Substrate suction member, top ring, substrate processing device, and method for manufacturing substrate suction member

Abstract

This substrate suction member comprises: a vacuum chuck member including a substrate suction obverse surface on which a substrate is suctioned, a reverse surface, and a plurality of through-holes penetrating from the substrate suction obverse surface to the reverse surface; a porous member positioned on the reverse-surface side of the vacuum chuck member; and a sealing material for sealing some of the plurality of through-holes. The plurality of through-holes are provided with a plurality of first through-holes opened in a first region where the substrate is arranged, and a plurality of second through-holes opened in a second region on the outer-peripheral side of the first region, in the substrate suction obverse surface. The sealing material seals the plurality of second through-holes.

Description

SUBSTRATE ATTACKING MEMBER, TOP RING, SUBSTRATE PROCESSING APPARATUS, AND METHOD FOR MANUFACTURING SUBSTRATE ATTACKING MEMBER

[0001] The present invention relates to a substrate attracting member, a top ring, a substrate processing apparatus, and a method for manufacturing a substrate attracting member.

[0002] Chemical mechanical polishing (CMP) equipment is used to planarize the surface of a substrate in the manufacture of semiconductor devices. The substrates used in semiconductor device manufacture are often circular. Furthermore, there is a growing demand for flatness when planarizing the surfaces of rectangular substrates, such as copper clad laminate (CCL) substrates, printed circuit board (PCB) substrates, photomask substrates, and display panels, in addition to semiconductor devices. There is also a growing demand for planarization of the surfaces of package substrates, such as PCB substrates, on which electronic devices are mounted.

[0003] Substrate processing apparatuses such as CMP apparatuses include a top ring for holding a substrate (see Patent Documents 1 and 2). For example, as described in Patent Document 1, the top ring includes a base member connected to a rotating shaft, and a porous member having a substrate attracting surface for attracting a substrate and a pressure reducing portion communicating with a pressure reducing means.

[0004] Japanese Patent Application Laid-Open No. 2023-057047 Japanese Patent Application Laid-Open No. 2020-515424 Japanese Patent Application Laid-Open No. 2012-033640 Japanese Patent Application Laid-Open No. 2008-187098

[0005] If the substrate has a notch or other defect on its peripheral edge or is small compared to the substrate chucking surface, vacuum leakage may occur, preventing the substrate from being attracted to the top ring's substrate chucking surface with sufficient force, resulting in the substrate shifting during polishing. Such substrate shifting may prevent polishing and may even result in damage to the substrate or the equipment. Patent documents 3 and 4 discuss the challenges of chuck tables, including ensuring reliable suction and support even when the wafer diameter varies by several millimeters, and chucking and supporting substrates of unusual shapes with sufficient suction force and at low cost. However, they do not address the challenges of top rings, which must be moved while chucking the substrate downward and are available in different sizes.

[0006] The present invention has been made in consideration of the above-mentioned circumstances, and one of its objects is to provide a substrate suction member, a top ring, or a substrate processing apparatus that reduces the risk of vacuum leakage depending on the size or shape of the substrate.

[0007] According to one embodiment of the present invention, a substrate suction member is a substrate suction member for a top ring for suctioning a substrate, and comprises: a vacuum chuck member including a substrate suction surface to which the substrate is suctioned, a back surface, and a plurality of through holes penetrating from the substrate suction surface to the back surface; a porous member located on the back surface side of the vacuum chuck member; and a sealant that seals some of the plurality of through holes, wherein the plurality of through holes include a plurality of first through holes that open to a first region on the substrate suction surface where the substrate is placed, and a plurality of second through holes that open to a second region that is more outer than the first region, and the sealant seals the plurality of second through holes.

[0008] FIG. 1 is a plan view showing an overall configuration of a substrate processing apparatus according to an embodiment; FIG. 2 is a perspective view schematically showing a configuration of a polishing unit according to an embodiment; FIG. 3 is a cross-sectional view schematically showing a top ring according to an embodiment; FIG. 4 is a cross-sectional view schematically showing a substrate suction member according to an embodiment; FIG. 5 is a bottom view schematically showing a substrate suction member according to an embodiment; FIG. 6 is a bottom view schematically showing a substrate suction member according to another embodiment; FIG. 7 is a cross-sectional view schematically showing a vacuum chuck member according to an embodiment; FIG. 8 is a cross-sectional view schematically showing a vacuum chuck member according to another embodiment; FIG. 9 is a cross-sectional view schematically showing a vacuum chuck member according to another embodiment; FIG. 10 is a conceptual diagram for explaining a method of manufacturing a substrate suction member according to an embodiment; FIG. 11 is a conceptual diagram for explaining a method of manufacturing a substrate suction member according to an embodiment; FIG. 12 is a conceptual diagram for explaining a method of manufacturing a substrate suction member according to an embodiment; FIG. 13 is a conceptual diagram for explaining a method of manufacturing a substrate suction member according to an embodiment; FIG. 14 is a conceptual diagram for explaining a method of manufacturing a substrate suction member according to an embodiment; Fig. 1 is a conceptual diagram for explaining a method for manufacturing a substrate suction member according to another embodiment; Fig. 2 is a conceptual diagram for explaining a method for manufacturing a substrate suction member according to another embodiment; Fig. 3 is a conceptual diagram for explaining a method for manufacturing a substrate suction member according to another embodiment; Fig. 4 is a cross-sectional view schematically showing a substrate suction member according to another embodiment.

[0009] Hereinafter, embodiments of a substrate attracting member and a manufacturing method thereof, a top ring, and a substrate processing apparatus according to the present invention will be described with reference to the accompanying drawings. In the accompanying drawings, identical or similar elements are designated by identical or similar reference numerals, and duplicate descriptions of identical or similar elements may be omitted in the description of each embodiment. Furthermore, features shown in each embodiment may also be applied to other embodiments as long as they are not mutually inconsistent.

[0010] FIG. 1 is a plan view showing the overall configuration of a substrate processing apparatus 1000 according to one embodiment. The substrate processing apparatus 1000 shown in FIG. 1 includes a load unit 100, a transport unit 200, a polishing unit 300, a drying unit 500, and an unload unit 600. In the illustrated embodiment, the transport unit 200 includes two transport units 200A and 200B, and the polishing unit 300 includes two polishing units 300A and 300B. In one embodiment, each of these units can be formed independently. By forming these units independently, substrate processing apparatuses 1000 with different configurations can be easily formed by arbitrarily combining the number of each unit. The substrate processing apparatus 1000 also includes a control device 900, which controls each component of the substrate processing apparatus 1000. In one embodiment, the control device 900 can be configured as a general computer including an input / output device, an arithmetic unit, a storage device, and the like.

[0011] <Load Unit> The load unit 100 is a unit for introducing a substrate WF before processing such as polishing and cleaning into the substrate processing apparatus 1000. In one embodiment, the load unit 100 is configured to comply with the SMEMA (Surface Mount Equipment Manufacturers Association) Mechanical Equipment Interface Standard (IPC-SMEMA-9851).

[0012] In the illustrated embodiment, the transport mechanism of the load unit 100 includes a plurality of transport rollers 202 and a plurality of roller shafts 204 to which the transport rollers 202 are attached. In the embodiment shown in FIG. 1 , three transport rollers 202 are attached to each roller shaft 204. The substrate WF is placed on the transport rollers 202, and the substrate WF is transported by the rotation of the transport rollers 202. The transport rollers 202 may be attached at any position on the roller shaft 204 as long as they can stably transport the substrate WF. However, since the transport rollers 202 come into contact with the substrate WF, they should be positioned so that they come into contact with an area of ​​the substrate WF that is to be processed without causing any problems. In one embodiment, the transport rollers 202 of the load unit 100 may be made of a conductive polymer. In one embodiment, the transport rollers 202 are electrically grounded via the roller shafts 204 or the like. This is to prevent the substrate WF from becoming charged and damaging the substrate WF. In one embodiment, the load unit 100 may also be provided with an ionizer (not shown) to prevent the substrate WF from being charged.

[0013] 1 includes two transport units 200 A and 200 B. The two transport units 200 A and 200 B can have the same configuration, and therefore will be collectively referred to as the transport unit 200 in the following description.

[0014] The transport unit 200 shown in the figure is equipped with a plurality of transport rollers 202 for transporting the substrate WF. By rotating the transport rollers 202, the substrate WF on the transport rollers 202 can be transported in a predetermined direction. The transport rollers 202 of the transport unit 200 may be formed from a conductive polymer or a non-conductive polymer. The transport rollers 202 are driven by a motor (not shown). The substrate WF is transported to a substrate transfer position by the transport rollers 202.

[0015] In one embodiment, the transport unit 200 includes a cleaning nozzle 284. The cleaning nozzle 284 is connected to a cleaning liquid supply source (not shown). The cleaning nozzle 284 is configured to supply the cleaning liquid to the substrate WF transported by the transport rollers 202.

[0016] <Polishing Unit> Fig. 2 is a perspective view schematically showing the configuration of a polishing unit 300 according to one embodiment. The substrate processing apparatus 1000 shown in Fig. 1 includes two polishing units 300A and 300B. The two polishing units 300A and 300B can have the same configuration, and therefore will be collectively referred to as the polishing unit 300 below.

[0017] As shown in FIG. 2 , the polishing unit 300 includes a polishing table 350 and a top ring 302 constituting a polishing head that holds a substrate, which is the object to be polished, and presses it against the polishing surface of the polishing table 350. The polishing table 350 is connected to a polishing table rotation motor (not shown) disposed below the table shaft 351 and is rotatable about the table shaft 351. A polishing pad 352 is attached to the upper surface of the polishing table 350, and a surface 352 a of the polishing pad 352 constitutes the polishing surface that polishes the substrate. In one embodiment, the polishing pad 352 may be attached via a layer that facilitates removal from the polishing table 350. Such a layer may be, for example, a silicone layer or a fluorine-based resin layer, and those described in, for example, Japanese Patent Application Laid-Open No. 2014-176950 may be used.

[0018] A polishing liquid supply nozzle 354 is installed above the polishing table 350, and this polishing liquid supply nozzle 354 supplies a polishing liquid onto a polishing pad 352 on the polishing table 350. Also, as shown in FIG. 2 , a passage 353 for supplying a polishing liquid is provided in the polishing table 350 and the table shaft 351. The passage 353 communicates with an opening 355 in the surface of the polishing table 350. A through-hole 357 is formed in the polishing pad 352 at a position corresponding to the opening 355 in the polishing table 350, and the polishing liquid passing through the passage 353 is supplied to the surface of the polishing pad 352 through the opening 355 in the polishing table 350 and the through-hole 357 in the polishing pad 352. The opening 355 in the polishing table 350 and the through-hole 357 in the polishing pad 352 may be one or more. The positions of the opening 355 in the polishing table 350 and the through-hole 357 in the polishing pad 352 are arbitrary, but in one embodiment, they are located near the center of the polishing table 350.

[0019] 2, in one embodiment, the polishing unit 300 includes an atomizer 358 (see FIG. 1) for spraying a liquid or a mixture of a liquid and a gas toward the polishing pad 352. The liquid sprayed from the atomizer 358 is, for example, pure water, and the gas is, for example, nitrogen gas.

[0020] The top ring 302 is connected to a top ring shaft 18, which is movable up and down relative to a swing arm 360 by a vertical movement mechanism 319. The vertical movement of the top ring shaft 18 moves the entire top ring 302 up and down relative to the swing arm 360, thereby positioning it. The top ring shaft 18 is rotated by a top ring rotation motor (not shown). The rotation of the top ring shaft 18 causes the top ring 302 to rotate around the top ring shaft 18.

[0021] The top ring 302 is capable of holding a rectangular substrate on its underside. The swing arm 360 is rotatable about a support shaft 362. The swing arm 360 rotates to move the top ring 302 between the substrate transfer position of the transport unit 200 and above the polishing table 350. By lowering the top ring shaft 18, the top ring 302 can be lowered to press the substrate against the surface (polishing surface) 352a of the polishing pad 352. At this time, the top ring 302 and the polishing table 350 are rotated, and a polishing liquid is supplied onto the polishing pad 352 from a polishing liquid supply nozzle 354 provided above the polishing table 350 and / or from an opening 355 provided in the polishing table 350. In this manner, the surface of the substrate WF can be polished by pressing it against the polishing surface 352a of the polishing pad 352. During polishing of the substrate WF, the arm 360 may be fixed or swung so that the top ring 302 passes through the center of the polishing pad 352 (so as to cover the through-hole 357 of the polishing pad 352).

[0022] The up-and-down movement mechanism 319 that moves the top ring shaft 18 and the top ring 302 up and down includes a bridge 28 that rotatably supports the top ring shaft 18 via a bearing 321, a ball screw 32 attached to the bridge 28, a support base 29 supported by a support column 130, and an AC servo motor 38 provided on the support base 29. The support base 29 that supports the servo motor 38 is fixed to a swing arm 360 via the support column 130.

[0023] The ball screw 32 includes a screw shaft 32a connected to a servo motor 38 and a nut 32b onto which the screw shaft 32a is threaded. The top ring shaft 18 moves up and down integrally with the bridge 28. Therefore, when the servo motor 38 is driven, the bridge 28 moves up and down via the ball screw 32, which in turn moves the top ring shaft 18 and the top ring 302 up and down.

[0024] The polishing unit 300 according to one embodiment includes a dressing unit 356 that dresses the polishing surface 352a of the polishing pad 352. The dressing unit 356 includes a dresser 50 that slides against the polishing surface 352a, a dresser shaft 51 to which the dresser 50 is connected, an air cylinder 53 attached to the upper end of the dresser shaft 51, and a swing arm 55 that rotatably supports the dresser shaft 51. The lower portion of the dresser 50 is formed by a dressing member 50a, and needle-shaped diamond particles are attached to the underside of the dressing member 50a. The air cylinder 53 is disposed on a support base 57 supported by struts 56, and the struts 56 are fixed to the swing arm 55.

[0025] The swing arm 55 is driven by a motor (not shown) and configured to rotate around a support shaft 58. The dresser shaft 51 is rotated by the drive of the motor (not shown), and the rotation of the dresser shaft 51 causes the dresser 50 to rotate around the dresser shaft 51. The air cylinder 53 moves the dresser 50 up and down via the dresser shaft 51, and presses the dresser 50 against the polishing surface 352a of the polishing pad 352 with a predetermined pressing force.

[0026] The polishing surface 352a of the polishing pad 352 is dressed as follows: The dresser 50 is pressed against the polishing surface 352a by the air cylinder 53, and simultaneously, pure water is supplied to the polishing surface 352a from a pure water supply nozzle (not shown). In this state, the dresser 50 rotates around the dresser shaft 51, and the swing arm 55 swings over the polishing surface 352a, causing the lower surface (diamond particles) of the dressing member 50a to slide against the rotating polishing surface 352a. In this way, the dresser 50 scrapes off the polishing pad 352, and the polishing surface 352a is dressed.

[0027] <Drying Unit> The drying unit 500 is an apparatus for drying the substrate WF. In the substrate processing apparatus 1000 shown in FIG. 1 , the drying unit 500 dries the substrate WF that has been polished in the polishing unit 300 and then cleaned in the cleaning section of the transport unit 200. As shown in FIG. 1 , the drying unit 500 is disposed downstream of the transport unit 200. The drying unit 500 has a nozzle 530 for spraying gas toward the substrate WF being transported on the transport rollers 202. The gas can be, for example, compressed air or nitrogen. The substrate WF can be dried by having the drying unit 500 blow off water droplets on the transported substrate WF.

[0028] <Unload Unit> The unload unit 600 is a unit for unloading the substrate WF after processing such as polishing and cleaning to the outside of the substrate processing apparatus 1000. In the substrate processing apparatus 1000 shown in FIG. 1 , the unload unit 600 receives the substrate after it has been dried in the drying unit 500. As shown in FIG. 1 , the unload unit 600 is disposed downstream of the drying unit 500. In one embodiment, the unload unit 600 is configured to comply with the Mechanical Equipment Interface Standard (IPC-SMEMA-9851) of the SMEMA (Surface Mount Equipment Manufacturers Association).

[0029] <Top Ring> Next, the top ring 302 in the polishing unit 300 according to one embodiment will be described. FIG. 3 is a cross-sectional view schematically illustrating the top ring 302 according to one embodiment. As shown in FIG. 3, the top ring 302 includes a base member 301 connected to the top ring shaft (rotating shaft) 18. Specifically, the base member 301 includes a flange 303 connected to the top ring shaft 18, an upper guide member 305 provided below the flange 303, and a lower guide member 306 provided below the upper guide member 305. The upper guide member 305 has a planar size smaller than the planar size of the flange 303 and protrudes downward from the lower surface of the flange 303. The lower guide member 306 is provided in a frame shape around the periphery of the lower surface of the upper guide member 305. The planar size of the upper guide member 305 or the flange 303 refers to the size of the upper guide member 305 or the flange 303 when viewed in a plan view (viewed from a direction along the top ring shaft 18).

[0030] The top ring 302 also includes a top ring substrate suction member 330 for suctioning the backside of the substrate WF with its surface to be polished facing downward. The substrate suction member 330 is disposed below the base member 301. The substrate suction member 330 includes a porous member 333 and a vacuum chuck member 334. The vacuum chuck member 334 will be described in detail later. The porous member 333 has suction holes 336 connected to the pressure reducing means (vacuum source) 31 in an exhaustable manner and an air flow path communicating with a plurality of through-holes 42 (see FIG. 4 ) of the vacuum chuck member 334. The porous member 333 is not particularly limited as long as it can be processed to be porous and can ensure an air flow path that fluidly connects the suction holes 336 and the plurality of through-holes 42. For example, the porous member 333 can be made of a resin porous material having numerous pores formed in a resin such as PE (polyethylene), PP (polypropylene), PTFE (polytetrafluoroethylene), or PVC (polyvinyl chloride). The porous member 333 has a pressure reducing portion 333b that communicates with the pressure reducing means (vacuum source) 31. It is preferable that the porous member 333 be formed in a flat plate shape from the viewpoint of uniformly reducing the pressure in the plurality of through holes 42 of the vacuum chuck member 334.

[0031] The substrate suction member 330 also includes a shielding member 332. The shielding member 332 may be any airtight member capable of blocking the flow of gas, and may be formed, for example, from a relatively soft resin plate such as PE, PP, PTFE, or PVC. In this embodiment, the shielding member 332 is formed to shield the surface of the porous member 333 opposite the substrate WF side. The shielding member 332 includes a suction hole 336 formed to communicate with the porous member 333. A pressure reduction section 333b of the porous member 333 is provided at the position where the suction hole 336 is formed. In this embodiment, the suction hole 336 is formed in the shielding member 332 to communicate with a side surface 333c on the outer periphery of the porous member 333, and the pressure reduction section 333b is provided on the side surface 333c. One end of the suction hole 336 is connected to the side surface 333c of the porous member 333, and the other end is connected to the pressure reduction means 31 via a suction path 312.

[0032] By providing the shielding member 332, when the vacuum chuck member 334 is evacuated by the pressure reducing means (vacuum source) 31, a negative pressure can be efficiently generated on the substrate attracting surface 334a. This allows the substrate WF to be reliably attracted to the substrate attracting member 330, preventing the substrate WF from jumping outward (slipping out) during polishing without providing a retainer member around the substrate WF. In particular, with the recent trend toward thinner substrates WF, even when a retainer member is provided, the substrate WF may slip out during polishing. Furthermore, if the substrate WF has a rectangular shape, the corners of the substrate WF may come into contact with the retainer member during polishing, potentially resulting in damage to the substrate WF or the top ring. In contrast, according to this embodiment, the substrate WF can be pressed against the polishing pad 352 while being vacuum-attracted by the substrate attracting member 330, preventing the substrate WF from slipping out during polishing and preventing damage to the substrate WF or the top ring during polishing.

[0033] Furthermore, in this embodiment, the pressure reducing section 333b is provided on the side surface 333c of the porous member 333, which makes it possible to uniformize the polishing profile of the substrate WF. That is, the location where the pressure reducing section 333b is provided is vacuumed by the pressure reducing means 31, resulting in a local negative pressure. If the pressure reducing section 333b were provided on the surface of the porous member 333 opposite the substrate WF side, the local negative pressure would be generated in that location, making it less likely that a pressing force would be applied to the substrate WF compared to other locations, resulting in a non-uniform polishing profile. In contrast, in this embodiment, the pressure reducing section 333b is provided on the side surface 333c of the porous member 333, which makes it less likely that a local negative pressure would be generated on the surface of the porous member 333 opposite the substrate WF side, making it possible to uniformize the polishing profile of the substrate WF.

[0034] 3 , the substrate suction member 330 includes a frame member 344 provided on the shielding member 332 so as to surround at least a portion of the base member 301 (specifically, the upper guide member 305 and the lower guide member 306). The frame member 344 includes a lower frame member 343 provided in a frame shape around the periphery of the upper surface of the shielding member 332, and a frame-like upper frame member 342 provided on the lower frame member 343. The lower frame member 343 and the shielding member 332 are connected via a sealant 341. Note that in this embodiment, the sealant 341 is formed in a film shape that covers the upper surface of the substrate suction member 330, but is not limited thereto, and may be in a frame shape having only a periphery for sealing between the lower frame member 343 and the shielding member 332.

[0035] The upper frame member 342 includes a frame member protrusion 342a that protrudes toward the base member 301 (specifically, the upper guide member 305). The upper guide member 305 also includes a guide member protrusion 305a that protrudes toward the upper frame member 342 at a height position different from that of the frame member protrusion 342a. The frame member protrusion 342a and the guide member protrusion 305a overlap each other in a predetermined region when the top ring 302 is viewed from above. Therefore, contact between the frame member protrusion 342a and the guide member protrusion 305a can restrict movement of the substrate suction member 330 in the height direction.

[0036] The substrate suction member 330 includes an elastic member 340 that connects at least a portion of the base member 301 surrounded by the frame member 344 to the frame member 344. Specifically, the elastic member 340 is a frame-shaped plate member having an inner end 340a that is sandwiched between the upper guide member 305 and the lower guide member 306, and an outer end 340b that is sandwiched between the lower frame member 343 and the upper frame member 342. The elastic member 340 can be made of a rubber material such as silicone rubber, EPDM (ethylene propylene diene rubber), or FKM (fluororubber), but is not limited to these.

[0037] As shown in FIG. 3 , the top ring 302 includes an elastic membrane 320 configured to form multiple pressure chambers between the base member 301 and the substrate suction member 330 for pressing the substrate WF with pressurized fluid. Specifically, the elastic membrane 320 includes multiple elastic membranes 320-1, 320-2, and 320-3 that are stacked and have different areas. Each of the elastic membranes 320-1, 320-2, and 320-3 includes a central portion that contacts the upper surface of the shielding member 332 and end portions that extend from the central portion and are fixed at different positions on the lower surface of the upper guide member 305. The multiple elastic membranes 320-1, 320-2, and 320-3 form multiple concentric pressure chambers for pressurizing the substrate WF between the base member 301 and the multiple elastic membranes 320-1, 320-2, and 320-3. Each of the multiple pressure chambers is in communication with the pressure adjustment unit 30 via a pressure path 313. The pressure adjusting unit 30 has a pressure adjusting function of adjusting the pressure of the pressure fluid supplied to each pressurizing chamber. By forming multiple pressurizing chambers, the pressing force of the substrate WF against the polishing pad 352 via the substrate attracting member 330 can be controlled for each area. According to this embodiment, the substrate WF is attracted to the substrate attracting surface 334a by applying negative pressure to the porous member 333 and the vacuum chuck member 334 using the decompression means 31, and the substrate WF can be pressed against the polishing pad 352 via the substrate attracting member 330 by pressurizing the pressurizing chambers using the pressure adjusting unit 30. The number of elastic membranes 320 and pressurizing chambers is not particularly limited and can be one or more.

[0038] 3 , the top ring 302 further includes a band 345 that connects the outer side surface of the portion of the base member 301 that is not surrounded by the frame member 344 (specifically, the flange 303) to the outer side surface of the frame member 344. The band 345 is attached from the outer side surface of the flange 303 to the outer side surface of the upper frame member 342. The band 345 allows the substrate suction member 330 to move relative to the base member 301 and prevents the polishing liquid and the like from entering the space between the substrate suction member 330 and the base member 301.

[0039] The frame member 344 or the band 345 functions as a connecting portion 70 for connecting the substrate suction member 330 and the base member 301. The form of the connecting portion 70 is not particularly limited as long as it is a physical connection, and the connecting portion 70 may be any surface of the substrate suction member 330 that comes into contact with the base member 301.

[0040] FIG. 4 is a cross-sectional view schematically illustrating the substrate suction member 330 of this embodiment. In the following figures, the frame member 344 and other components are omitted as appropriate. The vacuum chuck member 334 has a substrate suction surface 334a to which the substrate WF is suctioned, a back surface 334b, and a plurality of through-holes 42 that penetrate from the substrate suction surface 334a to the back surface 334b. The back surface 334b ​​is a surface formed on the vacuum chuck member 334 opposite the substrate suction surface 334a. In this embodiment, the vacuum chuck member 334 is configured in a flat plate shape, with the back surface 334b ​​located on the opposite side of the substrate suction surface 334a in the thickness direction. The plurality of through-holes 42 extend in the thickness direction, approximately perpendicular to the substrate suction surface 334a. This configuration allows the substrate WF to be suctioned more uniformly across the substrate suction surface 334a.

[0041] The vacuum chuck member 334 may be any member that can be machined with a plurality of through holes 42 and that can vacuum-suck the substrate WF by vacuuming using the pressure reducing means (vacuum source) 31, and may be made of a resin such as PE, PP, PTFE, or PVC. It is preferable that the porous member 333 and the vacuum chuck member 334 be made of the same material, but this is not a limitation.

[0042] The porous member 333 is located on the back surface 334b ​​side of the vacuum chuck member 334. The porous member 333 has an opposing surface 333a that faces the back surface 334b ​​of the vacuum chuck member 334. The porous member 333 defines an air flow path (not shown) that passes through the interior of the porous member 333 and connects the opposing surface 333a to surfaces of the porous member 33 other than the opposing surface 333a. In the illustrated example, the porous member 333 defines an air flow path that connects the opposing surface 333a to the side surface 333c. This air flow path is fluidly connected to the multiple through holes 42. In this embodiment, the porous member 333 is flat and extends along the back surface 334b ​​of the vacuum chuck member 334. This allows the multiple through holes 42 of the vacuum chuck member 334 to be evacuated to a more uniform pressure.

[0043] The substrate suction member 330 has a sealant 400 that seals some of the multiple through-holes 42 of the vacuum chuck member 334. The form of the sealant 400 is not particularly limited as long as it can suppress vacuum leakage. In this embodiment, the sealant 400 is a stopper that closes the through-hole 42. The sealant 400 is disposed inside the through-hole 42, so that the through-hole 42 can be sealed more reliably. The sealant 400 is preferably an elastic material such as rubber. The elastic deformation of the sealant 400 allows the sealant 400 to more reliably suppress vacuum leakage within the through-hole 42.

[0044] FIG. 5 is a bottom view of the substrate suction member 330, schematically illustrating the substrate suction surface 334a of the vacuum chuck member 334. In FIGS. 5 and 6, the sealant 400 is schematically illustrated with a dotted pattern. The vacuum chuck member 334 has a plurality of first through holes 421 and a plurality of second through holes 422. In this embodiment, the substrate WF is smaller than the substrate suction surface 334a. The region of the substrate suction surface 334a where the substrate WF is disposed is referred to as a first region V1. In this embodiment, the substrate WF is a rectangular substrate. The first region V1 is a rectangular region of the substrate suction surface 334a, the center of which is the position through which the rotation axis Ax of the top ring 302 passes. Hereinafter, the term "radial direction" refers to the radial direction with respect to the rotation axis Ax of the top ring 302. The region of the substrate suction surface 334a that is radially outward of the first region V1, in other words, the outer periphery, is referred to as a second region V2.

[0045] Of the multiple through holes 42, the through holes that open to the first region V1 are referred to as first through holes 421, and the through holes that open to the second region V2 are referred to as second through holes 422. The second through holes 422 are sealed with a sealant 400. This prevents vacuum leakage from the second through holes 422. In this way, in this embodiment, the risk of vacuum leakage can be reduced depending on the size or shape of the substrate WF.

[0046] FIG. 6 is a bottom view schematically illustrating the arrangement of the sealant 400 on the substrate attraction surface 334a in another embodiment. In this example, in addition to the plurality of second through holes 422, the sealant 400 seals a portion of the plurality of first through holes 421 that open to the periphery of the first region V1. In other words, the sealant 400 and the substrate WF are arranged so that they overlap each other in a predetermined area when the top ring 302 is viewed from above. As a result, even if the periphery of the substrate WF has a shape that could cause vacuum leakage, such as a notch, the first through holes 421 facing the periphery are sealed, thereby suppressing vacuum leakage. In this way, the embodiment of FIG. 6 can suppress the risk of vacuum leakage depending on the shape of the periphery of the substrate WF. Of the plurality of first through holes 421, it is preferable that the first through holes 421 located on the outermost side be sealed. The peripheral portion of the first region V1 may be determined based on the shape of the non-patterned region 20, such as the position where it overlaps with the non-patterned region 20 described later on the substrate WF, or may be determined based on the position where a notch or the like may exist.

[0047] By sealing some of the through holes 42 with the sealant 400, it is possible to provide the substrate attracting member 330, the top ring 302, etc., in which the risk of vacuum leakage is reduced, depending on the size or shape of the substrate WF. This allows the substrate WF to be attracted with a more uniform force across the substrate attracting surface 334a. This also reduces the risk of the substrate WF falling off the substrate attracting surface 334a, and reduces the risk of damage to the substrate WF, the top ring 302, etc.

[0048] FIG. 7 is a plan view schematically illustrating a substrate WF used in the substrate processing apparatus 1000 of this embodiment. FIG. 7 schematically illustrates patterned and non-patterned regions of the substrate WF of one embodiment. The substrate WF of this embodiment has a patterned region 10 in which wiring or functional chips, etc. are provided, and a non-patterned region 20 in which wiring or functional chips, etc. are not provided. The non-patterned region 20 is provided on the periphery of the substrate WF and is linearly arranged so as to divide the area excluding the periphery into two, upper and lower regions. The patterned region 10 is provided in the area surrounded by the non-patterned region 20. Since the sealing material 400 can be arranged according to the shape of the substrate WF, the substrate WF used in the substrate processing apparatus 1000 is not particularly limited. For example, the substrate WF does not have to be rectangular and may be circular.

[0049] From the viewpoint of vacuum-sucking the substrate WF with a more uniform pressure across the substrate suction surface 334a, the vacuum chuck member 334 preferably has a sieve-like structure in which a plurality of through holes 42 are dispersed. The plurality of through holes 42 are preferably uniformly distributed across the substrate suction surface 334a. From the same viewpoint, the plurality of through holes 42 are preferably formed in a predetermined pattern, such as at the positions of square or hexagonal lattice points. Alternatively, the plurality of through holes 42 may be formed in random positions. The diameter W1 ( FIG. 5 ) of the plurality of through holes 42 on the substrate suction surface 334a is preferably, but is not limited to, 1 mm or less from the viewpoint of vacuum-sucking the substrate WF with a uniform force across the substrate suction surface 334a. The diameter W1 is preferably, but is not limited to, 0.01 mm or more from the viewpoint of facilitating the manufacture of the vacuum chuck member 334. The diameter W1 is the maximum diameter of the through holes 42.

[0050] FIG. 8 is a cross-sectional view schematically illustrating a vacuum chuck member 334 according to one embodiment. FIG. 8 is an enlarged view schematically illustrating the cross section 8-8 of FIG. 4. The vacuum chuck member 334 according to this embodiment is a member formed by combining a plurality of element members 432, and is preferably integrally formed by fusing, crimping, adhering, or sintering the elements together. In this embodiment, the gaps C1 between the integrally formed element members 432 form the plurality of through holes 42. In the illustrated example, each element member 432 is cylindrical, with the bottom surface of the element member 432 extending along the substrate suction surface 334a, and the outer surface (cylindrical surface) of each element member 432 extending in the thickness direction of the flat vacuum chuck member 334. The gaps C1 forming the plurality of through holes 42 are surrounded by the outer surfaces of adjacent element members 432. In this example, it is not necessary to prepare element members 432 with through holes formed therein when manufacturing the vacuum chuck member 334. Therefore, by using fibers as the element members 432, it is easy to create a vacuum chuck member 334 having a small diameter of the through-hole 42 in the direction parallel to the substrate suction surface 334a. From this perspective, it is preferable that the element members 432 are resin fibers. The element members 432 may be cylindrical, annular, rod-like, or flat.

[0051] FIG. 9 is a cross-sectional view schematically illustrating a vacuum chuck member 334 according to another embodiment. FIG. 9 is a schematic enlarged view corresponding to the cross section 8-8 of FIG. 4. In the example shown in FIG. 9, the vacuum chuck member 334 is a member formed by combining multiple cylindrical or annular element members 432a, preferably integrally formed by fusion, pressure bonding, adhesive bonding, or sintering. In the illustrated example, each element member 432a is cylindrical or annular with a hollow H1. The bottom surface of each element member 432a extends along the substrate chucking surface 334a, and the outer surface (cylindrical surface) of each element member 432a extends in the thickness direction of the flat vacuum chuck member 334. The hollow H1 and the gaps C1 between adjacent element members 432a form multiple through-holes 42. In this example, the through-holes 42 can be widened to increase conductance.

[0052] FIG. 10 is a cross-sectional view schematically illustrating a vacuum chuck member 334 according to another embodiment. FIG. 10 is a schematic enlarged view corresponding to the cross section 8-8 of FIG. 4. In the example of FIG. 10, the vacuum chuck member 334 is a member formed by combining multiple element members 432b, preferably integrally formed by fusion, pressure bonding, adhesive bonding, or sintering. Each element member 432b is cylindrical with a hollow H2, and the bottom surface of the element member 432b extends along the substrate suction surface 334a. In the illustrated example, there are no gaps between the multiple element members 432b, and the element members 432b have a shape that allows them to be arranged without gaps on a plane, such as a hollow hexagonal column. The hollow H2 forms multiple through-holes 42. In this example, the contact areas of the multiple element members 432b can be widened to allow for a firm bond. Note that the vacuum chuck member 334 is not particularly limited to the above example, as long as it can suction the substrate WF with a desired degree of force and uniformity.

[0053] <Method of Manufacturing Substrate Suction Member> An example of a method of manufacturing the substrate suction member 330 will be described below. First, an example of a method of manufacturing the vacuum chuck member 334 will be described.

[0054] 11 to 14 are schematic diagrams illustrating the steps of the manufacturing method of the vacuum chuck member 334 according to this embodiment. FIGS. 11 and 12 are diagrams illustrating the arrangement step of preparing and arranging a plurality of element members 432c. In the following example, the element members 432c are cylindrical and deformed by sintering or the like, but this is not limiting. In the arrangement step, the plurality of element members 432c are arranged randomly or in a predetermined pattern based on the shape of the vacuum chuck member 334. The plurality of element members 432c are preferably arranged on a flat surface so that they are in contact with each other or so close together that they can be bonded by sintering or the like.

[0055] 11 and 12 are perspective and plan views, respectively, illustrating a plurality of element members 432c arranged in a predetermined pattern. In the illustrated example, the element members 432c are cylindrical with a hollow H3 extending in the longitudinal direction. The centers of the bottom surfaces of the element members 432c are located at lattice points of a lattice consisting of equilateral triangles when viewed from above, and the outer surfaces (cylindrical surfaces) of the element members 432c are arranged so that they are in contact with or close to each other. In this manner, the plurality of element members 432c are arranged so that their outer peripheral surfaces face each other. The plurality of element members 432c can be fibrous, tubular, annular, rod-shaped, or flat, and are preferably made of resin.

[0056] FIG. 13 is a conceptual diagram illustrating an integration step of integrating multiple element members 432c after the arrangement step. In the integration step, multiple element members 432c are integrated by sintering or the like to form an integrated member 450. FIG. 13 is a plan view schematically illustrating the integrated member 450. In the illustrated example, the integrated member 450 is in the form of a flat plate or block having a mesh-like wall portion 451 formed by sintering multiple element members 432c together. The multiple through holes 42 are holes surrounded by the mesh-like wall portion 451. Note that in the integration step, the multiple element members 432c may be fused or pressure-bonded by heat compression, or may be joined by adhesive.

[0057] FIG. 14 is a conceptual diagram illustrating the molding process for shaping the integrated member 450 into the shape of the vacuum chuck member 334 after the integration process. In the molding process, the integrated member 450 can be subjected to at least one of cutting, milling, grinding, and polishing. It is preferable to create an integrated member 450 that is thicker than the vacuum chuck member 334 and then cut it to the desired thickness so that it is flat. Furthermore, from the viewpoint of vacuum-suctioning the substrate WF more uniformly across the substrate suction surface 334a, it is preferable to smooth the surfaces of the substrate suction surface 334a, the back surface 334b, etc., by polishing or the like. The manufacturing method for the vacuum chuck member 334 is not limited to the above example. For example, the vacuum chuck member 334 may be manufactured by additive manufacturing using an additive manufacturing device such as a 3D printer.

[0058] The method for manufacturing the substrate suction member 330 of this embodiment can include arranging a plurality of element members 432c with their outer peripheral surfaces facing each other, each of the plurality of element members 432c being a fibrous, cylindrical, annular, rod-shaped, or flat-plate resin, heat-compressing, adhesively bonding, or sintering the plurality of element members 432c to obtain a flat or block-shaped integrated member 450 having a plurality of through holes formed therein, and performing at least one of cutting, milling, grinding, and polishing on the integrated member 450 to form the vacuum chuck member 334. This makes it possible to efficiently manufacture the substrate suction member 330 in which the plurality of through holes 42 are dispersed and which can perform vacuum suction more uniformly across the substrate suction surface 334a.

[0059] 15 is a conceptual diagram illustrating a step of bonding the vacuum chuck member 334 and the porous member 333 in the manufacturing method of the substrate suction member 330. In this step, the porous member 333 is placed on the back surface 334b ​​of the vacuum chuck member 334. It is preferable that the opposing surface 333a of the porous member 333 and the back surface 334b ​​of the vacuum chuck member 334 are bonded together. In this bonding, the amount of adhesive or the like is adjusted so that the air flow path of the porous member 333 and the multiple through-holes 42 of the vacuum chuck member 334 are not blocked. Note that the method of bonding the vacuum chuck member 334 and the porous member 333 is not particularly limited as long as the multiple through-holes 42 can be evacuated with the desired force and uniformity.

[0060] 16 is a conceptual diagram illustrating the process of attaching a shielding member 332 to a vacuum chuck member 334 and a porous member 333 to form a substrate suction member main body 331 in the manufacturing method of the substrate suction member 330. In this process, it is preferable that the surface of the porous member 333 opposite to the opposing surface 333a be bonded to the shielding member 332. The porous member 333 is attached to the shielding member 332 so as to connect the porous member 333 to the suction holes 336 in an exhaustable manner. A frame member 344 or the like is appropriately attached to the shielding member 332 as needed.

[0061] 17 to 19 are conceptual diagrams illustrating the process of forming the sealant 400 on the substrate suction member main body 331. FIG. 17 is a cross-sectional view of the substrate suction member main body 331, schematically illustrating the coating process of placing the cover member 460 on the substrate suction surface 334a. The cover member 460 is arranged to cover the multiple through-holes 42 where the sealant 400 is not to be placed. The cover member 460 may be a substrate WF or a component shaped like the substrate WF. Here, a shape based on the substrate WF refers to a shape that covers the multiple through-holes 42 that vacuum-suck the substrate WF and does not cover the other through-holes 42, such as having a surface with the same shape as the surface opposite the polished surface of the substrate WF. As described above, the sealant 400 may be placed in the second through-holes 422 as well as in some of the multiple first through-holes 421. Therefore, the shape based on the substrate WF may be a shape excluding the peripheral edge portion of the substrate WF where a notch or the like is present. The component shaped like the substrate WF may be flat or lumpy. The covering member 460 can be configured to cover the area of ​​the substrate attracting surface 334a that is covered by the substrate WF. The covering member 460 is detachably fixed on the substrate attracting surface 334a. The covering member 460 may be attracted to the substrate attracting surface 334a by depressurization by the depressurization means 31.

[0062] FIG. 18 is a conceptual diagram illustrating a sealing process in which a sealant 400 is placed in some of the through holes 42 after the covering process. In the sealing process, at least a plurality of second through holes 422 of the vacuum chuck member 334 are sealed. In this example, the sealant 400 is a liquid resin material, and the substrate chucking surface 334a is immersed in the sealant 400. As shown in FIG. 18 , the vacuum chuck member 334 is preferably immersed in the sealant 400 with the substrate chucking surface 334a facing vertically downward. This allows the sealant 400 to be efficiently placed inside the through holes 42 and facilitates uniform amounts of sealant 400 being placed in each through hole 42. At this time, depressurization by the depressurization means 31 may be used to promote entry of the sealant 400 into the through holes 42. Alternatively, the sealant 400 may be placed in the through holes 42 by applying or spraying a liquid resin material onto the substrate chucking surface 334a. Even in this case, the sealant 400 can be efficiently and easily placed in the through holes 42. The sealant 400 that has entered the plurality of through-holes 42 by coating, spraying, or immersion is held in the plurality of through-holes 42 by surface tension. The sealant 400 held in the plurality of through-holes 42 is solidified by natural drying, heating, or the like.

[0063] The sealing step is not limited to the above method, and for example, a film may be placed in each through-hole 42 as the sealant 400 by machine or by hand.

[0064] 19 is a conceptual diagram for explaining the removal step of removing the covering member 460 from the substrate suction surface 334a after the sealing step. The covering member 460 may be removed by machine or manually by the user. Alternatively, the covering member 460 may be removed by ceasing the decompression by the decompression means 31. After the covering member 460 is removed from the substrate suction surface 334a, the sealant 400 remaining on the substrate suction surface 334a may be removed as appropriate. In this manner, the sealant 400 is disposed on the substrate suction member main body 331, and the substrate suction member 330 can be obtained.

[0065] The top ring 302 can be manufactured by attaching the substrate suction member 330 to the base member 301 of the top ring 302. The substrate suction member 330 is physically connected to the base member 301 via the above-described connection portion 70. The substrate suction member 330 may be configured to be replaceable as a consumable item.

[0066] <Modification 1> Figure 20 is a cross-sectional view schematically illustrating a substrate attraction member 330a of this modification. The substrate attraction member 330a of this modification has substantially the same configuration as the substrate attraction member 330 of the above-described embodiment, but differs from the substrate attraction member 330 in that it has a sealant 400a instead of the sealant 400. The sealant 400a is a layer extending along the substrate attraction surface 334a. The sealant 400a is preferably a resin formed on the substrate attraction surface 334a. In the illustrated example, the sealant 400a is a film disposed on the periphery of the substrate attraction surface 334a. This facilitates sealing with the sealant 400a.

[0067] 21 to 23 are conceptual diagrams illustrating the process of forming a sealant 400a on the substrate adsorption member main body 331. FIG. 21 is a cross-sectional view of the substrate adsorption member main body 331, schematically illustrating the covering process of placing a cover member 460 on the substrate adsorption surface 334a. In the covering process of this modified example, it is preferable to place the cover member 460 with the substrate adsorption surface 334a facing vertically upward, as in the illustrated example. However, the orientation of the substrate adsorption surface 334a is not particularly limited as long as the cover member 460 can be held on the substrate adsorption surface 334a during the sealing process. The cover member 460 is placed so as to cover the multiple through-holes 42 where the sealant 400a is not placed.

[0068] 22 shows a sealing step of forming a film of sealant 400a on the substrate adsorption surface 334a after the covering step of this modified example. In the sealing step of this modified example, it is preferable to spray or apply the sealant 400a, such as a liquid resin material, to the substrate adsorption surface 334a on which the covering member 460 is disposed. Alternatively, a film of the sealant 400a may be attached to the substrate adsorption surface 334a. After the sealant 400a is disposed on the substrate adsorption surface 334a, the sealant 400a can be solidified by natural drying, heating, or the like.

[0069] 23 is a conceptual diagram illustrating a removal process for removing the covering member 460 from the substrate adsorption surface 334a after the sealing process of this modified example. The covering member 460 may be removed mechanically or manually by the user. After the covering member 460 is removed from the substrate adsorption surface 334a, the sealant 400a remaining on the substrate adsorption surface 334a may be removed as appropriate. In this manner, the sealant 400a is disposed on the substrate adsorption member main body 331, and the substrate adsorption member 330a can be obtained. Alternatively, instead of using the covering member 460, a film obtained by molding the sealant 400a to fit the positions of the multiple through-holes 42 that seal the sealant 400a may be placed on the substrate adsorption surface 334a by adhesive or the like.

[0070] <Modification 2> FIG. 24 is a cross-sectional view schematically illustrating a substrate suction member 330b of this modification. The substrate suction member 330b of this modification has substantially the same configuration as the substrate suction member 330 of the above-described embodiment, but differs from the substrate suction member 330 in that it includes a sealant 400b instead of the sealant 400. The sealant 400b is a layer extending along the back surface 334b ​​of the vacuum chuck member 334. The sealant 400b may be a resin film. The sealant 400b is preferably positioned between the vacuum chuck member 334 and the porous member 333. The sealant 400b has a sealant peripheral portion 471 that seals some of the through holes 42, and sealant through holes 472 are preferably formed inside the sealant peripheral portion 471 at positions corresponding to the through holes 42 that are not sealed. The sealant through holes 472 may be one or more holes of any shape, as long as they fluidly connect the through holes 42 to the porous member 333.

[0071] The manufacturing method of the substrate suction member 330b of this modified example is not particularly limited. For example, the porous member 333 and the sealant 400b may be bonded together, and then the bonded sealant 400b may be bonded to the vacuum chuck member 334. Alternatively, the sealant 400b may be bonded to the vacuum chuck member 334, and then the bonded sealant 400b may be bonded to the porous member 333.

[0072] The above-described embodiments can also be described as the following embodiments. [Mode 1] According to Mode 1, a substrate suction member is proposed, the substrate suction member being a substrate suction member for a top ring for suctioning a substrate, the substrate suction member comprising: a vacuum chuck member including a substrate suction surface to which the substrate is suctioned, a back surface, and a plurality of through holes extending from the substrate suction surface to the back surface; a porous member located on the back surface of the vacuum chuck member; and a sealant sealing some of the plurality of through holes, the plurality of through holes including a plurality of first through holes opening in a first region of the substrate suction surface where the substrate is placed and a plurality of second through holes opening in a second region outer than the first region, the sealant sealing the plurality of second through holes. Mode 1 makes it possible to provide a substrate suction member that reduces the risk of vacuum leakage depending on the size or shape of the substrate.

[0073] [Mode 2] According to Mode 2, the sealant in Mode 1 includes at least one of plugs that close the portions of the plurality of through holes, a film formed on the substrate suction surface, and a film formed on the back surface. According to Mode 2, the sealant can be disposed at an appropriate position according to design convenience.

[0074] [Mode 3] According to Mode 3, in Mode 1 or 2, the sealant seals some of the first through holes that open to the periphery of the first region. According to Mode 3, even if the periphery of the substrate has an area where vacuum leakage is likely to occur, such as a notch, vacuum leakage can be suppressed.

[0075] [Mode 4] According to Mode 4, in any one of Modes 1 to 3, the vacuum chuck member is flat with the back surface located on the opposite side of the substrate chucking surface in the thickness direction, and the porous member is flat with an opposing surface facing the back surface of the vacuum chuck member, and defines an air flow path that passes through the interior of the porous member and connects the opposing surface to another surface of the porous member. According to Mode 4, it is possible to more uniformly evacuate the substrate chucking surface.

[0076] [Mode 5] According to Mode 5, in any one of Modes 1 to 4, the diameter of the plurality of through holes in the substrate suction surface is 0.01 mm or more and 1 mm or less. According to Mode 5, the vacuum chuck member can be easily manufactured, and the substrate suction surface can be evacuated more uniformly.

[0077] [Mode 6] According to Mode 6, in any one of Modes 1 to 5, the vacuum chuck member includes a member formed by combining a plurality of cylindrical or annular element members, and the plurality of through holes are hollow in the plurality of cylindrical or annular element members. According to Mode 6, a vacuum chuck member having a plurality of through holes can be efficiently manufactured.

[0078] According to Mode 7, the vacuum chuck member in any one of Modes 1 to 6 includes a member in which a plurality of fibrous, tubular, annular, rod-shaped, or flat element members are combined with one another, and the plurality of through holes are gaps between adjacent element members. According to Mode 7, a vacuum chuck member having a plurality of through holes formed therein can be processed even if all of the element members are not necessarily hollow.

[0079] [Mode 8] According to Mode 8, in any one of Modes 1 to 7, the substrate is a rectangular substrate, and at least one of the vacuum chuck member and the porous member contains a resin. Mode 8 makes it possible to take advantage of the advantages of a rectangular substrate while suppressing damage to the substrate, the top ring, etc., caused by corners of the rectangular substrate falling off the top ring. In addition, resin allows for easy processing.

[0080] [Mode 9] According to Mode 9, there is provided a top ring, which includes the substrate suction member of any one of Modes 1 to 8. According to Mode 9, it is possible to provide a top ring that reduces the risk of vacuum leakage depending on the size or shape of the substrate.

[0081] [Mode 10] According to Mode 10, the device of Mode 9 further includes an elastic membrane configured to form a pressure chamber for pressing the substrate suction member with a pressurized fluid. According to Mode 10, the pressing force on the substrate can be controlled.

[0082] [Mode 11] According to Mode 11, in Mode 10, a plurality of the elastic membranes are provided, and the plurality of elastic membranes are configured to form a plurality of the pressure chambers arranged concentrically. According to Mode 10, the pressing force on the substrate can be controlled for each portion of the substrate.

[0083] [Mode 12] According to Mode 12, there is provided a substrate processing apparatus, the substrate processing apparatus including a top ring according to any one of Modes 9 to 11, and a polishing table configured to hold a polishing pad. According to Mode 12, it is possible to provide a substrate processing apparatus having a top ring that reduces the risk of vacuum leakage depending on the size or shape of the substrate.

[0084] [Mode 13] According to Mode 13, there is provided a method for manufacturing a substrate suction member, the method for manufacturing a substrate suction member being the method for manufacturing a substrate suction member of any one of Modes 1 to 8, which includes sealing the second through-hole of the vacuum chuck member with the sealant. According to Mode 13, it is possible to provide a substrate suction member in which the risk of vacuum leakage is reduced depending on the size or shape of the substrate.

[0085] [Mode 14] According to Mode 14, as in Mode 13, a covering member is disposed on the substrate suction surface so as to cover an area of ​​the substrate suction surface that is covered by the substrate, a liquid resin material is disposed on the substrate suction surface on which the covering member is disposed and the resin material is solidified, or a film is disposed on the substrate suction surface on which the covering member is disposed, and the covering member is removed from the substrate suction surface. According to Mode 14, it is possible to easily and reliably provide a substrate suction member that uses a covering member and that reduces the risk of vacuum leakage according to the size or shape of the substrate.

[0086] According to the fifth aspect, in the arrangement of the liquid resin material in the fourth aspect, the liquid resin material is arranged on the substrate suction surface on which the covering member is arranged by coating or spraying. According to the fifth aspect, the sealing material can be arranged on the substrate suction surface efficiently and easily.

[0087] According to the sixth aspect, in the arrangement of the liquid resin material in the fourth aspect, the vacuum chuck member is immersed in the liquid resin material with the substrate suction surface on which the covering member is arranged facing vertically downward. According to the sixth aspect, the sealant can be efficiently arranged on the substrate suction surface, and the amount of sealant arranged in each through hole can be easily made uniform.

[0088] [Mode 17] According to any one of Modes 13 to 16, the method includes arranging a plurality of element members so that their outer peripheral surfaces face each other, each of the plurality of element members being a fibrous, tubular, annular, rod-shaped, or flat-plate-shaped resin, heat-compressing, adhesively bonding, or sintering the plurality of element members to obtain a flat or block-shaped integrated member having a plurality of through holes formed therein, and performing at least one of cutting, milling, grinding, and polishing on the integrated member to obtain the vacuum chuck member. According to Mode 10, it is possible to efficiently manufacture a substrate suction member having a plurality of through holes dispersed and capable of more uniform vacuum suction across the substrate suction surface.

[0089] Although several embodiments of the present invention have been described above, the above-described embodiments of the present invention are intended to facilitate understanding of the present invention and are not intended to limit the present invention. The present invention may be modified or improved without departing from the spirit thereof, and the present invention naturally includes equivalents thereof. Furthermore, any combination or omission of the components described in the claims and specification is possible within the scope of solving at least part of the above-described problems or achieving at least part of the effects.

[0090] This application claims priority from Japanese Patent Application No. 2024-15847, filed February 5, 2024. The entire disclosure of Japanese Patent Application No. 2024-15847, including the specification, claims, drawings, and abstract, is incorporated herein by reference in its entirety. The entire disclosures of Japanese Patent Application No. 2023-57047 (Patent Document 1), Japanese Translation of PCT International Publication No. 2020-515424 (Patent Document 2), Japanese Patent Application No. 2012-33640 (Patent Document 3), and Japanese Patent Application No. 2008-187098 (Patent Document 4), including the specification, claims, drawings, and abstract, are incorporated herein by reference in their entirety.

[0091] 31 Pressure reducing means (vacuum source) 42 Through hole 70 Connection portion 301 Base member 302 Top ring 320 Elastic membrane 330, 330a, 330b Substrate suction member 332 Shielding member 333 Porous member 333a Opposing surface 333c Side surface 334 Vacuum chuck member 334a Substrate suction surface 334b ​​Back surface 336 Suction hole 344 Frame member 345 Band 400, 400a, 400b Sealing material 421 First through hole 422 Second through hole 432, 432a, 432b, 432c Element member 450 Integrated member 460 Covering member 1000 Substrate processing apparatus C1 Gap H1, H2, H3 Hollow V1 First region V2 Second region W1 Hole diameter WF Substrate

Claims

1. A substrate suction member for a top ring for suctioning a substrate, comprising: a vacuum chuck member including a substrate suction surface to which the substrate is suctioned, a back surface, and a plurality of through holes penetrating from the substrate suction surface to the back surface; a porous member located on the back surface side of the vacuum chuck member; and a sealant that seals some of the plurality of through holes, wherein the plurality of through holes include a plurality of first through holes that open to a first region on the substrate suction surface where the substrate is placed, and a plurality of second through holes that open to a second region that is more outer than the first region, and the sealant seals the plurality of second through holes.

2. The substrate adsorption member according to claim 1, wherein the sealing material includes at least one of plugs that block some of the plurality of through holes, a film formed on the substrate adsorption surface, and a film formed on the back surface.

3. A substrate suction member according to claim 1 or 2, wherein the sealing material seals a portion of the plurality of first through holes that open to the periphery of the first region.

4. A substrate suction member as described in claim 1 or 2, wherein the vacuum chuck member is flat with the back surface located on the opposite side of the substrate suction surface in the thickness direction, and the porous member is flat and has an opposing surface facing the back surface of the vacuum chuck member, and defines an air flow path that passes through the interior of the porous member and connects the opposing surface with another surface of the porous member.

5. A substrate suction member according to claim 1 or 2, wherein the diameter of the plurality of through holes in the substrate suction surface is 0.01 mm or more and 1 mm or less.

6. A substrate suction member according to claim 1 or 2, wherein the vacuum chuck member includes a member in which a plurality of cylindrical or annular element members are combined with each other, and the plurality of through holes are hollow in the plurality of cylindrical or annular element members.

7. A substrate suction member according to claim 1 or 2, wherein the vacuum chuck member includes a member in which a plurality of fibrous, cylindrical, annular, rod-shaped or flat element members are combined with one another, and the plurality of through holes are gaps between the plurality of adjacent element members.

8. The substrate suction member according to claim 1 or 2, wherein the substrate is a rectangular substrate, and at least one of the vacuum chuck member and the porous member contains a resin.

9. A top ring equipped with the substrate suction member according to claim 1 or 2.

10. The top ring according to claim 9, further comprising an elastic membrane configured to form a pressure chamber for pressing the substrate attracting member with a pressurized fluid.

11. The top ring according to claim 10, comprising a plurality of said elastic membranes, said plurality of elastic membranes being configured to form a plurality of said pressure chambers arranged concentrically.

12. A substrate processing apparatus comprising: the top ring according to claim 9; and a polishing table configured to hold a polishing pad.

13. A method for manufacturing a substrate suction member according to claim 1 or 2, comprising sealing the second through-hole of the vacuum chuck member with the sealing material.

14. A method for manufacturing a substrate adsorption member as described in claim 13, further comprising: placing a covering member on the substrate adsorption surface to cover an area of the substrate adsorption surface that is covered by the substrate; placing a liquid resin material on the substrate adsorption surface on which the covering member is placed and solidifying the resin material, or placing a film on the substrate adsorption surface on which the covering member is placed; and removing the covering member from the substrate adsorption surface.

15. A method for manufacturing a substrate adsorption member as described in claim 14, wherein, in disposing the liquid resin material, the liquid resin material is disposed on the substrate adsorption surface on which the covering member is disposed by coating or spraying.

16. A method for manufacturing a substrate suction member as described in claim 14, wherein, in disposing the liquid resin material, the vacuum chuck member is immersed in the liquid resin material with the substrate suction surface on which the coating member is disposed facing vertically downward.

17. A method for manufacturing a substrate suction member according to claim 13, comprising: arranging a plurality of element members so that their outer peripheral surfaces face each other, each of the plurality of element members being a fibrous, tubular, annular, rod-shaped or flat resin; heat-compressing, adhesively bonding or sintering the plurality of element members to obtain a flat or block-shaped integrated member having a plurality of through holes formed therein; and performing at least one of cutting, machining, grinding and polishing on the integrated member to form the vacuum chuck member.

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