Pin connector bridge for semiconductor chip devices and associated methods of manufacture and use

Abstract

Electrical interface devices for passively engaging with a chip device to facilitate operation of a diagnostic chip are provided herein. chip. Such devices can include a bridge connector having pin contacts thereon that is pivotally mounted within a processing module that passively actuated upon insertion of the chip device to deploy the pin contacts and provide controlled engagement with corresponding contact pads of the chip device. Such bridge connectors can include cam(s) having cam surface(s) designed to facilitate rotation of the connector to a deployed configuration and controlled engagement of the pin contacts to facilitate a scrubbing action of the pin contacts with the contact pads. Methods of assembly and use are also provided herein.

Description

PIN CONNECTOR BRIDGE FOR SEMICONDUCTOR CHIP DEVICES AND ASSOCIATED METHODS OF MANUFACTURE AND USECROSS-REFERENCES TO RELATED APPLICATIONS

[0001] This application is being filed on January 30, 2025, as a PCT International application and claims the benefit of U.S. Provisional Application No. 63 / 627,649, filed on January 31, 2024, the disclosure of which is hereby incorporated by reference in its entirety. To the extent appropriate, a claim of priority is made to the abovedisclosed application.

[0002] This application is generally related to U.S. Provisional Application No. 63 / 592,087 entitled “Thermal Switch for Diagnostic Detection Chip Devices and Associated Methods of Manufacture and Use” filed on October 20, 2023; U.S. Application No. 16 / 577,650 entitled “System, Device and Methods of Sample Processing Using Semiconductor Detection Chips” filed on September 20, 2019; U.S. Application No. 15 / 718,840 entitled “Fluidic Bridge Device and Sample Processing Methods” filed September 28, 2017; U.S. Patent No. 6,374,684 entitled “Fluid Control and Processing System,” filed August 25, 2000; U.S. Patent No. 8,048,386 entitled “Fluid Processing and Control,” filed February 25, 2002; and U.S. Application No. 15 / 217,902 entitled “Thermal Control Device and Methods of Use” filed July 22, 2016; each of which is incorporated herein by reference in its entirety for all purposes.BACKGROUND

[0003] The present disclosure relates generally to electrical interfaces for diagnostic detection chip devices, as well as methods of manufacture and use, particularly electrical pin connectors.

[0004] In recent years, there has been considerable development in the use of semiconductor diagnostic detection chips in performing fluid sample analysis (e.g. testing of clinical, biological, or environmental samples). One continual challenge in conventional MEMs technologies in diagnostics has been the lack of flexible sample preparation front end to provide a fluid sample suitable for analysis with the semiconductor chips. Sample preparation of such fluid samples involves a series of processing steps, including thermal cycling for sample preparation before performing detection of the prepared fluid sample with a diagnostic chip. Whether incorporated into a bench-top instrument, a portable analyzer, a disposable cartridge, or a combination thereof, such processing typically involves complex assemblies andprocessing algorithms. Moreover, devices developed for operating diagnostic chips often lack sample preparation capabilities.

[0005] Conventional approaches for processing fluid samples typically involves substantial manual operation, while more recent approaches have sought to automate many of the processing steps and can include the use of sample cartridges that employ a series of regions or chambers each configured for subjecting the fluid sample to a specific processing step. As the fluid sample flows through the cartridge sequentially from region or chamber to a subsequent region or chamber of the cartridge, the fluid sample undergoes the processing steps according to a specific protocol. Such systems, however, generally include an integrated means of analysis, and are not typically amenable to use with a semiconductor chip. The standard approach of utilizing semiconductor detection chips, such as “lab on a chip” devices, generally requires a considerably complex, time-consuming and costly endeavor, requiring the chip be incorporated into a conventional chip package and then incorporated into much larger systems utilizing conventional fluidic transport means to transport a fluid sample to the chip device. The fluid sample is typically prepared by one or more entirely separate systems (often including manual interaction) and then pipetted into the fluid transport system to be supplied to the chip package. These challenges associated with pre and post testing processes often minimize the advantages and benefits of such “lab on a chip” devices and present a practical barrier to their widespread use and acceptance in diagnostic testing. In order to make high functionality MEMS / silicon chip technologies feasible in the context of high volume diagnostic testing, it has been proposed to incorporate such devices with existing sample cartridge technologies that perform sample preparation. While this approach represents a marked advancement in the art, the conventional means of thermal cycling are less suited for use with semiconductor chips for various reasons.

[0006] Thus, there is need for systems and methods that improves integration of sample preparation technology with diagnostic chip technology, particularly in regard to electrical interfacing between a sample cartridge processing equipment and semiconductor diagnostic chips, particularly chips incorporated within a diagnostic chip carrier device attached to a sample preparation cartridge. There is further need for developing electrical interfaces that are compatible with existing sample processing technologies that meet the heightened requirements of electrical interfacing with diagnostic chips. There is further need to perform more reliable and robust electricalinterfaces and approaches that are compatible with existing sample cartridge processing modules and workflows.BRIEF SUMMARY

[0007] The present disclosure provides electrical interface components that can be utilized for electrically connecting with diagnostic detection chips and chip devices (also referred to as “chip,” “detection chip,” “semiconductor chip,” “diagnostic chip”). As used herein, “chip device” can refer to a semiconductor chip package, which can include contact pads electrically coupled with the semiconductor chip, or a chip carrier device that supports the semiconductor chip or chip package. In some embodiments, the chip carrier device includes an access window that allows access to contact pads of the semiconductor chip or chip package. In some embodiments, the chip earner device includes contact pads thereon that are electrically coupled with the semiconductor chip or chip package. Various approaches are provided that facilitate ease of use and assembly and improve integration of the electncal interface within the overall device.

[0008] In a first aspect, the disclosure pertains to an electrical interface comprising a connector bridge having one or more contacts for electrically interfacing with one or more corresponding contacts. In some embodiments, the connection interface uses a cam with a cam surface designs to provide actuation of connector and a tapered portion to assure precise alignment between contacts. Preferably, the design protects the connector and contacts when not in use and does not require separate actuation. For example, the connector design can utilize passive actuation that deploys the contact of the connector to interface with the chip device upon insertion of the chip device into a processing module. In some embodiments, the connector design provides controlled deployment that automatically aligns the connection and creates the proper scrub action to break through the oxide layer on the contact pads of the chip or chip device.

[0009] In one aspect, the disclosure pertains to a connector bridge that includes: a body having a protruding nose on which is disposed one or more pin contacts; one or more pivots configured to facilitate rotation of the body along a pivot axis between a non-deploy ed position and a deployed position; and one or more cams having a cam surface designed to translate engagement with a semiconductor chip device into movement of the body from the non-deployed position to the deployed position and engage the one or more pin contacts with one or more contact pads of the semiconductor chip device. In some embodiments, the cam surface is designed with a first cam surface to translate linear movement from engagement with thesemiconductor chip device into rotational movement of the body about the one or more pivots, thereby engaging the one or more pin contacts with the one or more contact pads of the semiconductor chip device. The first cam surface can include a variable radius of curvature. In some embodiments, the cam surface is further designed with a second cam surface to translate linear movement from the semiconductor chip device into translational movement of the body along a same direction so as to scrape or scrub the one or more contact pads with the one or more pin contacts. The second cam surface is tapered and linear.

[0010] In some embodiments, the one or more pin contacts comprise a plurality of pin contacts that correspond to a plurality of contact pads of the semiconductor chip device. The plurality of pin contacts are arranged to correspond with the plurality of contact pads. In some embodiments, the plurality of pin contacts are within a range of 6 and 24 pins. In some embodiments, the body is elongated along the pivot axis and the plurality' of pins are disposed in a row that extends in a direction parallel to the pivot axis. The one or more pivots can include a pair of pivots disposed on opposite sides of the elongate body. The one or more cams can include a pair of cams disposed at or near opposite ends of the elongate body. In some embodiments, the plurality of pin contacts are pogo pins.

[0011] In some embodiments, the semiconductor chip device comprises a chip carrier device that supports a diagnostic chip. In some embodiments, the connector bridge is configured to be mounted within a module, the module configured for operating the diagnostic chip. The connector bridge can be mounted within the module and to provide compliance of within about 0.4-0.6 mm in a vertical and horizontal direction to accommodate operation of the module. In some embodiments, the connector bridge includes a biasing means that biases rotation of the connector bridge along the one or more pivots to the non-deployed position so as to protect the plurality of pin contacts. The biasing means can include one or more torsion springs. In some embodiments, the connector bridge includes a flex cable electrically connected to the one or more pin contacts. The flex cable can be attached to the body at a position offset from the pivot axis and is flexed so as to exert a rotational bias in a same direction as the biasing means.

[0012] In another aspect, the disclosure pertains to a module for testing a sample via a diagnostic chip. In some embodiments, the module includes: a housing; a receiving bay for receiving a sample cartridge, the sample cartridge having an attached chipcarrier device supporting the diagnostic chip, wherein the receiving bay further comprises a processing receptable that receives the chip carrier device when the sample cartridge is received within the receiving bay; control circuitry configured for controlling operation of the sample cartridge to prepare a sample disposed within the sample cartridge and transport the prepared sample to the chip carrier device and for controlling operation of the diagnostic chip; an electrical interface to facilitate operation and communication with the diagnostic chip; and a bridge connector as in claim 6 that is electrically connected to the electrical interface and rotatably mounted within the module, wherein the bridge connector is configured to electrically interface with a plurality of contacts pads of the diagnostic chip upon insertion of the cartridge into the module.

[0013] In some embodiments, the cam surface of the bridge connector is designed with a first cam surface to translate linear movement from the semiconductor chip device into rotational movement of the body about the one or more pivots to the deployed position, thereby engaging the one or more pin contacts with the one or more contact pads of the semiconductor chip device. The first cam surface has a variable radius of curvature. In some embodiments, the cam surface is further designed with a second cam surface to translate linear movement from the semiconductor chip device into translational movement of the body along a same direction so as to scrape or scrub the one or more contact pads with the one or more pin contacts. The second cam surface is tapered and linear. In some embodiments, the one or more pin contacts of the bridge connector comprise a plurality of pin contacts that are arranged to correspond to a plurality of contact pads of the semiconductor chip device. In some embodiments, the plurality of pin contacts are within a range of 6 and 24 pins. In some embodiments, the body is elongated along the pivot axis and the plurality of pins are disposed in a row that extends in a direction parallel to the pivot axis. The one or more pivots can include a pair of pivots disposed on opposite sides of the elongate body. The one or more cams can include a pair of cams disposed at or near opposite ends of the elongate body. In some embodiments, the plurality of pin contacts are pogo pins.

[0014] In yet another aspect, the disclosure pertains to a chip device configured for interfacing with a connector bridge. In some embodiments, the chip device includes: an elongated frame configured for supporting a semiconductor chip therein, the elongated frame having a fluidic interface for fluidically coupling with a cartridge at one end and a chip earner portion for supporting the semiconductor chip at or near anopposite end, a flowcell adjacent an active surface of the semiconductor chip when disposed within the earner portion; and one or more protrusions extending laterally from the elongated body and configured for engagement with one or more cam surfaces of a connector bridge of a module to facilitate passive deployment of the bridge connector to electrically interface one or more pin contacts of the connector bridge with the semiconductor chip. In some embodiments, the frame includes an access window adjacent a plurality of contact pads of the semiconductor chip. In some embodiments, the one or more protrusions comprise one or more cam shoulders designed for engagement with the one or more cams of the connector bridge. The fluidic interface can include a fluidic inlet and outlet configured for coupling with corresponding ports of a sample cartridge. In some embodiments, the semiconductor chip is a diagnostic chip and the module is configured for processing the sample cartridge and testing the sample by operation of the diagnostic chip.

[0015] In still another aspect, the disclosure pertains to a method of testing a sample with a diagnostic chip. Such methods can include steps of: inserting a sample cartridge containing a fluid sample into a module, the sample cartridge having an attached chip carrier device supporting a diagnostic chip therein; deploying a connector bridge rotatably mounted within the module by one or more pivots to a deployed position so as to electrically interface a plurality of pin contacts of the bridge connector with a plurality of contact pads of the diagnostic chip; and operating, with the module via the connector bridge, the operation of the diagnostic chip to obtain a detection for a target analyte in the fluid sample. In some embodiments, deploying the connector bridge comprises engaging one or more cams of the connector bridge with one or more cam shoulders of the chip carrier device to effect rotation of the connector bridge. In some embodiments, rotationally biasing the connector bridge toward a non-deploy ed position, when disengaged from the chip carrier device to protect the plurality of pin contacts. In some embodiments, the cam surface of the bridge connector is designed with a first cam surface to translate linear movement from the semiconductor chip device into rotational movement of the body about the one or more pivots, thereby engaging the one or more pin contacts with the one or more contact pads of the semiconductor chip device. The first cam surface has a variable radius of curvature. In some embodiments, the cam surface is further designed with a second cam surface to translate linear movement from the semiconductor chip device into translational movement of the body along a same direction so as to scrape or scrubthe one or more contact pads with the one or more pin contacts. The second cam surface is tapered and linear. In some embodiments, the plurality of pin contacts of the bridge connector are arranged to correspond to the plurality of contact pads of the diagnostic chip. The plurality of pin contacts can be within a range of 6 and 24 pins. In some embodiments, the plurality of pin contacts comprise pogo pins. In some embodiments, the method further includes: operating, with the module, the sample cartridge, thereby transporting the fluid sample into the chip carrier device to interface with an active surface of the diagnostic chip.

[0016] Typically, embodiments described herein generally use a COB (Chip On Board) strategy, which involves a circuit board which the semiconductor chip is bonded to, then a wire bonding operation to electrically attach the chip to the board, and an epoxy encapsulant to protect the wire bonds. This approach completely eliminates the COB components and processes, significantly reducing the unit cost of the device.

[0017] It is appreciated that various aspects of the concepts and embodiments set forth above can be further understood by referring to the following figures and descriptions.BRIEF DESCRIPTION OF THE DRAWINGS

[0018] FIG. 1 is an overview of a sample cartridge fluidically coupled with a chip carrier device supporting a semiconductor diagnostic chip and an associated instrument interface of a module having a connector bridge for electrically interfacing with the diagnostic chip and athermal component for thermal cycling, in accordance with some embodiments of the disclosure.

[0019] FIG. 2A illustrates the instrument interface board of the module, the instrument interface board having an connector bridge having pogo pin contacts for interfacing with contact pads of the chip device and a thermal component for thermal cycling, which are also shown in FIG. 2B interfaced with the chip device, in accordance with some embodiments.

[0020] FIG. 3 illustrates a detailed view of the sample cartridge fluidically coupled with a chip carrier device supporting a diagnostic chip, in accordance with some embodiments.

[0021] FIGS. 4A-4E illustrate methods of fabricating, assembling diagnostic chip devices, in accordance with some embodiments.

[0022] FIGS. 5A-5D illustrate methods of fabricating, assembling diagnostic chip devices, in accordance with some embodiments.

[0023] FIGS. 6A-6C illustrate methods of fabricating, assembling diagnostic chip devices, in accordance with some embodiments.

[0024] FIGS. 7A-7C illustrate methods of fabricating, assembling diagnostic chip devices, in accordance with some embodiments.

[0025] FIG. 8 illustrates a diagnostic chip device before and instrument interface, in accordance with some embodiments.

[0026] FIGS. 9A-9C illustrate an integrated diagnostic chip and chip device, in accordance with some embodiments.

[0027] FIG. 10 shows an idealized thermal profile controlled to thermally cycle between elevated and reduced temperatures by a square wave, in accordance with some embodiments.

[0028] FIG. 11 shows a chip and interface assembly that includes a thermal control component with thermal switch defined by a copper slug to approach the idealized thermal profile, in accordance with some embodiments.

[0029] FIG. 12 shows an exemplary connector bridge for electrically interfacing with a diagnostic chip device, in accordance with some embodiments.

[0030] FIG. 13 shows an exemplary diagnostic chip carrier device configured for interfacing with the connector bridge in FIG. 12, in accordance with some embodiments.

[0031] FIG. 14 shows the product modularity of the module having the connector bridge, in accordance with some embodiments.

[0032] FIGS. 15A-15C demonstrates the familiarity and consistency of workflow by showing insertion of a sample cartridge having an attached diagnostic chip carrier device into a module having an electrical interface with connector bridge, in accordance with some embodiments.

[0033] FIG. 16A-16B demonstrates the fool-proof nature of embodiments of the electrical interface configuration in preventing insertion of a sample cartridge with attached diagnostic chip carrier device into a conventional module, as shown in FIG.16 A, and preventing deployment and harm of the delicate pin contacts of the connector bridge upon insertion of a conventional sample cartndge with attached reaction vessel, as shown in FIG. 16B.

[0034] FIG. 17 shows the precision and tolerances of the electrical interface between the diagnostic chip carrier device and connector bridge, in accordance with some embodiments.

[0035] FIG. 18 shows details of the electrical pads of an exemplary diagnostic chip and scrub region of the interface with pin contacts of the connector bridge, in accordance with some embodiments.

[0036] FIG. 19 shows compliance details of an exemplary connector bridge of an electrical interface of the module, in accordance with some embodiments.

[0037] FIGS. 20A-20B shows exemplar}' diagnostic chips for use with a chip carrier device and connector bridge electrical interface, which demonstrate the versatility and design modularity of the electrical interface, in accordance with some embodiments.

[0038] FIGS. 21A-21B shows the interaction of the flex cable of the electrical pin connector device, in accordance with some embodiments.

[0039] FIGS. 22A-22D show a scrubbing movement and geometry of the contact pins of the connector bridge during insertion of the chip earner device into the module, in accordance with some embodiments.

[0040] FIGS. 23-24 show the overall mechanical advantage of the electrical interface actuation of the pogo pins of the pin connector, in accordance with some embodiments, as compared to an conventional approach.

[0041] FIG. 25 show mounting of an exemplary diagnostic chip onto a diagnostic chip device compatible for use with a connector bridge electrical interface, in accordance with some embodiments.

[0042] FIG. 26 shows a flowchart of sample testing with a sample cartridge and module having an electrical interface with a connector bridge, in accordance with some embodiments.DETAILED DESCRIPTION

[0043] The present disclosure relates generally to a system, devices and methods for controlling temperature for thermal cycling of a diagnostic chip, particularly when disposed in a chip carrier device attached to a sample cartridge within a diagnostic module.

[0044] In one aspect, the disclosure pertains to an electrical interface that include an electrical connector having multiple pins, such as pogo pins, arranged for electrically contacting corresponding electrical contacts of a diagnostic chip and / or diagnostic chip device. In some embodiments, the contact pads are included on a chip device itself. In some embodiments, the contact pads are disposed on a chip carrier device that carries the diagnostic chip.I. Overview

[0045] In one aspect, the disclosure pertains to a thermal component that includes a thermal switch to improve cooling of a semiconductor diagnostic chip during cooling, thereby improving efficiency of thermal cycling. In some embodiments, the thermal component is designed to interface the thermal switch by engaging the diagnostic chip while disposed within a chip carrier device. The chip carrier device includes one or more fluid conduits that are fluidly coupleable with one or more ports of a sample cartridge to facilitate transport of a processed fluid sample from the cartridge into the chip carrier device through the one or more fluid conduits to facilitate transport of the fluid sample to the semiconductor chip in the chip carrier device. The sample cartridge is received by a module which facilitates operation of the sample cartridge to perform processing and transport of the processed fluid sample into the chip carrier device and includes an instrument interface that electrically connects to the chip carrier device to facilitate operation of the semiconductor chip carried within the chip carrier device and operate the thermal components to perform thermal cycling.A. Chip

[0046] As described herein, the term “chip” can refer to the chip itself or a chip device or chip package that includes the chip and an underlying support substrate and adjacent electrical interface that is electrically connected to the chip. Typically, the chip includes a silicon sensor element having an active face that is sealingly engaged with a flowcell filled with a prepared fluid sample. In some embodiments, the chip device is designed and configured to be carried within a chip carrier device having an integrated flowcell and fluid control features so as to be compatible for use with a sample processing module as described above. The chip device can be bonded within the recess of the chip carrier device or can be pressed into the recess and secured by a friction fit. The chip is provided to the user already secured within a chip carrier device, or an end user can assemble the chip within a chip carrier device.

[0047] In some embodiments, the semiconductor diagnostic chip is configured to perform sequencing of a nucleic acid target molecule by nanopore sequencing, which detects changes in electrical conductivity and does not require optical excitation or detection. The underlying technologies of such chips can be further understood by referring to U.S. Patent No. 8,986,928. In some embodiments, the semiconductor diagnostic chip analyzes other attributes of a target molecule in the sample, such as molecular weight and similar characteristics. Such technologies can be further understood by referring to : Xiaoyun Ding, et al. Surface acoustic wave microfluidics.Lab Chip. 2013 Sep 21; 13(18): 3626-3649. In some embodiments, the semiconductor diagnostic chip uses surface plasmon resonance to provide analysis of a target molecule, for example as used in the Biocore™ systems provided by GE Healthcare UK Limited and as described in their Biocore Sensor System Handbook (see gelifesciences.com / biacore). The entire contents of each of the above are incorporated herein by reference in their entirety.

[0048] Typically, the chip is a semiconductor diagnostic detection chip, including but not limited to CMOS, ISFET, bulk acoustic, non-bulk acoustic chips, piezo-acoustic, and pore array sensor chips. While semiconductor diagnostic chips are preferred, it is appreciated that the concepts described herein are applicable to any type of chip suitable for use in performing processing or analysis of a fluid sample.B. Chip Carrier Device

[0049] The chip carrier device is adapted to fluidically couple a semiconductor chip to a sample cartridge as described herein. In some embodiments, the chip carrier device includes an electrical interface adapted to interface with an instrument interface board of a sample processing module which operates the sample processing cartridge. It is appreciated that the chip carrier device can be configured for use with any type of chip. In some embodiments, the chip carrier device is designed to allow analysis of the biological fluid sample with the chip by electrical operation of the chip by the instrument interface of the module. This is accomplished through electrical probe contact pads of the chip device that are electrically connected to the instrument interface of the module, such as by the connector bridge described herein.

[0050] A configuration as described above allows for a more seamless transition between processing of the fluid sample with the sample cartridge and subsequent processing or analysis of the fluid sample with the chip in the chip carrier device. This configuration facilitates industry development of semiconductor chip devices by standardizing processing or preparation of the sample and delivery of the processed sample to the chip device. Preparation of the sample can be a time consuming and laborious process to perform by hand and can be challenging to develop within a next generation chip device. By utilizing a chip carrier device instead of the reaction tube, the user can utilize the sample cartridge to prepare the sample in a sample cartridge and subsequently transport the prepared sample into the attached chip carrier device for analysis with the semiconductor chip device carried therein. Such a configuration expedites development of semiconductor chip by utilizing existing sample preparationprocesses, originally configured for PCR detection, and allowing use of such processes with a chip device.

[0051] In some embodiments, the chip carrier device can include one or more processing features in fluid communication with one or more of the fluid flow channels, such as one or more chambers, filters, traps, membranes, ports and windows, to allow additional processing steps during transport of the fluid sample to the second sample processing device. Such chambers can be configured for use with an amplification chamber to perform nucleic acid amplification, filtration, chromatography, hybridization, incubation, chemical treatment, e.g., bisulfite treatment and the like. In some embodiments, the chamber allows for accumulation of a substantial portion of the fluid sample, if not the entire fluid sample, for further processing or analysis as needed for a particular protocol.C. Sample Cartridge

[0052] The sample cartridge can be any device configured to perform one or more process steps relating to preparation and / or analysis of a biological fluid sample according to any of the methods described herein. In some embodiments, the sample cartridge is configured to perform at least sample preparation. The sample cartridge can further be configured to perform additional processes, such as detection of a target nucleic acid in a nucleic acid amplification test (NAAT), e.g., Polymerase Chain Reaction (PCR) assay, by use of a reaction tube attached to the sample cartridge. Preparation of a fluid sample generally involves a series of processing steps, which can include chemical, electrical, mechanical, thermal, optical or acoustical processing steps according to a specific protocol. Such steps can be used to perform various sample preparation functions, such as cell capture, cell lysis, binding of analyte, and binding of unwanted material.

[0053] A sample cartridge suitable for use with embodiments according to the present disclosure, includes one or more transfer ports through which the prepared fluid sample can be transported into a reaction tube for analysis. FIG. 1 illustrates an exemplary sample cartridge 100 suitable for use with a chip carrier device 200 in accordance with some embodiments. Conventionally, such a sample cartridge is associated with a planar reaction tube adapted for analysis of a fluid sample processed within the sample cartridge 100. Such a sample cartridge 100 includes various components including a main housing having one or more chambers for processing of the fluid sample, which typically include sample preparation before analysis. Inaccordance with its conventional use, after the sample cartridge 100 and reaction tube are assembled and a biological fluid sample is deposited within a chamber of the sample cartridge, the cartridge is inserted into a cartridge processing module configured for sample preparation and analysis. The cartridge processing module then facilitates the processing steps needed to perform sample preparation and the prepared sample is transported through one of a pair of transfer ports into the fluid conduit of the reaction tube 110 attached to the housing of the sample cartridge 100. The prepared biological fluid sample is then transported into a chamber of the reaction tube 110 through a fluidic interface of the reaction tube where the biological fluid sample undergo nucleic acid amplification and testing to indicate the presence or absence of a target nucleic acid analyte of interest, e.g., a bacteria, a virus, a pathogen, a toxin, or other target analyte, for example by use of an excitation and optical detection means. Such a sample cartridge can also be utilized to perform analysis with the semiconductor chips described herein by use of a chip carrier device, which is fluidically coupleable to the sample cartridge in the same or similar manner as a conventional reaction tube.

[0054] An exemplary use of a sample cartridge with a planar reaction tube configured for controlled fluid control of a prepared fluid sample is described in commonly assigned U.S. Patent Application No. 6,818,185, entitled “Cartridge for Conducting a Chemical Reaction,” filed May 30, 2000, the entire contents of which are incorporated herein by reference for all purposes. Examples of the sample cartridge and associated module are also shown and described in U.S. Patent No. 6,374,684, entitled “Fluid Control and Processing System” filed August 25, 2000, and U.S. Patent No, 8,048,386, entitled “Fluid Processing and Control,” filed February 25, 2002, the entire contents of which are incorporated herein by reference for all purposes.

[0055] Various aspects of the sample cartridge 100 shown in FIG. 3 can be further understood by referring to U.S. Patent No. 6,374,684, which described certain aspects of the sample cartridge in greater detail. Such sample cartridges can include a fluid control mechanism, such as a rotary fluid control valve, that is connected to the chambers of the sample cartridge. Rotation of the rotary fluid control valve permits fluidic communication between chambers and the valve so as to control flow of a biological fluid sample deposited in the cartridge into different chambers in which various reagents can be provided according to a particular protocol as needed to prepare the biological fluid sample for analysis. To operate the rotary valve, the cartndge processing module comprises a motor such as a stepper motor that is typically coupledto a drive train that engages with a feature of the valve in the sample cartridge to control movement of the valve and resulting movement of the fluid sample according to the desired sample preparation protocol. Fluid metering and distribution functions of the rotary valve can be utilized and controlled to perform a particular sample preparation protocol.

[0056] It is appreciated that the sample cartridge described above is but one example of a sample processing device suitable for use with the chip carrier devices in accordance with embodiments described herein. While chip carrier configurations that allow for use of such a sample cartridge are particularly advantageous as they allow utilization of existing sample cartridges and sample processing devices, it is appreciated that the concepts described herein in regard to the chip design can be applied to other sample processing devices, for example, the dual piston rotary valve device described in U.S. Patent 7,032,605, incorporated herein by reference. It is further appreciated that the chip designs described herein can be configured to be compatible with various other chip earner devices, sample cartridge configurations or other fluid sample processing devices and components, for example, any of those described in U.S. Provisional Application No. 62 / 734,079 filed September 20, 2018, incorporated herein by reference.D. Instrument Interface

[0057] In another aspect, the module includes an instrument interface to facilitate powering and communication with the chip and operation of the thermal component for thermal cycling. The instrument interface can include a circuit board adapted to engage an electrical interface of the chip device to allow the module to electrically power, control and communicate with the chip device. In some embodiments, the instrument interface is located within a common housing of the module to provide more seamless processing between the sample cartridge and the chip device. The instrument interface can be controlled by the module in coordination with transport of the fluid sample from the sample cartridge to the chip.

[0058] In some embodiments, the instrument interface board includes an electrical connector with pogo contacts and is mechanically mounted on a pivot that moves toward the chip carrier device when received within the module. The instrument interface board is configured with a connector bridge configured to pivot from a nondeployed position to a deployed position when the sample cartridge is loaded to an engaged position within the module. A cam of the connector bridge positions theconnector bridge so that the electrical contact the electrical interface of the chip device. The probe contacts are typically pogo pins on the instrument interface board that contact corresponding probe contact pads on the electrical interface of the chip device to allow the module to control analysis of the fluid sample with the chip. The instrument interface board can also host passive and active electronic components in addition to those of the chip carrier as needed for various other tasks. For example, such components could include any components needed for signal integrity, amplification, multiplexing or other such tasks.

[0059] The instrument interface board can also include the thermal component that engages the diagnostic chip within the chip carrier and / or can include components that facilitate operations of the thermal component carried on-board the chip carrier device. The components can include air pumps / blowers, servo motors, or any suitable means to facilitate operation of the thermal component as described herein.E. Example Systems

[0060] FIG. 1 illustrates an overview of a system utilizing a conventional sample cartridge 100 fluidically coupled with a chip earner device 200 that supports the diagnostic chip 210. The sample cartridge 100 is adapted for insertion into a bay of a sample processing module configured to perform one or more processing steps on a fluid sample contained within the sample cartridge through manipulation of the sample cartridge. An instrument interface 300 of the module is incorporated into the module within the bay in which sample cartridge 100 is received and includes a plate 301 having a receptacle opening 302 through which the chip carrier device 200 extends when cartridge 100 is positioned within the bay. The instrument interface 300 further includes an instrument board 310, such as a PCB board, that extends alongside a major planar surface of chip carrier device 200 and includes electrical contacts 312 arranged so as to electrically couple with corresponding probe contact pads on the major planar surface of the chip 210. The instrument interface includes a connector bridge 320 that includes the contacts 312 (typically pogo pins) and frame and cam designed to control pivoting movement of the connector bridge and pogo contacts to engage with corresponding contacts on the chip. The instrument interface further includes a thermal component 330 to facilitate thermal cycling of the sample on the diagnostic chip. In this embodiment, the thermal component 330 includes a heat sink that is moved to contact the chip during cooling.

[0061] FIG. 2A illustrates the instrument interface board 310 of the module and the electrical connector bridge 320 with pogo contacts 312 for interfacing with electrical contact pads of the chip device. Typically, the contacts 312 are arranged in a pattern, such as a rectangular array, that corresponds to the contacts of the chip device. In this embodiment, the contacts 312 are configured as pogo-pins so as to deflect upon insertion of the chip carrier device 200 through receptacle opening 302 to provide secure electrical coupling between pogo contacts 312 of pogo connector 320 and corresponding probe contact pads on the instrument interface of the chip device secured within the chip carrier device 200, as shown in FIG. 2B. Although a rectangular array of pogo-pins is depicted here, it is appreciated that the electrical contacts could be arranged in various other patterns, in accordance with a corresponding chip carrier device and that various other contact constructions could be realized. In some embodiments, the electrical contacts could be configured as one or more edge connectors or other types of multi -pin connector arrangements. It is further appreciated that the instrument interface need not utilize every contact so as to be compatible for use with a chip carrier device having differing numbers or arrangements of contact pads, as desired. In some embodiments, the electrical contacts could include an additional adapter so as to be suitable for use with various differing types of chip carrier devices. In some embodiments, it may be cost effective to package a semiconductor controller as an adjunct to the chip carrier device such that the signal connectivity is minimized. Such an approach could use any suitable connector means, which can include a standard connector type, such as a USB interface (e.g. [+1,-2, sig 3, sig 4]). The thermal component 330 includes a heat sink 331 having a protruding portion 332 that is sized and dimensioned to contact an exposed surface of the chip when the chip carrier is inserted into the module. The heat sink is mounted on a moveable support 333 and movement of the heat sink toward the chip is controlled by a servo motor 334.

[0062] FIG. 3 illustrates a detailed view of the sample cartridge 100 fluidically coupled with chip carrier device 200 with integrated fluid flow control, in accordance with some embodiments. Typically, the chip carrier device 200 is a planar device that includes a flowcell chamber for engaging against the active area of the chip and a fluidic interface 201 that fluidically couples to a fluid sample container, such as sample cartridge 100. In this embodiment, the fluidic interface 201 fluidically couples to the sample cartridge 100 and includes a pair of fluid ports (not visible) that couple withcorresponding fluid ports of the sample cartridge. On one side of the planar device is the flowcell chamber, for example, as shown in FIG. 9A. The other side of the planar device can include one or more fluid control features, such as an amplification chamber. The chip carrier device can be formed from a suitably rigid material such that the chip carrier device 200 extends outward from the sample cartridge 100, which allows clearance for various other components, such as the instrument interface board of the module and / or thermal cycling units.

[0063] The chip carrier device 200 includes a fluidic interface 201 that can be configured with fluid ports (e.g. Luer type ports) and flange arrangement that is the same or similar as that of a typical PCR reaction tube so that the fluid sample adapter can easily interface with existing sample cartridges, as described previously. It is appreciated however that various other types of fluid ports (e.g. Luer type ports, pressure fit, friction fit, snap-fit, click-fit, screw-type connectors, etc.) in various other arrangements could be used. Typically, the fluidic pathways are defined in a first substrate and sealed by a second substrate, such as a thin film, similar to the construction of conventional PCR reaction tubes. In some embodiments, the fluid sample adapter also features alignment and assembly bosses as well as mechanical snaps so that a chip carrier component or chip can be secured against a flowcell of the flowcell portion with ease. In some embodiments, the chip carrier device includes one or more channels that extend between fluid-tight couplings without any chambers, valves or ports between the proximal and distal ends. In other embodiments, the device includes one or more valves, or ports. In some embodiments, the one or more channels can include one or more chambers or regions, which can be used to process or analyze the fluidic sample, for example, chambers or regions for thermal amplification of a nucleic acid target, filtration of the sample, chromatographic separation of the sample, hybridization, and / or incubation of the sample with one or more assay reagents.

[0064] As can be seen in the example of FIG. 9A, the fluidic path leads to a flowcell chamber 953 through set of flowcell ports 953a, 953b within the flowcell. In this embodiment, the flow cell chamber 953 includes an inlet flowcell port 953a and outlet flowcell port 953b, which allow for controlled fluid transport through the fluid sample adapter 951 into the flowcell chamber 953 via the fluidic inlet 951a and fluidic outlet 951b. Typically, the flowcell inlet 953a is disposed below the flowcell outlet 953b when the fluid sample adapter 201 is oriented vertically to facilitate controlled fluid flow' through the flowcell chamber 953. It should be understood that use of the terms"inlet" and "outlet" do not limit function of any fluid inlets or outlets described herein. Fluid can be introduced and evacuated from both or either. It is appreciated that the chip carrier device can be formed as an integral component or assembled from multiple components, and can incorporate various other features (e.g. valve, filter).

[0065] In some embodiments, the chip earner device (or at least a partial assembly) is provided pre-attached to a sample cartridge with the fluid-tight couplings coupled with corresponding fluid ports of the cartridge. For example, a sample cartridge may be provided already coupled with the fluid sample adapter 201 such that an end-user can insert any chip within the chip earner device 200 against the flowcell chamber to facilitate sample detection with a chip.

[0066] The flowcell portion of the chip carrier device is configured with an open chamber that, when interfaced with an active area of a chip within the chip carrier, forms an enclosed flowcell chamber to facilitate analysis of the fluid sample with the chip. The flowcell is shaped and configured to fluidly couple with a chip within a chip carrier attached to the fluid sample adapter 201. Typically, the fluidic pathway of the fluid flow portion fluidically connects to the flowcell chamber through fluid ports located at the top and bottom of the flowcell chamber. The chamber is formed by raised lands or ridges that come in contact with the active silicon or glass element used in the detection scheme. The active element is located on the chip carried within the chip carrier and secured to the flowcell by bonding and sealing, which can be accompished by various means (e.g. using epoxy preforms, dispensed epoxy or other adhesives, a gasket, a gasket with adhesive, mechanical features, or various other means). The purpose of the flowcell adapter is to create a complete flowcell chamber, bounded by the detection surface on one side and the flowcell adpater on the remaining sides. The flowcell can include one or more coupling features defined as alignment and assembly bosses as well as mechanical snaps that are received in corresponding holes to faciliate alignment of the chip when secured within.

[0067] The chip carrier device can include a contoured region dimensioned to receive the chip within. The contoured region includes a raised ridge along the perimeter thereof to engage a corresponding portion of the flowcell portion and effectively seal the chip within the chip carrier device. The raised lands or ridge around the open flowcell chamber engage an active surface of the chip so as to form an enclosed flowcell chamber. The chip carrier can include a window 952 to provide access to the plurality of probe contacts defined on the chip itself or on an electrical interface of thechip device. Alternatively, the chip carrier device can be dimensioned so that the electrical interface of the chip or chip device extends beyond the distal end of the chip earner device so as to be accessible by the instrument interface of the module, as shown in FIG. 4E.

[0068] It is appreciated that the chip carrier device with integrated fluid control can include any of the features or structures described herein, or any of those described in U.S. Provisional Application No. 62 / 734,079 fded September 20, 2018, incorporated herein in its entirety.II. Diagnostic Chip Devices and Assemblies

[0069] In one aspect, integrated diagnostic chip designs are described that further simplifies the fundamental design of the chip device, thereby reducing manufacturing costs and allowing for further integration and simplification of the chip device. These designs are compatible with the chip carrier devices and deploy able connector bridge electrical interface descried herein.

[0070] Embodiments previously described in U.S. Provisional Application No. 62 / 734,079 assume use of a chip design fabricated according to conventional techniques. The current low cost state of the art is to use chip on board (COB) strategies to eliminate separate semiconductor packaging elements. Generally, COB techniques rely on a PCB substrate to which the chip is mounted and perform wire bonding operations and subsequent bond protection operations on the device. The PCB serves the purpose of creating a mounting surface for the chip and utilizes vias on the PCB to electrically connect the chip to connection points (e.g. probe contact pads) disposed on the side opposite the chip. This approach allows a large number of contact pads to be distributed over the relatively large surface area on the opposite side of the chip. Use of a separate PCB in this manner aids the semiconductor processing workflow and is the widely accepted, most common approach. One significant drawback with this approach is that it is fairly expensive, requiring additional materials within the PCB (often costing as much as the chip itself) and incurs further expenses within the workflow steps needed to clean and mount the chip on the PCB. Therefore, the present disclosure provides alternative, integrated approaches to designing and fabricating a diagnostic chip to facilitate use within a chip carrier device and take advantage of existing sample preparation techniques while further reducing the fabrication and workflow costs of the chip. These approaches are advantageous overconventional COB techniques and allow for the further simplification without any modification or only slight modification in chip design.

[0071] There are several different approaches proposed for streamlining diagnostic chip design for use with the sample processing systems and methods described herein. These approaches include: (i) utilizing probe contacts on a separate PCB adjacent the chip, which allows for additional alternative approaches including: (ii) given the reduced size / thickness requirements of any PCB or support substrate of the diagnostic chip, replacing the PCB with a less expensive support substrate (e.g. thinner, lighter, more flexible, etc.) (iii) utilizing flex PCB and tab bonding techniques; (iv) using a metal core board to support the chip as a thermally conductive mount; (v) eliminating the substrate entirely and forming probe contact pads in the chip itself.A. Probe Contacts on Separate PCB

[0072] In a first aspect, the streamlined chip design entails substantially reducing the size of the PCB and moving the PCB alongside of the chip device (e.g. semiconductor / MEMs) and performing the wire bonding / wire bonding protection in the areas of co-adjacency of the components. In this approach, the diagnostic chip is designed to electrically connect with probe contacts provided on a separate PCB board. This allows the PCB board or substrate of the chip to be reduced in size and further allows the probe contacts to be probed from the same side as the chip. In some embodiments, this approach mounts both the PCB and device onto a separate surface, typically during the same pick and place operation of the semiconductor packaging work flow. This allows the mounting substrate to be very inexpensive, such as plastics and composites, and also opens the possibility of using thermally conductive metals or ceramics as the supporting substrate. This strategy generally prefers that the connections to the completed device be made from the same side as the devices. In some embodiments, this concept could be used and configured such that the probe contacts still face in the opposite direction. The main cost reduction is the size of the PCBs and the flexibility given to the process by allowing different PCBs and chip devices to be matched without significant redesigns. FIGS. 4A-4E illustrates sequential steps of assembling a chip device assembly 400 utilizing a chip having associated probe contact pads provided on a separate PCB, as described above.

[0073] FIG. 4A shows a support substrate 401 , which can be smaller and thinner than would be customarily used if the probe contacts on a backside of the PCB by via connections. FIG. 4B illustrates a diagnostic chip 410 that is die cut and mounted onthe substrate 400 with an active area 411 facing upwards and having an array of electrical contacts 412. In some existing chip designs, this array of contacts is considerably smaller than probe contact pads and are used for testing purposes during chip manufacturing. Adjacent the chip 410 is a PCB 420, having an area smaller than the chip area and having probe contact pads disposed on the same side as the chip. FIG. 4C shows the electrical contact array connected to the probe contacts 422 of PCB 420 by wire bonds 430. FIG. 4D shows the addition of bond protection 2140 (e.g. layer of epoxy). FIG. 4E shows the assembly secured within chip device 450 having an integrated flowcell engaged with active area 411. As can be seen, the probe contact pads 422 remain accessible to be probed by an electrical interface within a sample processing module in which the device 450 is inserted, as described in previous embodiments.B. Alternative Chip Substrates / Connection Types

[0074] Given that the probe contact pads are provided on a separate PCB, the support substrate of the chip can not only be smaller and thinner, but can utilize various different materials that are less expensive and / or have additional mechanical properties that provide further advantages. For example, the substrate can be a flexible material, such as a flex laminate, which are more economical. Further, the reduced area allows the substrate to be more easily mounted, for example, a self-adhesive flex laminate feature can be used as adhesive provides sufficient bond strength for a smaller lighter flex laminate (as compared to a conventional PCB component).

[0075] FIGS. 5A-5B shows assembly of another chip device assembly 500. In this example, the assembly includes a streamlined chip 510 and flex PCB 530 mounted to a substrate 500. The probe contacts are electrically connected to the chip 510 by wire bonds 520 over which bond protection 540 is added.

[0076] In another aspect, the PCB on which probe contacts are provided can also be flex PCB. This lends itself to less expensive bonding methods such as TAB bonding techniques, which are generally cheaper and faster than wire bonding at very high volume production.

[0077] FIGS. 5C-5D show such an example chip device assembly 500’ that includes a streamlined chip 510 and flex PCB 530 mounted to a substrate 500, with the probe contacts electrically connected to the chip 510 contacts by TAB bonding 522 over which bond protection 540 is added.C. On-Chip Probe Electrical Contacts / Connections

[0078] In yet another aspect, an integrated, streamlined chip can be designed that uses probe contact pads defined in the chip itself. This approach utilizes an additional portion of the chip (on a same side as the active area) such that wire bonded connections through a PCB are avoided. This design avoids the necessity of a separate PCB component for the probe contacts and further avoids any bonding procedures and various workflow steps. In some embodiments, the chip can be manufactured on an alternative support substrate, such as any of those described herein. Advantageously, the chip can be manufactured without any separate support substrate, for example, the silicon wafer in which the chip is defined can act as the support. In such embodiments, a step of thinning the silicon wafer is unnecessary, thereby providing a more cost effective and streamlined fabrication as compared to conventionally packaged chip devices. In such embodiments, any available wafers can be used, for example wafers having a thickness of 925, 775, 725, 675, 625, or 525 urn (thicknesses typically corresponding to wafer diameters). It is appreciated however that any suitable thickness wafer could be used.

[0079] This approach allows for an even more cost-effective approach of eliminating the separate PCB entirely and thus any electrical bonding requirements to the chip. By putting the onus of making the electrical connections to the chip onto the instrument entirely, the need for a separate PCB, PCB Flex component, and wire or TAB bonds and protection can be completely eliminated. This allows for a design where the chip (e.g. bare silicon / MEMS device) can be mounted directly into an integral flowcell / chip carrier device. The elimination of the steps pertaining to the separate PCB and associated electrical connections save time and cost on the order of the cost of the chip itself. Typically, this approach prefers that the chip (e g. silicon / MEMS device) has a reasonably low number of connections such that a sufficient area on the device can be allotted to the connections. This approach may incur some additional cost in regard to the additional area of silicon utilized for the contact connections, but for most chip designs, this increase in cost is significantly offset by the savings in the elimination of the separate PCB and associated reduction in workflow.

[0080] FIGS. 6A-6C show the assembly of an example chip device assembly 600 in accordance with the above approach. FIG. 6 A shows the streamlined chip 610 having an active area 610 and a probe contact array 620 formed along one side of the same side. In this embodiment, chip 610 includes 12 pad single row contacts, although it isappreciated that fewer or more contact pads could be included. FIG. 6B shows assembly of the chip 610 within a chip earner device 650 having an integrated flowcell. FIG. 6C shows chip 610 securely engaged within the chip earner device 650 such that the active area is sealingly engaged with the integrated flowcell (not shown). As can be seen in FIG. 6C, the chip device 650 includes a window 652 through which the contact pad array 620 can be accessed by probes of an electrical interface of a module in which the chip device 650 is inserted. In this embodiment, the contact pads are fairly small (e.g. 12 pads at 0.8 mm pitch). Such a design would require rather precise and small instrument connection interface design to ensure the probes consistently and reliably engaged the corresponding contact pads.

[0081] FIGS. 7A-7C show a substantially similar chip assembly 700, however, the chip 710 includes an integral probe contact array 740 defined in a dual row pad arrangement that sacrifices some additional area of the chip device to allow for sufficiently large number of pads, with each pad having sufficient area to make the instrument design significantly easier. In this embodiment, the spacing between the pads and arrangement of the pads allow use of a commonly available electrical contact arrangement (e.g. a 1.27 mm pitch, dual row, 16 pin pogo header). It is appreciated that the probe contact pads could be designed according to any dimension desired taking into account the available chip area. As in the previous embodiment, the chip 710 is secured within a chip carrier device 750 having a fluidic interface 751 and a window 752 through which the probe contact array 740 is accessible.

[0082] FIG. 8A shows a chip carrier device 850, in accordance with those described in FIGS. 6A-7C, before insertion into an instrument interface 860 of the module that includes a header 865 with probes (not visible) that engage corresponding on-chip contact pads exposed through window 852. The use and operation of the instrument interface with the chip is generally in accordance with the concepts discussed in the embodiments in FIGS. 1-3 and 8.

[0083] FIG. 9A-9C show detail views of a chip device assembly 900, in accordance with those described in FIGS. 6A-6C. FIG. 9A shows the chip carrier device 950 having an integrated flowcell chamber 953 in fluid communication with fluidic interface 951. The flowcell chamber is disposed within a recessed portion dimensioned to fittingly receive the chip 910 within so as to sealingly engage an active area of the chip against the flowcell chamber. The device can include a separate gasket to facilitate sealing or the gasket can be a raised portion defined within the device itself.In some embodiments, the chip carrier device 950 is formed as a unitary component and can be formed by injection molding or any suitable means. In other embodiments, the chip carrier device can be assembled by multiple components, for example, as in the previously described embodiments. The flowcell is filled with prepared fluid sample through flowcell inlet / outlet ports 953a, 953b in fluid communication with the inlet / outlet ports 951a, 951b of the fluidic interface 951.

[0084] As can be seen in the top view of FIG. 9B, the size and dimensions of the chip 951 corresponds to the recess in the chip carrier device 950. The chip carrier device 950 can include various retention or coupling features to secure chip 951 within, for example, retention tab 955 and snap-fit couplings 954 that are dimensioned and arranged to resiliency receive the chip and secure the chip with the active area sealingly engaged against the flowcell chamber. As can be seen in the underside view of FIG.10, the integrated flowcell / chip carrier device 950 includes a flowcell inlet channel 930a in fluid communication with fluidic inlet 951a of fluidic interface 951 and a flowcell outlet channel 950b in fluid communication with 951b such that the sample cartridge and module to which the device is attached precisely controls the flow of fluid sample from the fluid sample cartridge into the flowcell chamber through the fluidic interface. The chip 910 includes an integrated probe contact pad array 920 on the chip surface on a same side as the active area 911, the array being positioned to be accessible through the probe contact window 952 of the integrated flowcell / chip carrier device 950.III. Thermal Control Devices

[0085] FIG. 10 shows an idealized control scheme for thermal cycling between elevated and reduced temperature as controlled by a square wave. Ideally, to prepare a biological sample for PCR testing, the biological sample is thermally cycled between an elevated temperature Tmand a reduced temperature Tc. In many conventional systems, a heater or thermoelectric cooler (TEC) is placed near or in contact with a reaction tube or vessel containing the biological sample is controlled according to a square wave between a high temperature Th and a lower temperature Tc, often the high temperature being greater than the target elevated temperature of the sample to improve speed of heating of the sample. While this approach provides suitable thermal cycling, the overall rate of thermal cycling is limited by cooling rates, and as a result thermal cycling is less efficient and more time consuming.

[0086] FIG. 11 shows a chip earner and interface assembly 1100 that includes athermal switch 1110 to facilitate thermal cycling in a manner approaching the above idealized control scheme, in accordance with some embodiments. This embodiment, the thermal switch 1110 includes a heat sink 111 defined by a copper slug, which is supported in an air cylinder cradle 1112 attached to an air cylinder 1113, operation of which actuates movement of the heat sink within the cradle to engage the diagnostic chip 1120 during cooling. Optionally, the cradle can be attached to the air cylinder with levelling O-rings 1114. The air cylinder cradle is disposed adjacent the diagnostic chip cradle 1121, which supports the semiconductor diagnostic chip 1120 therein, the heat sink extending through a window in the chip cradle to engage the backside of the chip. The other side of the chip having the active face is engaged with an O-ring 1123 and O-ring backer plate 1122. The instrument interface can further include a connector bridge electrical interface with a pogo-pin connector having pogo pins on a pogo PCB 1132 supported by pogo cradle 1131 such that the pogo pins engage corresponding contacts on the active side of the chip when the chip carrier is inserted into the module. IV. Connector Bridge

[0087] FIG. 12 shows another example electrical pin connector bridge 320 for electrically interfacing the processing module with a diagnostic chip device, in accordance with some embodiments. As shown, the connector bridge 320 includes body 321 having pivots 323 on opposite ends that rotate the body 321 about pivot axis 323a. In this embodiment, the body is elongated along pivot axis and includes a protruding nose 311 along the center on which are disposed multiple pin contacts 312. The pin contacts 312 are disposed in a row extending in a direction parallel to the pivot axis 323a. The body 321 further includes cams 322 designed to engage a corresponding cam surface of the chip device or associated component such that insertion of the chip device into the module effects deployment of the pin contacts and controlled engagement of the pin contacts with corresponding contact pads of the chip device. In this embodiment, the cams 322 are configured to engage with cam shoulders 222 of the chip carrier device 200, as shown in FIG. 13, upon insertion of the chip device into a receptable of the module. As shown, each of the cams 322 includes a cam surface designed to control precise deployment and alignment of the pin contacts as the chip carrier device is inserted. In this embodiment, the cam surface is designed with a first cam surface 322a and a second cam surface 322b. The first cam surface 322 has a variable radius of curvature such that when engaged with the cam shoulders 222 during insertion, linear movement of the cam shoulders 222 is translated into rotationalmovement of the connector body 321 about pivots 323. This rotational movement deploys the nose 311 having the pin contacts 312 into the access window 211 so that the pin contacts 312 engage corresponding contact pads of the diagnostic chip 210 supported within the chip device 200. The second cam surface 322b is a linear, tapered surface such that when engaged against the cam shoulders transmits the linear motion to the connector to facilitate a scraping or scrubbing action of the pin contacts on the surface of the contact pads of the diagnostic chip. This scrubbing action is desirable as it scrapes through a silicon oxide layer that forms on the contact pads to ensure a reliable and robust electrical connection. Each of the pin contacts 312 is electrically connected to corresponding distal contacts 325 of a flex cable 324 that electrically connects to a plurality of conductors extending the length of the flex cable 324 to proximal contacts 326 that connect to the instrument interface and ultimately to control circuity of the module in which the connector bridge is mounted to facilitate control and communication with the diagnostic chip by the module. The flex cable can be secured to the connector bridge by a PCB secured to the body 321 with fasteners (e g. screws). In this embodiment, the flex cable connects to the body 312 at a location offset from pivots 323 and is curved, which adds a biasing rotational force toward a non-deployed configuration, as detailed further in FIGS. 21 A-21B. Additional biasing means, such as a torsion screw, can be used to further bias the connector.

[0088] FIG. 13 shows an example diagnostic chip carrier device 200 configured for interfacing with the electrical connector bridge in FIG. 12, in accordance with some embodiments. As shown, the chip carrier device includes a frame 220 that supports the diagnostic chip 210 therein. The frame 220 extends to a fluidic interface 201 that fluidically couples with a sample cartridge that is inserted into the module. The frame 220 supports the diagnostic chip adjacent a flowcell defined in the frame (optical lid not shown) and extends outwardly from the cartridge such that when the sample cartridge is inserted into the module, the chip carrier device is inserted into the receiving bay of the module, the frame extends through a receptable within the module. In this embodiment, the frame 220 includes cam shoulders 222 that extend laterally outward such that a surface of the cam shoulders engage against the cam surface of cams 232 of the connector bridge upon insertion of the chip device into the receptable of the module.

[0089] In some embodiments, the electrical connector include pin connectors (e.g. pogo pins) specifically arranged and designed to interface with a diagnostic chip device(e.g. biochip cartridge). In some embodiments, the electrical connector is defined as a bridge that interfaces electrical connections between the diagnostic chip device and the instrument module without mechanically coupling them together or requiring a separate actuation, as is commonly done with conventional connectors. In some embodiments, the electrical connector is part of a sub-module that can be incorporated into a larger instrument module (e g. GeneXpert), replacing an existing sub-module (e.g. I-Core module). In some embodiments, the connector bridge (e.g. “Pogo Bridge) is part of a sub-module ( “Silicon I-Core Module”) of a standard instrument (e.g. “GeneXpert”), replacing a standard module (e.g. “I-Core”) component, as shown in FIG. 14.

[0090] FIG. 14 demonstrates the product modularity according to the present disclosure. For example, as shown, an existing instrument module 1000 having a door 1100 that opens to receive a conventional sample cartridge includes a conventional instrument sub-module 300C that performs thermal cycling, optical excitation and detection of a conventional reaction vessel attached to the sample cartridge. An example of such an instrument module is the GeneXpert by Cepheid. In this embodiment, the instrument sub-module 300 is configured to replace the existing submodule 300C to facilitate operation of a cartridge having an attached diagnostic chip device (e.g. biochip cartridge) with minimal or no hardware modifications to the remainder of the existing instrument module. This modularity allows existing modules to be easily modified to process diagnostic chip devices, rather than be limited only to processing of conventional reaction vessels. In some embodiments, the improved submodule 300 is configured to perform processing of both conventional reaction vessel and diagnostic chips.

[0091] FIGS. 15A-15C demonstrate the familiarity and consistency of the workflow of using the biochip cartridge device in a module with passively actuated connector bridge, in accordance with some embodiments. FIG. 15A shows a user opening door 1110 of a module 1000 for insertion of a sample cartridge 100 with attached diagnostic chip device 200 (e.g. biochip cartridge). FIG. 15B shows insertion of the biochip cartridge 100 into the receiving bay of the module 1000. FIG. 15C shows the user closing door 1110 of the module to facilitate processing and testing of the biochip cartridge in the module. Thus, in this embodiment, the design of the pin connector bridge (e.g. pogo pin bridge) allows the sub-module (e.g. Silicon I-Core module) to provide a user workflow that is identical to the w orkflow of conventional systems (e.g. current GeneXpert workflow), that is, the user opens the instrument door, places thecartridge in the instrument, and closes the instrument door. As described, the pogo pin bridge ‘passively’ engages the biochip cartridge and establishes the electrical connections by using cams foregoing the need for a separate actuator or modified workflow. By this approach, regardless of whether personnel is loading a conventional cartridge with a reaction vessel in a conventional module, or a biochip cartridge with diagnostic chip in a modified module, the workflow is identical, thereby improving ease of use and reducing the likelihood of user error due to differing workflows.

[0092] FIGS. 16A-16B illustrate protective, fool-proof features of the interface connector and biochip cartridge configuration. In one aspect, the cartridge with chip carrier device (e.g. biochip cartridge) is configured so that it cannot be inserted into a conventional sub-module, which does not have the capability to process and operate the diagnostic chip and could potentially damage the instrument. As shown in FIG. 16A, if a biochip cartridge were inserted into a standard instrument with s conventional submodule 300C, it would be prevented from loading and likely damaging the standard instrument. This can be achieved by features such as the cam shoulders (e.g. lateral projections) on the chip carrier device portion that prevent insertion into the receptable of the standard instrument having a conventional sub-module 300C. In contrast, the improved sub-module 300 (e.g. “Silicon I-Core Module”) is configured such that insertion of a conventional reaction vessel does no harm (even though the sub-module may not have the capability to process the conventional reaction vessel), as shown in FIG. 16B. The connector design protects the fairly delicate electrical contacts (e.g. pogo pins) from damage by retracting behind a mechanical guard and only actuating when a cartridge with chip carrier device (e.g. biochip cartridge) having cam shoulders is inserted. In some embodiments, the guard prevents user tampering when not in use, and also prevents the cam from actuating if a standard cartridge is mistakenly inserted into the instrument (e.g. Biochip Instrument), which could damage the pins. The mechanical guard can be defined by a shape (e.g. U-shape, recessed portion) of the connector bridge body and the position of the connector in the non-deploy ed position.

[0093] In another aspect, the design of the passively actuated electrical connector (e.g. biochip bridge) provides precision engagement of the pin connectors with the contact of the chip device. As noted above, the electrical connector bridge includes a body having cam(s) designed to engage with corresponding side cam shoulder(s) on the chip carrier device (e.g. biochip frame) and rotate the bridge as the cartridge enters the instrument so as to engage the pin connectors with the contact pads in a controlled andprecise manner. In some embodiments, these cam features are fairly loose (e.g. + / - 0.5 mm) to allow the cartridge to move into the instrument freely. The cams facilitate the engagement of the protruding section 311 (e.g. nose) of the connector 320 having the pins 312 thereon into the receiver section (e.g. access window) of the chip carrier device (e.g. biochip frame), where the locational precision is developed as the tapered nose engages the tapered receiver. In some embodiments, the design shown provides an observed precision of about + / - 0.1 mm. This is advantageous since, in some embodiments, the contact pad that the pin is engaging is about 0.627 mm wide. Such a configuration is shown in the embodiments of FIGS. 17-18. It is appreciated that the design can be modified for various other dimensional tolerances and connectors and devices of differing sizes and geometries.

[0094] FIG. 17 shows the diagnostic chip carrier device 200 interfaced with the pin connector bridge 320, in accordance with some embodiments. As shown, the chip carrier device 200 includes access window 211 that provides access to electrical contacts 212 of the diagnostic chip supported within. As the chip carrier device attached to the sample cartridge (not shown) is inserted into the module, the shoulder 222 abuts against cams 322 of the connector bridge 320, thereby translating linear movement into rotational movement about pivots 323, which rotates the nose of the connector to enter the pocket defined by access window 211 so that the electncal pins 312 engage the chip contacts 312. Thus, insertion of the chip carrier device 200 into the module effects passive actuation of the connector 320 to electrically interface with the chip to facilitate operation of the chip by the module.

[0095] Advantageously, this rotating motion of the connector also allows the pin contact to scrape or “scrub” the contact upon engagement, which removes any protective oxide layer and ensure satisfactory electrical contact. As shown, the connector is designed with a +- 0.5 mm cam to frame tolerance and the nose to pocket tolerance is + / - 0.1 mm. These tolerances support a robust and consistent electrical interface with contact pads of a typical diagnostic chip, in particular, the chip design shown in FIG. 18. These designs includes the diagnostic chip 210 having an active surface at center that is electrically coupled with a row of electrical contacts 212. In this embodiment, the chip includes 14 electrical contacts, although it is appreciated that other embodiments may utilize more or fewer contacts. In this embodiment, each contact pad is 0.714 mm in length and 0.627 mm in width. This size of each contact allows suitable surface area for the scrubbing motion described above to ensure optimalelectrical contact by the pin connector. Although certain embodiments are described here, it is appreciated that various other dimensions of contact pads, number or arrangements of contact pads could be utilized in other diagnostic chips. However, the connector could be modified accordingly to correspond to the design of various other diagnostic chips as needed.

[0096] In another aspect, the connector bridge design allows for suitable compliance to withstand the forces exerted by other components of the module during processing of the sample in the cartridge. For example, as shown, in FIG. 19, the connector bridge is designed to freely move with the cartridge in the up and down direction (y-direction) by a pre-determined amount (e.g. + / - 0.4 mm) and also to move in the “in and out” direction (x-direction) by a pre-determined amount (e.g. + / - 0.6 mm). In some module applications described herein, this additional compliance is needed since the cartridge is exposed to the torque of the valve drive and the axial forces from the syringe drive, so it is not ‘static’ during the assay run during the sample preparation stage. Thus, the passive actuation design allows for this additional compliant movement of the connector while still allowing for the precise deployment and scrubbing action to electrically interface with the chip, as described above. Providing such compliant yet precise movement can be challenging in powered actuation (e.g. robotic) movements, particularly on the small-scale and tolerances described here.

[0097] In yet another aspect, the pin connector bridge and chip carrier device interface concepts described herein provide design modularity. For example, these concepts can be utilized for pin connectors designed to interface with contact pads of various diffenng sizes and configurations. In the embodiment described previously, the pin connector bridge is designed for a 14 pin contact arrangement (as shown at top in FIG. 20 A). The achieved precision and geometry provided by the design noted above would allow for up to 24 pins in the same footprint (as shown at bottom in FIG. 20B), with minor modifications. For example, the pitch of the pads on the chip can be reduced from the cunent 0.706 mm pitch center-to-enter (CtoC) to 0.4 mm pitch CtoC. However, it is noted that a mixed signal chip such as that depicted herein would be very unlikely to require so many pins.

[0098] In still another aspect, the connector design can allow for the pivoting actuation movement described herein by utilizing a flex cable. As shown in FIG. 21 A, the module 300 is electrically connected to pin connector bridge 320 by flex cable 329. In this embodiment, the flex cable was carefully designed to leverage its materialproperties and is located relative to the pivot axis 323a of the bridge connector 320 to assure that it contributes to the spring action designed to retract the bridge connector to the non-deploy ed position when the cartridge with attached chip carrier device is removed. As shown in FIG. 21 A, the connector bridge 320 has a rotational bias in the clockwise direction (thick arrow) and the force from the flex cable (thin arrow) contributes force on the connector to rotate in this direction. Accordingly, the flex cable reduces the burden on the biasing means. As shown in FIG. 21B, the biasing means can be a spring 328 extending around the pivot 323 and engaged with the module or associated frame to provide a biasing rotational force on the connector bridge to be rotated in the clock-wise direction. As shown in FIG. 21B, upon insertion of the chip carrier 200, the cam shoulder 222 abuts against the surface 322a of the cam 322 which causes rotation of the connector in a counter-clockwise motion, counter to the bias of the spring, so as to move the bridge and pin connectors to the deployed position for engagement with the contact pads as described above.

[0099] Advantageously, this passive actuation design described above allows for a scrubbing motion of the pin contacts and a design geometry, particularly suited for interfacing with diagnostic chips. For any electrical probing of silicon chips, a scrubbing action is recommended. For example, flying probe chip testers typically have a cantilevered contact design that achieves this scrubbing action as the contact makes contact with the chip. The pin connector bridge described herein achieves a similar scrub pattern by the carefully calculated centerline of the pin being offset from the rotation axis of the bridge. This precise scrubbing motion is designed to scrub the silicon oxide layer from the aluminum pad on the chip, as well as minimize lateral loading on the pogo pin, and providing an ‘over-center’ parking position. The scrubbing action is a desired by-product of the x-axis compliance and rotational movement. The geometry was optimized to give a suitable amount of compliance and a suitable amount of scrubbing based on the location of the center of rotation. This scrubbing motion can be understood further by referring to FIGS. 22A-22D. As shown in FIGS. 22A-22B, when the connector bridge 230 rotates to the deployed position and the nose 311 enters the access window 211, the contact pins 312 make initial contact with the contact pads 312 of the chip 210. As the connector 320 continues to rotate, the pitch of the pin varies providing increasing force in the y-direction and continued movement in the x-direction, thereby “scrubbing” the surface of the contact pads 212, as shown in FIG. 22C-22D. The cam(s) provide the general motive force andpositioning. The first cam provides motive force and the rough positioning required so that the second cam can reliably engage the pogo pocket. The second cam along the pogo pin pocket provides the precise positioning function. The geometry of the connector bridge determines the scrub distance and forces associated with the scrubbing movement, as shown in FIG. 22D.

[0100] In another aspect, the described connector bridge provides an overall mechanical design advantage as compared to conventional connectors. Conceivably, many conventional approaches may utilize powered solutions that actuate pogo pins orthogonally into the contact pads (as shown in FIG. 23). While this conventional approach might would appear a simple concept, it likely would require a complicated execution to satisfy the various requirements discussed herein. The described connector bridge, as shown in FIG. 24, satisfies these additional requirements beyond simply contacting the chip, and it does so ‘passively,’ resulting in an inexpensive and reliable design yet also provides locational compliance, pin protection, proper scrubbing action, within a robust solution.

[0101] Moreover, the connector bridge design approach also enables a fundamental game changer in the field of silicon detection chip technology. Most silicon detection devices are Chip On Board (COB) assemblies, which require: 1. a ‘board’; 2. wirebonds to connect the board to the chip; 3. protective epoxy to protect the wire-bond wires; and 4. bonding adhesive to attach the chip to the board. These process steps are time consuming, expensive, and result in yield losses. Other devices may use through silicon vias (TSVs) to avoid the wire-bonds, however, this relies on a substrate on which the chip is bonded using an anisotropic conductive film (ACF) to bring the signals out. This technology forgoes these process steps and allows direct connection to a bare silicon die, as shown in FIG. 25.

[0102] FIG. 26 shows a flowchart, in accordance with some embodiments. Such methods can include: inserting, into a processing module, a sample cartridge with attached chip carrier device having a diagnostic chip therein; engaging with the chip carrier device a cam surface of a connector bridge, thereby deploying a plurality of pins of the connector bridge to contact a plurality of contact pads of the diagnostic chip; translating a linear movement of insertion into a rotational movement of the connector bridge to deploy the pin contacts and engage the contacts of the chip, thereby scrubbing the plurality of pins against the engaged plurality of contacts pads to provide a robust electrical connection. After processing with the chip, the workflow entails removingthe cartridge after processing with the chip, which disengages the cam surface, thereby causing the connector to withdraw the plurality of contacts by a biasing means on the connector.

[0103] In the foregoing specification, aspects of the present disclosure are described with reference to specific embodiments thereof, but those skilled in the art will recognize that the disclosure is not limited thereto. Various features, embodiments and aspects of the present disclosure can be used individually or jointly. Further, embodiments according to the present disclosure can be utilized in any number of environments and applications beyond those described without departing from the broader spirit and scope of the specification. The specification and drawings are, accordingly, to be regarded as illustrative rather than restrictive. It is recognized that the terms "comprising." “including,” and “having,” as used herein, are specifically intended to be read as open-ended terms of art.

Claims

WHAT IS CLAIMED IS:

1. A connector bridge comprising: a body having a protruding nose on which is disposed one or more pin contacts; one or more pivots configured to facilitate rotation of the body along a pivot axis between a non-deployed position and a deployed position; and one or more cams having a cam surface designed to translate engagement with a semiconductor chip device into movement of the body from the non-deployed position to the deployed position and engage the one or more pin contacts with one or more contact pads of the semiconductor chip device.

2. The connector bridge of claim 1, wherein the cam surface is designed with a first cam surface to translate linear movement from engagement with the semiconductor chip device into rotational movement of the body about the one or more pivots, thereby engaging the one or more pin contacts with the one or more contact pads of the semiconductor chip device.

3. The connector bridge of claim 2, wherein the first cam surface has a variable radius of curvature.

4. The connector bridge of claim 2, wherein the cam surface is further designed with a second cam surface to translate linear movement from the semiconductor chip device into translational movement of the body along a same direction so as to scrape or scrub the one or more contact pads with the one or more pin contacts.

5. The connector bridge of claim 4, wherein second cam surface is tapered and linear.

6. The connector bridge of claim 1, wherein the one or more pin contacts comprise a plurality of pin contacts that correspond to a plurality of contact pads of the semiconductor chip device.

7. The connector bridge of claim 6, wherein the plurality of pm contacts are arranged to correspond with the plurality of contact pads.

8. The connector bridge of claim 6, wherein the plurality of pm contacts are within a range of 6 and 24 pins.

9. The connector bridge of claim 6, wherein the body is elongated along the pivot axis and the plurality of pins are disposed in a row that extends in a direction parallel to the pivot axis.

10. The connector bridge of claim 9, wherein the one or more pivots comprise a pair of pivots disposed on opposite sides of the elongate body.

11. The connector bridge of claim 9, wherein the one or more cams comprises a pair of cams disposed at or near opposite ends of the elongate body.

12. The connector bridge of claim 6, wherein the plurality of pin contacts are pogo pins.

13. The connector bridge of claim 6, wherein the semiconductor chip device comprises a chip carrier device that supports a diagnostic chip.

14. The connector bridge of claim 13, wherein the connector bridge is configured to be mounted within a module, the module configured for operating the diagnostic chip.

15. The connector bridge of claim 14, wherein the connector bridge is configured to be mounted within the module and to provide compliance of within about 0.4-0.6 mm in a vertical and horizontal direction to accommodate operation of the module.

16. The connector bridge of claim 14, wherein the connector bridge includes a biasing means that biases rotation of the connector bridge along the one or more pivots to the non-deployed position so as to protect the plurality of pin contacts.

17. The connector bridge of claim 16, wherein the biasing means comprises one or more torsion springs.

18. The connector bridge of claim 16, wherein the connector bridge includes a flex cable electrically connected to the one or more pin contacts.

19. The connector bridge of claim 18, wherein the flex cable is attached to the body at a position offset from the pivot axis and is flexed so as to exert a rotational bias in a same direction as the biasing means.

20. A module for testing a sample via a diagnostic chip, the module comprising: a housing; a receiving bay for receiving a sample cartridge, the sample cartridge having an attached chip carrier device supporting the diagnostic chip, wherein the receiving bay further comprises a processing receptable that receives the chip earner device when the sample cartridge is received within the receiving bay; control circuitry configured for controlling operation of the sample cartridge to prepare a sample disposed within the sample cartndge and transport the prepared sample to the chip carrier device and for controlling operation of the diagnostic chip; an electrical interface to facilitate operation and communication with the diagnostic chip; and a bridge connector as in claim 6 that is electrically connected to the electrical interface and rotatably mounted within the module, wherein the bridge connector is configured to electrically interface with a plurality of contacts pads of the diagnostic chip upon insertion of the cartridge into the module.

21. The module of claim 20, wherein the cam surface of the bridge connector is designed with a first cam surface to translate linear movement from the semiconductor chip device into rotational movement of the body about the one or more pivots to the deployed position, thereby engaging the one or more pin contacts with the one or more contact pads of the semiconductor chip device.

22. The module of claim 21, wherein the first cam surface has a variable radius of curvature.

23. The module of claim 21, wherein the cam surface is further designed with a second cam surface to translate linear movement from the semiconductor chip device into translational movement of the body along a same direction so as to scrape or scrub the one or more contact pads with the one or more pin contacts.

24. The module of claim 23, wherein second cam surface is tapered and linear.

25. The module of claim 20, wherein the one or more pin contacts of the bridge connector comprise a plurality of pin contacts that are arranged to correspond to a plurality of contact pads of the semiconductor chip device.

26. The module of claim 25, wherein the plurality of pin contacts are within a range of 6 and 24 pins.

27. The module of claim 25, wherein the body is elongated along the pivot axis and the plurality of pins are disposed in a row that extends in a direction parallel to the pivot axis.

28. The module of claim 25, wherein the one or more pivots comprise a pair of pivots disposed on opposite sides of the elongate body.

29. The module of claim 25, wherein the one or more cams comprises a pair of cams disposed at or near opposite ends of the elongate body.

30. The module of claim 25, wherein the plurality of pin contacts are pogo pins.

31. A chip device comprising; an elongated frame configured for supporting a semiconductor chiptherein, the elongated frame having a fluidic interface for fluidically coupling with a cartridge at one end and a chip carrier portion for supporting the semiconductor chip at or near an opposite end, a flowcell adjacent an active surface of the semiconductor chip when disposed within the carrier portion; and one or more protrusions extending laterally from the elongated body and configured for engagement with one or more cam surfaces of a connector bridge of a module to facilitate passive deployment of the bridge connector to electrically interface one or more pin contacts of the connector bridge with the semiconductor chip.

32. The chip device of claim 31, wherein the frame comprises an access window adjacent a plurality of contact pads of the semiconductor chip.

33. The chip device of claim 31 , wherein the one or more protrusions comprise one or more cam shoulders designed for engagement with the one or more cams of the connector bridge.

34. The chip device of claim 31 , wherein the fluidic interface comprises a fluidic inlet and outlet configured for coupling with corresponding ports of a sample cartridge.

35. The chip device of claim 31, wherein the semiconductor chip is a diagnostic chip and the module is configured for processing the sample cartridge and testing the sample by operation of the diagnostic chip.

36. A method of testing a sample with a diagnostic chip, the method comprising: inserting a sample cartridge containing a fluid sample into a module, the sample cartridge having an attached chip carrier device supporting a diagnostic chip therein; deploying a connector bridge rotatably mounted within the module by one or more pivots to a deployed position so as to electrically interface a plurality of pin contacts of the bridge connector with a plurality of contact pads of the diagnostic chip; andoperating, with the module via the connector bridge, the operation of the diagnostic chip to obtain a detection for a target analyte in the fluid sample.

37. The method of claim 36, wherein deploying the connector bridge comprises engaging one or more cams of the connector bridge with one or more cam shoulders of the chip carrier device to effect rotation of the connector bridge.

38. The method of claim 37, further comprising: rotationally biasing the connector bridge toward a non-deploy ed position, when disengaged from the chip carrier device to protect the plurality of pin contacts.

39. The method of claim 37, wherein the cam surface of the bridge connector is designed with a first cam surface to translate linear movement from the semiconductor chip device into rotational movement of the body about the one or more pivots, thereby engaging the one or more pin contacts with the one or more contact pads of the semiconductor chip device.

40. The method of claim 39, wherein the first cam surface has a variable radius of curvature.

41. The method of claim 39 wherein the cam surface is further designed with a second cam surface to translate linear movement from the semiconductor chip device into translational movement of the body along a same direction so as to scrape or scrub the one or more contact pads with the one or more pin contacts.

42. The method of claim 41, wherein second cam surface is tapered and linear.

43. The method of claim 36, wherein the plurality of pin contacts of the bridge connector are arranged to correspond to the plurality of contact pads of the diagnostic chip .

44. The method of claim 43, wherein the plurality of pin contacts are within a range of 6 and 24 pins.

45. The method of claim 44, wherein the plurality of pin contacts comprise pogo pins.

46. The method of claim 36, further comprising: operating, with the module, the sample cartridge, thereby transporting the fluid sample into the chip carrier device to interface with an active surface of the diagnostic chip.

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