Electronic device comprising printed circuit board having fill-cut part

Abstract

This electronic device comprises: a housing; a camera in the housing, arranged at the edge of the electronic device; a speaker arranged beside the camera; and a PCB including an opening part in which the speaker is accommodated, and a neck end part between the speaker and the camera, wherein the PCB includes a plurality of non-conductive layers, a conductive pad arranged at one from among outer layers of the plurality of non-conductive layers, and conductive patterns arranged between the non-conductive layers, a part of the conductive pad having arranged at the neck end part and the conductive patterns being disconnected from the neck end part by a predetermined distance.

Description

Electronic device comprising a printed circuit board having a fill-cut portion

[0001] The present disclosure relates to an electronic device including a printed circuit board having a fillet portion.

[0002] As electronic devices become smaller and thinner, the thickness and size of the components within them may be limited. Miniaturizing electronic devices may require reducing the size of individual electronic components and optimizing their layout. While optimizing the layout, it may also be necessary to provide a structure that reduces noise caused by electromagnetic interference between electronic components.

[0003] The above information may be provided as background art to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art related to the present disclosure.

[0004] According to one embodiment, an electronic device is disclosed. The electronic device may include a housing. The electronic device may further include a camera. The camera may be disposed at an edge of the electronic device and located within the housing. The electronic device may further include a speaker. The electronic device may be disposed next to the camera. The electronic device may further include a printed circuit board. The printed circuit board may include an opening for accommodating the speaker and a neck portion between the speaker and the camera. The printed circuit board may include a plurality of non-conductive layers. The printed circuit board may further include a conductive pad. The conductive pad may be disposed on one of the outer layers of the plurality of non-conductive layers. The printed circuit board may further include conductive patterns. The conductive patterns may be disposed between the non-conductive layers. A portion of the conductive pad may be disposed on the neck portion, and the conductive patterns may be disconnected from the neck portion by a predetermined distance.

[0005] According to one embodiment, an electronic device is disclosed. The electronic device may include a first electronic component. The electronic device may further include a second electronic component. The second electronic component may be disposed next to the first electronic component. The electronic device may further include a printed circuit board. The printed circuit board may include an opening for accommodating the first electronic component and a neck portion between the first electronic component and the second electronic component. The neck portion may include a plurality of non-conductive layers that are sequentially stacked. The neck portion may further include a conductive pad on one of the outer layers of the plurality of non-conductive layers. The printed circuit board may include conductive patterns that are disconnected at a predetermined distance from the neck portion.

[0006] FIG. 1 is a drawing showing an electronic device according to one embodiment.

[0007] Figure 2 is an exploded perspective view of an electronic device according to one embodiment.

[0008] Figure 3 is a drawing showing the interior of an exemplary electronic device.

[0009] Figure 4a is a cross-sectional view of an exemplary electronic device.

[0010] Figure 4b is a cross-sectional view of a printed circuit board of an exemplary electronic device.

[0011] Figures 5a, 5b, 5c, 5d and 5e are drawings exemplarily showing the arrangement of fill-cut portions of a printed circuit board.

[0012] Figure 6a illustrates an example of a current path and a magnetic field caused by current around a speaker placed on a printed circuit board that does not include a fill-cut portion.

[0013] Figure 6b illustrates an example of a current path and a magnetic field caused by a current around a speaker placed on a printed circuit board including a fill-cut portion.

[0014] Figure 7 illustrates an example of the size of noise transmitted to a speaker placed on a printed circuit board including a fill-cut portion.

[0015] FIG. 8 is a block diagram of an electronic device within a network environment according to various embodiments.

[0016] FIG. 1 is a drawing showing an electronic device according to one embodiment.

[0017] Referring to FIG. 1, an electronic device (100) according to one embodiment may include a housing (110) forming an exterior of the electronic device (100). For example, the housing (110) may include a first side (or front side) (100A), a second side (or back side) (100B), and a third side (or side surface) (100C) surrounding a space between the first side (100A) and the second side (100B). In one embodiment, the housing (110) may also refer to a structure (e.g., a frame structure (140) of FIG. 2) forming at least a portion of the first side (100A), the second side (100B), and / or the third side (100C).

[0018] An electronic device (100) according to one embodiment may include a substantially transparent front plate (102). In one embodiment, the front plate (102) may form at least a portion of the first surface (100A). In one embodiment, the front plate (102) may include, but is not limited to, a glass plate or a polymer plate including various coating layers, for example.

[0019] An electronic device (100) according to one embodiment may include a substantially opaque back plate (111). In one embodiment, the back plate (111) may form at least a portion of the second surface (100B). In one embodiment, the back plate (111) may be formed of a coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials.

[0020] An electronic device (100) according to one embodiment may include a side bezel structure (or side member) (118) (e.g., a side wall (141) of a frame structure (140) of FIG. 2). In one embodiment, the side bezel structure (118) may be combined with a front plate (102) and / or a rear plate (111) to form at least a portion of a third side (100C) of the electronic device (100). For example, the side bezel structure (118) may form the entire third side (100C) of the electronic device (100), or, for another example, the side bezel structure (118) may form the third side (100C) of the electronic device (100) together with the front plate (102) and / or the rear plate (111).

[0021] Unlike the illustrated embodiment, when the third side (100C) of the electronic device (100) is partially formed by the front plate (102) and / or the rear plate (111), the front plate (102) and / or the rear plate (111) may include a region that extends seamlessly from its edge toward the rear plate (111) and / or the front plate (102). The extending region of the front plate (102) and / or the rear plate (111) may be located at both ends of a long edge of the electronic device (100), for example, but is not limited to the above-described example.

[0022] In one embodiment, the side bezel structure (118) may comprise a metal and / or a polymer. In one embodiment, the back plate (111) and the side bezel structure (118) may be formed integrally and may comprise the same material (e.g., a metal material such as aluminum), but is not limited thereto. For example, the back plate (111) and the side bezel structure (118) may be formed as separate components and / or may comprise different materials.

[0023] In one embodiment, the electronic device (100) may include at least one of a display (101), an audio module (103, 104, 107), a sensor module (not shown), a camera module (105, 112, 113), a key input device (117), a light emitting element (not shown), and / or a connector hole. In one embodiment, the electronic device (100) may omit at least one of the above components (e.g., the key input device (117) or the light emitting element (not shown)) or may additionally include other components.

[0024] In one embodiment, the display (101) (e.g., the display module (660) of FIG. 6) may be visually exposed through a substantial portion of the front plate (102). For example, at least a portion of the display (101) may be visible through the front plate (102) forming the first surface (100A). In one embodiment, the display (101) may be disposed on the back surface of the front plate (102).

[0025] In one embodiment, the outer shape of the display (101) may be formed to be substantially the same as the outer shape of the front plate (102) adjacent to the display (101). In one embodiment, in order to expand the area where the display (101) is visually exposed, the gap between the outer shape of the display (101) and the outer shape of the front plate (102) may be formed to be substantially the same.

[0026] In one embodiment, the display (101) (or the first surface (100A) of the electronic device (100)) may include a screen display area (101A). In one embodiment, the display (101) may provide visual information to a user through the screen display area (101A). In the illustrated embodiment, when the first surface (100A) is viewed from the front, the screen display area (101A) is depicted as being positioned on the inside of the first surface (100A) and spaced apart from the outer edge of the first surface (100A), but is not limited thereto. In one embodiment, when the first surface (100A) is viewed from the front, at least a portion of an edge of the screen display area (101A) may substantially coincide with an edge of the first surface (100A) (or the front plate (102)).

[0027] In one embodiment, the screen display area (101A) may include a sensing area (101B) configured to acquire biometric information of the user. Here, the meaning of "the screen display area (101A) includes the sensing area (101B)" may be understood to mean that at least a portion of the sensing area (101B) may overlap the screen display area (101A). For example, the sensing area (101B) may be an area capable of displaying visual information by the display (101) like other areas of the screen display area (101A) and additionally capable of acquiring biometric information of the user (e.g., a fingerprint). In one embodiment, the sensing area (101B) may also be formed in the key input device (117).

[0028] In one embodiment, the display (101) may include an area where a first camera module (105) (e.g., camera module (680) of FIG. 6) is positioned. In one embodiment, an opening is formed in the area of ​​the display (101), and the first camera module (105) (e.g., a punch hole camera) may be at least partially positioned within the opening so as to face the first surface (100A). In this case, the screen display area (101A) may surround at least a portion of an edge of the opening. In one embodiment, the first camera module (105) (e.g., an under display camera (UDC)) may be positioned under the display (101) so as to overlap the area of ​​the display (101). In this case, the display (101) can provide visual information to the user through the above area, and additionally, the first camera module (105) can obtain an image corresponding to the direction toward the first surface (100A) through the above area of ​​the display (101).

[0029] In one embodiment, the display (101) may be coupled to or disposed adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer capable of detecting a magnetic field-type stylus pen.

[0030] In one embodiment, the audio module (103, 104, 107) (e.g., audio module (670) of FIG. 6) may include a microphone hole (103, 104) and a speaker hole (107).

[0031] In one embodiment, the microphone holes (103, 104) may include a first microphone hole (103) formed in a portion of the third surface (100C) and a second microphone hole (104) formed in a portion of the second surface (100B). A microphone (not shown) for acquiring external sound may be placed inside the microphone holes (103, 104). The microphone may include multiple microphones to detect the direction of the sound.

[0032] In one embodiment, a second microphone hole (104) formed in a portion of the second surface (100B) may be positioned adjacent to a camera module (105, 112, 113). For example, the second microphone hole (104) may acquire sound according to the operation of the camera module (105, 112, 113). However, the present invention is not limited thereto.

[0033] In one embodiment, the speaker hole (107) may include an external speaker hole (107) and a call receiver hole (not shown). The external speaker hole (107) may be formed on a part of the third surface (100C) of the electronic device (100). In one embodiment, the external speaker hole (107) may be implemented as a single hole with the microphone hole (103). Although not shown, the call receiver hole (not shown) may be formed on another part of the third surface (100C). For example, the call receiver hole may be formed on the opposite side of the external speaker hole (107) on the third surface (100C). For example, based on the city of FIG. 1, the external speaker hole (107) may be formed on the third surface (100C) corresponding to the lower portion of the electronic device (100), and the call receiver hole may be formed on the third surface (100C) corresponding to the upper portion of the electronic device (100). However, this is not limited thereto, and in one embodiment, the call receiver hole may be formed at a location other than the third surface (100C). For example, the call receiver hole may be formed by a spaced space between the front plate (102) (or, display (101)) and the side bezel structure (118).

[0034] In one embodiment, the electronic device (100) may include at least one speaker (not shown) configured to output sound to the outside of the housing (110) through an external speaker hole (107) and / or a call receiver hole (not shown).

[0035] In one embodiment, a sensor module (not shown) (e.g., sensor module (676) of FIG. 6) may generate an electrical signal or data value corresponding to an internal operating state of the electronic device (100) or an external environmental state. For example, the sensor module may include at least one of a proximity sensor, an HRM sensor, a fingerprint sensor, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0036] In one embodiment, a camera module (105, 112, 113) (e.g., camera module (680) of FIG. 6) may include a first camera module (105) positioned to face a first side (100A) of the electronic device (100), a second camera module (112) positioned to face a second side (100B), and a flash (113).

[0037] In one embodiment, the second camera module (112) may include multiple cameras (e.g., dual cameras, triple cameras, or quad cameras). However, the second camera module (112) is not necessarily limited to including multiple cameras and may include a single camera.

[0038] In one embodiment, the first camera module (105) and the second camera module (112) may include one or more lenses, image sensors, and / or image signal processors.

[0039] In one embodiment, the flash (113) may include, for example, a light emitting diode or a xenon lamp. In one embodiment, two or more lenses (infrared camera, wide-angle and telephoto lenses) and image sensors may be arranged on one side of the electronic device (100).

[0040] In one embodiment, a key input device (117) (e.g., input module (650) of FIG. 6) may be disposed on a third side (100C) of the electronic device (100). In one embodiment, the electronic device (100) may not include some or all of the key input devices (117), and the key input devices (117) that are not included may be implemented in another form, such as a soft key, on the display (101).

[0041] In one embodiment, a connector hole may be formed on the third surface (100C) of the electronic device (100) so that a connector of an external device can be accommodated. A connection terminal (e.g., connection terminal (678) of FIG. 6) electrically connected to the connector of the external device may be arranged within the connector hole. The electronic device (100) according to one embodiment may include an interface module (e.g., interface (677) of FIG. 6) for processing electrical signals transmitted and received through the connection terminal.

[0042] In one embodiment, the electronic device (100) may include a light-emitting element (not shown). For example, the light-emitting element (not shown) may be disposed on a first surface (100A) of the housing (110). The light-emitting element (not shown) may provide status information of the electronic device (100) in the form of light. In one embodiment, the light-emitting element (not shown) may provide a light source that is linked to the operation of the first camera module (105). For example, the light-emitting element (not shown) may include an LED, an IR LED, and / or a xenon lamp.

[0043] Figure 2 is an exploded perspective view of an electronic device according to one embodiment.

[0044] In the following, redundant descriptions of configurations having the same reference numerals as the configurations described above are omitted.

[0045] Referring to FIG. 2, an electronic device (100) according to one embodiment may include a frame structure (140), a first printed circuit board, a second printed circuit board (152), a cover plate (160), and a battery (170).

[0046] In one embodiment, the frame structure (140) may include a side wall (141) forming an exterior of the electronic device (100) (e.g., the third side (100C) of FIG. 2) and a support portion (143) extending inwardly from the side wall (141). In one embodiment, the frame structure (140) may be disposed between the display (101) and the back plate (111). In one embodiment, the side wall (141) of the frame structure (140) may surround a space between the back plate (111) and the front plate (102) (and / or the display (101)), and the support portion (143) of the frame structure (140) may extend from the side wall (141) within the space. According to one embodiment, a side wall (141) forming a side surface of an electronic device (100) (e.g., side surface (100C) of FIG. 2) may include a speaker hole (107) connecting the inside and the outside of the electronic device (100). The speaker hole (107) may penetrate the side wall (141).

[0047] In one embodiment, the frame structure (140) may support or accommodate other components included in the electronic device (100). For example, a display (101) may be disposed on one side of the frame structure (140) facing one direction (e.g., +z direction), and the display (101) may be supported by a support portion (143) of the frame structure (140). For another example, a first printed circuit board (150), a second printed circuit board (152), a battery (170), and a second camera module (112) may be disposed on the other side of the frame structure (140) facing the opposite direction (e.g., -z direction). The first printed circuit board (150), the second printed circuit board (152), the battery (170), and the second camera module (112) can each be mounted in a recess defined by a side wall (141) and / or a support portion (143) of the frame structure (140).

[0048] In one embodiment, the first printed circuit board (150), the second printed circuit board (152), and the battery (170) may be respectively coupled to the frame structure (140). For example, the first printed circuit board (150) and the second printed circuit board (152) may be fixedly disposed to the frame structure (140) via a coupling member such as a screw. For example, the battery (170) may be fixedly disposed to the frame structure (140) via an adhesive member (e.g., double-sided tape). However, the present invention is not limited to the above-described examples.

[0049] In one embodiment, the cover plate (160) may be disposed between the first printed circuit board (150) and the back plate (111). In one embodiment, the cover plate (160) may be disposed on the first printed circuit board (150). For example, the cover plate (160) may be disposed on a surface of the first printed circuit board (150) facing the -z direction.

[0050] In one embodiment, the cover plate (160) may at least partially overlap the first printed circuit board (150) with respect to the z-axis. In one embodiment, the cover plate (160) may cover at least a portion of the first printed circuit board (150). In this way, the cover plate (160) may protect the first printed circuit board (150) from physical impact or prevent detachment of a connector coupled to the first printed circuit board (150).

[0051] In one embodiment, the cover plate (160) may be fixedly positioned on the first printed circuit board (150) via a joining member (e.g., a screw), or may be joined to the frame structure (140) together with the first printed circuit board (150) via the joining member.

[0052] In one embodiment, the display (101) may be positioned between a frame structure (140) and a front plate (102). For example, the front plate (102) may be positioned on one side (e.g., in the +z direction) of the display (101), and the frame structure (140) may be positioned on the other side (e.g., in the -z direction).

[0053] In one embodiment, the front plate (102) may be coupled with the display (101). For example, the front plate (102) and the display (101) may be bonded to each other via an optically clear adhesive (e.g., optically clear adhesive (OCA) or optically clear resin (OCR)) interposed therebetween.

[0054] In one embodiment, the front plate (102) may be coupled with a frame structure (140). For example, the front plate (102) may include an outer portion extending outside the display (101) when viewed in the z-axis direction, and may be adhered to the frame structure (140) through an adhesive member (e.g., double-sided tape) disposed between the outer portion of the front plate (102) and the frame structure (140) (e.g., side wall (141)). However, the present invention is not limited to the above-described example.

[0055] In one embodiment, the first printed circuit board (150) and / or the second printed circuit board (152) may be equipped with a processor (e.g., processor (620) of FIG. 6), memory (e.g., memory (630) of FIG. 6), and / or an interface (e.g., interface (677) of FIG. 6). The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor. The memory may include, for example, volatile memory or non-volatile memory. The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. The interface may electrically or physically connect the electronic device (100) to an external electronic device, and may include a USB connector, an SD card / MMC connector, or an audio connector. In one embodiment, the first printed circuit board (150) and the second printed circuit board (152) may be operatively or electrically connected to each other via a connecting member (e.g., a flexible printed circuit board).

[0056] In one embodiment, a battery (170) (e.g., battery (689) of FIG. 6 ) may power at least one component of the electronic device (100). For example, the battery (170) may include a rechargeable secondary battery or a fuel cell. At least a portion of the battery (170) may be disposed substantially coplanar with the first printed circuit board (150) and / or the second printed circuit board (152).

[0057] An electronic device (100) according to one embodiment may include an antenna module (not shown) (e.g., antenna module (697) of FIG. 6). In one embodiment, the antenna module may be disposed between the rear plate (111) and the battery (170). The antenna module may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna module may, for example, perform short-range communication with an external device or wirelessly transmit and receive power with an external device.

[0058] In one embodiment, the housing (110) of the electronic device (100) may refer to a configuration or structure that forms at least a portion of the exterior of the electronic device (100). In this respect, at least a portion of the front plate (102), the frame structure (140), and / or the rear plate (111) that form the exterior of the electronic device (100) may be referred to as the housing (110) of the electronic device (100).

[0059] Figure 3 is a diagram illustrating the interior of an exemplary electronic device. Figure 4a is a cross-sectional view of the exemplary electronic device. Figure 4b is a cross-sectional view of the printed circuit board of the exemplary electronic device.

[0060] Referring to FIGS. 3, 4a, and 4b, the electronic device (100) may include a printed circuit board (150), a speaker (310), a camera (320), and a battery (170) disposed on a frame structure (140) disposed within a housing (110). The electronic device (100) may at least partially reference the electronic device (100) of FIG. 1 and the electronic device (100) of FIG. 2.

[0061] The electronic device (100) may include another printed circuit board spaced apart from the printed circuit board (150), and the other printed circuit board (e.g., the second printed circuit board (152) of FIG. 2) may be electrically connected to the printed circuit board (150) through a flexible printed circuit board. The printed circuit board (150) and the other printed circuit board may each be disposed on opposite sides of the housing (110) of the electronic device (100). For example, the printed circuit board (150) may be disposed on one side (e.g., the top) of the housing (110) of the electronic device (100). The other printed circuit board may be disposed on the other side (e.g., the bottom) of the housing (110) of the electronic device (100).

[0062] Electronic components (e.g., a camera, an optical sensor, a processor, or a memory) disposed on the top of the electronic device (100) may be disposed on or connected to a printed circuit board (150). For example, at least one processor controlling electronic components within the electronic device (100) may be disposed on the printed circuit board (150). The printed circuit board (150) may include an opening (352) (or receiving portion) for accommodating a speaker (310).

[0063] The opening (352) can reduce the thickness of the electronic device (100). In order to make the electronic device (100) thin, the speaker (310) is not placed on the printed circuit board (150), but is inserted into an opening formed in the printed circuit board (150), and the speaker (310) can be supported by a frame structure (e.g., the frame structure (140) of FIG. 2). The opening can be passed through by the speaker (310). The opening (352) can be referred to as a receiving portion from the side where a portion of the speaker (310) is received. One side of the speaker (310) supported by the frame structure (140) can be a side where a diaphragm for generating an audio signal is placed. The frame structure (140) can include an acoustic duct connected to an audio hole formed on the side of the electronic device (100) to transmit an audio signal to the outside. The other side opposite to one side of the speaker (310) may be the rear side of the speaker (310). The rear side of the speaker (310) may be a side where a resonance space for resonating an audio signal is arranged. Since the speaker (310) penetrates the opening (352) and comes into contact with the frame structure (140), the electronic device (100) may be thinner than when it includes the speaker (310) arranged on a printed circuit board (150).

[0064] The printed circuit board (150) may include a neck portion (351) between the speaker (310) and the camera (320). The neck portion (351) may have a thinner width than other parts of the printed circuit board (150). The neck portion (351) may be a thin connecting portion that connects parts of the printed circuit board (150) and may be referred to as a bridge or a connecting portion. The width of the printed circuit board (150) may represent a width in the x-axis direction or a width in the y-axis direction. The width of the neck portion (351) may be the smallest among the widths of the printed circuit board (150) arranged at the edge of the speaker (310). The neck portion (351) may represent a portion having the narrowest width among the widths of the printed circuit board (150) facing the four corners of the speaker (310). The speaker (310) may be placed next to the camera (320). The neck portion (351) of the printed circuit board (150) may be placed between the speaker (310) and the camera (320). A portion of the speaker (310) may be accommodated in the opening (352) of the printed circuit board, and the camera (320) may face the speaker (310) with the neck portion (351) therebetween. The camera (320) may be placed between the printed circuit board (150) and a side wall (e.g., the side wall (141) of FIG. 2) of the housing (110) of the electronic device (100). The camera (320) may be placed adjacent to the side wall disposed on the upper portion of the electronic device (100). The speaker (310) may be placed next to the camera (320). The speaker (310) may be a receiver that transmits an audio signal received through communication with an external electronic device. The speaker (310) may acquire noise due to the influence of various components (e.g., an antenna, a wireless communication circuit, a power amplifier circuit, or a camera) placed on the printed circuit board (150). The antenna connected to the wireless communication circuit may be placed toward the side wall of the electronic device.An antenna or wireless communication circuit placed adjacent to the side wall may generate a magnetic field that affects the speaker (310). The noise may degrade the quality of the audio signal transmitted through the speaker (310). To reduce the noise, the printed circuit board (150) may include a fillet portion (F).

[0065] The battery (170) may be disposed next to the printed circuit board (150). The battery (170) may be disposed at the bottom of the electronic device (100) and spaced apart from the printed circuit board (150). The battery (170) may be disposed at the bottom of the electronic device (100) and may supply power to the printed circuit board (150) or electronic components (e.g., a speaker (310), a camera (320), a wireless communication circuit, a power amplifier circuit, or at least one processor) disposed on the printed circuit board (150). The battery (170) may be electrically connected to the power amplifier circuit of the wireless communication circuit through conductive patterns within the printed circuit board (150). The wireless communication circuit may require a large amount of current or power to transmit a radio frequency (RF) signal. The conductive patterns within the printed circuit board (150) may transmit a large amount of current to the electronic components disposed on the printed circuit board (150). A printed circuit board (150) may allow current to flow through some of the conductive patterns that act as ground lines. These currents may generate magnetic fields that affect electronic components. The magnetic fields generated by these currents may induce currents in coils of electronic components, such as cameras or speakers, that include coils within them. The induced currents may cause the speakers to generate audio signals with noise. To reduce or eliminate this noise, the printed circuit board (150) may include a neck portion having a fillet portion.

[0066] Referring to FIG. 4b, the printed circuit board (150) may include a plurality of non-conductive layers (401a, 401b, ... 401n), a plurality of conductive pads (411), and a plurality of conductive patterns (421a, 421b, ... 421n).

[0067] The plurality of non-conductive layers (401a, 401b, ... 401n) may be formed of a polymer material and may include an insulating material. The plurality of non-conductive layers (401a, 401b, ... 401n) may be combined with each other to provide a single substrate or base material.

[0068] The conductive pad (411) may be exposed to the outside of the printed circuit board (150). The conductive pad (411) may be placed on one of the outer layers among the plurality of non-conductive layers (401a, 401b, ... 401n). For example, the conductive pad (411) may be placed on the first non-conductive layer (401a) forming the upper layer of the printed circuit board (150).

[0069] The conductive pad (411) may be combined with a case to provide a resonance space for the shield can or speaker (310). For example, the case (316) may be disposed at the rear of the speaker (310) to provide a resonance space for audio emitted from the speaker (310). The case (316) may be disposed along the side of the speaker (310). The case (316) may be formed of a conductive material. The case (316) may be welded or bonded to the conductive pad. The case (316) may be formed of a conductive material to shield external noise or magnetic fields, but may have difficulty blocking the influence of conductive lines disposed under the boundary of the case. The case (316) may surround the rear of the speaker (310) to provide a resonance space for the speaker (310). The resonance space may be configured to emphasize the low-frequency range of the audio signal emitted from the speaker. The case (316) can generate a low-frequency audio signal by providing a resonance space. The case (316) can be coupled to the conductive pad (411). The case (316) can be sealed with the printed circuit board (150). The case (316) can reduce the audio signal generated from the speaker (310) from being transmitted to the outside by sealing the gap between the case (316) and the printed circuit board (150). For example, the case (316) that is sealed while surrounding the outside of the speaker (310) can reduce sound leakage to the outside of the case (316). A part of the case (316) can be arranged on a part of the conductive pad (411) on the printed circuit board (150) along the neck portion (351). The conductive pad (411) can be formed as a single conductive pad along the opening (352). However, it is not limited thereto and may be composed of a plurality of pads. The plurality of pads may be spaced apart from each other and arranged along the opening (352).

[0070] The printed circuit board (150) may include conductive patterns (421a, 421b, ... 421n) arranged between non-conductive layers (401a, 401b, ... 401n).

[0071] The conductive patterns (421a, 421b, ... 421n) can be arranged to avoid the opening (352) and the neck portion (351). For example, the conductive patterns (421a, 421b, ... 421n) can extend along the edge portion of the opening (352) excluding the neck portion (351).

[0072] The conductive patterns (421a, 421b, ... 421n) may include conductive lines that transmit signals or power and ground lines that are connected to a ground portion of the electronic device (100) (e.g., a conductive portion of the frame structure (140)).

[0073] The printed circuit board (150) may have conductive patterns (421a, 421b, ... 421n) that are cut off at a predetermined distance in at least a portion of the neck portion (351). For example, the printed circuit board (150) may include a fill-cut portion (F) in at least a portion of the neck portion (351). The fill-cut portion (F) may include a plurality of non-conductive layers (401a, 401b, ... 401n) and a conductive pad (411b) that is arranged on the first non-conductive layer (401a), and may not include the conductive patterns (421a, 421b, ... 421n). The fill-cut portion (F) may be a portion from which the conductive patterns (421a, 421b, ... 421n) are completely removed. The fill-cut portion (F) can separate or disconnect each of the conductive patterns arranged on the same non-conductive layer by a certain distance. Not including the conductive patterns (421a, 421b, ... 421n) can indicate that the conductive patterns (421a, 421b, ... 421n) have been removed from the fill-cut portion (F). Not including the conductive patterns (421a, 421b, ... 421n) can indicate that the conductive patterns (421a, 421b, ... 421n) are not arranged in the fill-cut portion (F).

[0074] The fill-cut portion (F) placed on the neck portion (351) of the printed circuit board (150) can limit the flow of current to the neck portion (351) by disconnecting the conductive patterns (421a, 421b, ... 421n).

[0075] By cutting a thin edge of the speaker (310) at the neck portion (351), thereby blocking the transmission path of the current transmitted to the neck portion (351), the magnetic field around the speaker (310) can be reduced, thereby reducing noise transmitted to the speaker (310). The magnetic field transmitted to the speaker (310) is proportional to the intensity or size of the current, and may be inversely proportional to the square of the distance between the speaker (310) and the current path. Reducing the distance between the speaker (310) and the current path may be difficult due to the narrow space inside the electronic device (100), so the current path can be cut off to block the current flowing around the speaker (310). The cut portion (F) configured to block the current path can reduce the magnetic field around the speaker (310) by blocking the current flowing to the neck portion. The fill-cut portion (F) of the neck (351) can reduce noise transmitted to the speaker (310) by blocking the current path.

[0076] Figures 5a, 5b, 5c, 5d and 5e are drawings exemplarily showing the arrangement of fill-cut portions of a printed circuit board.

[0077] Referring to FIG. 5A, the fill-cut portion (F) disposed on the neck portion (351) of the printed circuit board (150) may be disposed at the first point (P1). The fill-cut portion (F) may include non-conductive layers in the neck portion (351) and may represent conductive patterns excluded from the neck portion (351). However, the present invention is not limited thereto.

[0078] Referring to FIGS. 5A and 5B, the first point (P1) of the neck portion (351) may be positioned at different points (P1-1, P1-2). The neck portion (351) of the printed circuit board (150) may be a thin portion among the portions of the printed circuit board (150) that are positioned along the edge of the opening (352) for a speaker (e.g., the speaker (310) of FIG. 3). The first point (P1) may be a point corresponding to an end of the neck portion (351). The other points (P1-1, P1-2) may be one of the internal portions of the neck portion (351). The conductive patterns (421a, 421b, ... 421n) of the neck portion (351) may be removed from the fill-cut portion (F), thereby reducing the current flowing through the neck portion (351). In order to block the flow of current, the conductive patterns (421a, 421b, ... 421n) of the neck portion (351) may be disconnected by a certain distance or more. The distance or more may be a distance at which the conductive patterns (421a, 421b, ... 421n) are spaced apart and it is difficult to form a coupling.

[0079] The point where the fillet portion (F) is formed may be the point where the width of the neck section (351) is the narrowest, and the location is not limited.

[0080] Referring to FIG. 5c, fill-cut portions (F) may be formed at a plurality of points (P1, P2) of a neck portion (351) of a printed circuit board (150). The fill-cut portion (F) may include non-conductive layers in the neck portion (351) and may represent a portion excluding conductive patterns in the neck portion (351). By forming a plurality of fill-cut portions (F), even if coupling occurs in the conductive patterns (421a, 421b, 421c) in some fill-cut portions (F), current may be cut off in other fill-cut portions (F). The conductive patterns (421a, 421b, ... 421n) in the fill-cut portions (F) may be cut off by a distance greater than the predetermined distance.

[0081] The fillet portion (F) of FIGS. 5b and 5c can be arranged so as to be formed over a certain distance while maintaining rigidity.

[0082] Referring to FIG. 5d, a fill-cut portion (F) may be formed in the entire portion (P) of the neck portion (351) of the printed circuit board (150). The fill-cut portion (F) may represent a portion including non-conductive layers in the neck portion (351) and excluding conductive patterns in the neck portion (351). By forming the fill-cut portion (F) in the entire neck portion (351), the current flowing through the neck portion (351) can be reduced. In order to block the flow of current, the neck portion (351) may exclude the conductive patterns (421a, 421b, ... 421n). In a case where rigidity is maintained even when the conductive portion of the neck portion (351) of the printed circuit board (150) is removed, the fill-cut portion (F) of the entire neck portion (351) of the printed circuit board (150) may be removed.

[0083] Referring to FIG. 5e, fill-cut portions (F) may be formed at a plurality of points (P1, P2) of a neck portion (351) of a printed circuit board (150). Conductive patterns cut by the fill-cut portions (F) formed at the plurality of points (P1, P2) may be selectively connected by switches (S1, S2). For example, a first switch (S1) may be arranged at a first point (P1), and conductive patterns connected to both ends of the first switch (S1) may be selectively connected. A second switch (S2) may be arranged at a second point (P2), and conductive patterns connected to both ends of the second switch (S2) may be selectively connected. The switches (S1, S2) may be operated for tuning or impedance matching of an antenna.

[0084] Fig. 6a illustrates an example of a current path and a magnetic field caused by the current around a speaker placed on a printed circuit board that does not include a fill-cut portion. Fig. 6b illustrates an example of a current path and a magnetic field caused by the current around a speaker placed on a printed circuit board that includes a fill-cut portion.

[0085] Referring to FIGS. 6a and 6b, when current flows through electrical paths (601, 602, 602') formed by conductive patterns (421a, 421b, ... 421n) around the speaker (310), the influence of a magnetic field due to the current is shown.

[0086] The electrical path (602) flowing along the neck portion (351) causes a relatively large current to flow through the narrow neck portion (351), and a strong magnetic field may be formed. As the amount of current flowing along the electrical path (602) increases, a magnetic field may be formed around the coil inside the speaker (310) (or receiver). A current may be induced in the coil by the magnetic field formed around the coil inside the speaker (310) (or receiver). The induced current may cause an unnecessary noise signal to be generated in the speaker (310) (or receiver).

[0087] At the point (P1) where the fill-cut portion (F) formed in the neck portion (351) is formed, the electrical path (602') may be disconnected. By the disconnected electrical path (602'), the current flowing to the upper portion of the speaker (310) may be blocked or reduced. By the reduced current, the size of the magnetic field formed around the coil inside the speaker (310) may be reduced. By the reduced magnetic field, the induced current formed in the coil may be reduced or eliminated, thereby preventing or reducing noise generated in the speaker (310) (or receiver).

[0088] Figure 7 illustrates an example of the size of noise transmitted to a speaker placed on a printed circuit board including a fill-cut portion.

[0089] Referring to Figure 7, the horizontal axis represents the frequency of noise, and the unit is Hz, and the vertical axis represents the size of noise, and the unit is dBm.

[0090] Graph 710 represents the magnitude of noise generated in or transmitted to the speaker (310) when the neck section (e.g., neck section (351) of FIG. 3) does not include a fill-cut portion (e.g., fill-cut portion (F) of FIG. 3). Graph 720 represents the magnitude of noise generated in or transmitted to the speaker (310) when the neck section (e.g., neck section (351) of FIG. 3) includes a fill-cut portion (e.g., fill-cut portion (F) of FIG. 3).

[0091] Looking at graphs 710 and 720, it can be seen that the highest noise occurs in the 2000 Hz band among the audible frequency bands. Looking at graph 710, the noise level generated in the speaker (310) in the approximately 2000 Hz band can be approximately -81.5 dBm when the fill cut portion is applied. Looking at graph 720, the noise level generated in the speaker (310) in the approximately 2000 Hz band can be approximately -71 dBm when the fill cut portion is not applied.

[0092] Since the conductive patterns (421a, 421b, ... 421n) removed from the fill-cut portion prevent current from flowing to the neck portion (351), the amount of current flowing around the speaker is reduced, and thus the size of the magnetic field formed around the speaker can be reduced. Due to the reduced size of the magnetic field, the current flowing in the coil portion of the speaker can be reduced or eliminated, and thus the size of audio noise generated in the speaker (310) can be reduced.

[0093] According to the above-described embodiments, the electronic device can improve noise generated in a speaker or receiver. By reducing the current flowing around the speaker or receiver, the size of the magnetic field around the speaker or receiver can be reduced or eliminated. By reducing the noise generated by the magnetic field, the sound quality of the speaker or receiver can be improved.

[0094] The technical tasks to be achieved in this document are not limited to the technical tasks mentioned above, and other technical tasks not mentioned will be clearly understood by those with ordinary knowledge in the technical field to which this document pertains.

[0095] According to the above-described embodiment, an electronic device (e.g., the electronic device (100) of FIG. 3) may include a housing (e.g., the housing (110) of FIG. 3). The electronic device may further include a camera (e.g., the camera (320) of FIG. 3) within the housing, which is disposed at an edge of the electronic device. The electronic device may further include a speaker (e.g., the speaker (310) of FIG. 3). The speaker may be disposed next to the camera. The electronic device may further include a printed circuit board (PCB) (e.g., the printed circuit board (150) of FIG. 3). The printed circuit board may include an opening (e.g., the opening (352) of FIG. 3) in which the speaker is accommodated and a neck portion (e.g., the neck portion (351) of FIG. 3) between the speaker and the camera. The printed circuit board may include a plurality of non-conductive layers (e.g., non-conductive layers (401a, 401b, 401c, ... 401n) of FIG. 4b). The printed circuit board may include a conductive pad (e.g., a conductive pad (411) of FIG. 4b). The conductive pad may be disposed on one of the outer layers of the plurality of non-conductive layers (e.g., a first non-conductive layer (401a) of FIG. 4b). The printed circuit board may include conductive patterns (e.g., conductive patterns (421a, 421b, ... 421n) of FIG. 4b). The conductive patterns may be disposed between the non-conductive layers. A portion of the conductive pad may be disposed on the neck portion, and the conductive patterns may be disconnected from the neck portion by a certain distance.

[0096] According to the above-described embodiment, the conductive patterns can be separated or disconnected from the speaker by a certain distance, thereby reducing or eliminating the current flowing around the speaker. As the current flowing around the speaker is reduced, the magnitude of the magnetic field formed around the speaker can be reduced or eliminated. As the noise caused by the magnetic field is reduced, the quality of the audio signal from the speaker can be improved.

[0097] The above conductive patterns can extend along a portion of the edge of the opening excluding the neck portion, avoiding the opening and the neck portion.

[0098] According to the above-described embodiment, conductive patterns can be arranged along a portion excluding the neck to transmit current or signals. As the current flow around the speaker avoids the neck, the magnetic field formed around the speaker can be minimized. The minimized magnetic field can improve the quality of the speaker's audio signal.

[0099] The conductive pattern may include a conductive line that transmits a signal or power and a ground line that is connected to the ground of the electronic device.

[0100] According to the above-described embodiment, the conductive patterns can connect electronic components mounted on a printed circuit board to each other and transmit power transmitted from a battery to the electronic components.

[0101] The electronic device may further include a case (e.g., case (316) of FIG. 3) disposed along a side of the speaker and surrounding the rear of the speaker to provide a resonance space for the speaker.

[0102] According to the above-described embodiment, the case can provide a resonant space for audio signals emitted from the speaker by wrapping around the rear of the speaker.

[0103] In one embodiment, the case is coupled to the conductive pad, and the space between the printed circuit board and the case can be sealed.

[0104] The above case can prevent noise leakage of audio signals emitted from the speaker by sealing the space between the printed circuit boards. By preventing noise leakage, the size of the audio signal can be maintained and the quality of the audio signal can be improved.

[0105] In one embodiment, a portion of the case may be disposed on a portion of the conductive pad on the PCB along the neck portion.

[0106] According to the above-described embodiment, the case can be fixed on a printed circuit board by being coupled to a conductive pad.

[0107] According to one embodiment, the disconnected portion of the conductive pattern within the neck portion can be formed at a plurality of points.

[0108] According to the above-described embodiment, the conductive pattern can limit or reduce the current flowing to the neck by including a disconnected portion. This limited current or reduced current flowing to the neck can reduce the size of the magnetic field surrounding the speaker. Through this reduced magnetic field, the audio quality of the speaker can be improved.

[0109] According to one embodiment, the electronic device may further include a switch (e.g., switch (S1, S2) of FIG. 5d) disposed at a disconnected portion of the conductive pattern within the neck portion to selectively connect the conductive pattern.

[0110] According to one embodiment, the conductive pattern may be excluded from the entire portion of the neck portion. If rigidity is maintained even when the conductive portion of the neck portion of the printed circuit board is removed, the entire fill-cut portion of the neck portion of the printed circuit board may be removed. According to the above-described embodiment, the neck portion includes a fill-cut portion from which the conductive pattern is removed, thereby limiting or reducing the current flowing to the neck portion. The limited current or the reduced current flowing to the neck portion may reduce the magnitude of the magnetic field around the speaker. Through the reduced magnitude of the magnetic field, the audio quality of the speaker may be improved.

[0111] In one embodiment, the camera may be positioned between the PCB and a side wall of the electronic device. The speaker may be a receiver that transmits an audio signal received through communication with an external electronic device.

[0112] According to the above-described embodiment, the speaker of the electronic device may be placed on a printed circuit board, which is a receiver, and which is disposed above the printed circuit board. The printed circuit board may be connected to a wireless communication circuit, and a power amplifier circuit may be disposed thereon. Since the current transmitted to the power amplifier circuit or transmitted through the power amplifier circuit is large, noise may be transmitted to the speaker. The fill-cut portion formed on the neck portion may reduce noise around the speaker by disconnecting the conductive pattern and limiting the current flowing to the neck portion.

[0113] According to one embodiment, the width of the neck portion may be the smallest among the widths of the PCB disposed at the edge of the speaker.

[0114] According to the above-described embodiment, the neck portion has the narrowest width among the widths of the printed circuit boards arranged at the edge of the speaker, thereby maintaining rigidity even when forming a fill-cut portion. Even when conductive portions (e.g., conductive patterns) are removed, the rigidity of the printed circuit board can be maintained.

[0115] According to one embodiment, the printed circuit board can limit current supplied to the printed circuit board from flowing to the neck portion.

[0116] According to the above-described embodiment, the printed circuit board can reduce the magnitude of the magnetic field affecting the speaker by limiting the current transmitted to the speaker terminal. As the magnetic field affecting the speaker is reduced, the current flowing in the coil inside the speaker is reduced, thereby reducing noise from the speaker.

[0117] According to one embodiment, the PCB may further include at least one processor disposed thereon and operatively connected to the speaker and the camera.

[0118] According to one embodiment, the electronic device may further include a wireless communication circuit and a battery within the housing.

[0119] The above battery can be electrically connected to a power amplifier circuit of the wireless communication circuit through the conductive pattern in the PCB.

[0120] According to the above-described embodiment, the printed circuit board may be connected to a wireless communication circuit and may have a power amplifier circuit arranged thereon. Because the current transmitted to the power amplifier circuit or through the power amplifier circuit is large, noise may be transmitted to the speaker. The fill-cut portion formed at the neck portion disconnects the conductive pattern, thereby limiting the current flowing to the neck portion, thereby reducing noise around the speaker.

[0121] An antenna connected to the above wireless communication circuit may be positioned toward a side wall of the electronic device.

[0122] An electronic device (e.g., an electronic device (100) of FIG. 3) may further include a first electronic component (e.g., a speaker (310) of FIG. 3). The electronic device may further include a second electronic component (e.g., a camera (320) of FIG. 3). The first electronic component may be placed next to the second electronic component.

[0123] . The electronic device may further include a printed circuit board (PCB) (e.g., a printed circuit board (150) of FIG. 3). The printed circuit board may include an opening (e.g., an opening (352) of FIG. 3) in which the first electronic component is accommodated and a connecting portion (e.g., a connecting portion (351) of FIG. 3) between the first electronic component and the second electronic component. The printed circuit board may include a plurality of non-conductive layers (e.g., non-conductive layers (401a, 401b, 401c, ... 401n) of FIG. 4b). The printed circuit board may include a conductive pad (e.g., a conductive pad (411) of FIG. 4b). The conductive pad may be disposed on one of the outer layers of the plurality of non-conductive layers (e.g., a first non-conductive layer (401a) of FIG. 4b). The printed circuit board may include conductive patterns (e.g., conductive patterns (421a, 421b, ... 421n) of FIG. 4b). The conductive patterns may be disposed between the non-conductive layers. A portion of the conductive pad may be disposed on the neck portion, and the conductive patterns may be disconnected from the neck portion by a predetermined distance.

[0124] According to the above-described embodiment, the conductive patterns can be separated or disconnected from the speaker by a certain distance, thereby reducing or eliminating the current flowing around the speaker. As the current flowing around the speaker is reduced, the magnitude of the magnetic field formed around the speaker can be reduced or eliminated. As the noise caused by the magnetic field is reduced, the quality of the audio signal from the speaker can be improved.

[0125] The above conductive patterns can extend along a portion of the edge of the opening excluding the neck portion, avoiding the opening and the neck portion.

[0126] According to the above-described embodiment, conductive patterns can be arranged along a portion excluding the neck to transmit current or signals. As the current flow around the speaker avoids the neck, the magnetic field formed around the speaker can be minimized. The minimized magnetic field can improve the quality of the speaker's audio signal.

[0127] The conductive pattern may include a conductive line that transmits a signal or power and a ground line that is connected to the ground of the electronic device.

[0128] According to the above-described embodiment, the conductive patterns can connect electronic components mounted on a printed circuit board to each other and transmit power transmitted from a battery to the electronic components.

[0129] The electronic device may further include a case (e.g., case (316) of FIG. 3) disposed along a side of the first electronic component, which is a speaker, and surrounding a rear surface of the speaker to provide a resonance space for the speaker.

[0130] According to the above-described embodiment, the case can provide a resonant space for an audio signal emitted from the speaker by wrapping the rear surface of the first electronic component, which is a speaker.

[0131] In one embodiment, the case is coupled to the conductive pad, and the space (or gap) between the printed circuit board and the case can be sealed.

[0132] The above case can prevent noise leakage of audio signals emitted from the speaker by sealing the space between the printed circuit boards. By preventing noise leakage, the size of the audio signal can be maintained and the quality of the audio signal can be improved.

[0133] The effects that can be obtained from the present disclosure are not limited to the effects mentioned above, and other effects that are not mentioned will be clearly understood by a person having ordinary skill in the art to which the present disclosure pertains.

[0134] FIG. 8 is a block diagram of an electronic device within a network environment according to various embodiments.

[0135] FIG. 8 is a block diagram of an electronic device (801) within a network environment (800) according to various embodiments. Referring to FIG. 8, in the network environment (800), the electronic device (801) may communicate with the electronic device (802) via a first network (898) (e.g., a short-range wireless communication network), or may communicate with at least one of the electronic device (804) or the server (808) via a second network (899) (e.g., a long-range wireless communication network). In one embodiment, the electronic device (801) may communicate with the electronic device (804) via the server (808). According to one embodiment, the electronic device (801) may include a processor (820), a memory (830), an input module (850), an audio output module (855), a display module (860), an audio module (870), a sensor module (876), an interface (877), a connection terminal (878), a haptic module (879), a camera module (880), a power management module (888), a battery (889), a communication module (890), a subscriber identification module (896), or an antenna module (897). In some embodiments, the electronic device (801) may omit at least one of these components (e.g., the connection terminal (878)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (876), the camera module (880), or the antenna module (897)) may be integrated into one component (e.g., the display module (860)).

[0136] The processor (820) may, for example, execute software (e.g., a program (840)) to control at least one other component (e.g., a hardware or software component) of the electronic device (801) connected to the processor (820) and perform various data processing or operations. According to one embodiment, as at least a part of the data processing or operations, the processor (820) may store commands or data received from other components (e.g., a sensor module (876) or a communication module (890)) in a volatile memory (832), process the commands or data stored in the volatile memory (832), and store result data in a non-volatile memory (834). According to one embodiment, the processor (820) may include a main processor (821) (e.g., a central processing unit or an application processor) or an auxiliary processor (823) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together with the main processor (821). For example, when the electronic device (801) includes the main processor (821) and the auxiliary processor (823), the auxiliary processor (823) may be configured to use less power than the main processor (821) or to be specialized for a given function. The auxiliary processor (823) may be implemented separately from the main processor (821) or as a part thereof.

[0137] The auxiliary processor (823) may control at least a portion of functions or states associated with at least one component (e.g., a display module (860), a sensor module (876), or a communication module (890)) of the electronic device (801), for example, on behalf of the main processor (821) while the main processor (821) is in an inactive (e.g., sleep) state, or together with the main processor (821) while the main processor (821) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (823) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (880) or a communication module (890)). In one embodiment, the auxiliary processor (823) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (801) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (808)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0138] The memory (830) can store various data used by at least one component (e.g., the processor (820) or the sensor module (876)) of the electronic device (801). The data can include, for example, software (e.g., the program (840)) and input data or output data for commands related thereto. The memory (830) can include volatile memory (832) or non-volatile memory (834).

[0139] The program (840) may be stored as software in the memory (830) and may include, for example, an operating system (842), middleware (844), or an application (846).

[0140] The input module (850) can receive commands or data to be used in a component of the electronic device (801) (e.g., a processor (820)) from an external source (e.g., a user) of the electronic device (801). The input module (850) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0141] The audio output module (855) can output audio signals to the outside of the electronic device (801). The audio output module (855) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0142] The display module (860) can visually provide information to an external party (e.g., a user) of the electronic device (801). The display module (860) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. In one embodiment, the display module (860) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0143] The audio module (870) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (870) can acquire sound through the input module (850), output sound through the sound output module (855), or an external electronic device (e.g., electronic device (802)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (801).

[0144] The sensor module (876) can detect the operating status (e.g., power or temperature) of the electronic device (801) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (876) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0145] The interface (877) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (801) with an external electronic device (e.g., the electronic device (802)). In one embodiment, the interface (877) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0146] The connection terminal (878) may include a connector through which the electronic device (801) may be physically connected to an external electronic device (e.g., the electronic device (802)). In one embodiment, the connection terminal (878) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0147] The haptic module (879) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one embodiment, the haptic module (879) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0148] The camera module (880) can capture still images and videos. According to one embodiment, the camera module (880) may include one or more lenses, image sensors, image signal processors, or flashes.

[0149] The power management module (888) can manage the power supplied to the electronic device (801). According to one embodiment, the power management module (888) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0150] A battery (889) may power at least one component of the electronic device (801). In one embodiment, the battery (889) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0151] The communication module (890) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (801) and an external electronic device (e.g., electronic device (802), electronic device (804), or server (808)), and the performance of communication through the established communication channel. The communication module (890) may operate independently from the processor (820) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (890) may include a wireless communication module (892) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (894) (e.g., a local area network (LAN) communication module, or a power line communication module). Any of these communication modules may communicate with an external electronic device (804) via a first network (898) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (899) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules may be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (892) may use subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (896) to verify or authenticate the electronic device (801) within a communication network such as the first network (898) or the second network (899).

[0152] The wireless communication module (892) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimizing terminal power and connecting multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (892) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (892) may support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (892) may support various requirements specified in the electronic device (801), an external electronic device (e.g., the electronic device (804)), or a network system (e.g., the second network (899)). According to one embodiment, the wireless communication module (892) may support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0153] The antenna module (897) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (897) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (897) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (898) or the second network (899), may be selected from the plurality of antennas by, for example, the communication module (890). A signal or power may be transmitted or received between the communication module (890) and an external electronic device via the selected at least one antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (897).

[0154] According to various embodiments, the antenna module (897) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high frequency band.

[0155] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0156] According to one embodiment, commands or data may be transmitted or received between the electronic device (801) and an external electronic device (804) via a server (808) connected to a second network (899). Each of the external electronic devices (802 or 804) may be the same or a different type of device as the electronic device (801). According to one embodiment, all or part of the operations executed in the electronic device (801) may be executed in one or more of the external electronic devices (802, 804, or 808). For example, when the electronic device (801) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (801) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (801). The electronic device (801) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (801) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (804) may include an Internet of Things (IoT) device. The server (808) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (804) or the server (808) may be included in the second network (899).The electronic device (801) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0157] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to the embodiments of this document are not limited to the aforementioned devices.

[0158] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0159] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0160] Various embodiments of the present document may be implemented as software (e.g., a program (840)) including one or more instructions stored in a storage medium (e.g., an internal memory (836) or an external memory (838)) readable by a machine (e.g., an electronic device (801)). For example, a processor (e.g., a processor (820)) of the machine (e.g., an electronic device (801)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0161] According to one embodiment, the method according to various embodiments disclosed in this document may be provided as included in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) via an application store (e.g., Play Store™) or directly between two user devices (e.g., smart phones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0162] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

Claims

1. In electronic devices, housing; A camera within the housing disposed at the edge of the electronic device; a speaker placed next to the above camera; and A PCB (printed circuit board) including an opening in which the speaker is accommodated and a neck portion between the speaker and the camera, The above PCB is, Multiple non-conductive layers, A conductive pad arranged on one of the outer layers of the plurality of non-conductive layers, and Containing conductive patterns disposed between the above non-conductive layers, Some of the above-mentioned conductive pads are, It is placed on the above neck, The challenging patterns are, Disconnected at a certain distance from the above-mentioned neck, Electronic devices.

2. In paragraph 1, The above challenging patterns are: Avoiding the above opening and the above neck part, extending along the edge part of the above opening excluding the neck part Electronic devices.

3. In paragraph 1 or 2, The above challenging patterns are: Conductive lines that transmit signals or power, and Including a ground line connected to the ground of the electronic device, Electronic devices.

4. In any one of paragraphs 1 to 3, Further comprising a case disposed along the side of the speaker and surrounding the rear of the speaker to provide a resonance space for the speaker. Electronic devices.

5. In paragraph 4, The above case is, is coupled to the above conductive pad, The space between the PCB and the case is sealed, Electronic devices.

6. In paragraph 4, Some of the above cases are, Placed on a part of the conductive pad on the PCB along the above-mentioned neck section, Electronic devices.

7. In any one of paragraphs 1 to 6, The part where the conductive patterns within the above-mentioned neck are disconnected is Formed at multiple points, Electronic devices.

8. In any one of paragraphs 1 to 7, Further comprising a switch disposed in a disconnected portion of the conductive patterns within the neck portion to selectively connect the conductive patterns. Electronic devices.

9. In any one of paragraphs 1 to 8, The above challenging patterns are: Excluding the entire part of the above-mentioned neck, Electronic devices.

10. In any one of paragraphs 1 to 9, The above camera is disposed between the PCB and the side wall of the electronic device, The above speaker, A receiver that transmits audio signals received through communication with an external electronic device. Electronic devices.

11. In any one of paragraphs 1 to 10, The width of the above neck section is The smallest of the widths of the PCB placed on the edge of the speaker, Electronic devices.

12. In any one of paragraphs 1 to 11, The above PCB is, Limiting the current supplied to the above PCB from flowing to the above-mentioned neck section, Electronic devices.

13. In any one of paragraphs 1 to 12, further comprising at least one processor disposed on the PCB and operatively connected to the speaker and the camera; Electronic devices.

14. In any one of paragraphs 1 to 13, wireless communication circuit; and Further comprising a battery disposed within the housing, The above battery, Through the conductive patterns in the PCB, electrically connected to the power amplifier circuit of the wireless communication circuit, Electronic devices.

15. In any one of paragraphs 1 to 14, An antenna connected to the above wireless communication circuit, Positioned toward the side wall of the electronic device, Electronic devices.

Images