Laser-assisted injection molding connection device, and process method

Abstract

A laser-assisted injection molding connection device and a process method. The connection device is characterized by comprising: a laser marking part (1), the laser marking part (1) comprising a laser device (11), a recording and identifying assembly (12) and a component platform (13), components being mounted on the component platform (13), the laser device (11) performing laser marking on the components, and the recording and identifying assembly (12) recording microstructures on the components and identifying grooves and molten pools in the microstructures; an injection molding part (2), the injection molding part (2) comprising an injection molding machine (21), the injection molding machine (21) performing injection molding on the components, so as to connect the components; a transfer part (3), the transfer part (3) comprising a manipulator, the manipulator transferring the components from the laser marking part (1) to the injection molding part (2); and a control part (4), the control part (4) controlling the operation of the laser marking part (1), the injection molding part (2) and the transfer part (3). The connection device solves the problems of complex processes, environmental pollution, poor material applicability, etc. in the prior art, improves the processing efficiency of components, and improves the degree of freedom in design and the batch production capacity of composite components while simplifying the process.

Description

Laser-assisted injection molding connection device and process method Technical Field

[0001] The present invention relates to the field of component connection, and in particular to a laser-assisted injection molding connection device and a process method. Background Art

[0002] Materials such as metals, plastics, and ceramics have been widely used in corresponding fields due to their respective performance advantages. However, as consumers' requirements for product performance, size, weight, etc. continue to increase, it is difficult for a single material to meet all the product index requirements. Therefore, we must continue to innovate in manufacturing materials, processes, etc. Metal / plastic composite components and ceramic / plastic composite components are highly favored because they have the advantages of both plastics and another material (metal or ceramic). They have been gradually applied and have broad prospects. For example, light metal / plastic composite components have great application prospects in aerospace, automobiles and other fields, because light metals have low density, good corrosion resistance, high toughness and are not easy to deform after processing, while plastics have high hardness, good insulation / flame retardancy and excellent thermal properties.

[0003] In the prior art, the connection methods of composite components can be divided into three categories: (a) gluing, i.e., applying adhesive to the contact surface of metal (or ceramic) and plastic to connect the two materials; (b) macro-mechanical connection, i.e., drilling holes in the two materials to be connected and fixing them with bolts / rivets, etc., or simply drilling holes in the metal (or ceramic) material and injecting molten plastic to form a plastic rivet connection; (c) micro-structural interlocking, i.e., preparing micro-nano textures on the metal (or ceramic) surface in advance, injecting molten plastic and cooling it to form a micro-scale interlocking connection at the interface of the two materials. Among them, the gluing method is suitable for connecting components with a larger area, but it requires tedious treatment such as cleaning the bonding surface, and there are problems such as long curing cycle and release of volatile harmful substances; the macro-mechanical connection method can easily disassemble and assemble the connected components, but it destroys the structural integrity of the connected materials, and has disadvantages such as local load-bearing, stress concentration, poor fatigue resistance and additional weight; the micro-structure interlocking method is increasingly widely used due to its wide range of applicable processes, high strength of composite components and uniform force, but it requires pre-offline preparation of metal (or ceramic) surface micro-texture, and the preparation process generally has environmental issues.

[0004] Therefore, the existing technology still needs to be improved and developed. Summary of the Invention

[0005] In view of the shortcomings of the existing technology, the purpose of this application is to provide a laser-assisted injection molding connection device and process method, aiming to solve the problems of poor material adaptability and environmentally unfriendly process in the existing technology for manufacturing composite components, and to simplify the process flow of composite component manufacturing.

[0006] The technical solution adopted by this application to solve the technical problem is as follows: a laser-assisted injection molding connection device, comprising:

[0007] Laser marking unit, which includes a laser, a recording and identification component, and a component platform. The component is mounted on the component platform, and the laser marks the component.

[0008] The recording and identification component records the microstructure on the component and identifies the grooves and molten pools of the microstructure;

[0009] The transfer unit includes a robot that transfers components from the laser marking unit to the injection molding unit;

[0010] The injection molding department includes an injection molding machine, which performs injection molding on a mold in which a component is placed to achieve connection between the plastic and the component and form a composite component in situ;

[0011] Control unit: The control unit controls the operation of the laser marking unit, injection molding unit and transfer unit.

[0012] Furthermore, the laser marking unit further includes a carrier, and the laser and the record identification component are respectively mounted on both sides of the carrier.

[0013] Furthermore, the recording and identification component includes a camera, a compensation aperture, and a servo element;

[0014] The servo component is installed on one side of the carrier component, the camera is installed on the top of the servo component, so that the servo component drives the camera to move toward or away from the component, and the compensation aperture is installed on the servo component.

[0015] Furthermore, the laser marking unit further includes a workbench, and the component platform and the bearing member are respectively installed on the workbench.

[0016] Furthermore, a first support member, a second support member, a third support member, a fourth support member and a component mounting member are provided on the component platform;

[0017] The first support member is mounted on the workbench along a first direction, the second support member is slidably mounted on the first support member along the first direction, and the second support member and the first support member are perpendicular to each other;

[0018] The third support member is slidably mounted on the second support member along a second direction, wherein the second direction is perpendicular to the first direction;

[0019] The fourth supporting member is installed on the top surface of the third supporting member, and the component mounting member is rotatably installed in the fourth supporting member.

[0020] Furthermore, a turntable is provided on the component mounting piece, and the turntable is rotatably mounted on the component mounting piece along the central axis of the component mounting piece.

[0021] Furthermore, the laser marking unit also includes a dust removal component, which is installed in the workbench.

[0022] Furthermore, the dust removal assembly includes a dust removal processor and a dust removal pipe. The dust removal processor is installed in the workbench. One end of the dust removal pipe is connected to the dust removal processor, and the other end passes through the fourth support member to remove dust from the component mounting member.

[0023] Furthermore, the injection molding part also includes a blanking conveyor belt, which is installed below the injection molding machine.

[0024] A laser-assisted injection molding process method and a laser-assisted injection molding connecting device, the process method comprising the following steps:

[0025] S01. Clean the surface of the component in advance and collect the component size and contour information, and upload the relevant information to the control unit, which generates a component processing plan based on this information;

[0026] S02. Place the component on the component platform, and fix the component in the component platform;

[0027] S03, controlling the component on the component platform to move to below the laser, and then controlling the laser to process the surface of the component to generate a microstructure on the surface of the component;

[0028] S04, the dust removal component processes the residual processing powder on the component platform;

[0029] S05. The recording and recognition component captures and records images of the processed component;

[0030] S06, the transfer department transfers the processed components to the injection molding machine;

[0031] S07, the injection molding machine performs injection molding on the mold in which the processed component is placed, so that the processed component and the plastic are connected in situ in the mold of the injection molding machine;

[0032] S08. Demolding the composite part and setting an information code on the composite part. The information code includes the batch, production time, processing parameters and image information captured by the recording and identification component of the composite part. Beneficial effects:

[0033] The present application provides a laser-assisted injection molding connection device and process method, in which a component is laser processed by a laser marking part to process a microstructure on the surface of the component, and then the component is recorded by a recording and recognition component to determine whether the component is qualified. After the processing is completed, it is transferred to an injection molding machine by a robot, and the mold in which the component is placed is injection molded by the injection molding machine to realize the formation of a composite component by plastic and the component.

[0034] Therefore, the laser-assisted injection molding connection device and process method in this application have certain advantages over the existing technology. For example, the existing technology mainly uses offline shot blasting / sand blasting or chemical etching methods to generate microstructures on the surface, while this project uses online laser to induce multi-level textures on the material surface, which solves the problems of cumbersome process, environmental pollution and poor material applicability of traditional offline methods, and improves the processing efficiency of components; secondly, the connection methods based on microstructure interlocking to form composite components in the existing technology mainly include hot pressing, molding and other methods. This project uses laser-assisted injection molding method to realize in-situ connection of the composite materials, which not only simplifies the process flow, but also greatly improves the design freedom and mass production capacity of composite components. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] FIG1 is a schematic diagram of a laser-assisted injection molding connection device according to an embodiment of the present application;

[0036] FIG2 is a schematic diagram of a laser marking portion in an embodiment of the present application;

[0037] FIG3 is a front view of a laser marking portion in an embodiment of the present application;

[0038] FIG4 is a left side view of the laser marking portion in an embodiment of the present application;

[0039] FIG5 is a top view of a laser marking portion in an embodiment of the present application;

[0040] FIG6 is a schematic diagram of a turntable in an embodiment of the present application;

[0041] FIG7 is a front view of the turntable in an embodiment of the present application;

[0042] FIG8 is a left side view of the turntable in the embodiment of the present application;

[0043] FIG9 is a top view of the turntable in an embodiment of the present application.

[0044] Explanation of the accompanying drawings: 1. Laser marking unit; 11. Laser; 12. Recording and identification component; 121. Camera; 122. Compensating aperture; 123. Servo component; 13. Component platform; 131. First support member; 132. Second support member; 133. Third support member; 134. Fourth support member; 135. Component mounting member; 136. Turntable; 137. Stop block; 138. Cylinder; 14. Carrying member; 15. Workbench; 16. Dust removal component; 161. Dust removal processor; 162. Dust removal duct; 2. Injection molding unit; 21. Injection molding machine; 22. Blanking conveyor belt; 3. Transfer unit; 4. Control unit. DETAILED DESCRIPTION

[0045] To make the purpose, technical solutions and advantages of this application clearer and more explicit, the following further describes this application in detail with reference to the accompanying drawings and examples. It should be understood that the specific examples described herein are only used to explain this application and are not intended to limit this application.

[0046] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present application, unless otherwise specified, "multiple" means two or more.

[0047] In the description of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed, detachable, or integral connections; mechanical or electrical connections; direct or indirect connections through an intermediate medium; and internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0048] The present invention provides a laser-assisted injection molding connection device and process method, as shown in Figures 1 to 9, the present application includes a laser-assisted injection molding connection device, including a laser marking part 1, an injection molding part 2, a transfer part 3 and a control part 4. The laser marking part 1 includes a laser 11, a recording and identification component 12 and a component platform 13. The component is installed on the component platform 13, wherein the component is specifically made of metal or ceramic and other materials. After the installation is completed, the component is fixed to prevent the component from falling off the component platform 13 to avoid adverse effects on the processing of the component. The laser 11 performs laser processing on the component, and the recording and identification component 12 records the component after laser processing; the injection molding part 2 includes an injection molding machine 21, and the injection molding machine 21 performs injection molding on the mold in which the component is placed to realize in-situ connection between the plastic and the component to form a composite component; the transfer part 3 includes a robot, which transfers the component from the laser marking part 1 to the injection molding part 2. When the component After laser processing in the laser marking part 1, the robot transports the component from the laser marking part 1 to the injection molding part 2. The processed component is placed in the mold of the injection molding machine 21 for injection molding to achieve its connection with the plastic to form a composite component; the control part 4 controls the operation of the laser marking part 1, the injection molding part 2 and the transfer part 3. Specifically, the control part 4 is electrically connected to the laser marking part 1, the injection molding part 2 and the transfer part 3 respectively, and communicates with the laser marking part 1, the injection molding part 2 and the transfer part 3 respectively through an open port protocol. The control part 4 controls the structures in the laser marking part 1, the injection molding part 2 and the transfer part 3 by controlling the motor input and output pulse signals of other parts.

[0049] In order to provide an installation location for the laser 11 and the record identification component 12, the laser marking unit 1 also includes a carrier 14. The carrier 14 is in the shape of a rectangular strip, one end of which is fixed to the workbench 15 of the laser marking unit 1. In order to more firmly fix the carrier 14 on the workbench 15, the surface of the workbench 15 located near the carrier 14 extends toward the carrier 14. At this time, there is a smooth transition between the end of the carrier 14 near the workbench 15 and the surface of the workbench 15. At the same time, the laser 11 and the record identification component 12 are respectively installed on both sides of the other end of the carrier 14. In addition, the component platform 13 is installed on the surface of the workbench 15. At the same time, the laser 11 and the record identification component 12 are respectively facing the component platform 13, so that the laser 11 can perform laser processing on the component on the component platform 13 and the record identification component 12 can record and identify the component.

[0050] Furthermore, to improve the accuracy of record recognition, the record recognition component 12 includes a camera 121, a compensation aperture 122, and a servo 123. The servo 123 is mounted on one side of the carrier 14, and the camera 121 is mounted on the top of the servo 123, so that the servo 123 drives the camera 121 to move toward or away from the component. The compensation aperture 122 is mounted on the servo 123, and the light beads on the compensation aperture 122 surround the lens of the camera 121 to provide fill light for the camera 121. In this embodiment, the camera 121 is a CCD (charge coupled device) camera. Specifically, first, the camera 121 will mainly archive the morphological pattern information of the component processing surface. Because after the online laser processing is completed, the processed product can no longer be taken out for corresponding morphological observation. Using the camera 121 to capture the image of the processed morphology after the processing is completed can provide support for the subsequent connection performance analysis of the composite component. At the same time, it can also timely eliminate defective morphology products by setting corresponding image features. Specifically, after the laser treats the surface of the component, a microstructure is generated on the surface of the component. The grooves and molten pool traces on the microstructure are analyzed to determine whether the processing of the microstructure is successful. Therefore, the image features at this time are the grooves and molten pools of the microstructure. Specifically, the grooves are first analyzed, and the standard deviation of the groove width is analyzed. Because the microstructure is mainly grooves, if the grooves in some areas of the microstructure image are uneven, a rectangular frame of a specific width is selected. This width is determined according to the set groove width. The groove width is generally between 35 microns and 45 microns. The width of the rectangular frame is consistent with the groove width under the ideal qualified state of the groove. When this rectangular frame selects part of the groove image, if it is recognized that the width of part of the groove exceeds the size of the selected frame area, it is judged as unqualified. The same microstructure image can be captured and identified multiple times by rectangular frames, and the results of multiple rectangular frame captures and identifications are analyzed at the same time. If it is unqualified If the rate reaches a certain value (this value is set according to the properties of the material), the system determines that the microstructure of the product is unqualified and the microstructure of the product needs to be reprocessed; secondly, when the surface of the component is laser processed to generate the microstructure, part of the material is cooled and solidified after melting, thus forming irregular protrusions (i.e., molten pool marks). The height of the protrusion is higher than the surface of the component. Therefore, in the image, the molten pool and other image features are not at the same height, and out of focus or highlights will appear. At this time, a certain grayscale threshold is set in the image. If a certain proportion of pixels exceeds the set grayscale threshold, the system determines that the microstructure of the product is unqualified and the microstructure of the product needs to be reprocessed. At this time, the compensation aperture 122 is mainly used to perform light compensation for the camera 121 to improve the imaging quality of subsequent images.At the same time, the servo component 123 here has two main functions: the first is the movement of the camera 121 away from or close to the component platform 13. Since the scale of the microstructure is on the order of 10μm when the camera 121 is capturing the image, the lens of the camera 121 is relatively close to the product component during shooting. However, since the component platform 13 where the component is located is movable, in order to prevent the lens from colliding with the component, the camera 121 needs to be able to move forward or backward relative to the component. At this time, a precision servo module with high repeatability positioning accuracy is required in the direction in which the camera 121 moves forward or backward relative to the component to achieve the avoidance movement of the camera 121 and the focus of the camera 121; the second is to ensure the uniformity of the light emitted by the compensation aperture 122, and to set a unique annular aperture structure and integrate it with the servo component 123 in the recording and identification component 12.

[0051] At the same time, in order for the laser 11 to process the entire surface of the component, it is necessary to allow the component platform 13 to drive the component to move so that the laser of the laser 11 can irradiate any surface of the component. The component platform 13 is provided with a first support member 131, a second support member 132, a third support member 133, a fourth support member 134 and a component mounting member 135, and these structures are used to drive the component to move. Specifically, the first support member 131 is installed on the workbench 15 along a first direction, the first direction is horizontal in this application, the first support member 131 is in the shape of an elongated strip, and two mutually parallel first support members 131 are installed at intervals on the workbench 15, and each first support member 131 is provided with a first slide bar, as shown in Figures 1 to 5; the second support member 132 is slidably installed on the first support member 131 along the first direction, and the second support member 132 is passed through the first slide bar, and the second support member 132 is in the shape of an elongated strip and is perpendicular to the first support member 131. At this time, the long side direction of the second support member 132 is the second direction, that is, the second direction is the longitudinal direction in this embodiment, and a second slide bar is provided in the second support member 132; the third support member 133 is slidably installed on the second support member 133 along the second direction 32, at this time the third support member 133 is passed through the second slide bar, and the bottom of the third support member 133 is in the shape of a square disk; the fourth support member 134 is installed on the top surface of the third support member 133, and the fourth support member 134 is composed of two vertical bars, and the two vertical bars are symmetrically arranged on the top surface of the third support member 133 along the central axis of the third support member 133, and the bottom of the vertical bars increases the contact area with the top surface of the third support member 133, so that the fourth support member 134 is more stably fixed on the top surface of the third support member 133; the component mounting member 135 is rotatably installed in the fourth support member 134, specifically, the first rotating shaft of the component mounting member 135 is rotatably installed in the hole of the fourth support member 134, so that the component can follow the rotation of the component mounting member 135, thereby allowing the laser to irradiate a wider range on the component.

[0052] In addition, a turntable 136 is provided on the component mounting part 135. The turntable 136 is rotatably mounted on the component mounting part 135 along the central axis of the component mounting part 135. The turntable 136 is mounted on the end of the steel component mounting part 135 close to the laser 11. At this time, the component is mounted on the turntable 136. The laser 11 is aligned with the component on the turntable 136 for laser processing. Therefore, when the turntable 136 rotates along the central axis of the component mounting part 135, the component rotates with the turntable 136 and cooperates with the rotation of the component mounting part 135, so that the laser 11 can irradiate a larger range on the component, thereby improving the laser processing efficiency.

[0053] In order to fix the component on the turntable 136 and prevent the component from falling off the turntable 136 due to the movement or rotation of the structure on the component platform 13, a stopper 137 and a cylinder 138 are provided on the turntable 136. As shown in Figures 6 to 9, the stopper 137 is L-shaped and protrudes from the surface of the turntable 136. A cylinder 138 is provided in the opposite directions of the two adjacent surfaces of the stopper 137. The cylinder 138 moves on the turntable 136 in the direction close to or away from the stopper 137. Therefore, when the component needs to be fixed on the turntable 136, the robot is first used to clamp it. Component, at this time, after the sensor on the cylinder 138 senses the distance position of the robot, the cylinder 138 retreats to the release position, and when the robot places the component on the turntable 136, there is space on both sides of the turntable 136 for the robot grippers to release and return the material. When the robot is released and rises away from the turntable 136, the sensor on the cylinder 138 senses the distance change of the robot and sends a signal, and the cylinder 138 clamps and pushes the component close to the block 137, thereby completing the clamping and positioning of the component, and then the laser 11 starts to laser process the component on the turntable 136.

[0054] At the same time, after the laser 11 performs laser processing on the component, powdery debris generated by the processed workpiece will be left on the turntable 136. This is because laser surface processing is the process of using the laser generated by the laser 11 to process a microstructure on the surface of the component. The process of removing material will produce powdery debris, which needs to be cleaned in time to avoid the residual powdery debris affecting the subsequent processing process. Therefore, the laser marking part 1 also includes a dust removal component 16, which is installed in the workbench 15. The dust removal component 16 is used to process the powder debris generated by the laser processing. Specifically, the dust removal component 16 includes a dust removal processor 161 and a dust removal pipe 162. The dust removal processor 161 is installed in the workbench 15. One end of the dust removal pipe 162 is connected to the dust removal processor 161, and the other end passes through the fourth support member 134 to clean the dust on the component mounting member 135. When the laser processing process is completed, the dust removal processor 161 starts to work and absorbs or blows the powder on the turntable 136 through the dust removal pipe 162 to ensure that no powder remains on the turntable 136. At this time, the dust removal component 16 has two dust removal modes, namely dust suction and blowing, which are similar to the reverse suction and forward blowing of a fan. Different modes are selected according to the particle size and concentration of the powder debris generated by the processing, and the particle concentration and size are related to the material properties. The laser-assisted injection molding connection device in this embodiment has a wide adaptability to materials. Therefore, whether the dust removal component 16 adopts the "blowing" or "dust suction" mode depends on the material. For example, when the laser-assisted injection molding connection device processes materials such as plastics and quartz, the powder debris particles generated by such materials are relatively large, so the powder debris particles need to be purged; when the laser-assisted injection molding connection device processes metal materials, the dust particles generated by such materials are relatively small, and the powder debris particles can be sucked in at this time. The dust removal intensity is adjusted by the power of the dust removal processor 161. A dust concentration monitor is installed on the component mounting part 135. The dust concentration monitor is electrically connected to the dust removal processor 161. The dust concentration monitor feeds back the concentration signal to the dust removal processor 161, and the dust removal processor 161 elastically adjusts the power according to the concentration signal.

[0055] Furthermore, the injection molding part 2 also includes a blanking conveyor belt 22, which is installed below the injection molding machine 21. After the processed component is connected with the plastic in situ in the injection mold, it needs to be demolded. After the demolding is completed, the component falls onto the blanking conveyor belt 22 and is sent to other places for subsequent processing.

[0056] This application also includes a laser-assisted injection molding process, and the following are the steps of the process:

[0057] S01, cleaning the surface of the component in advance and collecting the component size and profile information, and uploading the relevant information to the control unit 4, which generates a component processing plan based on the information;

[0058] S02, placing the component into the component platform 13, and the component is fixed in the component platform 13;

[0059] S03, the control unit 4 moves the component on the component platform 13 to below the laser 11, and then controls the laser 11 to process the surface of the component to generate a microstructure on the surface of the component;

[0060] S04, the dust removal component 16 processes the residual powdery debris on the component platform 13;

[0061] S05, the recording and recognition component 12 captures and records the image of the processed component;

[0062] S06, the transfer unit 3 transfers the processed component to the injection molding machine 21;

[0063] S07, the injection molding machine 21 performs injection molding on the mold in which the processed component is placed, so that the processed component and the plastic are connected in situ in the mold of the injection molding machine 21;

[0064] S08 , demoulding and taking out the composite part, and setting an information code on the composite part, wherein the information code includes the batch, production time, processing parameters and image information captured by the recording and recognition component 12 of the composite part.

[0065] Specifically, the various processes of the overall device are carried out in sequence, and the next process is not started until the previous process is completed, so as to avoid process confusion and the subsequent process from being unable to proceed. First, the surface of the component is cleaned to prevent problems when the surface of the component is microstructured and connected with plastic to form a composite component. After cleaning, the contour of the component is analyzed using three-dimensional scanning software. Before microstructure processing, the component's external dimension information and contour feature information are obtained in advance to provide position information for the subsequent movement control of the component platform 13 and the processing area of ​​the anchoring component surface. The position information is then uploaded to the control unit 4, and the corresponding movement path plan is generated through the path algorithm. At the same time, the plan is stored in the control unit 4 for subsequent use at any time. Then, the component is placed on the turntable by a manipulator, and the component is fixed on the turntable by the stopper 137 and cylinder 138 on the turntable. After the component is positioned, the movement path plan is uploaded and recognized, and a signal that the component is in place is transmitted to the control unit 4. During the component positioning process, the corresponding processing parameters can be adjusted according to the corresponding model of mechanical strength and microstructure morphology. The control unit 4 then sends a signal to the laser 11, causing it to begin processing and machine a microstructure on the component's surface. After processing is complete, the laser 11 sends a processing completion signal to the control unit 4. Upon receiving this signal, the control unit 4 sends a start signal to the dust removal assembly 16. The dust removal processor 161 begins operating and cleans the dust on the turntable 136. The dust removal process is time-controlled, meaning it automatically stops after completing a specific time period. Upon completing the suction process, the dust removal processor 161 sends a signal to the control unit 4. Upon receiving this signal, the control unit 4 sends a start signal to the recording and recognition assembly 12. At this point, the camera 121 activates, and the compensation aperture 122 and servo 123 are simultaneously activated. The servo 123 controls the movement of the camera 121 toward the turntable. During the descent, the camera 121 simultaneously focuses. Once the camera 121 has achieved focus, the servo 123 stops driving the camera 121, and the camera 121 captures and processes images of the machined component. The captured image and other information are transmitted to the control unit 4. After receiving the signal, the control unit 4 controls the servo 123, causing the servo 123 to drive the camera 121 away from the turntable, thereby preventing the component platform 13 from colliding and damaging the camera 121 during movement. When the camera 121 rises to its original position, the control unit 4 moves according to the set matrix point information and completes the component capture, transferring the processed component from the turntable to the injection molding machine 21. After the component is accurately placed, the injection molding machine 21 sends a signal to the control unit 4, which then controls the injection molding machine 21 to close the mold containing the component and perform injection molding.

[0066] It should be understood that the application of the present invention is not limited to the above examples. For those skilled in the art, improvements or changes can be made based on the above description. All these improvements and changes should fall within the scope of protection of the claims attached to the present invention.

Claims

1. A laser-assisted injection molding connection device, characterized in that: include: A laser marking unit, comprising a laser, a record identification component, and a component platform, wherein the component is mounted on the component platform, and the laser marks the component to form a microstructure on the component; The recording and identifying component records the microstructure on the component and identifies the grooves and molten pools of the microstructure; An injection molding unit, comprising an injection molding machine, which performs injection molding on a mold containing a component to achieve connection between the plastic and the component, thereby forming a composite component in situ; A transfer unit, comprising a robot, which transfers the component from the laser marking unit to the injection molding unit; A control unit controls the robot to transfer the component marked by the laser marking unit to the transfer unit.

2. The laser-assisted injection molding connection device according to claim 1, characterized in that: The laser marking unit further includes a carrier, and the laser and the record identification component are respectively mounted on two sides of the carrier.

3. The laser-assisted injection molding connection device according to claim 2, characterized in that: The record identification component includes a camera, a compensation aperture and a servo element; The servo component is installed on one side of the carrier, and the camera is installed on the top of the servo component, so that the servo component drives the camera to move toward or away from the component, and the compensation aperture is installed on the servo component.

4. The laser-assisted injection molding connecting device according to claim 3, characterized in that: The laser marking unit further includes a workbench, and the component platform and the bearing member are respectively mounted on the workbench.

5. The laser-assisted injection molding connection device according to claim 4, characterized in that: The component platform is provided with a first support member, a second support member, a third support member, a fourth support member and a component mounting member; The first support member is mounted on the workbench along a first direction, the second support member is slidably mounted on the first support member along the first direction, and the second support member and the first support member are perpendicular to each other; The third support member is slidably mounted on the second support member along a second direction, wherein the second direction is perpendicular to the first direction; The fourth support member is installed on the top surface of the third support member, and the component mounting member is rotatably installed in the fourth support member.

6. The laser-assisted injection molding connection device according to claim 5, characterized in that: The component mounting piece is further provided with a turntable, which is rotatably mounted on the component mounting piece along the central axis of the component mounting piece.

7. The laser-assisted injection molding connecting device according to claim 6, characterized in that: The laser marking unit further includes a dust removal component installed in the workbench.

8. The laser-assisted injection molding connecting device according to claim 7, characterized in that: The dust removal assembly includes a dust removal processor and a dust removal pipe. The dust removal processor is installed in the workbench. One end of the dust removal pipe is connected to the dust removal processor, and the other end passes through the fourth support member to remove dust from the component mounting member.

9. The laser-assisted injection molding connecting device according to any one of claims 1 to 8, characterized in that: The injection molding part also has a blanking conveyor belt, and the blanking conveyor belt is installed below the injection molding machine.

10. A laser-assisted injection molding process, comprising the laser-assisted injection molding connecting device according to any one of claims 1 to 9, characterized in that: The process comprises the following steps: Clean the surface of the component in advance and collect the component size and contour information, and upload the relevant information to the control unit, which generates a component processing plan based on this information; placing a component into the component platform, wherein the component is fixed in the component platform; The component on the component platform moves to below the laser, and then the laser is controlled to process the surface of the component to generate a microstructure on the surface of the component; The dust removal component processes residual processing powder on the component platform; The recording and recognition component captures and records images of the processed component; The transfer unit transfers the processed component to the injection molding machine; The injection molding machine performs injection molding on the mold in which the processed component is placed, so that the processed component and the plastic are connected in situ in the mold of the injection molding machine; The composite part is removed from the mold and an information code is set on the composite part. The information code includes the batch, production time, processing parameters and image information captured by the recording and identification component of the composite part.

Images