Semiconductor device and power conversion device using same

Abstract

The purpose of the present invention is to provide: a semiconductor device which makes it possible to reduce size and reduce the number of components; and a power conversion device using the same. The present semiconductor device is characterized in that a first MOSFET and a second MOSFET are disposed so as to be adjacent to each other, and the present semiconductor device comprises, on a lead frame, a first control element and a first capacitor which are associated with the first MOSFET and a second control element and a second capacitor which are associated with the second MOSFET. Alternatively, the present power conversion device has disposed therein a semiconductor device in which a first MOSFET and a second MOSFET are disposed so as to be adjacent to each other and which comprises, on a lead frame, a first control element and a first capacitor which are associated with the first MOSFET and a second control element and a second capacitor which are associated with the second MOSFET.

Description

Semiconductor device and power conversion device using the same

[0001] The present invention relates to a semiconductor device and a power conversion device using the same.

[0002] Power semiconductor modules, which form bridge circuits using multiple semiconductor elements and have power conversion functions, are used in a wide range of products, from social infrastructure such as railway vehicles and renewable energy power generation systems to products closely related to personal life such as outdoor units of air conditioners.

[0003] Against the backdrop of social demands, including environmental and resource issues, there is a demand for even higher efficiency in these power semiconductor modules.

[0004] Background art in this technical field includes, for example, technology such as that disclosed in Patent Document 1. Patent Document 1 discloses a "semiconductor device that can be easily assembled and has low loss."

[0005] Furthermore, Patent Document 2 discloses a "single in-line bridge diode for efficiently dissipating heat generated by a semiconductor chip."

[0006] JP 2015-116053 A JP 2002-26245 A

[0007] Unlike asynchronous rectifiers, synchronous rectifiers are packaged elements consisting of a MOSFET, a capacitor, and a control element. By reviewing the structure of the synchronous rectifier element that contains these four elements, it is hoped that the mounting size can be reduced and the number of components can be reduced.

[0008] An object of the present invention is to provide a semiconductor device that can be made smaller and has a reduced number of parts, and a power conversion device using the same.

[0009] The semiconductor device of the present invention is characterized in that a first MOSFET and a second MOSFET are arranged adjacent to each other, and a first control element and a first capacitor corresponding to the first MOSFET, and a second control element and a second capacitor corresponding to the second MOSFET are provided on a lead frame.

[0010] The power conversion device of the present invention has a first MOSFET and a second MOSFET arranged adjacent to each other, and a semiconductor device having a first control element and a first capacitor corresponding to the first MOSFET, and a second control element and a second capacitor corresponding to the second MOSFET, arranged on a lead frame.

[0011] According to the present invention, it is possible to provide a semiconductor device that can be made smaller and has a reduced number of parts, and a power conversion device using the same.

[0012] Problems, configurations, and effects other than those described above will become apparent from the following description of the embodiments.

[0013] 1A and 1B are diagrams showing the structure of a semiconductor device according to an embodiment of the present invention, a diagram showing the structure of a power converter using the semiconductor device according to an embodiment of the present invention, and a diagram showing the structure of a power converter that is a comparative example to the embodiment of the present invention.

[0014] Hereinafter, an embodiment of the present invention will be described with reference to the drawings. In the drawings, the same components are designated by the same reference numerals, and detailed description of overlapping parts will be omitted.

[0015] The structure of the semiconductor device according to this embodiment is shown in Fig. 1. As shown in Fig. 1, a source block 4 and a MOSFET 1 are arranged. Also, a package 7 containing the MOSFET 1 is arranged.

[0016] The two MOSFETs 1 are arranged adjacent to each other, and a control IC 2 and a capacitor 3, which are control elements corresponding to the MOSFETs 1, are also arranged.

[0017] If the upper part of the figure is represented as the first part and the lower part as the second part, then the upper part of the figure is arranged with a first MOSFET 1, a control IC 2 which is a first control element corresponding to the first MOSFET 1, and a first capacitor 3. The lower part of the figure is arranged with a second MOSFET 1, a control IC 2 which is a second control element corresponding to the second MOSFET 1, and a second capacitor 3. In other words, two sets of MOSFET 1, a control IC 2 which is a control element corresponding to MOSFET 1, and a first capacitor 3 are integrated to form a single element. The first MOSFET 1 and the second MOSFET 1 are arranged adjacent to each other.

[0018] One package 7 contains one MOSFET 1, one control IC 2, and one capacitor 3. The package 7 and other components are sealed with sealing resin 8.

[0019] In this embodiment, two sets of MOSFETs 1 and the corresponding control ICs 2 and capacitors 3 are appropriately arranged and integrated. Since the two sets are integrated in this way, the number of parts can be reduced.

[0020] Furthermore, the two MOSFETs 1 arranged adjacent to each other are configured so that wiring is avoided in the portion that is not to be divided into individual pieces, i.e., no wiring is provided between the upper and lower portions in the drawing.

[0021] Next, Fig. 2 shows the structure of a power converter using the semiconductor device according to this embodiment. This is an example in which two elements of the present invention are mounted. The semiconductor device of Fig. 1 is applied to a power converter.

[0022] A package 7 incorporating a MOSFET 1 is placed on a lead frame 5 and fixed to the lead frame 5 with clips 6 .

[0023] A package 7 incorporating a MOSFET 1 is placed on the lead frame 5 to which the AC input terminal 11 is connected, and is fixed to the lead frame 5 with clips 6. Similarly, a package 7 incorporating a MOSFET 1 is placed on the lead frame 5 to which the AC input terminal 12 is connected, and is fixed to the lead frame 5 with clips 6.

[0024] It is assumed that the packages 7 are arranged so that they face the lead frame 5 side.

[0025] The package 7 on the lead frame 5 to which the DC output terminal (+) 13 is connected is fixed to the lead frame 5 with clips 6, and the same sides of the package 7 are electrically connected via the clips 6 to the lead frame 5 to which the AC input terminal 11 is connected and the lead frame 5 to which the AC input terminal 12 is connected.

[0026] Furthermore, the package 7 on the lead frame 5 to which the AC input terminal 11 is connected and the package 7 on the lead frame 5 to which the AC input terminal 12 is connected are each fixed to the lead frame 5 with clips 6, and the same surface of the package 7 is electrically connected via the clip 6 to the lead frame 5 to which the DC output terminal (-) 14 is connected.

[0027] The package 7 , lead frame 5 and clip 6 are resin-sealed with sealing resin 8 .

[0028] In this embodiment, the two MOSFETs 1 are arranged adjacent to each other, so that the length t1 in FIG. 2 can be increased, and the element can be made smaller.

[0029] Fig. 3 shows a power converter structure that is a comparative example of this embodiment. The elements in this comparative example are rotated by 90° from those in Fig. 2 of this embodiment. This is an example in which four elements are mounted.

[0030] Two packages 7 each containing a built-in MOSFET 1 are placed on a lead frame 5 and are fixed to the lead frame 5 with clips 6. One package 7 each containing a built-in MOSFET 1 is placed on the lead frame 5 to which an AC input terminal 11 is connected and is fixed to the lead frame 5 with the clip 6.

[0031] Similarly, one package 7 incorporating MOSFET 1 is placed on lead frame 5 to which AC input terminal 12 is connected, and is fixed to lead frame 5 with clips 6. The four packages 7 are arranged so that the same side faces lead frame 5. The two packages 7 on lead frame 5 to which DC output terminal (+) 13 is connected are fixed to lead frame 5 with clips 6, and the same side of the package 7 is electrically connected via the clips 6 to the lead frame 5 to which AC input terminal 11 and the lead frame 5 to which AC input terminal 12 are connected, respectively.

[0032] Furthermore, the package 7 on the lead frame 5 to which the AC input terminal 11 is connected and the package 7 on the lead frame 5 to which the AC input terminal 12 is connected are each fixed to the lead frame 5 with clips 6, and the same surface of the package 7 is electrically connected via the clip 6 to the lead frame 5 to which the DC output terminal (-) 14 is connected.

[0033] All of the packages 7 , lead frames 5 and clips 6 are sealed with sealing resin 8 .

[0034] In this comparative example, two MOSFETs 1 are connected via a control IC 2 and a capacitor 3. t2 in Fig. 3 is shorter than t1 in Fig. 2, and the element is larger.

[0035] Here, a comparative example of Fig. 3 will be compared with the present embodiment of Fig. 1 and Fig. 2. In this embodiment, the lead frame 5 is provided with terminals that can be output to the outside, and wiring is avoided in advance in the frame portion that will be connected in the portion that will not be singulated. The frame portion that will be connected in the portion that will not be singulated is avoided in advance and is provided with terminals that can be output to the outside in the lead frame 5, making the arrangement of this embodiment possible.

[0036] In this embodiment, one MOSFET 1, one control IC 2, and one capacitor 3 are combined into one set, and the two sets are integrated to reduce the number of components to one. In other words, the number of components mounted can be halved to two, compared to the four components mounted in the lead frame structure used for the package structure element in the comparative example. As described above, miniaturization and a reduction in the number of mounted components can be achieved.

[0037] REFERENCE SIGNS LIST 1 MOSFET 2 Control IC 3 Capacitor 4 Source block 5 Lead frame 6 Clip 7 Package 8 Sealing resin 10 Semiconductor device 11 AC input terminal 12 AC input terminal 13 DC output terminal (+) 14 DC output terminal (-)

Claims

1. A semiconductor device, wherein a first MOSFET and a second MOSFET are arranged adjacent to each other, and a first control element and a first capacitor corresponding to the first MOSFET, and a second control element and a second capacitor corresponding to the second MOSFET are provided on a lead frame.

2. The semiconductor device according to claim 1, wherein a terminal capable of external output is provided on the lead frame.

3. The semiconductor device according to claim 1, wherein a terminal capable of external output is provided on the lead frame, and wiring is avoided between the adjacent first MOSFET and the second MOSFET.

4. A power conversion device using a semiconductor device, wherein a first MOSFET and a second MOSFET are arranged adjacent to each other, and a first control element and a first capacitor corresponding to the first MOSFET, and a second control element and a second capacitor corresponding to the second MOSFET are provided on a lead frame.

5. The power conversion device according to claim 4, wherein a terminal capable of external output is provided on the lead frame.

6. The power conversion device according to claim 4, wherein a terminal capable of external output is provided on the lead frame, and wiring is avoided between the adjacent first MOSFET and the second MOSFET.

Images