Electronic device

Abstract

Provided in the embodiments of the present application is an electronic device. The electronic device comprises a charging interface, a first circuit board, a metal reinforcing member and a support assembly, wherein the first circuit board comprises a connecting end, the connecting end is provided with a grounding terminal, and the connecting end is electrically connected to the charging interface; the metal reinforcing member and the connecting end are arranged in a stacked manner, and the metal reinforcing member is electrically connected to the grounding terminal; the support assembly comprises a metal support and a conductive member, at least part of the connecting end is located in the metal support, the metal support comprises a main body portion and a grounding portion, the grounding portion is electrically connected to the main body portion, the metal reinforcing member and the main body portion are both electrically connected to the conductive member, and the grounding portion is used for grounding. The electronic device in the embodiments of the present application facilitates reduction of the difficulty in terms of structure design, reduction of the difficulty in terms of assembling, and reduction of production costs.

Description

electronic devices

[0001] This application claims priority to the Chinese patent application filed with the China Patent Office on January 22, 2024, with application number 202410086776.3 and application name “Electronic Device”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The embodiments of the present application relate to the field of terminal technology, and in particular to an electronic device. Background Art

[0003] With the explosive growth of electronic devices such as smartphones and tablets, electronic devices have more and more functions. During the use of electronic devices, the batteries in the electronic devices need to be charged to ensure that the power in the battery meets the endurance required by the user. The electronic device includes a charging interface. When charging the electronic device, the charging head of the charger can be plugged into the charging interface to charge the battery with the charger. At present, in order to shorten the charging time, a high-power fast charging method is used to charge the battery. The charging interface is electrically connected to the circuit board. The circuit board can be electrically connected to the main board. The battery is electrically connected to the main board. The circuit board connected to the charging interface has a grounding requirement to reduce the current loss of the circuit board. However, the grounding structure of the circuit board in the related art has the problem of affecting the internal structure design of the electronic device. Summary of the Invention

[0004] The embodiments of the present application provide an electronic device that is conducive to reducing the difficulty of structural design, assembly difficulty and production cost.

[0005] An embodiment of the present application provides an electronic device, which includes a charging interface, a first circuit board, a metal reinforcement, and a bracket assembly.

[0006] The first circuit board includes a connection end. The connection end has a grounding terminal. The connection end is electrically connected to the charging port. The metal reinforcement is stacked with the connection end. The metal reinforcement is electrically connected to the grounding terminal. The bracket assembly includes a metal bracket and a conductive member. At least part of the connection end is located within the metal bracket. The metal bracket includes a main body and a grounding portion. The grounding portion is electrically connected to the main body. The metal reinforcement and the main body are respectively electrically connected to the conductive member. The grounding portion is used for grounding.

[0007] In the electronic device of the embodiment of the present application, the first circuit board connected to the charging interface includes a grounding terminal. The first circuit board can be grounded through the grounding terminal. The grounding terminal of the first circuit board can be electrically connected to the metal reinforcement. The bracket assembly includes a metal bracket and a conductive member. The metal reinforcement is electrically connected to the metal bracket through the conductive member. The metal bracket includes a grounding portion. The metal bracket is grounded through the grounding portion. The grounding path of the first circuit board can be a grounding terminal, a metal reinforcement, a conductive member and a metal bracket. In the embodiment of the present application, the metal reinforcement is reused, so that the metal reinforcement can form a protection for the first circuit board and can be used to transmit grounding current. The metal bracket is also reused, so that the metal bracket can support and fix the corresponding structural parts and can be used to transmit grounding current. Therefore, in the embodiment of the present application, the grounding structure design of the first circuit board can reduce the difficulty of structural design, assembly difficulty and production cost by reusing the corresponding structural parts.

[0008] In a possible implementation, the metal reinforcement piece is disposed between the main body and the connecting end, and the conductive piece is disposed between the metal reinforcement piece and the main body.

[0009] The metal reinforcement and the conductive parts can reuse the internal space of the metal bracket, which is beneficial to reducing the occupancy rate of the metal reinforcement and the conductive parts in the internal space of the electronic device in the thickness direction of the electronic device, thereby ensuring that the electronic device achieves a lightweight design.

[0010] In a possible embodiment, at least one of the metal reinforcement and the main body is provided with a recess, and at least part of the conductive member is located in the space formed by the recess.

[0011] Metal reinforcements and metal brackets can protect conductive parts and reduce the possibility of conductive parts being impacted or collided.

[0012] In one possible embodiment, the main body is provided with a recess having an opening facing the metal reinforcement, and a surface of the metal reinforcement facing the recess is flat.

[0013] The recessed portion provided on the metal bracket eliminates the need for a structure for accommodating the conductive member on the metal reinforcement, which facilitates a flat design of the metal reinforcement. That is, in the thickness direction of the electronic device, the two opposing surfaces of the metal reinforcement can be flat surfaces. Therefore, when the metal reinforcement presses against the connection end of the first circuit board, the metal reinforcement does not exert a large force on the local connection end, thereby avoiding stress concentration at the connection end and structural damage.

[0014] In a possible implementation manner, one of the metal reinforcement and the main body is welded to the conductive member, and the other is in contact with the conductive member.

[0015] The use of welding between one of the metal reinforcement and the main body and the conductive member can help ensure a stable and reliable connection between the metal reinforcement and the main body, thereby reducing the possibility of grounding failure caused by loss of contact between the metal reinforcement and the main body. The use of abutment between the metal reinforcement and the main body and the conductive member eliminates the need for tools to connect the metal reinforcement and the main body during assembly. As a result, the metal reinforcement, the conductive member, and the main body are already electrically connected after the metal reinforcement and the main body are assembled, thus reducing assembly complexity.

[0016] In a possible implementation, the conductive member is an elastic structural member, and the metal reinforcement member and the main body respectively apply compressive stress to the conductive member.

[0017] When the conductive part is under pressure, the conductive part itself has elastic restoring force, so that the conductive part can exert a reaction force on the metal reinforcement part and the main body of the metal bracket, so that the metal reinforcement part and the main body of the metal bracket respectively maintain a good and stable contact state with the conductive part, which is beneficial to reduce the possibility of false connection between the metal reinforcement part and the main body of the metal bracket and the conductive part, resulting in grounding failure or poor grounding.

[0018] In one possible embodiment, the conductive member is a metal structural member. The conductive member includes a base and elastic legs. One of the metal reinforcement member and the main body is connected to the base, and the other is connected to the elastic legs.

[0019] Since the conductive member is rigid, the main body of the metal reinforcement and the metal bracket are in rigid contact with the conductive member, respectively. As a result, the contact state between the main body of the metal reinforcement and the metal bracket and the conductive member is relatively more stable. As a result, radiated spurious emission (RSE) is less likely to occur between the main body of the metal reinforcement and the metal bracket and the conductive member, respectively, reducing the possibility of interference signals being generated during the current transmission process.

[0020] In a possible implementation manner, one of the metal reinforcement and the main body is welded to the base, and the other is in contact with the elastic support leg.

[0021] The use of welding between the metal reinforcement and one of the main parts of the metal bracket and the base body can help ensure the stability and reliability of the connection between the metal reinforcement and one of the main parts and the base body, and help reduce the possibility of grounding failure caused by the metal reinforcement and one of the main parts losing contact with the base body. In addition, the use of welding can eliminate the need for additional connecting components. The additional provision of connecting components will cause the connecting components to occupy more space in the thickness direction of the electronic device, affecting the lightweight design of the electronic device. Therefore, the use of welding can save space in the thickness direction of the electronic device, which is conducive to the lightweight design of the electronic device.

[0022] The metal reinforcement, one of the main body and the elastic support leg are in abutment with each other, so that when the metal reinforcement and the metal bracket are assembled, there is no need to use tools to connect the metal reinforcement, one of the main body and the elastic support leg, which helps to reduce the difficulty of assembly.

[0023] In a possible implementation, the number of the elastic legs is more than two.

[0024] More than two elastic legs can be used to transmit grounding current, thereby effectively increasing the number of grounding paths, facilitating current dispersion, and further reducing current loss.

[0025] In a possible implementation, the conductive member is a metal spring.

[0026] When the metal reinforcement, the conductive part and the metal bracket are assembled, the metal reinforcement and the metal bracket jointly extrude the conductive part to make the conductive part flatter, so that the conductive part can occupy less space in the thickness direction of the electronic device, which is conducive to the lightweight design of the electronic device.

[0027] In a possible implementation, the first circuit board is a flexible circuit board.

[0028] The first circuit board is flexible and can bend and fold when subjected to force, thereby facilitating its flexible placement within the electronic device. The first circuit board is relatively thin, allowing for easy passage between the battery and the battery cover. It also occupies less space in the thickness direction of the electronic device, contributing to a slimmer and lighter design.

[0029] In one possible implementation, the charging interface includes a ground pin, the ground terminal is electrically connected to the ground pin, and the metal reinforcement is electrically connected to the ground pin.

[0030] The charging interface can form a grounding path through the first circuit board, metal reinforcement, conductive part and metal bracket, so that the metal reinforcement and metal bracket can be reused to achieve the grounding of the charging interface, reducing the difficulty of grounding structure design, reducing assembly difficulty and production cost.

[0031] In one possible embodiment, the ground terminal includes a via and a metal pad. The metal pad is disposed in the via. The metal pad has a central through hole. The ground pin is disposed in the central through hole. The ground pin is welded to the metal pad.

[0032] The ground pin of the charging interface is welded to the metal pad, thereby ensuring a stable and reliable connection between the ground pin of the charging interface and the metal pad. In addition, the ground pin of the charging interface can reuse the space in the thickness direction of the first circuit board, reducing the space occupancy of the ground pin of the charging interface in the thickness direction.

[0033] In one possible embodiment, the metal reinforcement has a relief hole. The relief hole is provided corresponding to the central through hole of the metal pad. The ground pin is passed through the relief hole. The ground pin is welded to the metal reinforcement.

[0034] The charging interface's ground pin is welded to the metal reinforcement, allowing it to exert force on the metal reinforcement to press against the connection end of the first circuit board. The charging interface's ground pin can both provide a grounding function and securely connect the metal reinforcement, allowing the charging interface's ground pin to be reused. The metal reinforcement can be fixed in place via the charging interface's ground pin, eliminating the need for an additional connection structure. This reduces structural design difficulty, assembly difficulty, and production costs, while also taking up less space within the electronic device.

[0035] In one possible implementation, the electronic device further includes a metal middle frame, the grounding portion is electrically connected to the metal middle frame, and the grounding portion is grounded through the metal middle frame.

[0036] The first circuit board can form a ground path through the metal reinforcement, conductive components, metal bracket, and metal midframe, resulting in a shorter ground path for the first circuit board, further reducing current loss. The metal midframe can provide both support and grounding functions, allowing for reuse and reducing structural design, assembly difficulty, and production costs.

[0037] In a possible implementation, the electronic device further includes a conductive connector, and the grounding portion is connected to the metal middle frame via the conductive connector.

[0038] The conductive connector can ensure that the grounding portion of the metal bracket and the metal middle frame are stably and reliably connected and not prone to loosening, thereby reducing the possibility of a false connection between the grounding portion of the metal bracket and the metal middle frame, resulting in grounding failure or poor grounding.

[0039] In a possible embodiment, the conductive connector includes a pressing portion and a transition portion, wherein the transition portion is threadedly connected to the metal middle frame, and the pressing portion abuts against the ground portion.

[0040] The adapter part of the conductive connector is threadedly connected to the metal middle frame, which can facilitate the assembly of the adapter part and the metal middle frame, and also ensure the stable connection between the adapter part and the metal middle frame.

[0041] The pressing portion of the conductive connector abuts against the grounding portion of the metal bracket. The pressing portion of the conductive connector applies compressive stress to the grounding portion of the metal bracket, so that the pressing portion of the conductive connector and the grounding portion of the metal bracket maintain close contact and ensure a stable connection.

[0042] In one possible embodiment, the metal bracket includes a protrusion. The protrusion protrudes toward the metal middle frame. The protrusion forms a grounding portion. The pressing portion presses against a surface of the protrusion facing away from the metal middle frame.

[0043] In one possible embodiment, the electronic device further includes a second circuit board. The second circuit board is located inside the metal bracket. The metal bracket limits the second circuit board. The grounding portion is electrically connected to the second circuit board. The grounding portion is grounded through the second circuit board.

[0044] The second circuit board can realize the functions of installing components and grounding, so that the second circuit board can be reused, reducing the difficulty of grounding structure design, reducing assembly difficulty and production cost.

[0045] In one possible embodiment, the electronic device further includes a second circuit board, a battery, and a main board. The battery is disposed between the second circuit board and the main board. The battery is disposed on a side of the first circuit board. The first circuit board is electrically connected to the main board.

[0046] In one possible implementation, the electronic device further includes a metal middle frame. The second circuit board is connected to the metal middle frame. The second circuit board is a printed circuit board.

[0047] In a possible implementation manner, an insulator is provided on the surface of the main body facing the metal reinforcement.

[0048] The main body of the metal bracket and the metal reinforcement are in a non-electrical connection state, that is, in an insulated state from each other, thereby avoiding the problem that the metal bracket and the metal reinforcement are conductive and interfere with the signal transmitted in the first circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0049] FIG1 is a schematic structural diagram of an electronic device provided in an embodiment of the present application;

[0050] FIG2 is a schematic diagram of a partially exploded structure of an electronic device provided in an embodiment of the present application;

[0051] FIG3 is a schematic diagram of a partial structure of an electronic device provided in an embodiment of the present application;

[0052] FIG4 is a schematic diagram of a partially exploded structure of an electronic device provided in an embodiment of the present application;

[0053] FIG5 is a schematic diagram of a partial structure of a first circuit board provided in an embodiment of the present application;

[0054] FIG6 is a schematic diagram of a partial structure of a bracket assembly provided in an embodiment of the present application;

[0055] FIG7 is a schematic diagram of a partial cross-sectional structure of an electronic device provided in an embodiment of the present application;

[0056] FIG8 is an enlarged schematic diagram of point M in FIG7;

[0057] FIG9 is a schematic diagram of a partially exploded structure of an electronic device provided in an embodiment of the present application;

[0058] FIG10 is a schematic diagram of a partial cross-sectional structure of an electronic device provided in an embodiment of the present application;

[0059] FIG11 is an enlarged schematic diagram of point W in FIG7 .

[0060] Figure numerals: 10, electronic device; 20, display screen; 30, shell; 31, metal middle frame; 311, outer frame; 312, middle plate; 32, battery cover; 40, main board; 50, electronic device; 60, battery; 70, first circuit board; 71, connection end; 711, grounding terminal; 711a, via; 711b, metal pad; 80, second circuit board; 90, charging interface; 91, grounding pin; 100, bracket assembly; 110, metal bracket; 111, main body; 112, grounding part; 120, conductive part; 121, base; 122, elastic support foot; 200, metal reinforcement; 210, avoidance hole; 300, recess; 400, conductive connector; 410, pressing part; 420, adapter; Z, thickness direction. DETAILED DESCRIPTION

[0061] The electronic device in the embodiments of the present application may be referred to as user equipment (UE) or terminal, etc. For example, the electronic device may be a tablet computer (portable Android device, PAD), a personal digital assistant (PDA), a handheld device with wireless communication function, a computing device, a vehicle-mounted device, a wearable device, a virtual reality (VR) terminal device, an augmented reality (AR) terminal device, a wireless terminal in industrial control, a wireless terminal in self-driving, a wireless terminal in remote medical, a wireless terminal in smart grid, a wireless terminal in transportation safety, a wireless terminal in smart city, a wireless terminal in smart home, and other mobile terminals or fixed terminals. In the embodiments of the present application, the form of the terminal device is not specifically limited.

[0062] In the embodiments of the present application, the electronic device is a handheld device with wireless communication capabilities. The handheld device with wireless communication capabilities can be, for example, a flat-screen mobile phone or a foldable mobile phone. FIG1 schematically shows the structure of an electronic device 10. As shown in FIG1 , the handheld device with wireless communication capabilities can be, for example, a flat-screen mobile phone.

[0063] Figure 2 schematically shows a partial exploded structure of an electronic device 10. Figure 3 schematically shows a partial structure of an electronic device 10. Referring to Figures 1 to 3 , the electronic device 10 according to an embodiment of the present application may include a display assembly, a housing 30, a mainboard 40, an electronic device 50, a battery 60, a first circuit board 70, a second circuit board 80, and a charging port 90.

[0064] The display assembly includes a display screen 20 for displaying image information. The display assembly is mounted to a housing 30, and the display area of ​​the display screen 20 can be used to present image information to the user. The housing 30 may include a metal midframe 31 and a battery cover 32. The display assembly is connected to the metal midframe 31. For example, the display assembly may be bonded to the metal midframe 31. The material of the metal midframe 31 may be, but is not limited to, aluminum, an aluminum alloy, steel, or a titanium alloy.

[0065] The motherboard 40 and the battery 60 can be arranged inside the electronic device 10 and located on the inner side of the housing 30 and the display assembly, so that the user cannot easily observe the motherboard 40 and the battery 60 from the outside of the electronic device 10. The battery 60 can be arranged between the metal middle frame 31 and the battery cover 32. The battery cover 32 shields the battery 60. The battery 60 is used to provide power to the electronic device 10 to ensure that the electronic device 10 operates normally. For example, the battery 60 can provide power to the display assembly so that the display assembly displays image information or completes corresponding operating instructions. Alternatively, the battery 60 can provide power to the motherboard 40 to ensure that the electronic device 50 on the motherboard 40 operates normally. The battery 60 can be a lithium-ion battery, such as a lithium iron phosphate battery.

[0066] An electronic device 50 is mounted on the motherboard 40. The motherboard 40 may be a printed circuit board (PCB). The electronic device 50 is soldered to the motherboard 40 using a soldering process. The electronic device 50 includes, but is not limited to, a central processing unit (CPU), an intelligent algorithm chip, or a power management IC (PMIC).

[0067] The first circuit board 70 and the second circuit board 80 are disposed within the electronic device 10. The battery 60 may be disposed between the main board 40 and the second circuit board 80. A charging circuit is disposed on the main board 40. The charging circuit has an input and an output. The first circuit board 70 is electrically connected to the input of the charging circuit. The output of the charging circuit is electrically connected to the battery 60. When the battery 60 of the electronic device 10 is charged using an external charging device (e.g., a charger), the first circuit board 70 can be used to deliver the charging current.

[0068] The second circuit board 80 can be used as a sub-board. In the embodiment where the second circuit board 80 is used as a sub-board, the area of ​​the main board 40 is relatively larger than that of the second circuit board 80 , so that more electronic devices 50 can be arranged on the main board 40 .

[0069] In some examples, the first circuit board 70 may be a flexible printed circuit board (FPCB), and the second circuit board 80 may be a printed circuit board.

[0070] The electronic device 10 also includes a charging interface 90. The charging interface 90 can be set on the metal middle frame 31. The first circuit board 70 connects the charging interface 90 and the main board 40. The charging interface 90 can be electrically connected to the input end of the charging circuit through the first circuit board 70 and the main board 40. When the battery 60 of the electronic device 10 is charging, the electrical signal can be input from the charging interface 90, and then reach the charging circuit through the first circuit board 70 and the main board 40. After the charging circuit performs a step-up or step-down conversion on the input electrical signal, it outputs the electrical signal to the battery 60 through the main board 40. The electrical signal enters the battery 60 and is stored to achieve the purpose of energy storage. When the battery 60 of the electronic device 10 is discharged, the electrical signal output by the battery 60 can be output to the main board 40 to power the main board 40.

[0071] In some examples, the charging interface 90 can be a USB Type-C interface, a Micro USB interface, or a lightning interface.

[0072] The electronic device 10 also includes a bracket assembly 100. In the internal space of the electronic device 10, the bracket assembly 100 can be used to support and fix the second circuit board 80 to ensure the stability of the position of the second circuit board 80 and the charging port 90. When the electronic device 10 is subjected to an impact force, the positions of the second circuit board 80 and the charging port 90 are not easily shifted. In some examples, the bracket assembly 100 can be connected to the metal middle frame 31 to fix the position of the bracket assembly 100. The second circuit board 80 can be located inside the bracket assembly 100.

[0073] FIG4 schematically illustrates a partially exploded structure of the electronic device 10. As shown in FIG4 , the electronic device 10 further includes a metal reinforcement 200. The metal reinforcement 200 is connected to the first circuit board 70. The metal reinforcement 200 can provide protection for corresponding areas of the first circuit board 70, thereby reducing the likelihood of structural damage to the corresponding areas of the first circuit board 70 due to external pressure. In some examples, the metal reinforcement 200 can be a metal plate, which can reduce the thickness of the metal reinforcement 200 and reduce space occupancy. The material of the metal reinforcement 200 can be, but is not limited to, steel, aluminum, or an aluminum alloy.

[0074] In the related art, in order to effectively reduce the current flowing through the first circuit board during the charging process to reduce current loss, the first circuit board in the electronic device needs to be grounded. The first circuit board includes a main line and a branch line. The main line of the first circuit board is used to electrically connect to the charging interface and the main board. The first circuit board can be grounded through an additional branch line. The bifurcated structure design of the first circuit board will lead to relatively high structural design and processing difficulty of the first circuit board itself, resulting in a high cost of the first circuit board. In addition, the bifurcated structure design of the first circuit board will take up relatively more space. At the same time, in order to adapt to the bifurcated structure design of the first circuit board, other structural components inside the electronic device need to be adaptively adjusted. Therefore, the grounding structure design of the first circuit board will have an adverse effect on the structural design of the internal components of the electronic device.

[0075] The electronic device 10 provided in the embodiment of the present application can utilize the bracket assembly 100 located in the internal space of the electronic device 10 to achieve grounding of the first circuit board 70, thereby reusing the bracket assembly 100, so that the bracket assembly 100 can achieve the supporting and fixing functions and the grounding functions, which is conducive to reducing the difficulty of structural design, reducing the difficulty of assembly and production costs.

[0076] The following describes the implementation of the electronic device 10 provided in the embodiment of the present application.

[0077] FIG5 schematically shows a partial structure of the first circuit board 70. Referring to FIG4 and FIG5 , the first circuit board 70 of the embodiment of the present application includes a connection terminal 71. The connection terminal 71 is formed at the end of the first circuit board 70 near the charging interface 90. The end of the first circuit board 70 near the main board 40 is electrically connected to the main board 40. The connection terminal 71 has a ground terminal 711. The first circuit board 70 can be grounded through the ground terminal 711. The connection terminal 71 of the first circuit board 70 is electrically connected to the charging interface 90.

[0078] The charging port 90 has multiple pins. The connection end 71 has multiple conductive pads. Each conductive pad can be electrically connected to a corresponding pin. When the charging port 90 is connected to an external charging device for charging, the current at the charging port 90 can be transmitted to the first circuit board 70 through the connection end 71.

[0079] In an embodiment of the present application, the metal reinforcement 200 is stacked with the connection end 71 of the first circuit board 70. The metal reinforcement 200 can be arranged on the side of the connection end 71 facing the battery cover 32. At least part of the connection end 71 is located below the metal reinforcement 200. The connection end 71 can be in contact with and fit the metal reinforcement 200. The metal reinforcement 200 itself has high rigidity and deformation resistance. The metal reinforcement 200 can form a protection for the connection end 71, reducing the possibility of structural damage such as tearing or cracking of the connection end 71 due to external compressive stress. The metal reinforcement 200 is electrically connected to the ground terminal 711 of the connection end 71. Therefore, the metal reinforcement 200 can be reused, so that the metal reinforcement 200 has both protective and connection functions.

[0080] In some examples, the ground terminal 711 may be welded to the metal reinforcement 200 .

[0081] In some examples, the metal reinforcement 200 is an integrally formed structure. The metal reinforcement 200 may be a metal plate. In the embodiments of the present application, the shape of the metal reinforcement 200 itself is not specifically limited, as long as the shape of the metal reinforcement 200 can effectively cover the connection end 71.

[0082] In an embodiment of the present application, the bracket assembly 100 includes a metal bracket 110. The metal bracket 110 can improve the overall rigidity of the bracket assembly 100. At the same time, while ensuring that the bracket assembly 100 meets the rigidity requirements, the thickness of the metal bracket 110 itself is relatively small, which can help reduce the volume of the bracket assembly 100 and reduce the space occupancy rate of the bracket assembly 100. The bracket assembly 100 may also include an insulating structure. The insulating structure is connected to the metal bracket 110. The insulating structure is used to be arranged corresponding to devices that are more sensitive to metal structural parts, so as to help reduce interference. At least part of the connection end 71 is located in the metal bracket 110, so that the metal bracket 110 can form a protection for the connection end 71. The metal bracket 110 includes a main body 111 and a grounding portion 112. The grounding portion 112 is electrically connected to the main body 111. The grounding portion 112 of the metal bracket 110 is used for grounding.

[0083] In some examples, the metal bracket 110 may be made of, but not limited to, steel, aluminum, or an aluminum alloy. The bracket assembly 100 may be connected to the metal middle frame 31. For example, the metal bracket 110 and the insulating structure of the bracket assembly 100 may both be used to connect to the metal middle frame 31.

[0084] In some examples, the metal bracket 110 may be an integrally formed structure. For example, the metal bracket 110 may be formed by using a sheet material blank through a stamping process.

[0085] In the embodiment of the present application, the bracket assembly 100 also includes a conductive member 120. The conductive member 120 itself has good electrical conductivity. The metal reinforcement 200 and the main body 111 of the metal bracket 110 are electrically connected to the conductive member 120 respectively. The conductive member 120 serves as a transition connector to conduct electricity between the metal reinforcement 200 and the metal bracket 110. Since the metal reinforcement 200 is electrically connected to the grounding terminal 711 of the first circuit board 70, the metal bracket 110 can be electrically connected to the grounding terminal 711 of the first circuit board 70 through the conductive member 120 and the metal reinforcement 200. In the embodiment of the present application, the grounding terminal 711 of the first circuit board 70 is grounded through the metal reinforcement 200, the conductive member 120 and the grounding portion 112 of the metal bracket 110.

[0086] In the electronic device 10 of the embodiment of the present application, the first circuit board 70 connected to the charging port 90 includes a grounding terminal 711. The first circuit board 70 can be grounded via the grounding terminal 711. The grounding terminal 711 of the first circuit board 70 can be electrically connected to the metal reinforcement 200. The bracket assembly 100 includes a metal bracket 110 and a conductive member 120. The metal reinforcement 200 is electrically connected to the metal bracket 110 via the conductive member 120. The metal bracket 110 includes a grounding portion 112. The metal bracket 110 is grounded via the grounding portion 112. The grounding path of the first circuit board 70 can be the grounding terminal 711, the metal reinforcement 200, the conductive member 120, and the metal bracket 110. In the embodiment of the present application, the metal reinforcement 200 is reused, thereby providing protection for the first circuit board 70 and also serving to carry grounding current. The metal bracket 110 is also reused, thereby supporting and securing the corresponding structural components and also serving to carry grounding current. Therefore, in the embodiment of the present application, the grounding structure design of the first circuit board 70 can reduce the difficulty of structural design, assembly difficulty and production cost by reusing corresponding structural components.

[0087] The metal reinforcement 200 of the embodiment of the present application can be arranged between the main body 111 of the metal bracket 110 and the connection end 71 of the first circuit board 70. The conductive member 120 is arranged between the metal reinforcement 200 and the main body 111 of the metal bracket 110. In the thickness direction Z of the electronic device 10, the connection end 71 of the first circuit board 70, the metal reinforcement 200, and the main body 111 of the metal bracket 110 are stacked. The thickness direction Z of the electronic device 10 can be the same as the thickness direction of the display screen 20. The connection end 71 of the first circuit board 70 can be located on the side of the metal reinforcement 200 facing the display screen 20. The metal reinforcement 200 can be located on the side of the main body 111 of the metal bracket 110 facing the display screen 20. The conductive member 120 can be located on the side of the main body 111 of the metal bracket 110 facing the display screen 20.

[0088] The metal reinforcement 200 and the conductive member 120 can reuse the internal space of the metal bracket 110, which is beneficial to reducing the occupancy rate of the metal reinforcement 200 and the conductive member 120 in the internal space of the electronic device 10 in the thickness direction Z of the electronic device 10, thereby ensuring that the electronic device 10 achieves a lightweight design.

[0089] At least one of the metal reinforcement 200 and the main body 111 of the metal bracket 110 is provided with a recess. At least a portion of the conductive member 120 is located within the space formed by the recess. When the metal reinforcement 200 and the main body 111 of the metal bracket 110 are stacked, the recess between the metal reinforcement 200 and the metal bracket 110 forms an installation space for the conductive member 120. The metal reinforcement 200 and the metal bracket 110 provide protection for the conductive member 120, reducing the likelihood of it being impacted or struck.

[0090] In some examples, Figure 6 schematically shows a partial structure of the bracket assembly 100. Figure 7 schematically shows a partial cross-sectional structure of the electronic device 10. Figure 8 is an enlarged view of point M in Figure 7. Referring to Figures 6, 7 and 8, a recess 300 is provided in the main body 111 of the metal bracket 110. The recess 300 has an opening facing the metal reinforcement 200. The conductive member 120 is located in the space formed by the recess 300. For example, in the thickness direction Z of the electronic device 10, the spacing between the bottom wall of the recess 300 and the surface of the metal reinforcement 200 can be greater than or equal to 0.2 millimeters (mm), which is conducive to ensuring that the conductive member 120 occupies a smaller space in the thickness direction Z of the electronic device 10, so as to facilitate the electronic device 10 to achieve a lightweight and thin design.

[0091] For example, the surface of the metal reinforcement 200 facing the recess 300 is a plane. The surface of the metal reinforcement 200 facing the connection end 71 is a plane.

[0092] The provision of the recess 300 on the metal bracket 110 eliminates the need for a structure for accommodating the conductive member 120 on the metal reinforcement 200, thereby facilitating a flat design of the metal reinforcement 200. That is, in the thickness direction Z of the electronic device 10, the two opposing surfaces of the metal reinforcement 200 can be flat surfaces. Consequently, when the metal reinforcement 200 presses against the connection end 71 of the first circuit board 70, the metal reinforcement 200 does not exert a large force on a portion of the connection end 71, thereby avoiding stress concentration at the connection end 71 and structural damage.

[0093] In some examples, the metal reinforcement 200 defines a recess 300. The conductive member 120 is located in the space formed by the recess 300. For example, in the thickness direction Z of the electronic device 10, the distance between the bottom wall of the recess 300 and the surface of the main body 111 may be greater than or equal to 0.2 mm.

[0094] In some examples, the metal reinforcement 200 and the main body 111 of the metal bracket 110 are both provided with a recess 300. The conductive member 120 is entirely located within the space formed by the recess 300. For example, in the thickness direction Z of the electronic device 10, the distance between the bottom walls of the two recesses 300 can be greater than or equal to 0.2 millimeters (mm).

[0095] In an embodiment of the present application, the main body 111 of the metal bracket 110 can be connected to the conductive member 120. For example, the metal bracket 110 and the conductive member 120 can be an integrally formed structure. Alternatively, the metal bracket 110 and the conductive member 120 can be processed and manufactured separately and then connected through assembly. The metal reinforcement 200 can be connected to the conductive member 120 or abut against the conductive member 120. It should be noted that abutment refers to the state in which the two structural members are in contact and apply compressive stress to each other.

[0096] In the embodiment of the present application, the metal reinforcement 200 may also be connected to the conductive member 120. For example, the metal reinforcement 200 and the conductive member 120 may be integrally formed. Alternatively, the metal reinforcement 200 and the conductive member 120 may be manufactured separately and then connected through assembly. The metal bracket 110 may be connected to the conductive member 120 or abut against the conductive member 120.

[0097] In some implementations, one of the metal reinforcement 200 and the main body 111 of the metal bracket 110 is welded to the conductive member 120, while the other is in contact with the conductive member 120. Welding one of the metal reinforcement 200 and the main body 111 to the conductive member 120 can help ensure a stable and reliable connection between the metal reinforcement 200 and the main body 111, thereby reducing the possibility of grounding failure caused by loss of contact between the metal reinforcement 200 and the main body 111 and the conductive member 120. The metal reinforcement 200 and the main body 111 are in contact with the conductive member 120, so that when the metal reinforcement 200 and the main body 111 are assembled, there is no need to use tools to connect the metal reinforcement 200 and the main body 111 to the conductive member 120. Therefore, after the metal reinforcement 200 and the main body 111 are assembled, the metal reinforcement 200, the conductive member 120 and the main body 111 can be electrically connected, which helps to reduce the difficulty of assembly.

[0098] In some examples, the metal reinforcement 200 is welded to the conductive member 120 , and the main body 111 of the metal bracket 110 is in contact with the conductive member 120 .

[0099] In some examples, the main body 111 of the metal bracket 110 is welded to the conductive member 120 , and the metal reinforcement 200 is in contact with the conductive member 120 .

[0100] In the embodiment of the present application, the conductive part 120 can be an elastic structural part. The conductive part 120 can be deformed when subjected to external force. The metal reinforcement 200 and the main body 111 of the metal bracket 110 can respectively apply compressive stress to the conductive part 120. When the conductive part 120 is under pressure, the conductive part 120 itself has an elastic restoring force, so that the conductive part 120 can apply a reaction force to the metal reinforcement 200 and the main body 111 of the metal bracket 110, so that the metal reinforcement 200 and the main body 111 of the metal bracket 110 respectively maintain a good and stable contact state with the conductive part 120, which is conducive to reducing the possibility of a virtual connection between the metal reinforcement 200 and the main body 111 of the metal bracket 110 and the conductive part 120, resulting in grounding failure or poor grounding.

[0101] In addition, the conductive member 120 may be deformed in the thickness direction Z of the electronic device 10 , thereby reducing the space occupied by the conductive member 120 in the thickness direction Z of the electronic device 10 .

[0102] In some examples, the conductive member 120 itself is a flexible structural member. When subjected to force, the conductive member 120 may deform in the force-bearing area. The metal reinforcement 200 and the main body 111 of the metal bracket 110 may each abut against the conductive member 120. Alternatively, one of the metal reinforcement 200 and the main body 111 may be bonded to the conductive member 120, while the other abuts against the conductive member 120. For example, the conductive member 120 may be a conductive foam.

[0103] In some examples, the conductive member 120 is a metal structural member. The conductive member 120 itself is a rigid structural member. The conductive member 120 can be squeezed by the metal reinforcement 200 and the main body 111 of the metal bracket 110 to undergo corresponding deformation. Since the conductive member 120 is rigid, the metal reinforcement 200 and the main body 111 of the metal bracket 110 are in rigid contact with the conductive member 120, respectively, so that the contact state between the metal reinforcement 200 and the main body 111 of the metal bracket 110 and the conductive member 120 is relatively more stable, and thus radiated spurious emission (RSE) is less likely to occur between the metal reinforcement 200 and the main body 111 of the metal bracket 110 and the conductive member 120, respectively, reducing the possibility of generating interference signals during the current transmission process.

[0104] For example, as shown in Figures 6 and 8, the conductive member 120 includes a base 121 and elastic legs 122. Of the metal reinforcement 200 and the main body 111 of the metal bracket 110, one is connected to the base 121, and the other is connected to the elastic legs 122. When the elastic legs 122 are subjected to force, the elastic legs 122 can move relative to the base 121, so that the conductive member 120 produces corresponding deformation. When the metal reinforcement 200, the conductive member 120, and the main body 111 of the metal bracket 110 are assembled, the metal reinforcement 200 and the main body 111 of the metal bracket 110 jointly squeeze the conductive member 120, causing the elastic legs 122 to deform and accumulate elastic potential energy.

[0105] Exemplarily, one of the metal reinforcement 200 and the main body 111 of the metal bracket 110 is welded to the base 121 , and the other is in contact with the elastic legs 122 .

[0106] The use of welding between the metal reinforcement 200 and one of the main parts 111 of the metal bracket 110 and the base 121 can help ensure the stability and reliability of the connection between the metal reinforcement 200 and one of the main parts 111 and the base 121, and help reduce the possibility of grounding failure caused by the metal reinforcement 200 and one of the main parts 111 being out of contact with the base 121. In addition, the use of welding can eliminate the need for additional connecting components. The additional provision of connecting components will cause the connecting components to occupy more space in the thickness direction Z of the electronic device 10, affecting the lightweight design of the electronic device 10. Therefore, the use of welding can save space in the thickness direction Z of the electronic device 10, which is conducive to the lightweight design of the electronic device 10.

[0107] The abutment between one of the metal reinforcement 200 and the main body 111 and the elastic legs 122 eliminates the need for tools to connect the metal reinforcement 200 and the metal bracket 110, thus simplifying assembly. For example, during the process of the metal reinforcement 200 and the main body 111 of the metal bracket 110 jointly compressing the conductive member 120, the elastic legs 122 can slide relative to the metal reinforcement 200 and the main body 111.

[0108] In some examples, the main body 111 of the metal bracket 110 is welded to the base 121, and the metal reinforcement 200 abuts against the elastic legs 122. A gap is provided between the base 121 of the conductive member 120 and the metal reinforcement 200 to ensure that the base 121 does not contact the metal reinforcement 200.

[0109] In some examples, the metal reinforcement 200 is welded to the base 121, while the main body 111 of the metal bracket 110 abuts against the elastic legs 122. A gap is provided between the base 121 of the conductive member 120 and the main body 111 of the metal bracket 110 to ensure that the base 121 does not contact the main body 111 of the metal bracket 110.

[0110] In some examples, the base 121 and the elastic legs 122 of the conductive member 120 are an integrally formed structure.

[0111] In the embodiment of the present application, the number of the elastic leg 122 can be one.

[0112] In the embodiment of the present application, the number of elastic legs 122 can be more than two. The grounding current on the first circuit board 70 can be transmitted to the metal bracket 110 through the metal reinforcement 200, the two or more elastic legs 122 and the base 121. Then, the grounding current is grounded through the grounding portion 112 of the metal bracket 110. The two or more elastic legs 122 can all be used to transmit the grounding current, thereby effectively increasing the number of grounding paths, facilitating the dispersion of current, and further reducing current loss. The two or more elastic legs 122 are arranged at intervals around the base 121.

[0113] In some examples, the number of the elastic legs 122 may be two, three, or four, which is not specifically limited in the embodiments of the present application.

[0114] In some examples, the width of the elastic legs 122 gradually decreases in a direction away from the base 121. The ends of the elastic legs 122 away from the base 121 may be arc-shaped.

[0115] In an embodiment of the present application, the conductive member 120 may be a metal shrapnel. The material of the conductive member 120 may be, but is not limited to, copper, copper alloy, steel, aluminum or aluminum alloy. The elastic legs 122 are arranged to intersect with the base 121, so that the elastic legs 122 are in a tilted state relative to the base 121. When the metal reinforcement 200, the conductive member 120 and the metal bracket 110 are assembled, the metal reinforcement 200 and the metal bracket 110 jointly extrude the conductive member 120 to make the conductive member 120 flatter, so that in the thickness direction Z of the electronic device 10, the conductive member 120 can occupy less space, which is conducive to the lightweight design of the electronic device 10.

[0116] In the embodiment of the present application, the first circuit board 70 is a flexible circuit board. The first circuit board 70 itself is flexible and can be bent and folded when subjected to force, so that the first circuit board 70 can be flexibly arranged inside the electronic device 10. The first circuit board 70 itself is relatively thin, which can facilitate passing between the battery 60 and the battery cover 32. At the same time, it occupies a small space in the thickness direction Z of the electronic device 10, which is conducive to the lightweight design of the electronic device 10. Along the thickness direction of the first circuit board 70, the metal reinforcement 200 and the connection end 71 of the first circuit board 70 are stacked so that the metal reinforcement 200 blocks the connection end 71, so that the metal reinforcement 200 can effectively protect the connection end 71. The metal reinforcement 200 is arranged on the side of the connection end 71 facing the battery cover 32. The thickness direction of the first circuit board 70 can be the same as the thickness direction Z of the electronic device 10.

[0117] In an embodiment of the present application, FIG9 schematically shows a partial exploded structure of the electronic device 10. FIG10 schematically shows a partial cross-sectional structure of the electronic device 10. Referring to FIG9 and FIG10, the charging interface 90 includes a ground pin 91. The charging interface 90 can be grounded through the ground pin 91 to effectively improve the safety when charging using the charging interface 90. The ground terminal 711 of the first circuit board 70 is electrically connected to the ground pin 91 of the charging interface 90. The metal reinforcement 200 is electrically connected to the ground pin 91 of the charging interface 90. The charging interface 90 can form a grounding path through the first circuit board 70, the metal reinforcement 200, the conductive member 120 and the metal bracket 110, so that the metal reinforcement 200 and the metal bracket 110 can be reused to achieve grounding of the charging interface 90, reducing the difficulty of grounding structure design, assembly difficulty and production cost.

[0118] In some examples, the ground terminal 711 of the first circuit board 70 includes a via 711a and a metal pad 711b. The metal pad 711b is disposed in the via 711a. The metal pad 711b has a central through hole. The ground pin 91 of the charging interface 90 is passed through the central through hole of the metal pad 711b. The ground pin 91 of the charging interface 90 is welded to the metal pad 711b, thereby ensuring that the ground pin 91 of the charging interface 90 is stably and reliably connected to the metal pad 711b, and the ground pin 91 of the charging interface 90 can reuse the space of the first circuit board 70 in the thickness direction, reducing the space occupancy of the ground pin 91 of the charging interface 90 in the thickness direction.

[0119] In some examples, the metal reinforcement 200 can be electrically connected to the metal pad 711b. The metal reinforcement 200 has a relief hole 210. The relief hole 210 of the metal reinforcement 200 is arranged corresponding to the central through hole of the metal pad 711b. The ground pin 91 of the charging interface 90 is inserted into the relief hole 210 of the metal reinforcement 200. The ground pin 91 of the charging interface 90 passes through the first circuit board 70 and the metal reinforcement 200 in sequence. The ground pin 91 of the charging interface 90 is welded to the metal reinforcement 200, so that the ground pin 91 of the charging interface 90 can apply force to the metal reinforcement 200, so that the metal reinforcement 200 is pressed against the connection end 71 of the first circuit board 70. The metal reinforcement 200 can be electrically connected to the metal pad 711b through the ground pin 91. The ground pin 91 of the charging port 90 can be used for grounding and can also be connected to and fixed to the metal reinforcement 200, allowing the ground pin 91 of the charging port 90 to be reused. The metal reinforcement 200 is secured in place by the ground pin 91 of the charging port 90, eliminating the need for additional connection structures. This simplifies structural design, assembly, and production costs, while also taking up less space within the electronic device 10.

[0120] In some examples, the charging interface 90 includes more than two ground pins 91. A corresponding number of metal pads 711b are provided on the first circuit board 70. A corresponding number of avoidance holes 210 are provided on the metal reinforcement 200.

[0121] In the embodiment of the present application, the electronic device 10 also includes a metal middle frame 31. The grounding portion 112 of the metal bracket 110 is electrically connected to the metal middle frame 31. The grounding portion 112 of the metal bracket 110 can be grounded through the metal middle frame 31. The metal middle frame 31 can be used to provide an installation base for the devices inside the electronic device 10, while ensuring that the electronic device 10 as a whole has good rigidity and deformation resistance. The second circuit board 80 and the charging interface 90 can both be connected to the metal middle frame 31. The first circuit board 70 can form a grounding path through the metal reinforcement 200, the conductive part 120, the metal bracket 110 and the metal middle frame 31, so that the grounding path of the first circuit board 70 is shorter, which is conducive to further reducing current loss. The metal middle frame 31 can realize the supporting function and the grounding function, so that the metal middle frame 31 can be reused, reducing the difficulty of structural design, reducing the difficulty of assembly and production cost.

[0122] In some examples, the metal middle frame 31 includes an outer frame 311 and a middle plate 312 that are connected to each other. The outer frame 311 can be an annular frame. The middle plate 312 is located inside the outer frame 311. The grounding portion 112 of the metal bracket 110 can be electrically connected to the middle plate 312 of the metal middle frame 31.

[0123] In an embodiment of the present application, Figure 11 is an enlarged view of point W in Figure 7. Referring to Figures 4 and 11, the electronic device 10 also includes a conductive connector 400. The grounding portion 112 of the metal bracket 110 is connected to the metal middle frame 31 through the conductive connector 400. The conductive connector 400 can serve as a transitional electrical connector. After the second circuit board 80, the first circuit board 70, the metal reinforcement 200, the conductive member 120 and the metal bracket 110 complete the assembly process, the conductive connector 400 is used to connect the grounding portion 112 of the metal bracket 110 to the metal middle frame 31. The conductive connector 400 can ensure that the grounding portion 112 of the metal bracket 110 is stably and reliably connected to the metal middle frame 31, and is not prone to loosening, which is beneficial to reducing the possibility of a virtual connection between the grounding portion 112 of the metal bracket 110 and the metal middle frame 31, resulting in grounding failure or poor grounding.

[0124] In some examples, the conductive connector 400 includes a pressing portion 410 and a transition portion 420. The transition portion 420 is threadedly connected to the metal middle frame 31, which can facilitate the assembly of the transition portion 420 and the metal middle frame 31, and also ensure that the connection state between the transition portion 420 and the metal middle frame 31 is stable. The pressing portion 410 of the conductive connector 400 abuts against the grounding portion 112 of the metal bracket 110. The pressing portion 410 of the conductive connector 400 applies compressive stress to the grounding portion 112 of the metal bracket 110, so that the pressing portion 410 of the conductive connector 400 maintains a close contact state with the grounding portion 112 of the metal bracket 110, thereby ensuring a stable connection state.

[0125] Exemplarily, the grounding portion 112 of the metal bracket 110 is spaced apart from the conductive member 120. The grounding portion 112 of the metal bracket 110 is positioned close to the conductive member 120 to shorten the transmission path of the grounding current. The grounding portion 112 of the metal bracket 110 has a mounting hole. The adapter portion 420 of the conductive connector 400 can pass through the mounting hole of the grounding portion 112 and connect to the metal middle frame 31.

[0126] For example, the number of conductive connectors 400 can be two or more. The number of grounding portions 112 of the metal bracket 110 can be two or more. The conductive connectors 400 and the grounding portions 112 of the metal bracket 110 can be provided in a one-to-one correspondence. The two or more conductive connectors 400 can all be used to carry ground current, thereby effectively increasing the number of grounding paths, facilitating current dispersion, and further reducing current loss.

[0127] In some examples, the metal bracket 110 includes a protrusion. The protrusion protrudes toward the metal middle frame 31. For example, the protrusion protrudes toward the middle plate 312 of the metal middle frame 31. The protrusion forms the grounding portion 112. The pressing portion 410 presses against the surface of the protrusion facing away from the metal middle frame 31. The protrusion of the metal bracket 110 contacts the metal middle frame 31. After the transition portion 420 of the conductive connector 400 is connected to the metal middle frame 31, the pressing portion 410 presses the protrusion, thereby achieving grounding of the metal bracket 110 and the metal middle frame 31.

[0128] Exemplarily, a recessed portion is formed in an area on the metal bracket 110 corresponding to the protruding portion, and at least a portion of the pressing portion 410 is located in the recessed portion of the metal bracket 110 .

[0129] In the embodiment of the present application, the second circuit board 80 can be located inside the metal bracket 110. The metal bracket 110 can limit the second circuit board 80, improving the positional stability of the second circuit board 80. The grounding portion 112 of the metal bracket 110 is electrically connected to the second circuit board 80. The grounding portion 112 of the metal bracket 110 is grounded through the second circuit board 80. The second circuit board 80 can perform both component mounting and grounding functions, allowing the second circuit board 80 to be reused, reducing the difficulty of grounding structure design, assembly difficulty, and production costs.

[0130] In some examples, the charging port 90 can be electrically connected to the second circuit board 80. The second circuit board 80 is a printed circuit board. The second circuit board 80 can serve as a sub-board.

[0131] In some examples, the grounding portion 112 of the metal bracket 110 is electrically connected to the metal middle frame 31 and the second circuit board 80, respectively, to achieve grounding through the metal middle frame 31 and the second circuit board 80. This effectively increases the number of grounding paths, helps disperse current, and further reduces current loss. The second circuit board 80 includes a grounding point. The grounding portion 112 of the metal bracket 110 is electrically connected to the grounding point of the second circuit board 80.

[0132] In the embodiment of the present application, the main body 111 of the metal bracket 110 and the metal reinforcement 200 are in a non-electrically connected state, that is, in an insulated state from each other, to avoid the problem of the metal bracket 110 and the metal reinforcement 200 being electrically connected and interfering with the signal transmitted in the first circuit board 70. Along the thickness direction Z of the electronic device 10, there can be a gap between the main body 111 of the metal bracket 110 and the metal reinforcement 200, so that the main body 111 of the metal bracket 110 and the metal reinforcement 200 do not contact each other. An insulator (not shown in the figure) can be provided on the surface of the main body 111 of the metal bracket 110 facing the metal reinforcement 200. The insulator can insulate and separate the main body 111 of the metal bracket 110 and the metal reinforcement 200.

[0133] In some examples, the surface of the metal bracket 110 is sprayed with insulating paint to form an insulator.

[0134] In the description of the embodiments of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they may refer to a fixed connection, an indirect connection via an intermediate medium, internal communication between two components, or an interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in the embodiments of this application based on specific circumstances.

[0135] The embodiments of the present application do not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore should not be understood as limiting the embodiments of the present application. In the description of the embodiments of the present application, the meaning of "plurality" is more than two, unless otherwise specifically specified.

[0136] The terms "first", "second", "third", "fourth", etc. (if any) in the specification and claims of the embodiments of the present application and the above-mentioned drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or sequential order. It should be understood that the data used in this way can be interchangeable where appropriate, so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described here. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device comprising a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, systems, products or devices.

[0137] The term "plurality" in this document refers to two or more. The term "and / or" in this document simply describes a relationship between related objects, indicating that three possible relationships exist. For example, "A and / or B" can represent: A alone, A and B together, or B alone. Furthermore, the character " / " in this document generally indicates an "or" relationship between the related objects; in a formula, the character " / " indicates a "division" relationship between the related objects.

[0138] It will be understood that the various numerical numbers involved in the embodiments of the present application are merely distinctions for the convenience of description and are not intended to limit the scope of the embodiments of the present application.

[0139] It can be understood that in the embodiments of the present application, the size of the serial numbers of the above-mentioned processes does not mean the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present application.

Claims

1. An electronic device, characterized in that, include: Charging port; a first circuit board, comprising a connection end, the connection end having a ground terminal, the connection end being electrically connected to the charging port; a metal reinforcement piece, stacked with the connection end, the metal reinforcement piece being electrically connected to the ground terminal; The bracket assembly includes a metal bracket and a conductive member, at least part of the connection end is located in the metal bracket, the metal bracket includes a main body and a grounding part, the grounding part is electrically connected to the main body, the metal reinforcement and the main body are respectively electrically connected to the conductive member, and the grounding part is used for grounding.

2. The electronic device according to claim 1, wherein The metal reinforcement is arranged between the main body and the connecting end, and the conductive member is arranged between the metal reinforcement and the main body.

3. The electronic device according to claim 2, wherein At least one of the metal reinforcement and the main body is provided with a recess, and at least a portion of the conductive member is located in a space formed by the recess.

4. The electronic device according to claim 3, wherein The main body is provided with the recess, and the recess has an opening facing the metal reinforcement, and a surface of the metal reinforcement facing the recess is a plane.

5. The electronic device according to any one of claims 1 to 4, characterized in that One of the metal reinforcing member and the main body is welded to the conductive member, and the other is in contact with the conductive member.

6. The electronic device according to any one of claims 1 to 5, characterized in that, The conductive member is an elastic structural member, and the metal reinforcement member and the main body respectively apply compressive stress to the conductive member.

7. The electronic device according to claim 6, wherein The conductive member is a metal structural member, comprising a base and elastic legs. One of the metal reinforcement member and the main body is connected to the base, and the other is connected to the elastic legs.

8. The electronic device according to claim 7, characterized in that, One of the metal reinforcement and the main body is welded to the base, and the other is in contact with the elastic leg.

9. The electronic device according to claim 7 or 8, characterized in that, The number of the elastic supporting legs is more than two.

10. The electronic device according to any one of claims 1 to 9, characterized in that, The conductive member is a metal spring.

11. The electronic device according to any one of claims 1 to 10, characterized in that, The first circuit board is a flexible circuit board.

12. The electronic device according to any one of claims 1 to 11, characterized in that, The charging interface includes a ground pin, the ground terminal is electrically connected to the ground pin, and the metal reinforcement is electrically connected to the ground pin.

13. The electronic device according to claim 12, wherein The grounding terminal includes a via hole and a metal pad. The metal pad is arranged in the via hole. The metal pad has a central through hole. The grounding pin passes through the central through hole. The grounding pin is welded to the metal pad.

14. The electronic device according to claim 13, wherein The metal reinforcement has a avoidance hole, which is arranged corresponding to the central through hole of the metal pad. The grounding pin is passed through the avoidance hole, and the grounding pin is welded to the metal reinforcement.

15. The electronic device according to any one of claims 1 to 14, characterized in that, The electronic device further includes a metal middle frame, the grounding portion is electrically connected to the metal middle frame, and the grounding portion is grounded through the metal middle frame.

16. The electronic device according to claim 15, characterized in that, The electronic device further includes a conductive connector, and the grounding portion is connected to the metal middle frame via the conductive connector.

17. The electronic device according to claim 16, wherein The conductive connecting member includes a pressing portion and a transition portion, the transition portion is threadedly connected to the metal middle frame, and the pressing portion abuts against the grounding portion.

18. The electronic device according to claim 17, wherein The metal bracket includes a protruding portion, which protrudes toward the metal middle frame and forms the grounding portion. The pressing portion presses against a surface of the protruding portion that faces away from the metal middle frame.

19. The electronic device according to any one of claims 1 to 18, characterized in that, The electronic device further includes a second circuit board, the second circuit board is located inside the metal bracket, the metal bracket forms a limit on the second circuit board, the grounding portion is electrically connected to the second circuit board, and the grounding portion is grounded through the second circuit board.

20. The electronic device according to any one of claims 1 to 19, characterized in that, The electronic device further includes a second circuit board, a battery, and a main board. The battery is disposed between the second circuit board and the main board. The battery is disposed on one side of the first circuit board, and the first circuit board is electrically connected to the main board.

21. The electronic device according to claim 19 or 20, characterized in that, The electronic device further includes a metal middle frame, the second circuit board is connected to the metal middle frame, and the second circuit board is a printed circuit board.

22. The electronic device according to any one of claims 1 to 21, characterized in that, An insulator is disposed on the surface of the main body portion facing the metal reinforcement member.

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