Optical module

Abstract

The present disclosure provides an optical module, comprising a circuit board, a bearing member, a light-emitting component, and a light-receiving component. A cutout is formed in the surface of the circuit board, and the bearing member is disposed at the cutout. The light-emitting component comprises a laser and an optical multiplexing assembly. The laser and the optical multiplexing assembly are both disposed at a surface of the bearing member. The light-receiving component comprises a support part, a refraction part, an optical receiving chip, and an optical demultiplexing assembly. The support part can support the refraction part to a certain height. In the present disclosure, the optical demultiplexing assembly and the optical multiplexing assembly are arranged in a stacked manner, and a difference value exists between the height of a light inlet of the refraction part and the height of a light outlet of the laser, so that the optical path between the optical demultiplexing assembly and the refraction part and the optical path between the optical multiplexing assembly and the laser are separated by a certain distance in terms of the relative vertical positional relationship thereof, so that interference and crosstalk between a light-receiving optical path and a light-emitting optical path are avoided. In addition, by means of arranging the optical demultiplexing assembly and the optical multiplexing assembly in a stacked manner, the space occupied by an optical engine is reduced.

Description

An optical module

[0001] This application claims the priority of application number 202410315842.X filed with the China Patent Office on March 19, 2024; the priority of application number 202420535848.3 filed with the China Patent Office on March 19, 2024; and the priority of application number 202420224494.0 filed with the China Patent Office on January 30, 2024; all of which are incorporated by reference into this application. Technical Field

[0002] The present disclosure relates to the field of optical communication technology, and in particular to an optical module. Background Art

[0003] With the development of new services and applications such as cloud computing, mobile internet, and video, advances in optical communication technology are becoming increasingly important. As a key component in optical communication equipment, optical modules enable photoelectric signal conversion. As optical communication technology evolves, the data transmission rate of these modules continues to increase.

[0004] Summary of the Invention

[0005] The optical module provided in the embodiment of the present disclosure includes:

[0006] A circuit board having a notch formed on its surface;

[0007] A carrier is provided at the notch and is connected to the circuit board. A surface of the carrier is formed with:

[0008] a supporting area, the supporting area being formed at an edge of the carrier and connected to the circuit board to support the circuit board;

[0009] A light emitting component, comprising a laser, an optical multiplexing component and a first optical fiber collimator, wherein the laser, the optical multiplexing component and the first optical fiber collimator are respectively arranged on the surface of the carrier;

[0010] A light receiving component, comprising a supporting portion, a refracting portion, a light receiving chip, an optical demultiplexing assembly, and a second optical fiber collimator; wherein the refracting portion is provided on a surface of the supporting portion and is configured to deflect an optical signal output by the optical demultiplexing assembly toward a surface of the light receiving chip; a first optical path is defined between the optical demultiplexing assembly and the refracting portion, and a second optical path is defined between the optical multiplexing assembly and the laser;

[0011] The thickness of the support portion is matched with the surface of the carrier so that a preset difference exists between the height of the light inlet of the refraction portion and the height of the light outlet of the laser, so that the first light path and the second light path are misaligned;

[0012] The second optical fiber collimator cooperates with the surface of the carrier so that the optical paths of the second optical fiber collimator, the optical multiplexing component and the refraction part match;

[0013] The optical multiplexing component cooperates with the surface of the carrier so that the optical multiplexing component matches the optical path of the laser. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the following briefly introduces the drawings required for use in the embodiments or descriptions of the prior art. Obviously, the drawings described below are only some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0015] FIG1 is a partial architecture diagram of an optical communication system according to some embodiments of the present disclosure;

[0016] FIG2 is a partial structural diagram of a host computer provided according to some embodiments of the present disclosure;

[0017] FIG3 is a structural diagram of an optical module provided according to some embodiments of the present disclosure;

[0018] FIG4 is an exploded view of an optical module according to some embodiments of the present disclosure;

[0019] FIG5 is a diagram showing the internal structure of an optical module according to some embodiments of the present disclosure;

[0020] FIG6 is an internal exploded view of an optical module according to some embodiments of the present disclosure;

[0021] FIG7 is a first optical path diagram of an optical module according to some embodiments of the present disclosure;

[0022] FIG8 is a second optical path schematic diagram of an optical module provided according to some embodiments of the present disclosure;

[0023] FIG9 is a third optical path diagram of an optical module provided according to some embodiments of the present disclosure;

[0024] FIG10 is a fourth optical path diagram of an optical module provided according to some embodiments of the present disclosure;

[0025] FIG11 is a schematic internal cross-sectional view of an optical module according to some embodiments of the present disclosure;

[0026] FIG12 is a side view of an optical module according to some embodiments of the present disclosure;

[0027] FIG13 is an internal top view of an optical module according to some embodiments of the present disclosure;

[0028] FIG14 is a schematic diagram showing the relative positional relationship between a first fiber collimator and a second fiber collimator of an optical module according to some embodiments of the present disclosure;

[0029] FIG15 is a structural diagram 1 of a carrier provided according to an embodiment of the present disclosure;

[0030] FIG16 is a second structural diagram of a carrier provided according to some embodiments of the present disclosure;

[0031] FIG17 is a third structural diagram of a carrier provided according to some embodiments of the present disclosure;

[0032] FIG18 is a first schematic diagram of a connection between a circuit board and a carrier according to some embodiments of the present disclosure;

[0033] FIG19 is a second schematic diagram of a connection between a circuit board and a carrier according to some embodiments of the present disclosure;

[0034] FIG20 is a first assembly diagram of a carrier, a light emitting component, and a light receiving component according to some embodiments of the present disclosure;

[0035] FIG21 is an exploded view of an assembly between a carrier, a light emitting component, and a light receiving component according to some embodiments of the present disclosure;

[0036] FIG22 is a diagram showing the internal structure of an optical module according to some embodiments of the present disclosure;

[0037] FIG23 is a third schematic diagram of a connection between a circuit board and a carrier according to some embodiments of the present disclosure;

[0038] FIG24 is a fourth schematic diagram of a connection between a circuit board and a carrier according to some embodiments of the present disclosure;

[0039] FIG25 is a second assembly diagram of a carrier, a light emitting component, and a light receiving component according to some embodiments of the present disclosure;

[0040] FIG26 is a fourth structural diagram of a carrier provided according to some embodiments of the present disclosure;

[0041] FIG27 is a third assembly diagram of a carrier, a light emitting component, and a light receiving component according to some embodiments of the present disclosure;

[0042] FIG28 is a second exploded view of an assembly of a carrier, a light emitting component, and a light receiving component according to some embodiments of the present disclosure;

[0043] FIG29 is a cross-sectional structural diagram of a carrier provided according to some embodiments of the present disclosure;

[0044] FIG30 is a top view of a layout of a carrier according to some embodiments of the present disclosure;

[0045] FIG31 is a top view of an assembly of a circuit board, a carrier, a light emitting component, and a light receiving component according to some embodiments of the present disclosure;

[0046] FIG32 is a second top view of an assembly of a circuit board, a carrier, a light emitting component, and a light receiving component according to some embodiments of the present disclosure;

[0047] FIG33 is a diagram illustrating an assembly structure of a circuit board and a carrier according to some embodiments of the present disclosure;

[0048] FIG34 is an exploded view of an assembly of a circuit board and a carrier according to some embodiments of the present disclosure;

[0049] FIG35 is a side view of an assembly of a circuit board and a carrier according to some embodiments of the present disclosure;

[0050] FIG36 is a cross-sectional view of an assembly of a circuit board and a carrier according to some embodiments of the present disclosure. DETAILED DESCRIPTION

[0051] Some embodiments of the present disclosure will be described in detail below with reference to the accompanying drawings. However, the embodiments described are only some of the embodiments of the present disclosure, not all of them. All other embodiments obtained by those of ordinary skill in the art based on the embodiments provided in the present disclosure are within the scope of protection of the present disclosure.

[0052] Unless the context requires otherwise, throughout the specification and claims, the term "including" is to be interpreted as open and inclusive, that is, "including, but not limited to"; the terms "first" and "second" are not to be understood as indicating or implying relative importance or indicating an upper limit on quantity; the term "plurality" means two or more; the term "connected" is to be understood in a broad sense, for example, "connected" can be a fixed connection, a detachable connection, or an integral connection, and can be directly connected or indirectly connected through an intermediate medium; the use of the term "suitable for" or "configured to" means open and inclusive language, which does not exclude devices that are suitable for or configured to perform additional tasks or steps; the terms "parallel", "perpendicular", "same", "consistent", "level" and other descriptions are not limited to absolute mathematical theoretical relationships, but also include acceptable error ranges generated in practice, and also include differences based on the same design concept but due to manufacturing reasons.

[0053] In optical communication technology, to establish information transmission between information processing devices, it is necessary to load the information onto light and use the propagation of light to achieve information transmission. Here, the light loaded with information is an optical signal. When transmitting optical signals within information transmission equipment, they can reduce optical power loss, thereby enabling high-speed, long-distance, and low-cost information transmission. The signals that information processing equipment can recognize and process are electrical signals. Information processing equipment typically includes optical network units (ONUs), gateways, routers, switches, mobile phones, computers, servers, tablets, televisions, etc., and information transmission equipment typically includes optical fibers and optical waveguides.

[0054] Optical modules can convert optical signals into electrical signals between information processing devices and information transmission devices. For example, at least one of the optical signal input or output ends of an optical module is connected to an optical fiber, and at least one of the electrical signal input or output ends of the optical module is connected to an optical network terminal. A first optical signal from the optical fiber is transmitted to the optical module, which converts the first optical signal into a first electrical signal and transmits the first electrical signal to the optical network terminal. A second electrical signal from the optical network terminal is transmitted to the optical module, which converts the second electrical signal into a second optical signal and transmits the second optical signal to the optical fiber. Because multiple information processing devices can transmit information via electrical signals, at least one of the multiple information processing devices needs to be directly connected to the optical module, rather than all of them. Here, the information processing device directly connected to the optical module is referred to as the optical module's host computer. Furthermore, the optical signal input or output end of the optical module can be referred to as an optical port, and the electrical signal input or output end of the optical module can be referred to as an electrical port.

[0055] Figure 1 is a partial structural diagram of an optical communication system according to some embodiments of the present disclosure. As shown in Figure 1 , the optical communication system mainly includes a remote information processing device 1000, a local information processing device 2000, a host computer 100, an optical module 200, an optical fiber 101, and a network cable 103.

[0056] One end of optical fiber 101 extends toward remote information processing device 1000, and the other end of optical fiber 101 is connected to optical module 200 through the optical port of optical module 200. Optical signals can be totally reflected in optical fiber 101, and the propagation of the optical signal in the direction of total reflection can almost maintain the original optical power. The optical signal undergoes multiple total reflections in optical fiber 101 to transmit the optical signal from remote information processing device 1000 to optical module 200, and vice versa, thereby achieving long-distance, low-power information transmission.

[0057] The optical communication system may include one or more optical fibers 101, and the optical fibers 101 may be detachably connected or fixedly connected to the optical module 200. The host computer 100 is configured to provide data signals to the optical module 200, receive data signals from the optical module 200, or monitor or control the operating status of the optical module 200.

[0058] The host computer 100 includes a substantially rectangular housing and an optical module interface 102 disposed on the housing. The optical module interface 102 is configured to connect to the optical module 200 to establish a unidirectional or bidirectional electrical signal connection between the host computer 100 and the optical module 200.

[0059] The host computer 100 also includes an external electrical interface that can access an electrical signal network. For example, the external electrical interface includes a Universal Serial Bus (USB) interface or a network cable interface 104. The network cable interface 104 is configured to access a network cable 103 so that the host computer 100 establishes a unidirectional or bidirectional electrical signal connection with the network cable 103. One end of the network cable 103 is connected to the local information processing device 2000, and the other end of the network cable 103 is connected to the host computer 100, so that an electrical signal connection is established between the local information processing device 2000 and the host computer 100 via the network cable 103. For example, a third electrical signal emitted by the local information processing device 2000 is transmitted to the host computer 100 via the network cable 103. The host computer 100 generates a second electrical signal based on the third electrical signal. The second electrical signal from the host computer 100 is transmitted to the optical module 200. The optical module 200 converts the second electrical signal into a second optical signal and transmits the second optical signal to the optical fiber 101. The second optical signal is then transmitted to the remote information processing device 1000 via the optical fiber 101. For example, a first optical signal from the remote information processing device 1000 is transmitted through the optical fiber 101. The first optical signal from the optical fiber 101 is transmitted to the optical module 200. The optical module 200 converts the first optical signal into a first electrical signal. The optical module 200 transmits the first electrical signal to the host computer 100. The host computer 100 generates a fourth electrical signal based on the first electrical signal and transmits the fourth electrical signal to the local information processing device 2000. It should be noted that optical modules are tools for converting optical signals into electrical signals. During this conversion process, the information does not change, but the encoding and decoding methods of the information can change.

[0060] In addition to the optical network terminal, the host computer 100 also includes an optical line terminal (OLT), an optical network device (ONT), or a data center server.

[0061] Figure 2 is a partial structural diagram of a host computer according to some embodiments of the present disclosure. In order to clearly illustrate the connection relationship between the optical module 200 and the host computer 100, Figure 2 only shows the structure of the host computer 100 related to the optical module 200. As shown in Figure 2, the host computer 100 also includes a PCB circuit board 105 disposed within the housing, a cage 106 disposed on the surface of the PCB circuit board 105, a heat sink 107 disposed on the cage 106, and an electrical connector disposed within the cage 106. The electrical connector is configured to connect to the electrical port of the optical module 200; the heat sink 107 has a protruding structure such as fins that increase the heat dissipation area.

[0062] The optical module 200 is inserted into the cage 106 of the host computer 100. The cage 106 secures the optical module 200. Heat generated by the optical module 200 is transferred to the cage 106 and then dissipated through the heat sink 107. After the optical module 200 is inserted into the cage 106, the electrical port of the optical module 200 connects with the electrical connector inside the cage 106, thereby establishing a bidirectional electrical signal connection between the optical module 200 and the host computer 100. Furthermore, the optical port of the optical module 200 connects to the optical fiber 101, thereby establishing a bidirectional optical signal connection between the optical module 200 and the optical fiber 101.

[0063] Figure 3 is a structural diagram of an optical module according to some embodiments of the present disclosure, and Figure 4 is an exploded view of an optical module according to some embodiments of the present disclosure. As shown in Figures 3 and 4, the optical module 200 includes a housing, a circuit board 300 disposed within the housing, a light emitting component 400, and a light receiving component 500. However, the present disclosure is not limited thereto. In some embodiments, the optical module 200 includes either the light emitting component 400 or the light receiving component 500.

[0064] The housing includes an upper housing 201 and a lower housing 202 . The upper housing 201 covers the lower housing 202 to form the housing having two openings 204 and 205 . The outer contour of the housing is generally a square.

[0065] In some embodiments, the lower shell 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and arranged perpendicular to the base plate 2021; the upper shell 201 includes a cover plate 2011, and the cover plate 2011 covers the two lower side plates 2022 of the lower shell 202 to form the above-mentioned shell.

[0066] In some embodiments, the lower shell 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and arranged perpendicularly to the base plate 2021; the upper shell 201 includes a cover plate 2011 and two upper side plates located on both sides of the cover plate 2011 and arranged perpendicularly to the cover plate 2011. The two upper side plates are combined with the two lower side plates 2022 to achieve the upper shell 201 covering the lower shell 202.

[0067] The direction of the line connecting the two openings 204 and 205 can be consistent with the length direction of the optical module 200, or it can be inconsistent with the length direction of the optical module 200. For example, the opening 204 is located at the end of the optical module 200 (the left end in FIG3 ), and the opening 205 is also located at the end of the optical module 200 (the right end in FIG3 ). Alternatively, the opening 204 is located at the end of the optical module 200, and the opening 205 is located on the side of the optical module 200. The opening 204 is an electrical port, and the gold finger 301 of the circuit board 300 extends from the opening 204 and is inserted into the electrical connector of the host computer 100. The opening 205 is an optical port, which is configured to receive an external optical fiber 101, so that the optical fiber 101 connects the optical emitting component 400 and the optical receiving component 500 in the optical module 200.

[0068] The combined assembly of the upper housing 201 and the lower housing 202 facilitates the installation of the circuit board 300, the light emitting component 400, the light receiving component 500, and the like within the housing. The upper housing 201 and the lower housing 202 provide encapsulation and protection for these components. Furthermore, during assembly of the circuit board 300, the light emitting component 400, and the light receiving component 500, the positioning components, heat dissipation components, and electromagnetic shielding components of these components are easily positioned, facilitating automated production.

[0069] In some embodiments, the upper shell 201 and the lower shell 202 are made of metal materials, which facilitates electromagnetic shielding and heat dissipation.

[0070] In some embodiments, the optical module 200 further includes an unlocking component 600 located outside its housing. The unlocking component 600 is configured to achieve a fixed connection between the optical module 200 and the host computer, or to release the fixed connection between the optical module 200 and the host computer.

[0071] For example, the unlocking component 600 is located on the outside of the two lower side panels 2022 of the lower housing 202 and includes a snap-fit ​​component that mates with the cage 106 of the host computer 100. When the optical module 200 is inserted into the cage 106, the snap-fit ​​component of the unlocking component 600 secures the optical module 200 in the cage 106. When the unlocking component 600 is pulled, the snap-fit ​​component of the unlocking component 600 moves accordingly, thereby changing the connection between the snap-fit ​​component and the host computer, thereby releasing the optical module 200 from the cage 106 and allowing the optical module 200 to be removed from the cage 106.

[0072] The circuit board 300 includes circuit traces, electronic components, and chips. The electronic components and chips are connected according to the circuit design through the circuit traces to achieve functions such as power supply, electrical signal transmission, and grounding. Electronic components may include, for example, capacitors, resistors, transistors, and metal-oxide-semiconductor field-effect transistors (MOSFETs). Chips may include, for example, microcontroller units (MCUs), laser driver chips, transimpedance amplifiers (TIAs), limiting amplifiers, clock and data recovery chips (CDRs), power management chips, and digital signal processing (DSP) chips.

[0073] The circuit board 300 is generally a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also realize the load-bearing function. For example, the rigid circuit board can stably carry the above-mentioned electronic components and chips; the rigid circuit board can also be inserted into the electrical connector in the cage 106 of the host computer 100.

[0074] The circuit board 300 also includes a gold finger 301 formed on its end surface, and the gold finger 301 is composed of a plurality of independent pins. The circuit board 300 is inserted into the cage 106, and the gold finger 301 is connected to the electrical connector in the cage 106. The gold finger 301 can be set only on the surface of one side of the circuit board 300 (for example, the upper surface shown in Figure 4), or it can be set on the upper and lower surfaces of the circuit board 300 to provide a larger number of pins, thereby adapting to occasions where a large number of pins are required. The gold finger 301 is configured to establish an electrical connection with the host computer to achieve power supply, grounding, two-wire synchronous serial (Inter-Integrated Circuit, I2C) signal transmission, data signal transmission, etc. Of course, flexible circuit boards are also used in some optical modules. Flexible circuit boards are generally used in conjunction with rigid circuit boards to supplement rigid circuit boards.

[0075] At least one of the light emitting component 400 or the light receiving component 500 is located on a side of the circuit board 300 away from the gold finger 301 .

[0076] In some embodiments, the light emitting component 400 and the light receiving component 500 are physically separated from the circuit board 300 and then electrically connected to the circuit board 300 through corresponding flexible circuit boards or electrical connectors.

[0077] In some embodiments, at least one of the light emitting component or the light receiving component may be directly disposed on the circuit board 300. For example, at least one of the light emitting component or the light receiving component may be disposed on a surface of the circuit board 300 or a side of the circuit board 300.

[0078] As the transmission rate of optical modules becomes higher and higher, the volume requirement for optical modules becomes smaller and smaller, which brings problems such as high-frequency signal transmission performance and optical path crosstalk to the design of optical modules. It has become a major challenge in the industry to arrange more optical components in a smaller optical module housing while taking into account high-frequency signal transmission performance and optical path crosstalk.

[0079] In some examples of the present disclosure, the optical demultiplexing component and the optical multiplexing component can be arranged in a direction perpendicular to the light engine to reduce the space occupied by the light engine.

[0080] In some examples, the optical demultiplexing component and the optical multiplexing component can be stacked to reduce the space occupied by the optical engine.

[0081] To ensure high-frequency signal transmission, the laser surface can be flush with the circuit board surface. In this case, the optical path height at the light-emitting component is relatively low. However, the optical path at the light-receiving component requires a certain height difference from the circuit board surface. The optical path design and requirements for the light-emitting and light-receiving components make it feasible to stack the optical demultiplexer and optical multiplexer components. This height difference at the light-receiving component can be achieved by supporting the refraction unit at a certain height.

[0082] In some examples, the refractive portion may include a turning prism.

[0083] By reasonably setting the height of the optical device, optical path matching is achieved, so that the light receiving optical path and the light emitting optical path can be set in a relative upper and lower position relationship, avoiding interference and crosstalk between the light receiving optical path and the light emitting optical path, and realizing a reasonable layout of the light receiving components and the light emitting components.

[0084] In some examples of the embodiments of the present disclosure, in order to achieve the transmission of multiple optical signals, the optical transmission component 400 can emit multiple optical signals. In some embodiments, when emitting multiple optical signals, they can be emitted separately instead of being combined into a single optical signal for transmission. Exemplarily, multiple optical signals are emitted separately through an optical fiber array, and the laser has a corresponding optical fiber ribbon for transmitting the optical signal. In some embodiments, when emitting multiple optical signals, they can be combined into a single optical signal for transmission. Exemplarily, when combining, combining can be achieved through an optical multiplexing component. Exemplarily, when combining, combining can be achieved through a combination of different filters, and the transmission and reflection characteristics of the filters for specific wavelengths can be utilized to achieve combining by using a combination of multiple filters. Exemplarily, when combining, combining can also be achieved through a combination of different polarization state devices such as polarizers, and the polarization state devices have different transmission characteristics for light with different polarization directions, and the combination of multiple polarizers can be achieved. Exemplarily, when combining, combining can also be achieved through a combination of filters and polarizers.

[0085] In some examples of the embodiments of the present disclosure, in order to achieve the reception of multiple optical signals, the optical receiving component 500 may include multiple photodetectors to receive the multiple optical signals. In some embodiments, the multiple optical signals can be received by an optical fiber array, and then the optical path is deflected by an optical path deflection device, so that the multiple optical signals are transmitted to multiple photodetectors respectively. When the optical path is deflected, the optical fiber end face can also be formed into a reflective surface by grinding, thereby achieving the change of the optical path. For example, when the optical fiber end face is formed into a reflective surface by grinding, the optical fiber can be clamped up and down because the optical fiber is soft. At this time, the optical fiber can be extended or not extended. If the optical fiber is extended, the optical fiber end face can be polished separately. If the optical fiber is not extended, it can be polished together with the upper and lower clamping structures. In some embodiments, a received optical signal can be decomposed into multiple optical signals by an optical demultiplexing component, and then the optical path is deflected by an optical path deflection device, so that the multiple optical signals are transmitted to multiple photodetectors respectively. In some embodiments, an arrayed waveguide grating (AWG) may be used to decompose a received optical signal into multiple optical signals, and then the optical paths are turned so that the multiple optical signals are transmitted to the photodetector respectively.

[0086] Figure 5 illustrates the internal structure of an optical module according to some embodiments of the present disclosure; Figure 6 illustrates an exploded view of the internal structure of an optical module according to some embodiments of the present disclosure. As shown in Figures 5 and 6, the optical module may include a carrier 900. The surface of carrier 900 is used to support the light emitting component 400 and the light receiving component 500.

[0087] In some examples, a notch 302 may be formed on the surface of the circuit board 300 .

[0088] In some examples, the notch 302 may be formed in the middle of the circuit board 300 .

[0089] In some examples, the notch 302 may be formed on a side of the circuit board 300 .

[0090] In some examples, when the notch 302 is formed in the middle of the circuit board 300 , a supporting area may be formed on the carrier 900 , and the supporting area may support the edge of the notch 302 .

[0091] In some examples, the notch 302 may be formed at an end of the circuit board.

[0092] For ease of description, in some examples of the embodiments of the present disclosure, the example in which the notch 302 is formed in the middle of the circuit board 300 is first used for description.

[0093] In some examples, the carrier 900 is embedded in the notch 302 , thereby fixing the carrier 900 on the circuit board 300 .

[0094] In some embodiments, the light emitting component 400 may include a laser 401. The laser 401 may convert a received electrical signal into an optical signal.

[0095] The light emitting component 400 may include a thermoelectric cooler (TEC) 402. The laser 401 is disposed on the surface of the TEC 402. The TEC 402 may be configured to adjust the operating temperature of the laser 401 so that the operating temperature is stable within a certain range.

[0096] The optical emitting component 400 may include an optical multiplexing assembly 403. The optical multiplexing assembly 403 may be disposed on a surface of the carrier 900. The optical multiplexing assembly 403 is disposed on the optical path of the laser 401. The optical multiplexing assembly 403 may combine the laser signals emitted by the various lasers 401 into a single optical signal.

[0097] The light emitting component 400 may include a first collimating lens 404. The first collimating lens 404 is disposed between the laser 401 and the optical multiplexing component 403.

[0098] The light emitting component 400 may include a first converging lens 405 . The first converging lens 405 is disposed on the light outgoing path of the optical multiplexing component 403 .

[0099] The light emitting component 400 may include a first fiber collimator 406 .

[0100] In some examples of the disclosed embodiments, lasers 401 and first collimating lenses 404 are disposed on the surface of TEC 402. Lasers 401 are arranged in an array. A predetermined number of lasers 401 may be disposed on the surface of TEC 402. The optical signals emitted by each laser 401 are collimated by first collimating lenses 404 and then enter optical multiplexing assembly 403 as parallel light. Optical multiplexing assembly 403 combines the optical signals emitted by each laser 401 into a single optical signal. The combined optical signal is then transmitted to the exterior of the optical module via first converging lens 405 and first fiber collimator 406.

[0101] In order to improve high-frequency signal transmission performance, the surface of the laser 401 can be flush with the surface of the circuit board 300, so as to shorten the wiring distance between the laser 401 and the circuit board 300 and improve high-frequency signal transmission performance.

[0102] In some examples of the disclosed embodiments, when the surface of the laser 401 is flush with the surface of the circuit board 300, the height of the pigtail connected to the first fiber collimator 406 is aligned with the height of the surface of the circuit board 300. To prevent the pigtail connected to the first fiber collimator 406 from interfering with the surface of the circuit board 300 and being broken, a recessed portion 303 is formed on the surface of the circuit board 300 to allow the pigtail connected to the first fiber collimator 406 to pass through, thereby preventing the pigtail from interfering with the circuit board 300 and being broken.

[0103] In some embodiments, the light receiving component 500 may include a second fiber collimator 501 .

[0104] The light receiving part 500 may include a second collimating lens 502 .

[0105] The optical receiving component 500 may include an optical demultiplexing assembly 503. The external optical signal is transmitted to the optical demultiplexing assembly 503 via the second optical fiber collimator 501 and the second collimating lens 502. The optical demultiplexing assembly 503 decomposes the external optical signal into multiple optical signals.

[0106] The optical receiving component 500 may include a second converging lens 504. The second converging lens 504 is arranged in an array to receive the multiple optical signals output by the optical demultiplexing component 503. The light inlet of the second converging lens 504 faces the optical demultiplexing component 503.

[0107] The light receiving component 500 may include a deflecting portion 505. The light receiving direction of the light receiving chip is perpendicular to the surface of the circuit board 300, while the light transmission direction of the second fiber collimator 501 is parallel to the circuit board 300. To this end, the deflecting portion 505 is provided in the transmission optical path between the second fiber collimator 501 and the light receiving chip. The deflecting portion 505 functions as a light path deflection, redirecting the external optical signal transmitted by the second fiber collimator 501 toward the light receiving chip, thereby redirecting the external optical signal toward the light receiving chip for transmission into the light receiving chip.

[0108] In some examples, the light incident surface of the refracting portion 505 faces the optical demultiplexing component 503 , and the light emitting surface faces the light receiving chip.

[0109] Exemplarily, the refraction portion 505 may have a reflective surface.

[0110] Exemplarily, the refractive portion 505 may be a turning prism.

[0111] The light receiving component 500 may include a light receiving chip 506. The light receiving chip 506 may convert a received optical signal into an electrical signal. The light receiving chips 506 may be arranged in an array.

[0112] The optical receiving component 500 may include a transimpedance amplifier 507. The transimpedance amplifier 507 may be electrically connected to the optical receiving chip 506. The transimpedance amplifier 507 is configured to amplify the electrical signal converted and generated by the optical receiving chip 506.

[0113] The light receiving component 500 may include a support portion 508. The support portion 508 is used to support the refracting portion 505. Because the light path of the light receiving component needs to be turned, a certain height difference is required in the light path of the light receiving component. The support portion 508 supports the refracting portion to a certain height, thereby generating a certain height difference in the light path and achieving the turning of the light path.

[0114] Exemplarily, the support portion 508 supports the deflecting portion upward to a preset height from the surface of the circuit board 300 .

[0115] The second converging lens 504 and the refraction portion 505 are disposed on the surface of the support portion 508 so that the optical paths of the second converging lens 504 and the refraction portion 505 are coaxial with the optical path of the optical demultiplexing assembly 503 .

[0116] In some embodiments, the optical receiving chip 506 and the transimpedance amplifier 507 may be connected by wire bonding to achieve electrical connection between the two.

[0117] Exemplarily, the surface of the light receiving chip 506 has a first connection pad and a photosensitive surface. Usually, the first connection pad and the photosensitive surface of the light receiving chip 506 are located on the same surface.

[0118] A second connection pad is provided on the surface of the transimpedance amplifier 507. A wire bond is formed between the first and second connection pads to electrically connect the optical receiver chip 506 to the transimpedance amplifier 507. At this point, the photosensitive surface of the optical receiver chip 506 and the first connection pad are both facing upward, with the photosensitive surface exposed to the air. To reduce light signal reflection into the air and ensure that more light signal is absorbed into the photosensitive surface, the photosensitive surface is coated with an anti-reflection film. The refractive index of the anti-reflection film is greater than that of air, allowing more light signal to be transmitted into the photosensitive surface, thereby ensuring the received light power.

[0119] In some embodiments, the transimpedance amplifier 507 is disposed on the surface of the circuit board 300, and the first connection pad on the surface of the light receiving chip 506 is soldered to the second connection pad on the surface of the transimpedance amplifier 507, thereby electrically connecting the light receiving chip 506 and the transimpedance amplifier 507. That is, the light receiving chip 506 is attached upside down to the surface of the transimpedance amplifier 507, with the photosensitive surface of the light receiving chip 506 facing downward. To allow the light signal to be transmitted to the photosensitive surface, a lens is provided on the surface of the light receiving chip 506 exposed to air. An optical through hole can be formed between the lens and the photosensitive surface, through which the light signal is transmitted to the photosensitive surface, thereby achieving reception of the light signal.

[0120] By flip-chip bonding the optical receiver chip 506 to the transimpedance amplifier 507, parasitic effects caused by wire bonding can be avoided, improving signal transmission performance. Furthermore, since the photosensitive surface of the optical receiver chip 506 is not exposed to air, the optical signal is less likely to be reflected into the air, ensuring the received optical power.

[0121] As the transmission rate of optical modules continues to increase, the space reserved for optical engines becomes smaller. Therefore, in some embodiments of the present disclosure, the optical demultiplexing component 503 and the optical multiplexing component 403 may be stacked together to reduce the space occupied by the optical engine.

[0122] In some embodiments, since the space between the upper housing 201 and the circuit board 300 is larger than the space between the lower housing 202 and the circuit board 300, and a heat dissipation duct can be formed between the upper housing 201 of the optical module and the cage 106 of the host computer 100, the upper housing 201 has a better heat dissipation effect than the lower housing 202. Since the heat generated by the light emitting component is relatively large, the heat generated by it needs to be conducted away to ensure the normal operation of the light emitting component. In view of this, the carrier 900 can be set in the space between the upper housing 201 and the circuit board 300. That is, the position relationship of the carrier 900 shown in Figure 6 is flipped 180° for setting. At this time, the heat generated by the laser 401 is transmitted to the outside through the TEC 402 and the upper housing 201 in sequence, and the heat dissipation path is better, thereby achieving better heat dissipation.

[0123] The surface of the circuit board 300 that is opposite to the upper housing 201 is referred to as the top surface of the circuit board 300. The surface of the carrier 900 used to support the light emitting component 400 and the light receiving component 500 is referred to as the top surface of the carrier 900. For better heat dissipation, the bottom surface of the carrier 900 can be arranged toward the upper housing 201, that is, the bottom surface of the carrier 900 and the top surface of the circuit board 300 can both be arranged toward the upper housing 201 to provide a better heat dissipation path. Since the DSP 304 also generates a large amount of heat, the DSP 304 can be arranged on the top surface of the circuit board 300 so that the heat generated by the DSP 304 can be dissipated to the outside of the optical module through the upper housing 201.

[0124] Figure 7 is a first optical path diagram of an optical module according to some embodiments of the present disclosure. As shown in Figure 7 , the optical demultiplexing component 503 and the optical multiplexing component 403 are stacked.

[0125] The surface of the laser 401 is flush with the surface of the circuit board 300 , so the light path of the laser 401 is close to being along the surface of the circuit board 300 , and the light path of the laser 401 is relatively low.

[0126] Since the optical path of the optical receiving component needs to be turned, the optical receiving chip 506 is arranged on the surface of the circuit board 300 or on the surface of the transimpedance amplifier 507. Therefore, the optical path at the end of the optical receiving component needs to have a certain height difference from the surface of the circuit board in order to turn the optical path and turn the optical signal to the surface of the optical receiving chip 506.

[0127] The optical path design requirements of the optical transmitter and receiver provide feasibility for stacking the optical demultiplexer assembly 503 and the optical multiplexer assembly 403. The height difference of the optical receiver end can be achieved by supporting the deflecting portion 505 to a certain height from the surface of the circuit board 300 by the support portion 508.

[0128] In some embodiments of the present disclosure, the optical demultiplexing component 503 and the optical multiplexing component 403 are stacked to arrange the optical path of the light emitting end and the optical path of the light receiving end on the same surface of the circuit board 300 .

[0129] The surface of the circuit board 300 along which the light output path of the laser 401 is located and the surface of the circuit board 300 to which the refractive portion 505 is supported to a preset height by the support portion 508 can be the same surface of the circuit board 300 .

[0130] The light path of the laser 401 is close to the surface of the circuit board 300 , and the light path between the optical demultiplexing component 503 and the refracting portion 505 is at a preset distance from the surface of the circuit board 300 .

[0131] Exemplarily, the optical path (in some examples, it can be called the first optical path) formed between the second optical fiber collimator 501, the second collimating lens 502, the optical demultiplexing component 503, the second converging lens 504, and the refractive portion 505 is at a certain distance from the surface of the circuit board 300, so that the light output path of the laser 401 (in some examples, it can be called the second optical path) and the optical path formed between the second optical fiber collimator 501, the second collimating lens 502, the optical demultiplexing component 503, the second converging lens 504, and the refractive portion 505 are in a relative upper and lower position relationship, and the optical paths show a certain height difference in the relative upper and lower positions, thereby avoiding optical path interference and crosstalk between the light emitting end and the light receiving end.

[0132] FIG8 is a second optical path diagram of an optical module according to some embodiments of the present disclosure. As shown in FIG8 , the optical demultiplexing component 503 and the optical multiplexing component 403 are stacked.

[0133] The optical multiplexing assembly 403 is disposed on a surface of the carrier 900 , and the optical demultiplexing assembly 503 is disposed on a surface of the optical multiplexing assembly 403 .

[0134] The light inlet of the optical demultiplexing assembly 503 and the light outlet of the optical multiplexing assembly 403 may be located on two sides of the same end of the carrier 900 to avoid optical path interference.

[0135] The light emitting surface of the optical demultiplexing component 503 faces the light incident surface of the refraction portion 505 , and the light incident surface of the optical multiplexing component 403 faces the light emitting surface of the laser 401 .

[0136] The light emitting surface of the optical demultiplexing component 503 may be oriented in the same direction as the light incident surface of the optical multiplexing component 403 . For example, both face the laser 401 .

[0137] In some examples of the disclosed embodiments, the light input port of optical multiplexing assembly 403 faces the light output port of laser 401. The light output port of optical demultiplexing assembly 503 faces the light input port of refraction portion 505. The light input surface of optical multiplexing assembly 403 and the light output surface of optical demultiplexing assembly 503 are oriented in the same direction, both toward laser 401. In other words, laser 401 and refraction portion 505 are located on the same side of optical multiplexing assembly 403 and optical demultiplexing assembly 503.

[0138] In some examples of the embodiments of the present disclosure, in order to avoid optical path crosstalk between the optical receiving end and the optical transmitting end, there is a difference between the height of the light inlet of the refractive portion 505 and the height of the light outlet of the laser 401, so as to separate the optical path between the optical demultiplexing component 503 and the refractive portion 505 and the optical path between the optical multiplexing component 403 and the laser 401 by a certain distance in terms of relative upper and lower positional relationship, so that the optical path of the optical transmitting end and the optical path of the optical receiving end present a certain height difference in terms of relative upper and lower positional relationship, thereby avoiding interference and crosstalk between the optical receiving optical path and the optical transmitting optical path.

[0139] By aligning the surface of the laser 401 with the surface of the circuit board 300, the optical path of the light emitting end can be brought close to the surface of the circuit board 300. The support portion 508 supports the refracting portion 505 to a predetermined distance from the circuit board 300, providing a height difference for the optical path to bend, so that the optical path of the light receiving end is a predetermined distance from the surface of the circuit board 300. This ensures that the optical paths of the light emitting end and the light receiving end are in a relative vertical relationship. By adjusting the height of the light inlet of the refracting portion 505 and the height of the light outlet of the laser 401, the optical paths of the light emitting end and the light receiving end do not interfere with each other in their relative vertical relationship.

[0140] In terms of the positional relationship shown in FIG8 , the optical demultiplexing assembly 503 is positioned above the optical multiplexing assembly 403. The optical path formed by the second fiber collimator 501, the second collimating lens 502, the optical demultiplexing assembly 503, the second converging lens 504, and the refraction unit 505 is located above the optical path formed between the laser 401 and the optical multiplexing assembly 403.

[0141] The optical paths of the light emitting end and the light receiving end are in a relative upper and lower position relationship: the light output path of the laser 401 is relatively closer to the surface of the circuit board 300; the refraction portion 505 is at a certain distance from the surface of the circuit board 300 to facilitate the turning of the optical path. At this time, the refraction portion 505 is above the surface of the circuit board 300.

[0142] The support portion 508 can support the refracting portion 505 to a certain height to bend the optical path of the optical signal. For example, the optical path of the optical signal is turned downward.

[0143] In the positional relationship shown in Figure 8 , if the optical multiplexing assembly 403 is positioned above the optical demultiplexing assembly 503, then if the optical path height at the optical receiving end remains unchanged, the position of the laser 401 is passively raised. This causes the surface of the laser 401 to be uneven with the surface of the circuit board 300, resulting in a longer wire bond length between the laser 401 and the circuit board 300, and reduced high-frequency signal transmission performance. In the positional relationship shown in Figure 8 , if the optical multiplexing assembly 403 is positioned above the optical demultiplexing assembly 503, then if the optical path height at the optical transmitting end remains unchanged, the optical demultiplexing assembly 503 is positioned lower. In this case, due to the thickness of the TEC 402, the TEC 402 will inevitably block the optical path at the optical receiving end, hindering signal transmission at the optical receiving end.

[0144] In some embodiments of the present disclosure, the transimpedance amplifier 507 is electrically connected to the DSP 304 through metal vias to transmit the electrical signal amplified by the transimpedance amplifier 507 to the DSP 304. Wire bonding is performed between the surface of the laser 401 and the surface of the circuit board 300, and then an electrical connection is achieved between the surface of the laser 401 and the DSP 304 through metal vias on the surface of the circuit board 300 to transmit the electrical signal to the laser 401.

[0145] In some embodiments of the present disclosure, the optical demultiplexing assembly 503 is stacked with the optical multiplexing assembly 403. The light outlet of the optical demultiplexing assembly 503 faces the deflecting portion 505, and the light inlet of the optical multiplexing assembly 403 faces the laser 401. By adjusting the height difference between the light inlet of the deflecting portion 505 and the light outlet of the laser 401 to a preset value, the optical path between the optical demultiplexing assembly 503 and the deflecting portion 505 and the optical path between the optical multiplexing assembly 403 and the laser 401 are separated by a certain distance in terms of relative vertical position, thereby avoiding interference and crosstalk between the light receiving path and the light transmitting path.

[0146] For example, the light inlet height of the refracting portion 505 can be adjusted by adjusting the thickness of the supporting portion 508 , thereby adjusting the light inlet height of the refracting portion 505 and the light outlet height of the laser 401 to a preset difference.

[0147] Figure 9 is a third optical path diagram of an optical module according to some embodiments of the present disclosure. As shown in Figure 9, optical demultiplexing assembly 503 is stacked with optical multiplexing assembly 403. Optical multiplexing assembly 403 is disposed on the surface of carrier 900, and optical demultiplexing assembly 503 is disposed on the surface of optical multiplexing assembly 403.

[0148] The external optical signal is transmitted sequentially along the second optical fiber collimator 501, the second collimating lens 502, the optical demultiplexing assembly 503, the second converging lens 504, and the refracting portion 505. The external optical signal is split into multiple optical beams by the optical demultiplexing assembly 503. The refracting portion 505 redirects each optical beam to the surface of the optical receiving chip 506.

[0149] The support portion 508 supports the refracting portion 505 to a certain height to facilitate the turning of the optical signal path. When the support portion 508 supports the refracting portion 505 to a certain height, the optical path of the light receiving end is also supported to a certain height to avoid crosstalk and interference with the optical path of the light transmitting end.

[0150] Exemplarily, the second fiber collimator 501 and the second collimating lens 502 are disposed on the surface of the carrier 900. The surface height of the carrier 900 ensures that the optical path heights of the second fiber collimator 501 and the second collimating lens 502 are coaxial with the optical path heights of the optical demultiplexing assembly 503, thereby achieving optical path matching. The optical demultiplexing assembly 503 is disposed on the surface of the optical multiplexing assembly 403. One surface of the support portion 508 is connected to the circuit board 300, and the other surface is connected to the refractive portion 505.

[0151] Figure 10 is a fourth schematic diagram of the optical path of an optical module provided according to some embodiments of the present disclosure. As shown in Figure 10 , the optical signal emitted by laser 401 is collimated into parallel light by first collimating lens 404 and then enters optical multiplexing assembly 403 as parallel light. Optical multiplexing assembly 403 combines the individual optical signals into a single beam. The combined optical signal is then transmitted to the exterior of the optical module via first converging lens 405 and first fiber collimator 406.

[0152] The optical multiplexing assembly 403 is disposed on the surface of the carrier 900, and the surface of the laser 401 is flush with the surface of the circuit board 300, so that the optical path from the laser 401 to the optical multiplexing assembly 403 is close to the surface of the circuit board 300. The optical path from the laser 401 to the optical multiplexing assembly 403 is lower than the optical path between the second fiber collimator 501, the second collimating lens 502, the optical demultiplexing assembly 503, the second converging lens 504, and the refraction unit 505. The term "lower" refers to the positional relationship shown in Figure 10.

[0153] In some examples of the embodiments of the present disclosure, the light input port of the optical demultiplexing component 503 and the light output port of the optical multiplexing component 403 are located on opposite sides of the same end of the carrier 900. The first fiber collimator 406 and the second fiber collimator 501 are then located on opposite sides of the same end of the carrier 900, thereby further preventing optical crosstalk between the light emitting end and the light receiving end.

[0154] Exemplarily, the transmission path of the external optical signal along the second optical fiber collimator 501 and the second collimating lens 502 and the transmission path of the synthesized optical emission signal along the first converging lens 405 and the first optical fiber collimator 406 are located on different sides of the same surface, thereby avoiding interference or crosstalk between the optical paths.

[0155] The lens disposed between the second fiber collimator 501 and the optical demultiplexing assembly 503 is a second collimating lens 502. Therefore, each optical signal beam outputted by the optical demultiplexing assembly 503 is collimated light. Each optical signal beam outputted by the optical demultiplexing assembly 503 is transmitted as parallel light to the deflecting portion 505. In this case, the divergence angle is small, making it less likely for the optical signal to crosstalk with the optical transmitter, thus preventing optical signal crosstalk.

[0156] The lens positioned between laser 401 and optical multiplexing assembly 403 is a first collimating lens 404. Therefore, each optical signal entering optical multiplexing assembly 403 is collimated light. The optical signal output from laser 401 is transmitted to optical multiplexing assembly 403 as parallel light. This reduces the divergence angle, making it less likely that the optical signal will crosstalk with the optical receiving end, thus preventing optical signal crosstalk.

[0157] Figure 11 is a schematic cross-sectional view of the interior of an optical module according to some embodiments of the present disclosure; Figure 12 is a schematic side view of an optical module according to some embodiments of the present disclosure. As shown in Figures 11 and 12, the optical demultiplexing assembly 503 and the optical multiplexing assembly 403 are stacked on top of each other. By adjusting the optical path to avoid optical signal crosstalk, a compact optical device configuration is achieved, reducing the space occupied by the optical engine.

[0158] In some examples of the embodiments of the present disclosure, with respect to the upper and lower positional relationship shown in FIG12 , optical path crosstalk is avoided by setting the light output path of the laser 401 downward and then setting the light path of the light receiving end relatively upward.

[0159] The surface of the laser 401 is flush with the surface of the circuit board 300 , so the light path of the laser 401 is close to being along the surface of the circuit board 300 , and the light path of the laser 401 is relatively low.

[0160] In some examples, since the optical path of the light receiving component needs to be turned, the light receiving chip 506 can be disposed on the surface of the circuit board 300 .

[0161] In some examples, the optical receiving chip 506 can be disposed on the surface of the transimpedance amplifier 507. In this case, the optical path of the optical receiving component needs to have a certain height difference from the circuit board surface to bend the optical path and direct the optical signal to the surface of the optical receiving chip 506. This provides the feasibility of stacking the optical demultiplexing component 503 and the optical multiplexing component 403.

[0162] In some examples of the present disclosure, the optical demultiplexing component 503 and the optical multiplexing component 403 are stacked up and down. The thickness of the optical demultiplexing component 503 and the optical multiplexing component 403 can be adjusted to adjust the optical paths of the optical transmitting end and the optical receiving end, so as to achieve the purpose of non-interference of the optical paths.

[0163] Figure 13 is a top view of the interior of an optical module according to some embodiments of the present disclosure. As shown in Figure 13 , to avoid optical crosstalk and optical device interference, the light outlet of the optical multiplexing component 403 and the light inlet of the optical demultiplexing component 503 are located on both sides of the carrier 900 in the width direction.

[0164] Based on the principle of optical paths, the optical output port of optical multiplexing assembly 403 outputs a beam of optical signals, and the optical input port of optical demultiplexing assembly 503 inputs a beam of optical signals. When the optical output port of optical multiplexing assembly 403 and the optical input port of optical demultiplexing assembly 503 are located on opposite sides of the carrier 900 in the width direction, crosstalk between the optical signals output by the optical output port of optical multiplexing assembly 403 and the optical signals input by the optical input port of optical demultiplexing assembly 503 can be avoided.

[0165] The first optical fiber collimator 406 and the first converging lens 405 face the light outlet of the optical multiplexing component 403 .

[0166] The second fiber collimator 501 and the second collimating lens 502 face the light entrance of the optical demultiplexing component 503 .

[0167] The light output port of the optical multiplexing assembly 403 and the light input port of the optical demultiplexing assembly 503 are located on opposite sides of the carrier 900 in the width direction. Therefore, the first fiber collimator 406 and the second fiber collimator 501 are located on opposite sides of the same end of the carrier 900 in the width direction to prevent interference between the first fiber collimator 406 and the second fiber collimator 501. For example, the first fiber collimator 406 and the second fiber collimator 501 are located on the same side of the optical multiplexing assembly 403 or the optical demultiplexing assembly 503.

[0168] Accordingly, the first converging lens 405 and the second collimating lens 502 are located on opposite sides of the same end of the carrier 900 in the width direction, thereby preventing interference between the first converging lens 405 and the second collimating lens 502. For example, the first converging lens 405 and the second collimating lens 502 are located on the same side of the optical multiplexing assembly 403 or the optical demultiplexing assembly 503.

[0169] The transmission path of the external optical signal along the second optical fiber collimator 501 and the second collimating lens 502 and the transmission path of the synthesized optical transmit signal along the first converging lens 405 and the first optical fiber collimator 406 are located on different sides, thereby avoiding optical path crosstalk.

[0170] In some embodiments, the first fiber collimator 406 and the second fiber collimator 501 can also be located on different sides of the optical multiplexing assembly 403 or the optical demultiplexing assembly 503. For example, if the position of the light emitting component remains unchanged and the first fiber collimator 406 is moved to the other side of the optical multiplexing assembly 403 or the optical demultiplexing assembly 503, the position of the laser 401 should also be changed accordingly. When an external fiber ribbon is positioned on one side of the second fiber collimator 501, an optical connection can be achieved between the first fiber collimator 406 and the external fiber ribbon through fiber winding.

[0171] In some embodiments of the present disclosure, the light output port of the optical multiplexing assembly 403 is positioned near the first converging lens 405, and the light output end face of the optical multiplexing assembly 403 is tilted toward the first converging lens 405. The light input port of the optical demultiplexing assembly 503 is positioned toward the second collimating lens 502, and the light input end face of the optical demultiplexing assembly 503 is tilted toward the second collimating lens 502. Because the first converging lens 405 and the second collimating lens 502 are located on different sides of the carrier 900 in the width direction, there is a certain misalignment between the tilt direction of the light output end face of the optical multiplexing assembly 403 and the tilt direction of the light input end face of the optical demultiplexing assembly 503.

[0172] In some embodiments of the present disclosure, since the optical demultiplexing component 503 needs to be disposed on the surface of the optical multiplexing component 403 , the size of the optical multiplexing component 403 may be larger than that of the optical demultiplexing component 503 to better fix the optical demultiplexing component 503 .

[0173] Figure 14 is a schematic diagram illustrating the relative positional relationship between a first fiber collimator and a second fiber collimator of an optical module according to some embodiments of the present disclosure. As shown in Figure 14 , with respect to the positional relationship presented in Figure 14 , the optical axis of the second fiber collimator 501 is positioned higher than the optical axis of the first fiber collimator 406, thereby positioning the optical path of the light receiving component higher than the optical path of the light emitting component to avoid mutual interference.

[0174] The heights of the optical axes of the second fiber collimator 501 and the first fiber collimator 406 can be adjusted by adjusting the surface height of the supporting component 900 .

[0175] In some embodiments, to prevent the optical transmission signal from returning to the laser 401 along its original path, an isolator is integrated into the first fiber collimator 406. The isolator prevents the optical transmission signal from returning to the laser 401 along its original path, thereby ensuring the quality of the optical signal emitted by the laser 401. Because the first fiber collimator 406 is integrated with the isolator, its size is larger than that of the second fiber collimator 501.

[0176] Figure 15 is a structural diagram of a carrier according to an embodiment of the present disclosure. As shown in Figure 15, the surface of the carrier 900 is formed with supporting areas of varying surface heights for accommodating various optical devices. The varying surface heights of the supporting areas enable optical path matching.

[0177] A first carrying area 902 may be formed on a surface of the carrying member 900 .

[0178] The first carrying area 902 is configured to carry the second fiber collimator 501 and the second collimating lens 502 respectively.

[0179] The surface of the first supporting area 902 is relatively high to ensure that the second fiber collimator 501 and second collimating lens 502 disposed thereon are at a relatively high height. For example, the first supporting area 902 may be in the form of a boss. To avoid interference with the optical path of the light emitting component, the second fiber collimator 501 and second collimating lens 502 are disposed at a relatively high height. This also provides a height difference in the optical path at the light receiving end, facilitating optical path deflection during optical signal transmission.

[0180] A first stopper 903 is formed on one side of the first supporting area 902 to limit and secure the second fiber collimator 501. The first stopper 903 can be in the form of a barrier. The top surface of the first stopper 903 is higher than the top surface of the first supporting area 902. For example, the sidewalls of the second fiber collimator 501 rest against the sidewalls of the first stopper 903 to limit and secure the second fiber collimator 501.

[0181] The length of the first stopper 903 does not extend toward the second collimating lens 502. In other words, a notch 904 is formed on one side of the first stopper 903. Since the coupling of the second collimating lens 502 is active, such as by an active coupling device sucking the second collimating lens 502 for coupling, the notch 904 provides space for active coupling and facilitates observation of the coupling status of the second collimating lens 502.

[0182] The surface of the carrier 900 may form a second carrier area 905 .

[0183] Second support area 905 is configured to support TEC 402, laser 401, and first collimating lens 404. Laser 401 and first collimating lens 404 are provided on the surface of TEC 402. The assembly consisting of TEC 402, laser 401, and first collimating lens 404 is referred to as a light-emitting assembly. Second support area 905 is used to support the light-emitting assembly.

[0184] To improve high-frequency signal transmission performance, the surface of the laser 401 can be flush with the surface of the circuit board 300 to ensure shorter bonding wires, thereby improving high-frequency signal transmission performance. Because the TEC 402 has a certain height, the second supporting area 905 can be designed as a recessed area to ensure that the surface of the laser 401 is flush with the surface of the circuit board 300. The surface of the second supporting area 905 is relatively recessed.

[0185] A third carrying area 906 may be formed on the surface of the carrier 900 .

[0186] The third carrying area 906 is disposed between the first carrying area 902 and the second carrying area 905 , and is configured to carry the optical multiplexing component 403 .

[0187] To secure the optical multiplexing assembly 403 to the surface of the third supporting area 906, the surface of the third supporting area 906 is formed with a first subarea 9061, a second subarea 9062, and a third subarea 9063. The first subarea 9061 is a glue dispensing area for securing the optical multiplexing assembly 403. The second subarea 9062 is a glue overflow groove to collect overflowing glue. The surface of the third subarea 9063 is configured to support the optical multiplexing assembly 403.

[0188] Since the optical path height at the optical emission end is relatively low, the surface height of the third supporting area 906 is lower than the surface height of the first supporting area 902. The height difference between the third supporting area 906 and the first supporting area 902 forms a step, so that the optical multiplexing assembly 403 rests on the wall surface of the third supporting area 906.

[0189] A fourth carrying area 907 may be formed on the surface of the carrying member 900 .

[0190] The fourth carrying area 907 is configured to carry the first converging lens 405. The fourth carrying area 907 is disposed on one side of the first carrying area 902 so that the first converging lens 405 and the second collimating lens 502 are located on both sides.

[0191] A fifth carrying area 908 may be formed on the surface of the carrier 900 .

[0192] The fifth carrying area 908 is configured to carry the first optical fiber collimator 406. The fifth carrying area 908 is disposed on one side of the first carrying area 902 so that the first optical fiber collimator 406 and the second optical fiber collimator 501 are located on both sides.

[0193] The height of the first carrying area 902 is higher than that of the fourth carrying area 907 and the fifth carrying area 908 to avoid interference between the optical path of the light receiving end and the optical path of the light emitting end.

[0194] In some embodiments of the present disclosure, in order to coordinate the light receiving optical path and the light emitting optical path, in the carrier 900, the height of the third carrier area 906 and the thickness of the supporting portion are such that there is a preset difference between the height of the light inlet of the refractive portion 505 and the height of the light outlet of the laser 401, so that the optical path between the optical demultiplexing component 503 and the refractive portion 505 and the optical path between the optical multiplexing component 403 and the laser 401 are in relative upper and lower positions.

[0195] The height of the first carrying area 902 enables the optical path of the second optical fiber collimator 501 to match that of the refraction portion 505 .

[0196] The height of the second carrying area 905 enables the optical paths of the optical multiplexing component 403 and the laser 401 to match, and enables the optical demultiplexing component on the surface of the optical multiplexing component 403 to match the optical path of the refraction portion 505 to match.

[0197] The height of the fourth carrying area 907 enables the optical paths of the first converging lens 405 and the optical multiplexing component 403 to match each other.

[0198] The height of the fifth carrying area 908 enables the optical path of the first optical fiber collimator 406 to match that of the optical multiplexing component 403 .

[0199] In the present disclosure, the optical path design is achieved by rationally designing the structure of the carrier 900 .

[0200] FIG16 is a second structural diagram of a carrier according to some embodiments of the present disclosure. As shown in FIG16 , the surface height of the fourth carrier area 907 is higher than the surface height of the fifth carrier area 908 to match the optical path height of the first converging lens 405 and the first fiber collimator 406.

[0201] A second stopper 909 is formed on one side of the third support area 906 to securely position the optical multiplexing assembly 403. The second stopper 909 can be in the form of a barrier. The top surface of the second stopper 909 is higher than the top surface of the third support area 906. For example, the optical multiplexing assembly 403 rests on the sidewall of the second stopper 909 to securely position the optical multiplexing assembly 403.

[0202] Likewise, the second limiting portion 909 does not extend toward the fourth supporting area 907 , so as to provide a coupling space for the active coupling of the first converging lens 405 and facilitate observation of the coupling state of the first converging lens 405 .

[0203] FIG17 is a third structural diagram of a carrier according to some embodiments of the present disclosure. As shown in FIG17 , an escape portion 910 is formed between the second carrier area 905 and the second limiting portion 909 .

[0204] The surface of the second supporting area 905 is provided with a TEC 402. The avoidance portion 910 is provided to avoid the positive and negative bonding wires of the TEC 402.

[0205] Figure 18 is a schematic diagram (I) of a connection between a circuit board and a carrier according to some embodiments of the present disclosure; Figure 19 is a schematic diagram (II) of a connection between a circuit board and a carrier according to some embodiments of the present disclosure. As shown in Figures 18-19, the edge of the carrier 900 supports the circuit board 300, thereby achieving a fixed connection between the carrier 900 and the circuit board 300.

[0206] Edge portions (also referred to as supporting areas in some examples) 901 are formed around the edges of the carrier 900 . The edge portions 901 are used to support the circuit board 300 .

[0207] In the width direction of the carrier 900 , there is still a certain space between the second carrying area 905 and the outermost edge of the carrier 900 to form an edge portion 901 to support the circuit board 300 .

[0208] In the width direction of the carrier 900 , there is still a certain space between the first supporting area 902 and the other outermost edge of the carrier 900 to form an edge portion 901 on the other side to support the circuit board 300 .

[0209] The carrier 900 also has a certain amount of blank space in the length direction to form edge portions 901 on both sides to support the circuit board 300 .

[0210] Figure 20 shows an assembly diagram of a carrier, light emitting component, and light receiving component according to some embodiments of the present disclosure; Figure 21 shows an exploded view of the assembly diagram of a carrier, light emitting component, and light receiving component according to some embodiments of the present disclosure. As shown in Figures 20 and 21, the carrier 900 is used to support the light emitting component 400 and the light receiving component 500.

[0211] The surface of the carrier 900 is formed with supporting areas with different surface heights to accommodate various optical devices. The surface heights of the supporting areas are different to achieve optical path matching between the various optical devices.

[0212] In the light emitting component 400, the light emitting components are disposed on the surface of the carrier 900. For example, the light emitting components are disposed on the surface of the second carrier area 905. The light emitting components include a TEC 402, a laser 401, and a first collimating lens 404.

[0213] The optical multiplexing component 403 is disposed on the surface of the third supporting area 906 .

[0214] The first converging lens 405 is disposed on the surface of the fourth supporting area 907 .

[0215] The first optical fiber collimator 406 is disposed on the surface of the fifth supporting area 908 .

[0216] In the optical receiving component 500 , the second optical fiber collimator 501 and the second collimating lens 502 are both disposed on the surface of the first carrying area 902 . The optical demultiplexing assembly 503 is disposed on the surface of the optical multiplexing assembly 403 .

[0217] The support portion 508 is disposed on the surface of the circuit board 300 . The second converging lens 504 and the refractive portion 505 are disposed on the surface of the support portion 508 .

[0218] In the present disclosure, the optical demultiplexing component and the optical multiplexing component are stacked, and there is a difference between the height of the light inlet of the refractive part and the height of the light outlet of the laser, so as to separate the optical path between the optical demultiplexing component and the refractive part and the optical path between the optical multiplexing component and the laser by a certain distance in terms of the relative upper and lower positions, thereby avoiding interference and crosstalk between the light receiving optical path and the light emitting optical path. In the present disclosure, the space occupied by the light engine is reduced by stacking the optical demultiplexing component and the optical multiplexing component. The surface of the laser can be flush with the surface of the circuit board, and the height of the optical path at the end of the light emitting component is lower. The optical path at the end of the light receiving component just needs to have a certain height difference from the surface of the circuit board to turn the optical path. Therefore, it is feasible to stack the optical demultiplexing component and the optical multiplexing component. Among them, the height difference at the end of the light receiving component can be achieved by supporting the refractive part to a certain height by the support part. By rationally designing the setting height of the optical device, optical path matching is achieved, so that the light receiving optical path and the light emitting optical path are set in a relative upper and lower position relationship, thereby avoiding interference and crosstalk between the light receiving optical path and the light emitting optical path, and realizing a reasonable layout of the light receiving components and the light emitting components.

[0219] In some examples of the embodiments of the present disclosure, in order to maintain the integrity of the circuit board and ensure the strength of the circuit board, the notch on the circuit board can be set on the side of the circuit board.

[0220] For example, the notch may be provided on one side of the circuit board along the width direction of the circuit board.

[0221] In some examples, the notch can be provided at the side of the end of the circuit board. For example, the notch can be provided at one end of the circuit board along the length of the circuit board. For example, the notch can be provided at the end of the circuit board facing away from the gold finger.

[0222] For ease of explanation, the following description will be made by taking an example where the notch is formed at the end of the circuit board.

[0223] Figure 22 is a diagram of the internal structure of an optical module provided according to some embodiments of the present disclosure. As shown in Figure 22, in some embodiments, a DSP chip 304 may be provided on the surface of the circuit board 300. For example, a DSP chip (in some examples, it may also be referred to as a DSP) 304 may be provided on the upper surface of the circuit board 300. Because optical signals are distorted during transmission over an optical fiber link, some embodiments of the present disclosure use a DSP chip 304 to process electrical signals emitted by a host computer, thereby counteracting and compensating for distortion, thereby reducing the impact of distortion on the system bit error rate. The DSP chip 304 may also perform compensation processing on electrical signals, such as chromatic dispersion compensation and polarization mode dispersion compensation.

[0224] In some examples, the carrier 900 may be made of materials such as ceramics to have better heat dissipation performance, which is beneficial to the normal operation of the light emitting component 400 and the light receiving component 500 .

[0225] In some embodiments, the light emitting component 400 and the light receiving component 500 are respectively disposed on different surfaces of the carrier 900. In this case, the light emitting component 400 or the light receiving component 500 is inevitably electrically connected to the DSP chip 304 through a via. The via introduces parasitic effects, thereby reducing high-frequency signal transmission performance.

[0226] In some embodiments, the light emitting component 400 and the light receiving component 500 are disposed on the same surface of the carrier 900. For example, the light emitting component 400 and the light receiving component 500 can both be disposed on the upper surface of the carrier 900.

[0227] The light emitting component 400 and the light receiving component 500 can be arranged side by side on the same surface of the carrier 900, so that the light emitting component 400 and the light receiving component 500 do not interfere with each other, thereby avoiding the problem of optical path crosstalk.

[0228] The DSP chip 304 , the light emitting component 400 , and the light receiving component 500 may all be in the same direction. For example, the DSP chip 304 , the light emitting component 400 , and the light receiving component 500 may all face the upper housing 201 .

[0229] One side of the DSP chip 304 faces both the light emitting component 400 and the light receiving component 500. Therefore, the DSP chip 304 can be electrically connected to both the light emitting component 400 and the light receiving component 500 at the same time, and the electrical connection distances between the DSP chip 304 and the light emitting component 400, and between the DSP chip 304 and the light receiving component 500, are relatively short, thereby improving the high-frequency signal transmission performance of the light emitting end and the light receiving end.

[0230] On the side of the DSP chip 304 facing the light emitting component 400 and the light receiving component 500 , one end faces the light emitting component 400 , and the other end faces the light receiving component 500 .

[0231] Figure 23 is a third schematic diagram of a connection between a circuit board and a carrier according to some embodiments of the present disclosure. As shown in Figure 23 , in some embodiments, a carrier 900 can be connected to an end of a circuit board 300. It is understood that the carrier 900 can also be provided on the surface of the circuit board 300.

[0232] The carrier 900 may include a sixth carrier area 920. The sixth carrier area 920 is located on the upper surface of the carrier 900. The sixth carrier area 920 is configured to dispose the light emitting component 400.

[0233] The carrier 900 may include a seventh carrier area 930. The seventh carrier area 930 is located on the upper surface of the carrier 900. The seventh carrier area 930 is configured to accommodate the light receiving component 500. The seventh carrier area 930 may be located on one side of the sixth carrier area 920.

[0234] The seventh carrying area 930 and the sixth carrying area 920 can be arranged side by side on one side of the DSP chip 304 , so that the light emitting component 400 carried on the surface of the sixth carrying area 920 and the light receiving component 500 carried on the surface of the seventh carrying area 930 are arranged side by side on one side of the DSP chip 304 .

[0235] The carrier 900 may include a supporting area 940 configured to support the circuit board 300. The supporting area 940 is formed to extend along the sixth supporting area 920 and the seventh supporting area 930 toward the end of the circuit board 300 to connect with the end of the circuit board 300 in the length direction.

[0236] The circuit board 300 supported on the surface of the supporting area 940 can be electrically connected to the light emitting component 400 and the light receiving component 500 at the same time, and then the DSP chip 304 on the surface of the circuit board can be electrically connected to the light emitting component 400 and the light receiving component 500 at the same time.

[0237] The carrier 900 may include a sidewall 950 . The sidewall 950 may be provided on one side of the sixth carrier area 920 . The sidewall 950 may have a predetermined height. The top surface of the sidewall 950 may be higher than the surface of the sixth carrier area 920 .

[0238] The surface of the supporting area 940 forms a height difference with the seventh supporting area 930 and the side wall 950, so that the end of the circuit board 300 abuts against the side of the seventh supporting area 930 and the side of the side wall 950, thereby fixing the end of the circuit board 300 in the length direction to the surface of the supporting area 940.

[0239] For example, the top surface of the sidewall 950 is higher than the surface of the supporting area 940, thereby forming a height difference between the sidewall 950 and the supporting area 940. Thus, one end of the circuit board 300 can be overlapped at the height difference formed between the sidewall 950 and the supporting area 940, thereby fixing the end of the circuit board 300 in the longitudinal direction to the surface of the supporting area 940. The height difference formed between the sidewall 950 and the supporting area 940 can be a stepped structure.

[0240] For example, the surface of the seventh loading area 930 is higher than the surface of the supporting area 940, thereby forming a height difference between the seventh loading area 930 and the supporting area 940. The other end of the circuit board 300 can then be overlapped at the height difference formed between the seventh loading area 930 and the supporting area 940, thereby fixing the end of the circuit board 300 in the longitudinal direction to the surface of the supporting area 940. The height difference formed between the seventh loading area 930 and the supporting area 940 can be a stepped structure.

[0241] Figure 24 is a fourth schematic diagram of a connection between a circuit board and a carrier according to some embodiments of the present disclosure. As shown in Figure 7, in some embodiments, the light receiving component 500 may include a light receiving chip.

[0242] A boss (in some examples, may be referred to as a supporting portion) 931 may be formed on the surface of the supporting area 940. The surface of the boss 931 is configured to accommodate a light receiving chip.

[0243] The boss 931 has a predetermined height so that the light receiving chip is flush with the surface of the circuit board 300 .

[0244] In some examples of the embodiments of the present application, the notch 303 can be configured to avoid the boss 931. The notch 303 can be an open structure to facilitate the embedding of the boss 931.

[0245] It is understandable that the light receiving chip may also be disposed on the surface of the circuit board 300 .

[0246] In some examples of the embodiments of the present disclosure, in order to achieve the transmission of multiple optical signals, the optical transmission component 400 can emit multiple optical signals. In some embodiments, when emitting multiple optical signals, they can be emitted separately instead of being combined into a single optical signal for transmission. Exemplarily, multiple optical signals are emitted separately through an optical fiber array, and the laser has a corresponding optical fiber ribbon for transmitting the optical signal. In some embodiments, when emitting multiple optical signals, they can be combined into a single optical signal for transmission. Exemplarily, when combining, combining can be achieved through an optical multiplexing component. Exemplarily, when combining, combining can be achieved through a combination of different filters, and the transmission and reflection characteristics of the filters for specific wavelengths can be utilized to achieve combining by using a combination of multiple filters. Exemplarily, when combining, combining can also be achieved through a combination of different polarization state devices such as polarizers, and the polarization state devices have different transmission characteristics for light with different polarization directions, and the combination of multiple polarizers can be achieved. Exemplarily, when combining, combining can also be achieved through a combination of filters and polarizers.

[0247] In some examples of the embodiments of the present disclosure, in order to achieve the reception of multiple optical signals, the optical receiving component 500 may include multiple photodetectors to receive the multiple optical signals. In some embodiments, the multiple optical signals can be received by an optical fiber array, and then the optical path is deflected by an optical path deflection device, so that the multiple optical signals are transmitted to multiple photodetectors respectively. When the optical path is deflected, the optical fiber end face can also be formed into a reflective surface by grinding, thereby achieving the change of the optical path. For example, when the optical fiber end face is formed into a reflective surface by grinding, the optical fiber can be clamped up and down because the optical fiber is soft. At this time, the optical fiber can be extended or not extended. If the optical fiber is extended, the optical fiber end face can be polished separately. If the optical fiber is not extended, it can be polished together with the upper and lower clamping structures. In some embodiments, a received optical signal can be decomposed into multiple optical signals by an optical demultiplexing component, and then the optical path is deflected by an optical path deflection device, so that the multiple optical signals are transmitted to multiple photodetectors respectively. In some embodiments, an arrayed waveguide grating (AWG) may be used to decompose a received optical signal into multiple optical signals, and then the optical paths are turned so that the multiple optical signals are transmitted to the photodetector respectively.

[0248] In some embodiments, the light emitting component 400 may include a light emitting component including a laser.

[0249] The optical emitting component 400 may include an optical combining device, which may be the aforementioned optical multiplexing component.

[0250] The light emitting component 400 may include a light transmission device, which may be an optical fiber array, or a fiber collimator.

[0251] The sixth supporting area 920 may include a first supporting portion configured to support the light emitting assembly.

[0252] The sixth supporting area 920 may include a second supporting portion. The second supporting portion is configured to support the optical wave combining device.

[0253] The sixth supporting area 920 may include a third supporting portion configured to support the optical transmission component.

[0254] In some embodiments, the light receiving component 500 may include an optical transmission device, which may be an optical fiber array, or a fiber collimator.

[0255] The optical receiving component 500 may include an optical wave splitter device, which may be the aforementioned AWG, or the aforementioned optical demultiplexing component.

[0256] The light receiving part 500 may include a lens.

[0257] The light receiving component 500 may include a light path turning device, which may be a turning prism.

[0258] The light receiving component 500 may include a transimpedance amplifier. The transimpedance amplifier may be provided on the surface of the circuit board 300 or on the surface of the boss 931 .

[0259] The light receiving part 500 may include a light receiving chip.

[0260] For example, the lens may be connected to the optical path turning device. The light-emitting surface of the lens may be connected to the light-incoming surface of the optical path turning device, and the light-emitting surface of the optical path turning device faces the surface of the light receiving chip.

[0261] The seventh supporting area 930 is configured to respectively support optical transmission components, optical wavelength splitting components, lenses, and optical path turning components.

[0262] The transimpedance amplifier and the light receiving chip can be respectively disposed on the surface of the circuit board 300. The transimpedance amplifier and the light receiving chip can be respectively disposed on the surface of the carrier 900.

[0263] Figure 25 is a second schematic diagram illustrating the assembly of a carrier, light emitting component, and light receiving component according to some embodiments of the present disclosure; Figure 26 is a fourth schematic diagram illustrating the structure of a carrier according to some embodiments of the present disclosure. As shown in Figures 25 and 26, the light emitting component 400 and the light receiving component 500 are disposed on the carrier 900 in the same orientation.

[0264] In some embodiments, the light emitting component 400 may include a light emitting assembly, a laser 401, a first collimating lens 404, or a TEC 402.

[0265] The lasers 401 are arranged in an array to emit multiple optical signals of different wavelengths.

[0266] The laser 401 and the first collimating lens 404 can be respectively disposed on the surface of the TEC 402. The first collimating lens 404 can be disposed in the light emitting direction of the laser 401 to collimate the light beam emitted by the laser 401 and transmit it in the form of parallel light.

[0267] The optical transmitting component 400 may include an optical multiplexing component 403. The optical multiplexing component 403 may combine multiple optical signals of different wavelengths emitted by the laser array into one optical signal. The combined optical signal includes multiple different wavelengths.

[0268] The light emitting component 400 may include a first converging lens 405. The first converging lens 405 converges the light beams synthesized by the optical multiplexing component 403, thereby improving coupling efficiency.

[0269] The light emitting component 400 may include a fiber collimator 406. The light output from the first converging lens 405 is transmitted to the outside along the fiber collimator 406.

[0270] In some embodiments, the sixth loading area 920 is configured to dispose the light emitting component 400 .

[0271] The sixth supporting area 920 may include a first supporting portion 911. The first supporting portion 911 is configured to support the light emitting component.

[0272] The sixth supporting area 920 may include a second supporting portion 912 . The second supporting portion 912 is configured to support the optical multiplexing assembly 403 and the first converging lens 405 .

[0273] The surface of the second supporting portion 912 is formed with a protrusion 9121. The protrusion 9121 is configured to limit the optical multiplexing component 403 to ensure the stability of the optical path. At the same time, the protrusion 9121 can provide a glue dispensing platform for assembling the optical multiplexing component 403.

[0274] One side of the raised portion 9121 in the second supporting portion 912 is recessed to ensure that the first converging lens 405 is at the same height as the optical path of the optical multiplexing assembly 403. The other side of the raised portion 9121 in the second supporting portion 912 is recessed to avoid the lens at the light input end of the optical multiplexing assembly 403. In some embodiments, the lens at the light input end of the optical multiplexing assembly 403 may be thicker, so the other side of the raised portion 9121 may be recessed to avoid the lens at the light input end of the optical multiplexing assembly 403.

[0275] The sixth supporting area 920 may include a third supporting portion 913 . The third supporting portion 913 is configured to support the optical fiber collimator 406 .

[0276] In some embodiments, the light receiving component 500 may include a fiber collimator 501. The fiber collimator 501 is configured to receive and transmit an optical signal from the outside.

[0277] The light receiving component 500 may include a second converging lens 504 for converging and processing the optical signal transmitted from the optical fiber collimator 501 .

[0278] The optical receiving component 500 may include an optical demultiplexing assembly 503. The optical demultiplexing assembly 503 is configured to decompose the optical signal received by the optical fiber collimator 501 into multiple optical signals of different wavelengths.

[0279] The light receiving component 500 may include a second collimating lens 502. After the light output from the optical demultiplexing component 503 is collimated, it is further transmitted in the form of parallel light.

[0280] The light receiving component 500 may include a turning prism 505. Since the light path transmitted by the optical demultiplexing component 503 and the second collimating lens 502 is parallel to the circuit board 300, and the light receiving direction of the light receiving chip 506 is perpendicular to the circuit board 300, the turning prism 505 is provided on the light path to turn the light path to the surface of the light receiving chip 506.

[0281] The light receiving component 500 may include a light receiving chip 506. The light receiving chip 506 may convert a received optical signal into an electrical signal. The light receiving chips 506 may be arranged in an array.

[0282] The optical receiving component 500 may include a transimpedance amplifier 507. The transimpedance amplifier 507 may be electrically connected to the optical receiving chip 506. The transimpedance amplifier 507 is configured to amplify the electrical signal converted and generated by the optical receiving chip 506.

[0283] The optical receiving chip 506 and the transimpedance amplifier 507 are disposed close to the circuit board 300 .

[0284] In some embodiments, the optical receiving chip 506 and the transimpedance amplifier 507 may be connected by wire bonding to achieve electrical connection between the two.

[0285] The surface of the light receiving chip 506 has a first connection pad and a photosensitive surface. Usually, the first connection pad and the photosensitive surface of the light receiving chip 506 are located on the same surface.

[0286] A second connection pad is provided on the surface of the transimpedance amplifier 507. A wire bond is formed between the first and second connection pads to electrically connect the optical receiver chip 506 to the transimpedance amplifier 507. At this point, the photosensitive surface of the optical receiver chip 506 and the first connection pad are both facing upward, with the photosensitive surface exposed to the air. To reduce light signal reflection into the air and allow more light signal to be absorbed into the photosensitive surface, the photosensitive surface is coated with an anti-reflection film. The refractive index of the anti-reflection film is greater than that of air, allowing more light signal to be transmitted into the photosensitive surface, thereby ensuring the received light power.

[0287] In some embodiments, the transimpedance amplifier 507 is disposed on the surface of the circuit board 300, and the first connection pad on the surface of the light receiving chip 506 is soldered to the second connection pad on the surface of the transimpedance amplifier 507, thereby electrically connecting the light receiving chip 506 and the transimpedance amplifier 507. That is, the light receiving chip 506 is attached upside down to the surface of the transimpedance amplifier 507, with the photosensitive surface of the light receiving chip 506 facing downward. To allow the light signal to be transmitted to the photosensitive surface, a lens is provided on the surface of the light receiving chip 506 exposed to air. An optical through hole can be formed between the lens and the photosensitive surface, through which the light signal is transmitted to the photosensitive surface, thereby achieving reception of the light signal.

[0288] By flip-chip bonding the optical receiving chip 506 to the transimpedance amplifier 507, parasitic effects caused by wire bonding can be avoided, thereby improving signal transmission performance. At the same time, since the photosensitive surface of the optical receiving chip 506 is not exposed to the air, the reflection of the optical signal into the air is reduced, thereby ensuring the optical receiving power.

[0289] In some embodiments, a boss 931 may be formed on the surface of the supporting area 940. The transimpedance amplifier 507 is disposed on the surface of the boss 931. The first connection pad on the surface of the light receiving chip 506 is welded to the second connection pad on the surface of the transimpedance amplifier 507, thereby electrically connecting the light receiving chip 506 and the transimpedance amplifier 507. That is, the light receiving chip 506 is attached upside down to the surface of the transimpedance amplifier 507, with the photosensitive surface of the light receiving chip 506 facing downward. In order to transmit the light signal to the photosensitive surface, a lens is provided on the surface of the light receiving chip 506 exposed to the air, and a light through hole can be formed between the lens and the photosensitive surface, through which the light signal is transmitted to the photosensitive surface, thereby realizing the reception of the light signal.

[0290] In some examples of the disclosed embodiments, the carrier 900 has good heat dissipation. Placing the transimpedance amplifier 507 on the surface of the boss 931 facilitates heat dissipation for the transimpedance amplifier 507, ensuring proper operation of the transimpedance amplifier 507. The boss 931 then serves as a heat dissipation boss for the transimpedance amplifier 507.

[0291] When the transimpedance amplifier 507 is disposed on the surface of the boss 931, the boss 931 has a certain height so that the surface of the transimpedance amplifier 507 is flush with the surface of the circuit board 300. This shortens the wiring distance between the transimpedance amplifier 507 and the circuit board 300, which is beneficial to high-frequency signal transmission performance.

[0292] In some embodiments, the seventh supporting area 930 is configured to house the light receiving component 500 . The surface of the seventh supporting area 930 is used to support the fiber collimator 501 , the second converging lens 504 , the optical demultiplexing assembly 503 , the second collimating lens 502 , and the turning prism 505 .

[0293] The light receiving chip 506 is flip-chip mounted on the surface of the transimpedance amplifier 507 to achieve stacking of the two, and then the two can be placed on the surface of the boss 931. This can avoid parasitic effects generated when the light receiving chip 506 and the transimpedance amplifier 507 are connected by wire bonding, and at the same time it is beneficial to the heat dissipation of the transimpedance amplifier 507.

[0294] Figure 27 is a third schematic diagram illustrating the assembly of a carrier, light-emitting component, and light-receiving component according to some embodiments of the present disclosure; Figure 28 is a second exploded view illustrating the assembly of a carrier, light-emitting component, and light-receiving component according to some embodiments of the present disclosure. As shown in Figures 27 and 28, the light-emitting component 400 and the light-receiving component 500 are disposed in the same orientation on the carrier 900. For example, the light-emitting component 400 and the light-receiving component 500 are disposed on the upper surface of the carrier 900.

[0295] The carrier 900 may include a sixth carrier area 920. The sixth carrier area 920 is configured to dispose the light emitting component 400.

[0296] The carrier 900 may include a seventh carrier area 930 . The seventh carrier area 930 is configured to accommodate other devices in the optical receiving component 500 except the optical receiving chip 506 and the transimpedance amplifier 507 .

[0297] The carrier 900 may include a supporting area 940. The supporting area 940 is configured to accommodate the light receiving chip 506 and the transimpedance amplifier 507 in the light receiving component 500. The supporting area 940 is configured to support an end portion of the circuit board 300.

[0298] The carrier 900 may include a side wall 950 . A height difference is provided between the side wall 950 and the supporting area 940 to support the end of the circuit board 300 .

[0299] The carrier 900 may include a first recessed portion 951. The first recessed portion 951 is formed by the interface between the sixth carrier area 920 and the seventh carrier area 930 protruding toward the seventh carrier area 930. The first recessed portion 950 corresponds to the position of the first converging lens 405. The first recessed portion 951 is used to provide space for the coupling of the first converging lens 405. When the first converging lens 405 is coupled, the first converging lens 405 will move along the side wall 950 in the direction pointing to the first recessed portion 951, so the first recessed portion 951 needs to be opened to provide a coupling space for the coupling of the first converging lens 405.

[0300] The carrier 900 may include a second recessed portion 960. The second recessed portion 960 is formed by protruding toward the seventh carrier portion 930 at the interface between the sixth carrier area 920 and the seventh carrier area 930. The second recessed portion 960 corresponds to the position of the optical multiplexing assembly 403. The second recessed portion 960 is used to provide operating space for assembling the optical multiplexing assembly 403, thereby facilitating the assembly of the optical multiplexing assembly 403.

[0301] The carrier 900 may include a protrusion 970. The protrusion 970 is located between the first recess 950 and the second recess 960. The optical multiplexing assembly 403 is disposed on a sidewall of the protrusion 970. The protrusion 970 is used to limit the position of the optical multiplexing assembly 403.

[0302] In some embodiments, the second collimating lens 502 is fixedly connected to the turning prism 505. The turning prism 505 can be fixed by the second collimating lens 502. The light-emitting surface of the second collimating lens 502 is fixedly connected to the light-incoming surface of the turning prism 505, thereby achieving a fixed connection between the two.

[0303] The second collimating lens 502 is fixed to the surface of the seventh supporting area 930. For example, the bottom surface of the second collimating lens 502 is fixed to the end of the seventh supporting area 930 using glue. Due to the fluidity of the glue, the end of the seventh supporting area 930 is recessed inward to form a third recessed portion 921. Part of the bottom surface of the second collimating lens 502 is suspended above the third recessed portion 921, allowing excess glue to overflow along the third recessed portion 921, thereby preventing glue from contaminating the second collimating lens 502.

[0304] The turning prism 505 is fixed to the surface of the second collimating lens 502. The light emitting surface of the turning prism 505 faces the light receiving chip 506. The turning prism 505 can turn the light path from being parallel to the surface of the circuit board 300 to being perpendicular to the surface of the circuit board 300.

[0305] In some embodiments, the support area 940 has a relief opening 932 . The relief opening 932 is configured to clear electrical components, such as resistors and capacitors, on the surface of the circuit board 300 . The relief opening 932 and the boss 931 are located at different ends of the support area 940 to ensure support strength at one end, thereby ensuring the stability of the circuit board 300.

[0306] FIG29 is a cross-sectional structural diagram of a carrier according to some embodiments of the present disclosure. As shown in FIG29 , the carrier 900 may include a sixth carrier area 920 .

[0307] In some embodiments, the sixth loading area 920 is configured to dispose the light emitting component 400 .

[0308] The sixth supporting area 920 may include a first supporting portion 911 . The first supporting portion 911 is configured to support the light emitting assembly and is disposed close to the circuit board 300 .

[0309] The sixth supporting area 920 may include a second supporting portion 912 . The second supporting portion 912 is configured to support the optical multiplexing assembly 403 and the first converging lens 405 .

[0310] The sixth supporting area 920 may include a third supporting portion 913 . The third supporting portion 913 is configured to support the optical fiber collimator 406 .

[0311] The surface heights of the first supporting portion 911 , the second supporting portion 912 , and the third supporting portion 913 are not at the same height, so as to match the optical path heights of the optical devices so that the optical paths of the optical devices are at the same height.

[0312] The surface of the first support portion 911 is used to mount the light-emitting assembly. The light-emitting assembly includes a laser 401 and a TEC 402. Because the TEC 402 has a certain height, the surface of the first support portion 911 should be relatively concave to ensure that the surface of the laser 401 is flush with the surface of the circuit board 300 and to shorten the bonding distance between the laser 401 and the circuit board 300.

[0313] The surface of the first supporting portion 911 is relatively concave. For example, the surface of the first supporting portion 911 is concave relative to the surfaces of the second supporting portion 912 and the third supporting portion 913.

[0314] The surface of the first supporting portion 911 is relatively concave, so that the laser 401 sinks until the surface of the laser 401 is flush with the surface of the circuit board 300, shortening the bonding distance between the laser 401 and the circuit board 300 and improving high-frequency signal transmission performance.

[0315] The optical multiplexing assembly 403 disposed on the surface of the second supporting portion 912 and the optical fiber collimator 406 disposed on the surface of the third supporting portion 913 have different heights. Therefore, a height difference exists between the second supporting portion 912 and the third supporting portion 913 to match the optical path heights of the optical multiplexing assembly 403 and the optical fiber collimator 406. Exemplarily, the surface of the second supporting portion 912 is higher than the surface of the third supporting portion 913.

[0316] Exemplarily, the surface of the second supporting portion 912 protrudes from the surface of the third supporting portion 913 to match the optical path height of the optical multiplexing assembly 403 and the fiber collimator 406. The surface of the first supporting portion 911 is recessed from the surface of the third supporting portion 913 to ensure that the surface of the laser 401 is flush with the surface of the circuit board 300.

[0317] Figure 30 is a top view of a carrier layout according to some embodiments of the present disclosure. As shown in Figure 30 , in some embodiments, the light emitting component 400 and the light receiving component 500 are arranged side by side on the surface of the carrier 900 to avoid optical path interference between the light emitting end and the light receiving end.

[0318] The carrier 900 may include a first recessed portion 951. The first recessed portion 951 is formed by the interface between the sixth carrier area 920 and the seventh carrier area 930 protruding toward the seventh carrier area 930. The first recessed portion 951 corresponds to the position of the first converging lens 405. The first recessed portion 951 is used to provide space for the coupling of the first converging lens 405. When the first converging lens 405 is coupled, the first converging lens 405 will move along the side wall 950 in the direction pointing to the first recessed portion 951, so the first recessed portion 951 needs to be opened to provide a coupling space for the coupling of the first converging lens 405.

[0319] The carrier 900 may include a second recessed portion 960. The second recessed portion 960 is formed by protruding toward the seventh carrier portion 930 at the interface between the sixth carrier area 920 and the seventh carrier area 930. The second recessed portion 960 corresponds to the position of the optical multiplexing assembly 403. The second recessed portion 960 is used to provide operating space for assembling the optical multiplexing assembly 403, thereby facilitating the assembly of the optical multiplexing assembly 403.

[0320] The carrier 900 may include a protrusion 970. The protrusion 970 is located between the first recess 950 and the second recess 960. The optical multiplexing assembly 403 is disposed on a sidewall of the protrusion 970. The protrusion 970 is used to limit the position of the optical multiplexing assembly 403.

[0321] In some embodiments, the light-emitting end of the optical multiplexing assembly 403 is located near the protruding portion 970. At this point, the optical axis of the first converging lens 405 should be offset toward the first recessed portion 950 until it is aligned with the light-emitting axis of the optical multiplexing assembly 403. Therefore, the provision of the first recessed portion 951 can provide offset space for the first converging lens 405 to align with the optical axis of the optical multiplexing assembly 403.

[0322] In some embodiments, when the size of the first converging lens 405 is large, the first converging lens 405 will also shift toward the first recessed portion 951 . Therefore, the provision of the first recessed portion 951 can provide a shifting space for the first converging lens 405 .

[0323] The second collimating lens 502 is fixed to the surface of the seventh supporting area 930. For example, the bottom surface of the second collimating lens 502 is fixed to the end of the seventh supporting area 930 using glue. Due to the fluidity of the glue, the end of the seventh supporting area 930 is recessed inward to form a third recessed portion 921. Part of the bottom surface of the second collimating lens 502 is suspended above the third recessed portion 921, allowing excess glue to overflow along the third recessed portion 921, thereby preventing glue from contaminating the second collimating lens 502.

[0324] Figure 31 is a top view (I) of an assembly of a circuit board, a carrier, a light-emitting component, and a light-receiving component according to some embodiments of the present disclosure; Figure 32 is a top view (II) of an assembly of a circuit board, a carrier, a light-emitting component, and a light-receiving component according to some embodiments of the present disclosure. As shown in Figures 31 and 32, the light-emitting component 400 and the light-receiving component 500 are both located on one side of the DSP chip 304. The laser 401 in the light-emitting component 400 is located near the DSP chip 304. The light-receiving chip 506 in the light-receiving component 500 is located near the DSP chip 304.

[0325] The DSP chip 304 , the light emitting component 400 , and the light receiving component 500 may all be in the same direction. For example, the DSP chip 304 , the light emitting component 400 , and the light receiving component 500 may all face the upper housing 201 .

[0326] One side of the DSP chip 304 faces both the light emitting component 400 and the light receiving component 500. Therefore, the DSP chip 304 can be electrically connected to both the light emitting component 400 and the light receiving component 500 at the same time, and the electrical connection distances between the DSP chip 304 and the light emitting component 400, and between the DSP chip 304 and the light receiving component 500, are relatively short, thereby improving the high-frequency signal transmission performance of the light emitting end and the light receiving end.

[0327] One side of the DSP chip 304 faces both the laser 401 and the optical receiver chip 506. This can shorten the wire bonding distances between the DSP chip 304 and the laser 401, and between the DSP chip 304 and the optical receiver chip 506, thereby improving the high-frequency signal transmission performance of the optical transmitter and the optical receiver.

[0328] On the side of the DSP chip 304 facing the light emitting component 400 and the light receiving component 500 , one end faces the light emitting component 400 , and the other end faces the light receiving component 500 .

[0329] On the side of the DSP chip 304 facing the light emitting component 400 and the light receiving component 500 , one end faces the laser 401 and the other end faces the light receiving chip 506 , so that the DSP chip 304 can be wire-bonded to the laser 401 and the light receiving chip 506 at the same time.

[0330] The axis of the DSP chip 304 is disposed between the axis of the laser 401 and the axis of the light receiving chip 506 , so that the DSP chip 304 can take into account both the laser 401 and the light receiving chip 506 .

[0331] Figure 33 illustrates a circuit board and carrier assembly according to some embodiments of the present disclosure; Figure 34 illustrates an exploded view of the circuit board and carrier assembly according to some embodiments of the present disclosure. As shown in Figures 33 and 34 , the end of the circuit board 300 is connected to the carrier 900. It is understood that the carrier 900 can also be positioned on the surface of the circuit board 300 or embedded in the circuit board 300.

[0332] The carrier 900 may include a supporting area 940 . The supporting area 940 is configured to support the circuit board 300 .

[0333] The supporting area 940 is formed by extending toward the circuit board 300 along the width direction of the sixth supporting area 920 and the seventh supporting area 930, so the circuit board 300 on the surface of the supporting area 940 can be electrically connected to the light emitting component 400 and the light receiving component 500 at the same time, and then the DSP chip on the surface of the circuit board can be electrically connected to the light emitting component 400 and the light receiving component 500 at the same time.

[0334] The surface of the supporting area 940 is formed with a boss 931. Correspondingly, a notch 303 may be formed on the side of the circuit board 300 facing the carrier 900. The notch 303 is configured to avoid the boss 931. The notch 303 may be an open structure to facilitate the embedding of the boss 931.

[0335] Figure 35 is a side view of a circuit board and a carrier assembly according to some embodiments of the present disclosure; Figure 36 is a cross-sectional view of a circuit board and a carrier assembly according to some embodiments of the present disclosure. As shown in Figures 35 and 36, the support area 940 is used to support the end of the circuit board 300.

[0336] The surface of the supporting area 940 forms a height difference with the seventh supporting area 930 and the side wall 950, so that the end of the circuit board 300 abuts against the side of the seventh supporting area 930 and the side of the side wall 950, thereby achieving a fixed connection between the circuit board 300 and the supporting member 900.

[0337] For example, the top surface of the side wall 950 is higher than the surface of the supporting area 940, thereby forming a height difference between the side wall 950 and the supporting area 940, and one end of the circuit board 300 can be overlapped at the height difference formed by the side wall 950 and the supporting area 940. The height difference formed by the side wall 950 and the supporting area 940 can be a stepped structure.

[0338] The surface of the seventh supporting area 930 is higher than the surface of the supporting area 940, thereby forming a height difference between the seventh supporting area 930 and the supporting area 940. The other end of the circuit board 300 can then be connected to the height difference formed by the seventh supporting area 930 and the supporting area 940. The height difference formed by the seventh supporting area 930 and the supporting area 940 can be a stepped structure.

[0339] In the present disclosure, the optical module includes a carrier, and the light emitting component and the light receiving component are arranged on the same surface of the carrier. The surface of the carrier is respectively formed with a sixth bearing area, a seventh bearing area and a supporting area. Among them, the sixth bearing area is configured to set the light emitting component. The seventh bearing area is configured to set the light receiving component, and the seventh bearing area and the sixth bearing area are arranged on the same side of the DSP chip, and are arranged on one side of the sixth bearing area, so as to arrange the light emitting component and the light receiving component side by side on one side of the DSP chip. The supporting area is configured to support the circuit board, and the supporting area is formed by extending toward the circuit board along the width direction of the sixth bearing area and the seventh bearing area, so that the circuit board on the surface of the supporting area can be electrically connected to the light emitting component and the light receiving component at the same time, and then the DSP chip on the surface of the circuit board can be electrically connected to the light emitting component and the light receiving component at the same time.

[0340] In the present disclosure, in order to fix the circuit board on the supporting area, a side wall is provided on one side of the sixth supporting area, and the surface of the supporting area forms a height difference with the seventh supporting area and the side wall, so that the end of the circuit board abuts against the side of the seventh supporting area and the side of the side wall, respectively. For example, if the top surface of the side wall is higher than the surface of the supporting area, a height difference is formed between the side wall and the supporting area, and one end of the circuit board can be overlapped on the height difference formed by the side wall and the supporting area. If the surface of the seventh supporting area is higher than the surface of the supporting area, a height difference is formed between the seventh supporting area and the supporting area, and the other end of the circuit board can be overlapped on the height difference formed by the seventh supporting area and the supporting area. In the present disclosure, the light emitting component and the light receiving component are arranged on the same surface of the supporting part, and the light emitting component and the light receiving component are located on different sides of the same surface, so that the light emitting component and the light receiving component do not interfere with each other, thereby avoiding the problem of optical path crosstalk. At the same time, the DSP chip, the optical emitting component and the optical receiving component are all located in the same direction, and the DSP chip can be electrically connected to the optical emitting component and the optical receiving component at the same time, which can shorten the distance between the DSP chip and the optical emitting component, and between the DSP chip and the optical receiving component, thereby optimizing the high-frequency signal transmission performance of the optical emitting end and the optical receiving end.

[0341] In the present disclosure, the carrier is connected to the end portion of the circuit board in the length direction, and the connection between the carrier and the circuit board can be achieved without opening the surface of the circuit board, thereby ensuring the integrity of the circuit board.

[0342] The above description is merely a specific embodiment of the present disclosure, but the scope of protection of the present disclosure is not limited thereto. Any changes or substitutions that a person skilled in the art can conceive within the technical scope disclosed in the present disclosure should be included within the scope of protection of the present disclosure. Therefore, the scope of protection of the present disclosure should be based on the scope of protection of the claims.

Claims

1. An optical module, comprising: A circuit board having a notch formed on its surface; A carrier is provided at the notch and connected to the circuit board, and one surface of the carrier is formed with: a supporting area, the supporting area being formed at an edge of the carrier and connected to the circuit board to support the circuit board; A light emitting component, comprising a laser, an optical multiplexing component and a first optical fiber collimator, wherein the laser, the optical multiplexing component and the first optical fiber collimator are respectively arranged on the surface of the carrier; A light receiving component, comprising a supporting portion, a refracting portion, a light receiving chip, an optical demultiplexing assembly, and a second optical fiber collimator; wherein the refracting portion is provided on a surface of the supporting portion and is configured to deflect an optical signal output by the optical demultiplexing assembly toward a surface of the light receiving chip; a first optical path is defined between the optical demultiplexing assembly and the refracting portion, and a second optical path is defined between the optical multiplexing assembly and the laser; The thickness of the support portion is matched with the surface of the carrier so that a preset difference exists between the height of the light inlet of the refraction portion and the height of the light outlet of the laser, so that the first light path and the second light path are misaligned; The second optical fiber collimator cooperates with the surface of the carrier so that the optical paths of the second optical fiber collimator, the optical demultiplexing component and the refractive part match; The optical multiplexing component cooperates with the surface of the carrier so that the optical multiplexing component matches the optical path of the laser.

2. The optical module according to claim 1, wherein: The optical demultiplexing assembly and the optical multiplexing assembly are stacked and arranged on the carrier, the notch is formed in the middle of the circuit board, and the supporting area supports the edge of the notch so that a portion of the carrier is embedded in the notch; the carrier includes a first supporting area, a second supporting area, and a third supporting area, and the third supporting area is located between the first supporting area and the second supporting area; The second carrying area is configured to carry the laser; the height of the second carrying area and the thickness of the supporting portion are such that a preset difference exists between the height of the light inlet of the refractive portion and the height of the light outlet of the laser; The first carrying area is configured to carry the second optical fiber collimator, and the height of the first carrying area enables the second optical fiber collimator to match the optical path of the refractive portion; The third supporting area is configured to support the optical multiplexing component. The height of the third supporting area enables the optical multiplexing component to match the optical path of the laser, and enables the optical demultiplexing component on the surface of the optical multiplexing component to match the optical path of the refraction part.

3. The optical module according to claim 2, wherein: The surface of the laser is flush with the surface of the circuit board; There is a preset distance between the optical path between the optical demultiplexing component and the refraction portion and the surface of the circuit board.

4. The optical module according to claim 2, wherein: The light inlet of the optical demultiplexing component and the light outlet of the optical multiplexing component are located on both sides of the same end of the carrier; The light emitting surface of the optical demultiplexing component faces the light incident surface of the refraction portion, and the light incident surface of the optical multiplexing component faces the light emitting surface of the laser; The light emitting surface of the optical demultiplexing component is oriented in the same direction as the light incident surface of the optical multiplexing component.

5. The optical module according to claim 2, wherein: The light emitting component includes a first optical fiber collimator, and the light receiving component includes a second optical fiber collimator; The first fiber collimator and the second fiber collimator are located on opposite sides of the same end of the carrier.

6. The optical module according to claim 2, wherein: The light emitting components respectively include the laser, the first collimating lens, the optical multiplexing component, the first converging lens and the first optical fiber collimator; The light receiving components respectively include the second optical fiber collimator, the second collimating lens, the optical demultiplexing component, the second converging lens, the refraction part and the light receiving chip; The first carrying area is further configured to carry the second collimating lens; The second carrying area is further configured to carry the first collimating lens; the second carrying area is configured as a recessed area so that the surface of the laser is flush with the surface of the circuit board; The surface of the carrier is further formed with: a fourth carrying area configured to carry the first converging lens; the fourth carrying area is arranged on one side of the first carrying area so that the first converging lens and the second collimating lens are located on both sides; the height of the fourth carrying area enables the optical path of the first converging lens to match that of the optical multiplexing component; a fifth carrying area configured to carry the first optical fiber collimator, the fifth carrying area being disposed on one side of the first carrying area so that the first optical fiber collimator and the second optical fiber collimator are located on both sides; the height of the fifth carrying area being located so that the optical path of the first optical fiber collimator matches that of the optical multiplexing assembly; The height of the first bearing area is higher than that of the third bearing area, the fourth bearing area, and the fifth bearing area.

7. The optical module according to claim 1, wherein: The surfaces of the carriers are respectively formed with: A sixth carrying area is configured to arrange the light emitting component; a side wall is provided on one side of the sixth carrying area; a seventh carrying area, configured to be provided with the light receiving component; the seventh carrying area is provided on one side of the sixth carrying area; The supporting area is formed by extending along the sixth supporting area and the seventh supporting area toward the end of the circuit board, and the supporting area is connected to the end of the circuit board in the length direction to support the circuit board; the surface of the supporting area forms a height difference with the seventh supporting area and the side wall, so that the end of the circuit board in the length direction abuts against the side of the seventh supporting area and the side of the side wall, thereby fixing the end of the circuit board in the length direction to the surface of the supporting area.

8. The optical module according to claim 7, wherein: The light receiving component includes a transimpedance amplifier and the light receiving chip; The support portion is formed on a surface of the supporting area close to the seventh bearing area; the transimpedance amplifier is provided on the surface of the support portion, and the light receiving chip is inverted on the surface of the transimpedance amplifier; The notch is formed at one end of the circuit board facing the carrier, and the notch is configured to avoid the support portion; the support portion is embedded in the notch, and the height of the support portion makes the surface of the transimpedance amplifier flush with the surface of the circuit board.

9. The optical module according to claim 7, wherein: The sixth supporting area includes a first supporting portion, a second supporting portion, and a third supporting portion; the first supporting portion is configured to be provided with the laser, the second supporting portion is configured to be provided with the optical multiplexing component, and the third supporting portion is configured to be provided with the first optical fiber collimator; The surface of the second supporting part is protruding from the surface of the third supporting part; the surface of the first supporting part is recessed from the surface of the third supporting part, so that the surface of the laser is flush with the surface of the circuit board.

10. The optical module according to claim 7, wherein: The light receiving component further includes: a second converging lens and a transimpedance amplifier; wherein the light emitting surface of the second converging lens is connected to the light incident surface of the refraction portion, and the light emitting surface of the refraction portion faces the surface of the light receiving chip; The seventh supporting area is configured to respectively support the second optical fiber collimator, the optical demultiplexing component, the second converging lens, and the refractive part.

11. The optical module according to claim 7, wherein: A DSP chip is provided on the upper surface of the circuit board; The sixth bearing area, the seventh bearing area, and the supporting area are respectively formed on the upper surface of the bearing member; The supporting area is formed to extend along the width direction of the sixth supporting area and the seventh supporting area, so that the DSP chip on the surface of the circuit board is electrically connected to the light emitting component and the light receiving component at the same time.

Images