Substrate processing system and substrate processing method

Abstract

This substrate processing system includes a vacuum transfer module, a control unit, a plurality of processing modules, an aligner, a storage unit, and a specification unit. The aligner includes a stage and an optical sensor. The stage is configured so that a ring member is placed on the stage. The optical sensor is configured to detect the shape of the ring member placed on the stage. The storage unit includes a table in which characteristic information is stored in association with an identifier of each of the plurality of processing modules. The characteristic information indicates the characteristics of each of the plurality of ring members. The specification unit extracts the characteristic information of the ring member from the shape of the ring member detected by the optical sensor, and refers to the table of the storage unit in order to specify a processing module, from among the plurality of processing modules, by which the ring member should be conveyed, such specification performed on the basis of the identifier stored in association with the characteristic information.

Description

Substrate processing system and substrate processing method

[0001] SUMMARY Exemplary embodiments of the present disclosure relate to a substrate processing system and method.

[0002] A substrate processing system capable of performing various processes such as plasma processing on a substrate is known. The substrate processing system includes a process module having a processing chamber and a substrate support. The substrate support is provided in the processing chamber and supports a ring member disposed thereon. Patent Document 1 listed below discloses a technique for replacing the ring member disposed on the substrate support.

[0003] Japanese Patent Application Laid-Open No. 2022-02255

[0004] The present disclosure provides a technique for identifying a process module corresponding to a ring member.

[0005] In one exemplary embodiment, a substrate processing system is provided. The substrate processing system includes a vacuum transfer module, a controller, multiple process modules, an aligner, a memory unit, and an identification unit. The vacuum transfer module includes a transfer chamber and a transfer robot. The transfer chamber is depressurizable. The transfer robot is configured to transfer a substrate through the transfer chamber. The controller is configured to control the transfer robot. The multiple process modules each include a processing chamber and a substrate support. The processing chamber is connected to the transfer chamber. The substrate support is disposed within the processing chamber. The multiple process modules are each configured to perform substrate processing on a substrate on the substrate support. The aligner includes a stage and an optical sensor. The stage is configured to have a ring member placed thereon. The optical sensor is configured to detect a shape of the ring member placed on the stage. The memory unit includes a table in which characteristic information is stored in association with identifiers of each of the multiple process modules. The characteristic information indicates characteristics of each of the multiple ring members. The identification unit extracts characteristic information of the ring member from the shape of the ring member detected by the optical sensor, and refers to a table in the memory unit to identify the process module among the multiple process modules to which the ring member should be transported from an identifier stored in association with the characteristic information.

[0006] According to one exemplary embodiment, a process module corresponding to the ring member is identified.

[0007] 1 is a diagram illustrating a substrate processing system according to an exemplary embodiment; 2 is a diagram illustrating a schematic view of a plasma processing apparatus according to an exemplary embodiment; 3 is a partially enlarged cross-sectional view of a substrate support of a plasma processing apparatus according to an exemplary embodiment; 4 is a perspective view of a stocker module according to an exemplary embodiment; 5 is an end view of a stocker module according to an exemplary embodiment; 6 is a plan view of an edge ring and an aligner according to an exemplary embodiment; 7 is a plan view of a cover ring and an aligner according to an exemplary embodiment; 8 is a flowchart illustrating a substrate processing method according to an exemplary embodiment;

[0008] Various exemplary embodiments will be described in detail below with reference to the drawings, in which the same or equivalent parts are designated by the same reference numerals.

[0009] FIG. 1 is a diagram illustrating a substrate processing system according to an exemplary embodiment. As shown in FIG. 1, the substrate processing system PS includes a vacuum transfer module VTM, a controller MC, multiple process modules PM1 to PM6, an aligner RAN, a memory unit MU, and an identification unit IU. In one embodiment, the substrate processing system PS may further include a stocker module RSM, a loader module LM, and at least one load lock module. The substrate processing system PS includes two load lock modules LL1 and LL2 as the at least one load lock module. The substrate processing system PS may further include at least one load port, a substrate inspection module CM, an aligner AN, and a storage unit SR. The substrate processing system PS includes four load ports LP1 to LP4 as the at least one load port.

[0010] The loader module LM is an example of an atmospheric transfer module. In one embodiment, the loader module LM includes a transfer chamber ACH. The transfer chamber ACH is an example of another transfer chamber. The pressure inside the transfer chamber ACH of the loader module LM can be set to atmospheric pressure. The loader module LM may include a fan filter unit (FFU). The loader module LM is, for example, an equipment front end module (EFEM). The loader module LM is disposed between each of the load ports LP1 to LP4 and each of the load lock modules LL1 and LL2. The load ports LP1 to LP4 are arranged along one of a pair of longitudinal edges of the loader module LM. The load lock modules LL1 and LL2 are arranged along the other of a pair of longitudinal edges of the loader module LM. Each of the load ports LP1 to LP4 is configured to support a cassette CST placed thereon. The cassette CST is a container that accommodates a plurality of substrates W. The cassette CST is, for example, a front-opening unified pod (FOUP).

[0011] In one embodiment, the loader module LM includes a transport robot TR3. The transport robot TR3 is an example of another transport robot. The transport robot TR3 is provided in the transport chamber ACH of the loader module LM. The transport robot TR3 may include an articulated arm AR31 and an end effector FK31. The end effector FK31 is attached to the tip of the articulated arm AR31 and is configured to support a substrate W placed thereon. The transport robot TR3 is configured to transport the substrate W through the transport chamber ACH. For example, the transport robot TR3 transports the substrate W based on an operation instruction output by a controller MC, which will be described later. The transport robot TR3 transports the substrate W between any two of the cassettes CST, the load lock modules LL1 and LL2, the aligner AN, and the storage SR, which are placed on at least one of the load ports LP1 to LP4.

[0012] The aligner AN is disposed along one of a pair of edges along the shorter direction of the loader module LM. The aligner AN may be disposed along an edge along the longer direction of the loader module LM. Alternatively, the aligner AN may be disposed within the transfer chamber ACH of the loader module LM. The aligner AN includes a stage, an optical sensor, and the like. The stage of the aligner AN is rotatable and supports the substrate W placed thereon. The aligner AN detects the angular position of a marker (e.g., a notch) of the substrate W on the stage and the center position of the substrate W on the stage using the optical sensor. The controller MC controls the rotation of the stage of the aligner AN to correct the angular position of the marker (e.g., a notch) of the substrate W on the stage to a reference angular position so as to correct the amount of deviation in the angular position of the substrate W. Furthermore, the controller MC controls the position of the end effector FK31 when the end effector FK31 receives the substrate W from the aligner AN, in order to position the center of the substrate W on a predetermined position of the end effector FK31.

[0013] The storage SR is arranged along an edge along the longitudinal direction of the loader module LM. The storage SR may be arranged along an edge along the lateral direction of the loader module LM. Alternatively, the storage SR may be provided inside the loader module LM. The storage SR is configured to accommodate substrates W therein.

[0014] The substrate inspection module CM may be provided inside the loader module LM or the vacuum transport module VTM. The substrate inspection module CM may be connected to the loader module LM below the load ports LP1 to LP4. The substrate inspection module CM is not limited to the above locations and may be installed in any location. The substrate inspection module CM is configured to acquire an image of the substrate W.

[0015] In one embodiment, the load lock modules LL1 and LL2 are connected to the loader module LM. Each of the load lock modules LL1 and LL2 and the loader module LM may be connected via a gate valve G3. In the example shown in FIG. 1, each of the load lock modules LL1 and LL2 and the vacuum transfer module VTM are connected via a gate valve G2. Each of the load lock modules LL1 and LL2 may be disposed between the vacuum transfer module VTM and the loader module LM. Each of the load lock modules LL1 and LL2 provides a preliminary decompression chamber.

[0016] The vacuum transfer module VTM includes at least one transfer chamber and at least one transfer robot. In the example shown in Figure 1, the vacuum transfer module VTM includes a transfer chamber VCH and a transfer robot TR as the at least one transfer chamber and at least one transfer robot. The transfer chamber VCH is configured to be depressurized. The transfer robot TR is configured to transfer the substrate W through the transfer chamber VCH. In one embodiment, the aligner RAN is connected to the transfer chamber VCH of the vacuum transfer module VTM.

[0017] Each of the process modules PM1 to PM6 includes a processing chamber 10 and a substrate support 16 (see FIG. 2). The processing chamber 10 is connected to a vacuum transfer module VTM. In the example shown in FIG. 1, the process modules PM1 to PM6 are connected to the vacuum transfer module VTM via a gate valve G1.

[0018] The transport robot TR may include articulated arms AR11 and AR12 and end effectors FK11 and FK12. The end effector FK11 is attached to the tip of the articulated arm AR11 and is configured to support a substrate W placed thereon. The end effector FK12 is attached to the tip of the articulated arm AR12 and is configured to support a substrate W placed thereon. For example, the transport robot TR transports the substrate W based on operation instructions output by a controller MC (described later). The transport robot TR holds the substrate W using the end effectors FK11 and FK12. The transport robot TR is configured to transport the substrate W or a ring member R between paths between the load lock modules LL1 and LL2, the process modules PM1 to PM6, and the stocker module RSM. In one embodiment, the ring member R is an edge ring ER (focus ring) or a cover ring CR. The edge ring ER is used to surround the substrate W on the substrate support 16. The cover ring CR is used to surround the edge ring ER. Details of the edge ring ER and the cover ring CR will be described later.

[0019] In one embodiment, the stocker module RSM is connected to the transfer chamber VCH of the vacuum transfer module VTM. In one example, the stocker module RSM is connected to the transfer chamber VCH via a gate valve G1. The stocker module RSM is configured to accommodate a ring member R therein. The stocker module RSM is also referred to as a ring stocker. In the example shown in FIG. 1 , the aligner RAN is disposed within the stocker module RSM. Details of the stocker module RSM and the aligner RAN will be described later.

[0020] In one embodiment, each of the process modules PM1 to PM6 is configured to perform a dedicated process on a substrate W. At least one of the process modules PM1 to PM6 is a substrate processing apparatus such as the plasma processing apparatus 1 described below.

[0021] The controller MC is configured to control each part of the substrate processing system PS. The controller MC may be a computer including a processor, a storage device, an input device, a display device, etc. The controller MC executes a control program stored in the storage device and controls each part of the substrate processing system PS based on recipe data stored in the storage device. Transfer methods according to various exemplary embodiments, which will be described later, are executed in the substrate processing system PS by the controller MC controlling each part of the substrate processing system PS. The controller MC is configured to control the transfer robots TR, TR3. The controller MC may also function as the storage unit MU and the identification unit IU. Details of the storage unit MU and the identification unit IU will be described later.

[0022] Reference will now be made to FIG. 2, which is a schematic diagram of a plasma processing apparatus according to an exemplary embodiment. The plasma processing apparatus 1 shown in FIG. 2 is employed as at least one of the process modules PM1 to PM6. The plasma processing apparatus 1 is an example of a substrate processing apparatus.

[0023] The plasma processing apparatus 1 is a capacitively coupled plasma processing apparatus. The plasma processing apparatus 1 includes a processing chamber 10. The processing chamber 10 defines an internal space 10s therein. The central axis of the internal space 10s is an axis AX extending in the vertical direction.

[0024] In one embodiment, the processing chamber 10 includes a chamber body 12. The chamber body 12 has a substantially cylindrical shape. An internal space 10s is provided within the chamber body 12. The chamber body 12 is made of, for example, aluminum. The chamber body 12 is electrically grounded. A plasma-resistant film is formed on the inner wall surface of the chamber body 12, i.e., the wall surface defining the internal space 10s. This film may be a film formed by anodizing or a ceramic film such as a film formed from yttrium oxide.

[0025] A passage 12p is formed in the sidewall of the chamber body 12. The substrate W or the ring member R passes through the passage 12p when being transferred between the processing chamber 10 and the transfer chamber VCH. A gate valve G1 is provided along the sidewall of the chamber body 12 to open and close the passage 12p.

[0026] The plasma processing apparatus 1 further includes a substrate support 16. The substrate support 16 is provided in the processing chamber 10. The substrate support 16 is configured to support a substrate W placed thereon. The substrate W has a substantially disk shape. Details of the substrate support 16 will be described later.

[0027] The plasma processing apparatus 1 may further include an upper electrode 30. The upper electrode 30 is provided above the substrate support 16. The upper electrode 30, together with a member 32, closes the upper opening of the chamber body 12. The member 32 has insulating properties. The upper electrode 30 is supported on the upper part of the chamber body 12 via this member 32.

[0028] The upper electrode 30 includes a top plate 34 and a support 36. The lower surface of the top plate 34 defines an internal space 10s. The top plate 34 is provided with a plurality of gas holes 34a. Each of the plurality of gas holes 34a penetrates the top plate 34 in the thickness direction (vertical direction) and opens toward the internal space 10s. The top plate 34 is formed of, for example, silicon. Alternatively, the top plate 34 may have a structure in which a plasma-resistant film is provided on the surface of an aluminum member. This film may be a ceramic film, such as a film formed by anodizing or a film formed from yttrium oxide.

[0029] The support 36 detachably supports the top plate 34. The support 36 is formed of a conductive material such as aluminum. The support 36 has a gas diffusion chamber 36a and a plurality of gas holes 36b formed therein. The plurality of gas holes 36b extend downward from the gas diffusion chamber 36a and communicate with the plurality of gas holes 34a, respectively. The support 36 has a gas introduction port 36c. The gas introduction port 36c is connected to the gas diffusion chamber 36a. A gas supply pipe 38 is connected to the gas introduction port 36c.

[0030] A gas source group 40 is connected to the gas supply pipe 38 via a valve group 41, a flow rate controller group 42, and a valve group 43. The gas source group 40, the valve group 41, the flow rate controller group 42, and the valve group 43 constitute a gas supply unit GS. The gas source group 40 includes a plurality of gas sources. Each of the valve group 41 and the valve group 43 includes a plurality of valves (e.g., on-off valves). The flow rate controller group 42 includes a plurality of flow rate controllers. Each of the plurality of flow rate controllers in the flow rate controller group 42 is a mass flow controller or a pressure-controlled flow rate controller. Each of the plurality of gas sources in the gas source group 40 is connected to the gas supply pipe 38 via a corresponding valve in the valve group 41, a corresponding flow rate controller in the flow rate controller group 42, and a corresponding valve in the valve group 43. The plasma processing apparatus 1 can supply gas from one or more selected gas sources in the gas source group 40 to the internal space 10s at individually adjusted flow rates.

[0031] The processing chamber 10 provides an exhaust path around the substrate support 16. An exhaust pipe 52 is connected to the bottom of the processing chamber 10 below the exhaust path. An exhaust device 50 is connected to the exhaust pipe 52. The exhaust device 50 has a pressure controller such as an automatic pressure control valve and a vacuum pump such as a turbomolecular pump, and can reduce the pressure in the internal space 10s.

[0032] The plasma processing apparatus 1 further includes a high-frequency power supply 61. The high-frequency power supply 61 is a power supply that generates source high-frequency power. The source high-frequency power is used to generate plasma from the gas in the processing chamber 10. The frequency of the source high-frequency power (source frequency) is within the range of 27 to 100 MHz. The high-frequency power supply 61 is connected to the upper electrode 30 via a matching circuit 61m. The matching circuit 61m is configured to match the impedance of the load side (upper electrode 30 side) of the high-frequency power supply 61 to the output impedance of the high-frequency power supply 61. Note that the high-frequency power supply 61 may be connected to the substrate support 16 (e.g., a lower electrode such as the base 18) via the matching circuit 61m instead of the upper electrode 30.

[0033] The plasma processing apparatus 1 further includes a bias power supply 62. The bias power supply 62 is electrically coupled to the substrate support 16 (e.g., a lower electrode such as the base 18) and supplies an electric bias to the substrate support 16 for attracting ions from the plasma to the substrate W. The electric bias has a bias frequency. The bias frequency may be lower than the source frequency. The bias frequency is, for example, a frequency within a range of 100 kHz to 13.56 MHz.

[0034] The electrical bias may be a bias radio frequency power having a bias frequency. In this case, the bias power supply 62 is connected to the substrate support 16 (e.g., a lower electrode such as the base 18 or another electrode of the substrate support 16) via a matching circuit 62m. The matching circuit 62m is configured to match the impedance of the load side of the bias power supply 62 to the output impedance of the bias power supply 62. Alternatively, the electrical bias may be a sequence of voltage pulses. The voltage pulses may be DC voltage pulses. In this case, the plasma processing apparatus 1 does not include the matching circuit 62m.

[0035] The substrate support 16 includes a base 18 and an electrostatic chuck 20. The base 18 has a generally disk-like shape. The substrate support 16 may further include a base 17 and an insulator 27. The base 18 may be made of a metal such as aluminum and may constitute a lower electrode. The base 17 is provided on the bottom of the processing chamber 10. The insulator 27 is provided on the base 17. The insulator 27 is made of an insulating material such as quartz and extends to surround the outer periphery of the base 18. The electrostatic chuck 20 is provided on the base 18.

[0036] Reference will now be made to FIG. 3 in addition to FIG. 2. FIG. 3 is a partially enlarged cross-sectional view of a substrate support portion of a plasma processing apparatus according to an exemplary embodiment. The upper surface of the electrostatic chuck 20 includes a substrate support surface 20a and a ring support surface 20b. The substrate support surface 20a is a substantially circular surface, and its central axis is an axis line AX. The electrostatic chuck 20 supports a substrate W placed on the substrate support surface 20a.

[0037] The ring support surface 20b is an annular surface extending around the axis AX outside the substrate support surface 20a. The electrostatic chuck 20 supports an edge ring ER placed on the ring support surface 20b. The edge ring ER has an annular shape. The substrate W is disposed within the area surrounded by the edge ring ER. The edge ring ER is made of a conductive material such as silicon or silicon carbide. The edge ring ER may also be made of an insulating material such as quartz.

[0038] The electrostatic chuck 20 includes a dielectric portion 20c, a first chuck electrode 20d, and a second chuck electrode 20e. The dielectric portion 20c is made of a ceramic such as aluminum oxide. The dielectric portion 20c has a generally disk shape and provides a substrate support surface 20a and a ring support surface 20b.

[0039] The first chuck electrode 20d and the second chuck electrode 20e are disposed in the dielectric portion 20c and below the substrate support surface 20a. When a voltage is applied to the first chuck electrode 20d, the electrostatic chuck 20 generates an electrostatic force to attract and hold the substrate W to the substrate support surface 20a. The second chuck electrode 20e is disposed in the dielectric portion 20c and below the ring support surface 20b. When a voltage is applied to the second chuck electrode 20e, the electrostatic chuck 20 generates an electrostatic force to attract and hold the edge ring ER to the ring support surface 20b. In the illustrated example, the electrostatic chuck 20 includes a monopolar electrostatic chuck for holding the substrate W and a bipolar electrostatic chuck for holding the edge ring ER. However, a bipolar electrostatic chuck may be used instead of the monopolar electrostatic chuck, and a monopolar electrostatic chuck may be used instead of the bipolar electrostatic chuck.

[0040] A covering ring CR is disposed outside the edge ring ER so as to surround the edge ring ER. The covering ring CR has a ring shape. The covering ring CR covers the upper surface of the insulator 27. The covering ring CR is formed of an insulating material such as quartz. The covering ring CR may also be formed of a conductive material such as silicon or silicon carbide. The outer periphery of the edge ring ER is disposed so as to overlap with the inner periphery of the covering ring CR when viewed from above. Furthermore, the outer periphery of the covering ring CR is disposed outside the outer periphery of the edge ring ER and surrounds the outer periphery of the edge ring ER.

[0041] The plasma processing apparatus 1 further includes a lifter 70. The lifter 70 includes a lifter 71 and a lifter 72. The lifter 71 includes a plurality of lift pins 711 and an actuator 712. The plurality of lift pins 711 are inserted into a plurality of through holes 161 formed in the base 18 and the electrostatic chuck 20, respectively. The actuator 712 raises and lowers the plurality of lift pins 711. The lifting and lowering by the actuator 712 allows the plurality of lift pins 711 to protrude upward from the substrate support surface 20a and retract downward from the substrate support surface 20a. The actuator 712 may be, for example, a DC motor, a stepping motor, a linear motor, an air-driven mechanism such as an air cylinder, or a piezoelectric actuator. The lifter 71 raises and lowers the plurality of lift pins 711 when transferring the substrate W between the transport robot TR and the substrate support 16.

[0042] The lifter 72 includes a plurality of lift pins 721 and an actuator 722. The plurality of lift pins 721 are inserted into a plurality of through holes 162 formed in the insulator 27 and a plurality of through holes CRh formed in the covering CR, respectively. The actuator 722 raises and lowers the plurality of lift pins 721. As the actuator 722, for example, one similar to the actuator 712 can be used.

[0043] Each of the plurality of lift pins 721 includes a lower portion 723 and an upper portion 724. The lower portion 723 and the upper portion 724 are each rod-shaped. The diameter of the lower portion 723 is larger than the diameter of the upper portion 724. The upper portion 724 extends upward from the lower portion 723.

[0044] The diameter of each of the plurality of through holes 162 is slightly larger than the diameter of the lower portion 723 of each of the plurality of lift pins 721. The diameter of each of the plurality of through holes CRh is slightly larger than the diameter of the upper portion 724 of each of the plurality of lift pins 721 and smaller than the diameter of the lower portion 723 of each of the plurality of lift pins 721.

[0045] Each of the lift pins 721 can be positioned at a standby position, a first support position, or a second support position. The standby position is a position where an upper end surface 724t of the upper portion 724 is lower than the lower surface of the edge ring ER. When the lift pins 721 are positioned at the standby position, the edge ring ER and the cover ring CR are supported by the electrostatic chuck 20 and the insulator 27, respectively, without being lifted by the lift pins 721.

[0046] The first support position is a position higher than the standby position. When each of the multiple lift pins 721 is positioned at the first support position, the upper end surface 724t of the upper portion 724 is positioned above the upper surface of the covering ring CR, and the upper end surface 723t of the lower portion 723 is positioned below the lower surface of the covering ring CR. When the multiple lift pins 721 are positioned at the first support position, the upper end surface 724t of the upper portion 724 abuts against a surface that defines a recess ERr formed in the lower surface of the edge ring ER. In this way, the multiple lift pins 721 support the edge ring ER.

[0047] The second support position is a position higher than the first support position. When each of the multiple lift pins 721 is positioned at the second support position, the upper end surface 723t of the lower portion 723 is positioned higher than the upper surface of the insulator 27. When the multiple lift pins 721 are positioned at the second support position, the upper end surface 723t of the lower portion 723 abuts against the lower surface of the covering CR. This allows the multiple lift pins 721 to support the covering CR. Note that when the edge ring ER is positioned on the inner periphery of the covering CR, the upper end surface 724t of the upper portion 724 abuts against the surface that defines the recess ERr, and the multiple lift pins 721 support both the covering CR and the edge ring ER.

[0048] The lifter 72 moves the plurality of lift pins 721 to the first support position when transferring only the edge ring ER between the transport robot TR and the substrate support part 16. The lifter 72 moves the plurality of lift pins 721 to the second support position when transferring both the edge ring ER and the covering ring CR or only the covering ring CR between the transport robot TR and the substrate support part 16.

[0049] The aligner RAN and the stocker module RSM will be described in detail below with reference to Figures 4 and 5. Figure 4 is a perspective view showing a stocker module according to one embodiment. Figure 4 is a partially cutaway perspective view showing the interior of the stocker module RSM. Figure 5 is an end view of the stocker module according to one embodiment.

[0050] The stocker module RSM includes a chamber RC. The chamber RC is configured so that its internal space can be depressurized. Figure 4 illustrates the chamber RC with a portion thereof cut away to illustrate the internal space. An aligner RAN and a cassette module CTM are disposed within the chamber RC. The aligner RAN is disposed above the cassette module CTM. The cassette module CTM includes a plurality of cassettes CT. Each of the plurality of cassettes CT is configured to accommodate a ring member R therein.

[0051] The cassette module CTM accommodates a plurality of ring members R. The plurality of ring members R may include edge rings ER and cover rings CR. As shown in FIG. 5 , the edge rings ER and cover rings CR are arranged alternately in the cassette module CTM. The aligner RAN and the cassette module CTM may be configured to be movable in the vertical direction. For example, a ring member R is unloaded from a cassette CT placed at a transfer position in the chamber RC. The cassette module CTM can move in the vertical direction so that the unloaded ring member R is placed at the transfer position in the chamber RC. In the cassette module CTM, the plurality of ring members R may be unloaded in order, starting with the lowest ring member R.

[0052] The aligner RAN has a stage ST and an optical sensor S1. The stage ST is configured to place a ring member R thereon. The optical sensor S1 is configured to detect the shape of the ring member R placed on the stage ST.

[0053] In one embodiment, the stage ST is configured to be rotatable together with the ring member R placed thereon. For example, the stage ST may include a support part RST configured to be rotatable and to support the ring member R. The support part RST is formed from a material that is transparent to visible light. In one example, the support part RST is formed from glass. The support part RST may include a plurality of pads PD. The plurality of pads may include a pad for the edge ring ER and a pad for the covering ring CR. The pad for the edge ring ER is disposed inside the pad for the covering ring CR. The aligner RAN may move in the vertical direction so that the support part RST of the stage ST is disposed at a transfer position within the chamber RC.

[0054] In one embodiment, the optical sensor S1 includes a line sensor LS and a light source L. The line sensor LS is positioned so as to be able to detect the outer and inner edges of the ring member R. The light source L emits light toward the line sensor LS. In one example, the light source L may emit laser light. For example, the line sensor LS and the light source L are positioned so as to face each other in the vertical direction with the stage ST positioned therebetween. The line sensor LS may be positioned below the support portion RST so as to intersect with the inner and outer edges of the ring member R as viewed from the light source L. In one example, when the stage ST and the ring member R placed on the stage are rotating together, the light source L emits light toward the line sensor LS. The line sensor LS detects light projected from the inner and outer edges of the ring member R. The optical sensor S1 detects the shape of the ring member R from the light detected by the line sensor LS.

[0055] The aligner RAN may be configured to adjust (align) the position of the ring member R disposed on the stage ST. The optical sensor S1 may be configured to optically detect the position of the ring member on the support RST. The aligner RAN may be configured to adjust the position of the ring member R according to the position detected by the optical sensor S1. In one embodiment, the aligner RAN is configured to enable detection of the edge ring ER and the covering ring CR and aligning each of them. In one example, the aligner RAN may be configured to be able to align the edge ring ER with an inner portion of the line sensor LS and align the covering ring CR with an outer portion of the line sensor.

[0056] In one embodiment, the stocker module RSM may further include an optical sensor S2. The optical sensor S2 is configured to detect the thickness of the ring member R. In one example, the optical sensor S2 is a mapping sensor. The optical sensor S2 may include a light source that emits laser light in a horizontal direction and an optical sensor that receives the laser light emitted from the light source. The cassette CT may include a side surface on which a notch is formed. The notch is positioned so that the laser light can be irradiated onto the ring member R accommodated in the cassette CT.

[0057] The shape of the ring member R and the characteristic information of the ring member R extracted from the shape of the ring member R will be described below with reference to FIGS. 6 and 7. FIG. 6 is a plan view of an edge ring and an aligner according to one embodiment. FIG. 6 shows the edge ring ER placed on the support portion RST of the aligner RAN. FIG. 7 is a plan view of a cover ring and an aligner according to one embodiment. FIG. 7 shows the cover ring CR placed on the support portion RST of the aligner RAN.

[0058] The identification unit IU acquires characteristic information indicating the characteristics of the ring member R from the shape of the ring member R acquired by the optical sensor S1. In one embodiment, the characteristics of the ring member R may include at least one of the inner diameter, outer diameter, and thickness of the ring member. "May include at least one" means that the ring member R may include one or more of the inner diameter, outer diameter, and thickness as its characteristics. The inner and outer diameters of the ring member may be determined from the curvatures of the inner and outer edges of the ring member.

[0059] In the examples of Figures 6 and 7, a first notch NT1 and a second notch NT2 are formed in the ring member R. The ring member's features include at least one notch, the first notch NT1 and the second notch NT2. As shown in Figure 6, in the edge ring ER, the first notch NT1 and the second notch NT2 are formed on its outer edge. As shown in Figure 7, in the cover ring CR, the first notch NT1 and the second notch NT2 are formed on its inner edge. In one embodiment, the identification unit IU may acquire the thickness of the ring member R detected by the optical sensor S2 as feature information indicating the features of the ring member R.

[0060] In one embodiment, the characteristics of the ring member R may include the number of notches formed in the ring member R. In the examples of FIGS. 6 and 7 , the number of the at least one notch is two. If no notches are formed in the ring member R, the number of notches is set to zero. In one embodiment, the characteristics of the ring member R may include the relative positional relationship between the first notch NT1 and the second notch NT2. The relative positional relationship between the first notch NT1 and the second notch NT2 may be, for example, the angle between the first notch NT1 and the second notch NT2 with respect to the center of the ring member R. The relative positional relationship between the first notch NT1 and the second notch NT2 may be the distance between the first notch NT1 and the second notch NT2.

[0061] Each of the multiple ring members R is a ring member R for a corresponding process module among the multiple process modules PM1 to PM6. In the substrate processing system PS, each of the multiple ring members R is transported to a corresponding process module. The memory unit MU includes a table in which characteristic information indicating the characteristics of each of the multiple ring members R is stored in association with the identifiers of each of the multiple process modules PM1 to PM6. For example, the table stores the characteristic information indicating the characteristics of a specific ring member R and the identifier of a specific process module corresponding to the specific ring member R in correspondence with each other.

[0062] The identification unit IU refers to the table in the memory unit MU and identifies a process module among the plurality of process modules PM1 to PM6 to which the ring member R should be transported, from an identifier stored in association with characteristic information indicating the characteristics of the ring member R. The process module to which the ring member R should be transported is a process module among the plurality of process modules PM1 to PM6 that corresponds to the ring member R.

[0063] The characteristic information indicating the characteristics of the ring member R is associated with the identifier of the process module corresponding to the ring member R and stored in a table in the memory unit MU. According to the substrate processing system PS, the table in the memory unit MU is referenced to identify the process module corresponding to the ring member R from the characteristic information indicating the characteristics of the ring member R extracted from the shape of the R of the ring member.

[0064] The controller MC controls the transport robot TR. The controller MC may control the transport robot TR to transport the ring member R between the path between the cassette module CTM and the aligner RAN in the stocker module RSM. The controller MC may control the transport robot TR to transport the ring member R to a designated process module among the plurality of process modules PM1 to PM6.

[0065] In one embodiment, the control unit MC transfers the ring member R onto the stage ST of the aligner RAN before transferring the ring member R to a designated process module among the plurality of process modules PM1 to PM6. The control unit MC acquires an identifier of the process module to which the ring member R transferred onto the stage ST should be transferred among the plurality of process modules PM1 to PM6, the identifier of the process module being identified by referencing a table in the identification unit IU using characteristic information of the ring member R transferred onto the stage ST. The control unit MC determines whether the identifier of the designated process module matches the identifier of the process module to which the ring member R should be transferred.

[0066] In one embodiment, the controller MC transfers the ring member R onto the stage ST of the aligner RAN after unloading the ring member R from a process module. The controller MC acquires an identifier of a process module among the plurality of process modules PM1 to PM6 to which the ring member R transferred onto the stage ST should be transferred, the identifier of the process module being identified by referencing a table in the identification unit IU using characteristic information of the ring member R transferred onto the stage ST. The controller MC determines whether the identifier of the process module from which the ring member R was unloaded matches the identifier of the process module to which the ring member R should be transferred.

[0067] 8 is a flow chart showing a substrate processing method according to one exemplary embodiment. An example of performing the substrate processing method (hereinafter referred to as "method MT") will be described below with reference to FIG. 8. The method MT is performed using a substrate processing system PS. The control of each component and part of the substrate processing system PS in the method MT will also be described below. Note that the method MT may also be performed using a substrate processing system other than the substrate processing system PS.

[0068] The method MT begins with step ST1. In step ST1, a ring member R is transported to the aligner RAN. In one example, the ring member R is transported by a transport robot TR from the lowest cassette CT of the cassette modules CTM onto a stage ST of the aligner RAN. In one embodiment, step ST1 may be performed before the ring member R is transported to a designated process module among the plurality of process modules PM1 to PM6. In the example of FIG. 8 , step ST1 is performed before step ST5, in which the ring member R is transported to the designated process module.

[0069] After step ST1, step ST2 is performed. In step ST2, the shape of the ring member R transported to the aligner RAN is detected. For example, the shapes of the inner edge and the outer edge of the ring member R are detected by an optical sensor S1. In one embodiment, the shape of the ring member R may be the thickness of the ring member R. The thickness of the ring member R may be detected by an optical sensor S2 disposed in the stocker module RSM before step ST2.

[0070] After process ST2, process ST3 is performed. In process ST3, characteristic information indicating the characteristics of the ring member R is extracted from the shape of the ring member R. After the characteristic information is extracted, the table in the memory unit MU is referenced, and the process module to which the ring member R should be transported is identified from among the multiple process modules PM1 to PM6 based on the process module identifier stored in the table in the memory unit MU in association with the characteristic information.

[0071] For example, the table of the memory unit MU stores an identifier of the process module PM1 and characteristic information of the ring member R corresponding to the process module PM1 in association with each other. The table of the memory unit MU may also store an identifier of the process module PM1 and an identifier of the ring member R corresponding to the process module PM1 in association with each other, and may also store an identifier of the ring member R in association with the characteristic information of the ring member R.

[0072] In one embodiment, the method MT may include a step ST4. The step ST4 is performed after the step ST3. In the step ST4, it is determined whether the identifier of the designated process module to which the ring member R is to be transported matches the identifier of the process module to which the ring member R is to be transported, as determined in the step ST3. If it is determined that the identifiers match in the step ST4 (the result of the determination in the step ST4 in FIG. 8 is "NO"), the method MT may be terminated. In this case, for example, the method MT may be abnormally terminated. Before the method MT is abnormally terminated, the substrate processing system PS may notify the operator that the identifier of the designated process module does not match the identifier of the process module to which the ring member R is to be transported. If it is determined that the identifiers match in the step ST4 (the result of the determination in the step ST4 in FIG. 8 is "YES"), the process ST5 may be executed.

[0073] In one example, the method MT may include steps ST5 and ST6. In step ST5, the ring member R is transferred to a designated process module among the plurality of process modules PM1 to PM6. For example, the cover ring CR is transferred via a lifter 70 onto the insulator 27 of the substrate support 16 in the process chamber 10 of the designated process module. For example, the edge ring ER is transferred via the lifter 70 onto the ring support surface 20b of the substrate support 16 in the process chamber 10 of the designated process module.

[0074] After step ST5, the substrate W may be transported to a designated process module (not shown). For example, the substrate W is transported onto the substrate support surface 20a so as to be surrounded by the edge ring ER transported in step ST5.

[0075] Step ST6 is performed after step ST5. In step ST6, the substrate W on the substrate support 16 is subjected to substrate processing. The substrate processing may be plasma processing. The substrate processing may include an etching process and a film formation process.

[0076] After step ST6, the substrate W may be unloaded from the designated process module (not shown). For example, the substrate W may be transferred to the transfer chamber ACH via the transfer chamber VCH.

[0077] In one embodiment, the method MT may include steps ST7, ST8, ST9, and ST10. Step ST7 is performed after step ST6. In step ST7, the ring member R is unloaded from a designated process module and then transferred to the aligner RAN. In one example, the ring member R is transferred by the transfer robot TR from on the substrate support 16 in the process chamber 10 of the designated process module to on the stage ST of the aligner RAN.

[0078] Process ST8 is performed after process ST7. In process ST8, similar to process ST2, the shape of the ring member R transported to the aligner RAN is detected. Process ST9 is performed after process ST8. In process ST9, similar to process ST3, characteristic information indicating the characteristics of the ring member R is extracted from the shape of the ring member R, and the process module to which the ring member R should be transported is identified.

[0079] Process ST10 is performed after process ST9. In process ST10, it is determined whether the identifier of the process module from which the ring member R was unloaded matches the identifier of the process module to which the ring member R identified in process ST9 should be transferred. If it is determined that the identifiers match in process ST10 (the result of the determination in process ST4 in FIG. 8 is "NO"), the method MT may be terminated. In this case, for example, the method MT may be abnormally terminated. Before the method MT is abnormally terminated, the substrate processing system PS may notify the operator that the identifier of the designated process module does not match the identifier of the process module from which the ring member R was unloaded. If it is determined that the identifiers match in process ST10 (the result of the determination in process ST4 in FIG. 8 is "YES"), the method MT may be terminated. In this case, for example, the method MT may be normally terminated.

[0080] Although various exemplary embodiments have been described above, the present invention is not limited to the above-described exemplary embodiments, and various additions, omissions, substitutions, and modifications may be made. Furthermore, elements in different embodiments may be combined to form other embodiments.

[0081] The substrate processing system PS is not necessarily limited to that shown in FIG. 1 . For example, the number of process modules and / or the number of transfer modules in the substrate processing system may be different from those shown in FIG. 1 . For example, the number of load ports may be five or more, or any number of load ports may be used. Furthermore, the substrate processing system may be a system in which a plurality of module groups, each including a process module and a load lock module, are connected to a loader module (a so-called loader-type system). Furthermore, the substrate processing system may be a system in which two or more process modules are connected in a row around a transfer module so as to surround the transfer module (a so-called cluster-type system).

[0082] In one embodiment, the aligner RAN may be connected to the transport chamber ACH of the loader module LM, in which case the stocker module RSM may be connected to the transport chamber ACH.

[0083] The method MT may not include steps ST5 to ST10. The method MT may not include steps ST1 to ST6. If the method MT does not include steps ST1 to ST6, the method MT starts with step ST7.

[0084] Various exemplary embodiments included in the present disclosure are now described in [E1] to [E14] below.

[0085] [E1] A substrate processing system comprising: a vacuum transfer module having a decompressible transfer chamber and a transfer robot configured to transfer a substrate via the transfer chamber; a control unit configured to control the transfer robot; a plurality of process modules each having a processing chamber connected to the transfer chamber and a substrate support disposed within the processing chamber, and configured to perform substrate processing on a substrate on the substrate support; an aligner having a stage configured to place a ring member on the stage and an optical sensor configured to detect the shape of the ring member placed on the stage; a memory unit including a table storing characteristic information indicating characteristics of each of a plurality of ring members, associated with identifiers of each of the plurality of process modules; and an identification unit that extracts the characteristic information of the ring member from the shape of the ring member detected by the optical sensor, and identifies a process module among the plurality of process modules to which the ring member should be transferred from the identifier stored in association with the characteristic information by referring to the table in the memory unit.

[0086] [E2] The substrate processing system according to E1, wherein the characteristics include at least one of an inner diameter, an outer diameter, or a thickness of the ring member.

[0087] [E3] The substrate processing system according to E1 or E2, wherein the characteristics include the number of notches formed in the ring member.

[0088] [E4] The substrate processing system according to any one of E1 to E3, wherein a first notch and a second notch are formed in the ring member, and the feature includes a relative positional relationship between the first notch and the second notch.

[0089] [E5] The substrate processing system according to any one of E1 to E4, wherein the ring member is an edge ring used to surround the substrate on the substrate support part or a cover ring used to surround the edge ring.

[0090] [E6] The substrate processing system according to any one of E1 to E5, wherein the stage is configured to be rotatable together with the ring member placed thereon, and the optical sensor includes: a line sensor arranged to be able to detect the outer edge and inner edge of the ring member; and a light source configured to emit light toward the line sensor.

[0091] [E7] The substrate processing system according to any one of E1 to E6, further comprising: an atmospheric transfer module having a load lock module connected to the transfer chamber of the vacuum transfer module; and another transfer chamber connected to the load lock module and another transfer robot configured to transfer the substrate via the other transfer chamber, wherein the aligner is connected to the other transfer chamber of the atmospheric transfer module.

[0092] [E8] The substrate processing system according to any one of E1 to E6, wherein the aligner is connected to the transfer chamber of the vacuum transfer module.

[0093] [E9] The substrate processing system described in E8, further comprising a stocker module connected to the transfer chamber of the vacuum transfer module and configured to accommodate the ring member therein, and the aligner is disposed within the stocker module.

[0094] [E10] The substrate processing system of E9, wherein the characteristics include a thickness of the ring member, and the stocker module includes another optical sensor configured to detect the thickness.

[0095] [E11] The substrate processing system according to any one of E1 to E10, wherein the control unit is configured to: control the transport robot to transport the ring member onto the stage of the aligner before transporting the ring member to a specified one of the plurality of process modules; acquire an identifier of the process module to which the ring member transported onto the stage is to be transported, the identifier of the process module being identified by referring to the table in the identification unit using the characteristic information of the ring member transported onto the stage; and determine whether the identifier of the specified process module matches the identifier of the process module to which the ring member is to be transported.

[0096] [E12] The substrate processing system according to any one of E1 to E11, wherein the control unit is configured to: control the transport robot to transport the ring member onto the stage of the aligner after unloading the ring member from the process module; obtain an identifier of a process module among the plurality of process modules to which the ring member transported onto the stage should be transported from the identification unit which extracts the characteristic information of the ring member transported onto the stage and references the table in the memory unit; and determine whether the identifier of the process module from which the ring member was unloaded matches the identifier of the process module to which the ring member should be transported.

[0097] [E13] A substrate processing method executed in a substrate processing system, the substrate processing system comprising: a plurality of process modules each configured to perform substrate processing; an aligner configured to detect characteristics of a ring member; and a memory unit including a table storing characteristic information indicating characteristics of each of a plurality of ring members associated with identifiers of each of the plurality of process modules, the substrate processing method comprising: (a) a step of transporting a ring member to the aligner; (b) after step (a), a step of detecting a shape of the ring member transported to the aligner; and (c) after step (b), a step of extracting the characteristic information of the ring member from the detected shape of the ring member, and identifying a process module to which the ring member should be transported from the identifier stored in association with the characteristic information by referring to the table in the memory unit.

[0098] [E14] The substrate processing method according to E13, further comprising: (a) being performed before the ring member is transported to a designated process module; and (d) after (c), determining whether an identifier of the designated process module matches an identifier of the process module to which the ring member is to be transported.

[0099] [E15] The substrate processing method described in E13 or E14, wherein (a) is performed after the ring member is unloaded from the process module, and further includes a step (e) after (c), of determining whether an identifier of the process module from which the ring member is unloaded matches the identifier of the process module to which the ring member is to be transferred.

[0100] The processing methods described in E13 to E15 may be performed in the substrate processing system described in E1 to E12.

[0101] From the foregoing, it will be understood that various embodiments of the present disclosure have been described herein for purposes of illustration, and that various modifications may be made without departing from the scope and spirit of the present disclosure. Accordingly, the various embodiments disclosed herein are not intended to be limiting, with the true scope and spirit being indicated by the appended claims.

[0102] 10...processing chamber, 16...substrate support part, ACH, VCH...transfer chamber, CR...covering, ER...edge ring, IU...identification part, L...light source, LL1, LL2...load lock module, LM...loader module, LS...line sensor, MC...control part, MU...memory part, NT1...first notch, NT2...second notch, PM1 to PM6...multiple process modules, PS...substrate processing system, R...ring member, RAN...aligner, RSM...stocker module, S1, S2...optical sensor, ST...stage, TR...transfer robot, VTM...vacuum transfer module, W...substrate.

Claims

1. A substrate processing system comprising: a vacuum transfer module having a transfer chamber capable of being depressurized and a transfer robot configured to transfer a substrate through the transfer chamber; a control unit configured to control the transfer robot; a plurality of process modules each having a processing chamber connected to the transfer chamber and a substrate support portion disposed in the processing chamber, the process modules being configured to perform substrate processing on a substrate on the substrate support portion; an aligner having a stage configured such that a ring member is placed thereon and an optical sensor configured to detect the shape of the ring member placed on the stage; a storage unit including a table in which feature information indicating features of each of a plurality of ring members is stored in association with identifiers of each of the plurality of process modules; and a specifying unit configured to extract the feature information of the ring member from the shape of the ring member detected by the optical sensor and specify, with reference to the table in the storage unit, the process module to which the ring member is to be transferred from the identifiers stored in association with the feature information among the plurality of process modules.

2. The substrate processing system according to claim 1, wherein the feature includes at least one of an inner diameter, an outer diameter, and a thickness of the ring member.

3. The substrate processing system according to claim 1, wherein the feature includes the number of notches formed in the ring member.

4. The substrate processing system according to claim 1, wherein a first notch and a second notch are formed in the ring member, and the feature includes a relative positional relationship between the first notch and the second notch.

5. The substrate processing system according to claim 1, wherein the ring member is an edge ring used to surround a substrate on the substrate support portion or a cover ring used to surround the edge ring.

6. The substrate processing system according to claim 1, wherein the stage is configured to be rotatable together with the ring member placed thereon, and the optical sensor includes a line sensor disposed so as to be able to detect an outer edge and an inner edge of the ring member, and a light source configured to emit light toward the line sensor.

7. The substrate processing system further includes an atmospheric transfer module having a load lock module connected to the transfer chamber of the vacuum transfer module, another transfer chamber connected to the load lock module, and another transfer robot configured to transfer the substrate through the another transfer chamber, and the aligner is connected to the another transfer chamber of the atmospheric transfer module. The substrate processing system according to any one of claims 1 to 6.

8. The aligner is connected to the transfer chamber of the vacuum transfer module. The substrate processing system according to any one of claims 1 to 6.

9. The substrate processing system further includes a stocker module connected to the transfer chamber of the vacuum transfer module and configured to accommodate the ring member therein, and the aligner is disposed in the stocker module. The substrate processing system according to claim 8.

10. The feature includes the thickness of the ring member, and the stocker module includes another optical sensor configured to detect the thickness. The substrate processing system according to claim 9.

11. Before transferring the ring member to a designated process module among the plurality of process modules, the control unit controls the transfer robot to transfer the ring member onto the stage of the aligner, obtains an identifier of the process module to which the ring member transferred onto the stage is to be transferred, the identifier being specified by referring to the table using the feature information of the ring member transferred onto the stage in the specifying unit, and determines whether the identifier of the designated process module matches the identifier of the process module to be transferred. The substrate processing system according to any one of claims 1 to 6.

12. After the control unit unloads the ring member from the process module, the control unit controls the transfer robot to transfer the ring member onto the stage of the aligner, obtains an identifier of a process module to which the ring member transferred onto the stage among the plurality of process modules is to be transferred, the identifier being specified by referring to the table using the characteristic information of the ring member transferred onto the stage in the specifying unit, and determines whether the identifier of the process module from which the ring member has been unloaded matches the identifier of the process module to be transferred. The substrate processing system according to any one of claims 1 to 6 is configured as described above.

13. A substrate processing method executed in a substrate processing system, the substrate processing system including: a plurality of process modules each configured to perform substrate processing; an aligner configured to detect characteristics of a ring member; and a storage unit including a table storing characteristic information indicating characteristics of each of a plurality of ring members associated with identifiers of each of the plurality of process modules. The substrate processing method includes: (a) a step of transferring a ring member to the aligner; (b) a step of detecting a shape of the ring member transferred to the aligner after the step (a); and (c) a step of extracting the characteristic information of the ring member from the detected shape of the ring member after the step (b) and specifying a process module to which the ring member is to be transferred from the identifiers stored in association with the characteristic information by referring to the table in the storage unit.

14. The step (a) is performed before transferring the ring member to a designated process module. After the step (c), the method further includes (d) a step of determining whether the identifier of the designated process module matches the identifier of the process module to be transferred. The substrate processing method according to claim 13.

15. The step (a) is performed after the ring member is carried out from the process module, and (e) further includes a step of determining whether the identifier of the process module from which the ring member has been carried out after the step (c) matches the identifier of the process module to be conveyed, according to the substrate processing method of claim 13 or 14.

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