Board manufacturing jig and board manufacturing method

Abstract

[Problem] To provide a board manufacturing jig and a board manufacturing method capable of suppressing one-side warpage of a plurality of boards when integrating the boards by heating an adhesive member such as solder. [Solution] The present invention is a board manufacturing jig used in a board manufacturing process in which an adhesive member is attached to an adhesive surface between a first board and a second board, and heat is applied to bond the boards together. The board manufacturing jig is provided with: a jig body part of an annular member; a plurality of protrusions on a first surface side of the jig body part, on which a heavy stone is placed; and a plurality of board support parts which are provided on a second surface side of the jig body part so as to match the outer shape of the second board, and which support the second board. The second surface of the jig body part is attached to the first surface of the second board, and the weight of the heavy stone placed on the first surface side of the jig body part is dispersed and applied to the second board.

Description

Substrate manufacturing jig and substrate manufacturing method

[0001] The present invention relates to a substrate manufacturing jig and a substrate manufacturing method, and is applicable to a jig and a substrate manufacturing method used when manufacturing a substrate for a probe card used in electrical testing of semiconductor integrated circuits, for example.

[0002] For example, one of the processes for assembling a probe card used for electrical testing of semiconductor integrated circuits is a substrate integration process (also called a "soldering process") in which a multilayer wiring board and a printed circuit board (PCB board) are soldered together in a reflow furnace (see Patent Document 1).

[0003] JP 2010-245126 A

[0004] However, when heat is applied in a reflow furnace in the soldering process, the outer periphery of the multilayer wiring board may warp, as shown in FIG. 6, which may cause a problem in that the flatness of the integrated board may be impaired.

[0005] Therefore, in view of the above-mentioned problems, the present invention aims to provide a substrate manufacturing jig and a substrate manufacturing method that can suppress warping of one of the substrates when heating an adhesive material such as solder to integrate multiple substrates.

[0006] In order to solve such problems, the first invention is a substrate manufacturing jig used in a substrate manufacturing process in which an adhesive member is applied to the bonding surfaces of a first substrate and a second substrate and heat is applied to bond the substrates together, and is characterized in that it comprises: (1) a jig main body portion of an annular member; (2) a plurality of protrusions on the first surface side of the jig main body portion for placing weights; and (3) a plurality of substrate support portions on the second surface side of the jig main body portion that are arranged to match the outer shape of the second substrate and support the second substrate, and the second surface of the jig main body portion is attached to the first surface of the second substrate, and the weight of the weight placed on the first surface side of the jig main body portion is distributed and applied to the second substrate.

[0007] The second invention is a substrate manufacturing method for bonding the substrates together by applying an adhesive member to the bonding surfaces of a first substrate and a second substrate and applying heat, the method comprising: a substrate manufacturing jig having a jig main body of an annular member; a plurality of protrusions on the first surface side of the jig main body for placing weights; and a plurality of substrate support parts on the second surface side of the jig main body that are provided in accordance with the outer shape of the second substrate and support the second substrate; (1) applying the adhesive member to the second surface of the second substrate; (2) bonding the second surface of the jig main body to the first surface of the second substrate; The method is characterized by: (1) attaching a substrate manufacturing jig having a jig main body portion of an annular member, a plurality of protrusions on the first surface side of the jig main body portion for placing weights, and a plurality of substrate support portions on the second surface side of the jig main body portion that are arranged to match the outer shape of the second substrate and support the second substrate; (2) attaching an adhesive member to the first surface of the first substrate; (3) placing the second substrate with the substrate manufacturing jig attached on the first surface of the first substrate; and (5) placing weights on the first surface of the substrate manufacturing jig and placing it in a furnace for heating.

[0008] According to the present invention, when a plurality of substrates are integrated by heating an adhesive material such as solder, warping of one of the substrates can be suppressed.

[0009] FIG. 1 is a cross-sectional view showing a substrate configuration when a substrate manufacturing jig is attached in an embodiment; FIG. 2 is a perspective view showing a substrate configuration when a substrate manufacturing jig is attached in an embodiment; FIG. 3 is a planar perspective view showing a configuration of a first surface (e.g., an upper surface) of a substrate manufacturing jig according to an embodiment; FIG. 4 is a bottom perspective view showing a configuration of a second surface (e.g., a lower surface) of a substrate manufacturing jig according to an embodiment; FIG. 5 is a flowchart showing a substrate manufacturing method according to an embodiment; and FIG. 6 is an explanatory view explaining a problem in a substrate integration process of a multilayer wiring board and a wiring board.

[0010] (A) Main Embodiments Hereinafter, embodiments of a substrate manufacturing jig and a substrate manufacturing method according to the present invention will be described in detail with reference to the drawings.

[0011] (A-1) Configuration of the substrate manufacturing jig Fig. 1 is a cross-sectional view showing the configuration of a jig-mounted substrate on which a substrate manufacturing jig is mounted in an embodiment. Fig. 2 is a perspective view showing the jig-mounted substrate on which a substrate manufacturing jig is mounted in an embodiment.

[0012] 1 and 2 is used in a substrate integration process (soldering process), which is one of the manufacturing processes for a probe card. In this embodiment, a case is illustrated in which a wiring board 31 serving as a mother board (first board) is bonded to a multilayer wiring board 32 serving as a daughter board (second board) with an adhesive material 4 such as solder. Note that although the case in which two boards are bonded and integrated is illustrated here, three or more boards may also be bonded.

[0013] 1 and 2, the jig-mounted substrate configuration 1 includes attaching a substrate manufacturing jig 10 to a first surface (e.g., upper surface) 321 of a multilayer wiring substrate 32, applying an adhesive member 4 to a second surface (e.g., lower surface) 322 of the multilayer wiring substrate 32 to which the substrate manufacturing jig 10 is attached and to a first surface (e.g., upper surface) 311 of the wiring substrate 31, and then placing the multilayer wiring substrate 32 on the first surface 311 of the wiring substrate 31. Furthermore, to prevent warping of the multilayer wiring substrate 32 and ensure adhesion by the adhesive member 4, weights 20 (20-1 to 20-3) are placed on top of the substrate manufacturing jig 10 attached to the multilayer wiring substrate 32.

[0014] Here, warping of the substrate can be suppressed by using the substrate manufacturing jig 10, but in this embodiment, a relatively large and thick wiring substrate 31 (for example, a 500 mm square plate member with a thickness of 7 mm) serving as a mother substrate (first substrate) is integrated with a relatively small and thin multilayer wiring substrate 32 (for example, a 100 mm square plate member with a thickness of 3 mm) serving as a daughter substrate (second substrate). In this case, because the thickness of the multilayer wiring substrate 32 is thin, warping of the multilayer wiring substrate 32 may occur.

[0015] That is, in this embodiment, the warpage of the multilayer wiring board 32 is described with the intention of referring to the outer peripheral portion of the multilayer wiring board 32 warping up (the outer peripheral portion warping in a direction away from the wiring board 31). However, this is not limited to the outer peripheral portion warping up, and may also include a case where the central portion of the multilayer wiring board 32 moves away from the wiring board 31 and the outer peripheral portion warps down. In any case, warping of the multilayer wiring board 32 is suppressed so that flatness is maintained when the integrated board is set on the probe head.

[0016] The wiring board 31 is a printed circuit board made of, for example, a synthetic resin material such as polyimide, or a glass epoxy resin containing glass fiber. Printed wiring made of a conductive wiring material such as copper is formed on a first surface 311 and a second surface 312 of the wiring board 31. The wiring board 31 may be a multilayer printed circuit board, in which case wiring paths are formed inside the wiring board 31 and are electrically connected to terminals on the surface of the board.

[0017] The multilayer wiring board 32 is a substrate having a multilayer structure formed of multiple layers, with wiring paths formed between the multiple layers. For example, the multilayer wiring board 32 may be formed of an organic material such as a synthetic resin, and may be formed by laminating a synthetic resin film on a PET resin support, with the film further laminated with a synthetic resin protective film.

[0018] Solder, adhesive, etc. can be used as the adhesive member 4. In this embodiment, the description will be given assuming that the adhesive member 4 is solder that melts in a reflow furnace (not shown) to bond the wiring board 31 and the multilayer wiring board 32 together.

[0019] The weights 20 are placed on top of the substrate manufacturing jig 10 to suppress warping of the multilayer wiring substrate 32. The example in Figures 1 and 2 illustrates the use of three weights 20-1 to 20-3, but the number of weights 20 is not limited as long as a load can be applied to the multilayer wiring substrate 32. The material of the weights 20 is not particularly limited, but it is desirable to use a material that can suppress warping of the multilayer wiring substrate 32, taking into account the specific gravity and heat capacity. The weight 20 in this embodiment is made of tungsten and weighs approximately 1 kg.

[0020] The substrate manufacturing jig 10 is a jig for suppressing warping of the multilayer wiring substrate 32 caused by heating by applying the weight of the weight 20 to the multilayer wiring substrate 32. By integrating the substrates using the substrate manufacturing jig 10, it is possible to suppress warping of the multilayer wiring substrate 32. Furthermore, because warping of the multilayer wiring substrate 32 can be suppressed, when a probe card is constructed by integrating the substrate into which the wiring substrate 31 and the multilayer wiring substrate 32 are integrated with a probe head (not shown) that holds semiconductor inspection probes, it is possible to improve the flatness of the probe head.

[0021] Improving the flatness of the probe head contributes to aligning the height positions of the tips of the multiple probes arranged on the probe head, which allows each of the multiple probes to make good contact with the corresponding electrode terminal of the test object when testing the electrical characteristics of the semiconductor integrated circuit under test, and is expected to improve testing accuracy.

[0022] Fig. 3 is a plan perspective view showing the configuration of a first surface (e.g., an upper surface) 101 of the substrate manufacturing jig 10 according to the embodiment. Fig. 4 is a bottom perspective view showing the configuration of a second surface (e.g., a lower surface) 102 of the substrate manufacturing jig 10 according to the embodiment.

[0023] The substrate manufacturing jig 10 is formed from a heat-resistant, thermally conductive material such as aluminum or stainless steel. The jig body 11 of the substrate manufacturing jig 10 has a rectangular annular outer shape. The cross section of the annular member is rectangular. By making the jig body 11 annular, heat applied to the multilayer wiring substrate 32 escapes through the opening, thereby suppressing heat conduction to the weight 20.

[0024] 3 and 4 show an example in which the jig body 11 of the substrate manufacturing jig 10 has a rectangular ring-shaped outer shape, but the jig body 11 is not limited to this and may have a circular ring shape or a polygonal ring shape as long as it is capable of holding the multilayer wiring substrate 32 on the second surface 102 side (e.g., the lower side) as described below. Also, to simplify the operation, the substrate manufacturing jig 10 is made of a relatively light material (e.g., a tungsten material; for example, RG5 manufactured by Silverloy Co., Ltd.).

[0025] 3, the first surface (e.g., the top surface) 101 of the substrate manufacturing jig 10 has protrusions 12 at the positions of each of the four corners and near the midpoints of each of the four sides (four midpoints). In other words, the first surface 101 of the substrate manufacturing jig 10 has eight protrusions 12 for placing weights 20 thereon.

[0026] In order to place the weight 20 stably and to distribute the weight of the weight 20 evenly across the substrates (wiring substrate 31 and multilayer wiring substrate 32), the eight protrusions 12 are all made to be approximately the same height.

[0027] Furthermore, by providing the protrusions 12 on the first surface 101 of the substrate manufacturing jig 10 , the heat applied to the wiring board 31 and the multilayer wiring board 32 is prevented from being transmitted to the weight 20 .

[0028] If the heat applied to the wiring board 31 and the multilayer wiring board 32 were conducted to the weight 20, the temperatures of both boards (wiring board 31 and multilayer wiring board 32) would drop, reducing the thermal efficiency of the soldering process. In contrast, board configuration 1 has protrusions 12 to create a space between the board and the weight 20, and board manufacturing jig 10 has an annular shape, which makes it possible to suppress heat conduction from the board to the weight 20 and maintain the temperatures of both boards (wiring board 31 and multilayer wiring board 32) at a high temperature, thereby improving the efficiency of the soldering process.

[0029] The protrusions 12 can be formed by a press-fit method in which holes are formed at positions on the first surface 101 of the substrate manufacturing jig 10 where the protrusions 12 are to be provided, and the protrusions 12 are inserted into the holes. The shape of the protrusions 12 is not particularly limited, and rod-shaped members with circular or elliptical cross sections, rod-shaped members with square or polygonal cross sections, etc. As another formation method, the protrusions 12 may be formed physically integrally with the substrate manufacturing jig 10, if possible.

[0030] In this example, eight protrusions 12 are provided, but as long as the weight 20 can be placed stably on the substrate manufacturing jig 10, the number of protrusions 12 is not limited and may be less than eight or may be nine or more.

[0031] As illustrated in Figure 4, the second surface (e.g., the lower surface) 102 of the substrate manufacturing jig 10 forms an accommodation space that matches the outer shape of the multilayer wiring substrate 32 and has a substrate support portion 13 that supports the multilayer wiring substrate 32.

[0032] For example, on the second surface 102 of the substrate manufacturing jig 10, a substrate support portion 13 which is a polygonal prism member having a substantially L-shaped horizontal cross section (the horizontal surface of the substrate manufacturing jig 10) is provided at each of the four corners. Furthermore, a substrate support portion 13 which is a quadrangular prism member having a substantially rectangular horizontal cross section is provided at the center of each of the four sides. In other words, eight substrate support portions 13 are provided on the second surface 102 of the substrate manufacturing jig 10.

[0033] Each substrate support portion 13 has a main body portion 130 that is a polygonal or quadrangular prism member, and a support adjustment portion 131 that can be screwed into a screw hole (through hole) formed in the main body portion 130. The diameter of the screw hole (through hole) in the main body portion 130 is slightly larger than the diameter of the screw that serves as the support adjustment portion 131. A detailed description of the support adjustment portion 131 will be given later.

[0034] Each of the substrate support portions 13 has a step portion 132 on its inner side. For example, the substantially L-shaped substrate support portion 13 has a substantially L-shaped step portion 132, and the rectangular pillar-shaped substrate support portion 13 has a linear step portion 132, so that the rectangular multilayer wiring substrate 32 can be accommodated in the space formed by the step portions 132 of all eight of the substrate support portions 13. This prevents the multilayer wiring substrate 32 from shifting out of position.

[0035] For example, the step portion 132 has a horizontal portion 132a that is parallel to the horizontal plane of the substrate manufacturing jig 10, and a vertical portion 132b that is perpendicular to the horizontal plane.

[0036] The horizontal portion 132a of the step portion 132 is a portion that contacts the edge of the first surface (e.g., upper surface) 321 of the multilayer wiring substrate 32. The vertical portion 132b of the step portion 132 is a portion that contacts the thickness portion (wall surface portion) of the multilayer wiring substrate 32, and the length of the vertical portion 132b is, for example, approximately the same as or shorter than the thickness length of the multilayer wiring substrate 32.

[0037] When the substrate manufacturing jig 10 is attached to the first surface 321 of the multilayer wiring board 32, the space formed by the vertical portions 132b of each step portion 132 is slightly larger than the dimensions of the multilayer wiring board 32, so that the multilayer wiring board 32 can be accommodated in the space. Therefore, when the multilayer wiring board 32 is accommodated in the space, the horizontal portions 132a of each step portion 132 come into contact with the edge of the first surface 321 of the multilayer wiring board 32.

[0038] Here, since the dimensions of the space are slightly larger than the dimensions of the multilayer wiring board 32, the multilayer wiring board 32 and the board manufacturing jig 10 are not fixed together, and when the board manufacturing jig 10 is lifted, the multilayer wiring board 32 falls.

[0039] Therefore, each of the eight board support parts 13 is provided with a support adjustment part 131 such as a screw, and the main body part 130 having the step parts 132 is fastened by fastening the screw as the support adjustment part 131 in a screw hole (through hole) with a slightly larger diameter. This slightly reduces the size of the space, and all the step parts 132 can firmly support the multilayer wiring board 32. As a result, it is possible to prevent the multilayer wiring board 32 from falling.

[0040] For example, the second surface 102 of the jig body 11 of the substrate manufacturing jig 10 has screw holes (referred to as "first screw holes") at positions where each of the substrate support portions 13 is to be positioned. Furthermore, the body 130 of each of the substrate support portions 13 also has screw holes (referred to as "second screw holes"). In this example, two support adjustment portions 131 are provided for each of the substrate support portions 13, so that each of the substrate support portions 13 has two first screw holes and two second screw holes. The support adjustment portions 131 are provided so as to thread into the first screw holes of the jig body 11 and the second screw holes of the body 130. Tightening the support adjustment portions 131 tightens the clamping force of the body 130, and conversely, loosening the support adjustment portions 131 loosens the clamping force of the body 130. Such a configuration is possible.

[0041] Note that fine adjustment is required for the adjustment using the support adjustment parts 131 such as screws, etc. Therefore, in this embodiment, two support adjustment parts 131 are provided for each substrate support part 13.

[0042] Of course, the number of support adjustment units 131 provided in one substrate support unit 13 may be one, or may be three or more. Furthermore, a different number of support adjustment units 131 may be provided for each substrate support unit 13 depending on the installation position of the substrate support unit 13 in the substrate manufacturing jig 10.

[0043] In this way, since the substrate support portion 13 of the substrate manufacturing jig 10 is configured to be able to support the multilayer wiring substrate 32, the multilayer wiring substrate 32 can be moved by grasping and moving the substrate manufacturing jig 10 while supporting the multilayer wiring substrate 32 using a jig moving mechanism equipped with an arm or the like (not shown) or by human hand.

[0044] (A-2) Substrate Manufacturing Method Using Substrate Integration Process (Soldering Process) Next, a substrate manufacturing method in which a plurality of substrates are placed in a reflow furnace to manufacture an integrated substrate will be described with reference to the drawings.

[0045] FIG. 5 is a flowchart showing a substrate manufacturing method according to an embodiment.

[0046] [S101] First, the adhesive member 4 is applied to the second surface 322 of the multilayer wiring substrate 32 (S101).

[0047] For example, solder balls or solder paste may be applied as the adhesive member 4 to the second surface 322 of the multilayer wiring substrate 32. The same method for applying the adhesive member 4 can be used below.

[0048] [S102] Next, the substrate manufacturing jig 10 is attached to the first surface 321 of the multilayer wiring substrate 32 (S102).

[0049] For example, the multilayer wiring board 32 is fitted into an accommodation space formed by the step portions 132 of the eight board support portions 13 on the second surface 102 of the board manufacturing jig 10. For example, if the multilayer wiring board 32 is a 100 mm square and has a thickness of 3 mm, the dimensions of the accommodation space are formed to be approximately the same as or slightly larger than the dimensions of the multilayer wiring board 32, and the multilayer wiring board 32 is fitted into the accommodation space. Note that the dimensions of the multilayer wiring board 32 are not limited to the above example.

[0050] [S103] After the substrate manufacturing jig 10 is attached to the first surface 321 of the multilayer wiring substrate 32, in order to prevent the multilayer wiring substrate 32 from falling, the support adjustment parts 131 of each substrate support part 13 tighten the clamping force of the main body part 130, thereby strengthening the support of the multilayer wiring substrate 32 (S103).

[0051] For example, if the tightening of the main body 130 can be increased by tightening the screws serving as the support adjustment parts 131, and the tightening of the main body 130 can be decreased by loosening the screws, the tightening of the main body 130 can be adjusted by the support adjustment parts 131 of each board support part 13. When the tightening of the main body 130 of each board support part 13 is increased, the support of the multilayer wiring board 32 by the eight main body parts 130 can be strengthened.

[0052] S104] The adhesive member 4 is applied to the first surface 311 of the wiring substrate 31 (S104).

[0053] For example, the wiring board 31 to be bonded to the multilayer wiring board 32 is assumed to be a 500 mm square with a thickness of 7 mm. When the dimensions of the wiring board 31 are larger than the dimensions of the multilayer wiring board 32, it is preferable to apply the adhesive member 4 to the adhesive surface of the first surface 311 of the wiring board 31, rather than to the entire first surface 311. The dimensions of the wiring board 31 are not limited to the above example.

[0054] [S105] The multilayer wiring board 32 is placed on the wiring board 31, aligned with the contact surface of the first surface 311 (S105).

[0055] That is, the multilayer wiring substrate 32 to which the substrate manufacturing jig 10 is attached is placed on the first surface 311 of the wiring substrate 31 .

[0056] [S106] With the multilayer wiring substrate 32 with the substrate manufacturing jig 10 attached placed on the wiring substrate 31, a weight 20 is placed on the substrate manufacturing jig 10 (S106).

[0057] [S107, S108] The multilayer wiring board 32 with the board manufacturing jig 10 attached is placed on the wiring board 31 and placed in a reflow furnace. At this time, the heating temperature and heating time in the reflow furnace are set to a predetermined temperature and predetermined time (S107). Then, the board is removed from the reflow furnace, and it is confirmed whether the wiring board 31 and the multilayer wiring board 32 are soldered together (S108). In other words, it is confirmed whether there are any defects.

[0058] For example, depending on the type of solder, when the melting point is about 220° C., the heating temperature in the reflow furnace can be set to 240° C. and the heating time can be set to 3 seconds or less.

[0059] In this embodiment, the wiring board 31 is 500 mm square and 7 mm thick, while the multilayer wiring board 32 is 100 mm square and 3 mm thick, so the dimensions (sizes) of the two boards are significantly different, and therefore the smaller, thinner multilayer wiring board 32 may warp.

[0060] However, in this embodiment, by attaching the substrate manufacturing jig 10 to the multilayer wiring substrate 32 and further placing a weight 20 on top of it, it is possible to suppress warping of the multilayer wiring substrate 32 .

[0061] By using the substrate manufacturing jig 10, rather than simply placing the weight 20, the weight of the weight 20 can be distributed over the entire surface of the multilayer wiring substrate 32, thereby suppressing warping that may occur over the entire surface of the multilayer wiring substrate 32.

[0062] Furthermore, to improve soldering, it is desirable that heat not move toward the weight 20 but be accumulated in the wiring board 31 and the multilayer wiring board 32. Therefore, in order to reduce the contact surface of the weight 20, eight protrusions 12 are provided on the first surface 101 of the substrate manufacturing jig 10, and eight substrate support portions 13 are provided on the second surface 102.

[0063] (A-3) Effects of the Embodiment As described above, according to this embodiment, when a plurality of substrates are integrated by heating an adhesive member such as solder, warping of one of the substrates can be suppressed.

[0064] (B) Other Embodiments Although various modified embodiments have been mentioned in the above-described embodiment, the present invention can also be applied to the following modified embodiments.

[0065] (B-1) In the above-described embodiment, the order of the substrate manufacturing method illustrated in Fig. 6 is not limited to the order in Fig. 6. For example, the adhesive material 4 may be applied to the multilayer wiring substrate 32 or the wiring substrate 31 simultaneously, or the order may be reversed. Also, the adhesive material may be applied to the multilayer wiring substrate after the substrate manufacturing jig is attached to the multilayer wiring substrate.

[0066] (B-2) In the above-described embodiment, a weight is placed on the substrate manufacturing jig, and the weight may be considered as one of the components of the substrate manufacturing jig according to the present invention.

[0067] Conversely, if the substrate manufacturing jig is made of a material with a high specific gravity and the substrate manufacturing jig itself has sufficient weight to suppress warping of the multilayer wiring board, and it is possible to eliminate the need to place a weight on it, then the weight need not be considered one of the components. In any case, it is sufficient to be able to distribute the weight and add it to suppress warping of the multilayer wiring board.

[0068] 1...substrate structure, 10...substrate manufacturing jig, 101...first surface of substrate manufacturing jig, 102...second surface of substrate manufacturing jig, 11...jig main body, 12...protrusion, 13...substrate support portion, 130...main body, 131...support adjustment portion, 132...step portion, 132a...horizontal portion, 132b...vertical portion, 20 (20-1 to 20-3)...weight, 31...wiring board, 311...first surface of wiring board, 312...second surface of wiring board, 32...multilayer wiring board, 321...first surface of multilayer wiring board, 322...second surface of multilayer wiring board, 4...adhesive member

Claims

1. A substrate manufacturing jig used in a substrate manufacturing process in which an adhesive material is applied to the bonding surfaces of a first substrate and a second substrate and heat is applied to bond the substrates together, comprising: a jig main body portion made of an annular member; a plurality of protrusions on a first surface of the jig main body portion for placing weights; and a plurality of substrate support portions on a second surface of the jig main body portion that are arranged to match the outer shape of the second substrate and support the second substrate, wherein the second surface of the jig main body portion is attached to the first surface of the second substrate, and the weight of the weights placed on the first surface of the jig main body portion is distributed and applied to the second substrate.

2. A substrate manufacturing jig as described in claim 1, characterized in that each of the substrate support portions has a step portion, and each of the step portions contacts the edge of the first surface of the second substrate to position the second substrate.

3. A substrate manufacturing jig as described in claim 1, characterized in that the second surface of the jig body portion is provided with a first screw hole at the position of each of the substrate support portions, and each of the substrate support portions has a body portion having a second screw hole at a position corresponding to the first screw hole, and a support adjustment portion that screws into the first screw hole and the second screw hole of the body portion, and the support adjustment portion screws into the first screw hole and the second screw hole to support the second substrate.

4. A substrate manufacturing method for bonding substrates by applying an adhesive member to the bonding surfaces of a first substrate and a second substrate and applying heat, comprising the steps of: applying the adhesive member to the second surface of the second substrate; attaching a substrate manufacturing jig having a jig main body of an annular member, a plurality of protrusions on the first surface side of the jig main body for placing weights, and a plurality of substrate support portions on the second surface side of the jig main body for supporting the second substrate, the plurality of protrusions being arranged to match the outer shape of the second substrate; applying the adhesive member to the first surface of the first substrate; placing the second substrate with the substrate manufacturing jig attached on the first surface of the first substrate; placing a weight on the first surface of the substrate manufacturing jig and placing it in a furnace for heating.

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