Light-emitting device and preparation method therefor, and laser projection apparatus

Abstract

A light-emitting device (1000) and a preparation method therefor, and a laser projection apparatus (10). The light-emitting device (1000) comprises a substrate (1001), a light-emitting assembly (2001), and a second accommodating structure (305). The substrate (1001) comprises a first connection portion (301) and at least one electrical connection structure (303). The light-emitting assembly (2001) is fixed on one side of the substrate (1001) and comprises a housing (202) and a laser chip (2030). The housing (202) comprises a first accommodating structure (2021), a cover plate (2022), a second connection portion (302), and at least one conductive structure (303). The second connection portion (302) is fixed and electrically connected to the first connection portion (301) by means of a first connection material; and the second accommodating structure (305) is arranged between the first connection portion (301) and the second connection portion (302), and the second accommodating structure (305) is configured to accommodate the first connection material between the first connection portion (301) and the second connection portion (302).

Description

Light-emitting device and preparation method thereof, and laser projection equipment

[0001] This application claims priority to Chinese patent application No. 202410089831.4 filed on January 22, 2024; and priority to Chinese patent application No. 202410162521.0 filed on February 5, 2024, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present disclosure relates to the field of projection display technology, and in particular to a light-emitting device and a preparation method thereof, and laser projection equipment. Background Art

[0003] With the rapid development of projection display technology, it has become the next generation of new display technology. Furthermore, the light-emitting device is a core component in projection display technology. The light-emitting device includes a laser chip and a substrate. The laser chip is mounted on the substrate and emits a laser beam.

[0004] Summary of the Invention

[0005] In one aspect, a light-emitting device is provided. The light-emitting device includes a substrate, a light-emitting component, and a second housing structure. The substrate includes a first connecting portion and at least one electrical connecting structure. The at least one electrical connecting structure is spaced apart from and located around the first connecting portion. The light-emitting component is fixed to one side of the substrate and includes a housing and a laser chip. The housing includes a first housing structure, a cover plate, a second connecting portion, and at least one conductive structure. The first housing structure is disposed on the substrate, with the side of the first housing structure facing away from the substrate being recessed to form a cavity. The cover plate is disposed over the first housing structure to enclose the cavity and form a sealed space. The second connecting portion is disposed on the side of the first housing structure facing the substrate and is fixedly connected to and electrically connected to the first connecting portion via a first connecting material. The at least one conductive structure is disposed on the side of the first housing structure facing the substrate and is connected to and electrically connected to the at least one electrical connecting structure via a second connecting material. The at least one conductive structure is spaced apart from the second connecting portion. The laser chip is disposed within the first housing structure. The second accommodating structure is provided between the first connecting portion and the second connecting portion, and the second accommodating structure is configured to accommodate the first connecting material between the first connecting portion and the second connecting portion.

[0006] In another aspect, a laser projection device is provided. The laser projection device includes a light source assembly, an optical modulation assembly, and a lens. The light source assembly is configured to emit an illumination beam; the light source assembly includes the light-emitting device; the optical modulation assembly is configured to modulate the illumination beam provided by the light source assembly to obtain a projection beam; and the lens is configured to image the projection beam.

[0007] On the other hand, a method for preparing a light-emitting device is provided. The light-emitting device includes a substrate, a light-emitting component, and the light-emitting component includes a laser chip, a first accommodating structure, a cover plate, and a plurality of first sealing parts. The method includes: providing the laser chip, the first accommodating structure, the cover plate, and the plurality of first sealing parts; arranging the laser chip in the first accommodating structure; arranging the plurality of first sealing parts on the side of the cover plate facing the first accommodating structure; arranging adjacent two first sealing parts of the plurality of first sealing parts at intervals; connecting the first accommodating structure and the cover plate through the plurality of first sealing parts, so that any two adjacent first sealing parts contact each other to connect the first accommodating structure and the cover plate, so as to close the gap at the connection between the first accommodating structure and the cover plate to form the light-emitting component; and electrically connecting the light-emitting component to the substrate.

[0008] In another aspect, a light-emitting device is provided, wherein the light-emitting device is prepared by the method.

[0009] In yet another aspect, a laser projection device is provided. The laser projection device includes a light source assembly, an optical modulation assembly, and a lens. The light source assembly is configured to emit an illumination beam; the light source assembly includes a light-emitting device prepared by the method; the optical modulation assembly is configured to modulate the illumination beam provided by the light source assembly to obtain a projection beam; and the lens is configured to image the projection beam.

[0010] In the above scheme, the light-emitting device provided in some embodiments of the present disclosure seals the first accommodating structure and the cover plate through multiple first sealing parts separated from each other, thereby achieving the purpose of sealing the laser chip in the tube shell and isolating the laser chip from the outside world. In this way, the overflow of the first sealing part can be reduced, thereby avoiding or reducing holes and reducing the impact on the laser chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] FIG1 is a structural diagram of a laser projection device according to some embodiments;

[0012] FIG2 is a light path diagram of a light source assembly, an optical modulation assembly, and a lens in a laser projection device according to some embodiments;

[0013] FIG3 is a schematic diagram showing a laser projection device projecting an image according to some embodiments;

[0014] FIG4 is a diagram illustrating an arrangement of tiny reflective mirrors in a digital micromirror device according to some embodiments;

[0015] FIG5 is a diagram showing the position of a tiny reflective mirror in the digital micromirror device of FIG4;

[0016] FIG6 is a schematic diagram illustrating the operation of a micro reflective lens according to some embodiments;

[0017] FIG7 is a structural diagram of a light emitting device in the related art;

[0018] FIG8 is another structural diagram of a light emitting device in the related art;

[0019] FIG9 is a structural diagram of a light emitting device according to some embodiments;

[0020] FIG10 is another structural diagram of a light emitting device according to some embodiments;

[0021] FIG11 is another structural diagram of a light emitting device according to some embodiments;

[0022] FIG12 is a structural diagram of a cover plate and a plurality of first sealing portions according to some embodiments;

[0023] FIG13 is another structural diagram of a cover plate and a plurality of first sealing portions according to some embodiments;

[0024] FIG14 is another structural diagram of a cover plate and a plurality of first sealing portions according to some embodiments;

[0025] FIG15A is a structural diagram of a first accommodating structure according to some embodiments;

[0026] FIG15B is a structural diagram of a plurality of first accommodating structures according to some embodiments;

[0027] FIG16 is an exploded view of a light emitting assembly according to some embodiments;

[0028] FIG17 is another structural diagram of a light emitting device according to some embodiments;

[0029] FIG18 is a bottom view of a light emitting assembly according to some embodiments;

[0030] FIG19 is a top view of a substrate according to some embodiments;

[0031] FIG20 is another bottom view of a light emitting assembly according to some embodiments;

[0032] FIG21 is another top view of a substrate according to some embodiments;

[0033] FIG22 is a side view of a first groove according to some embodiments;

[0034] FIG23 is another bottom view of a light emitting assembly according to some embodiments;

[0035] FIG24 is another top view of a substrate according to some embodiments;

[0036] FIG25 is another bottom view of a light emitting assembly according to some embodiments;

[0037] FIG26 is another structural diagram of a light emitting device according to some embodiments;

[0038] FIG27 is another top view of a substrate according to some embodiments;

[0039] FIG28 is another top view of a substrate according to some embodiments;

[0040] FIG29 is another top view of a substrate according to some embodiments;

[0041] FIG30 is another top view of a substrate according to some embodiments;

[0042] FIG31 is another structural diagram of a light emitting device according to some embodiments;

[0043] FIG32 is a schematic diagram of a connection material according to some embodiments;

[0044] FIG33A is a flow chart of a method for preparing a light emitting device according to some embodiments;

[0045] FIG33B is another flow chart of a method for preparing a laser projection device according to some embodiments;

[0046] FIG33C is another flow chart of a method for manufacturing a laser projection device according to some embodiments;

[0047] FIG34 is another flow chart of a method for manufacturing a laser projection device according to some embodiments;

[0048] FIG35 is another flow chart of a method for manufacturing a laser projection device according to some embodiments;

[0049] FIG36 is a structural diagram of a cover plate and a second sealing portion according to some embodiments;

[0050] FIG37 is a structural diagram of a cover plate, a plurality of first sealing portions, and a second sealing portion according to some embodiments;

[0051] FIG38 is a structural diagram of a light emitting assembly according to some embodiments;

[0052] FIG39 is another structural diagram of a light emitting device according to some embodiments;

[0053] FIG. 40 is a partial structural diagram of a cover plate according to some embodiments. DETAILED DESCRIPTION

[0054] The following will be combined with the accompanying drawings to clearly and completely describe some embodiments of the present disclosure. Obviously, the embodiments described are only some embodiments of the present disclosure, not all embodiments. Based on the embodiments provided by the present disclosure, all other embodiments obtained by ordinary technicians in this field are within the scope of protection of the present disclosure.

[0055] Unless the context requires otherwise, throughout the specification and claims, the term "comprise" and its other forms, such as the third person singular form "comprises" and the present participle form "comprising", are to be interpreted as open and inclusive, that is, "including, but not limited to". In the description of the specification, the terms "one embodiment", "some embodiments", "exemplary embodiments", "example", "specific example" or "some examples" are intended to indicate that the particular features, structures, materials or characteristics associated with the embodiment or example are included in at least one embodiment or example of the present disclosure. The schematic representation of the above terms does not necessarily refer to the same embodiment or example. In addition, the particular features, structures, materials or characteristics may be included in any one or more embodiments or examples in any appropriate manner.

[0056] In the following, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of the technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of some embodiments of the present disclosure, unless otherwise specified, "plurality" means two or more.

[0057] When describing some embodiments, the word "connected" and its derivatives may be used. The term "connected" should be understood broadly. For example, "connected" can mean fixed, removable, or integrated; it can be directly connected or indirectly connected through an intermediary. The embodiments disclosed herein are not necessarily limited to the contents of this document.

[0058] “At least one of A, B and C” has the same meaning as “at least one of A, B or C” and both include the following combinations of A, B and C: A only, B only, C only, the combination of A and B, the combination of A and C, the combination of B and C, and the combination of A, B and C.

[0059] As used herein, the term "if" is optionally interpreted to mean "when" or "upon" or "in response to determining" or "in response to detecting," depending on the context. Similarly, the phrases "if it is determined that" or "if [stated condition or event] is detected" are optionally interpreted to mean "upon determining" or "in response to determining" or "upon detecting [stated condition or event]" or "in response to detecting [stated condition or event]," depending on the context.

[0060] The use of "adapted to" or "configured to" herein is intended to be open and inclusive language that does not exclude devices adapted or configured to perform additional tasks or steps.

[0061] Additionally, the use of “based on” is meant to be open and inclusive, as a process, step, calculation, or other action “based on” one or more stated conditions or values ​​may, in practice, be based on additional conditions or values ​​beyond those stated.

[0062] As used herein, "about," "substantially," or "approximately" includes the stated value and an average value that is within an acceptable range of deviation from the particular value as determined by one of ordinary skill in the art taking into account the measurements in question and the errors associated with the measurement of the particular quantity (i.e., the limitations of the measurement system).

[0063] As used herein, "parallel," "perpendicular," and "equal" include the stated conditions and conditions approximating the stated conditions within an acceptable range of deviation as determined by one of ordinary skill in the art taking into account the measurement in question and the errors associated with the measurement of the particular quantity (i.e., the limitations of the measurement system).

[0064] FIG1 is a structural diagram of a laser projection device according to some embodiments.

[0065] Some embodiments of the present disclosure provide a laser projection device 10. As shown in FIG1 , the laser projection device 10 includes a light source assembly 500, an optical modulation assembly 600, and a lens 700. The light source assembly 500 is configured to provide an illumination beam. The optical modulation assembly 600 is configured to modulate the illumination beam provided by the light source assembly 500 using an image signal to obtain a projection beam. The lens 700 is configured to project the projection beam onto a screen or wall to form an image.

[0066] The light source assembly 500, optical modulation assembly 600, and lens 700 are sequentially connected along the direction of light beam propagation and each is enclosed by a corresponding housing. The housings of the light source assembly 500, optical modulation assembly 600, and lens 700 support each optical component and ensure that each optical component meets the predetermined sealing or airtight requirements.

[0067] As shown in Figure 1, the first end of the optical modulation component 600 is connected to the light source component 500, and the light source component 500 and the optical modulation component 600 are arranged along the exit direction of the illumination light beam of the laser projection device 10 (refer to the M direction shown in Figure 1). The second end of the optical modulation component 600 is connected to the lens 700, and the optical modulation component 600 and the lens 700 are arranged along the exit direction of the projection light beam of the laser projection device 10 (refer to the N direction shown in Figure 1). The M direction is roughly perpendicular to the N direction. On the one hand, this connection structure can adapt to the optical path characteristics of the reflective light valve in the optical modulation component 600. On the other hand, it is also beneficial to shorten the length of the optical path in one dimension, which is beneficial to the structural arrangement of the laser projection device 10.

[0068] For example, when the light source assembly 500 , the optical modulation assembly 600 and the lens 700 are arranged in one dimensional direction (eg, the M direction), the length of the light path in this dimensional direction will be very long, which is not conducive to the structural arrangement of the laser projection device 10 .

[0069] In some embodiments, the light source assembly 500 can provide three primary colors of light in a time-sequential manner (other colors of light can also be added on the basis of the three primary colors of light). Due to the persistence of vision of the human eye, the human eye sees white light formed by the mixture of the three primary colors of light. Alternatively, the light source assembly 500 can also output the three primary colors of light simultaneously to continuously emit white light. The light source assembly 500 may include a light-emitting device that can emit a laser beam of at least one color, such as a red laser beam, a blue laser beam, or a green laser beam.

[0070] Figure 2 is a light path diagram of a light source assembly, an optical modulation assembly, and a lens in a laser projection device according to some embodiments. Figure 3 is a principle diagram of projection imaging by a laser projection device according to some embodiments.

[0071] The illumination beam emitted by the light source assembly 500 enters the optical modulation assembly 600. As shown in Figures 2 and 3, the optical modulation assembly 600 includes an illumination lens assembly 501 and a light modulation device (or light valve) 502. The illumination lens assembly 501 is configured to receive the illumination beam provided by the light source assembly 500 and transmit the illumination beam to the light modulation device 502 at a set angle and direction. The light modulation device 502 is configured to modulate the illumination beam to obtain a projection beam and reflect the projection beam into the lens 700.

[0072] In some embodiments, as shown in Figures 2 and 3, the lighting lens assembly 501 includes a light homogenizing component 510, a lens assembly 520, and a prism assembly 550. The light homogenizing component 510 is configured to receive the illumination beam provided by the light source assembly 500 and homogenize the illumination beam. The lens assembly 520 is configured to converge the illumination beam emitted from the light homogenizing component 510 to the prism assembly 550. The prism assembly 550 is configured to reflect the illumination beam to the light modulation device 502.

[0073] In some embodiments, as shown in Figures 2 and 3, the light homogenizing component 510 includes a light pipe 5101. The light outlet of the light pipe 5101 can be rectangular, thereby shaping the light spot. This allows the light spot shape of the illumination beam emitted from the light pipe 5101 to match the rectangular light-receiving surface of the optical modulator 502. Alternatively, the light homogenizing component 510 can include a fly-eye lens. This fly-eye lens can homogenize the incident illumination beam and shape it to output a rectangular light spot.

[0074] 2 and 3 , the illumination lens assembly 501 further includes a reflector 530 . The reflector 530 is located on the light-emitting side of the lens assembly 520 and is configured to reflect the illumination light beam emitted from the lens assembly 520 to the prism assembly 550 .

[0075] In some embodiments, as shown in FIG. 3 , the light modulation device 502 includes a digital micromirror device (DMD) 540 .

[0076] In the optical modulation assembly 600, the DMD 540 is a core component, which is configured to use the image signal to modulate the illumination beam provided by the light source assembly 500. In other words, the DMD 540 controls the illumination beam to display different brightness and grayscale for different pixels of the image to be projected, thereby ultimately forming an optical image.

[0077] Figure 4 is a diagram illustrating the arrangement of micro-reflective mirrors in a digital micro-mirror device according to some embodiments. Figure 5 is a diagram illustrating the position of a micro-reflective mirror in the digital micro-mirror device of Figure 4 during its swing. Figure 6 is a schematic diagram illustrating the operation of a micro-reflective mirror according to some embodiments.

[0078] The DMD 540 is used in a digital light processing (DLP) projection architecture. As shown in Figures 2 and 3, the optical modulation component 600 utilizes the DLP projection architecture. As shown in Figure 4, the DMD 540 includes thousands of individually driven, rotating micro-mirrors 2401. These micro-mirrors 2401 are arranged in an array, with each micro-mirror 2401 (e.g., each micro-mirror 2401) corresponding to a pixel in the projected image. In the DLP projection architecture, each micro-mirror 2401 acts as a digital switch, capable of swinging within a range of ±12° or ±17° under the action of an applied electric field, allowing the reflected light to pass through the lens 700 along the optical axis and form an image on the screen, forming a bright pixel.

[0079] For example, as shown in FIG5 , for a micro-reflector 2401 with a deflection angle of ±12°, the state at +12° is the on state, and the state at -12° is the off state. For deflection angles between -12° and +12°, the actual operating states of the micro-reflector 2401 are only the on state and the off state. As shown in FIG6 , the light reflected by the micro-reflector 2401 at a negative deflection angle is called OFF light, which is invalid light. Invalid light is generally reflected by the housing or light absorption portion of the optical modulation component 600 and absorbed. The light reflected by the micro-reflector 2401 at a positive deflection angle is called ON light. ON light is the effective light beam received by the micro-reflector 2401 on the surface of the DMD 540 and incident on the lens 700 through the positive deflection angle for projection imaging. During the display period of a frame of image, some or all of the tiny reflective mirrors 2401 will switch between the on state and the off state once, thereby realizing the grayscale of each pixel in a frame of image according to the time that the tiny reflective mirrors 2401 remain in the on state and the off state respectively.

[0080] The light homogenizing component 510 , the lens group 520 and the reflector 530 at the front end of the DMD 540 form an illumination light path. The illumination light beam emitted by the light source assembly 500 passes through the illumination light path to form a beam size and incident angle that meets the requirements of the DMD 540 .

[0081] As shown in FIG2 , the lens 700 includes a plurality of lens assemblies, which are generally divided into three groups, namely a front group, a middle group, and a rear group, or a two-group group, namely a front group and a rear group. The front group is the lens group close to the light-emitting side of the laser projection device 10 (such as the side of the lens 700 in FIG2 away from the optical modulation component 600 in the direction N), and the rear group is the lens group close to the light-emitting side of the optical modulation component 600 (such as the side of the lens 700 in FIG2 close to the optical modulation component 600 in the opposite direction of the direction N). According to the above-mentioned various lens combinations, the lens 700 can be a telephoto lens, a zoom lens, a fixed-focus adjustable lens, or a fixed-focus lens. It should be noted that the DMD 540 is located at the rear focal plane of the lens 700.

[0082] The following describes light-emitting devices in some embodiments of the present disclosure.

[0083] As the miniaturization trend of light-emitting devices continues to accelerate, product size continues to decrease. This has led to increased sealing challenges. Current welding methods struggle to achieve high airtightness and are subject to issues such as solder overflow and glass stress. Glass stress refers to the rapid heating of the weld area by the high-energy laser beam during the welding process, leading to localized thermal expansion. This, combined with the poor thermal conductivity of glass, can cause significant temperature differences inside and outside the weld area, potentially leading to localized thermal stress.

[0084] Figure 7 is a structural diagram of a light emitting device in the related art. Figure 8 is another structural diagram of a light emitting device in the related art.

[0085] Generally, as shown in Figures 7 and 8, a light-emitting device 1000 includes a substrate 1001 and at least one light-emitting assembly 2001. The light-emitting assembly 2001 includes a collimating portion 201 (e.g., a collimating lens), a housing 2020, a laser chip 2030, and a deflection component 204 (e.g., a reflective prism). The laser chip 2030 and the deflection component 204 are respectively disposed within the housing 2020. The housing 2020 includes a first housing structure 2021 and a cover plate 2022. The cover plate 2022 and the first housing structure 2021 are interconnected to form a sealed space. This sealed space is configured to accommodate the laser chip 2030 and the deflection component 204.

[0086] As shown in Figures 7 and 8, at least one light-emitting assembly 2001 includes multiple light-emitting assemblies 2001. The multiple light-emitting assemblies 2001 are evenly spaced along the length of the substrate 1001. The laser chip 2030 and the deflection component 204 are fixed to the tube shell 2020 using a nano-metal slurry through a low-temperature sintering process. After sintering, the thermal conductivity and mechanical reliability of the laser chip 2030 at high temperatures are significantly improved. The deflection component 204 is configured to deflect the light beam emitted by the laser chip 2030 by 90°, so that the light beam is emitted in a direction perpendicular to the substrate 1001. The reflected light beam passes through the cover plate 2022 and is ultimately collimated by the collimator 201 before being emitted.

[0087] The laser chip 2030 is an active device and needs to be packaged in a dust-free, dry, and highly airtight space to prevent water vapor and oxygen from entering the space, thereby ensuring the long-term operation reliability of the light-emitting device 1000. Gold-tin alloy solder is a commonly used solder for airtight packaging of the tube shell 2020. The gold-tin alloy has good strength and wettability. The wettability can refer to the ability of the gold-tin alloy to form a uniform and dense wetting layer on the surface of a material when the gold-tin alloy contacts the surface of the material. This wetting layer can quickly expand and evenly cover the surface of the material, filling tiny pores and depressions to form a stable contact interface.

[0088] As shown in Figure 8, the light emitting component 2001 further includes a soldering piece 205. The soldering piece 205 can be prepared in advance from a gold-tin alloy solder. The thickness of the soldering piece 205 can be adjusted according to demand, and the thickness of the soldering piece 205 is substantially uniform.

[0089] Typically, in the process of pre-preparing the soldering pad 205 with a gold-tin alloy solder to produce a eutectic alloy to achieve sealing, it is required to plate the soldering surface (e.g., at least a portion of the contact surface between the cover plate 2022 and the first accommodating structure 2021) with gold. When the temperature rises above the melting point of the solder, the solder melts and fills the gap between the cover plate 2022 and the first accommodating structure 2021, ultimately achieving airtightness. The soldering pad 205 is usually pre-fabricated on the cover plate 2022. During the soldering process, after the soldering pad 205 contacts the first accommodating structure 2021, the soldering pad 205 is heated to complete the soldering. Because when the soldering pad 205 melts and a certain amount of pressure is applied, the molten solder can easily overflow the sealing area (e.g., the contact area between the cover plate 2022 and the first accommodating structure 2021). As a result, insufficient solder can easily form solder voids. A solder void refers to a hole or gap formed when the weld seam is not completely filled during the soldering process. Furthermore, the overflow of the solder may also cause the solder to overflow into the sealed space, thereby affecting the laser chip 2030 .

[0090] To address the aforementioned issues, some embodiments of the present disclosure provide a light-emitting device 2000. The light-emitting device 2000 includes multiple first sealing portions. Adjacent first sealing portions contact each other by changing their physical form, thereby sealing the first housing structure and the cover plate, thereby enhancing the airtightness of the weld and preventing solder from overflowing and affecting the laser chip.

[0091] FIG9 is a structural diagram of a light-emitting device according to some embodiments. As shown in FIG9 , the light-emitting device 2000 includes a substrate 100 and a light-emitting component 200. The substrate 100 includes an electrical connection structure. The light-emitting component 200 is fixed to one side of the substrate 100. The substrate 100 is configured to support and fix the light-emitting component 200, and to be electrically connected to the light-emitting component 200 to provide a specific electrical signal to the light-emitting component 200, thereby achieving light emission of the light-emitting component 200. The light-emitting component 200 includes a tube shell 202, a laser chip, and a conductive structure. The laser chip is disposed in the tube shell 202, and the conductive structure is disposed on the side of the tube shell 202 facing the substrate 100 and is connected to the electrical connection structure. In this way, the light-emitting component 200 and the substrate 100 can be electrically connected via the conductive structure and the electrical connection structure.

[0092] As shown in Figure 9, the tube shell 202 includes a first accommodating structure 2021, a cover plate 2022, and a plurality of first sealing portions 2023. The first accommodating structure 2021 is disposed on the substrate 100. The side of the first accommodating structure 2021 away from the substrate 100 is recessed to form a cavity. The cover plate 2022 is disposed over the first accommodating structure 2021 to enclose the cavity and form a sealed space. The plurality of first sealing portions 2023 are disposed between the first accommodating structure 2021 and the cover plate 2022. The plurality of first sealing portions 2023 are configured to connect the first accommodating structure 2021 and the cover plate 2022 to seal the gap at the connection between the first accommodating structure 2021 and the cover plate 2022.

[0093] It should be noted that before the cover plate 2022 is welded to the first accommodating structure 2021, the multiple first sealing portions 2023 are separated from each other and are spaced apart on the side of the cover plate 2022 facing the first accommodating structure 2021. When the cover plate 2022 is welded to the first accommodating structure 2021, adjacent first sealing portions 2023 come into contact with each other based on changes in their physical form, thereby sealing the gap at the connection between the first accommodating structure 2021 and the cover plate 2022. The physical form may include solid, liquid, etc.

[0094] For example, when the cover plate 2022 is welded to the first accommodating structure 2021 , the two adjacent first sealing portions 2023 melt due to heating, changing from solid to liquid, so that the two adjacent first sealing portions 2023 contact each other to seal the gap at the connection between the first accommodating structure 2021 and the cover plate 2022 .

[0095] In some embodiments of the present disclosure, multiple first sealing portions 2023 seal the first housing structure 2021 and the cover plate 2022, isolating the laser chip housed within the tube housing 202 from the outside world and ensuring long-term, reliable operation of the light-emitting device 2000. The multiple first sealing portions 2023 are separated from one another, each representing an independent structure. After the multiple first sealing portions 2023 transition from a solid state to a liquid state, adjacent first sealing portions 2023 contact each other due to their changing shape, thereby sealing the gap at the junction between the first housing structure 2021 and the cover plate 2022.

[0096] Compared to the prior art method of sealing the first housing structure 2021 and the cover plate 2022 with prefabricated solder sheets 205, some embodiments of the present disclosure seal the first housing structure 2021 and the cover plate 2022 with multiple first sealing portions 2023. This prevents the formation of weld voids caused by overflow of the first sealing portions 2023, thereby improving airtightness. Furthermore, this prevents overflow of the first sealing portions 2023 from affecting the laser chip.

[0097] FIG10 is another structural diagram of a light-emitting device according to some embodiments. In some embodiments, as shown in FIG10 , the light-emitting device 2000 further includes a second sealing portion 2024. The orthographic projections of the plurality of first sealing portions 2023 on the plane where the cover plate 2022 is located at least partially overlap with the orthographic projections of the second sealing portion 2024 on the plane where the cover plate 2022 is located. FIG10 takes the example of the second sealing portion 2024 being disposed on the side of the cover plate 2022 facing the first accommodating structure 2021. The second sealing portion 2024 satisfies at least one of the following conditions: the second sealing portion 2024 is disposed on the side of the cover plate 2022 facing the first accommodating structure 2021 and is located between the cover plate 2022 and the plurality of first sealing portions 2023; or the second sealing portion 2024 is disposed on the side of the first accommodating structure 2021 facing the cover plate 2022 and is located between the first accommodating structure 2021 and the plurality of first sealing portions 2023.

[0098] In some embodiments, the second sealing portion 2024 can be a coating structure, such as a metallized layer. For example, the metallized layer includes at least one of titanium (Ti), platinum (Pt), or gold (Au), or at least one of nickel (Ni) or Au, or at least one of chromium (Cr) or gold (Au). Multiple first sealing portions 2023 can be provided on the second sealing portion 2024. The multiple first sealing portions 2023 cooperate with the second sealing portion 2024 to stably secure the cover plate 2022 to the first accommodating structure 2021 and seal the gap at the connection between the first accommodating structure 2021 and the cover plate 2022.

[0099] Figure 11 is another structural diagram of a light-emitting device according to some embodiments. In some embodiments, as shown in Figure 11, the light-emitting device 2000 further includes two sealed areas 300. The two sealed areas 300 are respectively a first sealed area and a second sealed area. The first sealed area is provided on the side of the first housing structure 2021 near the cover plate 2022; a plurality of first sealing portions 2023 are provided in the first sealed area. The second sealed area is provided corresponding to the first sealed area, provided on the side of the cover plate 2022 near the first housing structure 2021, and a plurality of first sealing portions 2023 are provided in the second sealed area. The orthographic projection of the second sealed area on the plane of the substrate 100 at least partially overlaps with the orthographic projection of the first sealed area on the plane of the substrate 100. The first and second sealed areas are respectively metallized layers. The first sealing portions 2023 are provided in the first and second sealed areas to close the gap at the connection between the first housing structure 2021 and the cover plate 2022.

[0100] In some embodiments, the first sealing region may include a second sealing portion 2024. The second sealing region may include the second sealing portion 2024. For example, if the second sealing portion 2024 is disposed on a side of the cover plate 2022 close to the first accommodating structure 2021, the second sealing region includes the second sealing portion 2024; if the second sealing portion 2024 is disposed on a side of the first accommodating structure 2021 close to the cover plate 2022, the first sealing region includes the second sealing portion 2024.

[0101] In the case where the light-emitting device 2000 also includes a first sealing area and a second sealing area, the second sealing portion 2024 satisfies at least one of the following: the orthographic projection of the second sealing portion 2024 on the surface of the cover plate 2022 close to the first accommodating structure 2021 is within the second sealing area, or the orthographic projection of the second sealing portion 2024 on the surface of the first accommodating structure 2021 close to the cover plate 2022 is located within the first sealing area.

[0102] In some embodiments, the sealed region 300 can be insulated from the circuit structures (e.g., the conductive structure and the electrical connection structure) in the light-emitting device 2000. The sealed region 300 can enhance the reliability of the connection between the first sealing portion 2023, the cover plate 2022, and the first housing structure 2021. In some embodiments, a scheme similar to that shown in FIG. 10 can be employed, with specific configurations made based on the material, surface flatness, and insulation properties of the sealed region 300. This can enhance the stability of the seal between the first housing structure 2021 and the cover plate 2022.

[0103] Figure 12 illustrates one structural diagram of a cover plate and multiple first sealing portions according to some embodiments, and Figure 13 illustrates another structural diagram of a cover plate and multiple first sealing portions according to some embodiments. In some embodiments, as shown in Figures 12 and 13 , multiple first sealing portions 2023 are disposed in the second sealing region. The first sealing portions 2023 are hemispherical, with gaps between adjacent first sealing portions 2023.

[0104] As shown in Figures 12 and 13, the first sealing portion 2023 is a hemispherical metal solder ball. The material of the first sealing portion 2023 can be a gold-tin alloy. A gap exists between two adjacent metal solder balls disposed on the cover plate 2022. Under pressure, the metal solder balls change their shape, extending toward each other and contacting each other, thereby sealing the cover plate 2022 and the first housing structure 2021. Under the pressure, the metal solder balls assume a rounded shape.

[0105] Compared with the method of welding through the welding sheet 205 in the related art, the metal solder balls contact each other by extension and thus seal the first accommodating structure 2021 and the cover plate 2022. In this way, the solder can be prevented from overflowing, thereby preventing the generation of welding voids and the overflowed solder from affecting the laser chip 203.

[0106] FIG14 is another structural diagram of a cover plate and a plurality of first sealing portions according to some embodiments. In some embodiments, as shown in FIG14 , the sealing region 300 is an annular structure. The surface area of ​​the sealing region 300 is defined as S, the spacing between the first accommodating structure 2021 and the cover plate 2022 is defined as H, the number of the plurality of hemispherical first sealing portions 2023 is defined as M, and the radius of the hemispherical first sealing portion 2023 is defined as R. Then, the surface area S of the sealing region 300, the spacing H between the first accommodating structure 2021 and the cover plate 2022, the number M of the plurality of first sealing portions 2023, and the radius R of the first sealing portion 2023 satisfy formula (1).

[0107] It is understood that the meaning of formula (1) is that the total volume of the plurality of first sealing portions 2023 is greater than or equal to the volume of the welding area. The welding area is the area defined by the sealing area 300, the first accommodating structure 2021 and the cover plate 2022.

[0108] As shown in Figure 14, the first accommodating structure 2021 and the cover plate 2022 are eutectic welded using a hemispherical first sealing portion 2023, which can reduce the unfilled area of ​​the first sealing portion 2023. The first sealing portion 2023 in a high-temperature molten state can fill the sealing area 300, thereby ensuring an airtight effect.

[0109] In some embodiments, the radius R of the first sealing portion 2023 and the distance between two adjacent first sealing portions 2023 are related to the thickness of the first sealing portion 2023 when subjected to pressure and after welding. As shown in FIG14 , the outer lengths of any sealing area 300 are defined as the first length L1 and the first width L3, and the inner lengths are defined as the second length L2 and the second width L4. The total volume of the plurality of first sealing portions 2023 is V. If the first sealing portion 2023 just fills the space corresponding to the sealing area 300 between the first accommodating structure 2021 and the cover plate 2022, then the total volume V of the plurality of first sealing portions 2023 satisfies formula (2) and formula (3). V = V1 Formula (2) V1 = S × H = (L1 × L3 - L2 × L4) × H Formula (3)

[0110] Ideally, the total volume V of the plurality of first sealing portions 2023 in some embodiments of the present disclosure is equal to the target volume V1. However, given the potential for errors in the accuracy of the total volume of the first sealing portions 2023, the total volume V of the plurality of first sealing portions 2023 may be slightly larger than the target volume V1. In some embodiments, the total volume V of the first sealing portions 2023 may exceed the target volume V1 by up to 10%. The volume V2 of any spherical first sealing portion 2023 satisfies formula (4).

[0111] The volume V3 of any hemispherical first sealing portion 2023 is half the volume of the spherical first sealing portion 2023 , as satisfying formula (5).

[0112] Therefore, when the plurality of first sealing portions 2023 are respectively hemispherical, the total volume V of the plurality of first sealing portions 2023 satisfies formula (6) and formula (7). (1+10%)×S×H≥V≥S×H Formula (7)

[0113] In some embodiments, the perimeter of any one of the sealing regions 300 is defined as L, the distance between two adjacent hemispherical first sealing portions 2023 is A, and the perimeter L of the sealing region 300, the distance A between two adjacent hemispherical first sealing portions 2023, and the number M of the first sealing portions 2023 satisfy formula (8). A×M = L Formula (8)

[0114] As shown in FIG. 14, the perimeter L of the sealing region 300 is approximately the sum of a first length L1, a second length L2, a first width L3, and a second width L4 (L = L1 + L2 + L3 + L4). The distance A between two adjacent hemispherical first sealing portions 2023 is defined as the distance between the centers of the surfaces of two adjacent first sealing portions 2023 that are close to the cover plate 2022. In order to enable multiple first sealing portions 2023 to fill the sealing region 300, the perimeter L of the sealing region 300, the distance A between the centers of the surfaces of two adjacent first sealing portions 2023 that are close to the cover plate 2022, and the number M of the first sealing portions 2023 satisfy formula (8).

[0115] According to formula (6), formula (7), and formula (8), it can be found that when the distance H between the first accommodating structure 2021 and the cover plate 2022 and the size of the sealing region 300 are determined, the relationship between the number M of the first sealing portions 2023 and the radius R of the first sealing portions 2023 can be obtained. The distance H between the first accommodating structure 2021 and the cover plate 2022 may refer to the thickness of the first sealing portion 2023 after the first accommodating structure 2021 and the cover plate 2022 are closed, hereinafter referred to as the sealing thickness. The sealing thickness may also be the distance between the cover plate 2022 and the first accommodating structure 2021 in a direction perpendicular to the plane of the substrate 100.

[0116] In some embodiments, during the preparation of the first sealing portion 2023, the radius R of the first sealing portion 2023 is greater than or equal to 5 μm and less than or equal to 3 μm (5 μm < r < 300 μm). For example, the radius R of the first sealing portion 2023 is 5 μm, 100 μm, 200 μm, 250 μm, or 300 μm. The size of the radius R of the first sealing portion 2023 corresponds to different sealing thicknesses.

[0117] For the package 202 with a volume less than the first preset threshold, during the sealing process, the sealing thickness satisfies at least one of the following: greater than or equal to 20 μm, or less than or equal to 50 μm. For example, the sealing thickness is 20 μm, 25 μm, 30 μm, 40 μm, or 50 μm. Correspondingly, the radius of the hemispherical first sealing portion 2023 satisfies at least one of the following: greater than or equal to 40 μm, or less than or equal to 100 μm. For example, the radius of the hemispherical first sealing portion 2023 is 40 μm, 50 μm, 70 μm, or 100 μm.

[0118] For a tube shell 202 having a volume greater than the first preset threshold, the sealing thickness satisfies at least one of the following: greater than or equal to 50 μm, or less than or equal to 100 μm. For example, the sealing thickness is 50 μm, 60 μm, 70 μm, 90 μm, or 100 μm. This can increase the sealing strength and the contact area between the first sealing portion 2023 and the cover plate 2022 and the first accommodating structure 2021. In this case, the radius of the first sealing portion 2023 satisfies at least one of the following: greater than or equal to 120 μm and less than or equal to 180 μm. For example, the radius of the hemispherical first sealing portion 2023 is 120 μm, 140 μm, 150 μm, 170 μm, or 180 μm. The desired sealing thickness can be obtained by adjusting the pressure on the cover plate 2022 and the spacing between adjacent first sealing portions 2023. By controlling the pressure during the sealing process within the radius range of the hemispherical first sealing portion 2023 (e.g., greater than or equal to 40 μm and less than or equal to 100 μm; greater than or equal to 120 μm and less than or equal to 180 μm), ideal welding can be achieved. Thus, when the first sealing portion 2023 is made of a gold-tin alloy, the diffusion of the first sealing portion 2023 can be uniform and dense as the temperature increases.

[0119] When the radius of the hemispherical first sealing portion 2023 is greater than or equal to 5 μm and less than or equal to 40 μm, for example, the radius of the hemispherical first sealing portion 2023 is 5 μm, 15 μm, 20 μm, 35 μm, or 40 μm, the required sealing contact area is generally small and the sealing thickness is thin. In this case, it is easy to cause solder joints in the sealing area 300 to be cold or false, thereby reducing the reliability and environmental adaptability of the light-emitting device 2000. Therefore, for the single-chip package tube shell 202, the size of the tube shell 202 and the area of ​​the sealing area 300 are generally small, and the above-mentioned radius of the first sealing portion 2023 is suitable for the tube shell 202.

[0120] When the radius of the hemispherical first sealing portion 2023 is greater than or equal to 200 μm and less than or equal to 300 μm, for example, the radius of the hemispherical first sealing portion 2023 is 200 μm, 220 μm, 250 μm, 280 μm or 300 μm, the first sealing portion 2023 is prone to overflow during the sealing process, and parameters such as pressure and temperature need to be strictly controlled, which increases the difficulty of the sealing process. In this case, due to the large radius of the first sealing portion 2023, it is difficult to control the sealing thickness after sealing during the sealing process, resulting in uneven thickness of the first sealing portion 2023. In addition, due to the increase in the volume of the first sealing portion 2023, the sealing cost will also increase. Therefore, when sealing a large-sized tube shell 202 and the sealing area 300 is large, the first sealing portion 2023 can completely fill the sealing area by using the above-mentioned radius.

[0121] When the radius of the first sealing portion 2023 and the size of the tube shell 202 are determined, the desired sealing thickness can be achieved by adjusting the number of first sealing portions 2023. Generally speaking, when the size of the tube shell 202 is determined, the smaller the radius of the first sealing portion 2023, the more first sealing portions 2023 are required. In some embodiments, when the number of first sealing portions 2023 is between 100 and 300, the number of first sealing portions 2023 is small, and first sealing portions 2023 with a radius greater than the second predetermined threshold can be used for sealing.

[0122] For some small-sized tube shells 202 , when the radius of the first sealing portion 2023 is small, the number of the first sealing portions 2023 may be between 4000 and 8000.

[0123] In some embodiments, the number of the first sealing parts 2023 is in a range of 500 to 2000. Under this number, a uniform sealing thickness can be obtained by adjusting the radius of the first sealing parts 2023, and ultimately a suitable sealing effect can be obtained.

[0124] The foregoing mainly takes the hemispherical shape of the first sealing portion 2023 as an example. Of course, in some embodiments, the first sealing portion 2023 can also be in other shapes, such as a cube, a cuboid, a sphere, an ellipsoid, a tetrahedron, etc.

[0125] Taking the first sealing portion 2023 as an example, the radius of the first sealing portion 2023 is R, and the volume of any first sealing portion 2023 satisfies formula (9).

[0126] Therefore, when the plurality of first sealing portions 2023 are spherical, the total volume V of the plurality of first sealing portions 2023 can be set to satisfy formula (10) and formula (11).

[0127] The process of determining the total volume of the prefabricated plurality of first sealing portions 2023 of other shapes is similar to the process and will not be repeated here.

[0128] FIG15A is a structural diagram of a first accommodating structure according to some embodiments. FIG15B is a structural diagram of multiple first accommodating structures according to some embodiments. As shown in FIG15A and FIG15B , the first accommodating structure 2021 includes a side wall 208 and a bottom plate. The side wall 208 is arranged on the bottom plate. The side wall 208 can be formed of a ceramic material or a metal alloy material. The bottom plate is the patch area for the laser chip 203 and the steering component 204. Considering the patch accuracy and heat dissipation effect, the flatness of the bottom plate is required to be high. Therefore, the bottom plate can be made of materials with good heat dissipation, such as oxygen-free copper and diamond. The bottom plate and the side wall 208 can be sintered to form the overall structure of the first accommodating structure 2021.

[0129] As shown in Figures 15A and 15B, the first containment structure 2021 also includes at least two steps 206. The at least two steps 206 are located on either side of the sidewall 208 along the length of the first containment structure 2021. A metal film is provided on each step 206, electrically connecting the step 206 to the base plate to achieve electrical connection between the light-emitting assembly 200 and the substrate 100. The first containment structure 2021 also includes a positioning portion 207. The positioning portion 207 is located in the middle portion of the step 206 along the width of the first containment structure 2021 and can serve as an identification area. For example, a global coordinate system can be constructed using the positioning portions 207 on both sides. The rectangular portion between the at least two steps 206 serves as a circuit isolation area, ensuring that the electrical connections between the at least two steps 206 and the base plate are independent of each other. An identification area can be added to one side of the sidewall 208 to identify the orientation or direction of the sidewall 208 when it is installed on the substrate 100.

[0130] The laser chip 203 can be welded to the heat sink through the eutectic process. The main material of the heat sink can be aluminum nitride (ALN), silicon carbide (SiC), etc. The waveguide size of the laser chip 203 in the direction of the fast axis is small, so that the beam quality of the output light beam is close to the diffraction limit and a large divergence angle will be generated. Depending on the size of the waveguide layer in the direction of the fast axis of the laser, the divergence angle of the light beam can be between 40° and 60°. The divergence angle of the laser chip 203 in the direction of the slow axis can be between 6° and 15°, and the beam quality is poor. The size of the active area is generally between 100μm and 500μm, and the direction of the fast axis is perpendicular to the direction of the slow axis.

[0131] The deflection component 204 deflects the light beam emitted by the laser chip 203 by 90°. The deflection component 204 can be made of materials such as borosilicate glass, quartz, and silicon. An antireflection coating can be applied to the surface of the deflection component 204 to improve reflectivity. Because the laser chip 203 has a large divergence angle along its fast axis, the deflection component 204 can only deflect the majority of the light beam emitted by the laser chip 203. A small portion of the light beam does not form effective light, but instead exits from the side of the deflection component 204 as a stray beam.

[0132] FIG16 is an exploded view of a light-emitting assembly according to some embodiments. In some embodiments, as shown in FIG16 , the light-emitting assembly 200 further includes at least one collimating portion 201. At least one collimating portion 201 is disposed on the cover plate 2022. The collimating portion 201 is primarily configured to process the divergence angle of the light beam emitted by the laser chip 203. Therefore, the collimating portion 201 needs to be designed and adjusted based on the divergence angle of the laser chip 203 and the optical path of the light-emitting device 2000. The curvature of the collimating portion 201 can be adjusted based on the different characteristics of any light-emitting device 2000, or the curvature of the collimating portion 201 can be maintained constant to facilitate processing and reduce costs.

[0133] In some embodiments, the surface shape of the collimating portion 201 can be an aspherical surface, a free-form surface, or a Fresnel structure can be used to achieve the function of compressing the divergence angle. The Fresnel structure is similar to a Fresnel lens. It should be noted that the surface parameters of the collimating portion 201 are related to the optical path of the light beam. Therefore, in the light-emitting device 2000, the position of the laser chip 203, the position of the steering component 204, and the spacing between the cover plate 2022 and the first accommodating structure 2021 need to be set within a preset tolerance range. The number of collimating portions 201 is the same as the number of light-emitting components 200.

[0134] In some embodiments, as shown in FIG16 , at least one collimating portion 201 includes a plurality of collimating portions 201 . The collimating portion 201 can be fixed by applying glue to the four corners of any collimating portion 201 , and the glue application position needs to avoid the optically effective area. The optically effective area may refer to an area where the collimating portion 201 can effectively process and transmit light. After the light beam emitted by the laser chip 203 is reflected by the steering component 204 , the fast axis direction of the laser is parallel to the short side direction of the collimating portion 201 , and the slow axis direction of the laser is parallel to the long side direction of the collimating portion 201 . At this time, the plurality of collimating portions 201 are arranged along the length direction of the substrate 100 .

[0135] Figure 17 is another structural diagram of a light-emitting device according to some embodiments. After completing the sealing of the gap between the connection between the first accommodating structure 2021 and the cover plate 2022, the packaged light-emitting component 200 can be separated again. After the cover plate 2022 is separated from the first accommodating structure 2021 again, as shown in Figure 17, by observing the sealing area 300, it can be seen that the distribution shape of the intermetallic compounds (Intermetallic Compounds) formed at the position of the first sealing portion 2023 is circular. Since the thickness of the intermetallic compounds at the position of the first sealing portion 2023 is thicker than that of other areas, it can be clearly observed that the corresponding area of ​​the first sealing portion 2023 and the area where the solder is not filled have different colors.

[0136] It should be noted that, during the process of fixing the light-emitting component to the substrate, the connection material used to fix the light-emitting component and the substrate is likely to overflow, thereby causing a short circuit in the light-emitting component.

[0137] Figure 18 is a bottom view of a light-emitting assembly according to some embodiments. In some embodiments, as shown in Figure 18 , the light-emitting assembly 200 further includes a second connecting portion 302 and at least one conductive structure 304. The second connecting portion 302 and the at least one conductive structure 304 are respectively disposed on a side of the first housing structure 2021 facing the substrate 100. The at least one conductive structure 304 is spaced apart from the second connecting portion 302.

[0138] FIG19 is a top view of a substrate according to some embodiments. As shown in FIG19 , the substrate 100 further includes a first connection portion 301 and at least one electrical connection structure 303. The first connection portion 301 and the at least one electrical connection structure 303 are respectively disposed on a side of the substrate 100 facing the first accommodating structure 2021. The at least one electrical connection structure 303 is spaced apart from the first connection portion 303 and is located around the first connection portion 303. The position of the first connection portion 301 corresponds to the position of the second connection portion 302. The second connection portion 302 is fixedly connected to the first connection portion 301 and is electrically conductive thereto via a first connecting material. The position of the at least one conductive structure 304 corresponds to the position of the at least one electrical connection structure 303. The at least one conductive structure 304 is connected to the at least one electrical connection structure 303 and is electrically conductive thereto via a second connecting material.

[0139] In some embodiments, the orthographic projection of the second connecting portion 302 on the plane of the substrate 100 is within the orthographic projection of the first connecting portion 301 on the plane of the substrate 100. The orthographic projection of the conductive structure 304 on the plane of the substrate 100 is within the orthographic projection of the electrical connection structure 303 on the plane of the substrate 100. The first connecting portion 301 is configured to support the light-emitting component 200 and can be rectangular.

[0140] In some embodiments, substrate 100 includes a conductive layer and an insulating film. The insulating film covers a portion of the conductive layer. This leaves a portion of the conductive layer exposed, forming first connecting portion 301. Alternatively, first connecting portion 301 may be formed from multiple metal layers. Electrical connection structure 303 is provided on the insulating film of the substrate.

[0141] In some embodiments, the at least one conductive structure 304 includes a plurality of conductive structures 304. The at least one electrical connection structure 303 includes a plurality of electrical connection structures 303. The plurality of conductive structures 304 correspond to the plurality of electrical connection structures 303. The plurality of conductive structures 304 are electrically connected to the plurality of electrical connection structures 303.

[0142] In some embodiments, as shown in FIG19 , multiple electrical connection structures 303 are arranged in pairs and located on either side of the first connection portion 301. Multiple electrical connection structures 304 are arranged in pairs and located on either side of the second connection portion 302. The multiple electrical connection structures 303 are electrically connected to the multiple conductive structures 304 to electrically connect the substrate 100 to the light-emitting component 200. The first connection portion 301 and the second connection portion 302 are relatively fixed to each other by a first connecting material to achieve relative fixation between the light-emitting component 200 and the substrate 100. The conductive structures 304 and the electrical connection structures 303 are relatively fixed to each other by a second connecting material.

[0143] In some embodiments, the electrical connection structure 303 is arranged around the first connection portion 301, and correspondingly, the conductive structure 304 is also arranged around the second connection portion 302. In the process of fixing and electrically connecting the light-emitting component 200 to the substrate 100, a first connection material is generally filled between the first connection portion 301 and the second connection portion 302, and a second connection material is generally filled between the conductive structure 304 and the electrical connection structure 303, and the first connection material and the second connection material are conductive materials. In the related art, the first connection material between the first connection portion 301 and the second connection portion 302 is generally a tin-silver-copper alloy solder. The advantage of the tin-silver-copper alloy is that it has good flow and wettability under the influence of temperature. After the first connection material is processed to a molten state, the light-emitting component 200 can be fixed and electrically connected to the substrate 100 by applying pressure to the light-emitting component 200.

[0144] As shown in FIG19 , the first connecting material between the first connecting portion 301 and the second connecting portion 302 is likely to overflow from all sides after being subjected to pressure, and then be connected to the surrounding electrical connection structure 303. Since the first connecting material is a conductive material, it is very easy to cause a short circuit in the light-emitting component 200 after the first connecting material overflows.

[0145] In order to solve the above problems, some embodiments of the present disclosure provide a light emitting device 2000 .

[0146] Figure 20 is another bottom view of a light-emitting assembly according to some embodiments, and Figure 21 is another top view of a substrate according to some embodiments. As shown in Figures 20 and 21, the light-emitting device 2000 further includes a second accommodating structure 305. The second accommodating structure 305 is disposed between the first connecting portion 301 and the second connecting portion 302, and is configured to accommodate the first connecting material between the first connecting portion 301 and the second connecting portion 302.

[0147] For the sake of simplicity, Figures 20 and 21 only illustrate the second connecting portion 302, conductive structure 304, second receiving structure 305, first connecting portion 301, and electrical connection structure 303 of the light-emitting assembly 200, omitting other components, such as the laser chip 203 and the deflection member 204. By providing the second receiving structure 305, during the process of securing the light-emitting assembly 200 to the substrate 100, even if pressure is applied to the light-emitting assembly 200, the first connecting material between the first connecting portion 301 and the second connecting portion 302 can be filled into the second receiving structure 305, rather than overflowing and connecting to the electrical connection structure 303, thereby causing a short circuit in the light-emitting assembly 200. Therefore, the light-emitting assembly 200 of some embodiments of the present disclosure can avoid the problem of short circuiting of the light-emitting assembly 200 due to overflow of the first connecting material.

[0148] In some embodiments, the second accommodating structure 305 satisfies at least one of the following conditions: the second accommodating structure 305 includes a first groove 3051, which is provided on a side of the second connecting portion 302 facing the first connecting portion 301. Alternatively, the second accommodating structure 305 includes a second groove 3052, which is provided on a side of the first connecting portion 301 facing the second connecting portion 302.

[0149] In a related solution, the side of the first connection part 301 facing the second connection part 302 and the side of the second connection part 302 facing the first connection part 301 are both planes. Therefore, applying pressure to the light-emitting component 200 will cause the first connection material to overflow.

[0150] In some embodiments of the present disclosure, a second accommodating structure 305 is provided between the first connecting portion 301 and the second connecting portion 302 , which can improve at least one of the light emitting assembly 200 and the substrate 100 .

[0151] In some embodiments, as shown in Figures 20 and 21, a first groove 3051 is provided on the side of the second connection portion 302 facing the first connection portion 301 to form a second accommodating structure 305. For example, the shape of the opening of the first groove 3051 can be a rectangle of 8mm×5mm, or the opening of the first groove 3051 can also be a special structure such as a rounded rectangle. The depth of the first groove 3051 can meet at least one of the following: greater than or equal to 0.3μm, or less than or equal to 0.5μm. It should be noted that this numerical value is only used as an example or solution. The present disclosure does not limit the depth of the first groove 3051, and the size of the first groove 3051 can be changed according to actual needs.

[0152] Furthermore, the present disclosure does not limit the shape of the first groove 3051. FIG20 illustrates the shape of the first groove 3051 as a round rectangle. FIG22 is a side view of a first groove according to some embodiments. As shown in FIG22 , FIG31 takes the bottom of the first groove 3051 as an example of an arc surface. In this way, overflow of the first connecting material can be avoided. The bottom of the first groove 3051 can also be a flat surface or other structure. In addition, the opening shape of the first groove 3051 can also be a rectangle, a circle, or any regular or irregular shape. The present disclosure does not limit the opening shape of the first groove 3051.

[0153] FIG23 is another bottom view of a light-emitting component according to some embodiments. Compared to FIG20 , the light-emitting component 200 in FIG23 further includes a non-conductive region 701. When a first groove 3051 is provided on the side of the second connecting portion 302 facing the first connecting portion 301, the thickness of the non-conductive region 701 can be greater than the thickness of the second connecting portion 302 in a direction perpendicular to the plane corresponding to the opening of the second connecting portion 302. For example, the difference between the thickness of the non-conductive region 701 and the thickness of the second connecting portion 302 can satisfy at least one of the following: greater than or equal to 0.3 μm, or less than or equal to 0.5 μm. Thus, a barrier structure can be formed to further prevent overflow of the first connecting material.

[0154] The above description mainly uses the example that the second accommodating structure 305 includes the first groove 3051 . Of course, in some embodiments, the second accommodating structure 305 may include the second groove 3052 .

[0155] In some embodiments, as shown in FIG21 , a second groove 3052 is provided on a side of the first connecting portion 301 facing the second connecting portion 302. The second groove 3052 functions similarly to the first groove 3051 and is not further described here. In some embodiments, the depth of the second groove 3052 can satisfy at least one of the following: greater than or equal to 30 μm, or less than or equal to 50 μm.

[0156] In some embodiments, when the second accommodating structure 305 includes a second groove 3052, the thickness of the second connecting portion 302 may also be greater than the thickness of the non-conductive region 701. For example, the difference between the thickness of the second connecting portion 302 and the thickness of the non-conductive region 701 may satisfy at least one of the following: greater than or equal to 0.1 μm, or less than or equal to 0.5 μm. Furthermore, the orthographic projection of the second connecting portion 302 on the plane of the substrate 100 is located within the orthographic projection of the opening edge of the second groove 3052 on the plane of the substrate 100. In this way, the second connecting portion 302 can be inserted into the second groove 3052, and cooperate with the second groove 3052 to further prevent overflow of the first connecting material.

[0157] The foregoing mainly uses the example that the first groove 3051 is provided on the side of the second connection part 302 facing the first connection part 301, or the second groove 3052 is provided on the side of the first connection part 301 facing the second connection part 302. Of course, in some embodiments, the second accommodating structure 305 includes the first groove 3051 and the second groove 3052 to achieve the purpose of accommodating the first connecting material and further avoid overflow of the first connecting material.

[0158] Figure 24 is another top view of a substrate according to some embodiments. In some embodiments, as shown in Figures 20 and 24 , when the second accommodating structure 305 includes a first groove 3051, the second accommodating structure 305 also includes a first protrusion 501, and the first protrusion 501 is disposed on the side of the first connecting portion 301 facing the second connecting portion 302. The orthographic projection of the first groove 3051 on the plane of the substrate 100 coincides with the orthographic projection of the first protrusion 501 on the plane of the substrate 100, and the shape of the first protrusion 501 is substantially the same as the shape of the first groove 3051. Thus, the first protrusion 501 and the first groove 3051 cooperate with each other to connect the first connecting portion 301 and the second connecting portion 302.

[0159] Figure 25 is another bottom view of a light-emitting assembly according to some embodiments. In some embodiments, as shown in Figures 21 and 25 , when the second accommodating structure 305 includes a second groove 3052, the second accommodating structure 305 also includes a second protrusion 502, and the second protrusion 502 is disposed on the side of the second connecting portion 302 facing the first connecting portion 301. The orthographic projection of the second groove 3052 on the plane of the substrate 100 coincides with the orthographic projection of the second protrusion 502 on the plane of the substrate 100, and the shape of the second protrusion 502 is substantially the same as that of the second groove 3052. Thus, the second protrusion 502 cooperates with the second groove 3052 to connect the first connecting portion 301 and the second connecting portion 302.

[0160] Figure 26 is another structural diagram of a light-emitting device according to some embodiments. In some embodiments, as shown in Figure 26, the light-emitting device 2000 further includes a first connecting surface 1201 and a second connecting surface 1202. The first connecting surface 1201 is the connecting surface between the first connecting portion 301 and the second connecting portion 302, and the second connecting surface 1202 is the connecting surface between the electrical connection structure 303 and the conductive structure 304. In a direction perpendicular to the plane of the substrate 100, the first connecting surface 1201 and the second connecting surface 1202 are at different heights.

[0161] Since the first connecting material extends or falls downward in the direction of gravity (the Z direction illustrated in FIG. 26 ) due to gravity after overflowing, in some embodiments, the first connecting surface 1201 and the second connecting surface 1202 may have different heights in a direction perpendicular to the plane of the substrate 100. The height of the first connecting surface 1201 may refer to the minimum distance between the first connecting surface 1201 and the plane of the substrate 100, and the height of the second connecting surface 1202 may refer to the minimum distance between the second connecting surface 1202 and the plane of the substrate 100.

[0162] In some examples, in a direction perpendicular to the plane of substrate 100, second connection surface 1202 can be located on a side of first connection surface 1201 away from substrate 100, so that first connection surface 1201 and second connection surface 1202 can be arranged sequentially along the direction of gravity. Thus, even if the first connection material overflows, the overflowed first connection material cannot connect to second connection surface 1202, thereby preventing a short circuit in light-emitting assembly 200.

[0163] In other examples, in a direction perpendicular to the plane of the substrate 100, the thickness of the second connection portion 302 is greater than the thickness of the first connection portion 301, and the thickness of the electrical connection structure 303 is greater than the thickness of the conductive structure 304. In this way, connection materials can be further avoided, thereby preventing short circuits in the light-emitting component 200.

[0164] To stagger the first connection surface 1201 and the second connection surface 1202, the thicknesses of the first connection portion 301, the second connection portion 302, the conductive structure 304, and the electrical connection structure 303 can be adjusted in a direction perpendicular to the plane of the substrate 100. A first thickness difference between the second connection portion 302 and the first connection portion 301 can satisfy at least one of the following: greater than or equal to 30 μm, or less than or equal to 50 μm. A second thickness difference between the electrical connection structure 303 and the conductive structure 304 can satisfy at least one of the following: greater than or equal to 30 μm, or less than or equal to 50 μm. For example, the first thickness difference and the second thickness difference can be the same. In this way, while the distance from the cover plate 2022 to the substrate 100 remains unchanged, only the relative positions of the first connecting surface 1201 and the second connecting surface 1202 in the direction perpendicular to the plane of the substrate 100 are changed, and the spacing between the first connecting part 301 and the second connecting part 302 and the spacing between the conductive structure 304 and the electrical connection structure 303 remain unchanged. Therefore, there is no need to add additional connecting materials, which reduces costs.

[0165] FIG27 is another top view of a substrate according to some embodiments. In some embodiments, as shown in FIG27 , substrate 100 includes a buffer zone 1401. At least a portion of buffer zone 1401 is disposed around first connection portion 301. Buffer zone 1401 is located between electrical connection structure 303 and first connection portion 301. Buffer zone 1401 is configured to accommodate any overflow of connection material between first connection portion 301 and second connection portion 302. In this manner, in the event of overflow of connection material, buffer zone 1401 can be used to contain the overflowed connection material. This allows the connection material to avoid electrical connection to electrical connection structure 303 after overflowing into buffer zone 1401, thereby preventing a short circuit in light-emitting assembly 200.

[0166] In some embodiments, as shown in FIG27 , the buffer zone 1401 includes at least one third groove 1402 . The third groove 1402 is formed by a recess on a side of the substrate 100 near the light-emitting assembly 200 . At least a portion of each third groove 1402 surrounds the first connecting portion 301 , and at least a portion of the third groove 1402 is located between the electrical connection structure 303 and the first connecting portion 301 . Even if connecting material overflows between the first and second connecting portions 301 and 302 , gravity will cause the material to flow directly into the third groove 1402 , preventing it from overflowing onto the electrical connection structure 303 .

[0167] Figure 27 illustrates an example in which the buffer zone 1401 includes a third groove 1402, and the third groove 1402 surrounds the first connecting portion 301. Figure 28 is another top view of a substrate according to some embodiments. In some embodiments, as shown in Figure 28, the at least one third groove 1402 includes a plurality of third grooves 1402. Any two adjacent third grooves 1402 in the plurality of third grooves 1402 are spaced apart and surround the first connecting portion 301.

[0168] Figure 29 is another top view of a substrate according to some embodiments. In some embodiments, as shown in Figure 29 , the at least one third groove 1402 may include multiple third grooves 1402, and the one or more third grooves 1402 are located in a portion of the area surrounding the first connecting portion 301. It should be noted that, on the plane where the substrate 100 is located, the smaller the area occupied by the third groove 1402, the stronger the substrate 100 is and the less susceptible it is to damage.

[0169] In some embodiments of the present disclosure, a buffer zone 1401 formed by providing at least one third groove 1402 can prevent the connection material from overflowing into the electrical connection structure 303 and causing a short circuit in the light-emitting component 200 .

[0170] Figure 30 is another top view of a substrate according to some embodiments. In some embodiments, as shown in Figure 30 , the first connecting portion 301 is further configured to absorb heat generated by the light-emitting assembly 200. On the plane of the substrate 100, a gap is provided between the electrical connection structure 303 and the first connecting portion 301, and a gap is provided between the conductive structure 304 and the second connecting portion 302. The amount of heat absorbed per unit time by the first connecting portion 301 is greater than or equal to the amount of heat generated per unit time by the light-emitting assembly 200.

[0171] In some embodiments, in addition to fixing the light-emitting component 200 to the substrate 100 through the first connecting portion 301 and the second connecting portion 302, the first connecting portion 301 and the second connecting portion 302 can also dissipate heat from the light-emitting component 200. Most of the heat generated by the light-emitting component 200 during the light-emitting process is conducted to the first connecting portion 301 through the first connecting portion 301 and the second connecting portion 302, and then the heat is dissipated to other areas (or into the air).

[0172] The present disclosure may also improve the shape of the first connecting portion 301 and the surface area of ​​the first connecting portion 301 parallel to the plane of the substrate 100, so that the first connecting portion 301 can cover the second connecting portion 302 and the first connecting portion 301 can meet the heat dissipation requirements of the light-emitting component 200. Figure 30 illustrates the first connecting portion 301 as an elliptical shape. Of course, the shape of the first connecting portion 301 can also be rectangular, circular, etc., and the present disclosure is not limited to this.

[0173] By improving the shape of the first connecting portion 301 and the surface area of ​​the first connecting portion 301 parallel to the plane of the substrate 100, the area of ​​the first connecting portion 301 can be further reduced, so that the shape of the first connecting portion 301 is reasonable, and the distance between the first connecting portion 301 and the electrical connection structure 303 is further increased, thereby achieving the purpose of preventing the connecting material from overflowing into the electrical connection structure 303.

[0174] In some embodiments, the connection material between the conductive structure 304 and the electrical connection structure 303 is different from the connection material between the first connection portion 301 and the second connection portion 302 .

[0175] In some embodiments, the thermal conductivity of the connection material between the first connection portion 301 and the second connection portion 302 is greater than the thermal conductivity of the connection material between the conductive structure 304 and the electrical connection structure 303 .

[0176] In related solutions, the connecting material between the first connecting portion 301 and the second connecting portion 302, and the connecting material between the electrical connecting structure 303 and the conductive structure 304, is generally a solder paste, and the main components of this solder paste are tin (Sn), silver (Ag), and copper (Cu). Although this solder paste has good flow and wettability under the influence of temperature, the thermal conductivity of the connecting material made from this solder paste is low, and it cannot quickly transfer the heat generated by the light-emitting component 200 to the first connecting portion 301 on the substrate 100. Moreover, the connecting material made from this solder paste requires flux to achieve a better fixing effect, which will cause gas pollution and increase costs.

[0177] Therefore, in some embodiments, the connecting material between the first connecting part 301 and the second connecting part 302 can be a high thermal conductivity material. The thermal conductivity of the high thermal conductivity material is greater than a predetermined value. The connecting material between the conductive structure 304 and the electrical connection structure 303 is still the solder paste. For example, the connecting material between the first connecting part 301 and the second connecting part 302 includes at least one of sintered copper, sintered silver and sintered gold. The thermal conductivity of the connecting materials such as sintered copper, sintered silver and sintered gold is greater than 200W / mK, respectively, while the thermal conductivity of the solder paste is less than 65W / mK. Since the solder paste has good flow and wettability under the influence of temperature, the connecting material between the conductive structure 304 and the electrical connection structure 303 is still the solder paste.

[0178] During the process of securing the light-emitting assembly 200 to the substrate 100, a specialized glue dispensing nozzle can be used to fill the space between the first connecting portion 301 and the second connecting portion 302 with a highly thermally conductive material. This not only facilitates securing the light-emitting assembly 200 to the substrate 100 but also reduces excess material. Furthermore, this improves the heat dissipation of the light-emitting device 2000 and facilitates securing the light-emitting assembly 200.

[0179] Fig. 31 is another structural diagram of a light emitting device according to some embodiments. In some embodiments, as shown in Fig. 31 , a second receiving structure 305 may be provided between the light emitting component 200 and the substrate 100 to prevent overflow of the first connection material.

[0180] Figure 32 is a schematic diagram of connection materials according to some embodiments. As shown in Figure 32, Figure 32 (A) shows the structure of the solder paste, and Figure 32 (B) shows the structure of the high thermal conductivity material. It can be seen that compared to the solder paste, the high thermal conductivity material has fewer voids and better connection quality.

[0181] The present disclosure also provides a method for preparing a light-emitting device, which can be applied to prepare the light-emitting device 2000 of any of the above embodiments. FIG33A is a flow chart of a method for preparing a light-emitting device according to some embodiments. As shown in FIG33A , the method includes steps 901 to 905.

[0182] In step 901 , a laser chip 203 , a first accommodating structure 2021 , a cover plate 2022 and a plurality of first sealing portions 2023 are provided.

[0183] In step 902 , the laser chip 203 is placed in the first housing structure 2021 .

[0184] In step 903 , a plurality of first sealing portions 2023 are disposed on a side of the cover plate 2022 facing the first accommodating structure 2021 ; two adjacent first sealing portions 2023 among the plurality of first sealing portions 2023 are disposed at intervals.

[0185] In step 904, the first accommodating structure 2021 and the cover plate 2022 are connected by multiple first sealing parts 2023, so that any two adjacent first sealing parts 2023 contact each other to connect the first accommodating structure 2021 and the cover plate 2022, so as to close the gap at the connection between the first accommodating structure 2021 and the cover plate 2022, thereby forming a light-emitting component 200.

[0186] In step 905 , the light emitting component 200 is electrically connected to the substrate 100 .

[0187] FIG33B is another flow chart of a method for preparing a laser projection device according to some embodiments. In some embodiments, as shown in FIG33B , the method further includes step 911 .

[0188] In step 911 , a second sealing portion 2024 is provided on a side of the cover plate 2022 facing the first accommodating structure 2021 .

[0189] FIG33C is another flow chart of a method for preparing a laser projection device according to some embodiments. In some embodiments, as shown in FIG33C , the method further includes step 913 .

[0190] In step 913 , the plurality of first sealing portions 2023 are connected to the second sealing portion 2024 .

[0191] FIG34 is another flow chart of a method for manufacturing a laser projection device according to some embodiments. In some embodiments, as shown in FIG34 , step 904 includes step 1001 and step 1002 .

[0192] In step 1001 , the plurality of first sealing portions 2023 are heated so that the plurality of first sealing portions 2023 are in a molten state.

[0193] In step 1002 , multiple first sealing parts 2023 are simultaneously connected to the first accommodating structure 2021 , and pressure is applied to the multiple first sealing parts 2023 so that adjacent first sealing parts 2023 contact each other to close the gap at the connection between the first accommodating structure 2021 and the cover plate 2022 .

[0194] FIG35 is another flow chart of a method for manufacturing a laser projection device according to some embodiments. In some embodiments, as shown in FIG35 , step 913 includes step 1101 and step 1102 .

[0195] In step 1101 , the number of first sealing portions 2023 , the distance between any two adjacent first sealing portions 2023 among the plurality of first sealing portions 2023 , and the radius of the first sealing portion 2023 are determined.

[0196] In step 1102 , the plurality of first sealing portions 2023 are connected to the second sealing portion 2024 according to the number of the first sealing portions 2023 , the distance between any two adjacent first sealing portions 2023 , and the radius of the first sealing portion 2023 .

[0197] The following, in conjunction with the accompanying drawings, illustrates the preparation process and operating principles of the light-emitting device 2000 provided in some embodiments of the present disclosure. It should be noted that the preparation methods in some embodiments of the present disclosure are merely illustrative, and the steps of some methods may be interchangeable. In the preparation methods of some embodiments of the present disclosure, the preparation process of all possible components of the light-emitting device 2000 may not be fully described. Where examples are not provided, it should be considered that these are omitted for the sake of brevity.

[0198] First, a laser chip 203 , a first accommodating structure 2021 , a cover plate 2022 , a plurality of first sealing portions 2023 and a second sealing portion 2024 are provided.

[0199] Figure 36 is a structural diagram of the cover plate and the second sealing portion according to some embodiments. As shown in Figure 36, a second sealing portion 2024 is then provided at the second sealing area corresponding to the side of the cover plate 2022 facing the first accommodating structure 2021. The second sealing portion 2024 can be used to connect the first sealing portion 2023. For example, a metallization layer is prepared at the second sealing area. The cover plate 2022 is used to form the tube shell 202 with the first accommodating structure 2021 to achieve sealing for the laser chip inside the tube shell 2022. The material of the cover plate 2022 can be high-strength sapphire, or it can also be quartz, glass, etc. The second sealing portion 2024 is provided around the cover plate 2022, and the remaining area of ​​the cover plate 2022 is a light-transmitting area. The second sealing portion 2024 achieves high airtightness by combining with the first sealing portion 2023.

[0200] Figure 37 illustrates the structure of a cover plate, multiple first sealing portions, and a second sealing portion according to some embodiments. Subsequently, as shown in Figure 37 , the number of first sealing portions 2023, the spacing between the multiple first sealing portions 2023, and the radius of the first sealing portions 2023 are determined based on the size of the tube shell 202. Furthermore, the multiple first sealing portions 2023 are connected to the second sealing portion 2024 based on the number of first sealing portions 2023, the spacing between the multiple first sealing portions 2023, and the radius of the first sealing portions 2023.

[0201] As shown in Figure 15A , components or structures such as a laser chip 203, a steering component 204, and a heat sink are then placed in the first housing structure 2021. The laser chip 203 is configured to emit a light beam, and the steering component 204 is configured to redirect the light beam. For example, the steering component 204 is a reflector. The heat sink is configured to conduct heat generated by the laser chip 203.

[0202] Figure 38 is a structural diagram of a light-emitting assembly according to some embodiments. As shown in Figure 38 , the prepared cover plate 2022 and first housing structure 2021 are aligned, and the first sealing portion 2023 is heated. Pressure is then applied to the cover plate 2022, causing the multiple first sealing portions 2023 to change shape under the pressure, filling the sealing area 300 and completing the seal between the cover plate 2022 and the first housing structure 2021.

[0203] Figure 39 is another structural diagram of a light-emitting device according to some embodiments. As shown in Figure 39, the light-emitting component 200 is electrically connected to the substrate 100 to complete the preparation of the light-emitting device 2000. The substrate 100 can not only be used to fix the light-emitting component 200, but also a printed circuit board (PCB) can be set inside the substrate 100 to realize the circuit interconnection function between the substrate 100 and the tube shell 202, and then the substrate 100 is electrically connected to the laser chip 203. The tube shell 202 and the substrate 100 can be fixed by reflow soldering using tin-silver-copper alloy, or the tube shell 202 and the substrate 100 can also be fixed by high-temperature pressure sintering silver paste or copper paste. The material of the substrate 100 can be metal materials such as oxygen-free copper and red copper.

[0204] Figure 40 is a partial structural diagram of a cover plate according to some embodiments. In some embodiments, as shown in Figure 40, the first sealing portion 2023 can be prefabricated on a large scale on the substrate corresponding to the cover plate 2022. The transmittance of the cover plate 2022 is increased by providing a transmissive film layer, and the cover plate 2022 is metallized and sputtered to form a second sealing portion 2024. The first sealing portion 2023 is then prefabricated on the second sealing portion 2024. After completing all the processes (i.e., after the cover plate 2022 and the first accommodating structure 2021 are connected), the cover plate 2022 is cut into shape. Metallization sputtering is a common surface coating technology that can form a metal film on the surface of the material. And it is achieved through a physical sputtering process.

[0205] In the description of the above embodiments, specific features, structures, materials or characteristics may be combined in an appropriate manner in any one or more embodiments or examples.

[0206] It should be noted that any one of the disclosed technical solutions in the present disclosure can solve one or more of the above-mentioned technical problems to a certain extent and achieve corresponding technical effects. Alternatively, multiple disclosed technical solutions can also be combined into an overall solution to solve one or more of the above-mentioned technical problems and achieve corresponding technical effects. Alternatively, some of the disclosed technical solutions are combined into an overall solution, and combined with related technologies and deterioration solutions, but the solution can compensate for the deterioration trend through the technical means of the present disclosure, thereby solving one or more of the above-mentioned technical problems to a certain extent as a whole and achieving corresponding technical effects. Alternatively, each disclosed technical solution is combined into a complete technical solution, constituting an organic and inseparable overall solution, thereby solving the technical problems as a whole and achieving corresponding technical effects.

[0207] Any technical solution disclosed in this disclosure, as well as the recombination of multiple technical solutions disclosed, can form a complete technical solution, and can solve one or more of the above-mentioned technical problems and achieve corresponding technical effects. They all belong to the content of this disclosure and are the content that is directly and unambiguously determined based on the content of this disclosure.

[0208] Those skilled in the art will understand that the scope of the present disclosure is not limited to the above specific embodiments, and that certain elements of the embodiments may be modified and replaced without departing from the spirit of the present disclosure. The scope of the present disclosure is limited by the appended claims.

Claims

1. A light-emitting device, comprising: a substrate, comprising: a first connection portion; and at least one electrical connection structure, which is disposed at an interval from the first connection portion and is located around the first connection portion; a light-emitting component, fixed to one side of the substrate, and comprising: a casing, comprising: a first accommodating structure, disposed on the substrate, and the side of the first accommodating structure away from the substrate is recessed to form a cavity; a cover plate, covering the first accommodating structure to enclose the cavity to form a sealed space; a second connection portion, disposed on the side of the first accommodating structure facing the substrate, and fixedly connected and electrically conducted with the first connection portion through a first connection material; and at least one conductive structure, disposed on the side of the first accommodating structure facing the substrate, and connected and electrically conducted with the at least one electrical connection structure through a second connection material; the at least one conductive structure is disposed at an interval from the second connection portion; and a laser chip, disposed in the first accommodating structure; and a second accommodating structure, disposed between the first connection portion and the second connection portion, and the second accommodating structure is configured to accommodate the first connection material between the first connection portion and the second connection portion.

2. The light-emitting device according to claim 1, wherein, The second accommodating structure satisfies at least one of the following: The second accommodating structure includes a first groove, and the first groove is disposed on the side of the second connection portion facing the first connection portion; or, The second accommodating structure includes a second groove, and the second groove is disposed on the side of the first connection portion facing the second connection portion.

3. The light-emitting device according to claim 2, wherein, The second accommodating structure satisfies at least one of the following: The second accommodating structure includes the first groove and a first protrusion, and the first protrusion is disposed on the side of the first connection portion facing the second connection portion. The orthographic projection of the first groove on the plane where the substrate is located coincides with the orthographic projection of the first protrusion on the plane where the substrate is located, and the shape of the first protrusion is substantially the same as the shape of the first groove; or, The second accommodating structure includes the second groove and a second protrusion, and the second protrusion is disposed on the side of the second connection portion facing the first connection portion. The orthographic projection of the second groove on the plane where the substrate is located coincides with the orthographic projection of the second protrusion on the plane where the substrate is located, and the shape of the second protrusion is substantially the same as the shape of the second groove.

4. The light-emitting device according to claim 2 or 3, further comprising: a first connection surface, which is the connection surface between the first connection portion and the second connection portion; and a second connection surface, which is the connection surface between the at least one electrical connection structure and the at least one conductive structure; wherein, in the direction perpendicular to the plane where the substrate is located, the heights of the first connection surface and the second connection surface are different.

5. The light-emitting device according to claim 4, wherein, In the direction perpendicular to the plane where the substrate is located, the thickness of the second connection portion is greater than the thickness of the first connection portion, and the thickness of any one of the at least one electrical connection structures is greater than the thickness of any one of the at least one conductive structures.

6. The light-emitting device according to claim 4 or 5, wherein, The substrate further includes a buffer; at least part of the buffer is disposed around the first connection portion, and the buffer is located between the at least one electrical connection structure and the at least one first connection portion; the buffer is configured to accommodate the first connection material that overflows between the first connection portion and the second connection portion.

7. The light emitting device according to claim 6, wherein, The buffer includes a third groove, and the third groove is recessed from a side of the substrate close to the light-emitting component.

8. The light-emitting device according to any one of claims 1 to 7, wherein, The at least one conductive structure includes a plurality of conductive structures, the plurality of conductive structures are arranged in pairs and are located on both sides of the first connection portion; the at least one electrical connection structure includes a plurality of electrical connection structures, the plurality of electrical connection structures are arranged in pairs and are located on both sides of the second connection portion; The second connection material between the plurality of conductive structures and the plurality of electrical connection structures is different from the first connection material between the first connection portion and the second connection portion; and the thermal conductivity of the first connection material is greater than the thermal conductivity of the second connection material.

9. The light-emitting device according to any one of claims 1 to 8, wherein, The first connection portion is further configured to absorb heat generated by the light-emitting component; a positive projection of the second connection portion on the plane of the substrate is located within a positive projection of the first connection portion on the plane of the substrate.

10. The light-emitting device according to any one of claims 1 to 9, wherein, The light-emitting component further includes a plurality of first sealing portions, the plurality of first sealing portions are disposed between the first accommodating structure and the cover plate, and two adjacent first sealing portions among the plurality of first sealing portions are in contact with each other, and the plurality of first sealing portions are configured to connect the first accommodating structure and the cover plate to seal a gap at a connection between the first accommodating structure and the cover plate.

11. The light-emitting device according to claim 10, further comprising: A first sealing region, disposed on a side of the first accommodating structure close to the cover plate; The plurality of first sealing portions are disposed in the first sealing region; And A second sealing region, correspondingly disposed with the first sealing region, disposed on a side of the cover plate close to the first accommodating structure, and the plurality of first sealing portions are disposed in the second sealing region; Wherein, a positive projection of the second sealing region on the plane of the substrate at least partially overlaps with a positive projection of the first sealing region on the plane of the substrate; the first sealing region and the second sealing region are respectively metallization layers.

12. The light-emitting device according to claim 11, further comprising a second sealing portion, a positive projection of the plurality of first sealing portions on the plane of the cover plate at least partially overlaps with a positive projection of the second sealing portion on the plane of the cover plate; the second sealing portion at least satisfies one of the following: The second sealing portion is disposed on a side of the cover plate facing the first accommodating structure and is located between the cover plate and the plurality of first sealing portions; the second sealing region includes the second sealing portion; or, The second sealing portion is disposed on a side of the first accommodating structure facing the cover plate and is located between the plurality of first sealing portions and the first accommodating structure; the first sealing region includes the second sealing portion.

13. A method for preparing a light-emitting device, the light-emitting device comprising a substrate and a light-emitting component, the light-emitting component comprising a laser chip, a first accommodating structure, a cover plate, and a plurality of first sealing portions, wherein, The method includes: Provide the laser chip, the first accommodating structure, the cover plate, and the plurality of first sealing parts; Dispose the laser chip in the first accommodating structure; Dispose the plurality of first sealing parts on a side of the cover plate facing the first accommodating structure; adjacent two of the plurality of first sealing parts are spaced apart; Connect the first accommodating structure and the cover plate through the plurality of first sealing parts, such that any two adjacent first sealing parts are in contact with each other to connect the first accommodating structure and the cover plate, so as to seal a gap at a connection between the first accommodating structure and the cover plate, thereby forming the light-emitting component; Electrically connect the light-emitting component to the substrate.

14. The method according to claim 13, wherein, The light-emitting component further includes a second sealing part, and the method further includes: disposing the second sealing part on a side of the cover plate facing the first accommodating structure.

15. The method according to claim 14, wherein, The providing the plurality of first sealing parts includes: connecting the plurality of first sealing parts to the second sealing part; Wherein, a positive projection of the plurality of first sealing parts on a plane where the cover plate is located and a positive projection of the second sealing part on the plane where the cover plate is located at least partially overlap; the second sealing part satisfies at least one of the following: The second sealing part is disposed on a side of the cover plate facing the first accommodating structure and is located between the cover plate and the plurality of first sealing parts; or, the second sealing part is disposed on a side of the first accommodating structure facing the cover plate and is located between the plurality of first sealing parts and the first accommodating structure.

16. The method according to claim 15, wherein, The connecting the plurality of first sealing parts to the second sealing part includes: Determine the number of the plurality of first sealing parts, a spacing between any two adjacent first sealing parts among the plurality of first sealing parts, and a radius of the plurality of first sealing parts; Connect the plurality of first sealing parts to the second sealing part according to the number of the plurality of first sealing parts, the spacing between any two adjacent first sealing parts among the plurality of first sealing parts, and the radius of the plurality of first sealing parts.

17. The method according to any one of claims 13 to 16, wherein The connecting the first accommodating structure and the cover plate through the plurality of first sealing parts, such that any two adjacent first sealing parts are in contact with each other to connect the first accommodating structure and the cover plate, so as to seal a gap at a connection between the first accommodating structure and the cover plate, thereby forming the light-emitting component includes: Heat the plurality of first sealing parts such that the plurality of first sealing parts are in a molten state; Simultaneously connect the plurality of first sealing parts to the first accommodating structure and apply pressure to the plurality of first sealing parts, such that the adjacent first sealing parts are in contact with each other to connect the first accommodating structure and the cover plate, so as to seal a gap at a connection between the first accommodating structure and the cover plate.

18. The method according to any one of claims 13 to 17, wherein The light-emitting device satisfies at least one of the following: In a direction perpendicular to the plane of the substrate, the distance between the cover plate and the first accommodating structure satisfies at least one of the following: greater than or equal to 20 μm, or less than or equal to 50 μm. The radius of any one of the plurality of first sealing portions satisfies at least one of the following: greater than or equal to 40 μm, or less than or equal to 100 μm; Or, In a direction perpendicular to the plane of the substrate, the distance between the cover plate and the first accommodating structure satisfies at least one of the following: greater than or equal to 50 μm, or less than or equal to 100 μm. The radius of any one of the plurality of first sealing portions satisfies at least one of the following: greater than or equal to 120 μm, or less than or equal to 180 μm.

19. A light-emitting device, which is prepared by the method according to any one of claims 13 to 17.

20. A laser projection device, comprising: A light source assembly configured to emit an illumination beam; the light source assembly includes the light-emitting device according to claim 19; An optical modulation assembly configured to modulate the illumination beam provided by the light source assembly to obtain a projection beam; And A lens configured to image the projection beam.

21. A laser projection device, comprising: A light source assembly configured to emit an illumination beam; the light source assembly includes the light-emitting device according to any one of claims 1 to 12; An optical modulation assembly configured to modulate the illumination beam provided by the light source assembly to obtain a projection beam; And A lens configured to image the projection beam.

Images