Conductive silver paste and preparation method therefor

Abstract

Disclosed in the present invention are a low-temperature curing conductive silver paste and a preparation method therefor. The conductive silver paste comprises silver powder, resin, a solvent, a curing agent, a thixotropic agent and an inorganic ion diffusion inhibitor in a mass ratio of (93-98): (1.0-3.0): (0.1-1.0): (0.1-1.0): (0.01-0.05): (0.01-0.2), wherein the inorganic ion diffusion inhibitor is an inorganic salt, and anions in the inorganic ion diffusion inhibitor are selected from one or more of carbonate, sulfate, chromate, sulfide ions, chloride ions, bromide ions and iodide ions. The conductive silver paste of the present invention can inhibit silver migration phenomena, enhance the reliability of modules, and realize the optimal conductivity and migration resistance.

Description

Conductive silver paste and preparation method thereof Technical Field

[0001] The invention belongs to the field of photovoltaic cells, and particularly relates to a conductive silver paste and a preparation method thereof. Background Art

[0002] Photovoltaic silver paste is widely used in the screen printing process of photovoltaic cells. The resulting grid lines are crucial for cell electron collection, subsequent ribbon connection, and module reliability. However, in the presence of an electric field and moisture, silver is susceptible to electromigration (ECM). On the one hand, the continued generation of hydroxides increases grid line resistance or contact resistance, leading to power loss. On the other hand, electromigration can also damage the cell grid lines or form bypasses between electrically disconnected conductors, causing insulation degradation and even short circuits, ultimately leading to module failure and even fire.

[0003] Currently, methods for addressing silver ECM include adding fluorine-containing materials, adding copper-tin-manganese mixed powders, alloy powders, or compound powders, and adding corrosion inhibitors commonly used for metal anti-oxidation. Fluorine-containing materials have excellent weather resistance, but are water- and oil-repellent, making them less suitable for bonding with solar encapsulation film EVA. Copper-tin-manganese mixed powders, alloy powders, or compound powders may interact with each other, such as forming intermetallic compounds, leading to unstable performance. Corrosion inhibitors typically contain organic groups with strong coordination capabilities. Organic groups with strong coordination capabilities can form a dense protective film on the Ag surface, thereby preventing the diffusion and transmission of silver ions generated by Ag oxidation into the electrolyte. However, corrosion inhibitors have poor weather resistance, and the organic groups are prone to decomposition and failure during sintering, curing, and exposure to light, making it difficult to meet the long-term service reliability requirements of photovoltaic modules.

[0004] Therefore, there is an urgent need to develop a conductive silver paste with stability, long-term reliability, excellent conductivity and resistance to silver migration.

[0005] Summary of the Invention

[0006] To solve the problems existing in the prior art, the present invention optimizes the formula of photovoltaic silver paste and uses inorganic additives as silver ion diffusion inhibitors. In an electric field and humid environment, the dissolved silver ions are caused to generate insoluble precipitates, which serve as physical barriers to prevent the diffusion and transmission of silver ions, inhibit silver electromigration, and increase the long-term reliability of the components. Moreover, by precisely controlling the amount of inorganic ion diffusion inhibitor added, optimal conductivity and anti-migration performance can be achieved.

[0007] Specifically, the present invention provides a conductive silver paste, which comprises silver powder, resin, solvent, curing agent, thixotropic agent and inorganic ion diffusion inhibitor in a mass ratio of (93-98): (1.0-3.0): (0.1-1.0): (0.1-1.0): (0.01-0.05): (0.01-0.2); wherein the inorganic ion diffusion inhibitor is an inorganic salt, and the anion in the inorganic ion diffusion inhibitor is selected from one or more of carbonate, sulfate, chromate, sulfide, chloride, bromide and iodide.

[0008] In one or more embodiments, the resin is selected from thermosetting resins; preferably, the thermosetting resin is selected from one or more of epoxy resins, polyamide resins, polyurethane resins, polyacrylic resins, silicone resins, polycarbonates, phenolic resins, amino resins and polyester resins.

[0009] In one or more embodiments, the epoxy resin is selected from one or more of bisphenol A epoxy resin, polypropylene glycol glycidyl ether, n-butyl glycidyl ether, glycidyl methacrylate, acrylic modified epoxy resin, hydrogenated epoxy resin, alicyclic epoxy resin, polyurethane modified epoxy resin and silicone modified epoxy resin.

[0010] In one or more embodiments, the solvent is selected from one or more of an alcohol compound, an ether compound, an ester compound, triethanolamine and turpentine; preferably, the alcohol compound is selected from one or more of ethylene glycol, diethylene glycol, isopropyl alcohol, butyl carbitol and terpineol; preferably, the ether compound is selected from one or more of ethylene glycol butyl ether, propylene glycol methyl ether and diethylene glycol butyl ether; preferably, the ester compound is selected from one or more of butyl carbitol acetate, dimethyl glutarate, dibutyl phthalate and ethylene glycol acetic acid acetate.

[0011] In one or more embodiments, the curing agent is selected from one or more of blocked isocyanates, methyl ethyl ketone peroxide, boron trifluoride-monoethylamine complex, dimethyl silicone oil, polyetheramine compounds, dicyandiamide, diethylenetriamine, aliphatic amine compounds, amine-blocked hexafluoroantimonate and acid anhydride compounds; preferably, the acid anhydride compound is selected from one or more of phthalic anhydride, trimellitic anhydride, pyromellitic dianhydride and maleic anhydride.

[0012] In one or more embodiments, the thixotropic agent is selected from one or more of fumed silica, graphene, and modified urea solution.

[0013] In one or more embodiments, the cations in the inorganic ion diffusion inhibitor are selected from one or more of ammonium ions, potassium ions, sodium ions, lanthanum ions, cerium ions, and neodymium ions.

[0014] The present invention provides a method for preparing the conductive silver paste of the present invention, the method comprising the following steps:

[0015] (1) uniformly mixing the resin, the solvent, the curing agent, and the thixotropic agent to obtain an organic vehicle;

[0016] (2) uniformly mixing the silver powder and the organic carrier to obtain a mixture;

[0017] (3) adding the inorganic ion diffusion inhibitor to the mixture obtained in step (2), mixing uniformly, and rolling with three rollers to obtain a conductive silver paste.

[0018] The present invention provides a conductive film or a gate line prepared by using the conductive silver paste of the present invention.

[0019] The present invention provides a solar cell comprising the conductive film or grid line of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] FIG1 is a schematic diagram showing the mechanism by which the conductive silver paste of the present invention inhibits silver ECM.

[0021] FIG2 is a schematic diagram of a silver electromigration resistance test according to some embodiments of the present invention. DETAILED DESCRIPTION

[0022] To facilitate understanding of the features and effects of the present invention by those skilled in the art, the following provides a general description and definition of the terms and expressions used herein. Unless otherwise indicated, all technical and scientific terms used herein have the ordinary meanings as understood by those skilled in the art regarding the present invention. In the event of conflict, the definitions in this specification shall prevail.

[0023] The theories or mechanisms described and disclosed herein, whether correct or incorrect, should not limit the scope of the present invention in any way, that is, the present invention can be implemented without being limited by any specific theory or mechanism.

[0024] Herein, “comprising,” “including,” “containing” and similar terms encompass the meanings of “consisting essentially of” and “consisting of,” for example, when “A comprises B and C” is disclosed herein, “A consists essentially of B and C” and “A consists of B and C” should be deemed to have been disclosed herein.

[0025] Throughout this document, all features, such as values, amounts, amounts, and concentrations, specified in numerical ranges or percentage ranges are provided for simplicity and convenience only. Accordingly, the description of numerical ranges or percentage ranges should be considered to encompass and specifically disclose all possible subranges and individual values ​​within those ranges (including integers and fractions).

[0026] In this document, unless otherwise specified, percentage refers to mass percentage and ratio refers to mass ratio.

[0027] Herein, when describing embodiments or examples, it should be understood that they are not intended to limit the present invention to these embodiments or examples. On the contrary, all substitutes, modifications and equivalents of the methods and materials described herein are within the scope defined by the present invention.

[0028] In this document, for the sake of brevity, not all possible combinations of the various technical features in each embodiment or example are described. Therefore, as long as there are no contradictions in the combination of these technical features, the various technical features in each embodiment or example can be combined in any way, and all possible combinations should be considered to be within the scope of this specification.

[0029] During the long-term use of photovoltaic modules, water vapor intrudes into the grid lines of the cells, forming an electrolyte containing ion diffusion inhibitors. In the presence of electrolyte and electric field, adjacent silver particles act as cathode and anode, respectively, and electrochemical reactions occur. As shown in Figure 1, during the long-term use of photovoltaic modules, water vapor intrudes into the grid lines of the cells, forming an electrolyte containing ion diffusion inhibitors. In the presence of electrolyte and electric field, adjacent silver particles act as cathode and anode, respectively, and electrochemical reactions occur. The anode silver undergoes oxidation reaction, dissolving Ag into the electrolyte. + And diffuse to the cathode, and SO4 in the electrolyte 2- 、CO3 2- 、Cr2O4 2- , I - 、S 2- 、Cl - Br - The formation of insoluble precipitates with large solubility product constants prevents Ag from + The insoluble precipitate can exist stably in the electrolyte for a long time, slowing down and eventually stopping the silver ECM.

[0030] The present invention provides a conductive silver paste, which comprises silver powder, resin, solvent, curing agent, thixotropic agent and inorganic ion diffusion inhibitor in a mass ratio of (93-98): (1.0-3.0): (0.1-1.0): (0.1-1.0): (0.01-0.05): (0.01-0.2); wherein the inorganic ion diffusion inhibitor is an inorganic salt, and the anions in the inorganic ion diffusion inhibitor can be selected from one or more of carbonate, sulfate, chromate, sulfide, chloride, bromide and iodide.

[0031] In the present invention, the resin may be selected from thermosetting resins, which may be selected from one or more of epoxy resins, polyamide resins, polyurethane resins, polyacrylic resins, silicone resins, polycarbonates, phenolic resins, amino resins, and polyester resins.

[0032] In the present invention, the epoxy resin can be selected from one or more of bisphenol A epoxy resin, polypropylene glycol glycidyl ether, n-butyl glycidyl ether, glycidyl methacrylate, acrylic modified epoxy resin, hydrogenated epoxy resin, alicyclic epoxy resin, polyurethane modified epoxy resin and silicone modified epoxy resin.

[0033] In the present invention, the solvent may be selected from one or more of an alcohol compound, an ether compound, an ester compound, triethanolamine, and turpentine. The alcohol compound may be selected from one or more of ethylene glycol, diethylene glycol, isopropyl alcohol, butyl carbitol, and terpineol. The ether compound may be selected from one or more of ethylene glycol butyl ether, propylene glycol methyl ether, and diethylene glycol butyl ether. The ester compound may be selected from one or more of butyl carbitol acetate, dimethyl glutarate, dibutyl phthalate, and ethylene glycol acetic acid acetate.

[0034] In the present invention, the curing agent can be selected from one or more of blocked isocyanates, methyl ethyl ketone peroxide, boron trifluoride-monoethylamine complex, dimethyl silicone oil, polyetheramine compounds, dicyandiamide, diethylenetriamine, aliphatic amine compounds, amine-blocked hexafluoroantimonate, and acid anhydride compounds. The acid anhydride compound can be selected from one or more of phthalic anhydride, trimellitic anhydride, pyromellitic dianhydride, and maleic anhydride.

[0035] In the present invention, the thixotropic agent can be selected from one or more of fumed silica, graphene and modified urea solution.

[0036] In the present invention, the cation in the inorganic ion diffusion inhibitor can be selected from one or more of ammonium ion, potassium ion, sodium ion, lanthanum ion, cerium ion and neodymium ion.

[0037] The present invention provides a method for preparing the conductive silver paste of the present invention, the method comprising the following steps:

[0038] (1) uniformly mixing a resin, a solvent, a curing agent, and a thixotropic agent to obtain an organic carrier;

[0039] (2) mixing the silver powder and the organic carrier, stirring uniformly to obtain a mixture;

[0040] (3) adding an inorganic ion diffusion inhibitor to the mixture obtained in step (2), mixing the mixture uniformly, and rolling the mixture with three rollers to obtain a conductive silver paste.

[0041] The present invention also provides a conductive film and a gate line prepared from the conductive silver paste of the present invention.

[0042] The present invention also provides a solar cell comprising the conductive film or grid line of the present invention.

[0043] Compared with the prior art, the present invention has the following beneficial effects:

[0044] (1) By precisely controlling the amount of inorganic ion diffusion inhibitor added, the conductivity and anti-silver migration performance of the conductive silver paste are balanced;

[0045] (2) The insoluble precipitate formed by the inorganic ion diffusion inhibitor can play a long-term role in resisting silver ion migration and improving the long-term reliability of photovoltaic modules;

[0046] (3) The added inorganic ion diffusion inhibitor will not affect the selection of component packaging materials, nor will it cause complex reactions that affect the stability of the gate line.

[0047] The present invention will be described below by way of specific examples. It should be understood that these examples are merely illustrative and are not intended to limit the scope of the present invention. The methods, reagents, and materials used in the examples are, unless otherwise stated, conventional methods, reagents, and materials in the art. The starting compounds in the examples can all be purchased from commercial sources.

[0048] The silver powder in the examples and comparative examples was purchased from Boqian New Materials, with the brand name Ag-S2000. The average particle size of the silver powder was 1.80-2.20 μm, and the specific surface area was 0.25-0.32 m 2 / g, tap density ≥5.0g / cm 3 .

[0049] The resins in the examples and comparative examples are: bisphenol A epoxy resin, purchased from Dow Chemical, with the brand name DER*331; and phenolic resin, purchased from Shengquan Group, with the brand name SQCN700-1.

[0050] The solvents in the examples and comparative examples are: triethanolamine (AR), purchased from Xilong Science and Technology Chemical Industry; butyl carbitol (≥99.0%), purchased from Merck Chemicals.

[0051] The curing agents in the examples and comparative examples are: dimethyl silicone oil, purchased from Dow Corning, brand PMX200-500CS; phthalic anhydride (≥99%), purchased from Merck Chemicals.

[0052] The thixotropic agents in the examples and comparative examples are: modified urea solution, purchased from BYK, brand BYK410; fumed silica, purchased from Huifu Nano, brand HL-200.

[0053] Example 1

[0054] In this embodiment, a conductive silver paste is prepared. The conductive silver paste includes silver powder, resin, solvent, curing agent, thixotropic agent, and inorganic ion diffusion inhibitor in a mass ratio of 97.0:2.0:0.4:0.3:0.03:0.01; wherein the resin, solvent, curing agent, and thixotropic agent are bisphenol A epoxy resin, triethanolamine, dimethyl silicone oil, and modified urea solution, respectively, and the inorganic ion diffusion inhibitor is a mixed salt composed of ammonium carbonate and sodium sulfate in a mass ratio of 1:1.

[0055] The preparation method of conductive silver paste is as follows:

[0056] (1) uniformly mixing a resin, a solvent, a curing agent, and a thixotropic agent to obtain an organic carrier;

[0057] (2) mixing the silver powder and the organic carrier, stirring uniformly to obtain a mixture;

[0058] (3) adding an inorganic ion diffusion inhibitor to the mixture, stirring the mixture uniformly, and rolling the mixture with three rollers to obtain a conductive silver paste.

[0059] Example 2

[0060] In this embodiment, a conductive silver paste is prepared. The conductive silver paste includes silver powder, resin, solvent, curing agent, thixotropic agent, and inorganic ion diffusion inhibitor in a mass ratio of 97.0:2.0:0.4:0.3:0.03:0.05; wherein the resin, solvent, curing agent, and thixotropic agent are bisphenol A epoxy resin, triethanolamine, dimethyl silicone oil, and modified urea solution, respectively, and the inorganic ion diffusion inhibitor is a mixed salt composed of sodium sulfate and ammonium chloride in a mass ratio of 1:1.

[0061] The preparation method of conductive silver paste is as follows:

[0062] (1) uniformly mixing a resin, a solvent, a curing agent, and a thixotropic agent to obtain an organic carrier;

[0063] (2) mixing the silver powder and the organic carrier, stirring uniformly to obtain a mixture;

[0064] (3) adding an inorganic ion diffusion inhibitor to the mixture, stirring the mixture uniformly, and rolling the mixture with three rollers to obtain a conductive silver paste.

[0065] Example 3

[0066] In this embodiment, a conductive silver paste is prepared. The conductive silver paste includes silver powder, resin, solvent, curing agent, thixotropic agent, and inorganic ion diffusion inhibitor in a mass ratio of 97.0:2.0:0.4:0.3:0.03:0.05; wherein the resin, solvent, curing agent, and thixotropic agent are bisphenol A epoxy resin, triethanolamine, dimethyl silicone oil, and modified urea solution, respectively, and the inorganic ion diffusion inhibitor is a mixed salt composed of sodium iodide and sodium bromide in a mass ratio of 1:1.

[0067] The preparation method of conductive silver paste is as follows:

[0068] (1) uniformly mixing a resin, a solvent, a curing agent, and a thixotropic agent to obtain an organic carrier;

[0069] (2) mixing the silver powder and the organic carrier, stirring uniformly to obtain a mixture;

[0070] (3) adding an inorganic ion diffusion inhibitor to the mixture, stirring the mixture uniformly, and rolling the mixture with three rollers to obtain a conductive silver paste.

[0071] Example 4

[0072] In this embodiment, a conductive silver paste is prepared. The conductive silver paste includes silver powder, resin, solvent, curing agent, thixotropic agent, and inorganic ion diffusion inhibitor in a mass ratio of 97.0:2.0:0.4:0.3:0.03:0.1; wherein the resin, solvent, curing agent, and thixotropic agent are bisphenol A epoxy resin, triethanolamine, dimethyl silicone oil, and modified urea solution, respectively, and the inorganic ion diffusion inhibitor is a mixed salt composed of ammonium carbonate, sodium sulfate, and potassium chromate in a mass ratio of 1:1:1.

[0073] The preparation method of conductive silver paste is as follows:

[0074] (1) uniformly mixing a resin, a solvent, a curing agent, and a thixotropic agent to obtain an organic carrier;

[0075] (2) mixing the silver powder and the organic carrier, stirring uniformly to obtain a mixture;

[0076] (3) adding an inorganic ion diffusion inhibitor to the mixture, stirring the mixture uniformly, and rolling the mixture with three rollers to obtain a conductive silver paste.

[0077] Example 5

[0078] In this embodiment, a conductive silver paste is prepared. The conductive silver paste includes silver powder, resin, solvent, curing agent, thixotropic agent, and inorganic ion diffusion inhibitor in a mass ratio of 97.0:2.0:0.4:0.3:0.03:0.05; wherein the resin, solvent, curing agent, and thixotropic agent are bisphenol A epoxy resin, triethanolamine, dimethyl silicone oil, and modified urea solution, respectively, and the inorganic ion diffusion inhibitor is ammonium chloride.

[0079] The preparation method of conductive silver paste is as follows:

[0080] (1) uniformly mixing a resin, a solvent, a curing agent, and a thixotropic agent to obtain an organic carrier;

[0081] (2) mixing the silver powder and the organic carrier, stirring uniformly to obtain a mixture;

[0082] (3) adding an inorganic ion diffusion inhibitor to the mixture, stirring the mixture uniformly, and rolling the mixture with three rollers to obtain a conductive silver paste.

[0083] Example 6

[0084] In this embodiment, a conductive silver paste is prepared. The conductive silver paste includes silver powder, resin, solvent, curing agent, thixotropic agent, and inorganic ion diffusion inhibitor in a mass ratio of 97.0:2.0:0.4:0.3:0.03:0.1; wherein the resin, solvent, curing agent, and thixotropic agent are phenolic resin, butyl carbitol, phthalic anhydride, and fumed silica, respectively, and the inorganic ion diffusion inhibitor is a mixed salt composed of lanthanum sulfide, cerium sulfide, and neodymium sulfide in a mass ratio of 1:1:1.

[0085] The preparation method of conductive silver paste is as follows:

[0086] (1) uniformly mixing a resin, a solvent, a curing agent, and a thixotropic agent to obtain an organic carrier;

[0087] (2) mixing the silver powder and the organic carrier, stirring uniformly to obtain a mixture;

[0088] (3) adding an inorganic ion diffusion inhibitor to the mixture, stirring the mixture uniformly, and rolling the mixture with three rollers to obtain a conductive silver paste.

[0089] Comparative Example 1

[0090] In this comparative example, a conductive silver paste was prepared, comprising silver powder, resin, solvent, curing agent, and thixotropic agent in a mass ratio of 97.0:2.0:0.4:0.3:0.03. The resin, solvent, curing agent, and thixotropic agent were bisphenol A epoxy resin, triethanolamine, dimethyl silicone oil, and modified urea solution, respectively.

[0091] The preparation method of conductive silver paste is as follows:

[0092] (1) uniformly mixing a resin, a solvent, a curing agent, and a thixotropic agent to obtain an organic carrier;

[0093] (2) The silver powder and the organic carrier are mixed, stirred evenly, and rolled by three rollers to obtain a conductive silver paste.

[0094] Comparative Example 2

[0095] In this comparative example, a conductive silver paste was prepared, comprising silver powder, resin, solvent, curing agent, and thixotropic agent in a mass ratio of 97.0:2.0:0.4:0.3:0.03, wherein the resin, solvent, curing agent, and thixotropic agent were phenolic resin, butyl carbitol, phthalic anhydride, and fumed silica, respectively.

[0096] The preparation method of conductive silver paste is as follows:

[0097] (1) uniformly mixing a resin, a solvent, a curing agent, and a thixotropic agent to obtain an organic carrier;

[0098] (2) The silver powder and the organic carrier are mixed, stirred evenly, and rolled by three rollers to obtain a conductive silver paste.

[0099] Test Case

[0100] (1) Silver paste stability test

[0101] Tested in accordance with the provisions of GB / T17473.5, set the test temperature to (25±0.5)°C, adjusted the speed to 10r / min, and read the initial viscosity V0 after 30s. Measure each sample 3 times and take the average value. After the slurry has been stored for 3 months, the viscosity V is measured under the same conditions. The slurry viscosity change rate RoC = (V-V0) / V0×100% is examined. The smaller the RoC, the better the long-term storage stability of the slurry. The silver paste stability test results of Examples 1 to 6 and Comparative Examples 1 to 2 are shown in Table 1.

[0102] (2) Gate line resistance test

[0103] The slurry was printed on the cell with a gate line width of 40 μm and cured at 190°C for 30 min. A ruler was used to measure the length L of the gate line at the beginning and end, and a multimeter with an accuracy of 0.1 mΩ was used to measure the resistance R of the gate line at the beginning and end. L =R / L, measure 3 grid lines for each sample and take the average value. L The smaller the gate line is, the better the conductivity is. The test results of the gate line resistance of Examples 1 to 6 and Comparative Examples 1 to 2 are shown in Table 1.

[0104] (3) Anti-silver electromigration test

[0105] As shown in Figure 2, the slurry is printed on the battery cell to obtain a slurry sheet. The size of the slurry sheet is 10mm×10mm×10μm, the spacing between the slurry sheets is 2mm, and the curing conditions are 190°C for 30min. After curing, a pair of slurry sheets are cut as a whole, 200μL of deionized water is added between the slurry sheets, and the VI curve under a 2V bias is measured using a constant potentiostat. The time t until the current value reaches 0.1mA is examined, and each sample is measured 3 times and the average value is taken. The larger t is, the better the migration resistance. The test results of the anti-silver electromigration properties of Examples 1 to 6 and Comparative Examples 1 to 2 are shown in Table 1.

[0106] Table 1: Test results of silver paste stability, gate line resistance and silver electromigration resistance of Examples 1 to 6 and Comparative Examples 1 to 2

Claims

1. A conductive silver paste, characterized in that, The conductive silver paste contains silver powder, resin, solvent, curing agent, thixotropic agent, and inorganic ion diffusion inhibitor in a mass ratio of (93-98):(1.0-3.0):(0.1-1.0):(0.1-1.0):(0.01-0.05):(0.01-0.2); wherein, the inorganic ion diffusion inhibitor is an inorganic salt, and the anions in the inorganic ion diffusion inhibitor are selected from one or more of carbonate, sulfate, chromate, sulfide, chloride, bromide, and iodide.

2. The conductive silver paste according to claim 1, wherein The resin is selected from thermosetting resins, and the thermosetting resins are selected from one or more of epoxy resins, polyamide resins, polyurethane resins, polyacrylic resins, silicone resins, polycarbonates, phenolic resins, amino resins, and polyester resins.

3. The conductive silver paste according to claim 2, characterized in that, The epoxy resins are selected from one or more of bisphenol A epoxy resins, polypropylene glycol glycidyl ether, n-butyl glycidyl ether, glycidyl methacrylate, acrylic acid modified epoxy resins, hydrogenated epoxy resins, alicyclic epoxy resins, polyurethane modified epoxy resins, and silicone modified epoxy resins.

4. The conductive silver paste according to claim 1, wherein The solvent is selected from one or more of alcohol compounds, ether compounds, ester compounds, triethanolamine, and turpentine; the alcohol compounds are selected from one or more of ethylene glycol, diethylene glycol, isopropyl alcohol, butyl carbitol, and terpineol; the ether compounds are selected from one or more of ethylene glycol monobutyl ether, propylene glycol monomethyl ether, and diethylene glycol monobutyl ether; the ester compounds are selected from one or more of butyl carbitol acetate, dimethyl glutarate, dibutyl phthalate, and ethylene glycol monoacetate acetate.

5. The conductive silver paste according to claim 1, wherein The curing agent is selected from one or more of blocked isocyanates, methyl ethyl ketone peroxide, boron trifluoride-monoethylamine complex, dimethyl silicone oil, polyetheramine compounds, dicyandiamide, diethylenetriamine, aliphatic amine compounds, amine-blocked hexafluoroantimonate, and acid anhydride compounds; the acid anhydride compounds are selected from one or more of phthalic anhydride, trimellitic anhydride, pyromellitic dianhydride, and maleic anhydride.

6. The electrically conductive silver paste according to claim 1, wherein, The thixotropic agent is selected from one or more of fumed silica, graphene, and modified urea solution.

7. The conductive silver paste according to claim 1, wherein The cations in the inorganic ion diffusion inhibitor are selected from one or more of ammonium ions, potassium ions, sodium ions, lanthanum ions, cerium ions, and neodymium ions.

8. A method for preparing the conductive silver paste according to any one of claims 1-7, characterized in that, The method includes the following steps: (1) Mix the resin, the solvent, the curing agent, and the thixotropic agent evenly to obtain an organic carrier. (2) Mix the silver powder and the organic carrier evenly to obtain a mixture. (3) Add the inorganic ion diffusion inhibitor to the mixture prepared in step (2), mix evenly, and obtain the conductive silver paste through three-roll rolling.

9. A conductive film or grid line prepared by using the conductive silver paste according to any one of claims 1-7.

10. A solar cell, characterized in that, The solar cell contains the conductive film or grid line according to claim 9.

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