Optoelectronic component with a sealing material in an edge region between a front coating and a rear coating

Abstract

The invention relates to an optoelectronic component (100) with a front coating (20), a rear coating (30), and a layer system (10) between the front coating (20) and the rear coating (30), wherein the front coating (20) and the rear coating (30) enclose the layer system (10) such that the two coatings protrude laterally beyond the layer system (10), and an edge region (40) between the front coating (20) and the rear coating (30) is filled with a sealing material (50).

Description

[0001] Optoelectronic component with a sealing material in an edge region between a front coating and a back coating

[0002] The invention relates to an optoelectronic component with a front coating and a rear coating, wherein an edge region between the front coating and the rear coating is filled with a sealing material.

[0003] Optoelectronics is made up of the fields of optics and semiconductor electronics. It particularly includes systems and methods that enable the conversion of electronically generated energy into light emissions or that convert light emissions into energy. Optoelectronic components, in particular organic photovoltaic elements (OPVs) and organic light-emitting diodes (OLEDs), generate electrical energy or convert electrical energy into light emissions. Organic optoelectronic components, in particular organic solar cells, consist of a sequence of thin layers with at least one photoactive layer, which are preferably vapor-deposited in a vacuum or processed from a solution. The electrical connection can be achieved by metal layers, transparent conductive oxides and / or transparent conductive polymers.

[0004] Organic optoelectronic components, in particular organic photovoltaic elements or organic photodetectors, exhibit a greatly reduced lifetime due to direct contact with air, in particular oxygen, and / or moisture, in particular water, and must therefore be adequately protected by a barrier layer and / or encapsulation. Organic optoelectronic components, in particular organic photovoltaic elements, therefore require a barrier to protect against moisture and / or oxygen in order to prevent contact of moisture and / or oxygen with the layer system, in particular organic photoactive layers of the layer system, of the optoelectronic component. Organic optoelectronic components can be protected against the penetration of moisture and oxygen as well as against mechanical damage by applying protective layers and barrier layers.Special films and layers with different properties are known for this purpose. Furthermore, the edges of the optoelectronic component, with the front coating and back coating laminated to one another, must be protected against the ingress of moisture and / or oxygen. The corners and edges are carefully sealed for this purpose. The protective layers are often permeable to moisture, while the barrier layer protects the layer system from moisture. To ensure an economical service life, organic photovoltaic elements (OPV) require high-quality barrier layers to protect against water and oxygen. High-barrier films, wide edge diffusion zones, and edge seals are used here. Edge seals require good, direct contact with the barrier layers.High-barrier films with an aluminum layer have an insulating layer on the inside, which reduces the effectiveness of the edge seal. For reasons of electrical insulation, the barrier layers cannot always be arranged on the inside of the coating; instead, they are insulated by another non-electrically conductive layer. The use of wide edge diffusion zones to reduce water penetration into the sensitive zones requires large inactive areas of the optoelectronic component.

[0005] WO 2008 / 009929 A2 discloses an encapsulation for flexible optoelectronic components and a method for producing the same. The encapsulation comprises an upper transparent encapsulation layer and a lower encapsulation layer. The two encapsulation layers are sealed at the edges.

[0006] US 2012 / 0048349 A1 discloses a flexible solar cell arrangement with solar cells arranged in a sealed module chamber.

[0007] US 2010 / 0031997 A1 discloses a flexible film comprising an elongated protective film with a front side and a back side for use in the manufacture of flexible solar cell modules. The back side comprises at least two barrier regions to which two moisture barrier layers are applied.

[0008] The encapsulation of a flexible photovoltaic element or other flat, water-sensitive optoelectronic components consists of laminated high-barrier films on the front and back. The penetration of moisture via the edges of the laminate cannot be prevented by the film properties; here the joining materials are used as a seal, forming a barrier against moisture. So-called edge seals can fulfil this task, but only if they have the most direct contact possible with the barrier layers of the high-barrier films. Edge seals are used in particular to reduce the width of diffusion zones at the edges of an encapsulation of optoelectronic components. The edge seals must be in direct contact with the barrier layer, since otherwise water can infiltrate the edge seal.

[0009] A disadvantage of the prior art, however, is that the end regions or edges of protective layers and / or encapsulation of optoelectronic components are not adequately protected against external influences, particularly moisture and / or oxygen. This, in particular, reduces the service life of the optoelectronic component.

[0010] The invention is therefore based on the object of providing a lamination or encapsulation for a layer system of an optoelectronic component, wherein the aforementioned disadvantages do not occur and wherein, in particular, improved protection of the optoelectronic component against external influences is ensured.

[0011] The problem is solved by the subject matter of the independent claims. Advantageous embodiments emerge from the subclaims.

[0012] The object is achieved in particular by providing an optoelectronic component having a front coating and a rear coating and a layer system arranged between the front coating and the rear coating with a front electrode, a rear electrode and at least one photoactive layer, wherein the at least one photoactive layer is arranged between the front electrode and the rear electrode.The front coating and the rear coating enclose the layer system in such a way that both protrude laterally beyond the layer system, the front coating being a laminate of an outer front protective layer and an inner front barrier layer, and the rear coating being a laminate of an inner rear protective layer, an outer rear protective layer and a conductive rear barrier layer arranged therebetween, the inner rear protective layer having at least one recess in an edge region of the optoelectronic component, a sealing material filling the at least one recess and the edge region at least partially in a width, preferably in a complete width, between the front coating and the rear coating.

[0013] The front coating and the rear coating are formed, in particular, over the entire extent of the layer system. The front coating and the rear coating enclose the layer system, in particular, in such a way that both protrude laterally beyond all sides of the layer system. The front coating and the rear coating enclose the layer system in such a way that the front coating and the rear coating protrude beyond the layer system. The edge region is formed, in particular, around all sides of the layer system.

[0014] The at least one recess filled with the sealing material and the edge region at least partially filled in a width between the front coating and the rear coating form a seal, a so-called edge seal. The sealing material, in particular, has low permeability to moisture and / or oxygen to protect the layer system.

[0015] In a preferred embodiment, the at least one recess is completely filled with sealing material. In a preferred embodiment, the laminate of the front coating has an adhesive layer between the outer front protective layer and the inner front barrier layer for bonding the layers.

[0016] In a preferred embodiment, the laminate of the rear coating has an adhesive layer between the inner rear protective layer and the rear barrier layer and / or the rear barrier layer and the outer rear protective layer for connecting the layers so that they are integrally bonded to one another.

[0017] A front side of an optoelectronic component, in particular a photovoltaic element, and correspondingly also a front coating and a front protective layer, is understood to mean a side of the optoelectronic component that is intended to face sunlight. The front coating is preferably transparent. Accordingly, a rear side of an optoelectronic component, in particular a photovoltaic element, and correspondingly also a rear coating and a rear protective layer, is understood to mean a side of the optoelectronic component that is intended to face away from sunlight. At least one layer of the front coating is preferably opaque.Accordingly, a front electrode of the layer system is understood to be an electrode of the layer system that is intended to face sunlight, and a back electrode of the layer system is understood to be an electrode of the layer system that is intended to face away from sunlight.

[0018] In a preferred embodiment, the front coating is largely permeable to light (transparent) in the visible wavelength range. In a preferred embodiment, the front barrier layer and the at least one front protective layer, and a connecting material arranged therebetween, are at least largely permeable to light (transparent) in the visible wavelength range. An edge region is understood to mean, in particular, a region at the edge of the optoelectronic component, in particular along at least one edge of the optoelectronic component. The edge region runs along one edge of the optoelectronic component, along a plurality of edges of the optoelectronic component, or along all edges of the optoelectronic component. Accordingly, the at least one recess is preferably formed along at least one edge of the optoelectronic component.The edge region is, in particular, the region of the front coating and the rear coating that protrudes beyond the layer system. The edge region, in particular, has a certain width from at least one edge of the optoelectronic component in the direction of the layer system.

[0019] In a preferred embodiment, the recess runs all around the edge region of the optoelectronic component or of the front coating and the rear coating.

[0020] In a preferred embodiment, the front coating and the rear coating protrude with an edge region beyond the layer system.

[0021] The term "width of the edge region" refers, in particular, to a region of the edge region that extends laterally of the optoelectronic component from an edge to the direction of the layer system. The width of the edge region is, in particular, configured such that a diffusion length of the edge region is sufficient to prevent the entry of moisture and / or oxygen into the interior of the optoelectronic component.

[0022] An edge of an optoelectronic component or of the front coating and rear coatings is understood to mean, in particular, an end of the edge region facing away from the layer system, wherein the optoelectronic component is arranged in the geometric plane of its greatest horizontal extent. Preferably, the at least one edge of the optoelectronic component is formed from the edges of the front coating and the rear coating. In a preferred embodiment, a connecting layer, in particular an adhesive layer, made of a connecting material is arranged between the layer system and the front coating and between the layer system and the rear coating.

[0023] A connecting material is understood to mean in particular a material, preferably an adhesive or glue, or a layer of a material, in particular an adhesive layer, by means of which an element is fixed to another element, in particular glued, in particular two layers are glued to one another, so that they are integrally connected to one another.

[0024] In a preferred embodiment, the connecting material is a curable material, in particular a crosslinkable material, preferably by UV curing, pressure curing or thermal curing. In a preferred embodiment, the connecting material between the layer system and the front coating and between the layer system and the rear coating is formed from a material selected from the group consisting of polysiloxanes, epoxides, in particular an epoxy resin, polyacrylates, in particular polymethyl methacrylate (PMMA), polystyrenes, polyurethanes, or derivatives thereof in the form of monomers, oligomers or polymers.

[0025] In a preferred embodiment, the sealing material between the front coating and the back coating and the connecting material of the connecting layer are different, in particular the sealing material has a higher water coefficient compared to the connecting material of the connecting layer, and / or the sealing material has a lower transparency compared to the connecting material of the connecting layer.

[0026] In an alternative preferred embodiment, the sealing material between the front coating and the back coating and the bonding material of the bonding layer are the same.

[0027] In a preferred embodiment, the sealing material is arranged entirely in a region of the front coating and rear coating projecting beyond the layer system.

[0028] In a preferred embodiment, a connecting material is arranged between successive barrier layers and protective layers, wherein the type of connecting material can differ in each case.

[0029] A protective layer is understood in particular to be a layer for increasing mechanical resistance, in particular scratch resistance, and / or a filter layer, preferably a layer with a UV filter. In a particularly preferred embodiment, a protective layer is also a barrier layer. The protective layer is preferably in the form of a film. An inner protective layer is understood in particular to be a side of the front coating or the rear coating facing towards the layer system. An outer protective layer is understood in particular to be a side of the front coating or the rear coating facing away from the layer system.

[0030] In a preferred embodiment, the outer front protective layer and / or the outer rear protective layer is a UV protective layer, an anti-reflection layer, a layer against moisture and / or oxygen, and / or a mechanical protective layer, preferably to increase scratch resistance.

[0031] A barrier layer is understood, in particular, to be a layer that provides protection, in particular a barrier, against chemical compounds, contaminants, moisture, and / or oxygen, in particular atmospheric oxygen. The barrier layer is, in particular, a layer for preventing the permeability of external influences, in particular atmospheric oxygen and / or moisture. The barrier layer is preferably formed as a film.

[0032] In a preferred embodiment, the front barrier layer and / or the rear barrier layer is a layer against moisture and / or oxygen. An element, in particular a layer, which is applied, arranged or formed on another element, in particular another layer, is understood to mean, in particular, direct contact between one element and the other element or indirect contact, in particular by means of at least one connecting layer, in particular an adhesive layer, arranged therebetween.

[0033] The optoelectronic component according to the invention with a sealing material in an edge region between a front coating and a rear coating has advantages compared to the prior art. Advantageously, the sealing material in the edge region of the optoelectronic component protects the layer system particularly well against external influences, in particular atmospheric oxygen, moisture and other environmental influences. Advantageously, the service life of an optoelectronic component is increased. Advantageously, a moisture barrier is made possible at the laminate edges, i.e. the edge regions, of the optoelectronic component without large diffusion zones. This results in higher area efficiency and a longer service life. Advantageously, inexpensive, metal-containing barrier layers can be used.Advantageously, a reduced diffusion zone results in higher module efficiency per square meter.

[0034] In a preferred embodiment, the front coating, in particular the front barrier layer and the outer front protective layer, and the rear coating, in particular the rear barrier layer, the inner rear protective layer and the outer rear protective layer are formed from different materials and / or a different number of layers.

[0035] According to a development of the invention, it is provided that the at least one recess in the edge region runs along at least one edge of the optoelectronic component; preferably, the at least one recess runs circumferentially along the edges of the entire edge region. In a preferred embodiment, the recess in the edge region is formed along all four edges of the optoelectronic component. In a preferred embodiment, the at least one recess in the inner rear protective layer is arranged directly on the at least one recess in the outer front protective layer and / or the at least one recess in the outer rear protective layer.

[0036] According to a further development of the invention, it is provided that the at least one recess is formed over the entire width of the edge region, or the at least one recess is formed partially over the width of the edge region, wherein the inner rear protective layer is interrupted at the edge region by a plurality of recesses running along the at least one edge of the optoelectronic component.

[0037] In a preferred embodiment, the width of the edge region is 5 mm to 200 mm, preferably 5 mm to 100 mm, preferably 10 mm to 100 mm, preferably 10 mm to 80 mm, preferably 10 mm to 50 mm, preferably 10 mm to 30 mm, preferably 20 mm to 100 mm, or preferably 20 mm to 50 mm.

[0038] According to a further development of the invention, it is provided that the at least one recess of the inner rear protective layer is formed up to the rear barrier layer, and wherein the sealing material is in direct contact with the rear barrier layer, preferably with the rear barrier layer and the front barrier layer.

[0039] According to a further development of the invention, it is provided that the rear barrier layer of the rear coating additionally has at least one recess in the edge region, wherein the at least one recess in the edge region runs along the at least one edge of the optoelectronic component adjacent to the recess of the inner rear protective layer.

[0040] According to a further development of the invention, it is provided that the conductive rear barrier layer is formed from a metal or an alloy thereof, preferably Al.

[0041] According to a further development of the invention, it is provided that the outer front protective layer, the inner rear protective layer and / or the outer rear protective layer are formed independently of one another from a polymer, wherein the polymer is preferably selected from the group consisting of polyolefins, polyesters, aromatic polyesters, polyamides, polyvinyl chlorides, fluoropolymers, polyimides, polyesteramides, or combinations thereof, in particular ethylene vinyl acetate (EVA), polyacrylate (PA), polycarbonate (PC), polyethylene (PE), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polymethyl methacrylate (PMMA), polypropylene (PP), polyvinyl chloride (PVC), and thermoplastic polyurethane (TPU).

[0042] In a preferred embodiment, the layer thickness of the front coating is 1 pm to 2000 pm, preferably 1 pm to 1000 pm, preferably 1 pm to 100 pm, preferably 1 pm to 10 pm, preferably 5 pm to 1000 pm, preferably 10 pm to 1000 pm, preferably 10 pm to 500 pm, preferably 10 pm to 200 pm, preferably 10 pm to 100 pm, preferably 20 pm to 200 pm, preferably 20 pm to 100 pm, preferably 20 pm to 100 pm, preferably 50 pm to 500 pm, preferably 50 pm to 200 pm, or preferably 50 pm to 100 pm.

[0043] In a preferred embodiment, a layer thickness of the outer front protective layer and / or the outer rear protective layer is 50 pm to 2000 pm, preferably 100 pm to 1000 pm, or preferably 100 pm to 500 pm.

[0044] In a preferred embodiment, the layer thickness of the rear coating is 10 pm to 2000 pm, preferably 10 pm to 1000 pm, preferably 10 pm to 500 pm, preferably 10 pm to 100 pm, preferably 10 pm to 200 pm, preferably 10 pm to 100 pm, preferably 20 pm to 200 pm, preferably 20 pm to 100 pm, preferably 20 pm to 100 pm, preferably 50 pm to 500 pm, preferably 50 pm to 200 pm, or preferably 50 pm to 100 pm.

[0045] In a preferred embodiment, a layer thickness of the inner rear protective layer is 20 pm to 1000 pm, preferably 20 pm to 500 pm, preferably 50 pm to 500 pm, preferably 100 pm to 500 pm, preferably 20 pm to 200 pm, preferably 50 pm to 200 pm, or preferably 30 pm to 100 pm. According to a development of the invention, it is provided that a width of the at least one recess in the edge region of the inner rear protective layer is 2 mm to 100 mm, preferably 2 mm to 50 mm, preferably 2 mm to 20 mm, preferably 5 mm to 100 mm, preferably 5 mm to 50 mm, preferably 5 mm to 20 mm, preferably 10 mm to 100 mm, preferably 10 mm to 50 mm, or preferably 20 mm to 50 mm. A width of the recess is understood here in particular to mean a region of the recess within the edge region which extends laterally of the optoelectronic component from the direction of an edge to the direction of the layer system.

[0046] According to a further development of the invention, it is provided that a layer thickness of the sealing material at the edge region between the front coating and the rear coating is 50 pm to 2000 pm, preferably 50 pm to 1000 pm, preferably 50 pm to 500 pm, preferably 50 pm to 200 pm, preferably 200 pm to 2000 pm, preferably 200 pm to 1000 pm, or preferably 200 pm to 500 pm.

[0047] According to a development of the invention, the sealing material is selected from the group consisting of a butyl rubber, in particular isobutene-isoprene rubber, a nitrile rubber, an ethylene-butyl acrylate copolymer, an epoxy, in particular epoxy resin, an acrylate, in particular polymethyl methacrylate (PMMA), ethylene-propylene-diene rubber (EPDM), and a silicone sealant. The sealing material is preferably made of a material that itself serves as an adhesive material, i.e. does not require an additional adhesive or binder. In a particularly preferred embodiment, the sealing material is a crosslinking or non-crosslinking hot melt, in particular a solvent-free synthetic rubber adhesive with high initial adhesion, or a pressure-sensitive adhesive, a so-called PSA adhesive (pressure sensitive adhesive).In particular, the sealing material has a high adhesion to the adjacent rear barrier layer, front barrier layer, and / or inner front barrier layer.

[0048] In a preferred embodiment, the sealing material is flexible. In a preferred embodiment, the sealing material has a low moisture vapor transmission rate (MVTR). The sealing material has a low water vapor transmission rate if, despite the potential difference, i.e., a different partial vapor pressure on one side of the sealing material compared to the other side of the sealing material, it only allows very little water to pass through.

[0049] In a preferred embodiment, the sealing material has a water vapor transmission rate of less than ICh 2 g / m 2 d on , preferably smaller than ICh 3 g / m2 d, or preferably smaller than ICh 2 g / m 2 d ( according to ASTM E96 / E96M-16 ) .

[0050] In a preferred embodiment, the sealing material has a water vapor diffusion resistance number p of at least 1000, preferably of at least 5000, preferably of at least 10000, or preferably of at least 50000.

[0051] In a preferred embodiment, the water vapor transmission rate at the edge region with the sealing material is lower compared to the water vapor transmission rate of the connecting layer with the connecting material.

[0052] The object is alternatively achieved by providing an optoelectronic component having a front coating and a rear coating and a layer system arranged between the front coating and the rear coating, comprising a front electrode, a rear electrode and at least one photoactive layer, wherein the at least one photoactive layer is arranged between the front electrode and the rear electrode, and the front coating and the rear coating enclose the layer system in such a way that both protrude laterally beyond the layer system, wherein the front coating is a laminate of an outer front protective layer and an inner front barrier layer, and the rear coating is a laminate of an inner rear protective layer, an outer rear protective layer and a conductive rear barrier layer arranged therebetween,wherein the outer front protective layer has at least one recess at an edge region and / or the outer rear protective layer has at least one recess at the edge region, wherein a sealing material covers the at least one recess and the edge of the front coating and the rear coating beyond the at least one recess. In particular according to one of the embodiments already described for the optoelectronic component.

[0053] In a preferred embodiment for the alternative optoelectronic component, the at least one recess of the outer front protective layer is formed up to the front barrier layer and / or the at least one recess of the outer rear protective layer is formed up to the rear barrier layer, and wherein the sealing material is in direct contact with the rear barrier layer and / or the front barrier layer.

[0054] In a preferred embodiment for the alternative optoelectronic component, the rear barrier layer of the rear coating additionally has at least one recess in the edge region, wherein the at least one recess in the edge region runs along the edge of the optoelectronic component adjacent to the recess of the outer rear protective layer and / or to the recess of the outer rear protective layer.

[0055] In a preferred embodiment for the alternative optoelectronic component, the sealing material for covering the at least one recess and the at least one edge of the optoelectronic component is designed as a strip. In a preferred embodiment, the sealing material is positively bonded to the front coating and the rear coating at the edge region.

[0056] In a preferred embodiment for the alternative optoelectronic component, the sealing material is designed as a tape, preferably the sealing material is selected from the group consisting of a butyl rubber, in particular isobutene-isoprene rubber, a nitrile rubber, an ethylene-butyl acrylate copolymer, an epoxy, in particular epoxy resin, an acrylate, in particular polymethyl methacrylate (PMMA), and ethylene-propylene-diene rubber (EPDM).

[0057] In a preferred embodiment for the alternative optoelectronic component, the tape has a layer of the sealing material and a barrier layer, wherein the barrier layer is preferably formed from a metal or an alloy thereof, preferably Al.

[0058] In a preferred embodiment, the optoelectronic component is a flexible optoelectronic component. In a preferred embodiment, the flexible optoelectronic component is a flexible photovoltaic element, in particular a flexible organic photovoltaic element. A flexible optoelectronic component is understood to mean, in particular, an optoelectronic component that is bendable and / or stretchable within a specific region.

[0059] In a preferred embodiment, the optoelectronic component is an LED, an OLED, a photovoltaic element, in particular a solar cell, an organic photovoltaic element, in particular an organic solar cell, or a photodetector, in particular an organic photodetector.

[0060] According to a further development of the invention, it is provided that the optoelectronic component is a photovoltaic element, in particular a solar cell, preferably the optoelectronic component is a flexible optoelectronic component, preferably a flexible photovoltaic element.

[0061] In a preferred embodiment, the photovoltaic element comprises a cell with at least one photoactive layer, in particular a CIS, CIGS, GaAs, or Si cell, a perovskite cell or an organic photovoltaic element (OPV), a so-called organic solar cell.

[0062] In a preferred embodiment, the modulus of elasticity of the flexible optoelectronic component is 80,000 psi to 360,000 psi, preferably 100,000 psi to 300,000 psi, preferably 120,000 psi to 260,000 psi, or preferably 100,000 psi to 200,000 psi. The invention is explained in more detail below with reference to the drawings. In the drawings:

[0063] Fig. 1 is a schematic representation of an embodiment of an optoelectronic component with a sealing material in an edge region between a front coating and a rear coating in cross section;

[0064] Fig. 2 is a schematic representation of an embodiment of an optoelectronic component with a sealing material in an edge region between a front coating and a rear coating in cross section;

[0065] Fig. 3 is a schematic representation of an embodiment of an optoelectronic component with a sealing material in an edge region between a front coating and a rear coating in cross section; and

[0066] Fig. 4 is a schematic representation of an embodiment of an optoelectronic component with a sealing material covering the edges of the front coating and the back coating in cross section.

[0067] Examples of implementation

[0068] Manufacturing of the optoelectronic component 100 :

[0069] The optoelectronic component 100 with the layer system 10 sealed between the front coating 20 and the back coating 30 can be manufactured in a batch process or in a roll-to-roll process.

[0070] The front coating 20, in particular the outer front protective layer 21 and the inner front barrier layer 23, and the back coating 30, in particular the inner back protective layer 31, the outer back protective layer 35, and the back barrier layer 33, can be laminated to one another in the form of a film, or alternatively can be applied by means of a printing process, preferably a screen printing process, a plotting process, an inkjet printing process or a 3D printing process, a slot die process, a comma process, an atomic layer deposition process (ALD), a plasma-enhanced atomic layer deposition process (PEALD) or a plasma-less atomic layer deposition process (PLALD), by means of a chemical vapor deposition process (CVD), or a vapor deposition process (PECVD).The individual layers can be cured by UV curing, dual curing, thermal curing, and / or by means of a reaction gas.

[0071] To produce the optoelectronic component 100 with the front coating 20 and the rear coating 30, in one exemplary embodiment the outer rear protective layer 35, consisting of a 200 μm thick PET carrier material and a plurality of SiOx layers, is first provided as a substrate to obtain the rear coating 30 and is then coated over its entire surface with a 50 μm thick layer of acrylate adhesive as the adhesive material using a slot die process. The rear barrier layer 33, consisting of 100 μm Al, is laminated thereon in the form of a film. This is again coated over its entire surface with a 50 μm thick layer of acrylate adhesive as the adhesive material using a slot die process, onto which a 100 μm PET film is applied as the inner rear protective layer 31. The laminate is then cured in a vacuum laminator at low pressure and at approximately 120°C.A recess 41 having a width of 10 mm is now created on the rear coating 30 by ablating material in the inner rear protective layer 31 along the edges of the rear coating 30 by means of a laser, alternatively by means of a milling machine, at the edge region 40, whereby the rear barrier layer 33 is exposed.

[0072] The front coating 20 is produced by applying a transparent 200 μm thick PET film as the outer front protective layer 21 and coating it over the entire surface with a 50 μm thick layer of acrylate adhesive as the adhesive material using a slot die process. A transparent barrier layer with a layer thickness of 70 μm and a water vapor transmission rate of less than 10~ is applied thereon. 2 g / m 2d laminated in the form of a film. The laminate is then cured in a vacuum laminator at low pressure and approx. 120 ° C. The sealing material 50 can be introduced in liquid form by means of a hot melt from the nozzle of a dispenser or as a tape from a roll into the recess 41 and onto the edge region 40 between the front coating 20 and the rear coating 30. The sealing material 50 completely fills the recess 41 and the edge region 40 between the front coating 20 and the rear coating 30, at least over a certain width. The sealing material 50 is then cured, in particular polymerized, by means of temperature, pressure and / or UV radiation. In this exemplary embodiment, a 10 mm wide tape made of isobutene-isoprene rubber is applied into the exposed recess 41 as the sealing material 50.

[0073] The inside of the front coating 20, i.e. the front barrier layer 23, and the inside of the rear coating 30, i.e. the inner rear protective layer 31, are each coated with acrylate adhesive as a bonding material for the bonding layer 52 and fed to a laminating unit, the inside of the front coating 20 and the inside of the rear coating 30 being oriented towards one another and the edges lying one above the other. A layer system 10 is cut off a roll, fed to the laminating unit, inserted between the front coating 20 and the rear coating 30, and pressed together. After pressing in the laminating unit, the bonding layer 52 is cured by exposure to heat under infrared lamps at 100°C for a duration of 180s. The optoelectronic component 100 is obtained in this way and can then be electrically contacted.

[0074] The embodiments relate in particular to an optoelectronic component 100 produced in a roll-to-roll process.

[0075] Fig. 1 shows a schematic representation of an embodiment of an optoelectronic component 100 with a sealing material 50 in an edge region 40 between a front coating 20 and a rear coating 30 in cross section. The optoelectronic component 100 has a front coating 20 and a rear coating 30 and a layer system 10 arranged between the front coating 20 and the rear coating 30 and having a front electrode 11, a rear electrode 12 and at least one photoactive layer 14, wherein the at least one photoactive layer 14 is arranged between the front electrode 11 and the rear electrode 12. The front coating 20 and the rear coating 30 enclose the layer system 10 such that both protrude laterally beyond the layer system 10.The front coating 20 is a laminate of an outer front protective layer 21 and an inner front barrier layer 23, and the back coating 30 is a laminate of an inner back protective layer 31, an outer back protective layer 35 and a conductive back barrier layer 33 arranged therebetween. The inner back protective layer 31 has at least one recess 41 at an edge region 40 of the optoelectronic component 100, wherein a sealing material 50 at least partially fills the at least one recess 41 and the edge region 40 in a width between the front coating 20 and the back coating 30. As a result, the layer system 10 between the front coating 20 and the back coating 30 is particularly well protected against external influences, in particular atmospheric oxygen and moisture.

[0076] In this embodiment, a connecting layer 52 is arranged between the layer system 10 and the front coating 20 and between the layer system 10 and the rear coating 30.

[0077] In this embodiment, the optoelectronic component 100 is a photovoltaic element. The photovoltaic element consists of a sequence of thin layers, the layer system 10, with at least one photoactive layer 14, which is preferably vapor-deposited in a vacuum or processed from a solution. The electrical connection can be achieved by metal layers, transparent conductive oxides, and / or transparent conductive polymers.

[0078] The layer system 10 of such an optoelectronic component 100 can be configured in different ways. In one exemplary embodiment, the layer system 10 has a front electrode 11, e.g., ITO, and a back electrode 12, e.g., aluminum, and at least one photoactive layer 14 arranged therebetween, comprising at least one absorber material. The layer system 10 can be present on a substrate, e.g., a polymer film.

[0079] In one embodiment of the invention, the at least one recess 41 runs on the edge region 40 along at least one edge of the optoelectronic component 100, preferably the at least one recess 41 runs circumferentially along the edges on the entire edge region 40.

[0080] In one embodiment of the invention, the at least one recess 41 is formed over the entire width of the edge region 40.

[0081] In one embodiment of the invention, the at least one recess 41 of the inner rear protective layer 31 is formed up to the rear barrier layer 33, and wherein the sealing material 50 is in direct contact with the rear barrier layer 33, preferably with the rear barrier layer 33 and the front barrier layer 23.

[0082] In one embodiment of the invention, the conductive rear barrier layer 33 is formed from a metal or an alloy thereof, preferably Al.

[0083] In one embodiment of the invention, the outer front protective layer 21, the inner rear protective layer 31 and / or the outer rear protective layer 35 are formed independently of one another from a polymer, wherein the polymer is preferably selected from the group consisting of polyolefins, polyesters, aromatic polyesters, polyamides, polyvinyl chlorides, fluoropolymers, polyimides, polyesteramides, or combinations thereof, in particular ethylene vinyl acetate (EVA), polyacrylate (PA), polycarbonate (PC), polyethylene (PE), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polymethyl methacrylate (PMMA), polypropylene (PP), polyvinyl chloride (PVC), and thermoplastic polyurethane (TPU).In one embodiment of the invention, a width of the at least one recess 41 at the edge region 40 of the inner rear protective layer 31 is 2 mm to 100 mm, preferably 2 mm to 50 mm, preferably 2 mm to 20 mm, preferably 5 mm to 100 mm, preferably 5 mm to 50 mm, preferably 5 mm to 20 mm, preferably 10 mm to 100 mm, preferably 10 mm to 50 mm, or preferably 20 mm to 50 mm.

[0084] In one embodiment of the invention, a layer thickness of the sealing material 50 at the edge region 40 between the front coating 20 and the rear coating 30 is 50 pm to 2000 pm, preferably 50 pm to 1000 pm, preferably 50 pm to 500 pm, preferably 50 pm to 200 pm, preferably 200 pm to 2000 pm, preferably 200 pm to 1000 pm, or preferably 200 pm to 500 pm.

[0085] In one embodiment of the invention, the sealing material 50 is selected from the group consisting of a butyl rubber, in particular isobutene-isoprene rubber, a nitrile rubber, an ethylene-butyl acrylate copolymer, an epoxy, in particular epoxy resin, an acrylate, in particular polymethyl methacrylate (PMMA), ethylene-propylene-diene rubber (EPDM), and a silicone sealant.

[0086] In a further embodiment of the invention, the front coating 20 and the rear barrier layer 30 are formed from different materials and / or a different number of layers.

[0087] In a further embodiment of the invention, the optoelectronic component 100 is a photovoltaic element, in particular a solar cell, preferably the optoelectronic component 100 is a flexible optoelectronic component 100, preferably a flexible photovoltaic element.

[0088] In a further embodiment of the invention, the recess 41 is formed all around the edge region 40 of the optoelectronic component 100.

[0089] Fig. 2 shows a schematic representation of an embodiment of an optoelectronic component 100 with a sealing material 50 in an edge region 40 between a front coating 20 and a rear coating 30 in cross section. Identical and functionally identical elements are provided with the same reference numerals, so that reference is made to the preceding description. In this embodiment, the optoelectronic component 100 is a photovoltaic element.

[0090] In one embodiment of the invention, the at least one recess 41 is formed partially over the width of the edge region 40, wherein the inner rear protective layer 31 at the edge region

[0091] 40 is interrupted by a plurality of recesses 41 running along at least one edge of the optoelectronic component 100.

[0092] In a further embodiment of the invention, a layer thickness of the front barrier layer 23 is 20 pm to 400 pm, preferably 50 pm to 200 pm, and / or a layer thickness of the rear barrier layer 33 is 20 pm to 400 pm, preferably 20 pm to 200 pm, or preferably 20 pm to 100 pm.

[0093] The optoelectronic component 100 is sealed at the edge region by means of the sealing material 50 between the front coating 20 and the rear coating 30.

[0094] Fig. 3 shows a schematic representation of an embodiment of an optoelectronic component 100 with a sealing material 50 in an edge region 40 between a front coating 20 and a rear coating 30 in cross section. Identical and functionally identical elements are provided with the same reference numerals, so that reference is made to the preceding description. In this embodiment, the optoelectronic component is a photovoltaic element.

[0095] In this exemplary embodiment, the rear barrier layer 33 of the rear coating 30 additionally has at least one recess 42 at the edge region 40, wherein the at least one recess 42 at the edge region 40 along the at least one edge of the optoelectronic component 100 adjacent to the recess

[0096] 41 of the inner rear protective layer 31. Fig. 4 shows a schematic representation of an embodiment of an optoelectronic component 100 with a sealing material 50 covering the edges of the front coating 20 and the rear coating 30, in cross section. Identical and functionally identical elements are provided with the same reference numerals, so that reference is made to the preceding description. In this embodiment, the optoelectronic component 100 is a photovoltaic element.

[0097] The optoelectronic component 100 has a front coating 20 and a back coating 30 and a layer system 10 arranged between the front coating 20 and the back coating 30 and having a front electrode 11, a back electrode 12 and at least one photoactive layer 14, wherein the at least one photoactive layer 14 is arranged between the front electrode 11 and the back electrode 12. The front coating 20 and the back coating 30 enclose the layer system 10 such that both protrude laterally beyond the layer system 10. The front coating 20 is a laminate of an outer front protective layer 21 and an inner front barrier layer 23, and the back coating 30 is a laminate of an inner back protective layer 31, an outer back protective layer 35 and a conductive back barrier layer 33 arranged therebetween.The outer front protective layer 21 has at least one recess 43 (not shown) at an edge region 40 and / or the outer rear protective layer 35 has at least one recess 44 at the edge region 40, wherein a sealing material 50 covers the at least one recess 43, 44 and the edge of the front coating 20 and the rear coating 30 beyond the at least one recess 43, 44.

[0098] In one embodiment, the at least one recess 43 of the outer front protective layer 21 is formed up to the front barrier layer 23 and / or the at least one recess 44 of the outer rear protective layer 35 up to the rear barrier layer 33, wherein the sealing material 50 is in direct contact with the rear barrier layer 33 and / or the front barrier layer 23. In a further embodiment, the rear barrier layer 33 of the rear coating 30 additionally has at least one recess 42 in the edge region 40, wherein the at least one recess 42 runs in the edge region 40 along the edge of the optoelectronic component 100 adjacent to the recess 44 of the outer rear protective layer 35 and / or to the recess 41 of the outer front protective layer 21.

[0099] In a further embodiment, the sealing material 50 is designed as a band 60, preferably the sealing material 50 is selected from the group consisting of a butyl rubber, in particular isobutene-isoprene rubber, a nitrile rubber, an ethylene-butyl acrylate copolymer, an epoxy, in particular epoxy resin, an acrylate, in particular polymethyl methacrylate (PMMA), ethylene-propylene-diene rubber (EPDM), and a silicone sealant.

[0100] In a further embodiment, the band 60 has a layer of the sealing material 50 and a barrier layer 62, wherein the barrier layer 62 is preferably formed from a metal or an alloy thereof, preferably Al.

Claims

Patent claims 1. Optoelectronic component (100) with a front coating (20) and a rear coating (30) and a layer system (10) arranged between the front coating (20) and the rear coating (30) with a front electrode (11), a rear electrode (12) and at least one photoactive layer (14), wherein the at least one photoactive layer (14) is arranged between the front electrode (11) and the rear electrode (12), and the front coating (20) and the rear coating (30) enclose the layer system (10) in such a way that both protrude laterally beyond the layer system (10), wherein the front coating (20) is a laminate of an outer front protective layer (21) and an inner front barrier layer (23), and the rear coating (30) is a laminate of an inner rear protective layer (31), an outer rear protective layer (35) and a conductive rear layer arranged therebetween. Barrier layer (33) is,wherein the inner rear protective layer (31) has at least one recess (41) at an edge region (40) of the optoelectronic component (100), wherein a sealing material (50) at least partially fills the at least one recess (41) and the edge region (40) in a width between the front coating (20) and the rear coating (30).

2. Optoelectronic component (100) according to claim 1, wherein the at least one recess (41) runs at the edge region (40) along at least one edge of the optoelectronic component (100), preferably the at least one recess (41) runs circumferentially along the edges at the entire edge region (40).

3. Optoelectronic component (100) according to claim 1 or 2, wherein the at least one recess (41) extends over the entire width of the edge region (40), or the at least one recess (41) is formed partially over the width of the edge region (40), wherein the inner rear protective layer (31) is Edge region (40) is interrupted by a plurality of recesses (41) running along at least one edge of the optoelectronic component (100).

4. Optoelectronic component (100) according to one of the preceding claims, wherein the at least one recess (41) of the inner rear protective layer (31) is formed up to the rear barrier layer (33), and wherein the sealing material (50) is in direct contact with the rear barrier layer (33), preferably with the rear barrier layer (33) and the front barrier layer (23).

5. Optoelectronic component (100) according to one of the preceding claims, wherein the rear barrier layer (33) of the rear coating (30) additionally has at least one recess (42) at the edge region (40), wherein the at least one recess (42) at the edge region (40) runs along the at least one edge of the optoelectronic component (100) adjacent to the recess (41) of the inner rear protective layer (31).

6. Optoelectronic component (100) according to one of the preceding claims, wherein the conductive rear barrier layer (33) is formed from a metal or an alloy thereof, preferably Al.

7. Optoelectronic component (100) according to one of the preceding claims, wherein the outer front protective layer (21), the inner rear protective layer (31) and / or the outer rear protective layer (35) are formed independently of one another from a polymer, wherein the polymer is preferably selected from the group consisting of polyolefins, polyesters, aromatic polyesters, polyamides, polyvinyl chlorides, fluoropolymers, polyimides, polyesteramides, or combinations thereof, in particular ethylene vinyl acetate (EVA), polyacrylate (PA), polycarbonate (PC), polyethylene (PE), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polymethyl methacrylate (PMMA), polypropylene (PP), polyvinyl chloride (PVC), and thermoplastic polyurethane (TPU).

8. Optoelectronic component (100) according to one of the preceding claims, wherein a width of the at least one recess (41) at the edge region (40) of the inner rear protective layer (31) is 2 mm to 100 mm, preferably 2 mm to 50 mm, preferably 2 mm to 20 mm, preferably 5 mm to 100 mm, preferably 5 mm to 50 mm, preferably 5 mm to 20 mm, preferably 10 mm to 100 mm, preferably 10 mm to 50 mm, or preferably 20 mm to 50 mm, and / or a layer thickness of the sealing material (50) at the edge region (40) between the front coating (20) and the rear coating (30) is 50 μm to 2000 μm, preferably 50 μm to 1000 μm, preferably 50 μm to 500 μm, preferably 50 μm to 200 μm, preferably 200 pm to 2000 pm, preferably 200 pm to 1000 pm, or preferably 200 pm to 500 pm.

9. Optoelectronic component (100) according to one of the preceding claims, wherein the sealing material (50) is selected from the group consisting of a butyl rubber, in particular isobutene-isoprene rubber, a nitrile rubber, an ethylene-butyl acrylate copolymer, an epoxy, in particular epoxy resin, an acrylate, in particular polymethyl methacrylate (PMMA), and ethylene-propylene-diene rubber (EPDM).

10. Optoelectronic component (100) according to one of the preceding claims, wherein the optoelectronic component (100) is a photovoltaic element, in particular a solar cell, preferably the optoelectronic component (100) is a flexible optoelectronic component (100), preferably a flexible photovoltaic element.

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