Frasera radiator with printed circuit board (PCB) feed structure

Abstract

A Fraser a radiator with printed circuit board (PCB) feed structure is disclosed. According to one aspect, a Frasera radiator includes a feed structure comprising at least one printed circuit board, PCB, each PCB having configured thereon two pairs of conducting traces, each conducting trace of a pair being on opposite sides of the PCB to form a balanced coupled transmission line (BCTL). The Frasera radiator includes four petals, each petal lying in a different one of four quadrants of a first plane that is perpendicular to a second plane of the at least one PCB, each petal being configured to be soldered or capacitively coupled to a different conducting trace configured on the at least one PCB board.

Description

[0001] FRASERA RADIATOR WITH PRINTED CIRCUIT BOARD (PCB) FEED STRUCTURE

[0002] TECHNICAL FIELD

[0003] The present disclosure relates to wireless communications, and in particular, to a Fraser antenna radiator having a printed circuit board (PCB) feed structure.

[0004] BACKGROUND

[0005] The Third Generation Partnership Project (3GPP) has developed and is developing standards for Fourth Generation (4G) (also referred to as Long Term Evolution (LTE)) and Fifth Generation (5G) (also referred to as New Radio (NR)) wireless communication systems. Such systems provide, among other features, broadband communication between network nodes, such as base stations, and mobile wireless devices (WD), as well as communication between network nodes and between WDs. The 3GPP is also developing standards for Sixth Generation (6G) wireless communication networks.

[0006] The requirements for antennas for 5G / 6G beamforming are very stringent. One aspect to good array performance is good antenna radiators. The antenna radiators must not only have good electrical performance but must also have very low weight as there are many radiators needed in large 5G / 6G array antennas.

[0007] Radiator spacing close to or lower than half a wavelength is needed for 5G / 6G antenna array beamforming applications to avoid significant performance degradation resulting from grating lobes. Also needed for 5G / 6G antenna array beamforming applications are small pattern deviations between radiators as well as good polarization, isolation and coupling properties.

[0008] In addition, larger bandwidths are needed for 5G / 6G antenna arrays as the number of bands and the frequency range of new bands continues to grow. A mechanical solution that is cost effective, sturdy with good manufacturing yield is required, while meeting antenna array radio frequency (RF) performance requirements.

[0009] Radiators that have been designed for technologies prior to 5G / 6G have a number of radiators in a column with spacing between radiators much greater than half a wavelength (0.7 to 0.85 wavelengths are typical) and typically have either one column or two columns with spacing much greater than half a wavelength. This is done in pre- 5G / 6G antennas to maximize antenna gain with a minimum number of radiators. Overmolded AAS Antenna Radiators have very good RF performance and are very accurate and mechanically stable. However, overmolding manufacturing costs are high and dielectric material costs are a challenge. Also, known PCB-fed Frasera radiators have a complicated balun as part of the feed structure which affects bandwidth and performance.

[0010] SUMMARY

[0011] Some embodiments advantageously provide a Fraser radiator with a printed circuit board (PCB) feed structure. The Frasera Antenna Radiator disclosed herein is small, symmetrical, light-weight and of high efficiency for optimal performance in 5G / 6G two- dimensional antenna arrays with spacing on the order of half a wavelength. Such arrays may be employed for mobile communication frequencies in use today as well as frequencies to be used in the future.

[0012] In some embodiments, a metal feed structure and overmolded support is replaced by a one PCB or two PCBs with a balanced coupled transmission line (BCTL) feed structure. When two PCBs are used to construct the feed structure, the PCBs may be slotted and form a support structure for the metal dipole petals. The structure may be secured by an optional plastic clip, in some embodiments.

[0013] Embodiments, may be employe simplify the design and reduce the cost of the overall antenna system. A conducting traces on a single or dual PCB feed structure may be soldered or capacitively coupled to connectors of the dipole petals. A PCB have slanted conducting traces, which may improve the adjacent radiating element spacings and overall antenna performance.

[0014] According to one aspect, a Frasera radiator is provided. The Frasera radiator includes a feed structure comprising at least one printed circuit board, PCB, each PCB having configured thereon two pairs of conducting traces, each conducting trace of a pair being on opposite sides of the PCB to form a balanced coupled transmission line, BCTL. The Frasera radiator includes four petals, each petal lying in a different one of four quadrants of a first plane that is perpendicular to a second plane of the at least one PCB, each petal being configured to be soldered or capacitively coupled to a different conducting trace configured on the at least one PCB board.

[0015] According to this aspect, in some embodiments, the feed structure includes two orthogonal PCBs, each orthogonal PCB having configured thereon two pairs of conducting traces, each pair of the two pairs forming a BCTL and being electrically coupled to a different one of the four petals. In some embodiments, each petal of the four petals includes a connector configured to be soldered or capacitively coupled to a conducting trace of a different pair of conducting traces. In some embodiments, a first conducting trace of each pair of conducting traces includes a crossover to conduct a signal from one side of a PCB that is in proximity to a first petal to another side of the PCB that is in proximity to a second petal opposite the first petal. In some embodiments, a first PCB of the two orthogonal PCBs is configured with a long slot configured to receive the second PCB of the two orthogonal PCBs. In some embodiments, the second PCB of the two orthogonal PCBs is configured with a short slot configured to receive the first PCB. In some embodiments, a first conducting trace of a pair of conducting traces is configured to be in electrical communication with a transmission line that is parallel to the first plane. In some embodiments, a second conducting trace of the pair of conducting traces is terminated in a ground plane that is parallel to the first plane. In some embodiments, the feed structure includes a single PCB, each trace of the two pairs of conducting traces configured on the single PCB being configured to connect to a different one of the four petals. In some embodiments, a direction of at least one pair of conducting traces forms an acute angle with respect to the first plane.

[0016] According to another aspect, a Frasera radiator includes four petals, each petal lying in a different quadrant of a first plane. The Frasera radiator also includes a printed circuit board, PCB, lying in second plane normal to the first plane, the PCB having a first pair of conducting traces and a second pair of conducting traces, each pair of conducting traces configured to form a balanced coupled transmission line, the first pair of conducting traces being electrically coupled to first and second petals of the four petals and the second pair of conducting traces being electrically coupled to third and fourth petals of the four petals.

[0017] According to this aspect, in some embodiments, a first petal includes a first connector configured to be soldered or capacitively coupled to a first conducting trace of the first pair of conducting traces and wherein a second petal includes a second connector configured to be soldered or capacitively coupled to a first conducting trace of the second pair of conducting traces. In some embodiments, a third petal includes a third connector configured to be soldered or capacitively coupled to a second conducting trace of the first pair of conducting traces and wherein a fourth petal includes a fourth connector configured to be soldered or capacitively coupled to a second conducting trace of the second pair of conducting traces. In some embodiments, the first connector crosses over the second connector. In some embodiments, the first petal is adjacent to the second petal. In some embodiments, the first conducting trace of the first pair of conducting traces and the first conducting trace of the second pair of second conducting traces are on a first side of the PCB. In some embodiments, the first conducting trace of the first pair of conducting traces is configured to be in electrical communication with a transmission line that is parallel to the first plane. In some embodiments, a second conducting trace of the first pair of conducting traces is terminated in a ground plane that is parallel to the first plane. In some embodiments, a direction of at least one pair of the first and second pairs of conducting traces forms an acute angle with respect to the first plane. In some embodiments, conducting traces on a same side of the PCB are parallel.

[0018] BRIEF DESCRIPTION OF THE DRAWINGS

[0019] A more complete understanding of the present embodiments, and the attendant advantages and features thereof, will be more readily understood by reference to the following detailed description when considered in conjunction with the accompanying drawings wherein:

[0020] FIG. 1 is a first illustration of a Fraser radiator with printed circuit board (PCB) feed structure configured according to principles disclosed herein;

[0021] FIG. 2 is a close-in view of an example dual PCB feed structure for a Frasera radiator constructed according to principles disclosed herein;

[0022] FIG. 3 is a perspective view of an upper end of a dual PCB structure constructed according to principles disclosed herein;

[0023] FIG. 4 is a perspective view of the dual PCB structure constructed according to principles disclosed herein;

[0024] FIG. 5 is a side view of a first side of a first PCB of the dual PCB structure;

[0025] FIG. 6 is a side view of the second side of the first PCB of the dual PCB structure; FIG. 7 is a side view of a first side of the second PCB of the dual PCB structure;

[0026] FIG. 8 is a side view of the second side of the second PCB of the dual PCB structure;

[0027] FIG. 9 is a perspective view of a Fraser radiator with a single PCB feed structure constructed according to principles disclosed herein;

[0028] FIG. 10 is a close-in view of an example single PCB feed structure constructed according to principles disclosed herein; FIG. 11 is another close-in view of the example single PCB feed structure shown in FIG. 10;

[0029] FIG. 12 is a side view of either side of an example PCB that may be used in the single PCB feed structure shown in FIGS. 10 and 11; and

[0030] FIG. 13 is a side view of a slanted conducting trace that may be used in slanted feed structure according to principles disclosed herein.

[0031] DETAILED DESCRIPTION

[0032] Before describing in detail example embodiments, it is noted that the embodiments reside primarily in combinations of apparatus components and processing steps related to a Fraser radiator with printed circuit board (PCB) feed structure Accordingly, components have been represented where appropriate by conventional symbols in the drawings, showing only those specific details that are pertinent to understanding the embodiments so as not to obscure the disclosure with details that will be readily apparent to those of ordinary skill in the art having the benefit of the description herein.

[0033] As used herein, relational terms, such as “first” and “second,” “top” and “bottom,” and the like, may be used solely to distinguish one entity or element from another entity or element without necessarily requiring or implying any physical or logical relationship or order between such entities or elements. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the concepts described herein. As used herein, the singular forms “a”, “an” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms “comprises,” “comprising,” “includes” and / or “including” when used herein, specify the presence of stated features, integers, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof.

[0034] In embodiments described herein, the joining term, “in communication with” and the like, may be used to indicate electrical or data communication, which may be accomplished by physical contact, induction, electromagnetic radiation, radio signaling, infrared signaling or optical signaling, for example. One having ordinary skill in the art will appreciate that multiple components may interoperate and modifications and variations are possible of achieving the electrical and data communication. In some embodiments described herein, the term “coupled,” “connected,” and the like, may be used herein to indicate a connection, although not necessarily directly, and may include wired and / or wireless connections.

[0035] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the concepts described herein. As used herein, the singular forms “a”, “an” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms “comprises,” “comprising,” “includes” and / or “including” when used herein, specify the presence of stated features, integers, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof.

[0036] Note further, that functions described herein as being performed by a wireless device or a network node may be distributed over a plurality of wireless devices and / or network nodes. In other words, it is contemplated that the functions of the network node and wireless device described herein are not limited to performance by a single physical device and, in fact, may be distributed among several physical devices.

[0037] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. It will be further understood that terms used herein should be interpreted as having a meaning that is consistent with their meaning in the context of this specification and the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

[0038] A Frasera antenna radiator with a PCB feed structure is a more cost-effective solution for the Frasera Ultra- wide band antenna radiator without sacrificing RF performance. The feed structure on the PCBs is a balanced coplanar transmission line (BCTL) that does not require a balun and is therefore easier to design and implement with good wideband RF performance as compared to known Frasera radiators.

[0039] Using a simplified feed to a balanced coplanar transmission line (BCTL) helps to reduce PCB size by more than 70% which may significantly reduce costs of an antenna and reduces the weight of the antenna system.

[0040] In some embodiments, a side fed radiator may improve the isolation and improve radiation pattern of the antenna in an array. Slanted feed or side fed radiators may reduce the cross-band interference in a multiband antenna environment by increasing the separation between the closely spaced radiating elements. In some embodiments, more space is available on the PCBs (as compared with other arrangements) to implement other components such as filters to suppress inter or intra band harmonics or resonances.

[0041] Embodiments disclosed herein help conserve the environment by reducing the amount of PCB material to implement the radiator. This also helps to reduce CO2 footprint of the antenna systems on the environment.

[0042] Referring now to the drawing figures, in which like elements are referred to by like reference numerals, there is shown in FIG. 1 an example of a Frasera radiator 2 with a PCB feed structure configured according to principles disclosed herein. The Frasera radiator 2 includes a first pair of metal dipole petals 4a, 4b and a second pair of metal dipole radiators 6a, 6b. The Frasera radiator 2 include an isolation fence 8 and a ground plane 9. The petals 4a, 4b, 6a and 6b may be configured to lie in a plane that is parallel to the ground plane 9.

[0043] In the example of FIG. 1, the four petals 4a, 4b, 6a and 6b are connected through a first feed printed circuit board, PCB 10, and a second feed PCB 12 using balanced coplanar transmission lines (BCTE) 14 and 16. The two PCBs 14, 16 are slotted into each other at 90 degrees and may form a feed structure 18 that may be mechanically integrated with the four petals 4a, 4b, 6a and 6b. The PCBs 10 and 12 may be configured to be orthogonal to each other and orthogonal to the ground plane. In some embodiments, the PCBs 10, 12 may be slotted along a center axis of both PCBs 10, 12, such that the center axis of PCBs 10, 12 coincide with a center axis of the Frasera radiator 2.

[0044] FIG. 2 is a close-in view of the upper portion of the feed structure 18 formed by PCBs 14 and 16. PCB 10 has a first conducting trace 20 of a first pair of conducting traces that are in electrical communication with petals 6a and 6b. PCB 12 has a second conducting trace 22 of a second pair of conducting traces that are in electrical communication with petals 4a and 4b.

[0045] FIG. 3 is a detailed view of the upper portion of the feed structure 18 formed by PCBs 10 and 12. The petals 4a, 4b, 6a and 6b are not shown in FIG. 3. The first conducting trace 20 may be soldered or capacitively coupled to a corresponding petal 6a, 6b in an area 24 where the first conducting trace 20 of the first pair of conducting traces terminates in an area of the corresponding petal 6a, 6b. Similarly, the second conducting trace 22 of the second pair of conducting traces may be soldered or capacitively coupled to a corresponding petal 4a, 4b in an area 26 where the second conducting trace 22 terminates in an area of the corresponding petal 4a, 4b. The first conducting trace 20 may include a first crossover 28 to conduct a signal from one side of the PCB 10 that is close to a first petal of the corresponding petals 6a, 6b to the other side of the PCB 10 that is close to the second petal of the corresponding petals 6a, 6b. Similarly, the second conducting trace 22 may include a second crossover 30 to conduct a signal from one side of the PCB 12 that is close to a first petal of the corresponding petals 4a, 4b to the other side of the PCB 12 that is close to the second petal of the corresponding petals 4a, 4b.

[0046] On each of the two sides of the PCB 10 are conducting traces 32a and 32b that mirror each other to form the first balanced coupled transmission line BCTL 14. On each side of PCB 12 are conducting traces 34a and 34b that mirror each other to form the second balanced coupled transmission line BCTL 16. The first conducting trace 20 includes or is electrically connected to conducting trace 32a and the second conducting trace 22 includes or is electrically connected to conducting trace 34a.

[0047] A perspective view of the feed structure 18 formed by PCBs 10 and 12 is shown in FIG. 4. FIG. 4 shows the two PCBs 10 and 12 at right angles to each other. In this example, the PCB 10 has a short slot configured to receive an upper end of the PCB 12. The short slot is shown in FIGS. 5 and 6. The PCB 12 has a long slot configured to receive the body of the PCB 10. The long slot is shown in FIGS. 7 and 8. At a base of the PCBs 10 and 12 are electrical conductors 35 which provide signal communication between a corresponding petal 4a, 4b, 6a, 6b and a transmission line structure that includes electrical conductors 35. In some embodiments, a petal 4a, 6a may be connected to electrical conductors 35 whereas petal 4b, 6b is connected to electrical ground. Thus, in some embodiments, a first conducting trace 32a of a pair of conducting traces may be in electrical communication with a transmission line that includes an electrical conductor 35 and a second conducting trace 32b of the pair of conducting traces may be in electrical communication with the ground plane 9.

[0048] FIG. 5 is a side view of a first face of the PCB 10 showing the short slot 36 that is configured to receive the upper end of the PCB 12. FIG. 6 is a side view of the opposite face of the PCB 10. FIG. 7 is a side view of a first face of the PCB 12 showing the long slot 38 that is configured to receive the body of the PCB 10. FIG. 8 is a side view of the opposite face of the PCB 12.

[0049] FIG. 9 is another example of a Frasera radiator 2 with petals 4a, 4b, 6a and 6b and an alternative feed structure 40. The petals 4a, 4b, 6a and 6b includes connectors 42. The connectors 42 and PCB 44 form the feed structure 40. The PCB 44 has conducting traces 46 that are configured to be soldered or capacitively coupled to corresponding connectors 42. For each conducting trace 46 on one side of the PCB 44, there is a corresponding trace 46 on the other side of the PCB 44 to form a balanced coupled transmission line.

[0050] FIG. 10 is a close-in view of the feed structure 40. A first connector 42a connects the petal 6a to a first coupling structure 48a that is configured to be soldered or capacitively coupled to a first conducting trace 46a of the PCB 44. A second connector 42b connects the petal 4b to a second coupling structure 48b that is configured to be soldered or capacitively coupled to a second conducting trace 46b on the PCB 44. The first connector 42a passes under the second connector 42b. FIG. 11 is another close-in view of the feed structure 40. Petals 4a and 6b are configured with third and fourth connectors 42c and 42d, respectively. Third connector 42c may be soldered or capacitively coupled to a third conducting trace 46c via a third coupling structure 48c and the fourth connector 42d may be soldered or capacitively coupled to a fourth conducting trace 46d via a fourth coupling structure 48d.

[0051] FIG. 12 shows one side of the PCB 44 with a first conducting trace 46 a and a second conducting trace 46b. Each conducting trace 46 is connected at a base of the PCB 44 to an electrical conductor 50, such as a stripline or microstrip, that provides signal communication to the petals 4a and 6b or 4b and 6a of the Frasera radiator 2. An opposite side of the PCB 44 may be configured to be identical to the side of the PCB 44 shown in FIG. 12. FIG. 13 is a slant PCB 52 that has, instead of a straight conducting trace, a slanted conducting trace 54, with a corresponding slanted conducting trace on an opposite side of the slant PCB 52 that mirrors the slanted conducting trace 54. The slanted conducting trace 54 may be implemented in sheet metal as part of the petals, 4a, 4b, 6a and 6b.

[0052] In some embodiments, an optional mechanical clip may be used to support join and / or align the petals 4a, 4b, 6a and 6b with the PCB(s) 10, 12, 44, 52.

[0053] It will be appreciated by persons skilled in the art that the embodiments described herein are not limited to what has been particularly shown and described herein above. In addition, unless mention was made above to the contrary, it should be noted that all of the accompanying drawings are not to scale. A variety of modifications and variations are possible in light of the above teachings without departing from the scope of the following claims.

Claims

What is claimed is:

1. A Frasera radiator (2), comprising: a feed structure (18, 40) comprising at least one printed circuit board, PCB (10, 12, 44, 52), each PCB (10, 12, 44, 52) having configured thereon two pairs of conducting traces (20, 22, 32, 34, 46, 54), each conducting trace (20, 22, 32, 34, 46, 54) of a pair being on opposite sides of the PCB (10, 12, 44, 52) to form a balanced coupled transmission line, BCTL; and four petals (4, 6), each petal (4, 6) lying in a different one of four quadrants of a first plane that is perpendicular to a second plane of the at least one PCB (10, 12, 44, 52), each petal (4, 6) being configured to be soldered or capacitively coupled to a different conducting trace (20, 22, 32, 34, 46, 54) configured on the at least one PCB (10, 12, 44, 52).

2. The Frasera radiator (2) of Claim 1, wherein the feed structure (18, 40) includes two orthogonal PCBs (10, 12, 44, 52), each orthogonal PCB (10, 12, 44, 52) having configured thereon two pairs of conducting traces (20, 22, 32, 34, 46, 54), each pair of the two pairs forming a BCTL and being electrically coupled to a different one of the four petals (4, 6).

3. The Frasera radiator (2) of Claim 2, wherein each petal (4, 6) of the four petals (4, 6) includes a connector configured to be soldered or capacitively coupled to a conducting trace (20, 22, 32, 34, 46, 54) of a different pair of conducting traces (20, 22, 32, 34, 46, 54).

4. The Frasera radiator (2) of any of Claims 2 and 3, wherein a first conducting trace (20, 22, 32, 34, 46, 54) of each pair of conducting traces (20, 22, 32, 34, 46, 54) includes a crossover to conduct a signal from one side of a PCB (10, 12, 44, 52) that is in proximity to a first petal (4, 6) to another side of the PCB (10, 12, 44, 52) that is in proximity to a second petal (4, 6) opposite the first petal (4, 6).

5. The Frasera radiator (2) of any of Claims 2-4, wherein a first PCB (10, 12, 44, 52) of the two orthogonal PCBs (10, 12, 44, 52) is configured with a long slotconfigured to receive the second PCB (10, 12, 44, 52) of the two orthogonal PCBs (10, 12, 44, 52).

6. The Frasera radiator (2) of Claim 5, wherein the second PCB (10, 12, 44, 52) of the two orthogonal PCBs (10, 12, 44, 52) is configured with a short slot configured to receive the first PCB (10, 12, 44, 52).

7. The Frasera radiator (2) of any of Claims 2-6, wherein a first conducting trace (20, 22, 32, 34, 46, 54) of a pair of conducting traces (20, 22, 32, 34, 46, 54) is configured to be in electrical communication with a transmission line that is parallel to the first plane.

8. The Frasera radiator (2) of Claim 7, wherein a second conducting trace (20, 22, 32, 34, 46, 54) of the pair of conducting traces (20, 22, 32, 34, 46, 54) is terminated in a ground plane that is parallel to the first plane.

9. The Frasera radiator (2) of Claim 1, wherein the feed structure (18, 40) includes a single PCB (10, 12, 44, 52), each trace of the two pairs of conducting traces (20, 22, 32, 34, 46, 54) configured on the single PCB (10, 12, 44, 52) being configured to connect to a different one of the four petals (4, 6).

10. The Frasera radiator (2) of any of Claims 1-9, wherein a direction of at least one pair of conducting traces (20, 22, 32, 34, 46, 54) forms an acute angle with respect to the first plane.

11. A Frasera radiator (2), comprising: four petals (4, 6), each petal (4, 6) lying in a different quadrant of a first plane; and a printed circuit board, PCB (10, 12, 44, 52), lying in second plane normal to the first plane, the PCB (10, 12, 44, 52) having a first pair of conducting traces (20, 22, 32, 34, 46, 54) and a second pair of conducting traces (20, 22, 32, 34, 46, 54), each pair of conducting traces (20, 22, 32, 34, 46, 54) configured to form a balanced coupled transmission line, the first pair of conducting traces (20, 22, 32, 34, 46, 54) being electrically coupled to first and second petals (4, 6) of the four petals (4, 6) and the secondpair of conducting traces (20, 22, 32, 34, 46, 54) being electrically coupled to third and fourth petals (4, 6) of the four petals (4, 6).

12. The Frasera radiator (2) of Claim 11, wherein a first petal (4, 6) includes a first connector configured to be soldered or capacitively coupled to a first conducting trace (20, 22, 32, 34, 46, 54) of the first pair of conducting traces (20, 22, 32, 34, 46, 54) and wherein a second petal (4, 6) includes a second connector configured to be soldered or capacitively coupled to a first conducting trace (20, 22, 32, 34, 46, 54) of the second pair of conducting traces (20, 22, 32, 34, 46, 54).

13. The Frasera radiator (2) of Claim 12, wherein a third petal (4, 6) includes a third connector configured to be soldered or capacitively coupled to a second conducting trace (20, 22, 32, 34, 46, 54) of the first pair of conducting traces (20, 22, 32, 34, 46, 54) and wherein a fourth petal (4, 6) includes a fourth connector configured to be soldered or capacitively coupled to a second conducting trace (20, 22, 32, 34, 46, 54) of the second pair of conducting traces (20, 22, 32, 34, 46, 54).

14. The Frasera radiator (2) of any of Claims 12 and 13, wherein the first connector crosses over the second connector.

15. The Frasera radiator (2) of any of Claims 12-14, wherein the first petal (4, 6) is adjacent to the second petal (4, 6).

16. The Frasera radiator (2) of any of Claims 12-15, wherein the first conducting trace (20, 22, 32, 34, 46, 54) of the first pair of conducting traces (20, 22, 32, 34, 46, 54) and the first conducting trace (20, 22, 32, 34, 46, 54) of the second pair of second conducting traces (20, 22, 32, 34, 46, 54) are on a first side of the PCB (10, 12, 44, 52).

17. The Frasera radiator (2) of any of Claims 12-16, wherein the first conducting trace (20, 22, 32, 34, 46, 54) of the first pair of conducting traces (20, 22, 32, 34, 46, 54) is configured to be in electrical communication with a transmission line that is parallel to the first plane.

18. The Fraser a radiator (2) of Claim 17, wherein a second conducting trace (20, 22, 32, 34, 46, 54) of the first pair of conducting traces (20, 22, 32, 34, 46, 54) is terminated in a ground plane that is parallel to the first plane.

19. The Fraser a radiator (2) of any of Claims 11-18, wherein a direction of at least one pair of the first and second pairs of conducting traces (20, 22, 32, 34, 46, 54) forms an acute angle with respect to the first plane.

20. The Frasera radiator (2) of any of Claims 11-19, wherein conducting traces (20, 22, 32, 34, 46, 54) on a same side of the PCB (10, 12, 44, 52) are parallel.

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