Aligner device and method for controlling aligner device

Abstract

Provided are an aligner device for accurately aligning a conveyance object, and a method for controlling the aligner device.　An aligner device provided in a conveyance path for conveying a conveyance object from a first conveyance chamber including a first conveyance device to a second conveyance chamber including a second conveyance device comprises: a stage on which the conveyance object is placed; a position adjustment mechanism for aligning the rotation direction of the conveyance object placed on the stage and the position of the conveyance object; an optical detection unit for optically detecting the outer peripheral shape of the conveyance object placed on the stage; and a control unit for controlling the position adjustment mechanism on the basis of the outer peripheral shape of the conveyance object detected by the optical detection unit.

Description

Aligner device and control method for aligner device

[0001] The present disclosure relates to an aligner device and a method for controlling an aligner device.

[0002] Patent Document 1 discloses a substrate positioning device comprising: a substrate mounting table for mounting a substrate; a rotation drive mechanism for rotating the substrate together with the substrate mounting table; a detection mechanism for detecting the position of the peripheral edge of the substrate rotated by the rotation drive mechanism; and a positional deviation calculation means for rotating the substrate approximately one revolution and then further rotating it a predetermined angle, and comparing position detection data of the peripheral edge of the substrate when the substrate has been rotated approximately one revolution with position detection data of the peripheral edge of the substrate when the substrate has been rotated the predetermined angle to calculate the positional deviation of the substrate on the substrate mounting table.

[0003] Japanese Patent Application Laid-Open No. 2004-47654

[0004] In one aspect, the present disclosure provides an aligner apparatus and a control method for the aligner apparatus that accurately aligns an object to be conveyed.

[0005] In order to solve the above problem, according to one aspect, an aligner device can be provided that is installed on a transport path for transporting an object to be transported from a first transport chamber having a first transport device to a second transport chamber having a second transport device, the aligner device comprising: a stage for placing the object to be transported; a position adjustment mechanism for aligning the rotation direction and position of the object to be transported placed on the stage; an optical detection unit for optically detecting the outer peripheral shape of the object to be transported placed on the stage; and a control unit for controlling the position adjustment mechanism based on the outer peripheral shape of the object to be transported detected by the optical detection unit.

[0006] According to one aspect, it is possible to provide an aligner apparatus that accurately aligns an object to be conveyed and a method for controlling the aligner apparatus.

[0007] FIG. 1 is a diagram showing an example of a schematic configuration of a processing system according to an embodiment. FIG. 2 is a diagram showing an example of a hardware configuration of a control device. FIG. 3 is a flowchart showing an example of a substrate transport method when transporting a substrate. FIG. 4 is an example of a perspective view illustrating the configuration of a load lock module according to an embodiment. FIG. 5 is an example of a perspective view illustrating the configuration of a load lock module according to another embodiment. FIG. 6 is an example of a cross-sectional view illustrating the configuration of a load lock module according to yet another embodiment.

[0008] Various exemplary embodiments will be described in detail below with reference to the drawings, in which the same or equivalent parts are designated by the same reference numerals.

[0009] [Processing System] An example of a processing system 1 will be described with reference to Fig. 1 and Fig. 2. Fig. 1 is a diagram showing an example of a schematic configuration of the processing system 1 according to an embodiment. Fig. 2 is a diagram showing an example of a hardware configuration of a control device (control unit) 100.

[0010] The processing system 1 includes a transfer module 10, a process module 20, a loader module 30, a load lock module 40, and a control device 100. In this embodiment, four process modules 20 and two load lock modules 40 are provided, but the number of process modules 20 and load lock modules 40 is not limited to this. The transfer module 10, the process module 20, the loader module 30, and the load lock module 40 constitute a processing device.

[0011] The transfer module (second transfer chamber, vacuum transfer chamber) 10 is a vacuum transfer chamber that has a generally hexagonal shape in a plan view and is maintained in a vacuum atmosphere. The transfer module 10 has a transfer device (second transfer device) 11 disposed therein. The transfer device 11 is formed by an articulated arm that can bend, extend, lift, and rotate, and is positioned to allow access to the process module 20 and the load lock module 40. The transfer device 11 has two picks (also referred to as forks, end effectors, or substrate holders) 12 that can bend and extend independently in opposite directions, and is capable of transporting two substrates (transport objects) W at a time. Note that the transfer device 11 is not limited to the configuration shown in FIG. 1 as long as it is capable of transporting substrates W, such as wafers, between the process module 20 and the load lock module 40.

[0012] The process modules 20 are arranged radially around the transfer module 10 and are connected to the transfer module 10. The process module 20 comprises a processing chamber and has a cylindrical mounting table 21 therein on which a substrate W is placed. In the process module 20, various semiconductor manufacturing processes are performed on the substrate W placed on the mounting table 21. The semiconductor manufacturing processes include various processes for manufacturing semiconductors, such as film formation, etching, and heat treatment. The transfer module 10 and the process module 20 are separated by an openable and closable gate valve 22.

[0013] The loader module (first transfer chamber, atmospheric transfer chamber) 30 is disposed opposite the transfer module 10. The loader module 30 is a rectangular parallelepiped atmospheric transfer chamber maintained at atmospheric pressure. The loader module 30 has a transfer device (first transfer device) 31 disposed therein. The transfer device 31 is slidably supported on a guide rail 32 provided to extend along the long side of the center of the loader module 30. A linear motor (not shown) having an encoder, for example, is built into the guide rail 32, and the transfer device 31 moves along the guide rail 32 by driving the linear motor.

[0014] The transport device 31 has two articulated arms 33 arranged in two tiers, one above the other. A bifurcated pick (also referred to as a fork, end effector, or substrate holder) 34 is attached to the tip of each articulated arm 33. A substrate W is held (placed) on each pick 34. Each articulated arm 33 is bendable and movable in a radial direction from the center, and can be raised and lowered. The bending and extension movements of each articulated arm 33 can be individually controlled. Each rotation shaft of the articulated arm 33 is rotatably connected coaxially to a base 35, and rotates integrally in, for example, a rotation direction relative to the base 35. The guide rail 32 and the articulated arm 33 function as a drive mechanism for moving the pick 34. The transport device 31 transports substrates W between a load lock module 40 and a transport container 51, which will be described later. The transport device 31 is not limited to the configuration shown in FIG. 1 as long as it is capable of transporting substrates W between the load lock module 40 and the transport container 51.

[0015] That is, the transport device 31 has an arm drive mechanism (not shown) that drives each joint of the articulated arm 33 to move the pick 34 in the horizontal direction, and an arm lifting mechanism (not shown) that moves the articulated arm 33 and the pick 34 in the vertical direction. The arm drive mechanism has a drive motor (not shown) and an encoder (not shown) that drive the articulated arm 33. The control device 100 receives a detection signal from the encoder of the arm drive mechanism and controls the drive motor of the arm drive mechanism. The arm lifting mechanism also has a drive motor (not shown) and an encoder (not shown) that move the articulated arm 33 and the pick 34 in the vertical direction. The control device 100 receives a detection signal from the encoder of the arm lifting mechanism and controls the drive motor of the arm lifting mechanism.

[0016] Two load lock modules 40 are connected to one side surface along the long side of the loader module 30. Meanwhile, one or more loading ports 36 for introducing substrates W are provided on the other side surface along the long side of the loader module 30. In the illustrated example, three loading ports 36 are provided. Each loading port 36 is provided with an openable / closable door 37. A load port 50 is provided corresponding to each loading port 36. A transport container 51 for accommodating and transporting substrates W is placed on the load port 50. The transport container 51 may be a front-opening unified pod (FOUP) that accommodates multiple substrates W (e.g., 25 substrates W) in multiple stages spaced apart at a predetermined interval. The transport container 51 has a container body with an opening for accommodating substrates W, and an openable / closeable lid that closes the opening. Each load port 50 is provided with a drive mechanism (not shown) for the openable / closeable door 37 that can be raised and lowered and moved forward and backward to open and close the openable / closeable lid of the transport container 51.

[0017] The load lock module (aligner device, load lock chamber) 40 is disposed between the transfer module 10 and the loader module 30. In other words, the load lock module 40 is provided on a transfer path for transferring a substrate W from the loader module 30 to the transfer module 10. The load lock module 40 comprises an internal pressure variable chamber whose interior can be switched between a vacuum atmosphere and atmospheric pressure, and has a cylindrical stage 41 therein on which the substrate W is placed. The stage 41 has a diameter smaller than that of the substrate W. When transferring a substrate W from the loader module 30 to the transfer module 10, the load lock module 40 maintains its interior at atmospheric pressure while receiving the substrate W from the loader module 30, and then reduces the pressure inside the load lock module 40 before transferring the substrate W into the transfer module 10. Furthermore, when the substrate W is transferred from the transfer module 10 to the loader module 30, the interior is maintained at a vacuum and the substrate W is received from the transfer module 10, and then the interior is pressurized to atmospheric pressure before the substrate W is transferred into the loader module 30. The load lock module 40 and the transfer module 10 are separated by an openable and closable gate valve 42. The load lock module 40 and the loader module 30 are also separated by an openable and closable gate valve 43.

[0018] The load lock module 40 according to this embodiment also aligns the substrate W. Here, the substrate W has a feature (not shown) formed on its peripheral edge. The feature is, for example, a cutout such as an orientation flat or a notch. The load lock module 40 has a position adjustment mechanism 44 (see FIG. 4 , etc., described later) that adjusts the center position of the substrate W placed on the stage 41 and the orientation of the feature relative to the center of the substrate W. The position adjustment mechanism 44 has a stage rotation mechanism that rotates the stage 41. The stage rotation mechanism rotates the substrate W placed on the stage 41 by rotating the stage 41. The stage rotation mechanism also adjusts the orientation of the substrate W placed on the stage 41 (the orientation of the feature relative to the center of the substrate W) by adjusting the rotation of the stage 41. The position adjustment mechanism 44 also has a stage movement mechanism that moves the stage 41 horizontally. The stage movement mechanism moves the stage 41 horizontally to move the substrate W placed on the stage 41 horizontally. The stage moving mechanism adjusts the horizontal position of the stage 41 to adjust the center position of the substrate W placed on the stage 41. The position adjustment mechanism 44 also has a stage lifting mechanism that vertically raises and lowers the stage 41. The stage lifting mechanism raises and lowers the stage 41 to move the substrate W placed on the stage 41 in the vertical direction.

[0019] The control device 100 controls the position adjustment mechanism 44 (stage rotation mechanism, stage movement mechanism, and stage lifting mechanism). In other words, the control device 100 controls the stage rotation mechanism, stage movement mechanism, and stage lifting mechanism to control the rotation, horizontal position, and height of the stage 41. In yet other words, the control device 100 controls the stage rotation mechanism, stage movement mechanism, and stage lifting mechanism to control the rotation, horizontal position, and height of the substrate W placed on the stage 41. Details of the stage rotation mechanism, stage movement mechanism, and stage lifting mechanism will be described later using FIGS. 4 to 7 .

[0020] The load lock module 40 also has an optical detector 45 (see FIG. 4 and the like, which will be described later) that optically detects the outer peripheral shape of the substrate W.

[0021] The optical detection unit 45 may be a line sensor that detects the position of the edge of the substrate W at the peripheral portion of the substrate W placed on the stage 41. The line sensor has a plurality of light sources arranged radially on one side of the substrate W (e.g., above the substrate W) and a plurality of light receiving sensors arranged radially on the other side of the substrate W (e.g., below the substrate W), and detects the position of the edge of the substrate W based on the positions of the light receiving sensors that detect light from the light sources and the positions of the light receiving sensors where the light from the light sources is blocked by the substrate W. Then, by rotating the substrate W using a stage rotation mechanism, the line sensor detects the position of the edge of the substrate W over the entire circumference. This detects the outer peripheral shape of the substrate W.

[0022] Alternatively, the optical detection unit 45 may be a camera capable of capturing an image of at least a portion of the peripheral edge of the substrate W placed on the stage 41. Based on the image captured by the camera, the position of the edge of the substrate W is detected by image processing. Then, by rotating the substrate W using a stage rotation mechanism, the camera captures an image of the entire peripheral edge of the substrate W. In this way, the outer peripheral shape of the substrate W is detected.

[0023] The optical detection unit 45 may also be a camera that can simultaneously capture an image of the entire periphery of the substrate W placed on the stage 41. This allows the outer peripheral shape of the substrate W to be detected by image processing based on the image captured by the camera.

[0024] The control device 100 controls the operation of each component of the processing system 1. As shown in FIG. 2, the control device 100 is a computer including a drive device 101, an auxiliary storage device 102, a memory device 103, a CPU 104, an interface device 105, and the like, all of which are interconnected via a bus B. A program that realizes processing in the control device 100 is provided by a recording medium 106 such as a CD-ROM. When the recording medium 106 storing the program is inserted into the drive device 101, the program is installed from the recording medium 106 to the auxiliary storage device 102 via the drive device 101. However, the program does not necessarily have to be installed from the recording medium 106; it may be downloaded from another computer via a network. The auxiliary storage device 102 stores necessary data such as installed programs and recipes. The memory device 103 reads and stores the program from the auxiliary storage device 102 when a program startup instruction is received. The CPU 104 executes functions related to the processing system 1 in accordance with the program stored in the memory device 103. The interface device 105 is used as an interface for connecting to a network.

[0025] [Substrate Transfer Method] Next, an example of a substrate transfer method will be described with reference to Fig. 3. Fig. 3 is a flowchart showing an example of a substrate transfer method when transferring a substrate W.

[0026] In step S101, the substrate W is transported to the load lock module 40.

[0027] Here, the control device 100 controls the transport device 31 to insert the pick 34 into the transport container 51, receive the substrate W with the pick 34, and transport the substrate W from the transport container 51 to the loader module 30. Next, the control device 100 opens the gate valve 43. The control device 100 controls the transport device 31 to insert the pick 34 holding the substrate W into the load lock module 40 and move the pick 34 to a predetermined transfer position (first position). Next, the control device 100 controls the arm lifting mechanism of the transport device 31 to lower the pick 34 and place the substrate W held by the pick 34 on the stage 41. Note that the stage lifting mechanism may be configured to lift the stage 41 to place the substrate W held by the pick 34 on the stage 41. Thereafter, the control device 100 controls the transport device 31 to retract the pick 34 from within the load lock module 40 and close the gate valve 43.

[0028] After closing the gate valve 43, the control device 100 controls the load lock module 40 to reduce the pressure inside the load lock module 40 from atmospheric pressure to a vacuum atmosphere.

[0029] In step S102, the substrate W is aligned in the load lock module 40. Here, the position of the substrate W placed on the stage 41 is corrected to align the substrate W.

[0030] First, the control device 100 detects the position of the edge of the substrate W (the outer peripheral shape of the substrate W) using the optical detection unit 45. Here, the control device 100 detects the position of the edge of the substrate W using the optical detection unit 45 while controlling the stage rotation mechanism to rotate the stage 41 and the substrate W. In this way, the optical detection unit 45 detects the position of the edge of the substrate W (the outer peripheral shape of the substrate W) over the entire circumference of the substrate W. Note that if the optical detection unit 45 is a camera that can capture an image of the entire peripheral edge of the substrate W placed on the stage 41 at once, the stage 41 and the substrate W do not need to be rotated.

[0031] Next, based on the edge position of the substrate W (the outer peripheral shape of the substrate W) detected by the optical detection unit 45, the control device 100 detects the center position of the substrate W, the position of the characteristic shape portion provided on the substrate W, and the direction of the characteristic shape portion relative to the center of the substrate W. In this way, the control device 100 detects the center position of the substrate W and the direction of the characteristic shape portion relative to the center of the substrate W using the optical detection unit 45.

[0032] Next, the control device 100 controls the stage rotation mechanism to rotate the stage 41 based on the direction of the characteristic shape portion relative to the center of the substrate W detected by the optical detection unit 45. The control device 100 controls the stage movement mechanism to move the stage 41 based on the center position of the substrate W detected by the optical detection unit 45. In this way, the substrate W is aligned within the load lock module 40 so that the center position of the substrate W is at a predetermined position and the direction of the characteristic shape portion is in a predetermined direction.

[0033] In step S103 , the substrate W is transported to the process module 20 .

[0034] Here, the control device 100 opens the gate valve 42. The control device 100 controls the transport device 11 to insert the pick 12 not holding a substrate W into the load lock module 40 and move the pick 12 to a predetermined receiving position (second position). Next, the control device 100 controls the arm lifting mechanism of the transport device 11 to raise the pick 12 and receive the substrate W placed on the stage 41 with the pick 12. Note that the stage 41 may be lowered by the stage lifting mechanism, so that the substrate W placed on the stage 41 is received by the pick 12.

[0035] Next, the control device 100 opens the gate valve 22. The control device 100 controls the transport device 11 to insert the pick 12 holding the substrate W into the process module 20 and move the pick 12 to a predetermined transfer position (third position). Next, the control device 100 raises lift pins (not shown) provided on the mounting table 21 of the process module 20, and receives the substrate W on the lift pins. Thereafter, the control device 100 controls the transport device 11 to retract the pick 12 from the process module 20 and close the gate valve 22. The control device 100 also lowers the lift pins and places the substrate W on the mounting table 21.

[0036] In this manner, the transport device 31 moves the pick 34 holding the substrate W to a predetermined transfer position (first position) and places the substrate W on the stage 41. The transport device 11 also moves the pick 12 to a predetermined receiving position (second position) and receives the aligned substrate W with the pick 12. The transport device 11 then moves the pick 12 holding the substrate W to a predetermined transfer position (third position) and transfers the substrate W to the lift pins of the mounting table 21, and then places the substrate W on the mounting table 21. As a result, compared to the case where the substrate W aligned by an aligner device provided in the load port 50 is transported to the process module 20, in the processing system 1 of this embodiment, the substrate W is aligned in the load lock module 40, thereby reducing accumulation of errors and improving the positional accuracy of the substrate W placed on the mounting table 21.

[0037] Furthermore, compared to the case where a substrate W aligned by an aligner device provided in the load port 50 is transported to the process module 20, in this embodiment, the distance of the transport path of the substrate W from the transport container 51 to the process module 20 can be shortened, thereby improving throughput.

[0038] Furthermore, in this embodiment, the position of the substrate W relative to the picks 34 and 12 is detected during transport of the substrate W, and compared to control that corrects the positions of the pick 34 transfer position (first position), the pick 12 receiving position (second position), and the pick 12 transfer position (third position) based on the difference between the reference position of the picks 34 and 12 and the center position of the substrate W, transport accuracy can be improved by transporting at a predetermined position.

[0039] As described above, the load lock module 40 has the stage 41, the position adjustment mechanism 44, and the optical detection unit 45, and functions as an aligner device that aligns the substrate W. Each embodiment of the load lock module 40 (aligner device) will be described below.

[0040] [Load Lock Module (Aligner Apparatus)] Next, a load lock module 40A (aligner apparatus) which is one embodiment of the load lock module 40 shown in Fig. 1 will be described with reference to Fig. 4. Fig. 4 is an example of a perspective view illustrating the configuration of the load lock module 40A according to one embodiment.

[0041] The load lock module 40 has a side wall 210 and a ceiling wall 220. Note that in FIG. 4 (and FIGS. 5 and 7 described below), the gate valves 42 and 43, and the front side wall are omitted so that the interior of the load lock module 40 can be seen. In the following descriptions of FIGS. 4 to 7, the X direction will be defined as one horizontal direction, which is the width direction of the opening of the gate valve 43 (see FIG. 1), the Y direction will be defined as another horizontal direction perpendicular to the horizontal direction, which is the direction in which the pick 34 is inserted and removed from the opening of the gate valve 43 (see FIG. 1), and the Z direction will be defined as the vertical direction.

[0042] The ceiling wall 220 is formed of, for example, a light-transmitting member. An opening may be formed in a portion of the ceiling wall 220, and a light-transmitting member may be disposed in the opening to form a window through which the interior of the load lock module 40 can be viewed from outside the load lock module 40. The optical detection unit 45 (camera) is disposed outside the load lock module 40, and optically detects the outer circumferential shape of the substrate W in the interior of the load lock module 40 via the light-transmitting member. The optical detection unit 45 may be a line sensor or the like. The line sensor may be disposed outside the load lock module 40 or inside the interior of the load lock module 40.

[0043] 4 includes a position adjustment mechanism 44A. The position adjustment mechanism 44A includes a planar motor 310 and a moving body 320. The planar motor 310 is disposed on the floor of the room of the load lock module 40A. The moving body 320 includes a stage 41 and a base 321 that supports the stage 41.

[0044] Planar motor 310 has multiple coils (not shown) arranged inside it. When current is supplied to the coils, they generate a magnetic field that magnetically levitates base 321. Control device 100 (see FIG. 1) is configured to be able to individually control the value of the current passed through each coil.

[0045] A plurality of permanent magnets are arranged inside base 321. The magnetic field generated by the coils causes base 321 to magnetically levitate above planar motor 310. The magnetic field generated by the coils also causes base 321 to move and rotate above planar motor 310.

[0046] With this configuration, control device 100 is configured to be able to control the position, orientation, and levitation amount of base 321 by controlling the current value of each coil of planar motor 310. That is, position adjustment mechanism 44A functions as a stage rotation mechanism that rotates stage 41 by controlling the rotation of magnetically levitated base 321. Position adjustment mechanism 44A also functions as a stage movement mechanism that moves stage 41 in the horizontal direction by controlling the horizontal position of magnetically levitated base 321. Position adjustment mechanism 44A also functions as a stage elevation mechanism that raises and lowers stage 41 in the vertical direction by controlling the magnetic levitation amount of base 321.

[0047] Next, a load lock module 40B (aligner device), which is another embodiment of the load lock module 40 shown in Fig. 1, will be described with reference to Fig. 5 and Fig. 6. Fig. 5 is an example of a perspective view illustrating the configuration of the load lock module 40B according to this embodiment. Fig. 6 is an example of a cross-sectional view illustrating the configuration of the load lock module 40B according to this embodiment.

[0048] The stage 41 of the load lock module 40B has a first stage 41A and a second stage 41B. The first stage 41A is disposed in the center in a plan view. The second stage 41B is formed in an annular shape surrounding the first stage 41A in a plan view.

[0049] The first stage 41A is supported by a support shaft 411. The lower part of the support shaft 411 penetrates the bottom wall and is connected to a stage rotation mechanism 412. The second stage 41B is supported by a plurality of support shafts 421. The lower part of the support shaft 421 penetrates the bottom wall and is connected to a stage movement mechanism 422.

[0050] 5 and 6 includes a position adjustment mechanism 44B. The position adjustment mechanism 44B includes a stage rotation mechanism 412 that rotates the first stage 41A, stage movement mechanisms 422 and 423 that move the second stage 41B in the horizontal direction, and a stage lifting mechanism 413 that raises and lowers the first stage 41A in the vertical direction to change the relative heights of the first stage 41A and the second stage 41B.

[0051] The stage rotation mechanism 412 is disposed outside the chamber that switches between the vacuum atmosphere and the air atmosphere of the load lock module 40B. The stage rotation mechanism 412 has, for example, a motor (not shown) and rotates the support shaft 411 around the axis of the support shaft 411 as a rotation axis.

[0052] The stage lifting mechanism 413 is disposed outside the chamber that switches between the vacuum atmosphere and the air atmosphere of the load lock module 40B. The stage lifting mechanism 413 has, for example, a motor, a rotary-linear mechanism that converts rotational motion such as a ball screw into linear motion, a linear guide, etc., and moves the support shaft 411 up and down in the axial direction (Z direction) of the support shaft 411.

[0053] A vacuum seal (not shown) is provided between the support shaft 411 and the opening in the bottom wall through which the support shaft 411 passes.

[0054] The stage movement mechanism 422 is disposed outside the chamber that switches between the vacuum atmosphere and the air atmosphere of the load lock module 40B. The stage movement mechanism 422 has, for example, a motor, a rotary-linear mechanism that converts the rotational motion of a ball screw or the like into linear motion, a linear guide, or the like, and moves the support shaft 421 in one horizontal direction (X direction).

[0055] The stage moving mechanism 423 is disposed outside the chamber that switches between the vacuum atmosphere and the air atmosphere of the load lock module 40B. The stage moving mechanism 423 has, for example, a motor, a rotary-linear mechanism that converts rotational motion of a ball screw or the like into linear motion, a linear guide, etc., and moves the support shaft 421 and the stage moving mechanism 422 in the horizontal direction (Y direction).

[0056] A bellows 424 is provided between the second stage 41B and the opening in the bottom wall through which the support shaft 421 passes.

[0057] With this configuration, the control device 100 controls the stage lifting mechanism 413 to position the upper surface of the first stage 41A higher than the upper surface of the second stage 41B, thereby supporting the substrate W on the first stage 41A. The control device 100 also controls the stage lifting mechanism 413 to position the lower surface of the first stage 41A higher than the upper surface of the second stage 41B, and controls the stage rotation mechanism 412 to rotate the first stage 41A, thereby rotating the substrate W supported on the first stage 41A.

[0058] That is, the substrate W supported by the first stage 41A can be rotated when the optical detection unit 45 detects the edge position of the substrate W (the outer peripheral shape of the substrate W). Furthermore, by rotating the substrate W supported by the first stage 41A, the orientation of the substrate W supported by the first stage 41A (the direction of the feature shape portion relative to the center of the substrate W) can be aligned in a predetermined direction.

[0059] The control device 100 also controls the stage lifting mechanism 413 to position the top surface of the first stage 41A lower than the top surface of the second stage 41B, thereby supporting the substrate W on the second stage 41B. The control device 100 also controls the stage moving mechanisms 422, 423 to move the second stage 41B in the horizontal direction, thereby moving the substrate W supported on the second stage 41B in the horizontal direction. In this way, by moving the substrate W supported on the second stage 41B in the horizontal direction, the center position of the substrate W supported on the second stage 41B can be aligned to a predetermined position.

[0060] Then, after the center position of the substrate W supported by the second stage 41B is aligned to a predetermined position, the control device 100 controls the stage lifting mechanism 413 to position the upper surface of the first stage 41A higher than the upper surface of the second stage 41B, thereby supporting the substrate W on the first stage 41A. This allows the center position of the substrate W supported by the first stage 41A to be aligned to a predetermined position.

[0061] An example of control when the optical detection unit 45 is a camera that detects the position of the edge of the substrate W (the outer peripheral shape of the substrate W) over the entire periphery of the substrate W will be described.

[0062] First, the control device 100 controls the stage lifting mechanism 413 to lift the first stage 41A, and the first stage 41A receives the substrate W held by the pick 34. After the pick 34 retracts from the load lock module 40B, the control device 100 controls the stage lifting mechanism 413 to lower the first stage 41A, and the substrate W is supported by the second stage 41B. Next, the control device 100 detects the center position of the substrate W and the direction of the feature shape portion relative to the center of the substrate W using the optical detection unit 45. Next, the control device 100 controls the stage moving mechanisms 422 and 423 to align the center position of the substrate W supported by the second stage 41B to a predetermined position. Next, the control device 100 controls the stage lifting mechanism 413 to lift the first stage 41A, and the substrate W is supported by the first stage 41A. Next, the control device 100 controls the stage rotation mechanism 412 to align the direction of the substrate W supported by the first stage 41A (the direction of the feature shape portion relative to the center of the substrate W) to a predetermined direction.

[0063] By the above processing, the substrate W supported by the first stage 41A is aligned so that the center position of the substrate W is at a predetermined position and the direction of the feature shape portion is in a predetermined direction.

[0064] Next, an example of control in which the optical detector 45 detects the edge position of the substrate W while rotating the substrate W will be described.

[0065] First, the control device 100 controls the stage lifting mechanism 413 to lift the first stage 41A and receive the substrate W held by the pick 34 onto the first stage 41A. After the pick 34 retracts from the load lock module 40B, the control device 100 controls the stage lifting mechanism 413 to rotate the substrate W while detecting the edge position of the substrate W using the optical detection unit 45, and detecting the center position of the substrate W and the direction of the feature shape portion relative to the center of the substrate W. Next, the control device 100 controls the stage rotation mechanism 412 to align the direction of the substrate W supported by the first stage 41A (the direction of the feature shape portion relative to the center of the substrate W) to a predetermined orientation. Next, the control device 100 controls the stage lifting mechanism 413 to lower the first stage 41A and support the substrate W on the second stage 41B. Next, the control device 100 controls the stage moving mechanisms 422 and 423 to align the center position of the substrate W supported by the second stage 41B to a predetermined position. Next, the controller 100 controls the stage lifting mechanism 413 to lift the first stage 41A and support the substrate W on the first stage 41A.

[0066] By the above processing, the substrate W supported by the first stage 41A is aligned so that the center position of the substrate W is at a predetermined position and the direction of the feature shape portion is in a predetermined direction.

[0067] Note that the position adjustment mechanism 44B has been described using an example configuration in which the stage rotation mechanism 412 rotates the support shaft 411, causing the first stage 41A to rotate; the stage movement mechanisms 422, 423 move the support shaft 421 horizontally, causing the second stage 41B to move horizontally; and the stage lifting mechanism 413 raises and lowers the support shaft 411 vertically (in the axial direction of the support shaft 411), causing the first stage 41A to rise and lower; however, the present invention is not limited to this.

[0068] The stage lifting mechanism may be configured to lift and lower the second stage 41B by raising and lowering the support shaft 421 in the vertical direction (axial direction of the support shaft 421) and change the relative heights of the first stage 41A and the second stage 41B. That is, the position adjustment mechanism 44B may be configured such that the stage rotation mechanism 412 rotates the support shaft 411 to rotate the first stage 41A, the stage movement mechanisms 422 and 423 move the support shaft 421 in the horizontal direction to move the second stage 41B horizontally, and the stage lifting mechanism 413 lifts and lowers the support shaft 421 in the vertical direction (axial direction of the support shaft 421) to lift and lower the second stage 41B.

[0069] Next, a load lock module 40C (aligner device), which is yet another embodiment of the load lock module 40 shown in Fig. 1, will be described with reference to Fig. 7. Fig. 7 is an example of a perspective view illustrating the configuration of the load lock module 40C according to yet another embodiment.

[0070] The load lock module 40C shown in Figure 7 has a position adjustment mechanism 44C. The position adjustment mechanism 44C has a horizontal articulated robot having links 521 and 522, and an elevator shaft 523. One longitudinal side of the link 521 supports the stage 41 rotatably about a rotation axis C1. One longitudinal side of the link 522 supports the other longitudinal side of the link 521 rotatably about a rotation axis C2. The elevator shaft 523 supports the other longitudinal side of the link 522 rotatably about a rotation axis C3.

[0071] The horizontal articulated robot of the position adjustment mechanism 44C controls the position of the rotation axis C1 in the horizontal direction by controlling the rotation angle of the rotation axis C3 and the rotation angle of the rotation axis C2. In other words, the horizontal articulated robot of the position adjustment mechanism 44C functions as a stage moving mechanism that moves the stage 41 in the horizontal direction.

[0072] Furthermore, the horizontal articulated robot of the position adjustment mechanism 44C controls the rotation angle of the rotation axis C1, thereby controlling the rotation of the stage 41. In other words, the horizontal articulated robot of the position adjustment mechanism 44C functions as a stage rotation mechanism that rotates the stage 41.

[0073] The horizontal articulated robot of the position adjustment mechanism 44C is supported by an elevator shaft 523 so as to be movable up and down in the vertical direction. That is, the drive mechanism that raises and lowers the elevator shaft 523 functions as a stage elevator mechanism that raises and lowers the stage 41 in the vertical direction.

[0074] Although the description has been given assuming that the object to be transferred, which is aligned in the load lock module 40 and transferred to the process module 20, is a substrate W, the present invention is not limited to this. The mounting table 21 of the process module 20 has an edge ring (annular member) that is arranged to surround the substrate W. The object to be transferred may also be an edge ring.

[0075] 4 to 7 has been described as being the load lock module 40, but is not limited to this. Any of the aligner devices shown in FIGS. 4 to 7 may be applied to a path module disposed between the first vacuum transfer chamber and the second vacuum transfer chamber.

[0076] The embodiments disclosed above include, for example, the following aspects. (Supplementary Note 1) An aligner apparatus provided on a transfer path for transferring an object to be transferred from a first transfer chamber having a first transfer device to a second transfer chamber having a second transfer device, the aligner apparatus comprising: a stage on which the object to be transferred is placed; a position adjustment mechanism for aligning a rotational direction and a position of the object to be transferred placed on the stage; an optical detection unit for optically detecting a peripheral shape of the object to be transferred placed on the stage; and a control unit for controlling the position adjustment mechanism based on the peripheral shape of the object to be transferred detected by the optical detection unit. (Supplementary Note 2) The aligner apparatus according to Supplementary Note 1, wherein the position adjustment mechanism includes a stage rotation mechanism for rotating the stage, and a stage movement mechanism for moving the stage in a horizontal direction. (Supplementary Note 3) The aligner apparatus according to Supplementary Note 2, wherein the position adjustment mechanism further includes a stage elevation mechanism for vertically elevating the stage. (Supplementary Note 4) The aligner device according to any one of Supplementary Notes 1 to 3, wherein the position adjustment mechanism comprises: a base supporting the stage and having a permanent magnet; and a planar motor arranged on a floor surface inside the aligner device and having a plurality of coils that generate a magnetic field for magnetically levitating the base. (Supplementary Note 5) The aligner device according to any one of Supplementary Notes 1 to 3, wherein the stage comprises a first stage and a second stage, and the position adjustment mechanism comprises: a stage rotation mechanism that rotates the first stage, a stage movement mechanism that moves the second stage in a horizontal direction, and a stage elevating mechanism that raises and lowers the first stage or the second stage in a vertical direction to change the relative heights of the first stage and the second stage. (Supplementary Note 6) The aligner device according to Supplementary Note 5, wherein the second stage is arranged to surround the first stage in a plan view. (Supplementary Note 7) The aligner apparatus according to any one of Supplementary Notes 1 to 3, wherein the position adjustment mechanism has a multi-joint arm that rotates the stage and moves the stage in a horizontal direction. (Supplementary Note 8) The aligner apparatus according to Supplementary Note 7, wherein the position adjustment mechanism further has an elevator shaft that raises and lowers the multi-joint arm in a vertical direction.(Supplementary Note 9) The aligner apparatus according to any one of Supplementary Notes 1 to 8, wherein the first transfer chamber is an atmospheric transfer chamber with an atmospheric pressure atmosphere inside, the second transfer chamber is a vacuum transfer chamber with a vacuum atmosphere inside, and the aligner apparatus is a load lock chamber the interior of which can be switched between a vacuum atmosphere and an atmospheric pressure atmosphere. (Supplementary Note 10) The aligner apparatus according to any one of Supplementary Notes 1 to 9, wherein the transfer object is a substrate or an annular member. (Supplementary Note 11) A control method for an aligner device, the control method being provided on a transfer path for transferring an object to be transferred from a first transfer chamber having a first transfer device to a second transfer chamber having a second transfer device, the control method comprising: a stage for placing the object to be transferred; a position adjustment mechanism for aligning the rotation direction of the object to be transferred placed on the stage and the position of the object to be transferred; and an optical detection unit for optically detecting the outer circumferential shape of the object to be transferred placed on the stage, the control method comprising: a step of placing the object to be transferred, which has a characteristic shape portion on a peripheral edge portion, on the stage; a step of detecting the outer circumferential shape of the object to be transferred placed on the stage; a step of detecting a center position of the object to be transferred and a direction of the characteristic shape portion relative to the center of the object to be transferred based on the detected center position of the object to be transferred and the detected direction of the characteristic shape portion relative to the center of the object to be transferred, so that the center position of the object to be transferred is at a predetermined position and the direction of the characteristic shape portion relative to the center of the object to be transferred is a predetermined direction. A method for controlling an aligner device.

[0077] The present invention is not limited to the configurations described in the above embodiments, but may be combined with other elements, etc. These aspects can be changed without departing from the spirit of the present invention, and can be appropriately determined depending on the application form.

[0078] This application claims priority based on Japanese Patent Application No. 2024-014419, filed on February 1, 2024, the entire contents of which are incorporated herein by reference.

[0079] REFERENCE SIGNS LIST 1 Processing system 10 Transfer module (second transfer chamber, vacuum transfer chamber) 11 Transfer device (second transfer device) 12 Pick 20 Process module 21 Placement table 30 Loader module (first transfer chamber, atmospheric transfer chamber) 31 Transfer device (first transfer device) 34 Pick 40 Load lock module (aligner device, load lock chamber) 41 Stage 41A First stage 41B Second stage 44 Position adjustment mechanism 45 Optical detection unit 50 Load port 51 Transfer container 100 Control device (control unit) 310 Planar motor 320 Moving body 321 Base 411 Support shaft 412 Stage rotation mechanism 421 Support shaft 422 Stage movement mechanism 423 Stage movement mechanism W Substrate

Claims

1. An aligner device provided on a transfer path for transferring an object to be transferred from a first transfer chamber having a first transfer device to a second transfer chamber having a second transfer device, comprising: a stage for placing the object to be transferred; a position adjustment mechanism for aligning the rotation direction and position of the object to be transferred placed on the stage; an optical detection unit for optically detecting the outer peripheral shape of the object to be transferred placed on the stage; and a control unit for controlling the position adjustment mechanism based on the outer peripheral shape of the object to be transferred detected by the optical detection unit.

2. The aligner device according to claim 1, wherein the position adjustment mechanism comprises a stage rotation mechanism that rotates the stage, and a stage movement mechanism that moves the stage in a horizontal direction.

3. The aligner device according to claim 2, wherein the position adjustment mechanism further comprises a stage lifting mechanism that raises and lowers the stage in the vertical direction.

4. The aligner device according to claim 1, wherein the position adjustment mechanism comprises: a base that supports the stage and has a permanent magnet; and a planar motor that is placed on the floor of a room of the aligner device and has a plurality of coils that generate a magnetic field that magnetically levitates the base.

5. The aligner device according to claim 1, wherein the stage has a first stage and a second stage, and the position adjustment mechanism has a stage rotation mechanism that rotates the first stage, a stage movement mechanism that moves the second stage horizontally, and a stage lifting mechanism that raises and lowers the first stage or the second stage vertically to change the relative heights of the first stage and the second stage.

6. The aligner apparatus according to claim 5, wherein the second stage is provided so as to surround the first stage in a plan view.

7. The aligner device according to claim 1, wherein the position adjustment mechanism has a multi-joint arm that rotates the stage and moves the stage in a horizontal direction.

8. The aligner device according to claim 7, wherein the position adjustment mechanism further has an elevator shaft that raises and lowers the articulated arm in the vertical direction.

9. An aligner device according to any one of claims 1 to 8, wherein the first transfer chamber is an atmospheric transfer chamber with an atmospheric pressure atmosphere inside, the second transfer chamber is a vacuum transfer chamber with a vacuum atmosphere inside, and the aligner device is a load lock chamber whose interior can be switched between a vacuum atmosphere and an atmospheric pressure atmosphere.

10. The aligner apparatus according to any one of claims 1 to 8, wherein the object to be transferred is a substrate or an annular member.

11. A control method for an aligner device provided on a transfer path for transferring an object to be transferred from a first transfer chamber having a first transfer device to a second transfer chamber having a second transfer device, the control method comprising: a stage on which the object to be transferred is placed; a position adjustment mechanism for aligning the rotation direction and position of the object to be transferred placed on the stage; and an optical detection unit for optically detecting the outer peripheral shape of the object to be transferred placed on the stage, the control method comprising the steps of: placing the object to be transferred, which has a characteristic shape portion on its peripheral edge, on the stage; detecting the outer peripheral shape of the object to be transferred placed on the stage; detecting the center position of the object to be transferred and the direction of the characteristic shape portion relative to the center of the object to be transferred based on the detected center position of the object to be transferred and the detected direction of the characteristic shape portion relative to the center of the object to be transferred, so that the center position of the object to be transferred is at a predetermined position and the direction of the characteristic shape portion relative to the center of the object to be transferred is a predetermined direction.

Images