Inverter

Abstract

An inverter, which comprises a housing carrier plate, a plurality of first capacitors, a plurality of second capacitors, and a first bus assembly, wherein the housing carrier plate is provided with a bearing surface, a plurality of first grooves and a plurality of second grooves being provided in the bearing surface; the first capacitors are respectively arranged in the first grooves, and the first grooves are filled with a thermally conductive adhesive to respectively adhere to the first capacitors; the second capacitors are respectively arranged in the second grooves, and the second grooves are filled with the thermally conductive adhesive to adhere to the second capacitors; and the first bus assembly is stacked on the bearing surface and is separately electrically connected to the first capacitors and the second capacitors.

Description

Inverter Technical Field

[0001] The present disclosure relates to an inverter, and more particularly to an inverter that is easy to assemble. Background Art

[0002] Today's automotive inverters typically consist of a main body and a housing. The main body is housed within the housing, and an outer shell is equipped with connectors electrically connected to the main body for external connections to a power source and load. Typically, the main body includes a circuit board and the electronic components mounted on the circuit board. Conventional assembly involves soldering the electronic components to the control circuit board and then securing them to the housing. Soldering the electronic components to the control circuit board requires manually or automatically placing them in the desired position on the circuit board. The circuit board is then placed in a soldering furnace for heating to complete the soldering process. If the electronic components are misaligned during placement, the inverter will malfunction.

[0003] Furthermore, the space between the electronic components and the housing creates thermal resistance, which in turn makes the inverter's heat dissipation efficiency poor. It is necessary to set up a separate heat conduction channel to dissipate the large amount of heat generated by the electronic components when the inverter is operating.

[0004] Therefore, current assembly methods are costly, have low process yields, and suffer from poor heat dissipation efficiency.

[0005] In view of this, the present inventor has conducted intensive research on the above-mentioned prior art and applied theoretical knowledge to try his best to solve the above-mentioned problems, which has become the goal of the present inventor's improvement. Summary of the Invention

[0006] The present disclosure provides an inverter that is easy to assemble.

[0007] The present disclosure provides an inverter, which includes a housing carrier, multiple power conversion modules, multiple first capacitors and a first bus component. The housing carrier has a bearing surface, on which at least one first groove is provided. The power conversion module is attached to the bearing surface. The first capacitors are respectively arranged in the first grooves, and the first grooves are filled with thermally conductive adhesive to adhere the first capacitors, and each first capacitor has multiple capacitor electrodes. The first bus component is stacked on the bearing surface and electrically connected to the first capacitors respectively. The connection points of the capacitor electrodes of the first capacitors and the first bus component are arranged in one row, and the connection points of the power conversion module and the first bus component are arranged in another parallel row.

[0008] In one embodiment of the present disclosure, the inverter further includes a second bus assembly, which is stacked on the supporting surface and electrically connected to the power conversion modules respectively.

[0009] In one embodiment of the present disclosure, the second bus assembly has a bracket and a plurality of second electrodes attached to the bracket. The second electrodes are arranged coplanarly on the bracket. The bracket is locked to the supporting surface and the second electrodes are respectively welded to the power conversion modules.

[0010] In one embodiment of the present disclosure, the connection points between the power conversion modules and the second bus assembly are arranged in one row, and the connection points between the power conversion modules and the first bus assembly are arranged in another parallel row.

[0011] In one embodiment of the present disclosure, the inverter further includes a control circuit board. The first bus component is stacked on the first capacitor, the power conversion module, and the second bus component, and the control circuit board is stacked on the first bus component.

[0012] In one embodiment of the present disclosure, the first bus assembly has a plurality of voltage terminals, and the voltage terminals are respectively soldered to the control circuit board.

[0013] In one embodiment of the present disclosure, the first bus component has multiple through-windows corresponding to the configuration of the power conversion modules, and each power conversion module is connected to the control circuit board through the corresponding through-windows. Each power conversion module has multiple solder pins, and the solder pins of the power conversion module respectively penetrate the first bus component and are soldered to the control circuit board.

[0014] In one embodiment of the present disclosure, each power conversion module has at least one pair of output pins, the second electrodes are respectively connected to the corresponding output pins, and the connection points between the second electrodes and the corresponding output pins are arranged in a row.

[0015] In one embodiment of the present disclosure, the first capacitors are arranged in one row, the power conversion modules are arranged in another parallel row, the second electrodes are arranged in another parallel row, and the second electrodes and the first capacitors are disposed on two sides of the power conversion modules facing each other.

[0016] In one embodiment of the present disclosure, each bracket is arranged in parallel with the power conversion module.

[0017] In one embodiment of the present disclosure, the bracket has a plurality of component grooves, and the second bus component includes a plurality of current sensors. The current sensors are respectively disposed in the component grooves, and each component groove is filled with thermally conductive adhesive to adhere the current sensors.

[0018] In one embodiment of the present disclosure, the second electrodes pass through the corresponding current sensors respectively.

[0019] In one embodiment of the present disclosure, each current sensor is a magnetically sensitive sensor. The magnetically sensitive sensor includes a Hall element and a shield. The Hall element is disposed corresponding to the second electrode, and the shield surrounds the second electrode and the Hall element.

[0020] In one embodiment of the present disclosure, the inverter further includes two second capacitors. Two second grooves are provided on the supporting surface of the housing carrier. The second capacitors are respectively disposed in the second grooves. Each second groove is filled with thermally conductive adhesive to adhere the second capacitors.

[0021] In one embodiment of the present disclosure, a pair of input terminals is disposed between the two second grooves, and the pair of input terminals are respectively connected to each second capacitor and the first bus component.

[0022] In one embodiment of the present disclosure, a second longitudinal limiting protrusion, a second transverse limiting protrusion, and a second positive limiting protrusion are disposed within the second groove. The second longitudinal limiting protrusion, the second transverse limiting protrusion, and the second positive limiting protrusion respectively abut the second capacitor, forming a second gap between the second capacitor and the inner wall of the second groove. Thermally conductive adhesive is then filled into the second gap. The second longitudinal limiting protrusion and the second transverse limiting protrusion respectively limit the horizontal position of the second capacitor, while the second positive limiting protrusion respectively limits the vertical position of the second capacitor, thereby restricting the position of the capacitor electrode of the second capacitor from forming an electrical connection with the input terminal.

[0023] In one embodiment of the present disclosure, a plurality of heat exchange chambers are provided on the carrying surface, and the power conversion modules are respectively arranged corresponding to the heat exchange chambers. The first groove is close to the heat exchange chamber, and the heat of the first groove is transferred to the heat exchange chamber through the outer shell carrier.

[0024] In one embodiment of the present disclosure, the heat exchange chambers are arranged in one row, and the first grooves are arranged in another parallel row.

[0025] In one embodiment of the present disclosure, the inverter further includes a capacitor electrode bracket, the capacitor electrode bracket is locked inside the housing carrier, and the capacitor electrodes of the first capacitor are respectively fixed to the capacitor electrode bracket.

[0026] In one embodiment of the present disclosure, in each first capacitor, the capacitor electrode is attached to a surface of the first capacitor.

[0027] In one embodiment of the present disclosure, a first longitudinal limiting protrusion, a first transverse limiting protrusion, and a first positive limiting protrusion are protruded from the inner wall of the first groove. The first longitudinal limiting protrusion, the first transverse limiting protrusion, and the first positive limiting protrusion respectively abut against the first capacitor to form a first gap between the first capacitor and the inner wall of the first groove, and thermal conductive glue is filled in the first gap.

[0028] During assembly of the inverter disclosed herein, the first and second recesses of the housing carrier can be pre-filled with a specific amount of thermally conductive adhesive. The first and second capacitors are then positioned within the first and second recesses, respectively. The power conversion module and second bus assembly are then secured to the housing carrier. This structure facilitates the positioning of discrete components, allowing the first bus assembly and control circuit board to be positioned simply by stacking them on the carrier surface for soldering.

[0029] Furthermore, by adhering the electronic components (capacitors) with higher heat dissipation to the housing carrier through thermal conductive adhesive, the thermal resistance between the electronic components and the housing carrier can be reduced, thereby improving the heat dissipation efficiency of the inverter. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] FIG1 is a perspective schematic diagram of an inverter according to an embodiment of the present disclosure;

[0031] FIG2 is another perspective schematic diagram of an inverter according to an embodiment of the present disclosure;

[0032] FIG3A is a perspective exploded schematic diagram of an inverter according to an embodiment of the present disclosure;

[0033] FIG3B is another exploded perspective view of an inverter according to an embodiment of the present disclosure;

[0034] FIG4A is a perspective diagram of the internal structure of an inverter according to an embodiment of the present disclosure;

[0035] FIG4B is another exploded perspective view of an inverter according to an embodiment of the present disclosure;

[0036] FIG4C is a circuit diagram of an inverter according to an embodiment of the present disclosure;

[0037] FIG5 is another exploded perspective view of an inverter according to an embodiment of the present disclosure;

[0038] FIG6 is a perspective diagram of a housing carrier of an inverter according to an embodiment of the present disclosure;

[0039] FIG7 is a schematic diagram of the assembly of the first capacitor of the inverter according to an embodiment of the present disclosure;

[0040] FIG8 is a schematic diagram of the assembly of the second capacitor of the inverter according to an embodiment of the present disclosure;

[0041] FIG9 is a schematic diagram illustrating the assembly of a power conversion module of an inverter according to an embodiment of the present disclosure;

[0042] FIG10 is a schematic diagram of the assembly of the second bus assembly of the inverter according to an embodiment of the present disclosure;

[0043] FIG11 is a schematic diagram of a housing and a carrier plate of an inverter according to an embodiment of the present disclosure;

[0044] FIG12 is a cross-sectional view of the inverter housing and the carrier plate supporting components shown along the section line 12-12 of FIG11 according to an embodiment of the present disclosure;

[0045] FIG13 is a cross-sectional view of an inverter according to an embodiment of the present disclosure, shown along line 13-13 in FIG4A;

[0046] FIG14 is a partially enlarged view of FIG13 .

[0047] DESCRIPTION OF REFERENCE NUMERALS 100: housing carrier 100a: cover 101: carrying surface 110: first groove 111: first longitudinal limiting protrusion 112: first transverse limiting protrusion 113: first forward limiting protrusion 114: thermal conductive adhesive 120: second groove; 121: Second longitudinal limiting protrusion 122: Second transverse limiting protrusion 123: Second positive limiting protrusion 124: Thermally conductive adhesive 130: Heat exchange chamber 140: Serial flow channel 210: First capacitor 213: Capacitor electrode 220: Second capacitor 230: Power conversion module 231: Welding feet 232a, 232b: Module electrode 233: Output pin 310: First bus component 311: Through window 312a, 312b: Electrode welding point 313: Capacitor welding point 314: Terminal welding point 315: Input terminal 316: Voltage terminal 320: Second bus component 321: Bracket 321a: Component groove 322: Second electrode 323: Current sensor 323a: Shielding member 330: Capacitor electrode bracket 400: Control circuit board DETAILED DESCRIPTION

[0048] In the description of the present disclosure, it should be understood that the terms "front side", "rear side", "left side", "right side", "front end", "rear end", "end", "longitudinal", "lateral", "vertical", "top", "bottom", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings. They are only for the convenience of describing the present disclosure and simplifying the description. They do not indicate or imply that the device or component referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present disclosure.

[0049] As used herein and not otherwise defined, the terms "substantially" and "approximately" are used to describe and describe small variations. When applied to an event or circumstance, the terms may include the exact moment the event or circumstance occurred, as well as the point at which the event or circumstance occurred to a close approximation. For example, when applied to a numerical value, the terms may include a range of variation less than or equal to ±10% of the numerical value, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%.

[0050] The detailed description and technical contents of the present disclosure are described below with reference to the accompanying drawings. However, the drawings are for illustrative purposes only and are not intended to limit the present disclosure.

[0051] FIG1 is a schematic perspective view of an inverter according to an embodiment of the present disclosure. FIG2 is another schematic perspective view of an inverter according to an embodiment of the present disclosure. FIG3A is an exploded perspective view of an inverter according to an embodiment of the present disclosure. FIG3B is another exploded perspective view of an inverter according to an embodiment of the present disclosure. FIG4A is a schematic perspective view of the internal structure of an inverter according to an embodiment of the present disclosure. FIG4B is yet another exploded perspective view of an inverter according to an embodiment of the present disclosure. FIG5 is yet another exploded perspective view of an inverter according to an embodiment of the present disclosure.

[0052] Referring to Figures 1 to 5 , an embodiment of the present disclosure provides an inverter comprising at least a housing carrier 100, a plurality of first capacitors 210, a plurality of second capacitors 220, a plurality of power conversion modules 230, a first bus assembly 310, a second bus assembly 320, and a control circuit board 400. In this embodiment, the inverter further comprises a cover 100a for closing the housing carrier 100. The electrical connections between the various components are shown in the circuit of Figure 4C , where the first capacitor 210 is a buck capacitor used to limit the current input to each power conversion module 230, and the second capacitor 220 is used to filter the DC power input to the first bus assembly 310.

[0053] FIG6 is a three-dimensional schematic diagram of the housing carrier 100 of the inverter according to an embodiment of the present disclosure. Referring to FIG6 , in this embodiment, the housing carrier 100 is made of metal, and the inner side of the housing carrier 100 has a bearing surface 101, and at least a plurality of first grooves 110 and a plurality of second grooves 120 are provided inside the housing carrier 100. The bearing surface 101 referred to here is not a specific plane or curved surface, but refers to the portion of the inner surface of the housing carrier 100 that can be used to carry components, such as the portion other than the peripheral wall of the housing carrier 100 shown in this embodiment. Specifically, each first groove 110 and each second groove 120 are recessed in the bearing surface 101. In this embodiment, a plurality of heat exchange chambers 130 are also provided inside the housing carrier 100, and the heat exchange chambers 130 are recessed in the bearing surface 101. The first grooves 110 are close to the heat exchange chambers 130 . The heat exchange chambers 130 are arranged in a row and connected in series by a series flow channel 140 . The first grooves 110 are arranged in another row parallel to the row of heat exchange chambers 130 (or parallel to the series flow channel 140 ).

[0054] The first grooves 110 shown in this embodiment have the same structure. In each first groove 110, a first longitudinal limiting protrusion 111, a first transverse limiting protrusion 112 and a first positive limiting protrusion 113 are protruded from the inner wall of the first groove 110. The first positive limiting protrusion 113 protrudes from the bottom surface of the first groove 110 toward the opening of the first groove 110, and the first longitudinal limiting protrusion 111 and the first transverse limiting protrusion 112 protrude from the inner side surface of the first groove 110 along two directions perpendicular to each other. The second grooves 120 shown in this embodiment have the same structure. In each second groove 120, a second longitudinal limiting protrusion 121, a second transverse limiting protrusion 122 and a second positive limiting protrusion 123 are provided in the second groove 120. The second positive limiting protrusion 123 protrudes from the bottom surface of the second groove 120 toward the opening of the second groove 120, and the second longitudinal limiting protrusion 121 and the second transverse limiting protrusion 122 protrude from the inner side surface of the second groove 120 along two directions perpendicular to each other.

[0055] Figure 7 illustrates the assembly of the first capacitor 210 of an inverter according to one embodiment of the present disclosure. Referring to Figure 7 , the inverter shown in this embodiment is configured with multiple identical first capacitors 210, and the housing carrier 100 is configured with multiple corresponding first recesses 110. These first capacitors 210 are individually disposed within each corresponding first recess 110, but these first capacitors 210 can also be integrated within a single first recess 110. In this embodiment, each first capacitor 210 is disposed in the same manner within the corresponding first recess 110. The following description uses one first recess 110 and the first capacitor 210 therein as an example. Thermally conductive adhesive 114 is filled within this first recess 110, and this adhesive secures the first capacitor 210 to the housing carrier 100. Heat generated by the first capacitor 210 during operation can be conducted from the first recess 110 through the housing carrier 100 to the heat exchange chamber 130. The electrical contacts between each first capacitor 210 and the first bus assembly 310 are arranged parallel to the solder pins 231 of the power conversion module 230. The first longitudinal limiting protrusion 111 in the first groove 110 positions the first capacitor 210 horizontally (with reference to the bottom surface of the first groove 110), the first transverse limiting protrusion 112 in the first groove 110 positions the first capacitor 210 horizontally, and the first positive limiting protrusion 113 in the first groove 110 positions the first capacitor 210 vertically. This ensures the relative position of the electrical contacts of the first capacitor 210 and the electrical contacts of the first bus assembly 310, facilitating soldering.

[0056] Figure 8 illustrates the assembly of the second capacitors 220 of an inverter according to an embodiment of the present disclosure. Referring to Figure 8 , the second capacitors 220 are disposed within corresponding second recesses 120. The following description uses one second recess 120 and the second capacitors 220 therein as an example. Thermally conductive adhesive 124 is filled within this second recess 120, and this adhesive secures the second capacitors 220 to the housing carrier 100.

[0057] Figure 9 illustrates the assembly of the power conversion modules 230 of an inverter according to one embodiment of the present disclosure. Referring to Figure 9 , the power conversion modules 230 are attached to the support surface 101. Specifically, the power conversion modules 230 are secured to the support surface 101 and positioned corresponding to the heat exchange chambers 130. In this embodiment, a portion of each power conversion module 230 is housed within a corresponding heat exchange chamber 130.

[0058] FIG10 is a schematic diagram illustrating the assembly of the second bus assembly 320 of an inverter according to an embodiment of the present disclosure. Referring to FIG10 , the second bus assembly 320 is stacked on the support surface 101 and electrically connected to the power conversion modules 230. The second bus assembly 320 is secured to the support surface 101. The second bus assembly 320 comprises a bracket 321 and a plurality of second electrodes 322 attached to the bracket 321. The second electrodes 322 are arranged substantially coplanarly on the bracket 321. The bracket 321 is secured to the support surface 101, and the second electrodes 322 are welded to the power conversion modules 230. The bracket 321 is defined by a plurality of component recesses 321 a. The second bus assembly 320 includes a plurality of current sensors 323, each of which is disposed within each of the component recesses 321 a. Each recess 321 a is filled with adhesive to secure the current sensors 323. These second electrodes 322 pass through corresponding current sensors 323, and each current sensor 323 in this embodiment is a current sensor. The current sensor referred to in this embodiment generally includes a Hall element (not shown) and a shielding member 323a. The Hall element is disposed within the circuit of the control circuit board 400 and positioned corresponding to each second electrode 322. The shielding member 323a is adhesively fixed within each component recess 321a. Specifically, the shielding member 323a is U-shaped and surrounds the opposing second electrodes 322 and the Hall element, thereby concentrating the magnetic field generated by the second electrodes 322 to the Hall element. The shielding member 323a is made of ferromagnetic material and is used to concentrate the local magnetic field to amplify the magnetic field variation, thereby improving the sensitivity and accuracy of the Hall element.

[0059] In this embodiment, the second bus component 320 includes a plurality of second electrodes 322 to provide multi-phase output (generally three-phase output, but the present disclosure is not limited to three-phase output). The second electrodes 322 are arranged on the same plane.

[0060] In this embodiment, the second bus assembly 320 is provided with three second electrodes 322 . When the power conversion modules 230 convert the direct current into three-phase alternating current, the three-phase alternating current is outputted through the second electrodes 322 .

[0061] Referring to FIG. 11 , the first and second recesses 110, 120 of the housing carrier 100 can be pre-filled with a specific amount of thermally conductive adhesive (114, 124), and then the first and second capacitors 210, 220 are placed in the first and second recesses 110, 110, respectively. Furthermore, the power conversion module 230 and the second bus assembly 320 are then fastened to the housing carrier 100. This structure facilitates the positioning of discrete components.

[0062] FIG12 is a cross-sectional view of the inverter housing and carrier assembly according to an embodiment of the present disclosure, as shown along line 12-12 in FIG11 . FIG13 is a cross-sectional view of the inverter according to an embodiment of the present disclosure, as shown along line 13-13 in FIG4A . FIG14 is a partially enlarged view of FIG13 . Referring to FIG7 and FIG12 to FIG14 , the bottom of the first capacitor 210 is accommodated within the first recess 110, causing the first capacitor 210 to protrude from the first recess 110. The first longitudinal limiting protrusion 111, the first transverse limiting protrusion 112, and the first positive limiting protrusion 113 within the first recess 110 respectively abut against the bottom of the first capacitor 210 accommodated within the first recess 110, forming a first gap 115 between the first capacitor 210 and the inner wall of the first recess 110. Specifically, after the first capacitor 210 is placed in the first recess 110, the pre-injected thermal conductive adhesive 114 shown in FIG7 is squeezed and ultimately fills the first gap 115, as shown in FIG12 .

[0063] 8 and 12 , the bottom of the second capacitor 220 is accommodated within the second groove 120, causing the second capacitor 220 to protrude from the second groove 120. The second longitudinal limiting protrusion 121, the first transverse limiting protrusion 112, and the second positive limiting protrusion 123 within the second groove 120 respectively abut the bottom of the second capacitor 220 accommodated within the second groove 120, forming a second gap 125 between the second capacitor 220 and the inner wall of the second groove 120. Specifically, after the second capacitor 220 is placed into the second groove 120, the pre-injected thermal conductive adhesive 124 shown in FIG. 8 is squeezed and ultimately fills the second gap 125 as shown in FIG. 12 .

[0064] 3B to 4B , a first bus assembly 310 is stacked on the carrier surface 101 and electrically connected to the first capacitors 210 and the second capacitors 220. The first bus assembly 310 is stacked on the first capacitors 210 and the second capacitors 220. The first capacitors 210 and the second capacitors 220 are soldered to the first bus assembly 310.

[0065] Referring again to Figures 4A to 5 and also to Figures 11 to 14 , the first capacitors 210, power conversion modules 230, and second bus components 320 are generally arranged together in a layer. The first capacitors 210 and power conversion modules 230 are arranged in parallel, and the second bus components 320 are arranged on one side of the power conversion modules 230 relative to the first capacitors 210. Specifically, the first capacitors 210 are arranged in one row and the power conversion modules 230 are arranged in another row. The power conversion modules 230 and second bus components 320 are respectively arranged on either side of the row of first capacitors 210, and the first bus components 310 are stacked on top of the layer. Each power conversion module 230 has a plurality of solder pins 231, at least one pair of module electrodes (232a, 232b), and at least one pair of output pins 233. Solder pins 231 extend upward for soldering to the control circuit board 400. Module electrodes (232a, 232b) are located on top of the power conversion module 230 and soldered to the first bus assembly 310. Within each pair of module electrodes (232a, 232b), one module electrode 232a is connected to the positive charge, while the other module electrode 232b is connected to the negative charge. The module electrodes 232a corresponding to the positive charge are arranged in one row, while the module electrodes 232b corresponding to the negative charge are arranged in another parallel row. Output pins 233 are located on one side of the power conversion module 230, adjacent to the second bus assembly 320, and soldered to the corresponding second electrodes 322. The connection points of these second electrodes 322 and the corresponding output pins 233 are arranged in another parallel row.

[0066] As shown in Figures 3B to 5, a capacitor electrode bracket 330 is attached to the inner lock of the housing carrier 100. The capacitor electrodes 213 of the first capacitors 210 extend to the capacitor electrode bracket 330 and are received therein. Each first capacitor 210 has a pair of capacitor electrodes 213. In this embodiment, the capacitor electrodes 213 of each first capacitor 210 protrude from one side of its top surface toward the power conversion module 230, and each pair of capacitor electrodes 213 of each first capacitor 210 is fixed to the capacitor electrode bracket 330, thereby positioning the capacitor electrodes 213 to facilitate soldering of the capacitor electrodes 213 to the first bus assembly 310. However, the present disclosure is not limited to this. For example, the capacitor electrodes 213 of each first capacitor 210 can also be attached to its top surface so that they can be soldered to the first bus assembly 310 without passing through the capacitor electrode bracket 330.

[0067] Referring to FIG. 4B , specifically, the capacitor electrodes 213 of the first capacitor 210 and the electrical contacts of the first bus assembly 310 are arranged in a row, and the aforementioned second electrodes 322 and the electrical contacts of the output pins 233 of the corresponding power conversion modules 230 are arranged in a parallel row. Furthermore, the series flow channel 140 is disposed between the two rows.

[0068] The control circuit board 400 is stacked on the supporting surface 101 and electrically connected to the power conversion modules 230 and the first bus assembly 310 . The control circuit board 400 controls the direct current input to the power conversion modules 230 through the first bus assembly 310 .

[0069] As shown in Figures 3B and 4B, in this embodiment, a control circuit board 400 is stacked on the first bus assembly 310 and the power conversion modules 230, and the control circuit board 400 is soldered to each of the power conversion modules 230 and the first bus assembly 310. The first bus assembly 310 has a plurality of voltage terminals 316, which are soldered to the control circuit board 400, enabling the control circuit board 400 to measure the voltage of the first bus assembly 310 and control the power conversion modules 230 accordingly. The first bus assembly 310 has a plurality of through-holes 311 corresponding to the power conversion modules 230. Each power conversion module 230 has a plurality of solder pins 231, which are soldered to the control circuit board 400. The control circuit board 400 can control each power conversion module 230 through these solder pins 231. Furthermore, some of the solder pins 231 of each power conversion module 230 pass through the corresponding through-holes 311 and are soldered to the control circuit board 400.

[0070] As shown in Figures 3B to 4B, the first bus assembly 310 has multiple electrode solder joints (312a, 312b) corresponding to positive and negative electrodes for respectively welding to the module electrodes (232a, 232b) of each power conversion module 230. Two sides of each electrode solder joint (312a, 312b) are exposed on two sides of the first bus assembly 310. One side of the electrode solder joint (312a / 312b) is used to contact the corresponding module electrode (232a / 232b), and the other side can be laser welded. The first bus assembly 310 has multiple capacitor solder joints 313 for respectively welding to the capacitor electrode 213 of each first capacitor 210. Two sides of each capacitor solder joint 313 are exposed on two sides of the first bus assembly 310. One side of the capacitor solder joint 313 is used to contact the corresponding capacitor electrode 213, and the other side can be laser welded. A pair of terminal solder joints 314 extend from the edge of the first busbar assembly 310. These solder joints are used to mount a pair of input terminals 315. Each input terminal 315 can be pre-fixed to the housing carrier 100 and then laser-welded to each solder joint 314. The pair of input terminals 315 are further connected to the second capacitors 220, which are symmetrically positioned on either side of the pair of input terminals 315. Specifically, as shown in FIG3B , after the first busbar assembly 310 is installed, its electrode solder joints ( 312a , 312b ), capacitor solder joints 313 , and terminal solder joints 314 are all exposed, facilitating simultaneous laser welding. As shown in FIG4B , the input terminal 315 is positioned between the two second capacitors 220.

[0071] 8 , the second longitudinal limiting protrusion 121 and the second transverse limiting protrusion 122 limit the horizontal position of the second capacitor 220 , and the second positive limiting protrusion 123 limits the vertical position of the second capacitor 220 , thereby limiting the position of the capacitor electrode 213 of the second capacitor 220 to form an electrical connection with the input terminal 315 .

[0072] Referring to Figures 4B and 4C , current flows from input terminal 315 through the second capacitor and the first capacitor, then into each power conversion module 230 before being output through each second electrode 322. The disclosed inverter utilizes a symmetrical parallel arrangement of electrical and thermal connections for identical components in the current transmission direction. This ensures uniform electrical and thermal performance for each circuit passing through the power conversion modules 230. This minimizes differences in characteristics between circuits, preventing mutual interference and maintaining optimized overall conversion efficiency.

[0073] Referring to FIG. 11 , during assembly of the inverter disclosed herein, the first and second recesses 110, 120 of the housing carrier 100 can be pre-filled with a predetermined amount of thermally conductive adhesive (114, 124). The first and second capacitors 210, 220 are then positioned within the first and second recesses 110, 110, respectively. The power conversion module 230 and the second bus assembly 320 are then secured to the housing carrier 100. This structure facilitates the positioning of discrete components. As shown in FIG. 3B , the first bus assembly 310 and the control circuit board 400 can be positioned by simply stacking them sequentially on the carrier surface 101 to facilitate further soldering. Finally, the cover 100a is placed over the carrier surface 101 to close the housing carrier 100, completing the inverter assembly.

[0074] Furthermore, the electronic components (capacitors) with higher heat generation are adhered to the housing carrier 100 by the thermal conductive adhesive (114, 124), which can reduce the thermal resistance between the electronic components and the housing carrier 100, thereby improving the heat dissipation efficiency of the inverter.

[0075] The above description is only a preferred embodiment of the present invention and is not intended to limit the scope of the claims of the present invention. Other equivalent variations that apply the patent spirit of the present invention should all fall within the patent scope of the present invention.

Claims

1. An inverter, comprising: The housing carrier has a carrying surface, and at least one first groove is provided on the carrying surface; A plurality of power conversion modules are attached to the carrying surface; A plurality of first capacitors are respectively disposed in the first grooves, and the first grooves are filled with thermally conductive adhesive to adhere the plurality of first capacitors, each of the first capacitors having a plurality of capacitor electrodes; and A first bus assembly is stacked on the carrying surface and electrically connected to the plurality of first capacitors respectively. The connection points between the plurality of capacitor electrodes of the plurality of first capacitors and the first bus component are arranged in one row, and the connection points between the plurality of power conversion modules and the first bus component are arranged in another parallel row. 2 . The inverter according to claim 1 , further comprising a second bus assembly, wherein the second bus assembly is stacked on the supporting surface and electrically connected to the plurality of power conversion modules respectively.

3. The inverter according to claim 2, wherein the second bus assembly comprises a bracket and a plurality of second electrodes attached to the bracket, the plurality of second electrodes are arranged coplanarly on the bracket, the bracket is locked to the supporting surface, and the plurality of second electrodes are respectively welded to the plurality of power conversion modules. 4 . The inverter according to claim 2 , wherein the connection points of the plurality of power conversion modules and the second bus assembly are arranged in one row, and the connection points of the plurality of power conversion modules and the first bus assembly are arranged in another parallel row.

5. The inverter according to claim 2 further comprises a control circuit board, wherein the first bus component is stacked on the plurality of first capacitors and the plurality of power conversion modules, and the control circuit board is stacked on the first bus component and the plurality of power conversion modules. 6 . The inverter according to claim 5 , wherein the first bus assembly has a plurality of voltage terminals, and the plurality of voltage terminals are respectively soldered to the control circuit board.

7. The inverter according to claim 6, wherein the first bus component has a plurality of through windows configured corresponding to the plurality of power conversion modules, each of the power conversion modules is connected to the control circuit board through the corresponding through windows, and each of the power conversion modules has a plurality of solder pins, and the plurality of solder pins of the power conversion modules respectively penetrate the first bus component and are soldered to the control circuit board.

8. The inverter according to claim 3, wherein each of the power conversion modules has at least one pair of output pins, the plurality of second electrodes are respectively connected to the corresponding output pins, and the connection points of the plurality of second electrodes and the corresponding plurality of output pins are arranged in a parallel row.

9. The inverter according to claim 8, wherein the plurality of first capacitors are arranged in one row, the plurality of power conversion modules are arranged in another parallel row, the plurality of second electrodes are arranged in yet another parallel row, and the plurality of second electrodes and the plurality of first capacitors are arranged on two sides of the plurality of power conversion modules opposite to each other. 10 . The inverter according to claim 9 , wherein each of the brackets is arranged in parallel with the plurality of power conversion modules.

11. The inverter according to claim 9, wherein the bracket is provided with a plurality of component grooves, the second bus component comprises a plurality of current sensors, the plurality of current sensors are respectively disposed in the plurality of component grooves, and each of the component grooves is filled with thermally conductive adhesive to adhere the plurality of current sensors respectively. 12 . The inverter according to claim 11 , wherein the plurality of second electrodes pass through corresponding current sensors, respectively. 13 . The inverter according to claim 11 , wherein each of the current sensors is a magnetically sensitive sensor, the magnetically sensitive sensor comprising a Hall element and a shield, the Hall element is disposed corresponding to the second electrode, and the shield surrounds the second electrode and the Hall element.

14. The inverter according to claim 1 further comprises two second capacitors, wherein two second grooves are provided on the supporting surface of the housing carrier, the plurality of second capacitors are respectively disposed in the plurality of second grooves, and each second groove is filled with thermally conductive adhesive to adhere the plurality of second capacitors respectively.

15. The inverter according to claim 14, wherein a pair of input terminals is provided between the two second grooves, and the pair of input terminals are respectively connected to each of the second capacitors and the first bus component; in, The plurality of second capacitors are symmetrically arranged on both sides of the pair of input terminals.

16. The inverter according to claim 15, wherein a second longitudinal limiting protrusion, a second transverse limiting protrusion, and a second positive limiting protrusion are provided in the second groove, the second longitudinal limiting protrusion, the second transverse limiting protrusion, and the second positive limiting protrusion respectively abut against the second capacitor to form a second gap between the second capacitor and an inner wall of the second groove, and the thermal conductive adhesive is filled in the second gap; The second longitudinal limiting protrusion and the second transverse limiting protrusion correspondingly limit the horizontal position of the second capacitor, and the second positive limiting protrusion correspondingly limits the vertical position of the second capacitor, thereby limiting the capacitor electrode position of the second capacitor to form an electrical connection with the input terminal.

17. The inverter according to claim 1, wherein a plurality of heat exchange chambers are provided on the carrying surface, and the plurality of power conversion modules are respectively arranged corresponding to the heat exchange chambers, the plurality of first grooves are close to the heat exchange chambers, and heat from the first grooves is conducted to the heat exchange chambers through the outer shell carrier. 18 . The inverter according to claim 17 , wherein the plurality of heat exchange chambers are arranged in one row, and the plurality of first grooves are arranged in another parallel row.

19. The inverter according to claim 1, further comprising a capacitor electrode bracket, wherein the capacitor electrode bracket is locked inside the housing carrier, and the capacitor electrodes of the first capacitors are respectively fixed to the capacitor electrode bracket.

20. The inverter according to claim 1, wherein in each of the first capacitors, the capacitor electrode is attached to a surface of the first capacitor.

21. The inverter according to claim 1, wherein the inner wall of the first groove is provided with a first longitudinal limiting protrusion, a first transverse limiting protrusion and a first positive limiting protrusion, the first longitudinal limiting protrusion, the first transverse limiting protrusion and the first positive limiting protrusion respectively abut against the first capacitor to form a first gap between the first capacitor and the inner wall of the first groove, and the thermal conductive adhesive is filled in the first gap; wherein the first longitudinal limiting protrusion and the first transverse limiting protrusion correspondingly limit the horizontal position of the first capacitor, and the first positive limiting protrusion correspondingly limits the vertical position of the first capacitor, thereby limiting the capacitor electrode position of the first capacitor and the connection point that forms an electrical connection with the first bus component.

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