Display panel, display apparatus, and tiled display apparatus

Abstract

A display panel, a display apparatus, and a tiled display apparatus. The display panel comprises a substrate and a plurality of recessed regions. The substrate comprises a first surface and a second surface which are oppositely arranged, and at least one side surface connecting the first surface and the second surface. At least one of the at least one side surface is a selected side surface. The plurality of recessed regions are arranged at intervals in a first direction. Each of the recessed regions comprises a first recessed sub-region located on the first surface, a second recessed sub-region located on the second surface, and a side-surface recessed sub-region located on the selected side surface. Each of the recessed regions further comprises a first transition recessed sub-region connecting the first recessed sub-region and the side-surface recessed sub-region, and / or a second transition recessed sub-region connecting the second recessed sub-region and the side-surface recessed sub-region. The first transition recessed sub-region comprises a first mesh recess, and / or the second transition recessed sub-region comprises a second mesh recess. The display panel is used for displaying images.

Description

Display panel, display device, and spliced ​​display device Technical Field

[0001] The present disclosure relates to the field of display technology, and in particular to a display panel, a display device, and a spliced ​​display device. Background Art

[0002] The use of micro light-emitting diodes (Micro LEDs) or sub-millimeter light-emitting diodes (Mini LEDs) as pixels in display panels has attracted widespread attention and research. Currently, due to the massive transfer yield issues of Micro LED and Mini LED display panels, large-scale display devices cannot be produced in one go. Instead, a large-scale spliced ​​display device is typically assembled by splicing together smaller display devices.

[0003] Summary of the Invention

[0004] In one aspect, a display panel is provided, comprising a substrate and a plurality of recessed areas.

[0005] The substrate includes a first surface and a second surface that are opposite to each other, and at least one side surface connecting the first surface and the second surface, wherein the at least one side surface is a selected side surface.

[0006] A plurality of recessed regions are spaced apart along a first direction, each of the recessed regions extending from the first surface through the selected side surface to the second surface. Each of the recessed regions includes a first recessed sub-region located on the first surface, a second recessed sub-region located on the second surface, and a side recessed sub-region located on the selected side surface.

[0007] Each of the first recessed sub-regions and each of the second recessed sub-regions extends along a second direction; each of the side recessed sub-regions extends along a third direction; the second direction is perpendicular to the selected side, the first direction is perpendicular to the second direction, and the third direction is perpendicular to the first surface or the second surface.

[0008] Each of the recessed regions further includes a first transition recessed sub-region connecting the first recessed sub-region and the side recessed sub-region, and / or a second transition recessed sub-region connecting the second recessed sub-region and the side recessed sub-region.

[0009] The first transition recessed sub-region includes a first reticular recessed portion, and / or the second transition recessed sub-region includes a second reticular recessed portion.

[0010] In some embodiments, the first recessed sub-region includes a plurality of first grooves arranged in parallel, the second recessed sub-region includes a plurality of second grooves arranged in parallel, and the side recessed sub-region includes a plurality of side grooves arranged in parallel.

[0011] In some embodiments, the first groove extends to the first transition recessed sub-region, and / or the second groove extends to the second transition recessed sub-region, and / or the side groove extends to the first transition recessed sub-region and the second transition recessed sub-region.

[0012] The first transition recessed sub-area includes a plurality of parallel first transition grooves, the extension direction of the first transition grooves forms a first angle with the extension direction of at least one of the first groove and the side grooves, and the first transition grooves intersect with at least one of the first groove and the side grooves to form the first mesh-shaped recessed portion. And / or,

[0013] The second transition recess sub-area includes a plurality of second transition grooves arranged in parallel, the extension direction of the second transition groove has a second angle with the extension direction of the second groove and at least one of the side grooves, and the second transition groove intersects with the second groove and at least one of the side grooves to form the second mesh recess.

[0014] In some embodiments, the size of the first transition recessed sub-area along the first direction is not less than the size of the side recessed sub-area along the first direction; and / or the size of the second transition recessed sub-area along the first direction is not less than the size of the side recessed sub-area along the first direction.

[0015] In some embodiments, the substrate further includes a first chamfered surface and a second chamfered surface.

[0016] The first chamfered surface connects the first surface and the selected side surface, and the second chamfered surface connects the second surface and the selected side surface.

[0017] The first transition recessed sub-region is at least disposed on the first chamfered surface, and the second transition recessed sub-region is at least disposed on the second chamfered surface.

[0018] In some embodiments, the first transition recessed sub-region extends to the selected side surface; and / or, the first transition recessed sub-region extends to the first surface.

[0019] In some embodiments, the second transition recessed sub-region extends to the selected side surface, and / or the second transition recessed sub-region extends to the second surface.

[0020] In some embodiments, a size of an orthographic projection of the first chamfered surface on the plane where the first surface is located along the second direction is greater than or equal to 10 μm and less than or equal to 50 μm.

[0021] A size of an orthographic projection of the second chamfered surface on the plane where the second surface is located along the second direction is greater than or equal to 10 μm and less than or equal to 50 μm.

[0022] In some embodiments, a size of the first recessed sub-region along the first direction is not smaller than a size of the side recessed sub-region along the first direction.

[0023] In some embodiments, a size of the first recessed sub-region along the first direction is the same as a size of the first transition recessed sub-region along the first direction.

[0024] In some embodiments, a dimension of the recessed region along the first direction is greater than or equal to 25 μm.

[0025] In some embodiments, the display panel further includes a plurality of first electrodes located on one side of the first surface of the substrate, and the plurality of first electrodes are arranged at intervals along the first direction.

[0026] A recessed area is provided between two adjacent first electrodes, and a size of the recessed area along the first direction is less than or equal to 70% of a distance between the two adjacent first electrodes.

[0027] In some embodiments, a plurality of the first transition grooves are parallel to each other; and / or a plurality of the second transition grooves are parallel to each other.

[0028] In some embodiments, a depth of each of the first transition grooves is 1 μm to 3 μm; and / or a width of each of the first transition grooves is 1 μm to 10 μm.

[0029] The depth of each second transition groove is 1 μm to 3 μm; and / or the width of each second transition groove is 1 μm to 10 μm.

[0030] In some embodiments, at least two of the plurality of first transition grooves have different depths, and / or at least two of the plurality of first transition grooves have different widths.

[0031] At least two of the plurality of second transition grooves have different depths, and / or at least two of the plurality of second transition grooves have different widths.

[0032] In some embodiments, the side recessed sub-region is provided with a plurality of side grooves extending along the third direction, and the plurality of side grooves are arranged at intervals along the first direction.

[0033] The plurality of side grooves overlap with the plurality of first transition grooves on a selected side surface of the substrate; and / or the plurality of side grooves overlap with the plurality of second transition grooves on a selected side surface of the substrate.

[0034] In some embodiments, the display panel further includes an insulating layer located on the first surface of the substrate, and a boundary of the insulating layer extends along an edge of the substrate.

[0035] A plurality of first grooves are provided in the first recessed sub-region, and at least a portion of at least one first groove or a plurality of first grooves among the plurality of first grooves overlaps with the insulating layer.

[0036] In some embodiments, the display panel further includes a connecting lead disposed between two adjacent recessed areas, and the connecting lead extends from the first surface through the selected side surface to the second surface.

[0037] The connecting lead includes a first lead segment located on the first surface, a second lead segment located on the second surface, and a side lead segment located on the selected side, as well as a first transition lead segment connecting the first lead segment and the side lead segment, and / or a second transition lead segment connecting the second lead segment and the side lead segment.

[0038] Wherein, the dimension of the first transition lead segment along the first direction is not greater than the dimension of the side lead segment along the first direction; and / or the dimension of the second transition lead segment along the first direction is not greater than the dimension of the side lead segment along the first direction.

[0039] In some embodiments, the substrate further includes a first chamfered surface and a second chamfered surface, wherein the first chamfered surface connects the first surface and the selected side surface, and the second chamfered surface connects the second surface and the selected side surface.

[0040] The first transition lead segment is at least disposed on the first chamfered surface, and the second transition lead segment is at least disposed on the second chamfered surface.

[0041] In some embodiments, a dimension of the connecting lead along the first direction is greater than or equal to 60 μm.

[0042] In some embodiments, the display panel further includes a protective layer, wherein the protective layer fills the plurality of recessed areas and covers a surface of a side of the plurality of connecting leads away from the substrate.

[0043] On the other hand, a display device is provided, comprising the display panel and the circuit board as described in any one of the above embodiments.

[0044] The display panel includes a plurality of connecting leads, wherein one connecting lead is provided between each two adjacent etching grooves, and the circuit board is electrically connected to the plurality of connecting leads.

[0045] In yet another aspect, a spliced ​​display device is provided, comprising a plurality of display panels as described in any one of the above embodiments and at least one circuit board.

[0046] A plurality of the display panels are spliced ​​together, each display panel includes a plurality of connecting leads, one connecting lead is provided between each two adjacent etched grooves, and each of the at least one circuit board is electrically connected to the plurality of connecting leads of at least one display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0047] To more clearly illustrate the technical solutions of the present disclosure, the following briefly introduces the drawings required for use in some embodiments of the present disclosure. Obviously, the drawings described below are only drawings of some embodiments of the present disclosure, and those skilled in the art can also derive other drawings based on these drawings. Furthermore, the drawings described below are schematic diagrams and are not intended to limit the actual dimensions of the products, actual processes of the methods, actual timing of signals, and the like involved in the embodiments of the present disclosure.

[0048] FIG1 is a structural diagram of a spliced ​​display device according to some embodiments of the present disclosure;

[0049] FIG2 is a structural diagram of a display device according to some embodiments of the present disclosure;

[0050] FIG3 is a cross-sectional view of the display device in FIG2 along section line BB;

[0051] FIG4A is a structural diagram of a local area of ​​a display device according to some embodiments of the present disclosure;

[0052] FIG4B is another structural diagram of a partial area of ​​a display device according to some embodiments of the present disclosure;

[0053] FIG5A is a structural diagram of a display panel according to some embodiments of the present disclosure;

[0054] FIG5B is another structural diagram of a display panel according to some embodiments of the present disclosure;

[0055] FIG5C is another structural diagram of a display panel according to some embodiments of the present disclosure;

[0056] FIG6A is another structural diagram of a display panel according to some embodiments of the present disclosure;

[0057] FIG6B is another structural diagram of a display panel according to some embodiments of the present disclosure;

[0058] FIG7 is another structural diagram of a display panel according to some embodiments of the present disclosure;

[0059] FIG8A is a flow chart of a process for preparing a plurality of connecting leads according to some embodiments of the present disclosure;

[0060] FIG8B is a structural diagram of the display panel corresponding to step R1 in the process of preparing the plurality of connecting leads in FIG8A ;

[0061] FIG8C is a structural diagram of a display panel corresponding to step R2 in the process for preparing a plurality of connecting leads in FIG8A ;

[0062] FIG8D is another structural diagram of a display panel according to some embodiments of the present disclosure;

[0063] FIG8E is another structural diagram of a display panel according to some embodiments of the present disclosure;

[0064] FIG8F is another structural diagram of a display panel according to some embodiments of the present disclosure;

[0065] FIG8G is another structural diagram of a display panel according to some embodiments of the present disclosure;

[0066] FIG9A is another structural diagram of a display panel according to some embodiments of the present disclosure;

[0067] FIG9B is another structural diagram of a display panel according to some embodiments of the present disclosure;

[0068] FIG9C is another structural diagram of a display panel according to some embodiments of the present disclosure;

[0069] FIG10A is another structural diagram of a display panel according to some embodiments of the present disclosure;

[0070] FIG10B is another structural diagram of a display panel according to some embodiments of the present disclosure;

[0071] FIG11 is another structural diagram of a display panel according to some embodiments of the present disclosure;

[0072] FIG12 is another structural diagram of a display panel according to some embodiments of the present disclosure;

[0073] FIG13A is another structural diagram of a display panel according to some embodiments of the present disclosure;

[0074] FIG13B is another structural diagram of a display panel according to some embodiments of the present disclosure;

[0075] FIG14 is another structural diagram of a display panel according to some embodiments of the present disclosure;

[0076] FIG15A is another structural diagram of a display panel according to some embodiments of the present disclosure;

[0077] FIG15B is another structural diagram of a display panel according to some embodiments of the present disclosure;

[0078] FIG16 is another structural diagram of a display panel according to some embodiments of the present disclosure;

[0079] FIG17 is another structural diagram of a display panel according to some embodiments of the present disclosure;

[0080] FIG18 is a flow chart of a method for manufacturing a display panel according to some embodiments of the present disclosure;

[0081] FIG19 is a flow chart of step S3 in the method for manufacturing the display panel in FIG18 ;

[0082] FIG20 is a structural diagram of the display panel corresponding to step S3 in the method for manufacturing the display panel in FIG19 ;

[0083] FIG21A is a cross-sectional view of the first transition groove along section line PP' in FIG8E;

[0084] FIG21B is a cross-sectional view of the second transition groove along section line QQ' in FIG8E;

[0085] FIG22 is a structural diagram of a recessed area of ​​a display panel corresponding to step S31 in the method for manufacturing the display panel in FIG19 ;

[0086] FIG23A is a structural diagram of a display panel corresponding to step S34 in the method for manufacturing the display panel in FIG19 ;

[0087] FIG23B is another structural diagram of the display panel corresponding to step S34 in the method for manufacturing the display panel in FIG19 ;

[0088] FIG24 is a structural diagram of an insulating layer groove according to some embodiments of the present disclosure;

[0089] FIG25 is a cross-sectional view of the second transition recessed sub-region K15 along the section line RR′ in FIG8E ;

[0090] FIG. 26 is another structural diagram of a plurality of first transition grooves according to some embodiments of the present disclosure. DETAILED DESCRIPTION

[0091] The following will be combined with the accompanying drawings to clearly and completely describe the technical solutions in some embodiments of the present disclosure. Obviously, the embodiments described are only some embodiments of the present disclosure, not all embodiments. Based on the embodiments provided by the present disclosure, all other embodiments obtained by ordinary technicians in this field are within the scope of protection of the present disclosure.

[0092] Unless the context requires otherwise, throughout the specification and claims, the term "comprise" and its other forms, such as the third person singular form "comprises" and the present participle form "comprising", are to be interpreted as open and inclusive, that is, "including, but not limited to". In the description of the specification, the terms "one embodiment", "some embodiments", "exemplary embodiments", "example", "specific example" or "some examples" are intended to indicate that the particular features, structures, materials or characteristics associated with the embodiment or example are included in at least one embodiment or example of the present disclosure. The schematic representation of the above terms does not necessarily refer to the same embodiment or example. In addition, the particular features, structures, materials or characteristics may be included in any one or more embodiments or examples in any appropriate manner.

[0093] In the following, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of the technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present disclosure, unless otherwise specified, "plurality" means two or more.

[0094] When describing some embodiments, the expression "connected" and its derivatives may be used. The term "connected" should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected or indirectly connected through an intermediate medium. The term "coupled" indicates, for example, that two or more components are in direct physical or electrical contact. The term "coupled" or "communicatively coupled" may also refer to two or more components that are not in direct contact with each other, but still cooperate or interact with each other. The embodiments disclosed herein are not necessarily limited to the contents of this document.

[0095] “At least one of A, B and C” has the same meaning as “at least one of A, B or C” and both include the following combinations of A, B and C: A only, B only, C only, the combination of A and B, the combination of A and C, the combination of B and C, and the combination of A, B and C.

[0096] “A and / or B” includes the following three combinations: A only, B only, and a combination of A and B.

[0097] The use of "adapted to" or "configured to" herein is intended to be open and inclusive language that does not exclude devices adapted or configured to perform additional tasks or steps.

[0098] Additionally, the use of “based on” is meant to be open and inclusive, as a process, step, calculation, or other action “based on” one or more stated conditions or values ​​may, in practice, be based on additional conditions or values ​​beyond those stated.

[0099] As used herein, "about," "substantially," or "approximately" includes the stated value and an average value that is within an acceptable range of deviation from the particular value as determined by one of ordinary skill in the art taking into account the measurements in question and the errors associated with the measurement of the particular quantity (i.e., the limitations of the measurement system).

[0100] As used herein, "parallel", "perpendicular", and "equal" include the situations described and situations similar to the situations described, and the range of the similar situations is within an acceptable deviation range, wherein the acceptable deviation range is as determined by a person of ordinary skill in the art taking into account the measurement in question and the errors associated with the measurement of the specific quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, wherein the acceptable deviation range of approximate parallelism can be, for example, a deviation within 5°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, wherein the acceptable deviation range of approximate perpendicularity can also be, for example, a deviation within 5°. "Equal" includes absolute equality and approximate equality, wherein the acceptable deviation range of approximate equality can be, for example, that the difference between the two equals is less than or equal to 5% of either one.

[0101] It will be understood that when a layer or element is referred to as being on another layer or substrate, it can be directly on the other layer or substrate, or intervening layers may be present therebetween.

[0102] Exemplary embodiments are described herein with reference to cross-sectional and / or plan views that are idealized exemplary drawings. In the drawings, the thickness of layers and the area of ​​regions are exaggerated for clarity. Therefore, variations in shape relative to the drawings due to, for example, manufacturing techniques and / or tolerances are contemplated. Therefore, the exemplary embodiments should not be construed as limited to the shapes of the regions shown herein, but rather include deviations in shape due to, for example, manufacturing. For example, an etched region shown as a rectangle will typically have curved features. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to illustrate the actual shape of regions of the device and are not intended to limit the scope of the exemplary embodiments.

[0103] It should be noted that, for example, 1cc / 1c appearing in the drawings of the present disclosure indicates that component 1c includes component 1cc, and other similar numbers appearing in the drawings also follow the above description.

[0104] For the convenience of the following description, an XYZ coordinate system is established. The third direction Z is the thickness direction of the spliced ​​display device or the display device. The XY plane is perpendicular to the Z direction, and the X direction intersects the Y direction. For example, the X direction and the Y direction are perpendicular to each other.

[0105] As shown in FIG1 , some embodiments of the present disclosure provide a spliced ​​display device 1000, comprising a plurality of spliced ​​display panels 10 and at least one circuit board (not shown). Each circuit board is electrically connected to a connection lead of at least one display panel 10 to control the light emission of the display panel 10 and realize the display function of the display panel 10.

[0106] By splicing a plurality of display panels 10 to form a large-sized spliced ​​display device 1000 , product reliability can be improved, and transportation costs and maintenance costs can be reduced.

[0107] For example, the number of circuit boards in the spliced ​​display device 1000 may be one, and the multiple display panels 10 are connected to the same circuit board.

[0108] The number of circuit boards may also be multiple. For example, each display panel 10 in a plurality of display panels 10 is connected to a circuit board, that is, the display panels 10 and the circuit boards are connected one-to-one. For another example, the plurality of display panels 10 are divided into multiple groups, and each group of display panels 10 is connected to a circuit board, wherein the number of display panels 10 in each group of display panels 10 may be the same or different.

[0109] Illustratively, the circuit board includes but is not limited to a PCB (Printed Circuit Board) and an FPC (Flexible Printed Circuit Board).

[0110] In some embodiments, the spliced ​​display device 1000 may also be directly spliced ​​together by multiple display devices, each display device including a display panel 10 and a circuit board connected to the display panel 10 .

[0111] Some embodiments of the present disclosure further provide a display device, which may be an independent display device or may be used to splice together to form the spliced ​​display device 1000 .

[0112] The display device will be described in detail below.

[0113] The display device can be any product or component with a display function, such as a television, a monitor, a laptop, a tablet computer, a mobile phone, a navigator, etc. FIG2 illustrates the display device 100 as a mobile phone.

[0114] Exemplarily, the display device 100 may be a micro light-emitting diode display device (Micro Light-emitting Diode, referred to as Micro LED) or a sub-millimeter light-emitting diode display device (Mini Light-emitting Diode, referred to as Mini LED).

[0115] The display device 100 may also be an electroluminescent display device or a photoluminescent display device. If the display device 100 is an electroluminescent display device, the electroluminescent display device may be an organic light-emitting diode (OLED) or a quantum dot light-emitting diode (QLED). If the display device 100 is a photoluminescent display device, the photoluminescent display device may be a quantum dot photoluminescent display device.

[0116] The display device 100 may also be a liquid crystal display (LCD) device.

[0117] As shown in Figures 2 and 3, Figure 2 is a structural diagram of a display device 100 according to some embodiments of the present disclosure, and Figure 3 is a cross-sectional view of the display device 100 along section line BB in Figure 2. The display device 100 includes a display panel 10 and a circuit board 20, and the display panel 10 is electrically connected to the circuit board 20 via connecting leads 2.

[0118] The display panel 10 is described in detail below.

[0119] The display panel 10 may be a Micro LED display panel, a Mini LED display panel, an OLED display panel, or a liquid crystal display panel.

[0120] For example, when the display panel 10 is a Micro LED display panel or a Mini LED display panel, the Micro LED display panel or the Mini LED display panel includes: an array substrate and micro light emitting diodes or sub-millimeter light emitting diodes located on the array substrate.

[0121] For another example, when the display panel 10 is an OLED display panel, the OLED display panel includes: an array substrate and a pixel defining layer located on the array substrate, wherein an anode, a hole injection layer, a hole transport layer, a light-emitting layer, an electron transport layer, an electron injection layer and a cathode are sequentially arranged in the pixel defining area of ​​the pixel defining layer.

[0122] For another example, when the display panel 10 is a liquid crystal display panel, the liquid crystal display panel includes an array substrate and a color filter substrate that are arranged in a cell-to-cell manner, and a liquid crystal layer located between the array substrate and the color filter substrate.

[0123] The following uses the display panel 10 as a Micro LED display panel or a Mini LED display panel as an example to schematically illustrate some embodiments of the present disclosure. However, the implementation methods of the present disclosure include but are not limited to this, and any other display panels can also be considered as long as the same technical concept is applied.

[0124] Exemplarily, the display panel 10 may be a rectangular structure, a circular structure, or other shapes with corners, which is not specifically limited in the present disclosure.

[0125] It should be noted that the aforementioned "rectangular structure" means that the shape of the boundary of the display panel 10 is rectangular as a whole, but is not limited to a standard rectangle. That is, the "rectangle" here includes not only a standard rectangular shape, but also a shape similar to a rectangle taking into account process conditions. For example, the long and short sides of the rectangle are curved at each intersection (i.e., at the corners), that is, the corners are smooth, so that the shape of the boundary of the display panel 10 in a plan view is a rounded rectangle.

[0126] In the following, some embodiments of the present disclosure are schematically described by taking the display panel 10 as a rectangular structure as an example. However, the embodiments of the present disclosure include but are not limited to this. The shape of the display panel 10 may also be any other shape.

[0127] 1 , 2 and 3 , the display panel 10 has a display area AA for displaying images, and a peripheral area AN located on at least one side of the display area AA.

[0128] For example, as shown in FIG. 1 , the peripheral area AN is located on one side of the display area AA.

[0129] For another example, the peripheral area AN is located on two opposite sides of the display area AA.

[0130] For another example, as shown in FIG2 , the peripheral area AN surrounds the display area AA.

[0131] It should be noted that the specific configuration of the peripheral area AN is related to the specific design of the display panel 10 and can be designed according to actual needs. It is only used as an example here and is not intended to limit the present disclosure.

[0132] In some embodiments, as shown in FIG. 2 and FIG. 3 , a plurality of pixel units P are provided in the display area AA of the display panel 10 . Each pixel unit P includes at least three sub-pixels 3 of three colors. The sub-pixel 3 is the smallest light-emitting unit in the display area AA.

[0133] The above “each pixel unit P includes at least three colors of sub-pixels 3” means that each pixel unit P may include three, four or more sub-pixels 3, and the multiple sub-pixels 3 included in each pixel unit P may be a row, a column or a group of sub-pixels 3, a group of sub-pixels 3 may be multiple sub-pixels 3 adjacent to each other, and the multiple adjacent sub-pixels 3 are arranged in a row, a column, an L-shape, a rectangle or a diamond, etc. At the same time, the luminous areas of the multiple sub-pixels 3 included in each pixel unit P may be the same or different. The above is only an exemplary description and is not intended to limit the present disclosure. Adaptive design can be carried out according to actual needs.

[0134] Exemplarily, as shown in FIG2 , a plurality of pixel units P are arranged in multiple rows and columns.

[0135] In some examples, the multiple sub-pixels 3 emit light of the same color, and the display panel 10 may further include a color filter layer disposed on the light-emitting sides of the multiple sub-pixels 3 .

[0136] For example, multiple sub-pixels 3 emit white light, red light, green light, blue light or other color light. In this case, the color light emitted by the sub-pixel 3 remains the same color light after passing through the color filter layer, or is converted into other color light and emitted. Therefore, when multiple sub-pixels 3 emit the same color light, the display panel 10 can achieve multi-color light output.

[0137] In other examples, multiple sub-pixels 3 emit light of different colors. For example, multiple sub-pixels 3 include a red sub-pixel 31 that emits red light, a green sub-pixel 32 that emits green light, and a blue sub-pixel 33 that emits blue light, thereby realizing multi-color light output of the display panel 10.

[0138] In some embodiments, as shown in FIG. 2 and FIG. 3 , the display panel 10 further includes a substrate 1 , and a plurality of pixel units P are disposed on the substrate 1 .

[0139] The substrate 1 includes a first surface 1 a and a second surface 1 b that are opposite to each other, and at least one side surface 1 c connecting the first surface 1 a and the second surface 1 b , wherein the at least one side surface is a selected side surface 1 cc.

[0140] Exemplarily, as shown in FIG3 , the side surface 1 c is perpendicular or substantially perpendicular to the first surface 1 a and the second surface 1 b .

[0141] In the XYZ coordinate system described above, the third direction Z is perpendicular to the first surface 1a or the second surface 1b of the substrate 1 and perpendicular to the XY plane, the second direction Y is perpendicular to the selected side surface 1cc of the substrate 1, and the first direction X is perpendicular to the second direction Y.

[0142] Illustratively, the material of substrate 1 can be a rigid material. For example, the material of substrate 1 includes, but is not limited to, glass, quartz, plastic, etc. The material of substrate 1 can also be a flexible material. For example, the material of substrate 1 includes, but is not limited to, FPC, PI-based film (Polyimide Film), etc.

[0143] It should be noted that the material selection of the substrate 1 is related to the specific design of the display panel 10 and can be selected according to actual needs. It is only used as an example here and is not intended to limit the present disclosure.

[0144] 2 and 3 , the display panel 10 further includes a plurality of first electrodes 4 . The plurality of first electrodes 4 are disposed on the first surface 1 a of the substrate 1 and are arranged along the first direction X at intervals.

[0145] For example, as shown in FIG4A , FIG4A is a structural diagram of a local area (an area near the edge of the substrate 1) of the display device 1000 according to some embodiments of the present disclosure. The boundary of the first surface 1a of the substrate 1 near the selected side 1cc is the first boundary 1aa. In the row of sub-pixels 3 closest to the first boundary 1aa, at least one first electrode 4 is located between two adjacent sub-pixels 3, that is, the first electrode 4 and the sub-pixel 3 intersect at the same time with at least one straight line (for example, straight line TT) parallel to the boundary of the substrate 1 near the selected side 1cc, which is beneficial to increase the area ratio of the display area AA on the first surface 1a of the substrate 1, that is, the first electrode 4 does not occupy the area of ​​the peripheral area AN, which can reduce the area ratio of the peripheral area AN of the display panel 10 on the first surface 1a of the substrate 1, narrow the frame to a large extent, and improve the display effect of the display panel 10.

[0146] Alternatively, as shown in FIG4B , FIG4B is another structural diagram of a local area (an area near the edge of the substrate 1) of the display device 1000 according to some embodiments of the present disclosure. A plurality of first electrodes 4 are located in the peripheral area AN of the display panel 10, the pixel unit P is located in the display area AA of the display panel 10, the first electrode 4 is located in the peripheral area AN, and the first electrode 4 is closer to the first boundary 1aa than the pixel unit P. There is no straight line parallel to the first boundary 1aa that intersects the first electrode 4 and the sub-pixel 3 at the same time. In this case, although the area proportion of the peripheral area AN of the display panel 10 on the first surface 1a of the substrate 1 will increase, the first electrode 4 can be set in a larger space. Accordingly, when the shape and size of the first electrode 4 remain unchanged, a larger number of first electrodes 4 can be set, thereby reducing the design difficulty.

[0147] In some embodiments, please continue to refer to Figures 4A and 4B, and in combination with Figure 2, the display panel 10 also includes an insulating layer 6 located on the first surface 1a of the substrate 1, and the insulating layer 6 includes at least two sub-insulating layers; among which the sub-insulating layer farthest from the substrate 1 is the first sub-insulating layer 62, and the multiple sub-insulating layers also include a second sub-insulating layer 63 located between the first sub-insulating layer 62 and the substrate 1; the second sub-insulating layer 63 can be a single-layer structure or a stacked structure.

[0148] As shown in Figures 4A and 4B , the boundary of the first surface 1a of the substrate 1 near the selected side surface 1cc is a first boundary 1aa. The orthographic projection of the first sub-insulating layer 62 on the substrate 1 has an outline 62a in the area near the first boundary 1aa, and the orthographic projection of the second sub-insulating layer 63 on the substrate 1 has a second outline 63a in the area near the selected side surface 1cc. Three sub-pixels 3 are provided in a pixel unit P, each of which includes two conductive pads 3a for connecting to a light-emitting device. Therefore, a plurality of first openings 621 are provided in the first sub-insulating layer 62, and a plurality of second openings 631 are provided in the second sub-insulating layer 63, exposing at least portions of the conductive pads 3a for connection to the light-emitting device as solder pads 3aa. The orthographic projections of the second openings 631 on the substrate 1 are located within the orthographic projections of the corresponding conductive pads 3a on the substrate 1; and the orthographic projections of the first openings 621 on the substrate 1 are located within the orthographic projections of the corresponding second openings 631 on the substrate 1. That is, the positional relationship among the conductive pad 3 a , the second sub-insulating layer 63 and the first sub-insulating layer 62 is that the conductive pad 3 a , the second sub-insulating layer 63 and the first sub-insulating layer 62 are sequentially stacked on the substrate 1 .

[0149] For example, as shown in Figures 4A and 4B , the orthographic projection of the first sub-insulating layer 62 on the substrate 1 forms a first contour 62a near the first boundary 1aa, having a concave-convex shape. The first sub-insulating layer 62 surrounds the first electrode 4 at a boundary away from the first boundary 1aa, and there is no overlap between the first sub-insulating layer 62 and the first electrode 4. In the concave-convex first contour 62a, the convex portion corresponds to the first sub-recessed region K11 within the recessed region K1, and the recessed portion corresponds to the first electrode 4.

[0150] For example, as shown in Figures 4A and 4B, the second sub-insulating layer 63 is further provided with a plurality of third openings 632 for exposing a portion of the surface of the first electrode 4 away from the substrate 1, enabling connection of the first electrode 4 to the subsequently formed connecting lead 2, while also covering the edge region of the first electrode 4 to reduce the probability of water and oxygen intrusion. Specifically, the positional relationship between the first electrode 4, the second sub-insulating layer 63, and the first sub-insulating layer 62 is such that the first electrode 4, the second sub-insulating layer 63, and the first sub-insulating layer 62 are sequentially stacked on the substrate 1.

[0151] 4A and 4B , the orthographic projection of the second sub-insulating layer 63 on the substrate 1 has a second profile 63a in an area close to the selected side surface 1cc, the second profile 63a may be parallel to the first boundary 1aa, and the second profile 63a is located between the first boundary 1aa and the first profile 62a.

[0152] In some embodiments, referring to FIG. 3 , the display panel 10 further includes a plurality of connecting leads 2. Each of the plurality of connecting leads 2 extends from the first surface 1a of the substrate 1, through the side surface 1c of the substrate 1, and to the second surface 1b of the substrate 1. For ease of description, the side surface 1c where the connecting lead 2 is located is collectively referred to as a selected side surface 1cc.

[0153] It should be noted that when the substrate 1 includes multiple side surfaces 1c, the present disclosure does not limit the structure of other side surfaces 1c (i.e., side surfaces 1c other than the selected side surfaces 1cc) among the multiple side surfaces 1c. For example, when the display panel 10 is a rectangular structure, it has four side surfaces 1c. For example, the four side surfaces 1c of the substrate 1 can all be selected side surfaces 1cc; for another example, as shown in Figures 2 and 3, one side surface 1c of the four side surfaces 1c of the back panel 1 (the side surface 1c to which the multiple first electrodes 4 in Figures 2 and 3 are close) is the selected side surface 1cc, and the structures of the other three side surfaces 1c are not limited.

[0154] One end of each of the multiple connecting leads 2 is connected to a first electrode 4 located on the first surface 1a of the substrate 1, and the other end is connected to the circuit board 20 located on the second surface 1b of the substrate 1, which can transfer the binding area of ​​the display panel 10 to the second surface 1b of the display panel 10, and electrically connect the circuit board 20 to the first surface 1a of the display panel 10 through the multiple connecting leads 2, controlling the display panel 10 to display, thereby reducing the area of ​​the peripheral area AN of the display panel 10, which is beneficial to improving the screen-to-body ratio of the display panel 10.

[0155] Furthermore, the screen-to-body ratio of the display device 100 including the display panel 10 can be increased, which is beneficial for the display device 100 to achieve a narrow frame and enhance the display effect of the display device 100 .

[0156] Furthermore, when the spliced ​​display device 1000 includes multiple display panels 10, taking the example of a peripheral area AN of the display panel 10 being located on one side of the display area AA of the display panel 10, as shown in FIG1 , the multiple display panels 10 are arranged in multiple columns along a first direction X and in multiple rows along a second direction Y. In the spliced ​​multiple display panels 10, the peripheral areas AN of the display panels 10 are all arranged along the first direction X. Thus, among the multiple display panels 10 arranged in a row along the first direction X, there is substantially no splicing seam between two adjacent display panels 10 along the first direction X; whereas, among the multiple display panels 10 arranged in a column along the second direction Y, there is a splicing seam between two adjacent display panels 10. In other words, the size of the splicing seam between two adjacent display panels 10 in the multiple display panels 10 arranged in a row along the first direction X is smaller than the size of the splicing seam between two adjacent display panels 10 in the multiple display panels 10 arranged in a column along the second direction Y.

[0157] When viewing the spliced ​​display device 1000, since the area of ​​the peripheral region AN of the display panel 10 is relatively small, the size of the splicing gap between two adjacent display panels 10 among the multiple display panels 10 arranged in a row along the second direction Y is also relatively small. The splicing gap between two adjacent display panels 10 is difficult to be detected by the naked eye within the viewing distance, thereby making the display image of the spliced ​​display device 1000 more complete and presenting a better display effect.

[0158] In some embodiments, referring to FIG3 again, the display panel 10 further includes a protective layer 5. The protective layer 5 covers the plurality of connecting leads 2. The protective layer 5 is disposed on a side of the plurality of connecting leads 2 away from the substrate 1.

[0159] It should be noted that if portions of the plurality of connecting leads 2 located on the second surface 1b of the substrate 1 need to be exposed for binding and connection with the circuit board 20, the protective layer 5 should avoid covering the portions of the connecting leads 2 to be connected to the circuit board 20. Furthermore, the area of ​​the orthographic projection of the protective layer 5 on any surface of the display panel 10 (e.g., the first surface 1a or the second surface 1b) is generally equal to or greater than the area of ​​the orthographic projection of the connecting leads 2 on any surface of the display panel 10 (e.g., the first surface 1a or the second surface 1b).

[0160] The protective layer 5 can protect the multiple connecting leads 2 and play the role of electrical insulation and waterproof oxygen corrosion, thereby preventing the multiple connecting leads 2 from being damaged by the outside world and causing problems such as peeling, disconnection, oxidation, etc.

[0161] For example, the material of the protective layer 5 can be an insulating material with high corrosion resistance and adhesion, such as glue.

[0162] As shown in Figures 5A, 5B, and 5C, which are all structural diagrams of a display panel 10 according to some embodiments of the present disclosure, a recessed area K1 is provided between two adjacent connecting leads 2 to separate the adjacent connecting leads 2. Furthermore, the protective layer 5 may further be filled with multiple recessed areas K1 to ensure mutual insulation between adjacent connecting leads 2.

[0163] The recessed area K1 is described in detail below.

[0164] In some embodiments, as shown in Figures 5A, 5B, 5C, 6A, and 6B (Figures 6A and 6B are both structural diagrams of a display panel 10 according to some embodiments of the present disclosure), the display panel 10 includes a plurality of recessed areas K1. The connecting leads 2 and the recessed areas K1 are alternately arranged along the first direction X. Each recessed area K1 extends from the first surface 1a, through the selected side surface 1cc, to the second surface 1b.

[0165] The recessed region K1 includes a first recessed sub-region K11 located on the first surface 1a of the substrate 1, a second recessed sub-region K12 located on the second surface 1b of the substrate 1, and a side recessed sub-region K13 located on a selected side surface 1cc of the substrate 1, as well as a first transition recessed sub-region K14 connecting the first recessed sub-region K11 and the side recessed sub-region K13, and a second transition recessed sub-region K15 connecting the second recessed sub-region K12 and the side recessed sub-region K13. Each first recessed sub-region K11 and each second recessed sub-region K12 extend along the second direction Y; each side recessed sub-region K13 extends along the third direction Z.

[0166] It should be noted that Figures 5A, 5B, 5C, 6A, and 6B illustrate the example of the first transition recessed sub-area K14 and the second transition recessed sub-area K15 both being located on the selected side surface 1cc of the substrate 1. However, the locations of the first transition recessed sub-area K14 and the second transition recessed sub-area K15 are not limited to this. For example, the first transition recessed sub-area K14 may also be located on the first surface 1a of the substrate 1, or a portion of the first transition recessed sub-area K14 may be located on the selected side surface 1cc of the substrate 1 and another portion may be located on the first surface 1a of the substrate 1. The second transition recessed sub-area K15 may also be located on the second surface 1b of the substrate 1, or a portion of the second transition recessed sub-area K15 may be located on the selected side surface 1cc of the substrate 1 and another portion may be located on the second surface 1b of the substrate 1.

[0167] 5C , 9C , and 14 , the recessed region K1 includes a fan-out recessed sub-region K16 located on the second surface 1 b of the substrate 1. The fan-out recessed sub-region K16 is connected to the second recessed sub-region K12 and is located on a side of the second recessed sub-region K12 away from the selected side surface 1 cc.

[0168] For example, referring to FIG. 5C , the extension direction of the fan-out recessed sub-region K16 intersects with the extension direction of the second recessed sub-region K12 , and the ends of the plurality of fan-out recessed sub-regions K16 away from the second recessed sub-region K12 converge inward.

[0169] Please continue to refer to Figures 5A, 5B, 5C, 6A and 6B. Each connecting lead 2 includes a first lead segment 2a located between two adjacent first recessed sub-areas K11, a second lead segment 2b located between two adjacent second recessed sub-areas K12, a side lead segment 2c located between two adjacent side recessed sub-areas K13, a first transition lead segment 2d located between two adjacent first transition recessed sub-areas K14, a second transition lead segment 2e located between two adjacent second transition recessed sub-areas K15, and a fan-out lead segment 2f located between two adjacent fan-out recessed sub-areas K16; the first lead segment 2a, the first transition lead segment 2d, the side lead segment 2c, the second transition lead segment 2e, the second lead segment 2b and the fan-out lead segment 2f are connected in sequence, and the multiple fan-out lead segments 2f are retracted inward at one end away from the selected side 1cc.

[0170] It is understandable that because the connecting lead 2 is located between two adjacent recessed areas K1, that is, the recessed area K1 separates the two adjacent connecting leads 2, the size of the recessed area K1 along the first direction X is the same as the spacing between the two connecting leads 2 on either side thereof. For example, the size of the first transition recessed sub-area K14 of the recessed area K1 along the first direction X is the same as the spacing between the two first transition lead segments 2d on either side thereof, and the size of the second transition recessed sub-area K15 of the recessed area K1 along the first direction X is also the same as the spacing between the two first transition lead segments 2e on either side thereof.

[0171] Exemplarily, the size of the recessed area K1 along the first direction X is greater than or equal to 25 μm, which is beneficial to reducing the probability of short circuit between the connecting leads 2 on both sides of the recessed area K1.

[0172] For example, please continue to refer to FIG. 4B , the dimension M of the recessed area K1 along the first direction X is K1 Less than or equal to 70% of the distance M4 between two adjacent first electrodes 4 .

[0173] In some embodiments, please continue to refer to Figures 4A and 4B. The minimum spacing between the first sub-insulating layer 62 and the first boundary 1aa is c1, the spacing between one end of the connecting lead 2 located on the first surface 1a and the first boundary 1aa is c2, the spacing between one end of the recessed area K1 close to the display area AA of the display panel 10 and the first boundary 1aa is c3, the spacing between the boundary of the third opening 632 close to the display area AA of the display panel 10 and the first boundary 1aa is c4, and the spacing between the boundary of the first electrode 4 close to the display area AA of the display panel 10 and the first boundary 1aa is c5.

[0174] 4A , c1≤c3≤c2≤c4≤c5. For example, c1=c3<c2<c4<c5.

[0175] Alternatively, as shown in FIG4B , c1≤c2≤c3≤c4≤c5. For example, c1<c2<c3<c4<c5.

[0176] In some embodiments, please continue to refer to Figures 5A, 5B, 5C, 6A and 6B. The size of the first transition recessed sub-area K14 along the first direction X is not less than the size of the side recessed sub-area K13 along the first direction X; and / or, the size of the second transition recessed sub-area K15 along the first direction X is not less than the size of the side recessed sub-area K13 along the first direction X.

[0177] For example, as shown in Figures 5A, 5B, and 5C, the first recessed sub-region K11, the side recessed sub-region K13, the first transition recessed sub-region K14, and the second transition recessed sub-region K15 have the same size m1' along the first direction X. In other words, the spacing between two adjacent first lead segments 2a, side lead segments 2c, and first transition lead segments 2d and second transition lead segments 2e is also the same, m1'.

[0178] 6A and 6B , which are both structural diagrams of a display panel 10 according to some embodiments of the present disclosure, a dimension m1 of the first transition recessed sub-region K14 along the first direction X is greater than a dimension m3 of the side recessed sub-region K13 along the first direction X.

[0179] The dimension m1 of the first transition recessed sub-region K14 along the first direction X is set to be larger than the dimension m3 of the side recessed sub-region K13 along the first direction X, that is, the dimension of the first transition recessed sub-region K14 along the first direction X is increased.

[0180] Because the first transition recessed sub-region K14 separates the first transition lead segments 2d of two adjacent connecting leads 2, the dimension of the first transition recessed sub-region K14 along the first direction X and the spacing between the two first transition lead segments 2d on either side thereof are identical, both being m1. Therefore, increasing the dimension m1 of the first transition recessed sub-region K14 along the first direction X is equivalent to increasing the spacing m1 between the two first transition lead segments 2d on either side of the first transition recessed sub-region K14. Due to the increased spacing m1 between the two first transition lead segments 2d on either side of the first transition recessed sub-region K14, when the first lead segment 2a of the connecting lead 2 located on the first surface 1a is connected to the side lead segment 2c located on the selected side surface 1cc via the first transition lead segment 2d, the probability of misalignment among the first lead segment 2a, first transition lead segment 2d, and side lead segment 2c of the connecting lead 2 can be reduced, thereby ensuring normal display of the display panel 10.

[0181] It should be noted that the above-mentioned "the first lead segment 2a, the first transition lead segment 2d and the side lead segment 2c of the connecting lead 2 are misaligned and connected" means that the first lead segment 2a and the first transition lead segment 2d on the same connecting lead 2 may be misaligned when connected, and the first lead segment 2a will be connected to the first transition lead segment 2d of other connecting leads 2 (for example, adjacent connecting leads 2).

[0182] In addition, when the side lead segment 2c and the first transition lead segment 2d on the same connecting lead 2 are connected, an alignment offset may occur, and the side lead segment 2c may be connected to the first transition lead segment 2d of other connecting leads 2 (for example, an adjacent connecting lead 2), which may easily cause the display panel 10 to fail to display normally.

[0183] The same or similar descriptions below regarding “the first lead segment 2a, the first transition lead segment 2d and the side lead segment 2c of the connecting lead 2 are misaligned and connected” will also follow this description and will not be repeated.

[0184] In some embodiments, referring to FIG. 6A and FIG. 6B , a dimension m2 of the second transition recessed sub-region K15 along the first direction X is greater than a dimension m3 of the side recessed sub-region K13 along the first direction X.

[0185] The dimension m2 of the second transition recessed sub-region K15 along the first direction X is set to be larger than the dimension m3 of the side recessed sub-region K13 along the first direction X, that is, the dimension of the second transition recessed sub-region K15 along the first direction X is increased.

[0186] Because the second transition recessed sub-region K15 separates the second transition lead segments 2e of two adjacent connecting leads 2, it can be understood that the size of the second transition recessed sub-region K15 along the first direction X and the spacing between the two second transition lead segments 2e on either side of it are the same, both being m2. Therefore, increasing the size m2 of the second transition recessed sub-region K15 along the first direction X is equivalent to increasing the spacing m2 between the two second transition lead segments 2e on either side of the second transition recessed sub-region K15. Due to the increased spacing m2 between the two second transition lead segments 2e on either side of the second transition recessed sub-region K15, when the second lead segment 2b of the connecting lead 2 located on the second surface 1b is connected to the side lead segment 2c located on the selected side surface 1cc via the second transition lead segment 2e, the probability of misalignment among the second lead segment 2b, second transition lead segment 2e, and side lead segment 2c of the connecting lead 2 can be reduced, thereby ensuring normal display of the display panel 10.

[0187] It should be noted that the above-mentioned "the second lead segment 2b, the second transition lead segment 2e and the side lead segment 2c of the connecting lead 2 are misaligned and connected" means that the second lead segment 2b and the second transition lead segment 2e on the same connecting lead 2 may be misaligned when connected, and the second lead segment 2b will be connected to the second transition lead segment 2e of other connecting leads 2 (for example, adjacent connecting leads 2).

[0188] Alternatively, when the side lead segment 2c and the second transition lead segment 2e on the same connecting lead 2 are connected, an alignment offset may occur, and the side lead segment 2c may be connected to the second transition lead segment 2e of other connecting leads 2 (for example, an adjacent connecting lead 2), which may easily cause the display panel 10 to fail to display normally.

[0189] The same or similar descriptions below regarding “the second lead segment 2b, the second transition lead segment 2e and the side lead segment 2c of the connecting lead 2 are misalignedly connected” will also follow this description and will not be repeated.

[0190] In some embodiments, as shown in FIG7 , which illustrates a structure of a display panel 10 according to some embodiments of the present disclosure, the substrate 1 further includes a first chamfered surface 1d and a second chamfered surface 1e. The first chamfered surface 1d connects the first surface 1a of the substrate 1 and the selected side surface 1cc of the substrate 1, and the second chamfered surface 1e connects the second surface 1b of the substrate 1 and the selected side surface 1cc of the substrate 1.

[0191] For example, the first chamfered surface 1d and the second chamfered surface 1e can be arranged as arc surfaces or as inclined surfaces. FIG7 only illustrates the example that the first chamfered surface 1d and the second chamfered surface 1e can be arranged as arc surfaces.

[0192] For example, when the first chamfered surface 1d of the substrate 1 is an arc surface, the first surface 1a can smoothly transition from the first chamfered surface 1d to the selected side surface 1cc, or the selected side surface 1cc can smoothly transition from the first chamfered surface 1d to the first surface 1a.

[0193] Similarly, when the second chamfered surface 1e of the substrate 1 is also arranged in an arc shape, the second surface 1b can smoothly transition from the second chamfered surface 1e to the selected side surface 1cc, or the selected side surface 1cc can smoothly transition from the second chamfered surface 1e to the second surface 1b.

[0194] For another example, when the first chamfered surface 1d of the substrate 1 is arranged in an inclined surface, the angle between the first chamfered surface 1d and the first surface 1a of the substrate 1 and the angle between the first chamfered surface 1d and the selected side surface 1cc of the substrate 1 are both obtuse angles, and the first surface 1a can be relatively smoothly transitioned from the first chamfered surface 1d to the selected side surface 1cc, or the selected side surface 1cc can be relatively smoothly transitioned from the first chamfered surface 1d to the first surface 1a.

[0195] Similarly, when the second chamfered surface 1e of the substrate 1 is also inclined, the second surface 1b can transition relatively smoothly from the second chamfered surface 1e to the selected side surface 1cc, or the selected side surface 1cc can transition relatively smoothly from the second chamfered surface 1e to the second surface 1b.

[0196] Exemplarily, as shown in FIG7 , a dimension d1 of an orthographic projection of the first chamfered surface 1 d on the plane where the first surface 1 a is located along the second direction Y is greater than or equal to 10 μm and less than or equal to 50 μm.

[0197] A dimension d2 of an orthographic projection of the first chamfered surface 1d on the plane where the selected side surface 1cc is located along the third direction Z is greater than or equal to 10 μm and less than or equal to 50 μm.

[0198] A dimension d3 of an orthographic projection of the second chamfered surface 1 e on the plane where the second surface 1 b is located along the second direction Y is greater than or equal to 10 μm and less than or equal to 50 μm.

[0199] A dimension d4 of the orthographic projection of the second chamfered surface 1e on the plane where the selected side surface 1cc is located along the third direction Z is greater than or equal to 10 μm and less than or equal to 50 μm.

[0200] For example, a dimension d1 of an orthographic projection of the first chamfered surface 1 d on the plane where the first surface 1 a is located along the second direction Y may be 10 μm, 20 μm, 30 μm, 40 μm or 50 μm.

[0201] A dimension d2 of an orthographic projection of the first chamfered surface 1d on the plane where the selected side surface 1cc is located along the third direction Z may be 10 μm, 20 μm, 30 μm, 40 μm or 50 μm.

[0202] A dimension d3 of an orthographic projection of the second chamfered surface 1e on the plane where the second surface 1b is located along the second direction Y may be 10 μm, 20 μm, 30 μm, 40 μm or 50 μm.

[0203] A dimension d4 of the orthographic projection of the second chamfered surface 1e on the plane where the selected side surface 1cc is located along the third direction Z may be 10 μm, 20 μm, 30 μm, 40 μm or 50 μm.

[0204] For example, a dimension d1 of the orthographic projection of the first chamfered surface 1d on the plane where the first surface 1a is located, along the second direction Y, and a dimension d2 of the orthographic projection of the first chamfered surface 1d on the plane where the selected side surface 1cc is located, along the third direction Z, may be the same as or different from each other. When the dimension d1 of the orthographic projection of the first chamfered surface 1d on the plane where the first surface 1a is located, along the second direction Y, and the dimension d2 of the orthographic projection of the first chamfered surface 1d on the plane where the selected side surface 1cc is located, along the third direction Z, are the same, the first chamfered surface 1d has good symmetry.

[0205] A dimension d3 of the orthographic projection of the second chamfered surface 1e on the plane where the second surface 1b lies along the second direction Y and a dimension d4 of the orthographic projection of the second chamfered surface 1e on the plane where the selected side surface 1cc lies along the third direction Z may be the same or different. When the dimension d3 of the orthographic projection of the second chamfered surface 1e on the plane where the second surface 1b lies along the second direction Y and the dimension d4 of the orthographic projection of the second chamfered surface 1e on the plane where the selected side surface 1cc lies along the third direction Z are the same, the second chamfered surface 1e has good symmetry.

[0206] Exemplarily, when the substrate 1 has a first chamfered surface 1d and a second chamfered surface 1e, the first transition recessed sub-area K14 of the recessed area K1 is at least arranged on the first chamfered surface 1d, and the second transition recessed sub-area K15 of the recessed area K1 is at least arranged on the second chamfered surface 1e.

[0207] It should be noted that the aforementioned "first transition recessed sub-area K14 is provided at least on the first chamfered surface 1d" means that the first transition recessed sub-area K14 can be provided only on the first chamfered surface 1d of the substrate 1, or can extend to the first surface 1a of the substrate 1 and / or a selected side surface 1cc of the substrate 1. The aforementioned "second transition recessed sub-area K15 is provided at least on the second chamfered surface 1e" means that the second transition recessed sub-area K15 can be provided only on the second chamfered surface 1e of the substrate 1, or can extend to the second surface 1b of the substrate 1 and / or a selected side surface 1cc of the substrate 1.

[0208] Please continue to refer to Figure 7. When the substrate 1 has a first chamfered surface 1d and a second chamfered surface 1e, each of the multiple connecting leads 2 extends from the first surface 1a of the substrate 1, passes through the first chamfered surface 1d of the substrate 1, the selected side surface 1cc of the substrate 1 and the second chamfered surface 1e of the substrate 1 in sequence, and extends to the second surface 1b of the substrate 1. When multiple connecting leads 2 pass through the first chamfered surface 1d, since the first surface 1a of the substrate 1 can transition relatively smoothly from the first chamfered surface 1d to the selected side 1cc, or the selected side 1cc can transition relatively smoothly from the first chamfered surface 1d to the first surface 1a, compared with the case where the first surface 1a is directly connected to the selected side 1cc (in this case, the angle between the first surface 1a and the selected side 1cc is 90°), in the embodiment of the present disclosure, each connecting lead 2 in the multiple connecting leads 2 is subjected to less stress at the corner between the first surface 1a and the selected side 1cc (i.e., the first chamfered surface 1d), thereby reducing the problem of wire breakage caused by excessive stress concentration. In this way, the multiple connecting leads 2 are not easily broken at the corner between the first surface 1a and the selected side 1cc (i.e., the first chamfered surface 1d), thereby ensuring that the multiple connecting leads 2 can stably connect the relatively arranged first surface 1a and second surface 1b of the substrate 1, thereby improving the stability of the display panel 10.

[0209] Similarly, when multiple connecting leads 2 pass through the second chamfered surface 1e, the stress on each connecting lead 2 in the multiple connecting leads 2 at the corner between the second surface 1b and the selected side surface 1cc (i.e., the second chamfered surface 1e) is relatively small, reducing the problem of wire breakage caused by excessive stress concentration. In this way, the multiple connecting leads 2 are not easily broken at the corner between the second surface 1b and the selected side surface 1cc (i.e., the second chamfered surface 1e), ensuring that the multiple connecting leads 2 can effectively connect the relatively arranged first surface 1a and second surface 1b of the substrate 1, further improving the reliability of the display panel 10.

[0210] The following is a detailed description of the preparation process of the plurality of connecting leads 2 .

[0211] As shown in Figures 8A and 8B, Figure 8A is a flow chart of a process for preparing a plurality of connecting leads 2 according to some embodiments of the present disclosure, and Figure 8B is a structural diagram of the display panel 10 corresponding to step R1 in the process for preparing a plurality of connecting leads 2 in Figure 8A. The process for preparing a plurality of connecting leads 2 includes the following steps:

[0212] R1: As shown in FIG8B , a conductive layer D is formed on the first surface 1a, the first chamfered surface 1d, the selected side surface 1cc, the second chamfered surface 1e, and the second surface 1b of the substrate 1. The conductive layer D includes a first portion D1 located on the first surface 1a of the substrate 1, a fourth portion D4 located on the first chamfered surface 1d of the substrate 1, a third portion D3 located on the selected side surface 1cc of the substrate 1, a fifth portion D5 located on the second chamfered surface 1e of the substrate 1, and a second portion D2 located on the second surface 1b of the substrate 1. The first portion D1, the fourth portion D4, the third portion D3, the fifth portion D5, and the second portion D2 are sequentially connected.

[0213] R2: A plurality of recessed areas K1 are formed by a laser etching process to form independent connecting leads 2 between two adjacent recessed areas K1.

[0214] It should be noted that Figures 8A and 8B illustrate only the example in which the substrate 1 includes a first chamfered surface 1d and a second chamfered surface 1e, and the fourth portion D4 of the conductive layer D is located on the first chamfered surface 1d of the substrate 1, while the fifth portion D5 of the conductive layer D is located on the second chamfered surface 1e of the substrate 1. When the substrate 1 does not include the first chamfered surface 1d and the second chamfered surface 1e, the fourth portion D4 of the conductive layer D may be located on the first surface 1a or the selected side surface 1cc of the substrate 1. Alternatively, a portion of the fourth portion D4 of the conductive layer D may be located on the selected side surface 1cc of the substrate 1 and another portion may be located on the first surface 1a of the substrate 1. The fifth portion D5 of the conductive layer D may also be located on the second surface 1b or the selected side surface 1cc of the substrate 1, or a portion of the fifth portion D5 of the conductive layer D may be located on the selected side surface 1cc of the substrate 1 and another portion may be located on the second surface 1b of the substrate 1.

[0215] It is understood that by applying a laser to the conductive layer, a portion of the conductive layer is removed to form the recessed region K1 and the connecting lead 2, wherein the recessed region K1 includes a groove extending along the laser etching direction. For example, as shown in Figures 8D, 8E, and 8F, when forming the first recessed sub-region K11, a portion of the conductive layer on the first surface 1a is irradiated by the laser, and the two move relative to each other along a specific direction (e.g., the second direction Y). The laser-irradiated area of ​​the conductive layer is removed, and the remaining conductive layer on the first surface 1a forms the first lead segments of the multiple connecting leads; illustratively, during the laser etching process, it is possible to etch grooves extending along the laser etching direction on the first surface, that is, the first recessed sub-region K11 includes multiple first grooves K11a arranged in parallel and extending along the second direction Y. When forming the second recessed sub-region K12, a portion of the conductive layer on the second surface 1b is irradiated with a laser, and the two move relative to each other in a specific direction (e.g., the second direction Y). The laser-irradiated region of the conductive layer is removed, and the remaining conductive layer on the second surface 1b forms a plurality of second lead segments for connecting leads. Exemplarily, during the laser etching process, grooves extending along the laser etching direction may be etched on the second surface, i.e., the second recessed sub-region K12 includes a plurality of second grooves K12a arranged in parallel and extending along the second direction Y. When forming the side recessed sub-region K13, a portion of the conductive layer on the selected side surface 1cc is irradiated with a laser, and the two move relative to each other in a specific direction (e.g., the third direction Z). The laser-irradiated region of the conductive layer is removed, and the remaining conductive layer on the selected side surface 1cc forms a plurality of side lead segments for connecting leads. Exemplarily, during the laser etching process, grooves extending along the laser etching direction may be etched on the selected side surface, i.e., the side recessed sub-region K13 includes a plurality of side grooves K13a arranged in parallel and extending along the third direction Z. In some examples, the first groove K11a extends to the first transition recessed sub-region K14, the second groove K12a extends to the second transition recessed sub-region K15, and the side groove K13a extends to the first transition recessed sub-region K14 and the second transition recessed sub-region K15.

[0216] For example, a conductive layer D can be formed on the first surface 1a, the first chamfered surface 1d, the selected side surface 1cc, the second chamfered surface 1e and the second surface 1b of the substrate 1 by using an electroplating process, an evaporation process, a pad printing silver paste, a sputtering process (for example, a multi-arc magnetron sputtering process), a deposition process, etc.

[0217] It is understandable that before the conductive layer D is formed by a deposition process, a mask needs to be set on the first surface 1a and the second surface 1b of the substrate 1 to at least cover the area where the pixel unit P is located. Considering the alignment accuracy / tolerance, etc., the mask will also cover the partial area of ​​the first electrode 4 near the pixel unit P exposed by the third opening 632.

[0218] Exemplarily, the contour of the mask close to the boundary of the substrate 1 is conformal to the contour 61 of the first sub-insulating layer 62 close to the boundary of the substrate 1 .

[0219] Exemplarily, the first portion D1 of the conductive layer D located on the first surface 1a of the substrate 1 is in electrical contact with the first electrode 4. For example, the first portion D1 of the conductive layer D may cover multiple first electrodes 4 to increase the contact area between the two.

[0220] When the substrate 1 includes a first chamfered surface 1d and a second chamfered surface 1e, please continue to refer to Figure 8B. Since the first chamfered surface 1d and the second chamfered surface 1e of the substrate 1 are arc surfaces or inclined surfaces, the fourth portion D4 and the fifth portion D5 of the conductive layer D formed on the outside thereof are conformal to the first chamfered surface 1d and the second chamfered surface 1e, respectively.

[0221] It is understood that because the fourth portion D4 of the conductive layer D is configured as an arcuate surface, a distance exists between portions of the surface of the fourth portion D4 of the conductive layer D on the side away from the substrate 1 along the second direction Y or the third direction Z. For example, in FIG8B , two regions selected from the surface of the fourth portion D4 of the conductive layer D on the side away from the substrate 1 have a distance L1 along the second direction Y and a distance L2 along the third direction Z.

[0222] Similarly, because the fifth portion D5 of the conductive layer D is configured as an arcuate surface, a distance exists between portions of the surface of the fifth portion D5 of the conductive layer D on the side facing away from the substrate 1 along the second direction Y or the third direction Z. For example, in FIG8B , two regions selected from the surface of the fifth portion D5 of the conductive layer D on the side facing away from the substrate 1 have a distance L3 along the second direction Y and a distance L4 along the third direction Z.

[0223] When the recessed area K1 is formed by the laser etching process in the above-mentioned step R2, since the surfaces of the fourth portion D4 and the fifth portion D5 of the conductive layer D are not coplanar with the surfaces of other areas of the conductive layer D, when etching the fourth portion D4 of the conductive layer D on the first chamfered surface 1d or the fifth portion D5 of the conductive layer D on the second chamfered surface 1e, whether the laser moves along the second direction Y on a plane at a specific distance from the first surface 1a or the second surface 1b of the substrate 1, or the laser moves along the third direction Z on a plane at a specific distance from the selected side surface 1cc, the defocus amount changes, which may cause the conductive pattern Q shown in Figure 8C to remain when etching the fourth portion D4 and the fifth portion D5 of the conductive layer D, further causing a short circuit between subsequent adjacent connecting leads 2.

[0224] It should be noted that when the recessed area K1 is formed by the laser etching process in the above-mentioned step R2, when the substrate 1 does not include the first chamfered surface 1d and the second chamfered surface 1e, when etching the conductive layer D on the first surface 1a, the selected side surface 1cc and the second surface 1b of the substrate 1, due to the preparation process reasons, the conductive layer D formed at the junction of the first surface 1a and the selected side surface 1cc of the substrate 1 and the junction of the second surface 1b and the selected side surface 1cc of the substrate 1 is not an absolute right angle, and the fourth part D4 and the fifth part D5 of the conductive layer D also present an arc shape with a smaller curvature, which is prone to etching residue problems caused by differences in defocus during the laser etching process.

[0225] Based on this, the following takes the substrate 1 including the first chamfered surface 1d and the second chamfered surface 1e as an example to firstly describe an embodiment of the arrangement of the first transition recessed sub-region K14.

[0226] In some embodiments, as shown in Figures 9A, 9B, and 9C, each of which is a structural diagram of a display panel 10 according to some embodiments of the present disclosure, the display panel 10 includes a plurality of recessed regions K1, which extend from the first surface 1a to the second surface 1b, sequentially through the first chamfered surface 1d, the selected side surface 1cc, and the second chamfered surface 1e. The recessed regions K1 include a first recessed sub-region K11 located on the first surface 1a, a second recessed sub-region K12 located on the second surface 1b, a side recessed sub-region K13 located on the selected side surface 1cc, a first transition recessed sub-region K14 located on the first chamfered surface 1d, and a second transition recessed sub-region K15 located on the second chamfered surface 1e.

[0227] A connecting lead 2 is provided between two adjacent recessed areas K1. The connecting lead 2 includes a first lead segment 2a located on the first surface 1a, a second lead segment 2b located on the second surface 1b, a side lead segment 2c located on the selected side surface 1cc, a first transition lead segment 2d located on the first chamfered surface 1d, and a second transition lead segment 2e located on the second chamfered surface 1e.

[0228] Please continue to refer to Figures 8D and 8E. The first transition recessed sub-area K14 includes a plurality of first transition grooves K14a arranged in parallel. The extension direction of the first transition groove K14a has a first angle with the extension direction of at least one of the first groove K11a and the side groove K13a. The first transition groove K14a intersects with at least one of the first groove K11a and the side groove K13a to form a first mesh recess K14W.

[0229] That is, the first groove K11a is not only located in the first recessed sub-area K11, but also includes a portion extending into the first transition recessed sub-area K14. And / or the side groove K13a is not only located in the side recessed sub-area K13, but also includes a portion extending into the first transition recessed sub-area K14. That is, the first mesh recess K14W located in the first transition recessed sub-area K14 can be formed by the intersection of the first transition groove K14a and the first groove K11a (as shown in FIG8D ), or by the intersection of the first transition groove K14a and the side groove K13a (as shown in FIG8E and FIG8G ), or can be formed by the intersection of the first transition groove K14a, the first groove K11a, and the side groove K13a.

[0230] It should be noted that Figures 8D and 8E illustrate the example of the first transition groove K14a extending perpendicularly to the first groove K11a and / or the side groove K13a. For example, the first groove K11a extends along the second direction Y, the side groove K13a extends along the third direction Z, and the first transition groove K14a extends along the first direction X.

[0231] As shown in FIG8G , the first groove K11a extends along the first direction X, the side groove K13a extends along the third direction Z, and the first transition groove K14a includes multiple first transition grooves that also extend along the first direction X. In this case, the first mesh-shaped recessed portion K14W located in the first transition recessed sub-area K14 is formed by the intersection of the first transition groove K14a and the side groove K13a. The multiple first transition grooves K14a can be formed by laser etching. For example, at least one of the multiple first transition grooves K14a can be located on the first surface, and at least one of the multiple first transition grooves K14a can be located on a selected side surface. The multiple first transition grooves K14a located on the first surface 1a of the substrate 1 are arranged along the second direction Y, and the multiple first transition grooves K14a located on the selected side surface 1cc of the substrate 1 are arranged along the third direction Z.

[0232] Because the extension direction of the multiple first transition grooves K14a in the first transition recessed sub-region K14 forms a first angle with the extension direction of at least one of the first grooves K11a and the side grooves K13a, that is, the etching direction when forming the first transition grooves K14a is different from the etching direction when forming at least one of the first grooves K11a and the side grooves K13a, it is necessary to perform two etchings in different etching directions on the fourth portion D4 of the conductive layer D to form the first mesh-shaped recessed portion K14W in the first transition recessed sub-region K14, thereby reducing the probability of residual conductive pattern Q in the first transition recessed sub-region K14.

[0233] For example, the size of the first transition recessed sub-region K14 along the first direction X may be the same as the size of the side recessed sub-region K13 along the first direction X. Alternatively, as shown in FIG9B , the size m1 of the first transition recessed sub-region K14 along the first direction X may also be greater than the size m3 of the side recessed sub-region K13 along the first direction X.

[0234] When the dimension m1 of the first transition recessed sub-region K14 along the first direction X is greater than the dimension m3 of the side recessed sub-region K13 along the first direction X, that is, the dimension of the first transition recessed sub-region K14 along the first direction X is increased. On the one hand, because the first transition recessed sub-region K14 separates two adjacent first transition lead segments 2d of the connecting leads 2, it can be understood that the dimension of the first transition recessed sub-region K14 along the first direction X and the spacing between the two first transition lead segments 2d on either side of it are the same, both being m1. Therefore, increasing the dimension m1 of the first transition recessed sub-region K14 along the first direction X is equivalent to increasing the spacing m1 between the two first transition lead segments 2d on either side of the first transition recessed sub-region K14. When the spacing m1 between the two first transition lead segments 2d on both sides of the first transition recessed sub-area K14 increases, even if there are one or more residual conductive patterns Q in the first transition recessed sub-area K14, the probability of short circuit caused by the one or more residual conductive patterns Q being connected to the first transition lead segments 2d of the connecting leads 2 on both sides thereof can be reduced, which is beneficial to improving the stability of the display panel 10.

[0235] On the other hand, since the spacing m1 between the two first transition lead segments 2d on both sides of the first transition recessed sub-area K14 increases, when the first lead segment 2a of the connecting lead 2 located on the first surface 1a is connected through the first transition lead segment 2d and the side lead segment 2c located on the selected side 1cc, the probability of misalignment connection between the first lead segment 2a, the first transition lead segment 2d and the side lead segment 2c of the connecting lead 2 can be reduced, thereby ensuring the normal display of the display panel 10.

[0236] Exemplarily, as shown in FIG9B , a dimension m4 of an orthographic projection of the first transition recessed sub-region K14 on the plane where the selected side surface 1cc is located along the third direction Z is greater than or equal to 10 μm and less than or equal to 50 μm.

[0237] For example, a dimension m4 of an orthographic projection of the first transition recessed sub-region K14 on the plane where the selected side surface 1cc is located along the third direction Z may be 10 μm, 20 μm, 30 μm, 40 μm, or 50 μm.

[0238] In some embodiments, as shown in Figures 10A and 10B, which are structural diagrams of a display panel 10 according to some embodiments of the present disclosure, based on the embodiments shown in Figures 9A, 9B, and 9C, in the embodiments shown in Figures 10A and 10B, the first transition recessed sub-region K14 extends to the selected side surface 1cc of the substrate 1.

[0239] When the fourth portion D4 of the conductive layer D on the first chamfered surface 1d is etched by a laser etching process to obtain the first transition recessed sub-area K14, and the third portion D3 of the conductive layer D on the selected side surface 1cc is etched to obtain the side recessed sub-area K13, the first transition recessed sub-area K14 is extended to the selected side surface 1cc, which is beneficial to fully etching the junction of the first chamfered surface 1d and the selected side surface 1cc of the substrate 1, reducing the probability of short circuit of the connecting lead 2, and ensuring the normal display of the display panel 10.

[0240] For example, the size of the first transition recessed sub-region K14 along the first direction X may be the same as the size of the side recessed sub-region K13 along the first direction X. Alternatively, as shown in FIG10B , the size m1 of the first transition recessed sub-region K14 along the first direction X may also be greater than the size m3 of the side recessed sub-region K13 along the first direction X.

[0241] When the dimension m1 of the first transition recessed sub-area K14 along the first direction X is greater than the dimension m3 of the side recessed sub-area K13 along the first direction X, and the first transition recessed sub-area K14 extends to the selected side 1cc of the substrate 1, along the first direction X, the spacing between the first transition lead segment 2d of the two connecting leads 2 on both sides of the first transition recessed sub-area K14 located on the first chamfered surface 1d and the partial area of ​​the side lead segment 2c located on the selected side 1cc (that is, along the first direction X, the partial side lead segment 2c on both sides of the first transition recessed sub-area K14) is also m1. When the side lead segment 2c and the first transition lead segment 2d on the same connecting lead 2 are connected, the probability of misalignment connection between the first transition lead segment 2d and the side lead segment 2c of the connecting lead 2 can be further reduced, thereby ensuring the normal display of the display panel 10.

[0242] Exemplarily, as shown in FIG10B , a dimension m5 of an orthographic projection of the first transition recessed sub-region K14 on the plane where the selected side surface 1 cc is located along the third direction Z is greater than or equal to 60 μm.

[0243] For example, a dimension m5 of the orthographic projection of the first transition recessed sub-region K14 on the plane where the selected side surface 1cc is located along the third direction Z may be 60 μm, 63 μm, 66 μm, 69 μm, 73 μm, 80 μm, 88 μm, 90 μm, 93 μm or 100 μm.

[0244] In some embodiments, as shown in FIG11 , which is a structural diagram of a display panel 10 according to some embodiments of the present disclosure, based on the embodiments shown in FIG9A , FIG9B , and FIG9C , in the embodiment shown in FIG11 , the first transition recessed sub-region K14 extends to the first surface 1 a of the substrate 1 .

[0245] It should be noted that FIG11 uses the embodiment shown in FIG9A , FIG9B , and FIG9C as an example to schematically illustrate that the first transition recessed sub-region K14 extends to the first surface 1a of the substrate 1. However, the embodiments of the present disclosure are not limited thereto. For example, based on the embodiment shown in FIG10A and FIG10B , the first transition recessed sub-region K14 may be configured to extend to the first surface 1a of the substrate 1. That is, the first transition recessed sub-region K14 may extend to both the selected side surface 1cc and the first surface 1a of the substrate 1.

[0246] By extending the first transition recessed sub-region K14 to the first surface 1a of the substrate 1, when the fourth portion D4 of the conductive layer D on the first chamfered surface 1d is etched by a laser etching process to obtain the first transition recessed sub-region K14, and when the first portion D1 of the conductive layer D on the first surface 1a is etched to obtain the first recessed sub-region K11, the first transition recessed sub-region K14 is extended to the first surface 1a, which is beneficial to fully etching the junction between the first chamfered surface 1d and the first surface 1a of the substrate 1, reducing the probability of short circuit of the connecting lead 2, and ensuring the normal display of the display panel 10.

[0247] For example, the size of the first transition recessed sub-region K14 along the first direction X may be the same as the size of the side recessed sub-region K13 along the first direction X. Alternatively, as shown in FIG11 , the size m1 of the first transition recessed sub-region K14 along the first direction X may also be greater than the size m3 of the side recessed sub-region K13 along the first direction X. The first direction X is perpendicular to the extension direction of the recessed region K1.

[0248] When the dimension m1 of the first transition recessed sub-area K14 along the first direction X is greater than the dimension m3 of the side recessed sub-area K13 along the first direction X, and the first transition recessed sub-area K14 extends to the first surface 1a, along the first direction X, the spacing between the first transition lead segments 2d of the two connecting leads 2 on both sides of the first transition recessed sub-area K14 located on the first chamfered surface 1d and the partial area of ​​the first lead segment 2a located on the first surface 1a (that is, the partial first lead segments 2a on both sides of the first transition recessed sub-area K14 along the first direction X) is also m1. When the first lead segment 2a and the first transition lead segment 2d on the same connecting lead 2 are connected, the probability of misalignment between the first transition lead segment 2d and the first lead segment 2a of the connecting lead 2 can be further reduced, thereby ensuring the normal display of the display panel 10.

[0249] Exemplarily, as shown in FIG11 , a dimension m6 of an orthographic projection of the first transition recessed sub-region K14 on the plane where the first surface 1 a is located along the second direction Y is greater than or equal to 60 μm.

[0250] For example, a dimension m6 of the orthographic projection of the first transition recessed sub-region K14 on the plane of the first surface 1a along the second direction Y may be 60 μm, 63 μm, 66 μm, 69 μm, 73 μm, 80 μm, 88 μm, 90 μm, 93 μm or 100 μm.

[0251] Next, an embodiment of the configuration of the second transition recessed sub-region K15 is described.

[0252] In some embodiments, please continue to refer to Figures 8E and 8F. The second transition recess sub-area K15 includes a plurality of parallel second transition grooves K15a. The extension direction of the second transition groove K15a has a second angle with the extension direction of at least one of the second groove K12a and the side groove K13a. The second transition groove K15a intersects with at least one of the second groove K12a and the side groove K13a to form a second mesh recess K15W.

[0253] That is, the second groove K12a is not only located in the second recessed sub-area K12, but also includes a portion extending into the second transition recessed sub-area K15. And / or, the side recess K13a is not only located in the side recessed sub-area K13, but also includes a portion extending into the second transition recessed sub-area K15. That is, the second mesh recess K15W located in the second transition recessed sub-area K15 can be formed by the intersection of the second transition recess K15a and the second groove K12a (as shown in FIG8F ), or by the intersection of the second transition recess K15a and the side recess K13a (as shown in FIG8E ), or by the intersection of the first transition recess K14a, the first recess K11a, and the side recess K13a.

[0254] It should be noted that Figures 8E and 8F illustrate the example in which the second transition groove K15a extends perpendicular to the second groove K12a and / or the side groove K13a. For example, the second groove K12a extends along the second direction Y, the side groove K13a extends along the third direction Z, and the second transition groove K15a extends along the first direction X.

[0255] The above-mentioned multiple second transition grooves K15a can be formed by laser etching. For example, a portion of the multiple second transition grooves K15a are located on the first surface, and a portion are located on the selected side. On the second surface 1b of the substrate 1, the multiple second transition grooves K15a are arranged along the second direction Y, and on the selected side 1cc of the substrate 1, the multiple second transition grooves K15a are arranged along the third direction Z.

[0256] Because the extension direction of the plurality of second transition grooves K15a within the second transition recessed sub-region K15 forms a second angle with the extension direction of at least one of the first groove K11a and the side groove K13a, that is, the etching direction when forming the second transition groove K15a is different from the etching direction when forming at least one of the second groove K12a and the side groove K13a. Therefore, when forming the second transition recessed sub-region K15, it is necessary to perform two etchings in different etching directions on the fifth portion D5 of the conductive layer D to form the second mesh-shaped recessed portion K15W, thereby reducing the probability of residual conductive pattern Q in the second transition recessed sub-region K15.

[0257] In some embodiments, as shown in Figure 8E, the side groove K13a extends to the first transition recessed sub-area K14 and the second transition recessed sub-area K15, and the size of the portion of the side groove K13a extending to the first transition recessed sub-area K14 is not equal to the size of the portion extending to the second transition recessed sub-area K15. For example, the size of the portion of the side groove K13a extending to the first transition recessed sub-area K14 is smaller than the size of the portion extending to the second transition recessed sub-area K15. In this way, the areas of the second mesh recess K15W formed by the intersection of the second transition groove K15a and the side groove K13a and the first mesh recess K14W formed by the intersection of the first transition groove K14a and the side groove K13a are not equal.

[0258] Exemplarily, the second transition recessed sub-region K15 is located on the second chamfered surface 1e of the substrate 1. The size of the second transition recessed sub-region K15 along the first direction X can be the same as the size of the side recessed sub-region K13 along the first direction X. Alternatively, as shown in FIG12 , which is a structural diagram of a display panel 10 according to some embodiments of the present disclosure, the size m2 of the second transition recessed sub-region K15 along the first direction X is greater than the size m3 of the side recessed sub-region K13 along the first direction X. The first direction X is perpendicular to the extension direction of the recessed region K1.

[0259] When the dimension m2 of the second transition recessed sub-region K15 along the first direction X is greater than the dimension m3 of the side recessed sub-region K13 along the first direction X, that is, when the dimension of the second transition recessed sub-region K15 along the first direction X is increased, on the one hand, because the spacing m2 between the two second transition lead segments 2e on both sides of the second transition recessed sub-region K15 is increased, when the second lead segment 2b of the connecting lead 2 located on the second surface 1b is connected to the side lead segment 2c located on the defining side surface 1cc via the second transition lead segment 2e, the probability of misalignment of the second lead segment 2b, the second transition lead segment 2e, and the side lead segment 2c of the connecting lead 2 can be reduced, thereby ensuring normal display of the display panel 10.

[0260] On the other hand, since the second transition recessed sub-region K15 separates the second transition lead segments 2e of two adjacent connecting leads 2, it can be understood that the size of the second transition recessed sub-region K15 along the first direction X and the spacing between the two second transition lead segments 2e on either side of it are the same, both being m2. Therefore, increasing the size m2 of the second transition recessed sub-region K15 along the first direction X is equivalent to increasing the spacing m2 between the two second transition lead segments 2e on either side of the second transition recessed sub-region K15. When the spacing m2 between the two second transition lead segments 2e on either side of the second transition recessed sub-region K15 is increased, even if one or more residual conductive patterns Q exist in the second transition recessed sub-region K15, the probability of one or more residual conductive patterns Q connecting to the second transition lead segments 2e of the connecting leads 2 on either side, resulting in a short circuit, can be reduced, thereby improving the stability of the display panel 10.

[0261] Exemplarily, as shown in FIG12 , a dimension m7 of an orthographic projection of the second transition recessed sub-region K15 on the plane where the selected side surface 1cc is located along the third direction Z is greater than or equal to 10 μm and less than or equal to 50 μm.

[0262] For example, a dimension m7 of an orthographic projection of the second transition recessed sub-region K15 on the plane where the selected side surface 1cc is located along the third direction Z may be 10 μm, 20 μm, 30 μm, 40 μm, or 50 μm.

[0263] In some embodiments, as shown in Figures 13A and 13B, which are structural diagrams of a display panel 10 according to some embodiments of the present disclosure, based on the embodiment shown in Figure 12, in the embodiment shown in Figures 13A and 13B, the second transition recessed sub-region K15 extends to the selected side surface 1cc of the substrate 1.

[0264] When the fifth portion D5 of the conductive layer D on the second chamfered surface 1e is etched by a laser etching process to obtain the second transition recessed sub-area K15, and the third portion D3 of the conductive layer D on the selected side surface 1cc is etched to obtain the side recessed sub-area K13, the second transition recessed sub-area K15 is extended to the selected side surface 1cc, which is beneficial to fully etching the junction of the second chamfered surface 1e and the selected side surface 1cc of the substrate 1, reducing the probability of short circuit of the connecting lead 2, and ensuring the normal display of the display panel 10.

[0265] For example, the size of the second transition recessed sub-region K15 along the first direction X may be the same as the size of the side recessed sub-region K13 along the first direction X. Alternatively, as shown in FIG13B , the size m2 of the second transition recessed sub-region K15 along the first direction X may also be greater than the size m3 of the side recessed sub-region K13 along the first direction X. The first direction X is perpendicular to the extension direction of the recessed region K1.

[0266] When the dimension m2 of the second transition recessed sub-area K15 along the first direction X is greater than the dimension m3 of the side recessed sub-area K13 along the first direction X, and the second transition recessed sub-area K15 extends to the selected side 1cc, along the first direction X, the spacing between the second transition lead segments 2e of the two connecting leads 2 on both sides of the second transition recessed sub-area K15 located on the second chamfered surface 1e and a partial area of ​​the side lead segment 2c located on the selected side 1cc (i.e., a portion of the side lead segments 2c on both sides of the second transition recessed sub-area K15 along the first direction X) is also m2. When the side lead segment 2c and the second transition lead segment 2e on the same connecting lead 2 are connected, the probability of misalignment connection between the second transition lead segment 2e and the side lead segment 2c of the connecting lead 2 can be further reduced, thereby ensuring the normal display of the display panel 10.

[0267] Exemplarily, as shown in FIG13B , a dimension m8 of an orthographic projection of the second transition recessed sub-region K15 on the plane where the selected side surface 1 cc is located along the third direction Z is greater than or equal to 60 μm.

[0268] For example, a dimension m8 of the orthographic projection of the second transition recessed sub-region K15 on the plane where the selected side surface 1cc is located along the third direction Z may be 60μm, 63μm, 66μm, 69μm, 73μm, 80μm, 88μm, 90μm, 93μm or 100μm.

[0269] In some embodiments, as shown in FIG14 , which is a structural diagram of a display panel 10 according to some embodiments of the present disclosure, based on the embodiment shown in FIG12 , in the embodiment shown in FIG14 , the second transition recessed sub-region K15 extends to the second surface 1 b of the substrate 1 .

[0270] It should be noted that FIG14 uses the embodiment shown in FIG12 as an example to schematically illustrate that the second transition recessed sub-region K15 extends to the second surface 1b of the substrate 1. However, the embodiments of the present disclosure are not limited thereto. For example, based on the embodiment shown in FIG13A and FIG13B , the second transition recessed sub-region K15 may be configured to extend to the second surface 1b of the substrate 1. That is, the second transition recessed sub-region K15 may extend to both the selected side surface 1cc and the second surface 1b of the substrate 1.

[0271] By extending the second transition recessed sub-area K15 to the second surface 1b of the substrate 1, when the fifth portion D5 of the conductive layer D on the second chamfered surface 1e is etched by a laser etching process to obtain the second transition recessed sub-area K15, and the second portion D2 of the conductive layer D on the second surface 1b is etched to obtain the second recessed sub-area K12, the second transition recessed sub-area K15 is extended to the second surface 1b, which is beneficial to fully etching the junction between the second chamfered surface 1e and the second surface 1b of the substrate 1, reducing the probability of short circuit of the connecting lead 2, and ensuring the normal display of the display panel 10.

[0272] Exemplarily, when the dimension m2 of the second transition recessed sub-area K15 along the first direction X is greater than the dimension m3 of the side recessed sub-area K13 along the first direction X, and the second transition recessed sub-area K15 extends to the second surface 1b, along the first direction X, the spacing between the second transition lead segments 2e of the two connecting leads 2 on both sides of the second transition recessed sub-area K15 located on the second chamfered surface 1e and the partial area of ​​the second lead segment 2b located on the second surface 1b (i.e., the partial second lead segments 2b on both sides of the second transition recessed sub-area K15 along the first direction X) is also m2. When the second lead segment 2b and the second transition lead segment 2e on the same connecting lead 2 are connected, the probability of misalignment connection between the second transition lead segment 2e and the second lead segment 2b of the connecting lead 2 can be further reduced, thereby ensuring the normal display of the display panel 10.

[0273] Exemplarily, as shown in FIG14 , a dimension m9 of an orthographic projection of the second transition recessed sub-region K15 on the plane where the second surface 1 b is located along the second direction Y is greater than or equal to 60 μm.

[0274] For example, a dimension m9 of an orthographic projection of the second transition recessed sub-region K15 on the plane of the second surface 1b along the second direction Y may be 60 μm, 63 μm, 66 μm, 69 μm, 73 μm, 80 μm, 88 μm, 90 μm, 93 μm or 100 μm.

[0275] Although some embodiments of the present application are described herein in conjunction with Figures 9A-14, the above description is exemplary and not exhaustive, and is therefore not limited to the disclosed embodiments. Many modifications and variations will be apparent to those skilled in the art without departing from the scope of the above embodiments. For example, the embodiments of the arrangement of the first transition recessed sub-area K14 shown in Figures 9A-11 and the embodiments of the arrangement of the second transition recessed sub-area K15 shown in Figures 12-14 can be arbitrarily combined, that is, the first transition recessed sub-area K14 and the second transition recessed sub-area K15 of the display panel 10 can be arranged simultaneously.

[0276] For example, as shown in Figures 15A and 15B, which illustrate a structure of a display panel 10 according to some embodiments of the present disclosure, the first transition recessed sub-area K14 is located on the first chamfered surface 1d of the substrate 1, and the second transition recessed sub-area K15 is located on the second chamfered surface 1e of the substrate 1. The dimension m1 of the first transition recessed sub-area K14 along the first direction X and the dimension m2 of the second transition recessed sub-area K15 along the first direction X are both greater than the dimension m3 of the side recessed sub-area K13 along the first direction X. This means that the dimension m1 of the first transition recessed sub-area K14 along the first direction X and the dimension m2 of the second transition recessed sub-area K15 along the first direction X are increased.

[0277] It can be understood that, since the dimension m1 of the first transition recessed sub-area K14 along the first direction X and the dimension m2 of the second transition recessed sub-area K15 along the first direction X increase, the dimension m10 of the first transition lead segment 2d of the connecting lead 2 between two adjacent first transition recessed sub-areas K14 along the first direction X decreases, and the dimension m11 of the second transition lead segment 2e of the connecting lead 2 between two adjacent second transition recessed sub-areas K15 along the first direction X also decreases, and both are smaller than the dimension m12 of the side lead segment 2c of the connecting lead 2 between two adjacent side recessed sub-areas K13 along the first direction X.

[0278] Exemplarily, as shown in FIG. 15B , a dimension m1 of the first transition recessed sub-region K14 along the first direction X is less than or equal to 120 μm and greater than or equal to 50 μm.

[0279] For example, the size m1 of the first transition recessed sub-region K14 along the first direction X may be 50 μm, 55 μm, 60 μm, 63 μm, 66 μm, 75 μm, 80 μm, 83 μm, 88 μm, 90 μm, 96 μm, 100 μm, 105 μm, 110 μm, 112 μm, 118 μm or 120 μm.

[0280] Exemplarily, as shown in FIG. 15B , a dimension m2 of the second transition recessed sub-region K15 along the first direction X is less than or equal to 120 μm and greater than or equal to 50 μm.

[0281] For example, the dimension m2 of the second transition recessed sub-region K15 along the first direction X may be 50 μm, 55 μm, 60 μm, 63 μm, 66 μm, 75 μm, 80 μm, 83 μm, 88 μm, 90 μm, 96 μm, 100 μm, 105 μm, 110 μm, 112 μm, 118 μm or 120 μm.

[0282] Exemplarily, as shown in FIG15B , a dimension m3 of the side-surface recessed sub-region K13 along the first direction X is less than or equal to 45 μm and greater than or equal to 25 μm.

[0283] For example, the size m3 of the side-surface recessed sub-region K13 along the first direction X may be 25 μm, 26 μm, 28 μm, 30 μm, 33 μm, 36 μm, 39 μm, 41 μm, 43 μm or 45 μm.

[0284] In some embodiments, a dimension of the connecting lead 2 along the first direction X is greater than or equal to 60 μm.

[0285] Exemplarily, as shown in FIG15B , the dimension m10 of the first transition lead segment 2 d of the connecting lead 2 along the first direction X (ie, the distance between two adjacent first transition recessed sub-regions K14 along the first direction X) is less than or equal to 140 μm and greater than or equal to 60 μm.

[0286] For example, the dimension m10 of the first transition lead segment 2d of the connecting lead 2 along the first direction X may be: 60μm, 66μm, 68μm, 73μm, 75μm, 80μm, 85μm, 88μm, 90μm, 93μm, 96μm, 100μm, 105μm, 110μm, 112μm, 120μm, 126μm, 130μm, 135μm or 140μm.

[0287] Exemplarily, as shown in FIG15B , the dimension m11 of the second transition lead segment 2e of the connecting lead 2 along the first direction X (ie, the distance between two adjacent second transition recessed sub-regions K15 along the first direction X) is less than or equal to 140 μm and greater than or equal to 60 μm.

[0288] For example, the dimension m11 of the second transition lead segment 2e of the connecting lead 2 along the first direction X may be: 60μm, 66μm, 68μm, 73μm, 75μm, 80μm, 85μm, 88μm, 90μm, 93μm, 96μm, 100μm, 105μm, 110μm, 112μm, 120μm, 126μm, 130μm, 135μm or 140μm.

[0289] Exemplarily, as shown in FIG15B , the dimension m12 of the side lead segment 2 c of the connecting lead 2 along the first direction X (ie, the distance between two adjacent side recessed sub-regions K13 along the first direction X) is less than or equal to 170 μm and greater than or equal to 150 μm.

[0290] For example, the dimension m12 of the side lead segment 2 c of the connecting lead 2 along the first direction X may be 150 μm, 152 μm, 155 μm, 158 μm, 160 μm, 165 μm, 168 μm or 170 μm.

[0291] An embodiment of the disposition of the first recessed sub-region K11 of the recessed region K1 is described below.

[0292] In some embodiments, referring to FIG. 5A , the size of the first recessed sub-region K11 on the first surface 1 a of the substrate 1 along the first direction X is the same as the size of the side recessed sub-region K13 along the first direction X, and both are m1′.

[0293] In other embodiments, as shown in Figures 16 and 17, which are both structural diagrams of a display panel 10 according to some embodiments of the present disclosure, the first recessed sub-region K11 located on the first surface 1a of the substrate 1 has a dimension m13 along the first direction X that is greater than the dimension m3 of the side recessed sub-region K13 along the first direction X.

[0294] By setting the dimension m13 of the first recessed sub-region K11 along the first direction X to be larger than the dimension m3 of the side recessed sub-region K13 along the first direction X, the dimension of the first recessed sub-region K11 along the first direction X is increased.

[0295] On the one hand, because the first recessed sub-region K11 separates two adjacent first lead segments 2a of the connecting leads 2, it can be understood that the size of the first recessed sub-region K11 along the first direction X and the spacing between the two first lead segments 2a on either side of it are the same, both being m13. Therefore, increasing the size m13 of the first recessed sub-region K11 along the first direction X is equivalent to increasing the spacing m13 between the two first lead segments 2a on either side of the first recessed sub-region K11. When the spacing m13 between the two first lead segments 2a on either side of the first recessed sub-region K11 is increased, the probability of misalignment between the first lead segment 2a and the first transition lead segment 2d of the connecting lead 2 located on the first surface 1a can be reduced, thereby ensuring normal display of the display panel 10.

[0296] It should be noted that, in the embodiments shown in Figures 16 and 17, only the substrate 1 including the first chamfered surface 1d is used as an example for illustration. When the substrate 1 does not include the first chamfered surface 1d, the above-mentioned setting can also be performed on the first recessed sub-area K11 of the recessed area K1, and the probability of misaligned connection between the first lead segment 2a and the first transition lead segment 2d of the connecting lead 2 is reduced, thereby ensuring the normal display of the display panel 10.

[0297] Exemplarily, as shown in FIG. 16 and FIG. 17 , a dimension m13 of the first recessed sub-region K11 along the first direction X is less than or equal to 120 μm and greater than or equal to 50 μm.

[0298] For example, the size m13 of the first recessed sub-region K11 along the first direction X may be 50 μm, 55 μm, 60 μm, 63 μm, 66 μm, 75 μm, 80 μm, 83 μm, 88 μm, 90 μm, 96 μm, 100 μm, 105 μm, 110 μm, 112 μm, 118 μm or 120 μm.

[0299] For example, as shown in FIG16 , the dimension m13 of the first recessed sub-region K11 along the first direction X and the dimension m1 of the first transition recessed sub-region K14 along the first direction X may be the same; alternatively, as shown in FIG17 , the dimension m13 of the first recessed sub-region K11 along the first direction X and the dimension m1 of the first transition recessed sub-region K14 along the first direction X may be different. For example, the dimension m13 of the first recessed sub-region K11 along the first direction X is smaller than the dimension m1 of the first transition recessed sub-region K14 along the first direction X.

[0300] When the dimension m13 of the first recessed sub-region K11 along the first direction X and the dimension m1 of the first transition recessed sub-region K14 along the first direction X are the same, it is not necessary to adjust the etching dimensions when etching the conductive layer D to form the first recessed sub-region K11 and the first transition recessed sub-region K14, which can simplify the etching steps and help improve the etching efficiency.

[0301] Although some embodiments of the configuration of the first recessed sub-area K11 of the present application are described herein in conjunction with Figures 16 and 17, the above description is exemplary and non-exhaustive, and is therefore not limited to the disclosed embodiments. Many modifications and variations will be apparent to those skilled in the art without departing from the scope of the above embodiments. For example, the embodiments of the configuration of the first transition recessed sub-area K14 shown in Figures 9A to 11, the embodiments of the configuration of the second transition recessed sub-area K15 shown in Figures 12 to 14, and the embodiments of the configuration of the first recessed sub-area K11 shown in Figures 16 and 17 can be arbitrarily combined, that is, any two or three of the first transition recessed sub-area K14, the second transition recessed sub-area K15, and the first recessed sub-area K11 of the display panel 10 can be configured simultaneously.

[0302] The following is a detailed description of the method for manufacturing the display panel 10 .

[0303] As shown in FIG18 , FIG18 is a flow chart of a method for manufacturing a display panel 10 according to some embodiments of the present disclosure. The method for manufacturing the display panel 10 includes the following steps:

[0304] S1: Provide a substrate 1, which includes a first surface 1a and a second surface 1b arranged opposite to each other, and a side surface 1c connecting the first surface 1a and the second surface 1b, a first chamfered surface 1d and a second chamfered surface 1e, the first chamfered surface 1d connecting the first surface 1a and the side surface 1c, and the second chamfered surface 1e connecting the second surface 1b and the side surface 1c.

[0305] S2: A conductive layer D is formed on the first surface 1a, the second surface 1b, the side surface 1c (i.e., the selected side surface 1cc), the first chamfered surface 1d, and the second chamfered surface 1e. The conductive layer D includes a first portion D1 located on the first surface 1a of the substrate 1, a fourth portion D4 located on the first chamfered surface 1d of the substrate 1, a third portion D3 located on the selected side surface 1cc of the substrate 1, a fifth portion D5 located on the second chamfered surface 1e of the substrate 1, and a second portion D2 located on the second surface 1b of the substrate 1. The first portion D1, the fourth portion D4, the third portion D3, the fifth portion D5, and the second portion D2 are sequentially connected.

[0306] S3: Etching the conductive layer D using a laser etching process to form a plurality of recessed areas K1.

[0307] As shown in Figures 9A to 14, the recessed area K1 extends from the first surface 1a to the second surface 1b, sequentially passing through the first chamfered surface 1d, the selected side surface 1cc, and the second chamfered surface 1e. The recessed area K1 includes a first recessed sub-area K11 located on the first surface 1a, a second recessed sub-area K12 located on the second surface 1b, a side recessed sub-area K13 located on the selected side surface 1cc, a first transition recessed sub-area K14 located at least on the first chamfered surface 1d, and a second transition recessed sub-area K15 located at least on the second chamfered surface 1e.

[0308] Continuing with Figures 9A to 14 , a connecting lead 2 is formed between two adjacent recessed areas K1. The connecting lead 2 includes a first lead segment 2a located on the first surface 1a, a second lead segment 2b located on the second surface 1b, a side lead segment 2c located on the selected side surface 1cc, a first transition lead segment 2d located on the first chamfered surface 1d, and a second transition lead segment 2e located on the second chamfered surface 1e.

[0309] It should be noted that the above-mentioned "first transition recessed sub-area K14 at least located on the first chamfered surface 1d" means that, as shown in Figures 9A to 9C, the first transition recessed sub-area K14 can be only arranged on the first chamfered surface 1d of the substrate 1; or, as shown in Figures 10A to 11, the first transition recessed sub-area K14 can also extend to the selected side surface 1cc or the first surface 1a of the substrate 1; or, the first transition recessed sub-area K14 can also extend to the selected side surface 1cc and the first surface 1a of the substrate 1 at the same time.

[0310] The above-mentioned “the second transition recessed sub-area K15 at least located on the second chamfered surface 1e” means that, as shown in FIG12 , the second transition recessed sub-area K15 can be only arranged on the second chamfered surface 1e of the substrate 1; or, as shown in FIG13A to FIG14 , the second transition recessed sub-area K15 can also extend to the selected side surface 1cc or the second surface 1b of the substrate 1; or, the second transition recessed sub-area K15 can also extend to the selected side surface 1cc and the second surface 1b of the substrate 1 at the same time.

[0311] In some embodiments, as shown in Figures 19 and 20, Figure 19 is a flow chart of step S3 in the method for manufacturing the display panel 10 in Figure 18, and Figure 20 is a structural diagram of the display panel 10 corresponding to step S3 in the method for manufacturing the display panel 10 in Figure 19.

[0312] Step S3 in the method for manufacturing the display panel 10 includes the following steps:

[0313] S31: Etching the conductive layer D on the first chamfered surface 1d (i.e., the fourth portion D4 of the conductive layer D) along a set direction to form a first transition recessed sub-region K14. The set direction is parallel to the first direction X, or the set direction and the first direction X form an acute angle.

[0314] S32: etching the conductive layer D on the second chamfered surface 1e (ie, the fifth portion D5 of the conductive layer D) along a set direction to form a second transition recessed sub-region K15.

[0315] S33 : etching the conductive layer D (ie, the third portion D3 of the conductive layer D) on the side surface 1 c (ie, the selected side surface 1 cc) along the third direction Z to form a side surface recessed sub-region K13 .

[0316] It should be noted that there is no limitation on the order of the above steps S31, S32 and S33.

[0317] It should be noted that FIG. 20 is merely an illustration of an example in which the setting direction is parallel to the first direction X.

[0318] Since the extension direction of the first transition groove K14a and the second transition groove K15a is the set direction, and the set direction is parallel to the first direction X, or the angle between the set direction and the first direction X is an acute angle, and the extension direction of the side groove K13a is the third direction Z, and the third direction Z and the first direction X are perpendicular to each other, that is, the extension direction of the first transition groove K14a and the second transition groove K15a is different from the extension direction of the side groove K13a, it is necessary to etch the fourth part D4 and the fifth part D5 of the conductive layer D separately, and since the set direction is parallel to the first direction X, the fourth part D4 and the fifth part D5 of the conductive layer D need to be etched separately. In the first direction X, or, the angle between the setting direction and the first direction X is an acute angle, when the fourth portion D4 and the fifth portion D5 of the conductive layer D are etched by laser, along the first direction X, the defocus amount of the etched area of ​​the fourth portion D4 or the fifth portion D5 of the conductive layer D (that is, the distance between the laser focus and the fourth portion D4 or the fifth portion D5 of the conductive layer D) is the same or has a small difference, which is beneficial to improving the etching quality at the first chamfered surface 1d and the second chamfered surface 1e, and reducing the probability of residual conductive pattern Q in the first transition recessed sub-area K14 and the second transition recessed sub-area K15.

[0319] In some embodiments, please continue to refer to FIG. 20 , a plurality of first transition grooves K14 a extending along a set direction are provided in the first transition recess sub-region K14 . The plurality of first transition grooves K14 a can be formed by laser etching, and the plurality of first transition grooves K14 a are provided in parallel.

[0320] A plurality of second transition grooves K15 a extending along a set direction are provided in the second transition recessed sub-area K15 . The plurality of second transition grooves K15 a can be formed by laser etching, and the plurality of second transition grooves K15 a are provided in parallel.

[0321] It can be understood that when the setting direction of each of the multiple first transition grooves K14a within the first transition recessed sub-area K14 is the same, the multiple first transition grooves K14a within the first transition recessed sub-area K14 are parallel to each other. When the setting direction of each of the multiple second transition grooves K15a within the second transition recessed sub-area K15 is the same, the multiple second transition grooves K15a within the second transition recessed sub-area K15 are also parallel to each other. For example, because the first transition recessed sub-area K14 is provided with multiple first transition grooves K14a extending along the setting direction (first direction X), the first transition recessed sub-area K14 has a striped morphology along the setting direction (first direction X). Similarly, since a plurality of second transition grooves K15a extending along the set direction (first direction X) are provided in the second transition recessed sub-region K15, the second transition recessed sub-region K15 has a stripe-like morphology along the set direction (first direction X).

[0322] In some embodiments, referring to FIG. 20 again, a plurality of side grooves K13 a extending along the third direction Z are disposed in the side recessed sub-region K13 of each recessed region K1 , and the plurality of side grooves K13 a are disposed in parallel.

[0323] It should be noted that the aforementioned “multiple side grooves K13 a are arranged in parallel” means that the multiple side grooves K13 a are arranged along the first direction X on the selected side surface 1 cc of the substrate 1 .

[0324] Exemplarily, the side recessed sub-region K13 extends to the first chamfered surface 1d of the substrate 1, and the first transition recessed sub-region K14 extends to the selected side surface 1cc of the substrate 1. That is, the side recessed sub-region K13 and the first transition recessed sub-region K14 have a first overlapping region EE as shown in FIG20. Since the side recessed sub-region K13 is provided with a plurality of side grooves K13a extending along the third direction Z and arranged along the first direction X, and the first transition recessed sub-region K14 is provided with a plurality of first transition grooves K14a extending along a set direction (the first direction X), that is, the side grooves K13a in the side recessed sub-region K13 and the first transition grooves K14a in the first transition recessed sub-region K14 are arranged perpendicular to each other, therefore, in the first overlapping region EE shown in FIG20, the plurality of side grooves K13a in the side recessed sub-region K13 and the plurality of first transition grooves K14a in the first transition recessed sub-region K14 jointly form a first mesh-shaped recessed portion K14W.

[0325] Through the above-mentioned setting, when the side recessed sub-area K13 and the first transition recessed sub-area K14 are formed by the laser etching process, the first overlapping area EE of the side recessed sub-area K13 and the first transition recessed sub-area K14 are etched respectively, which is beneficial to improving the etching quality of the first overlapping area EE and reducing the probability of residual conductive pattern Q existing in the first overlapping area EE.

[0326] Exemplarily, the side recessed sub-area K13 extends to the second chamfered surface 1e of the substrate 1, and the second transition recessed sub-area K15 extends to the selected side surface 1cc of the substrate 1. That is, the side recessed sub-area K13 and the second transition recessed sub-area K15 have a second overlapping region FF as shown in FIG20. Since the side recessed sub-area K13 is provided with a plurality of side grooves K13a extending along the third direction Z and arranged along the first direction X, and the second transition recessed sub-area K15 is provided with a plurality of second transition grooves K15a extending along a set direction (the first direction X), that is, the side grooves K13a in the side recessed sub-area K13 and the second transition grooves K15a in the second transition recessed sub-area K15 are arranged perpendicular to each other, therefore, in the second overlapping region FF shown in FIG20, the plurality of side grooves K13a in the side recessed sub-area K13 and the plurality of second transition grooves K15a in the second transition recessed sub-area K15 jointly form a second mesh-shaped recessed portion K15W.

[0327] Through the above-mentioned setting, when the side recessed sub-area K13 and the second transition recessed sub-area K15 are formed by the laser etching process, the second overlapping area FF of the side recessed sub-area K13 and the second transition recessed sub-area K15 are etched respectively, which is beneficial to improving the etching quality of the second overlapping area FF and reducing the probability of residual conductive pattern Q existing in the first overlapping area EE.

[0328] In some embodiments, as shown in FIG. 21A , FIG. 21A is a cross-sectional view of the first transition groove K14 a along section line PP′ in FIG. 8E .

[0329] The depth h1 of each first transition groove K14a is 1 μm to 3 μm, and the width w1 of each first transition groove K14a is 1 μm to 10 μm.

[0330] For example, the depth h1 of each first transition groove K14 a may be 1 μm, 1.2 μm, 1.6 μm, 2 μm, 2.1 μm, 2.3 μm, 2.6 μm, 2.8 μm, and 3 μm.

[0331] The width w1 of each first transition groove K14 a may be 1 μm, 2 μm, 3 μm, 4 μm, 5 μm, 6 μm, 7 μm, 8 μm, 9 μm, or 10 μm.

[0332] It should be noted that the aforementioned "depth of the first transition groove K14a" refers to the distance between the bottom end of a transition groove K14a and the corresponding surface of the substrate 1 on which it is located (e.g., the first surface 1a of the substrate 1 shown in FIG21A ). FIG21A illustrates an example in which the depth h1 of the multiple first transition grooves K14a within the first transition recessed sub-region K14 is the same. However, the configuration of the depth h1 of the multiple first transition grooves K14a within the first transition recessed sub-region K14 in the present disclosure is not limited to this. For example, at least two of the multiple first transition grooves K14a within the first transition recessed sub-region K14 may have different depths h1.

[0333] The aforementioned "width of the first transition groove K14a" refers to the maximum dimension of the first transition groove K14a along the extension direction of the recessed region K1 (on the first surface 1a of the substrate 1, the extension direction of the recessed region K1 is the second direction Y). FIG. 21A illustrates an example in which the width w1 of the multiple first transition grooves K14a within the first transition recessed sub-region K14 is the same. However, the present disclosure is not limited to this arrangement for the width w1 of the multiple first transition grooves K14a within the first transition recessed sub-region K14. For example, at least two of the multiple first transition grooves K14a within the first transition recessed sub-region K14 may have different widths w1.

[0334] In some embodiments, as shown in FIG. 21B , FIG. 21B is a cross-sectional view of the second transition groove K15 a along section line QQ′ in FIG. 8E .

[0335] The depth h3 of each second transition groove K15a is 1 μm to 3 μm, and the width w3 of each second transition groove K15a is 1 μm to 10 μm.

[0336] For example, the depth h3 of each second transition groove K15 a may be 1 μm, 1.2 μm, 1.6 μm, 2 μm, 2.1 μm, 2.3 μm, 2.6 μm, 2.8 μm, and 3 μm.

[0337] The width w3 of each second transition groove K15a can be 1μm, 2μm, 3μm, 4μm, 5μm, 6μm, 7μm, 8μm, 9μm, and 10μm. It should be noted that the "depth of the second transition groove K15a" described above refers to the distance between the bottom end of the second transition groove K15a and the corresponding surface of the substrate 1 on which it is located (e.g., the second surface 1b of the substrate 1 shown in FIG21B ). FIG21B illustrates an example in which the depth h3 of the plurality of second transition grooves K15a within the second transition recessed sub-area K15 is the same. However, the configuration of the depth h3 of the plurality of second transition grooves K15a within the second transition recessed sub-area K15 in the present disclosure is not limited to this. For example, at least two of the plurality of second transition grooves K15a within the second transition recessed sub-area K15 may have different depths h3.

[0338] The "width of the second transition groove K15a" described above refers to the maximum dimension of the second transition groove K15a in a direction perpendicular to its extension direction. FIG21B illustrates an example in which the width w3 of the plurality of second transition grooves K15a within the second transition recessed sub-area K15 is the same. However, the present disclosure is not limited to this arrangement for the width w3 of the plurality of second transition grooves K15a within the second transition recessed sub-area K15. For example, at least two of the plurality of second transition grooves K15a within the second transition recessed sub-area K15 may have different widths w3.

[0339] In some embodiments, as shown in FIG. 19 and FIG. 22 , FIG. 22 is a structural diagram of the first transition recessed sub-region K14 of the display panel 10 corresponding to step S31 in the method for manufacturing the display panel 10 in FIG. 19 .

[0340] Step S31 in the method for manufacturing the display panel 10 includes:

[0341] S311: Make the laser perpendicular to the selected side surface 1cc of the substrate 1, and etch the conductive layer D on the first chamfered surface 1d of the substrate 1 (that is, the fourth part D4 of the conductive layer D) along the set direction to form the first part K141 of the first transition recessed sub-area K14; wherein, the range of the laser etching does not exceed the plane where the first surface 1a of the substrate 1 is located.

[0342] S312: Make the laser perpendicular to the first surface 1a of the substrate 1 and etch the conductive layer D (i.e., the fourth portion D4 of the conductive layer D) on the first chamfered surface 1d of the substrate 1 along a set direction to form the second portion K142 of the first transition recessed sub-region K14.

[0343] As shown in Figure 22, the first transition recessed sub-region K14 includes a first portion K141 and a second portion K142. When forming the first portion K141 of the first transition recessed sub-region K14, the laser is perpendicular to the selected side surface 1cc of the substrate 1, and the range of the laser etching does not exceed the plane of the first surface 1a of the substrate 1. That is, the orthographic projection of the first portion K141 of the first transition recessed sub-region K14 on the selected side surface 1cc of the substrate 1 is within the boundary of the selected side surface 1cc of the substrate 1. This can prevent laser damage to the insulating layer 6 located on the first surface 1a of the substrate 1 when forming the first portion K141 of the first transition recessed sub-region K14.

[0344] In some embodiments, as shown in FIG19, FIG23A and FIG23B, FIG23A and FIG23B are both structural diagrams of the region NN of the display panel 10 in the embodiment shown in FIG4B corresponding to step S34 in the method for manufacturing the display panel 10 in FIG19. Step S3 in the method for manufacturing the display panel 10 further includes step S34:

[0345] The conductive layer D on the first surface 1 a (ie, the first portion D1 of the conductive layer D) is etched along a set direction to form a first recessed sub-region K11 .

[0346] It should be noted that Figure 23A illustrates the example of setting the direction parallel to the first direction X, but the setting method of the setting direction in the present disclosure is not limited to this. For example, the setting direction and the first direction X may have an angle, and the angle is an acute angle.

[0347] In some embodiments, please continue to refer to Figures 8G and 23A. A plurality of first grooves K11a extending along a set direction are provided in the first recessed sub-area K11. The plurality of first grooves K11a are arranged along the extension direction of the recessed area K1. The plurality of first grooves K11a are located on the first surface 1a of the substrate 1.

[0348] The aforementioned “a plurality of first grooves K11 a are arranged along the extending direction of the recessed area K1 ” means that a plurality of first grooves K11 a in the first recessed sub-area K11 are arranged along the second direction Y on the first surface 1 a of the substrate 1 .

[0349] It can be understood that when the setting direction of each of the multiple first grooves K11a in the first recessed sub-region K11 is the same, the multiple first grooves K11a in the first recessed sub-region K11 are parallel to each other.

[0350] Exemplarily, the first recessed sub-region K11 extends to the first chamfered surface 1d of the substrate 1, and the first transition recessed sub-region K14 extends to the first surface 1a of the substrate 1. That is, the first recessed sub-region K11 and the first transition recessed sub-region K14 have a third overlapping region GG as shown in FIG23A . Because the first recessed sub-region K11 is provided with a plurality of first grooves K11a extending along a set direction (first direction X) and arranged along a second direction Y, and the first transition recessed sub-region K14 is provided with a plurality of first transition grooves K14a extending along the set direction (first direction X), that is, the side grooves K13a in the side recessed sub-region K13 and the first transition grooves K14a in the first transition recessed sub-region K14 are arranged parallel to each other, thus, in the third overlapping region GG shown in FIG23A , the plurality of first grooves K11a in the first recessed sub-region K11 and the plurality of first transition grooves K14a in the first transition recessed sub-region K14 collectively form a striped morphology.

[0351] Through the above-mentioned setting, when the first recessed sub-region K11 and the first transition recessed sub-region K14 are formed by the laser etching process, the third overlapping region GG of the first recessed sub-region K11 and the first transition recessed sub-region K14 are etched respectively, which is beneficial to improving the etching quality of the third overlapping region GG and reducing the probability of residual conductive pattern Q existing in the third overlapping region GG.

[0352] It should be noted that in FIG23A , to facilitate distinction between the multiple first grooves K11a in the first recessed sub-region K11 and the multiple first transition grooves K14a in the first transition recessed sub-region K14, a dimension m13 of the multiple first grooves K11a in the first recessed sub-region K11 along the first direction X is set to be smaller than a dimension m1 of the multiple first transition grooves K14a in the first transition recessed sub-region K14 along the first direction X. However, the manner in which the dimension m13 of the multiple first grooves K11a in the first recessed sub-region K11 along the first direction X and the dimension m1 of the multiple first transition grooves K14a in the first transition recessed sub-region K14 along the first direction X are set in the present disclosure is not limited to this. For example, the dimension m13 of the multiple first grooves K11a in the first recessed sub-area K11 along the first direction X and the dimension m1 of the multiple first transition grooves K14a in the first transition recessed sub-area K14 along the first direction X may be the same, or the dimension m13 of the multiple first grooves K11a in the first recessed sub-area K11 along the first direction X may be greater than the dimension m1 of the multiple first transition grooves K14a in the first transition recessed sub-area K14 along the first direction X.

[0353] In some embodiments, referring again to FIG. 23A and FIG. 23B , the first recessed sub-region K11 partially extends to the first insulating layer 62. This facilitates sufficient etching of the first portion D1 of the conductive layer D at the boundary of the insulating layer 6, thereby preventing residual conductive layer D in the first recessed sub-region K11 from causing a short circuit in the connecting lead 2 and affecting the normal display of the display panel 10.

[0354] In some examples, as shown in FIG. 23B , a plurality of first grooves K11 a are provided in the first recessed sub-region K11 , and at least portions of the plurality of first grooves K11 a overlap with the first insulating layer 62 .

[0355] The plurality of first grooves K11a extend along the second direction Y and are arranged along the first direction X. At least a portion of the plurality of first grooves K11a overlaps with the insulating layer 6, meaning that the first grooves K11a extend onto the first insulating layer 62 in the insulating layer 6. The portion of the first groove extending onto the first insulating layer 62 in the insulating layer 6 is referred to herein as the insulating layer groove K11b. The insulating layer groove K11b is located on the surface of the insulating layer 6, specifically, the insulating layer groove K11b is located on the surface of the first insulating layer 62.

[0356] When the insulating layer groove K11b extends along the second direction Y and is arranged along the first direction X, the portions of the multiple first grooves away from the selected side surface all extend to the first insulating layer 62. That is, during the etching process, the insulating layer groove K11b will cause certain damage to the surface of the first insulating layer. The sizes of the multiple first grooves along the second direction Y are different, that is, the end surfaces of the multiple first grooves K11a away from the selected side surface 1cc are not flush and are crescent-shaped.

[0357] In some other examples, as shown in FIG23A , a plurality of first grooves K11 a are provided in the first recessed sub-region K11 , and at least one of the plurality of first grooves overlaps with the insulating layer.

[0358] Multiple first grooves extend along a set direction, and the set direction is the first direction X, or the angle between the set direction and the first direction X is less than 15°. The above-mentioned "at least one first groove overlaps with the insulating layer" means that there is at least one first groove away from the selected side among the multiple first grooves and is located on the first insulating layer 62. The first groove K11a that overlaps with the first insulating layer 62 is called the insulating layer groove K11b.

[0359] As shown in FIG23A , the total dimension m14 of the multiple insulating layer grooves K11b along the second direction Y (i.e., the dimension of the portion of the first recessed sub-region K11 extending into the insulating layer 6) can be adjusted by adjusting the number of insulating layer grooves K11b. Therefore, when forming the first recessed region K11, when the laser etches to the region where the insulating layer 6 is located, the total dimension m14 of the multiple insulating layer grooves K11b along the second direction Y can be controlled by adjusting the number of insulating layer grooves K11b to prevent excessive laser damage to the first insulating layer 62.

[0360] The above-mentioned “excessive damage to the first insulating layer 62 ” refers to affecting the performance of the first insulating layer 62 , for example, the performance of the first insulating layer 62 in blocking the organic material of the encapsulation layer of the display panel 10 is reduced, which may cause the organic material of the encapsulation layer of the display panel 10 to overflow.

[0361] The aforementioned “adjusting the total size of the plurality of insulating layer grooves K11b along the second direction Y” can be achieved, for example, by adjusting the size of the insulating layer grooves K11b along the second direction Y, or by adjusting the number of the insulating layer grooves K11b.

[0362] It is understood that when the setting direction of each of the multiple insulating layer grooves K11b is the same, the multiple insulating layer grooves K11b are parallel to each other. For example, as shown in FIG23A , the setting direction of each of the multiple insulating layer grooves K11b is the first direction X.

[0363] Furthermore, when the setting direction of each insulating layer groove K11b in the plurality of insulating layer grooves K11b and the setting direction of each first groove K11a in the plurality of first grooves K11a are the same, the plurality of insulating layer grooves K11b and the first groove K11a are parallel to each other. For example, as shown in FIG22 , the setting direction of each insulating layer groove K11b in the plurality of insulating layer grooves K11b and the setting direction of each first groove K11a in the plurality of first grooves K11a are both the first direction X.

[0364] In some embodiments, as shown in FIG. 24 , FIG. 24 is a structural diagram of an insulating layer groove K11 b according to some embodiments of the present disclosure.

[0365] The depth h6 of each insulating layer groove K11b is 1 μm to 3 μm, and the width w6 of each insulating layer groove K11b is 1 μm to 10 μm.

[0366] For example, the depth h6 of each insulating layer groove K11 b may be 1 μm, 1.2 μm, 1.6 μm, 2 μm, 2.1 μm, 2.3 μm, 2.6 μm, 2.8 μm, and 3 μm.

[0367] The depth h6 of each insulating layer groove K11b can be 1μm, 2μm, 3μm, 4μm, 5μm, 6μm, 7μm, 8μm, 9μm, and 10μm. It should be noted that the above-mentioned "depth of the insulating layer groove K11b" refers to the distance between the bottom end of the insulating layer groove K11b and the upper surface 6a of the insulating layer 6 (the upper surface 6a of the insulating layer 6 refers to the side of the insulating layer 6 away from the substrate 1). Figure 24 illustrates an example in which the depth h6 of multiple insulating layer grooves K11b is the same. However, the setting method of the depth h6 of multiple insulating layer grooves K11b in the present disclosure is not limited to this. For example, at least two insulating layer grooves K11b among the multiple insulating layer grooves K11b have different depths h6.

[0368] The aforementioned "width of the insulating layer groove K11b" refers to the maximum dimension of the insulating layer groove K11b along the second direction Y. FIG. 24 illustrates an example in which the width w6 of the plurality of insulating layer grooves K11b is the same. However, the configuration of the width w6 of the plurality of insulating layer grooves K11b in the present disclosure is not limited thereto. For example, at least two of the plurality of insulating layer grooves K11b may have different widths w6.

[0369] Figures 21A, 21B and 24 respectively illustrate the examples of the multiple first transition grooves K14a set in the first transition recessed sub-area K14 contacting each other but not overlapping, the multiple second transition grooves K15a set in the second transition recessed sub-area K15 contacting each other but not overlapping, and the multiple insulation layer grooves K11b set in the first recessed sub-area K11 contacting each other along the second direction Y but not overlapping. However, the arrangement of the multiple first transition grooves K14a set in the first transition recessed sub-area K14, the multiple second transition grooves K15a set in the second transition recessed sub-area K15 overlapping, the multiple insulation layer grooves K11b set in the first recessed sub-area K11, the multiple first grooves K11a set in the first recessed sub-area K11, and the multiple side grooves K13a set in the side recessed sub-area K13 in the present disclosure are not limited to this.

[0370] The following uses the multiple first transition grooves K14a provided within the first transition recessed sub-region K14 as an example to describe other configurations of the multiple first transition grooves K14a provided within the first transition recessed sub-region K14. The multiple second transition grooves K15a provided within the second transition recessed sub-region K15, the multiple insulating layer grooves K11b provided within the first recessed sub-region K11, the multiple first grooves K11a provided within the first recessed sub-region K11, and the multiple side surface grooves K13a provided within the side surface recessed sub-region K13 may also be configured in the same or similar manner.

[0371] In some embodiments, as shown in FIG25 , which is a cross-sectional view of the second transition recessed sub-region K15 along the section line RR' in FIG8E , when laser etching the fifth portion D5 of the conductive portion D to form a plurality of second transition grooves K15a and side grooves K13a, when a certain position of the fifth portion D5 of the conductive portion D is etched multiple times (e.g., twice) to form the second mesh-shaped recessed portion K15w, for example, the laser first etches along a first direction to form a plurality of second transition grooves K15a, and then forms a plurality of side grooves K13a along a third direction Z. The width w7 of the side grooves K13a in the second mesh-shaped recessed portion K15w is smaller than the width of the side grooves K13a in the side recessed sub-region K13, and the distance h1' between the bottom of the side grooves K13a and h1' and the selected side surface 1cc is greater than the depth h1 of the second transition grooves K15a.

[0372] In some embodiments, as shown in FIG26 , which illustrates a structure diagram of multiple first transition grooves K14a according to some embodiments of the present disclosure, if two adjacent first transition grooves K14a overlap in a fourth region HH (the region outlined by the dashed line in FIG26 ) during the sequential formation of the first transition grooves K14a, the resulting cross-sectional width w1' of each first transition groove K14a decreases, becoming smaller than the theoretical width w1. In this case, residual conductive pattern between two adjacent first transition grooves K14a due to tolerance or precision issues can be avoided, thereby preventing short circuits between two subsequently formed adjacent connecting leads 2.

[0373] In some embodiments, referring to FIG. 8D to FIG. 8G , the number of side grooves K13 a in any two recessed areas K1 along the first direction X may be the same or different, so that the multiple connecting traces formed subsequently may have different widths.

[0374] Referring to Figures 8D-8G , within the same recessed region K1, at least two of the first recessed sub-region K11, the second recessed sub-region K11, the side recessed sub-region K13, the first transition recessed sub-region K14, and the second transition recessed sub-region K15 have different numbers of grooves. For example, the number of first grooves in the first recessed sub-region K11 is different from the number of side recessed grooves in the side recessed sub-region K13, and the number of first grooves in the first recessed sub-region K11 is different from the number of first transitional grooves in the first transitional recessed sub-region K14. Furthermore, the width of the same connecting lead varies at different locations.

[0375] The above description is merely a specific embodiment of the present disclosure, but the scope of protection of the present disclosure is not limited thereto. Any changes or substitutions that a person skilled in the art can conceive within the technical scope disclosed in the present disclosure should be included within the scope of protection of the present disclosure. Therefore, the scope of protection of the present disclosure should be based on the scope of protection of the claims.

Claims

1. A display panel, comprising: A substrate comprising a first surface and a second surface disposed opposite to each other, and at least one side surface connecting the first surface and the second surface, wherein the at least one side surface is a selected side surface; A plurality of recessed areas are spaced apart along a first direction, each of the recessed areas extending from the first surface through the selected side surface to the second surface; each of the recessed areas includes a first recessed sub-area located on the first surface, a second recessed sub-area located on the second surface, and a side recessed sub-area located on the selected side surface; Each of the first recessed sub-regions and each of the second recessed sub-regions extends along a second direction; each of the side recessed sub-regions extends along a third direction; the second direction is perpendicular to the selected side surface, the first direction is perpendicular to the second direction, and the third direction is perpendicular to the first surface or the second surface; Each of the recessed regions further comprises a first transition recessed sub-region connecting the first recessed sub-region and the side recessed sub-region, and / or a second transition recessed sub-region connecting the second recessed sub-region and the side recessed sub-region; The first transition recessed sub-region includes a first reticular recessed portion, and / or the second transition recessed sub-region includes a second reticular recessed portion.

2. The display panel according to claim 1, wherein The first recessed sub-region includes a plurality of first grooves arranged in parallel, the second recessed sub-region includes a plurality of second grooves arranged in parallel, and the side recessed sub-region includes a plurality of side grooves arranged in parallel.

3. The display panel according to claim 2, wherein: The first groove extends to the first transition recessed sub-region, and / or the second groove extends to the second transition recessed sub-region, and / or the side groove extends to the first transition recessed sub-region and the second transition recessed sub-region; The first transition recessed sub-area includes a plurality of first transition recesses arranged in parallel, wherein an extension direction of the first transition recess forms a first angle with an extension direction of at least one of the first recess and the side recess, and the first transition recess intersects with at least one of the first recess and the side recess to form the first mesh-shaped recessed portion; and / or, The second transition recess sub-area includes a plurality of second transition grooves arranged in parallel, the extension direction of the second transition groove has a second angle with the extension direction of the second groove and at least one of the side grooves, and the second transition groove intersects with the second groove and at least one of the side grooves to form the second mesh recess.

4. The display panel according to any one of claims 1 to 3, wherein The size of the first transition recessed sub-area along the first direction is not less than the size of the side recessed sub-area along the first direction; and / or the size of the second transition recessed sub-area along the first direction is not less than the size of the side recessed sub-area along the first direction.

5. The display panel according to any one of claims 1 to 4, wherein The substrate further includes a first chamfered surface and a second chamfered surface; The first chamfered surface connects the first surface and the selected side surface, and the second chamfered surface connects the second surface and the selected side surface; The first transition recessed sub-region is at least disposed on the first chamfered surface, and the second transition recessed sub-region is at least disposed on the second chamfered surface. The display panel according to claim 5 , wherein: The first transition recessed sub-region extends to the selected side surface; and / or the first transition recessed sub-region extends to the first surface.

7. The display panel according to claim 5 or 6, wherein: The second transition recessed sub-region extends to the selected side surface, and / or the second transition recessed sub-region extends to the second surface.

8. The display panel according to any one of claims 5 to 7, wherein: The size of the orthographic projection of the first chamfered surface on the plane where the first surface is located along the second direction is greater than or equal to 10 μm and less than or equal to 50 μm; A size of an orthographic projection of the second chamfered surface on the plane where the second surface is located along the second direction is greater than or equal to 10 μm and less than or equal to 50 μm.

9. The display panel according to any one of claims 1 to 8, wherein: A size of the first recessed sub-region along the first direction is not smaller than a size of the side recessed sub-region along the first direction.

10. The display panel according to claim 9, wherein: A size of the first recessed sub-region along the first direction is the same as a size of the first transition recessed sub-region along the first direction.

11. The display panel according to any one of claims 1 to 10, wherein: A size of the recessed area along the first direction is greater than or equal to 25 μm.

12. The display panel according to any one of claims 1 to 11, wherein: The display panel further includes a plurality of first electrodes located on one side of the first surface of the substrate, and the plurality of first electrodes are arranged at intervals along a first direction; A recessed area is provided between two adjacent first electrodes; The size of the recessed area along the first direction is less than or equal to 70% of the distance between two adjacent first electrodes.

13. The display panel according to claim 3, wherein: The plurality of first transition grooves are parallel to each other; and / or, A plurality of the second transition grooves are parallel to each other.

14. The display panel according to claim 3 or 13, wherein: The depth of each of the first transition grooves is 1 μm to 3 μm; and / or the width of each of the first transition grooves is 1 μm to 10 μm; The depth of each second transition groove is 1 μm to 3 μm; and / or the width of each second transition groove is 1 μm to 10 μm.

15. The display panel according to claim 14, wherein: At least two of the plurality of first transition grooves have different depths, and / or at least two of the plurality of first transition grooves have different widths; At least two of the plurality of second transition grooves have different depths, and / or at least two of the plurality of second transition grooves have different widths.

16. The display panel according to claim 6 or 7, wherein: The side recessed sub-area is provided with a plurality of side grooves extending along the third direction, and the plurality of side grooves are arranged at intervals along the first direction; The plurality of side grooves overlap with the plurality of first transition grooves on a selected side surface of the substrate; and / or the plurality of side grooves overlap with the plurality of second transition grooves on a selected side surface of the substrate.

17. The display panel according to any one of claims 1 to 16, wherein: The display panel further includes an insulating layer located on the first surface of the substrate, wherein a boundary of the insulating layer extends along an edge of the substrate; A plurality of first grooves are provided in the first recessed sub-region, and at least a portion of at least one first groove or a plurality of first grooves among the plurality of first grooves overlaps with the insulating layer.

18. The display panel according to any one of claims 1 to 17, wherein: The display panel further includes a connecting lead disposed between two adjacent recessed areas, wherein the connecting lead extends from the first surface through the selected side surface to the second surface; The connecting lead includes a first lead segment located on the first surface, a second lead segment located on the second surface, and a side lead segment located on the selected side surface, and a first transition lead segment connecting the first lead segment and the side lead segment, and / or a second transition lead segment connecting the second lead segment and the side lead segment; Wherein, the dimension of the first transition lead segment along the first direction is not greater than the dimension of the side lead segment along the first direction; and / or the dimension of the second transition lead segment along the first direction is not greater than the dimension of the side lead segment along the first direction.

19. The display panel according to claim 18, wherein: The substrate further includes a first chamfered surface and a second chamfered surface; The first chamfered surface connects the first surface and the selected side surface, and the second chamfered surface connects the second surface and the selected side surface; The first transition lead segment is at least disposed on the first chamfered surface, and the second transition lead segment is at least disposed on the second chamfered surface.

20. The display panel according to claim 18 or 19, wherein: The size of the connecting lead along the first direction is greater than or equal to 60 μm.

21. The display panel according to any one of claims 17 to 20, wherein: The display panel further includes a protective layer, which fills the plurality of recessed areas and covers a surface of a side of the plurality of connecting leads away from the substrate.

22. A display device comprising: The display panel according to any one of claims 1 to 21, wherein the display panel comprises a plurality of connecting leads, wherein one connecting lead is provided between each two adjacent recessed areas; A circuit board is electrically connected to the plurality of connecting leads.

23. A spliced ​​display device, comprising: A plurality of display panels according to any one of claims 1 to 21, wherein the plurality of display panels are spliced ​​together; each of the display panels comprises a plurality of connecting leads, and one connecting lead is provided between each two adjacent recessed areas; At least one circuit board, each of the circuit boards is electrically connected to the plurality of connecting leads of at least one display panel.

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