Indexing of autogapping sensing device for setting gaps between showerheads and substrate supports

Abstract

An indexing arm for indexing an device within a process chamber includes: a first member to at least one of engage with a hub of the process chamber, the hub being disposed between substrate processing stations of the process chamber; and a second member extending from the first member and to support the device between a showerhead and a substrate support of one of the substrate processing stations, the device to measure a gap between the showerhead and the device. The second member, via the hub and the first member, is indexable among the substrate processing stations.

Description

INDEXING OF AUTOGAPPING SENSING DEVICE FOR SETTING GAPS BETWEEN SHOWERHEADS AND SUBSTRATE SUPPORTSCROSS-REFERENCE TO RELATED APPLICATIONS

[0001] This application claims the benefit of U.S. Provisional Application No. 63 / 551 ,461 , filed on February 8, 2024. The entire disclosure of the application referenced above is incorporated herein by reference.FIELD

[0002] The present disclosure relates to systems and methods for adjusting gapping between showerheads and substrate supports.BACKGROUND

[0003] The background description provided here is for the purpose of generally presenting the context of the disclosure. Work of the presently named inventors, to the extent it is described in this background section, as well as aspects of the description that may not otherwise qualify as prior art at the time of filing, are neither expressly nor impliedly admitted as prior art against the present disclosure.

[0004] A process chamber of a substrate processing system typically includes a plurality of process stations to perform deposition, etching, and other treatments of substrates such as semiconductor wafers. For example, deposition may be performed to deposit conductive film, dielectric film, or other types of film using chemical vapor deposition (CVD), plasma enhanced CVD (PECVD), atomic layer deposition (ALD), plasma enhance ALD (PEALD), and / or other deposition processes. As an example, etching may be performed to remove material from one or more layers and include atomic layer etching (ALE), high aspect ratio (HAR) etching, plasma etching, and / or other etch processes. During deposition, a substrate is arranged on a substrate support (e.g., a pedestal) and one or more precursor gases may be supplied to a process chamber using a gas distribution device (e.g., a showerhead) during one or more process steps. In a PECVD or PEALD process, plasma is used to activate chemical reactions within the process chamber during deposition. Additional examples of processes that may be performed on a substrate include, but are not limited to, dielectric etching, chemical etching, plasma etching, reactive ion etching, and cleaningprocesses. During the deposition and etching processes, gas mixtures are introduced into the process chamber via showerheads, and plasma is struck to activate chemical reactions. During the cleaning processes, gases may also be introduced via the showerheads.SUMMARY

[0005] An indexing arm for indexing a device within a process chamber is disclosed. The indexing arm includes: a first member to at least one of engage with a hub of the process chamber, the hub being disposed between substrate processing stations of the process chamber; and a second member extending from the first member and to support the device between a showerhead and a substrate support of one of the substrate processing stations, the device to measure a gap between the showerhead and the device, where the second member, via the hub and the first member, is indexable among the substrate processing stations.

[0006] In other features, the first member includes a first linearly extending portion and a second linearly extending portion. The first linearly extending portion extends perpendicular to the second linearly extending portion.

[0007] In other features, the first member is shaped to be disposed in a notch of the hub, the notch having a bottom surface and side surfaces extending upward from the bottom surface. In other features, the second member includes arched members extending from the first member.

[0008] In other features, the second member includes notches to receive tabs extending from the device, each of the notches having a bottom surface and side surfaces extending upward from the bottom surface.

[0009] In other features, the notches extend from a radially inner surface of the second member radially outward to a centerline of the second member. In other features, the notches do not extend to a radially outer surface of the second member.

[0010] In other features, the second member has: an inner diameter that is greater than an outer diameter of the substrate support; and an outer diameter that is less than an inner diameter of one of the substrate processing stations.

[0011] In other features, an indexing arm assembly includes: the indexing arm of claim 1 ; and a plate to extend over the first member and support the first member to the hub. In other features, the first member is disposed in a pocket of the hub and held in thepocket of the hub by the plate. In other features, the plate is coupled to the hub and prevents the first member from separating from the hub.

[0012] In other features, the indexing arm assembly further includes fasteners extending through the plate and into the hub and fastening the plate to the hub. In other features, the indexing arm assembly further includes self-tapping inserts screwed into the hub, where fasteners extend through the plate and are screwed into the self-tapping inserts.

[0013] In other features, a system includes: the indexing arm assembly; the hub; and the device. In other features, the device includes tabs extending to and being held by the second member of the indexing arm. In other features, the tabs are partially disposed respectively in pockets of the second member.

[0014] In other features, a device for measuring gaps between showerheads and substrate supports of substrate processing stations is disclosed. The device includes: sensors, when disposed in one of the substrate processing stations, to detect distances between one of the showerheads and the sensors; a sensor holding member to hold the sensors between the showerheads and the substrate supports and be indexed among the substrate processing stations; and tabs extending from the sensor holding member and held by an indexing arm, the indexing arm indexing the device among the substrate processing stations.

[0015] In other features, the device further includes ribs, where the tabs are held on to the ribs by at least one of screws and pins. In other features, the tabs are welded onto at least one of the sensor holding member and a base of the device. In other features, the tabs are adhered to at least one of the sensor holding member and a base of the device. In other features, the tabs are integrally formed as part of at least one of the sensor holding member and a base of the device. In other features, the sensors are capacitance sensors.

[0016] In other features, the device further includes: a wireless transceiver; and a controller receiving outputs of the sensors and wirelessly transmitting via the wireless transceiver the distances between the one of the showerheads and the sensors.

[0017] In other features, a system is disclosed and includes: a process chamber including processing stations, each of the processing stations including a substrate support and a showerhead; a hub disposed between the processing stations; an deviceto sense gaps between the showerheads and the device; an indexing arm coupled to the hub and supporting the device; and a motor connected to the hub and indexing the indexing arm with the device among the processing stations.

[0018] In other features, the device senses gaps between the showerhead of one of the processing stations and the device when the device is disposed between the showerhead of the one of the processing stations and the substrate support of the one of the processing stations.

[0019] In other features, the system further includes a controller to: control operation of the motor to index the device to a first one of the processing stations; signal the device to measure a gap between the device and the showerhead of the first one of the processing stations; control operation of the motor to index the device from the first one of the processing stations to a second one of the processing stations; and signal the device to measure a gap between the device and the showerhead of the second one of the processing stations while the device is on the substrate support of the second one of the processing stations. In other features, the device includes tabs extending to and held by the indexing arm.

[0020] In other features, a first method includes: placing an device on a first indexing arm within a process chamber; closing the process chamber; measuring and adjusting a first gap via the device between a showerhead of a first processing station in the process chamber and the device; without opening the process chamber, indexing the first indexing arm with the device from the first processing station to a second processing station; and measuring and adjusting a second gap via the device between a showerhead of the second processing station and the device.

[0021] In other features, the first method further includes swapping out a second indexing arm for indexing a substrate between the first processing station and the second processing station with the first indexing arm prior to placing the device on the first indexing arm.

[0022] In other features, the first method further includes: without opening the process chamber, indexing the first indexing arm with the device from the second processing station to a third processing station; measuring and adjusting a third gap via the device between a showerhead of the third processing station and the device; without opening the process chamber, indexing the first indexing arm with the device from the third processing station to a fourth processing station; and measuring and adjusting a fourthgap via the device between a showerhead of the fourth processing station and the device.

[0023] In other features, the first method further includes: subsequent to measuring the fourth gap, opening the process chamber and removing the device; and swapping out the first indexing arm with a second indexing arm for indexing substrates.

[0024] In other features, a second method is disclosed and includes: the first method; opening the process chamber; removing the device; closing the process chamber; placing a substrate on a substrate support of the first processing station; and processing the substrate in the first processing station based on the measurement of the first gap.

[0025] In other features, the second method further includes: without opening the process chamber, indexing the substrate from the first processing station to the second processing station; and processing the substrate in the second processing station based on the measurement of the second gap.

[0026] An indexing arm for indexing an autogapping sensing device within a process chamber is disclosed. The indexing arm includes: a coupling member to at least one of engage with and couple a hub of the process chamber, the hub being disposed between substrate processing stations of the process chamber; and a supporting member extending from the coupling member and to support the autogapping sensing device between a showerhead and a substrate support of one of the substrate processing stations, the autogapping sensing device to measure a gap between the showerhead and a top surface of the autogapping sensing device. The supporting member, via the hub and the coupling member, is indexable among the substrate processing stations.

[0027] In other features, the coupling member is T-shaped. In other features, the coupling member is shaped to be disposed in a pocket of the hub. In other features, the supporting member is ‘C’-shaped.

[0028] In other features, the supporting member includes pockets to receive tabs extending from the autogapping sensing device. In other features, the pockets extend from a radially inner surface of the supporting member radially outward to a centerline of the supporting member. In other features, the pockets do not extend to a radially outer surface of the supporting member.

[0029] In other features, the supporting member is at least one of circular-shaped and ‘C’-shaped and has: an inner diameter that is greater than an outer diameter of the substrate support; and an outer diameter that is less than an inner diameter of one of the substrate processing stations.

[0030] In other features, an indexing arm assembly includes: the indexing arm; and a plate to extend over the coupling member and support the coupling member to the hub. In other features, the coupling member is disposed in a pocket of the hub and held in the pocket of the hub by the plate. In other features, the plate is coupled to the hub and prevents the coupling member from separating from the hub. In other features, the indexing arm assembly further includes fasteners extending through the plate and into the hub and fastening the plate to the hub. In other features, the indexing arm assembly further includes self-tapping inserts screwed into the hub. The fasteners extend through the plate and are screwed into the self-tapping inserts.

[0031] In other features, an autogapping system is disclosed and includes: the indexing arm assembly; the hub; and the autogapping sensing device.

[0032] In other features, the autogapping sensing device includes tabs extending to and being held by the supporting member of the indexing arm. In other features, the tabs are partially disposed respectively in pockets of the supporting member.

[0033] In other features, an autogapping sensing device for measuring gaps between showerheads and substrate supports of substrate processing stations is disclosed. The autogapping sensing device includes: sensors, when disposed in one of the substrate processing stations, to detect distances between one of the showerheads and top surfaces of the sensors; a sensor holding member to hold the sensors between the showerheads and the substrate supports and be indexed among the substrate processing stations; and tabs extending from the sensor holding member and held by an autogapping indexing arm, the autogapping indexing arm indexing the autogapping sensing device among the substrate processing stations.

[0034] In other features, the autogapping sensing device further includes ribs. The tabs are held on to the ribs by at least one of screws and pins.

[0035] In other features, the tabs are welded onto at least one of the sensor holding member and a base of the autogapping sensing device. In other features, the tabs are adhered to at least one of the sensor holding member and a base of the autogappingsensing device. In other features, the tabs are integrally formed as part of at least one of the sensor holding member and a base of the autogapping sensing device.

[0036] In other features, the sensors are capacitance sensors. The autogapping sensing device further includes: a wireless transceiver; and a controller receiving outputs of the sensors and wirelessly transmitting via the wireless transceiver the distances between the one of the showerheads and the top surfaces of the sensors.

[0037] In other features, an autogapping system is disclosed and includes: a process chamber including processing stations, where each of the processing stations including a substrate support and a showerhead; a hub disposed between the processing stations; an autogapping sensing device to sense gaps between the showerheads and a top surface of the autogapping sensing device; an autogapping indexing arm coupled to the hub and supporting the autogapping sensing device; and a motor connected to the hub and indexing the autogapping indexing arm with the autogapping sensing device among the processing stations.

[0038] In other features, the autogapping sensing device senses gaps between the showerhead of one of the processing stations and top surfaces of the autogapping sensing device when the autogapping sensing device is disposed between the showerhead of the one of the processing stations and the substrate support of the one of the processing stations.

[0039] In other features, the autogapping system further includes a controller to: control operation of the motor to index the autogapping sensing device to a first one of the processing stations; signal the autogapping sensing device to measure a gap between the showerhead and a top surface of the autogapping sensing device; control operation of the motor to index the autogapping sensing device from the first one of the processing stations to a second one of the processing stations; and signal the autogapping sensing device to measure a gap between the showerhead and a top surface of the autogapping sensing device while the autogapping sensing device is on the substrate support of the second one of the processing stations.

[0040] In other features, the autogapping sensing device includes tabs extending to and held by the autogapping indexing arm.

[0041] In other features, an autogapping method is disclosed and includes: placing an autogapping sensing device on a first indexing arm within a process chamber; closingthe process chamber; measuring and adjusting a first gap via the autogapping sensing device between a showerhead of a first processing station in the process chamber and a top surface of the autogapping sensing device; without opening the process chamber, indexing the first indexing arm with the autogapping sensing device from the first processing station to a second processing station; and measuring and adjusting a second gap via the autogapping sensing device between a showerhead of the second processing station and a top surface of the autogapping sensing device.

[0042] In other features, the autogapping method further includes swapping out a second indexing arm for indexing a substrate between the first processing station and the second processing station with the first indexing arm prior to placing the autogapping sensing device on the first indexing arm.

[0043] In other features, the autogapping method further includes: without opening the process chamber, indexing the first indexing arm with the autogapping sensing device from the second processing station to a third processing station; measuring and adjusting a third gap via the autogapping sensing device between a showerhead of the third processing station and a top surface of the autogapping sensing device; without opening the process chamber, indexing the first indexing arm with the autogapping sensing device from the third processing station to a fourth processing station; and measuring and adjusting a fourth gap via the autogapping sensing device between a showerhead of the fourth processing station and a top surface of the autogapping sensing device.

[0044] In other features, the autogapping method further includes: subsequent to measuring the fourth gap, opening the process chamber and removing the autogapping sensing device; and swapping out the first indexing arm with a second indexing arm for indexing substrates.

[0045] In other features, a substrate processing method is disclosed and includes: the autogapping method; opening the process chamber; removing the autogapping sensing device; closing the process chamber; placing a substrate on a substrate support of the first processing station; and processing the substrate in the first processing station based on the measurement of the first gap.

[0046] In other features, the substrate processing method further includes: without opening the process chamber, indexing the substrate from the first processing station tothe second processing station; and processing the substrate in the second processing station based on the measurement of the second gap.

[0047] Further areas of applicability of the present disclosure will become apparent from the detailed description, the claims and the drawings. The detailed description and specific examples are intended for purposes of illustration only and are not intended to limit the scope of the disclosure.BRIEF DESCRIPTION OF THE DRAWINGS

[0048] The present disclosure will become more fully understood from the detailed description and the accompanying drawings, wherein:

[0049] FIG. 1 is a functional block diagram of a portion of an example substrate processing system including an autogapping (AG) system in accordance with the present disclosure;

[0050] FIG. 2 is a perspective view of an interior of an example process chamber including an AG indexing arm supporting an AG sensing device (AGSD) in accordance with the present disclosure;

[0051] FIGs. 3A-3D are top views of an example process chamber including an AG indexing arm shown indexing an AGSD among processing stations of the process chamber in accordance with the present disclosure;

[0052] FIG. 4 is a top view of the process chamber of FIGs. 3A-3D showing the AG indexing arm moving from one processing station to a next processing station;

[0053] FIG. 5 is a perspective view of an interior of the process chamber of FIG. 2 including a substrate indexing arm in accordance with the present disclosure;

[0054] FIG. 6 is a perspective view of an example hub including four substrate indexing arms;

[0055] FIG. 7 is a top perspective view of an example AGSD including tabs for supporting a sensing holding member on a supporting member of an AG indexing arm in accordance with the present disclosure;

[0056] FIG. 8 is a top view of the AGSD of FIG. 7;

[0057] FIG. 9 is a top view of an example AG indexing arm in accordance with the present disclosure;

[0058] FIG. 10 is a perspective view of an AG indexing arm assembly including the AG indexing arm of FIG. 9 in accordance with the present disclosure;

[0059] FIG. 11 is a perspective view of a portion of the AG indexing arm of FIG. 9 illustrating a close-up view of a pocket in accordance with the present disclosure;

[0060] FIG. 12A is top view of an example tab in accordance with the present disclosure;

[0061] FIG. 12B is a side view of the tab of FIG. 12A;

[0062] FIG. 13A is a functional block diagram of an alignment system illustrating a side cross-sectional view of an AG indexing arm in an up (or lifted) position in accordance with the present disclosure;

[0063] FIG. 13B is a side cross-sectional view of portions of a hub, chamber rib, and the AG indexing arm shown in FIG. 13A when the AG indexing arm is in the lifted position;

[0064] FIG. 14A is a functional block diagram of the alignment system of FIG. 13A illustrating a side cross-sectional view of an AG indexing arm in a down (or non-lifted) position;

[0065] FIG. 14B is a side cross-sectional view of portions of the hub, the chamber rib, and the AG indexing arm shown in FIG. 14A when the AG indexing arm is in the nonlifted position;

[0066] FIG. 15 shows a top view of a processing station including an AGSD and an AG indexing arm and a corresponding close-up top view of one of the tabs of the AG sensing device in accordance with the present disclosure;

[0067] FIG. 16 illustrates an AG process (or alignment method) utilizing an AG indexing arm and AGSD in accordance with the present disclosure;

[0068] FIG. 17 illustrates a substrate processing method based on measurements made during the alignment method of FIG. 16 in accordance with the present disclosure; and

[0069] FIGs. 18 is a functional block diagram of an example AGSD in accordance with the present disclosure.

[0070] In the drawings, reference numbers may be reused to identify similar and / or identical elements.DETAILED DESCRIPTION

[0071] Gapping between a showerhead and a respective substrate support of a processing station and thus gapping between the showerhead and a substrate being processed on the substrate support can affect processing uniformity. For example, if a bottom surface of the showerhead and a top surface of the substrate support are not parallel, then a deposition, etch, or clean process will likely not be uniform across the substrate being processed. In order to have a parallel relationship between the bottom surface of the showerhead and a top surface of the substrate support, an autogapping process is performed prior to processing. The tool including the showerhead and substrate support are down for maintenance while the autogapping process is being performed.

[0072] A traditional autogapping (AG) process includes venting and opening a process chamber and manually placing an autogapping system (AGS) wafer on a substrate support in a first processing station. The opening of the process chamber can include removing a top plate of the process chamber to expose the substrate supports in the process chamber. The AGS wafer includes sensors for measuring gaps. After placement of the AGS wafer, the process chamber is closed and pumped down to mimic processing condition pressures during processing of a substrate. After pumping down, the AGS wafer is used to measure distances between the bottom surface of a showerhead and top surfaces of the sensors. As an example, tilt and / or height of the showerhead relative to the substrate support are then adjusted such that the distances between the bottom surface of a showerhead and top surfaces of the sensors are equal to each other. After adjusting the gap of the first station, the process chamber is vented and opened. The AGS wafer is then manually moved from the first processing station to the next processing station and manually placed on the substrate support of the next station and the process chamber is again closed and pumped down. These operations are repeated until gaps between the showerheads and the substrate supports of each of the processing stations are set.

[0073] The process chamber typically includes four processing stations and thus the AGS wafer is manually moved and set in each of the four processing stations. After setting the gaps of the processing stations, the process chamber is vented and opened a last time to remove the AGS wafer. Each chamber venting and opening step, each gapping adjustment step, and each AGS wafer placing and pumping down step can take 20 minutes. In addition, the AGS wafer needs to be recalibrated every four hoursof use. Thus, the traditional AG process can require calibrating the AGS wafer twice, once prior to performing the AG process and a second time during the AG process. As a result, the AG process is time consuming and can take 4.5-6.0 hours to perform and includes opening the process chamber at least five times and closing the process chamber at least four times. Since the corresponding tool is down for the 4.5-6.0 hours, the AG process has a substantial amount of green-to-green (G2G) time (referred to as down time).

[0074] A process chamber can include substrate indexing arms that are used to move substrates being processed between processing stations. The existing AGS wafer is too thick to be indexed between processing stations using one of the substrate indexing arms. There is not enough space between the showerheads and the substrate supports to allow the AGS wafer to be lifted and moved from station-to-station without coming in contact with the showerheads using one of the substrate indexing arms. Thus, the process chamber needs to be vented and opened to move the AGS wafer between processing stations.

[0075] Examples set forth herein include an AG system including an AG indexing arm assembly. The AG indexing arm assembly includes an AG indexing arm that supports an AG sensing device (AGSD). The AG system performs an AG process that includes indexing the AG indexing arm via a hub, which is rotated to move the AGSD from station-to-station. The AGSD includes tabs that extend radially outward and are supported by the AG indexing arm. The AG indexing arm extends around the AGSD and is used to lift and set the AGSD on substrate supports of processing stations. The tabs and the AG indexing arm are configured to allow the AGSD to be indexed among the processing stations without the AGSD contacting a showerhead and without needing to vent and open the process chamber. This AG process includes opening the process chamber 2 times and closing the process chamber once and may take approximately 3 hours to perform. Due to the shortened process time, the AGSD is calibrated once for the entire process. The AG system is thus able to efficiently perform an AG process thereby minimizing the associated G2G time.

[0076] FIG. 1 shows a portion 100 of a substrate processing system (or tool) including an AG system 102. The AG system 102 includes an AG indexing arm 103, an AGSD 104, and a system controller 105. The AG indexing arm 103 supports the AGSD 104. The system controller 105 includes firmware for performing an AG process thatincludes indexing the AG indexing arm 103 with the AGSD 104 from station-to-station to set gaps between showerheads and substrate supports of the stations. Example AGSDs and portions thereof are shown and described with respect to FIGs. 2-4, 7-8, 13A-15 and 18. Example AG indexing arms are shown and described with respect to FIGs. 2-4, 9-11 , and 13A-15. An example AG process is described with respect to FIG. 16.

[0077] The substrate processing system includes a process chamber 106 having multiple processing stations 107, two processing stations are shown in FIG. 1 , however, the process chamber 106 may have four processing stations as shown in FIGs. 2-5. Each of the processing stations 107 includes respective substrate supports (e.g., substrate supports 108), such as electrostatic chucks, and showerheads (e.g., showerheads 109). The substrate supports may be referred to as pedestals. The substrate supports may include respective lift pin actuator assemblies (e.g., lift pin actuator assemblies 110).

[0078] The lift pin actuator assemblies include lift pins (e.g., lift pins 112) that are actuated to lift substrates (e.g., substrates 114) on and off of the substrate supports and substrate indexing arms (or transfer paddles). During the AG process, substrates are not on the substrate supports, thus the substrates are shown with dashed lines. Examples of the substrate indexing arms are shown in FIGs. 5-6. Prior to the AG process, one or more substrate indexing arms are removed and the AG indexing arm 103 is installed. Subsequent to performing the AG process, the AG indexing arm 103 is removed and the one or more substrate indexing arms are reinstalled. The amount of time to swap out the substrate indexing arm(s) with the AG indexing arm is minimal (e.g., 3-5 minutes). The same amount of time is associated with swapping out the AG indexing arm with the substrate indexing arm(s).

[0079] Each of the processing stations 107 includes upper and lower electrodes. The showerheads may be implemented as or include the upper electrodes. The substrate supports may be implemented as or include the lower electrodes. The upper and lower electrodes may be implemented as radio frequency (RF) electrodes, bias electrodes, clamping electrodes and / or heating electrodes. For example, the upper electrodes may be implemented as the showerheads, which introduce and distribute gases in the processing stations. The showerheads may include stem portions 116 including ends connected to top surfaces of the process chamber 106. The showerheads are generallycylindrical and extend radially outward from opposite ends of the stem portions 116 at a location that is spaced from the top surface of the process chamber. Substrate facing surfaces of the showerheads include holes through which process or purge gas flows. Alternatively, the showerheads may include a conducting plate and the gases may be introduced in another manner.

[0080] An RF generating system 120 generates and outputs RF voltages to the upper electrodes and the lower electrodes. For each of the processing stations, one of the upper electrodes and the lower electrodes may be direct current (DC) grounded, alternating current (AC) grounded or at a floating potential. For example, the RF generating system 120 may be controlled by the system controller 105 and include one or more RF generators 122 (e.g., a capacitive coupled plasma RF power generator, a bias power generator, and / or other RF power generator) that generate RF voltages, which are fed by one or more matching and distribution networks 124 to the upper electrodes and / or the lower electrodes. The system controller 105 sets and adjusts frequencies of RF signals output from the RF generators 123, 125. The frequencies may be adjusted to adjust power distribution within and across the substrate supports. The system controller 105 may be connected to and / or include memory, which may store a chamber clean application 130 for implementing cleaning processes disclosed herein.

[0081] As an example, a first RF generator 123, a second RF generator 125, a first RF matching network 127 and a second RF matching network 129 are shown. The first RF generator 123 and the first RF matching network 127 may provide a RF voltage or may simply connect the showerheads to a ground reference. The second RF generator 125 and the second RF matching network 129 may each or collectively be referred to as a power source and provide a RF / bias voltage to the substrate supports. In one embodiment, the first RF generator 123 and the first RF matching network 127 provide power that ionizes gas and drives plasma. In another embodiment, the second RF generator 125 and the second RF matching network 129 provide power that ionizes gas and drives plasma. One of the RF generators 123, 125 may be a high-power RF generator producing, for example, 6-10 kilowatts (kW) of power or more.

[0082] A gas delivery system 131 includes one or more gas sources 132-1 , 132-2,..., and 132-N (collectively gas sources 132), where N is an integer greater than zero. The gas sources 132 supply one or more precursors and gas mixtures thereof. The gassources 132 may also supply etch gas, carrier gas and / or purge gas. The gas sources 132 are connected by valves 134-1 , 134-2, ..., and 134-N (collectively valves 134) and mass flow controllers 136-1 , 136-2, ..., and 136-N (collectively mass flow controllers 136) to a manifold and valve assembly 140. An output of the manifold and valve assembly 140 is fed to the process chamber 106. For example, the output of the manifold and valve assembly 140 is fed to the showerheads.

[0083] The manifold and valve assembly 140 may also supply gases to a remote plasma source 142. The remote plasma source 142 may supply, for example, plasma to a center channel 144 in a center top plate 145 and out an output port 146 to a center of the process chamber 106. The plasma is directed to a center of a hub 148 for chamber cleaning purposes, as further described below. The output port 146 is located above and in lateral alignment with a center of the hub 148.

[0084] A valve 156 and pump 158 may be used to evacuate reactants from the process chamber 106. The system controller 105 may control components of the substrate processing system including controlling supplied RF power levels, pressures and flow rates of supplied gases, RF matching, etc. The system controller 105 controls states of the valve 156 and the pump 158. A robot 164 may be used to deliver substrates into and remove substrates from the processing stations 107. For example, the robot 164 may transfer substrates between the substrate supports and a load lock 166. The robot 164 may be controlled by the system controller 105. The system controller 105 may control operation of the load lock 166. The valves, gas and / or coolant pumps, power sources, RF generators, etc. may be referred to as actuators.

[0085] The substrate processing system further includes a power source 170 that may supply power to the system controller 105, the lift pin actuator assemblies 110 and motors 172. The motors 172 rotates a spindle 174 and move the spindle 174 and hub 148 in a Z direction (or vertically). The power source 170 may be controlled by the system controller 105. The system controller 105 may control supply of power from the power source 170 to the motors 172 and / or to the RF generating system 120.

[0086] The lift pin actuator assemblies 110 raise and lower the lift pins 112. The lift pin actuator assemblies 110 may include electrical and / or pneumatic actuators for adjusting positions of the lift pins 112. One of the motors 172 rotates a spindle 174, which is connected to and thus rotates the hub 148 about a vertical center axis 175. The hub 148 is connected to either the AG indexing arm 103 or to the substrate indexing arm(s),which extend laterally from the hub 148. Top and / or bottom planar surfaces of the AG indexing arm 103 and / or to the substrate indexing arm(s) may be parallel to bottom planar surfaces of the showerheads and / or top planar surfaces of the substrate supports when attached to the hub.

[0087] During substrate processing, the substrate indexing arms are rotated to position the substrates 114 over the substrate supports. The lift pins 112 are raised to lift the substrates 114 off the substrate indexing arm(s) and the substrate indexing arms are rotated out of the way to stowed positions. The lift pins 112 are then lowered to set the substrates 114 on the substrate supports. One or more processing operations (e.g., etch, deposition, or clean operation) are then performed on the substrates 114. Subsequently, the lift pins 112 are raised to lift the substrates off of the substrate supports and the substrate indexing arms are rotated to be between the substrate supports and the substrates 114. The lift pins 112 are then lowered to set the substrates 114 back on the substrate indexing arms. This process may be repeated and the substrates may be moved from processing station to processing station in this manner. Each processing station may perform a different set of processing operations.

[0088] The lift pins 112 may also be used to allow delivery and removal of the substrates 114 from the process chamber 106 using a robot arm of the robot 164. Upper ends of the lift pins 112 may be located flush with or below upper surfaces of the substrate supports when stowed. During substrate delivery, removal and / or transfer, the lift pins are raised relative to the upper surfaces of the substrate supports to lift the substrates 114 and provide clearance between the substrates 114 and the substrate supports. The clearance between the substrates 114 and the substrate supports allows (i) an end effector of the robot arm to be inserted or removed, and (ii) the substrate transfer paddles to be moved between the substrates 114 and the substrate supports.

[0089] FIG. 2 shows an interior 200 of the process chamber 106 including the AG indexing arm 103 supporting an AGSD 104. The AG indexing arm 103 includes a coupling member 202 and a supporting member 204. The coupling member 202 is coupled to the hub 148 and may be disposed in a pocket 203 of the hub 148, as shown.

[0090] The supporting member 204 extends from the coupling member and supports the AGSD 104. The supporting member 204 is ‘C’-shaped and extends around the substrate support 108 and includes pockets (examples pockets are shown in FIGs. 9- 11 ). The AGSD 104 includes a sensor holding member 210 and tabs 212 that extendradially from the sensor holding member 210 and are partially disposed in the pockets when the supporting member 204 is supporting the AGSD 104. In an embodiment, the pockets may extend from a radially inner side surface 208 to, for example, a centerline 209 of the supporting member 204. The sensor holding member 210 includes sensors (e.g., three sensors 214 are shown). The sensors may be capacitance sensors that are used to detect capacitances between a showerhead and the sensors. Distances between a bottom surface of the showerhead and top surfaces of the sensors are directly related to the detected capacitances and thus can be measured and / or determined based on the capacitances.

[0091] The process chamber 106 further includes the substrate supports 108. Substrates are provided through slit valve openings 220 and placed on the substrate supports 108. Chamber ribs 224 are shown and extend from side walls 222, between the processing stations 107 towards the hub 148. The hub 148 is rotated to index the AG indexing arm 103 and the AGSD 104 from station-to-station.

[0092] FIGs. 3A-3D show an example process chamber 300 including an AG indexing arm 302 indexing an AGSD 304 among processing stations 306A-D of the process chamber 300. The process chamber 300 may be configured similarly as the process chamber 106 of FIGs. 1 -2. FIG. 3A shows the AG indexing arm 302 in a home position over a first substrate support 310 of a first one of the processing stations 306A-D. FIG. 3B shows the AG indexing arm 302 over a second substrate support 312 of a first processing station. FIG. 3C shows the AG indexing arm 302 over a third substrate support 314 of a third processing station. FIG. 3D shows the AG indexing arm 302 over a fourth substrate support 316 of a fourth processing station.

[0093] FIG. 4 shows the process chamber 300 of FIGs. 3A-3D showing the AG indexing arm 302 moving from one processing station (the fourth processing station 306D) to a next processing station (the first processing station 306A). The substrate supports 310, 312, 314, 316 may have an outer diameter OD1 and the processing stations 306 may have an outer diameter OD2, which is greater than OD1 .

[0094] FIG. 5 shows the interior 200 of the process chamber 106 of FIG. 2 including an example substrate indexing arm 500. The substrate indexing arm 500 is shown in replacement of the AG indexing arm 103. The substrate indexing arm 500 may be used to move a substrate being processed from station-to-station. The substrate indexing arm 500 may include a coupling member 502 and a supporting member 504 thatsupports a substrate. The substrate indexing arm 500 is shown in a stowed state between processing stations. When indexing a substrate, the substrate indexing arm 500 is in a deployed state. Although a single substrate indexing arm is shown, additional substrate indexing arms may be incorporated. FIG. 6 shows a hub 600 including four substrate indexing arms 602, which may replace the hub 148 and substrate indexing arm 500 of FIG. 5. The substrate indexing arms 602 may be clamped to the hub 600 via clamps 604. The substrate indexing arms 602 are equally distanced apart from each other about the hub 600. The substrate indexing arms 602 are 90° apart from each other.

[0095] In an embodiment, the hub 600 is not used for an AG indexing arm, but rather is replaced with one of the hubs referred to herein that is configured for an AG indexing arm. This occurs at the beginning of an AG process. At the end of the AG process the hub configured for the AG indexing arm is removed and the hub 600 is reinstalled.

[0096] FIG. 7 shows an example AGSD 700, which may replace any of the AGSDs referred to herein. The AGSD 700 includes a base 702, a sensor holding member 704, ribs 706, and tabs 708. The base 702 supports the sensor holding member 704 and the ribs 706. In one embodiment, the base 702, the sensor holding member 704 and the ribs 706 are integrally formed as a single part. The sensor holding member 704 may be configured as a housing having a circuit disposed therein including sensors 710. An example of the circuit is shown in FIG. 18. In the example shown, the AGSD 700 includes three sensors, although a different number of sensors may be included. Each of the sensors provides at least one point of measurement for measuring distance, as further described below.

[0097] The ribs 706 extend from the sensor holding member 704 and are attached to the sensor holding member 704 and the base 702. The base 702 may be disc-shaped. The ribs 706 provide rigidity to the AGSD 700. The ribs 706 may be thin rectangular shaped flanges that extend radially outward from the sensor holding member 704 and upward from the base 702. The ribs 706 may take on other shapes and may be integrally formed as part of the sensor holding member 704 and the base 702. The tabs 708 include slits 711 through which corresponding ones of the ribs 706 extend. The tabs 708 are mounted on the corresponding ones of the ribs 706. A detailed example of this coupling is shown in FIG. 15. The tabs 708 may be screwed on, pinned on, welded on, adhered to, and / or attached to the ribs using another technique. The tabs 708 maynot be attached to the ribs, but rather attached to the sensor holding member 704 and / or the base 702. In an embodiment, the tabs are integrally formed with the base 702, the sensor holding member 704 and / or the ribs 706 as a single part. The tabs 708 may include notches 720 on lower radially outward ends 722 of the tabs 708, which allow the ends 722 to sit in pockets of an AG indexing arm.

[0098] FIG. 8 shows the AGSD 700 of FIG. 7 and includes the base 702, a sensor holding member 704, tabs 708 and sensors 710. The base 702 has an outer diameter OD2. The outer diameter OD3 is less than the inner diameter of a corresponding AG indexing arm, such as the AG indexing arm of FIG. 9. The outer diameter OD3 may be the same as an outer diameter of a substrate support. For example, OD3 may be equal to OD1 of FIG. 4.

[0099] FIG. 9 shows an example AG indexing arm 900, which includes a coupling member 902 and a supporting member 904, which may be integrally formed as a single member. In an embodiment, the coupling member 902 is T-shaped. This allows the coupling member 902 to be disposed in a T-shaped pocket 901 of a hub 903 (a portion of which is shown with hidden lines), which aids in preventing the AG indexing arm 900 from shifting, for example, in X, Y and annular directions relative to the hub 903. The hub 903 may be configured similarly as any of the hubs disclosed herein. The pocket901 is a notch in an upper radially outer portion of the hub that is shaped to receive the coupling member 902. The notch has a bottom surface and, in the example shown, seven side surfaces extending upward from the bottom surface. The coupling member902 is shaped similarly as the pocket 901 and includes a first member 905 and a second member 907. The members 905, 907 may be linearly extending portions of a single member that are perpendicular to each other. An end of the second member 907 in centered on and extends perpendicular to the first member 905 to the supporting member 904. The second member 907 is integrally formed with the first member 905. When the coupling member 902 is disposed in the pocket 901 of the hub 903, outer peripheral sides 909, 911 of the members 905, 907 sit adjacent and contact corresponding inner sides 913 of the pocket 901. This prevents lateral movement and rotation of the AG indexing arm 900 relative to the hub 903.

[0100] In an embodiment, the coupling member 902 does not include holes. When without holes, the coupling member is held in place relative to the hub by the sidewalls of the pocket of the hub and a cover plate. An example cover plate is shown in FIG. 10.In another embodiment, the coupling member 902 does include holes for attaching the coupling member 902 to a hub with fasteners. An example of a coupling member of an AG indexing arm being fastened to a hub is shown in FIG. 15.

[0101] The supporting member 904 includes pockets 910, which are used as lift points for lifting an AGSD. In the example shown, four pockets 910 are included to receive ends of four tabs of the AGSD. A different number of pockets may be included. The supporting member 904 may be ‘C’-shaped such that, although circular in shape, the supporting member 904 does not make a complete circle, as shown, or the supporting member 904 may be circular shaped and make a complete circle. The supporting member 904 includes a left arched member 912 and a right arched member 914. The arched members 912, 914 extend from the coupling member 902 and are connected to the coupling member 902 at first ends 915, 917 of the arched members 912, 914. In the shown example embodiment of FIG. 9, second ends 919, 921 of the arched members 912, 914 are not connected such that there is a gap G between the second ends 919, 921 of the arched members 912, 914. Each of the arched members 912, 914 includes two of the pockets 910. The pockets are notches in upper portions of the arched members 912, 914. The arched members 912, 914 have a centerline that extends along a circle 916. An inner diameter ID and an outer diameter OD4 of the supporting member 904 are shown.

[0102] An inner diameter ID of the supporting member 904 is greater than the outer diameter of the substrate supports of a process chamber, such as the outer diameter OD1 of FIG. 4. The outer diameter OD4 is less than the outer diameter of processing stations of the process chamber, such as the outer diameter OD2 of FIG. 4. The outer diameter OD4 is sized to allow the AG indexing arm 900 to be indexed from station-to- station without coming in contact with interior sidewalls of a corresponding process chamber.

[0103] FIG. 10 shows an AG indexing arm assembly 1000 including the AG indexing arm 900 of FIG. 9. The AG indexing arm 900 includes the coupling member 902 and the supporting member 904 having the pockets 910, which are on an upper side of the supporting member 904. The coupling member 902 is disposed in a pocket 1002 of a hub 1004. In an embodiment, the coupling member 902 engages with the hub 1004. For example, the coupling member 902 may be pressed into the pocket 1002. The coupling member 902 is held in the pocket 1002 by a plate 1006 that covers an endportion of the coupling member 902. Portions 1008 of the plate 1006 extend past sides of the coupling member 902 and overlap portions of the hub 1004. The portions 1008 of the coupling member 902 that are overlapping the hub 1004 are attached to the hub 1004. In the example shown, the portions 1008 are held to the hub 1004 via a first set of fasteners 1010. In an embodiment, the fasteners 1010 extend through holes in the plate 1006 and holes in the hub 1004 and nuts are tightened on ends of the fasteners. In another embodiment, self-tapping inserts (represented by dashed lines 1011 ) installed in the hub 1004 and receive the fasteners 1010. As an example, the AG indexing arm 900 is formed of ceramic and the hub 1004 is formed of aluminum. By forming the AG indexing arm 900 of ceramic instead of aluminum, the AG indexing arm 900 is more rigid and thus tends not to flex when being indexed and / or moved in a vertical direction. The AG indexing arm 900 also tends not to flex when an AGSD is set on the AG indexing arm 900. The hub 1004 may also include holes 1012 for extending therethrough another set of fasteners for attaching the hub 1004 to a spindle.

[0104] FIG. 11 shows a portion of the AG indexing arm 900 of FIG. 9 illustrating a close-up view of one of the pockets 910 of the supporting member 904. The pocket 910 is sized to receive an end of one of the tabs referred to herein. Other pockets of AG indexing arms referred to herein may be shaped and sized similarly as the pocket 910. The pockets are depressions in top surfaces and / or notches in upper portions of the support member 904 shaped to receive ends of tabs of AGSDs. Each of the notches has a bottom surface and three side surfaces extending upward from the bottom surface.

[0105] FIGs. 12A-12B show an example tab 1200, which may replace any of the tabs referred to herein. The tab 1200 may be rectangular shaped and include a slit 1202 for receiving a rib of an AGSD. The slit 1202 is open on three sides 1204, 1206, 1208. of the tab. Side 1204 is shown in FIG. 12B. The slit 1202 extends inward from one end of the tab 1200. The tab 1200 has an overall length L1 and a width W. The tab 1200 further includes a notch 1210. A lower portion 1212 of the tab 1200, in radial alignment with the notch 1210, has a length L2, which is less than the length L1. L1 is greater than W. The tab 1200 includes side holes 1214 that extend laterally through the tab 1200. This allows fasteners or pins to extend through the tab 1200 and the slit 1202 to allow the tab to be attached to a rib of an AGSD. The end of the tab 1200 that includes the notch has a thickness T1 that is less than an overall thickness T2 of the tab 1200.

[0106] FIG. 13A shows an alignment system 1300 for aligning a showerhead 1302 relative to a substrate support 1304 or vice versa. The alignment system 1300 includes a showerhead alignment system 1310 and / or a substrate support alignment system 1312. The showerhead alignment system 1310 adjusts positioning (e.g., X, Y and / or Z positioning) and tilt of the showerhead 1302 relative to the substrate support 1304. The substrate support alignment system 1312 adjusts the positioning (e.g., X, Y and / or Z positioning) and tilt of the substrate support 1304. The showerhead alignment system 1310 may include a showerhead alignment assembly 1314 and motors 1316. The motors 1316 may move, via the showerhead alignment assembly 1314, the showerhead 1302 in X, Y, and / or Z directions and tilt the showerhead 1302 about X and Y axes of the showerhead 1302. The substrate support alignment system 1312 may include a substrate support alignment assembly 1318 and motors 1320. The motors 1320 may move, via the substrate support alignment assembly 1318, the substrate support 1304 in X, Y, and / or Z directions and tilt the substrate support 1304 about X and Y axes of the substrate support 1304.

[0107] An AG indexing arm 1322 is shown in an up (or lifted) position and supporting an AGSD 1324 via tabs 1326. A gap G1 exists between a bottom surface of the showerhead 1302 and a top surface of the AGSD 1324 and a gap G2 exists between the AGSD 1324 and the substrate support 1304. The gaps G1 and G2 allow the AGSD 1324 to be moved onto the substrate support 1304 and off of the substrate support 1304 without contacting the showerhead 1302 and the substrate support 1304. The AGSD 1324 is moved in vertical and annular directions. Substrate supports of different stations of a process chamber can have top surfaces that are not at a same height. As an example, the differences in heights may be 2 millimeters. The gap G2 is greater than the differences in heights of the substrate supports, such that when the AG indexing arm 1322 and the AGSD 1324 are being indexed between stations, there is not an interference issue between the AG indexing arm 1322 and the AGSD 1324.

[0108] When the AG indexing arm 1322 is in the down (non-lifted) position (as shown in FIG. 14A) and the AGSD 1324 is sitting on the substrate support 1304, an autogapping operation is performed to set gaps between i) the substrate support 1304 and ii) the AGSD 1324 and / or substrate support 1304. A controller 1328, such as the system controller 105 of FIG. 1 , may control operation of one or more of the systems 1310, 1312. This may include wirelessly receiving distance measurements made by theAGSD 1324, as represented by arrow 1330 and then adjusting height and / or tilt of the showerhead 1302 and / or height and / or tilt of the substrate support 1304.

[0109] FIG. 13B shows portions of a hub 1340, chamber rib 1342, and the AG indexing arm 1322 shown in FIG. 13A when the AG indexing arm 1322 is in the lifted position. A distance D1 is shown between the hub 1340 and the chamber rib 1342. The distance D1 provides clearance such that there is not interference with the chamber rib 1342 by the hub 1340 while the AG indexing arm 1322 is being indexed between stations. The chamber rib 1342 is similar to one of the chamber ribs 224 of FIG. 2. The hub 1340 lifts the AG indexing arm 1322. The hub 1340 may be moved via a spindle in the Z direction as well as rotated about a vertical center axis of the spindle and hub 1340.

[0110] FIG. 14A shows the alignment system 1300 of FIG. 13A illustrating a side cross-sectional view of an AG indexing arm 1322 in a down (or non-lifted) position. FIG. 14B shows portions of the hub 1340, the chamber rib 1342, and the AG indexing arm 1322 shown in FIG. 14A when the AG indexing arm 1322 is in the non-lifted position.

[0111] The alignment system 1300 includes the showerhead alignment system 1310 and / or the substrate support alignment system 1312. The showerhead alignment system 1310 may include the showerhead alignment assembly 1314 and the motors 1316. The substrate support alignment system 1312 may include the substrate support alignment assembly 1318 and the motors 1320. The alignment systems 1310, 1312 adjust positioning and tilt of the showerhead 1302 and the substrate support 1304.

[0112] When in the non-lifted state, a distance D2 exists between the tabs 1326 and the AG indexing arm 1322. A distance D3 exists between the hub 1340 and the chamber rib 1342, as shown in FIG. 14B. The distance D3 is less than the distance D2 of FIG. 13B and is greater than 0.

[0113] FIG. 15 shows a top view of a processing station 1500 of a process chamber 1502 including an AGSD 1503 and an AG indexing arm 1504 along with a close-up top view of one of the tabs 1506 of the AGSD 1503. The AG indexing arm 1504 is fastened to a hub 1510 via fasteners 1512. A first end of the tab 1506 includes a slit 1520 and adjacent members 1522 that are fastened to a rib 1524 of the AGSD 1503 extending in the slit 1520. In the example shown, fasteners 1530 extend through the members 1522 through the slit 1520 and are screwed into nuts 1532.

[0114] A second end of the tab 1506, opposite the first end of the tab 1506, is disposed in a pocket 1540 of the AG indexing arm 1504. The AG indexing arm 1504 includes a pocket 1540 including sides 1542, 1544, 1546. In an embodiment, gaps may exist between the sides 1542, 1544, 1546 and the second end of the tab 1506. In another embodiment, gaps do not exist between the sides 1542, 1544, 1546 and the second end of the tab 1506.

[0115] FIG. 16 shows an AG process (or alignment method) utilizing an AG indexing arm and AGSD, such as any of the AG indexing arms and AGSDs referred to herein. The alignment method may be performed to provide a parallel and / or target gapping arrangement between showerheads and substrate supports of a process chamber. The target gapping arrangement may not be a parallel arrangement. This method is applicable to any of the above-described embodiments of FIGs. 1 -15.

[0116] At 1600, the process chamber is vented and opened. This may include removing a top (or lid) of the process chamber to provide access to processing stations within the process chamber.

[0117] At 1602, one or more substrate indexing arms are removed. This may include unclamping and / or unfastening the one or more substrate indexing arms from a hub. If one or more plates are holding the one or more substrate indexing arms to the hub, the one or more plates are removed.

[0118] At 1604, an AG indexing arm is installed. This may include setting a coupling member of the AG indexing arm in a pocket of the hub, placing a plate over the coupling member and fastening the plate to the hub. In another embodiment, this operation includes fastening the coupling member to the hub.

[0119] At 1606, the AGSD is setup including calibrating sensors of the AGSD if not already calibrated. This may occur on a fixture outside of the process chamber. Operation 1606 may be performed prior to performing the alignment method. The AGSDs disclosed herein are designed such that a traditional calibration fixture is able to be used for calibrating the AGSDs. The tabs of the AGSDs do not interfere with the calibration fixture.

[0120] At 1608, a system controller, such as one of the system controllers referred to herein, indexes the AG indexing arm to a home position if not already in the homeposition. The home position may refer to when the AG indexing arm is centered over a first substrate support of a first processing station of the process chamber.

[0121] At 1610, the AGSD is manually placed on the supporting member of the AG indexing arm. At 1612, the process chamber is closed and pumped down.

[0122] At 1614, the AGSD measures gaps between the bottom surface of the first showerhead of the first processing station and top surfaces of the sensors of the AGSD. The controller of the AGSD may average the distances measured by the sensors. The measured gaps (or distances) and the average are stored in memory and are wirelessly transmitted to the system controller.

[0123] At 1616, the system controller indexes the AG indexing arm including the AGSD to the next processing station. At 1618, the system controller measures and adjusts gaps between the showerhead of the current processing station and top surfaces of sensors of the AGSD. The controller of the AGSD may average the distances measured by the sensors. The measured gaps (or distances) and the average are stored in memory and are wirelessly transmitted to the system controller. Operation 1618 is similar to operation 1614.

[0124] At 1620, the system controller determines whether there is another processing station for which to measure and adjust gapping. If yes, operation 1616 is performed, otherwise operation 1622 is performed.

[0125] At 1622, the process chamber is vented and opened, as similarly done during operation 1600. At 1624, the AGSD is removed from the process chamber, the AG indexing arm is uninstalled, and the one or more substrate indexing arms are reinstalled.

[0126] At 1626, the process chamber may be closed and pumped down in preparation for processing one or more substrates. The method of FIG. 17 may be performed subsequent to the method of FIG. 16. The method may end subsequent to operation 1626 as shown or subsequent to operation 1624 without closing and pumping down the process chamber.

[0127] FIG. 17 shows a substrate processing method performed based on measurements and adjustments made during the alignment method of FIG. 16. Although the following operations are described with respect to a single substrate, the operations may be modified for processing multiple substrates concurrently. Thefollowing operations may be performed by a system controller, such as one of the system controllers referred to herein.

[0128] At 1700, a substrate is placed on a substrate indexing arm in a process chamber. At 1702, the substrate is indexed to a first processing station and placed on a first substrate support of the first processing station.

[0129] At 1704, the substrate is processed based on i) the measured gaps between the first showerhead and the sensors of an AGSD, and / or ii) the parallel and / or the target gapping arrangement, provided by the method of FIG. 16 for the first processing station. This may include setting fluid pressures, fluid flow rates, temperatures of showerhead and / or substrate support, etc. based on the measured gaps and average.

[0130] At 1706, the system controller determines whether to further process the substrate in another processing station of the process chamber. If yes, operation 1708 is performed, otherwise operation 1712 is performed.

[0131] At 1708, the system controller indexes the substrate to the next processing station and places the substrate on the substrate support of the next processing station.

[0132] At 1710, the substrate is processed in the next processing station based on i) measured gaps and average, and / or ii) the parallel and / or target gapping arrangement provided by the method of FIG. 16 for the next processing station. The target gapping arrangement provided for the next processing station may be different than the target gapping arrangements provided for one or more of the other processing stations of the process chamber.

[0133] At 1712, the substrate is removed from the process chamber. The method may end subsequent to operation 1712.

[0134] FIGs 18 shows an AG sensing device 1800 that includes an AGSD controller 1802, sensors 1804, memory 1806, a wireless transceiver 1808 and a power source 1810. The wireless transceiver 1808 is in wireless communication with a system controller 1812 and / or a wireless transceiver of the system controller 1812. As an example, the wireless transceiver 1808 may be a Bluetooth® transceiver. The sensors 1804 may be capacitance sensors that are used to measure distances between showerheads and top surfaces of the capacitance sensors. The stated measurements are directly related to distances between the showerheads and respective substrate supports. The measured distances are stored in the memory 1806 and shared with thesystem controller 1812. The AGSD controller 1802 executes software to acquire gap measurements, store the measurements, and transmit the measurements to the system controller 1812, which may display the measurements via a user interface 1814. The power source 1810 may include one or more batteries and provides power to the AGSD controller 1802, the memory 1806, and the wireless transceiver 1808.

[0135] The foregoing description is merely illustrative in nature and is in no way intended to limit the disclosure, its application, or uses. The broad teachings of the disclosure can be implemented in a variety of forms. Therefore, while this disclosure includes particular examples, the true scope of the disclosure should not be so limited since other modifications will become apparent upon a study of the drawings, the specification, and the following claims. It should be understood that one or more steps within a method may be executed in different order (or concurrently) without altering the principles of the present disclosure. Further, although each of the embodiments is described above as having certain features, any one or more of those features described with respect to any embodiment of the disclosure can be implemented in and / or combined with features of any of the other embodiments, even if that combination is not explicitly described. In other words, the described embodiments are not mutually exclusive, and permutations of one or more embodiments with one another remain within the scope of this disclosure.

[0136] Spatial and functional relationships between elements (for example, between modules, circuit elements, semiconductor layers, etc.) are described using various terms, including “connected,” “engaged,” “coupled,” “adjacent,” “next to,” “on top of,” “above,” “below,” and “disposed.” Unless explicitly described as being “direct,” when a relationship between first and second elements is described in the above disclosure, that relationship can be a direct relationship where no other intervening elements are present between the first and second elements, but can also be an indirect relationship where one or more intervening elements are present (either spatially or functionally) between the first and second elements. As used herein, the phrase at least one of A, B, and C should be construed to mean a logical (A OR B OR C), using a non-exclusive logical OR, and should not be construed to mean “at least one of A, at least one of B, and at least one of C.”

[0137] In some implementations, a controller is part of a system, which may be part of the above-described examples. Such systems can include semiconductor processingequipment, including a processing tool or tools, chamber or chambers, a platform or platforms for processing, and / or specific processing components (a wafer pedestal, a gas flow system, etc.). These systems may be integrated with electronics for controlling their operation before, during, and after processing of a semiconductor wafer or substrate. The electronics may be referred to as the “controller,” which may control various components or subparts of the system or systems. The controller, depending on the processing requirements and / or the type of system, may be programmed to control any of the processes disclosed herein, including the delivery of processing gases, temperature settings (e.g., heating and / or cooling), pressure settings, vacuum settings, power settings, radio frequency (RF) generator settings, RF matching circuit settings, frequency settings, flow rate settings, fluid delivery settings, positional and operation settings, wafer transfers into and out of a tool and other transfer tools and / or load locks connected to or interfaced with a specific system.

[0138] Broadly speaking, the controller may be defined as electronics having various integrated circuits, logic, memory, and / or software that receive instructions, issue instructions, control operation, enable cleaning operations, enable endpoint measurements, and the like. The integrated circuits may include chips in the form of firmware that store program instructions, digital signal processors (DSPs), chips defined as application specific integrated circuits (ASICs), and / or one or more microprocessors, or microcontrollers that execute program instructions (e.g., software). Program instructions may be instructions communicated to the controller in the form of various individual settings (or program files), defining operational parameters for carrying out a particular process on or for a semiconductor wafer or to a system. The operational parameters may, in some embodiments, be part of a recipe defined by process engineers to accomplish one or more processing steps during the fabrication of one or more layers, materials, metals, oxides, silicon, silicon dioxide, surfaces, circuits, and / or dies of a wafer.

[0139] The controller, in some implementations, may be a part of or coupled to a computer that is integrated with the system, coupled to the system, otherwise networked to the system, or a combination thereof. For example, the controller may be in the “cloud” or all or a part of a fab host computer system, which can allow for remote access of the wafer processing. The computer may enable remote access to the system to monitor current progress of fabrication operations, examine a history of past fabrication operations, examine trends or performance metrics from multiple fabricationoperations, to change parameters of current processing, to set processing steps to follow a current processing, or to start a new process. In some examples, a remote computer (e.g., a server) can provide process recipes to a system over a network, which may include a local network or the Internet. The remote computer may include a user interface that enables entry or programming of parameters and / or settings, which are then communicated to the system from the remote computer. In some examples, the controller receives instructions in the form of data, which specify parameters for each of the processing steps to be performed during one or more operations. It should be understood that the parameters may be specific to the type of process to be performed and the type of tool that the controller is configured to interface with or control. Thus, as described above, the controller may be distributed, such as by including one or more discrete controllers that are networked together and working towards a common purpose, such as the processes and controls described herein. An example of a distributed controller for such purposes would be one or more integrated circuits on a chamber in communication with one or more integrated circuits located remotely (such as at the platform level or as part of a remote computer) that combine to control a process on the chamber.

[0140] Without limitation, example systems may include a plasma etch chamber or module, a deposition chamber or module, a spin-rinse chamber or module, a metal plating chamber or module, a clean chamber or module, a bevel edge etch chamber or module, a physical vapor deposition (PVD) chamber or module, a chemical vapor deposition (CVD) chamber or module, an atomic layer deposition (ALD) chamber or module, an atomic layer etch (ALE) chamber or module, an ion implantation chamber or module, a track chamber or module, and any other semiconductor processing systems that may be associated or used in the fabrication and / or manufacturing of semiconductor wafers.

[0141] As noted above, depending on the process step or steps to be performed by the tool, the controller might communicate with one or more of other tool circuits or modules, other tool components, cluster tools, other tool interfaces, adjacent tools, neighboring tools, tools located throughout a factory, a main computer, another controller, or tools used in material transport that bring containers of wafers to and from tool locations and / or load ports in a semiconductor manufacturing factory.

Claims

CLAIMSWhat is claimed is:1 . An indexing arm for indexing a device within a process chamber, the indexing arm comprising: a first member to at least one of engage with a hub of the process chamber, the hub being disposed between a plurality of substrate processing stations of the process chamber; and a second member extending from the first member and to support the device between a showerhead and a substrate support of one of the plurality of substrate processing stations, the device to measure a gap between the showerhead and the device, wherein the second member, via the hub and the first member, is indexable among the plurality of substrate processing stations.

2. The indexing arm of claim 1 , wherein: the first member comprises a first linearly extending portion and a second linearly extending portion; and the first linearly extending portion extends perpendicular to the second linearly extending portion.

3. The indexing arm of claim 1 , wherein the first member is shaped to be disposed in a notch of the hub, the notch having a bottom surface and a plurality of side surfaces extending upward from the bottom surface.

4. The indexing arm of claim 1 , wherein the second member comprises a plurality of arched members extending from the first member.

5. The indexing arm of claim 1 , wherein the second member comprises a plurality of notches to receive a plurality of tabs extending from the device, each of the notches having a bottom surface and a plurality of side surfaces extending upward from the bottom surface.

6. The indexing arm of claim 5, wherein the plurality of notches extend from a radially inner surface of the second member radially outward to a centerline of the second member.

7. The indexing arm of claim 6, wherein the plurality of notches do not extend to a radially outer surface of the second member.

8. The indexing arm of claim 1 , wherein the second member has: an inner diameter that is greater than an outer diameter of the substrate support; and an outer diameter that is less than an inner diameter of one of the plurality of substrate processing stations.

9. An indexing arm assembly comprising: the indexing arm of claim 1 ; and a plate to extend over the first member and support the first member to the hub.

10. The indexing arm assembly of claim 9, wherein the first member is disposed in a pocket of the hub and held in the pocket of the hub by the plate.11 . The indexing arm assembly of claim 9, wherein the plate is coupled to the hub and prevents the first member from separating from the hub.

12. The indexing arm assembly of claim 9, further comprising a plurality of fasteners extending through the plate and into the hub and fastening the plate to the hub.

13. The indexing arm assembly of claim 12, further comprising a plurality of selftapping inserts screwed into the hub, wherein the plurality of fasteners extend through the plate and are screwed into the self-tapping inserts.

14. A system comprising: the indexing arm assembly of claim 9; the hub; and the device.

15. The system of claim 14, wherein the device comprises a plurality of tabs extending to and being held by the second member of the indexing arm.

16. The system of claim 15, wherein the plurality of tabs are partially disposed respectively in pockets of the second member.

17. A device for measuring gaps between showerheads and substrate supports of a plurality of substrate processing stations, the device comprising: a plurality of sensors, when disposed in one of the plurality of substrate processing stations, to detect distances between one of the showerheads and the plurality of sensors; a sensor holding member to hold the sensors between the showerheads and the substrate supports and be indexed among the plurality of substrate processing stations; and a plurality of tabs extending from the sensor holding member and held by an indexing arm, the indexing arm indexing the device among the plurality of substrate processing stations.

18. The device of claim 17, further comprising a plurality of ribs, wherein the plurality of tabs are held on to the plurality of ribs by at least one of screws and pins.

19. The device of claim 17, wherein the plurality of tabs are welded onto at least one of the sensor holding member and a base of the device.

20. The device of claim 17, wherein the plurality of tabs are adhered to at least one of the sensor holding member and a base of the device.21 . The device of claim 17, wherein the plurality of tabs are integrally formed as part of at least one of the sensor holding member and a base of the device.

22. The device of claim 17, wherein the plurality of sensors are capacitance sensors.

23. The device of claim 17, further comprising: a wireless transceiver; and a controller receiving outputs of the plurality of sensors and wirelessly transmitting via the wireless transceiver the distances between the one of the showerheads and the plurality of sensors.

24. A system comprising: a process chamber comprising a plurality of processing stations, each of the plurality of processing stations comprising a substrate support and a showerhead; a hub disposed between the plurality of processing stations; an device to sense gaps between the showerheads and the device; an indexing arm coupled to the hub and supporting the device; and a motor connected to the hub and indexing the indexing arm with the device among the plurality of processing stations.

25. The system of claim 24, wherein the device senses gaps between the showerhead of one of the plurality of processing stations and the device when the device is disposed between the showerhead of the one of the plurality of processing stations and the substrate support of the one of the plurality of processing stations.

26. The system of claim 24, further comprising a controller to: control operation of the motor to index the device to a first one of the plurality of processing stations; signal the device to measure a gap between the device and the showerhead of the first one of the plurality of processing stations; control operation of the motor to index the device from the first one of the plurality of processing stations to a second one of the plurality of processing stations; and signal the device to measure a gap between the device and the showerhead of the second one of the plurality of processing stations while the device is on the substrate support of the second one of the plurality of processing stations.

27. The system of claim 24, wherein the device comprises a plurality of tabs extending to and held by the indexing arm.

28. A first method comprising: placing an device on a first indexing arm within a process chamber; closing the process chamber; measuring and adjusting a first gap via the device between a showerhead of a first processing station in the process chamber and the device; without opening the process chamber, indexing the first indexing arm with the device from the first processing station to a second processing station; and measuring and adjusting a second gap via the device between a showerhead of the second processing station and the device.

29. The first method of claim 28, further comprising swapping out a second indexing arm for indexing a substrate between the first processing station and the second processing station with the first indexing arm prior to placing the device on the first indexing arm.

30. The first method of claim 28, further comprising: without opening the process chamber, indexing the first indexing arm with the device from the second processing station to a third processing station; measuring and adjusting a third gap via the device between a showerhead of the third processing station and the device; without opening the process chamber, indexing the first indexing arm with the device from the third processing station to a fourth processing station; and measuring and adjusting a fourth gap via the device between a showerhead of the fourth processing station and the device.31 . The first method of claim 30, further comprising: subsequent to measuring the fourth gap, opening the process chamber and removing the device; and swapping out the first indexing arm with a second indexing arm for indexing substrates.

32. A second method comprising: the first method of claim 28; opening the process chamber; removing the device; closing the process chamber; placing a substrate on a substrate support of the first processing station; and processing the substrate in the first processing station based on the measurement of the first gap.

33. The second method of claim 32, further comprising: without opening the process chamber, indexing the substrate from the first processing station to the second processing station; and processing the substrate in the second processing station based on the measurement of the second gap.

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