Substrate processing apparatus

Abstract

The disclosed substrate processing apparatus comprises: a chuck table on which a substrate assembly is supported, the substrate assembly having a substrate and a ring frame that is arranged to surround the substrate and supports the substrate; and a ring frame pressurizing unit that presses the ring frame in a direction in which a bend of the substrate is straightened when the substrate assembly is supported on the chuck table.

Description

Substrate processing equipment

[0001] The present invention relates to a substrate processing device, and more specifically, to a substrate processing device that stably places a substrate on a chuck table.

[0002] Typically, semiconductor manufacturing processes involve an etching process for etching substrates such as wafers, a singulation process for cutting the substrate into multiple dies, and a cleaning process for cleaning the substrate. Substrate processing equipment is used in the substrate etching and cleaning processes.

[0003] A substrate processing device includes a chuck table that rotates by absorbing a substrate, and a transfer robot that transfers the substrate to the chuck table. A processing liquid for processing the substrate is supplied to the substrate while the substrate rotates on the chuck table.

[0004] However, in conventional substrate processing equipment, due to warpage of the substrate or warping of the ring frame that supports the substrate using adhesive tape, the substrate may not be stably placed on the chuck table despite the chuck table's suction force, which may cause problems such as poor work performance or reduced work productivity.

[0005] The present invention was created to improve the above-mentioned problems, and the purpose of the present invention is to provide a substrate processing device in which a substrate is stably placed on a chuck table despite warpage of the substrate or ring frame.

[0006] The substrate processing device of the present invention comprises: a chuck table on which a substrate assembly is supported, the substrate assembly having a ring frame arranged to surround the substrate and supporting the substrate; and a ring frame pressurizing unit that presses the ring frame in a direction in which the bending of the substrate is straightened.

[0007] The above substrate processing device further includes a transfer arranged outside the chuck table and raised and lowered relative to the chuck table; and the ring frame pressurizing unit may be provided on the transfer.

[0008] The above transfers are provided in a pair, and the pair of transfers can be arranged to face each other with the chuck table between them.

[0009] The substrate processing device may further include a substrate transfer robot that supports the substrate assembly and moves it to a point aligned with the chuck table through a pair of transfers.

[0010] The above substrate processing device further includes a ring frame support portion that is positioned below the ring frame pressurizing portion and supports the ring frame; and a gap between the ring frame pressurizing portion and the ring frame support portion may be greater than a thickness of the ring frame.

[0011] The above substrate processing device further includes a ring frame support portion that is positioned below the ring frame pressurizing portion and supports the ring frame; and the ring frame support portion may include an adsorption portion to which the ring frame is adsorbed.

[0012] The above substrate processing device further includes a ring frame support portion that is positioned below the ring frame pressurizing portion and supports the ring frame, and the ring frame pressurizing portion can move horizontally with respect to the ring frame support portion.

[0013] The substrate processing device further includes a ring frame support portion that is positioned below the ring frame pressurizing portion and supports the ring frame; the chuck table may include a substrate support portion that supports the substrate assembly and has a negative pressure formed on a surface so that the substrate assembly is adsorbed, and an avoidance portion that is concavely formed to avoid collision with the ring frame support portion.

[0014] The substrate processing device further includes a ring frame support portion that is disposed below the ring frame pressurizing portion and supports the ring frame, and the ring frame pressurizing portion and the ring frame support portion are lowered toward the chuck table while the ring frame is supported by the ring frame support portion, so that the substrate assembly is supported by the chuck table, and the ring frame pressurizing portion and the ring frame support portion are further lowered so that the ring frame support portion is spaced from the ring frame, and the ring frame pressurizing portion can press the ring frame downward.

[0015] The above ring frame pressurizing unit may include a rotation lever that rotates (pivots) while the substrate assembly is supported on the chuck table to pressurize the ring frame toward the chuck table.

[0016] The above ring frame pressurizing portion may further include a trigger capable of linear movement in a direction parallel to the substrate assembly, a cam portion connecting the trigger and the rotary lever so that the linear movement of the trigger is converted into a rotational (pivot) movement of the rotary lever, and a pressurizing roller connected to the rotary lever to press the ring frame downward.

[0017] The ring frame pressurizing portion further includes a trigger that can move linearly in a direction parallel to the substrate assembly, wherein the ring frame is supported by the ring frame support portion, and the ring frame pressurizing portion and the ring frame support portion are lowered toward the chuck table so that the substrate assembly is supported by the chuck table, and the trigger can move linearly in one direction so that the rotary lever can pivot to press the ring frame downward.

[0018] The substrate processing device may further include a substrate transfer robot that supports and moves the substrate assembly so that the substrate assembly is supported on the chuck table.

[0019] The chuck table may include a plurality of support pins protruding from a surface of the chuck table to support the substrate assembly.

[0020] The ring frame pressurizing portion is located above the chuck table, and when the substrate assembly is supported on the chuck table, the substrate transfer robot moves away from the substrate assembly and the chuck table, and the chuck table rises toward the ring frame pressurizing portion so that the ring frame can be pressed downward by the ring frame pressurizing portion.

[0021] The above ring frame may include a magnetic body, and the ring frame pressurizing portion may include an electromagnet that generates a magnetic force that pulls the ring frame by supplying electric energy.

[0022] The above ring frame pressurizing portion supports the ring frame from above the ring frame by the magnetic force so that the ring frame does not fall, and the ring frame pressurizing portion is lowered toward the chuck table while the ring frame is supported by the ring frame pressurizing portion so that the substrate assembly is supported by the chuck table, and the ring frame pressurizing portion can further be lowered to press the ring frame downward.

[0023] The above ring frame pressurizing portion supports the ring frame from below the ring frame, and the ring frame pressurizing portion is lowered toward the chuck table while the ring frame is supported by the ring frame pressurizing portion, so that the substrate assembly is supported by the chuck table, and the ring frame pressurizing portion is further lowered and pulls the ring frame downward with the magnetic force so that the ring frame can be unfolded.

[0024] The substrate processing device of the present invention includes a ring frame pressurizing unit that pressurizes the ring frame of the substrate assembly in a direction that smooths out warpage. Accordingly, even in the case of a substrate assembly with warpage in the ring frame or the substrate, the ring frame or the substrate can be stably mounted on the chuck table, thereby improving the quality and productivity of substrate processing operations such as singulation, etching, and cleaning, reducing the rate of work failure, and reducing work costs.

[0025] FIG. 1 is a plan view showing the configuration of a substrate processing device according to a first embodiment of the present invention.

[0026] Figure 2 is a perspective view illustrating the transfer of Figure 1.

[0027] FIG. 3 is a plan view of a substrate processing device according to a first embodiment of the present invention, showing a substrate assembly moved to a position between a chuck table and a pair of transfers.

[0028] FIG. 4 is a front view of a substrate processing device according to a first embodiment of the present invention, showing a state in which a substrate assembly is lowered so as to be supported on a chuck table.

[0029] Figure 5 is an enlarged view of a portion corresponding to portion A of Figure 4, showing the transfer lowered so that the ring frame pressurizing portion touches the ring frame.

[0030] Fig. 6 is a drawing showing a state in which the transfer is lowered further than the position in Fig. 5 so that the ring frame pressurizing portion presses and expands the ring frame.

[0031] FIG. 7 is a plan view of a substrate processing device according to a second embodiment of the present invention, showing a substrate assembly being lowered so as to be supported by a pair of transfers and placed on a chuck table.

[0032] Fig. 8 is a cross-sectional view of Fig. 7 taken along line VIII-VIII.

[0033] Fig. 9 is a cross-sectional view showing the ring frame pressurizing part of Fig. 8 rotated to pressurize and expand the ring frame.

[0034] FIG. 10 is a plan view of a substrate processing device according to a third embodiment of the present invention, showing a substrate assembly placed on a chuck table.

[0035] Fig. 11 is a perspective view illustrating the transfer of Fig. 10.

[0036] Figure 12 is a front view showing the chuck table of Figure 10 and the substrate assembly supported on the chuck table.

[0037] Figure 13 is an enlarged view of a portion corresponding to portion B of Figure 12, showing the chuck table raised so that the ring frame is pressed against the ring frame pressurizing portion and spread.

[0038] FIG. 14 is a plan view of a substrate processing device according to a fourth embodiment of the present invention, showing a substrate assembly attached and supported to a ring frame pressurizing portion on a chuck table.

[0039] Fig. 15 is a perspective view illustrating the transfer of Fig. 14.

[0040] Figure 16 is a drawing showing the ring frame pressurizing part of Figure 15 pressing down and unfolding the ring frame supported on the chuck table.

[0041] Figure 17 is a drawing showing the ring frame pressurizing part of Figure 15 pulling the ring frame downward with magnetic force, thereby unfolding the ring frame.

[0042] Hereinafter, a substrate processing device according to an embodiment of the present invention will be described in detail with reference to the attached drawings. The terminology used in this specification is intended to adequately express preferred embodiments of the present invention and may vary depending on the intent of the user or operator, or the customary practices in the field to which the present invention pertains. Therefore, the definitions of these terms should be based on the contents throughout this specification.

[0043] FIG. 1 is a plan view showing the configuration of a substrate processing apparatus according to a first embodiment of the present invention, FIG. 2 is a perspective view showing the transfer of FIG. 1, FIG. 3 is a plan view of the substrate processing apparatus according to the first embodiment of the present invention, and is a drawing showing a state in which a substrate assembly has moved to a position on a chuck table and between a pair of transfers, FIG. 4 is a front view of the substrate processing apparatus according to the first embodiment of the present invention, and is a drawing showing a state in which the substrate assembly has been lowered so as to be supported by the chuck table, FIG. 5 is an enlarged view of a portion corresponding to part A of FIG. 4, and is a drawing showing a state in which the transfer has been lowered so that a ring frame pressurizing portion contacts the ring frame, and FIG. 6 is a drawing showing a state in which the transfer has been lowered further than the position of FIG. 5 so that the ring frame pressurizing portion presses and spreads the ring frame.

[0044] Referring to FIGS. 1 to 6, a substrate processing device (10) according to a first embodiment of the present invention includes a chuck table (60) and a ring frame pressurizing unit (120). A substrate assembly (1) is supported on the chuck table (60). The substrate assembly (1) includes a substrate (2) and a ring frame (5).

[0045] The substrate (2) may be, for example, a wafer made of silicon. The ring frame (5) is arranged to surround the substrate (2). The ring frame (5) is arranged to be spaced apart from the substrate (2). The ring frame (5) supports the substrate (2).

[0046] For example, the substrate assembly (1) further includes an adhesive tape (8), and the ring frame (5) can support the substrate (2) via the adhesive tape (8). The adhesive tape (8) adhesively supports the lower surface of the substrate (2) and the lower surface of the ring frame (5). The adhesive tape (8) can be flexibly bent and has a roughly circular flat shape.

[0047] The ring frame (5) is adhered to the outer periphery of the adhesive tape (8) to prevent the adhesive tape (8) from being wrinkled or crumpled. The adhesive tape (8) may have a substrate adhesive portion for adhesively supporting the substrate (2), a ring frame adhesive portion for adhesively supporting the ring frame (5), and a connecting portion for connecting the substrate adhesive portion and the ring frame adhesive portion.

[0048] The chuck table (60) may include a substrate support (63) and a avoidance portion (65). The substrate support (63) supports a substrate assembly (1). A negative pressure may be formed on the surface of the substrate support (63) so that the substrate assembly (1) is adsorbed. In a state where the substrate assembly (1) is stably supported on the substrate support (63) without slipping or being separated from the substrate support (63), a substrate processing operation, such as singulation, etching, or cleaning, may be performed. When the substrate processing operation is performed, the chuck table (60) may rotate around a vertical rotation axis (RX).

[0049] The avoidance portion (65) may be a concave portion that is formed downward to avoid collision with the ring frame support portion (110) to be described later. The avoidance portion (65) may be formed to be stepped from the substrate support portion (63). The substrate support portion (63) may be provided at the center of the chuck table (60), and the avoidance portion (65) may be provided at the outer peripheral portion of the chuck table (60). In the embodiment illustrated in FIG. 1, the avoidance portion (65) has a circular planar shape, but alternatively, the avoidance portion may be a groove that has a concave planar shape only in an area that can avoid the ring frame support portion (110).

[0050] In contrast, in another embodiment, the chuck table (60) may not be provided with a avoidance member (65) and may only include a substrate support member (63).

[0051] The ring frame pressurizing unit (120) presses the ring frame (5) in a direction in which the warpage of the substrate (2) is straightened when the substrate assembly (1) is supported on the chuck table (60). The substrate processing device (10) may further include a transfer (100).

[0052] The transfer (100) is placed outside the chuck table (60) and can be raised and lowered relative to the chuck table (60). The transfer (100) may include a body part (101) and an elevation drive part (105) that raises and lowers the body part (101).

[0053] A ring frame pressurizing portion (120) may be provided in the transfer (100). The ring frame pressurizing portion (120) may include a neck portion (121) that protrudes horizontally from the body portion (101), and a curved extension portion (124) that is connected to the neck portion (121) and extends in a curved path so as to be able to overlap with the ring frame (5) up and down. With reference to FIGS. 1 to 3, the neck portion (121) extends parallel to the X-axis.

[0054] The substrate processing device (10) may further include a ring frame support (110). The ring frame support (110) may be positioned below the ring frame pressurizing portion (120) to support the ring frame (5). The ring frame support (110) may be provided in the transfer (100). The ring frame support (110) may protrude and extend horizontally from the body portion (101). With reference to FIGS. 1 to 3, the ring frame support (110) extends parallel to the X-axis.

[0055] The ring frame support (110) and the neck (121) may extend in parallel. The ring frame support (110) may include an adsorption portion to which the ring frame (5) is adsorbed at an end far from the body (101). The adsorption portion may include an adsorption pad (112). As illustrated in FIGS. 5 and 6, the gap (D1) between the ring frame pressurizing portion (120) and the ring frame support (110) may be greater than the thickness of the ring frame (5).

[0056] The ring frame support member (110) can move horizontally with respect to the body member (101), specifically, in the longitudinal direction of the ring frame support member (110). The ring frame pressurizing member (120) can move together with the ring frame support member (110) when the ring frame support member (110) moves horizontally. For example, the ring frame pressurizing member (120) can move in the same direction as the direction in which the ring frame support member (110) moves with respect to the body member (101), and by the same distance as the distance in which the ring frame support member (110) moves.

[0057] The ring frame pressurizing portion (120) can move horizontally with respect to the ring frame support portion (110). For example, when the ring frame support portion (110) moves horizontally in a direction protruding from the body portion (101) to support the ring frame (5), the ring frame pressurizing portion (120) moves horizontally together with the ring frame support portion (110) in a direction protruding from the body portion (101). In other words, with reference to FIGS. 1 to 3, the ring frame pressurizing portion (120) moves parallel to the X-axis.

[0058] After the ring frame (5) is supported on the ring frame support member (110), and the ring frame support member (110) does not move in the horizontal direction, the ring frame pressurizing member (120) can additionally move in the direction protruding from the body member (101) to press the ring frame (5) downward.

[0059] The transfer (100) may be provided as a pair. Accordingly, the ring frame support portion (110) and the ring frame pressurizing portion (120) provided in the transfer (100) may also be provided as a pair each. As illustrated in FIGS. 1, 3, and 4, the pair of transfers (100) may be arranged to face each other with the chuck table (60) interposed therebetween. In other words, the pair of ring frame support portions (110) and the pair of ring frame pressurizing portions (120) may be arranged to face each other with the chuck table (60) interposed therebetween.

[0060] The substrate processing device (10) may further include a substrate transfer robot (50) that supports the substrate assembly (1) and moves the substrate assembly (1). The substrate transfer robot (50) may include a plurality of fingers (52) that are spaced apart from each other and extend in parallel at the same height. The substrate transfer robot (50) may move the substrate assembly (1) to a point aligned vertically with a chuck table (60) between a pair of transfers (100).

[0061] The process of supporting a substrate assembly (1) on a chuck table (60) without slipping or shaking using a substrate transfer device (10) is as follows. First, a pair of ring frame support parts (110) are horizontally protruded from the body part (101) so that the ends (112) of the pair of ring frame support parts (110) are aligned vertically with the avoidance part (65) of the chuck table (60).

[0062] At this time, a pair of ring frame pressurizing parts (120) move in a direction protruding from the body part (101) together with a pair of ring frame support parts (110), but may not be aligned vertically with the avoidance part (65) of the chuck table (60) as shown in FIG. 1.

[0063] Next, as shown in FIGS. 1 and 3, the substrate transfer robot (50) enters between a pair of ring frame supports (110) while supporting the substrate assembly (1) on a plurality of fingers (52) and aligns the substrate assembly (1) vertically with the chuck table (60). With reference to FIG. 3, the substrate transfer robot (50) can enter by moving in the Y-axis (-) direction while supporting the substrate assembly (1).

[0064] The substrate transfer robot (50) can move the substrate assembly (1) so that the substrate assembly (1) is positioned higher than the height of a pair of ring frame supports (110).

[0065] At this time, the width (FD) of the substrate transfer robot (50), for example, the maximum distance between multiple fingers (52), is smaller than the gap (SD) between a pair of ring frame supports (110), so the substrate transfer robot (50) and the ring frame support (110) may not collide.

[0066] Next, when the substrate transfer robot (50) descends, i.e., moves in the negative (-) direction of the Z-axis, the ring frame (5) is supported on a pair of ring frame supports (110) and the substrate transfer robot (50) can be separated from the substrate assembly (1). The substrate transfer robot (50) separated from the substrate assembly (1) can move in the positive (+) direction of the Y-axis to a standby position where it does not overlap with the chuck table (60).

[0067] Next, a pair of ring frame pressurizing parts (120) move horizontally in a direction in which they additionally protrude from the body part (101) so as to overlap with the ring frame (5) from above the ring frame (5).

[0068] Next, a pair of transfers (100) descend. Specifically, the body part (101) of the transfer (100) moves in the negative (-) direction of the Z-axis and descends. As a result, as shown in FIGS. 4 and 5, the ring frame (5) is supported by a pair of ring frame support parts (110), and the pair of ring frame pressurizing parts (120) and the pair of ring frame support parts (110) descend toward the chuck table (60), so that the substrate assembly (1) can be supported by the substrate support part (63) of the chuck table (60).

[0069] A vacuum pump (not shown) may be operated to form a negative pressure on the substrate support (63) of the chuck table (60) while a pair of transfers (100) are descending.

[0070] Next, a pair of transfers (100) additionally move in the negative (-) direction of the Z-axis and descend. As a result, as shown in FIG. 6, a pair of ring frame pressurizing parts (120) and a pair of ring frame support parts (110) additionally descend, so that a pair of ring frame support parts (110) are spaced apart from the ring frame (5), and a pair of ring frame pressurizing parts (120) press the ring frame (5) downward.

[0071] When the size of the negative pressure of the substrate support (63) is within the range of the reference pressure, it is determined that the substrate assembly (1) is stably supported by the substrate support (63), and a pair of ring frame support parts (110) and a pair of ring frame pressurizing parts (120) move in the direction of insertion into the corresponding body part (101), and a pair of transfers (100) can be moved up and down to a standby position that does not interfere with the substrate processing operation on the chuck table (60).

[0072] Next, a scheduled substrate processing process can be performed on the substrate (2) of the substrate assembly (1) stably supported on the substrate support member (63) of the chuck table (60).

[0073] The substrate processing device (10) described above has a ring frame pressurizing unit (120) that presses the ring frame (5) of the substrate assembly (1) in a direction in which the bend is straightened. Therefore, even in the case of a substrate assembly (1) in which the ring frame (5) or the substrate (2) has a bend, the ring frame (5) or the substrate (2) can be stably seated on the chuck table (60), so that the quality and work productivity of substrate processing operations such as singulation, etching, and cleaning can be improved, the work defect rate can be reduced, and the work cost can be reduced.

[0074] The ring frame pressurizing portion (120) illustrated in FIGS. 5 and 6 presses the ring frame (5) so that the bending of the ring frame (5) is straightened by the ring frame pressurizing portion (120) pressing the outer peripheral end (6) of the ring frame (5) downward when the substrate assembly (1) is convexly bent downward.

[0075] Meanwhile, when the substrate assembly (1) is convexly bent upward, the substrate assembly (1) can be straightened by pulling the central portion of the substrate assembly (1) spaced apart from the substrate support (63) in the direction of attachment to the substrate support (63) by the negative pressure formed in the substrate support (63) when the substrate assembly (1) is supported on the substrate support (63).

[0076] FIG. 7 is a plan view of a substrate processing device according to a second embodiment of the present invention, and is a drawing showing a state in which a substrate assembly is lowered to be placed on a chuck table while being supported by a pair of transfers, FIG. 8 is a cross-sectional view taken along line VIII-VIII of FIG. 7, and FIG. 9 is a cross-sectional view showing a state in which the ring frame pressing part of FIG. 8 is rotated so that the ring frame pressing part presses and unfolds the ring frame.

[0077] As in the case of the substrate processing device according to the first embodiment of the present invention described with reference to FIGS. 1 to 6, in the case of the second embodiment of the present invention illustrated in FIGS. 7 to 9, the direction in which the ring frame pressurizing unit moves horizontally may be a direction parallel to the X-axis, the direction in which the ring frame, the ring frame pressurizing unit, and the transfer are raised and lowered may be a direction parallel to the Z-axis, and the direction in which the substrate transfer robot moves horizontally to intersect the X-axis may be a direction parallel to the Y-axis.

[0078] Referring to FIGS. 7 to 9, a substrate processing device (20) according to a second embodiment of the present invention may include a substrate transfer robot (50) (see FIG. 1), a chuck table (60), a transfer (200), a ring frame support (210), and a ring frame pressurizing device (220). The substrate transfer robot (50) and the chuck table (60) are the same as the substrate transfer robot (50) and the chuck table (60) included in the substrate processing device (10) according to the first embodiment of the present invention described with reference to FIGS. 1 to 6, and are indicated by the same reference numerals, so redundant mention will be omitted.

[0079] The substrate processing device (20) may include a pair of transfers (200). The pair of transfers (200) are arranged outside the chuck table (60) and are capable of being elevated relative to the chuck table (60). Each transfer (200) may include a body part (201) and an elevation drive part (not shown) for elevating the body part (201).

[0080] Each transfer (200) may further include one ring frame support member (210) and multiple ring frame pressurization members (220). As illustrated in FIG. 7, a pair of transfers (200) may be arranged to face each other with a chuck table (60) therebetween. In other words, a pair of ring frame support members (210) and multiple pairs of ring frame pressurization members (220) may be arranged to face each other with a chuck table (60) therebetween.

[0081] The ring frame support member (210) can be positioned below the ring frame pressurizing member (220) to support the ring frame (5). The ring frame support member (210) can include a neck member (211) that protrudes horizontally from the body member (201), and a curved extension member (214) that is connected to the neck member (211) and extends in a curved path so as to overlap with the ring frame (5) in the upper and lower directions.

[0082] The ring frame support (210) can move in a direction in which it protrudes horizontally with respect to the body part (201) and a direction in which it is horizontally inserted into the body part (201). In other words, the ring frame support (210) can move in a direction toward the rotation axis (RX) of the chuck table (60) and a direction away from the rotation axis (RX).

[0083] Each ring frame pressurizing member (220) may include a rotary lever (225), a rotary lever bracket (221), a trigger (240), and a cam member (237). The rotary lever (225) rotates (pivots) while the substrate assembly (1) is supported on the chuck table (60) to pressurize the ring frame (5) toward the ring frame support member (210).

[0084] The rotary lever bracket (221) rotatably supports the rotary lever (225) and can be supported by the ring frame support member (210). The rotary lever bracket (221) can protrude upward from the neck (211) of the ring frame support member (210). For example, the rotary lever (225) can be rotatably supported by the rotary lever bracket (221) by a hinge pin (223) penetrating through the rotary lever (225) and the rotary lever bracket (221).

[0085] The rotary lever (225) can be divided into a first lever portion (226) on one side and a second lever portion (228) on the other side based on a hinge pin (223) that serves as a center of rotation. The first lever portion (226) and the second lever portion (228) can be bent at a predetermined angle. A slot (212) can be formed in the neck portion (211) to avoid collision with the second lever portion (228).

[0086] The trigger (240) may be configured to be linearly movable in a horizontal direction. For example, the trigger (240) may be linearly movable in a direction toward and opposite to the rotation axis (RX). One side of the trigger (240) may be extended to be inserted into the body part (201), and the other side of the trigger (240) may be connected to the second lever part (228) via the cam part (237).

[0087] The cam (237) connects the trigger (240) and the rotary lever (225), and can connect the trigger (240) and the rotary lever (225) so that the linear motion of the trigger (240) is converted into the rotary motion of the rotary lever (225).

[0088] For example, the cam portion (237) may include a long hole (235) extending in the longitudinal direction of the second lever portion (228) and penetrating the second lever portion (228), and a lever connecting pin (236) protruding from the other side of the trigger (240) and penetrating the long hole (235).

[0089] Referring to FIGS. 8 and 9, when a control signal is transmitted from the control unit (not shown) of the substrate processing device (20) to the transfer (200) and the trigger (240) moves in a straight line in the direction of insertion into the body (201), the rotary lever (225) can rotate to press down the ring frame (5).

[0090] The ring frame pressurizing unit (220) may further include a pressurizing roller (230) that presses the ring frame (50) downward to minimize damage due to friction. The pressurizing roller (230) may be rotatably coupled to the first lever unit (226) by a roller pin (232) that penetrates the end of the first lever unit (226) and the pressurizing roller (230).

[0091] As illustrated in Fig. 8, when the trigger (240) is moved to the maximum in the opposite direction to the direction toward the body (201), that is, in the direction toward the rotation axis (RX), the gap (D2) between the ring frame support (210) and the pressure roller (230) in the vertical direction may be greater than the thickness of the ring frame (5). A plurality of ring frame pressure members (220) may be arranged to be spaced apart from each other on the ring frame support (210).

[0092] The process of supporting a substrate assembly (1) on a chuck table (60) without slipping or shaking using a substrate transfer device (20) is as follows. First, a pair of ring frame support members (210) are horizontally protruded from the body (201) so that the curved extensions (214) of the pair of ring frame support members (210) are aligned vertically with the avoidance members (65) of the chuck table (60).

[0093] Next, as illustrated in FIG. 7, the substrate transfer robot (50) (see FIG. 1) enters between a pair of ring frame supports (210) while supporting the substrate assembly (1) and aligns the substrate assembly (1) with the chuck table (60) up and down. The substrate transfer robot (50) can move the substrate assembly (1) so that the substrate assembly (1) is positioned higher than the height of the pair of ring frame supports (210) and lower than the height of the end of the second lever (226), i.e., the pressure roller (230).

[0094] Next, when the substrate transfer robot (50) descends, the ring frame (5) is supported on a pair of ring frame supports (210) and the substrate transfer robot (50) can be separated from the substrate assembly (1). The substrate transfer robot (50) separated from the substrate assembly (1) can be moved to a standby position that does not overlap with the chuck table (60).

[0095] Next, a pair of transfers (200) are lowered. Specifically, the body portion (201) of the transfers (200) is lowered. As a result, as illustrated in FIG. 8, the ring frame (5) is supported by a pair of ring frame support portions (210), and the ring frame pressurizing portion (220) and the ring frame support portion (210) are lowered toward the chuck table (60), so that the substrate assembly (1) can be supported by the substrate support portion (63) of the chuck table (60).

[0096] A vacuum pump (not shown) may be operated to form a negative pressure on the substrate support (63) of the chuck table (60) while a pair of transfers (200) are descending.

[0097] Next, the trigger (240) moves linearly toward the body (201). The linear motion of the trigger (240) is converted into the rotary motion of the rotary lever (225) by the cam (237), and the pressure roller (230) supported at the end of the second lever (226) presses the ring frame (5) downward.

[0098] When the size of the negative pressure of the substrate support (63) is within the range of the reference pressure, it is determined that the substrate assembly (1) is stably supported by the substrate support (63), and the ring frame support (210) and the ring frame pressurizing portion (220) move in the direction of insertion into the corresponding body portion (201), and a pair of transfers (200) can be moved up and down to a standby position that does not interfere with the substrate processing operation on the chuck table (60).

[0099] Next, a scheduled substrate processing process can be performed on the substrate (2) of the substrate assembly (1) stably supported on the substrate support member (63) of the chuck table (60).

[0100] In the embodiment illustrated in FIG. 7, a pair of ring frame pressurizing parts (220) including a pressurizing roller (230) are arranged close to each other at the center of the longitudinal direction of the ring frame support part (210), but unlike the illustration, a pair of ring frame pressurizing parts (220) may be arranged as spaced apart as possible at each end of each side of the longitudinal direction of the ring frame support part (210).

[0101] FIG. 10 is a plan view of a substrate processing device according to a third embodiment of the present invention, and is a drawing showing a state in which a substrate assembly is placed on a chuck table, FIG. 11 is a perspective view showing the transfer of FIG. 10, FIG. 12 is a front view showing the chuck table of FIG. 10 and the substrate assembly supported on the chuck table, and FIG. 13 is an enlarged view of a portion corresponding to part B of FIG. 12, and is a drawing showing a state in which the chuck table is raised so that the ring frame is pressed against the ring frame pressurizing portion and spread.

[0102] As in the case of the substrate processing device according to the first embodiment of the present invention described with reference to FIGS. 1 to 6, in the case of the third embodiment of the present invention illustrated in FIGS. 10 to 13, the direction in which the ring frame pressurizing unit moves horizontally may be a direction parallel to the X-axis, the direction in which the ring frame, the ring frame pressurizing unit, and the transfer are raised and lowered may be a direction parallel to the Z-axis, and the direction in which the substrate transfer robot moves horizontally to intersect the X-axis may be a direction parallel to the Y-axis.

[0103] Referring to FIGS. 10 to 13, a substrate processing device (30) according to a third embodiment of the present invention may include a substrate transfer robot (50) (see FIG. 1), a chuck table (70), a transfer (300), and a ring frame pressurizing unit (320). The substrate transfer robot (50) is the same as the substrate transfer robot (50) included in the substrate processing device (10) according to the first embodiment of the present invention described with reference to FIGS. 1 to 6, and therefore, any duplicate mention will be omitted.

[0104] The chuck table (70) may include a substrate support member (73) that supports the substrate assembly (1), and a plurality of support pins (75) that protrude from the surface of the chuck table (70), for example, the substrate support member (73), to support the substrate assembly (1) while avoiding the fingers (52) of the substrate transfer robot (50). The plurality of support pins (75) may be spaced apart from each other. The plurality of support pins (75) may support the substrate assembly (1) at three or more points.

[0105] When a plurality of support pins (75) are inserted into the substrate support (73) and the substrate assembly (1) is supported on the substrate support (73), a negative pressure can be formed on the surface of the substrate support (73) so that the substrate assembly (1) is absorbed onto the substrate support (73).

[0106] The substrate processing device (30) may include a pair of transfers (300). The pair of transfers (300) are arranged outside the chuck table (70) and are capable of being elevated relative to the chuck table (70). Each transfer (300) may include a body part (301) and an elevation drive part (305) for elevating the body part (301).

[0107] Each transfer (300) may further include a ring frame pressurizing portion (320). As illustrated in FIG. 10, a pair of transfers (300) may be arranged to face each other with a chuck table (70) interposed therebetween. In other words, a pair of ring frame pressurizing portions (320) may be arranged to face each other with a chuck table (70) interposed therebetween.

[0108] The ring frame pressurizing portion (320) may include a neck portion (321) protruding horizontally from the body portion (301), and a straight extension portion (324) extending in a straight path so as to be connected to the neck portion (321) and overlapped with the ring frame (5) up and down.

[0109] The ring frame pressurizing portion (320) can move in a direction in which it protrudes horizontally with respect to the body portion (301) and a direction in which it is horizontally inserted into the body portion (301). In other words, the ring frame pressurizing portion (320) can move in a direction toward the rotation axis (RX) of the chuck table (70) and a direction away from the rotation axis (RX).

[0110] The process of supporting the substrate assembly (1) on the chuck table (70) without slipping or shaking using the substrate transfer device (30) is as follows.

[0111] First, as shown in FIGS. 10 and 12, the substrate transfer robot (50) (see FIG. 1) moves while supporting the substrate assembly (1) so that the substrate assembly (1) is transferred and supported on the chuck table (70).

[0112] In detail, when a plurality of support pins (75) are protruded from a substrate support member (73), and a substrate transfer robot (50) is horizontally moved so as to be aligned up and down with a chuck table (70) so that a plurality of fingers (52) avoid the plurality of support pins (75), and the substrate transfer robot (50) is lowered, a substrate assembly (1) is supported by the plurality of support pins (75), and the substrate transfer robot (50) can be spaced apart from the substrate assembly (1). The substrate transfer robot (50) spaced apart from the substrate assembly (1) can be moved to a standby position where it does not overlap with the chuck table (70).

[0113] Next, a pair of ring frame pressurizing parts (320) are horizontally moved in a direction protruding from the body part (301) so that the straight extensions (324) of a pair of ring frame pressurizing parts (320) overlap with the ring frame (5) vertically. As illustrated in Fig. 12, a pair of ring frame pressurizing parts (320) may be positioned above a chuck table (70).

[0114] Next, the plurality of support pins (75) are lowered so that they are inserted into the inside of the substrate support member (73), and the chuck table (70) is raised so that it approaches a pair of ring frame pressurizing members (320) as indicated by the arrows in Fig. 12. When the chuck table (70) is raised, a vacuum pump (not shown) may be operated so that a negative pressure is formed in the substrate support member (63) of the chuck table (70).

[0115] As the chuck table (70) rises while the ring frame pressurizing part (320) is stopped, the ring frame (5) is pressed downward by a pair of ring frame pressurizing parts (120) while the substrate assembly (1) is supported on the substrate support part (73) as shown in FIG. 13.

[0116] When the size of the negative pressure of the substrate support (73) is within the range of the reference pressure, it is determined that the substrate assembly (1) is stably supported by the substrate support (73), and a pair of ring frame pressurizing parts (320) move in the direction of insertion into the corresponding body part (301), and a pair of transfers (300) can be moved up and down to a standby position that does not interfere with the substrate processing operation on the chuck table (60).

[0117] Next, a scheduled substrate processing process can be performed on the substrate (2) of the substrate assembly (1) stably supported on the substrate support member (63) of the chuck table (60).

[0118] Meanwhile, unlike that shown in Fig. 12, the chuck table (70) may not be raised, but a pair of ring frame pressurizing parts (320) may be lowered to approach the chuck table (70) to press down the ring frame (5).

[0119] FIG. 14 is a plan view of a substrate processing device according to a fourth embodiment of the present invention, and is a drawing showing a state in which a substrate assembly is attached and supported by a ring frame pressurizing part on a chuck table, FIG. 15 is a perspective view showing the transfer of FIG. 14, FIG. 16 is a drawing showing a state in which the ring frame pressurizing part of FIG. 15 presses downward and unfolds a ring frame supported on a chuck table, and FIG. 17 is a drawing showing a state in which the ring frame pressurizing part of FIG. 15 pulls downward the ring frame with magnetic force to unfold the ring frame.

[0120] As in the case of the substrate processing device according to the first embodiment of the present invention described with reference to FIGS. 1 to 6, in the case of the fourth embodiment of the present invention illustrated in FIGS. 14 to 17, the direction in which the ring frame pressurizing unit moves horizontally may be a direction parallel to the X-axis, the direction in which the ring frame, the ring frame pressurizing unit, and the transfer are raised and lowered may be a direction parallel to the Z-axis, and the direction in which the substrate transfer robot moves horizontally to intersect the X-axis may be a direction parallel to the Y-axis.

[0121] Referring to FIGS. 14 to 16, a substrate processing device (40) according to a fourth embodiment of the present invention may include a substrate transfer robot (50) (see FIG. 1), a chuck table (60), a transfer (400), and a ring frame pressurizing unit (420). The substrate transfer robot (50) and the chuck table (60) are the same as the substrate transfer robot (50) and the chuck table (60) included in the substrate processing device (10) according to the first embodiment of the present invention described with reference to FIGS. 1 to 6, and are indicated by the same reference numerals, so redundant mention is omitted.

[0122] The substrate processing device (40) may include a pair of transfers (400). The pair of transfers (400) are arranged outside the chuck table (60) and are capable of being elevated relative to the chuck table (60). Each transfer (400) may include a body part (401) and an elevation drive part (405) for elevating the body part (401).

[0123] Each transfer (400) may further include a ring frame pressurizing portion (420). As illustrated in FIGS. 14 and 15 , a pair of transfers (400) may be arranged to face each other with a chuck table (60) interposed therebetween. In other words, a pair of ring frame pressurizing portions (420) may be arranged to face each other with a chuck table (60) interposed therebetween.

[0124] The ring frame pressurizing portion (420) may include a neck portion (421) protruding horizontally from the body portion (401), and a curved extension portion (424) extending along a curved path so as to be connected to the neck portion (421) and overlapped with the ring frame (5) up and down.

[0125] The ring frame pressurizing portion (420) can move in a direction in which it protrudes horizontally with respect to the body portion (401) and a direction in which it is horizontally inserted into the body portion (401). In other words, the ring frame pressurizing portion (420) can move in a direction toward the rotation axis (RX) of the chuck table (60) and a direction away from the rotation axis (RX).

[0126] The ring frame (5) of the substrate assembly (1) may include a magnetic material. For example, the ring frame (5) may be made of steel. The ring frame pressurizing portion (420) may include an electromagnet (426) that generates a magnetic force that pulls the ring frame (5) by supplying electric energy. The electromagnet (426) may be provided in multiple numbers. The multiple electromagnets (426) may be spaced apart from each other along the length direction of the curved extension portion (420).

[0127] The process of supporting a substrate assembly (1) on a chuck table (60) without slipping or shaking using a substrate transfer device (40) is as follows. First, a pair of ring frame pressurizing parts (420) are horizontally protruded from the body part (401) so that the curved extensions (424) of the pair of ring frame pressurizing parts (420) are aligned vertically with the avoidance parts (65) of the chuck table (60).

[0128] Next, the substrate transfer robot (50) (see FIG. 1) enters between a pair of ring frame pressurizing parts (420) while supporting the substrate assembly (1) and aligns the substrate assembly (1) vertically with the chuck table (60). The substrate transfer robot (50) can move the substrate assembly (1) so that the substrate assembly (1) is positioned lower than the height of the pair of ring frame pressurizing parts (420).

[0129] Next, a pair of transfers (400) are lowered so that a pair of ring frame pressurizing parts (420) come into contact with the upper surface of the ring frame (5). Specifically, the body part (401) of the transfer (400) can be lowered. A pair of ring frame pressurizing parts (420) can magnetically support the ring frame (5) and the substrate assembly (1) from above the ring frame (5) so that they do not fall. The substrate transfer robot (50) can move to a standby position that is spaced apart from the substrate assembly (1) and does not overlap with the chuck table (60).

[0130] Next, a pair of transfers (200) are lowered. Specifically, the body portion (401) of the transfers (200) can be lowered. As a result, as illustrated in FIG. 16, the substrate assembly (1) can be lowered toward the chuck table (60) while the ring frame (5) is supported by the pair of ring frame pressurizing portions (420) and supported by the substrate support portion (63) of the chuck table (60).

[0131] A vacuum pump (not shown) may be operated to form a negative pressure in the substrate support portion (63) of the chuck table (60) while a pair of transfers (400) are descending.

[0132] Next, a pair of transfers (400) are additionally lowered. This causes a pair of ring frame pressurizing members (420) to additionally lower, as shown in Fig. 16, to press down on the ring frame (5) so that the bent ring frame (5) is straightened.

[0133] When the size of the negative pressure of the substrate support (63) is within the range of the reference pressure, it is determined that the substrate assembly (1) is stably supported by the substrate support (63), the ring frame pressurizing portion (420) moves in the direction of insertion into the corresponding body portion (401), and a pair of transfers (400) can be moved up and down to a standby position that does not interfere with the substrate processing operation on the chuck table (60).

[0134] Next, a scheduled substrate processing process can be performed on the substrate (2) of the substrate assembly (1) stably supported on the substrate support member (63) of the chuck table (60).

[0135] Meanwhile, as illustrated in FIG. 17, a ring frame pressurizing member (420) including an electromagnet (426) may support the ring frame (5) from below the ring frame (5). Referring to FIGS. 15 and 17, when a pair of transfers (200) are lowered while the ring frame pressurizing member (420) supports the ring frame (5) from below the ring frame (5), the ring frame (5) is supported by the pair of ring frame pressurizing members (420) and the pair of ring frame pressurizing members (420) are lowered toward the chuck table (60), so that the substrate assembly (1) can be supported by the substrate support member (63) of the chuck table (60).

[0136] A vacuum pump (not shown) may be operated to form a negative pressure in the substrate support portion (63) of the chuck table (60) while a pair of transfers (400) are descending.

[0137] Next, a pair of transfers (400) are additionally lowered. As illustrated in Fig. 17, a pair of ring frame pressurizing parts (420) are additionally lowered and pull the ring frame (5) downwards with magnetic force, thereby allowing the ring frame (5) to unfold.

[0138] When the magnitude of the negative pressure of the substrate support (63) is within the range of the reference pressure, it is determined that the substrate assembly (1) is stably supported by absorption on the substrate support (63).

[0139] When the substrate assembly (1) is stably supported by being absorbed by the substrate support member (63), the supply of electrical energy to the electromagnet (426) can be stopped so that the magnetic force of the electromagnet (426) is eliminated. This causes the ring frame pressurizing member (420) to be separated from the ring frame (5).

[0140] Next, the ring frame pressurizing part (420) moves in the direction of being inserted into the corresponding body part (401), and a pair of transfers (400) can be moved up and down to a standby position that does not interfere with the substrate processing operation on the chuck table (60).

[0141] Next, a scheduled substrate processing process can be performed on the substrate (2) of the substrate assembly (1) stably supported on the substrate support member (63) of the chuck table (60).

[0142] While the present invention has been described with reference to the embodiments illustrated in the drawings, these are merely exemplary, and those skilled in the art will appreciate that various modifications and equivalent embodiments are possible. Therefore, the true scope of protection of the present invention should be defined solely by the appended claims.

Claims

1. A chuck table supporting a substrate assembly having a substrate and a ring frame that surrounds the substrate and supports the substrate; and A substrate processing device characterized by including a ring frame pressurizing unit that presses the ring frame in a direction in which the bending of the substrate is straightened.

2. In paragraph 1, The above substrate processing device, Further comprising a transfer arranged outside the chuck table and ascending and descending relative to the chuck table; A substrate processing device characterized in that the ring frame pressurizing part is provided in the transfer.

3. In paragraph 2, The above transfers are provided in pairs, A substrate processing device characterized in that a pair of the above transfers are arranged to face each other with the chuck table between them.

4. In paragraph 3, A substrate processing device further comprising a substrate transfer robot that supports the substrate assembly and moves the substrate assembly to a point aligned with the chuck table through a pair of transfers.

5. In paragraph 1, The above substrate processing device, Further comprising a ring frame support member positioned below the ring frame pressurizing member to support the ring frame; A substrate processing device characterized in that the gap between the ring frame pressurizing portion and the ring frame support portion is greater than the thickness of the ring frame.

6. In paragraph 1, The above substrate processing device, Further comprising a ring frame support member positioned below the ring frame pressurizing member to support the ring frame; A substrate processing device characterized in that the ring frame support part includes an adsorption part to which the ring frame is adsorbed.

7. In paragraph 1, The above substrate processing device, Further comprising a ring frame support member positioned below the ring frame pressurizing member to support the ring frame; A substrate processing device characterized in that the ring frame pressurizing portion is movable in a horizontal direction with respect to the ring frame support portion.

8. In paragraph 1, The above substrate processing device, Further comprising a ring frame support member positioned below the ring frame pressurizing member to support the ring frame; The above chuck table is, A substrate support member that supports the substrate assembly and forms a negative pressure on the surface so that the substrate assembly is absorbed, and A substrate processing device characterized by including a concave avoidance member to avoid collision with the ring frame support member.

9. In paragraph 1, The above substrate processing device, Further comprising a ring frame support member positioned below the ring frame pressurizing member to support the ring frame; The ring frame is supported on the ring frame support member, and the ring frame pressurizing member and the ring frame support member are lowered toward the chuck table so that the substrate assembly is supported on the chuck table. A substrate processing device characterized in that the ring frame pressurizing portion and the ring frame support portion are further lowered so that the ring frame support portion is spaced from the ring frame and the ring frame pressurizing portion presses the ring frame downward.

10. In paragraph 1, The above ring frame pressurizing part is, A substrate processing device characterized in that it includes a rotation lever that pivots while the substrate assembly is supported on the chuck table to press the ring frame toward the chuck table.

11. In paragraph 10, The above ring frame pressurizing part is, A trigger capable of linear movement in a direction parallel to the above substrate assembly, A cam portion that connects the trigger and the rotary lever, and connects the trigger and the rotary lever so that the linear motion of the trigger is converted into the rotary (pivot) motion of the rotary lever, and A substrate processing device characterized in that it further includes a pressure roller connected to the above-mentioned rotary lever and pressurizing the above-mentioned ring frame downward.

12. In paragraph 10, The above ring frame pressurizing portion further includes a trigger capable of linear movement in a direction parallel to the substrate assembly, The ring frame is supported on the ring frame support member, and the ring frame pressurizing member and the ring frame support member are lowered toward the chuck table so that the substrate assembly is supported on the chuck table. A substrate processing device characterized in that the trigger moves linearly in one direction so that the rotary lever rotates (pivots) to press the ring frame downward.

13. In paragraph 1, A substrate processing device further comprising a substrate transfer robot that supports and moves the substrate assembly so that the substrate assembly is supported on the chuck table.

14. In paragraph 1, The above chuck table is, A substrate processing device characterized by including a plurality of support pins protruding from the surface of the chuck table to support the substrate assembly.

15. In paragraph 13, The above ring frame pressurizing part is located above the chuck table, When the substrate assembly is supported on the chuck table, the substrate transfer robot moves away from the substrate assembly and the chuck table, A substrate processing device characterized in that the chuck table rises toward the ring frame pressurizing portion and the ring frame is pressed downward by the ring frame pressurizing portion.

16. In paragraph 1, The above ring frame includes a magnetic material, A substrate processing device characterized in that the ring frame pressurizing unit includes an electromagnet that generates a magnetic force that pulls the ring frame by supplying electric energy.

17. In paragraph 16, The above ring frame pressurizing part supports the ring frame from above by the magnetic force so that the ring frame does not fall, The ring frame is supported by the ring frame pressurizing portion, and the ring frame pressurizing portion is lowered toward the chuck table so that the substrate assembly is supported by the chuck table. A substrate processing device characterized in that the ring frame pressurizing portion is further lowered to pressurize the ring frame downward.

18. In paragraph 16, The above ring frame pressurizing portion supports the ring frame from below the ring frame, The ring frame is supported by the ring frame pressurizing portion, and the ring frame pressurizing portion is lowered toward the chuck table so that the substrate assembly is supported by the chuck table. A substrate processing device characterized in that the ring frame pressurizing portion is further lowered and the ring frame is pulled downward by the magnetic force, thereby unfolding the ring frame.

Images