Blade pin for electrical connection test for semiconductor
By designing a multi-layer telescopic shrapnel needle, the problem of insufficient accuracy and strength on the traditional testing method on miniaturized semiconductor products is solved, and the low resistance current path is achieved, which improves the accuracy and mechanical strength of the test.
Patent Information
- Application Number
- PCT/CN2024/071335
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2023-12-27
- Filing Date
- 2024-01-09
- Publication Date
- 2025-07-03
AI Technical Summary
Traditional double thimble or double gold finger testing methods are difficult to achieve high-precision and high mechanical strength electrical functional testing on miniaturized semiconductor products, and traditional shrapnel needles produce a large voltage drop during high current testing, which affects the numerical judgment of the test.
A shrapnel needle including an integrated shrapnel needle head, shrapnel needle body and shrapnel needle tail is designed, adopting a multi-layer telescopic shrapnel structure, providing stroke through the first and third telescopic shrapnel structures, and providing stable elasticity, realizing a low resistance current path.
While maintaining the consistency of elasticity and stroke, the resistance value is significantly reduced, the test accuracy and mechanical strength are improved, and the test value is ensured.
Smart Images
Figure CN2024071335_03072025_PF_FP_ABST
Abstract
Description
Shrapnel probe for semiconductor continuity test Technical Field
[0001] The present invention relates to the application field of semiconductor continuity testing, and in particular to a spring needle for semiconductor continuity testing. Background Art
[0002] The testing process is to test the electrical functions of the packaged products after IC packaging to ensure the functional integrity of the IC before leaving the factory. The tested products are classified according to their electrical functions, which serves as the basis for evaluating different grades of IC products. Finally, the products are visually inspected. Technical issues
[0003] Electrical function testing is a test of various electrical parameters of the product to ensure that the product can operate normally. Traditional two-point contact tests on the same terminal under test, such as the Kelvin test, often use a parallel arrangement of two ejector pins or two gold fingers. As semiconductor product size continues to shrink, the size of the terminals under test and the spacing between them are also shrinking. To accommodate this trend, the traditional parallel arrangement of two ejector pins or two gold fingers has become increasingly bottlenecked by the problem of fine spacing. Precision requirements are becoming increasingly stringent, and in some cases, it has become impossible to achieve. To achieve two-point contact testing within the limited space on the terminal under test, the ejector pins or gold fingers have become increasingly thinner, and their mechanical strength has also weakened. The test contacts of traditional ejector pins or gold fingers are susceptible to wear, especially when higher precision requirements are imposed and mechanical strength is relatively low. This wear is even greater, thus reducing the service life of the test fixture. To meet the growing demand for thinner and shorter semiconductors, spring-clip pins have emerged. However, to meet the requirements of spring force, travel, and space, the small elastic wire diameter of traditional spring-clip pins produces a large resistance value. Furthermore, when performing high-current tests, a large voltage drop can affect the interpretation of test values. Technical Solutions
[0004] In order to overcome the above shortcomings, the present invention provides a spring-type needle for semiconductor continuity testing, so as to achieve the purpose of meeting various requirements of low resistance stroke and spring force.
[0005] In order to achieve the above objectives, the technical solution adopted by the present invention is: a spring needle for semiconductor conduction testing, comprising an integrally formed spring needle head, a spring needle body and a spring needle tail, one end of the spring needle head contacts the object to be tested, and one end of the spring needle tail contacts the PCB board, the spring needle body comprises a first telescopic spring structure, a second telescopic spring structure and a third telescopic spring structure connected to each other, the other end of the spring needle head is provided with a first conductive contact end, the other end of the spring needle tail is provided with a second conductive contact end, one end of the second telescopic spring structure is provided with a third conductive contact end that cooperates with the first conductive contact end, and the other end of the second telescopic spring structure is provided with a fourth conductive contact end that cooperates with the second conductive contact end, the first conductive contact end and the third conductive contact end are in contact or away from each other through the telescopic state of the first telescopic spring structure, and the second conductive contact end and the fourth conductive contact end are in contact or away from each other through the telescopic state of the third telescopic spring structure.
[0006] Preferably, one end of the first telescopic spring structure is connected to the spring needle head, and the other end is connected to the second telescopic spring structure; one end of the third telescopic spring structure is connected to the spring needle tail, and the other end is connected to the second telescopic spring structure.
[0007] Preferably, the second telescopic elastic piece structure is a single-arch structure, and the first telescopic elastic piece structure and the third telescopic elastic piece structure are multi-arch structures.
[0008] Preferably, the first telescopic elastic piece structure and the third telescopic elastic piece structure have the same structure and shape, and are symmetrically distributed with respect to the second telescopic elastic piece structure.
[0009] Preferably, the width of the single arch structure of the second telescopic elastic piece structure is greater than the width of the single arch structure in the multi-arch structure of the first telescopic elastic piece structure and the third telescopic elastic piece structure, and is smaller than the width of the entire multi-arch structure.
[0010] Preferably, the second telescopic elastic piece structure is C-shaped or V-shaped.
[0011] Preferably, the shape structures of the first telescopic elastic piece structure and the third telescopic elastic piece structure are both three-section U-shaped elastic structures.
[0012] Preferably, the first conductive contact terminal and the third conductive contact terminal, and the second conductive contact terminal and the fourth conductive contact terminal are in contact with or away from each other at the same time.
[0013] Preferably, the structures of the first conductive contact terminal, the second conductive contact terminal, the third conductive contact terminal, and the fourth conductive contact terminal are the same or different.
[0014] Preferably, the first conductive contact terminal and the second conductive contact terminal have the same structure, both being rectangular parallelepiped structures, and the third conductive contact terminal and the fourth conductive contact terminal have the same structure, both being rectangular parallelepiped structures with rounded corners. Beneficial effects
[0015] The beneficial effects of the present invention are as follows: while being consistent with the shape, elastic force and stroke of conventional spring-loaded needles, it can provide a smaller resistance value and pass a larger current, while the elastic force, test accuracy and required space can be consistent with those of spring-loaded needles with existing structures; during testing, the elastic force is mainly provided by the second telescopic spring-loaded structure, the area affected by processing is smaller, and the elastic force consistency is better when multiple needles work simultaneously. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] FIG1 is a schematic structural diagram of this embodiment.
[0017] In the figure: 1. Spring pin head; 2. First conductive contact terminal; 3. Third conductive contact terminal; 4. Fourth conductive contact terminal; 5. Second conductive contact terminal; 6. Spring pin tail; 7. First telescopic spring structure; 8. Second telescopic spring structure; 9. Third telescopic spring structure. Modes for Carrying Out the Invention
[0018] The preferred embodiments of the present invention are described in detail below with reference to the accompanying drawings so that the advantages and features of the present invention can be more easily understood by those skilled in the art, thereby making a clearer and more precise definition of the protection scope of the present invention.
[0019] As shown in Figure 1, this embodiment discloses a spring needle for semiconductor conduction testing, including an integrally formed spring needle head 1, a spring needle body and a spring needle tail 6. One end of the spring needle head 1 contacts the object to be tested, and one end of the spring needle tail 6 contacts the PCB board. The spring needle body includes a first telescopic spring structure 7, a second telescopic spring structure 8 and a third telescopic spring structure 9 connected to each other. The other end of the spring needle head 1 is provided with a first conductive contact end 2, and the other end of the spring needle tail 6 is provided with a second conductive contact end 5. One end of the second telescopic spring structure 8 is provided with a third conductive contact end 3 that cooperates with the first conductive contact end 2, and the other end of the second telescopic spring structure 8 is provided with a fourth conductive contact end 4 that cooperates with the second conductive contact end 5. The first conductive contact end 2 and the third conductive contact end 3 are in contact or away from each other through the telescopic state of the first telescopic spring structure 7, and the second conductive contact end 5 and the fourth conductive contact end 4 are in contact or away from each other through the telescopic state of the third telescopic spring structure 9.
[0020] The shrapnel needle head 1 is connected to the head end of the shrapnel needle body, and the end of the shrapnel needle body is connected to the shrapnel needle tail 6, that is, one end of the first telescopic shrapnel structure 7 is connected to the shrapnel needle head 1, and the other end is connected to one end of the second telescopic shrapnel structure 8, one end of the third telescopic shrapnel structure 9 is connected to the shrapnel needle tail 6, and the other end is connected to the other end of the second telescopic shrapnel structure 8, the first telescopic shrapnel structure 7, the second telescopic shrapnel structure 8, and the third telescopic shrapnel structure 9 are also connected at the end, thereby realizing that the shrapnel needle head 1, the first telescopic shrapnel structure 7, the second telescopic shrapnel structure 8, the third telescopic shrapnel structure 9, and the shrapnel needle tail 6 are connected at the end.
[0021] Among them, the second telescopic spring structure 8 is a single arch structure, the first telescopic spring structure 7 and the third telescopic spring structure 9 are multi-arch structures, the first telescopic spring structure 7 and the third telescopic spring structure 9 have the same structure and shape, and are symmetrically distributed about the second telescopic spring structure 8. The width of the single arch structure of the second telescopic spring structure 8 is greater than the width of the single arch structure in the multi-arch structure of the first telescopic spring structure 7 and the third telescopic spring structure 9, and is smaller than the width of the multi-arch structure as a whole. The second telescopic spring structure 8 will withstand greater low resistance.
[0022] Most preferably, the shape of the second telescopic spring structure 8 is C-shaped or V-shaped, and the shape structures of the first telescopic spring structure 7 and the third telescopic spring structure 9 are both three-section U-shaped elastic structures, and the three-section U-shaped elastic structures are evenly distributed, so that the first telescopic spring structure 7 and the third telescopic spring structure 9 can be telescoped synchronously at the same time.
[0023] The first conductive contact terminal 2 and the third conductive contact terminal 3, the second conductive contact terminal 5 and the fourth conductive contact terminal 4 are in contact or away from each other at the same time. The structures of the first conductive contact terminal 2, the second conductive contact terminal 5, the third conductive contact terminal 3, and the fourth conductive contact terminal 4 can be the same or different. In this embodiment, the structures of the first conductive contact terminal 2 and the second conductive contact terminal 5 are the same, both are rectangular parallelepiped structures, and the structures of the third conductive contact terminal 3 and the fourth conductive contact terminal 4 are the same, both are rectangular parallelepiped structures with rounded corners.
[0024] Specifically, the spring needle head 1 contacts the object to be measured and is pressed down, and the elastic parts of the first telescopic spring structure 7, the second telescopic spring structure 8 and the third telescopic spring structure 9 are deformed at the same time, and the spring needle tail 6 contacts the PCB board; during the pressing process, the deformation of the elastic parts of the first telescopic spring structure 7 and the third telescopic spring structure 9 will be much greater than the deformation of the elastic part of the second telescopic spring structure 8. When the deformation reaches a certain extent, the first conductive contact end 2 contacts the third conductive contact end 3, and the second conductive contact end 5 contacts the fourth conductive contact end 4. At this time, the force is completely transferred to the second telescopic spring structure 8. After pressing down to a predetermined stroke, The current flows from the path of the spring needle head 1-first conductive contact terminal 2-third conductive contact terminal 3-fourth conductive contact terminal 4-second conductive contact terminal 5-spring needle tail 6 and the path of the spring needle head 1-first telescopic spring structure 7-second telescopic spring structure 8-third telescopic spring structure 9-spring needle tail 6, which is equivalent to a lower resistance path in parallel. Compared with the traditional spring needle single path, the resistance is greatly reduced. The elastic parts of the first telescopic spring structure 7 and the third telescopic spring structure 9 can provide a larger stroke, and the elastic part of the second telescopic spring structure 8 can provide a stable elastic force, which can meet various low-resistance stroke and elastic force requirements. After the external load is removed, the elastic energy parts of the first telescopic spring structure 7, the second telescopic spring structure 8, and the third telescopic spring structure 9 will return to their original state, and the spring needle will return to its initial length. Industrial Applicability
[0025] The above embodiments are only for illustrating the technical concept and features of the present invention. Its purpose is to enable people familiar with this technology to understand the content of the present invention and implement it. It cannot be used to limit the scope of protection of the present invention. Any equivalent changes or modifications made according to the spirit of the present invention should be included in the scope of protection of the present invention.
Claims
1. A shrapnel needle for semiconductor conduction testing, comprising an integrally formed shrapnel needle head, a shrapnel needle body, and a shrapnel needle tail. One end of the shrapnel needle head contacts the object to be measured, and one end of the shrapnel needle tail contacts the PCB board. It is characterized in that, The shrapnel needle body includes a first telescopic shrapnel structure, a second telescopic shrapnel structure, and a third telescopic shrapnel structure that are connected to each other. At the other end of the shrapnel needle head, a first conduction contact end is provided. At the other end of the shrapnel needle tail, a second conduction contact end is provided. At one end of the second telescopic shrapnel structure, a third conduction contact end that cooperates with the first conduction contact end is provided. At the other end of the second telescopic shrapnel structure, a fourth conduction contact end that cooperates with the second conduction contact end is provided. The first conduction contact end and the third conduction contact end are in contact or separated from each other through the telescopic state of the first telescopic shrapnel structure. The second conduction contact end and the fourth conduction contact end are in contact or separated from each other through the telescopic state of the third telescopic shrapnel structure.
2. The shrapnel needle for semiconductor conduction test according to claim 1, characterized in that, One end of the first telescopic shrapnel structure is connected to the shrapnel needle head, and the other end is connected to the second telescopic shrapnel structure. One end of the third telescopic shrapnel structure is connected to the shrapnel needle tail, and the other end is connected to the second telescopic shrapnel structure.
3. The shrapnel needle for semiconductor conduction test according to claim 2, characterized in that, The second telescopic shrapnel structure is a single-arch structure, and the first telescopic shrapnel structure and the third telescopic shrapnel structure are multi-arch structures.
4. The shrapnel needle for semiconductor conduction test according to claim 2, characterized in that, The first telescopic shrapnel structure and the third telescopic shrapnel structure have the same structure and shape, and are symmetrically distributed with respect to the second telescopic shrapnel structure.
5. The shrapnel needle for semiconductor conduction test according to claim 3, characterized in that The width dimension of the single-arch structure of the second telescopic shrapnel structure is greater than the width of the single-arch structure in the multi-arch structures of the first telescopic shrapnel structure and the third telescopic shrapnel structure, and less than the width of the overall multi-arch structure.
6. The shrapnel needle for semiconductor conduction test according to claim 2, wherein The shape of the second telescopic shrapnel structure is C-shaped or V-shaped.
7. The shrapnel needle for semiconductor conduction test according to claim 6, characterized in that, The shape structures of the first telescopic shrapnel structure and the third telescopic shrapnel structure are both three-segment U-shaped elastic structures.
8. The shrapnel needle for semiconductor conduction test according to claim 1, wherein The first conduction contact end and the third conduction contact end, and the second conduction contact end and the fourth conduction contact end are in contact or separated from each other simultaneously.
9. The shrapnel needle for semiconductor conduction test according to claim 1, characterized in that, The structures of the first conduction contact end, the second conduction contact end, the third conduction contact end, and the fourth conduction contact end are the same or different.
10. The shrapnel needle for semiconductor conduction test according to claim 9, characterized in that, The structures of the first conduction contact end and the second conduction contact end are the same, both being rectangular parallelepiped structures. The structures of the third conduction contact end and the fourth conduction contact end are the same, both being rectangular parallelepiped structures with rounded corners.
Citation Information
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