Antenna micro-system structure

Abstract

The present application discloses an antenna micro-system structure. The antenna micro-system structure comprises an antenna radiation structure, a circuit module and a feed structure; a mounting cavity is formed in the antenna radiation structure; the circuit module is arranged in the mounting cavity; the feed structure is led out from the circuit module to excite the antenna radiation structure; the antenna radiation structure comprises a first radiator, a second radiator and an electric connecting member; the first radiator is communicatively connected to the second radiator by means of the electric connecting member; the first radiator is arranged on the second radiator; the mounting cavity is formed between the first radiator and the second radiator.

Description

Antenna microsystem structure

[0001] This application claims priority to Chinese patent application No. 202410132944.8, filed on January 30, 2024, the entire contents of which are incorporated herein by reference. Technical Field

[0002] The present application relates to the field of communications, and in particular to an antenna microsystem structure. Background Art

[0003] As communication modules become increasingly miniaturized, the heat dissipation problem caused by circuit modules has become increasingly serious. In traditional architectures, circuit modules are often placed outside the antenna radiation structure. This is because in the RF link, the antenna is responsible for transmitting and receiving electromagnetic waves and must be located at the outermost, unobstructed part of the system. However, the circuit module, the primary source of heat, is structurally located within the system, unable to dissipate the heat it generates. Heat dissipation from the circuit module often requires the addition of a heat sink, which is detrimental to the high integration of the system structure. Ignoring the impact of heat can lead to poor system performance and, in severe cases, even system failure. Therefore, how to maintain high integration while ensuring excellent heat dissipation has become a dilemma that needs to be resolved urgently. Technical issues

[0004] The main purpose of this application is to propose an antenna microsystem structure to solve the above-mentioned technical problems. Technical Solutions

[0005] To achieve the above objectives, the present application proposes an antenna microsystem structure comprising:

[0006] An antenna radiation structure, wherein a mounting cavity is provided in the antenna radiation structure;

[0007] a circuit module, the circuit module being disposed in the mounting cavity;

[0008] A feeding structure is led out from the circuit module to excite the antenna radiation structure.

[0009] In one embodiment, the antenna radiation structure includes a first radiator, a second radiator and an electrical connector, the first radiator and the second radiator are connected through the electrical connector, the first radiator is arranged on the second radiator, and the mounting cavity is formed between the first radiator and the second radiator.

[0010] In one embodiment, the second radiator is a metal structure located on a side of the circuit module away from the first radiator.

[0011] In one embodiment, an extended edge is provided around the first radiator, and the extended edge is extended along the first radiator toward the circuit module. The first radiator and the extended edge enclose the installation cavity.

[0012] In one embodiment, a heat dissipation hole is provided on the antenna radiation structure, and the heat dissipation hole is used to connect the installation cavity with the external environment.

[0013] In one embodiment, a heat-conducting layer is provided in the installation cavity, so that the circuit module is indirectly attached to the cavity wall of the installation cavity.

[0014] In one embodiment, the electrical connector is provided around the circuit module, the bottom of the electrical connector is connected to the second radiator, and the top of the electrical connector abuts the extended edge to electrically connect the first radiator to the second radiator.

[0015] In one embodiment, a shielding metal structure is provided on the second radiator, a wire is provided inside the shielding metal structure, and the wire is connected to an external DC power supply to supply power to the circuit module.

[0016] In one embodiment, SMA connectors are provided on both sides of the shielding metal structure, and the SMA connectors include an outer conductor and an inner conductor, the outer conductor is insulated and connected to the inner conductor, the outer conductor is connected to the second radiator, and the inner conductor is connected to the circuit module.

[0017] In one embodiment, the antenna radiation structure also includes a reflective floor, which is arranged on a side of the second radiator away from the first radiator, the shielding metal structure is arranged on the reflective floor, and the SMA connector is passed through the reflective floor so that the reflective floor is connected to the second radiator through the outer conductor.

[0018] In one embodiment, the SMA connector protrudes from the reflective floor and, together with the shielding metal structure, supports the circuit module, thereby ensuring a distance between the circuit module and the reflective floor. This distance depends on the operating frequency of the antenna radiating structure and the dielectric material between the circuit module and the reflective floor.

[0019] In one embodiment, a nylon screw is passed through the circuit module, and a nylon nut is provided on a side of the reflective floor away from the second radiator, and the nylon nut is used for threaded connection with the nylon screw.

[0020] In one embodiment, the circuit module includes a PCB board and an analog circuit, the analog circuit is provided on the PCB board, and the circuit module further includes a digital circuit and / or a digital-analog hybrid circuit. Beneficial effects

[0021] The technical solution of the present application adopts a first radiator and a second radiator to form an antenna radiation structure, and the circuit module is arranged between the first radiator and the second radiator. When the circuit module is put into use, the circuit module can dissipate heat to the outside world by using the first radiator and the second radiator as heat dissipation components. Through such an arrangement, the circuit module can be highly integrated with the antenna radiation structure, and at the same time solve the problem of heat dissipation difficulty caused by the high integration of the circuit module and the antenna radiation structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying any creative work.

[0023] FIG1 is a schematic diagram of an embodiment of an antenna radiation structure of the present application;

[0024] FIG2 is a schematic structural diagram of an embodiment of the antenna radiation structure of the present application after removing the reflective floor;

[0025] FIG3 is a schematic diagram of the antenna radiation structure in FIG2 when viewed from above after removing the reflective floor;

[0026] FIG4 is a schematic diagram of the structure of the antenna radiation structure of the present application including a reflective floor;

[0027] FIG5 is a schematic structural diagram of the antenna radiation structure after removing the first radiator in FIG4 ;

[0028] FIG6 is a schematic structural diagram of FIG4 without the first radiator and the circuit module;

[0029] FIG7 is a schematic diagram of the structure of FIG4 from above;

[0030] FIG8 is a schematic structural diagram of the antenna radiation structure array layout of the present application.

[0031] Explanation of the accompanying drawings: 100, antenna microsystem structure; 110, first radiator; 111, cover body; 112, extended edge; 120, circuit module; 121, PCB board; 122, filter; 123, RF switch; 124, low-noise amplifier; 125, power amplifier; 126, electrical connector; 130, second radiator; 140, screw connector; 150, SMA connector; 160, nylon screw; 161, lead screw; 162, nylon nut; 170, feeding structure; 180, connecting through hole; 190, reflecting floor; 191, shielding metal structure; 192, through hole; 200, metal through hole.

[0032] The realization of the objectives, functional features and advantages of this application will be further explained in conjunction with embodiments and with reference to the accompanying drawings. Modes for Carrying Out the Invention

[0033] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0034] It should be noted that if the embodiments of the present application involve directional indications (such as up, down, left, right, front, back, etc.), such directional indications are only used to explain the relative position relationship, movement status, etc. between the various components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0035] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present application, the descriptions of "first", "second", etc. are only for descriptive purposes and cannot be understood as indicating or suggesting their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of such features. In addition, if the meaning of "and / or" appearing in the full text is to include three parallel schemes, taking "A and / or B" as an example, it includes scheme A, or scheme B, or a scheme in which A and B are satisfied at the same time. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is mutually contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by this application.

[0036] An antenna microsystem structure includes an antenna radiating structure 100, a circuit module 120 and a feeding structure 170. A mounting cavity is provided in the antenna radiating structure; the circuit module 120 is disposed in the mounting cavity; and the feeding structure 170 is led out from the circuit module 120 to excite the antenna radiating structure.

[0037] In this embodiment, as shown in Figures 1 and 2, the antenna microsystem structure 100 includes an antenna radiation structure, a circuit module 120 and a feeding structure 170, wherein an installation cavity is provided in the antenna radiation structure, and the installation cavity can be an upward protrusion of the middle part of the antenna radiation structure, and the periphery of the protrusion is hollowed out, and the protrusion can be detachably connected to the lower part of the antenna radiation structure, or can be integrally provided, and the circuit module 120 is detachably installed in the installation cavity. Since the middle part of the antenna radiation structure is covered on the circuit module 120, the antenna radiation structure has a shielding effect on the circuit module 120, and the circuit module 120 has a feeding structure 170 facing the antenna radiation structure, and the feeding structure 170 is connected to the antenna radiation structure. The feeding structure 170 can be a metal probe. In other embodiments, the feeding structure 170 can be replaced by a coupled feeding method. When the circuit module 120 needs to send a radio frequency signal to the outside through the antenna radiation structure, the circuit module 120 transmits the signal to the antenna radiation structure through the feeding structure 170, and then radiates the signal to the outside through the antenna radiation structure. Through such a setting, the circuit module 120 and the antenna radiation structure can be highly integrated. When the circuit module 120 generates heat due to operation, the circuit module 120 can dissipate heat to the outside through the antenna radiation structure. Therefore, after the circuit module 120 is highly integrated with the antenna radiation structure and installed, the circuit module 120 can also dissipate heat to the outside through the antenna radiation structure, thereby achieving better use effect.

[0038] For ease of description, this application will take the patch radiating antenna as an example to describe in detail the technical solution of the embodiment of the present application.

[0039] In one embodiment, as shown in Figures 1 to 2, in this embodiment, the antenna radiation structure includes a radiator and a reflective floor 190, wherein the radiator includes a first radiator 110, a second radiator 130 and an electrical connector 126, the first radiator 110 and the second radiator 130 are connected through the electrical connector 126, the first radiator 110 is arranged on the second radiator 130, and the mounting cavity is formed between the first radiator 110 and the second radiator 130. In this embodiment, the first radiator 110 is covered on the second radiator 130, and a gap is reserved between the two. The installation cavity refers to the gap between the first radiator 110 and the second radiator 130. Then, the circuit module 120 is installed between the first radiator 110 and the second radiator 130. When the circuit module 120 is fixed, the circuit module 120 can be detachably installed with the first radiator 110, and can also be detachably installed with the second radiator 130. No further restrictions are made here. In this embodiment, the second radiator 130, the circuit module 120 and the first radiator 110 are connected by screw connectors 140, wherein the electrical connector 126 is used to electrically connect the first radiator 110 and the second radiator 130. The electrical connector can be implemented by conductor contact, metal welding, etc.

[0040] In one embodiment, as shown in Figures 1 and 2, the second radiator 130 is a metal structure on the side of the circuit module 120 away from the first radiator 110. In this embodiment, the metal structure is a metal coating provided on the side of the circuit module 120 away from the first radiator 110, and the metal coating is the second radiator 130 described above. In this embodiment, the metal coating provided on the circuit module 120 away from the first radiator 110 is both a part of the circuit module 120 and a part of the radiator. The metal coating can cooperate with the first radiator 110 to stimulate the circuit module 120 to radiate signals outward through the feeding structure 170, and can also provide a zero potential for the circuit module 120. Of course, in other embodiments, the metal structure can also be a metal layer detachably mounted on the side of the circuit module 120 away from the first radiator 110, and this is not limited here.

[0041] In one embodiment, as shown in FIG. 1 and FIG. 2 , an extension edge 112 is provided around the first radiator 110 . The extension edge 112 extends from the first radiator 110 toward the circuit module 120 . The first radiator 110 and the extension edge 112 form a mounting cavity. In this embodiment, in order to further enhance the shielding effect of the first radiator 110 on the circuit module 120, an extension edge 112 is provided on the periphery of the cover body 111 of the first radiator 110, and the extension edge 112 is provided in the direction in which the second radiator 130 is provided. Due to the provision of the extension edge 112, the cover body 111 and the extension edge 112 are enclosed to form the above-mentioned installation cavity. When installing the circuit module 120, the circuit module 120 can be installed in the installation cavity. After the circuit module 120 is installed in the installation cavity, the second radiator 130 is installed at the bottom, so that the circuit module 120 is surrounded by the radiation structure on all sides. At this time, the antenna radiation structure can provide a better shielding effect for the circuit module 120, so that when the circuit module 120 is installed in the antenna radiation structure and put into use, it can effectively shield the interference of external signals through the antenna radiation structure provided on the periphery.

[0042] In another embodiment, not shown in the figure, in order to further improve the heat dissipation effect of the circuit module 120 while ensuring the shielding effect, in this embodiment, the antenna radiation structure is provided with a heat dissipation hole, and the heat dissipation hole is used to connect the installation cavity with the external environment. In this embodiment, the heat dissipation holes can be set in the extension direction of the extension edge 112, or in a direction perpendicular to the extension direction of the extension edge 112, or they can be heat dissipation holes set on the cover body 111. Of course, in order to make the heat dissipation holes allow the installation cavity to communicate with the external environment better, multiple heat dissipation holes can be set on at least the extension edge 112 on the same side of the extension edges 112 set around, or one heat dissipation hole can be set on the extension edges 112 on different sides, so that the external gas can flow through the relatively arranged heat dissipation holes. In order to improve the communication effect between the installation cavity and the external environment, the heat dissipation holes are not limited to the above-mentioned method. In other embodiments, heat dissipation holes can also be set on the cover body 111. In order to ensure that the shielding effect is not weakened, when opening the heat dissipation holes, the diameter of the heat dissipation holes can be set with reference to less than 0.1 wavelength of the system working frequency band. There is no restriction on the shape of the heat dissipation holes. The heat dissipation holes can be long strips or slits.

[0043] In one embodiment, a heat-conducting layer is provided in the installation cavity so that the circuit module 120 is indirectly attached to the cavity wall of the installation cavity. Since the circuit module 120 is provided with multiple electronic components, and the multiple electronic components generate heat when put into use, and because the circuit module 120 is installed inside the first radiator 110, the circuit module 120 is not attached to the cavity bottom of the first radiator 110, which will result in poor heat exchange between the multiple electronic components on the circuit module 120 and the first radiator 110. Therefore, in order to solve this problem, a heat-conducting layer (not shown in the figure) is installed between the first radiator 110 and the circuit module 120. The heat-conducting layer mainly connects the circuit module 120 to the first radiator 110. 0 is heat-exchanged more quickly with the first radiator 110, and then dissipated through the first radiator 110. In this embodiment, the heat-conducting layer adopts a thermal interface material, and the thermal interface material is mostly a flexible material, such as a gel or silicone grease. In other embodiments, a heat dissipation structure can be further provided on a side of the first radiator 110 away from the circuit module 120. The heat dissipation structure can be a heat dissipation fin. The heat dissipation structure can effectively enhance the heat exchange between the first radiator 110 and the external environment, thereby achieving a better heat dissipation effect.

[0044] In one embodiment, an electrical connector 126 is disposed around the circuit module 120. The bottom of the electrical connector 126 is connected to the second radiator 130, and the top of the electrical connector 126 abuts the extended edge 112, thereby electrically connecting the first radiator 110 to the second radiator 130. In this embodiment, the electrical connector is a metal via 200, which passes through the circuit module. A plurality of metal vias 200 are provided, and the plurality of metal vias 200 are disposed around the periphery of the circuit module 120. When the first radiator 110 is disposed on top of the metal via 200, the extended edge 112 disposed around the first radiator 110 abuts the metal via 200, thereby connecting the first radiator 110 to the second radiator 130 through the metal via 200. In other embodiments, the electrical connector 126 may also be a metal connector disposed around the circuit module 120 in a covering manner.

[0045] In one embodiment, as shown in FIG. 2 , a shielding metal structure 191 is provided in the middle of the second radiator 130 . A wire is provided in the middle of the shielding metal structure 191 . The wire is connected to an external DC power source to power the circuit module 120 . In this embodiment, the shielding metal structure 191 is a shielding metal column. In other embodiments, the shielding metal structure 191 can also be a shielding metal column of other shapes. In this embodiment, a connecting through hole 180 is opened in the middle of the second radiator 130. The connecting through hole 180 is used for the shielding metal structure 191 to be plugged in, so that the shielding metal structure 191 is connected to the circuit module 120. A wire is passed through the inside of the shielding metal structure 191. The wire is used to be electrically connected to an external power supply, and the wire is electrically connected to the circuit module 120, thereby supplying power to the circuit module 120. The reason for choosing to set the shielding metal structure 191 at the center position of the second radiator 130, that is, the center position of the circuit module 120, is because this is the virtual short-circuit point of the patch radiating antenna, which has little effect on the radiation performance. In this embodiment, since the wire is passed through the inside of the shielding metal column, the shielding metal column can reduce the impact of the wire on the radiation performance of the radiating antenna structure.

[0046] In one embodiment, SMA connectors 150 are provided on both sides of the shielding metal structure 191. The SMA connectors 150 include an outer conductor and an inner conductor, the outer conductor being insulated and connected to the inner conductor. The outer conductor is connected to the second radiator 130, and the inner conductor is connected to the circuit module 120. The SMA connector 150 has an inner conductor and an outer conductor. The inner conductor is used to electrically connect to the circuit module 120, while the outer conductor is used to electrically connect the circuit module 120 to the second radiator 130. In this embodiment, two SMA connectors 150 are provided, one for signal output and one for signal input, and the SMA connectors 150 are provided at both ends of the circuit in the circuit module 120.

[0047] In one embodiment, as shown in Figures 3 to 6, the antenna radiating structure further includes a reflective floor 190. The reflective floor 190 is disposed on the side of the second radiator 130 away from the first radiator 110. A shielding metal structure 191 is disposed on the reflective floor 190. An SMA connector 150 passes through the reflective floor 190, connecting the reflective floor 190 to the second radiator 130 via an external conductor. In this embodiment, the antenna radiating structure comprises the reflective floor 190 and the radiator formed by the first radiator 110 and the second radiator 130. The reflective floor 190 is disposed on the side of the second radiator 130 away from the first radiator 110, the shielding metal structure 191 is disposed in the middle of the reflective floor 190, and the SMA connector 150 passes through the reflective floor 190 and connects to the second radiator 130 via an external conductor. When the antenna radiating structure is in use, the reflective floor 190 can cooperate with the first radiator 110 and the second radiator 130 to transmit signals.

[0048] In one embodiment, as shown in Figure 5 , an SMA connector 150 protrudes from a reflective floor 190 and, together with a shielding metal structure 191, supports the circuit module 120, thereby maintaining a distance between the circuit module 120 and the reflective floor 190. The SMA connector 150 protrudes from the reflective floor 190, creating a distance between the reflective floor 190 and the second radiator 130. The distance between the two is related to the operating frequency of the system and the intervening dielectric medium. The relationship is that the higher the operating frequency of the antenna microsystem, the smaller the distance between the two. In this embodiment, the intervening dielectric medium is air. However, in other embodiments, the intervening dielectric medium can be replaced with a dielectric plate.

[0049] To further enhance the connection stability between the circuit module 120 and the reflective floor 190, as shown in Figures 4 to 6, a nylon screw 160 is provided on the circuit module 120, and a nylon nut 162 is provided on the side of the reflective floor 190 away from the second radiator 130. The nylon nut 162 is threadedly connected to the nylon screw 160. In this embodiment, the circuit module 120 is provided with a nylon screw 160, which includes a threaded rod 161. The second radiator 130 and the reflective floor 190 are provided with connecting holes 180 for the threaded rod 161 to pass through. A nylon nut 162 is provided on the side of the reflective floor 190 away from the second radiator 130. After passing through the circuit module 120, the second radiator 130, and the reflective floor 190, the threaded rod 161 of the nylon screw 160 is threadedly connected to the nylon nut 162, thereby further enhancing the connection stability between the reflective floor 190, the second radiator 130, and the circuit module 120.

[0050] In one embodiment, the circuit module 120 includes a PCB board 121 and an analog circuit, which is disposed on the PCB board 121. As shown in Figure 4, the circuit module 120 includes the PCB board 121 and the analog circuit, the analog circuit including a radio frequency circuit module, and the radio frequency circuit module includes the PCB board 121, a filter 122, an radio frequency switch 123, a power amplifier 125, and a low-noise amplifier 124. The filter 122, the radio frequency switch 123, the power amplifier 125, and the low-noise amplifier 124 are disposed on the PCB board 121. During normal use, the analog circuit has two states: first, when the first radiation board receives a signal, the signal passes through the filter 122, the radio frequency switch 123, and the low-noise amplifier in the radio frequency circuit module in the analog circuit in sequence, and then outputs the signal; second, when the circuit module 120 issues an output signal instruction, the signal enters the power amplifier 125 for amplification in sequence, then passes through the switch, and finally connects to the antenna for radiation.

[0051] In another embodiment, the circuit module 120 also includes digital circuits and / or mixed analog-digital circuits. To further expand the functionality of the antenna microsystem structure 100, digital circuits and / or mixed analog-digital circuits are also provided on the PCB board 121. The digital circuits include digital signal processing circuits and storage circuits; the mixed analog-digital circuits include analog-to-digital conversion circuits and digital-to-analog conversion circuits. The circuit module 120 can be implemented as multiple discrete chips or in the form of a System on Chip (SOC) composed of any of the above circuits. The digital circuits are primarily used to process digital signals, and the mixed analog-digital circuits are primarily used to convert analog signals into digital signals or vice versa. When the circuit module 120 is in use, the analog circuits, digital circuits, and / or mixed analog-digital circuits work together to achieve multiple functions.

[0052] In another embodiment, the antenna microsystem structure 100 is an omnidirectional antenna. When the antenna microsystem structure 100 is an omnidirectional antenna, the antenna radiation structure does not include the reflective floor 190. Since the omnidirectional antenna adopts all the technical solutions of the radiators of all the above embodiments, it has at least all the beneficial effects brought by the technical solutions of the above embodiments, which will not be repeated here.

[0053] In another embodiment, as shown in FIG. 7 , a plurality of antenna microsystem structures 100 are arranged in an array.

[0054] The above description is merely an optional embodiment of the present application and does not limit the patent scope of the present application. All equivalent structural transformations made using the contents of the present application specification and drawings under the inventive concept of the present application, or direct / indirect application in other related technical fields are included in the patent protection scope of the present application.

Claims

1. An antenna microsystem structure, wherein: The antenna microsystem structure includes: An antenna radiation structure, wherein a mounting cavity is provided in the antenna radiation structure; a circuit module, the circuit module being disposed in the mounting cavity; A feeding structure is led out from the circuit module to excite the antenna radiation structure.

2. The antenna microsystem structure according to claim 1, wherein: The antenna radiation structure includes a first radiator, a second radiator and an electrical connector. The first radiator and the second radiator are connected via the electrical connector. The first radiator is arranged on the second radiator, and the mounting cavity is formed between the first radiator and the second radiator.

3. The antenna microsystem structure according to claim 2, wherein: The second radiator is a metal structure located on a side of the circuit module away from the first radiator.

4. The antenna microsystem structure according to claim 2, wherein: An extended edge is provided around the first radiator, and the extended edge is extended along the first radiator toward the circuit module. The first radiator and the extended edge enclose the installation cavity.

5. The antenna microsystem structure according to claim 4, wherein: The antenna radiation structure is provided with heat dissipation holes, and the heat dissipation holes are used to connect the installation cavity with the external environment.

6. The antenna microsystem structure according to claim 4, wherein: A heat-conducting layer is provided in the installation cavity, so that the circuit module is indirectly attached and connected to the cavity wall of the installation cavity.

7. The antenna microsystem structure according to claim 4, wherein: The electrical connector is disposed around the circuit module, the bottom of the electrical connector is connected to the second radiator, and the top of the electrical connector abuts against the extended edge, so that the first radiator is electrically connected to the second radiator.

8. The antenna microsystem structure according to any one of claims 2 to 7, wherein: A shielding metal structure is provided on the second radiator, a wire is provided inside the shielding metal structure, and the wire is connected to an external DC power supply to supply power to the circuit module.

9. The antenna microsystem structure according to claim 8, wherein: SMA connectors are provided on both sides of the shielding metal structure. The SMA connectors include an outer conductor and an inner conductor. The outer conductor is insulated and connected to the inner conductor. The outer conductor is connected to the second radiator, and the inner conductor is connected to the circuit module.

10. The antenna microsystem structure according to claim 9, wherein: The antenna radiation structure also includes a reflecting floor, which is arranged on a side of the second radiator away from the first radiator. The shielding metal structure is arranged on the reflecting floor, and the SMA connector passes through the reflecting floor so that the reflecting floor is connected to the second radiator through the outer conductor.

11. The antenna microsystem structure according to claim 10, wherein: The SMA connector protrudes from the reflective floor and supports the circuit module together with the shielding metal structure, so that there is a distance between the circuit module and the reflective floor.

12. The antenna microsystem structure according to claim 10, wherein: The circuit module is provided with a nylon screw, and a nylon nut is provided on a side of the reflective floor away from the second radiator. The nylon nut is used for threaded connection with the nylon screw.

13. The antenna microsystem structure according to any one of claims 1 to 7, wherein: The circuit module includes a PCB board and an analog circuit. The analog circuit is arranged on the PCB board. The circuit module also includes a digital circuit and / or a digital-analog hybrid circuit.

Images