Electrical connection member and electronic device comprising same

Abstract

This electronic device may comprise: a printed circuit board; an electrical connection member in contact with a conductive area of the printed circuit board; and a counterpart electrically connected to the conductive area through the electrical connection member. The electrical connection member disposed between the printed circuit board and the counterpart may comprise: an insulating member; a conductive pad which is disposed on a second surface of the insulating member and is in contact with the conductive area; a first conductive part which is electrically connected to the counterpart and extends from a first surface opposite to the second surface of the insulating member; and a second conductive part which extends from the first conductive part to the second surface, and is electrically connected to the conductive pad. The first conductive part may include a first plurality of conductive particles coated with a first conductive metal, and the second conductive part may include a second plurality of conductive particles coated with a second conductive metal different from the first conductive metal.

Description

Electrical connection member and electronic device including same

[0001] The present disclosure relates to an electrical connecting member and an electronic device including the same.

[0002] Electronic devices may include connecting elements for electrical connection between various components of the electronic device. Such connecting elements may include, for example, a surface mount technology gasket (SMT gasket) for ground contact on a printed circuit board.

[0003] The above information may be provided as background art to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art in connection with the present disclosure.

[0004] In one embodiment, an electronic device may include a printed circuit board including a conductive region, an electrical connection member disposed on the printed circuit board and in contact with the conductive region, and a counterpart electrically connected to the conductive region of the printed circuit board through the electrical connection member. The electrical connection member disposed between the printed circuit board and the counterpart may include an insulating member including a first surface facing the counterpart and a second surface opposite to the first surface and facing the printed circuit board, a conductive pad disposed on the second surface of the insulating member and in contact with the conductive region of the printed circuit board, a first conductive portion electrically connected to the counterpart and extending from the first surface of the insulating member toward the conductive pad, and a second conductive portion extending from the first conductive portion to the second surface of the insulating member and electrically connected to the conductive pad. The first conductive portion may include a first plurality of conductive particles coated with a first conductive metal. The second conductive portion may include a second plurality of conductive particles coated with a second conductive metal. The second conductive metal may be different from the first conductive metal and may have higher electrical conductivity than the first conductive metal.

[0005] In one embodiment, an electronic device may include a printed circuit board including one surface having a conductive region, an electrical connection member disposed on the one surface of the printed circuit board so as to contact the conductive region, and a counterpart electrically connected to the conductive region of the printed circuit board through the electrical connection member. The electrical connection member disposed between the printed circuit board and the counterpart may include an insulating member including a first surface facing the counterpart and a second surface opposite to the first surface and facing the one surface of the printed circuit board, a conductive pad disposed on the second surface of the insulating member, a first conductive portion electrically connected to the counterpart and extending from the first surface of the insulating member toward the second surface, and a second conductive portion extending from the first conductive portion to the conductive region of the printed circuit board. The second conductive portion may include a portion penetrating the conductive pad and protruding outside the conductive pad. The electrical connection member may include an adhesive member surrounding the protruding portion of the second conductive portion and interposed between the conductive pad and the one surface of the printed circuit board. The first conductive portion may include a first plurality of conductive particles coated with a first conductive metal. The second conductive portion may include a second plurality of conductive particles coated with a second conductive metal. The second conductive metal may be different from the first conductive metal and may have a lower electrical resistance than the first conductive metal.

[0006] In one embodiment, a conductive gasket may include an insulating sheet having a first surface and a second surface opposite to the first surface, a conductive pad disposed on the second surface of the insulating member, a first conductive portion extending from the first surface of the insulating sheet toward the conductive pad, and a second conductive portion extending from the first conductive portion to the second surface of the insulating sheet and in contact with the conductive pad. The first conductive portion may include a first plurality of conductive particles plated with a first conductive metal. The second conductive portion may include a second plurality of conductive particles plated with a second conductive metal. The second conductive metal may be different from the first conductive metal and may have higher electrical conductivity than the first conductive metal. The second plurality of conductive particles may have a smaller average diameter than the first plurality of conductive particles.

[0007] FIG. 1 is a block diagram of an electronic device within a network environment according to various embodiments.

[0008] FIG. 2A is a diagram illustrating an exemplary electronic device according to one embodiment.

[0009] FIG. 2b is an exploded perspective view of an exemplary electronic device according to one embodiment.

[0010] FIG. 3a is an exemplary drawing showing a connecting member according to one embodiment.

[0011] FIG. 3b is an exemplary drawing showing a connecting member according to one embodiment.

[0012] FIG. 4 is an exemplary drawing showing a connecting member according to one embodiment.

[0013] FIG. 5A is an exemplary drawing showing a connecting member according to one embodiment.

[0014] FIG. 5b is an exemplary drawing showing a connecting member according to one embodiment.

[0015] FIG. 5c is an exemplary drawing showing a connecting member according to one embodiment.

[0016] FIG. 6A is an exemplary drawing showing a connecting member according to one embodiment.

[0017] FIG. 6b is an exemplary drawing showing a connecting member according to one embodiment.

[0018] FIG. 7a is an exemplary drawing showing a connecting member according to one embodiment.

[0019] FIG. 7b is a drawing illustrating examples of a connecting member being bonded to another object according to one embodiment.

[0020] FIG. 7c is a drawing illustrating examples of a connecting member being bonded to another object according to one embodiment.

[0021] FIG. 7d is a drawing illustrating examples of a connecting member being bonded to another object according to one embodiment.

[0022] FIG. 8a is an exemplary drawing showing a connecting member according to one embodiment.

[0023] FIG. 8b is an exemplary drawing showing a connecting member according to one embodiment.

[0024] FIG. 9 is an exemplary drawing showing a connecting member according to one embodiment.

[0025] FIG. 10a is a flowchart illustrating a method for manufacturing a connecting member according to one embodiment.

[0026] Figure 10b shows the arrangement state of conductive particles according to one embodiment.

[0027] Figure 10c shows the arrangement state of conductive particles according to one embodiment.

[0028] FIG. 1 is a block diagram of an electronic device (101) within a network environment (100) according to various embodiments. Referring to FIG. 1, in the network environment (100), the electronic device (101) may communicate with the electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of the electronic device (104) or the server (108) via a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0029] The processor (120) may control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) by executing, for example, software (e.g., a program (140)), and may perform various data processing or calculations. According to one embodiment, as at least a part of the data processing or calculation, the processor (120) may store a command or data received from another component (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the command or data stored in the volatile memory (132), and store the resulting data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or a secondary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together therewith. For example, if the electronic device (101) includes a main processor (121) and a secondary processor (123), the secondary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a specified function. The secondary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0030] The auxiliary processor (123) may control at least a part of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0031] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0032] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0033] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0034] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. According to one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0035] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0036] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0037] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0038] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0039] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0040] A haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0041] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0042] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0043] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0044] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, Wi-Fi (wireless fidelity) direct, or IrDA (infrared data association)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0045] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) may support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0046] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). According to one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas by, for example, the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the selected at least one antenna. According to some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0047] According to various embodiments, the antenna module (197) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0048] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0049] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service by itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0050] In this disclosure, identical components may be assigned the same reference numerals, and descriptions of components having the same reference numerals may be applied in the same or corresponding manner, even when referring to different drawings, unless otherwise specified. Furthermore, overlapping descriptions of components having the same reference numerals may be omitted.

[0051] FIG. 2A is a diagram illustrating an exemplary electronic device according to an embodiment. Referring to FIG. 2A, an electronic device (200) according to an embodiment may include a housing (210) forming an exterior of the electronic device (200). For example, the housing (210) may include a first side (or front side) (200A), a second side (or back side) (200B), and a third side (or side surface) (200C) surrounding a space between the first side (200A) and the second side (200B). In an embodiment, the housing (210) may also refer to a structure forming at least a portion of the first side (200A), the second side (200B), and / or the third side (200C).

[0052] An electronic device (200) according to one embodiment may include a substantially transparent front plate (202). In one embodiment, the front plate (202) may form at least a portion of the first surface (200A). In one embodiment, the front plate (202) may include, but is not limited to, a glass plate or a polymer plate including various coating layers.

[0053] An electronic device (200) according to one embodiment may include a substantially opaque back plate (211). In one embodiment, the back plate (211) may form at least a portion of the second surface (200B). In one embodiment, the back plate (211) may be formed of a coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), titanium, or magnesium), or a combination of at least two of the foregoing materials.

[0054] An electronic device (200) according to one embodiment may include a side bezel structure (e.g., a side member or bracket) (218). In one embodiment, the side bezel structure (218) may be combined with a front plate (202) and / or a rear plate (211) to form at least a portion of a third side (200C) of the electronic device (200). For example, the side bezel structure (218) may form the entire third side (200C) of the electronic device (200), or, for another example, the side bezel structure (218) may form the third side (200C) of the electronic device (200) together with the front plate (202) and / or the rear plate (211).

[0055] Unlike the illustrated embodiment, when the third side (200C) of the electronic device (200) is partially formed by the front plate (202) and / or the rear plate (211), the front plate (202) and / or the rear plate (211) may include a portion extending from its edge and curved toward the rear plate (211) and / or the front plate (202). The extending portion of the front plate (202) and / or the rear plate (211) may be positioned at both ends of a long edge of the electronic device (200), for example, but is not limited to the above-described example.

[0056] In one embodiment, the side bezel structure (218) may include a metal and / or a polymer. In one embodiment, the back plate (211) and the side bezel structure (218) may be formed integrally and may include the same material (e.g., a metal material such as aluminum), but is not limited thereto. For example, the back plate (211) and the side bezel structure (218) may be formed as separate components and / or may include different materials.

[0057] In one embodiment, the electronic device (200) may include a display (201) (e.g., the display module (160) of FIG. 1), an audio module (203, 204, 207) (e.g., the audio module (170) of FIG. 1), a sensor module (e.g., the sensor module (176) of FIG. 1), a camera module (205, 212, 213) (e.g., the camera module (180) of FIG. 1), a key input device (217) (e.g., the input module (150) of FIG. 1), a light-emitting element (not shown), and a connector hole (208). In one embodiment, the electronic device (200) may omit at least one of the above components (e.g., the key input device (217) or the light-emitting element (not shown)), or may additionally include other components.

[0058] In one embodiment, the display (201) may be visually exposed through a substantial portion of the front plate (202). For example, at least a portion of the display (201) may be visible through the front plate (202) forming the first side (200A). The display (201) may be disposed on the back surface of the front plate (202).

[0059] In one embodiment, in order to expand the area to which the display (201) is visually exposed, the outer shape of the display (201) may be formed to be substantially the same as the outer shape of the front plate (202) adjacent to the display (201). In one embodiment, the gap between the outer shape of the display (201) and the outer shape of the front plate (202) may be formed to be substantially the same.

[0060] In one embodiment, the display (201) (or the first surface (200A) of the electronic device (200)) may include a screen display area (201A). In one embodiment, the display (201) may provide visual information to a user through the screen display area (201A). In the illustrated embodiment, when the first surface (200A) is viewed from the front, the screen display area (201A) is depicted as being positioned on the inside of the first surface (200A) and spaced apart from the outer edge of the first surface (200A), but is not limited thereto. For example, when the first surface (200A) is viewed from the front, at least a portion of an edge of the screen display area (201A) may substantially coincide with an edge of the first surface (200A) (or the front plate (202)).

[0061] In one embodiment, the screen display area (201A) may include a sensing area (201B) configured to acquire a user's biometric information. Here, the meaning of "the screen display area (201A) includes the sensing area (201B)" may be understood to mean that at least a portion of the sensing area (201B) may overlap the screen display area (201A). For example, the sensing area (201B) may refer to an area that, like other areas of the screen display area (201A), can display visual information by the display (201) and additionally acquire the user's biometric information (e.g., a fingerprint). Although the sensing area (201B) is illustrated as being formed within the screen display area (201A), it is not limited thereto. For example, the sensing area (201B) may also be formed in the key input device (217).

[0062] In one embodiment, the display (201) may include an area where a first camera module (205) is positioned. For example, an opening may be formed in the area of ​​the display (201), and the first camera module (205) (e.g., a punch hole camera) may be at least partially positioned within the opening so as to face the first surface (200A). In this case, the screen display area (201A) may surround at least a portion of an edge of the opening. In one embodiment, the first camera module (205) (e.g., an under display camera (UDC)) may be positioned below the display (201) so as to overlap the area of ​​the display (201). In this case, the display (201) may provide visual information to the user through the area, and additionally, the first camera module (205) may acquire an image corresponding to a direction facing the first surface (200A) through the area of ​​the display (201).

[0063] In one embodiment, the display (201) may be coupled to or disposed adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer capable of detecting a magnetic field-type stylus pen.

[0064] In one embodiment, the audio module (203, 204, 207) may include a microphone hole (203, 204) and a speaker hole (207).

[0065] In one embodiment, the microphone holes (203, 204) may include a first microphone hole (203) formed in a portion of the third surface (200C) and a second microphone hole (204) formed in a portion of the second surface (200B). A microphone (not shown) for acquiring external sound may be placed inside the microphone holes (203, 204). The microphone may include a plurality of microphones to detect the direction of the sound, but is not limited thereto.

[0066] In one embodiment, a second microphone hole (204) formed in a portion of the second surface (200B) may be positioned adjacent to a camera module (205, 212, 213). For example, the second microphone hole (204) may acquire sound according to the operation of the camera module (205, 212, 213). However, the present invention is not limited thereto.

[0067] In one embodiment, the speaker hole (207) may include an external speaker hole (207) and a call receiver hole (not shown). The external speaker hole (207) may be formed in a part of the third surface (200C) of the electronic device (200). In one embodiment, the external speaker hole (207) may be integrated into the microphone hole (203), and the speaker hole (207) and the microphone hole (203) may be implemented as a single hole. Although not shown, the call receiver hole (not shown) may be formed in another part of the third surface (200C). For example, the call receiver hole may be formed on the opposite side of the external speaker hole (207) on the third surface (200C). For example, based on the city of FIG. 2A, the external speaker hole (207) may be formed on the third surface (200C) corresponding to the lower part of the electronic device (200), and the call receiver hole may be formed on the third surface (200C) corresponding to the upper part of the electronic device (200). However, this is not limited thereto, and in other embodiments, the call receiver hole may be formed at a location other than the third surface (200C). For example, the call receiver hole may be formed by a spaced space between the front plate (202) (or, display (201)) and the side bezel structure (218).

[0068] In one embodiment, the electronic device (200) may include at least one speaker (not shown) (e.g., an audio output module (155) of FIG. 1) configured to output sound to the outside of the housing (210) through an external speaker hole (207) and / or a call receiver hole (not shown).

[0069] In one embodiment, a sensor module (not shown) may generate an electrical signal or data value corresponding to an internal operating state of the electronic device (200) or an external environmental state. For example, the sensor module may include at least one of a proximity sensor, an HRM sensor, a fingerprint sensor, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0070] In one embodiment, the camera modules (205, 212, 213) may include a first camera module (205) arranged to face a first side (200A) of the electronic device (200), a second camera module (212) arranged to face a second side (200B), and a flash (213).

[0071] In one embodiment, the second camera module (212) may include multiple cameras (e.g., dual cameras, triple cameras, or quad cameras). However, the second camera module (212) is not necessarily limited to including multiple cameras and may include one camera.

[0072] In one embodiment, the first camera module (205) and the second camera module (212) may include one or more lenses, image sensors, and / or image signal processors.

[0073] In one embodiment, the flash (213) may include, for example, a light-emitting diode or a xenon lamp. In one embodiment, two or more lenses (infrared camera, wide-angle and telephoto lenses) and image sensors may be arranged on one side of the electronic device (200).

[0074] In one embodiment, the key input device (217) may be arranged on the third side (200C) of the electronic device (200). In one embodiment, the electronic device (200) may not include some or all of the key input devices (217), and the key input devices (217) that are not included may be implemented in another form, such as a soft key, on the display (201).

[0075] In one embodiment, a connector hole (208) may be formed on the third side (200C) of the electronic device (200) so that a connector of an external device can be accommodated. A connection terminal (e.g., a connection terminal (178) of FIG. 1) electrically connected to the connector of the external device may be arranged within the connector hole (208). The electronic device (200) according to one embodiment may include an interface module (e.g., an interface (177) of FIG. 1) for processing an electrical signal transmitted and received through the connection terminal.

[0076] In one embodiment, the electronic device (200) may include a light-emitting element (not shown). For example, the light-emitting element (not shown) may be disposed on a first surface (200A) of the housing (210). The light-emitting element (not shown) may provide status information of the electronic device (200) in the form of light. In one embodiment, the light-emitting element (not shown) may provide a light source that is linked to the operation of the first camera module (205). For example, the light-emitting element (not shown) may include an LED, an IR LED, and / or a xenon lamp.

[0077] FIG. 2B is an exploded perspective view of an exemplary electronic device according to an embodiment. Referring to FIG. 2B, an electronic device (200) according to an embodiment may include a frame structure (240) (e.g., the side bezel structure (218) of FIG. 2A), a first printed circuit board (250), a second printed circuit board (252), a cover plate (260), and a battery (270) (e.g., the battery (189) of FIG. 1).

[0078] In one embodiment, the frame structure (240) may be positioned between the display (201) and the back plate (211). In one embodiment, the frame structure (240) may support or accommodate components included in the electronic device (200). For example, the display (201) may be disposed on one side of the frame structure (240) facing one direction (e.g., +Z direction). A first printed circuit board (250), a second printed circuit board (252), a battery (270), and a second camera module (212) may be disposed on the other side of the frame structure (240) facing the opposite direction (e.g., -Z direction). The first printed circuit board (250), the second printed circuit board (252), the battery (270), and the second camera module (212) may be disposed within recesses formed in the frame structure (240).

[0079] In one embodiment, the frame structure (240) may include a first part (241) and a second part (243) surrounding the first part (241). The first part (241) and the second part (243) may be positioned below the display (201) (e.g., in the -Z direction). The first part (241) and / or the second part (243) may support the display (201). The second part (243) may surround a space between the back plate (211) and the front plate (202) (and / or the display (201)). The second part (243) surrounding the space may form a side surface of the electronic device (200) (e.g., the third surface (200C) of FIG. 2A). The first part (241) may be positioned within the space surrounded by the second part (243) by extending inwardly from the second part (243). The side surface of the electronic device (200) may extend from the front surface (e.g., the first surface (200A) of FIG. 2A) or the perimeter of the front plate (202) of the electronic device (200) to the rear surface (e.g., the second surface (200B) of FIG. 2A) or the perimeter of the rear plate (211) of the electronic device (200). In one embodiment, the first part (241) and / or the second part (243) may include a conductive portion formed of a conductive material such as a metal and / or a non-conductive portion formed of a non-conductive material such as a polymer. The frame structure (240) or the first part (241) of the frame structure (240) may be referred to as a support member.

[0080] In one embodiment, the first printed circuit board (250), the second printed circuit board (252), and the battery (270) may be respectively coupled to the frame structure (240). For example, the first printed circuit board (250) and the second printed circuit board (252) may be disposed on the frame structure (240) (e.g., the first part (241)) (e.g., in the -Z direction) and may be fixed on the frame structure (240) via a coupling member such as a screw. For example, the battery (270) may be at least partially accommodated within a recess formed on the frame structure (240) (e.g., the first part (241)) (e.g., in the -Z direction) and may be fixed on the frame structure (240) via an adhesive member such as a double-sided tape. However, the present invention is not limited to the above-described examples.

[0081] In one embodiment, the battery (270) may power at least one component of the electronic device (200). For example, the battery (270) may include a rechargeable secondary battery or a fuel cell.

[0082] In one embodiment, the display (201) may be positioned between a frame structure (240) and a front plate (202). For example, the front plate (202) may be positioned on one side (e.g., in the +Z direction) of the display (201), and the frame structure (240) may be positioned on the other side (e.g., in the -Z direction).

[0083] In one embodiment, the front plate (202) can be coupled with the display (201). For example, the display (201) can be attached to the back surface of the front plate (202) via an optically clear adhesive (e.g., optically clear adhesive (OCA) or optically clear resin (OCR)).

[0084] In one embodiment, the front plate (202) may be coupled to a frame structure (240). For example, the front plate (202) may include an outer portion extending outside the display (201) when viewed in the Z-axis direction. The outer portion of the front plate (202) may be attached to, but is not limited to, the frame structure (240) (e.g., the second part (243)).

[0085] In one embodiment, a processor (e.g., processor (120) of FIG. 1), a memory (e.g., memory (130) of FIG. 1), and / or an interface (e.g., interface (177) of FIG. 1) may be disposed on the first printed circuit board (250) and / or the second printed circuit board (252). The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor. The memory may include, for example, volatile memory or non-volatile memory. The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. The interface may electrically or physically connect the electronic device (200) to an external electronic device, and may include a USB connector, an SD card / MMC connector, or an audio connector. In one embodiment, the first printed circuit board (250) and the second printed circuit board (252) may be operatively or electrically connected to each other via a connecting member (e.g., a flexible printed circuit board).

[0086] In one embodiment, the cover plate (260) may be disposed between the first printed circuit board (250) and the back plate (211). For example, the cover plate (260) may be disposed on the first printed circuit board (250). For example, the cover plate (260) may be disposed on a surface of the first printed circuit board (250) facing the -Z direction. In one embodiment, the cover plate (260) may be coupled to the first printed circuit board (250) and / or the frame structure (240) via a coupling member (e.g., a screw). The cover plate (260) may cover at least a portion of the first printed circuit board (250), thereby protecting the first printed circuit board (250) from physical impact or preventing a connector coupled to the first printed circuit board (250) from being detached.

[0087] In one embodiment, a first camera module (205) (e.g., a front camera) may be disposed in at least a portion of a frame structure (240) (e.g., a first part (241)) such that the lens can receive external light through a portion of the front plate (202) (e.g., the camera area (237)) (e.g., the front (200A) of FIG. 2A).

[0088] In one embodiment, a second camera module (212) (e.g., a rear camera) may be disposed between the frame structure (240) and the rear plate (211). In one embodiment, the second camera module (212) may be electrically connected to the first printed circuit board (250) via a connecting member (e.g., a connector). In one embodiment, the second camera module (212) may be disposed such that the lens can receive external light through the camera area (284) of the rear plate (211) of the electronic device (200).

[0089] In one embodiment, the camera area (284) may be formed on a surface of the rear plate (211) (e.g., the rear surface (200B) of FIG. 2A). In one embodiment, the camera area (284) may be formed to be at least partially transparent so that external light may be incident on the lens of the second camera module (212). In one embodiment, at least a portion of the camera area (284) may protrude from the surface of the rear plate (211) by a predetermined height. However, the present invention is not limited thereto, and in another embodiment, the camera area (284) may form a substantially same plane as the surface of the rear plate (211).

[0090] In one embodiment, the housing (210) of the electronic device (200) may refer to a configuration or structure that forms at least a portion of the exterior of the electronic device (200). In this respect, at least a portion of the front plate (202), the frame structure (240), and / or the rear plate (211) that form the exterior of the electronic device (200) may be referred to as the housing (210) of the electronic device (200).

[0091] An electronic device (200) according to one embodiment may include an antenna module (not shown). In one embodiment, the antenna module may be disposed between the rear plate (211) and the cover plate (260). The antenna module may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna module may, for example, perform short-range communication with an external device or wirelessly transmit and receive power with an external device.

[0092] In one embodiment, the electronic device (200) may include a connecting member (230) for providing electrical connection between various components. For example, the connecting member (230) may be disposed between a first printed circuit board (250) (or a second printed circuit board (252)) and a frame structure (240) to electrically connect a conductive area (e.g., a conductive pad) of the first printed circuit board (250) (or the second printed circuit board (252)) and a conductive portion of the frame structure (240). As another example, the connecting member (230) may be disposed between the first printed circuit board (250) (or the second printed circuit board (252)) and a rear plate (211) to electrically connect a conductive area of ​​the first printed circuit board (250) (or the second printed circuit board (252)) and a conductive portion included in the rear plate (211). For another example, the connecting member (230) can be disposed between the first printed circuit board (250) (or the second printed circuit board (252)) and another printed circuit board (not shown) to electrically connect a conductive area of ​​the first printed circuit board (250) (or the second printed circuit board (252)) and a conductive area of ​​the other printed circuit board. For another example, the connecting member (230) can be disposed on a conductive structure disposed on the first printed circuit board (250), such as a cover plate or a shield can. In this case, the connecting member (230) can be disposed between the conductive structure and a counterpart (e.g., the conductive portion of the frame structure (240) or the conductive portion of the rear plate (211)) to electrically connect them. For another example, the connecting member (230) can be disposed between conductive members or conductive structures of the electronic device (200) to electrically connect them. Additionally, in FIG. 2b, the electronic device (200) is illustrated as including one connecting member (230), but is not limited thereto.The electronic device (200) may include a plurality of connecting members for electrical connection between various components included in the electronic device (200), and each of the plurality of connecting members may correspond to a connecting member (230).

[0093] In one embodiment, the connecting member (230) may be referred to as, but is not limited to, an electrical connecting member, an electrical connector, an electrical terminal, an interconnection, an electrical contact, a conductive gasket, a conductive elastomer, a conductive interface, an electrical interface, or a conductive socket.

[0094] Referring to the drawings below, the connecting member (230) is described in detail.

[0095] FIGS. 3A and 3B are exemplary drawings illustrating a connecting member according to an embodiment. FIG. 3B may be a plan view of the connecting member (330) of FIG. 3A as viewed from above (e.g., in direction (A)). In FIG. 3A, a structure in which a printed circuit board (350) and a counterpart (390) are electrically connected through the connecting member (330) is illustrated, but the present invention is not limited to the illustrated example of electrical connection through the connecting member (330). As described above, the connecting member (330) may electrically connect various components included in an electronic device (e.g., the electronic device (200) of FIG. 2B , hereinafter referred to as the electronic device (200)).

[0096] Referring to FIGS. 3A and 3B, a connecting member (330) (e.g., connecting member (230) of FIG. 2B) may be disposed between a printed circuit board (350) (e.g., first printed circuit board (250) or second printed circuit board (252) of FIG. 2B) and a counterpart (390) (e.g., frame structure (240) of FIG. 2B). For example, the connecting member (330) may be disposed on the printed circuit board (350) so as to be in contact with a conductive region (352) of the printed circuit board (350). The conductive region (352) of the printed circuit board (350) may be formed of a conductive material, such as copper. For example, the conductive region (352) may include a conductive pad disposed on the printed circuit board (350).

[0097] In one embodiment, the counterpart (390) may be electrically connected to the printed circuit board (350) via the connecting member (330). For example, the counterpart (390) may be electrically connected to a conductive region (352) of the printed circuit board (350) via the connecting member (330). Various electrical signals, such as analog signals, digital signals, or radio frequency (RF) signals, may be transmitted via the electrical path formed by the connecting member (330). For example, but not limited to, the connecting member (330) may be used for ground contact of the electronic device (200) or various components of the electronic device (200).

[0098] In one embodiment, the connecting member (330) may include an insulating member (300), a conductive pad (340), and a conductive portion (310). The insulating member (300) may include a first surface (or upper surface) (300A), a second surface (or lower surface) (300B), and a side surface (300C). The first surface (300A) and the second surface (300B) may be opposite to each other, and the side surface (300C) may extend from an outer edge of the first surface (300A) to an outer edge of the second surface (300B). The first surface (300A) may face the counterpart (390). The second surface (300B) may face the printed circuit board (350) and be spaced apart from the printed circuit board (350). In one embodiment, the insulating member (300) may be configured to have elasticity and insulation. For example, the insulating member (300) may include, but is not limited to, silicone, urethane, polyurethane, polyimide (PI), polycarbonate (PC), polypropylene (PP), polyester, polymethyl methacrylate (PMMA), and combinations thereof. In one embodiment, the insulating member (300) may be referred to as an elastic member, a support sheet, an insulating sheet, an insulator, an insulating elastomer, or a housing of the connecting member (330).

[0099] In one embodiment, the conductive pad (340) may be disposed under the insulating member (300). For example, the conductive pad (340) may be disposed on the second side (300B) of the insulating member (300). The conductive pad (340) may be disposed between the insulating member (300) and the conductive region (352) of the printed circuit board (350). The conductive pad (340) may be in contact with the conductive region (352) of the printed circuit board (350). The conductive pad (340) may be coupled to the conductive region (352) of the printed circuit board (350). For example, the conductive pad (340) may be bonded to the conductive region (352) of the printed circuit board (350) by soldering. In one embodiment, the conductive pad (340) may be formed of a conductive material such as copper. In one embodiment, the area of ​​the conductive pad (340) may be larger than the area of ​​the second surface (300B) of the insulating member (300), but is not limited thereto. In one embodiment, when the connecting member (330) is viewed from above (e.g., in direction (A)), the insulating member (300) may be positioned within the outer edge of the conductive pad (340), but is not limited thereto.

[0100] In one embodiment, the conductive pad (340) may be disposed on the second surface (300B) of the insulating member (300) to cover the conductive portion (310). Accordingly, the conductive pad (340) may prevent oxidation of the conductive portion (310) by preventing the conductive portion (310) from being exposed to the outside. In addition, the conductive pad (340) may be interposed between the conductive portion (310) and the conductive region (352) of the printed circuit board (350), thereby reducing or preventing galvanic corrosion caused by a potential difference between the conductive portion (310) and the conductive region (352) of the printed circuit board (350). Alternatively or alternatively, the connecting member (330) may not include the conductive pad (340).

[0101] In one embodiment, the conductive portion (310) may be positioned within the insulating member (300). For example, the conductive portion (310) may extend from the first side (300A) of the insulating member (300) to the second side (300B). The conductive portion (310) may have a shape that penetrates the insulating member (300). For example, the conductive portion (310) may have a pillar shape that extends in a direction perpendicular to the insulating member (300) (e.g., the first side (300A)).

[0102] In one embodiment, the conductive portion (310) may form a portion of the first surface (300A) and a portion of the second surface (300B) of the insulating member (300). The conductive portion (310) may be electrically connected to the conductive pad (340) disposed on the second surface (300B) of the insulating member (300) by contacting the conductive pad (340). The conductive portion (310) may be electrically connected to the counterpart (390) disposed on the first surface (300A) of the insulating member (300) by contacting the counterpart (390). Accordingly, an electrical path may be formed that leads to the conductive region (352) of the printed circuit board (350), the conductive pad (340) of the connecting member (330), the conductive portion (310), and the counterpart (390).

[0103] Additionally or optionally, another conductive pad may be interposed between the counterpart (390) of the connecting member (330) and the counterpart (390). The other conductive pad may cover the conductive portion (310). Accordingly, the other conductive pad may prevent oxidation of the conductive portion (310) by preventing the conductive portion (310) from being exposed to the outside. In addition, the other conductive pad may be interposed between the conductive portion (310) of the connecting member (330) and the counterpart (390), thereby reducing or preventing galvanic corrosion caused by a potential difference between the conductive portion (310) and the counterpart (390).

[0104] In one embodiment, the conductive portion (310) may include a plurality of conductive particles for providing an electrical path. For example, the conductive portion (310) may include a first plurality of conductive particles (361) and a second plurality of conductive particles (362). The first plurality of conductive particles (361) and the second plurality of conductive particles (362) may be arranged to be uniformly mixed within the conductive portion (310).

[0105] In one embodiment, the first plurality of conductive particles (361) may include first core particles and a first conductive metal coated (or plated) on the surface of the first core particles. The first core particles may include a magnetic material for alignment of the first plurality of conductive particles (361). For non-limiting examples, the first core particles may include nickel, cobalt, iron, an alloy thereof, or a combination thereof. The first conductive metal may include, for example, gold. In one embodiment, the second plurality of conductive particles (362) may include second core particles. The second core particles may include a magnetic material for alignment of the second plurality of conductive particles (362). The second core particles may include, for non-limiting examples, nickel, cobalt, iron, an alloy thereof, or a combination thereof. Additionally, the second plurality of conductive particles (362) may include a second conductive metal coated (or plated) on the second core particles. The second conductive metal may be different from the first conductive metal. For example, the first conductive metal may include gold, and the second conductive metal may include silver or copper.

[0106] Table 1 below shows the bulk resistivity (μΩ-cm) of major metals.

[0107] Ag (silver) 1.6Al (aluminum) 2.65Au (gold) 2.2Co (cobalt) 6Cu (copper) 1.7Mo (molybdenum) 5Ni (nickel) 7

[0108] As shown in Table 1 above, by using a first plurality of conductive particles (361) plated with gold and a second plurality of conductive particles (362) plated with silver or copper, which has better electrical conductivity and lower electrical resistance than gold, the electrical conductivity of the connecting member (330) can be improved. In addition, by using silver or copper, which is cheaper than gold, for the second plurality of conductive particles (362), the cost of raw materials can be reduced.

[0109] Additionally, in a comparative example, a surface mount device (SMD) gasket may be used for vertical electrical connection. The SMD gasket, when formed with a small thickness (or height), may cause electrical connection breakdown when pressed by objects for electrical connection. Enlarging the two-dimensional area (e.g., width and height) of the SMD gasket can reduce the reliability of electrical connections due to its thin thickness, but there are limitations to miniaturization. In contrast, the connecting member (330) according to one embodiment can provide a stable electrical connection without a change in the two-dimensional area even if it has a thin thickness. For example, the connecting member (330) may have a height of about 0.7 mm or less and a width and height of 1.0 mm or less, but is not limited thereto.

[0110] For example, but not limited to, the first thickness of the first conductive metal, which is a coating layer of each of the first plurality of conductive particles (361), may be about 50 nm to about 100 nm. For example, but not limited to, the second thickness of the second conductive metal, which is a coating layer of each of the second plurality of conductive particles (362), may be about 50 nm to about 100 nm. In one embodiment, the first thickness of the first plurality of conductive particles (361) may be thinner than the second thickness of the second plurality of conductive particles (362), but is not limited thereto.

[0111] For example, but not limited to, the first diameter of each of the first plurality of conductive particles (361) (or the average diameter of the first plurality of conductive particles (361)) may be from about 40 μm to about 150 μm. For example, but not limited to, the second diameter of each of the second plurality of conductive particles (362) (or the average diameter of the second plurality of conductive particles (362)) may be from about 40 μm to about 150 μm. In one embodiment, the first diameter of the first plurality of conductive particles (361) may be substantially the same as or larger than the second diameter of the second plurality of conductive particles (362), but is not limited thereto.

[0112] Although not shown, the conductive portion (310) may include an elastic material interposed between the plurality of conductive particles. The elastic material of the conductive portion (310) may include the same material as the material forming the insulating member (300). The elastic material may fix and support the plurality of conductive particles of the conductive portion (310) within the insulating member (300). When the connecting member (330) is pressed, the distance between the plurality of conductive particles of the conductive portion (310) may be reduced, thereby forming an electrical path.

[0113] FIG. 4 is an exemplary drawing showing a connecting member according to one embodiment.

[0114] Referring to FIG. 4, a connecting member (430) (e.g., connecting member (230) of FIG. 2B or connecting member (330) of FIG. 3A) may include an insulating member (300), a conductive pad (340), and a conductive portion (410). The insulating member (300) may include a first side (300A), a second side (300B), and a side surface (300C).

[0115] In one embodiment, the conductive portion (410) may be positioned within the insulating member (300). For example, the conductive portion (410) may extend from the first side (300A) of the insulating member (300) to the second side (300B). The conductive portion (410) may have a shape that penetrates the insulating member (300). For example, the conductive portion (410) may have a pillar shape that extends in a direction perpendicular to the insulating member (300) (e.g., the first side (300A)).

[0116] In one embodiment, the conductive portion (410) may include a first portion (or first conductive portion) (411) and a second portion (or second conductive portion) (412). The first portion (411) may extend from the first side (300A) of the insulating member (300) toward the conductive pad (340). The first portion (411) may form a portion of the first side (300A) of the insulating member (300). The second portion (412) may extend from the first portion (411) to the conductive pad (340). The second portion (412) may be disposed between the first portion (411) and the conductive pad (340). The second portion (412) may be electrically connected to the conductive pad (340) by contacting the conductive pad (340). The second portion (412) may form a part of the second surface (300B) of the insulating member (300). The conductive pad (340) may be disposed on the second surface (300B) of the insulating member (300) to cover the second portion (412) of the conductive portion (410).

[0117] In one embodiment, the conductive portion (410) may include a plurality of conductive particles to provide an electrical path. For example, the first portion (411) of the conductive portion (410) may include a first plurality of conductive particles. The description of the first plurality of conductive particles of the first portion (411) may be applied in a substantially identical or corresponding manner to the description of the first plurality of conductive particles (361) of FIG. 3A. For example, the second portion (412) of the conductive portion (410) may include a second plurality of conductive particles. The description of the second plurality of conductive particles of the second portion (412) may be applied in a substantially identical or corresponding manner to the description of the second plurality of conductive particles (362) of FIG. 3A. Unlike the first and second plurality of conductive particles (361, 362) of FIG. 3A, which are uniformly mixed within the conductive portion (310), the conductive portion (410) can be divided into a first portion (411) including the first plurality of conductive particles and a second portion (412) including the second plurality of conductive particles. In this respect, the first portion (411) and the second portion (412) can be referred to as a first layer and a second layer of the conductive portion (410).

[0118] In one embodiment, the first size of the first plurality of conductive particles of the first portion (411) may be substantially the same as or larger than the second size of the second plurality of conductive particles of the second portion (412). In one embodiment, by increasing the first size of the first plurality of conductive particles of the first portion (411), the cost for forming a coating layer (e.g., gold) of the first plurality of conductive particles may be reduced. However, by increasing the size of the first plurality of conductive particles, the repulsive force of the connecting member (430) may increase. Due to the increased repulsive force, the electrical connection performance of the connecting member (430) may be degraded. To prevent this, the repulsive force of the connecting member (430) may be reduced by making the second size of the second plurality of conductive particles of the second portion (412) larger than the first size of the first plurality of conductive particles. Accordingly, the performance of the connecting member (430) can be maintained or improved even while reducing manufacturing costs.

[0119] Additionally, the coating layer (e.g., silver or copper) of the second plurality of conductive particles of the second portion (412) may have lower corrosion resistance than the coating layer (e.g., gold) of the first plurality of conductive particles of the first portion (411). However, since the second portion (412) is covered by the conductive pad (340), the corrosion problem of the second plurality of conductive particles of the second portion (412) can be reduced or prevented.

[0120] In FIG. 4, the first thickness of the first portion (411) is illustrated as being smaller than the second thickness of the second portion (412), but is not limited thereto. For example, the first thickness of the first portion (411) may be substantially the same as or greater than the second thickness of the second portion (412). The first thickness and the second thickness may be lengths based on a direction perpendicular to the insulating member (300) (e.g., a direction perpendicular to the first surface (300A)). The thicknesses of the first portion (411) and / or the second portion (412) may be variously determined by comprehensively considering the size of the connecting member (430), manufacturing cost, required repulsive force, and support force of the insulating member (300).

[0121] Figures 5a, 5b, and 5c are exemplary drawings illustrating a connecting member according to one embodiment. Figure 5b may be a plan view of the connecting member (530) of Figure 5a viewed from above (e.g., in direction (B)).

[0122] Referring to FIGS. 5A and 5B, a connecting member (530) (e.g., connecting members (230, 330, or 430)) may include an insulating member (500), a conductive pad (340), and a conductive portion (410).

[0123] In one embodiment, the insulating member (500) (e.g., the insulating member (300) of FIG. 3A) may include a first surface (500A), a second surface (500B), and a side surface (500C). The first surface (500A) and the second surface (500B) may be opposite each other, and the side surface (500C) may extend from an outer edge of the first surface (500A) to an outer edge of the second surface (500B). The connecting member (530) may electrically connect an object (e.g., a counterpart (390) of FIG. 3A) disposed on the first surface (500A) of the insulating member (500) and an object (e.g., a printed circuit board (350) of FIG. 3A or a conductive region (352) of the printed circuit board (350)) disposed under the conductive pad (340).

[0124] In one embodiment, the conductive pad (340) may be disposed on the second surface (500B) of the insulating member (500). In one embodiment, the area of ​​the conductive pad (340) may be larger than the area of ​​the second surface (500B) of the insulating member (500), but is not limited thereto. In one embodiment, as illustrated in FIG. 5B, when the connecting member (530) is viewed from above (e.g., in direction (B)), the insulating member (500) may be positioned inside the outer edge of the conductive pad (340), but is not limited thereto.

[0125] In one embodiment, the conductive portion (410) may be positioned within the insulating member (500). For example, the conductive portion (410) may extend from the first side (500A) of the insulating member (500) to the second side (500B). The conductive portion (410) may have a shape that penetrates the insulating member (500). For example, the conductive portion (410) may have a pillar shape that extends in a direction perpendicular to the insulating member (500) (e.g., a direction perpendicular to the first side (500A)).

[0126] In one embodiment, the conductive portion (410) may form a portion of the first side (500A) and a portion of the second side (500B) of the insulating member (500). In one embodiment, the conductive portion (410) may include a first portion (411) forming a portion of the first side (500A) of the insulating member (500) and a second portion (412) forming a portion of the second side (500B). The first portion (411) may extend from the first side (500A) of the insulating member (500) toward the conductive pad (340). The second portion (412) may extend from the first portion (411) to the conductive pad (340).

[0127] In one embodiment, the insulating member (500) may include a first part (or upper part) (501) and a second part (or lower part) (502). In one embodiment, the first part (501) may at least partially surround a side surface of the first part (411) of the conductive part (410). For example, the first part (501) may surround the entire first area (A1) formed by the first part (411). For example, the first part (501) may extend from the first side (500A) of the insulating member (500) toward the second side (500B) so as to surround at least a portion of the first part (411) in the vertical direction. In one embodiment, the second part (502) may at least partially surround a side surface of the second part (412) of the conductive part (410). For example, the second part (502) may surround the entire first region (B1) formed by the second part (412). For example, the second part (502) may extend from the second surface (500B) of the insulating member (500) to the first part (501) so as to surround at least a portion of the second part (412) in the vertical direction.

[0128] In one embodiment, the first thickness of the first part (501) may be substantially the same as the second thickness of the second part (502), but is not limited thereto. For example, unlike the illustration in FIG. 5A, the first thickness of the first part (501) may be greater than or less than the second thickness of the second part (502). The first thickness of the first part (501) and / or the second thickness of the second part (502) may be a length based on a direction perpendicular to the insulating member (500) (e.g., a direction perpendicular to the first surface (500A)). The first thickness of the first part (501) and / or the second thickness of the second part (502) may be variously determined in consideration of the size of the connecting member (430), the repulsive force, and the supporting force for supporting the conductive portion (410).

[0129] In one embodiment, the first thickness of the first part (501) and the first thickness of the first portion (411) may be substantially the same, but are not limited thereto. For example, the first thickness of the first part (501) may be smaller or larger than the first thickness of the first portion (411). In one embodiment, the second thickness of the second part (502) and the second thickness of the second portion (412) may be substantially the same, but are not limited thereto. For example, the second thickness of the second part (502) may be smaller or larger than the second thickness of the second portion (412). The relative thicknesses of the first part (501), the second part (502), the first portion (411), and the second portion (412) may be variously determined in consideration of the size, support force, repulsive force, and manufacturing cost of the connecting member (430).

[0130] In one embodiment, the first surface (500A) of the insulating member (500) may include a first region (A1) and a second region (A2). The first region (A1) may be formed by the first part (411) of the conductive portion (410). The second region (A2) may be formed by the first part (501) of the insulating member (500). The second region (A2) may extend from the outer edge of the first region (A1) to the outer edge of the first surface (500A).

[0131] In one embodiment, the second side (500B) of the insulating member (500) may include a first region (B1) and a second region (B2). The first region (B1) may be formed by the second part (412) of the conductive portion (410). The second region (B2) may be formed by the second part (502) of the insulating member (500). The second region (B2) may extend from the outer edge of the first region (B1) to the outer edge of the second side (500B).

[0132] In one embodiment, the size (e.g., area) of the first side (500A) of the insulating member (500) may be smaller than the size of the second side (500B). For example, the size of the first region (A1) of the first side (500A) may be substantially the same as the size of the first region (B1) of the second side (500B), but the size of the second region (A2) of the first side (500A) may be smaller than the size of the second region (B2) of the second side (500B). As described above, by increasing the first size of the first plurality of conductive particles of the first portion (411), the material cost can be reduced, but the repulsive force of the connecting member (530) may be increased. An increase in the repulsive force may deteriorate the reliability of electrical contact. However, according to one embodiment, the connecting member (530) can reduce the repulsive force of the connecting member (530) by making the size of the first side (500A) (or the second area (A2)) of the insulating member (500) smaller than the size of the second side (500B) (or the second area (B2)). Accordingly, the performance of the connecting member (430) can be maintained or improved even if the manufacturing cost is reduced.

[0133] Referring to FIGS. 5A, 5B, and 5C, in one embodiment, in order to make the size of the first side (500A) of the insulating member (500) smaller than the second side (500B), the width of the insulating member (500) may decrease from the second side (500B) to the first side (500A). For example, the first width of the first part (501) may be smaller than the second width of the second part (502). The first width and the second width may be the lengths of the first part (501) and the second part (502) based on a direction parallel to the insulating member (500) (e.g., a direction parallel to the first side (500A)). For example, the side surface (C2) of the second part (502) may be located outside the side surface (C1) of the first part (501). For example, as shown in the illustration of FIG. 5B, when the connecting member (530) is viewed from above, the first part (501) may be positioned within the boundary of the second part (502). For example, as shown in the illustrations of FIGS. 5A and 5B, the second part (502) may protrude outwardly from the first part (501) of the insulating member (500) such that the side surface (500C) of the insulating member (500) has a step shape. Accordingly, a step portion may be formed between the first part (501) and the second part (502). For another example, referring to FIG. 5C, for example, the side surface (C1) of the first part (501) and the side surface (C2) of the second part (502) may be connected without a step. For example, the cross-sectional shape of the insulating member (500) cut along a plane perpendicular to the first surface (500A) of the insulating member (500) may include a trapezoidal shape in which the first surface (500A) is shorter than the second surface (500B), the first surface (500A) and the second surface (500B) are parallel to each other, and the side surface (500C) is inclined. The trapezoidal-shaped insulating member (500) can reduce the repulsive force of the connecting member (530) by dispersing the applied pressure.

[0134] The connecting member (530) illustrated in FIGS. 5A and 5B is illustrated as including the conductive portion (410) of FIG. 4, but is not limited thereto. For example, as illustrated in FIG. 5C, the conductive portion (410) of the connecting member (530) may be replaced with the conductive portion (310) of FIG. 3A.

[0135] Figures 6a and 6b are exemplary drawings illustrating a connecting member according to one embodiment. Referring to Figure 6a, a connecting member (630) (e.g., connecting members (230, 330, 430, or 530)) may include an insulating member (500), a conductive pad (640), and a conductive portion (610).

[0136] In one embodiment, the conductive portion (610) may extend from the first side (500A) of the insulating member (500) to the second side (640B) of the conductive pad (640). The conductive portion (610) may have a shape that penetrates the insulating member (500) and the conductive pad (640). For example, the conductive portion (610) may have a pillar shape that extends in a direction perpendicular to the insulating member (500) (e.g., the first side (500A)).

[0137] In one embodiment, the conductive portion (610) may include a first portion (411), a second portion (412), and a third portion (or third conductive portion) (613). Between the first portion (411) and the third portion (613), the second portion (412) may be positioned. The third portion (613) may extend from the second portion (412). In one embodiment, the conductive portion (610) may be partially positioned within the insulating member (500). For example, the first portion (411) and the second portion (412) of the conductive portion (610) may be positioned within the insulating member (500), and the third portion (613) may be positioned outside the insulating member (500), but is not limited thereto. For example, a part of the third part (613) may be positioned inside the insulating member (500), and the remainder of the third part (613) may be positioned outside the insulating member (500).

[0138] In one embodiment, the conductive pad (640) may be disposed on the second side (500B) of the insulating member (500). For example, the conductive pad (640) may include a first side (640A) and a second side (640B) opposite the first side (640A). The first side (640A) of the conductive pad (640) may be disposed on the second side (500B) of the insulating member (500). The conductive pad (640) may include a through hole (645) extending from the first side (640A) to the second side (640B). The conductive portion (610) may be at least partially positioned within the through hole (645). For example, the third portion (613) of the conductive portion (610) may be at least partially positioned within the through hole (645). The third portion (613) of the conductive portion (610) may form a portion of the second surface (640B) of the conductive pad (640). Although not shown, the third portion (613) may be in direct contact with an object (e.g., a printed circuit board (350), a conductive region (352), or a counterpart (390) of FIG. 3A) connected to the connecting member (630). In one embodiment, the area of ​​the conductive pad (640) may be larger than the area of ​​the second surface (500B) of the insulating member (500), but is not limited thereto.

[0139] In one embodiment, the third portion (613) of the conductive portion (610) may include a third plurality of conductive particles. For the third plurality of conductive particles of the third portion (613), the description of the first plurality of conductive particles of the first portion (411) and / or the first plurality of conductive particles (361) of FIG. 3A may be applied in a substantially identical or corresponding manner. For example, the third plurality of conductive particles may include third core particles and a third conductive metal coated (or plated) on the surfaces of the third core particles. The third core particles may include, but are not limited to, nickel, cobalt, iron, alloys thereof, or combinations thereof. The third conductive metal may include, but are not limited to, gold. For example, the third thickness of the third conductive metal, which is a coating layer of each of the third plurality of conductive particles, may be from about 50 nm to about 100 nm. In one embodiment, the third thickness of the third plurality of conductive particles may be, but is not limited to, thinner than the second thickness of the second plurality of conductive particles of the second portion (412). For example, but not limited to, the third diameter of each of the third plurality of conductive particles (or an average diameter of the third plurality of conductive particles) may be from about 40 μm to about 150 μm. In one embodiment, the third diameter of the third plurality of conductive particles of the third portion (613) may be, but is not limited to, substantially the same as or greater than the second diameter of the second plurality of conductive particles of the second portion (412).

[0140] In one embodiment, the coating layer (e.g., silver or copper) of the second plurality of conductive particles of the second portion (412) may have lower corrosion resistance than the coating layer (e.g., gold) of the conductive particles included in the first portion (411) or the third portion (613). However, the second portion (412) may be completely surrounded by the first portion (411), the third portion (613), and the insulating member (500), thereby reducing or preventing corrosion of the second plurality of conductive particles of the second portion (412).

[0141] Unlike the first and second plurality of conductive particles (361, 362) of FIG. 3A, which are uniformly mixed within the conductive portion (310), the conductive portion (610) can be divided into a first portion (411) including the first plurality of conductive particles, a second portion (412) including the second plurality of conductive particles, and a third portion (613) including the third plurality of conductive particles. In this respect, the first portion (411), the second portion (412), and the third portion (613) can be referred to as a first layer, a second layer, and a third layer of the conductive portion (610).

[0142] In one embodiment, the conductive portion (610) of the connecting member (630) of FIG. 6A may be replaced with a conductive portion (610-1) (e.g., the conductive portion (310) of FIG. 3A) in which a first plurality of conductive particles (361) and a second plurality of conductive particles (362) are mixed, as illustrated in FIG. 6B. The conductive portion (610-1) may extend from the first side (500A) of the insulating member (500) to the second side (640B) of the conductive pad (640) so as to penetrate the insulating member (500) and the conductive pad (640).

[0143] FIG. 7A is an exemplary drawing illustrating a connecting member according to one embodiment. FIGS. 7B, 7C, and 7D are drawings illustrating examples of a connecting member being attached to another object according to one embodiment.

[0144] Reference numeral (701) of Fig. 7c is a plan view of the connecting member (630) of Fig. 7b as viewed from below (e.g., direction (C)). Reference numeral (702) of Fig. 7c is a plan view of the adhesive member (770) of Fig. 7b as viewed from below (e.g., direction (C)). Reference numeral (703) of Fig. 7c is a plan view of the connecting member (630) of Fig. 7b and the adhesive member (770) attached to the connecting member (630) as viewed from below (e.g., direction (C)).

[0145] Referring to FIG. 7A, according to one embodiment, the connecting member (630) may alternatively include a conductive portion (710) in place of the conductive portion (610) of FIG. 6A (or the conductive portion (610-1) of FIG. 6B). In one embodiment, the conductive portion (710) may protrude outside the conductive pad (640). For example, the conductive portion (710) may be referred to as the conductive portion (610) in which the third portion (613) protrudes outside the conductive pad (640) in FIG. 6A. For example, the conductive portion (710) may be referred to as the conductive portion (610-1) formed to protrude outside the conductive pad (640) in FIG. 6B. As the conductive portion (710) protrudes, a more stable electrical connection may be possible.

[0146] Referring to FIGS. 7b and 7c, according to one embodiment, an electronic device (200) may include an object (750) electrically connected to a connecting member (630) and an adhesive member (770) for bonding the connecting member (630) and the object (750).

[0147] In one embodiment, the object (750) may include, for example, a conductive member or conductive structure of the electronic device (200). For example, the object (750) may include a conductive region formed on a printed circuit board (e.g., conductive region (352) of FIG. 3A), a conductive structure disposed on a printed circuit board such as a shield can, or a conductive portion included in a housing of the electronic device (e.g., frame structure (240) or back plate (211) of FIG. 2B).

[0148] In one embodiment, the adhesive member (770) may include an adhesive tape or an adhesive. In one embodiment, the adhesive member (770) may be disposed on the second side (640B) of the conductive pad (640). The adhesive member (770) may surround a portion of the conductive portion (710) that protrudes outside the conductive pad (640). For example, the adhesive member (770) may be formed with a hole (775) that is aligned with the through hole (645) of the conductive pad (640), and the conductive portion (710) may be positioned within the hole (775) of the adhesive member (770). In one embodiment, the adhesive member (770) may be interposed between the conductive pad (640) and the object (750), thereby attaching the connecting member (630) to the object (750). For another example, referring to FIG. 7d, the adhesive member (770-1) may be positioned at a plurality of points on the second surface (640B) of the conductive pad (640), each of which is spaced apart from one another.

[0149] FIGS. 8A and 8B are exemplary drawings illustrating a connecting member according to one embodiment. FIG. 8B may be a drawing of the connecting member (830) of FIG. 8A viewed from above (e.g., in direction (D)).

[0150] Referring to FIG. 8A, an electronic device (200) according to an embodiment may include a connecting member (830) and an object (750) electrically connected to the connecting member (830). Referring to FIGS. 8A and 8B, in an embodiment, the connecting member (830) may include an insulating member (800), a conductive portion (810), and a conductive pad (840). The connecting member (830) may be an example of the connecting members (230, 330, 430, 530, or 630) described above. The insulating member (800) may be an example of the insulating members (300 or 500) described above. The conductive portion (810) may be an example of the conductive portions (310, 410, 610, or 710) described above. The conductive pad (840) may be an example of the conductive pads (340 or 640) described above.

[0151] In one embodiment, the conductive pad (840) can be coupled to the object (750). For example, the conductive pad (840) can be coupled to the object (750) by welding (e.g., laser welding or ultrasonic welding) at a plurality of points (P). In one embodiment, the conductive pad (840) can be formed of a material that allows easy welding (e.g., stainless steel). Accordingly, the connecting member (830) can be coupled to an object that is not capable of surface mount technology (SMT), and the manufacturing cost can be reduced compared to manufacturing the conductive pad (840) from copper foil.

[0152] FIG. 9 is an exemplary drawing showing a connecting member according to one embodiment.

[0153] Referring to FIG. 9, an electronic device (200) according to an embodiment may include a connecting member (930) (e.g., connecting member (230) of FIG. 2B). In an embodiment, the connecting member (930) may include an insulating member (900), conductive portions (910-1, 910-2, 910-3), and conductive pads (940-1, 940-2, 940-3). In an embodiment, the insulating member (900) may be applied in a substantially identical or corresponding manner to the description provided with reference to the insulating members (300, 500, or 800) described above.

[0154] In one embodiment, the conductive portions (910-1, 910-2, 910-3) may be disposed within the insulating member (900). The conductive portions (910-1, 910-2, 910-3) may be spaced apart from each other. Each of the conductive portions (910-1, 910-2, 910-3) may extend from the first side (900A) of the insulating member (900) to the second side (900B). For each of the conductive portions (910-1, 910-2, 910-3), the description provided with reference to the aforementioned conductive portions (310, 410, 610, 710, or 810) may be applied in a substantially identical or corresponding manner.

[0155] In one embodiment, each of the conductive pads (940-1, 940-2, 940-3) may be disposed on the second surface (900B) of the insulating member (900). The conductive pads (940-1, 940-2, 940-3) may be spaced apart from each other. In one embodiment, the conductive pad (940-1) may be electrically connected to the conductive portion (910-1) by making contact with the conductive portion (910-1). The conductive pad (940-2) may be electrically connected to the conductive portion (910-2) by making contact with the conductive portion (910-2). The conductive pad (940-3) may be electrically connected to the conductive portion (910-3) by making contact with the conductive portion (910-3). Although not shown, each of the conductive pads (940-1, 940-2, 940-3) may be electrically connected to each of the conductive pads (e.g., the conductive region (352) of FIG. 3A) on a printed circuit board (e.g., the printed circuit board (350) of FIG. 3A). Accordingly, multiple electrical paths may be provided by the connecting member (930).

[0156] Fig. 10a is a flowchart illustrating a method for manufacturing a connecting member according to one embodiment. Figs. 10b and 10c illustrate the arrangement of conductive particles according to one embodiment.

[0157] Referring to FIGS. 10A, 10B, and 10C, a method for manufacturing a connecting member according to an embodiment will be described. The following manufacturing method is described with reference to the example of the connecting member (630) of FIG. 6A, which has a conductive portion (610) formed of three layers. However, the manufacturing method described below can be applied to a connecting member having a conductive portion (310) formed of one layer or a conductive portion (410) formed of two layers with the same or corresponding mechanism. In FIGS. 10A, 10B, and 10C, the insulating member (500) is described as being formed of silicon, but this is only for the convenience of explanation and the material of the insulating member is not limited to silicon.

[0158] Referring to FIG. 10a, in operation 1010, liquid silicone can be prepared. For example, liquid silicone, which is a material for an insulating member (500), can be prepared.

[0159] In operation 1020, conductive particles of each layer may be injected into the liquid silicon. For example, conductive particles of each layer of the conductive portion (610) may be injected into the liquid silicon. For example, referring to FIG. 10B, first conductive particles (1061) corresponding to the first portion (411) of the conductive portion (610) (e.g., the first plurality of conductive particles (361) of FIG. 3A), second conductive particles (1062) corresponding to the second portion (412) (e.g., the second plurality of conductive particles (362) of FIG. 3A), and third conductive particles (1063) corresponding to the third portion (613) (e.g., the first plurality of conductive particles (361) of FIG. 3A)) may be injected into the liquid silicon. Accordingly, as illustrated in FIG. 10b, the first, second, and third conductive particles (1061, 1062, 1063) can be arranged in a disorderly manner within the liquid silicon (1027).

[0160] In operation 1030, the conductive particles can be aligned layer by layer using magnetism. For example, by applying a magnetic field to the liquid silicon into which the conductive particles are injected, the conductive particles can be aligned according to magnetism. For example, referring to FIG. 10c, a magnetic field can be applied to the upper and lower portions of the liquid silicon (1027). By the applied magnetic field, the conductive particles (1061, 1062, 1063) can be aligned according to magnetism. For example, the arrangement of the conductive particles (1061, 1062, 1063) can be controlled by controlling the size of the core particles (e.g., nickel) of the conductive particles (1061, 1062, 1063), which are ferromagnetic, and the thickness of the plating of gold or silver, which is a diamagnetic material formed on the surface of the core particles. In FIG. 10c, by making the diameters of the core particles of the first conductive particles (1061) and the third conductive particles (1063) relatively large and making the thickness of the plating layer relatively thin, the first conductive particles (1061) and the third conductive particles (1063) can be arranged adjacent to the upper and lower portions of the liquid silicon (1027) to which a magnetic field is applied. In addition, by making the diameters of the core particles of the second conductive particles (1062) relatively small and making the thickness of the plating layer relatively thick, the second conductive particles (1062) can be arranged inside the liquid silicon (1027) between the first conductive particles (1061) and the third conductive particles (1063). By controlling the size of the core particles and the thickness of the plating layer as described above, not only the arrangement of the conductive particles but also the proportion of gold-plated particles can be reduced and the proportion of silver-plated particles can be increased. Accordingly, the manufacturing cost of the connecting member (630) can be reduced and low repulsive force can be formed.

[0161] In operation 1040, the silicon can be cured. Accordingly, the state in which the conductive particles (1061, 1062, 1063) are arranged in operation 1030 can be fixed. At this time, by manufacturing the shape of the jig frame itself for curing the silicon in a step shape or a trapezoidal shape and using this to mold the silicon, a step shape like the insulating member (500) of FIG. 5A or a trapezoidal shape like the insulating member (500) of FIG. 5C can be formed.

[0162] Although not shown, after operation 1040, a conductive pad (640) can be placed on the second side (500B) of the insulating member (500).

[0163] In one embodiment, an electronic device (e.g., electronic device (200) of FIG. 2B) may include a printed circuit board (e.g., printed circuit board (350) of FIG. 3A) including a conductive region (e.g., conductive region (352) of FIG. 3A), an electrical connection member (e.g., connection members (230, 330, 430, 530, 630, 830, or 930)) disposed on the printed circuit board and in contact with the conductive region, and a counterpart (e.g., counterpart (390) of FIG. 3A) electrically connected to the conductive region of the printed circuit board via the electrical connection member. The electrical connection member disposed between the printed circuit board and the counterpart comprises an insulating member (e.g., insulating members (300, 500, 800, or 900)) having a first surface facing the counterpart (e.g., first surfaces (300A, 500A, 800A, or 900A)) and a second surface opposite to the first surface and facing the printed circuit board (e.g., second surfaces (300B, 500B, 800B, or 900B)), a conductive pad (e.g., conductive pads (340, 640, 940-1, 940-2, or 940-3)) disposed on the second surface of the insulating member and in contact with the conductive area of ​​the printed circuit board, and a first conductive portion (e.g., do) electrically connected to the counterpart and extending from the first surface of the insulating member toward the conductive pad. The insulating member may include a first portion (411) of Fig. 4), and a second conductive portion (e.g., the second portion (412) of Fig. 4) extending from the first conductive portion to the second surface of the insulating member and electrically connected to the conductive pad. The first conductive portion may include a first plurality of conductive particles coated with a first conductive metal (e.g., the first plurality of conductive particles (361) of Fig. 3a). The second conductive portion may include a second plurality of conductive particles coated with a second conductive metal (e.g., the second plurality of conductive particles (362) of Fig. 3a).The second conductive metal may be different from the first conductive metal and may have higher electrical conductivity than the first conductive metal.

[0164] In one embodiment, the first conductive metal may include gold, and the second conductive metal may include silver or copper.

[0165] In one embodiment, the thickness of the second conductive metal coated on the second plurality of conductive particles may be thinner than the thickness of the first conductive metal coated on the first plurality of conductive particles.

[0166] In one embodiment, the average diameter of the second plurality of conductive particles may be smaller than the average diameter of the first plurality of conductive particles.

[0167] In one embodiment, the first thickness of the first conductive portion may be smaller than the second thickness of the second conductive portion. The first thickness and the second thickness may be lengths based on a direction perpendicular to the first surface of the insulating member.

[0168] In one embodiment, the first surface of the insulating member may include a first region formed by the first conductive portion (e.g., the first region (A1) of FIG. 5A) and a second region extending from an outer edge of the first region to an outer edge of the first surface (e.g., the second region (A2) of FIG. 5A). The second surface of the insulating member may include a first region formed by the second conductive portion (e.g., the first region (B1) of FIG. 5A) and a second region extending from an outer edge of the first region of the second surface to an outer edge of the second surface (e.g., the second region (B2) of FIG. 5A). An area of ​​the second region of the first surface may be smaller than an area of ​​the second region of the second surface.

[0169] In one embodiment, the insulating member may include a first portion (e.g., the first portion (501) of FIG. 5A) extending from the second region of the first surface toward the second surface so as to surround at least a portion of the first conductive portion, and a second portion (e.g., the second portion (502) of FIG. 5A) extending from the first portion to the second region of the second surface so as to surround at least a portion of the second conductive portion. A thickness of the first portion may be smaller than a thickness of the second portion. The thicknesses of the first portion and the second portion may be lengths based on a direction parallel to the first surface.

[0170] In one embodiment, the insulating member may include side surfaces (C1, C2) extending from the outer edge of the first side to the outer edge of the second side and formed by the first portion and the second portion. The side surface (C2) of the second portion may protrude outwardly of the insulating member more than the side surface (C1) of the first portion.

[0171] In one embodiment, the insulating member may include a side surface (e.g., side surfaces (300C, 500C, 800C, or 900C)) extending from the outer edge of the first surface to the outer edge of the second surface. A cross-sectional shape of the insulating member along a surface perpendicular to the first surface may include a trapezoidal shape in which the side surface is inclined.

[0172] In one embodiment, the electrical connection member may include a third conductive portion (e.g., the third conductive portion (613) of FIG. 6A) extending from the second conductive portion to the conductive area of ​​the printed circuit board so as to penetrate the conductive pad. The third conductive portion may include a third plurality of conductive particles coated with a third conductive metal.

[0173] In one embodiment, the third conductive metal may include gold.

[0174] In one embodiment, the insulating member may include silicone.

[0175] In one embodiment, the first conductive portion may be in direct contact with the counterpart.

[0176] In one embodiment, the electronic device may include another conductive pad interposed between the counterpart and the first conductive portion.

[0177] In one embodiment, the electronic device may include a housing (e.g., housing (210) of FIG. 2A) that accommodates the printed circuit board and includes a conductive portion. The counterpart may include the conductive portion of the housing.

[0178] In one embodiment, the conductive region of the printed circuit board can be soldered to the conductive pad of the electrical connecting member.

[0179] In one embodiment, the conductive region of the printed circuit board can be welded to the conductive pad of the electrical connecting member.

[0180] In one embodiment, the printed circuit board may include a shield can disposed on one surface of the printed circuit board and including the conductive region.

[0181] In one embodiment, an electronic device (e.g., electronic device (200) of FIG. 2B) may include a printed circuit board (e.g., printed circuit board (350) of FIG. 3A) including one surface having a conductive region (e.g., conductive region (352) of FIG. 3A), an electrical connection member (e.g., connection members (230, 330, 430, 530, 630, 830, or 930)) disposed on the one surface of the printed circuit board so as to contact the conductive region, and a counterpart (e.g., counterpart (390) of FIG. 3A) electrically connected to the conductive region of the printed circuit board via the electrical connection member. The electrical connection member disposed between the printed circuit board and the counterpart comprises an insulating member (e.g., insulating members (300, 500, 800, or 900)) having a first surface facing the counterpart (e.g., first surfaces (300A, 500A, 800A, or 900A)) and a second surface opposite to the first surface and facing the one surface of the printed circuit board (e.g., second surfaces (300B, 500B, 800B, or 900B)), a conductive pad disposed on the second surface of the insulating member (e.g., conductive pads (340, 640, 940-1, 940-2, or 940-3)), a first conductive portion (e.g., first surface of FIG. 4) electrically connected to the counterpart and extending from the first surface of the insulating member toward the second surface The electrical connection member may include a first conductive portion (e.g., the second portion (412) of FIG. 4) extending from the first conductive portion to the conductive area of ​​the printed circuit board. The second conductive portion may include a portion penetrating the conductive pad and protruding outside the conductive pad. The electrical connection member may include an adhesive member (e.g., the adhesive member (770) of FIG. 7b) surrounding the protruding portion of the second conductive portion and interposed between the conductive pad and the one surface of the printed circuit board.The first conductive portion may include a first plurality of conductive particles coated with a first conductive metal (e.g., the first plurality of conductive particles (361) of FIG. 3A). The second conductive portion may include a second plurality of conductive particles coated with a second conductive metal (e.g., the second plurality of conductive particles (362) of FIG. 3A). The second conductive metal may be different from the first conductive metal and may have a lower electrical resistance than the first conductive metal.

[0182] In one embodiment, a conductive gasket (e.g., connecting members (230, 330, 430, 530, 630, 830, or 930)) comprises an insulating sheet (e.g., insulating members (300, 500, 800, or 900)) having a first side (e.g., first sides (300A, 500A, 800A, or 900A)) and a second side (e.g., second sides (300B, 500B, 800B, or 900B)) opposite the first side, a conductive pad (e.g., conductive pads (340, 640, 940-1, 940-2, or 940-3)) disposed on the second side of the insulating member, a first conductive pad extending from the first side of the insulating sheet toward the conductive pad. The insulating sheet may include a first conductive portion (e.g., a first portion (411) of FIG. 4), and a second conductive portion (e.g., a second portion (412) of FIG. 4) extending from the first conductive portion to the second surface of the insulating sheet and in contact with the conductive pad. The first conductive portion may include a first plurality of conductive particles plated with a first conductive metal (e.g., a first plurality of conductive particles (361) of FIG. 3A). The second conductive portion may include a second plurality of conductive particles plated with a second conductive metal (e.g., a second plurality of conductive particles (362) of FIG. 3A). The second conductive metal may be different from the first conductive metal and may have higher electrical conductivity than the first conductive metal. The second plurality of conductive particles may have a smaller average diameter than the first plurality of conductive particles.

[0183] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to the embodiments disclosed in this document are not limited to the aforementioned devices.

[0184] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another component (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0185] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0186] Various embodiments of the present document may be implemented as software (e.g., a program (140)) including one or more commands stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one command among the one or more commands stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one command called. The one or more commands may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0187] According to one embodiment, the method according to the various embodiments disclosed in the present document may be provided as included in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) via an application store (e.g., Play Store™) or directly between two user devices (e.g., smart phones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0188] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

Claims

1. In electronic devices, A printed circuit board comprising a challenging area; An electrical connecting member disposed on the printed circuit board and in contact with the conductive area; and A counterpart electrically connected to the conductive area of ​​the printed circuit board through the electrical connecting member, The electrical connecting member disposed between the printed circuit board and the counterpart comprises: An insulating member comprising a first side facing the counterpart and a second side opposite to the first side and facing the printed circuit board; A conductive pad disposed on the second surface of the insulating member and in contact with the conductive area of ​​the printed circuit board; a first conductive portion electrically connected to said counterpart and extending from said first surface of said insulating member toward said conductive pad; and A second conductive portion extending from the first conductive portion to the second surface of the insulating member and electrically connected to the conductive pad, The first conductive portion comprises a first plurality of conductive particles coated with a first conductive metal, The second conductive portion comprises a second plurality of conductive particles coated with a second conductive metal, The second conductive metal is different from the first conductive metal and has higher electrical conductivity than the first conductive metal. Electronic devices.

2. In claim 1, The above first challenging metal comprises gold, The second conductive metal comprises silver or copper. Electronic devices.

3. In claim 1 or claim 2, The thickness of the second conductive metal coated on the second plurality of conductive particles is thinner than the thickness of the first conductive metal coated on the first plurality of conductive particles. Electronic devices.

4. In any one of claims 1 to 3, The average diameter of the second plurality of conductive particles is smaller than the average diameter of the first plurality of conductive particles. Electronic devices.

5. In any one of claims 1 to 4, The first thickness of the first conductive portion is smaller than the second thickness of the second conductive portion, The first thickness and the second thickness are lengths based on a direction perpendicular to the first surface of the insulating member. Electronic devices.

6. In any one of claims 1 to 5, The first surface of the above insulating member is, A first region formed by the first conductive portion and a second region extending from an outer edge of the first region to an outer edge of the first surface, The second side of the above insulating member is, A first region formed by the second conductive portion and a second region extending from an outer edge of the first region of the second surface to an outer edge of the second surface, The area of ​​the second region of the first surface is smaller than the area of ​​the second region of the second surface. Electronic devices.

7. In claim 6, The above insulating material is, a first portion extending from the second region of the first surface toward the second surface, so as to surround at least a portion of the first challenging portion; and A second portion extending from the first portion to the second area of ​​the second surface, so as to surround at least a portion of the second challenging portion, The thickness of the above first part is smaller than the thickness of the above second part, The thicknesses of the first part and the second part are lengths based on the direction parallel to the first surface. Electronic devices.

8. In claim 7, The above insulating material is, A side surface extending from the outer edge of the first surface to the outer edge of the second surface and formed by the first portion and the second portion, The side surface of the second part protrudes outwardly from the insulating member more than the side surface of the first part. Electronic devices.

9. In any one of claims 1 to 8, The above insulating material is, Including a side extending from the outer edge of the first surface to the outer edge of the second surface, The cross-sectional shape of the insulating member along a plane perpendicular to the first surface includes a trapezoidal shape with the side surface inclined. Electronic devices.

10. In any one of claims 1 to 9, The above electrical connection absence is, A third conductive portion extending from the second conductive portion to the conductive area of ​​the printed circuit board, so as to penetrate the conductive pad, The third conductive portion comprises a third plurality of conductive particles coated with a third conductive metal. Electronic devices.

11. In claim 10, An electronic device wherein the third challenging metal comprises gold.

12. In any one of claims 1 to 11, The above insulating material comprises silicon. Electronic devices.

13. In any one of claims 1 to 12, The above first challenging portion is in direct contact with the counterpart, Electronic devices.

14. In any one of claims 1 to 12, comprising another conductive pad interposed between said counterpart and said first conductive portion; Electronic devices.

15. In any one of claims 1 to 14, A housing comprising: a printed circuit board accommodating the printed circuit board and including a conductive portion; The said counterpart comprises the said conductive portion of the said housing, Electronic devices.

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