Circuit board and display module

Abstract

A circuit board and a display module. The circuit board comprises a substrate (600), and a plurality of voltage conversion units (510) and a plurality of light-emitting driving units (520), which are arranged on the substrate (600), wherein each voltage conversion unit (510) comprises an input end and an output end, and is configured to output a preset voltage; each light-emitting driving unit (520) is connected to the output end of the voltage conversion unit (510), and is configured to drive a light-emitting unit; the plurality of voltage conversion units (510) and the plurality of light-emitting driving units (520) are arranged in one-to-one correspondence, and the voltage conversion unit (510) is arranged between every adjacent light-emitting driving units (520); and each voltage conversion unit (510) comprises a first inductor (L1) and a second inductor (L2), which are connected in parallel and are arranged in a staggered manner. The voltage conversion unit (510) is arranged between every adjacent light-emitting driving units (520), and the first inductor (L1) and the second inductor (L2) in the voltage conversion unit (510) are arranged in a staggered manner, such that components with relatively high heat can be arranged in a dispersed manner, thereby improving the effect of heat addition between the components.

Description

Circuit boards and display modules

[0001] This application claims priority to Chinese patent application No. 202311836443.X filed on December 28, 2023. The contents of the above-mentioned Chinese patent application disclosure are hereby incorporated by reference in their entirety as a part of this application. Technical Field

[0002] At least one embodiment of the present disclosure relates to a circuit board and a display module. Background Art

[0003] With the development of light emitting diode (LED) technology, its application range is also expanding. In some liquid crystal display devices, a constant current board can output a constant current to the LED backlight, thereby ensuring the consistency of brightness and color of each LED. Summary of the Invention

[0004] At least one embodiment of the present disclosure provides a circuit board, comprising: a substrate; a plurality of voltage conversion units and a plurality of light-emitting driving units arranged on the substrate, the voltage conversion unit comprising an input end and an output end, and being configured to output a preset voltage; the light-emitting driving unit being connected to the output end of the voltage conversion unit, and being configured to drive the light-emitting unit; wherein the plurality of voltage conversion units and the plurality of light-emitting driving units are arranged in a one-to-one correspondence, and the voltage conversion unit is arranged between adjacent light-emitting driving units; the voltage conversion unit comprises a first inductor and a second inductor connected in parallel, and the first inductor and the second inductor are arranged in a staggered manner.

[0005] For example, according to an embodiment of the present disclosure, the circuit board includes a first edge close to the voltage conversion unit in a first direction, and the first direction is a direction from the voltage conversion unit to the light-emitting driving unit; the first inductor is spaced apart from the first edge in the first direction at a first spacing, and the second inductor is spaced apart from the first edge in the first direction at a second spacing, and the first spacing is different from the second spacing.

[0006] For example, according to an embodiment of the present disclosure, the difference between the first spacing and the second spacing is less than or equal to 1 / 2 of the width of the first inductor in the first direction.

[0007] For example, according to an embodiment of the present disclosure, the plurality of voltage conversion units include a first voltage conversion unit and a second voltage conversion unit located on both sides of a first light-emitting driving unit in a first direction, where the first direction is a direction from the voltage conversion unit to the light-emitting driving unit; the first voltage conversion unit includes a first inductor module, and the second voltage conversion unit includes a second inductor module; the distance between the first inductor module and the second inductor module in the first direction is y, there is a non-overlapping part between the orthographic projection of the first inductor on a first reference plane and the orthographic projection of the second inductor on the first reference plane, the size of the non-overlapping part in the first direction is h, and the size of the light-emitting driving unit in the first direction is x, then: y = a × x + b × h, 2 < a < 4, 1 < b < 3; where the second direction intersects the first direction, and the first reference plane is a plane perpendicular to the second direction.

[0008] For example, according to an embodiment of the present disclosure, the plurality of voltage conversion units include a first voltage conversion unit and a second voltage conversion unit located on both sides of a first light-emitting driving unit. The first voltage conversion unit includes a first inductor module, a first capacitor module, and a first switch module, and the second voltage conversion unit includes a second inductor module; the distance between the first inductor module and the second inductor module in a first direction is y, the size of the first inductor module in the first direction is y1, the size of the first capacitor module in the first direction is y2, and the size of the first switch module in the first direction is y3, then: y = k × y1 + y3 + 2 × y2, 1 < k < 3; where the first direction is a direction from the voltage conversion unit to the light-emitting driving unit.

[0009] For example, according to an embodiment of the present disclosure, the multiple voltage conversion units include a first voltage conversion unit and a second voltage conversion unit located on both sides of the first light-emitting driving unit, the first voltage conversion unit includes a first inductor module, a first capacitor module and a first switch module; the first inductor module includes the first inductor and the second inductor connected in parallel, the first inductor and the second inductor have a first interval in the second direction, the first capacitor module includes a first output capacitor module and a first input capacitor module connected in parallel, the first output capacitor module and the first input capacitor module have a second interval in the second direction, the first switch module includes a first switch and a second switch connected in parallel, the first switch and the second switch have a third interval in the second direction, the second voltage conversion unit includes a second capacitor module, the second capacitor module includes a second output capacitor module and a second input capacitor module connected in parallel, the second output capacitor module and the second input capacitor module have a fourth interval in the second direction; the fourth interval has an overlapping portion with at least one of the first interval, the second interval and the third interval on a second reference plane, the second reference plane being a plane perpendicular to the first direction, the first direction being a direction from the voltage conversion unit to the light-emitting driving unit, and the second direction being parallel to the substrate and intersecting with the first direction.

[0010] For example, according to an embodiment of the present disclosure, the first interval, the second interval, the third interval, and the fourth interval have a common overlapping portion on the second reference plane.

[0011] For example, according to an embodiment of the present disclosure, a size of the common overlapping portion in the second direction is smaller than or equal to a size of the first interval in the second direction.

[0012] For example, according to an embodiment of the present disclosure, a ratio of a size of the common overlapping portion in the second direction to a size of the first interval in the second direction is 0.3 to 0.7.

[0013] For example, according to an embodiment of the present disclosure, the first interval, the second interval, the third interval and the fourth interval are configured to satisfy at least one of the following conditions: the first interval is greater than or equal to 10 mm; the second interval is greater than or equal to 28 mm; the third interval is greater than or equal to 8 mm; the fourth interval is greater than or equal to 4 mm.

[0014] For example, according to an embodiment of the present disclosure, the second voltage conversion unit includes a second inductor module, and the second inductor module includes a third inductor and a fourth inductor arranged opposite to each other in a second direction; the second direction is parallel to the substrate and intersects with the first direction; the first interval is configured to satisfy at least one of the following conditions: the orthographic projection of the first interval on the second reference plane and the orthographic projection of the third inductor or the fourth inductor on the second reference plane have a first overlapping part; the size of the first overlapping part in the second direction is greater than 1 / 3 of the size of the third inductor or the fourth inductor in the second direction; the orthographic projection of the first interval on the second reference plane and the orthographic projection of the second input capacitor module on the second reference plane have a third overlapping part, and the size of the third overlapping part in the second direction is greater than 1 / 3 of the size of the second input capacitor module in the second direction.

[0015] For example, according to an embodiment of the present disclosure, a size of the first interval in the second direction is the same as a distance between the third inductor and the fourth inductor in the second direction.

[0016] For example, according to an embodiment of the present disclosure, the second interval is configured to satisfy at least one of the following conditions: the second voltage conversion unit includes a second inductance module, and the orthographic projection of the second interval on the second reference plane at least partially overlaps with the orthographic projection of the second inductance module on the second reference plane; the orthographic projection of the second interval on the second reference plane and the orthographic projection of the second output capacitor module or the second input capacitor module on the second reference plane have an eighth overlapping portion, and the size of the eighth overlapping portion in the second direction is greater than 2 / 3 of the size of the second output capacitor module or the second input capacitor module in the second direction.

[0017] For example, according to an embodiment of the present disclosure, the second voltage conversion unit includes a second inductor module, and the second inductor module includes a third inductor and a fourth inductor arranged opposite to each other in the second direction; the second interval is configured to satisfy at least one of the following conditions: the size of the second interval in the second direction is larger than the size of the first inductor or the second inductor in the second direction; the orthographic projection of the second interval on the second reference plane and the orthographic projection of the first inductor or the second inductor on the second reference plane have a sixth overlapping part, and the size of the sixth overlapping part in the second direction is larger than 1 / 3 of the size of the first inductor in the second direction; the orthographic projection of the second interval on the second reference plane at least partially overlaps with the orthographic projection of the third inductor on the second reference plane; the orthographic projection of the second interval on the second reference plane completely overlaps with the orthographic projection of the fourth inductor on the second reference plane.

[0018] For example, according to an embodiment of the present disclosure, the second voltage conversion unit includes a second inductor module, and the second inductor module includes a third inductor and a fourth inductor arranged opposite to each other in the second direction; the third interval is configured to satisfy at least one of the following conditions: the orthographic projection of the third interval on the second reference plane and the orthographic projection of the third inductor or the fourth inductor on the second reference plane have a fourteenth overlapping part; the orthographic projection of the third interval on the second reference plane and the orthographic projection of the second output capacitor module or the second input capacitor module on the second reference plane have a sixteenth overlapping part.

[0019] For example, according to an embodiment of the present disclosure, the size of the fourteenth overlapping portion in the second direction is greater than the size of the third inductor or 1 / 2 of the size in the second direction; and / or, the size of the sixteenth overlapping portion in the second direction is greater than 1 / 3 of the size of the second output capacitor module or the second input capacitor module in the second direction.

[0020] For example, according to an embodiment of the present disclosure, the second voltage conversion unit includes a second inductor module; an orthographic projection of the first inductor module on the second reference plane and an orthographic projection of the second inductor module on the second reference plane have non-overlapping portions.

[0021] For example, according to an embodiment of the present disclosure, the voltage conversion unit includes an inductor module, a diode module, a switch module, an output capacitor module, and an input capacitor module; the inductor module includes the first inductor and the second inductor; the inductor module is connected between the input end of the voltage conversion unit and the positive pole of the diode module; the negative pole of the diode module is connected to the output end of the voltage conversion unit; the switch module includes a control end, an input end, and an output end, the control end of the switch module is configured to receive a control signal, and the control signal is used to control the conduction or cutoff between the input end and the output end of the switch module, one of the input end and the output end of the switch module is connected between the inductor module and the diode module, and the other of the input end and the output end of the switch module is connected to the ground end; the first pole of the output capacitor module is connected to the negative pole of the diode module, and the second pole of the output capacitor module is connected to the ground end; the input capacitor module is connected between the input end and the ground end.

[0022] For example, according to an embodiment of the present disclosure, the substrate includes a first edge and a second edge arranged opposite to each other in the first direction. In each of the driving structures, the first direction is a direction from the voltage conversion unit to the light-emitting driving unit. At least in the voltage conversion unit closest to the first edge of the substrate, the inductor module is arranged on a side of the voltage conversion unit away from the light-emitting driving unit in the first direction; the output capacitor module is arranged on a side of the voltage conversion unit close to the light-emitting driving unit in the first direction; the input capacitor module and the output capacitor module are arranged opposite to each other in a second direction, and the second direction is parallel to the substrate and intersects with the first direction; the diode module is closer to the third edge of the substrate than the inductor module and the output capacitor module, and the third edge connects the first edge and the second edge; the switch module is arranged between the inductor module and the output capacitor module.

[0023] For example, according to an embodiment of the present disclosure, the circuit board is configured to meet at least one of the following conditions: the switch module includes at least a first switch element and a second switch element connected in parallel; the spacing between the first switch element and the second switch element in the second direction is greater than or equal to 8 mm; the output capacitor module includes at least a first output capacitor module and a second output capacitor module connected in parallel; the spacing between the first output capacitor module and the second output capacitor module in the first direction is greater than or equal to 2 mm; in the voltage conversion unit closest to the first edge of the substrate, the distance between the inductor module and the periphery of the substrate in the first direction is greater than or equal to 5 mm; the diode module includes a first diode and a second diode connected in parallel, and the spacing between the first diode and the second diode in the first direction is greater than or equal to 9 mm; wherein, the first direction is the direction from the voltage conversion unit to the light-emitting drive unit, and the second direction is parallel to the substrate and intersects with the first direction.

[0024] For example, according to an embodiment of the present disclosure, the voltage conversion unit is configured to satisfy at least one of the following conditions: the spacing between the inductor module and the switch module in the first direction is greater than or equal to 10 mm; the spacing between the inductor module and the diode module in the second direction is greater than or equal to 12 mm; the spacing between the inductor module and the output capacitor module in the first direction is greater than or equal to 15 mm; the spacing between the inductor module and the input capacitor module in the first direction is greater than or equal to 29 mm; the spacing between the diode module and the switch module in the second direction is greater than or equal to 10 mm; the spacing between the diode module and the output capacitor module in the first direction is greater than or equal to 4 mm; the spacing between the switch module and the output capacitor module in the second direction is greater than or equal to 3 mm; the spacing between the switch module and the input capacitor module in the first direction is greater than or equal to 6 mm; and the spacing between the switch module and the input capacitor module in the second direction is greater than or equal to 2 mm.

[0025] For example, according to an embodiment of the present disclosure, the diode module includes a Schottky diode; and / or the switch module includes a transistor.

[0026] For example, according to an embodiment of the present disclosure, the voltage conversion unit is provided in plurality, and the light-emitting driving unit is provided in plurality; the plurality of voltage conversion units and the plurality of light-emitting driving units are provided in one-to-one correspondence, and the voltage conversion units and the light-emitting driving units corresponding to each other are connected to form a plurality of driving structures; the plurality of driving structures are arranged in sequence along a first direction, and the plurality of light-emitting driving units and the plurality of voltage conversion units are alternately provided along the first direction; the plurality of driving structures include a first driving structure and a second driving structure, the first driving structure includes a first voltage conversion unit and a first light-emitting driving unit, and the second driving structure includes a second voltage conversion unit and a second light-emitting driving unit; the first driving structure and the second driving structure are configured to satisfy at least one of the following conditions: the orthographic projection of the first voltage conversion unit on the second reference plane and the orthographic projection of the second voltage conversion unit on the second reference plane are perpendicular to the first direction There is a non-overlapping part in the orthographic projection on the plane; the second reference plane is a plane perpendicular to the first direction; there is a non-overlapping part in the orthographic projection of the first light-emitting driving unit on the second reference plane and the orthographic projection of the second light-emitting driving unit on the second reference plane; there is a non-overlapping part in the orthographic projection of the first voltage conversion unit on the second reference plane and the orthographic projection of the first light-emitting driving unit on the second reference plane; there is a non-overlapping part in the orthographic projection of the first voltage conversion unit on the second reference plane and the orthographic projection of the second light-emitting driving unit on the second reference plane; there is a non-overlapping part in the orthographic projection of the second voltage conversion unit on the second reference plane and the orthographic projection of the second light-emitting driving unit on the second reference plane; there is a non-overlapping part in the orthographic projection of the second voltage conversion unit on the second reference plane and the orthographic projection of the first light-emitting driving unit on the second reference plane.

[0027] For example, according to an embodiment of the present disclosure, the first voltage conversion unit includes a first diode module and a first input capacitor module, the first light-emitting driving unit includes a first switch tube module and a first driver module; the second voltage conversion unit includes a second output capacitor module and a second inductor module, and the second light-emitting driving unit includes a second switch tube module and a second driver module; the first driving structure and the second driving structure are configured to satisfy at least one of the following conditions: the orthographic projection of the first diode module on the second reference plane and the orthographic projection of the second output capacitor module on the second reference plane have a first non-overlapping portion; the orthographic projection of the first input capacitor module on the second reference plane and the orthographic projection of the second inductor module on the second reference plane have a second non-overlapping portion; the orthographic projection of the first switch tube module on the second reference plane and the orthographic projection of the second switch tube module on the second reference plane have a third non-overlapping portion; the orthographic projection of the first driver module on the second reference plane and the orthographic projection of the second driver module on the second reference plane have a fourth non-overlapping portion; the orthographic projection of the first diode module on the second reference plane and the orthographic projection of the first switch tube module on the second reference plane have a fourth non-overlapping portion. There is a fifth non-overlapping portion between the orthographic projection of the first input capacitor module on the second reference plane and the orthographic projection of the first driver module on the second reference plane; there is a sixth non-overlapping portion between the orthographic projection of the first diode module on the second reference plane and the orthographic projection of the second switch tube module on the second reference plane; there is an eighth non-overlapping portion between the orthographic projection of the first input capacitor module on the second reference plane and the orthographic projection of the second driver module on the second reference plane; there is a ninth non-overlapping portion between the orthographic projection of the first switch tube module on the second reference plane and the orthographic projection of the second output capacitor module on the second reference plane; there is a tenth non-overlapping portion between the orthographic projection of the first driver module on the second reference plane and the orthographic projection of the second inductor module on the second reference plane; there is an eleventh non-overlapping portion between the orthographic projection of the second output capacitor module on the second reference plane and the orthographic projection of the second switch tube module on the second reference plane; and there is a twelfth non-overlapping portion between the orthographic projection of the second inductor module on the second reference plane and the orthographic projection of the second driver module on the second reference plane.

[0028] For example, according to an embodiment of the present disclosure, the substrate includes a first conductive layer and a first solder resist layer, the first conductive layer and the first solder resist layer are located on a side of the substrate where the light-emitting driving unit is provided, and the first conductive layer is located on a side of the first solder resist layer away from the light-emitting driving unit; the voltage conversion unit includes an inductor module, a diode module, and a switch module, and the inductor module includes the first inductor and the second inductor; a first opening is provided in the first solder resist layer to expose the first conductive layer; the first opening surrounds at least one of the inductor module, the diode module, and the switch module.

[0029] For example, according to an embodiment of the present disclosure, the first opening includes a first opening portion, a second opening portion, and a third opening portion that do not overlap with each other; the first opening portion is located between the inductor module, the diode module, and the switch module, the second opening portion surrounds the inductor module, and the third opening portion surrounds the diode module; wherein the area of ​​the first opening portion is larger than the area of ​​the second opening portion, and the area of ​​the first opening portion is larger than the area of ​​the third opening portion.

[0030] For example, according to an embodiment of the present disclosure, the area of ​​the first opening is less than or equal to 800 square millimeters; the area of ​​the second opening is greater than or equal to 320 square millimeters; and the area of ​​the third opening is greater than or equal to 90 square millimeters.

[0031] For example, according to an embodiment of the present disclosure, the substrate includes a second conductive layer and a second solder resist layer located on a side of the first conductive layer away from the first solder resist layer, and the second conductive layer is located between the second solder resist layer and the first conductive layer; a second opening is provided in the second solder resist layer to expose the second conductive layer; the orthographic projection of the second opening on the third reference plane overlaps with the orthographic projection of the first opening on the third reference plane; and the third reference plane is parallel to the substrate.

[0032] For example, according to an embodiment of the present disclosure, it also includes: a plurality of vias penetrating at least the first conductive layer and the second conductive layer, and the plurality of vias are arranged in an array; the orthographic projection of the first opening on the third reference plane covers at least part of the orthographic projection of the vias on the third reference plane.

[0033] For example, according to an embodiment of the present disclosure, a shielding component is further included; the shielding component is at least arranged on two opposite sides of the light-emitting driving unit in a first direction, and the first direction is a direction from the voltage conversion unit to the light-emitting driving unit.

[0034] At least one embodiment of the present disclosure provides a display module, comprising: a back panel; a circuit board as described in any of the above embodiments, arranged on the back panel; a light-emitting unit, arranged on a side of the back panel away from the circuit board and connected to the driving structure; and a shell, covering the outside of the circuit board; wherein the shell comprises a top wall and a bottom wall arranged opposite to each other in the first direction; the first direction is a direction from the voltage conversion unit to the light-emitting driving unit; the shell is configured to meet at least one of the following conditions: a first through hole is provided on the top wall, and the first through hole connects the internal space and the external space of the shell; and a second through hole is provided on the bottom wall, and the second through hole connects the internal space and the external space of the shell.

[0035] For example, according to an embodiment of the present disclosure, the shell also includes a side wall connecting the top wall and the bottom wall, and the side wall is provided with a third through hole; the orthographic projection of the third through hole on the third reference plane overlaps with the orthographic projection of the driving structure on the third reference plane; and the third reference plane is parallel to the substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the drawings of the embodiments will be briefly introduced below. Obviously, the drawings in the following description only relate to some embodiments of the present disclosure, rather than limiting the present disclosure.

[0037] FIG1 is a schematic diagram of a light panel according to an example of the present disclosure.

[0038] FIG2 is a schematic diagram of area division of a light-emitting unit exemplified in the present disclosure.

[0039] FIG3 is a schematic diagram of a mainboard driving architecture of a light-emitting unit exemplified in the present disclosure.

[0040] FIG4 is a schematic diagram of a sub-board driving architecture of a light-emitting unit exemplified in the present disclosure.

[0041] FIG5 is a schematic diagram of another light panel according to an example of the present disclosure.

[0042] FIG6 is a schematic diagram of area division of another light-emitting unit exemplified in the present disclosure.

[0043] FIG7 is a schematic diagram of another mainboard driving architecture of a light-emitting unit exemplified in the present disclosure.

[0044] FIG8 is a schematic diagram of another sub-board driving architecture of a light-emitting unit exemplified in the present disclosure.

[0045] FIG9 is a schematic diagram of a light-emitting unit driving circuit according to an example of the present disclosure.

[0046] FIG10A is a schematic diagram of a circuit board according to an example of the present disclosure.

[0047] FIG10B is a partial schematic diagram of the circuit board shown in FIG10A .

[0048] FIG11 is a schematic diagram of another light-emitting unit driving circuit exemplified in the present disclosure.

[0049] FIG12A is a schematic diagram of another circuit board according to an example of the present disclosure.

[0050] FIG12B is a partial schematic diagram of the circuit board shown in FIG12A .

[0051] FIG13A is a schematic diagram of a light-emitting unit driving circuit provided by at least one embodiment of the present disclosure.

[0052] FIG13B is a schematic diagram showing the principle of a voltage conversion unit in a light-emitting unit driving circuit provided in an example of the present disclosure.

[0053] FIG13C is a schematic diagram showing the principle of a voltage conversion unit in a light-emitting unit driving circuit provided in another example of the present disclosure.

[0054] FIG13D is a schematic diagram showing the principle of a control module in a voltage conversion unit provided in an example of the present disclosure.

[0055] FIG13E is a schematic diagram of an equivalent circuit of a control module provided in an example of the present disclosure.

[0056] FIG13F is a schematic diagram showing the principle of a control module in a voltage conversion unit provided in another example of the present disclosure.

[0057] FIG13G is a schematic diagram of an equivalent circuit of a control module provided in another example of the present disclosure.

[0058] FIG14 is a schematic diagram of a light-emitting unit driving circuit provided in another example of the present disclosure.

[0059] FIG15A is a schematic diagram of a side surface of a circuit board provided by at least one embodiment of the present disclosure.

[0060] FIG15B is a schematic diagram of the other side surface of the circuit board provided by at least one embodiment of the present disclosure.

[0061] FIG15C is a partial schematic diagram of the circuit board shown in FIG15A .

[0062] FIG15D is a schematic plan view of the circuit board shown in FIG15A .

[0063] FIG16 is a schematic diagram of a light-emitting unit driving circuit provided in another example of the present disclosure.

[0064] FIG17A is a schematic diagram of a circuit board provided in yet another example of the present disclosure.

[0065] FIG17B is a partial schematic diagram of the circuit board shown in FIG17A .

[0066] FIG17C is a schematic plan view of the circuit board shown in FIG17A .

[0067] FIG18 is a schematic diagram of a light-emitting unit driving circuit provided in yet another example of the present disclosure.

[0068] FIG19 is a schematic diagram of a shell provided in an example of the present disclosure. DETAILED DESCRIPTION

[0069] To make the purpose, technical solutions, and advantages of the embodiments of the present disclosure more clear, the technical solutions of the embodiments of the present disclosure will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present disclosure. Obviously, the described embodiments are part of the embodiments of the present disclosure, not all of the embodiments. Based on the described embodiments of the present disclosure, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present disclosure.

[0070] Unless otherwise defined, technical or scientific terms used in this disclosure should have the ordinary meanings understood by people with ordinary skills in the field to which this disclosure belongs. The words "first", "second" and similar terms used in this disclosure do not indicate any order, quantity or importance, but are simply used to distinguish different components. The words "include" or "comprising" and similar terms mean that the elements or objects preceding the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects.

[0071] The features such as "perpendicular", "parallel" and "same" used in the embodiments of the present disclosure include the features such as "perpendicular", "parallel" and "same" in the strict sense, as well as the cases where "approximately perpendicular", "approximately parallel" and "approximately the same" contain certain errors, taking into account the errors associated with the measurement and the measurement of specific quantities (that is, the limitations of the measurement system), and are expressed as being within the acceptable deviation range for a specific value determined by a person of ordinary skill in the art. The "center" in the embodiments of the present disclosure can include a position strictly at the geometric center and a position approximately at the center of a small area around the geometric center. For example, "approximately" can mean within one or more standard deviations, or within 10% or 5% of the value.

[0072] Currently, local dimming (LD) technology is widely used in video wall strips on the market. However, most commercial advertising displays lack this feature, and their brightness is generally below 1000 nits. Most of these products use an AC / DC (alternating current to direct current) converter to convert 220V AC voltage into a voltage that matches the LED light strip, achieving constant current drive for the LED light strip. Furthermore, the components of the AC / DC converter support high power output, and the requirements for component package size and height are relatively low.

[0073] In order to achieve the local dimming function of display devices such as commercial display advertising screens while meeting the requirements of backlight brightness and wide temperature operation, it is necessary to use a direct current to direct current (DC / DC) converter to convert voltage and control the constant current output at the same time. In addition, higher requirements are also placed on the package size and height of components. Due to limitations in size, cost, etc., DC / DC converters often use power MOSFETs (metal-oxide semiconductor field-effect transistors) with smaller packages, and it is often impossible to add heat sinks. This makes MOSFET face the problem of excessive temperature. On this basis, the temperature rise of components is often too high, and the heat dissipation efficiency is difficult to improve.

[0074] For example, local dimming technology can divide the entire light-emitting unit into multiple independently drivable light-emitting zones, each of which includes one or more LEDs. The driving current of the LEDs in the light-emitting zones corresponding to different parts of the display image is automatically adjusted according to the grayscale required to be displayed in these parts, thereby achieving independent adjustment of the brightness of each zone in the light-emitting unit, thereby improving the contrast of the displayed image. Local dimming technology is generally only applicable to direct-type light-emitting units, and the multiple LEDs serving as the light source are evenly distributed across the entire backplane, for example.

[0075] At least one embodiment of the present disclosure also provides a circuit board, comprising: a substrate and a plurality of voltage conversion units and a plurality of light-emitting driving units arranged on the substrate, the voltage conversion unit comprising an input terminal and an output terminal, and being configured to output a preset voltage; the light-emitting driving unit being connected to the output terminal of the voltage conversion unit, and being configured to drive the light-emitting unit; wherein the plurality of voltage conversion units and the plurality of driving units are arranged in a one-to-one correspondence, and a voltage conversion unit is arranged between adjacent light-emitting driving units; the voltage conversion unit comprises a first inductor and a second inductor connected in parallel, and the first inductor and the second inductor are staggered. The circuit board provided by the present disclosure can disperse components with higher heat generation and improve the heat addition effect between components by arranging a voltage conversion unit between adjacent light-emitting driving units and staggering the first inductor and the second inductor in the voltage conversion unit.

[0076] At least one embodiment of the present disclosure further provides a display module, comprising: a back panel; a circuit board as in any of the above embodiments, disposed on the back panel; a light-emitting unit, disposed on a side of the back panel away from the circuit board and connected to the drive structure; and a housing, covering the outside of the circuit board; wherein the housing comprises a top wall and a bottom wall disposed opposite to each other in a first direction; the first direction is a direction from the voltage conversion unit to the light-emitting drive unit; the housing is configured to satisfy at least one of the following conditions: a first through hole is provided on the top wall, the first through hole connecting the internal space and the external space of the housing; a second through hole is provided on the bottom wall, the second through hole connecting the internal space and the external space of the housing. In the display module provided by at least one embodiment of the present disclosure, the first through hole provided on the top wall and the second through hole provided on the bottom wall can connect the internal and external spaces of the housing, can dissipate heat from both sides of the circuit board in the first direction, accelerate heat exchange between the internal and external spaces of the housing, and improve heat dissipation efficiency.

[0077] The circuit board, display module and display device provided by the present disclosure are described below with reference to the accompanying drawings and through some embodiments.

[0078] Figure 1 is a schematic diagram of a light panel according to an example of the present disclosure. Figure 2 is a schematic diagram of the area division of a light-emitting unit according to an example of the present disclosure.

[0079] For example, Figure 1 shows four light boards, each equipped with a light-emitting unit 10A. The light-emitting units 10A on the four light boards are arranged in two rows and two columns. For example, a schematic diagram of the area division of the light source LED 11A in each light-emitting unit 10A is shown in Figure 2. The small square in the figure represents an LED 11A, and the multiple areas framed by dashed lines represent light-emitting subareas 12A. Each light-emitting unit 10A may include multiple light-emitting subareas 12A. It should be understood that the four dashed boxes shown in Figure 2 do not mean that there are only four light-emitting subareas 12A on the light-emitting unit 10A, and the other light-emitting subareas 12A on the light-emitting unit 10A are omitted. Each light-emitting subarea 12A includes one or more LEDs 11A and can be controlled independently of the other light-emitting subareas 12A. For example, the multiple LEDs 11A within each light-emitting subarea 12A are linked, meaning that the current flowing through the multiple LEDs 11A within the same light-emitting subarea 12A is consistent, resulting in substantially consistent luminance.

[0080] As shown in FIG2 , the light-emitting unit includes multiple light-emitting subareas 12A. For example, the light-emitting unit can be driven by a local dimming method. For example, FIG2 shows a light-emitting unit including 12 light-emitting subareas 12A, each light-emitting subarea 12A including 24 LEDs 11A, but this disclosure is not limited to this.

[0081] Figure 3 is a schematic diagram of a mainboard driving architecture of a light-emitting unit according to an example of the present disclosure. Figure 4 is a schematic diagram of a sub-board driving architecture of a light-emitting unit according to an example of the present disclosure.

[0082] 3 and 4 , two constant current boards control four light emitting units 10A, with each board controlling one light emitting unit 10A. In combination with the aforementioned embodiments, the maximum anode voltage of the 24 LEDs 11A in each light emitting subarea 12A needs to be approximately 72V.

[0083] For example, each constant current board uses a boost converter to boost the voltage and an LED driver to regulate the constant current. In both constant current boards, the main board also has a microcontroller unit (MCU). The MCU controls the LED driver to adjust the LED current and establishes communication between the main constant current board and the slave constant current board.

[0084] As shown in Figure 3, motherboard 010 is equipped with two boost converters 011, two buck converters 012, and two sets of LED drivers 013. For example, motherboard 010 includes input interfaces CN1-CN2 and output interfaces CN4-CN6. Input interface CN1 on motherboard 010 can receive a 24V voltage and provide input voltage to the two boost converters 011 and the two buck converters 012. For example, each boost converter 011 outputs a first drive signal (e.g., a high voltage) to the anode of the LED in the corresponding light-emitting unit via output interfaces CN5-CN6. The two sets of LED drivers 013 output a second drive signal (e.g., a low voltage) to the cathode of the LED in the corresponding light-emitting unit via output interfaces CN5 and CN6, respectively. As a result, the corresponding drive voltage (e.g., the difference between the first and second drive signals) is applied to the LEDs in the light-emitting units, causing the corresponding drive current to flow and emit light. The microcontroller unit 014 controls the LED driver 013 to turn each corresponding light-emitting subarea 12A on or off. It also controls the current drawn during on-state operation, thereby achieving local dimming of the two light-emitting units 10A controlled by the mainboard 010. The buck converter 012a steps down the 24V high voltage input from the input interface CN1 to a 12V low voltage, thereby supplying power to the LED driver 013. The buck converter 012b steps down the 12V low voltage to 3.3V, thereby supplying power to the microcontroller unit 014.

[0085] As shown in Figure 4, the sub-board 020 is equipped with two boost converters 021, one buck converter 022, and two LED drivers 023. For example, the sub-board 020 includes input interfaces CN1 and CN3, as well as output interfaces CN5 and CN6. For example, the input interface CN1 on the sub-board 020 can receive a 24V voltage. The driving principle for driving the LEDs in the sub-board 020 is roughly the same as that of the main board 010, and reference can be made to the driving method of the main board 010 described above. For example, the microcontroller unit 014 on the main board 010 transmits backlight data to the LED drivers 023 via three serial peripheral interfaces (SPIs). The first SPI1 receives local dimming data via input interface CN2. After processing, it is sent to the LED drivers 013 on the main board 010 via the second SPI2. Simultaneously, the third SPI3 sends data to the LED drivers 023 on the sub-board 020 via input interface CN3, corresponding to the LEDs in different zones.

[0086] For example, the drive current outputted by output interfaces CN5-CN6 can be derived using conventional algorithms in the art, and the on-time of output interfaces CN5-CN6 can be determined based on backlight data to implement local dimming. For example, LED driver 023 can provide switching control signals and output control signals to output interfaces CN5-CN6, thereby driving the LEDs in each backlight subarea to emit light. For example, the aforementioned backlight data includes width configuration parameters for the output control signals of output interfaces CN5-CN6.

[0087] Figure 5 is a schematic diagram of another light board according to an example of the present disclosure. Figure 6 is a schematic diagram of the regional division of another light-emitting unit according to an example of the present disclosure. Figure 7 is a schematic diagram of the main board driving architecture of another light-emitting unit according to an example of the present disclosure. Figure 8 is a schematic diagram of the sub-board driving architecture of another light-emitting unit according to an example of the present disclosure.

[0088] For example, Figure 5 shows six light-emitting units 10A on six light boards arranged in three rows and two columns. For example, Figure 6 shows a light-emitting unit comprising twelve light-emitting subareas 12A, each of which comprises 30 LEDs 11A. Again, this disclosure is not limited to this arrangement. In conjunction with some of the aforementioned embodiments, the anode voltage of the LED strings 11A in each light-emitting subarea 12A needs to be a maximum of approximately 90V.

[0089] As shown in Figures 7 and 8, two constant current boards control six light-emitting units 10A, with each board controlling three light-emitting units. To achieve control of three light-emitting units per board, three boost converters 011 and three sets of LED drivers 013 are provided on main board 010, as shown in Figure 7. As shown in Figure 8, three boost converters 021 and three sets of LED drivers 023 are provided on sub-board 020. The specific driving principles for the light-emitting units can be found in the aforementioned description of driving four light-emitting units 10A and will not be repeated here.

[0090] FIG9 is a schematic diagram of a light-emitting unit driving circuit according to an example of the present disclosure.

[0091] For example, as shown in Figure 9, a light-emitting unit driving circuit 100 includes a voltage conversion unit 110 and a light-emitting driver unit 120. The voltage conversion unit 110 is configured to output a voltage. The light-emitting driver unit 120 is connected to the output terminal of the voltage conversion unit 110 and is configured to drive the light-emitting unit. The voltage conversion unit 110 includes an inductor module 111, a switch element 112, a diode module 113, an output capacitor 114, and an input capacitor 115. The inductor module 111 includes a first inductor L1 and a second inductor L2 connected in parallel, and the diode module 113 includes a first diode D1 and a second diode D2 connected in parallel. The input capacitor 115 is used to reduce the resistance to current changes caused by parasitic inductance on the wiring. When the switch element 112 is closed, the inductor module 111 is grounded, the input voltage charges the inductor module 111, the diode module 113 is turned off, and the output capacitor 114 outputs a voltage to the light-emitting driver unit 120. When the switch element 112 is open, the inductor module 111 discharges, the diode module 113 conducts, and the voltage across the output capacitor 114 increases. Thus, the output voltage is adjusted by adjusting the switching frequency and duty cycle of the switch element 112 , thereby achieving voltage boost. For example, the voltage conversion unit 110 further includes a control chip 116 (Boost IC) configured to control the on and off state of the switch element 112 .

[0092] For example, in combination with some of the aforementioned examples, each light-emitting unit includes 12 light-emitting subareas, and each subarea includes 24 or 30 LEDs connected in series. The light-emitting driving unit 120 includes a driving module 121 (e.g., an LED driver) to correspond to the 12 light-emitting subareas. For example, the light-emitting driving unit 120 also includes 12 switching tubes 122 connected between the driving module 121 and the light-emitting subareas to receive the driving signal of the driving module 121 and realize the conduction or cutoff between the driving module 121 and the light-emitting subareas.

[0093] Figure 10A is a schematic diagram of a circuit board exemplified in the present disclosure. Figure 10B is a partial schematic diagram of the circuit board shown in Figure 10A. It should be noted that, in order to more clearly illustrate the arrangement of components in the circuit board, Figure 10B only illustrates some of the components in the first drive structure.

[0094] For example, as shown in FIG10A , a circuit board includes a substrate 200 and the light-emitting unit driving circuit 100 shown in FIG9 , which is disposed on the substrate 200. In conjunction with some of the aforementioned embodiments, an example of two light-emitting unit driving circuits 100 driving six light-emitting units is used for illustration. To enable each light-emitting unit driving circuit 100 to drive three light-emitting units, the light-emitting unit driving circuit 100 includes a first driving structure 101, a second driving structure 102, and a third driving structure 103. Each driving structure includes a voltage conversion unit 110 and a light-emitting driving unit 120 connected to each other, and is configured to drive a corresponding light-emitting unit.

[0095] In some usage scenarios, the circuit board is installed in a display panel, and the longitudinal direction of the substrate 200 of the circuit board can extend along one edge of the display panel, for example, along the short side of the display panel. For example, when the display panel is in normal viewing mode, the circuit board can be placed vertically relative to the ground. For example, the voltage conversion units 110 in the three driving structures are concentrated on one side of the substrate 200 along a first direction y, and the light driving units 120 are concentrated on the other side of the substrate 200 along the first direction y. The first direction y is parallel to the longitudinal direction of the substrate 200. For example, the first direction y is the direction from the side where the light driving units 120 are located to the side where the voltage conversion units 110 are located. In this way, the high-voltage area where the voltage conversion units 110 are located is separated from the low-voltage area where the light driving units 120 are located, effectively reducing the impact of interference during logic signal transmission. For example, when the circuit board is placed vertically relative to the ground, the three voltage conversion units 110 are located on the upper side of the substrate 200, and the three light driving units 120 are located on the lower side of the substrate 200.

[0096] To facilitate wiring arrangement, the light-emitting driving unit 1201 of the first driving structure 101, the light-emitting driving unit 1202 of the second driving structure 102, the light-emitting driving unit 1203 of the third driving structure 103, the voltage conversion unit 1103 of the third driving structure 103, the voltage conversion unit 1102 of the second driving structure 102, and the voltage conversion unit 1101 of the first driving structure 101 are arranged in sequence along the first direction y.

[0097] As shown in Figure 10A and in conjunction with Figure 10B , taking the voltage conversion unit 1101 in the first driving structure 101 as an example, the output capacitor 114 and the inductor module 111 are arranged on opposite sides of the substrate 200 along the second direction x. For example, in conjunction with the above example, the output capacitor 114 on the circuit board is located on the side near the output interfaces CN5-CN7. In the inductor module 111, the first inductor L1 and the second inductor L2 are arranged spaced apart from each other along the second direction x. The second direction x is parallel to the substrate 200 and intersects the first direction y. For example, the second direction x is perpendicular to the first direction y. The spacing d11 between the first inductor L1 and the second inductor L2 in the second direction x is less than or equal to 0.5 mm.

[0098] The diode module 113 is located between the output capacitor 114 and the inductor module 111, on a side close to the output capacitor 114. A spacing d12 between the diode module 113 and the output capacitor 114 in the second direction x is greater than or equal to 1.2 mm. In the diode module 113, the first diode D1 and the second diode D2 are spaced apart from each other along the first direction y. A spacing d13 between the first diode D1 and the second diode D2 in the first direction y is less than or equal to 0.5 mm.

[0099] The switch element 112 is located between the inductor module 111 and the diode module 113. For example, the minimum distance d14 between the switch element 112 and the diode module 113 is less than or equal to 2 mm. For example, the minimum distance d15 between the switch element 112 and the inductor module 111 is less than or equal to 2 mm.

[0100] The input capacitor 115 is spaced apart from the inductor module 111 in the first direction y, and the distance d16 between the inductor module 111 and the input capacitor 115 in the first direction y is greater than or equal to 3 mm. For example, in combination with the above example, the input capacitor 115 on the circuit board is located on a side close to the input interface CN1.

[0101] As shown in FIG10A , the arrangement of components in the voltage conversion unit 1102 of the second driving structure 102 and the voltage conversion unit 1103 of the third driving structure 103 is substantially the same as that of the voltage conversion unit 1101 of the first driving structure 101. Of course, the arrangement of components in the voltage conversion unit of the second driving structure and the voltage conversion unit of the third driving structure may also be different from the arrangement of components in the voltage conversion unit of the first driving structure, and may be adjusted according to actual needs, and the present disclosure does not limit this. For example, the arrangement of components in the light-emitting driving units of the first driving structure, the second driving structure, and the third driving structure may be exactly the same as shown in FIG10A , or may be adjusted according to actual needs, and the present disclosure does not limit this. It should be noted that FIG10A schematically shows a schematic diagram of the main board of the circuit board. Referring to the arrangement of components of the main board, the output capacitor and the input capacitor on the sub-board of the circuit board are correspondingly arranged on the side close to the output interface of the sub-board and the side close to the input interface of the sub-board. The arrangement of other components may be substantially the same as that of the main board.

[0102] After testing the aforementioned embodiment for two hours at the maximum power state of the components, it was found that the temperature of the switch element 112 was 123.6°C, the temperature of the first inductor L1 and the second inductor L2 was 114.6°C, and the temperature of the first diode D1 and the second diode D2 was 111.5°C. The component temperatures were too high, making it difficult to dissipate heat.

[0103] Combined with the aforementioned test results, when high-heat-generating components are placed close together, their heat generation can be additive, leading to component temperature increases. To address this, the inventors adjusted the layout of the components in the voltage conversion unit. Furthermore, considering that the switching components experience the highest temperatures, the inventors adjusted the voltage conversion unit's circuitry to address the issue of excessively high switching current.

[0104] FIG11 is a schematic diagram of another light-emitting unit driving circuit exemplified in the present disclosure.

[0105] For example, as shown in Figure 11, a light-emitting unit driving circuit 300 includes a voltage conversion unit 310 and a light-emitting driver unit 320. The voltage conversion unit 310 is configured to output a voltage. The light-emitting driver unit 320 is connected to the output terminal of the voltage conversion unit 310 and is configured to drive the light-emitting unit. The voltage conversion unit 310 includes an inductor module 311, a switch module 312, a diode module 313, an output capacitor 314, and an input capacitor 315. The inductor module 311 includes a first inductor L1 and a second inductor L2 connected in parallel. The diode module 313 includes a first diode D1 and a second diode D2 connected in parallel. The switch module 312 includes a first switching element Q1 and a second switching element Q2 connected in parallel. For example, in conjunction with some of the aforementioned examples, each light-emitting unit includes 12 light-emitting sub-zones, and each sub-zone includes 24 or 30 LEDs connected in series. The light-emitting driver unit 320 includes a driver module 321 that can correspond one-to-one with the 12 light-emitting sub-zones. For example, the light driving unit 320 further includes 12 switch tubes 322 connected between the driving module 321 and the light emitting partitions to receive the driving signal of the driving module 321 and realize the conduction or cutoff between the driving module 321 and the light emitting partitions.

[0106] Thus, in some embodiments of the present disclosure, the second switching element Q2 is connected in parallel with the first switching element Q1 to reduce the current carried by a single switching element, thereby reducing conduction losses and thus reducing the temperature of the switch module 312. The driving principle of the voltage conversion unit 310 and the light driving unit 320, as well as the centralized arrangement of the voltage conversion unit 310 and the light driving unit 320 in the three driving structures, can be found in the previous embodiments and will not be repeated here.

[0107] Figure 12A is a schematic diagram of another circuit board exemplified in the present disclosure. Figure 12B is a partial schematic diagram of the circuit board shown in Figure 12A. It should be noted that in order to more clearly illustrate the arrangement of components on the circuit board, Figure 12B only illustrates some of the components in the first and second drive structures.

[0108] 12A , the light-emitting driving unit 3201 of the first driving structure 301, the light-emitting driving unit 3202 of the second driving structure 302, the light-emitting driving unit 3203 of the third driving structure 303, the voltage conversion unit 3103 of the third driving structure 303, the voltage conversion unit 3102 of the second driving structure 302, and the voltage conversion unit 3101 of the first driving structure 301 are arranged in sequence along the first direction y.

[0109] As shown in FIG12A and in conjunction with FIG12B , using the voltage conversion unit 3101 in the first driving structure 301 as an example, the output capacitor 314 and the input capacitor 315 are disposed on opposite sides of the substrate 400 along a second direction x, thereby reducing the impact of heat generated by the power device on both sides. The second direction x is parallel to the substrate 400 and intersects the first direction y. For example, the second direction x is perpendicular to the first direction y.

[0110] The inductor module 311 is arranged between the input capacitor 315 and the output capacitor 314 on a side close to the input capacitor 315. In the inductor module 311, the first inductor L1 and the second inductor L2 are arranged to be spaced apart from each other along the first direction y. The spacing d31 between the first inductor L1 and the second inductor L2 in the first direction y is greater than or equal to 8 mm. It should be noted that Figure 12A schematically shows a schematic diagram of the main board of the circuit board. Referring to the arrangement of components of the main board, on the sub-board of the circuit board, the output capacitor and the input capacitor are correspondingly arranged on the side close to the output interface and the side close to the input interface, and the arrangement of other components can be basically the same as the arrangement of components of the main board. For example, the voltage conversion unit 310 also includes a control chip 316, which is configured to control the conduction and cutoff of the switch element 312.

[0111] The diode module 313 is located between the output capacitor 314 and the inductor module 311 on a side close to the output capacitor 314. The first diode D1 and the second diode D2 in the diode module 313 are spaced apart from each other along the first direction y. The distance d32 between the first diode D1 and the second diode D2 in the first direction y is greater than or equal to 2.2 mm.

[0112] The switch module 312 is located between the inductor module 311 and the diode module 313. For example, the minimum distance d33 between the switch element and the diode module 313 is greater than or equal to 3 mm. For example, the minimum distance d34 between the switch element and the inductor module 311 is greater than or equal to 5 mm. In the switch module 312, the first switch element Q1 and the second switch element Q2 are spaced apart in the second direction x, and the distance d35 between them is greater than or equal to 0.4 mm.

[0113] As shown in Figure 12A , the arrangement of components in the voltage conversion unit 3102 of the second drive structure 302 and the voltage conversion unit 3103 of the third drive structure 303 is substantially identical to that of the voltage conversion unit 3101 of the first drive structure 301. Referring to Figure 12B , the spacing d36 between the first inductor L1 in the first drive structure 301 and the second inductor L2' in the second drive structure 302 in the first direction y is also greater than 8 mm, thereby ensuring adequate heat dissipation of the inductor module 311. For example, referring to Figure 12A , in the voltage conversion unit 311 of the second drive structure 302, the arrangement of the switch module 312, the diode module 313, and the output capacitor 314 is identical to that of the first drive structure 301. The input capacitors 315 of the first and second drive structures 302 are arranged along the first direction y. For example, the arrangement of components in the voltage conversion unit 310 of the third drive structure 303 is substantially identical to that of the second drive structure 302.

[0114] Of course, the arrangement of components in the voltage conversion unit of the second drive structure and the voltage conversion unit of the third drive structure can also be exactly the same as the arrangement of components in the voltage conversion unit of the first drive structure, and can be adjusted according to actual needs, and this disclosure does not limit this. For example, the arrangement of components in the light-emitting drive units of the first drive structure, the second drive structure, and the third drive structure can be the same, or can be slightly different as shown in Figure 12A, and can be adjusted according to actual needs, and this disclosure does not limit this.

[0115] For example, the substrate 400 includes a first conductive layer 410 and a first solder resist layer 420. The first conductive layer 410 and the first solder resist layer 420 are located on the side of the substrate 400 where the light-emitting unit driving circuit 300 is located. The first conductive layer 410 is located on the side of the first solder resist layer 420 away from the light-emitting unit driving circuit 300. The first solder resist layer 420 is provided with a first opening 421 that exposes the first conductive layer 410. The first opening 421 provided in the first solder resist layer 420 can expose the first conductive layer 410, thereby dissipating heat. Considering the layout of the wiring and components on the circuit board, the first opening 421 in the area where the first drive structure 301, the second drive structure 302, and the third drive structure 303 are located is slightly different. This disclosure uses the first opening 421 in the area where the first drive structure 301 is located as an example for explanation.

[0116] The first opening 421 includes a first opening portion 4211. The first opening portion 4211 is located between the inductor module 311, the diode module 313, and the switch module 312. This dissipates heat from the center of the components and reduces the effect of heat addition between the components. The area of ​​the first opening portion 4211 is greater than or equal to 320 square millimeters.

[0117] The first opening 421 includes a second opening portion 4212 located on a side of the inductor module 311 away from the switch module 412 in the second direction x, thereby cooperating with the first opening portion 4211 to dissipate heat from the inductor module 311. The area of ​​the second opening portion 4212 is greater than or equal to 75 square millimeters.

[0118] The first opening 421 includes a third opening portion 4213 located on a side of the diode module 313 facing the voltage conversion unit 310 of the second driving structure 302, thereby dissipating heat from the diode module 313. The area of ​​the third opening portion 4213 is greater than or equal to 90 square millimeters.

[0119] The side of substrate 400 facing away from first solder resist layer 420 also includes a second conductive layer and a second solder resist layer, with the second conductive layer located between the second solder resist layer and first conductive layer 410. A second opening is defined in the second solder resist layer, exposing the second conductive layer. The orthographic projection of the second opening on a plane parallel to substrate 400 overlaps the orthographic projection of first opening 421 on the same plane. Thus, the openings on opposite sides of substrate 400 correspond to each other. While components dissipate heat through first opening 421, the side where the second opening resides also dissipates heat through the second opening, improving the circuit board's heat dissipation efficiency.

[0120] After testing the aforementioned embodiment for 2 hours at the maximum power state of the components, it was found that in the switch module 312, the temperature of the first switch element Q1 close to the inductor module 311 was relatively higher, at 101.8°C. Due to the influence of upward heat, the temperature of the second inductor L2 located further up in the inductor module 311 was even higher, at 96.5°C. In the diode module 313, the temperature of the second diode D2 located between the output capacitor 314 and the second switch element Q2 was relatively higher, at 93.0°C. Compared with the aforementioned embodiment, the temperature of the improved switch module 312 dropped by 21.8°C, the temperature of the inductor module 311 dropped by 18.1°C, and the temperature of the diode module 313 dropped by 18.5°C.

[0121] FIG13A is a schematic diagram of a light-emitting unit driving circuit provided by at least one embodiment of the present disclosure.

[0122] Referring to Figure 13A, at least one embodiment of the present disclosure provides a light-emitting unit driving circuit 500, comprising a voltage conversion unit 510 and a light-emitting driver unit 520. For example, the voltage conversion unit 510 is a DC-DC converter. For example, the voltage conversion unit 510 is a boost circuit that can generate an output voltage higher than the input voltage. For example, the light-emitting driver unit 520 is an LED driver. The voltage conversion unit 510 includes an input terminal and an output terminal and is configured to output a preset voltage. For example, the voltage conversion unit 510 adjusts the voltage to a preset voltage by controlling the duty cycle, so that the preset voltage is output from the output terminal of the voltage conversion unit 510. The light-emitting driver unit 520 is connected to the output terminal of the voltage conversion unit 510 and is configured to drive the light-emitting unit. The voltage conversion unit 510 outputs the preset voltage to the light-emitting driver unit 520, thereby adjusting the brightness of the light-emitting unit. For example, in combination with some of the aforementioned examples, each light-emitting unit includes 12 light-emitting sub-regions, and each sub-region includes 24 or 30 LEDs connected in series. The light-emitting driving unit 520 includes a driving module 521 that can correspond one-to-one with the 12 light-emitting subareas. For example, the light-emitting driving unit 520 also includes 12 switching transistors 522 connected between the driving module 521 and the light-emitting subareas to receive driving signals from the driving module 521 and realize conduction or cutoff between the driving module 521 and the light-emitting subareas.

[0123] As shown in Figure 13A, the voltage conversion unit 510 includes an inductor module 511, a diode module 513, a switch module 512, and an output capacitor module 514. For example, during the charging process, the switch module 512 is closed, the input voltage flows through the inductor module 511, and the diode module 513 prevents the output capacitor module 514 from discharging to ground. The current in the inductor module 511 increases linearly, and energy is stored in the inductor module 511. For example, during the discharging process, the switch module 512 is opened, the inductor module 511 discharges, and the output capacitor module 514 is charged. The voltage across the output capacitor module 514 increases, thereby achieving voltage boosting of the voltage conversion unit 510. For example, the voltage conversion unit 510 also includes a control chip 516 configured to control the conduction and cutoff of the switch element 512.

[0124] As shown in FIG13A , the inductor module 511 is connected between the input terminal of the voltage conversion unit 510 and the positive electrode of the diode module 513, and the negative electrode of the diode module 513 is connected to the output terminal of the voltage conversion unit 510. For example, referring to FIG13A , one end of the inductor module 511 near the input terminal of the voltage conversion unit 510 is used to apply the input voltage Vin and is electrically connected to the input capacitor module 515. The other end of the inductor module 511 is electrically connected to one end of the switch module 512 (for example, one of the input and output terminals of the switch module 512, in conjunction with the examples described below), and the other end of the switch module 512 (for example, the other of the input and output terminals of the switch module 512, in conjunction with the examples described below) is used to apply the ground voltage GND. For example, the inductor module 511 is used to convert electrical energy into magnetic field energy for storage when the switch module 512 is turned on. When the switch module 512 is turned off, the inductor module 511 converts the stored magnetic field into electric field energy. The electric field energy converted by the inductor module 511 is superimposed on the input voltage, and is filtered by the diode module 513 and the output capacitor module 514 to output a smooth DC voltage.

[0125] For example, the anode of the diode module 513 is electrically connected to one end of the switch module 512 (in conjunction with the example described later, for example, one of the input and output ends of the switch module 512); the cathode of the diode module 513 is electrically connected to the output end of the voltage conversion unit 510 and is also connected to the output capacitor module 514. In this way, by controlling the on and off states of the switch module 512, the output voltage Vout of the voltage conversion unit 510 can be made higher than the input voltage Vin.

[0126] For example, the forward conduction direction of the diode module 513 is from the input terminal to the output capacitor module 514. For example, the diode module 513 serves as an isolation function in the voltage conversion unit 510. When the switch module 512 is turned on, the positive electrode voltage of the diode module 513 is higher than the negative electrode voltage, and the diode module 513 is reversely blocked. The energy storage process of the inductor module 511 does not affect the power output of the output capacitor module 514, thereby reducing the conduction loss of the switch module 512. When the switch module 512 is turned off, the energy obtained by superimposing the electric field energy converted by the inductor module 511 and the input voltage is used to supply power to the output terminal of the voltage conversion unit 510 through the diode module 513.

[0127] As shown in Figure 13A, the switch module 512 includes a control terminal, an input terminal, and an output terminal. The control terminal of the switch module 512 is configured to receive a control signal, which is used to control whether the input and output terminals of the switch module 512 are connected. One of the input and output terminals of the switch module 512 is connected between the inductor module 511 and the diode module 513, and the other of the input and output terminals of the switch module 512 is connected to the ground terminal. For example, if the control terminal of the switch module 512 receives an on control signal, the input and output terminals of the switch module 512 are connected, and the voltage conversion unit 510 begins the charging process, and the input voltage charges the inductor module 511. For example, if the control terminal of the switch module 512 receives a off control signal, the input and output terminals of the switch module 512 are disconnected, and the voltage conversion unit 510 begins the discharging process, and the energy stored in the inductor module 511 is discharged through the diode module 513.

[0128] As shown in Figure 13A, the first electrode of the output capacitor module 514 is connected to the cathode of the diode module 513, and the second electrode of the output capacitor module 514 is connected to the ground terminal. The output capacitor module 514 can reduce the AC ripple coefficient and smooth the DC output. For example, the first electrode of the output capacitor module 514 is the positive electrode, and the second electrode is the negative electrode.

[0129] FIG14 is a schematic diagram of a light-emitting unit driving circuit provided in another example of the present disclosure.

[0130] As shown in Figures 13A and 14, the switch module 512 includes at least a first switch element Q1 and a second switch element Q2 connected in parallel. For example, the switch module 512 includes a first switch element Q1, a second switch element Q2, and a third switch element Q3 connected in parallel. In conjunction with some of the aforementioned embodiments, as shown in Figure 14, when the output capacitor module 514 has only one output capacitor, the heat generated by the switch module 512 is high, making it difficult to reduce the temperature of each switch element. By connecting the first switch element Q1, the second switch element Q2, and the third switch element Q3 in parallel, the current in each switch element can be reduced, thereby reducing conduction losses.

[0131] For example, the voltage conversion unit 510 includes a first switching element Q1, a second switching element Q2, and a third switching element Q3. The first switching element Q1 and the second switching element Q2 are connected in parallel. If the temperature of the two switching elements is difficult to further reduce, the third switching element Q3 is connected in parallel to further reduce the temperature of each switching element.

[0132] For example, at least one of the first switching element Q1 and the second switching element Q2 is a transistor. It should be noted that the transistors used in the embodiments of the present disclosure can all be field-effect transistors or other switching components with the same characteristics. The embodiments of the present disclosure are described using field-effect transistors as an example.

[0133] FIG13B is a schematic diagram showing the principle of a voltage conversion unit in a light-emitting unit driving circuit provided in an example of the present disclosure.

[0134] Referring to FIG13B , the switch module 512 is described as a field effect transistor (power MOSFET) as an example. For example, the voltage conversion unit 510 further includes a control module CTR connected to the control terminal of the power MOSFET (for example, the control module CTR is the control chip 516 shown in FIG13A ). The control module CTR is configured to provide a control signal capable of controlling the on and off of the power MOSFET. The control signal includes a high-level signal and a low-level signal. The voltage value of the high-level signal in the control signal is 0.5 to 0.8 times the maximum rated value of the gate-source voltage of the power MOSFET.

[0135] In an example disclosed herein, the high-level signal of the control signal provided by the control module CTR has a relatively high voltage value, which can enable the power MOSFET to maintain a higher gate-source voltage when it is turned on, thereby reducing the static loss of the power MOSFET, especially significantly reducing the conduction loss of the power MOSFET, thereby significantly reducing the power consumption of the power MOSFET and reducing the heat release of the power MOSFET, thereby preventing the power MOSFET and the voltage conversion unit from overheating. In this example, when the high-level signal of the control signal is applied to the control terminal of the power MOSFET, the gate-source voltage of the power MOSFET is substantially equal to the voltage value of the high-level signal (without considering the voltage drop); so that the voltage value of the high-level signal of the control signal is 0.5 to 0.8 times the maximum rated value of the gate-source voltage of the power MOSFET, it can ensure the safety of the power MOSFET and maximize the gate-source voltage of the power MOSFET when it is turned on. In this way, the voltage conversion unit can reduce the loss and heat generation of the power MOSFET while ensuring the safety of the power MOSFET.

[0136] For example, power MOSFET losses primarily include static losses and dynamic losses. Static losses include conduction losses (also known as power conduction losses) and cutoff losses (also known as turn-off losses). Dynamic losses primarily include switching losses, gate drive losses, built-in diode forward losses (also known as freewheeling losses), and internal diode reverse losses. The zero-gate voltage leakage current of a power MOSFET is small, so cutoff losses are not a major loss factor in the power MOSFET. The total gate charge of the power MOSFET and the reverse recovery charge of the PN junction of the internal diode are also very small, so gate drive losses and internal diode reverse losses are not major loss factors in the power MOSFET either.

[0137] For example, the largest share of power MOSFET losses is conduction loss. By reducing the static impedance of the power MOSFET when it is on, the conduction loss of the power MOSFET can be reduced. At the same time, increasing the gate-source voltage of the power MOSFET when it is on can also reduce the turn-on loss of the power MOSFET. In this way, the voltage conversion unit 510 can reduce the loss of the power MOSFET and lower the temperature of the power MOSFET.

[0138] For example, the voltage value of the high-level signal in the control signal is 0.6 to 0.7 times the maximum rated value of the gate-source voltage of the power MOSFET. For example, when the maximum rated value of the gate-source voltage of the power MOSFET is 20V, the voltage value of the high-level signal in the control signal can be set to 12 to 14V, thereby ensuring that the gate-source voltage of the power MOSFET is within the range of 12 to 14V when it is turned on.

[0139] For example, a control signal for controlling the on and off of the power MOSFET can be provided by the control module CTR; the control signal includes a high-level signal and a low-level signal. The voltage value of the high-level signal of the control signal output by the control module CTR is often relatively low, for example, generally between 4 and 8V. Although the high-level signal is sufficient to turn on the power MOSFET, since the gate-source voltage of the power MOSFET is not high enough, the power MOSFET will have a large on-resistance, resulting in a large conduction loss of the power MOSFET and severe heat generation, and the temperature of the power MOSFET is high. In the example disclosed in the present disclosure, the gate-source voltage of the power MOSFET when it is turned on can be increased as much as possible while ensuring the safety of the power MOSFET. For example, the gate-source voltage of the power MOSFET when it is turned on can be increased to 12 to 14V, thereby achieving the purpose of reducing the conduction loss of the power MOSFET, reducing the heat generation of the power MOSFET, and reducing the temperature of the power MOSFET.

[0140] It should be understood that the above example only uses the maximum gate-source voltage rating of the power MOSFET as 20V as an example to illustrate the gate-source voltage when the power MOSFET is turned on. In other examples of the present disclosure, the maximum gate-source voltage rating of the power MOSFET may not be 20V, for example, it may be 25V, 30V, etc. Furthermore, the maximum gate-source voltage rating of the power MOSFET can be obtained by consulting the power MOSFET's parameter manual.

[0141] The inventors discovered in their research that, referring to Figures 13A and 14, after further connecting the third switching element Q3 in parallel with the first switching element Q1 and the second switching element Q2, the temperature change of each switching element is relatively small. It can be seen from this that in the voltage conversion unit 510 of the disclosed example, the impact on the temperature of the switch module 512 mainly comes from switching losses, and the impact of conduction losses is not significant. In addition, when the spacing between components with high heat generation is small, the heat generated between the components will have an additive effect, which will also cause the temperature of the components to rise. Based on this, the switch module 512 only includes the first switching element Q1 and the second switching element Q2 connected in parallel. In this way, not only can the conduction losses be reduced, but the spacing between the components can also be increased, thereby reducing the temperature of the switch module 512 by increasing the spacing and reducing the conduction losses.

[0142] For example, larger switch components can be packaged to reduce the temperature rise of the switch module 512, and this disclosure does not limit this. For example, switching losses can also be reduced by selecting switch components with lower switching losses. Although this will increase costs, it can also reduce the temperature of the switch module 512, and this disclosure does not limit this.

[0143] As shown in Figure 13A, the output capacitor module 514 includes at least a first output capacitor C1 and a second output capacitor C2 connected in parallel. The output current of the voltage conversion unit 510 fluctuates constantly, causing the temperature of the output capacitor module 514 to rise. By connecting the first and second output capacitors C1 and C2 in parallel, the current flowing through a single component is reduced, thereby lowering the temperature of the first and second output capacitors C1 and C2, extending the service life of the capacitor module, reducing output voltage and current ripple, and improving output stability.

[0144] For example, the inductor module 511 includes at least a first inductor L1 and a second inductor L2 connected in parallel. By connecting the first inductor L1 and the second inductor L2 in parallel, the current flowing through the first inductor L1 and the second inductor L2 can be reduced, thereby reducing the temperature of the inductor module 511. For example, a larger inductor component can be packaged to reduce the temperature rise of the inductor module 511, and this disclosure is not limited thereto.

[0145] For example, diode module 513 includes at least a first diode D1 and a second diode D2 connected in parallel. The parallel connection of first diode D1 and second diode D2 can reduce the temperature of each component, thereby reducing the temperature of diode module 513. For example, at least one of first diode D1 and second diode D2 is a Schottky diode. Schottky diodes have high current density and low forward voltage drop, which means that Schottky diodes consume less energy and generate less heat. For example, larger diode components can be packaged to reduce the temperature rise of diode module 513, but this disclosure is not limited to this.

[0146] Referring to FIG. 13B , for example, the control module CTR is further configured such that, when providing a sink current to the control terminal of the power MOSFET, the maximum sink current is no less than 0.5A, for example, between 1A and 2A. In this way, the control module CTR can provide a large sink current to the power MOSFET, thereby further reducing the on-state loss of the power MOSFET and facilitating lowering the temperature of the power MOSFET. It will be appreciated that when the control module CTR provides a sink current to the control terminal of the power MOSFET, the magnitude of the sink current varies dynamically rather than being a constant current.

[0147] Referring to FIG. 13B , the voltage conversion unit 510 may further include a gate resistor Rg. A first end of the gate resistor Rg is electrically connected to the output terminal of the control module CTR, and a second end of the gate resistor Rg is electrically connected to the control terminal of the power MOSFET. Thus, when the control module CTR applies a high-level signal to the control terminal of the power MOSFET, the gate resistor Rg can also control the current flow, preventing damage to the power MOSFET caused by excessive current flow.

[0148] Figure 13C is a schematic diagram of the principle of a voltage conversion unit in a light-emitting unit driving circuit provided in another example of the present disclosure. Figure 13D is a schematic diagram of the principle of a control module in a voltage conversion unit provided in an example of the present disclosure. Figure 13E is a schematic diagram of the equivalent circuit of a control module provided in an example of the present disclosure.

[0149] Referring to Figure 13C , the voltage conversion unit 510 may further include a diode D'. The anode of the diode D' is electrically connected to the second end of the gate resistor Rg, and the cathode of the diode D' is electrically connected to the first end of the gate resistor Rg. When the control signal output by the control module CTR is a low-level signal, the control terminal of the power MOSFET can discharge through the diode D' and the gate resistor Rg. At this time, the diode D' is turned on, thereby allowing the power MOSFET to have a large current draw, which can reduce the power MOSFET's off-state loss.

[0150] Referring to Figure 13D, for example, the control module CTR may include a voltage stabilizing unit U1, which is configured to provide a driving voltage that is not less than the voltage of the high-level signal in the control signal. The control module CTR can use this driving voltage to make the high-level signal of the output control signal have a higher voltage value, thereby achieving the purpose of increasing the gate-source voltage of the power MOSFET when it is turned on, and overcoming the problem that the voltage value of the high-level signal of the control signal directly output by the control chip 516 is relatively low. For example, the voltage stabilizing unit U1 can output the driving voltage based on the input voltage Vin. In this way, the power supply on the driver circuit board can simultaneously power the inductor module 511 and the voltage stabilizing unit U1, which is conducive to simplifying the circuit of the driver circuit board and reducing the cost of the driver circuit board. Of course, in other examples of the present disclosure, the voltage stabilizing unit U1 can also use other power supply voltages to generate the driving voltage.

[0151] For example, referring to Figure 13E , the voltage stabilizing unit U1 includes a first switching element Q1, a Zener diode ZD1, a first resistor R1, and a filtering sub-circuit C1. The first end of the first switching element Q1 is used to apply the input voltage Vin, and the second end of the first switching element Q1 is electrically connected to the output end of the voltage stabilizing unit U1. A first resistor R1 is connected between the control end of the first switching element Q1 and the first end of the first switching element Q1. The control end of the first switching element Q1 is electrically connected to the cathode of the Zener diode ZD1, and the anode of the Zener diode ZD1 is used to apply the ground voltage GND. The filtering sub-circuit C1 is electrically connected to the output end of the voltage stabilizing unit U1. In this example, the first switching element Q1, the Zener diode ZD1, and the first resistor R1 form a voltage regulator. The filtering sub-circuit C1 can filter the output of the voltage regulator to remove the AC component. The appropriate Zener diode ZD1 can be selected based on the required drive voltage. For example, when the maximum gate-source voltage rating of the power MOSFET is 20 V and the derating factor used is 0.6-0.7, the Zener diode ZD1 can be a Zener diode with a stable voltage range of 12 V to 14 V. It will be appreciated that when selecting the first switching element Q1, the first resistor R1, and the Zener diode ZD1, the specifications (e.g., current specifications, power specifications, voltage specifications, etc.) of the first switching element Q1, the first resistor R1, and the Zener diode ZD1 may also be verified to avoid damage to the first switching element Q1, the first resistor R1, and the Zener diode ZD1 during operation due to specifications not meeting the requirements.

[0152] It is understandable that a variety of different strategies can be adopted to utilize the voltage stabilizing unit U1 to generate a control signal and make the voltage value of the high-level signal of the control signal higher, and even enable the control module CTR to provide a large current sink for the control terminal of the power MOSFET.

[0153] 13D and 13E , for example, the control module CTR includes a driver chip DIC, a voltage stabilizing unit U1, an inverter unit U2, and a driver unit U3. The driver chip DIC is configured to provide an initial control signal, which includes a high-level signal and a low-level signal. The voltage stabilizing unit U1 is configured to provide a driving voltage that is no less than the voltage of the high-level signal in the control signal. The inverter unit U2 includes a second resistor R2 and a second switch element Q2. The first end of the second resistor R2 is electrically connected to the output end of the voltage stabilizing unit U1, the second end of the second resistor R2 and the first end of the second switch element Q2 are electrically connected to the first node N1, and the second end of the second switch element Q2 is used to apply the ground voltage GND.

[0154] The driver chip DIC has an output terminal GATE for outputting an initial control signal. The control terminal of the second switch element Q2 is electrically connected to the output terminal of the driver chip. This allows the control terminal of the second switch element Q2 to receive the initial control signal from the driver chip DIC. The second switch element Q2 is configured to turn on in response to a high-level signal in the initial control signal and to turn off in response to a low-level signal in the initial control signal. When the second switch element Q2 is turned on, the voltage at the first node N1 is pulled down to the ground voltage GND, reaching a low level. When the second switch element Q2 is turned off, the voltage at the first node N1 is pulled up to a high level by the voltage stabilization unit U1.

[0155] The first terminal of the driver unit U3 is electrically connected to the output terminal of the voltage stabilizing unit U1, and the second terminal of the driver unit U3 is used to apply the ground voltage GND. The control terminal of the driver unit U3 is electrically connected to the first node N1, and the output terminal of the driver unit U3 is electrically connected to the control terminal of the power MOSFET. The driver unit U3 is configured to, when the voltage at the first node N1 is low, conduct electricity between the first terminal of the driver unit U3 and the control terminal of the power MOSFET (in this case, the driver unit U3 outputs a high-level signal of the control signal), and when the voltage at the first node N1 is high, conduct electricity between the second terminal of the driver unit U3 and the control terminal of the power MOSFET (in this case, the driver unit U3 outputs a low-level signal of the control signal).

[0156] In this way, when the voltage at the first node N1 is low, the driving voltage can be written to the control terminal of the power MOSFET (i.e., providing a sink current to charge the control terminal of the power MOSFET), turning on the power MOSFET and ensuring a high gate-source voltage when the power MOSFET is on. Furthermore, because the driving voltage has a large voltage value, the driver unit U3 can provide a large sink current to the control terminal of the power MOSFET. Overall, when the initial control signal output by the driver chip DIC is a high-level signal, the control signal output by the driver unit U3 is a high-level signal. Conversely, when the voltage at the first node N1 is high, the ground voltage GND can be written to the control terminal of the power MOSFET via the driver unit U3 (i.e., providing a drain current to discharge the control terminal of the power MOSFET), thereby turning off the power MOSFET. In this process, the control terminal of the power MOSFET discharges, which is equivalent to the driver unit U3 providing a drain current to the control terminal of the power MOSFET. Overall, when the initial control signal output by the driver chip DIC is a low-level signal, the control signal output by the driver unit U3 is a low-level signal. In this way, the control signal output by the driving unit U3 is synchronized with the initial control signal output by the driving chip DIC.

[0157] In this example, the inverter unit U2 and the driver unit U3 together constitute a level conversion sub-circuit, which converts the high-level voltage of the initial control signal output by the driver chip DIC into the gate drive voltage required by the power MOSFET; the driver unit U1 provides the sink current in the gate drive current required by the power MOSFET, and the gate drive current also includes the extraction current (also called leakage current).

[0158] Figure 13F is a schematic diagram of the principle of a control module in a voltage conversion unit provided in another example of the present disclosure. Figure 13G is a schematic diagram of an equivalent circuit of a control module provided in another example of the present disclosure.

[0159] Referring to Figures 13F and 13G , for example, the control module CTR includes a driver chip DIC, a voltage regulator unit U1, and a driver unit U3. The voltage regulator unit U1 is configured to provide a driving voltage that is no less than the voltage of the high-level signal in the control signal. The driver chip DIC is a control chip capable of utilizing an external voltage input and is configured to output an initial control signal based on the driving voltage provided by the voltage regulator unit U1. A first terminal of the driver unit U3 is electrically connected to the output terminal of the voltage regulator unit U1, and a second terminal of the driver unit U3 is used to apply a ground voltage GND. The control terminal of the driver unit U3 is configured to receive the initial control signal, and the output terminal of the driver unit U3 is electrically connected to the gate of the power MOSFET. The driver unit U3 is configured to electrically connect the first terminal of the driver unit U3 to the power MOSFET in response to a high-level signal in the initial control signal, and to electrically connect the second terminal of the driver unit U3 to the power MOSFET in response to a low-level signal in the initial control signal.

[0160] In this example, the high-level signal of the initial control signal output by the driver chip DIC has a sufficiently high voltage value, and is therefore sufficient to directly drive the driver unit U3. Therefore, the control module CTR of this example does not need to be provided with an inverter unit U2, thereby reducing the cost of the control module CTR.

[0161] For example, referring to Figures 13F and 13G , the driver unit U3 includes a third switching element Q3 and a fourth switching element Q4. A first terminal of the third switching element Q3 is electrically connected to the output terminal of the voltage stabilizing unit U1, and a first terminal of the fourth switching element Q4 is applied to the ground voltage GND. The control terminals of the third switching element Q3 and the fourth switching element Q4 are configured to receive an initial control signal. A second terminal of the third switching element Q3 and a second terminal of the fourth switching element Q4 are electrically connected to a second node N2, which is electrically connected to the control terminal of the power MOSFET, for example, via a gate resistor Rg. The third switching element Q3 is configured to turn on in response to a high-level signal in the initial control signal and to turn off in response to a low-level signal in the initial control signal. The fourth switching element Q4 is configured to turn on in response to a low-level signal in the initial control signal and to turn off in response to a high-level signal in the initial control signal.

[0162] For example, referring to Figures 13F and 13G , the control module CTR includes a driver chip DIC and a voltage regulator unit U1. Voltage regulator unit U1 is configured to provide a driving voltage that is no less than the voltage of the high-level signal in the control signal. The driver chip DIC is a control chip capable of utilizing an external voltage input and is configured to output a control signal based on the driving voltage. In this example, the initial control signal output by the driver chip DIC can be directly applied to the control terminal of the power MOSFET as a control signal, without the need for voltage or current adjustment by the driver unit U3.

[0163] For example, referring to Figures 13F and 13G, the driver chip DIC has an external voltage input terminal VCC for loading an external voltage input, and an output terminal GATE for outputting a control signal. The output terminal of the voltage stabilizing unit U1 can be electrically connected to the external voltage input terminal VCC, thereby allowing the driving voltage to be loaded as an external voltage input to the driver chip DIC. The driver chip DIC can output a control signal from the output terminal GATE based on the external voltage input, rather than outputting the control signal based on an internal constant voltage, which makes the high-level signal of the control signal have a high voltage value. The output terminal GATE can be electrically connected to the control terminal of the power MOSFET, for example, through the gate resistor Rg.

[0164] In this example, the driver chip DIC can generate a control signal based on the external input voltage (drive voltage) provided by the voltage stabilizing unit U1. The high-level signal of this control signal has a relatively high voltage value, thereby significantly reducing the conduction loss of the control terminal of the power MOSFET. In particular, when the DC-DC boost circuit does not have strict requirements for controlling temperature rise, the control module CTR of this example can omit the inverter unit U2 and the driver unit U3, thereby reducing the cost of the control module CTR.

[0165] It can be understood that the light-emitting unit driving circuits shown in FIG. 13A to FIG. 13G can all be applied to the circuit board in the present disclosure.

[0166] Figure 15A is a schematic diagram of one side surface of a circuit board provided in at least one embodiment of the present disclosure. Figure 15B is a schematic diagram of the other side surface of a circuit board provided in at least one embodiment of the present disclosure. Figure 15C is a partial schematic diagram of the circuit board shown in Figure 15A. Figure 15D is a planar schematic diagram of the circuit board shown in Figure 15A. Figure 16 is a schematic diagram of a light-emitting unit driving circuit provided in another example of the present disclosure. It should be noted that in order to more clearly illustrate the arrangement of components in the circuit board, Figure 15C only illustrates some of the components in the first driving structure, and Figure 15D only illustrates some of the components on the circuit board.

[0167] Referring to Figures 15A to 16, at least one embodiment of the present disclosure further provides a circuit board including a substrate 600 and a light-emitting unit driving circuit 500. The light-emitting unit driving circuit 500 is disposed on the substrate 600 and includes a voltage conversion unit 510 and a light-emitting driver unit 520. For example, the voltage conversion unit 510 is a DC-DC converter. For example, the voltage conversion unit 510 is a boost circuit that can generate an output voltage higher than the input voltage. For example, the light-emitting driver unit 520 is an LED driver. The voltage conversion unit 510 includes an input terminal and an output terminal and is configured to output a preset voltage. The light-emitting driver unit 520 is connected to the output terminal of the voltage conversion unit 510 and is configured to drive the light-emitting unit. For example, the voltage conversion unit 510 adjusts the voltage to a preset voltage by controlling the duty cycle, so that the preset voltage is output from the output terminal of the voltage conversion unit 510. The light-emitting driver unit 520 is connected to the output terminal of the voltage conversion unit 510 and is configured to drive the light-emitting unit. The voltage conversion unit 510 outputs a preset voltage to the light driving unit 520, thereby adjusting the brightness of the light emitting unit.

[0168] As shown in Figures 15A and 16, a plurality of voltage conversion units 510 are provided, and a plurality of light-emitting driving units 520 are provided. The plurality of voltage conversion units 510 and the plurality of light-emitting driving units 520 are provided in a one-to-one correspondence, and the corresponding voltage conversion units 510 and light-emitting driving units 520 are connected to form multiple driving structures. For example, three voltage conversion units 510 are provided, and three light-emitting driving units 520 are provided, and the corresponding voltage conversion units 510 and light-emitting driving units 520 are connected to form three driving structures.

[0169] For example, the voltage conversion units in multiple drive structures are concentrated on one side of the substrate, while the light-emitting drive units in multiple drive structures are concentrated on the other side of the substrate. This separates the high-voltage area where the voltage conversion units are located from the low-voltage area where the light-emitting drive units are located, effectively reducing the impact of interference during logic signal transmission.

[0170] For example, the multiple drive structures include three drive structures arranged in sequence along the longitudinal direction of the substrate. For example, the three drive structures are a first drive structure, a second drive structure, and a third drive structure. Arranged in sequence along the first direction are the light-emitting drive unit of the first drive structure, the light-emitting drive unit of the second drive structure, and the light-emitting drive unit of the third drive structure. Furthermore, to facilitate wiring layout, the voltage conversion unit of the third drive structure, the voltage conversion unit of the second drive structure, and the voltage conversion unit of the first drive structure are arranged in sequence along the first direction.

[0171] In some circuit board usage scenarios, the surface of the substrate 600 is arranged at an angle to the ground. For example, the surface of the substrate 600 is perpendicular to the ground. For example, to facilitate heat dissipation, the voltage conversion unit 510 is arranged on the side of the substrate 600 away from the ground.

[0172] As shown in Figures 15A and 16, multiple driving structures are arranged sequentially along a first direction y, and multiple light-emitting driving units 520 and multiple voltage conversion units 510 are alternately arranged along the first direction y. The first direction y is parallel to the surface of the substrate 600. For example, the dimension of the substrate 600 in the first direction y is greater than the dimension of the substrate 600 in the second direction x. The second direction x intersects the first direction y and is parallel to the surface of the substrate 600. For example, the first direction y is the longitudinal direction of the substrate 600, and the second direction x is the width direction of the substrate 600. For example, the second direction x is perpendicular to the first direction y.

[0173] For example, in the first direction y, three driving structures are arranged in sequence so that the voltage conversion unit 510 and the light-emitting driving unit 520 are arranged alternately. For example, the multiple driving structures include a first driving structure 501, a second driving structure 502, and a third driving structure 503. The light-emitting driving unit 5201 in the first driving structure 501 is adjacent to the voltage conversion unit 5102 in the second driving structure 502, and the light-emitting driving unit 5202 in the second driving structure 502 is adjacent to the voltage conversion unit 3103 in the third driving structure 503. By arranging the voltage conversion unit 510 and the light-emitting driving unit 520 alternately, the components with higher heat can be dispersed and the heat addition effect between the components can be improved. Moreover, considering that heat propagates upward away from the ground, resulting in a relatively high overall temperature of the voltage conversion unit 510 located further above, the dispersed arrangement method can also reduce the heat addition effect between the components.

[0174] For example, a light-emitting unit includes multiple LEDs connected in series to form multiple LED strings. The number of LED strings is greater than the number of driver structures, and each driver structure is connected to two or more LED strings in the multiple LED strings. For example, as shown in Figures 6 and 16, 30 LEDs are connected in series to form a LED string, and each light-emitting unit includes 12 LED strings. The light-emitting driver unit 520 in each driver structure includes 12 driver modules 521, each of which drives a corresponding LED string.

[0175] For example, the light-emitting driver unit 520 also includes 12 switching transistors 522 connected between the driver module 521 and the light-emitting subregions to receive drive signals from the driver module 521 and achieve conduction or cutoff between the light-emitting driver unit 520 and the light-emitting subregions. As shown in FIG15A , the 12 switching transistors 522 are arranged in two rows and six columns on the substrate 400 to facilitate heat dissipation. For example, the switching transistors 522 in two rows are staggered to increase the spacing between adjacent switching transistors 522.

[0176] For example, the circuit board further includes a shielding component, which is disposed at least on two opposing sides of the light-emitting driving unit 520 in the first direction y. The shielding component is disposed at the interface between the light-emitting driving unit 520 and the voltage conversion unit 510 to shield the voltage conversion unit 510 from signal interference with the light-emitting driving unit 520. For example, the shielding component is an internal ground trace within a conductive layer of the circuit board.

[0177] In one usage scenario, the circuit board is placed vertically, and heat convection will be generated in the vertical direction relative to the ground, that is, hot air rises and cold air falls. In this case, the components below will continue to bake the components above. For example, the drive structure close to the edge of the substrate 600 in the first direction y is the first drive structure 501. Taking into account the impact of heat upward, among the three drive structures, the temperature of the components in the first drive structure 501 is often relatively higher. Based on this, when adjusting the layout of the components in each drive structure, the components in the first drive structure 501 are adjusted first.

[0178] For example, substrate 600 includes a first edge a1 and a second edge a2 disposed opposite each other in a first direction y. In each drive structure, using first drive structure 501 as an example, the voltage conversion unit 510 and the light-emitting driver unit 520 are arranged in a direction from the first edge a1 toward the second edge a2. At least in the voltage conversion unit 510 closest to the first edge a1 of substrate 600, the inductor module 511 is arranged on the side of the voltage conversion unit 510 away from the light-emitting driver unit 520 in the first direction y. The inductor module 511 has relatively high power and relatively high temperature. Placing the inductor module 511 at a relatively peripheral position on substrate 600 facilitates heat dissipation from the inductor module 511. For example, the first edge a1 and the second edge a2 are parallel to the second direction x, and the third edge a3 is parallel to the first direction y. For example, the first edge a1 and the second edge a2 are both smaller than the third edge a3.

[0179] For example, taking the first driving structure 501 as an example, the output capacitor module 514 is arranged on a side of the voltage conversion unit 510 that is close to the light-emitting driving unit 520 in the first direction y. Arranging the output capacitor module 514 opposite the inductor module 511 can reduce the impact of heat generated by the inductor module 511 on the output capacitor module 514, thereby reducing the temperature of the output capacitor module 514.

[0180] For example, using the first drive structure 501 as an example, the diode module 513 is closer to the third edge a3 of the substrate 600 than the inductor module 511 and the output capacitor module 514. The third edge a3 connects the first edge a1 and the second edge a2. Placing the diode module 513 near the third edge a3 of the substrate 600 increases the distance between the diode module 513 and other power devices, thereby reducing the impact of heat generated by the power devices on the diode module 513.

[0181] For example, using the first drive structure 501 as an example, the switch module 512 is arranged between the inductor module 511 and the output capacitor module 514. A relatively open area exists between the opposing inductor module 511 and the output capacitor module 514. By arranging the switch module 512 between the inductor module 511 and the output capacitor module 514, a relatively large distance can be maintained between the inductor module 511, the switch module 512, and the output capacitor module 514, thereby reducing the effect of heat generation between the modules.

[0182] For example, using the first driving structure 501 as an example, the light-emitting unit driving circuit 500 also includes an input capacitor module 515, which is connected between the input terminal and the ground terminal. Considering that the input power supply supplying the voltage conversion unit 510 and the input terminal of the light-emitting unit driving circuit 500 often require a long trace, and parasitic inductance on the trace may hinder current flow, the input capacitor module 515 is provided at the input terminal of the light-emitting unit driving circuit 500. When the switch module 512 of the voltage conversion unit 510 is open, the current suddenly increases, and the input capacitor module 515 is in a discharging state, assisting in providing current. When the switch module 512 is closed, the current suddenly decreases to zero, and the input capacitor module 515 is in a charging state. The input capacitor module 515 and the output capacitor module 514 are arranged opposite each other in a second direction x to form a heat conduction channel extending along the first direction y. The second direction x is parallel to the substrate 600 and intersects the first direction y. For example, the second direction x is perpendicular to the first direction y. That is, the input capacitor module 515 and the output capacitor module 514 are arranged on both sides of the substrate 600 relative to each other, which can reduce the impact of heat generation caused by the power device. The heat conduction channel formed between the input capacitor module 515 and the output capacitor module 514 can facilitate heat upward. It should be noted that Figure 15A schematically shows a schematic diagram of the main board of the circuit board, and the arrangement of the components on the sub-board can be basically the same as the arrangement of the components on the main board. For example, the output capacitor module on the sub-board of the circuit board is correspondingly arranged on the side close to the output interface, and the input capacitor module on the sub-board is correspondingly arranged on the side close to the input interface. The arrangement of other components is completely consistent with the arrangement of the components on the main board.

[0183] For example, the plurality of drive structures include a first drive structure, a second drive structure, and a third drive structure. At least two of the first drive structure, the second drive structure, and the third drive structure have non-overlapping portions in the first direction. Referring to Figure 15A, the first drive structure 501 and the second drive structure 502 have non-overlapping portions in the first direction y, and the second drive structure 502 is staggered relative to the first drive structure 501 in the second direction x. In this way, the first drive structure 501 and the second drive structure 502 form a heat dissipation space due to the staggered arrangement. When the circuit board is placed vertically, the heat emitted by the second drive structure 502 that is relatively lower can flow upward through the heat dissipation space, reducing obstacles to heat flow.

[0184] In some examples, the plurality of driving structures include a first driving structure 501 and a second driving structure 502, the first driving structure 501 including a first voltage conversion unit 5101 and a first light-emitting driving unit 5201, and the second driving structure 502 including a second voltage conversion unit 5102 and a second light-emitting driving unit 5202; the first driving structure 501 and the second driving structure 502 are configured to satisfy at least one of the following conditions: the orthographic projection of the first voltage conversion unit 5101 on a plane perpendicular to the first direction y and the orthographic projection of the second voltage conversion unit 5102 on a plane perpendicular to the first direction y have no overlapping parts; the orthographic projection of the first light-emitting driving unit 5201 on a plane perpendicular to the first direction y and the orthographic projection of the second light-emitting driving unit 5202 on a plane perpendicular to the first direction y have no overlapping parts. part; the orthographic projection of the first voltage conversion unit 5101 on the plane perpendicular to the first direction y and the orthographic projection of the first light-emitting driving unit 5201 on the plane perpendicular to the first direction y have no overlapping part; the orthographic projection of the first voltage conversion unit 5101 on the plane perpendicular to the first direction y and the orthographic projection of the second light-emitting driving unit 5202 on the plane perpendicular to the first direction y have no overlapping part; the orthographic projection of the second voltage conversion unit 5102 on the plane perpendicular to the first direction y and the orthographic projection of the second light-emitting driving unit 5202 on the plane perpendicular to the first direction y have no overlapping part; and the orthographic projection of the second voltage conversion unit 5102 on the plane perpendicular to the first direction y and the orthographic projection of the first light-emitting driving unit 5201 on the plane perpendicular to the first direction y have no overlapping part.

[0185] For example, the orthographic projection of the first voltage conversion unit 5101 on a plane perpendicular to the first direction y and the orthographic projection of the second voltage conversion unit 5102 on a plane perpendicular to the first direction y have non-overlapping portions. For example, in at least two of the first drive structure, the second drive structure, and the third drive structure, the voltage conversion units have non-overlapping portions in the first direction. For example, referring to Figure 15A, the voltage conversion unit 5101 in the first drive structure 501 and the voltage conversion unit 5102 in the second drive structure 502 have non-overlapping portions in the first direction y, and the voltage conversion unit 5102 is staggered relative to the voltage conversion unit 5101 in the second direction x.

[0186] Referring to Figure 15A , for example, the first voltage conversion unit 5101 includes a first diode module 513 and a first input capacitor module 515, and the second voltage conversion unit 5102 includes a second output capacitor module 514' and a second inductor module 511'. The orthographic projection of the first diode module 513 on a plane perpendicular to the first direction y and the orthographic projection of the second output capacitor module 514' on a plane perpendicular to the first direction y have a first non-overlapping portion; the orthographic projection of the first input capacitor module 515 on a plane perpendicular to the first direction y and the orthographic projection of the second inductor module 511' on a plane perpendicular to the first direction y have a second non-overlapping portion. For example, the dimension of the first non-overlapping portion in the second direction x is greater than 10 mm; the second direction x is parallel to the substrate and intersects the first direction y; and the dimension of the second non-overlapping portion in the second direction x is greater than 3 mm.

[0187] Referring to Figure 15A , for example, the edge of the diode module 513 (first diode module) near the third edge a3 is one edge of the first voltage conversion unit 5101, and the edge of the input capacitor module 515 (first input capacitor module) away from the third edge a3 is the other edge of the first voltage conversion unit 5101. For example, the edge of the output capacitor module 514' (second output capacitor module) near the third edge a3 is one edge of the second voltage conversion unit 5102, and the edge of the inductor module 511' (second inductor module) away from the third edge a3 is the other edge of the second voltage conversion unit 5102. Therefore, the offset distance between the first diode module 513 and the second output capacitor module 514' is also the offset distance between the first voltage conversion unit 5101 and the second voltage conversion unit 5102 on the side near the third edge a3. Correspondingly, the offset distance between the first input capacitor module 515 and the second inductor 511 ′ is the offset distance between the first voltage conversion unit 5101 and the second voltage conversion unit 5102 on the side away from the third edge a3 .

[0188] As shown in Figure 15A , taking the first and second drive structures 501 and 502 as examples, the two boundaries of the first voltage conversion unit 5101 in the first drive structure 501 in the second direction x are the boundaries of the first diode module 513 and the first input capacitor module 515, respectively. The two boundaries of the first light-emitting driver unit 5201 in the first drive structure 501 in the second direction x are the boundaries of the first switch module 522 and the first driver module 521, respectively. In the second drive structure 502, the two boundaries of the second voltage conversion unit 5102 in the second direction x are the boundaries of the second output capacitor module 514' and the second inductor 511', respectively. The two boundaries of the second light-emitting driver unit 5202 in the second direction x are the boundaries of the second switch module 522' and the second driver module 521', respectively. In this way, the misalignment distances between voltage conversion units and between light-emitting driver units can be determined based on the misalignment distances between components.

[0189] For example, the plurality of drive structures include a first drive structure 501 and a second drive structure 502. The first drive structure 501 includes a first voltage conversion unit 5101, which includes a first inductor module 511. The second drive structure 502 includes a second voltage conversion unit 5102, which includes a second inductor module 511'. The orthographic projection of the first inductor module 511 on a plane perpendicular to the first direction y and the orthographic projection of the second inductor module 511' on a plane perpendicular to the first direction y do not overlap. For example, the inductor module 511 in the voltage conversion unit 5101 and the inductor module 511' in the voltage conversion unit 5102 are staggered. For example, the switch module 512 in the voltage conversion module 5101 and the switch module 512' in the voltage conversion unit 5102 are staggered.

[0190] For example, in at least two of the first drive structure, the second drive structure, and the third drive structure, the orthographic projections of the diode modules on a plane perpendicular to the first direction at least partially do not overlap. For example, the diode module 513 in the voltage conversion module 5101 and the diode module 513' in the voltage conversion unit 5102 are staggered.

[0191] For example, the orthographic projection of the first light-emitting driving unit 5201 on a plane perpendicular to the first direction y and the orthographic projection of the second light-emitting driving unit 5202 on a plane perpendicular to the first direction y have non-overlapping portions. For example, in at least two driving structures of the first driving structure, the second driving structure, and the third driving structure, the light-emitting driving units have non-overlapping portions in the first direction. For example, referring to Figure 15A, the light-emitting driving unit 5201 in the first driving structure 501 and the light-emitting driving unit 5202 in the second driving structure 502 have non-overlapping portions in the first direction y, and the light-emitting driving unit 5202 is staggered relative to the light-emitting driving unit 5201 in the second direction x.

[0192] For example, the first light-emitting driver unit 5201 includes a first switching tube module 522 and a first driver module 521, and the second light-emitting driver unit 5202 includes a second switching tube module 522' and a second driver module 521'. For example, the orthographic projection of the first switching tube module 522 on a plane perpendicular to the first direction y and the orthographic projection of the second switching tube module 522' on a plane perpendicular to the first direction y have a third non-overlapping portion; the orthographic projection of the first driver module 521 on a plane perpendicular to the first direction y and the orthographic projection of the second driver module 521' on a plane perpendicular to the first direction y have a fourth non-overlapping portion. For example, the dimension of the third non-overlapping portion in the second direction x is greater than 5 mm; and the dimension of the fourth non-overlapping portion in the second direction x is greater than 3 mm. For example, the switching tubes 522 in the light-emitting driver unit 5201 and the switching tubes 522' in the light-emitting driver unit 5202 are staggered. For example, in conjunction with the above example, the switching tubes 522 are arranged in two rows and six columns, and the switching tubes 522 in two adjacent rows are staggered. For example, the switch tubes 522 ′ are also arranged in two rows and six columns, and the switch tubes 522 ′ in two adjacent rows are staggered.

[0193] For example, the orthographic projection of the first voltage conversion unit 5101 on a plane perpendicular to the first direction y and the orthographic projection of the first light-emitting driver unit 5201 on a plane perpendicular to the first direction y do not overlap. For example, the orthographic projection of the first voltage conversion unit 5101 on a plane perpendicular to the first direction y and the orthographic projection of the second light-emitting driver unit 5202 on a plane perpendicular to the first direction y do not overlap. For example, the orthographic projection of the second voltage conversion unit 5102 on a plane perpendicular to the first direction y and the orthographic projection of the second light-emitting driver unit 5202 on a plane perpendicular to the first direction y do not overlap. For example, the orthographic projection of the second voltage conversion unit 5102 on a plane perpendicular to the first direction y and the orthographic projection of the first light-emitting driver unit 5201 on a plane perpendicular to the first direction y do not overlap. For example, in at least two of the first drive structure, the second drive structure, and the third drive structure, at least one voltage conversion unit and at least one light-emitting driver unit have non-overlapping portions in the first direction. For example, referring to FIG15A , the light-emitting driving unit 5201 in the first driving structure 501 and the voltage conversion unit 5102 in the second driving structure 502 do not overlap in a first direction y, and the voltage conversion unit 5102 is staggered relative to the light-emitting driving unit 5201 in a second direction x. For example, the switch 522 in the light-emitting driving unit 5201 and the output capacitor module 514′ in the voltage conversion unit 5102 are staggered.

[0194] For example, the two boundaries of the first voltage conversion unit 5101 in the first driving structure 501 in the second direction x are the boundaries of the first diode module 513 and the boundaries of the first input capacitor module 515, respectively. The two boundaries of the first light-emitting driving unit 5201 in the first driving structure 501 in the second direction x are the boundaries of the first switch tube module 522 and the boundaries of the first driving module 521, respectively. In the second driving structure 502, the two boundaries of the second voltage conversion unit 5102 in the second direction x are the boundaries of the second output capacitor module 514' and the boundaries of the second inductor 511', respectively. The two boundaries of the second light-emitting driving unit 5202 in the second direction x are the boundaries of the second switch tube module 522' and the boundaries of the second driving module 521', respectively. It can be understood that the misalignment relationship between the voltage conversion unit and the light-emitting driving unit, that is, the distance difference between the edges of each component.

[0195] For example, the orthographic projection of the first diode module 513 on a plane perpendicular to the first direction y and the orthographic projection of the first switch tube module 522 on a plane perpendicular to the first direction y have a fifth non-overlapping portion. For example, the dimension of the fifth non-overlapping portion in the second direction x is greater than 6 mm.

[0196] For example, the orthographic projection of the first input capacitor module 515 on a plane perpendicular to the first direction y and the orthographic projection of the first driving module 521 on a plane perpendicular to the first direction y have a sixth non-overlapping portion. For example, a dimension of the sixth non-overlapping portion in the second direction x is greater than 11 mm.

[0197] For example, the orthographic projection of the first diode module 513 on the plane perpendicular to the first direction y and the orthographic projection of the second switch tube module 522' on the plane perpendicular to the first direction y have a seventh non-overlapping portion; for example, the size of the seventh non-overlapping portion in the second direction x is greater than 11 mm.

[0198] For example, the orthographic projection of the first input capacitor module 515 on the plane perpendicular to the first direction y and the orthographic projection of the second driving module 521' on the plane perpendicular to the first direction y have an eighth non-overlapping portion; for example, the size of the eighth non-overlapping portion in the second direction x is greater than 7 mm.

[0199] For example, the orthographic projection of the first switching tube module 522 on the plane perpendicular to the first direction y and the orthographic projection of the second output capacitor module 514' on the plane perpendicular to the first direction y have a ninth non-overlapping portion; for example, the size of the ninth non-overlapping portion in the second direction x is greater than 5 mm.

[0200] For example, the orthographic projection of the first driving module 521 on the plane perpendicular to the first direction y and the orthographic projection of the second inductor module 511 ′ on the plane perpendicular to the first direction y have a tenth non-overlapping portion; for example, the size of the tenth non-overlapping portion in the second direction x is greater than 8 mm.

[0201] For example, the orthographic projection of the second output capacitor module 514' on the plane perpendicular to the first direction y and the orthographic projection of the second switch tube module 522' on the plane perpendicular to the first direction y have an eleventh non-overlapping portion; for example, the size of the eleventh non-overlapping portion in the second direction x is greater than 0.5 mm.

[0202] For example, the orthographic projection of the second inductor module 511' on the plane perpendicular to the first direction y and the orthographic projection of the second driving module 521' on the plane perpendicular to the first direction y have a twelfth non-overlapping portion; for example, the size of the twelfth non-overlapping portion in the second direction x is greater than 4 mm.

[0203] For example, the substrate includes a first edge and a second edge disposed opposite to each other in a first direction, and the heat conduction channel is directed from the second edge to the first edge. Referring to FIG15D , for example, the heat conduction channel as indicated by the arrow can conduct heat from the second edge a2 to the first edge a1.

[0204] As shown in FIG15D , the spacing between components forms a heat conduction channel. FIG15D schematically illustrates the spacing between two adjacent inductors, the spacing between the output capacitor and the input capacitor, the spacing between two adjacent switching elements, and the spacing between the diode and the inductor (as shown in the shaded area). It is understood that the above spacings all extend along the longitudinal direction of the circuit board. When the circuit board is placed in a vertical position, the longitudinally extending spacings formed between the components together form a heat conduction channel, so that the heat dissipated by the components flows upward through the heat conduction channel formed by the spacing, from the second edge a2 and out from the first edge a1. By providing heat conduction channels in the longitudinal direction of the components, the present disclosure reduces heat barriers, allowing heat to be dissipated through the shortest possible channel, thereby improving the heat dissipation effect. Referring to FIG15D , in addition to the spacings extending along the first direction, the circuit board of the present disclosure is also provided with multiple spacings extending along the second direction, such as the spacing between two adjacent diodes. In this way, in addition to heat flowing upward along the first direction, heat can also be dissipated to both sides of the circuit board through the spacings in the second direction. In addition, by setting intervals extending along the second direction, the spacing between components can be increased, thereby providing a larger peripheral space for heat dissipation of the components and reducing the problem of heat addition caused by overly dense distribution between components.

[0205] As shown in Figures 15A to 15D , for example, the first inductor module 511 includes a first inductor and a second inductor arranged oppositely in the second direction x, and the second inductor module 511' includes a third inductor and a fourth inductor arranged oppositely in the second direction x. The second direction x is parallel to the substrate and intersects the first direction y. The thermal conductive path includes a first gap between the first and second inductors. For example, the first gap is greater than or equal to 10 mm. Referring to Figure 15D , the gray area between the first inductor L1 and the second inductor L2 represents the first gap extending along the first direction y. It should be noted that Figure 15D only illustrates an embodiment in which the first gap extends to the second switch module 512'. However, the present disclosure is not limited to this embodiment. Referring to Figures 15A and 15D , the first gap may also continue along the first direction y to the second edge a2 of the substrate 600.

[0206] As shown in Figures 15A to 15D , for example, the orthographic projection of the first interval on a plane perpendicular to the first direction y and the orthographic projection of the third inductor on a plane perpendicular to the first direction y form a first overlapping portion 01. For example, the orthographic projection of the first interval on a plane perpendicular to the first direction y and the orthographic projection of the fourth inductor on a plane perpendicular to the first direction y form a second overlapping portion. For example, the dimension of the first overlapping portion 01 in the second direction x is greater than 1 / 3 of the dimension of the third inductor in the second direction x. For example, the dimension of the first overlapping portion 01 in the second direction x can be 10 mm, and the dimension of the third inductor in the second direction x can be 17 mm. Of course, the dimensions of the first overlapping portion 01 and the third inductor are not limited herein. For example, the dimension of the second overlapping portion in the second direction x is greater than 1 / 3 of the dimension of the fourth inductor in the second direction x. For example, the fourth inductor may also overlap with the interval in the first direction y. For example, the dimension of the second overlapping portion in the second direction x can also be 10 mm, and the dimension of the fourth inductor in the second direction x can be 17 mm. Of course, the size of the second overlapping portion and the size of the fourth inductor are not limited here.

[0207] As shown in Figures 15A to 15D , for example, the spacing between the first and second inductors in the second direction x is the same as the spacing between the third and fourth inductors in the second direction x. For example, the spacing between the first and second inductors is 10 mm, and the spacing between the third and fourth inductors is 10 mm. In other examples, the spacing between the first and second inductors may be different from the spacing between the third and fourth inductors, and this disclosure is not limited thereto.

[0208] For example, the multiple drive structures further include a third drive structure 503, which includes a third voltage conversion unit 5103, which includes a third inductor module. The first inductor module and the third inductor module have non-overlapping portions in the first direction. For example, the second inductor module and the third inductor module have non-overlapping portions in the first direction. It is understood that the inductor modules in the first drive structure 501, the second drive structure 502, and the third drive structure 503 can be staggered.

[0209] For example, the third inductor module includes a fifth inductor and a sixth inductor arranged opposite each other in the second direction. The spacing between the first and third inductors in the first direction is the same as the spacing between the third and fifth inductors in the first direction. The spacing between the second and fourth inductors in the first direction is the same as the spacing between the fourth and sixth inductors in the first direction. It is understood that the spacing between the inductor modules in two adjacent drive structures can be set to be the same. This allows for a more even distribution of the drive structures on the circuit board.

[0210] As shown in Figures 15A to 15D , for example, the second voltage conversion unit 5102 includes a second output capacitor module 514' and a second input capacitor module 515' arranged opposite each other in the second direction x. The orthographic projection of the first gap on a plane perpendicular to the first direction y and the orthographic projection of the second input capacitor module 515' on a plane perpendicular to the first direction y form a third overlapping portion 03. Thus, in the first direction y, at least a portion of the second input capacitor module 515' overlaps with the first gap, allowing heat from the input capacitor module to be better dissipated from the first gap. For example, the dimension of the third overlapping portion 03 in the second direction x is greater than 1 / 3 of the dimension of the second input capacitor module 515' in the second direction x. For example, in the second direction x, the dimension of the third overlapping portion 03 is 10 mm, while the dimension of the second input capacitor module 515' is 18 mm. Of course, the dimensions of the third overlapping portion 03 and the second input capacitor module 515' are not limited herein.

[0211] As shown in Figures 15A to 15D , for example, the first voltage conversion unit 5101 includes a first switch module 512. The orthographic projection of the first spacer on a plane perpendicular to the first direction y at least partially overlaps with the orthographic projection of the first switch module 512 on the plane perpendicular to the first direction y. Thus, when heat dissipated by the first switch module 512 travels upward, the first spacer, which overlaps with the first switch module 512 in the first direction y, can reduce obstruction to heat dissipation.

[0212] For example, the second voltage conversion unit 5102 includes a second switch module, and the spacing between the first switch module and the first inductor module in the first direction is the same as the spacing between the second switch module and the second inductor module in the first direction. For example, the multiple drive structures further include a third drive structure 503, which includes a third voltage conversion unit 5103; the third voltage conversion unit 5103 includes a third switch module; the spacing between the first switch module and the second switch module in the first direction is the same as the spacing between the second switch module and the third switch module in the first direction. In this way, by setting the spacing between the switch modules in two adjacent drive structures to be the same, the distribution of components on the circuit board can be more uniform.

[0213] As shown in conjunction with Figures 15A to 15D , for example, the first switch module 512 includes a first switching element and a second switching element spaced apart along a second direction x. The orthographic projection of the first spacing on a plane perpendicular to the first direction y and the orthographic projection of the first switching element on a plane perpendicular to the first direction y have a fourth overlapping portion 04, thereby facilitating heat from the first switching element to flow upward through the first spacing and dissipate. For example, the orthographic projection of the first spacing on a plane perpendicular to the first direction y and the orthographic projection of the second switching element on a plane perpendicular to the first direction y have a fifth overlapping portion, thereby facilitating heat from the second switching element to flow upward through the first spacing and dissipate.

[0214] As shown in conjunction with Figures 15A to 15D , for example, the dimension of the first spacer in the second direction x is larger than the dimension of the first switching element in the second direction x, thereby facilitating heat dissipation of the first switching element. For example, the dimension of the first spacer in the second direction x is larger than the dimension of the second switching element in the second direction x, thereby facilitating heat dissipation of the second switching element.

[0215] As shown in Figures 15A to 15D , for example, the size of the fourth overlapping portion 04 in the second direction x is greater than half the size of the first switching element in the second direction x. For example, the size of the fourth overlapping portion 04 in the second direction x is 5 mm, and the size of the first switching element in the second direction x is 8 mm. For example, the size of the fifth overlapping portion in the second direction x is greater than half the size of the second switching element in the second direction x. For example, the size of the fifth overlapping portion in the second direction x is 5 mm, and the size of the second switching element in the second direction x is 8 mm. Of course, this disclosure does not limit the sizes of the first switching element, the second switching element, the fourth overlapping portion 04, or the fifth overlapping portion.

[0216] As shown in conjunction with Figures 15A to 15D , for example, the second voltage conversion unit 5102 includes a second switch module 512'. The orthographic projection of the first interval on a plane perpendicular to the first direction y at least partially overlaps with the orthographic projection of the second switch module 512' on a plane perpendicular to the first direction y. In some circuit board usage scenarios, the second voltage conversion unit 5102 is located below the first voltage conversion unit 5101. The first interval in the first voltage conversion unit 5101 overlaps with the second switch module 512' in the second voltage conversion unit 5102 in the first direction y, which facilitates the upward dissipation of heat from the second switch module 512'.

[0217] As shown in conjunction with Figures 15A to 15D , for example, the second switch module 512' includes a third switching element and a fourth switching element spaced apart along a second direction x. For example, the orthographic projection of the first spacing on a plane perpendicular to the first direction y at least partially overlaps the orthographic projection of the third switching element on a plane perpendicular to the first direction y, allowing heat from the third switching element to dissipate from the first spacing. For example, the orthographic projection of the first spacing on a plane perpendicular to the first direction y at least partially overlaps the orthographic projection of the fourth switching element on a plane perpendicular to the first direction y, allowing heat from the fourth switching element to dissipate from the first spacing.

[0218] 15A to 15D , for example, the orthographic projection of the first spacer on a plane perpendicular to the first direction y completely overlaps the orthographic projection of the third switching element on a plane perpendicular to the first direction y, thereby improving the heat dissipation effect on the third switching element. For example, the orthographic projection of the first spacer on a plane perpendicular to the first direction y completely overlaps the orthographic projection of the fourth switching element on a plane perpendicular to the first direction y, thereby improving the heat dissipation effect on the fourth switching element.

[0219] As shown in Figures 15A to 15D , for example, the voltage conversion unit includes an inductor module, an output capacitor module, and an input capacitor module. The input capacitor module and the output capacitor module are arranged opposite each other in a second direction, which is parallel to the substrate and intersects the first direction. The first inductor module 511 includes a first inductor and a second inductor arranged opposite each other in a second direction x, which is parallel to the substrate and intersects the first direction y. The first voltage conversion unit 5101 includes a first output capacitor module 514 and a first input capacitor module 515 arranged opposite each other in the second direction x. The thermal conductive path includes a second gap between the first output capacitor module 514 and the first input capacitor module 515. For example, the second gap is greater than or equal to 28 mm. Referring to Figure 15D , the gray area between the first output capacitor module 514 and the first input capacitor module 515 represents the second gap extending along the first direction y. It should be noted that Figure 15D only shows an embodiment in which the second interval extends to the second switch module 512'. However, the present disclosure is not limited to this. Referring to Figures 15A and 15D, the second interval can also continue to extend along the first direction y to the second edge a2 of the substrate 600.

[0220] As shown in Figures 15A to 15D , for example, the orthographic projection of the second spacer on a plane perpendicular to the first direction y and the orthographic projection of the first inductor on a plane perpendicular to the first direction y form a sixth overlapping portion 06, allowing heat dissipation from the first inductor via the second spacer. For example, the orthographic projection of the second spacer on a plane perpendicular to the first direction y and the orthographic projection of the second inductor on a plane perpendicular to the first direction y form a seventh overlapping portion 07, allowing heat dissipation from the second inductor via the second spacer.

[0221] As shown in conjunction with Figures 15A to 15D , for example, the dimension of the second spacer in the second direction x is larger than the dimension of the first inductor in the second direction x, thereby improving the heat dissipation effect on the first inductor. For example, the dimension of the second spacer in the second direction x is larger than the dimension of the second inductor in the second direction x, thereby improving the heat dissipation effect on the second inductor.

[0222] As shown in Figures 15A to 15D , for example, the dimension of the sixth overlapping portion 06 in the second direction x is greater than one-third of the dimension of the first inductor in the second direction x. For example, the dimension of the sixth overlapping portion 06 in the second direction x is 6 mm, and the dimension of the first inductor in the second direction x is 17 mm. For example, the dimension of the seventh overlapping portion 07 in the second direction x is greater than one-third of the dimension of the second inductor in the second direction x. For example, the dimension of the seventh overlapping portion 07 in the second direction x is 12 mm. The dimension of the second inductor in the second direction x is 19 mm.

[0223] 15A to 15D , for example, the orthographic projection of the second interval on a plane perpendicular to the first direction y at least partially overlaps with the orthographic projection of the second inductor module 511 ′ on a plane perpendicular to the first direction y, so that heat of the second inductor module 511 ′ can be dissipated through the second interval.

[0224] As shown in Figures 15A to 15D , for example, the second inductor module 511' includes a third inductor and a fourth inductor arranged opposite each other in the second direction x. The orthographic projection of the second interval on a plane perpendicular to the first direction y at least partially overlaps with the orthographic projection of the third inductor on a plane perpendicular to the first direction y, thereby improving the heat dissipation effect of the third inductor. The orthographic projection of the second interval on a plane perpendicular to the first direction y at least partially overlaps with the orthographic projection of the fourth inductor on a plane perpendicular to the first direction y, thereby improving the heat dissipation effect of the fourth inductor.

[0225] 15A to 15D , for example, the orthographic projection of the second spacer on a plane perpendicular to the first direction y completely overlaps with the orthographic projection of the third inductor on a plane perpendicular to the first direction y, i.e., the orthographic projection of the second spacer can completely cover the orthographic projection of the third inductor, thereby increasing the heat dissipation area. For example, the orthographic projection of the second spacer on a plane perpendicular to the first direction y completely overlaps with the orthographic projection of the fourth inductor on a plane perpendicular to the first direction y, i.e., the orthographic projection of the second spacer can completely cover the orthographic projection of the fourth inductor, thereby increasing the heat dissipation area.

[0226] As shown in conjunction with Figures 15A to 15D , for example, the second voltage conversion unit 5102 includes a second output capacitor module 514' and a second input capacitor module 515' arranged opposite each other in the second direction x. The orthographic projection of the second interval on a plane perpendicular to the first direction y and the orthographic projection of the second output capacitor module 514' on a plane perpendicular to the first direction y form an eighth overlapping portion 08, thereby improving the heat dissipation effect of the second output capacitor module 514'. For example, the orthographic projection of the second interval on a plane perpendicular to the first direction y and the orthographic projection of the second input capacitor module 515' on a plane perpendicular to the first direction y form a ninth overlapping portion 09, thereby improving the heat dissipation effect of the second input capacitor module 515'.

[0227] As shown in Figures 15A to 15D, for example, the size of the eighth overlapping portion 08 in the second direction x is greater than 1 / 15 of the size of the second output capacitor module 514' in the second direction x. For example, in the second direction x, the size of the eighth overlapping portion 08 is 2 mm, and the size of the second output capacitor module 514' is 28 mm. For example, the size of the ninth overlapping portion 09 in the second direction x is greater than 2 / 3 of the size of the second output capacitor module 514' in the second direction x. For example, in the second direction x, the size of the ninth overlapping portion 09 is 22 mm, and the size of the second output capacitor module 514' is 28 mm. Of course, the sizes of the eighth overlapping portion 08, the ninth overlapping portion 09, the second output capacitor module 514', and the second input capacitor module 515' are not limited in the present disclosure.

[0228] 15A to 15D , for example, the first voltage conversion unit 5101 includes a first switch module 512. The orthographic projection of the second interval on a plane perpendicular to the first direction y at least partially overlaps with the orthographic projection of the first switch module 512 on the plane perpendicular to the first direction y, so that heat from the first switch module 512 is better dissipated.

[0229] As shown in conjunction with Figures 15A to 15D , for example, the first switch module 512 includes a first switching element and a second switching element spaced apart along a second direction x. For example, the orthographic projection of the second spacing on a plane perpendicular to the first direction y at least partially overlaps with the orthographic projection of the first switching element on a plane perpendicular to the first direction y, thereby dissipating heat from the first switching element through the second spacing. For example, the orthographic projection of the second spacing on a plane perpendicular to the first direction y at least partially overlaps with the orthographic projection of the second switching element on a plane perpendicular to the first direction y, thereby dissipating heat from the second switching element through the second spacing.

[0230] 15A to 15D , for example, the orthographic projection of the second spacer on a plane perpendicular to the first direction y completely overlaps with the orthographic projection of the first switching element on a plane perpendicular to the first direction y, thereby improving the heat dissipation effect on the first switching element. For example, the orthographic projection of the second spacer on a plane perpendicular to the first direction y completely overlaps with the orthographic projection of the second switching element on a plane perpendicular to the first direction y, thereby improving the heat dissipation effect on the second switching element.

[0231] 15A to 15D , for example, the second voltage conversion unit 5102 includes a second switch module 512'. The orthographic projection of the second interval on a plane perpendicular to the first direction y at least partially overlaps with the orthographic projection of the second switch module 512' on the plane perpendicular to the first direction y, thereby better dissipating heat from the second switch module 512'.

[0232] As shown in Figures 15A to 15D , for example, the second switch module 512' includes a third switching element and a fourth switching element spaced apart along a second direction x. For example, the orthographic projection of the second spacing on a plane perpendicular to the first direction y and the orthographic projection of the third switching element on a plane perpendicular to the first direction y form a tenth overlapping portion 10, thereby enabling better heat dissipation from the third switching element. For example, the orthographic projection of the second spacing on a plane perpendicular to the first direction y and the orthographic projection of the fourth switching element on a plane perpendicular to the first direction y form an eleventh overlapping portion 11, thereby enabling better heat dissipation from the fourth switching element.

[0233] As shown in conjunction with Figures 15A to 15D , for example, the dimension of the tenth overlapping portion 10 in the second direction x is greater than two-thirds of the dimension of the third switching element in the second direction x. Of course, the tenth overlapping portion 10 may also completely overlap the third switching element. For example, the dimension of the eleventh overlapping portion 11 in the second direction x is greater than two-thirds of the dimension of the fourth switching element in the second direction x. For example, the dimension of the eleventh overlapping portion 11 in the second direction x is 7 mm, and the dimension of the fourth switching element in the second direction x is 8 mm. It is understood that the present disclosure does not limit the dimensions of the tenth overlapping portion 10, the eleventh overlapping portion 11, the third switching element, and the fourth switching element. As shown in conjunction with Figures 15A to 15D , for example, the thermal conductive path includes a second gap between the output capacitor module and the input capacitor module. For example, the second gap in the first driving structure 501 is formed between the input capacitor module 515 and the output capacitor module 514, for example, between the input capacitor module 515, the first output capacitor C1, and the second output capacitor C2. The second gap in the second driving structure 502 is formed between the input capacitor module 515' and the output capacitor module 514', for example, between the input capacitor module 515', the first output capacitor C1', and the second output capacitor C2'. The second gap in the third driving structure 503 is formed between the input capacitor module 515" and the output capacitor module 514", for example, between the input capacitor module 515", the first output capacitor C1", and the second output capacitor C2".

[0234] As shown in Figures 15A to 15D, for example, the second intervals in the first drive structure 501, the second intervals in the second drive structure 502, and the second intervals in the third drive structure 503 have overlapping portions in the corresponding extension directions. In this way, when the components closer to the second edge a2 dissipate heat, due to the upward movement of heat, the heat further below can pass through the three second intervals in sequence and dissipate from the end of the second interval close to the first edge a1. As a result, the heat conduction channels in the drive structure can reduce the obstruction in the upward movement of heat and improve the heat dissipation efficiency of the components. For example, the size of the second interval in the second drive structure 502 in the second direction and the size of the second interval in the third drive structure 503 in the second direction are both smaller than the size of the second interval in the first drive structure 501 in the second direction. Since the components further above will be continuously baked by the heat source below, the wider second interval can not only increase the distance between the output capacitor module 514 and the input capacitor module 515, but also make it easier to dissipate heat.

[0235] For example, the orthographic projection of the inductor module on a plane perpendicular to the first direction overlaps with the orthographic projection of the interval on a plane perpendicular to the first direction. For example, referring to Figure 15D, in the first driving structure 501, part of the structure of the inductor module 511 is located in the extension direction of the interval. Taking the first driving structure 501 as an example, the inductor module 511 includes a first inductor L1 and a second inductor L2 connected in parallel, and the first inductor L1 and the second inductor L2 are arranged to be spaced apart from each other along the second direction x. The spaced first inductor L1 and the second inductor L2 can increase the spacing between the components to improve the heat dissipation effect. For example, part of the structure of the first inductor L1 is located in the extension direction of the second interval, and part of the structure of the second inductor L2 is located in the extension direction of the second interval.

[0236] For example, the ratio of the size of the gap in the second direction to the size of the first inductor in the second direction is greater than 1.5. For example, the ratio of the size of the gap in the second direction to the size of the second inductor in the second direction is greater than 1.5. This ratio can be, but is not limited to, 1.5, 1.55, 1.6, 1.65, 1.7, etc., and the present disclosure does not impose any restrictions on this. Referring to Figure 15D, in the first driving structure 501, the ratio of the second gap to the length dimension of the first inductor L1 is greater than 1.5. The ratio of the second gap to the length dimension of the second inductor L2 is greater than 1.5. This ratio can be, but is not limited to, 1.5, 1.55, 1.6, 1.65, 1.7, etc., and the present disclosure does not impose any restrictions on this.

[0237] For example, the orthographic projection of the spacer on a plane perpendicular to the second direction does not at least partially overlap with the orthographic projection of the inductor module on a plane perpendicular to the second direction. For example, referring to FIG15D , the first drive structure 501 is used as an example for illustration. Since the second spacer is located between the output capacitor module 514 and the input capacitor module 515, the second spacer is spaced apart from the inductor module 511 in the first direction y. This means that the inductor module 514 is spaced apart from the output capacitor module 514, and the inductor module 514 is spaced apart from the input capacitor module 515. This increases the spacing between the components and reduces the heat generation effect between the components.

[0238] As shown in Figures 15A to 15D , for example, the first inductor module 511 includes a first inductor and a second inductor arranged opposite each other in a second direction x, which is parallel to the substrate and intersects the first direction y. The first voltage conversion unit 5101 includes a first switch module 512, which includes a first switching element and a second switching element spaced apart along the second direction x. The thermal conductive path includes a third gap between the first and second switching elements. Referring to Figure 15D , the gray area between the first and second switching elements Q1 and Q2 represents the third gap extending along the first direction y. It should be noted that Figure 15D only illustrates an embodiment in which the third gap extends to the second switch module 512'. However, the present disclosure is not limited to this embodiment. Referring to Figures 15A and 15D , the third gap may also extend along the first direction y to the second edge a2 of the substrate 600. For example, the third gap is greater than or equal to 8 mm. For example, the orthographic projection of the third interval on a plane perpendicular to the first direction y and the orthographic projection of the first inductor on a plane perpendicular to the first direction y form a twelfth overlapping portion 12, thereby dissipating heat from the first inductor through the third interval. For example, the orthographic projection of the third interval on a plane perpendicular to the first direction y and the orthographic projection of the second inductor on a plane perpendicular to the first direction y form a thirteenth overlapping portion 13, thereby dissipating heat from the second inductor through the third interval.

[0239] As shown in Figures 15A to 15D , for example, the dimension of the twelfth overlapping portion 12 in the second direction x is greater than 1 / 10 of the dimension of the first inductor in the second direction x. For example, the dimension of the thirteenth overlapping portion 13 in the second direction x is greater than 1 / 10 of the dimension of the second inductor in the second direction x. For example, the dimension of the thirteenth overlapping portion 13 in the second direction x is 3 mm, and the dimension of the second inductor in the second direction x is 19 mm. Of course, the present disclosure does not limit the dimensions of the twelfth overlapping portion 12, the thirteenth overlapping portion 13, the first inductor, and the second inductor.

[0240] As shown in Figures 15A to 15D , for example, the second inductor module 511' includes a third inductor and a fourth inductor arranged opposite each other in a second direction x. The second direction x is parallel to the substrate and intersects the first direction y. For example, the orthographic projection of the third interval on a plane perpendicular to the first direction y and the orthographic projection of the third inductor on a plane perpendicular to the first direction y have a fourteenth overlapping portion 14, so that heat is dissipated from the third inductor via the third interval. For example, the orthographic projection of the third interval on a plane perpendicular to the first direction y and the orthographic projection of the fourth inductor on a plane perpendicular to the first direction y have a fifteenth overlapping portion, so that heat is dissipated from the fourth inductor via the third interval.

[0241] As shown in Figures 15A to 15D , for example, the dimension of the fourteenth overlapping portion 14 in the second direction x is greater than half the dimension of the third inductor in the second direction x. For example, the dimension of the fourteenth overlapping portion 14 in the second direction x is 8 mm, and the dimension of the third inductor in the second direction x is 17 mm. For example, the dimension of the fifteenth overlapping portion in the second direction x is greater than half the dimension of the fourth inductor in the second direction x. Of course, the present disclosure does not limit the dimensions of the fourteenth overlapping portion 14, the fifteenth overlapping portion, the third inductor, and the fourth inductor.

[0242] As shown in conjunction with Figures 15A to 15D , for example, the second voltage conversion unit 5102 includes a second output capacitor module 514' and a second input capacitor module 515' arranged opposite each other in the second direction x. For example, the orthographic projection of the third interval on a plane perpendicular to the first direction y and the orthographic projection of the second output capacitor module 514' on a plane perpendicular to the first direction y have a sixteenth overlapping portion, so that heat is dissipated from the second output capacitor module 514' via the third interval. For example, the orthographic projection of the third interval on a plane perpendicular to the first direction y and the orthographic projection of the second input capacitor module 515' on a plane perpendicular to the first direction y have a seventeenth overlapping portion 17, so that heat is dissipated from the second input capacitor module 515' via the third interval.

[0243] As shown in Figures 15A to 15D , for example, the size of the sixteenth overlapping portion in the second direction x is greater than 1 / 3 of the size of the second output capacitor module 514' in the second direction x. For example, the size of the seventeenth overlapping portion 17 in the second direction x is greater than 1 / 3 of the size of the second input capacitor module 515' in the second direction x. For example, the size of the seventeenth overlapping portion 17 in the second direction x is 8 mm, and the size of the second input capacitor module 515' in the second direction x is 28 mm. Of course, the present disclosure does not limit the sizes of the sixteenth overlapping portion, the seventeenth overlapping portion 17, the second output capacitor module 514', and the second input capacitor module 515'.

[0244] 15A to 15D , for example, the second voltage conversion unit 5102 includes a second switch module 512 ′; the orthographic projection of the third interval on a plane perpendicular to the first direction y at least partially overlaps with the orthographic projection of the second switch module 512 ′ on a plane perpendicular to the first direction y, so as to dissipate heat for the second switch module 512 ′ through the third interval.

[0245] As shown in Figures 15A to 15D , for example, the second switch module 512' includes a third switching element and a fourth switching element spaced apart along the second direction x. The orthographic projection of the third spacing on a plane perpendicular to the first direction y and the orthographic projection of the third switching element on a plane perpendicular to the first direction y have an eighteenth overlapping portion 18, thereby dissipating heat from the third switching element through the third spacing. For example, the orthographic projection of the third spacing on a plane perpendicular to the first direction y and the orthographic projection of the fourth switching element on a plane perpendicular to the first direction y have a nineteenth overlapping portion, thereby dissipating heat from the fourth switching element through the third spacing.

[0246] As shown in Figures 15A to 15D , for example, the dimension of the eighteenth overlapping portion 18 in the second direction x is greater than one-third of the dimension of the third switching element in the second direction x. For example, the dimension of the eighteenth overlapping portion 18 in the second direction x is 3 mm, and the dimension of the third switching element in the second direction x is 7 mm. The dimension of the nineteenth overlapping portion in the second direction x is greater than one-third of the dimension of the fourth switching element in the second direction x. Of course, the present disclosure does not limit the dimensions of the eighteenth overlapping portion 18, the nineteenth overlapping portion, the third switching element, and the fourth switching element.

[0247] For example, the voltage conversion unit further includes a switch module. For example, the orthographic projection of the switch module on a plane perpendicular to the first direction overlaps with the orthographic projection of the heat conduction channel on a plane perpendicular to the first direction. For example, referring to FIG15D , in the first drive structure 501, a portion of the switch module 512 is located in the extension direction of the heat conduction channel. Using the first drive structure 501 as an example, a portion of the first switch element Q1 is located in the extension direction of the heat conduction channel, and a portion of the second switch element Q2 is located in the extension direction of the heat conduction channel.

[0248] As shown in Figures 15A to 15D , for example, the first inductor module 511 includes a first inductor and a second inductor arranged opposite each other in a second direction x, which is parallel to the substrate and intersects the first direction y. The first voltage conversion unit 5101 includes a first diode module 513, which includes a first diode and a second diode spaced apart in the first direction y. The first voltage conversion unit 5101 also includes a first output capacitor module 514. The thermal conductive path includes a fourth gap between the first diode and the second inductor. Referring to Figures 15A and 15D , the gray area between the first diode D1 and the second inductor L2 represents the fourth gap extending along the first direction y. It should be noted that Figure 15D only illustrates an embodiment in which the fourth gap extends to the second output capacitor module 514'. However, the present disclosure is not limited to this embodiment. Referring to Figures 15A and 15D , the fourth gap may also extend along the first direction y to the second edge a2 of the substrate 600. For example, the fourth gap is greater than or equal to 12 mm. For example, the orthographic projection of the fourth interval on the plane perpendicular to the first direction y and the orthographic projection of the first output capacitor module 514 on the plane perpendicular to the first direction y have a twentieth overlapping portion 20, so that the first output capacitor module 514 is cooled by the fourth interval.

[0249] As shown in Figures 15A to 15D , for example, the size of the twentieth overlapping portion 20 in the second direction x is greater than one-third of the size of the first output capacitor module 514 in the second direction x. For example, the size of the twentieth overlapping portion 20 in the second direction x is 12 mm, and the size of the first output capacitor module 514 in the second direction x is 28 mm. Of course, the present disclosure does not limit the size of either the twentieth overlapping portion 20 or the first output capacitor module 514.

[0250] 15A to 15D , for example, the second voltage conversion unit 5102 includes a second output capacitor module 514 ′; an orthographic projection of the fourth interval on a plane perpendicular to the first direction y and an orthographic projection of the second output capacitor module 514 ′ on a plane perpendicular to the first direction y have a twenty-first overlapping portion 21, so as to dissipate heat for the second output capacitor module 514 ′ through the fourth interval.

[0251] As shown in Figures 15A to 15D , for example, the dimension of the twenty-first overlapping portion 21 in the second direction x is greater than one-third of the dimension of the second output capacitor module 514' in the second direction x. For example, the dimension of the twenty-first overlapping portion 21 in the second direction x is 12 mm, and the dimension of the second output capacitor module 514' in the second direction x is 28 mm. Of course, the present disclosure does not limit the dimensions of either the twenty-first overlapping portion 21 or the second output capacitor module 514'.

[0252] As shown in Figures 15A to 15D , for example, multiple drive structures include a first drive structure 501 and a second drive structure 502. The first drive structure 501 includes a first voltage conversion unit 5101, which includes a first diode module 513. The second drive structure 502 includes a second voltage conversion unit 5102, which includes a second diode module 513'. The orthographic projection of the first diode module 513 on a plane perpendicular to the first direction y and the orthographic projection of the second diode module 513' on a plane perpendicular to the first direction y do not overlap. In this way, the misalignment between the first diode module 513 and the second diode module 513' can reduce the obstruction of heat dissipation between components in the first direction y, thereby improving the heat dissipation effect.

[0253] As shown in Figures 15A to 15D , for example, the orthographic projection of the first diode module 513 on a plane perpendicular to the first direction y and the orthographic projection of the second diode module 513' on a plane perpendicular to the first direction y do not overlap at all. Thus, the first diode module 513 and the second diode module 513' are completely offset, thereby providing greater heat dissipation space.

[0254] For example, in at least two of the first, second, and third drive structures, the spacing between the inductor modules and the switch modules in the first direction is the same. For example, in at least two of the multiple drive structures, the spacing between the inductor modules and the switch modules in the first direction is the same. For example, referring to FIG15D , in the second drive structure 502 and the third drive structure 503, the spacing between the inductor modules and the switch modules is the same. For example, the spacing l21 between the first inductor L1' and the first switch element Q1' can be the same as or different from the spacing l31 between the first inductor L1" and the first switch element Q1". For example, in the first, second, and third drive structures, the spacing between the inductor modules and the switch modules can be the same as or different from each other. In the example of FIG15D , the spacing l11 between the first inductor L1 and the first switch element Q1 is different from the spacing l21 and different from the spacing l31. For example, the distance 122 between the second inductor L2' and the second switching element Q2' may be the same as or different from the distance 132 between the second inductor L2" and the second switching element Q2". For example, the distance 112 between the second inductor L2 and the second switching element Q2 is different from the distance 122 and different from the distance 132.

[0255] Referring to Figures 15A and 15B , for example, a substrate 600 includes a first conductive layer 610 and a first solder resist layer 620. The first conductive layer 610 and the first solder resist layer 620 are located on the side of the substrate 600 where the light-emitting unit driving circuit 500 is located. The first conductive layer 610 is located on the side of the first solder resist layer 620 away from the light-emitting unit driving circuit 500. A first opening 621 is defined in the first solder resist layer 620, exposing the first conductive layer 610. The first opening 621 defined in the first solder resist layer 620 exposes the first conductive layer 610, thereby dissipating heat. Considering the layout of traces and components on the circuit board, the first opening 621 in the regions where the first, second, and third driving structures 501, 502, and 503 are located is slightly different. This disclosure uses the first opening 621 in the region where the first driving structure 501 is located as an example for illustration.

[0256] The first opening 621 includes a first opening portion 6211. The first opening portion 6211 is located between the inductor module 511, the diode module 513, and the switch module 512. This dissipates heat from the center of the components and reduces the effect of heat addition between the components. The area of ​​the first opening portion 6211 is greater than or equal to 970 square millimeters.

[0257] The first opening 621 includes a second opening portion 6212, which surrounds the inductor module 511 to dissipate heat from the inductor module 511. The area of ​​the second opening portion 6212 is greater than or equal to 320 square millimeters. "Surrounding" means that the second opening portion 6212 is provided in the peripheral area of ​​the inductor module 511. Surrounding can be limited to a partial circumferential area of ​​the inductor module 511, as shown in FIG15A , or can be adjusted to surround the entire circumferential area of ​​the inductor module according to actual needs, and this is not a limitation of the present disclosure.

[0258] The first opening 621 includes a third opening portion 6213, which surrounds the diode module 513, thereby dissipating heat from the diode module 513. It is understood that the third opening portion 6213 can be located between the first diode D1 and the second diode D2, as shown in FIG15A , or it can surround the entire circumference of the diode module, as needed. The third opening portion 6213 includes a sub-region located between the first diode D1 and the second diode D2, with an area greater than or equal to 50 square millimeters. The third opening portion 6213 also includes an area greater than or equal to 90 square millimeters on the side of the second diode D2 away from the first diode D1.

[0259] Referring to Figures 15A to 15C , substrate 600 includes a second conductive layer 630 and a second solder resist layer 640 located on a side of first conductive layer 610 away from first solder resist layer 620. Second conductive layer 630 is located between second solder resist layer 640 and first conductive layer 610. A second opening 641 is defined in second solder resist layer 640, exposing second conductive layer 630. The orthographic projection of second opening 641 on a third reference plane overlaps with the orthographic projection of first opening 621 on the same plane. The third reference plane is parallel to substrate 600. Thus, the openings on opposite sides of substrate 600 correspond to each other. While components dissipate heat through first opening 621, the side where second opening 641 is located also dissipates heat through second opening 641, thereby improving the heat dissipation efficiency of the circuit board. As shown in Figure 15B , the second opening 641 includes a first opening portion 6411 corresponding to the first opening portion 6211 of the first opening 621, a second opening portion 6412 corresponding to the second opening portion 6212 of the first opening 621, and a third opening portion 6413 corresponding to the third opening portion 6213 of the first opening 621. The second opening 641 also includes a fourth opening portion 6414 corresponding to the location of the diode module 513. As shown in Figures 15A and 15B , the orthographic projection of the second opening 641 on the third reference plane overlaps the orthographic projection of the first opening 621 on that surface. For example, the orthographic projection of the first opening 621 on the substrate 600 completely falls within the orthographic projection of the second opening 641 on the substrate 600. It will be appreciated that the shape and size of the second opening can be adjusted according to actual needs. Figure 15B merely schematically illustrates the second opening 641 and does not limit the shape and size of the second opening.

[0260] For example, it also includes a plurality of vias that penetrate at least the first conductive layer 610 and the second conductive layer 630, and the plurality of vias are arranged in an array. For example, the vias are heat dissipation vias. The vias can conduct the heat of the first conductive layer 610 to the second conductive layer 630, thereby dissipating heat. For example, copper is electroplated and filled in the vias. The orthographic projection of the first opening 621 on the third reference plane (a plane parallel to the substrate 600) covers at least part of the orthographic projection of the via on the third reference plane, that is, the vias are opened around the components, so as to dissipate heat faster. For example, the orthographic projection of the via on the plane parallel to the substrate 600 also falls into the orthographic projection of the second opening 641 on the plane. In this way, the vias can conduct the heat at the first opening 621 to the second opening 641.

[0261] Figure 17A is a schematic diagram of a circuit board provided in another example of the present disclosure. Figure 17B is a partial schematic diagram of the circuit board shown in Figure 17A. The difference between Figure 17A and Figure 15A is that the number of switching elements and the number of output capacitors in each voltage conversion unit of Figure 17A are different from the number of switching elements and the number of output capacitors in each voltage conversion unit of Figure 15A. For example, each voltage conversion unit in Figure 17A includes three switching elements and one output capacitor. Of course, the circuit board shown in Figure 17A may also have other differences from the circuit board shown in Figure 1, such as the positional relationship between components, and the present disclosure does not limit this. Figure 17C is a planar schematic diagram of the circuit board shown in Figure 17A. Figure 18 is a schematic diagram of a light-emitting unit driving circuit provided in another example of the present disclosure. It should be noted that in order to more clearly illustrate the arrangement of components in the circuit board, Figure 17B only illustrates some of the components in the first drive structure, and Figure 17C only illustrates some of the components on the circuit board.

[0262] For example, as shown in Figures 17A to 17C, and in conjunction with Figure 15D, the circuit board includes a substrate 600, multiple voltage conversion units 510 and multiple light-emitting driving units 520 disposed on the substrate 600. The voltage conversion unit 510 includes an input terminal and an output terminal, and is configured to output a preset voltage. The light-emitting driving unit 520 is connected to the output terminal of the voltage conversion unit 510 and is configured to drive the light-emitting unit. The multiple voltage conversion units 510 and the multiple light-emitting driving units 520 are arranged in a one-to-one correspondence, and a voltage conversion unit 510 is provided between adjacent light-emitting driving units 520. The voltage conversion unit 510 includes a first inductor L1 and a second inductor L2 connected in parallel, and the first inductor L1 and the second inductor L2 are arranged in a staggered manner. The circuit board provided by the present disclosure, by providing the voltage conversion unit 510 between adjacent light-emitting driving units 520 and staggering the first inductor L1 and the second inductor L2 in the voltage conversion unit 510, can disperse the components with higher heat generation and reduce the heat addition effect between the components.

[0263] For example, as shown in Figures 17A to 17C , in conjunction with Figure 15D , the circuit board includes a first edge a1 proximal to the voltage conversion unit 510 in a first direction y, where the first direction y is a direction from the voltage conversion unit 510 to the light-emitting driver unit 520 . The first inductor L1 is spaced a first distance from the first edge a1 in the first direction y, and the second inductor L2 is spaced a second distance from the first edge a1 in the first direction y, where the first distance and the second distance are different. By setting the first distance and the second distance to be different, the offset between the first inductor L1 and the second inductor L2 can be increased, thereby improving heat dissipation.

[0264] For example, as shown in FIGS. 17A to 17C and in combination with FIG. 15D, the difference between the first pitch and the second pitch is less than or equal to 1 / 2 of the width dimension of the first inductor L1 in the first direction y. For example, the difference between d54 and d55 is less than or equal to 1 / 2 of the width dimension of the first inductor L1 in the first direction y.

[0265] For example, as shown in FIGS. 17A to 17C and in combination with FIG. 15D, the plurality of voltage conversion units 510 include a first voltage conversion unit 510 and a second voltage conversion unit 510 located on both sides of the first light-emitting driving unit 520 in the first direction y, and the first direction y is the direction from the voltage conversion unit 510 to the light-emitting driving unit 520; the first voltage conversion unit 510 includes a first inductor module 511, and the second voltage conversion unit 510 includes a second inductor module 511'; the interval between the first inductor module 511 and the second inductor module 511' in the first direction y is y, there is a non-overlapping part between the orthographic projection of the first inductor L1 on the first reference plane and the orthographic projection of the second inductor L2 on the first reference plane, and the dimension of the non-overlapping part in the first direction y is h, and the dimension of the light-emitting driving unit 520 in the first direction y is x, then: y = a×x + b×h, 2 < a < 4, 1 < b < 3; wherein, the second direction x intersects the first direction y, and the first reference plane is a plane perpendicular to the second direction x. For example, by setting the parameter relationship between the interval between the first inductor module 511 and the second inductor module 511' and the misalignment dimension between the first inductor L1 and the second inductor L2, the layout of each component on the circuit board can be made more reasonable, and the heat dissipation effect can also be improved.

[0266] For example, as shown in FIGS. 17A to 17C and in combination with FIG. 15D, the plurality of voltage conversion units 510 include a first voltage conversion unit 510 and a second voltage conversion unit 510 located on both sides of the first light-emitting driving unit 520, the first voltage conversion unit 510 includes a first inductor module 511, a first capacitor module, and a first switch module 512, and the second voltage conversion unit 510 includes a second inductor module 511'; the interval between the first inductor module 511 and the second inductor module 511' in the first direction y is y, the dimension of the first inductor module 511 in the first direction y is y1, the dimension of the first capacitor module in the first direction y is y2, and the dimension of the first switch module 512 in the first direction y is y3, then: y = k×y1 + y3 + 2×y2, 1 < k < 3; wherein, the first direction y is the direction from the voltage conversion unit 510 to the light-emitting driving unit 520. By setting the parameter relationship between the first inductor module 511, the first capacitor module, the first switch module 512, and the interval y between the first inductor module 511 and the second inductor module 511' in the first direction y, the arrangement between each driving structure can be made more reasonable.

[0267] For example, as shown in FIG17A to FIG17C and in combination with FIG15D, the plurality of voltage conversion units 510 include a first voltage conversion unit 510 and a second voltage conversion unit 510 located on both sides of the first light-emitting driving unit 520, the first voltage conversion unit 510 includes a first inductor module 511, a first capacitor module and a first switch module 512; the first inductor module 511 includes a first inductor L1 and a second inductor L2 connected in parallel, the first inductor L1 and the second inductor L2 have a first interval in the second direction x, the first capacitor module includes a first output capacitor module 514 and a first input capacitor module 515 connected in parallel, the first output capacitor module 514 and the first input capacitor module 515 have a second interval in the second direction x, the first switch module 512 The first switch Q1 and the second switch Q2 are connected in parallel, and the first switch Q1 and the second switch Q2 have a third interval in the second direction x. The second voltage conversion unit 510 includes a second capacitor module, and the second capacitor module includes a second output capacitor module 514' and a second input capacitor module 515' connected in parallel. The second output capacitor module 514' and the second input capacitor module 515' have a fourth interval in the second direction x; the fourth interval has an overlapping portion with at least one of the first interval, the second interval, and the third interval on the second reference plane, and the second reference plane is a plane perpendicular to the first direction y. The first direction y is a direction from the voltage conversion unit 510 to the light-emitting driving unit 520, and the second direction x is parallel to the substrate 600 and intersects with the first direction y.

[0268] For example, as shown in Figures 17A to 17C and in conjunction with Figure 15D, the first, second, third, and fourth intervals have overlapping portions on the second reference plane. By overlapping the first, second, third, and fourth intervals, it is possible to reduce the obstruction to the upward dissipation of heat from components on the circuit board, thereby improving heat dissipation efficiency.

[0269] For example, as shown in Figures 17A to 17C , and in conjunction with Figure 15D , the size of the common overlapping portion in the second direction x is less than or equal to the size of the first interval in the second direction x. For example, the ratio of the size of the common overlapping portion in the second direction x to the size of the first interval in the second direction x is 0.3 to 0.7. For example, the ratio of the size of the common overlapping portion in the second direction x to the size of the first interval in the second direction x is 0.4 to 0.6. For example, the ratio of the size of the common overlapping portion in the second direction x to the size of the first interval in the second direction x is 0.5.

[0270] For example, as shown in Figures 17A to 17C, and in combination with Figure 15D, the first interval, the second interval, the third interval and the fourth interval are configured to satisfy at least one of the following conditions: the first interval is greater than or equal to 10 mm; the second interval is greater than or equal to 28 mm; the third interval is greater than or equal to 8 mm; and the fourth interval is greater than or equal to 4 mm.

[0271] In some embodiments, as shown in FIG17A and in conjunction with FIG17B , the voltage conversion unit 5101 in the first drive structure 501 is used as an example for illustration. In conjunction with some of the aforementioned embodiments, to further reduce the temperature of the switch module 512, as shown in FIG18 , the switch module 512 includes a first switching element Q1, a second switching element Q2, and a third switching element Q3 connected in parallel. Referring to FIG17A and FIG17B , the first switching element Q1, the second switching element Q2, and the third switching element Q3 are spaced apart from each other along the second direction x, and the spacing d51 between each of the first switching element Q1, the second switching element Q2, and the third switching element Q3 is no less than 8 mm.

[0272] 17A and 17B , for example, based on the temperature conditions of the inductor module 511, the switch module 512, and the diode module 513, the spacing d51 between the first switch element Q1, the second switch element Q2, and the third switch element Q3 in the switch module 512 is smaller than the spacing d52 between the first diode D1 and the second diode D2 in the diode module 513, and the spacing d52 between the first diode D1 and the second diode D2 is smaller than the spacing d53 between the first inductor L1 and the second inductor L2 in the inductor module 511.

[0273] 17A and 17B , for example, the inductor module 511 is located on one side of the switch module 512 in the first direction y, and the first inductor L1 and the second inductor L2 are spaced apart from each other along the second direction x. For example, the spacing d53 between the first inductor L1 and the second inductor L2 is greater than or equal to 10 mm.

[0274] Referring to Figures 17A and 17B , for example, in the first direction y, the minimum spacing between the first inductor L1 and the outer periphery of the substrate 600 is a first spacing d54, and the minimum spacing between the second inductor L2 and the outer periphery of the substrate 600 is a second spacing d55. The first spacing d54 and the second spacing d55 are different. For example, the minimum spacing between a side edge of the first inductor L1 and the outer periphery of the substrate 600 in the first direction y is the first spacing d54, and the minimum spacing between a side edge of the second inductor L2 and the outer periphery of the substrate 600 in the first direction y is the second spacing d55. The first spacing d54 and the second spacing d55 are different. The staggered arrangement of the first inductor L1 and the second inductor L2 in the first direction y can increase the space around the first inductor L1 and the second inductor L2, thereby increasing the heat dissipation space for the first inductor L1 and the second inductor L2 and reducing the temperature of the inductor module 511.

[0275] Referring to Figures 17A and 17B , for example, the difference between the first spacing d54 and the second spacing d55 is greater than or equal to 1 / 2 of the width of the first inductor L1 in the first direction y. For example, the staggered distance between the first inductor L1 and the second inductor L2 in the first direction y is greater than or equal to 1 / 2 of the width of the first inductor L1. For example, the first inductor L1 and the second inductor L2 have the same dimensions. Referring to Figure 17C , for example, the difference between the first spacing d54 and the second spacing d55 is also the staggered distance between the first inductor L1 and the second inductor L2 in the first direction y. For example, in multiple drive structures, the staggered distances between the first inductor L1 and the second inductor L2 in the first direction y can be the same or different. Referring to Figure 17C , at least two of the staggered distance d between the first inductor L1 and the second inductor L2, the staggered distance d' between the first inductor L1' and the second inductor L2', and the staggered distance d" between the first inductor L1" and the second inductor L2" are the same.

[0276] Referring to Figures 17A and 17B , for example, the first inductor L1 and the second inductor L2 are arranged alternately along the first direction y. For example, between the inductor module 511 and the switch module 512, the spacing d56 between the first inductor L1, which is relatively closer to the switch module 512, and the first switching element Q1 is at least 10 mm, i.e., greater than or equal to 10 mm. For example, the spacing d57 between the second inductor L2, which is relatively farther from the switch module 512, and the third switching element Q3 is greater than or equal to 11 mm. The spacing d58 between the third switching element Q3 and the second diode D2 in the diode module 513 is the smallest, and is greater than or equal to 10 mm. The first diode D1 and the second diode D2 in the diode module 513 are spaced apart along the first direction y, with a spacing d52 greater than or equal to 9 mm.

[0277] For example, the orthographic projection of the switch module on a plane perpendicular to the first direction overlaps with the orthographic projection of the heat conduction channel on a plane perpendicular to the first direction. For example, referring to Figure 17C , in the first drive structure 501, a portion of the switch module 512 is located in the extension direction of the heat conduction channel. In the first drive structure 501, the second switch element Q2 is located between the first switch element Q1 and the third switch element Q3, and the second switch element Q2 is located in the extension direction of the heat conduction channel. In the second drive structure 502, the second switch element Q2' is located between the first switch element Q1' and the third switch element Q3', and the second switch element Q2' is located in the extension direction of the heat conduction channel. In the third drive structure 503, the second switch element Q2" is located between the first switch element Q1" and the third switch element Q3", and portions of the second switch element Q2" and the first switch element Q1 are located in the extension direction of the heat conduction channel. Considering that the second switching element is located between the first switching element and the third switching element and will be affected by the heat generated between the components, arranging the second switching element in the extension direction of the heat conduction channel is beneficial to the heat dissipation of the second switching element.

[0278] For example, in at least two of the first, second, and third drive structures, the inductor modules have non-overlapping portions in the first direction. For example, among the multiple inductor modules in the multiple drive structures, at least two of the inductor modules have non-overlapping portions in the first direction. By staggering the inductor modules along the heat dissipation path, the spacing between components can be increased, heat resistance can be reduced, and heat dissipation can be accelerated. For example, referring to Figure 17C, the inductance module 511 of the first driving structure 501, the inductance module 511' of the second driving structure 502, and the inductance module 511" of the third driving structure 503 are all staggered. For example, at least two of the first inductor L1 in the inductance module 511, the first inductor L1' in the inductance module 511', and the first inductor L1" in the inductance module 511" are staggered, and at least two of the second inductor L2 in the inductance module 511, the second inductor L2' in the inductance module 511', and the second inductor L2" in the inductance module 511" are staggered.

[0279] For example, in at least two drive structures of the first drive structure, the second drive structure, and the third drive structure, the spacing between the first inductor and the second inductor in the second direction is the same. For example, in the multiple inductor modules in the multiple drive structures, the spacing between the first inductor and the second inductor in each inductor module in the second direction is the same. Referring to Figure 17C, in the inductor module 511 of the first drive structure 501, the spacing between the first inductor L1 and the second inductor L2 in the second direction x is l1; in the inductor module 511' of the second drive structure 502, the spacing between the first inductor L1' and the second inductor L2' in the second direction x is l2; in the inductor module 511" of the third drive structure 503, the spacing between the first inductor L1" and the second inductor L2" in the second direction x is l3, and the spacing l1, spacing l2, and spacing l3 are all the same.

[0280] For example, the spacing in the first direction between the first inductor of the first drive structure and the first inductor of the second drive structure is the same as the spacing in the first direction between the first inductor of the second drive structure and the first inductor of the third drive structure. For example, in multiple inductor modules in multiple drive structures, the spacing in the first direction between the first inductors of each adjacent two drive structures is the same. For example, referring to Figure 17C, the spacing in the first direction y between the first inductor L1 in the inductor module 511 and the first inductor L1' in the inductor module 511' is l1', and the spacing in the first direction y between the first inductor L1' in the inductor module 511' and the first inductor L1" in the inductor module 511" is l2', and the spacing l1' is equal to the spacing l2'.

[0281] For example, the spacing in the first direction between the second inductor of the first drive structure and the second inductor of the second drive structure is the same as the spacing in the first direction between the second inductor of the second drive structure and the second inductor of the third drive structure. For example, in multiple inductor modules within multiple drive structures, the spacing in the first direction between the second inductors of each adjacent two drive structures is the same. For example, referring to FIG17C , the spacing in the first direction y between the second inductor L2 in inductor module 511 and the second inductor L2' in inductor module 511' is l1", the spacing in the first direction y between the second inductor L2' in inductor module 511' and the second inductor L2" in inductor module 511" is l2", and the spacing l1" is equal to the spacing l2".

[0282] As shown in FIG. 17A and FIG. 18 , the arrangement of components in the voltage conversion unit 5102 of the second driving structure 502 and the voltage conversion unit 5103 of the third driving structure 503 is substantially the same as that of the voltage conversion unit 5101 of the first driving structure 501 .

[0283] For example, referring to FIG17A , the arrangement of the inductor module 511′, switch module 512′, and diode module 513′ of the voltage conversion unit 5102 in the second driving structure 502 is the same as that in the first driving structure 501. The output capacitor module 514′ and the input capacitor module 515′ are located on the side of the voltage conversion unit 5102 closer to the first edge a1, that is, relatively above the inductor module 511′. For example, the arrangement of the components in the voltage conversion unit 5103 in the third driving structure 503 is substantially the same as that in the second driving structure 502.

[0284] Of course, the arrangement of components in the voltage conversion unit of the second drive structure and the voltage conversion unit of the third drive structure can also be exactly the same as the arrangement of components in the voltage conversion unit of the first drive structure, and can be adjusted according to actual needs, and this disclosure does not limit this. For example, the arrangement of components in the light-emitting drive units of the first drive structure, the second drive structure, and the third drive structure can be exactly the same, or can be slightly different as shown in Figure 17A, and can be adjusted according to actual needs, and this disclosure does not limit this.

[0285] According to the embodiments shown in Figures 17A to 18, after testing the aforementioned embodiments at the maximum power state of the components for two hours, it was found that in the first drive structure 501, the temperature of the second switch element Q2 in the switch module 512, which is closer to the inductor module 511, was relatively higher, reaching 76.8°C. Due to the upward influence of heat, the temperature of the second inductor L2 located further up in the inductor module 511 was even higher, reaching 87.5°C. The temperature of the first diode D1 located further up in the diode module 513 was even higher, reaching 82.5°C. The temperature of the output capacitor was 69.4°C. Compared with the embodiment shown in Figure 12A, the temperature of the improved switch module 512 decreased by 25°C, the temperature of the inductor module 511 decreased by 9°C, and the temperature of the diode module 513 decreased by 10.5°C. The improvement was significant; except for the inductor module 511, the temperatures of all other components could be controlled within 85°C. In addition, the inventors also found that the temperature of the output capacitor was relatively high.

[0286] As shown in Figures 15A and 16 , for example, the switch module 512 includes at least a first switching element Q1 and a second switching element Q2 connected in parallel. The parallel arrangement of the first and second switching elements Q1 and Q2 not only reduces conduction losses but also increases the spacing between components, thereby lowering the temperature of the switch module 512 by combining increased spacing with reduced conduction losses. The first and second switching elements Q1 and Q2 are spaced apart along the second direction x, i.e., spaced apart from each other, which reduces the additive effect of heat generation between the first and second switching elements Q1 and Q2.

[0287] 15A and 15C , taking the first driving structure 501 as an example, a distance d1 between the first switching element Q1 and the second switching element Q2 in the second direction x is greater than or equal to 8 mm. It is understood that the distance d1 between the first switching element Q1 and the second switching element Q2 may be, but is not limited to, 8 mm, 8.1 mm, 8.2 mm, 8.3 mm, 8.4 mm, 8.5 mm, 8.6 mm, 8.7 mm, 8.8 mm, 8.9 mm, or 9 mm. Of course, depending on the space available on different circuit boards, the distance between the first switching element Q1 and the second switching element Q2 may be even greater, and this is not a limitation here.

[0288] For example, the output capacitor module 514 includes at least a first output capacitor C1 and a second output capacitor C2 connected in parallel. By connecting the first output capacitor C1 and the second output capacitor C2 in parallel, the current in a single component is reduced, thereby reducing the temperature of the first output capacitor C1 and the second output capacitor C2, and increasing the service life of the capacitor module. The first output capacitor C1 and the second output capacitor C2 are spaced apart from each other along the first direction y, that is, the first output capacitor C1 and the second output capacitor C2 are arranged in the longitudinal direction of the substrate 600. For example, the spacing between the first output capacitor C1 and the second output capacitor C2 in the first direction y is greater than or equal to 2 mm.

[0289] For example, in at least two of the first, second, and third drive structures, the orthographic projections of the output capacitor modules on a plane perpendicular to the first direction at least partially do not overlap. Referring to Figures 15A and 15D , the output capacitor modules 514 in the first drive structure 501 and the output capacitor modules 514' in the second drive structure 502 are offset in the first direction y. The output capacitor modules 514' in the second drive structure 502 and the output capacitor modules 514" in the third drive structure 503 are offset in the first direction y.

[0290] For example, in at least two of the first, second, and third drive structures, the orthographic projections of the input capacitor modules on a plane perpendicular to the first direction at least partially do not overlap. Referring to Figures 15A and 15D , the input capacitor modules 515 in the first drive structure 501 and the input capacitor modules 515' in the second drive structure 502 are offset in the first direction y. The input capacitor modules 515' in the second drive structure 502 and the input capacitor modules 515" in the third drive structure 503 are offset in the first direction y.

[0291] For example, the orthographic projection of the output capacitor module on a plane perpendicular to the second direction at least partially overlaps the orthographic projection of the input capacitor module on a plane perpendicular to the second direction. Referring to Figures 15A and 15D , in the first driving structure 501, the output capacitor module 514 and the input capacitor module 515 are spaced apart and arranged opposite each other in the second direction x. For example, the second output capacitor C2 in the output capacitor module 514 is spaced apart and arranged opposite each other in the second direction x. For example, the second output capacitor C2 and the input capacitor module 515 at least partially overlap in the second direction x, and the first output capacitor C1 and the input capacitor 515 do not overlap in the second direction x. In the second driving structure 502, the first output capacitor C1′ partially overlaps with the input capacitor module 515 in the second direction x, and the second output capacitor C2′ partially overlaps with the input capacitor module 515 in the second direction x. In the third driving structure 503, the first output capacitor C1″ and the second output capacitor C1″ also overlap with the input capacitor module 515 in the second direction x.

[0292] For example, referring to Figure 15D, the spacing between the switch module 512 of the first driving structure 501 and the switch module 512' of the second driving structure 502 in the first direction y is the same as the spacing between the switch module 512' of the second driving structure 502 and the switch module 512" of the third driving structure 503 in the first direction y.

[0293] In combination with some of the aforementioned embodiments, the arrangement of only the first switching element Q1 and the second switching element Q2 in parallel can save layout space on the surface of the substrate 600. When the first output capacitor C1 and the second output capacitor C2 are arranged in parallel, more sufficient layout space can be provided for them, increasing the spacing between the output capacitor module 514 and other components.

[0294] As shown in Figures 15A and 16, for example, the inductor module 511 includes at least a first inductor L1 and a second inductor L2 connected in parallel. By connecting the first inductor L1 and the second inductor L2 in parallel, the current flowing through the first inductor L1 and the second inductor L2 can be reduced, thereby reducing the temperature of the inductor module 511. The first inductor L1 and the second inductor L2 are spaced apart from each other along the second direction x to reduce the temperature effect between the first inductor L1 and the second inductor L2 and increase the heat dissipation space around the first inductor L1 and the second inductor L2.

[0295] 15A and 15C , for example, a distance d2 between the first inductor L1 and the second inductor L2 in the second direction x is greater than or equal to 10 mm. It should be understood that the distance d2 between the first inductor L1 and the second inductor L2 in the second direction x includes, but is not limited to, 10 mm, 10.1 mm, 10.2 mm, 10.3 mm, 10.4 mm, 10.5 mm, 10.5 mm, 10.7 mm, 10.8 mm, 10.9 mm, and 11 mm.

[0296] Referring to Figures 15A and 15C, for example, in some circuit board usage scenarios, the substrate 600 is arranged at an angle to the ground. In combination with some of the aforementioned embodiments, the arrangement of the components of the voltage conversion unit 510 in the first drive structure 501 is first adjusted. For example, the arrangement of the components in the second drive structure 502 and the third drive structure 503 shown in Figure 15A can be consistent with the arrangement of the components shown in Figure 17A. For example, in the voltage conversion unit 510 closest to the first edge a1 of the substrate 600, the distance d3 between the inductor module 511 and the outer periphery of the substrate 600 in the first direction y is greater than or equal to 5 mm. By adjusting the position of the inductor module 511, a heat dissipation space is reserved between the inductor module 511 and the outer periphery of the substrate 600, which facilitates heat dissipation of the inductor module 511. It can be understood that the distance d3 between any point on the inductor module 511 and any point on the periphery of the substrate 600 can be, but is not limited to, 5 mm, 5.1 mm, 5.2 mm, 5.3 mm, 5.4 mm, or 5.5 mm.

[0297] For example, in some circuit board usage scenarios, the circuit board housing is provided with a shell to protect the circuit board from dust. By adjusting the position of the inductor module 511 to maintain a certain distance from the periphery of the substrate 600, more space can be reserved between the inductor module 511 and the shell, allowing for better heat dissipation of the inductor module 511.

[0298] Referring to Figures 15A and 15C , for example, the spacing d4 between the inductor module 511 and the switch module 512 in the first direction y is greater than or equal to 10 mm. That is, the minimum distance between the inductor module 511 and the switch module 512 is greater than or equal to 10 mm. It is understood that the spacing d4 between any point on the inductor module 511 and any point on the switch module 512 can be, but is not limited to, 10 mm, 10.1 mm, 10.2 mm, 10.3 mm, 10.4 mm, 10.5 mm, 10.6 mm, 10.7 mm, 10.8 mm, 10.9 mm, or 11 mm. Of course, the spacing between the inductor module 511 and the switch module 512 can be greater, and this is not a limitation. For example, the spacing between the inductor module and the diode module in the second direction is greater than or equal to 12 mm. For example, the spacing between the inductor module and the output capacitor module in the first direction is greater than or equal to 15 mm. For example, the spacing between the inductor module and the input capacitor module in the first direction is greater than or equal to 29 mm.

[0299] Referring to Figures 15A and 15C , for example, the spacing d5 between the diode module 513 and the switch module 512 in the first direction y is greater than or equal to 10 mm. That is, the minimum distance between the diode module 513 and the switch module 512 is greater than or equal to 10 mm. It is understood that the spacing d5 between any point on the diode module 513 and any point on the switch module 512 can be, but is not limited to, 10 mm, 10.1 mm, 10.2 mm, 10.3 mm, 10.4 mm, 10.5 mm, 10.6 mm, 10.7 mm, 10.8 mm, 10.9 mm, or 11 mm. Of course, the spacing between the diode module 513 and the switch module 512 can be greater, and this is not a limitation. For example, the spacing between the diode module and the output capacitor module in the first direction is greater than or equal to 4 mm. For example, the spacing between the switch module and the output capacitor module in the second direction is greater than or equal to 3 mm. For example, the spacing between the switch module and the input capacitor module in the first direction is greater than or equal to 6 mm. For example, the spacing between the switch module and the input capacitor module in the second direction is greater than or equal to 2 mm.

[0300] For example, the diode module 513 includes a first diode D1 and a second diode D2 connected in parallel. The parallel connection of the first diode D1 and the second diode D2 can reduce the temperature of each component, thereby reducing the temperature of the diode module 513. For example, the first diode D1 and the second diode D2 are spaced apart from each other along the first direction y. In other words, the first diode D1 and the second diode D2 are both arranged on one side of the substrate 600 near the longitudinal edge. This allows for greater heat dissipation space between the first diode D1 and the second diode D2 and other power components, thereby facilitating heat dissipation of the first diode D1 and the second diode D2.

[0301] 15A and 15C , for example, the spacing d6 between the first diode D1 and the second diode D2 in the first direction y is greater than or equal to 9 mm. It is understood that the spacing between the first diode D1 and the second diode D2 in the first direction y can be, but is not limited to, 9 mm, 9.1 mm, 9.2 mm, 9.3 mm, 9.4 mm, 9.5 mm, 9.6 mm, 9.7 mm, 9.8 mm, 9.9 mm, or 10 mm. Of course, the spacing between the first diode D1 and the second diode D2 can also be greater, and this is not a limitation here.

[0302] For example, a first conductive layer 610 and a first solder resist layer 620 are provided on the side of the substrate 600 where the light-emitting unit driving circuit 500 is provided. For example, components in the light-emitting unit driving circuit 500 can be electrically connected to the first conductive layer 610. For example, the material of the first conductive layer 610 includes copper. For example, the first solder resist layer 620 is a green varnish layer, which serves as an insulating solder resist.

[0303] For example, a first opening 621 is provided in the first solder resist layer 620 to expose the first conductive layer 610. The first opening 621 provided in the first solder resist layer 620 can expose the first conductive layer 610, thereby dissipating heat. The first opening 621 surrounds at least one of the inductor module 511, the diode module 513, and the switch module 512, that is, the first opening 621 is provided around at least one of the inductor module 511, the diode module 513, and the switch module 512, thereby improving heat dissipation efficiency. For example, the first opening 621 can surround the entire peripheral area of ​​at least one of the inductor module 511, the diode module 513, and the switch module 512, or it can surround only a portion of the peripheral area of ​​at least one of the inductor module 511, the diode module 513, and the switch module 512. For example, the first opening 621 is a heat dissipation window provided in the first solder resist layer 620.

[0304] For example, the first opening 621 includes a first opening portion 6211, a second opening portion 6212, and a third opening portion 6213. The first opening portion 6211 is located between the inductor module 511, the diode module 513, and the switch module 512, thereby reducing the heat generation effect between the inductor module 511, the diode module 513, and the switch module 512. For example, the area of ​​the first opening portion 6211 is less than or equal to 800 square millimeters. Compared to the previous example, the area of ​​the first opening portion 6211 is reduced by at least 150 square millimeters. For example, the first opening portion 6211 includes a first sub-region, a second sub-region, a third sub-region, and a fourth sub-region. The first sub-region is located between the first inductor L1, the second inductor L2, the first switching element Q1, and the second switching element Q2. The second sub-region is located between the first inductor L1 and the second inductor L2. The third sub-region is located between the first switching element Q1 and the second switching element Q2. The fourth sub-region is located between the second inductor L2 and the first diode D1. For example, the second sub-area, the third sub-area and the fourth sub-area are all adjacent to the first sub-area. In this way, a more complete first opening portion 6211 can be formed by the adjacency of the four sub-areas, thereby increasing the area of ​​the first opening portion 6211 and thus improving the heat dissipation effect of the first opening portion 6211.

[0305] For example, the second opening 6212 surrounds the inductor module 511, the third opening 6213 surrounds the diode module 513, and the first opening 6211, the second opening 6212, and the third opening 6213 do not overlap. For example, the second opening 6212 surrounds at least a portion of the circumference of the inductor module 511, and the third opening 6213 surrounds at least a portion of the circumference of the diode module 513. Since the second opening 6212 surrounds the inductor module 511 and does not overlap with the first opening 6211, heat can be dissipated in the circumferential area of ​​the inductor module 511 not covered by the first opening 6211. Since the third opening 6213 surrounds the diode module 513 and does not overlap with the first opening 6211, heat can be dissipated in the circumferential area of ​​the diode module 513 not covered by the first opening 6211.

[0306] For example, the area of ​​the first opening 6211 is larger than that of the second opening 6212, and the area of ​​the first opening 6211 is also larger than that of the third opening 6213. It can be understood that the first opening 6211 has the largest area among the three regions of the first opening 621. The temperatures of the switch module 512 and the inductor module 511 are relatively high, and the larger area of ​​the first opening 6211 can dissipate heat more effectively.

[0307] For example, a second conductive layer 630 and a second solder resist layer 640 are provided on the side of the substrate 600 away from the first solder resist layer 620. The second conductive layer 630 is located between the second solder resist layer 640 and the first conductive layer 610. For example, the material of the second conductive layer 630 includes copper. For example, the second solder resist layer 640 is a green varnish layer, which acts as an insulating solder resist. For example, a second opening 641 is provided in the second solder resist layer 640, exposing the second conductive layer 630. The orthographic projection of the second opening 641 on a plane parallel to the substrate 600 overlaps with the orthographic projection of the first opening 621 on the same plane. The orthographic projections of the first opening 621 and the second opening 641 overlap on a plane parallel to the substrate 600, meaning that the openings on opposite sides of the substrate 600 correspond to each other. As a result, while the components dissipate heat through the first opening 621, the side where the second opening 641 is located also dissipates heat through the second opening 641, thereby improving the heat dissipation efficiency of the circuit board. For example, the second opening 641 is a heat dissipation window provided in the second solder resist layer 640. It can be understood that Figure 15B only schematically shows the second opening 641 corresponding to the area where the first drive structure 501 is located. In addition, the shape, area and opening position of the second opening 641 shown in Figure 15B can be adaptively adjusted according to actual needs, and the present disclosure does not limit this.

[0308] For example, the orthographic projection of the first opening 621 on the plane falls within the orthographic projection of the second opening 641 on the plane. On the side surface of the substrate 600 where the first opening 621 is located, the placement of components is limited, resulting in greater restrictions on the opening of the first opening 621. The side surface where the second opening 641 is located has relatively fewer restrictions. Therefore, a larger heat dissipation opening can be provided in the second opening 641. Furthermore, there is no need to consider component avoidance when opening the second opening 641, which simplifies the manufacturing process and saves costs.

[0309] As shown in Figures 15A and 15B , the arrangement of components in the voltage conversion unit 5102 of the second drive structure 502 and the voltage conversion unit 5103 of the third drive structure 503 is substantially identical to that of the voltage conversion unit 510 of the first drive structure 501. For example, referring to Figure 15A , the arrangement of the inductor module 511', switch module 512', and diode module 513' of the voltage conversion unit 5102 of the second drive structure 502 is substantially identical to that of the first drive structure 501. The output capacitor module 514' and the input capacitor module 551' are located on the side of the voltage conversion unit 5102 closer to the first edge a1, i.e., relatively above the inductor module 511'. For example, the diode module 513' is located further away from the third edge a3 than the diode module 513. This not only avoids the output interface (e.g., output interfaces CN6-CN7), but also allows the second drive structure 502 and the first drive structure 501 to be offset in the second direction x, thereby facilitating upward heat dissipation. For example, in the second direction x, the spacing between the diode module 513' and the third edge a3 is different from the spacing between the diode module 513 and the third edge a3. For example, the first inductor L1' and the second inductor L2' in the inductor module 511' are staggered in the first direction y, thereby increasing the heat dissipation space between the first inductor L1' and the second inductor L2'. For example, the arrangement of components in the voltage conversion unit 5103 in the third drive structure 503 is substantially the same as the arrangement of components in the second drive structure 502.

[0310] Of course, the arrangement of components in the voltage conversion unit of the second drive structure and the voltage conversion unit of the third drive structure can also be exactly the same as the arrangement of components in the voltage conversion unit of the first drive structure, and can be adjusted according to actual needs, and this disclosure does not limit this. For example, the arrangement of components in the light-emitting drive units of the first drive structure, the second drive structure, and the third drive structure can be the same, or can be slightly different as shown in Figure 15A, and can be adjusted according to actual needs, and this disclosure does not limit this.

[0311] For example, it also includes a plurality of vias 601 that penetrate at least the first conductive layer 610 and the second conductive layer 630, and the plurality of vias 601 are arranged in an array. For example, the vias 601 are heat dissipation vias. The vias 601 can transfer the heat of the first conductive layer 610 to the second conductive layer 630, thereby dissipating heat. For example, the vias 601 are filled with copper by electroplating. The orthographic projection of at least part of the vias 601 on the plane falls within the orthographic projection of the first opening 621 on the plane. It can be understood that the vias 601 are formed at a position where a heat dissipation window is opened around the components. By opening the vias 601 around the components, the heat of the components can be dissipated faster, thereby achieving cooling of the components. In addition, the first conductive layer 610 and the second conductive layer 630 can cooperate with the via 601, and the exposed first conductive layer 610 and the exposed second conductive layer 630 are formed into a whole by the via 601. While the first conductive layer 610 is dissipating heat, the heat emitted by the components is conducted to the other side surface more quickly, and then the heat is further dissipated with the help of the second opening 641 that exposes the second conductive layer 630, thereby improving the heat dissipation efficiency.

[0312] After testing the aforementioned embodiment for two hours at maximum component power, it was found that in the first drive structure 501, within the switch module 512, the second switch element Q2 was significantly affected by the heat generated by other components, reaching a relatively higher temperature of 80.3°C. Compared to the embodiment shown in Figures 17A to 18, the maximum temperature of the switch module 512 increased by 3.5°C. Compared to the embodiment with the third switch element Q3 connected in parallel, although the temperature of the second switch element Q2 increased, the increase was only approximately 3°C, a relatively small increase, and the impact on the temperature rise of other components was also relatively small. In the inductor module 511, the temperature of the first inductor L1, which is closer to the first switch element Q1, was 84.2°C, and the temperature of the second inductor L2, which is closer to the diode module 513, was 86.1°C. Compared to the embodiment shown in Figures 17A to 18, the maximum temperature of the inductor module 511 decreased by 1.4°C. In the diode module 513, the first diode D1, which is located further up, had a higher temperature of 81.2°C. Compared with the embodiments shown in Figures 17A to 18, the maximum temperature of the diode module 513 drops by 1.3°C. In the output capacitor module 514, the temperature of the first output capacitor C1, which is relatively higher, is higher, at 56.2°C. Compared with the embodiments shown in Figures 17A to 18, the maximum temperature of the output capacitor module 514 drops by 13.2°C. It can be seen that except for the second inductor L2, which has a higher temperature, which exceeds 85°C by only 1.1°C, the temperatures of other components can be controlled below 85°C. At the same time, the temperatures of the components in the second drive structure 502 and the third drive structure 503, which are relatively lower, are also below 85°C.

[0313] FIG19 is a schematic diagram of a shell provided in an example of the present disclosure.

[0314] At least one embodiment of the present disclosure provides a display module comprising a backplane, a circuit board (as shown in FIG15A ), a light-emitting unit, and a housing 900. The circuit board is disposed on the backplane, and the light-emitting unit is disposed on a side of the backplane away from the circuit board and connected to a drive structure. Driven by the drive structure, the light-emitting unit emits light and adjusts brightness.

[0315] For example, in some use scenarios for circuit boards, the circuit board is also covered with a housing 900 as shown in Figure 19. Housing 900 protects the circuit board from external forces and prevents dust from entering, which could cause short circuits or other problems. It should be understood that Figure 19 only schematically illustrates housing 900 and does not limit the shape and structure of the housing used to cover the circuit board to be exactly the same as that shown in Figure 19.

[0316] As shown in FIG. 19 , the housing 900 includes a top wall 910 and a bottom wall 920 disposed opposite each other in a first direction y. A first through-hole 911 is defined in the top wall 910, and a second through-hole 912 is defined in the bottom wall 920. Both the first through-hole 911 and the second through-hole 912 connect the interior and exterior of the housing 900. The first through-hole 911 and the second through-hole 912 can dissipate heat from both sides of the circuit board in the first direction y, accelerating heat exchange between the interior and exterior of the housing 900 and improving heat dissipation efficiency.

[0317] As shown in Figures 19 and 15A , in some display module usage scenarios, the housing 900 and the circuit board within it are positioned at an angle to the ground. For example, the first direction y is the longitudinal direction of the substrate 600 in the circuit board, and the first direction y is positioned at an angle to the ground. As heat travels upward away from the ground, the first through-holes 911 and second through-holes 912 connecting the interior and exterior of the housing 900 can create a convection cycle, thereby dissipating heat.

[0318] For example, a plurality of first through holes 911 are provided, and the plurality of first through holes 911 are arranged at intervals along the second direction x, and the second direction x is parallel to the substrate 600 and intersects with the first direction y. For example, the second direction x is perpendicular to the first direction y. A plurality of second through holes 912 are provided, and the plurality of second through holes 912 are arranged at intervals along the second direction x. For example, the second direction x is the width direction of the substrate 600 in the circuit board. By providing a plurality of first through holes 911 and a plurality of second through holes 912, the opening area of ​​the top wall 910 and the bottom wall 920 can be increased, thereby increasing the heat dissipation area. Moreover, the plurality of first through holes 911 and the plurality of second through holes 912 can also more easily form a convection cycle, thereby accelerating heat dissipation.

[0319] As shown in FIG19 , taking the example of a housing 900 having a dimension of 115 mm in the first direction y and a dimension of 15 mm in the second direction x, the number of first through holes 911 is set to no less than 9, and the number of second through holes 912 is set to no less than 9. For example, the diameters of the first through holes 911 and the second through holes 912 are no less than 6 mm. For example, the plurality of first through holes 911 and the plurality of second through holes 912 are uniformly arranged in the second direction x. Of course, this disclosure is not limited here, and the number and size of the first through holes 911 and the second through holes 912 can be further set according to actual needs.

[0320] For example, the housing 900 further includes a sidewall 930 connecting the top wall 910 and the bottom wall 920, and the sidewall 930 is provided with a third through hole 931. As shown in conjunction with FIG19 and FIG15A , for example, the two sidewalls 930 of the housing 900 that are parallel to the surface of the substrate 600 of the circuit board are provided with a plurality of third through holes 931, and the plurality of third through holes 931 are arranged in an array. In this manner, the housing 900 can also facilitate heat exchange between the interior and exterior spaces of the housing 900 through the plurality of third through holes 931, further improving the heat dissipation efficiency of components on the circuit board. For example, the orthographic projection of the third through hole 931 on the third reference plane overlaps with the orthographic projection of the drive structure on the third reference plane, and the third reference plane is parallel to the substrate. For example, the third through hole 931 corresponds to the location of components in the drive structure to facilitate heat dissipation. For example, the third through hole 931 substantially corresponds to the location of the voltage conversion unit 510 and the light-emitting driver unit 520. For example, referring to Figure 19, the third through hole 9311 close to the first through hole 911 can correspond to the voltage conversion unit 5101 in Figure 15A, the third through hole 9313 close to the second through hole 912 can correspond to the light-emitting driving unit 5203 in Figure 15A, and the third through hole 9312 in the middle part can correspond to the light-emitting driving unit 5201, the second driving structure 502 and the voltage conversion unit 5103 in Figure 15A.

[0321] After testing the aforementioned embodiment for 2 hours at the maximum power state of the components, it was found that the light-emitting unit in the display module generated heat, causing the temperature of the backplane to rise to 52°C, but the temperature of all components in the circuit board dropped below 85°C, with the highest temperature being only 83.4°C. All components met the temperature rise requirements.

[0322] At least one embodiment of the present disclosure provides a display device including the above-mentioned display module.

[0323] For example, the display device provided in the embodiments of the present disclosure may be any product or component with a display function, such as a liquid crystal display, a television, an electronic paper display device, a mobile phone, a tablet computer, a laptop computer, a digital photo frame, a navigation system, a virtual reality device, or the like. It should be noted that the display device may also include other conventional components or structures. For example, to achieve the necessary functions of the display device, those skilled in the art may configure other conventional components or structures according to specific application scenarios, and the embodiments of the present disclosure do not limit this.

[0324] Since the display device according to the embodiment of the present disclosure includes the above-mentioned display module, it also has corresponding beneficial technical effects, which will not be described in detail here.

[0325] There are a few points to note:

[0326] (1) The drawings of the embodiments of the present disclosure only involve structures related to the embodiments of the present disclosure, and other structures can refer to general designs.

[0327] (2) In the absence of conflict, features in the same embodiment and different embodiments of the present disclosure may be combined with each other.

[0328] The foregoing description is merely an exemplary embodiment of the present disclosure and is not intended to limit the scope of protection of the present disclosure. The scope of protection of the present disclosure is determined by the appended claims.

Claims

1. A circuit board, comprising: a substrate; a plurality of voltage conversion units and a plurality of light-emitting driving units disposed on the substrate, the voltage conversion unit including an input end and an output end and being configured to output a preset voltage; the light-emitting driving unit is connected to the output end of the voltage conversion unit and is configured to drive a light-emitting unit; wherein, the plurality of voltage conversion units and the plurality of light-emitting driving units are arranged in one-to-one correspondence, and the voltage conversion unit is arranged between adjacent light-emitting driving units; the voltage conversion unit includes a first inductor and a second inductor connected in parallel, and the first inductor and the second inductor are arranged in a staggered manner.

2. The circuit board according to claim 1, wherein, The circuit board includes a first edge close to the voltage conversion unit in a first direction, and the first direction is a direction from the voltage conversion unit to the light-emitting driving unit; The distance between the first inductor and the first edge in the first direction is a first distance, the distance between the second inductor and the first edge in the first direction is a second distance, and the first distance is different from the second distance.

3. The circuit board according to claim 2, wherein, The difference between the first distance and the second distance is less than or equal to 1 / 2 of the width dimension of the first inductor in the first direction.

4. The circuit board according to claim 1, wherein, The plurality of voltage conversion units include a first voltage conversion unit and a second voltage conversion unit located on both sides of a first light-emitting driving unit in a first direction, and the first direction is a direction from the voltage conversion unit to the light-emitting driving unit; The first voltage conversion unit includes a first inductor module, and the second voltage conversion unit includes a second inductor module; the interval between the first inductor module and the second inductor module in the first direction is y, the orthographic projection of the first inductor on a first reference plane and the orthographic projection of the second inductor on the first reference plane have a non-overlapping part, the dimension of the non-overlapping part in the first direction is h, and the dimension of the light-emitting driving unit in the first direction is x, then: y = a×x + b×h, 2 < a < 4, 1 < b < 3; wherein, a second direction intersects the first direction, and the first reference plane is a plane perpendicular to the second direction.

5. The circuit board according to claim 1, wherein, The plurality of voltage conversion units include a first voltage conversion unit and a second voltage conversion unit located on both sides of a first light-emitting driving unit, the first voltage conversion unit includes a first inductor module, a first capacitor module and a first switch module, and the second voltage conversion unit includes a second inductor module; The interval between the first inductor module and the second inductor module in the first direction is y, the dimension of the first inductor module in the first direction is y1, the dimension of the first capacitor module in the first direction is y2, and the dimension of the first switch module in the first direction is y3, then: y = k×y1 + y3 + 2×y2, 1 < k < 3; wherein, the first direction is a direction from the voltage conversion unit to the light-emitting driving unit.

6. The circuit board according to claim 1, wherein, The multiple voltage conversion units include a first voltage conversion unit and a second voltage conversion unit located on both sides of the first light-emitting driving unit. The first voltage conversion unit includes a first inductor module, a first capacitor module, and a first switch module; The first inductor module includes the first inductor and the second inductor connected in parallel with each other. The first inductor and the second inductor have a first interval in the second direction. The first capacitor module includes a first output capacitor module and a first input capacitor module connected in parallel with each other. The first output capacitor module and the first input capacitor module have a second interval in the second direction. The first switch module includes a first switch and a second switch connected in parallel with each other. The first switch and the second switch have a third interval in the second direction. The second voltage conversion unit includes a second capacitor module. The second capacitor module includes a second output capacitor module and a second input capacitor module connected in parallel with each other. The second output capacitor module and the second input capacitor module have a fourth interval in the second direction. The fourth interval and at least one of the first interval, the second interval, and the third interval have an overlapping portion on a second reference plane. The second reference plane is a plane perpendicular to the first direction. The first direction is the direction from the voltage conversion unit to the light-emitting driving unit. The second direction is parallel to the substrate and intersects with the first direction.

7. The circuit board according to claim 6, wherein, The first interval, the second interval, the third interval, and the fourth interval have a common overlapping portion on the second reference plane.

8. The circuit board according to claim 7, wherein, The size of the common overlapping portion in the second direction is less than or equal to the size of the first interval in the second direction.

9. The circuit board according to claim 7 or 8, wherein The ratio of the size of the common overlapping portion in the second direction to the size of the first interval in the second direction is 0.3 to 0.

7.

10. The circuit board according to any one of claims 6-9, wherein, The first interval, the second interval, the third interval, and the fourth interval are configured to satisfy at least one of the following conditions: The first interval is greater than or equal to 10 millimeters; The second interval is greater than or equal to 28 millimeters; The third interval is greater than or equal to 8 millimeters; The fourth interval is greater than or equal to 4 millimeters.

11. The circuit board according to any one of claims 6-10, wherein, The second voltage conversion unit includes a second inductor module. The second inductor module includes a third inductor and a fourth inductor oppositely arranged in the second direction; The first interval is configured to satisfy at least one of the following conditions: There is a first overlapping portion between the orthographic projection of the first interval on the second reference plane and the orthographic projection of the third inductor or the fourth inductor on the second reference plane. The size of the first overlapping portion in the second direction is greater than 1 / 3 of the size of the third inductor or the fourth inductor in the second direction; There is a third overlapping portion between the orthographic projection of the first interval on the second reference plane and the orthographic projection of the second input capacitor module on the second reference plane. The size of the third overlapping portion in the second direction is greater than 1 / 3 of the size of the second input capacitor module in the second direction.

12. The circuit board according to claim 11, wherein, The dimension of the first interval in the second direction is the same as the spacing between the third inductor and the fourth inductor in the second direction.

13. The circuit board according to any one of claims 6-12, wherein, The second interval is configured to satisfy at least one of the following conditions: The second voltage conversion unit includes a second inductor module, and the positive projection of the second interval on the second reference plane at least partially overlaps with the positive projection of the second inductor module on the second reference plane; There is an eighth overlapping portion between the positive projection of the second interval on the second reference plane and the positive projection of the second output capacitor module or the second input capacitor module on the second reference plane, and the dimension of the eighth overlapping portion in the second direction is greater than 2 / 3 of the dimension of the second output capacitor module or the second input capacitor module in the second direction.

14. The circuit board according to any one of claims 6-12, wherein, The second voltage conversion unit includes a second inductor module, and the second inductor module includes a third inductor and a fourth inductor that are oppositely arranged in the second direction; The second interval is configured to satisfy at least one of the following conditions: The dimension of the second interval in the second direction is greater than the dimension of the first inductor or the second inductor in the second direction; There is a sixth overlapping portion between the positive projection of the second interval on the second reference plane and the positive projection of the first inductor or the second inductor on the second reference plane, and the dimension of the sixth overlapping portion in the second direction is greater than 1 / 3 of the dimension of the first inductor in the second direction; The positive projection of the second interval on the second reference plane at least partially overlaps with the positive projection of the third inductor on the second reference plane; The positive projection of the second interval on the second reference plane completely overlaps with the positive projection of the fourth inductor on the second reference plane.

15. The circuit board according to any one of claims 6-12, wherein, The second voltage conversion unit includes a second inductor module, and the second inductor module includes a third inductor and a fourth inductor that are oppositely arranged in the second direction; The third interval is configured to satisfy at least one of the following conditions: There is a fourteenth overlapping portion between the positive projection of the third interval on the second reference plane and the positive projection of the third inductor or the fourth inductor on the second reference plane; There is a sixteenth overlapping portion between the positive projection of the third interval on the second reference plane and the positive projection of the second output capacitor module or the second input capacitor module on the second reference plane.

16. The circuit board according to claim 15, wherein, The dimension of the fourteenth overlapping portion in the second direction is greater than 1 / 2 of the dimension of the third inductor or in the second direction; and / or, The dimension of the sixteenth overlapping portion in the second direction is greater than 1 / 3 of the dimension of the second output capacitor module or the second input capacitor module in the second direction.

17. The circuit board according to any one of claims 6-12, wherein, The second voltage conversion unit includes a second inductor module; There is a non-overlapping portion between the positive projection of the first inductor module on the second reference plane and the positive projection of the second inductor module on the second reference plane.

18. The circuit board according to claim 1, wherein, The voltage conversion unit includes an inductor module, a diode module, a switch module, an output capacitor module, and an input capacitor module; The inductance module is connected between the input end of the voltage conversion unit and the positive electrode of the diode module; The negative electrode of the diode module is connected to the output end of the voltage conversion unit; The switch module includes a control end, an input end, and an output end. The control end of the switch module is configured to receive a control signal, and the control signal is used to control the conduction or cutoff between the input end and the output end of the switch module. One of the input end and the output end of the switch module is connected between the inductance module and the diode module, and the other of the input end and the output end of the switch module is connected to the ground end; The first pole of the output capacitance module is connected to the negative electrode of the diode module, and the second pole of the output capacitance module is connected to the ground end; The input capacitance module is connected between the input end and the ground end.

19. The circuit board according to claim 18, wherein, The substrate includes a first edge and a second edge disposed opposite to each other in a first direction. A plurality of the voltage conversion units and a plurality of the light-emitting driving units are provided in one-to-one correspondence, and the corresponding voltage conversion unit and the light-emitting driving unit are connected to form a plurality of driving structures. In each of the driving structures, the first direction is the direction from the voltage conversion unit to the light-emitting driving unit; At least in the voltage conversion unit closest to the first edge of the substrate, The inductance module is disposed on a side of the voltage conversion unit away from the light-emitting driving unit in the first direction; The output capacitance module is disposed on a side of the voltage conversion unit close to the light-emitting driving unit in the first direction; The input capacitance module and the output capacitance module are disposed opposite to each other in a second direction, and the second direction is parallel to the substrate and intersects with the first direction; The diode module is closer to the third edge of the substrate than the inductance module and the output capacitance module, and the third edge connects the first edge and the second edge; The switch module is disposed between the inductance module and the output capacitance module.

20. The circuit board according to claim 19, wherein, The circuit board is configured to satisfy at least one of the following conditions: The switch module includes at least a first switch element and a second switch element connected in parallel; the distance between the first switch element and the second switch element in the second direction is greater than or equal to 8 millimeters; The output capacitance module includes at least a first output capacitance module and a second output capacitance module connected in parallel; The distance between the first output capacitance module and the second output capacitance module in the first direction is greater than or equal to 2 millimeters; In the voltage conversion unit closest to the first edge of the substrate, the distance between the inductance module and the outer periphery of the substrate in the first direction is greater than or equal to 5 millimeters; The diode module includes a first diode and a second diode connected in parallel, and the distance between the first diode and the second diode in the first direction is greater than or equal to 9 millimeters; Wherein, the first direction is the direction from the voltage conversion unit to the light-emitting driving unit, and the second direction is parallel to the substrate and intersects with the first direction.

21. The circuit board according to claim 19, wherein, The voltage conversion unit is configured to satisfy at least one of the following conditions: The spacing between the inductor module and the switch module in the first direction is greater than or equal to 10 millimeters; The spacing between the inductor module and the diode module in the second direction is greater than or equal to 12 millimeters; The spacing between the inductor module and the output capacitor module in the first direction is greater than or equal to 15 millimeters; The spacing between the inductor module and the input capacitor module in the first direction is greater than or equal to 29 millimeters; The spacing between the diode module and the switch module in the second direction is greater than or equal to 10 millimeters; The spacing between the diode module and the output capacitor module in the first direction is greater than or equal to 4 millimeters; The spacing between the switch module and the output capacitor module in the second direction is greater than or equal to 3 millimeters; The spacing between the switch module and the input capacitor module in the first direction is greater than or equal to 6 millimeters; The spacing between the switch module and the input capacitor module in the second direction is greater than or equal to 2 millimeters.

22. The circuit board according to claim 19, wherein, The diode module includes a Schottky diode; and / or The switch module includes a transistor.

23. The circuit board according to claim 1, wherein, The voltage conversion units are provided in multiple numbers, and the light-emitting drive units are provided in multiple numbers; the multiple voltage conversion units and the multiple light-emitting drive units are arranged in one-to-one correspondence, and the corresponding voltage conversion unit and the light-emitting drive unit are connected to form multiple drive structures; The multiple drive structures are arranged in sequence along the first direction, and the multiple light-emitting drive units and the multiple voltage conversion units are alternately arranged along the first direction; The multiple drive structures include a first drive structure and a second drive structure, the first drive structure includes a first voltage conversion unit and a first light-emitting drive unit, and the second drive structure includes a second voltage conversion unit and a second light-emitting drive unit; The first drive structure and the second drive structure are configured to satisfy at least one of the following conditions: There is a non-overlapping part between the orthographic projection of the first voltage conversion unit on the second reference plane and the orthographic projection of the second voltage conversion unit on the plane perpendicular to the first direction; The second reference plane is a plane perpendicular to the first direction; There is a non-overlapping part between the orthographic projection of the first light-emitting drive unit on the second reference plane and the orthographic projection of the second light-emitting drive unit on the second reference plane; There is a non-overlapping part between the orthographic projection of the first voltage conversion unit on the second reference plane and the orthographic projection of the first light-emitting drive unit on the second reference plane; There is a non-overlapping part between the orthographic projection of the first voltage conversion unit on the second reference plane and the orthographic projection of the second light-emitting drive unit on the second reference plane; There is a non-overlapping part between the orthographic projection of the second voltage conversion unit on the second reference plane and the orthographic projection of the second light-emitting drive unit on the second reference plane; There is a non-overlapping part between the orthographic projection of the second voltage conversion unit on the second reference plane and the orthographic projection of the first light-emitting drive unit on the second reference plane.

24. The circuit board according to claim 23, wherein, The first voltage conversion unit includes a first diode module and a first input capacitor module, and the first light-emitting driving unit includes a first switching tube module and a first driving module; the second voltage conversion unit includes a second output capacitor module and a second inductor module, and the second light-emitting driving unit includes a second switching tube module and a second driving module; The first driving structure and the second driving structure are configured to satisfy at least one of the following conditions: A first non-overlapping portion exists between the orthographic projection of the first diode module on the second reference plane and the orthographic projection of the second output capacitor module on the second reference plane; A second non-overlapping portion exists between the orthographic projection of the first input capacitor module on the second reference plane and the orthographic projection of the second inductor module on the second reference plane; A third non-overlapping portion exists between the orthographic projection of the first switching tube module on the second reference plane and the orthographic projection of the second switching tube module on the second reference plane; A fourth non-overlapping portion exists between the orthographic projection of the first driving module on the second reference plane and the orthographic projection of the second driving module on the second reference plane; A fifth non-overlapping portion exists between the orthographic projection of the first diode module on the second reference plane and the orthographic projection of the first switching tube module on the second reference plane; A sixth non-overlapping portion exists between the orthographic projection of the first input capacitor module on the second reference plane and the orthographic projection of the first driving module on the second reference plane; A seventh non-overlapping portion exists between the orthographic projection of the first diode module on the second reference plane and the orthographic projection of the second switching tube module on the second reference plane; An eighth non-overlapping portion exists between the orthographic projection of the first input capacitor module on the second reference plane and the orthographic projection of the second driving module on the second reference plane; A ninth non-overlapping portion exists between the orthographic projection of the first switching tube module on the second reference plane and the orthographic projection of the second output capacitor module on the second reference plane; A tenth non-overlapping portion exists between the orthographic projection of the first driving module on the second reference plane and the orthographic projection of the second inductor module on the second reference plane; An eleventh non-overlapping portion exists between the orthographic projection of the second output capacitor module on the second reference plane and the orthographic projection of the second switching tube module on the second reference plane; A twelfth non-overlapping portion exists between the orthographic projection of the second inductor module on the second reference plane and the orthographic projection of the second driving module on the second reference plane.

25. The circuit board according to claim 1, wherein, The substrate includes a first conductive layer and a first solder mask layer. The first conductive layer and the first solder mask layer are located on the side of the substrate where the light-emitting driving unit is provided, and the first conductive layer is located on the side of the first solder mask layer away from the light-emitting driving unit; The voltage conversion unit includes an inductor module, a diode module, and a switching module. The inductor module includes the first inductor and the second inductor; A first opening exposing the first conductive layer is formed in the first solder mask layer; the first opening surrounds at least one of the inductor module, the diode module, and the switching module.

26. The circuit board according to claim 25, wherein, The first opening includes a first opening portion, a second opening portion, and a third opening portion that do not overlap each other; The first opening portion is located between the inductor module, the diode module, and the switch module, the second opening portion surrounds the inductor module, and the third opening portion surrounds the diode module; wherein, the area of the first opening portion is larger than the area of the second opening portion, and the area of the first opening portion is larger than the area of the third opening portion.

27. The circuit board according to claim 26, wherein, The area of the first opening portion is less than or equal to 800 square millimeters; The area of the second opening portion is greater than or equal to 320 square millimeters; The area of the third opening portion is greater than or equal to 90 square millimeters.

28. The circuit board according to any one of claims 25-27, wherein, The substrate includes a second conductive layer and a second solder mask layer on a side of the first conductive layer away from the first solder mask layer, and the second conductive layer is located between the second solder mask layer and the first conductive layer; A second opening exposing the second conductive layer is formed in the second solder mask layer; a positive projection of the second opening on a third reference plane overlaps a positive projection of the first opening on the third reference plane; The third reference plane is parallel to the substrate.

29. The circuit board according to claim 28, further comprising: A plurality of vias penetrating at least the first conductive layer and the second conductive layer, and the plurality of vias are arranged in an array; A positive projection of the first opening on the third reference plane covers at least a part of a positive projection of the vias on the third reference plane.

30. The circuit board according to any one of claims 1-29, further comprising a shielding component; The shielding component is disposed at least on opposite sides of the light-emitting driving unit in a first direction, and the first direction is a direction from the voltage conversion unit to the light-emitting driving unit.

31. A display module, comprising: A backplane; The circuit board according to any one of claims 1-30, disposed on the backplane; A light-emitting unit, disposed on a side of the backplane away from the circuit board and connected to the driving structure; And A housing covering the outside of the circuit board; Wherein, the housing includes a top wall and a bottom wall oppositely disposed in a first direction; the first direction is a direction from the voltage conversion unit to the light-emitting driving unit; the housing is configured to satisfy at least one of the following conditions: The top wall is provided with a first through hole, and the first through hole communicates the internal space and the external space of the housing; The bottom wall is provided with a second through hole, and the second through hole communicates the internal space and the external space of the housing.

32. The display module according to claim 31, wherein The housing further includes a side wall connecting the top wall and the bottom wall, and the side wall is provided with a third through hole; A positive projection of the third through hole on a third reference plane overlaps a positive projection of the driving structure on the third reference plane; the third reference plane is parallel to the substrate.

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