Sensing apparatus for acquiring motion signal of target object and wearable device

Abstract

Provided are a sensing apparatus (100) for acquiring a motion signal of a target object, and a wearable device comprising the sensing apparatus (100). The sensing apparatus (100) comprises a first sensitive unit (120) arranged on a first side (110-a) of a flexible substrate (110) facing the target object. By means of a first conductive channel (111) arranged on the flexible substrate (110), an electrical signal generated by the first sensitive unit (120) is conducted to a target position (A), wherein the target position (A) is farther away from the target object than the first side (110-a), such that a connection position between the sensing apparatus (100) and an external circuit can be away from the first side (110-a), allowing the first side (110-a) of the sensing apparatus (100) facing the target object to remain flat, avoiding uneven deformation of the first sensitive unit (120) on the first side (110-a), and thus improving operational stability of the sensing apparatus (100). Moreover, the flatness of the first side (110-a) can also reduce foreign body sensation during the wearing of the sensing apparatus (100) and enhance the wearing comfort of the sensing apparatus (100).

Description

A sensor device and wearable device for collecting motion signals of a target object Technical Field

[0001] This specification relates to the field of sensing technology, and in particular to a sensing device and a wearable device. Background Art

[0002] With the increasing popularity of wearable devices, wearable flexible and stretchable sensing devices suitable for integration into smart clothing (such as clothes, pants, gloves, shoes, etc.) are gaining more and more applications. In specific scenarios, the connection between the sensing device and the external circuit must be considered, but this connection may affect the reliability and comfort of the sensing device.

[0003] Therefore, it is desired to provide a sensing device for collecting motion signals of a target object with high working stability and good wearing comfort, and a wearable device including the sensing device.

[0004] Summary of the Invention

[0005] One of the embodiments of the present specification provides a sensing device for collecting motion signals of a target object, comprising: a flexible substrate, comprising a first side facing the target object; a first sensitive unit, for detecting the target object and generating an electrical signal, the first sensitive unit being arranged on the first side of the flexible substrate; wherein the flexible substrate is provided with a first conductive channel, the first conductive channel being used to conduct the electrical signal generated by the first sensitive unit to a target position, the target position being further away from the target object relative to the first side.

[0006] One of the embodiments of this specification further provides a wearable device for collecting motion signals of a target object, which includes the sensing device as described above. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] This specification will be further described in the form of exemplary embodiments, which will be described in detail with reference to the accompanying drawings. These embodiments are not limiting, and in these embodiments, like numbers represent like structures, wherein:

[0008] FIG1 is a schematic diagram of an exemplary structure of a sensing device according to some embodiments of this specification;

[0009] FIG2 is another exemplary structural diagram of a sensing device according to some embodiments of this specification;

[0010] FIG3 is another exemplary structural diagram of a sensing device according to some embodiments of this specification;

[0011] FIG4 is another exemplary structural diagram of a sensing device according to some embodiments of this specification;

[0012] FIG5 is another exemplary structural diagram of a sensing device according to some embodiments of this specification;

[0013] FIG6 is another exemplary structural diagram of a sensing device according to some embodiments of this specification;

[0014] FIG. 7 is another exemplary structural diagram of a sensing device according to some embodiments of this specification. DETAILED DESCRIPTION

[0015] In order to more clearly illustrate the technical solutions of the embodiments of this specification, the following is a brief introduction to the drawings required for the description of the embodiments. Obviously, the drawings described below are only some examples or embodiments of this specification. For ordinary technicians in this field, this specification can also be applied to other similar scenarios based on these drawings without paying any creative work. It should be understood that these exemplary embodiments are provided only to enable technicians in the relevant fields to better understand and implement this specification, and do not limit the scope of this specification in any way. Unless it is obvious from the language environment or otherwise explained, the same reference numerals in the figures represent the same structure or operation.

[0016] As used in this specification and claims, unless the context clearly indicates an exception, the words "a", "an", "an" and / or "the" do not specifically refer to the singular and may also include the plural, unless the context clearly indicates an exception. Generally speaking, the terms "include" and "comprise" only indicate the inclusion of the steps and elements that have been explicitly identified, and these steps and elements do not constitute an exclusive list. The method or apparatus may also include other steps or elements. The term "based on" means "at least in part based on." The term "one embodiment" means "at least one embodiment"; the term "another embodiment" means "at least one other embodiment."

[0017] In the description of this specification, it should be understood that the terms "front", "rear", "ear hook", "rear hook", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of describing this specification and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they cannot be understood as limitations on this specification.

[0018] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. Throughout this specification, "plurality" means at least two, such as two or three, unless otherwise specifically defined.

[0019] In this specification, unless otherwise specified or limited, the terms "mounted," "connected," "connect," "fixed," etc. should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection or electrical connection; direct connection or indirect connection through an intermediate medium; internal communication between two components or interaction between two components, unless otherwise specified. Those skilled in the art will understand the specific meanings of the above terms in this specification based on specific circumstances.

[0020] Some embodiments of the present specification provide a sensing device comprising a first sensitive unit disposed on a first side surface of a flexible substrate facing a target object. An electrical signal generated by the first sensitive unit is conducted to a target location via a first conductive path disposed on the flexible substrate, where the target location is further away from the target object than the first side surface. This allows the connection point between the sensing device and an external circuit to be further away from the first side surface, allowing the first side surface of the sensing device facing the target object to remain flat, thereby preventing uneven deformation of the first sensitive unit on the first side surface and improving the operating stability of the sensing device. Furthermore, maintaining a flat first side surface can reduce the foreign body sensation when the sensing device is worn, thereby improving the wearing comfort of the sensing device.

[0021] Some embodiments of this specification provide a wearable device for collecting motion signals of a target object, which includes the above-mentioned sensing device. The wearable device can have high working stability and wearing comfort.

[0022] Figure 1 is a schematic diagram of an exemplary structure of a sensing device according to some embodiments of this specification. As shown in Figure 1 , some embodiments of this specification provide a sensing device 100, which includes a flexible substrate 110 and a first sensitive unit 120. Flexible substrate 110 serves as the mounting base for sensing device 100, and first sensitive unit 120 is mounted on flexible substrate 110.

[0023] The first sensitive unit 120 can be used to detect a target object and generate an electrical signal. In some embodiments, the target object refers to the subject of the motion signal collected by the sensing device 100. In some embodiments, the target object may include, but is not limited to, a human body, a portion of a human body, a movable object, etc. For example, the target object may be a human finger, a human palm, a motion simulation robot arm, etc.

[0024] In some embodiments, the first sensitive unit 120 can undergo corresponding deformation in response to the movement of the target object, thereby generating a corresponding electrical signal. By processing and analyzing the electrical signal, information such as the movement process and movement posture of the target object can be obtained. In some embodiments, the first sensitive unit 120 can also directly read the relevant signals of the target object. Exemplarily, the first sensitive unit 120 may include a collection electrode. When the target object is a human body, the collection electrode can be attached to the skin of the human body, thereby collecting the myoelectric signal of the human body as an electrical signal output; when the target object is a mechanical structure, the collection electrode can be connected to the control circuit of the mechanical structure, thereby collecting the signal in the control circuit as an electrical signal output.

[0025] In some embodiments, the first sensitive unit 120 can be arranged on the first side 110-a of the flexible substrate 110 facing the target object, so that the movement of the target object can be directly transmitted to the first sensitive unit 120 to cause it to deform, so that the deformation of the first sensitive unit 120 can be more consistent with the movement of the target object, so that the sensing device 100 has higher working accuracy.

[0026] In some embodiments, the first sensitive unit 120 may include but is not limited to a capacitive structure, a resistive structure, an inductive structure, etc. For details, please refer to the relevant descriptions of the subsequent Figures 1-7.

[0027] In some embodiments, the flexible substrate 110 includes a second side 110-b opposite to the first side 110-a, and the sensing device may further include a second sensitive unit (such as the second sensitive unit 140 shown in Figure 1) provided on the second side. By providing the second sensitive unit, the second sensitive unit can also collect information for the target object and generate an electrical signal accordingly. The electrical signal generated by the second sensitive unit can be combined with and compared with the electrical signal generated by the first sensitive unit to improve the measurement accuracy of the sensing device. For example, by performing differential processing on the electrical signals generated by the first sensitive unit and the second sensitive unit, the noise signal generated by the wrinkles of the flexible substrate 110 can be eliminated. In some embodiments, the structure of the second sensitive unit may be the same as or different from that of the first sensitive unit. In some embodiments, in order to reduce the difference between the electrical signal generated by the second sensitive unit and the electrical signal generated by the first sensitive unit, thereby improving the working stability and measurement accuracy of the sensing device, the structure of the second sensitive unit may be the same as that of the first sensitive unit. For more information about the second sensitive unit, please refer to Figures 1 to 6 and their related descriptions, which will not be repeated here.

[0028] The flexible substrate 110 can provide a mounting platform for other components of the sensor device 100 (e.g., the first sensitive unit 120). In some embodiments, the flexible substrate 110 can be elastic so that it can deform and bend accordingly with the movement of the target object, thereby accurately reflecting the movement of the target object.

[0029] In some embodiments, the flexible substrate 110 may be made of an insulating elastic material, such as PDMS (Polydimethylsiloxane), silicone, or TPU (Thermoplastic polyurethanes). Using an insulating elastic material allows the flexible substrate 110 to have both insulating and elastic properties, thereby reducing the impact of deformation on the first sensitive unit 120 and preventing interference with the electrical signals generated by the first sensitive unit 120.

[0030] In some embodiments, the flexible substrate 110 is provided with a first conductive channel 111. One end of the first conductive channel 111 is electrically connected to the first sensitive unit 120, and the other end of the first conductive channel 111 extends to a target location (e.g., area A in FIG1 ). The first conductive channel 111 can be used to conduct the electrical signal generated by the first sensitive unit 120 to the target location (as shown in FIG1 ).

[0031] 1 , in some embodiments, the direction from the sensor device 100 pointing to the target object is set as the X direction, and the extending direction of the flexible substrate 110 is set as the Y direction. Then, the first conductive channel 111 is extended along the X direction.

[0032] In some embodiments, the target position may refer to a position for connecting other circuits (e.g., the processing circuit 152 shown in FIG1 , or an external circuit, etc.) to conduct the electrical signal generated by the first sensitive unit 120 to the corresponding circuit for processing or output. In some embodiments, the target position is farther away from the target object relative to the first side 110 - a, that is, the distance between the target position and the target object in the X direction is greater than the distance between the first side 110 - a and the target object, so that the first side 110 - a can remain flat, avoid uneven deformation of the first sensitive unit 120, improve the working stability of the sensing device 100, and reduce the foreign body sensation when the sensing device 100 is worn, thereby improving the wearing comfort of the sensing device 100. For example, the target position may be located at the second side 110 - b of the flexible substrate 110 away from the target object, such as the position of area B shown in FIG2 , FIG4 , and FIG6 . For another example, the target position may be located between the first side 110 - a and the second side 110 - b, such as the position of area A shown in FIG1 , FIG3 , and FIG5 .

[0033] In some embodiments, the flexible substrate 110 may be provided with a first hole (not shown), which may be filled with a flexible conductive material to form a first conductive channel 111. This allows the first conductive channel 111 to deform to match the deformation of the flexible substrate 110, thereby avoiding obstruction of the deformation of the first sensitive unit 120. In some embodiments, the flexible substrate 110 may also be directly provided with a flexible conductor (e.g., a wire), which directly constitutes the corresponding conductive channel.

[0034] In some embodiments, the flexible conductive material refers to a material that has both electrical conductivity and elasticity. In some embodiments, the flexible conductive material may include but is not limited to conductive silicone, graphene, carbon nanotubes, metal nanowires, etc.

[0035] In some embodiments, the first hole portion can be cut on the flexible substrate 110 by laser or mechanical cutting.

[0036] If the first hole is too large, more flexible conductive material will be used, resulting in higher costs. Furthermore, because the flexible conductive material may be made of a different material than the flexible substrate 110, the first conductive channel 111 may interfere with the deformation of the flexible substrate 110 and the first sensitive unit 120. If the first hole is too small, processing becomes more difficult, and the conductive performance of the first conductive channel 111 may be poor, potentially affecting the transmission of the electrical signal generated by the first sensitive unit 120.

[0037] To save costs and reduce the impact of the first conductive channel 111 on the deformation of the flexible substrate 110 and the deformation of the first sensitive unit 120, while ensuring the electrical signal conduction performance of the first conductive channel 111, in some embodiments, the diameter of the first hole portion can be 0.7mm-1.3mm. In some embodiments, to further save material costs, the diameter of the first hole portion can be 0.8mm-1.2mm. In some embodiments, to further reduce processing difficulty, the diameter of the first hole portion can be 0.9mm-1.1mm. For example, the diameter of the first hole portion can be 1mm.

[0038] In some embodiments, the sensing device 100 may further include a derivation circuit 150 disposed at a target location. The derivation circuit 150 may receive and process or derivate the electrical signal generated by the first sensing unit 120. Accordingly, the target location may be the location of the derivation circuit 150 in the X direction or the location of the connection point between the sensing unit and the derivation circuit.

[0039] In some embodiments, first conductive channel 111 forms a first end (not shown) on first side surface 110 - a , electrically connected to an electrode of first sensitive unit 120 ; first conductive channel 111 forms a second end (not shown) at a target location, electrically connected to derivation circuit 150 . The electrical signal generated by first sensitive unit 120 is conducted to derivation circuit 150 via first conductive channel 111 . For details, please refer to the subsequent descriptions of FIG. 1 to FIG. 6 .

[0040] In some embodiments, the location of the derivation circuit 150 varies depending on the target location. For example, when the target location is located in the middle between the first side 110-a and the second side 110-b of the flexible substrate 110 (i.e., region A), the derivation circuit 150 is also correspondingly located in the middle of the flexible substrate 110, as shown in Figures 1, 3, and 5. For another example, when the target location is located in the second side 110-b of the flexible substrate 110 (i.e., region B), the derivation circuit 150 is also correspondingly located on the second side 110-b, as shown in Figures 2, 4, and 6.

[0041] In some embodiments, the derivation circuit 150 may include a circuit board (e.g., the circuit board 151 shown in FIG. 1 ) or a wire (e.g., the wire 655 shown in FIG. 4 ). The circuit board may be used to receive the electrical signal generated by the first sensitive unit 120 and process or derive it. By directly processing the electrical signal generated by the first sensitive unit 120 (e.g., filtering and denoising, merging with other electrical signals, time domain and frequency domain analysis to predict change trends, etc.), the sensing device 100 may not need to be connected to a processor, and the signal output by the sensing device 100 may directly characterize the movement of the target object, or the sensing device 100 may output the electrical signal after preliminary processing for subsequent further processing. The wire may directly derive the electrical signal generated by the first sensitive unit 120. The arrangement position and routing direction of the wire are flexible and changeable, which may reduce the complexity of the internal structure of the sensing device 100 and simplify the difficulty of installation design.

[0042] In some embodiments, the circuit board can be used to connect to an external circuit (e.g., via a solder pad) to output the electrical signal generated by the first sensitive unit 120. In some embodiments, other components (e.g., processing circuit 152) can also be provided on the circuit board to process the first sensitive unit 120.

[0043] In some embodiments, when the export circuit 150 is arranged in the middle position between the first side 110-a and the second side 110-b of the flexible substrate 110, the circuit board (for example, the circuit board 151) extends into the interior of the flexible substrate 110 (as shown in Figure 1). In order to avoid the circuit board from hindering the deformation of the flexible substrate 110 and the first sensitive unit 120, the circuit board can adopt a flexible FPC (Flexible Printed Circuit).

[0044] In other embodiments, when the derivation circuit 150 is disposed on the second side surface 110-b of the flexible substrate 110, the circuit board is disposed outside the flexible substrate 110 (as shown in FIG2 , the circuit board 451 is located outside the flexible substrate 410). In this manner, the second sensitive unit located on the second side surface can be connected to the derivation circuit without requiring a conductive path provided on the flexible substrate 110, thereby avoiding the need for excessive conductive paths on the flexible substrate 110. This simplifies the production process and improves the overall flexibility of the flexible substrate 110. When the circuit board 151 of the derivation circuit 150 is located outside the flexible substrate 110, the circuit board can optionally be a rigid PCB (Printed Circuit Board) or a flexible FPC.

[0045] In some other embodiments, the derivation circuit may also correspond to two different target positions at the same time, and the first sensitive unit and the second sensitive unit may respectively conduct their respective electrical signals to the two different target positions. For example, when the derivation circuit includes a circuit board, one side of the circuit board may correspond to one target position, and the first sensitive unit may conduct the electrical signal to the one target position; the other side of the circuit board may correspond to another target position, and the second sensitive unit may conduct the electrical signal to the other target position. The one target position may be located between the first side 110-a and the second side 110-b, and the other target position may be located on the second side 110-b. For details, please refer to the relevant content of Figure 7.

[0046] 1 , in some embodiments, a circuit board 151 may include a flexible area and a non-flexible area. The flexible area is disposed at a target location, and a processing circuit (eg, the processing circuit 152 in FIG. 1 ) may be disposed in the non-flexible area.

[0047] A flexible region refers to an area that can be elastically deformed and bent, while an inflexible region refers to a rigid region. In some embodiments, to prevent the inflexible region of the circuit board from obstructing the deformation of the flexible substrate 110, the projection of the inflexible region on the target object is located outside the projection of the first sensitive unit 120 on the target object. For illustrative purposes, in the direction from the sensing device 100 toward the target object (i.e., the X direction), the first sensitive unit 120 has a first projection on the target object (e.g., segment CD in FIG. 1 ), and the circuit board 151 has a second projection on the target object (e.g., segment EF in FIG. 1 ). The region corresponding to the portion of the second projection within the first projection (e.g., segment ED in FIG. 1 ) can be considered the flexible region of the circuit board 151, while the region corresponding to the portion of the second projection outside the first projection (e.g., segment DF in FIG. 1 ) can be considered the inflexible region of the circuit board 151. For example, when the target location is between the first side 110 - a and the second side 110 - b (e.g., region A shown in FIG. 1 ), the flexible region can be the portion of the circuit board 151 within the flexible substrate 110, and the inflexible region can be the portion of the circuit board 151 outside the flexible substrate 110. In some embodiments, the flexible area of ​​the circuit board may adopt a flexible FPC, and the non-flexible area may adopt a rigid PCB.

[0048] The flexible area can bend elastically and deform accordingly with the deformation of the first sensitive unit 120 and the flexible substrate 110, so as to avoid obstructing the deformation of the first sensitive unit 120 and the flexible substrate 110, resulting in inaccurate motion measurement of the target object by the sensing device 100. The non-flexible area can provide rigid support for the processing circuit 152, while providing an installation position for the processing circuit 152 and preventing the processing circuit 152 from being bent and damaged. On the other hand, the setting of the flexible area and the non-flexible area can also make the stress concentration point of the circuit board 151 located in the non-flexible area, so that the projection of the stress concentration point of the circuit board 151 on the target object is located outside the first projection of the first sensitive unit 120 on the target object, so that the circuit board 151 has less influence on the deformation of the first sensitive unit 120 and the flexible substrate 110, thereby improving the working stability and accuracy of the sensing device 100.

[0049] In some embodiments, the non-flexible region of the circuit board 151 may further be provided with a soldering pad 154 , and the circuit board 151 may be electrically connected to an external circuit via the soldering pad 154 .

[0050] In some embodiments, the non-flexible region may be further provided with a reinforcing plate 153, which may be made of a rigid material (e.g., a stainless steel sheet, a ceramic sheet, etc.). The reinforcing plate 153 may further support the non-flexible region and reduce the probability of damage to the processing circuit 152 due to bending of the non-flexible region.

[0051] By setting a processing circuit 152 on the circuit board 151, the sensing device 100 can directly process the electrical signal generated by the first sensitive unit 120 without the need for an additional processor. The signal output by the sensing device 100 can be directly transmitted to the terminal and display the operating information of the target object.

[0052] In other embodiments, the derivation circuit 150 may not include the processing circuit 152. The processing circuit 152 may be connected to the derivation circuit 150 as an external circuit. In this case, when the derivation circuit 150 includes the circuit board 151, the circuit board 151 may not include a non-flexible region, and there is no need for the reinforcement plate 153. When the derivation circuit 150 includes a wire (such as the wire 655 shown in FIG. 4 ), the wire is directly connected to the processing circuit as an external circuit. This effectively reduces the size and volume of the sensor device 100 and simplifies its structural design.

[0053] In some embodiments, the sensing device 100 may further include a protective layer 130, which is disposed on the outermost layer of the sensing device 100 to protect the sensing device 100 and prevent external contact and corrosion of components of the sensing device 100 (such as the first sensitive unit 120, the export circuit 150, etc.).

[0054] In some embodiments, the protection layer 130 may include a first protection portion 131 and a second protection portion 132. The first protection portion 131 covers the first sensitive unit 120 to protect the first sensitive unit 120. The second protection portion 132 covers the derivation circuit 150 to protect the derivation circuit 150.

[0055] In some embodiments, the thickness of the first protective portion 131 protruding from the first side surface 110 - a is the same as the thickness of the second protective portion 132 protruding from the first side surface 110 - a. That is, the side of the first protective portion 131 facing the target object is flush with the side of the second protective portion 132 facing the target object. This ensures that the side of the sensor device 100 facing the target object remains flat, preventing uneven deformation of the first sensitive unit 120, improving the operating stability of the sensor device 100, and reducing the foreign body sensation when the sensor device 100 is worn, thereby improving the wearing comfort of the sensor device 100.

[0056] In some embodiments, the thickness of the first protective portion 131 protruding from the second side surface 110 - b may be the same as or different from the thickness of the second protective portion 132 protruding from the second side surface 110 - b , and this specification does not impose excessive restrictions on this.

[0057] Referring to Figure 1 , as shown, sensor device 100 includes only a first sensitive unit 120 disposed on first side 110 - a . First sensitive unit 120 is a capacitive structure. The target location is located between first side 110 - a and second side 110 - b , such as in area A shown in Figure 1 . Derivation circuit 150 includes a circuit board 151 , a processing circuit 152 , and a reinforcement plate 153 . For more information about derivation circuit 150, please refer to the previous section and will not be repeated here.

[0058] In some embodiments, in the direction from the sensing device 100 toward the target object (i.e., the X direction), the first sensitive unit 120 includes a first electrode layer 121, a first dielectric layer 122, and a second electrode layer 123, which are sequentially arranged. The first dielectric layer 122 is located between the first electrode layer 121 and the second electrode layer 123. The first electrode layer 121 is connected to the first side surface 110-a of the flexible substrate 110, and the second electrode layer 123 is connected to the first protective portion 131.

[0059] The first conductive channel 111 can include a first sub-channel 111-1 and a second sub-channel 111-2, the first electrode layer 121 is electrically connected to the first sub-channel 111-1, and the second electrode layer 123 is electrically connected to the second sub-channel 111-2, so that the first electrode layer 121 is electrically connected to the derivation circuit 150 of the target position through the first sub-channel 111-1, and the second electrode layer 123 is electrically connected to the derivation circuit 150 of the target position through the second sub-channel 111-2, thereby realizing the connection between the capacitive structure and the derivation circuit 150. It should be noted that in some embodiments, when the first electrode layer 121 or the second electrode layer 123 of the first sensitive unit 120 has multiple electrodes, the number of the first sub-channel 111-1 or the second sub-channel 111-2 is also set to multiple according to the corresponding number of electrodes. In some embodiments, when the sensing device 100 is provided with multiple sensitive units, the number of electrodes of the electrode layer of each sensitive unit can be one or more, and the number of sub-channels of the corresponding conductive channel can also be one or more accordingly, so as to conduct the electrical signal generated by the sensitive unit to the derivation circuit 150.

[0060] Specifically, the first subchannel 111-1 forms a first subport (not marked in the figure) on the first side 110-a, and the first subchannel 111-1 forms a second subport (not marked in the figure) at the target position (for example, the position of area A), the first subchannel 111-1 is electrically connected to the electrode of the first electrode layer 121 at the first subport, and the first subchannel 111-1 is electrically connected to the export circuit 150 at the second subport; the second subchannel 111-2 forms a third subport (not marked in the figure) on the first side 110-a, and the second subchannel 111-2 forms a fourth subport (not marked in the figure) at the target position (for example, the position of area A), the second subchannel 111-2 is electrically connected to the electrode of the second electrode layer 123 at the third subport, and the second subchannel 111-2 is electrically connected to the export circuit 150 at the fourth subport.

[0061] As shown in FIG1 , the thickness of the first protective portion 131 protruding from the second side surface 110 - b can be different from the thickness of the second protective portion 132 protruding from the second side surface 110 - b . That is, the side of the first protective portion 131 facing away from the target object is not flush with the side of the second protective portion 132 facing away from the target object, thereby making the side of the sensor device 100 facing away from the target object uneven. This allows for greater differentiation between the side of the sensor device 100 provided with the first sensitive unit 120 and the other side without the sensitive unit, facilitating proper wearing of the sensor device 100.

[0062] In some embodiments, when the target location is located between the first side surface 110-a and the second side surface 110-b (e.g., area A shown in FIG1 ), the flexible substrate 110 may be symmetrically structured with the circuit board 151 of the derivation circuit 150 located at the target location as the center. In this case, the flexible substrate 110 may include a first sub-substrate 110-1 and a second sub-substrate 110-2 located on either side of the circuit board 151. In some embodiments, conductive adhesive is used to bond the first conductive channel 111 (i.e., the first sub-substrate 111-1 and the second sub-substrate 111-2) on the first sub-substrate 110-1 to the circuit board 251 to ensure electrical connection between the first conductive channel 111 and the circuit board 151. Non-conductive adhesive is used to bond the first sub-substrate 110-1 and the second sub-substrate 110-2, and non-conductive adhesive is used to bond the first sub-substrate 110-1 to the circuit board 251 outside of the first conductive channel 111 to prevent interference with the conduction of electrical signals.

[0063] In some embodiments, the first sensitive unit 120 can be prepared first, wherein the preparation method of the first sensitive unit 120 can include but is not limited to spraying, sputtering, printing, etc. For example, two electrode layers can be printed on two films respectively, and the two films can be bonded to form the first sensitive unit 120 of the capacitive structure, wherein the two electrode layers correspond to the first electrode layer 121 and the second electrode layer 123 respectively, and the two bonded films correspond to the first dielectric layer 122. For another example, the second electrode layer 123, the first dielectric layer 122, and the first electrode layer 121 can be prepared in sequence on the first protective layer 131 of the protective layer 130 that abuts the first side surface 110-a. Compared to the first electrode layer 121 and the first dielectric layer 122, the second electrode layer 123 is relatively farther away from the flexible substrate 110. To prevent the first electrode layer 121 and the first dielectric layer 122 from obstructing the electrical connection between the second electrode layer 123 and the second sub-channel 111-2, in some embodiments, the second electrode layer 123 is larger than the first electrode layer 121 and the first dielectric layer 122. This allows the second electrode layer 123 to form a protrusion toward the flexible substrate 110, and the protrusion can abut against the second sub-channel 111-2 on the flexible substrate 110 to achieve electrical connection between the second electrode layer 123 and the second sub-channel 111-2. In some embodiments, the first electrode layer 121 and the second electrode layer 123 can be made of a flexible conductive material such as conductive ink or liquid metal.

[0064] The first sensitive unit 120 is attached to the first side surface 110-a of the first sub-base 110-1. A first hole is then machined in the first sub-base 110-1 and filled with a flexible conductive material to form a first conductive path 111. Heat and pressure are applied to ensure that the flexible conductive material in the first hole is in full contact with the electrode layer of the first sensitive unit 120 and is cured, thereby completing the preparation and installation of the first sensitive unit 120 and the first sub-base 110-1.

[0065] In some embodiments, the sensing device 100 further includes a second sensitive unit 140 disposed on the second side surface 110 - b . The second sensitive unit 140 can deform in response to the movement of the target object and generate an electrical signal accordingly. The electrical signal generated by the second sensitive unit 140 can be combined with and compared with the electrical signal generated by the first sensitive unit 120 to improve the measurement accuracy of the sensing device 100 .

[0066] In some embodiments, the second sensitive unit 140 can be a capacitive structure. In the direction from the first side 110-a to the second side 110-b (i.e., the opposite direction of the X direction), the second sensitive unit 140 includes a third electrode layer 141, a second dielectric layer 142, and a fourth electrode layer 143, which are arranged in sequence. The second dielectric layer 142 is located between the third electrode layer 141 and the fourth electrode layer 143. The third electrode layer 141 is connected to the second side 110-b of the flexible substrate 110, and the fourth electrode layer 143 is connected to the first protective portion 231.

[0067] In some embodiments, the flexible substrate 110 is provided with a second conductive channel 112, the second conductive channel 112 forms a third end on the second side 110-b, the third end is electrically connected to the electrode of the second sensitive unit 140, the second conductive channel 112 forms a fourth end at the target position, the fourth end is electrically connected to the export circuit 150 at the target position, thereby transmitting the electrical signal generated by the second sensitive unit 140 to the export circuit 150 at the target position through the second conductive channel 112.

[0068] Specifically, the second conductive channel 112 includes a third subchannel 112-1 and a fourth subchannel 112-2. The third subchannel 112-1 forms a fifth subport (not shown) on the second side surface 110-b. The third subchannel 112-1 forms a sixth subport (not shown) at a target location (e.g., region A shown in FIG1 ). The third subchannel 112-1 is electrically connected to an electrode of the third electrode layer 141 at the fifth subport, and is electrically connected to the derivation circuit 150 at the sixth subport. The fourth subchannel 112-2 forms a seventh subport (not shown) on the second side surface 110-b. The fourth subchannel 112-2 forms an eighth subport (not shown) at a target location (e.g., region A shown in FIG1 ). The fourth subchannel 112-2 is electrically connected to an electrode of the fourth electrode layer 143 at the seventh subport, and is electrically connected to the derivation circuit 150 at the eighth subport.

[0069] In some embodiments, the thickness of the first protective portion 131 protruding from the second side surface 110 - b and the thickness of the second protective portion 132 protruding from the second side surface 110 - b of the protective layer 130 can be the same. That is, the side of the first protective portion 131 facing away from the target object is flush with the side of the second protective portion 132 facing away from the target object. This ensures that the side of the sensor device 100 facing away from the target object remains flat, preventing uneven deformation of the second sensitive unit 140, improving the operating stability of the sensor device 100, and reducing the foreign body sensation when the sensor device 100 is worn, thereby improving the wearing comfort of the sensor device 100.

[0070] In some embodiments, the thickness of the first protective portion 131 of the protective layer 130 protruding from the second side 110 - b can be different from the thickness of the second protective portion 132 protruding from the second side 110 - b. That is, the side of the first protective portion 131 facing away from the target object is not flush with the side of the second protective portion 132 facing away from the target object. This allows for greater distinction between the sides of the sensor device 100 facing toward and away from the target object, facilitating proper fitting of the sensor device 100. Furthermore, since the second protective portion 132 needs to cover and protect the derivation circuit 150, and the circuit board 151 and processing circuit 152 of the derivation circuit 150 have a certain thickness, the second protective portion 132 needs to be thick enough to cover the derivation circuit 150. The thickness of the first protective portion 131 is not particularly restricted. In some embodiments, the second protective portion 132 protruding from the second side 110 - b can be thicker than the first protective portion 131 to cover and protect the derivation circuit 150.

[0071] In some embodiments, when the target position is set between the first side surface 110-a and the second side surface 110-b (for example, the position of area A shown in Figure 1), the flexible substrate 110 can be symmetrically structured with the circuit board 151 of the derivation circuit 150 set at the target position as the center. In this case, the flexible substrate 110 can correspondingly include a first sub-substrate 110-1 and a second sub-substrate 110-2 located on both sides of the circuit board 151. The connection between the first sub-substrate 110-1 and the first sensitive unit 120 and the connection between the second sub-substrate 110-2 and the second sensitive unit 140 can refer to the connection between the first sub-substrate 110-1 and the first sensitive unit 120 described above, and will not be repeated here.

[0072] In some embodiments, the preparation and installation of the first sub-substrate 110-1 and the first sensing unit 120, and the preparation and installation of the second sub-substrate 110-2 and the second sensing unit 140 can be the same as the preparation and installation of the first sub-substrate 110-1 and the first sensing unit 120 described above, and will not be repeated here. The circuit board 151 of the derivation circuit 150 is placed between the first sub-substrate 110-1 and the second sub-substrate 110-2 and bonded together, and finally covered with a protective layer 130, thereby completing the preparation of the sensor device 100.

[0073] FIG2 is another exemplary structural diagram of a sensing device according to some embodiments of the present disclosure. As shown in FIG2 , sensing device 400 includes a flexible substrate 410, a first sensitive unit 420, a protective layer 430, a second sensitive unit 440, and a derivation circuit 450. The target location is located at the second side surface 410 - b , such as area B shown in FIG2 . The flexible substrate 410 (e.g., first side surface 410 - a, second side surface 410 - b ), first sensitive unit 420 (e.g., first electrode layer 421 , first dielectric layer 422 , second electrode layer 423 ), protective layer 430 (e.g., first protective portion 431 , second protective portion 432 ), and derivation circuit 450 (e.g., circuit board 451 , processing circuit 452 , solder pads 454 ), can be the same or similar to the flexible substrate 110, first sensitive unit 120, protective layer 130, and derivation circuit 150 shown in FIG1 , and are not further described herein. The difference between the sensing device 400 and the sensing device 100 is that the target position of the sensing device 400 is located on the second side 410 - b , and the derivation circuit 450 is also correspondingly arranged on the second side 410 - b , such as the position of area B shown in FIG. 2 .

[0074] As shown in Figure 2, in some embodiments, the circuit board 451 is arranged on the second side 410-b, and the circuit board 451 has little effect on the deformation of the flexible substrate 410 and the first sensitive unit 420. The circuit board 451 does not need to deform accordingly with the deformation of the flexible substrate 410 and the first sensitive unit 420. The circuit board 451 can adopt a flexible FPC or a rigid PCB, and the setting of the circuit board 451 can be more flexible.

[0075] In some embodiments, when the circuit board 451 is a rigid PCB, no additional reinforcement plate may be provided.

[0076] In some embodiments, the circuit board 451 can be flush with the side of the first protective portion 431 away from the target object, and the circuit board 451 is covered by the second protective portion 432 to reduce the impact of the circuit board 451 on the first sensitive unit 420, while protecting the circuit board 451 from external contact and corrosion. At this time, the first sub-channel 411-1 and the second sub-channel 411-2 of the first conductive channel 411 pass through the flexible substrate 410 and extend to the target position. Specifically, the first sub-channel 411-1 and the second sub-channel 411-2 can respectively pass through the protective layer 430 between the circuit board 451 and the flexible substrate 410 and extend to the circuit board 451 at the target position to conduct the electrical signal generated by the first sensitive unit 420 to the derivation circuit 450 at the target position.

[0077] In some embodiments, the third electrode layer 441 and the fourth electrode layer 443 of the second sensitive unit 440 can be directly electrically connected to the export circuit 450 (for example, a circuit board 451) located on the second side 410-b without the need for additional conductive channels, thereby simplifying the structure of the sensing device 400.

[0078] In some embodiments, the preparation and installation of the flexible substrate 410 and the first sensitive unit 420 can be the same as the preparation and installation process of the first sub-substrate 110-1 and the first sensitive unit 120, and will not be repeated here. Referring to Figure 2, since the third electrode layer 441 and the fourth electrode layer 443 of the second sensitive unit 440 penetrate the first protective portion 431 of the protective layer 430 and are connected to the circuit board 451 of the export circuit 450, it is more difficult and complicated to prepare the second sensitive unit 440 directly on the side of the protective layer 450 that contacts the first protective portion 431 and the second side 410-b. In some embodiments, the second sensitive unit 440 can be prepared by screen printing the third electrode layer 441, the second dielectric layer 442, and the third electrode layer 443 in sequence on the second side 410-b of the flexible substrate 410. Compared with the fourth electrode layer 443 and the second dielectric layer 442, the third electrode layer 441 is relatively farther away from the export circuit 450 (for example, the circuit board 451). In order to avoid the fourth electrode layer 443 and the second dielectric layer 442 hindering the electrical connection between the third electrode layer 441 and the export circuit 450, in some embodiments, the size of the third electrode layer 441 is larger than the size of the fourth electrode layer 443 and the second dielectric layer 442, so that the third electrode layer 441 can form a protrusion toward the export circuit 450 (for example, the circuit board 451), and the protrusion can abut the export circuit 450 (for example, the circuit board 451) to realize the electrical connection between the second electrode layer 123 and the second sub-channel 111-2.

[0079] FIG3 is another exemplary structural diagram of a sensing device according to some embodiments of this specification. As shown in FIG3 , sensing device 500 includes a flexible substrate 510, a first sensitive unit 520, a protective layer 530, a second sensitive unit 540, and a derivation circuit 550. The target location is located between a first side surface 2510 - a and a second side surface 510 - b, such as in region A shown in FIG3 . Among them, the flexible substrate 510 (for example, the first sub-substrate 510-1, the second sub-substrate 510-2, the first sub-channel 511-1 and the second sub-channel 511-2 of the first conductive channel 511, the third sub-channel 512-1 and the fourth sub-channel 512-2 of the second conductive channel 512, the first side 510-a, the second side 510-b, etc.), the first sensitive unit 520 (for example, the first electrode layer 521, the first dielectric layer 522, the second electrode layer 523, etc.), the protective layer 530 (for example, the first protective part 531, the second protective part 532, etc.), and the second sensitive unit 540 (for example, the third electrode layer 541, the second dielectric layer 542, the fourth electrode layer 543, etc.) can be the same as or similar to the flexible substrate 110, the first sensitive unit 120, the protective layer 130, and the second sensitive unit 140 shown in Figure 1, and will not be repeated here. The difference between the sensor device 500 and the sensor device 100 is that the export circuit 550 of the sensor device 500 is not provided with a processing circuit and a reinforcement plate, that is, the export circuit 550 does not process the electrical signal generated by the first sensitive unit 520 and the electrical signal generated by the second sensitive unit 540, but directly transmits the electrical signal through the circuit board 551 to the external circuit connected to the solder pad 554, and the external circuit processes and analyzes the electrical signal.

[0080] In some embodiments, the thickness of the first protective portion 531 protruding from the second side surface 510-b and the thickness of the second protective portion 532 protruding from the second side surface 510-b of the protective layer 530 of the sensing device 500 can be different. That is, the side of the first protective portion 531 facing away from the target object and the side of the second protective portion 532 facing away from the target object are not flush. This allows for greater distinction between the two sides of the sensing device 500 facing toward and away from the target object, facilitating proper wearing of the sensing device 500.

[0081] Figure 4 is another exemplary structural diagram of a sensing device according to some embodiments of this specification. As shown in Figure 4, sensing device 600 includes a flexible substrate 610, a first sensitive unit 620, a protective layer 630, a second sensitive unit 640, and a derivation circuit 650. The target location is located on the second side 610-b, such as the area B shown in Figure 4. Among them, the flexible substrate 610 (for example, the first side 610-a, the second side 610-b, the first sub-channel 611-1 and the second sub-channel 611-2 of the first conductive channel 611, etc.), the first sensitive unit 620 (for example, the first electrode layer 621, the first dielectric layer 622, the second electrode layer 623, etc.), the protective layer 630 (for example, the first protective part 631, the second protective part 632, etc.), and the second sensitive unit 640 (for example, the third electrode layer 641, the second dielectric layer 642, the fourth electrode layer 643, etc.) can be the same as or similar to the flexible substrate 410, the first sensitive unit 420, the protective layer 430, and the second sensitive unit 440 shown in Figure 2, and will not be repeated here. The difference between the sensing device 600 and the sensing device 400 is that the derivation circuit 650 of the sensing device 600 is a wire 655, that is, the derivation circuit 650 does not process the electrical signal generated by the first sensitive unit 620 and the electrical signal generated by the second sensitive unit 640, but directly transmits the electrical signal through the wire 655 to an external circuit connected to the wire 655, and the external circuit processes and analyzes the electrical signal.

[0082] Specifically, the first electrode layer 621 of the first sensitive unit 620 can be electrically connected to the first wire through the first sub-channel 611-1, the second electrode layer 623 of the first sensitive unit 620 can be electrically connected to the second wire through the second sub-channel 611-2, the third electrode layer 641 of the second sensitive unit 640 can be electrically connected to the third wire, and the fourth electrode layer 643 of the second sensitive unit 640 can be electrically connected to the fourth wire. The above four wires are electrically connected to the external circuit together.

[0083] Figure 5 is another exemplary structural diagram of a sensing device according to some embodiments of this specification. As shown in Figure 5, sensing device 800 includes a flexible substrate 810, a first sensitive unit 820, a protective layer 830, a second sensitive unit 840, and a derivation circuit 850. The target location is located between a first side surface 810-a and a second side surface 810-b, such as in region A shown in Figure 5. The flexible substrate 810 (e.g., the first sub-substrate 810-1, the second sub-substrate 810-2, the first sub-channel 811-1 and the second sub-channel 811-2 of the first conductive channel 811, the third sub-channel 812-1 and the fourth sub-channel 812-2 of the second conductive channel 812, the first side surface 810-a, the second side surface 810-b, etc.), the protective layer 830 (e.g., the first protective portion 831, the second protective portion 832, etc.), and the derivation circuit 850 (e.g., the circuit board 851, the processing circuit 852, the reinforcement plate 853, the pad 854, etc.) can be the same as or similar to the flexible substrate 110, the protective layer 130, and the derivation circuit 150, and are not further described here. The difference between the sensing device 800 and the sensing device 100 is that the first sensitive unit 820 and the second sensitive unit 840 can be resistive or inductive structures.

[0084] In some embodiments, the first sensitive unit 820 may include a first electrode 821 and a second electrode 823. The first subchannel 811-1 is electrically connected to the first electrode 821 at a first subport on the first side 810-a, and the second subport of the first subchannel 811-1 at a target location (e.g., region A shown in FIG5 ) is electrically connected to the derivation circuit 850. The second subchannel 811-2 is electrically connected to the second electrode 823 at a third subport on the first side 810-a, and the fourth subport of the second subchannel 811-2 at a target location (e.g., region A shown in FIG5 ) is electrically connected to the derivation circuit 850. The second sensitive unit 840 may include a third electrode 841 and a fourth electrode 843. The flexible substrate 810 may be provided with a second conductive channel 812, and the third electrode 841 and the fourth electrode 843 of the second sensitive unit 840 are electrically connected to the derivation circuit 850 via the second conductive channel 812, respectively. For example, the second conductive channel 812 may include a third subchannel 812-1 and a fourth subchannel 812-2. The third subchannel 812-1 forms a fifth subport on the second side surface 810-b, and forms a sixth subport at a target location (e.g., region A shown in FIG5 ). The third subchannel 812-1 is electrically connected to the third electrode 841 at the fifth subport, and is electrically connected to the derivation circuit 850 at the sixth subport. The fourth subchannel 812-2 forms a seventh subport on the second side surface 810-b, and forms an eighth subport at a target location (e.g., region A shown in FIG5 ). The fourth subchannel 812-2 is electrically connected to the fourth electrode 843 at the seventh subport, and is electrically connected to the derivation circuit 850 at the eighth subport.

[0085] FIG6 is another exemplary structural diagram of a sensing device according to some embodiments of the present disclosure. As shown in FIG6 , sensing device 900 includes a flexible substrate 910, a first sensitive unit 920, a protective layer 930, a second sensitive unit 940, and a derivation circuit 950. The flexible substrate 910 (e.g., the first sub-substrate 810-1, the second sub-substrate 810-2, the first side surface 810-a, the second side surface 810-b, etc.), the first sensitive unit 920, the protective layer 930 (e.g., the first protective portion 931, the second protective portion 932, etc.), the second sensitive unit 940, and the derivation circuit 950 (e.g., the circuit board 951, the processing circuit 952, the pad 954, etc.) may be the same as or similar to the flexible substrate 810, the first sensitive unit 820, the protective layer 830, the second sensitive unit 840, and the derivation circuit 850, and are not further described herein. The difference between the sensing device 900 and the sensing device 800 is that the target position of the sensing device 900 is located on the second side 910-b, such as the area B shown in Figure 6, and the corresponding derivation circuit 950 is also set on the second side 910-b.

[0086] In some embodiments, when the circuit board 951 of the derivation circuit 950 is disposed on the second side surface 910 - b , the circuit board 951 has a minimal effect on the deformation of the flexible substrate 910 and the first and second sensitive units 920 and 940 . The circuit board 951 does not need to deform accordingly with the deformation of the flexible substrate 910 and the first and second sensitive units 920 and 940 . The circuit board 951 can be a flexible FPC or a rigid PCB, allowing for greater flexibility in its configuration. In some embodiments, when the circuit board 951 is a rigid PCB, no additional reinforcement plate is required.

[0087] In some embodiments, the third electrode 941 and the fourth electrode 943 of the second sensitive unit 940 can be directly electrically connected to the export circuit 950 (for example, a circuit board 951) located on the second side 910-b without the need for an additional conductive channel, thereby simplifying the structure of the sensing device 900.

[0088] FIG7 is another exemplary structural diagram of a sensing device according to some embodiments of the present disclosure. As shown in FIG7 , sensing device 1000 includes a flexible substrate 1010, a first sensitive unit 1020, a protective layer 1030, a second sensitive unit 1040, and a derivation circuit 1050. The first sensitive unit 1020 (e.g., first electrode layer 1021, first dielectric layer 1022, second electrode layer 1023, etc.), the protective layer 1030 (e.g., first protective portion 1031, second protective portion 1032, etc.), and the second sensitive unit 1040 (e.g., third electrode layer 1041, second dielectric layer 1042, fourth electrode layer 1043, etc.) may be the same as or similar to the first sensitive unit 120, protective layer 130, and second sensitive unit 140 of sensing device 100 shown in FIG1 , or the first sensitive unit 420, protective layer 430, and second sensitive unit 440 of sensing device 400 shown in FIG2 , and are not further described herein. Sensor device 1000 differs from sensor devices 100 and 400 in that the target location of first sensitive unit 1020 of sensor device 1000 is located between first side surface 1010-a and second side surface 1010-b, such as region A shown in FIG7 ; and the target location of second sensitive unit 1040 is located on second side surface 1010-b, such as region B shown in FIG7 . Derivation circuit 1050 can be electrically connected to the corresponding sensitive units at both target locations.

[0089] In some embodiments, the flexible substrate 1010 can be divided into a first sub-substrate 1010-1, which is relatively close to the target object, and a second sub-substrate 1010-2, which is relatively far away from the target object, by a plane passing through region A and parallel to the first side surface 1010-a or the second side surface 1010-b. The side of the first sub-substrate 1010-1 close to the target object is the first side surface 1010-a, and the side of the second sub-substrate 1010-2 far away from the target object is the second side surface 1010-b. In the direction from the sensing device 1000 pointing toward the target object (i.e., the X direction), the thickness of the first sub-substrate 1010-1 and the second sub-substrate 1010-2 can be the same or different. In the extension direction of the flexible substrate 1010 (i.e., the Y direction), the length of the first sub-substrate 1010-1 can be less than the length of the second sub-substrate 1010-2. In some embodiments, the first sub-substrate 1010-1 and the second sub-substrate 1010-2 can be integrally formed or separately prepared and then bonded.

[0090] In some embodiments, the circuit board 1051 of the derivation circuit 1050 and the second sub-substrate 1010-2 are arranged side by side in the Y direction on a side of the first sub-substrate 1010-1 opposite the first side surface 1010-a. This ensures that one side of the derivation circuit 1050 is electrically connected to the first sensitive unit 1020 in region A via the first conductive path 1011, while the other side of the derivation circuit 1050 is directly electrically connected to the second sensitive unit 1040 in region B. The processing circuit 1052 and the pads 1054 are both arranged on the other side of the circuit board 1051.

[0091] In some embodiments, the thickness of the circuit board 1051 of the derivation circuit 1050 can be the same as or approximately the same as the thickness of the second sub-substrate 1010-2. That is, the side of the second sub-substrate 1010-2 facing away from the target object is flush or approximately flush with the side of the circuit board 1051 facing away from the target object, together forming the second side surface 1010-b. This configuration can increase the thickness of the derivation circuit 1050 in the X direction, thereby improving the support strength of the derivation circuit 1050 for the processing circuit 1052 and enhancing the operating stability of the sensor device 1000.

[0092] Exemplarily, when the first sensitive unit 1020 and the second sensitive unit 1040 are capacitive structures, a first conductive channel 1011 is provided on the first sub-substrate 1010-1, and the first conductive channel 1011 includes a first sub-channel 1011-1 and a second sub-channel 1011-2. The first electrode layer 1021 of the first sensitive unit 1020 is electrically connected to the first sub-port of the first sub-channel 1011-1 at the first side 1010-a, and the second sub-port of the first sub-channel 1011-1 at the position of area A is electrically connected to the said one side of the circuit board 1051; the second electrode layer 1023 of the first sensitive unit 1020 is electrically connected to the third sub-port of the second sub-channel 1011-2 at the first side 1010-a, and the fourth sub-port of the second sub-channel 1011-2 at the position of area A is electrically connected to the said one side of the circuit board 1051. The third electrode layer 1041 and the fourth electrode layer 1043 of the second sensitive unit 1040 are directly electrically connected to the other side of the circuit board 1051 .

[0093] The sensor device 1000 shown in FIG7 not only simplifies the installation process, but also allows the preparation process of the first sensitive unit 1020 and the second sensitive unit 1040 to be the same as the preparation process of the first sensitive unit 120 and the second sensitive unit 140 shown in FIG1 , resulting in a higher yield rate for the first sensitive unit 1020 and the second sensitive unit 1040. The sensor device 1000 is suitable not only for laboratory applications, but also for industrial mass production applications.

[0094] In some embodiments, when the first sensitive unit 1020 and the second sensitive unit 1040 are of resistive or inductive structures, the connection method between the two and the circuit board 1051 can refer to the connection method between the above-mentioned capacitive structure and the circuit board 1051, which will not be repeated here.

[0095] In some embodiments, when the derivation circuit 1050 includes wires, two of the wires can be electrically connected to the first sensitive unit 1020 through the first sub-channel 1011-1 and the second sub-channel 1011-2 at the position of area A, and the other two wires can be directly electrically connected to the second sensitive unit 1040 at the position of area B.

[0096] Some embodiments of this specification also provide a wearable device for collecting motion signals of a target object, which includes the sensing device as described above (for example, sensing device 100, sensing device 400, sensing device 500, sensing device 1000, etc.), so that the wearable device can have higher working stability and wearing comfort.

[0097] While the basic concepts have been described above, it will be apparent to those skilled in the art that the detailed disclosure is merely illustrative and does not limit this specification. Although not explicitly stated herein, various modifications, improvements, and revisions to this specification may be made by those skilled in the art. Such modifications, improvements, and revisions are suggested in this specification and remain within the spirit and scope of the exemplary embodiments of this specification.

[0098] This specification also uses specific terms to describe the embodiments of this specification. For example, "one embodiment," "an embodiment," and / or "some embodiments" refer to a feature, structure, or characteristic associated with at least one embodiment of this specification. Therefore, it should be emphasized and noted that references to "one embodiment," "an embodiment," or "an alternative embodiment" two or more times in different locations in this specification do not necessarily refer to the same embodiment. Furthermore, certain features, structures, or characteristics of one or more embodiments of this specification may be appropriately combined.

[0099] Similarly, it should be noted that, in order to simplify the presentation of this specification and thus facilitate understanding of one or more embodiments of the invention, the foregoing descriptions of the embodiments of this specification sometimes combine multiple features into a single embodiment, figure, or description thereof. However, this disclosure method does not imply that the subject matter of this specification requires more features than those recited in the claims. In fact, an embodiment may have fewer features than all of the features of a single disclosed embodiment.

[0100] Finally, it should be understood that the embodiments described in this specification are intended only to illustrate the principles of the embodiments of this specification. Other variations may also fall within the scope of this specification. Therefore, by way of example and not limitation, alternative configurations of the embodiments of this specification may be considered consistent with the teachings of this specification. Accordingly, the embodiments of this specification are not limited to the embodiments explicitly described and illustrated in this specification.

Claims

1. A sensing device for collecting motion signals of a target object, comprising: a flexible substrate comprising a first side facing the target object; The first sensitive unit is used to detect the target object and generate an electrical signal, and the first sensitive unit is arranged on the first side of the flexible substrate; wherein, The flexible substrate is provided with a first conductive channel, and the first conductive channel is used to conduct the electrical signal generated by the first sensitive unit to a target position, and the target position is farther away from the target object than the first side surface.

2. The sensing device according to claim 1, wherein The flexible substrate is provided with a first hole portion, and the first hole portion is filled with a flexible conductive material to form the first conductive channel.

3. The sensing device according to claim 1 or 2, wherein: The sensing device also includes a derivation circuit arranged at the target position, the first conductive channel forms a first end on the first side, and the first end is electrically connected to the electrode of the first sensitive unit; the first conductive channel forms a second end at the target position, and the second end is electrically connected to the derivation circuit.

4. The sensing device according to claim 3, wherein: The flexible substrate includes a second side surface opposite to the first side surface. A second sensitive unit is provided on the second side surface. Another electrical signal generated by the second sensitive unit is conducted to the derivation circuit.

5. The sensing device according to claim 4, wherein: The target position is located between the first side surface and the second side surface, the flexible substrate is provided with a second conductive channel, the second conductive channel forms a third end portion on the second side surface, the third end portion is electrically connected to the electrode of the second sensitive unit; the second conductive channel forms a fourth end portion at the target position, the fourth end portion is electrically connected to the derivation circuit.

6. The sensing device according to claim 4, wherein: The target location is located on the second side surface, and the first conductive path penetrates the flexible substrate and extends to the target location.

7. The sensing device according to any one of claims 3 to 6, wherein: The derivation circuit includes a circuit board or a wire.

8. The sensing device according to claim 7, wherein: The circuit board includes a flexible area and a non-flexible area. The flexible area is arranged at the target position, and a processing circuit is arranged on the non-flexible area.

9. The sensing device according to claim 8, wherein: The non-flexible area is provided with a reinforcing plate, and the reinforcing plate is in contact with the non-flexible area.

10. The sensing device according to claim 8, wherein: The projection of the non-flexible area on the target object is outside the projection of the first sensitive unit on the target object.

11. The sensing device according to any one of claims 7 to 10, wherein: The flexible substrate includes a first sub-substrate and a second sub-substrate, wherein the first sub-substrate is close to the target object and the second sub-substrate is far away from the target object, the side of the first sub-substrate close to the target object is the first side surface, and the side of the second sub-substrate far away from the target object is the second side surface, and the first sub-substrate is provided with the first conductive path; When the derivation circuit includes a circuit board, the circuit board and the second sub-base are arranged side by side on a side of the first sub-base opposite to the first side surface.

12. The sensing device according to claim 1, wherein The first sensitive unit is a capacitive structure, and the first sensitive unit includes a first electrode layer and a second electrode layer. A dielectric layer is provided between the first electrode layer and the second electrode layer. The first conductive channel includes a first sub-channel and a second sub-channel. The first sub-channel is electrically connected to the first electrode layer, and the second sub-channel is electrically connected to the second electrode layer.

13. The sensing device according to claim 12, wherein: The sensing device further includes a derivation circuit provided at the target location, the first subchannel forming a first subport at the first side surface, the first subchannel forming a second subport at the target location, the first subchannel being electrically connected to an electrode of the first electrode layer at the first subport, and the first subchannel being electrically connected to the derivation circuit at the second subport; The second sub-channel forms a third sub-port at the first side, and the second sub-channel forms a fourth sub-port at the target position. The second subchannel is electrically connected to the electrode of the second electrode layer at the third subport, and the second subchannel is electrically connected to the derivation circuit at the fourth subport.

14. The sensing device according to claim 12, wherein: The sensing device further includes a derivation circuit disposed at the target position, the flexible substrate includes a second side surface opposite to the first side surface, the second side surface is provided with a second sensitive unit, the second sensitive unit is a capacitive structure, the second sensitive unit includes a third electrode layer and a fourth electrode layer, another dielectric layer is provided between the third electrode layer and the fourth electrode layer, the target position is located between the first side surface and the second side surface, the flexible substrate is provided with a second conductive channel, the second conductive channel includes a third sub-channel and a fourth sub-channel, The third subchannel forms a fifth subport at the second side surface, the third subchannel forms a sixth subport at the target position, the third subchannel is electrically connected to the electrode of the third electrode layer at the fifth subport, and the third subchannel is electrically connected to the derivation circuit at the sixth subport; The fourth subchannel forms a seventh subport on the second side, the fourth subchannel forms an eighth subport at the target position, the fourth subchannel is electrically connected to the electrode of the fourth electrode layer at the seventh subport, and the fourth subchannel is electrically connected to the export circuit at the eighth subport.

15. The sensing device according to claim 12, wherein: The sensing device also includes a derivation circuit arranged at the target position, the flexible substrate includes a second side surface opposite to the first side surface, the second side surface is provided with a second sensitive unit, the second sensitive unit is a capacitive structure, the second sensitive unit includes a third electrode layer and a fourth electrode layer, another dielectric layer is provided between the third electrode layer and the fourth electrode layer, the target position is located on the second side surface, and the third electrode layer and the fourth electrode layer are respectively directly electrically connected to the derivation circuit.

16. The sensing device according to claim 1, wherein The first sensitive unit is a resistive structure or an inductive structure, the resistive structure or the inductive structure includes a first electrode and a second electrode, the first conductive channel includes a first sub-channel and a second sub-channel, the first sub-channel is electrically connected to the first electrode, and the second sub-channel is electrically connected to the second electrode.

17. The sensing device according to claim 16, wherein: The sensing device further includes a derivation circuit provided at the target location, wherein the first subchannel forms a first subport on the first side surface, and the first subchannel forms a second subport at the target location, the first subchannel is connected to the first electrode at the first subport, and the first subchannel is electrically connected to the derivation circuit at the second subport; The second subchannel forms a third subport on the first side, the second subchannel forms a fourth subport at the target position, the second subchannel is electrically connected to the second electrode at the third subport, and the second subchannel is electrically connected to the derivation circuit at the fourth subport.

18. The sensing device according to claim 16, wherein: The sensing device further includes a derivation circuit disposed at the target position, the flexible substrate includes a second side surface opposite to the first side surface, the second side surface is provided with a second sensitive unit, the second sensitive unit is a resistive structure or an inductive structure, the second sensitive unit includes a third electrode and a fourth electrode, the target position is located between the first side surface and the second side surface, the flexible substrate is provided with a second conductive channel, the second conductive channel includes a third sub-channel and a fourth sub-channel, The third subchannel forms a fifth subport at the second side surface, the third subchannel forms a sixth subport at the target position, the third subchannel is electrically connected to the third electrode at the fifth subport, and the third subchannel is electrically connected to the derivation circuit at the sixth subport; The fourth subchannel forms a seventh subport on the second side, the fourth subchannel forms an eighth subport at the target position, the fourth subchannel is electrically connected to the fourth electrode at the seventh subport, and the fourth subchannel is electrically connected to the derivation circuit at the eighth subport.

19. The sensing device according to claim 16, wherein: The sensing device also includes a derivation circuit arranged at the target position, the flexible substrate includes a second side surface opposite to the first side surface, the second side surface is provided with a second sensitive unit, the second sensitive unit is a resistive structure or an inductive structure, the second sensitive unit includes a third electrode and a fourth electrode, the target position is located at the second side surface, and the third electrode and the fourth electrode are respectively directly electrically connected to the derivation circuit.

20. The sensing device according to claim 1, wherein The sensing device includes a protective layer, which includes a first protective part and a second protective part. The first protective part covers the first sensitive unit. The sensing device also includes a derivation circuit arranged at the target position, and the second protective part covers the derivation circuit. The thickness of the first protective part protruding from the first side surface is the same as the thickness of the second protective part protruding from the first side surface.

21. A wearable device for collecting motion signals of a target object, comprising the sensing device according to any one of claims 1 to 20.

Images