Heat dissipation structure and electronic device comprising same

Abstract

In embodiments, an electronic device is provided. The electronic device may comprise: a printed circuit board; an electronic component arranged on one surface of the printed circuit board; and a housing for dissipating heat of the electronic component. The housing may include a base portion for the electronic component, a cover portion arranged on a support of the base portion, and a plurality of fin portions coupled to the cover portion. Each of the plurality of fin portions may have a heat dissipation plate region and protruding regions. A portion of the heat dissipation plate region may protrude from a first surface of the cover portion, and another portion of the heat dissipation plate region may protrude from a second surface of the cover portion, which is opposite to the first surface. The protruding regions may be coupled to the support or the cover portion such that the heat dissipation plate region is spaced apart from one surface of the base portion by a predetermined distance or more.

Description

Heat dissipation structure and electronic device including the same

[0001] The present disclosure relates to a heat dissipation structure and an electronic device including the same.

[0002] Electronic devices may include various electronic components to perform communications. These electronic components within the electronic device may generate heat. For example, heat generated by the electronic components may degrade the performance of the electronic components and other electronic components. To dissipate the heat generated by the electronic components, the electronic device may include a heat dissipation structure.

[0003] The above information may be provided as background art to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art related to the present disclosure.

[0004] In some embodiments, an electronic device is provided. The electronic device may include a printed circuit board, an electronic component disposed on one surface of the printed circuit board, and a housing for heat dissipation of the electronic component. The housing may include a base portion for the electronic component, a cover portion disposed on a support of the base portion, and a plurality of fin portions coupled with the cover portion. Each of the plurality of fin portions may have a heat dissipation region and protruding regions. A portion of the heat dissipation region may be arranged to protrude from a first surface of the cover portion, and another portion of the heat dissipation region may be arranged to protrude from a second surface of the cover portion opposite to the first surface. The protruding regions may be coupled to the support portion or the cover portion such that the heat dissipation region is arranged to be spaced apart from one surface of the base portion by a predetermined distance or more.

[0005] In embodiments, a housing having a vapor chamber is provided. The housing may include a base portion having a support, a cover portion disposed on the support of the base portion, and a plurality of fin portions coupled with the cover portion. Each of the plurality of fin portions may have a heat dissipation region and protruding regions. A portion of the heat dissipation region may be disposed to protrude from a first surface of the cover portion, and another portion of the heat dissipation region may be disposed to protrude from a second surface of the cover portion opposite to the first surface. The protruding regions may be coupled to the support or the cover portion such that the heat dissipation region is disposed at a predetermined distance or more from one surface of the base portion.

[0006] Figure 1 shows a wireless communication system.

[0007] Figure 2 shows network entities according to distributed deployment.

[0008] FIG. 3a illustrates an example of an external appearance of an electronic device including a heat dissipation structure.

[0009] Figure 3b illustrates an example of an electronic device including a heat dissipation structure.

[0010] Figure 4 shows a front view of a housing having a vapor chamber.

[0011] Figure 5 shows a perspective view of a housing having a vapor chamber.

[0012] Figure 6 shows an example of components of a housing having a vapor chamber.

[0013] Figures 7a and 7b show the connection structure between components of a housing having a vapor chamber.

[0014] Figures 8a to 8d show examples of arrangement of protruding areas of the housing for separation of the cover portion and the base portion of the housing.

[0015] Figures 9a and 9b show examples of fins of a housing having a vapor chamber.

[0016] Figure 10 shows an example of the design of columns in the base section.

[0017] Figures 11a and 11b illustrate examples of electronic devices including a housing having a vapor chamber.

[0018] Figures 12a and 12b illustrate examples of electronic devices including a housing having a vapor chamber.

[0019] The terms used in this disclosure are used only to describe specific embodiments and may not be intended to limit the scope of other embodiments. The singular expression may include plural expressions unless the context clearly indicates otherwise. Terms used herein, including technical or scientific terms, may have the same meaning as commonly understood by those of ordinary skill in the art described in this disclosure. Terms defined in general dictionaries among the terms used in this disclosure may be interpreted as having the same or similar meaning in the context of the relevant technology, and shall not be interpreted in an idealized or overly formal sense unless explicitly defined in this disclosure. In some cases, even if a term is defined in this disclosure, it cannot be interpreted to exclude embodiments of the present disclosure.

[0020] In the various embodiments of the present disclosure described below, a hardware approach is described as an example. However, in the various embodiments of the present disclosure,

[0021] Because the present disclosure encompasses techniques utilizing both hardware and software, the various embodiments of the present disclosure do not exclude software-based approaches.

[0022] Terms referring to parts of electronic devices used in the following description (e.g., communication module, wireless communication module, heat dissipation module, substrate, PCB (printed circuit board), FPCB (flexible PCB), PBA (printed circuit board assembly), module, antenna, antenna element, circuit, processor, chip, component, device), terms referring to RF-related parts (FEM (front end module0, PAM (power amplifier module), FEMid (FEM including duplexer), PAMid (power amplifier module including duplexer), LPAMid (low noise amplifier PAM including duplexer), RFFE (radio frequency front end)), RFIC (radio frequency integrated circuit)), terms referring to the shape of parts (e.g., opening area, opening, protrusion area, protrusion, structure, structure, support, contact), terms referring to connections between structures (e.g., connection, contact, support, contact structure, conductive member, assembly), terms referring to circuits (e.g., PCB, FPCB, signal line, Feeding lines, data lines, RF signal lines, antenna lines, RF paths, RF modules, RF circuits, splitters, dividers, couplers, combiners, etc. are examples for convenience of explanation. Therefore, the present disclosure is not limited to the terms described below, and other terms having equivalent technical meanings may be used. In addition, terms such as '... part', '... device', '... object', '... body', etc. used below may mean at least one shape structure or a unit that processes a function.

[0023] In addition, in the present disclosure, expressions such as "more than" or "less than" may be used to determine whether a specific condition is satisfied or fulfilled, but this is merely a description for expressing an example and does not exclude descriptions such as "more than" or "less than." A condition described as "more than" may be replaced with "more than," a condition described as "less than" may be replaced with "less than," and a condition described as "more than and less than" may be replaced with "more than and less than." In addition, hereinafter, "A" to "B" mean at least one of elements from A (including A) to B (including B). hereinafter, "C" and / or "D" mean at least one of "C" or "D," that is, including {"C", "D", "C" and "D"}.

[0024] Figure 1 shows a wireless communication system.

[0025] Referring to FIG. 1, FIG. 1 illustrates a base station (110) and a terminal (120) as some of the nodes utilizing a wireless channel in a wireless communication system. Although FIG. 1 illustrates only one base station, the wireless communication system may further include other base stations identical or similar to the base station (110).

[0026] The base station (110) is a network infrastructure that provides wireless access to terminals (120). The base station (110) has coverage defined based on the distance at which a signal can be transmitted. In addition to the base station, the base station (110) includes an 'access point (AP)', a 'RAN (radio access network) node', an 'eNodeB (eNB)', and a '5G node (5 thThe term "network node" may be referred to as "next generation node (gNB)", "wireless point", "transmission / reception point (TRP)", "communication node", "wireless communication device", "wireless communication equipment", "network node", "network entity", or other terms having equivalent technical meaning.

[0027] The terminal (120) is a device used by a user and communicates with the base station (110) via a wireless channel. The link from the base station (110) to the terminal (120) is referred to as a downlink (DL), and the link from the terminal (120) to the base station (110) is referred to as an uplink (UL). In addition, although not shown in FIG. 1, the terminal (120) and another terminal may communicate with each other via a wireless channel. In this case, the link between the terminal (120) and another terminal (device-to-device link, D2D) is referred to as a sidelink, and the sidelink may be used interchangeably with the PC5 interface. In some other embodiments, the terminal (120) may be operated without the involvement of a user. In one embodiment, the terminal (120) is a device that performs machine type communication (MTC) and may not be carried by the user. Additionally, according to one embodiment, the terminal (120) may be an NB (narrowband)-IoT (internet of things) device.

[0028] The terminal (120) may be referred to as a terminal, or other terms such as 'user equipment (UE),' 'customer premises equipment (CPE),' 'mobile station,' 'subscriber station,' 'remote terminal,' 'wireless terminal,' 'electronic device,' or 'user device,' or other terms having equivalent technical meanings.

[0029] In the past, in communication systems with relatively large cell radius of base stations, each base station was installed to include the functions of a digital processing unit (or DU (distributed unit)) and an RF (radio frequency) processing unit (or RU (radio unit)). However, in 4G (4 th As higher frequency bands are used in the 5G generation and / or subsequent communication systems (e.g., 5G) and the cell coverage of base stations becomes smaller, the number of base stations to cover a specific area has increased. The installation cost burden on operators to install base stations has also increased. In order to minimize the installation cost of base stations, a structure has been proposed in which the DU and RU of a base station (e.g., base station (110)) are separated, one or more RUs are connected to one DU via a wired network, and one or more RUs are geographically distributed to cover a specific area. The distributed deployment is described in more detail with reference to FIG. 2.

[0030] FIG. 2 illustrates network entities according to a distributed arrangement. For example, the network entities may include a digital unit (DU) and a radio unit (RU) (220) (or a massive multiple input multiple output (MMU) unit). For example, the network entities may be connected via a fronthaul. Unlike the backhaul between a base station and a core network, the fronthaul refers to entities (e.g., DU (210), RU (220)) between a wireless LAN and a base station. Although FIG. 2 illustrates an example of a fronthaul structure between a DU (210) and one RU (220), this is merely for convenience of explanation and the present disclosure is not limited thereto. In other words, embodiments of the present disclosure may also be applied to a fronthaul structure between one DU and multiple RUs. For example, embodiments of the present disclosure may be applied to a fronthaul structure between one DU and two RUs. Additionally, the embodiments of the present disclosure can also be applied to a fronthaul structure between one DU and three RUs.

[0031] Referring to FIG. 2, the base station (110) may include a DU (210) and a RU (220). The front hole (215) between the DU (210) and the RU (220) is F xIt can be operated through an interface. For the operation of the fronthaul (215), for example, an interface such as eCPRI (enhanced common public radio interface) and ROE (radio over ethernet) can be used. Depending on the implementation example, in addition to the DU (digital unit), the DU (210) may be referred to as a baseband unit (BBU), a digital BBU, a baseband digital unit, a digital processing unit, a digital processing circuit, a baseband processing circuit, a baseband processing unit, and / or equivalent technical terms thereof. Depending on the implementation example, in addition to the RU (radio unit), the RU (220) may be referred to as a remote unit, a radio demote head (RRH), a radio processing circuit, a radio processing unit, an antenna integrated radio, an air radio device, an air scale communication device, a radio device, a radio communication device, and / or equivalent technical terms thereof. Also, according to the implementation example, the network entity connected to the DU (210) in the present disclosure is described as the RU (210), but it is of course possible for a massive multiple input multiple output (MMU) unit to be connected to the DU (210) and used instead of the RU (210).

[0032] As communication technology advances, mobile data traffic increases, significantly increasing the bandwidth requirements for the fronthaul between the digital unit and the wireless unit. In a deployment such as a centralized / cloud radio access network (C-RAN), the DU performs functions for the packet data convergence protocol (PDCP), radio link control (RLC), media access control (MAC), and physical (PHY) layer, while the RU can be implemented to perform functions for the PHY layer in addition to the radio frequency (RF) layer. The DU (210) can be responsible for upper layer functions of the wireless network.

[0033] For example, DU (210) can perform functions of MAC layer and part of PHY layer. Here, part of PHY layer means functions performed at a higher level among the functions of PHY layer, and may include, for example, channel encoding (or channel decoding), scrambling (or descrambling), modulation (or demodulation), layer mapping (or layer demapping). According to an embodiment, if DU (210) complies with O-RAN standard, it may be referred to as O-DU (O-RAN DU). DU (210) may be replaced and expressed as a first network entity for a base station (e.g., gNB) in embodiments of the present disclosure, if necessary. RU (220) may be in charge of lower layer functions of a wireless network. For example, RU (220) may perform part of PHY layer and RF functions. Here, a part of the PHY layer refers to functions of the PHY layer that are performed at a relatively lower level than the DU (210), and may include, for example, iFFT transform (or FFT transform), CP insertion (CP removal), and digital beamforming. The RU (220) may be referred to as an 'access unit (AU)', an 'access point (AP)', a 'transmission / reception point (TRP)', a 'remote radio head (RRH)', a 'radio unit (RU)', or other terms having an equivalent technical meaning thereto. According to an embodiment, when the RU (220) complies with the O-RAN standard, it may be referred to as an O-RU (O-RAN RU). The RU (220) may be expressed by being replaced with a second network entity for a base station (e.g., gNB) in embodiments of the present disclosure, as needed.

[0034] In FIG. 2, the base station (110) is described as including a DU (210) and a RU (220), but the embodiments of the present disclosure are not limited thereto. The base station according to the embodiments may be implemented in a distributed deployment according to a centralized unit (CU) configured to perform functions of upper layers of an access network (e.g., packet data convergence protocol (PDCP), radio resource control (RRC)) and a distributed unit (DU) configured to perform functions of lower layers. For example, the digital unit (DU) (210) may be implemented by being separated into the CU and the DU. Between a core (e.g., 5GC (5G core) or NGC (next generation core)) network and a radio network (RAN), the base station may be implemented in a structure in which the CU, DU, and RU are arranged in that order. The interface between the CU and the distributed unit (DU) may be referred to as an F1 interface.

[0035] A centralized unit (CU) can be connected to one or more DUs and can be responsible for functions at a higher layer than the DU. For example, the CU can be responsible for functions at the RRC (radio resource control) and PDCP (packet data convergence protocol) layers, while the DU and RU can be responsible for functions at lower layers. The DU can perform some functions (high PHY) of the RLC (radio link control), MAC (media access control), and PHY (physical) layers, while the RU can be responsible for the remaining functions (low PHY) of the PHY layer. In addition, for example, a digital unit (DU) can be included in a distributed unit (DU) depending on the implementation of a distributed deployment of the base station. Hereinafter, unless otherwise defined, the operations of DU (digital unit) and RU are described, but various embodiments of the present disclosure can be applied to both a base station arrangement including a CU and an arrangement in which a DU is directly connected to a core network (i.e., a base station in which the CU and DU are integrated into a single entity (e.g., an NG-RAN node)).

[0036] A housing is the outer shell that houses the internal components of various devices, such as electronic and mechanical devices. It is used to protect and secure the device components. Electronic devices that use power, such as network equipment, or mechanical devices that move physically, can generate heat during operation. Because heat can adversely affect the device's operation, housings are typically designed to dissipate heat to the outside. Recently, with the advancement of the electronics industry, circuit integration and miniaturization have led to closer integration of electronic components on printed circuit boards (PCBs). Furthermore, with the trend toward miniaturization of electronic devices, high-density and high-package packaging, including the PCBs themselves, are becoming increasingly important factors. When an electronic device operates, each of the electronic components on the PCB can generate heat. Failure to adequately dissipate the heat generated by these components can lead to reduced functionality and shortened product lifespan. Accordingly, to maintain optimal performance for electronic components mounted on printed circuit boards, an environment appropriate to the operating characteristics of each electronic component used in the device must be maintained. A device that disperses and dissipates heat generated within the device is essential.

[0037] Network communication equipment such as a base station (110), a terminal (120), a RAN intelligence controller (RIC), a central unit (CU), a DU, an RU, a massive MIMO (multiple input multiple output) unit (MMU), or an access unit (AU) may include a plurality of electronic components for generating a transmission signal to an external electronic device or processing a reception signal from an external electronic device. At least one electronic component may generate heat while the network communication equipment operates. The network communication equipment may have a heat dissipation structure to disperse the generated heat or release the heat to the outside. Hereinafter, in the present disclosure, a structure and related technologies for a heat dissipation structure for dissipating heat generated in network communication equipment such as a CU, a DU, an RU, an MMU, and an AU are described. Hereinafter, the network communication equipment may be referred to as an electronic device.

[0038] FIG. 3a illustrates an example of an external appearance of an electronic device (e.g., a base station (110), a terminal (120), a DU (210), a RU (220), an MMU, an AU) including a heat dissipation structure.

[0039] Referring to FIG. 3A, an electronic device may include a first housing (301) and a second housing (302). The first housing (301) may be referred to as an upper housing, and the second housing (302) may be referred to as a lower housing. The first housing (301) and the second housing (302) may be assembled to form a sealed space for protecting a printed board assembly (PBA) from the outside. A PBA is a collection of circuits including a board and a plurality of components installed on the board. Like a PBA, components disposed in the internal space formed by the first housing (301) and the second housing (302) may generate heat depending on their operation. For example, the operation may include transmitting and / or receiving signals for wireless communication, and data operations. According to one embodiment, each of the first housing (301) and the second housing (302) may include a plurality of fins for heat dissipation.

[0040] The housing of the electronic device (e.g., the first housing (301), the second housing (302)) can protect the PBA mounted inside the electronic device from the external environment. For example, the inner side of the housing that comes into contact with the PBA can have a shape with various heights due to the various sizes of the electronic components of the PBA. The outer side of the housing can include a plurality of fins to dissipate heat generated in the PBA to the outside (e.g., into the air). These fins can be referred to as heat dissipation fins. To effectively dissipate heat, the fins can have a plate shape with a large surface area. The electronic components inside the PBA can be in contact with the bottom surface of the housing. Through this, while the electronic components are operating (e.g., while the electronic components are processing a wireless signal), the heat generated from the electronic components of the PBA can be dissipated to the outside air through the bottom surface of the housing and the heat dissipation fins.

[0041] FIG. 3b illustrates an example of an electronic device (e.g., a base station (110), a terminal (120), a DU (210), a RU (220), an MMU, an AU) including a heat dissipation structure. FIG. 3b illustrates a cross-section of the interior of one housing (e.g., a first housing (301), a second housing (302)) of the electronic device.

[0042] Referring to FIG. 3B, an electronic device may include a housing (300). A plurality of electronic components may be arranged inside the housing (300) of the electronic device. The housing (300) of the electronic device may protect a printed circuit board assembly (PBA) mounted inside the product from the external environment. The PBA refers to a board completed by soldering electronic components to a printed circuit board (PCB). The PCB is an insulating board on which a conductive pattern (e.g., a pattern composed of copper wires) is formed for electrical connection of electronic components, and the PBA may be manufactured through a connection between electronic components and the conductive pattern. The inner side of the housing (300) that comes into contact with the PBA may have a shape having various heights due to various component heights above the PBA.

[0043] The exterior of the housing (300) may include a heat sink (310) to dissipate heat generated from the PBA to the outside. The heat sink (310) of the housing (300) may be formed for heat dissipation. According to one embodiment, the heat sink (310) may include a plurality of fins. Each fin of the plurality of fins may be referred to as a heat dissipation fin. To effectively dissipate heat, the fins may have a plate shape with a large surface area. For example, the housing (300) may be manufactured using a die casting method. The die casting method is one of the casting processes, which not only provides high productivity but also provides high precision because parts are manufactured using a mold. The die casting method includes a method of manufacturing parts using various metals (e.g., aluminum, zinc, magnesium, copper, tin, lead, and iron). For example, the housing (300) may be formed of aluminum. Aluminum is lightweight, has high thermal conductivity, and is also excellent in corrosion resistance. As network communication equipment becomes more functional and highly integrated, the demand for lightweight housing (300) also continuously arises. There are various methods for lightweighting the housing (300). For example, a technology may be used to reduce the weight by using magnesium, which has a lower specific gravity than aluminum, a lightweight metal, or by making the fin thickness of the housing (300) thinner. For example, in order to diffuse the heat from the high-heat generation unit to the surroundings and release it to the outside, a material with high thermal conductivity may be used instead of aluminum for the housing (300), or a separate component with high thermal conductivity (e.g., a graphite sheet, a heat pipe, a vapor chamber) may be attached to the inside of the housing (300).

[0044] The housing (300) can reduce the influence of corrosion due to exposure of the PBA or electronic components to external moisture or dust. Heat generated from the electronic components can be dissipated into the outside air through the fins on the inner surface of the housing (300). At least some components located on or within the PBA can come into contact with the surface of the housing (300). During operation of the electronic device, heat generated from the components can be dissipated into the outside air through the bottom surface and heat dissipation fins of the housing. Electronic components arranged in the PBA can have various temperature margins. For components with high heat generation or insufficient temperature margin among the electronic components, a vapor chamber or a heat pipe can be used to widely distribute the heat generated from the components to the fins of the heat sink (310) of the housing (300) with a wider area for sufficient heat dissipation. Generally, the vapor chamber or the heat pipe can be arranged between the electronic components and the inner surface of the housing (300). However, since the vapor chamber and heat pipe are made of copper, which has a higher specific gravity than aluminum, the electronic device may become heavier due to the additional heat dissipation components. It may be difficult to mount a large number of heat dissipation components on the electronic device.

[0045] The housing (300) according to embodiments of the present disclosure may have a vapor chamber structure inside the housing (300). The vapor chamber is a heat conductor using a refrigerant and may be configured to discharge heat through the refrigerant inside the metal plate space. By securing a space for a working fluid inside the housing (300), the housing (300) may be used not only to protect the product from the outside but also as a vapor chamber for heat dissipation. For example, the electronic component (340) (e.g., the first electronic component (341) and the second electronic component (342)) may contact the surface of the housing (300) through a thermal interface material (TIM). The heat of the electronic component (340) may heat the working fluid in the space inside the housing (300). The heat of the electronic component (340) may be transferred to the upper surface of the internal space through the working fluid. The housing (300) may include a base portion having a support to have an internal space to function as a vapor chamber. The electronic device may include a first base portion (361) for a first electronic component (341). The electronic device may include a second base portion (362) for a second electronic component (342). A space may be formed between the base portion (360) and a cover portion (not shown) of the housing (300), and a space may be formed inside the heat dissipation fins of the heat sink (310). A working fluid for heat dissipation may be placed in at least some of the spaces. Heat of the electronic component (340) may be transferred to the heat dissipation fins through the working fluid. The heat dissipation fins are exposed to the outside and function as a cooler, so that heat of the electronic device may be discharged to the outside. Since the housing (300) also functions as a vapor chamber, heat generated in the electronic component (340) may quickly diffuse to the surroundings.

[0046] FIG. 4 shows a front view of a housing having a vapor chamber (e.g., housing (300)).

[0047] Referring to FIG. 4, the housing (300) may include a base portion (410), a cover portion (420), and a plurality of pin portions (430). The base portion (410) may correspond to the bottom surface of the housing (300). The base portion (410) can transfer heat of an electronic component (e.g., an electronic component (340)) to the cover portion (420). In order to form a space (440a) for a working fluid inside the housing (300), the base portion (410) can include a support. The support can be formed to support the cover portion (420). By placing the cover portion (420) on the support of the base portion (410), a space (440a) can be formed between the base portion (410) and the cover portion (420). A working fluid (e.g., water) can be placed in at least a part of the space (440a). A plurality of pin portions (430) can be placed above the cover portion (420). For example, the plurality of pin portions (430) can include a first pin portion (431), a second pin (432), a third pin (433), a fourth pin (434), a fifth pin (435), It may include a sixth fin (436) and a seventh fin (437). A space through which refrigerant can flow may be formed inside each of the plurality of fin portions (430). In other words, each of the plurality of fin portions (430) may not be filled with a metal material, but may have a separate space (440b) formed in which a vacuum state or air portion is located. For the space (440b), one end of each of the plurality of fin portions (430) may include an opening. At least a portion of the space (440a) and the space (440b) may contain a working fluid for the vapor chamber. Through the opening, at least a portion of the working fluid may move from the space (440a) to the space (440b) or from the space (440b) to the space (440a).

[0048] Fig. 5 is a perspective view of a housing (e.g., housing (300)) having a vapor chamber. While Fig. 4 illustrates an interior space (440) of the housing (300), Fig. 5 is a view of the housing (300) viewed from the outside.

[0049] Referring to FIG. 5, the housing (300) may include a base portion (410), a cover portion (420), and a plurality of pin portions (430). The cover portion (420) of the housing (300) may include a plurality of slots (510). The plurality of slots (510) may respectively correspond to the plurality of pin portions (430). A corresponding pin may be inserted into each of the plurality of slots (510), and a portion of the pin may be soldered while being inserted into the corresponding slot. Through the soldering, the pin may be coupled to the cover portion (420) as a part of the housing (300).

[0050] The housing (300) having a vapor chamber described through FIGS. 4 and 5 may have a space for a working fluid not only between the bottom surface of the housing (e.g., the bottom surface of the base portion (410)) and the cover portion (420), but also inside each fin. Due to the space, the thermal resistance between the bottom surface and each fin is eliminated, enabling efficient heat dissipation, and weight reduction and miniaturization of the product can be achieved. In order to implement a vapor chamber in a three-dimensional space, sufficient space (440b) must be secured inside each fin. For the injection of the working fluid, the lower end of the fin may include an opening. The fin should not only be simply coupled to the cover portion (420), but also be bonded to the cover portion (420) so that the fluid does not leak out. For example, the base portion (410), the cover portion (420), and the plurality of fin portions (430) may be bonded using an aluminum brazing process. Since the fluid injected into the housing (300) must not leak out, sealing is required during the joining. For example, the cover portion (420) may be formed of an aluminum clad material having different aluminum materials. The aluminum clad material refers to a material formed of aluminum materials having different melting points. By brazing near the lowest melting point, the molten aluminum material can permeate the microscopic gaps of the slots by capillary action, thereby joining the cover portion (420) and the plurality of pin portions (430).

[0051] When the corresponding pins of the plurality of pin portions (430) are fitted into each of the slots (510) of the cover portion (420), a sufficient amount of molten aluminum material is required to be supplied so that leakage does not occur in the gaps between the slots. On the other hand, the excess molten aluminum that remains after filling the gaps between each pin and the slots of the cover portion (420) (e.g., the slots (510)) may be arranged to spread to the ends of the pins and block the openings of the pins. As the openings of some of the pins among the plurality of pin portions (430) are blocked by the aluminum cladding, it may be difficult for the working fluid to flow into the internal spaces of some of the pins. If the working fluid cannot enter the internal spaces of some of the pins, the heat dissipation characteristics of the housing (300) may be deteriorated. In the present disclosure, in order to solve the above-described problem when manufacturing a housing (300) having a vapor chamber, the shapes of the components of the housing (300) are proposed. The shapes of the components of the housing (300) are described to secure a space (e.g., space (440a), space (440b)) for a working fluid inside the housing (300) and to prevent the openings of each pin of the plurality of pin portions (430) of the housing (300) from being blocked by molten aluminum.

[0052] 1. Shape of the opening of the heat dissipation fin

[0053] Fig. 6 illustrates an example of components of a housing having a vapor chamber (e.g., housing (300)). In Fig. 6, for convenience of explanation, the (+) y-axis direction is described as the upward direction and the (-) y-axis direction is described as the downward direction. However, this description is not to be construed as limiting the arrangement of the housing (300) or an electronic device including the housing (300).

[0054] Referring to FIG. 6, the pin portion (431) can be inserted into the slot (510). A portion of the pin portion (431) can protrude above the first surface (621) of the cover portion (420), and another portion (e.g., portion (630)) of the pin portion (431) can protrude below the second surface (622) of the cover portion (420). A fluid can be injected into the pin portion (431) of the housing (300) having the vapor chamber. The pin portion (431) can have an opening so that the fluid can be injected into the interior of the pin portion (431).

[0055] The depth at which the fin portion (431) is inserted into the slot (510) can be determined by various conditions. To provide a space between the base portion (410) and the cover portion (420), the fin portion (431) should be positioned so as not to touch the bottom surface (610) of the base portion (410). In addition, the more the fin portion (431) is exposed to the outside, the better the heat dissipation performance can be. However, if the fin portion (431) is positioned only on the first surface (621) of the cover portion (420), the opening at the bottom of the fin portion (431) may be partially blocked by molten aluminum. This blockage of the opening indicates that the working fluid of the vapor chamber cannot smoothly move into the internal space of the fin portion (431), thereby causing a deterioration in heat dissipation performance. Considering the relationships described above, the fin portion (431) may be positioned so as to penetrate the slot (510). For example, the thickness of the cover portion (420) may be about 1.5 mm or more and less than 3.0 mm. A portion (630) of the pin portion (431) may protrude about 0.5 mm or more below the second surface (622) of the cover portion (420). The pin portion (431) may include a protruding region so that a portion (630) of the pin portion (431) protrudes and is fixed only by a specific length. The protruding region is described in detail with reference to FIGS. 8A to 8D .

[0056] As described above, the cover portion (420) may be formed of an aluminum clad material having different aluminum materials. For example, the cover portion (420) may be formed of an aluminum clad material having a structure such as "Al40xx / A10xx or Al30xx / Al40xx" or "A10xx or Al30xx / Al40xx". Through an aluminum brazing process, the cover portion (420) may be joined to the pin portion (431). Through the aluminum brazing process, the cover portion (420) may also be joined to the base portion (410). While the aluminum brazing process is performed, the molten aluminum of the cover portion (420) may fill the slot (510) and flow into other gaps. At this time, in order to prevent the molten aluminum from flowing into the opening of the pin portion (431), the pin portion (431) may protrude a certain distance from the second surface (622) of the cover portion (420). A portion (630) of the pin portion (431) is exposed in the space (440a). In order to prevent the inflow of the molten aluminum and to fill the empty space of the slot (510), a portion (630) of the pin portion (431) may have a shape in which the opening is expanded through an expansion process. For example, a portion (630) of the pin portion (431) may have a shape in which both sides of the aluminum sheets come into contact with the second surface (622) of the cover portion (420) through an expansion process after the pin portion (431) is inserted into the slot (510). For another example, a portion (630) of the pin portion (431) may be inserted into the slot (510) of the cover portion (420) with the end portion spread out.

[0057] The base portion (410) may include a first column portion (651) and a second column portion (652). Each column portion secures a space for the fluid, and when the base portion (410) and the cover portion (420) are joined, the working fluid within the space is subjected to pressure due to temperature, thereby preventing the product from being deformed.

[0058] Although an aluminum brazing process is described in FIG. 6, embodiments of the present disclosure are not limited thereto. In addition to the aluminum brazing process described above, various welding methods such as laser, friction stir welding (FSW), and / or friction stir welding may be utilized.

[0059] 2. Protruding areas of the heat sink fins

[0060] Figures 7a and 7b illustrate the connection structure between components of a housing having a vapor chamber (e.g., housing (300)). Figure 7a illustrates the shape of a pin having an internal space for a working fluid. Figure 7b illustrates the connection structure of a pin portion (431), a base portion (410), and a cover portion (420).

[0061] Referring to FIG. 7A, the fin portion (431) may include a heat sink region. The heat sink region may include a first connection region (711), a second connection region (712), and a heat sink region (720). The heat sink region may be joined to a support of the cover portion (420) or the base portion (410) through each of both sides. On a first side of the heat sink region (e.g., a region corresponding to the (+) y-axis direction), the first connection region (711) may be joined to a support of the cover portion (420) or the base portion (410). On a second side of the heat sink region (e.g., a region corresponding to the (-) y-axis direction), the second connection region (712) may be joined to a support of the cover portion (420) or the base portion (410). The first connection region (711) may be joined to both aluminum sheets. The second connection region (712) may be formed by bonding both aluminum sheets. The heat dissipation region (720) between the first connection region (711) and the second connection region (712) may include a space through which a working fluid flows. The fin portion (431) may be formed by partially bonding two aluminum sheets (e.g., the first aluminum sheet and the second aluminum sheet). Some portions of the two aluminum sheets may be bonded and other portions may not be bonded. The heat dissipation region (720) may include a bonded region (721) and a non-bonded region (722). If the two aluminum sheets are not bonded, a space through which a working fluid may flow may be formed inside the two aluminum sheets. The non-bonded region (722) may have a shape that is inflated by air blow. The working fluid for the vapor chamber may flow through the space of the non-bonded region (722). In other words, a path through which the working fluid flows can be formed in the space corresponding to the non-bonded region (722).

[0062] Referring to FIG. 7B, the pin portion (431) can be coupled with the base portion (410) and the cover portion (420). The first connection area (711) of the pin portion (431) can be inserted into a slot corresponding to the pin portion (431) and can contact an area of ​​the base portion (410). A protruding area (or may be referred to as a protruding area) at the lower end of the first connection area (711) corresponding to the lower end of the pin portion (431) allows the heat dissipation area (720) of the pin portion (431) to be spaced apart from the base portion (410) by a certain distance. A certain space can be maintained between the base portion (410) and the cover portion (420) through the protruding area of ​​the first connection area (711). However, when the first connection area (711) penetrating the slot and the cover portion (420) are joined, there is still a possibility that the molten aluminum of the cover portion (420) will flow beyond the first connection area (711) into the non-joined area (722).

[0063] In the present disclosure, in order to solve the problem of the lower part of the pin portion (431) being blocked, the shape of the pin portion (431) and the structure in which the pin portion (431) is fastened to the base portion (410) or the cover portion (420) are described. When the pin portion (431) is inserted into the slot (510) of the cover portion (420), the pin portion (431) may be positioned so that the lower end (e.g., the non-bonded area (722)) of the pin portion (431) maintains a certain height from the bottom surface (610) of the base portion (410). The pin portion (431) may include protruding regions so that the pin portion (431) passes through the slot (510) and hangs over the cover portion (420) while maintaining a certain height from the bottom surface (610) of the base portion (410). The protruding regions are described in detail below with reference to FIGS. 8A to 8D .

[0064] FIGS. 8A to 8D illustrate examples of arrangements of protruding areas of a housing for separation of a cover portion (e.g., a cover portion (420)) and a base portion (e.g., a base portion (410)) of a housing (e.g., a housing (300)).

[0065] Referring to FIG. 8a, the plan view (801a) is a drawing of the connection structure of the pin portion (431) and the base portion (410) as viewed from above (e.g., as viewed in the (-) z-axis direction). The front view (802a) is a drawing of the connection structure of the pin portion (431) and the base portion (410) as viewed from the front (e.g., as viewed in the (-) x-axis direction). Both ends of the heat sink region may be in a straight line shape. The pin portion (431) may be arranged such that each of the first connection region (711) and the second connection region (712) hangs over the support of the base portion (410). For example, the first connection region (711) of the pin portion (431) may be coupled with the support (821) of the base portion (410). However, since the pin portion (431) is inserted to the same thickness as the cover portion (410), it is difficult for the pin portion (431) to have a portion that protrudes toward the second surface (622) of the cover portion (410). Since there is no protruding portion, the expansion described in FIG. 6 is difficult. Therefore, the structure of FIG. 8a can cause the molten aluminum of the cover portion (420) to block the opening of the heat dissipation area (720).

[0066] Referring to FIG. 8b, the plan view (801b) is a drawing of the connection structure of the pin portion (431) and the base portion (410) as viewed from above (e.g., as viewed in the (-) z-axis direction). The front view (802b) is a drawing of the connection structure of the pin portion (431) and the base portion (410) as viewed from the front (e.g., as viewed in the (-) x-axis direction). Both ends of the heat sink region may include protruding portions. The pin portion (431) may have a first connection region (711) and a second connection region (712) each having a protruding shape. For example, the first connection region (711) of the pin portion (431) may have a protruding portion (811) protruding in the (-) z-axis direction. The protruding portion (811) of the first connection region (711) may function as a stopper. The base portion (410) may have the shape of a support (821) and a step portion (823). The step portion (823) may be in contact with the protruding portion (811). Through the protruding portion (811), the heat dissipation area (720) of the fin portion (431) may be spaced apart from the base portion (410) by a certain distance or more. Since a part of the fin portion (431) protrudes below the second surface (622) of the cover portion (420), the fin portion (431) may have the extended shape described in FIG. 6. However, there is a risk that molten aluminum may flow into the heat dissipation area (720) of the fin portion (431) due to the joint between the first connection area (711) and the slot of the cover portion (420) in the y-axis direction.

[0067] Referring to FIG. 8c, the plan view (801c) is a drawing of the connection structure of the pin portion (431) and the base portion (410) as viewed from above (e.g., as viewed in the (-) z-axis direction). The front view (802c) is a drawing of the connection structure of the pin portion (431) and the base portion (410) as viewed from the front (e.g., as viewed in the (-) x-axis direction). Both ends of the heat sink region may include protruding portions. Unlike FIG. 8b, the protruding portions may protrude on the xy plane. The pin portion (431) may have a shape in which each of the first connection region (711) and the second connection region (712) protrudes on the xy plane. For example, the first connection region (711) of the pin portion (431) may have a protruding portion (813) that protrudes in the (+) y-axis direction. The protruding portion (813) of the first connection area (711) can function as a stopper. The base portion (410) can have a shape of a support (821). The protruding portion (813) can be combined with the support (821) of the base portion (410). The protruding portion (813) can hang over one side of the support (821) of the base portion (410). By hanging the protruding portion (813) over one side of the support (821) of the base portion (410), the heat dissipation area (720) can be spaced apart from the bottom surface of the base portion (410) by a certain distance or more. In addition, due to the protruding portion (813), the distance of the first connection area (711) in the y-axis direction can be formed longer than the distance of the first connection area (711) of FIG. 8A or FIG. 8B. Since a portion of the pin portion (431) protrudes below the second surface (622) of the cover portion (420), the pin portion (431) may have an extended shape as described in Fig. 6. The protruding portion (813) may span the upper surface of the support (821), and the first connection area (711) may have a wider bonding area in the y-axis direction than the first connection area (711) of Fig. 8a or Fig. 8b.Due to this shape, molten aluminum from the cover portion (420) does not block the lower portion of the pin portion (431) during joining.

[0068] Referring to FIG. 8d, the plan view (801d) is a drawing of the connection structure of the pin portion (431) and the base portion (410) as viewed from above (e.g., as viewed in the (-) z-axis direction). The front view (802d) is a drawing of the connection structure of the pin portion (431) and the base portion (410) as viewed from the front (e.g., as viewed in the (-) x-axis direction). Both ends of the heat sink region may include protruding portions. The protruding portions may protrude on the xy plane, as shown in FIG. 8c. The pin portion (431) may have a shape in which each of the first connection region (711) and the second connection region (712) protrudes on the xy plane. For example, the first connection region (711) of the pin portion (431) may have a protruding portion (815) that protrudes in the (+) y-axis direction. The protruding portion (815) of the first connection area (711) can function as a stopper. The protruding portion (815) can be coupled with the cover portion (420) of the base portion (410). Unlike FIG. 8C, the protruding portion (815) may not penetrate the slot of the cover portion (420). Therefore, the protruding portion (815) can be positioned on the first surface (621) of the cover portion (420). By the protruding portion (815) being hung on the first surface (621) of the cover portion (420), the heat dissipation area (720) can be spaced apart from the bottom surface of the base portion (410) by a certain distance or more. In addition, due to the protruding portion (815), the distance of the first connection area (711) in the y-axis direction can be formed to be longer than the distance of the first connection area (711) of FIG. 8A or FIG. 8B. Since a portion of the pin portion (431) protrudes below the second surface (622) of the cover portion (420), the pin portion (431) may have an extended shape as described in FIG. 6. The protruding portion (815) may span the upper surface (e.g., the first surface (622)) of the cover portion (420), and the first connection area (711) may have a wider bonding area in the y-axis direction than the first connection area (711) of FIG. 8a or FIG. 8b.Due to this shape, molten aluminum from the cover portion (420) does not block the lower portion of the pin portion (431) during joining.

[0069] FIGS. 9A and 9B illustrate examples of pins (e.g., pin portions (431)) of a housing (e.g., housing (300)) having a vapor chamber.

[0070] Referring to Fig. 9a, the shape of the heat dissipation fin according to the plan view (802a) and the front view (802b) of Fig. 8b is illustrated. The fin portion (431) may include a first connection region (711), a second connection region (712), and a heat dissipation region (720). The heat dissipation region (720) may include a connection region (721) and a non-connection region (722), and the space inside the non-connection region (722) may be used as a path for a working fluid for the vapor chamber. The protruding portion (811) may be formed to extend from the first connection region (711) in the (-) z-axis direction, and the heat dissipation region (720) may be spaced apart from the bottom surface (610) of the base portion (410) by a certain distance or more through the protruding portion (811).

[0071] Referring to FIG. 9b, the shape of the heat dissipation fin according to the plan view (802c) and the front view (802c) of FIG. 8c is illustrated. The fin portion (431) may include a first connection region (711), a second connection region (712), and a heat dissipation region (720). The heat dissipation region (720) may include a connection region (721) and a non-connection region (722), and the space inside the non-connection region (722) may be used as a path for a working fluid for the vapor chamber. The protruding portion (811) may be formed to extend from the first connection region (711) in the (+) y-axis direction, and the heat dissipation region (720) may be spaced apart from the bottom surface (610) of the base portion (410) by a certain distance or more through the protruding portion (813).

[0072] The first connection region (711) of the pin portion (431) of FIG. 9B may extend in one direction (e.g., in the (-) y-axis direction) more than the first connection region (711) of the pin portion (431) of FIG. 9A. The second connection region (712) may extend in the opposite direction (e.g., in the (+) y-axis direction) of the first connection region (711) of FIG. 9A. For example, referring to the lower end of the pin portion (431), the portion where the non-bonded region (722) begins after the first connection region (711) in the one direction (e.g., in the (-) y-axis direction) of FIG. 9B may be located later than the portion where the non-bonded region (722) begins after the first connection region (711) in the one direction (e.g., in the (-) y-axis direction) of FIG. 9A. For example, referring to the bottom of the pin portion (431), the part where the non-bonded region (722) starts after the second connected region (712) in the above-mentioned one direction (e.g., (+) y-axis direction) in FIG. 9b may be located later than the part where the non-bonded region (722) starts after the second connected region (712) in the above-mentioned one direction (e.g., (+) y-axis direction) in FIG. 9b. In other words, the distance between the support (821) and the lower part of the non-bonded region (722) in FIG. 9b may be longer than the distance between the support (821) and the lower part of the non-bonded region (722) in FIG. 9b. By increasing the distance from the support (821) to the non-bonded region (722), the risk of molten aluminum flowing into the space inside the non-bonded region (722) during the process may be reduced.

[0073] To secure space in the vapor chamber while reducing the risk of the opening being blocked, the area bonded to the slot (e.g., the lower portion of the boundary between the first connection area (711) and the non-bonded area (722), the lower portion of the boundary between the second connection area (712) and the non-bonded area (722)) may be formed to be further away from the support (821) than the other areas. For example, the boundary between the first connection area (711) and the non-bonded area (722) may be formed to be further from the support (821) as it goes downward. The boundary between the second connection area (712) and the non-bonded area (722) may be formed to be further from the support (821) as it goes downward. In one embodiment, the non-bonded area (722) of the heat dissipation area (720) may have a width (e.g., a length in the y-axis direction) that becomes narrower as it goes downward. For example, the width of a portion of a non-bonded region (722) located below a protruding portion (813) of each connecting region (e.g., a first connecting region (711), a second connecting region (712)) may be narrower than the width of a portion of a non-bonded region (722) located above the protruding portion (813). Among the regions of the non-bonded region (722) of the heat dissipation region (720), a region that is bonded to a slot (510) or a cover portion (420) may be formed far from the support (821).

[0074] 3. Pillars of the base

[0075] Fig. 10 shows an example of the design of columns of a base portion (e.g., base portion (410)).

[0076] Referring to FIG. 10, the base portion (410) may include a plurality of column portions (e.g., a first column portion (1001), a second column portion (1002), a third column portion (1003), a fourth column portion (1004), a fifth column portion (1005), a sixth column portion (1006), a seventh column portion (1007), an eighth column portion (1008), a ninth column portion (1009), a tenth column portion (1010), an eleventh column portion (1011), a twelfth column portion (1012), and a thirteenth column portion (1013)). Each column may be referred to as a boss.

[0077] The pin portion (431) is inserted into the slot (510) of the cover portion (420), and a lower portion (e.g., a portion (630)) of the pin portion (431) can be expanded. After the assembly of the pin portion (431) and the cover portion (420) is placed on the base portion (410), a brazing process can be performed. A separate jig can be used to ensure the quality of the bonding between the base portion (410), the cover portion (420), and the plurality of pin portions (430). However, as the size of the electronic device increases and the number of brazing operations for the pin portions (430) increases, the flatness (e.g., how flat it is) of the cover portion (420) can deteriorate. A deterioration in flatness can mean that the surface of the cover portion (420) is warped. As the surface of the cover portion (420) becomes more rounded, at least some of the pillar portions of the base portion (410) may not be joined to the second surface (622) of the cover portion (420). Due to the pillar portions that are not joined among the plurality of pillar portions, the heat dissipation performance of the vapor chamber of the housing (300) may deteriorate.

[0078] In order to solve the above-described problem, the housing (300) according to embodiments of the present disclosure may have column parts having different heights. In one embodiment, the housing (300) may include column parts having different heights depending on the position of the column parts. Each column part may have a relatively lower height as it approaches the periphery of the base part (410) and a relatively higher height as it approaches the center of the base part (410). For example, even if the cover part (420) is bent downward at both ends, the column parts may all be joined to the second surface (622) of the cover part (420) due to the height difference between the column parts. As a non-limiting example, the maximum height difference between the column parts may be designed to be about 0.3 mm or less. For example, the column heights of the column parts of the first group (e.g., the first column part (1001), the second column part (1002), the third column part (1003), the eleventh column part (1011), the twelfth column part (1012), and the thirteenth column part (1013)) may be different from the column heights of the column parts of the second group (e.g., the fourth column part (1004), the fifth column part (1005), the ninth column part (1009), and the tenth column part (1010)). The column heights of the first group and the column heights of the second group may have a height difference by a first distance (1020) (e.g., about 0.1 mm). The column heights of the column parts of the second group (e.g., the fourth column part (1004), the fifth column part (1005), the ninth column part (1009), and the tenth column part (1010)) may be different from the column heights of the column parts of the third group (e.g., the sixth column part (1006), the seventh column part (1007), and the eighth column part (1008)). The column heights of the second group and the column heights of the third group may have a height difference by a second distance (1030) (e.g., about 0.1 mm).

[0079] FIGS. 11A and 11B illustrate examples of electronic devices (e.g., base station (110), terminal (120), DU (210), RU (220), MMU, AU) including a housing having a vapor chamber.

[0080] Referring to FIG. 11A, an electronic device may include a housing (300). The housing (300) may include a base portion (410), a cover portion (420), and a plurality of fin portions (430). Due to the brazing process, the components of the housing (300) may be formed as a molten integral body. The housing (300) may be configured to dissipate heat generated from each electronic component to the outside. Each fin of the plurality of fin portions (430) may be configured to be exposed to the air and cool the generated heat due to the electronic device being placed outdoors.

[0081] An electronic device may include a PCB (1120). The PCB (1120) may be configured as a PBA by being combined with electronic components configured in a circuit form. A plurality of electronic components may be arranged on one surface of the PCB (1120). For example, an electronic component (1130) may be arranged on one surface of the PCB (1120). For example, the electronic component (1130) may be a module (e.g., RFFE, FEM, FEMid, PAMid, LPAMid) or a chip including a power amplifier. Heat generated in the electronic component (1130) may be transferred to the housing (300) through the plurality of components. For example, the electronic device may include a TIM (1140), a vapor chamber (1150), and a TIM (1160). For example, each of the TIM (1140) and the TIM (1160) may include a thermal pad, a gel, or grease. Since each of the TIM (1140) and the TIM (1160) includes metal and ceramic particles having thermal conductivity characteristics based on a polymer material, the arrangement of the TIM (1140) or the TIM (1160) can lower the mechanical tolerance and increase the thermal conductivity at the interface. The heat generated in the electronic component (1130) can be released through the vapor chamber (1150). The heat can come into contact with the vapor chamber (1150) and spread to the periphery as much as the area of ​​the vapor chamber (1150). The heat transferred through the vapor chamber (1150) and the TIM (1160) can be transferred to the plurality of fin portions (430) through the housing (300). However, since the TIM (1140) and the TIM (1160) are added for the attachment of a separate vapor chamber (1150), the heat dissipation performance can be relatively lowered due to the thermal resistance of the TIM. Therefore, it is difficult to maximize the heat dissipation performance due to the vapor chamber of the housing (300) with the arrangement structure of Fig. 11a.

[0082] Referring to FIG. 11B, an electronic device may include a housing (300). The electronic device may include a PCB (1120). The electronic device may include an electronic component (1130). The electronic device may include a TIM (1140). For each component, the descriptions of FIG. 11A may be referred to. The electronic device of FIG. 11B may include a base portion (410) having an outer shape that includes a portion adjacent to the electronic component (1130) so as to avoid the need for a separate vapor chamber. For example, one side of the base portion (410) may protrude in one direction (e.g., the (-) z-axis direction) so as to contact the electronic component (1120) through the TIM (1140). The separate vapor chamber uses copper, which has high thermal conductivity but high specific gravity, but the structure illustrated in FIG. 11B is advantageous in weight reduction because the vapor chamber is omitted. However, the heat of the electronic component (1130) is transferred to the cover portion (420) and the plurality of fin portions (430) through the working fluid in the internal space of the housing (300). As the internal space expands downward, additional thermal resistance may occur. An appropriate amount of the working fluid is vaporized by the heat and moves with the heat, but too much fluid remains in a fluid state and may act as a thermal resistor.

[0083] FIGS. 12A and 12B illustrate examples of electronic devices (e.g., base station (110), terminal (120), DU (210), RU (220), MMU, AU) including a housing having a vapor chamber.

[0084] Referring to FIG. 12A, the electronic device may include a housing (300). The electronic device may include a PCB (1120). The electronic device may include an electronic component (1130). The electronic device may include a TIM (1140). For each component, the descriptions of FIGS. 11A and 11B may be referred to. To accommodate different heights of the PCB (1120) and the electronic component (1130), the base portion (410) of the housing (300) may have a block portion (1210). The block portion (1210) may be an aluminum portion and may be used to fill a space between the bottom surface of the base portion (410) and the electronic component (1130). For example, the block portion (1210) may be manufactured integrally with or molded together with the base portion (410). For another example, the block portion (1210) may be a separate aluminum block and may be bonded to the second surface (622) of the base portion (410) during an aluminum brazing process. The size of the block portion (1210) should be larger than the size of the electronic component (1130) which is a heat source. Since the block portion (1210) is filled with aluminum material, there is no thermal resistance at the interface, and thus it can provide higher heat dissipation performance than the structure including the vapor chamber (1150) of FIG. 11A.

[0085] Referring to FIG. 12B, the electronic device may include a housing (300). The electronic device may include a PCB (1120). The electronic device may include an electronic component (1130). The electronic device may include a TIM (1140). For each component, the descriptions of FIGS. 11A and 11B may be referred to. To accommodate various heights of the PCB (1120) and the electronic component (1130), the base portion (410) of the housing (300) may include a porous medium (1260). For example, the porous medium (1260) may be formed by sintering stainless steel, aluminum, copper, and / or other metal powders. As another example, the porous medium (1260) may be formed through a ceramic powder material.

[0086] An appropriate amount of working fluid is vaporized by heat and moves with the heat, but too much fluid may remain in a fluid state and act as a thermal resistor. Fluid tends to remain near the electronic component (1130). To reduce the amount of fluid and thereby reduce the thermal resistance, a porous medium (1260) may be placed within the space of the housing (300). The porous medium (1260) may include fine pores. For example, the porous medium (1260) may include fine pores of about several micrometers (um). Due to the hydrophilic and porous material, the fluid can be absorbed by the porous medium (1260). The porous medium (1260) can absorb the fluid and evenly spread the absorbed fluid within the porous medium (1260). A fluid exists inside the porous medium (1260) and can be easily vaporized by a heat source (e.g., heat from an electronic component (1130)).

[0087] In some embodiments, an electronic device is provided. The electronic device may include a printed circuit board, an electronic component disposed on one surface of the printed circuit board, and a housing for heat dissipation of the electronic component. The housing may include a base portion for the electronic component, a cover portion disposed on a support of the base portion, and a plurality of fin portions coupled with the cover portion. Each of the plurality of fin portions may have a heat dissipation region and protruding regions. A portion of the heat dissipation region may be arranged to protrude from a first surface of the cover portion, and another portion of the heat dissipation region may be arranged to protrude from a second surface of the cover portion opposite to the first surface. The protruding regions may be coupled to the support portion or the cover portion such that the heat dissipation region is arranged to be spaced apart from one surface of the base portion by a predetermined distance or more.

[0088] For example, at least a portion of the space between the base portion and the cover portion and the internal space of each of the plurality of fin portions may contain a working fluid. Another portion of the heat sink region may include an opening for the internal space.

[0089] For example, the other part of the heat sink area may have a shape in which the opening extends in the direction in which the second surface faces.

[0090] For example, the cover portion may be formed based on a clad formed by combining a first aluminum material and a second aluminum material having different melting points.

[0091] For example, the cover portion may include a plurality of slots. Each of the plurality of pin portions may be positioned to penetrate a corresponding slot among the plurality of slots.

[0092] For example, the heat sink region may include a first connection region where a first aluminum sheet and a second aluminum sheet are bonded on a first side, a second connection region where the first aluminum sheet and the second aluminum sheet are bonded on a second side opposite to the first side, and a heat sink region having a boundary where the first aluminum sheet and the second aluminum sheet are not bonded. In each of the first connection region and the second connection region, a first bonding length corresponding to a first height from one side of the support may be longer than a second bonding length corresponding to a second height higher than the first height from one side of the support.

[0093] For example, the base portion may include a plurality of columns arranged on the one surface of the base portion. The plurality of columns may include a first column having a first height and a second column having a second height greater than the first height. The second column may be arranged closer to the center of the one surface of the base portion than the first column.

[0094] For example, the base portion may include a vapor chamber portion having an internal space through the support, and an aluminum block portion between the vapor chamber portion and the electronic component.

[0095] For example, the space between the base portion and the cover portion may include a porous medium disposed on one surface of the base portion.

[0096] For example, the electronic device may further include a thermal interface material (TIM). The TIM may be in contact with the electronic component and the base portion.

[0097] For example, the electronic component may include at least one processor, at least one central processing unit (CPU), or at least one field programmable gate array (FPGA).

[0098] For example, the electronic device may include a radio unit (RU), a distributed unit (DU), a digital unit (DU), or a massive multiple input multiple output (MIMO) unit (MMU).

[0099] In embodiments, a housing having a vapor chamber is provided. The housing may include a base portion having a support, a cover portion disposed on the support of the base portion, and a plurality of fin portions coupled with the cover portion. Each of the plurality of fin portions may have a heat dissipation region and protruding regions. A portion of the heat dissipation region may be disposed to protrude from a first surface of the cover portion, and another portion of the heat dissipation region may be disposed to protrude from a second surface of the cover portion opposite to the first surface. The protruding regions may be coupled to the support or the cover portion such that the heat dissipation region is disposed at a predetermined distance or more from one surface of the base portion.

[0100] For example, at least a portion of the space between the base portion and the cover portion and the internal space of each of the plurality of fin portions may contain a working fluid. Another portion of the heat sink region may include an opening for the internal space.

[0101] For example, the other part of the heat sink area may have a shape in which the opening extends in the direction in which the second surface faces.

[0102] For example, the cover portion may be formed based on a clad formed by combining a first aluminum material and a second aluminum material having different melting points.

[0103] For example, the cover portion may include a plurality of slots. Each of the plurality of pin portions may be positioned to penetrate a corresponding slot among the plurality of slots.

[0104] For example, the heat sink region may include a first connection region where a first aluminum sheet and a second aluminum sheet are bonded on a first side, a second connection region where the first aluminum sheet and the second aluminum sheet are bonded on a second side opposite to the first side, and a heat sink region having a boundary where the first aluminum sheet and the second aluminum sheet are not bonded. In each of the first connection region and the second connection region, a first bonding length corresponding to a first height from one side of the support may be longer than a second bonding length corresponding to a second height higher than the first height from one side of the support.

[0105] For example, the base portion may include a plurality of columns arranged on the one surface of the base portion. The plurality of columns may include a first column having a first height and a second column having a second height greater than the first height. The second column may be arranged closer to the center of the one surface of the base portion than the first column.

[0106] For example, the space between the base portion and the cover portion may include a porous medium disposed on one surface of the base portion.

[0107] For one or more embodiments, at least one of the components described in one or more of the preceding drawings may be configured to perform one or more operations, techniques, processes, and / or methods as described herein. For example, a processor (e.g., a baseband processor) described herein with respect to one or more of the preceding drawings may be configured to operate according to one or more examples described herein. For another example, circuitry associated with a user equipment (UE), a base station, a network element, and the like, as described above with respect to one or more of the preceding drawings, may be configured to operate according to one or more examples described herein.

[0108] Any of the embodiments described above may be combined with any other embodiment (or combination of embodiments) unless explicitly stated otherwise. The foregoing description of one or more implementations provides examples and descriptions, but is not intended to be exhaustive or limit the scope of the embodiments to the precise forms disclosed. Modifications and variations are possible in light of the above teachings or may be learned from practicing various embodiments.

[0109] The methods according to the embodiments described in the claims or specification of the present disclosure may be implemented in the form of hardware, software, or a combination of hardware and software.

[0110] When implemented in software, a computer-readable storage medium storing one or more programs (software modules) may be provided. The one or more programs stored in the computer-readable storage medium are configured for execution by one or more processors in an electronic device. The one or more programs include instructions that cause the electronic device to execute methods according to embodiments described in the claims or specifications of the present disclosure. The one or more programs may be provided as included in a computer program product. The computer program product may be traded between sellers and buyers as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read only memory (CD-ROM)) or an application store (e.g., Play Store). ™ ) or directly between two user devices (e.g., smart phones), online distribution (e.g., downloading or uploading). In the case of online distribution, at least a portion of the computer program product may be at least temporarily stored or temporarily created in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0111] These programs (software modules, software) may be stored in random access memory, non-volatile memory including flash memory, read only memory (ROM), electrically erasable programmable read only memory (EEPROM), magnetic disc storage devices, compact disc-ROM (CD-ROM), digital versatile discs (DVDs) or other forms of optical storage devices, magnetic cassettes, or may be stored in memories formed by a combination of some or all of these. In addition, each configuration memory may include multiple copies.

[0112] Additionally, the program may be stored on an attachable storage device that is accessible via a communication network, such as the Internet, an intranet, a local area network (LAN), a wide area network (WAN), a storage area network (SAN), or a combination thereof. Such a storage device may be connected to a device implementing an embodiment of the present disclosure via an external port. Additionally, a separate storage device on the communication network may be connected to a device implementing an embodiment of the present disclosure.

[0113] In the specific embodiments of the present disclosure described above, components included in the disclosure are expressed singularly or plurally, depending on the specific embodiment presented. However, the singular or plural expressions are selected to suit the presented situation for convenience of explanation, and the present disclosure is not limited to singular or plural components. Components expressed in plural may be composed of singular elements, or components expressed in singular may be composed of plural elements.

[0114] According to embodiments, one or more of the components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., modules or programs) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0115] Meanwhile, although the detailed description of the present disclosure has described specific embodiments, it is obvious that various modifications are possible within the scope of the present disclosure.

Claims

1. In electronic devices, printed circuit board; Electronic components arranged on one side of the printed circuit board; and Including a housing for heat dissipation of the above electronic components, The housing includes a base portion for the electronic component, a cover portion arranged on a support of the base portion, and a plurality of pin portions coupled with the cover portion. Each of the above plurality of fin portions has a heat sink region and a protruding region, A portion of the heat sink area is arranged to protrude from a first surface of the cover portion, and another portion of the heat sink area is arranged to protrude from a second surface of the cover portion opposite to the first surface, The above protruding regions are combined with the support or the cover portion so that the heat sink region is positioned at a certain distance or more from one side of the base portion. Electronic devices.

2. In claim 1, At least a portion of the space between the base portion and the cover portion and the internal space of each of the plurality of pin portions contains a working fluid, said other part of said heat sink area including an opening for said internal space, Electronic devices.

3. In claim 2, The other part of the above heat sink area has a shape in which the opening extends in the direction in which the second surface faces. Electronic devices.

4. In claim 1, The above cover portion is formed based on a clad in which a first aluminum material and a second aluminum material having different melting points are combined. Electronic devices.

5. In claim 1, The above cover portion includes a plurality of slots, Each of the plurality of pin parts is arranged to penetrate a corresponding slot among the plurality of slots. Electronic devices.

6. In claim 1, The heat dissipation region includes a first connection region where a first aluminum sheet and a second aluminum sheet are joined on a first side, a second connection region where the first aluminum sheet and the second aluminum sheet are joined on a second side facing opposite to the first side, and a heat dissipation region having a boundary between the first aluminum sheet and the second aluminum sheet and a region where the first aluminum sheet and the second aluminum sheet are not joined. In each of the first connection region and the second connection region, the first bonding length corresponding to the first height from one side of the support is longer than the second bonding length corresponding to the second height higher than the first height from one side of the support. Electronic devices.

7. In claim 1, The above base portion includes a plurality of pillars arranged on the above one surface of the above base portion, The above plurality of columns include a first column having a first height and a second column having a second height higher than the first height, The second pillar is positioned closer to the center of the one side of the base portion than the first pillar. Electronic devices.

8. In claim 1, The above base part: A vapor chamber portion having an internal space through the above support, Including an aluminum block portion between the vapor chamber portion and the electronic components; Electronic devices.

9. In claim 1, The space between the base portion and the cover portion includes a porous medium disposed on one surface of the base portion. Electronic devices.

10. In claim 1, Including additional TIM (thermal interface material), The above TIM is in contact with the electronic component and the base portion, Electronic devices.

11. In claim 1, The electronic component comprises at least one processor, at least one central processing unit (CPU), or at least one field programmable gate array (FPGA). Electronic devices.

12. In claim 1, The electronic device comprises a radio unit (RU), a distributed unit (DU), a digital unit (DU), or a massive multiple input multiple output (MIMO) unit (MMU). Electronic devices.

13. In a housing having a vapor chamber, the housing: Base part having a support; A cover portion placed on the support of the base portion; and Containing a plurality of pin parts coupled with the above cover part, Each of the above plurality of fin portions has a heat sink region and a protruding region, A portion of the heat sink area is arranged to protrude from a first surface of the cover portion, and another portion of the heat sink area is arranged to protrude from a second surface of the cover portion opposite to the first surface, The above protruding regions are combined with the support or the cover portion so that the heat sink region is positioned at a certain distance or more from one side of the base portion. Housing.

14. In claim 13, At least a portion of the space between the base portion and the cover portion and the internal space of each of the plurality of pin portions contains a working fluid, said other part of said heat sink area including an opening for said internal space, Housing.

15. In claim 14, The other part of the above heat sink area has a shape in which the opening extends in the direction in which the second surface faces. Housing.

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