups or the addition of other features, integers, steps, operations, elements, components, and / or groups in the system / method.

[0038] These and other features of this specification, as well as the operation and function of the associated elements of the structure, and the economical assembly and manufacture of the components, can be significantly improved with consideration of the following description. Reference is made to the accompanying drawings, all of which form a part of this specification. However, it should be expressly understood that the drawings are for illustration and description purposes only and are not intended to limit the scope of this specification. It should also be understood that the drawings are not drawn to scale.

[0039] The flowcharts used in this specification illustrate operations implemented by systems according to some embodiments of the present specification. It should be clearly understood that the operations of the flowcharts may not be implemented in sequence. Rather, the operations may be implemented in reverse order or simultaneously. Furthermore, one or more additional operations may be added to the flowcharts. One or more operations may be removed from the flowcharts.

[0040] In this specification, "X includes at least one of A, B, or C" means that X includes at least A, or X includes at least B, or X includes at least C. In other words, X may include only any one of A, B, and C, or any combination of A, B, and C, as well as other possible contents / elements. Any combination of A, B, and C may be A, B, C, AB, AC, BC, or ABC.

[0041] In this specification, unless otherwise specified, the association relationship between structures can be a direct association relationship or an indirect association relationship. For example, when describing "A is connected to B", unless it is clearly stated that A is directly connected to B, it should be understood that A can be directly connected to B or indirectly connected to B; for another example, when describing "A is above B", unless it is clearly stated that A is directly above B (AB are adjacent and A is above B), it should be understood that A can be directly above B or indirectly above B (AB is separated by other elements and A is above B). And so on.

[0042] This specification provides an earhook headset. This specification does not limit the type of headset. For example, the headset can be a bone conduction headset, an air conduction headset, or a combination of an air conduction headset and a bone conduction headset. For another example, the headset can be a wired headset or a wireless headset.

[0043] In some usage scenarios, in order to meet the user's functional requirements for headphones, it is sometimes necessary to expand new circuit modules. For example, if the user needs to play local music, an MP3 module can be designed in the circuit. Or, if the user needs to listen to the radio or intercom, a radio module or an intercom module can be designed in the circuit. However, the wearing comfort and stability of the headphones cannot be reduced due to the expansion of circuit board functions, that is, the volume of the circuit board compartment cannot be increased in order to expand the circuit area, thereby increasing the weight of the circuit board compartment. Therefore, this manual provides a headset that can be equipped with a larger circuit area within the limited circuit board compartment space.

[0044] Figure 1 shows a schematic diagram of the structure of headphones 001 provided according to some embodiments of this specification. Headphones 001 provided herein may include a speaker unit 030 and a circuit board compartment 010. In some embodiments, headphones 001 may also include a power supply compartment 040. Power supply compartment 040 may contain a battery for powering active components within the headphones.

[0045] The speaker unit 030 can convert the received audio electrical signal into sound waves. The number of speaker units 030 can be one or two. In some embodiments, for usage scenarios that do not require high stereo sound, such as hearing aids for hearing-impaired patients, host prompting, etc., the number of speaker units 030 can be one. During use, the user can wear the earphones on the left ear or the right ear. In some embodiments, as shown in Figure 1, the number of speaker units 030 can be two. Earphones with dual speaker units can be used in usage scenarios that require stereo effects to enhance the listening experience. This manual will introduce earphones containing two speaker units as an example.

[0046] In some embodiments, the speaker unit 030 can be directly or indirectly connected to the circuit board compartment 010. In the earphone shown in Figure 1, one speaker unit 031 is directly connected to the circuit board compartment 010 via one ear hook 021, while the other speaker unit 032 is connected to the power supply compartment 040 via the other ear hook 022, and then connected to the rear hook 050 via an adapter inside the power supply compartment 040, and then indirectly connected to the circuit board compartment 010 via the rear hook 050.

[0047] Figure 2 shows a partial exploded view according to some embodiments of this specification. As shown in the exploded view of area A in Figure 2, circuit board compartment 010 includes a housing 100 and a storage space enclosed by housing 100. The storage space can be used to store the circuit boards of earphones 001. Housing 100 includes a first housing 110 and a second housing 120, which together form the storage space.

[0048] To ensure comfortable wearing of the earphones 001, the circuit board compartment 010 can be shaped like a flat, elongated strip. When worn, the side of the circuit board compartment 010 closest to the user's skin and the sides of the ear hook 020 and rear hook 050 closest to the user's skin lie roughly on a smooth, curved surface. This ensures ergonomic fit and prevents or mitigates any pressure or unevenness caused by the protrusion of the circuit board compartment 010 near the user's skin. To ensure stable wearing of the earphones 001, the volume or mass of the circuit board compartment 010 and the power supply compartment 040 should be as close as possible to prevent the earphones 001 from tilting to one side during wear. To ensure aesthetics, the earphones 001 can be designed to be roughly symmetrical, meaning the shapes of the circuit board compartment 010 and power supply compartment 040 can be roughly the same. Given the need for miniaturization and lightweight design of the earphones 001, the shapes and sizes of the circuit board compartment 010 and power supply compartment 040 should be minimized. Therefore, it is necessary to provide an earphone 001 that can expand the circuit board area within the circuit board compartment 010 space with limited shape and volume.

[0049] In some embodiments, the thickness of the circuit board compartment 010 ranges from 0.4 cm to 1.6 cm. Furthermore, to provide a better wearing experience and reduce or avoid the pressure of the circuit board compartment 010 on the user's skin, in some embodiments, the thickness of the circuit board compartment 010 ranges from 0.5 cm to 1.3 cm. In some embodiments, the thickness of the circuit board compartment 010 ranges from 0.6 cm to 1 cm. In some embodiments, the length of the circuit board compartment 010 ranges from 2 cm to 5 cm. Furthermore, to improve the wearing stability of the earphones 001 and prevent the excessive length of the circuit board compartment 010 from causing the overall center of gravity of the earphones 001 to shift backward, in some embodiments, the length of the circuit board compartment 010 ranges from 2.5 cm to 4.5 cm. In some embodiments, the length of the circuit board compartment 010 ranges from 3 cm to 4 cm. The maximum distance between the side of the circuit board compartment 010 facing away from the user's skin and the side facing the user's skin is the thickness of the circuit board compartment 010, and the distance between the connection between the circuit board compartment 010 and the ear hook 020 and the connection between the circuit board compartment 010 and the rear hook 050 is the length of the circuit board compartment 010.

[0050] The earphones 001 provided in this specification expand the circuit board area by designing the circuit board on the first circuit board 210 and the second circuit board 220, and fully utilize the storage space of the circuit board compartment 010 by arranging the two circuit boards in double layers.

[0051] Due to the limited space of the circuit board compartment 010, it is necessary to consider improving the utilization rate of the storage space in the direction perpendicular to the surface of the first circuit board 210. The thickness of the double-layer circuit board structure 200 is the actual longitudinal space required. Since there are components of different heights on the circuit board, the thickness is the maximum distance between the first circuit board 210 and its components and the second circuit board 220 and its components in the direction perpendicular to the surface of the first circuit board 210. As mentioned above, the thickness of the circuit board compartment 010 is the maximum distance between the side of the circuit board compartment 010 away from the user's skin and the side close to the user's skin. The ratio of the thickness of the circuit board compartment 010 to the thickness of the double-layer circuit board structure 200 is greater than 1.0. The closer this ratio is to 1.0, the higher the utilization rate of the storage space of the double-layer circuit board structure 200 in the direction perpendicular to the surface of the first circuit board 210. In some embodiments, the ratio of the thickness of the circuit board compartment 010 to the thickness of the double-layer circuit board structure 200 is less than or equal to 1.5.

[0052] Furthermore, it is also necessary to consider improving the utilization rate of the accommodation space in the direction parallel to the surface of the first circuit board 210. The combined area of ​​the first circuit board 210 and the second circuit board 220 in the direction of the first circuit board 210 along the surface of the board is the minimum area actually required by the double-layer circuit board structure 200. The combined area should be smaller than the cross-sectional area of ​​the accommodation space in this direction, that is, the ratio of the maximum cross-sectional area of ​​the accommodation space to the combined area of ​​the first circuit board 210 and the second circuit board 220 in the direction of the first circuit board 210 along the surface of the board is greater than 1.0. The closer this ratio is to 1.0, the higher the utilization rate of the accommodation space in the direction of the first circuit board 210 by the double-layer circuit board structure 200. In some embodiments, the ratio of the maximum cross-sectional area of ​​the accommodation space to the combined area of ​​the first circuit board 210 and the second circuit board 220 in the direction of the first circuit board 210 along the surface of the board is less than or equal to 1.5.

[0053] In addition to considering the overall space utilization of the double-layer circuit board structure 200 in the board direction, the relative position between the two circuit boards within the double-layer circuit board structure 200 should also be considered. The first circuit board 210 and the second circuit board 220 are arranged in a double layer, and the overlapping area between the two along the board direction of the first circuit board 210 is greater than 0. In some technical fields, IoU (intersection over union) is used to measure the similarity between two indicators to be compared. For the double-layer circuit board structure 200 of the earphones 001 provided in this specification, IoU can be used to measure the degree of overlap between the two circuit boards. In the board direction of the first circuit board 210, the ratio of the overlapping area of ​​the first circuit board 210 and the second circuit board 220 to the area of ​​the union of the two, that is, IoU, is less than or equal to 1.0. IoU can only reach 1.0 when the areas of the first circuit board 210 and the second circuit board 220 are the same and completely overlap. The closer the IoU is to 1.0, the greater the degree of overlap between the two circuit boards in the double-layer circuit board structure 200. In some embodiments, in the surface direction of the first circuit board 210 , a ratio of an overlapping area of ​​the first circuit board 210 and the second circuit board 220 to a combined area of ​​the first circuit board 210 and the second circuit board 220 is greater than or equal to 0.2.

[0054] In summary, the earphones 001 provided herein utilize the longitudinal space within the circuit board compartment 010 perpendicular to the surface of the first circuit board 210 by forming a dual-layer circuit board structure 200 with a first circuit board 210 and a second circuit board 220. Furthermore, by overlapping the dual-layer circuit board structure 200, the transverse space within the circuit board compartment 010 parallel to the surface of the first circuit board 210 can be utilized.

[0055] FIG3 illustrates a schematic diagram of a double-layer circuit board structure 200 provided according to some embodiments of this specification. The double-layer circuit board structure 200 may include a first circuit board 210, a second circuit board 220, and a connector 230. The connector 230 may be used to connect the first circuit board 210 and the second circuit board 220, thereby establishing electrical communication between them. For example, the connector 230 may be a board-to-board connector as shown in FIG3 , with the first circuit board 210 and the second circuit board 220 positioned parallel to each other on opposite sides of the board-to-board connector, forming the double-layer circuit board structure 200. For example, the connector 230 may include a flexible circuit board, with the first circuit board 210 and the second circuit board 220 foldably connected and arranged parallel to each other via the flexible circuit board, forming the double-layer circuit board structure 200. In some embodiments, the connector 230 may also include a terminal connector for use with the flexible circuit board. For another example, the connector 230 may be a wire, with the first circuit board 210 and the second circuit board 220 foldably connected and arranged parallel to each other via the wire, forming the double-layer circuit board structure 200.

[0056] In some embodiments, the first circuit board 210 may include a control element, which may be an MCU (Microcontroller Unit). The control element may send control signals or instructions to the elements connected thereto, or perform one-way or two-way transmission of data signals thereto. In some embodiments, the control element may be connected to a radio frequency device to receive and transmit wireless signals, for example, by at least one of Bluetooth, NFC, or Wifi, to achieve communication with an external media player or a main-end device. In some embodiments, the control element may achieve communication with the main-end device in a wired manner through a wired transmission interface. In some embodiments, the control element may perform audio data decoding or digital-to-analog conversion, converting the digital signal into an analog signal and then transmitting it to the speaker unit.

[0057] In some embodiments, the first circuit board 210 may include a power amplifier. The power amplifier is used to amplify the power of a received analog signal and then transmit it to a speaker so that the sound can be heard. The control element and the power amplifier are electrically connected to receive a control signal or an electrical sound signal sent by the control element.

[0058] In some embodiments, the first circuit board 210 may further include a Bluetooth antenna 211. The control element may establish a connection with an external device via the Bluetooth antenna 211 to receive and play audio data sent by an external media player, that is, to play music via a Bluetooth connection.

[0059] The earphones 001 provided in this specification can perform local audio playback. In some embodiments, the local audio playback function can be implemented by an MP3 module. The functions of the MP3 module may include at least one of importing and storing audio files, decoding and playing audio files, volume adjustment, or song switching. The MP3 module may include at least part of the components and corresponding circuits on the second circuit board 220. Specifically, the MP3 module can be completely set on the second circuit board 220, or the MP3 module can be partially set on the second circuit board 220 and partially set on the first circuit board 210. For example, the audio storage unit can be set on the second circuit board 220, and the volume button can be set on the first circuit board 210.

[0060] The MP3 module may include a data unit. The data unit may import audio data from an external device and store it. The data unit may read the stored audio data and play it through a speaker during audio playback. In some embodiments, the second circuit board 220 may include a data unit, and the data unit and the first circuit board 210 may transmit signals to each other via a connector 230 when in operation. When importing data, the control unit on the first circuit board 210 may synchronize the clock signal with the data unit, and the connector 230 may transmit the clock signal. When reading data, the control unit on the first circuit board 210 may receive audio data from the data unit. In some embodiments, the data unit may include a data input / output circuit and a memory 221. The memory 221 is used to store audio data, and the memory is electrically connected to the data input / output circuit to enable data import and export.

[0061] In some embodiments, the data input / output circuitry can be located on the side of the second circuit board 220 facing the first circuit board 210. Data transmission in the data input / output circuitry is accompanied by high-frequency clock signals and rapidly changing data signals. The definition of high frequency varies across different technical fields. In the definition of high-speed circuitry, if the clock frequency in an electronic system reaches or exceeds 50 MHz, the circuit system is considered high-speed and the clock frequency is considered high frequency. References to high frequency in this specification should refer to this definition. High-frequency signals can cause many problems in circuit systems. For example, electromagnetic radiation generated by high-frequency signals may cause crosstalk within the circuit system, resulting in timing errors or affecting the sensitivity of components. For example, electromagnetic waves generated by high-frequency signals may radiate externally through component surfaces or interfaces, causing electromagnetic interference to other electronic devices. For another example, circuits containing high-frequency signals are more likely to couple with external electromagnetic radiation, causing electromagnetic interference to the data input / output circuitry. To address the above issues, the earphones 001 provided in this specification can provide signal shielding for the data input / output circuitry.

[0062] In some embodiments, a signal shielding component 300 may be provided over the entire data input / output circuit, or over part of the data input / output circuit, to at least partially block the electromagnetic radiation generated during audio data transmission. At the same time, it also reduces the interference that external electromagnetic radiation may cause to the data input / output circuit. In some embodiments, the signal shielding component 300 may be a semi-enclosed metal cover with an open side, which is provided over the data input / output circuit with the open side facing the data input / output circuit and abuts against the second circuit board 220. In some embodiments, the signal shielding component 300 is made of a metal material with low resistivity, and utilizes the eddy currents generated in the metal to form a counteracting effect on external electromagnetic waves, thereby achieving a shielding effect. The signal shielding component 300 is grounded.

[0063] In some embodiments, a conductive buffer pad can be provided between the first circuit board 210 and the signal shielding component 300. The conductive buffer pad abuts the first circuit board 210 and the signal shielding component 300 to increase the electrical connection between the ground wires of the first circuit board 210 and the second circuit board 220, thereby reducing the signal loop area between the two boards. Since the outer surface of the conductive buffer pad is a conductive layer, the signal shielding component can be electrically connected to the first circuit board 210, and the second circuit board 220 is also grounded to the first circuit board 210. The signal loop area is reduced and the electromagnetic radiation in the circuit is suppressed. On the other hand, since the conductive buffer pad is made of a buffer material, it can play a supporting and buffering role when provided between the first circuit board 210 and the second circuit board 220. In some embodiments, the conductive buffer pad is bonded to the surface of the signal shielding component 300. In some embodiments, the conductive buffer pad can be a conductive foam.

[0064] In some embodiments, the memory 221 can be located on a side of the second circuit board 220 away from the first circuit board 210. The data input / output circuit is located between the first circuit board 210 and the second circuit board 220, and is also covered with a signal shielding component 300 and a conductive buffer pad, thus occupying a relatively large area. Therefore, the memory 221 can be installed on the other side of the second circuit board 220 to reduce the area of ​​the second circuit board 220. Furthermore, arranging the data input / output circuit and the memory 221 on opposite sides of corresponding locations on the second circuit board 220 shortens the wiring between them, thereby reducing signal delay.

[0065] The headset 001 provided in this specification features a reasonable layout for the data unit. On one hand, it fully utilizes the layout space on both sides of the second circuit board 220, thereby reducing the area of ​​the second circuit board 220 itself. On the other hand, the double-layer circuit board structure allows the combined use of a signal shielding component 300 and a conductive buffer pad between the two circuit boards, increasing the grounding area of ​​the two boards and reducing the signal loop area, thereby reducing external electromagnetic radiation. On the other hand, the conductive buffer pad provides physical support and buffering for the first circuit board 210, maintaining relative parallelism and stability between the two circuit boards.

[0066] As shown in Figure 3, the circuit board compartment 010 may also include a button 400. For example, the circuit board compartment 010 includes a play button, a pause button, and the like of an MP3 player. The number of buttons 400 may be one or more. In some embodiments, the button 400 may be a volume adjustment button. The button 400 may include a button cap, an elastic member, and a switch circuit, and the switch circuit is electrically connected to the first circuit board 210 or the second circuit board 220. The button cap includes a cap portion and a rod portion, and the cap portion is at least partially exposed outside the housing 100 to receive a user's pressing operation. The rod portion passes through the button hole, and when not pressed, there is no elastic force between the rod portion and the elastic member. When pressed, the pressure is transmitted to the elastic member through the rod portion, causing the elastic member to move toward the switch circuit. The switch circuit converts the received user button operation into an electrical signal and transmits it to the control element on the first circuit board 210. In some embodiments, when viewed along the gap left between the first circuit board 210 and the second circuit board 220, the one or more buttons 400 are entirely or partially disposed between the first circuit board 210 and the second circuit board 220, wherein at least the switch circuit portion is located between the two circuit boards. Accordingly, the housing 100 further includes a corresponding number of button holes at corresponding positions. In this way, on the assembled earphones, each button 400 is inserted into the corresponding button hole. As shown in FIG3 , the thickness of the button should be less than or equal to the distance between the first circuit board 210 and the second circuit board 220, so that the button 400 can move freely in the gap left between the first circuit board 210 and the second circuit board 220 when pressed without getting stuck, wherein the thickness is the maximum distance of the switch circuit along a direction perpendicular to the surface of the first circuit board.

[0067] The earphones 001 provided in this specification have a reasonable layout of buttons. At least one button is completely or partially located between the two circuit boards, making full use of the gap between the two boards without taking up additional vertical space.

[0068] Next, we will introduce how the double-layer circuit board structure 200 of the earphone 001 provided in this specification maintains a stable position within the circuit board compartment 010.

[0069] Figure 4 shows a schematic diagram of the internal structure of a circuit board magazine 010 according to some embodiments of this specification. The housing 100 of the circuit board magazine 010 may include at least one positioning post 111. This specification illustrates the at least one positioning post being located on the first housing 110, but it should be understood that the one or more positioning posts can be located on either the first housing 110 or the second housing 120. The first circuit board 210 and the second circuit board 220 may be provided with one or more positioning holes and / or one or more positioning notches. These positioning holes or positioning notches may be provided entirely or partially on one of the first and second circuit boards 210, 220. For example, in some embodiments, the first circuit board 210 may be provided with at least one positioning hole and / or at least one positioning notch, while the second circuit board 220 may be provided with no positioning holes or positioning notches. In some embodiments, the second circuit board 220 may be provided with at least one positioning hole and / or at least one positioning notch, while the first circuit board 210 may be provided with no positioning holes or positioning notches. In some embodiments, the first circuit board 210 may be provided with at least one positioning hole and / or at least one positioning notch, while the second circuit board 220 may also be provided with at least one positioning hole and / or at least one positioning notch. Furthermore, one or more positioning posts 111 are provided on the first housing 110. These positioning posts 111 are provided through the one or more positioning holes or positioning notches to limit the movement of the first circuit board 210 and the second circuit board 220 relative to the circuit board compartment 010 along their respective board surface directions, thereby fixing the first circuit board 210 and the second circuit board 220 in their respective board surface directions.

[0070] In some embodiments, at least one of these positioning posts 11 has the structure of a target positioning post. The target positioning post includes a column body and an enlarged column head, wherein the column body is fixedly connected to the first housing 110 and passes through the first circuit board 210 and the second circuit board 220, and the column head abuts against the side of the first circuit board 210 or the second circuit board 220 away from the first housing 110 to fix the first circuit board 210 and the second circuit board 220 along the axis of the column body. In other words, the enlarged column head of the target positioning post can limit the movement of the first circuit board 210 and the second circuit board 220 relative to the circuit board bin 010 in a direction perpendicular to the first circuit board 210 or the second circuit board 220. In some embodiments, the target positioning post can be a hot melt column, and the column head is deformed after being hot melted to fix the double-layer circuit board structure 200. The target positioning post can also be a screw, wherein the screw portion corresponds to the main body and the nut portion corresponds to the column head. Of course, the target positioning post can also have other forms of structure.

[0071] As shown in Figure 4, three positioning posts 111-1, 111-2, and 111-3 can be provided on the first housing 110. These three positioning posts are all targeted positioning posts and are evenly spaced around the accommodating space. On the one hand, the even placement of the three positioning posts can stably restrict the movement of the first and second circuit boards 210, 220 relative to the circuit board compartment 010, along the direction of the first or second circuit board 210, 220. On the other hand, this even placement also ensures that when the posts are used to restrain the circuit boards along the axis of the posts, the force applied to the circuit boards is more even, helping to maintain the stable parallelism of the two-layer circuit boards.

[0072] In some embodiments, glue may be applied to the position where at least one positioning column on the side of the first circuit board 210 or the second circuit board 220 close to the first shell 110 contacts at least one positioning hole / positioning notch to fix the side of the first circuit board 210 or the second circuit board 220 close to the first shell 110 along the axial direction of the positioning column.

[0073] Furthermore, the circuit board compartment 010 of the earphones 001 provided in this specification may also be provided with a accommodating cavity. The accommodating cavity is used to accommodate and limit the movement of components on the circuit board along the direction of the circuit board, thereby limiting the movement of the circuit board where the components are located along the direction of the board surface. In some embodiments, an accommodating cavity may be provided in the first shell 110 of the circuit board compartment 010 to accommodate the corresponding target component and limit the movement of the circuit board where the target component is located along the direction of the board surface. The target component is the component with the highest height on the surface of the circuit board where it is located in the direction perpendicular to the board surface. For example, the memory on the second circuit board 220 is higher than other electronic components on the same board, and can serve as an "anchor point" to further fix the second circuit board 220 when it is assembled into the circuit board compartment. Accordingly, a accommodating cavity with matching shape can be provided at the corresponding position of the inner wall of the circuit board compartment 100, so that the second circuit board 220 is just embedded in the accommodating cavity when it is assembled into the circuit board compartment 110, thereby further fixing the second circuit board 220.

[0074] In order to allow the target component to be smoothly inserted into the accommodating cavity without affecting other components such as the circuit board itself, the depth of the accommodating cavity is designed to be less than or equal to the height of the target component relative to the surface of the circuit board on which it is located. This design, on the one hand, allows the target component to abut against the first housing 110, thereby limiting the target component's movement toward the first housing 110 in a direction perpendicular to the surface of the board. On the other hand, it prevents the top of the accommodating cavity wall from abutting against the circuit board, thereby avoiding possible damage to the circuit board. It can be imagined that the number of accommodating cavities can be one or more, and the number of target components can also be one or more.

[0075] In the above application scenario, the target component is memory 221, which is located on the side of second circuit board 220 away from first circuit board 210. The side of memory 221 facing outward from the double-layer circuit board structure 200 is large and has a regular shape. Therefore, placing it in the accommodating cavity can effectively stabilize the double-layer circuit board structure 200.

[0076] To further enhance the structural stability of the components after assembly and improve product quality, the earphones 001 provided herein may also include a cushioning member. In some embodiments, the cushioning member may be located in the gap formed between the shorter of the two circuit boards and the longer of the two circuit boards and the housing 100 of the circuit board compartment 010. In some embodiments, the cushioning member is located between the first circuit board 210 and the housing 100 of the circuit board compartment 010, abutting against both the first circuit board 210 and the housing 100 to provide support for the first circuit board 210 perpendicular to its surface. Figure 5 illustrates a schematic diagram of a double-layer circuit board structure provided in accordance with some embodiments of this specification. As shown in Figure 5, the cushioning member 500 is bonded to a portion of the first circuit board 210 that faces the second circuit board 220 and protrudes relative to the second circuit board 220. The cushioning member 500 is located in the gap formed between the second circuit board 220 and the housing 100 of the circuit board compartment 010, providing support between the first circuit board 210 and the housing 100. The shape and size of the cushioning member 500 can be adjusted based on the relative positions of the first and second circuit boards 210, 220. The thickness of the buffer member 500 is not less than the distance between the first circuit board 210 and the housing 100 , so as to form a support between the first circuit board 210 and the housing 100 .

[0077] The double-layer circuit board structure 200 of the earphone 001 provided in this specification can be stably assembled in the circuit board bin 010 thanks to: on the one hand, positioning columns and / or accommodating cavities can be set on the shell 100 of the circuit board bin 010 to limit the movement of the double-layer circuit board structure 200 along the board surface direction; on the other hand, target positioning columns and / or buffer parts can be set on the shell 100 of the circuit board bin 010 to limit the movement of the double-layer circuit board structure 200 along the direction perpendicular to the board surface.

[0078] In actual production, product iterations and updates are extremely rapid, especially for electronic devices. If the housing had to be redesigned and then molded for production for each update, the costs would be enormous. The earphones 001 provided in this specification can be re-used without replacing the housing, meaning the housing of the original model remains. By utilizing a double-layer circuit board design, a larger circuit board area can be placed in the circuit board compartment 010 of the earphones 001, thereby reducing mold costs. For ease of description, the earphones 001 provided in this specification are the first model earphones, and the original model earphones are the second model earphones. In some embodiments, the circuit board compartment 010 of the first model earphones and the second model earphones are identical in at least their outer shape and dimensions. Furthermore, the first model earphones can be expanded and upgraded directly based on the first circuit board of the second model earphones, with functional modules that need to be updated or added being located on the second circuit board 220, further reducing circuit design costs. In some embodiments, the circuit board compartment 010 of the second model earphones may not include a second circuit board, but may contain only a single circuit board or a replaceable second circuit board. In some embodiments, specific functional modules, such as those that are easily damaged or require rapid iteration, can be located on the second circuit board. In this way, the coupling degree between the functional modules on the second circuit board and the first circuit board module can be minimized during circuit design, thereby reducing the difficulty and cost of repairing and updating the headphones, and improving the maintainability and scalability of the headphones.

[0079] In summary, the earphones 001 provided in this specification can be provided with a double-layer circuit board structure 200 in a circuit board compartment 010 with limited space, thereby expanding the area of ​​the circuit board. The double-layer circuit board structure 200 improves the utilization rate of the longitudinal space of the accommodating space while making full use of the lateral space of the accommodating space. At the same time, by utilizing the structural characteristics of the double-layer circuit board, a conductive buffer structure is provided between the two circuit boards to increase the grounding point, thereby reducing the signal loop area and reducing external electromagnetic radiation. Furthermore, the earphones 001 provided in this specification can maintain the stability of the double-layer circuit board structure 200 in the circuit board compartment 010. Furthermore, the earphones 001 provided in this specification can use the shell of an existing model of earphones to assemble the double-layer circuit board structure 200, which can reduce production costs.

[0080] The foregoing description describes specific embodiments of the present application. Other embodiments are within the scope of the appended claims. In some cases, the actions or steps recited in the claims may be performed in an order different from that described in the embodiments and still achieve the desired results. Furthermore, the processes depicted in the accompanying drawings do not necessarily require a specific or sequential order to achieve the desired results. In certain embodiments, multitasking and parallel processing are also possible or may be advantageous.

[0081] In summary, after reading this detailed disclosure, those skilled in the art will appreciate that the foregoing detailed disclosure may be presented by way of example only and may not be limiting. Although not expressly stated herein, those skilled in the art will understand that the present application requires various reasonable changes, improvements, and modifications to the embodiments. Such changes, improvements, and modifications are intended to be proposed by the present application and are within the spirit and scope of the exemplary embodiments of the present application.

[0082] In addition, certain terms in this application have been used to describe embodiments of the application. For example, "one embodiment," "an embodiment," and / or "some embodiments" mean that a particular feature, structure, or characteristic described in conjunction with that embodiment may be included in at least one embodiment of the application. Therefore, it is emphasized and should be understood that two or more references to "an embodiment," "one embodiment," or "an alternative embodiment" in various sections of this application do not necessarily refer to the same embodiment. Furthermore, particular features, structures, or characteristics may be appropriately combined in one or more embodiments of the application.

[0083] It should be understood that in the foregoing description of the embodiments of this application, in order to facilitate understanding of a feature and to simplify this application, this application combines various features into a single embodiment, figure, or description thereof. However, this does not mean that the combination of these features is required. When reading this application, it is entirely possible for a person skilled in the art to mark out some of the devices and understand them as separate embodiments. In other words, the embodiments of this application can also be understood as the integration of multiple secondary embodiments. This also applies when the content of each secondary embodiment is less than all the features of a single aforementioned disclosed embodiment.

[0084] Each patent, patent application, patent application publication, and other materials, such as articles, books, specifications, publications, documents, articles, and the like, cited herein, except any historical prosecution documents to which it relates, any equivalent that may be inconsistent or conflicting with this document, or any equivalent historical prosecution documents that may have a limiting effect on the broadest scope of the claims, is hereby incorporated by reference for all purposes now or hereafter connected with this document. In addition, in the event of any inconsistency or conflict between the descriptions, definitions, and / or use of terms associated with any incorporated material and the terminology, descriptions, definitions, and / or use associated with this document, the terminology in this document shall control.

[0085] Finally, it should be understood that the embodiments of the application disclosed herein are illustrations of the principles of the embodiments of the present application. Other modified embodiments are also within the scope of the present application. Therefore, the embodiments disclosed in the present application are merely examples and not limitations. Those skilled in the art can adopt alternative configurations based on the embodiments in the present application to implement the applications in the present application. Therefore, the embodiments of the present application are not limited to the embodiments precisely described in the application.

Claims

1. An ear-hanging type earphone, characterized in that, Comprising: A speaker unit for converting an input into sound; And A circuit board compartment including a receiving space; And A first circuit board, a second circuit board, and a connector, wherein The first circuit board and the second circuit board are connected by the connector within the receiving space to form a double-layer circuit board structure for utilizing the longitudinal space perpendicular to the plane of the first circuit board in the circuit board compartment.

2. The earphone according to claim 1, wherein The connector is a board-to-board connector, and the first circuit board and the second circuit board are arranged in parallel on both sides of the board-to-board connector to form the double-layer circuit board structure; or The connector includes a flexible circuit board, and the first circuit board and the second circuit board are foldably connected and arranged in parallel through the flexible circuit board to form the double-layer circuit board structure.

3. The earphone according to claim 1 or 2, characterized in that, In the plane direction of the first circuit board, the ratio of the overlapping area of the first circuit board and the second circuit board to the union area of the two is greater than or equal to 0.

2.

4. The earphone according to any one of claims 1-3, characterized in that, The ratio of the maximum cross-sectional area of the receiving space to the union area of the first circuit board and the second circuit board in the plane direction of the first circuit board is less than or equal to 1.

5.

5. The earphone according to any one of claims 1-4, characterized in that, The thickness ratio of the circuit board compartment to the thickness of the double-layer circuit board structure is less than or equal to 1.5, wherein The thickness of the double-layer circuit board structure is the maximum distance between the first circuit board and its components and the second circuit board and its components in the direction perpendicular to the plane of the first circuit board.

6. The earphone according to any one of claims 1-5, characterized in that The thickness of the circuit board compartment is in the range of 0.6 cm to 1 cm.

7. The earphone according to any one of claims 1 to 6, characterized in that The length of the circuit board compartment is in the range of 3 cm to 4 cm.

8. The earphone according to any one of claims 1-7, characterized in that, The second circuit board includes a data unit, The data unit and the first circuit board transmit signals to each other through the connector during operation, wherein the first circuit board and the second circuit board are arranged in a double layer.

9. The earphone according to claim 8, wherein, The data unit includes: A data input / output circuit provided on one side of the second circuit board facing the first circuit board; and A memory for storing audio data, electrically connected to the data input / output circuit, and the memory is provided on the side of the second circuit board away from the first circuit board.

10. The earphone according to any one of claims 1-9, characterized in that, Including an MP3 module, and the MP3 module includes at least part of the second circuit board.

11. The earphone according to claim 9 or 10, characterized in that, Further comprising: A signal shielding component at least partially covering the data input / output circuit to at least partially block electromagnetic radiation generated during audio data transmission.

12. The earphone according to claim 11, wherein, Further comprising: A conductive buffer pad located between the first circuit board and the signal shielding component and abutting against the first circuit board and the signal shielding component to increase the electrical connection of the ground wires of the first circuit board and the second circuit board and reduce the signal loop area between the two boards.

13. The earphone according to any one of claims 1 to 12, characterized in that, The housing of the circuit board compartment includes at least one positioning post; and At least one positioning hole and / or at least one positioning notch are provided on the first circuit board and the second circuit board, Wherein, the at least one positioning post passes through the at least one positioning hole or the at least one positioning notch to fix the first circuit board and the second circuit board in their respective plane directions.

14. The earphone according to claim 13, wherein, At least one target positioning post among the at least one positioning post includes a column body and an enlarged column head. The column body is fixedly connected to the housing and passes through the first circuit board and the second circuit board. The column head abuts against the side of the first circuit board or the second circuit board away from the housing, so as to fix the first circuit board and the second circuit board along the axial direction of the column body.

15. The earphone according to any one of claims 1 to 14, characterized in that, At least one accommodating cavity is provided in the housing of the circuit board bin to accommodate at least one target component and limit the movement of the circuit board where the at least one target component is located in the plane direction of the board. The target component is the component with the highest height in the direction perpendicular to the plane of the circuit board where it is located; and The depth of the accommodating cavity is less than or equal to the height of the target component relative to the plane of the circuit board where it is located.

16. The earphone according to claim 15, characterized in that, The target component is a memory, and the memory is arranged on the side of the second circuit board away from the first circuit board.

17. The earphone according to any one of claims 1 to 16, characterized in that, Further included is: A buffer member, located between the first circuit board and the housing of the circuit board bin, and abutting against the first circuit board and the housing.

18. The earphone according to any one of claims 1-17, characterized in that, Further included are at least one button, at least part of the at least one button is arranged between the first circuit board and the second circuit board, and the button is electrically connected to the first circuit board or the second circuit board. At least one button hole is further provided on the housing, and the at least one button passes through the at least one button hole.

19. The earphone according to claim 18, wherein The thickness of the button is less than or equal to the distance between the first circuit board and the second circuit board.

20. The earphone according to any one of claims 1-19, characterized in that, The earphone is a first model earphone, and The circuit board bin is the same in shape and the size of the shape as the circuit board bin of a second model earphone, and the second circuit board is not included in the circuit board bin of the second model earphone.

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