Electronic device comprising sensor

Abstract

An electronic device according to one embodiment of the present disclosure includes: a first housing; a second housing coupled to the first housing so as to be movable; a first support bracket and a first printed circuit board that are disposed in the first housing; a second printed circuit board disposed in the second housing; a sensor structure connected to the first support bracket at one end thereof and connected to the second printed circuit board at the other end thereof; and a second support bracket for supporting the sensor structure, wherein the sensor structure can comprise a bending sensor device, which comprises a dielectric layer and a protective layer for protecting the dielectric layer, and which measures the angle of the sensor structure, and a flexible printed circuit board, which electrically connects the first printed circuit board and the second printed circuit board and, which is partially coupled to the bending sensor device.

Description

Electronic devices containing sensors

[0001] The present disclosure relates to an electronic device including a sensor.

[0002] An electronic device (e.g., a rollable electronic device) may include a first housing, a second housing, and a flexible display. The second housing may be coupled to the first housing so as to be movable relative to the first housing. The flexible display may have a display area that is displayed externally expand or contract depending on the movement of the second housing relative to the first housing.

[0003] The above information may be provided as background information to aid in understanding the present disclosure. None of the above is claimed to be prior art related to the present disclosure, nor can it be used to determine prior art.

[0004] An electronic device according to one embodiment of the present disclosure may include a first housing, a second housing, a first support bracket, a first printed circuit board, a second printed circuit board, a sensor structure, and a second support bracket.

[0005] In one embodiment, the second housing may be movably coupled to the first housing.

[0006] In one embodiment, the first support bracket may be disposed in the first housing.

[0007] In one embodiment, the first printed circuit board may be disposed in the first housing.

[0008] In one embodiment, the second printed circuit board may be disposed in the second housing.

[0009] In one embodiment, the sensor structure may be connected to a first support bracket at one end and to a second printed circuit board at the other end.

[0010] In one embodiment, the second support bracket can support the sensor structure.

[0011] In one embodiment, the sensor structure may include a bending sensor element and a flexible printed circuit board.

[0012] In one embodiment, the bending sensor element includes a dielectric layer and a protective layer protecting the dielectric layer, and is capable of measuring an angle of the sensor structure.

[0013] In one embodiment, the flexible printed circuit board electrically connects the first printed circuit board and the second printed circuit board and can be at least partially coupled to the bending sensor element.

[0014] In one embodiment, the electronic device may include a processor disposed on a second printed circuit board.

[0015] In one embodiment, the processor may be configured to calculate a distance the second housing has moved in the longitudinal direction of the electronic device relative to the first housing based on an angle of the sensor structure.

[0016] FIG. 1 is a block diagram of an electronic device within a network environment according to one embodiment.

[0017] FIGS. 2A and 2B are diagrams showing an electronic device in a slide-in state according to one embodiment of the present disclosure.

[0018] FIGS. 3A and 3B are diagrams showing an electronic device in a slide-out state according to one embodiment of the present disclosure.

[0019] FIG. 4 is an exploded perspective view of an electronic device according to one embodiment of the present disclosure.

[0020] FIGS. 5A, 5B, and 5C are cross-sectional views illustrating an electronic device according to one embodiment of the present disclosure.

[0021] FIGS. 6A and 6B are diagrams showing an electronic device according to one embodiment of the present disclosure.

[0022] FIG. 7 is a drawing showing a first support bracket, a printed circuit board, a sensor structure, and a second support bracket according to one embodiment of the present disclosure.

[0023] FIGS. 8A and 8B are drawings showing a sensor structure according to one embodiment of the present disclosure.

[0024] FIG. 9a and FIG. 9b are conceptual diagrams showing the angle of a bending sensor element according to one embodiment of the present disclosure.

[0025] FIGS. 10A, 10B, and 10C are drawings showing a second support bracket according to one embodiment of the present disclosure.

[0026] FIGS. 11A and 11B are drawings showing movement of a second support bracket according to one embodiment of the present disclosure.

[0027] FIG. 12 is a drawing showing a second printed circuit board and sensor structure according to one embodiment of the present disclosure.

[0028] FIGS. 13A and 13B are drawings showing a sensor structure according to one embodiment of the present disclosure.

[0029] FIG. 14 is a drawing showing a sensor structure according to one embodiment of the present disclosure.

[0030] FIG. 15 is a drawing showing an electronic device according to one embodiment of the present disclosure.

[0031] FIG. 16 is a block diagram illustrating an electronic device according to one embodiment of the present disclosure.

[0032] Fig. 17 is a drawing showing an electronic device according to a comparative example.

[0033] FIG. 1 is a block diagram of an electronic device (101) within a network environment (100), according to one embodiment. Referring to FIG. 1 , in the network environment (100), the electronic device (101) may communicate with the electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of the electronic device (104) or the server (108) via a second network (199) (e.g., a long-range wireless communication network). In one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0034] The processor (120) may control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) by executing, for example, software (e.g., a program (140)), and may perform various data processing or calculations. According to one embodiment, as at least a part of the data processing or calculation, the processor (120) may store a command or data received from another component (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the command or data stored in the volatile memory (132), and store the resulting data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or processor) or a secondary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together therewith. For example, if the electronic device (101) includes a main processor (121) and a secondary processor (123), the secondary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a specified function. The secondary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0035] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0036] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0037] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0038] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0039] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0040] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0041] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0042] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0043] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0044] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0045] The haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0046] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0047] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0048] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0049] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0050] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0051] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas, for example, by the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the at least one selected antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0052] In one embodiment, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0053] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0054] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In one embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0055] FIGS. 2A and 2B are diagrams illustrating the front and back of an electronic device in a slide-in state according to one embodiment of the present disclosure. FIGS. 3A and 3B are diagrams illustrating the front and back of an electronic device in a slide-out state according to one embodiment of the present disclosure.

[0056] The electronic device (200) of FIGS. 2A to 3B may refer to the electronic device (101) of FIG. 1 or may include at least some of the components of the electronic device (101) of FIG. 1.

[0057] Referring to FIGS. 2A to 3B, the electronic device (200) may include a first housing (210), a second housing (220) slidably coupled from the first housing (210) in a specified direction (e.g., direction ① or direction ②) (e.g., ± y-axis direction), and a rollable display (230) (e.g., flexible display, expandable display, or stretchable display) arranged to be supported by at least a portion of the first housing (210) and the second housing (220). In one embodiment, the second housing (220) may be slidably coupled with the first housing (210) so as to be withdrawn in a first direction (direction ①) or inserted in a second direction (direction ②) opposite to the first direction (direction ①) with respect to the first housing (210). In one embodiment, the electronic device (200) can be changed to a slide-in state (e.g., a retracted state) by accommodating at least a portion of the second housing (220) in at least a portion of the first space (2101) formed by the first housing (210). In one embodiment, the electronic device (200) can be changed to a slide-out state (e.g., a retracted state) by moving at least a portion of the second housing (220) outwardly (e.g., in direction ①) from the first space (2101). In one embodiment, the electronic device (200) may include a support member (e.g., a bendable member, a bendable support member, a multi-joint hinge module, or a multi-bar assembly) that, in a slide-out state, forms at least partially a plane substantially coextensive with at least a portion of the second housing (220), and, in a slide-in state, is received in a bendable manner into the first space (2101) of the first housing (210).In one embodiment, at least a portion of the rollable display (230) may be arranged in such a way that it is attached to at least a portion of the second housing (220). In one embodiment, at least a portion of the remaining portion of the rollable display (230) may be attached to a support member (e.g., the support member (240) of FIG. 4). In one embodiment, at least a portion of the rollable display (230) may be arranged so that it is not visually visible from the outside by being accommodated in a bendable manner into the first space (2101) of the first housing (210) while being supported by the support member (e.g., the support member (240) of FIG. 4) in a slide-in state. In one embodiment, at least a portion of the rollable display (230) may be arranged so that it is visually visible from the outside while being supported by the support member (e.g., the support member (240) of FIG. 4) that forms at least partially the same plane as the second housing (220) in a slide-out state.

[0058] According to one embodiment, the electronic device (200) may include a first housing (210) including a first side member (211) and a second housing (220) including a second side member (221). In one embodiment, the first side member (211) may include a first side (2111) having a first length along a designated direction (e.g., a ± y-axis direction), a second side (2112) extending from the first side (2111) to have a second length shorter than the first length along a direction substantially perpendicular to the first side (2111) (e.g., an x-axis direction), and a third side (2113) extending from the second side (2112) substantially parallel to the first side (2111) and having the first length. In one embodiment, the first side member (211) may be formed at least partially of a conductive material (e.g., a metal). In some embodiments, the first side member (211) may be formed by combining a conductive member and a non-conductive member (e.g., a polymer). In one embodiment, the first housing (210) may include a first extension member (212) extending from at least a portion of the first side member (211) to at least a portion of the first space (2101). In one embodiment, the first extension member (212) may be formed integrally with the first side member (211). In some embodiments, the first extension member (212) may be formed separately from the first side member (211) and structurally coupled to the first side member (211).

[0059] In one embodiment, the second side member (221) can include a fourth side member (2211) that corresponds at least partially to the first side member (2111) and has a third length, a fifth side member (2212) that extends from the fourth side member (2211) in a direction substantially parallel to the second side member (2112) and has a fourth length that is shorter than the third length, and a sixth side member (2213) that extends from the fifth side member (2212) to correspond to the third side member (2113) and has a third length. In one embodiment, the second side member (221) can be formed at least partially of a conductive member (e.g., a metal). In some embodiments, the second side member (221) can be formed by combining a conductive member and a non-conductive member (e.g., a polymer). In one embodiment, at least a portion of the second side member (221) may include a second extension member (222) that extends to at least a portion of the second space (2201) of the second housing (220). In one embodiment, the second extension member (222) may be formed integrally with the second side member (221). In some embodiments, the second extension member (222) may be formed separately from the second side member (221) and structurally coupled to the second side member (221).

[0060] In one embodiment, the first side (2111) and the fourth side (2211) can be slidably coupled with respect to one another. In one embodiment, the third side (2113) and the sixth side (2213) can be slidably coupled with respect to one another. In one embodiment, in the slide-in state, the fourth side (2211) can be arranged to overlap with the first side (2111) so as to be substantially invisible from the outside. In one embodiment, in the slide-in state, the sixth side (2213) can be arranged to overlap with the third side (2113) so as to be substantially invisible from the outside. In some embodiments, at least a portion of the fourth side (2211) and the sixth side (2213) can be arranged to be at least partially visible from the outside in the slide-in state. In one embodiment, in the slide-in state, the second extension member (222) may be arranged to overlap the first extension member (212) so as to be substantially invisible from the outside. In some embodiments, the second extension member (222) may be arranged to be at least partially visible from the outside in the slide-in state.

[0061] In one embodiment, the first housing (210) may include a first rear cover (213) coupled with at least a portion of the first side member (211). In one embodiment, the first rear cover (213) may be arranged in such a way that it couples with at least a portion of the first extension member (212). In some embodiments, the first rear cover (213) may be formed integrally with the first side member (211). In one embodiment, the first rear cover (213) may be formed of a polymer, a coated or colored glass, a ceramic, a metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of these materials. In some embodiments, the first rear cover (213) may extend to at least a portion of the first side member (211). In some embodiments, the first rear cover (213) may be omitted and at least a portion of the first extension member (212) may be replaced with the first rear cover (213).

[0062] In one embodiment, the second housing (220) may include a second rear cover (223) coupled with at least a portion of the second side member (221). In one embodiment, the second rear cover (223) may be arranged in such a way that it couples with at least a portion of the second extension member (222). In some embodiments, the second rear cover (223) may be formed integrally with the second side member (221). In one embodiment, the second rear cover (223) may be formed of a polymer, a coated or colored glass, a ceramic, a metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of these materials. In some embodiments, the second rear cover (223) may extend to at least a portion of the second side member (221). In some embodiments, the second rear cover (223) may be omitted, and at least a portion of the second extension member (222) may be replaced with the second rear cover (223).

[0063] According to one embodiment, the rollable display (230) may include a first portion (230a) (e.g., a flat portion) that is visually visible from the outside and a second portion (230b) (e.g., a bendable portion or a bending portion) that extends from the first portion (230a) and is accommodated in a manner that is at least partially bent into a first space (2101) of the first housing (210) so as to be invisible from the outside when in a slide-in state. In one embodiment, the first portion (230a) may be arranged to be supported by the second housing (220), and the second portion (230b) may be arranged to be at least partially supported by a support member (e.g., a support member (240) of FIG. 4). In one embodiment, the second part (230b) of the rollable display (230) may be arranged so as to form substantially the same plane as the first part (230a) and be visually visible from the outside while being supported by a support member (e.g., support member (240) of FIG. 4) when the second housing (220) is in a slide-out state along the first direction (direction ①). In one embodiment, the second part (230b) of the rollable display (230) may be accommodated in a manner of bending into the first space (2101) of the first housing (210) when the second housing (220) is in a slide-in state along the second direction (direction ②), and may be arranged so as not to be visually visible from the outside. Accordingly, the display area of ​​the rollable display (230) may be varied as the second housing (220) is moved in a sliding manner along a specified direction (e.g., ±y-axis direction) from the first housing (210).

[0064] According to one embodiment, the rollable display (230) may have a variable length in the first direction (direction ①) according to the sliding movement of the second housing (220) that is moved based on the first housing (210). For example, the rollable display (230), in a slide-in state, may have a first display area corresponding to a first length (L1). In one embodiment, the rollable display (230), in a slide-out state, may be expanded to have a second display area (e.g., an area including the first portion (230a) and the second portion (230b)) that corresponds to a third length (L3) that is longer than the first length (L1) and is larger than the first display area (e.g., an area corresponding to the first portion (230a)), according to the sliding movement of the second housing (220) that is additionally moved by a second length (L2) based on the first housing (210).

[0065] According to one embodiment, the electronic device (200) may include at least one of an input device (e.g., a microphone (203-1)), an audio output device (e.g., a call receiver (206) and / or a speaker (207)), a sensor module (204, 217), a camera module (e.g., a first camera module (205) or a second camera module (216)), a connector port (208, see FIG. 4), a socket module (218), a key input device (219), or an indicator (not shown) disposed in the second space (2201) of the second housing (220). In one embodiment, the electronic device (200) may include another input device (e.g., a microphone (203)) disposed in the first housing (210). In some embodiments, the electronic device (200) may be configured such that at least one of the above-described components is omitted, or other components are additionally included. In some embodiments, at least one of the above-described components may be arranged in the first space (2101) of the first housing (210).

[0066] In one embodiment, the input device may include a microphone (203-1). In some embodiments, the input device (e.g., microphone (203-1)) may include multiple microphones arranged to detect the direction of sound. The audio output device may include, for example, a call receiver (206) and a speaker (207). In one embodiment, the speaker (207) may communicate with the outside through at least one speaker hole formed in the second housing (220) at a location that is visually exposed to the outside (e.g., fifth side (2212)), regardless of the slide-in / slide-out state. In some embodiments, the call receiver (206) may include a speaker (e.g., a piezo speaker) that operates without a separate speaker hole.

[0067] In one embodiment, the socket module (218) (e.g., SIM tray) may be positioned in a visually exposed position externally, regardless of the slide-in / slide-out state. For example, the socket module (218) may be positioned on the fifth side (2212) of the second housing (220).

[0068] According to one embodiment, the sensor module (204, 217) may generate an electrical signal or data value corresponding to an internal operating state of the electronic device (200) or an external environmental state. In one embodiment, the sensor module (204, 217) may include, for example, a first sensor module (204) (e.g., a proximity sensor or an illuminance sensor) disposed on the front of the electronic device (200) and / or a second sensor module (217) (e.g., a heart rate monitoring (HRM) sensor) disposed on the rear of the electronic device (200). In one embodiment, the first sensor module (204) may be disposed on the front of the electronic device (200), below the rollable display (230). In one embodiment, the first sensor module (204) and / or the second sensor module (217) may include at least one of a proximity sensor, an ambient light sensor, a time of flight (TOF) sensor, an ultrasonic sensor, a fingerprint recognition sensor, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, or a humidity sensor.

[0069] In one embodiment, the camera module may include a first camera module (205) disposed on the front of the electronic device (200) and a second camera module (216) disposed on the rear of the electronic device (200). In one embodiment, the electronic device (200) may also include a flash (not shown) positioned near the second camera module (216). In one embodiment, the camera modules (205, 216) may include one or more lenses, an image sensor, and / or an image signal processor. In one embodiment, the first camera module (205) may be disposed under the rollable display (230) and configured to capture an object through a portion of an active area (e.g., a display area) of the rollable display (230).

[0070] According to one embodiment, among the camera modules, the first camera module (205) and among the sensor modules (204, 217), some of the sensor modules (204) may be arranged to detect the external environment through the rollable display (230). For example, the first camera module (205) or some of the sensor modules (204) may be arranged in the second space (2201) of the second housing (220) so as to be in contact with the external environment through a transparent area or a perforated opening formed in the rollable display (230). In one embodiment, an area of ​​the rollable display (230) facing the first camera module (205) may be formed as a transparent area having a designated transmittance as part of an active area for displaying content. In one embodiment, the transparent area may be formed to have a transmittance in a range of about 5% to about 20%. This transparent area may include an area overlapping with the effective area (e.g., field of view area) of the first camera module (205) through which light passes to be imaged by the image sensor to create an image. For example, the transparent area of ​​the rollable display (230) may include an area with a lower pixel arrangement density and / or wiring density than the surrounding area. For example, the transparent area may be replaced with the opening described above. For example, some camera modules (205) may include an under display camera (UDC). In some embodiments, some sensor modules (204) may be arranged to perform their functions without being visually exposed through the rollable display (230) in the second space (2201) of the second housing (220).

[0071] According to one embodiment, the electronic device (200) may include at least one antenna element (e.g., the antenna element (224b) of FIG. 4) electrically connected to a wireless communication circuit (e.g., the wireless communication module (192) of FIG. 1) disposed in an internal space (e.g., the second space (2201) of the second housing (220)). In one embodiment, the electronic device (200) may also include a bezel antenna (A) disposed through at least a portion of a conductive first side member (211) of the first housing (210). For example, the bezel antenna (A) may include a conductive portion (227) (e.g., a conductive member) disposed through at least a portion of the second side (2112) and the third side (2113) of the first side member (211) and electrically segmented through at least one segment (2271, 2272) formed of a non-conductive material (e.g., a polymer). In one embodiment, a wireless communication circuit (e.g., a wireless communication module (192) of FIG. 1) may be configured to transmit or receive a wireless signal in at least one frequency band (e.g., about 600 MHz to 9000 MHz) (e.g., a legacy band or an NR band) designated through the conductive portion (227). In one embodiment, the electronic device (200) may include a side cover (2112a) disposed on the second side (2112) to cover at least a portion of the at least one segment (2271). In some embodiments, the bezel antenna (A) may be disposed on at least one of the first side (2111), the second side (2112), or the third side (2113). In some embodiments, the bezel antenna (A) may be disposed on at least one of the fourth side (2211), the fifth side (2212), or the sixth side (2213) of the second housing (220).In some embodiments, the electronic device (200) may further include at least one antenna module (e.g., a mmWave antenna module or a mmWave antenna structure) disposed in an internal space (e.g., the first space (2101) or the second space (2201)) and arranged to transmit or receive a wireless signal in a frequency band ranging from about 3 GHz to 100 GHz via another wireless communication circuit (e.g., the wireless communication module (192) of FIG. 1).

[0072] According to one embodiment, the slide-in / slide-out operation of the electronic device (200) can be performed automatically. For example, the slide-in / slide-out operation of the electronic device (200) can be performed through gear engagement between a drive motor (e.g., drive motor (260) of FIG. 4) including a pinion gear (e.g., pinion gear (261) of FIG. 4) disposed in a first space (2101) of a first housing (210) and a rack gear (e.g., rack gear (2221) of FIG. 4) disposed in a second space (2201) of a second housing (220) and gear-coupled with the pinion gear (261). In some embodiments, a drive motor (260) including a pinion gear (261) may be disposed in a second space (2201) of a second housing (220), and a rack gear (2221) coupled with the pinion gear (261) may be disposed in a first space (2101) of a first housing (210). For example, a processor of the electronic device (200) (e.g., the processor (120) of FIG. 1) may operate a drive motor (e.g., the drive motor (260) of FIG. 4) disposed inside the electronic device (200) when detecting a triggering signal for changing from a slide-in state to a slide-out state or from a slide-out state to a slide-in state. In one embodiment, the triggering signal may include a signal according to selection (e.g., touch) of an object displayed on the rollable display (230) or a signal according to operation of a physical button (e.g., a key button) included in the electronic device (200). In some embodiments, the slide-in / slide-out operation of the electronic device (200) may be performed manually through user operation.

[0073] According to one embodiment, the electronic device (200) has a structure in which the second housing (220) slides in and / or out relative to the first housing (210) along the longitudinal direction (e.g., vertical direction) (e.g., ± y-axis direction) of the electronic device (200), but is not limited thereto. For example, the electronic device (200) may have a structure in which the second housing (220) slides in and / or out relative to the first housing (210) along the width direction (e.g., horizontal direction) (e.g., ± x-axis direction) perpendicular to the longitudinal direction of the electronic device (200). In some embodiments, the electronic device (200) may be formed such that the length of the second side (2112) of the first housing (210) is longer than the length of the first side (2111). In this case, the length of the fifth side (2212) of the second housing (220) can also be formed to be longer than the length of the fourth side (2211).

[0074] FIG. 4 is an exploded perspective view of an electronic device according to one embodiment of the present disclosure.

[0075] In describing the electronic device (200) of FIG. 4, the same symbols are given to components that are substantially the same as those of the electronic devices (200) of FIGS. 2A to 3B, and a detailed description thereof may be omitted.

[0076] Referring to FIG. 4, the electronic device (200) may include a first housing (210) including a first space (2101), a second housing (220) slidably coupled from the first housing (210) and including a second space (2201), a support member (240) fixed to at least a portion of the second housing (220) and at least partially bendably received into the first space (2101) according to a slide-in operation, a rollable display (230) arranged to be supported by at least a portion of the support member (240) and the second housing (220), and a drive module (e.g., a drive mechanism) that drives the second housing (220) from the first housing (210) in a slide-in direction (e.g., in the -y-axis direction) and / or a slide-out direction (e.g., in the y-axis direction). In one embodiment, the first housing (210) may include a first side member (211) and a first rear cover (213) coupled with at least a portion of the first side member (211) (e.g., at least a portion of the first extension member (212)). In one embodiment, the second housing (220) may include a second side member (221) and a second rear cover (223) coupled with at least a portion of the second side member (221) (e.g., at least a portion of the second extension member (222)). In one embodiment, the drive module may be disposed in the first space (2101) and include a drive motor (260) including a pinion gear (261) and a rack gear (2221) arranged in gear engagement with the pinion gear (261) in the second space (2201). In one embodiment, the drive module may further include a reduction module (e.g., a reduction gear assembly) arranged to reduce the rotational speed and increase the driving force by being coupled with the drive motor (260). In one embodiment, the drive motor (260) may be arranged to be supported by a motor bracket (260a) arranged on a support bracket (225) arranged in the first space (2101) of the first housing (210).In one embodiment, the drive motor (260) may be fixed to an end (e.g., an edge) of the support bracket (225) in the slide-out direction (e.g., in the y-axis direction) in the first space (2101). In one embodiment, the rack gear (2221) may be arranged in a manner fixed to the second extension member (222) of the second housing (220). In some embodiments, the rack gear (2221) may be integrally formed by injection molding at least a portion of the second extension member (222). In one embodiment, the rack gear (2221) may be arranged to have a length in a direction parallel to the sliding direction (e.g., in the ± y-axis direction). Accordingly, when the electronic device (200) is assembled, the pinion gear (261) can maintain a state of gear engagement with the rack gear (2221), and the pinion gear (261) provided with the driving force of the driving motor (260) moves along the rack gear (2221), so that the second housing (220) can move relative to the first housing (210). In one embodiment, the sliding distance of the second housing (220) can be determined by the length of the rack gear (2221).

[0077] According to one embodiment, the electronic device (200) may include a plurality of electronic components arranged in a second space (2201). In one embodiment, the plurality of electronic components may include a first substrate (251) (e.g., a main substrate), a camera module (216), a speaker (207), a connector port (208), and a microphone (203-1) arranged around the first substrate (251). In one embodiment, the plurality of electronic components may be arranged around the first substrate (251) in the second space (2201) of the second housing (220), thereby enabling efficient electrical connection. In some embodiments, at least one of the plurality of electronic components described above may be arranged in the first space (2101) of the first housing (210).

[0078] According to one embodiment, the electronic device (200) may include a rear bracket (224) disposed between a second extension member (222) and a second rear cover (223) in a second housing (220). In one embodiment, the rear bracket (224) may be disposed to cover at least a portion of a plurality of electronic components. In one embodiment, the rear bracket (224) may be structurally coupled to at least a portion of the second extension member (222). In some embodiments, the rear bracket (224) may be omitted. In one embodiment, the rear bracket (224) may be disposed to cover a plurality of electronic components and support the second rear cover (223). In one embodiment, the rear bracket (224) may include an opening (224a) (e.g., a through hole) or a notch area (224c) (e.g., a cut portion) formed in an area corresponding to a camera module (216) and / or a sensor module (e.g., a sensor module (217) of FIG. 3B). In one embodiment, the rear bracket (224) may include at least one antenna element (224b). In one embodiment, the at least one antenna element (224b) may be disposed on an outer surface when the rear bracket (224) is formed as an injection-molded article of a dielectric material (e.g., an antenna carrier). In one embodiment, the at least one antenna element (224b) may include a laser direct structuring (LDS) antenna pattern formed on an outer surface of the rear bracket (224). In some embodiments, at least one antenna element (224b) may include a conductive plate attached to the outer surface of the rear bracket (224), a conductive paint formed on the outer surface, or a conductive pattern. In some embodiments, at least one antenna element (224b) may be disposed in a manner that is built into the rear bracket (224) during injection molding.In one embodiment, at least one antenna element (224b) may be configured to transmit or receive a wireless signal in a designated frequency band (e.g., a legacy band) by being electrically connected to a wireless communication circuit (e.g., a wireless communication module (192) of FIG. 1) disposed on the first substrate (251). In one embodiment, the camera module (216) and / or the sensor module (217) may be disposed to detect the external environment through the opening (224a) or the notch area (224a). In one embodiment, the second rear cover (223) may be processed to be transparent in at least an area corresponding to the camera module (216) and / or the sensor module (217). In some embodiments, the second rear cover (223) may include a through hole formed in at least an area corresponding to the camera module (216) and / or the sensor module (217). In this case, the through hole may be covered by a transparent window. In some embodiments, the camera module (216) and / or the sensor module (217) may be configured to operate only when the electronic device (200) is in a slide-out state.

[0079] In one embodiment, the connector port (208) may be in contact with the outside through a connector port hole formed in the second housing (220) in a slide-out state. In some embodiments, the connector port (208) may be in contact with the outside through an opening formed in the first housing (210) in a slide-in state and formed to correspond with the connector port hole.

[0080] According to one embodiment, the electronic device (200) may include a support bracket (225) disposed in a first space (2101) of a first housing (210). In one embodiment, the support bracket (225) may include a support portion (2252) disposed at one end and having a curved outer surface to support a back surface of a support member (240) that is bent during a sliding operation transitioning from a slide-out state to a slide-in state. In one embodiment, the support bracket (225) may include a support structure for supporting and fixing a drive motor (260) via a motor bracket (260a). In one embodiment, the support bracket (225) may include a battery mounting portion (2251) for accommodating a battery (B). In one embodiment, the drive motor (260) may be disposed at the farthest end (e.g., edge) in the slide-out direction (e.g., y-axis direction) of the support bracket (225). For example, when the assembly of the electronic device (200) is completed, the drive motor (260) may be disposed at a position closest to the first substrate (251) among the electronic components disposed in the first housing (210), thereby helping to minimize the size and / or length of a flexible substrate (F1) (e.g., a flexible printed circuit board (FPCB)) that electrically connects the first substrate (251) and the drive motor (260). In one embodiment, the electronic device (200) may include a pair of guide rails (226) disposed on both sides of the support bracket (225) to guide both ends of the support member (240) in the sliding direction.

[0081] According to one embodiment, the first housing (210) may include an opening (212a) (e.g., a through hole) disposed in an area corresponding to a camera module (216) and / or a sensor module (217) disposed in the second housing (220) when the electronic device (200) is in a slide-in state in the first extension member (212). In one embodiment, the camera module (216) and / or the sensor module (217) may detect an external environment through the opening (212a) formed in the first housing (210) when the electronic device (200) is in a slide-in state. In some embodiments, the area corresponding to the camera module (216) and / or the sensor module (217) of the first rear cover (213) may be processed to be transparent.

[0082] According to one embodiment, the electronic device (200) may include a second substrate (252) (e.g., a sub-substrate) and an antenna member (253) disposed between a first extension member (212) and a first rear cover (213) in a first housing (210). In one embodiment, the second substrate (252) and the antenna member (253) may be disposed on at least a portion of the first extension member (212). In one embodiment, the second substrate (252) and the antenna member (253) may be electrically connected to the first substrate (251) via at least one electrical connection member (e.g., FPCB, flexible printed circuit board or FRC, flexible RF cable). In one embodiment, the antenna member (253) may include a multi-function coil (MFC) or multi-function core (MFC) antenna for performing a wireless charging function, a neat field communication (NFC) function, and / or an electronic payment function. In some embodiments, the antenna member (253) may be electrically connected to the second substrate (252), thereby being electrically connected to the first substrate (251) through the second substrate (252). In some embodiments, the second substrate (252) and / or the antenna member (253) may be electrically connected to the first substrate (251) through at least a portion of a flexible substrate (F1) connecting the drive motor (260) and the first substrate (251).

[0083] According to one embodiment, the support member (240) may be guided by a guide rail (226) during a slide-in / slide-out operation. In one embodiment, the support member (240) may include a plurality of multi-bars (241) that are rotatably coupled with respect to each other and guide protrusions (2411) that are protruded at both ends of each of the multi-bars (241). In one embodiment, the guide rail (226) may include a guide slit (2261) that is formed at a position corresponding to a movement trajectory of the support member (240). In one embodiment, when the support member (240) that is fixed in a manner of being attached to the back surface of the rollable display (230) is movably coupled with the guide rail (226), the guide protrusions (2411) move along the guide slits (2611), thereby helping to reduce the phenomenon of the rollable display (230) being detached or deformed during operation.

[0084] FIG. 5A is a cross-sectional view of an electronic device taken along line 5A-5A of FIG. 2A according to an embodiment of the present disclosure. FIG. 5B is a cross-sectional view of an electronic device in an intermediate state according to an embodiment of the present disclosure. FIG. 5C is a cross-sectional view of an electronic device taken along line 5C-5C of FIG. 3A according to an embodiment of the present disclosure.

[0085] In describing the electronic device (200) of FIGS. 5A to 5C, the same reference numerals are given to components that are substantially the same as those of the electronic device (200) of FIG. 4, and a detailed description thereof may be omitted.

[0086] Referring to FIGS. 5A to 5C, the electronic device (200) may include a first housing (210) having a first space (2101), a second housing (220) having a second space (2201), a support member (240) connected to the second housing (220) and at least partially accommodated in the first space (2101) in a slide-in state, a rollable display (230) arranged to be supported by at least a portion of the support member (240) and at least a portion of the second housing (220), and a drive motor (260) arranged in the first space (2101) and including a pinion gear (e.g., a pinion gear (261) of FIG. 4) gear-coupled with a rack gear (e.g., a rack gear (2221) of FIG. 4) of the second space (2201). In one embodiment, the drive motor (260) can automatically move the second housing (220) in a slide-in direction (② direction) or a slide-out direction (① direction) with respect to the second housing (220) through gear engagement of a pinion gear (e.g., pinion gear (261) of FIG. 4) and a rack gear (e.g., rack gear (2221) of FIG. 4).

[0087] According to one embodiment, at least a portion of the second housing (220) may be accommodated in the first space (2101) of the first housing (210) when the electronic device (200) is in a slide-in state (state of FIG. 5a). In one embodiment, at least a portion of the rollable display (230) may be accommodated in a manner of being bent into the first space (2101) together with the support member (240), thereby being arranged so as not to be visually visible from the outside. In this case, the rollable display (230) may have a first display area (e.g., a display area corresponding to the first portion (230a) of FIG. 3a) visually exposed to the outside.

[0088] According to one embodiment, the electronic device (200) can transition from an intermediate state (state of FIG. 5b) to a slide-out state (state of FIG. 5c) by controlling the driving of the drive motor (260). In some embodiments, the electronic device (200) can be set to stop in a designated intermediate state between the slide-in state and the slide-out state (free stop function). In some embodiments, the electronic device (200) can transition to the slide-in state, the intermediate state, or the slide-out state through a user's operation in a state where no driving force is provided to the drive motor (260).

[0089] According to one embodiment, at least a portion of the second housing (220) may be transitioned to a slide-out state in which it is moved outwardly from the first housing (210) at least partially along the first direction (direction ①) by driving the drive motor (260). In one embodiment, the rollable display (230) may be supported by the support bracket (225) and moved together with the support member (240) in the slide-out state (state of FIG. 5c) of the electronic device (200), such that a portion that has slid into the first space (2101) may be exposed so that it is at least partially visible to the outside. In this case, the rollable display (230) may have a second display area that is expanded beyond the first display area (e.g., a display area including the first portion (230a) and the second portion (230b) of FIG. 3a) visually exposed to the outside.

[0090] According to one embodiment, the electronic device (200) may include a battery (B) arranged through a battery mounting portion (2251) of a support bracket (225) fixed to a first space (2101) of a first housing (210). In one embodiment, since the battery (B) is arranged in the first housing (210), a separate driving gap may not be required to avoid interference with surrounding structures due to movement. Accordingly, the battery (B) may be expanded in thickness from the battery mounting portion (2251) of the support bracket (225) in a manner that it comes into close proximity to or comes into contact with the back surface of the support member (240), thereby relatively increasing the battery volume and supporting the moving support member (240), thereby reducing the sagging phenomenon of the rollable display (230) and helping to improve operational reliability.

[0091] FIG. 6A and FIG. 6B are drawings showing an electronic device (600) according to one embodiment of the present disclosure.

[0092] FIG. 6A is an exploded perspective view illustrating an electronic device (600) according to one embodiment. FIG. 6B is a diagram illustrating an electronic device (600) in a slide-out state according to one embodiment.

[0093] The electronic device (600) of FIGS. 6A and 6B may refer to the electronic device (101) of FIG. 1 or may include at least some of the components of the electronic device (101) illustrated in FIG. 1.

[0094] The electronic device (600) of FIGS. 6A and 6B may refer to the electronic device (200) of FIG. 4 or may include at least some of the components of the electronic device (200) illustrated in FIG. 4.

[0095] In describing an electronic device (600) according to one embodiment of the present disclosure, the width direction of the electronic device (600) may mean the X-axis direction, and the length direction of the electronic device (600) may mean the Y-axis direction. The height direction of the electronic device (600) may mean the Z-axis direction.

[0096] Referring to FIGS. 6A and 6B , an electronic device (600) according to an embodiment of the present disclosure may include a housing (610), a first support bracket (620), a first printed circuit board (e.g., the second substrate (252) of FIG. 4 ), a second printed circuit board (630) (e.g., the first substrate (251) of FIG. 4 ), a sensor structure (640), a second support bracket (650), a drive motor (660), a support member (670), a connecting member (680), a pinion gear (691) (e.g., the pinion gear (261) of FIG. 4 ), and / or a rack gear (693) (e.g., the rack gear (2221) of FIG. 4 ).

[0097] In one embodiment, the housing (610) may include a first housing (e.g., the first housing (210) of FIG. 4) and / or a second housing (612).

[0098] In one embodiment, the housing (610) may be a component that forms the exterior of the electronic device (600).

[0099] The second housing (612) of FIGS. 6A and 6B may refer to the second housing (220) illustrated in FIG. 4, or may include at least some of the components of the second housing (220).

[0100] In one embodiment, the second housing (612) can be movably coupled to the first housing (e.g., the first housing (210) of FIG. 4). For example, the second housing (612) can be moved along the longitudinal direction (e.g., the Y-axis direction) of the electronic device (600) relative to the first housing (e.g., the first housing (210) of FIG. 4).

[0101] In one embodiment, the electronic device (600) may include a flexible display (e.g., a rollable display (230) of FIG. 4) that is arranged so that at least a portion of the display is supported by a housing (610).

[0102] In one embodiment, at least some of the components of the electronic device (600) may be disposed in the second housing (612). For example, a second printed circuit board (630) may be disposed in the second housing (612).

[0103] In one embodiment, the first support bracket (620) may be disposed in a first housing (e.g., the first housing (210) of FIG. 4).

[0104] In one embodiment, a first printed circuit board (e.g., second board (252) of FIG. 4) may be disposed in a first housing (e.g., first housing (210) of FIG. 4).

[0105] The first support bracket (620) of FIGS. 6A and 6B may refer to the support bracket (225) illustrated in FIG. 4, or may include at least some of the components of the support bracket (225).

[0106] In one embodiment, a battery (e.g., battery (B) of FIG. 4) may be placed on the first support bracket (620).

[0107] In one embodiment, a second printed circuit board (630) may be disposed in a second housing (612).

[0108] In one embodiment, the drive motor (660) may refer to the drive motor (260) illustrated in FIG. 4, or may include at least a portion of the drive motor (260).

[0109] In one embodiment, the drive motor (660) may be disposed in the first housing (e.g., the first housing (210) of FIG. 4) or the second housing (612). For example, in one embodiment, the drive motor (660) may be disposed in the first support bracket (620) disposed inside the first housing (e.g., the first housing (210) of FIG. 4). In some embodiments, the drive motor (660) may be disposed in at least a portion of the second housing (612).

[0110] In one embodiment, the drive motor (660) can generate rotational force. The rotational force generated by the drive motor (660) can be transmitted to the pinion gear (691). The pinion gear (691) can rotate according to the rotation of the drive motor (660).

[0111] In one embodiment, the pinion gear (691) may be arranged to mesh with the rack gear (693). Depending on the rotational motion of the pinion gear (691), the rack gear (693) may move linearly in the longitudinal direction (e.g., Y-axis direction) of the electronic device (600).

[0112] In one embodiment, the support member (670) may be positioned to cover at least a portion of the first support bracket (620).

[0113] In one embodiment, the sensor structure (640) may be connected to a first support bracket (620) at one end and connected to a second printed circuit board (630) at the other end, which is the opposite end of the first end.

[0114] In one embodiment, the second support bracket (650) may serve to support the sensor structure (640). In one embodiment, the second support bracket (650) may be configured to move in accordance with movement of the second housing (612) relative to the first housing (e.g., the first housing (210) of FIG. 4).

[0115] In one embodiment, the second housing (612) may include a groove (6125) that guides movement of the second support bracket (650).

[0116] In one embodiment, the connecting member (680) may electrically connect the sensor structure (640) to another component of the electronic device (600), such as the battery (B) of FIG. 4.

[0117] FIG. 7 is a drawing showing a first support bracket (620), a second printed circuit board (630), a sensor structure (640), and a second support bracket (650) according to one embodiment of the present disclosure.

[0118] In one embodiment, the sensor structure (640) may be connected to a first support bracket (620) at one end and to a second printed circuit board (630) at the other end.

[0119] In one embodiment, the sensor structure (640) may include a first connector (645) and / or a second connector (646). The first connector (645) may be disposed on the first support bracket (620), and the second connector (646) may be disposed on the second printed circuit board (630). The sensor structure (640) may be electrically connected to the second printed circuit board (630) using the second connector (646).

[0120] In one embodiment, the sensor structure (640) may extend between the first support bracket (620) and the second printed circuit board (630).

[0121] In one embodiment, the sensor structure (640) can be bent between the first support bracket (620) and the second printed circuit board (630). For example, the sensor structure (640) can be bent at least partially depending on a change in distance between the first support bracket (620) and the second printed circuit board (630).

[0122] In one embodiment, the second support bracket (650) may be positioned to support at least a portion of the sensor structure (640). For example, the second support bracket (650) may be positioned to face at least a portion of the sensor structure (640) to support the sensor structure (640).

[0123] FIGS. 8A and 8B are drawings showing a sensor structure (640) according to one embodiment of the present disclosure.

[0124] FIG. 8A is a drawing showing a sensor structure (640) in a slide-out state of an electronic device (600) according to one embodiment. FIG. 8B is a drawing showing a sensor structure (640) in a state in which the first connector (645) and the second connector (646) are positioned relatively close to each other compared to the state of FIG. 8A.

[0125] In one embodiment, the sensor structure (640) may include a bending sensor element (641) and / or a flexible printed circuit board (642).

[0126] In one embodiment, the bending sensor element (641) can measure an angle (AG, see FIG. 9A) of the bending sensor element (641). In one embodiment, the angle (AG) of the bending sensor element (641) can mean an angle at which the bending sensor element (641) is bent, a degree of bending, or an angular displacement of the sensor.

[0127] In one embodiment, the bending sensor element (641) can measure the tensile strain and compressive strain of the bending sensor element (641). In one embodiment, the bending sensor element (641) can measure the displacement of the bending sensor element (641).

[0128] In one embodiment, the bending sensor element (641) may be disposed on a flexible printed circuit board (642). For example, the bending sensor element (641) may be bonded to one surface of the flexible printed circuit board (642) using an adhesive member (e.g., adhesive member (1231) of FIG. 12).

[0129] In one embodiment, the bending sensor element (641) and the flexible printed circuit board (642) may each comprise a bendable material. In one embodiment, since the bending sensor element (641) and the flexible printed circuit board (642) comprise a bendable material, the sensor structure (640) may be bendable at least in part.

[0130] In one embodiment, the bending sensor element (641) may include a first sensor connector (6411) and / or a second sensor connector (6412). The first sensor connector (6411) may be formed at one end of the bending sensor element (641), and the second sensor connector (6412) may be formed at the other end of the bending sensor element (641).

[0131] In one embodiment, the flexible printed circuit board (642) may include a first substrate connector (6421) and / or a second substrate connector (6422). The first substrate connector (6421) may be formed at one end of the flexible printed circuit board (642), and the second substrate connector (6422) may be formed at the other end of the flexible printed circuit board (642).

[0132] In one embodiment, a flexible printed circuit board (642) can electrically connect a first printed circuit board (e.g., the second substrate (252) of FIG. 4) and a second printed circuit board (e.g., the first substrate (251) of FIG. 4, the second printed circuit board (630) of FIG. 7).

[0133] In one embodiment, the flexible printed circuit board (642) may serve to transmit power and signals (e.g., data). The flexible printed circuit board (642) may include a transmission layer (e.g., transmission layers 1440 and 1450 of FIG. 14) through which power and signals (e.g., data) are transmitted. According to one embodiment, the flexible printed circuit board (642) may include both a layer for transmitting power and a layer for transmitting signals.

[0134] Although the sensor structure (640) is illustrated in FIGS. 8A and 8B as including one flexible printed circuit board (642), this is exemplary, and the sensor structure (640) may include two or more flexible printed circuit boards (642). For example, the sensor structure (640) may include two flexible printed circuit boards (642), and one of the two flexible printed circuit boards (642) may include a layer for transmitting power, and the other flexible printed circuit board (642) may include a layer for transmitting signals (e.g., data).

[0135] In one embodiment, the first connector (645) may include a first sensor connector (6411) and a first substrate connector (6421).

[0136] In one embodiment, the second connector (646) may include a second sensor connector (6412) and a second substrate connector (6422).

[0137] In one embodiment, the distance between the first connector (645) and the second connector (646) may vary depending on the movement of the second housing (612, see FIG. 6A) relative to the first housing (210, see FIG. 4). For example, when the second housing (612, see FIG. 6A) moves away from the first housing (210, see FIG. 4), the distance between the first support bracket (620, see FIG. 7) and the second printed circuit board (630, see FIG. 7) may increase, and the distance between the first connector (645) and the second connector (646) may also increase.

[0138] FIG. 9a and FIG. 9b are conceptual diagrams showing the angle (AG) of the bending sensor element (641) according to one embodiment of the present disclosure.

[0139] In one embodiment, the bending sensor element (641) can measure an angle (AG) at which the bending sensor element (641) is bent. The bending sensor element (641) can include a bending sensor (e.g., the bending sensor (1211) of FIG. 12) that can measure the angle (AG). In one embodiment, the angle (AG) of the bending sensor element (641) can refer to an angle of the sensor structure (640, see FIGS. 8A and 8B). In one embodiment, referring to FIGS. 9A and 9B, the angle (AG) of the bending sensor element (641) can refer to an angle formed by straight arms of the bending sensor element (641) corresponding to one end and the other end of the bending sensor element (641) when the bending sensor element (641) is bent.

[0140] Referring to FIGS. 9A and 9B, the angle (AG) of the bending sensor element (641) according to one embodiment may be an angle formed by a virtual first straight line (T1) parallel to one end of the bending sensor element (641) and a virtual second straight line (T2) parallel to the other end of the bending sensor element (641).

[0141] In one embodiment, the angle (AG) of the bending sensor element (641) may be formed regardless of the shape of the bending sensor element (641). Since the angle (AG) of the bending sensor element (641) refers to the angle formed by the first straight line (T1) and the second straight line (T2), it may be unrelated to the shape of the bending sensor element (641). For example, although the bending shape of the bending sensor element (641) of FIG. 9A is different from the bending shape of the bending sensor element (641) of FIG. 9B, the angle formed by the first straight line (T1) and the second straight line (T2) in FIGS. 9A and 9B is substantially the same, and therefore, the angle (AG) of the bending sensor element (641) illustrated in FIG. 9A may be substantially the same as the angle (AG) of the bending sensor element (641) illustrated in FIG. 9B. In one embodiment, each displacement of the bending sensor element (641) can be formed independently of the path of the bending sensor element (641).

[0142] In one embodiment, the bending sensor element (641) may include at least two capacitors.

[0143] In one embodiment, a sensor of the bending sensor element (641) (e.g., bending sensor (1211) of FIG. 12) can measure the differential capacitance of two capacitors.

[0144] In one embodiment, the bending sensor element (641) can recognize that tensile deformation has occurred when the differential capacitance is greater than a predetermined reference value, and can calculate the angle (AG) of the bending sensor element (641). In one embodiment, the angle (AG) of the bending sensor element (641) can be calculated based on the differential capacitance. For example, the angle (AG) of the bending sensor element (641) can have a linear relationship with the differential capacitance.

[0145] FIGS. 10A, 10B and 10C are drawings showing a second support bracket (650) according to one embodiment of the present disclosure.

[0146] FIG. 10A is an exploded perspective view of a second support bracket (650) according to one embodiment. FIG. 10B is a perspective view of a second support bracket (650) according to one embodiment. FIG. 10C is a drawing showing a second housing (612) and a second support bracket (650) according to one embodiment.

[0147] Referring to FIG. 10A, a second support bracket (650) according to one embodiment may include a first part (651), a second part (652), and / or a coupling pin (653).

[0148] In one embodiment, the first part (651) may include a first coupling portion (6511) and / or a second coupling portion (6512).

[0149] In one embodiment, the second part (652) may include a third coupling portion (6521) and / or a fourth coupling portion (6522).

[0150] In one embodiment, the coupling pin (653) may include a first pin (6531), a second pin (6532), and / or a third pin (6533).

[0151] Referring to FIGS. 10A and 10B, the first coupling portion (6511) of the first part (651) and the third coupling portion (6521) of the second part (652) may be positioned at corresponding positions. In one embodiment, the first coupling portion (6511) of the first part (651) and the third coupling portion (6521) of the second part (652) may be coupled using a first pin (6531).

[0152] In one embodiment, the first part (651) and the second part (652) may be rotatably coupled with respect to each other. For example, the first coupling portion (6511) of the first part (651) and the third coupling portion (6521) of the second part (652) may be coupled using the first pin (6531), and the first part (651) and the second part (652) may be rotatably coupled with respect to each other.

[0153] Referring to FIG. 10c, the second housing (612) according to one embodiment may include a groove (6125). In one embodiment, the groove (6125) may include a curved shape.

[0154] Referring to FIG. 10c, the second support bracket (650) can be placed in the second housing (612).

[0155] Referring to FIG. 10c, the second support bracket (650) may be connected to the first support bracket (620) at one end and to the second housing (612) at the other end. For example, the second connecting portion (6512) of the first part (651) may be connected to the first support bracket (620). The fourth connecting portion (6522) of the second part (652) may be connected to the second housing (612).

[0156] In one embodiment, the second pin (6532) may be a pin for coupling the end of the first part (651) to the first support bracket (620). In one embodiment, the second pin (6532) may couple the second coupling portion (6512) of the first part (651) to the first support bracket (620).

[0157] In one embodiment, the third pin (6533) may be a pin for coupling the end of the second part (652) to the second housing (612). In one embodiment, the third pin (6533) may couple the fourth coupling portion (6522) of the second part (652) to the second housing (612).

[0158] Referring to FIGS. 10B and 10C, the first coupling portion (6511), the third coupling portion (6521), and the first pin (6531) may constitute a hinge (655) of the second support bracket (650). For example, the hinge (655) of the second support bracket (650) may include the first coupling portion (6511), the third coupling portion (6521), and the first pin (6531), and may be a portion that rotatably connects the first part (651) and the second part (652).

[0159] In one embodiment, the groove (6125) may serve to guide the movement of the second support bracket (650). For example, the hinge (655) of the second support bracket (650) may move along the direction in which the groove (6125) extends.

[0160] In one embodiment, the hinge (655) of the second support bracket (650) can move along the groove (6125) according to the sliding movement of the second housing (612). Since the hinge (655) of the second support bracket (650) moves along the groove (6125), the angle between the first part (651) and the second part (652) can be changed within a predetermined range. In one embodiment, since the angle between the first part (651) and the second part (652) of the second support bracket (650) is changed within a predetermined range, the angle (AG, see FIG. 9a) of the sensor structure (640, see FIG. 8a) supported by the second support bracket (650) can also be changed within a predetermined range.

[0161] FIG. 11a and FIG. 11b are drawings showing the movement of the second support bracket (650) according to one embodiment of the present disclosure.

[0162] FIG. 11a is a drawing showing the position of the second support bracket (650) in a first state of the electronic device (600) according to one embodiment. FIG. 11b is a drawing showing the position of the second support bracket (650) in a second state of the electronic device (600) according to one embodiment.

[0163] In one embodiment, the first state of the electronic device (600) may mean a state in which the first support bracket (620) is moved toward the second printed circuit board (630) as compared to a slide-out state (e.g., the state illustrated in FIG. 6b).

[0164] In explaining the configurations shown in FIGS. 11a and 11b, a description of configurations that are substantially the same as those of FIGS. 6a and 6b may be omitted.

[0165] In one embodiment, the second state of the electronic device (600) may mean a state in which the first support bracket (620) is moved toward the second printed circuit board (630) compared to the first state of the electronic device (600).

[0166] Referring to FIGS. 11a and 11b, when the first support bracket (620) is moved in the first movement direction (M1), the hinge (655) of the second support bracket (650) can be moved in the second movement direction (M2) along the direction in which the groove (6125) extends.

[0167] In one embodiment, the second support bracket (650) can support the sensor structure (640, see FIG. 8A). The second support bracket (650) can move along the groove (6125) and allow the sensor structure (640, see FIG. 8A) to move within a predetermined angular range.

[0168] FIG. 12 is a drawing showing a second printed circuit board (630) and a sensor structure (1200) according to one embodiment of the present disclosure.

[0169] The sensor structure (1200) of FIG. 12 may refer to the sensor structure (640) illustrated in FIG. 8a, or may include at least some of the components of the sensor structure (640) illustrated in FIG. 8a.

[0170] In one embodiment, the sensor structure (1200) may include a bending sensor element (1210), a flexible printed circuit board (1220), a joint (1230), and / or a connector (1240).

[0171] In one embodiment, the bending sensor element (1210) can measure the angle (AG, see FIG. 9a) of the bending sensor element (1210).

[0172] In one embodiment, the bending sensor element (1210) can measure tensile strain and compressive strain of the bending sensor element (1210). In one embodiment, the bending sensor element (1210) can measure displacement of the bending sensor element (1210).

[0173] In one embodiment, the bending sensor element (1210) may include a silicone material.

[0174] In one embodiment, the bending sensor element (1210) may include a conductive material. For example, the bending sensor element (1210) may include a conductive silicone material.

[0175] In one embodiment, the bending sensor element (1210) may include a bending sensor (1211) and / or a sensor circuit (1212).

[0176] In one embodiment, the joint (1230) may include an adhesive member (1231) and / or a contact pad (1232).

[0177] In one embodiment, the adhesive member (1231) may serve to bond the bending sensor element (1210) and the flexible printed circuit board (1220) to each other.

[0178] In one embodiment, the adhesive member (1231) may include an adhesive material. For example, the adhesive member (1231) according to one embodiment may include an anisotropic conductive paste (ACP). In one embodiment, the adhesive member (1231) may include an epoxy adhesive in a polymer liquid form.

[0179] In one embodiment, the contact pad (1232) may serve to electrically connect the bending sensor element (1210) (e.g., the sensor circuit (1212)) and the flexible printed circuit board (1220).

[0180] In one embodiment, the flexible printed circuit board (1220) may be electrically connected to a second printed circuit board (630). In one embodiment, the flexible printed circuit board (1220) may serve to transmit power and signals (e.g., data).

[0181] In one embodiment, a flexible printed circuit board (1220) can electrically connect a first printed circuit board (e.g., the second substrate (252) of FIG. 4) and a second printed circuit board (630) (e.g., the first substrate (251) of FIG. 4).

[0182] In one embodiment, the connector (1240) of FIG. 12 may include the second connector (646) illustrated in FIG. 8a.

[0183] In one embodiment, the sensor structure (1200) may be electrically connected to a second printed circuit board (630) via a connector (1240).

[0184] FIGS. 13A and 13B are drawings showing a sensor structure (1300-1, 1300-2) according to one embodiment of the present disclosure.

[0185] FIG. 13a is a drawing showing a sensor structure (1300-1) including a first protective layer (1311) and a second protective layer (1313) according to one embodiment. FIG. 13b is a drawing showing a sensor structure (1300-2) including a first protective layer (1311) according to one embodiment.

[0186] The sensor structures (1300-1, 1300-2) illustrated in FIG. 13a and FIG. 13a may refer to the sensor structure (640) of FIG. 8a or may include at least some of the components of the sensor structure (640) of FIG. 8a.

[0187] The sensor structures (1300-1, 1300-2) illustrated in FIGS. 13a and 13b may refer to the sensor structure (1200) of FIG. 12 or may include at least some of the components of the sensor structure (1200) of FIG. 12.

[0188] Referring to FIG. 13A, a sensor structure (1300-1) according to one embodiment may include a bending sensor element (1310-1) and / or a flexible printed circuit board (1320).

[0189] In one embodiment, the bending sensor element (1310-1) may include a first protective layer (1311), a dielectric layer (1312), and / or a second protective layer (1313).

[0190] In one embodiment, the sensor structure (1300-1) may be laminated in the following order: a flexible printed circuit board (1320), a second protective layer (1313), a dielectric layer (1312), and a first protective layer (1311).

[0191] In one embodiment, the protective layer (1311, 1313) and the dielectric layer (1312) may include a silicone material.

[0192] In one embodiment, the protective layer (1311, 1313) may serve to protect the dielectric layer (1312).

[0193] In one embodiment, the protective layer (1311, 1313) may include a conductive material. For example, the protective layer (1311, 1313) may include a conductive silicon material.

[0194] In one embodiment, the dielectric layer (1312) may include a capacitor having a given capacitance. In one embodiment, at least two capacitors may be included.

[0195] In one embodiment, the flexible printed circuit board (1320) may include a conductive material.

[0196] Referring to FIG. 13b, a sensor structure (1300-2) according to one embodiment may include a bending sensor element (1310-2) and / or a flexible printed circuit board (1320).

[0197] In one embodiment, the sensor structure (1300-2) may be laminated in the following order: a flexible printed circuit board (1320), a dielectric layer (1312), and a first protective layer (1311).

[0198] The embodiment illustrated in FIG. 13b may not include the second protective layer (1313) included in the embodiment illustrated in FIG. 13a. For example, in the embodiment illustrated in FIG. 13b, a flexible printed circuit board (1320) including a conductive material may function as the second protective layer (1313) of FIG. 13a.

[0199] In one embodiment, the bending sensor elements (1310-1, 1310-2) can measure the angle (AG, see FIG. 9A) of the bending sensor elements (1310-1, 1310-2). For example, the angle of the bending sensor elements (1310-1, 1310-2) can be calculated using the differential capacitance of two capacitors included in the dielectric layer (1312).

[0200] In one embodiment, the bending sensor elements (1310-1, 1310-2) can measure tensile strain and compressive strain of the bending sensor elements (1310-1, 1310-2). In one embodiment, the bending sensor elements (1310-1, 1310-2) can measure displacement of the bending sensor elements (1310-1, 1310-2).

[0201] FIG. 14 is a drawing showing a sensor structure (1400) according to one embodiment of the present disclosure.

[0202] In one embodiment, the sensor structure (1400) may be manufactured by integrally forming a bending sensor element (e.g., bending sensor element (641) of FIG. 8A) and a flexible printed circuit board (e.g., flexible printed circuit board (642) of FIG. 8A).

[0203] The sensor structure (1400) illustrated in FIG. 14 may refer to the sensor structure (640) of FIG. 8a, or may include at least some of the components of the sensor structure (640) of FIG. 8a.

[0204] In one embodiment, the sensor structure (1400) may include a first protective layer (1410), a first dielectric layer (1420), a second dielectric layer (1430), a first transmission layer (1440), a second transmission layer (1450), and / or a second protective layer (1460).

[0205] In one embodiment, the protective layer (1410, 1460) and the dielectric layer (1420, 1430) may include a silicone material.

[0206] In one embodiment, the protective layer (1410, 1460) may serve to protect the dielectric layer (1420, 1430).

[0207] In one embodiment, the protective layer (1410, 1460) may include a conductive material. For example, the protective layer (1410, 1460) may include a conductive silicon material.

[0208] In one embodiment, the second protective layer (1460) may include a ground of a flexible printed circuit board (642, see FIG. 8A). For example, the second protective layer (1460) may be a layer formed as a ground of the flexible printed circuit board (642, FIG. 8A). In one embodiment, the second protective layer (1460) may be in the form of a conductive silicone material added to the ground of the flexible printed circuit board (642, FIG. 8A) to protect the dielectric layers (1420, 1430) and the transmission layers (1440, 1450).

[0209] In one embodiment, the transfer layer (1440, 1450) may be a layer included in a flexible printed circuit board (642, FIG. 8a).

[0210] In one embodiment, power and / or signals may be transmitted through transmission layers (1440, 1450). In one embodiment, the first transmission layer (1440) and the second transmission layer (1450) may be layers through which power and / or signals (e.g., data) are transmitted.

[0211] A sensor structure (1400) according to one embodiment may be configured in such a way that a transmission layer (1440, 1450) of a flexible printed circuit board (642, FIG. 8A) is placed between a first protective layer (1410) and a second protective layer (1460) of a bending sensor element (e.g., a bending sensor element (641) of FIG. 8A).

[0212] When a bending sensor element (e.g., a bending sensor element (641) of FIG. 8A) and a flexible printed circuit board (e.g., a flexible printed circuit board (642) of FIG. 8A) are formed integrally, the total number of layers of the sensor structure (1400) can be reduced. According to one embodiment, the sensor structure (1400) is formed integrally with a bending sensor element (e.g., a bending sensor element (641) of FIG. 8A) and a flexible printed circuit board (e.g., a flexible printed circuit board (642) of FIG. 8A), so that the total number of layers of the sensor structure (1400) is reduced, and thus the manufacturing cost required for manufacturing the sensor structure (1400) can be reduced.

[0213] FIG. 15 is a drawing showing an electronic device (1500) according to one embodiment of the present disclosure.

[0214] The electronic device (600) of FIG. 15 may refer to the electronic device (600) of FIGS. 6A and 6B, or may include at least some of the components of the electronic device (600) illustrated in FIGS. 6A and 6B.

[0215] Referring to FIG. 15, an electronic device (1500) according to one embodiment may include a housing (1510), a first support bracket (1520), a printed circuit board (1530), a sensor structure (1540), a second support bracket (1550), a drive motor (1560), a pinion gear (1591), a rack gear (1593), and / or a battery (1595).

[0216] In explaining the configuration shown in Fig. 15, the description of the configuration that is substantially the same as the configuration of Figs. 6a and 6b may be omitted.

[0217] In one embodiment, the sensor structure (1540) may include a bending sensor element (1541) and / or a flexible printed circuit board (1542).

[0218] In one embodiment, a flexible printed circuit board (1542) can transfer power from a battery (1595) to a printed circuit board (1530).

[0219] In one embodiment, the sensor structure (1540) may be supported by a second support bracket (1550).

[0220] In one embodiment, the second support bracket (1550) may include at least a hinge (1555) on at least a portion of the second support bracket (1550). At least a portion of the second support bracket (1550) may be rotatable about the hinge (1555).

[0221] In one embodiment, the sensor structure (1540) may include a straight region (1540A, 1540B) and / or a bent region (1540C).

[0222] In one embodiment, the straight region (1540A, 1540B) may be a region in which the sensor structure (1540) extends in a straight line. The straight region (1540A, 1540B) may include a first straight region (1540A) and / or a second straight region (1540B).

[0223] In one embodiment, the bend region (1540C) may be a region in which the sensor structure (1540) bends and extends at least in part. The bend region (1540C) may be located between the first straight region (1540A) and the second straight region (1540B).

[0224] In one embodiment, in the straight region (1540A, 1540B) of the sensor structure (1540), the bending sensor element (1541) and the flexible printed circuit board (1542) can be coupled to each other.

[0225] In one embodiment, in the bending region (1540C) of the sensor structure (1540), the bending sensor element (1541) and the flexible printed circuit board (1542) may be spaced apart from each other. For example, in the bending region (1540C), the bending sensor element (1541) and the flexible printed circuit board (1542) may not be coupled to each other but may be positioned at a distance from each other.

[0226] The displacement and stress of the bending sensor element (1541) and the displacement and stress of the flexible printed circuit board (1542) due to an external force may be different from each other. For example, even if the same external force is applied to the bending sensor element (1541) and the flexible printed circuit board (1542), the displacement and stress of the bending sensor element (1541) and the displacement and stress of the flexible printed circuit board (1542) may be different from each other. As the external force applied to the bending sensor element (1541) and the flexible printed circuit board (1542) increases, the difference between the displacement and stress of the bending sensor element (1541) and the displacement and stress of the flexible printed circuit board (1542) may increase.

[0227] Among the flexible printed circuit board (1542) regions, the region located in the bending region (1540C) of the sensor structure (1540) may be subjected to greater stress than other regions. Therefore, when the flexible printed circuit board (1542) and the bending sensor element (1541) are combined in the bending region (1540C) of the sensor structure (1540), the bending sensor element (1541) may be subjected to relatively greater stress.

[0228] An electronic device (1500) according to one embodiment of the present disclosure can reduce stress applied to the bending sensor element (1541) by arranging the bending sensor element (1541) and the flexible printed circuit board (1542) to be spaced apart from each other in a bending region (1540C) of a sensor structure (1540).

[0229] According to one embodiment, the electronic device (1500) can prevent or reduce damage to the bending sensor element (1541) by reducing the stress applied to the bending sensor element (1541) in the bending region (1540C).

[0230] According to one embodiment, the electronic device (1500) may be configured such that the stress applied to the bending sensor element (1541) in the bending region (1540C) is reduced, thereby making it easier for the bending sensor element (1541) to measure an accurate angle (e.g., AG, see FIG. 9A).

[0231] FIG. 16 is a block diagram illustrating an electronic device (1600) according to one embodiment of the present disclosure.

[0232] The electronic device (1600) of FIG. 16 may refer to the electronic device (600) of FIGS. 6A and 6B, or may include at least some of the components of the electronic device (600) illustrated in FIGS. 6A and 6B.

[0233] FIG. 16 may be a block diagram illustrating components of an electronic device (1600) according to one embodiment, components related to measuring angles (e.g., AG, see FIG. 9A) and calculating distances (e.g., distances moved by the second housing).

[0234] The arrows illustrated in FIG. 16 may indicate that each component is electrically connected. For example, the sensor (1610) may be electrically connected to the sensor circuit (1620), and the sensor circuit (1620) may be electrically connected to the sensor hub (1630). The sensor hub (1630) may be electrically connected to the processor (1640).

[0235] Referring to FIG. 16, an electronic device (1600) may include a sensor (1610), a sensor circuit (1620), a sensor hub (1630), and / or a processor (1640).

[0236] In one embodiment, the sensor (1610) may include a bending sensor (1211, see FIG. 12). The sensor (1610) may measure an angle (AG, see FIG. 9a) of a bending sensor element (641, see FIG. 9a).

[0237] In one embodiment, the sensor circuit (1620) can transmit angle information including the angle (AG, see FIG. 9A) measured by the sensor (1610) to the sensor hub (1630).

[0238] In one embodiment, the sensor hub (1630) may be disposed on a second printed circuit board (630, see FIG. 6A). In one embodiment, the sensor hub (1630) may be configured to be included in the second printed circuit board (630, see FIG. 6A).

[0239] In one embodiment, the processor (1640) may refer to or include the processor (120) of FIG. 1.

[0240] In one embodiment, the processor (1640) may control other components (e.g., hardware or software components) of the electronic device (1600) and perform various data processing or operations.

[0241] In one embodiment, the processor (1640) may include an application processor.

[0242] In one embodiment, the processor (1640) may be disposed on a second printed circuit board (630, see FIG. 6A).

[0243] In one embodiment, the processor (1640) may be configured to calculate a distance traveled by the second housing (612, see FIG. 6A) based on angle information received by the sensor hub (1630). For example, the processor (1640) may convert angle information received by the sensor hub (1630) into a distance traveled by the second housing (612, see FIG. 6A) using a predetermined algorithm.

[0244] FIG. 17 is a drawing showing an electronic device (1700) according to a comparative example.

[0245] Referring to FIG. 17, an electronic device (1700) according to a comparative example may include a housing (1710), a support bracket (1720), a printed circuit board (1730), a magnetic detection sensor (1740), a magnetic body (1750), a driving motor (1760), a camera module (1770), a display (1780), a pinion gear (1791) and a rack gear (1793), a rack gear guide (1794), and a battery (1795).

[0246] In a comparative embodiment, the housing (1710) may include a first housing (not shown) and / or a second housing (1712). The first housing (not shown) and the second housing (1712) may be movably coupled with respect to each other.

[0247] In a comparative embodiment, a magnetic detection sensor (1740) may be disposed in the second housing (1712). The magnetic detection sensor (1740) may include a Hall sensor.

[0248] In a comparative embodiment, the magnet (1750) may be placed on the support bracket (1720).

[0249] An electronic device (1700) according to a comparative example may include a plurality of magnetic detection sensors (1740). The plurality of magnetic detection sensors (1740) may be arranged at intervals from each other.

[0250] The electronic device (1700) according to the comparative example can detect the position of the magnetic body (1750) and the relative movement of the magnetic body (1750) through the magnetic body detection sensor (1740). For example, when the support bracket (1720) moves in one direction (e.g., in the Y-axis direction) with respect to the second housing (1712), the magnetic body (1750) disposed on the support bracket (1720) can also move in one direction (e.g., in the Y-axis direction) with respect to the second housing (1712). Each of the plurality of magnetic body detection sensors (1740) can detect the relative movement of the magnetic body (1750).

[0251] An electronic device (1700) according to a comparative example can measure the distance between each of a plurality of magnetic body detection sensors (1740) and a magnetic body (1750), and based on this, calculate the distance by which the second housing (1712) slides relative to the first housing (not shown).

[0252] The electronic device (1700) according to the comparative embodiment may require separate components for the magnetic detection sensor (1740) (e.g., a substrate for arranging the magnetic detection sensor, a signal line for driving the magnetic detection sensor). In addition, the electronic device (1700) according to the comparative embodiment may require space for arranging the magnetic detection sensor (1740) and components for the magnetic detection sensor (1740).

[0253] In the electronic device (1700) according to the comparative example, since the plurality of magnetic body detection sensors (1740) are arranged at intervals, it may be relatively difficult to accurately measure the position of the magnetic body (1750). For example, in the electronic device (1700) according to the comparative example, since the plurality of magnetic body detection sensors (1740) are arranged at intervals, it may be difficult to continuously measure the positions of the magnetic body (1750) and the support bracket (1720) on which the magnetic body (1750) is arranged.

[0254] The electronic device (1700) according to the comparative example includes a magnetic body (1750) for measuring the movement distance of the second housing (1712), and thus may affect or be affected by a magnetic body outside the electronic device (1700).

[0255] An electronic device (600) according to one embodiment of the present disclosure may include a first housing (210), a second housing (612), a first support bracket (620), a first printed circuit board (252), a second printed circuit board (630), a sensor structure (640), and a second support bracket (650).

[0256] In one embodiment, the second housing (612) may be movably coupled to the first housing (210).

[0257] In one embodiment, the first support bracket (620) may be disposed in the first housing (210).

[0258] In one embodiment, a first printed circuit board (252) may be disposed in a first housing (210).

[0259] In one embodiment, the second printed circuit board (630) may be disposed in the second housing (612).

[0260] In one embodiment, the sensor structure (640) may be connected to a first support bracket (620) at one end and to a printed circuit board (630) at the other end.

[0261] In one embodiment, the second support bracket (650) can support the sensor structure (640).

[0262] In one embodiment, the sensor structure (640) may include a bending sensor element (641) and a flexible printed circuit board (642).

[0263] In one embodiment, the bending sensor element (641) may include a dielectric layer (1312) and a protective layer (1311, 1313) protecting the dielectric layer (1312).

[0264] In one embodiment, the bending sensor element (641) can measure the angle (AG) of the sensor structure (640).

[0265] In one embodiment, a flexible printed circuit board (642) can electrically connect a first printed circuit board (252) and a second printed circuit board (630).

[0266] In one embodiment, a flexible printed circuit board (642) may be at least partially coupled to a bending sensor element (641).

[0267] In one embodiment, the electronic device (600) may include a processor (120, 1640) disposed on a second printed circuit board (630).

[0268] In one embodiment, the processor (120, 1640) may be configured to calculate a distance that the second housing (612) has moved in the longitudinal direction of the electronic device (600) relative to the first housing (210) based on an angle of the sensor structure (640) measured by the bending sensor element (641).

[0269] An electronic device (600) according to one embodiment of the present disclosure can accurately measure the distance that the second housing (612) moves relative to the first housing (210) compared to an electronic device (1700) according to a comparative embodiment. For example, an electronic device (600) according to one embodiment of the present disclosure can continuously calculate the movement distance of the second housing (612) based on the angle (AG) of the bending sensor element (641) that continuously changes.

[0270] An electronic device (600) according to one embodiment of the present disclosure can enable precise control of the electronic device (600) based on a continuously calculated movement distance of the second housing (612).

[0271] An electronic device (600) according to one embodiment of the present disclosure can more precisely control a flexible display (230) based on a continuously calculated movement distance of a second housing (612). For example, an electronic device (600) according to one embodiment of the present disclosure can control a display area of ​​a flexible display (230) to be more precisely expanded or reduced.

[0272] An electronic device (600) according to one embodiment of the present disclosure may be configured to perform various operations based on the continuously calculated movement distance of the second housing (612). The electronic device (600) may be configured to accurately calculate the slide-in speed and / or the slide-out speed of the second housing (612) based on the continuously calculated movement distance of the second housing (612), and to perform another operation based on the slide-in speed and / or the slide-out speed of the second housing (612). For example, the electronic device (600) may be configured to perform a first operation (e.g., ending shooting, disabling an alarm) when the slide-in of the second housing (612) is relatively fast, and may be configured to perform a second operation (e.g., maintaining a shooting mode, setting an alarm) that is different from the first operation when the slide-in of the second housing (612) is relatively slow.

[0273] The electronic device (600) according to one embodiment of the present disclosure does not include a magnetic body for measuring the movement distance of the second housing (612), and therefore may not be affected by a magnetic body outside the electronic device (600) or may not be affected by a magnetic body outside the electronic device (600).

[0274] In one embodiment, the sensor structure (640) and the second support bracket (650) may serve to reinforce the strength of the electronic device (600). According to one embodiment, the electronic device (600) may include the sensor structure (640) and the second support bracket (650), thereby improving the overall rigidity of the electronic device (600).

[0275] In one embodiment, the second support bracket (650) may include a first part (651) connected to the first support bracket (620) and a second part (652) connected to the second housing (612) and rotatably coupled to the first part (651).

[0276] In one embodiment, the bending sensor element (641, 1210) may include a bending sensor (1211) for measuring an angle of the sensor structure (640, 1200) and a sensor circuit (1212) for transmitting angle information including an angle (AG) measured by the bending sensor (1211) to a printed circuit board (630).

[0277] In one embodiment, the sensor circuit (1212) may be electrically connected to a second printed circuit board (630) via a flexible printed circuit board (642).

[0278] In one embodiment, the second housing (612) may include a groove (6125) having a curved shape that guides movement of the second support bracket (650).

[0279] In one embodiment, the second support bracket (650) can guide the movement of the sensor structure (640) so that the sensor structure (640) moves within a predetermined angular range.

[0280] In one embodiment, the angle (AG) of the sensor structure (640) may include the angle between a virtual first straight line (T1) parallel to one end of the bending sensor element (641) and a virtual second straight line (T2) parallel to the other end of the bending sensor element (641).

[0281] In one embodiment, the sensor structure (640, 1540) includes a straight region (1540A, 1540B) extending in a straight line and a bend region (1540C) that is bent at least in a portion, wherein in the straight region (1540A, 1540B), the bending sensor element (641) and the flexible printed circuit board (642) are coupled to each other, and in the bend region (1540C), the bending sensor element (641) and the flexible printed circuit board (642) can be spaced from each other.

[0282] In one embodiment, the flexible printed circuit board (642) may include a transmission layer (1440, 1450) for transmitting power and signals.

[0283] In one embodiment, the bending sensor element (641) may be formed integrally with a flexible printed circuit board (642).

[0284] In one embodiment, the electronic device (600) may include a battery (B) disposed on a first support bracket (620).

[0285] In one embodiment, a flexible printed circuit board (642) can electrically connect a battery (B) and a second printed circuit board (630).

[0286] In one embodiment, the second support bracket (650) may include a first pin (6531) for coupling the first part (651) and the second part (652), a second pin (6532) for coupling an end of the first part (651) to the first support bracket (620), and a third pin (6533) for coupling an end of the second part (652) to the second housing (612).

[0287] In one embodiment, the sensor structure (640) may include a connector (646) for electrically connecting the sensor structure (640) to a second printed circuit board (630).

[0288] An electronic device (600) according to one embodiment of the present disclosure may include a first housing (210), a second housing (612), a first support bracket (620), a second printed circuit board (630), a processor (120, 1640), and a sensor structure (640).

[0289] In one embodiment, the processor (120, 1640) may be disposed on a second printed circuit board (630).

[0290] In one embodiment, the processor (120, 1640) may be configured to calculate a distance the second housing (612) has moved in the longitudinal direction of the electronic device (600) relative to the first housing (210) based on the angle of the sensor structure (640).

[0291] In one embodiment, a bending sensor element that detects angular displacement using a differential capacitance method may be composed of two flexible capacitors arranged along the length of the bending sensor element. The two flexible capacitors may be arranged spaced apart on either side of the center of the bending sensor element. When the bending sensor element is bent, the capacitor on the inside of the bend may experience compressive deformation, and the capacitor on the outside may experience tensile deformation, which may cause a difference in measurable capacitance. For example, when the bending sensor element is not bent, the differential capacitance is 0, and thus the angular displacement value or measured angle may be formed as 0°. As the bending sensor element is bent, the differential capacitance value and the measured angle may increase. The differential capacitance measurement may be linearly proportional to the angular displacement of the sensor.

[0292] In one embodiment, the bending sensor element may have a resistance that varies as the bending sensor element is bent. The sensor structure may include a bending sensor element capable of determining the degree of bending. The technical problems to be solved in the present disclosure are not limited to the technical problems mentioned above, and other technical problems not mentioned will be clearly understood by those skilled in the art to which the present disclosure pertains.

[0293] The effects that can be obtained from the present disclosure are not limited to the effects mentioned above, and other effects that are not mentioned will be clearly understood by a person having ordinary skill in the art to which the present disclosure pertains.

[0294] Electronic devices according to embodiments of the present disclosure may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to embodiments of the present disclosure are not limited to the aforementioned devices.

[0295] It should be understood that the embodiments of the present disclosure and the terminology used herein are not intended to limit the technical features described in the present disclosure to specific embodiments, but include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In the present disclosure, each of the phrases "A or B," "at least one of A and B," "at least one of A or B," "A, B, or C," "at least one of A, B, and C," and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among the phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0296] The term "module" used in one embodiment of the present disclosure may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0297] An embodiment of the present disclosure may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0298] According to one embodiment, a method according to one embodiment of the present disclosure may be provided as included in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) through an application store (e.g., Play Store™) or directly between two user devices (e.g., smart phones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or a relay server.

[0299] According to one embodiment, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to one embodiment, one or more components or operations of the above-described components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each component of the plurality of components in a manner identical to or similar to that performed by the corresponding component among the plurality of components prior to the integration.

[0300] According to one embodiment, the operations performed by a module, program or other component may be performed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be performed in a different order, omitted, or one or more other operations may be added.

Claims

1. In an electronic device (610), First housing (210); A second housing (612) movably coupled to the first housing; A first support bracket (620) and a first printed circuit board (252) arranged in the first housing; A second printed circuit board (630) disposed in the second housing; A sensor structure (640) connected to the first support bracket at one end and connected to the second printed circuit board at the other end; and Includes a second support bracket (650) that supports the above sensor structure, The above sensor structure is, Bending sensor element (641); and A flexible printed circuit board (642) electrically connecting the first printed circuit board and the second printed circuit board and having at least a portion thereof coupled to the bending sensor element, The above bending sensor element is an electronic device that determines the degree to which the bending sensor element is bent.

2. In paragraph 1, Further comprising a processor (1640) disposed on the second printed circuit board; The above processor, An electronic device configured to calculate a distance by which the second housing moves in the longitudinal direction of the electronic device relative to the first housing based on the degree of bending of the bending sensor element determined by the bending sensor element.

3. In paragraph 1, The above second support bracket, A first part (651) connected to the first support bracket; and An electronic device comprising a second part (652) connected to the second housing and rotatably coupled to the first part.

4. In paragraph 3, The above second support bracket, A first pin (6531) for connecting the first part and the second part; A second pin (6532) for connecting the end of the first part to the first support bracket; and An electronic device comprising a third pin (6533) for connecting the terminal of the second part to the second housing.

5. In paragraph 1, The above bending sensor element, A bending sensor (1211) configured to determine an angle (AG) corresponding to the degree of bending of the bending sensor element; and It includes a sensor circuit (1212) for transmitting angle information including the angle determined by the bending sensor to the printed circuit board, The above sensor circuit, An electronic device electrically connected to the second printed circuit board via the flexible printed circuit board.

6. In paragraph 1, The above second housing, An electronic device comprising a groove (6125) having a curved shape that guides movement of the second support bracket.

7. In paragraph 1, The above second support bracket, An electronic device that guides the movement of the sensor structure so that the sensor structure moves within a predetermined angular range.

8. In paragraph 1, The above sensor structure is, a straight area extending in a straight line (1540A, 1540B)); and Contains a bending region (1540C) that bends at least in part, In the above straight area, the bending sensor element and the flexible printed circuit board are coupled to each other, An electronic device in which the bending sensor element and the flexible printed circuit board are spaced apart from each other in the above bending region.

9. In paragraph 1, The above bending sensor element, An electronic device comprising a dielectric layer (1312, 1420, 1430) and a protective layer (1311, 1313, 1410, 1460) protecting the dielectric layer.

10. In paragraph 1, The above flexible printed circuit board is, An electronic device comprising a transmission layer (1440, 1450) for transmitting power and signals.

11. In paragraph 1, The above bending sensor element is an electronic device formed integrally with the flexible printed circuit board.

12. In paragraph 1, It further includes a battery (B) placed on the first support bracket, The above flexible printed circuit board is, An electronic device electrically connecting the battery and the second printed circuit board.

13. In paragraph 1, The above sensor structure is, An electronic device comprising a connector (646) for electrically connecting the sensor structure to the second printed circuit board.

14. In paragraph 1, The above second support bracket, An electronic device configured to move in accordance with movement of a second housing relative to the first housing.

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