Printed circuit board and electronic device comprising same

Abstract

A printed circuit board is disclosed. This printed circuit board includes: a first electronic device module having at least one mounting hole and including a first substrate and a plurality of first electronic devices mounted on the first substrate in a line at intervals; and a second electronic device module including a second substrate and a plurality of second electronic devices mounted on the second substrate in a line at intervals. The first electronic device module and the second electronic device module are arranged such that the plurality of first electronic devices and the plurality of second electronic devices cross each other in the at least one mounting hole.

Description

Printed circuit board and electronic device including same

[0001] The present disclosure relates to a printed circuit board and an electronic device including the same.

[0002] When mounting DIP (dual in-line package) type electronic components on a printed circuit board, through holes are formed on the mounting surface of the printed circuit board, and the lead wires of the electronic components are inserted into the through holes and then soldered. Recently, as switching mode power supplies (SMPS) have become slimmer, the demand for leadless printed circuit boards without lead wires is increasing. Accordingly, DIP type electronic components mounted on printed circuit boards are being changed to SMD (surface mount device) type electronic components to configure SMPSs without lead wires. Among the components that can be changed to SMD type electronic components, electrolytic capacitors (EL capacitors) can be replaced with tantalum capacitors, but since they are not used for general industrial purposes, their high price causes the overall price of SMPS to increase, which is a problem.

[0003] A printed circuit board according to one embodiment of the present disclosure may include a first electronic device module having at least one mounting hole, a first substrate, and a plurality of first electronic devices mounted in a row with a space between them on the first substrate; and a second electronic device module including a second substrate and a plurality of second electronic devices mounted in a row with a space between them on the second substrate. The first electronic device module and the second electronic device module may be arranged such that the plurality of first electronic devices and the plurality of second electronic devices intersect each other within the at least one mounting hole.

[0004] The first electronic element module may have the plurality of first electronic elements arranged parallel to one surface of the printed circuit board. The second electronic element module may have the plurality of second electronic elements arranged parallel to one surface of the printed circuit board.

[0005] The plurality of first electronic elements and the plurality of second electronic elements may be alternately arranged one by one.

[0006] At least one first electronic element among the plurality of first electronic elements can be attached to the second substrate by an adhesive.

[0007] At least one of the plurality of second electronic elements can be attached to the first substrate via an adhesive.

[0008] The first substrate may include a plurality of first insertion holes into which the tip portions of the plurality of second electronic elements are inserted. The second substrate may include a plurality of second insertion holes into which the tip portions of the plurality of first electronic elements are inserted.

[0009] The first substrate may include a plurality of first fixing grooves on which the tip portions of the plurality of second electronic elements are mounted. The second substrate may include a plurality of second fixing grooves on which the tip portions of the plurality of first electronic elements are mounted.

[0010] The tip portions of the plurality of first electronic elements can be press-coupled to the plurality of second fixing grooves. The tip portions of the plurality of first electronic elements can be press-coupled to the plurality of second fixing grooves.

[0011] The printed circuit board may further include an additional mounting hole; and a third electronic component module and a fourth electronic component module arranged to intersect each other in the additional mounting hole in a different direction from the first electronic component module and the second electronic component module.

[0012] The printed circuit board may further include a third electronic component module including a third substrate and a fourth electronic component module including a fourth substrate, which are arranged to intersect each other and are mounted in the at least one mounting hole in the same direction as the first electronic component module and the second electronic component module.

[0013] One end and the other end of the first substrate and one end and the other end of the second substrate may include a plurality of conductive metal terminals for soldering the first substrate and the second substrate to the printed circuit board.

[0014] Each of the plurality of first electronic elements and the plurality of second electronic elements may include a DIP type or SMD type capacitor.

[0015] An electronic device according to one embodiment of the present disclosure may include a housing; a display disposed in the housing; and a printed circuit board disposed between the display and the housing and including a processor that individually and / or collectively includes a processing circuit to control an operation of the display. The printed circuit board may include at least one mounting hole, a first electronic device module including a first substrate, and a plurality of first electronic devices mounted in a row with a gap therebetween; and a second electronic device module including a second substrate, and a plurality of second electronic devices mounted in a row with a gap therebetween. The first electronic device module and the second electronic device module may be arranged such that the plurality of first electronic devices and the plurality of second electronic devices intersect each other within the at least one mounting hole.

[0016] The first electronic element module may have the plurality of first electronic elements arranged parallel to one surface of the printed circuit board. The second electronic element module may have the plurality of second electronic elements arranged parallel to one surface of the printed circuit board. The plurality of first electronic elements and the plurality of second electronic elements may be arranged alternately one by one.

[0017] At least one first electronic element among the plurality of first electronic elements may be attached to the second substrate by an adhesive. At least one second electronic element among the plurality of second electronic elements may be attached to the first substrate by an adhesive.

[0018] The above and other aspects, features and advantages of specific embodiments of the present disclosure will become more apparent from the following detailed description taken in conjunction with the accompanying drawings.

[0019] FIG. 1 is a block diagram illustrating an electronic device according to various embodiments of the present disclosure.

[0020] FIG. 2 is an exploded view illustrating an electronic device according to various embodiments of the present disclosure.

[0021] FIG. 3 is a perspective view showing a portion of a printed circuit board of an electronic device according to various embodiments of the present disclosure.

[0022] FIG. 4 is a drawing showing an example in which a pair of electronic component modules are arranged in an intersecting direction according to various embodiments of the present disclosure.

[0023] FIG. 5 is an enlarged perspective view of a plurality of electronic component modules mounted on a printed circuit board of an electronic device according to various embodiments of the present disclosure.

[0024] FIG. 6 is a perspective view showing an electronic component module mounted on a printed circuit board of an electronic device according to various embodiments of the present disclosure.

[0025] FIG. 7 is a drawing showing an example of an electronic device module including a DIP (dual in-line package) type capacitor according to various embodiments of the present disclosure.

[0026] FIG. 8 is a drawing showing an example of an electronic component module including a SMD (surface mount device) type capacitor according to various embodiments of the present disclosure.

[0027] Figure 9 is a drawing showing a comparative example in which a plurality of electronic component modules are individually arranged in parallel.

[0028] FIG. 10 is a drawing showing an example of a plurality of electronic component modules arranged in pairs in a direction intersecting each other according to various embodiments of the present disclosure.

[0029] FIG. 11 is a drawing showing an example of arranging a plurality of electronic component modules in horizontal and vertical directions according to various embodiments of the present disclosure.

[0030] FIG. 12 is a drawing showing an example in which a pair of electronic component modules are arranged in an intersecting direction according to various embodiments of the present disclosure.

[0031] FIG. 13 is a drawing showing a substrate of an electronic device module according to various embodiments of the present disclosure illustrated in FIG. 12.

[0032] FIG. 14 is a drawing showing an example in which a pair of electronic component modules are arranged in an intersecting direction according to various embodiments of the present disclosure.

[0033] FIG. 15 is a drawing showing a substrate of an electronic device module according to various embodiments of the present disclosure illustrated in FIG. 14.

[0034] The various embodiments described in this disclosure and the configurations depicted in the drawings are merely one or more preferred embodiments, and there may be various modified examples that can replace the various embodiments and drawings of this disclosure at the time of filing of this application.

[0035] In this disclosure, the same reference numbers or symbols presented in each drawing represent parts or components that perform substantially the same function.

[0036] The terminology used in this disclosure is for the purpose of describing embodiments and is not intended to limit and / or restrict the disclosed invention. The singular expression includes the plural expression unless the context clearly indicates otherwise. In this specification, the terms "comprises" or "has" and the like are intended to indicate the presence of a feature, number, step, operation, component, part, or combination thereof described in the specification, but do not preclude the presence or addition of one or more other features, numbers, steps, operations, components, parts, or combinations thereof.

[0037] Terms including ordinal numbers, such as "first," "second," etc., used in this disclosure may be used to describe various components; however, the components are not limited by these terms, and the terms are used only to distinguish one component from another. For example, without departing from the scope of the present disclosure, the first component could be referred to as the second component, and similarly, the second component could also be referred to as the first component. The term "and / or" includes any combination of a plurality of related listed items or any item among a plurality of related listed items.

[0038] The terms “leading end,” “rear end,” “upper end,” “lower end,” “front end,” “rear end,” “top surface,” “bottom surface,” “top end,” “bottom end,” “one end,” “the other end,” “left side,” and “right side” used in this disclosure are defined based on the drawings, and the shape and position of each component are not limited by these terms.

[0039] When the expression “at least one” of a plurality of components used in the present disclosure appears, the expression refers to all of the plurality of components, as well as each one of the plurality of components excluding the rest, or a combination thereof.

[0040] Hereinafter, electronic devices according to various embodiments of the present disclosure will be described in detail with reference to the attached drawings.

[0041] FIG. 1 is a block diagram illustrating an electronic device according to various embodiments of the present disclosure.

[0042] Referring to FIG. 1, the electronic device (1) may be implemented as, for example, a display device. However, a case such as the present disclosure is only one of various implementation examples of the electronic device (1).

[0043] The type of electronic device (1) is not limited, and may be implemented as various types of devices, such as a display device (e.g., TV, monitor, digital signage, electronic whiteboard, electronic picture frame, video wall, etc.), an image processing device (e.g., set-top box, optical media player, etc.), an information processing device (e.g., computer main body, laptop computer, etc.), a mobile device (e.g., smartphone, tablet device, portable multimedia player, etc.), a wearable device, or a home appliance (e.g., refrigerator, washing machine, air conditioner, dishwasher, etc.).

[0044] An electronic device (1) may include a communication interface (20) having various communication circuits. The communication interface (20) may include an interface circuit for the electronic device (1) to communicate with various types of devices and servers, including external devices, and also to transmit and receive data. The communication interface (20) may include at least one of various wired interfaces (21) for wired communication connections and various wireless interfaces (22) for wireless communication connections.

[0045] The wired interface (21) includes a connector or port to which a cable of a predefined transmission standard is connected. For example, the wired interface (21) includes a port to which a terrestrial or satellite broadcasting antenna is connected to receive a broadcasting signal, or a port to which a cable of a cable broadcasting is connected. The wired interface (21) may include a port to which cables of various wired transmission standards, such as HDMI (high definition multimedia interface), DP (display port), DVI (digital visual interface), component, composite, S-Video, and Thunderbolt, are connected to connect to various image processing devices. The wired interface (21) may include a USB standard port to connect to a USB (universal serial bus) device. The wired interface (21) may include an optical port to which an optical cable is connected. The wired interface (21) may include an audio input port to which an external microphone is connected, and an audio output port to which a headset, earphones, external speakers, etc. are connected. The wired interface (21) may include an Ethernet port to which a gateway, router, hub, etc. are connected to connect to a wide area network.

[0046] The wireless interface (22) may include a bidirectional communication circuit including at least one or more components such as a communication module and a communication chip corresponding to various types of wireless communication protocols. For example, the wireless interface (22) may include a Wi-Fi communication chip that performs wireless communication with an AP (access point) according to a Wi-Fi method, a communication chip that performs wireless communication such as Bluetooth, Zigbee, Z-Wave, WirelessHD, WiGig, NFC, etc., an IR module for IR communication, a mobile communication chip that performs mobile communication with a mobile device, etc.

[0047] An electronic device (1) may include a display (30) capable of displaying an image on a screen. The display (30) may have a light-receiving structure such as a liquid crystal display, or a self-luminous structure including a plurality of light-emitting elements, for example, organic light-emitting diodes (OLEDs), Mini LEDs, or Micro LEDs. If the display (30) is a liquid crystal display, it may include a liquid crystal display panel, a backlight unit for supplying light, and a panel driving substrate for driving liquid crystals of the liquid crystal display panel. If the display (30) includes a self-luminous structure, it may include a substrate on which a driving circuit is provided, and a plurality of pixels arranged at a predetermined pitch on the substrate. In this case, one pixel may include a plurality of sub-pixels. The plurality of sub-pixels may be a plurality of light-emitting elements that emit light of different wavelength bands. One sub-pixel may be one light-emitting element (e.g., OLED, Mini LED, or Micro LED).

[0048] The electronic device (1) may include an input device (50) having various input circuits. The input device (50) may include various types of user input interface-related circuits that are provided so that a user can operate them to perform user input. The input device (50) may have various configurations depending on the type of the electronic device (1). For example, the input device (50) may be a mechanical or electronic button, a touchpad, a sensor, a camera, a touch screen, or a remote controller separate from the main body of the electronic device (1).

[0049] The electronic device (1) may include a power supply unit (60). The power supply unit (60) may adjust the power characteristics of the input external power to correspond to each component of the electronic device (1) and transmit the adjusted power to the corresponding components. For example, the power supply unit (60) may convert AC power input from the external power source into DC power and output power adjusted to a current or voltage suitable for each component of the electronic device (1). For this purpose, the power supply unit (60) may include a switched mode power supply (SMPS).

[0050] An electronic device (1) may include a memory (70). The memory (70) stores digitized data. The memory (70) includes non-volatile storage capable of preserving data regardless of whether power is supplied, and volatile memory into which data to be processed by a processor (80) is loaded and which cannot preserving data if power is not supplied. The storage includes a flash memory, a hard-disc drive (HDD), a solid-state drive (SSD), a read-only memory (ROM), etc., and the memory includes a buffer, a random access memory (RAM), etc.

[0051] An electronic device (1) may include a processor (80) having various processing circuits. The processor (80) includes various hardware processors implemented as a CPU, chipset, buffer, circuit, etc. mounted on a printed circuit board (100, see FIG. 2), and may be implemented as a SoC (system on chip) depending on the design method.

[0052] The processor (80) may be implemented as a digital signal processor (DSP), a microprocessor, a graphics processing unit (GPU), an artificial intelligence (AI) processor, a neural processing unit (NPU), or a time controller (TCON) for processing a digital image signal. However, the present invention is not limited thereto, and may include one or more of a central processing unit (CPU), a micro controller unit (MCU), a micro processing unit (MPU), a controller, an application processor (AP), a communication processor (CP), or an ARM processor, or may be defined by the relevant terminology. The processor (80) may be implemented as a system on chip (SoC) or large scale integration (LSI) with a built-in processing algorithm, or may be implemented in the form of an application specific integrated circuit (ASIC), or a field programmable gate array (FPGA). The processor (80) may include various processing circuits and / or multiple processors. For example, the term "processor" used in the present disclosure, including the claims, includes at least one processor and may be implemented as a processor for performing various processing operations. The circuit may include at least one processor, wherein one or more of the processors may be individually and / or collectively configured to perform various functions described in the present disclosure in a distributed manner.When the terms "processor," "at least one processor," and "one or more processors" are used herein to describe a processor configured to perform a number of functions, these terms may encompass, for example, without limitation, a situation where one processor performs some of the recited functions and other processor(s) perform other of the recited functions, and a situation where a single processor can perform all of the recited functions. Furthermore, the at least one processor may comprise a combination of processors that perform various recited / disclosed functions, for example, in a distributed manner. At least one processor may execute program instructions to achieve or perform various functions.

[0053] The processor (80) can control hardware or software components connected to the processor (80) by running an operating system or application program, and can perform various data processing and operations. In addition, the processor (80) can load commands or data received from at least one of the other components into volatile memory and process them, and store various data in non-volatile memory.

[0054] The processor (80) may include modules corresponding to various processes such as a demultiplexer, a decoder, a scaler, an audio DSP (digital signal processor), an amplifier, etc. when the electronic device (1) is implemented as a display device. Here, some or all of these modules may be implemented as an SoC. For example, modules related to image processing such as a demultiplexer, a decoder, a scaler, etc. may be implemented as an image processing SoC, and the audio DSP may be implemented as a chipset separate from the SoC.

[0055] FIG. 2 is an exploded view illustrating an electronic device according to various embodiments of the present disclosure.

[0056] An electronic device (1) according to various embodiments of the present disclosure may be a display device as illustrated in FIG. 2. The electronic device (1) may include a housing (10) forming an exterior, a display (30), and a printed circuit board (100).

[0057] The housing (10) may include an edge frame (11) forming a side surface of the electronic device (1) and a rear chassis (13) forming a rear surface of the electronic device (1). The edge frame (11) may have a frame shape with an open front surface and a rear surface. The rear chassis (13) may be coupled to the edge frame (11). The rear chassis (13) may be coupled to the open rear surface of the edge frame (11) to form an exterior of the electronic device (1) together with the edge frame (11).

[0058] The display (30) may be placed inside the housing (10). The display (30) may be provided with a screen (31) on which clear and moving images are displayed. The display (30) may display various images on the screen according to an image signal input from the outside. The display (30) may include a self-luminous display panel in which an image is generated by a plurality of pixels independently generating light, or a non-luminous display panel in which an image is generated by a plurality of pixels reflecting / transmitting / blocking light.

[0059] A display panel may be provided with a display driver IC. The display driver IC may include an interface module, a buffer memory, an image processing module, or a mapping module. The display driver IC may receive, for example, image information including image data or an image control signal corresponding to a command for controlling the image data, from another component of the electronic device (1) through the interface module. For example, the image information may be received from a processor (80) (e.g., a main processor (e.g., an application processor) or an auxiliary processor (e.g., a graphics processing unit) that operates independently of the function of the main processor).

[0060] The display driver IC can communicate with the sensor module and the interface module. In addition, the display driver IC can store at least a portion of the received image information in a buffer memory, for example, on a frame basis. The image processing module can, for example, perform preprocessing or postprocessing (e.g., adjusting resolution, brightness, or size) on at least a portion of the image data based on characteristics of the image data or characteristics of the display panel. The mapping module can generate a voltage value or a current value corresponding to the image data preprocessed or postprocessed through the image processing module. According to one embodiment, the generation of the voltage value or current value can be performed based at least in part on, for example, the properties of the pixels of the display panel (e.g., the arrangement of the pixels (RGB stripe or pentile structure) or the size of each subpixel). At least some of the pixels of the display panel can be driven based at least in part on, for example, the voltage value or current value, so that visual information (e.g., text, an image, or an icon) corresponding to the image data can be displayed through the display (30).

[0061] The display driver IC can transmit a driving signal (e.g., a driver driving signal, a gate driving signal, etc.) to the display based on image information received from the processor (80). The display driver IC can display an image based on the image signal received from the processor (80). For example, the display driver IC can generate driving signals for a plurality of sub-pixels based on the image signal received from the processor (80), and display an image by controlling the light emission of the plurality of sub-pixels based on the driving signals.

[0062] A printed circuit board (100) may be placed between the housing (10) and the display (30). The printed circuit board (100) may be detachably attached to the rear chassis (13) by a plurality of screws. The printed circuit board (100) may be used as a main board different from the display board included in the display (30).

[0063] A printed circuit board (100) may have an insulating layer and a mounting layer provided on both sides (front and back) of the insulating layer. The insulating layer may be a prepreg. For example, the insulating layer may be a composite material in which a matrix resin is impregnated into reinforcing fibers. The mounting layer may include a metal layer or metal wiring to be electrically connected to a plurality of electronic components or electronic component modules (200, 300, see FIG. 3). For example, the mounting layer may be formed of copper. The processor (80), electrode wires or electrode pads of the plurality of electronic components and / or electronic component modules (200, 300) may be electrically connected to the mounting layer. A solder mask for corrosion prevention and a silk screen for displaying characters or symbols may be provided on the mounting layer.

[0064] FIG. 3 is a perspective view illustrating a portion of a printed circuit board of an electronic device according to various embodiments of the present disclosure. FIG. 4 is a diagram illustrating an example in which a pair of electronic component modules are arranged in an intersecting direction according to various embodiments of the present disclosure.

[0065] Referring to FIG. 3, the printed circuit board (100) may be provided with a mounting hole (110) into which a first electronic component module (210) and a second electronic component module (220) may be mounted. The mounting hole (110) may have a length along the X-axis direction of FIG. 3 and a width along the Y-axis direction of FIG. 3.

[0066] For example, the length of the mounting hole (110) may be approximately smaller than the lengths of the first electronic component module (210) and the second electronic component module (220). In this case, a plurality of first electronic components (213) mounted on the first electronic component module (210) and a plurality of second electronic components (223) mounted on the second electronic component module (220) may be inserted, and both ends of the first substrate (211) of the first electronic component module (210) and both ends of the second substrate (221) of the second electronic component module (220) may be respectively placed around the mounting hole (110). The width of the mounting hole (110) may be larger than the widths of the first electronic component module (210) and the second electronic component module (210) when the first electronic component module (210) and the second electronic component module (220) are arranged to intersect or be interleaved with each other. In this case, a part of the first substrate (211) of the first electronic component module (210) and a part of the second substrate (221) of the second electronic component module (220) can be inserted into the mounting hole (110).

[0067] The first electronic element module (210) and the second electronic element module (220) mounted on the printed circuit board (100) may be arranged to intersect each other. This may be, for example, where a plurality of second electronic elements (223) of the second electronic element module (220) are arranged one by one between a plurality of first electronic elements (213) of the first electronic element module (210). In this case, the plurality of first electronic elements (213) of the first electronic element module (210) and the plurality of second electronic elements (223) of the second electronic element module (220) inserted into the mounting hole (110) may be arranged approximately parallel to the printed circuit board (100).

[0068] Referring to FIG. 4, one second electronic element (223-1) can be inserted into a first space (S1) between a pair of adjacent first electronic elements (213-1, 213-2). In addition, one first electronic element (213-2) can be inserted into a second space (S2) between a pair of adjacent second electronic elements (223-1, 223-2). Accordingly, when the first electronic element module (210) and the second electronic element module (220) are mounted in the mounting hole (110) of the printed circuit board (100) so as to intersect each other, the first plurality of first electronic elements (213) and the second plurality of second electronic elements (223) can be arranged alternately one by one along the X-axis direction as shown in FIG. 3.

[0069] In this case, the first gap (D1) of the pair of first electronic elements (213-1, 213-2) may be greater than the first width (W1) of the first electronic element (213-1). In addition, the second gap (D2) of the pair of second electronic elements (223-1, 223-2) may be greater than the second width (W2) of the second electronic element (223-1). For example, the first gap (D1) may be approximately 1.1 to 1.2 times the first width (W1). The second gap (D2) may be approximately 1.1 to 1.2 times the second width (W2). Therefore, when a plurality of second electronic elements (223) are inserted between a plurality of first electronic elements (213), the plurality of first electronic elements (213) and the plurality of second electronic elements (223) may not interfere with each other.

[0070] FIG. 5 is an enlarged perspective view of a plurality of electronic component modules mounted on a printed circuit board of an electronic device according to various embodiments of the present disclosure.

[0071] Referring to FIG. 5, the first electronic component module (210) may be soldered to the printed circuit board (100) on one side and the other side by solder (270). Accordingly, the first electronic component module (210) and the second electronic component module (220) may be physically fixed to the printed circuit board (100). In this case, the first substrate (211) of the first electronic component module (210) and the second substrate (221) of the second electronic component module (220) may be mounted approximately vertically with respect to the mounting surface (100a) of the printed circuit board (100). Accordingly, the first electronic component module (210) and the second electronic component module (220) may be mounted on the printed circuit board (100) so as to have a minimum / relatively small height from the mounting surface (100a) of the printed circuit board (100).

[0072] The first electronic element module (210) and the second electronic element module (220) can be mutually attached by an adhesive (400). In this case, the adhesive (400) can be applied between at least one of the plurality of first electronic elements (213) and the second substrate (221), and between at least one of the second electronic elements (223) and the first substrate (211).

[0073] For example, as shown in FIG. 5, an adhesive (400) may be applied between two first electronic elements (213-1, 213-n) located at the outermost side among the plurality of first electronic elements of the first electronic element module (210) and the second substrate (221) of the electronic element module (220). In addition, an adhesive (400) may be applied between two second electronic elements (223-1, 223-n) located at the outermost side among the plurality of second electronic elements of the second electronic element module (220) and the first substrate (211) of the first electronic element module (210). Accordingly, the first electronic element module (210) and the second electronic element module (220) may be firmly fixed to each other through the adhesive (400).

[0074] Hereinafter, the first electronic component module (210) will be described with reference to the drawings. The second electronic component module (220) has substantially the same structure as the first electronic component module (210), so a detailed description thereof will be omitted.

[0075] FIG. 6 is a perspective view illustrating an electronic component module mounted on a printed circuit board of an electronic device according to various embodiments of the present disclosure. FIG. 7 is a diagram illustrating an example in which an electronic component module according to various embodiments of the present disclosure includes a DIP (dual in-line package) type capacitor.

[0076] Referring to FIG. 6, the first electronic element module (210) may include a first substrate (211) and a plurality of first electronic elements (213) arranged in one column (or one row) with a first interval (D1) on a first surface (211a) of the first substrate (211).

[0077] A first substrate (211) may be provided with a plurality of conductive metal terminals (212) on both sides of a first surface (211a) and on both sides of a second surface (211b) opposite to the first surface (211a). The plurality of conductive metal terminals (212) may be electrically and physically connected to a mounting surface (110a, see FIG. 3a) of a printed circuit board by applying solder (270). One of the conductive metal terminals (212) may be electrically connected to a first wiring (216) formed on a second surface (211b) of the first substrate (211). Another of the conductive metal terminals (212) may be electrically connected to a second wiring (218) formed on a second surface (211b) of the first substrate (211).

[0078] Referring to Fig. 7, the first electronic element (213) may be a capacitor. For example, the first electronic element (213) may be a DIP type capacitor having a first lead wire (214) and a second lead wire (215) provided at the bottom. The first lead wire (214) and the second lead wire (215) may be inserted into a first through hole (217) and a second through hole (219) provided in a first substrate (211).

[0079] The first lead wire (214) can be electrically connected to the first wiring (216) by solder (250, see FIG. 4). The second lead wire (215) can be electrically connected to the second wiring (218) by solder (250). The first wiring (216) and the second wiring (218) can be formed on the second surface (211b) of the first substrate (211) along the longitudinal direction of the first substrate (211) at a constant interval.

[0080] The first electronic element (213) is not limited to a DIP type capacitor and may be an SMD type capacitor.

[0081] FIG. 8 is a drawing showing an example of an electronic component module including a SMD (surface mount device) type capacitor according to various embodiments of the present disclosure.

[0082] As shown in Fig. 8, all of the plurality of first electronic elements (213') included in the first electronic element module (210') may be SMD type capacitors. In this case, the plurality of through holes may be omitted in the first substrate (211').

[0083] The first electronic element (213') may have a small substrate (212') provided at the bottom, and a first terminal (214') and a second terminal (215') may be provided on the lower surface of the small substrate (211'). The first substrate (211') may have a first wiring (216') and a second wiring (218') formed along the length direction of the first substrate (211') at intervals on the first surface (211a').

[0084] The first terminal (214') of the first electronic element (213') can be soldered to a first pad (216a') formed extending from the first wiring (216'). The second terminal (215') of the first electronic element (213') can be soldered to a second pad (218a') formed extending from the second wiring (218').

[0085] FIG. 9 is a drawing showing a comparative example in which a plurality of electronic component modules are individually arranged in parallel. FIG. 10 is a drawing showing an example in which a plurality of electronic component modules are arranged in pairs in an intersecting direction according to various embodiments of the present disclosure.

[0086] Referring to FIG. 9, the printed circuit board (100-1) according to the comparative example has six electronic component modules (230-1, 230-2, 230-3, 230-4, 230-5, 230-6) mounted in six mounting holes (110-1, 110-2, 110-3, 110-4, 110-5, 110-6), respectively. In this way, the printed circuit board (100-1) according to the comparative example is arranged so that the electronic component modules correspond one-to-one to the mounting holes.

[0087] In this way, when one electronic component module (230-1) is mounted in one mounting hole (110-1), a dead space (DS) occurs in the mounting hole (110-1). Due to the dead space (DS) occurring in the six mounting holes (110-1, 110-2, 110-3, 110-4, 110-5, 110-6), it is difficult to reduce the size of the printed circuit board (100-1). The dead space (DS) is caused by the gap (D3) between adjacent electronic components (233) mounted on the substrate (231) of the electronic component module (230-1).

[0088] A plurality of electronic components (233) are grasped by fingers provided on a robot arm and automatically mounted on a substrate (231). When the fingers grasp the electronic components and mount them on the substrate (231), a certain distance (D3) must be maintained between adjacent electronic components (233) to prevent or avoid interference between the fingers and electronic components previously mounted on the substrate (231). Therefore, it is difficult to reduce the distance (D3) between the plurality of electronic components (233) of the electronic component module (230-1).

[0089] The printed circuit board of the present disclosure can utilize dead space (DS) by arranging multiple electronic component modules differently from the comparative example.

[0090] Referring to FIG. 10, a printed circuit board (100-2) according to one or more embodiments of the present disclosure may have a plurality of mounting holes spaced approximately parallel to each other. The plurality of mounting holes may be first, second, and third mounting holes (110a-1, 110a-2, 110a-3).

[0091] In this case, the printed circuit board (100-1) may be mounted so that the first electronic component module (210-1) and the second electronic component module (220-1) intersect with each other in the first, second, and third mounting holes (110a-1, 110a-2, 110a-3), the third electronic component module (210-2) and the fourth electronic component module (220-2) intersect with each other, and the fifth electronic component module (210-3) and the sixth electronic component module (220-3) intersect with each other.

[0092] In this way, the printed circuit board (100-2) according to various embodiments of the present disclosure has three fewer mounting holes than the printed circuit board (100-1) of the comparative example, but can mount six electronic component modules, the same as the printed circuit board (100-1) of the comparative example.

[0093] Accordingly, the printed circuit board (100-2) according to a plurality of embodiments of the present disclosure can reduce the area where the electronic component module is mounted by approximately 40 to 50% compared to the comparative example of FIG. 9. The printed circuit board (100-2) can be reduced in size by the amount of the spare area (103). In addition, the spare area (103) of the printed circuit board (100-2) can be used as an area for mounting electronic components, etc., for implementing various additional functions of the electronic device (1).

[0094] The printed circuit board (100-2) may omit the first part (105) of the printed circuit board (100-2) positioned between the first and second mounting holes (110a-1, 110a-2) and the second part (106) of the printed circuit board (100-2) positioned between the second and third mounting holes (110a-2, 110a-3). In this case, the printed circuit board (100-2) may have six electronic component modules (210-1, 210-2, 210-3, 220-1, 220-2, 220-3) installed in one mounting hole.

[0095] The third electronic element module (210-2) and the fourth electronic element module (220-2), which are cross-aligned with each other, can be arranged adjacent to the first electronic element module (210-1), and the fifth electronic element module (210-3) and the fourth electronic element module (220-3), which are cross-aligned with each other, can be arranged adjacent to the third electronic element module (210-2). In this case, the size of the printed circuit board (100-2) can be further reduced by the size of the first portion (105) and the second portion (106).

[0096] FIG. 11 is a drawing showing an example of arranging a plurality of electronic component modules in horizontal and vertical directions according to various embodiments of the present disclosure.

[0097] Referring to FIG. 11, a printed circuit board (100-3) according to various embodiments of the present disclosure can arrange a plurality of electronic component modules in various directions depending on its shape.

[0098] For example, the printed circuit board (100-3) may have a shape in which the upper right side of the printed circuit board (100-3) is cut off. The printed circuit board (100-3) may have a width wider than the upper width of the printed circuit board (100-3), and the first electronic component module (210b-1) and the second electronic component module (220b-1) may be arranged to cross each other along the first direction (e.g., the X-axis direction of FIG. 11) on the lower side of the printed circuit board (100-3). The printed circuit board (100-3) may be arranged so that the third electronic component module (210b-2) and the fourth electronic component module (220b-2) are intersected with each other along the second direction (e.g., the Y-axis direction of FIG. 11) on the upper left side of the printed circuit board (100-3), and the fifth electronic component module (210b-3) and the sixth electronic component module (220b-3) are intersected with each other along the second direction.

[0099] The lengths of the third electronic component module (210b-2), the fourth electronic component module (220b-2), the fifth electronic component module (210b-3), and the sixth electronic component module (220b-3) may be shorter than the lengths of the first electronic component module (210b-1) and the second electronic component module (220b-1), respectively. Accordingly, the length of the first mounting hole (110b-1) may be formed to be longer than the lengths of the second and third mounting holes (110b-2, 110b-3).

[0100] In this way, the printed circuit board (100-3) can apply various arrangement directions and lengths of multiple electronic element modules in consideration of its shape, thereby improving ease of manufacturing.

[0101] A pair of electronic component modules (210, 220) arranged to cross each other as shown in Fig. 5 can be firmly fixed to each other using an adhesive (400). Hereinafter, a printed circuit device in which a pair of electronic component modules can be firmly fixed to each other without using an adhesive (400) will be described with reference to the drawings.

[0102] FIG. 12 is a diagram showing an example in which a pair of electronic component modules are arranged in an intersecting direction according to various embodiments of the present disclosure. FIG. 13 is a diagram showing a substrate of an electronic component module according to various embodiments of the present disclosure illustrated in FIG. 12.

[0103] Referring to FIG. 12, a plurality of first electronic elements (213c) of a first electronic element module (210c) can be mounted in the mounting holes (110c) of a printed circuit board (100-4) so ​​as to intersect each other. In this case, the tip ends (214c) of the plurality of first electronic elements (213c) of the first electronic element module (210c) can each penetrate the second substrate (221c) of the second electronic element module (220c). The tip ends (224c) of the plurality of second electronic elements (223c) of the second electronic element module (220c) can each penetrate the first substrate (211c) of the first electronic element module (210c).

[0104] Referring to FIG. 13, a first substrate (211c) of a first electronic component module (210c) may have first wiring (216c) and second wiring (218c) spaced apart from each other along the length direction of the first substrate (211c) on a second surface (290c). The first surface of the first substrate (211c) is formed on an opposite side of the second surface (290c), and a plurality of first electronic components (213c) may be mounted thereon. The first wiring (216c) may be connected to a plurality of first through-holes (217c), and the second wiring (218c) may be connected to a plurality of second through-holes (219c). The first wiring (216c) can be electrically connected to one of the conductive metal terminals (212c), and the second wiring (218c) can be electrically connected to another of the conductive metal terminals (212c).

[0105] A first substrate (211c) of a first electronic element module (210c) may be provided with a plurality of first insertion holes (260c) into which the tip portions (224c) of a plurality of second electronic elements (223c) of a second electronic element module (220c) are inserted. The plurality of first insertion holes (260c) may be arranged between the first wiring (216c) and the second wiring (218c) and may be provided along the length direction of the first substrate (211c) at regular intervals.

[0106] The second substrate (221c) of the second electronic element module (220c) may be formed substantially identically to the first substrate (211c) of the first electronic element module (210c). Accordingly, the second substrate (221c) may be provided with a plurality of second insertion holes into which the tip portions (214c) of the plurality of first electronic elements (213c) are inserted.

[0107] When the first electronic element module (210c) and the second electronic element module (220c) are arranged with each other, the tip portions (224c) of the plurality of second electronic elements (223c) can be inserted into the plurality of first insertion holes (260c) provided in the first substrate (211c) of the facing first electronic element module (210c), and the tip portions (214c) of the plurality of first electronic elements (213c) can be inserted into the plurality of second insertion holes provided in the second substrate (221c) of the facing second electronic element module (220c).

[0108] Accordingly, the first electronic component module (210c) and the second electronic component module (220c) can be firmly fixed to each other without using an adhesive (400). Since the printed circuit board (100-4) can omit the process of applying the adhesive (400) among the manufacturing processes, the manufacturing time can be shortened and material costs can be reduced.

[0109] FIG. 14 is a diagram showing an example in which a pair of electronic component modules are arranged in an intersecting direction according to various embodiments of the present disclosure. FIG. 15 is a diagram showing a substrate of an electronic component module according to various embodiments of the present disclosure illustrated in FIG. 14.

[0110] Referring to FIG. 14, a plurality of first electronic elements (213d) of a first electronic element module (210d) can be mounted in the mounting holes (110d) of a printed circuit board (100-5) so as to intersect each other. In this case, the plurality of first electronic elements (213d) of the first electronic element module (210d) can have their respective tip ends (214d) inserted into the plurality of first fixing grooves (262d) of the second substrate (221d) of the second electronic element module (220d). The plurality of second electronic elements (223d) of the second electronic element module (220d) can have their respective tip ends (224d) inserted into the plurality of second fixing grooves (261d) of the first substrate (211d) of the first electronic element module (210d).

[0111] Referring to FIG. 15, a first substrate (211d) of a first electronic element module (210d) may have a first wiring (216d) arranged along the length direction of the first substrate (211d) on a second surface (290d). The first surface of the first substrate (211d) is formed on the opposite side of the second surface (290d), and a plurality of first electronic elements (213d) may be mounted thereon.

[0112] The second wiring (218d) may be arranged along the length direction of the first substrate (211d) on the second surface (290d). In this case, the second wiring (218d) may be arranged spaced apart from the plurality of first fixing grooves (261d) so as not to interfere with the plurality of first fixing grooves (261d).

[0113] The first wiring (216d) can be connected to a plurality of first through-holes (217d), and the second wiring (218d) can be connected to a plurality of second through-holes (219d). The first wiring (216d) can be electrically connected to one of the conductive metal terminals (212d), and the second wiring (218d) can be electrically connected to another of the conductive metal terminals (212d).

[0114] The first substrate (211d) of the first electronic element module (210d) may be provided with a plurality of first fixing grooves (261d) on which the tip portions (224c) of the plurality of second electronic elements (223d) of the second electronic element module (220d) are mounted. The second substrate (221d) of the second electronic element module (220d) may be formed substantially identically to the first substrate (211d) of the first electronic element module (210d). Accordingly, the second substrate (221d) may be provided with a plurality of second fixing grooves (262d) on which the tip portions (214d) of the plurality of first electronic elements (213d) are mounted.

[0115] The diameter of the plurality of first fixing grooves (261d) may be formed to be slightly smaller than or approximately the same as the diameter of the tip portions (224d) of the plurality of second electric elements (223d). Accordingly, the tip portions (224d) of the plurality of second electric elements (223d) may be firmly coupled to the plurality of first fixing grooves (261d) in a pressed state. Similarly, the diameter of the plurality of second fixing grooves (262d) may be formed to be slightly smaller than or approximately the same as the diameter of the tip portions (214d) of the plurality of first electric elements (213d). Accordingly, the tip portions (214d) of the plurality of first electric elements (213d) may be firmly coupled to the plurality of second fixing grooves (262d) in a pressed state.

[0116] When the first electronic element module (210d) and the second electronic element module (220d) are arranged to cross each other, the tip portions (224d) of the plurality of second electronic elements (223d) are placed in the plurality of first fixing grooves (261d) provided in the first substrate (211d) of the facing first electronic element module (210d), and the tip portions (214d) of the plurality of first electronic elements (213d) can be inserted into the plurality of second fixing grooves (262d) provided in the second substrate (221d) of the facing second electronic element module (220d). The plurality of first fixing grooves (261d) and the plurality of second fixing grooves (262d) can be opened in the same direction.

[0117] When the first electronic element module (210d) and the second electronic element module (220d) are mounted on the printed circuit board (100-5), the height from the mounting surface (100a-5) of the printed circuit board (100-5) to the uppermost portions of the first and second electronic element modules (210d, 220d) (e.g., the upper portion of the first substrate (211d) and the upper portion of the second substrate (221d)) can be minimized / reduced.

[0118] In addition, the first electronic component module (210d) and the second electronic component module (220d) can be firmly fixed to each other without using an adhesive (400). Like the printed circuit board (100-4) of FIG. 12, the printed circuit board (100-5) can omit the process of applying an adhesive (400) among the manufacturing processes, thereby shortening the manufacturing time and reducing material costs.

[0119] While the present disclosure has been described and illustrated with reference to various exemplary embodiments, it should be understood that the various exemplary embodiments are illustrative and not limiting. Those skilled in the art will appreciate that various changes in form and detail may be made without departing from the true spirit and scope of the present disclosure, including the appended claims and their equivalents. Furthermore, it should be understood that any of the embodiments described herein may be used in conjunction with any other embodiments described herein.

Claims

1. In printed circuit boards, At least one mounting hole is provided, A first electronic component module including a first substrate and a plurality of first electronic components mounted in a row with a space between them on the first substrate; and A second electronic element module including a second substrate and a plurality of second electronic elements mounted in a row with a space between them on the second substrate; The above first electronic component module and the above second electronic component module, A printed circuit board, wherein the plurality of first electronic elements and the plurality of second electronic elements are arranged to intersect each other within the at least one mounting hole.

2. In paragraph 1, The first electronic component module has the plurality of first electronic components arranged parallel to one surface of the printed circuit board, The second electronic element module is a printed circuit board in which the plurality of second electronic elements are arranged parallel to one surface of the printed circuit board.

3. In paragraph 2, A printed circuit board in which the plurality of first electronic elements and the plurality of second electronic elements are alternately arranged one by one.

4. In paragraph 3, A printed circuit board, wherein at least one first electronic element among the plurality of first electronic elements is attached to the second substrate by an adhesive.

5. In paragraph 4, A printed circuit board, wherein at least one of the plurality of second electronic elements is attached to the first substrate via an adhesive.

6. In paragraph 3, The first substrate includes a plurality of first insertion holes configured to receive tip portions of the plurality of second electronic elements, A printed circuit board, wherein the second substrate includes a plurality of second insertion holes configured to receive tip portions of the plurality of first electronic elements.

7. In paragraph 3, The first substrate includes a plurality of first fixing grooves configured to accommodate the tip portions of the plurality of second electronic elements, A printed circuit board, wherein the second substrate includes a plurality of second fixing grooves configured to accommodate the tip portions of the plurality of first electronic elements.

8. In paragraph 7, The tip portions of the plurality of first electronic elements are press-coupled to the plurality of second fixing grooves, A printed circuit board, wherein the tip portions of the plurality of first electronic elements are press-coupled to the plurality of second fixing grooves.

9. In paragraph 1, The above printed circuit board, additional mounting holes; and A printed circuit board further comprising a third electronic element module including a third substrate and a fourth electronic element module including a fourth substrate, wherein the third electronic element module and the second electronic element module are arranged to intersect each other in the additional mounting hole in a different direction from the first electronic element module and the second electronic element module.

10. In paragraph 9, The above printed circuit board, A printed circuit board further comprising a third electronic element module and a fourth electronic element module, which are arranged to intersect each other and are mounted in the at least one mounting hole in the same direction as the first electronic element module and the second electronic element module.

11. In paragraph 1, A printed circuit board comprising a plurality of conductive metal terminals configured such that the first substrate and the second substrate are soldered to the printed circuit board, at one end and the other end of the first substrate and at one end and the other end of the second substrate.

12. In paragraph 1, Each of the plurality of first electronic elements and the plurality of second electronic elements, A printed circuit board including a capacitor of the DIP (dual in-line package) type or the SMD (surface mount device) type.

13. In electronic devices, housing; a display disposed in the housing; and A printed circuit board disposed between the display and the housing and including at least one processor that individually and / or collectively includes processing circuitry to control the operation of the display; The above printed circuit board, At least one mounting hole is provided, A first electronic component module including a first substrate and a plurality of first electronic components mounted in a row with a space between them on the first substrate; and A second electronic element module including a second substrate and a plurality of second electronic elements mounted in a row with a space between them on the second substrate; The above first electronic component module and the above second electronic component module, An electronic device wherein the plurality of first electronic elements and the plurality of second electronic elements are arranged to intersect each other within the at least one mounting hole.

14. In paragraph 13, The first electronic component module has the plurality of first electronic components arranged parallel to one surface of the printed circuit board, The second electronic element module has the plurality of second electronic elements arranged parallel to one surface of the printed circuit board, An electronic device in which the plurality of first electronic elements and the plurality of second electronic elements are alternately arranged one by one.

15. In paragraph 14, At least one first electronic element among the plurality of first electronic elements is attached to the second substrate by an adhesive, An electronic device, wherein at least one of the plurality of second electronic elements is attached to the first substrate via an adhesive.

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