Component mounting apparatus and component mounting method

Abstract

In this component mounting method, a nozzle is caused to suction a component by shifting from an ideal suction state, the nozzle that has suctioned the component is moved at a plurality of movement speeds or a plurality of movement accelerations, the suction position of the component after the movement is detected, and a parameter relating to at least one of the movement speed or the movement acceleration of the nozzle that has suctioned the component is set on the basis of the suction position of the component after the movement.

Description

Component mounting device and component mounting method

[0001] The present disclosure relates to a component mounting apparatus and a component mounting method that picks up components with a nozzle and mounts them on a board.

[0002] A component mounting device uses a nozzle to vacuum-suck and hold the top surface of a component supplied by a component supply unit, then moves the nozzle above the board, rotates the component in a predetermined direction, and lowers the nozzle to mount the held component on the board. However, for large or heavy components, if the nozzle moving speed is too fast, the nozzle may shift the component pickup position or the component may fall off the nozzle (see, for example, Patent Document 1). Patent Document 1 discloses a method for gradually increasing the nozzle pickup speed, capturing an image of the component held by the nozzle with a parts camera each time the nozzle is raised to detect the component pickup position, and setting the nozzle pickup speed based on the amount of deviation in the pickup position before and after the nozzle movement.

[0003] JP 2014-27227 A

[0004] However, in conventional technologies including Patent Document 1, although it is possible to set the movement speed of the nozzle that holds the component, no consideration is given to variations in the suction state of the nozzle, such as variations in the position where the nozzle picks up the component or variations in the nozzle's vacuum suction force, and there is a risk that malfunctions will occur, such as the component being picked up and held by the nozzle shifting position or the component falling during component mounting work, depending on the suction state of the nozzle, leaving room for further improvement.

[0005] Therefore, an object of the present disclosure is to provide a component mounting device and a component mounting method that can appropriately set the nozzle movement speed and movement acceleration in consideration of variations in the nozzle suction state.

[0006] A component mounting apparatus according to the present disclosure includes a head that picks up a component with a nozzle and moves the nozzle to mount the component on a board, a head movement mechanism that moves the head, a pickup position detection means that detects the pickup position of the component picked up by the nozzle, and a control unit that controls the head, the head movement mechanism, and the pickup position detection means and sets parameters related to at least one of the movement speed or movement acceleration of the nozzle that has picked up the component. The control unit causes the nozzle to pick up the component while shifting it from an ideal pickup state, moves the nozzle that has picked up the component at multiple movement speeds or multiple movement accelerations, and sets the parameters based on the pickup position of the component after the movement.

[0007] The component mounting method disclosed herein is a component mounting method using a component mounting device that moves a nozzle that has picked up a component to mount the component on a board, in which the component is picked up by the nozzle in a state that is deviated from the ideal pickup state, the nozzle that has picked up the component is moved at multiple movement speeds or multiple movement accelerations, the pickup position of the component after the movement is detected, and a parameter related to at least one of the movement speed or movement acceleration of the nozzle that has picked up the component is set based on the pickup position of the component after the movement.

[0008] According to the present disclosure, the nozzle movement speed and movement acceleration can be appropriately set in consideration of variations in the suction state of the nozzles.

[0009] FIG. 1 is a plan view showing the configuration of a component mounting system including a component mounting apparatus according to an embodiment of the present disclosure; FIG. 2 is a side view showing the configuration of a main part of a component mounting apparatus according to an embodiment of the present disclosure; FIG. 3 is a block diagram showing the configuration of a vacuum suction circuit of a head included in a component mounting apparatus according to an embodiment of the present disclosure; FIG. 4 is a block diagram showing the configuration of a control system of a component mounting apparatus according to an embodiment of the present disclosure; FIG. 5 is an explanatory diagram of an example of component data used in a component mounting apparatus according to an embodiment of the present disclosure; FIG. 6 is a diagram showing an example of a component recognition image of a component recognition camera included in a component mounting apparatus according to an embodiment of the present disclosure;

[0010] Hereinafter, with reference to the drawings as appropriate, detailed descriptions will be provided of specific embodiments of a component mounting apparatus and a component mounting method according to the present disclosure. However, more detailed descriptions than necessary may be omitted. For example, detailed descriptions of well-known matters and redundant descriptions of substantially identical configurations may be omitted. This is to avoid unnecessary redundancy in the following description and to facilitate understanding by those skilled in the art. Note that the accompanying drawings and the following description are provided to enable those skilled in the art to fully understand the present disclosure and are not intended to limit the subject matter recited in the claims.

[0011] An embodiment of the present disclosure will be described in detail below with reference to the drawings. The configurations, shapes, and the like described below are merely examples for explanatory purposes and may be modified as appropriate depending on the specifications of the component mounting system, component mounting device, head, and vacuum suction circuit. Corresponding elements in all drawings will be denoted by the same reference numerals, and redundant description will be omitted. In FIG. 1 and in some portions described below, two axes perpendicular to each other in a horizontal plane are shown: an X-axis in the substrate transport direction (the left-right direction in FIG. 1 ), and a Y-axis perpendicular to the substrate transport direction (the up-down direction in FIG. 1 ). In FIG. 2 and in some portions described below, a Z-axis (the up-down direction in FIG. 2 ) is shown as a height direction perpendicular to the horizontal plane.

[0012] First, the configuration of a component mounting system 1 will be described with reference to Fig. 1. Fig. 1 is a plan view showing the configuration of a component mounting system including a component mounting apparatus according to an embodiment of the present disclosure. The component mounting system 1 includes a component mounting apparatus 2 and has the function of mounting components on a board to produce a mounted board. The component mounting apparatus 2 is connected to a management computer 4 via a communication network 3. In addition to a line management function, the management computer 4 has the function of setting parameters used by the component mounting apparatus 2 in the component mounting operation of picking up components with a nozzle and mounting the components on a board, based on data acquired by the component mounting apparatus 2.

[0013] Next, the configuration of the component mounting apparatus 2 will be described with reference to FIGS. 1 to 3. FIG. 2 is a side view showing the configuration of a main part of a component mounting apparatus according to an embodiment of the present disclosure. FIG. 3 is a block diagram showing the configuration of a vacuum suction circuit of a head provided in the component mounting apparatus according to an embodiment of the present disclosure. FIG. 2 also schematically shows a portion of the component mounting apparatus 2 shown in FIG. 1. In FIGS. 1 and 2, the component mounting apparatus 2 has the function of performing a component mounting operation in which components supplied from a component supply unit are mounted on a substrate. A substrate transport mechanism 6 is disposed along the X-axis at the center of the base 5. The substrate transport mechanism 6 transports a substrate P transported from upstream to a mounting operation position, positions it, and holds it. The substrate transport mechanism 6 also transports the substrate P downstream after the component mounting operation has been completed.

[0014] Component supply units 7 are provided on both sides of the board transport mechanism 6 (front and rear directions along the Y axis). Each component supply unit 7 has multiple tape feeders 8 arranged along the X axis. Each tape feeder 8 of the component supply unit 7 pitch-feeds a component tape 20, which has pockets for storing components, in a direction (tape feed direction) from the outside of the component supply unit 7 toward the board transport mechanism 6, thereby supplying components to a component supply position from which the components are picked up by a head 13, which will be described below. One of the component supply units 7 is also equipped with a tray feeder 9, which supplies multiple trays 10 containing components D, such as large components and connectors, to the component supply position.

[0015] 1 and 2, a Y-axis table 11 equipped with a linear drive mechanism is arranged along the Y-axis on both ends of the X-axis on the upper surface of the base 5. A beam 12 similarly equipped with a linear drive mechanism is connected to the Y-axis table 11 so as to be movable along the Y-axis. The beam 12 is arranged along the X-axis. A head 13 is attached to the beam 12 via a plate 12a so as to be movable along the X-axis.

[0016] 2 and 3 , the head 13 includes a plurality of component mounting units 14. A nozzle holder 14a is provided at the bottom of each component mounting unit 14 to which a nozzle 15 is attached, which vacuum-sucks and holds a component D. Each component mounting unit 14 includes a motor 14b that raises and lowers the nozzle holder 14a along the Z axis and rotates it in the θ direction around the axis of the nozzle 15, and a vacuum suction circuit 14c that supplies vacuum pressure (negative pressure) to the nozzle 15 attached to the nozzle holder 14a. The vacuum suction circuit 14c includes a vacuum valve 23 and a flow sensor 24. A vacuum pressure generated by a vacuum suction source 25 is supplied to the vacuum suction circuit 14c via a suction force changing unit 26 having a flow control valve.

[0017] 3, when the vacuum valve 23 is opened while the vacuum suction source 25 is driven, the nozzle 15 attached to the nozzle holder 14a is connected to the vacuum suction source 25 via the suction force change unit 26, and vacuum suction is performed through suction holes provided on the suction surface at the bottom end of the nozzle 15. The nozzle holder 14a has a built-in filter 27, and as the air sucked through the nozzle 15 passes through the filter 27, foreign matter sucked in along with the air during vacuum suction is collected by the filter 27.

[0018] The flow rate sensor 24 is disposed between the vacuum valve 23 and the suction force changing unit 26, and measures the flow rate of air sucked through the nozzle 15 attached to the nozzle holder 14a and passing through the vacuum suction circuit 14c. The suction force changing unit 26 adjusts the pressure regulation valve to change the flow rate of air sucked through the nozzle 15, thereby changing the suction force with which the nozzle 15 vacuum-sucks the component D.

[0019] 1, the Y-axis table 11 and the beam 12 constitute a head moving mechanism 16 that moves the head 13 along the X-axis and the Y-axis. The head moving mechanism 16 and the head 13 perform a mounting turn in which a component D is vacuum-sucked and removed from a tape feeder 8 or a tray feeder 9 arranged in the component supply unit 7 by a nozzle 15 attached to the head 13, and the component D is mounted at a mounting position on the board P positioned by the board transport mechanism 6. In this way, the head 13 sucks the component D with the nozzle 15 and moves the nozzle 15 to mount the component D on the board P.

[0020] 1 and 2, a component recognition camera 17 is disposed between the component supply unit 7 and the board transport mechanism 6. When the head 13, which has picked up a component D from the component supply unit 7, moves above the component recognition camera 17, the component recognition camera 17 captures an image of the component D held by the head 13 and recognizes the holding posture (suction position) of the component D. A head camera 18 is attached to the plate 12a to which the head 13 is attached. The head camera 18 moves integrally with the head 13.

[0021] As head 13 moves, head camera 18 moves above board P positioned on board transport mechanism 6, and captures an image of a board mark (not shown) provided on board P to recognize the position of board P. When head 13 mounts components on board P, the mounting position is corrected taking into account the recognition results of components D by component recognition camera 17 and the recognition results of the board position by head camera 18.

[0022] 2, a carriage 19 with a number of tape feeders 8 already attached to the top of the component supply unit 7 is set. The carriage 19 holds a reel 21 that stores a wound component tape 20 holding components D. The component tape 20 is pulled out from the reel 21 and is pitch-fed by the tape feeders 8 to the component supply position.

[0023] 1, a touch panel 22 operated by the worker is installed at the position where the worker works in front of the component mounting device 2. The touch panel 22 displays various information on its display unit, and the worker inputs data and operates the component mounting device 2 using operation buttons and the like displayed on the display unit.

[0024] Next, the configuration of the control system of the component mounting apparatus 2 will be described with reference to FIG. 4 . FIG. 4 is a block diagram showing the configuration of the control system of a component mounting apparatus according to an embodiment of the present disclosure. The following description will focus on the function of setting parameters related to the moving speed or moving acceleration of the nozzle 15 that picks up the component D during component mounting work. The component mounting apparatus 2 includes a control device 30, a substrate conveying mechanism 6, a tape feeder 8, a tray feeder 9, a head 13, a head moving mechanism 16, a component recognition camera 17, a head camera 18, a touch panel 22, and a suction force changing unit 26. The head 13 includes a plurality of component mounting units 14 each including a motor 14 b, a vacuum valve 23, and a flow sensor 24.

[0025] The control device 30 includes a storage unit 31, a mounting control unit 32, a parameter setting processing unit 33, and a pickup position detection processing unit 34. The storage unit 31 is a storage device that stores mounting data 35, component data 36, ​​tolerance data 37, pickup position data 38, and the like. The mounting data 35 stores, for each type of mounting board, information identifying the component D to be mounted on the board P (component number), the mounting position (XY coordinates) of the component D on the board P, and other information. The component data 36 stores, for each type of component D, information such as the size of the component D, information related to the nozzle 15 that picks up the component D, and control parameters for the component mounting operation.

[0026] An example of component data 36 will now be described with reference to FIG. 5 . FIG. 5 is an explanatory diagram of an example of component data used in a component mounting apparatus according to an embodiment of the present disclosure. The component data 36 includes, for each component number 40, a component shape 41, a component size (length 42, width 43, height 44), a corresponding nozzle number 45, a movement speed parameter 46, and a movement acceleration parameter 47. The component shape 41 is information specifying the shape of the component D, such as a chip component (chip), a large component (large), a shield case (case), or a socket. The movement speed parameters 46 (46x, 46y, 46z, 46θ) and the movement acceleration parameters 47 (47x, 47y, 47z, 47θ) define the movement speed and movement acceleration when moving the nozzle 15 that has picked up the component D, and the parameters for the X-axis direction, Y-axis direction, Z-axis direction, and θ-axis direction are defined, respectively.

[0027] In this example, the moving speed parameter 46 and the moving acceleration parameter 47 are defined as seven levels ranging from "1" to "7." "1" indicates the minimum moving speed and moving acceleration, and "7" indicates the maximum moving speed and moving acceleration. For example, component D, whose component number 40 is "D01," is a chip component, and is set to the maximum moving speed (7) and moving acceleration (7). A large component (D02) and a socket (D04) that are heavy and have a large inertia force are set to a moving acceleration that is smaller than that of the chip component (D01). Furthermore, a case (D03) and a socket (D04) that are large in component size and have a large air resistance during movement are set to a moving speed that is smaller than that of the chip component (D01). Note that the moving speed parameter 46 and the moving acceleration parameter 47 may be defined by a numerical value in addition to being defined by a level (division).

[0028] In Figure 4, the mounting control unit 32 moves the head 13 using the head moving mechanism 16 based on the mounting data 35 and component data 36, ​​and raises and lowers the nozzle 15 attached to the component mounting unit 14 of the head 13 to pick up the component D supplied by the tape feeder 8 or tray feeder 9 of the component supply unit 7 and mount it at the mounting position on the substrate P, thereby performing the component mounting work.

[0029] The pickup position detection processing unit 34 recognizes and processes the image of the component D picked up by the nozzle 15, captured by the component recognition camera 17, to detect the pickup position of the component D picked up by the nozzle 15. Information about the detected pickup position is stored in the storage unit 31 as pickup position data 38. In this way, the component recognition camera 17 is an imaging unit that captures the image of the component D picked up by the nozzle 15. The component recognition camera 17 (imaging unit) and the pickup position detection processing unit 34 together constitute a pickup position detection means 39 that detects the pickup position of the component D picked up by the nozzle 15.

[0030] Here, the suction position detected by the suction position detection unit 39 will be described with reference to FIG. 6 . FIG. 6 is a diagram illustrating an example of a component recognition image captured by a component recognition camera included in a component mounting device according to an embodiment of the present disclosure. FIG. 6 illustrates an example of a captured image 17a captured by the component recognition camera 17 of a component D picked up by the nozzle 15. The captured image 17a displays a center line 17x in the X-axis direction and a center line 17y in the Y-axis direction superimposed on each other. The intersection of the center line 17x in the X-axis direction and the center line 17y in the Y-axis direction is the center 17c of the captured image 17a. The captured image 17a is captured while the head 13 is moved so that the nozzle center 15c of the nozzle 15 picking up the component D is the center of the component recognition camera 17. As a result, the center 17c of the captured image 17a is the suction position Q (nozzle center 15c) of the component D picked up by the nozzle 15.

[0031] The pickup position detection processor 34 extracts the component center Dc, which is the center position of the component D, by performing a recognition process on the captured image 17a. Furthermore, the pickup position detection processor 34 calculates the amount of deviation (-ΔX) in the X-axis direction and the amount of deviation (-ΔY) in the Y-axis direction of the component center Dc, with the center 17c of the captured image 17a (the nozzle center 15c of the nozzle 15) as the origin. Furthermore, the pickup position detection processor 34 calculates the amount of deviation (-Δθ) in the θ-axis direction from the inclination of the outer periphery of the component D. The pickup position detection processor 34 then calculates the pickup position Q (ΔX, ΔY, Δθ) of the component D picked up by the nozzle 15 from the calculated deviation, with the component center Dc as the origin, and stores this as pickup position data 38. Hereinafter, the position of the component center Dc of the component D will be described as the ideal pickup position Q0 for the nozzle 15 to pick up the component (the target position for the nozzle 15 to pick up the component D in a component mounting operation).

[0032] In Figure 4, a parameter setting processing unit 33 provided in the control device 30 (control unit) controls the head 13, head moving mechanism 16, suction force changing unit 26, and suction position detection means 39, determines parameters (movement speed parameter 46, movement acceleration parameter 47) related to at least one of the movement speed or movement acceleration of the nozzle 15 that has sucked up the component D, and executes a parameter setting process to set (change) the parameters in the component data 36 of the corresponding component D.

[0033] Specifically, the parameter setting processing unit 33 causes the nozzle 15 to pick up the component D by shifting the ideal pickup position Q0 (component center Dc) of the component D from the ideal pickup state in which the nozzle 15 picks up the component D with the initially set suction force, moves the nozzle 15 that has picked up the component D at multiple movement speeds or multiple movement accelerations in either the horizontal direction (X-axis direction, Y-axis direction), the up-down direction (Z-axis direction), or the rotational direction around the axis of the nozzle 15 (θ direction), and sets parameters based on the pickup position Q of the component after the movement.

[0034] 4, tolerance data 37 stores data related to tolerances referenced by parameter setting processing unit 33 in the parameter setting process. For example, tolerance data 37 includes a tolerance mounting position range within which the mounting position at which nozzle 15 mounts component D on board P is allowed to deviate from the ideal mounting position in a component mounting operation in which nozzle 15 picks up component D and mounts it on board P.

[0035] The tolerance data 37 also includes an allowable pickup position range in which the pickup position Q of the nozzle 15 that has picked up the component D is allowed to deviate from the ideal pickup position Q0 during component mounting work. The tolerance data 37 also includes an allowable suction force range in which the suction force of the nozzle 15 that has picked up the component D (the flow rate of air sucked from the nozzle 15 that is not picking up the component D) is allowed to decrease during component mounting work.

[0036] 4, the parameter setting processing unit 33 controls the suction force changing unit 26 to reduce the suction force from the initially set suction force within the allowable suction force range (tolerable range) and cause the nozzle 15 to pick up the component D, thereby creating a state deviated from the ideal suction state. The parameter setting processing unit 33 also controls the head moving mechanism 16 to cause the nozzle 15 to pick up the component D, aiming at a suction position Q that is deviated from the ideal suction position Q0 within the allowable suction position range (tolerable range), thereby creating a state deviated from the ideal suction state.

[0037] The parameter setting processing unit 33 also controls the suction force changing unit 26 to reduce the suction force from the initially set suction force within the allowable suction force range, and further controls the head moving mechanism 16 to have the nozzle 15 suction the component D at a target suction position Q that is shifted from the ideal suction position Q0 within the allowable suction position range, thereby creating a state shifted from the ideal suction state.

[0038] 4, the parameter setting processing unit 33 moves the nozzle 15, which has picked up the component D while shifting it from the ideal pickup state, at each of a plurality of movement speeds or a plurality of movement accelerations, detects the pickup position Q after each movement, and calculates a pickup position difference ΔQ, which is the difference between the pickup position Q after the movement and the initial pickup position Q. The parameter setting processing unit 33 then determines whether the pickup position difference ΔQ is equal to or greater than a predetermined value, and sets parameters (movement speed parameter 46, movement acceleration parameter 47) based on the maximum movement speed or maximum movement acceleration among the plurality of movement speeds or movement accelerations that is determined to result in a pickup position difference ΔQ that is not equal to or greater than the predetermined value. The predetermined value may be the maximum value of the allowable placement position range (the maximum range within which the placement position at which the nozzle 15 places the component D on the board P is allowed to deviate from the ideal placement position).

[0039] Based on the parameters set in the mounting data 35 and the component data 36, ​​the mounting control unit 32 of the control device 30 executes a component mounting operation in which the nozzle 15 picks up the component D and mounts it on the board P. In the example described above, the mounting control unit 32 moves the nozzle 15 so that the movement speed and movement acceleration of the nozzle 15 that has picked up the component D do not exceed the movement speed and movement acceleration specified by the movement speed parameter 46 and movement acceleration parameter 47 of the component data 36.

[0040] Here, we will explain the technical significance of using the maximum value of the allowable mounting position range as the predetermined value when setting the parameters. The amount of deviation of the pickup position Q from the ideal pickup position Q0 when the nozzle 15 picks up a component D from the tape feeder 8 or tray feeder 9 is calculated based on the pickup position Q detected by the pickup position detection means 39 (component recognition camera 17), and is corrected when the component D is mounted on the board P.

[0041] On the other hand, after the pickup position Q is detected, the pickup position difference ΔQ that occurs while the nozzle 15 moves from above the component recognition camera 17 to the mounting position on the board P is not corrected, and the pickup position difference ΔQ becomes a mounting position deviation. Therefore, by setting the predetermined value when setting the parameters to the maximum value of the allowable mounting position range, the pickup position difference ΔQ that occurs due to movement after the pickup position Q is detected by the pickup position detection means 39 will not exceed the allowable mounting position range. Therefore, even if the pickup position difference ΔQ occurs during movement, it is guaranteed that the amount of mounting position deviation of the component D mounted on the board P will not exceed the allowable mounting position range.

[0042] Here, an example of a path along which the parameter setting processing unit 33 moves the nozzle 15 that has picked up the component D during the parameter setting process will be described with reference to FIG. 7 . FIG. 7 is an explanatory diagram of the nozzle movement path during the parameter setting process of the component mounting device according to an embodiment of the present disclosure. During the parameter setting process, when the nozzle 15 that has picked up the component D is moved at a set movement speed and movement acceleration (hereinafter referred to as the "measurement movement speed, etc."), the nozzle 15 is moved above the substrate P held at the mounting operation position of the substrate transport mechanism 6 so that the component D that has detached from the nozzle 15 during movement does not fall onto the component recognition camera 17 or into the component mounting device 2. FIG. 7 shows an example in which the nozzle 15 is moved (arrow a3) in the positive X-axis direction (a direction from upstream to downstream) at the measurement movement speed, etc.

[0043] First, the parameter setting processor 33 causes the nozzle 15 to pick up a component D on the tray 10 of the tray feeder 9. Next, the parameter setting processor 33 moves the nozzle 15 from above the tray 10 to above the component recognition camera 17 at a speed and acceleration (hereinafter referred to as the "non-measurement speed, etc.") that are smaller than the minimum movement speed and minimum movement acceleration defined by the movement speed parameter 46 and the movement acceleration parameter 47 (arrow a1). When the nozzle 15 moves at the non-measurement speed, etc., there is little chance that the component D will detach from the nozzle 15. Next, the parameter setting processor 33 causes the pickup position detector 39 to detect the initial pickup position Q. Next, the parameter setting processor 33 moves the nozzle 15 above the substrate P at the non-measurement speed, etc. (arrow a2).

[0044] 7, the parameter setting processing unit 33 then moves the nozzle 15 from upstream to downstream along the X-axis at the measurement speed or the like (arrow a3). The parameter setting processing unit 33 then moves the nozzle 15 above the component recognition camera 17 at the non-measurement speed or the like (arrow a4). The parameter setting processing unit 33 then causes the suction position detection means 39 to detect the suction position Q after movement. Similarly, the parameter setting processing unit 33 moves the nozzle 15, which has suctioned the component D, above the board P in the horizontal direction (X-axis direction, Y-axis direction), the up-down direction (Z-axis direction), and the θ direction (rotational direction around the nozzle axis) at the measurement speed or the like.

[0045] In this way, the parameter setting processing unit 33 of the control device 30 (control unit) moves the nozzle 15 that has picked up the component D at a measurement speed or the like (a set movement speed or movement acceleration) (arrow a3) at a position (above the substrate P) away from the component recognition camera 17 (imaging unit), and moves the nozzle 15 at a non-measurement speed or the like (a speed or acceleration lower than the movement speed) between the component recognition camera 17 and a position (above the substrate P) away from the component recognition camera 17 (arrows a2 and a4). Note that the area where the nozzle 15 is moved at the measurement speed or the like is not limited to above the substrate P, and may be any area where no problems will occur even if the component D picked up by the nozzle 15 falls. Also, a mat may be attached to the substrate P to prevent damage to the dropped component D.

[0046] Next, referring to FIG. 8 , an example of the results will be described in which the parameter setting processing unit 33 causes the nozzle 15 to pick up a component D, targeting a pickup position Q shifted from the ideal pickup position Q0, and then measures the pickup position Q after the movement while gradually increasing the movement speed Vx in the X-axis direction. FIG. 8 is an explanatory diagram of the relationship between the nozzle movement speed and the pickup position deviation amount in the parameter setting processing of a component mounting device according to an embodiment of the present disclosure. In this example, the nozzle 15 picks up a component D, targeting three pickup positions Q (ΔX1, ΔX2, ΔX3) between the ideal pickup position Q0 (ΔX is "0") and the maximum allowable pickup deviation amount ΔX.max within the allowable pickup position range. The nozzle 15 is then moved while increasing the measurement movement speed, etc., in seven stages between the minimum movement speed Vx1, Vx.min, and the maximum movement speed Vx7, Vx.max, and the pickup position Q after the movement is detected.

[0047] At the pickup position Q (ΔX1) close to the ideal pickup position Q0, the pickup position difference ΔQ between the initial pickup position Q (ΔX1) and the pickup position Q after movement is smaller than the allowable mounting deviation (prescribed value), which is the maximum value of the allowable mounting position range, even when the measurement movement speed, etc. is the maximum movement speed Vx7. At the intermediate pickup position Q (ΔX2), the pickup position difference ΔQ exceeds the allowable mounting deviation when the measurement movement speed, etc. is the movement speed Vx6. Furthermore, at the pickup position Q (ΔX3) with the greatest deviation from the ideal pickup position Q0, the pickup position difference ΔQ exceeds the allowable mounting deviation when the measurement movement speed, etc. is the movement speed Vx5. In this way, when the deviation of the pickup position Q from the ideal pickup position Q0 becomes large, the pickup position difference ΔQ exceeds the allowable mounting deviation (prescribed value) even when the measurement movement speed, etc. is small.

[0048] Next, referring to FIG. 9 , an example of the results will be described in which the parameter setting processing unit 33 causes the nozzle 15 to pick up a component D at suction forces F1 and F2, which are reduced from the initially set suction force F0, and then measures the pickup position Q after the movement while gradually increasing the movement speed Vx in the X-axis direction. FIG. 9 is an explanatory diagram of the relationship between the nozzle movement speed and suction force in the parameter setting process of a component mounting device according to an embodiment of the present disclosure. In this example, the nozzle 15 picks up a component D at two suction forces F1 and F2 between the initially set suction force F0 and the allowable suction force, which is the minimum value of the allowable suction force range, with the aim of achieving the ideal pickup position Q0. The nozzle 15 is then moved while the measurement movement speed, etc., is increased in seven stages between the minimum movement speed Vx1 (Vx.min) and the maximum movement speed Vx7 (Vx.max), and the pickup position Q after the movement is detected.

[0049] With the initially set attracting force F0, even when the measurement movement speed etc. is the maximum movement speed Vx7, the attracting position difference ΔQ between the initial attracting position Q(0) and the attracting position Q after movement is smaller than the allowable mounting deviation amount (prescribed value), which is the maximum value of the allowable mounting position range. With the attracting force F1, which is smaller than the initially set attracting force F0, the attracting position difference ΔQ exceeds the allowable mounting deviation amount when the measurement movement speed etc. is movement speed Vx6. Furthermore, with the attracting force F2, which is smaller than the attracting force F1, the attracting position difference ΔQ exceeds the allowable mounting deviation amount when the measurement movement speed etc. is movement speed Vx5. In this way, when the attracting force is smaller than the initially set attracting force F0, the attracting position difference ΔQ exceeds the allowable mounting deviation amount (prescribed value) even at a small measurement movement speed etc.

[0050] Next, a component mounting method by the component mounting apparatus 2 will be described with reference to the flow chart of FIG. 10 . FIG. 10 is a flow chart of a component mounting method according to an embodiment of the present disclosure. Here, an example of setting a parameter for the movement speed Vx in the X-axis direction (movement speed parameter 46x) will be described. First, the parameter setting processing unit 33 controls the suction force changing unit 26 to reduce the suction force from the initially set suction force F0 (ST1: suction force setting step). Next, the parameter setting processing unit 33 controls the head moving mechanism 16 to pick up a component D supplied by the tray feeder 9 onto the nozzle 15, aiming for a suction position Q shifted from the ideal suction position Q0 (ST2: component suction step).

[0051] As a result, the component D picked up by the nozzle 15 is deviated from its ideal pickup state. That is, the suction force setting step (ST1) and the component pickup step (ST2) cause the component D to be picked up by the nozzle 15 in a state deviated from its ideal pickup state. Note that the suction force F may be set to the initially set suction force F0 in the suction force setting step (ST1), and the target pickup position Q may be deviated from the ideal pickup position Q0 in the component pickup step (ST2). Alternatively, the suction force F may be set to suction forces F1 and F2, which are obtained by reducing the initially set suction force F0, in the suction force setting step (ST1), and the target pickup position Q may be set to the ideal pickup position Q0 in the component pickup step (ST2).

[0052] 10 , the parameter setting processing unit 33 then controls the head moving mechanism 16 to move the nozzle 15 above the component recognition camera 17 (recognition unit) (arrow a1 in FIG. 7 ), and causes the pickup position detection means 39 to detect the initial pickup position Q (ST3: initial pickup position detection step). The parameter setting processing unit 33 then sets the movement speed parameter 46x to "1," which is the minimum movement speed Vx1 (first speed) (ST4: minimum setting step). The parameter setting processing unit 33 then moves the nozzle 15 in the X-axis direction at the set movement speed Vx1 (ST5: movement step) (arrow a3 in FIG. 7 ).

[0053] Next, the parameter setting processing unit 33 controls the head moving mechanism 16 to move the nozzle 15 above the component recognition camera 17 (recognition unit) (arrow a4 in FIG. 7 ), and causes the pickup position detection means 39 to detect the pickup position Q after the movement (ST6: pickup position detection step after movement). Next, the parameter setting processing unit 33 calculates a pickup position difference ΔQ, which is the difference between the pickup position Q after the movement and the initial pickup position Q, and determines whether the pickup position difference ΔQ is equal to or greater than a predetermined value (for example, the maximum value of the allowable mounting position range) (ST7: determination step).

[0054] In FIG. 10, if the suction position difference ΔQ is not equal to or greater than a predetermined value (No in ST7), and if the movement speed parameter 46x is not the maximum value of “7” (No in ST8), the parameter setting processing unit 33 sets (changes) the movement speed parameter 46x to “2,” which is one step larger, that is, movement speed Vx2 (second speed) (ST9: setting change process).

[0055] Next, a second movement process (ST5) and a second post-movement adsorption position detection process (ST6) are executed, and if the adsorption position difference ΔQ is not equal to or greater than a predetermined value (No in ST7) and the movement speed parameter 46x is not the maximum value of "7" (No in ST8), the movement speed parameter 46x is set to "3", which is an even larger movement speed Vx3 (third speed) (ST9).

[0056] Similarly, the setting change step (ST9), movement step (ST5), post-movement pickup position detection step (ST6), and judgment step (ST7) are repeatedly executed, and if the pickup position difference ΔQ is not equal to or greater than the predetermined value (No in ST7) but the movement speed parameter 46x is the maximum value of "7" (Yes in ST8), the parameter setting processor 33 sets the movement speed parameter 46x to "7", which is the maximum movement speed Vx7 that has been set (ST10: maximum parameter setting step). Next, the parameter setting processor 33 returns the component D that was picked up by the nozzle 15 to its original position in the tray feeder 9 (ST11: component returning step).

[0057] 10 , if the pickup position difference ΔQ is equal to or greater than a predetermined value (Yes in ST7) and if the movement speed parameter 46x is the minimum value of "1" (Yes in ST12), the parameter setting processing unit 33 causes the touch panel 22 to notify the user that "the pickup position difference ΔQ is equal to or greater than the predetermined value even at the minimum movement speed Vx1" (ST13: notification step). Possible cases in which the pickup position difference ΔQ is equal to or greater than the predetermined value when moving at the minimum movement speed Vx1 include when the type of nozzle 15 is not suitable for the type of component D to be picked up, or when the nozzle 15 is inappropriately designed or manufactured.

[0058] In this way, the touch panel 22 is a notification unit that issues a notification when it is determined that the difference (suction position difference ΔQ) when the nozzle 15 is moved at the smallest speed (movement speed Vx1) of the multiple movement speeds Vx1 to Vx7 (or the smallest acceleration of the multiple movement accelerations) is equal to or greater than a predetermined value (Yes in ST7). Note that the notification unit that issues the notification is not limited to the touch panel 22 of the component mounting device 2, and may be a display device of the management computer 4 or an information terminal carried by the worker.

[0059] 10 , if the movement speed parameter 46x is not the minimum value of "1" (No in ST12), the parameter setting processing unit 33 sets the movement speed parameter 46x to a movement speed Vx that is one step lower than the previously set movement speed parameter 46x (ST14: one-step lower parameter setting step). For example, if it is determined that the pickup position difference ΔQ is equal to or greater than a predetermined value when the component is moved at a movement speed Vx6 (the movement speed parameter 46x is "6") (Yes in ST7), the movement speed parameter 46x is set to "5" in the one-step lower parameter setting step (ST14) so ​​that the movement speed parameter 46x becomes a movement speed Vx5 that is one step lower. Next, the part returning step (ST11) is executed.

[0060] In this way, the parameter setting processing unit 33 moves the nozzle 15, which has adsorbed the component D in a state deviated from the ideal adsorption state (ST1, ST2), at a first speed (movement speed Vx1) among the plurality of moving speeds Vx1 to Vx7 (or a first acceleration among the plurality of moving accelerations) (first ST5), and if it determines that the difference (adsorption movement difference ΔQ) is not equal to or greater than a predetermined value (No in ST7), moves the nozzle 15 at a second speed (movement speed Vx2) that is greater than the first speed among the plurality of moving speeds Vx1 to Vx7 (or a second acceleration that is greater than the first acceleration among the plurality of moving accelerations) (second ST5).

[0061] Then, the parameter setting processing unit 33 moves the nozzle 15, which has picked up the component D while shifting it from the ideal pick-up state, at multiple movement speeds Vx1 to Vx7 (or multiple movement accelerations), detects the pick-up position Q after each movement (ST6), calculates the difference between the pick-up position Q after the movement and the initial pick-up position Q (pick-up position difference ΔQ), and determines whether the difference is equal to or greater than a predetermined value (ST7), and sets parameters based on the maximum movement speed (or maximum movement acceleration) among the multiple movement speeds Vx1 to Vx7 (or multiple movement accelerations) for which it is determined that the difference is not equal to or greater than the predetermined value (ST10, ST14).

[0062] Furthermore, the component mounting method by component mounting apparatus 2 of this embodiment involves causing nozzle 15 to pick up component D in a state that is different from the ideal suction state (ST1, ST2), moving nozzle 15 that has picked up component D at multiple movement speeds or multiple movement accelerations (ST5), detecting pickup position Q of component D after movement (ST6), and setting parameters (movement speed parameter 46, movement acceleration parameter 47) related to at least one of the movement speed or movement acceleration of nozzle 15 that has picked up component D based on pickup position Q of component D after movement (ST10, ST14). This makes it possible to appropriately set the movement speed and movement acceleration of nozzle 15 in consideration of variations in the suction state of nozzle 15.

[0063] Although the above describes an example of setting the parameter for the movement speed Vx in the X-axis direction (movement speed parameter 46x), the other movement speed parameters 46y, 46z, 46θ and movement acceleration parameters 47x, 47y, 47z, 47θ are set in the same manner, and detailed explanations will be omitted.

[0064] As described above, the component mounting device 2 in this mounting form includes a head 13 that picks up a component D with a nozzle 15 and moves the nozzle 15 to mount the component D on a substrate P, a head moving mechanism 16 that moves the head 13, a pick-up position detection means 39 that detects the pick-up position Q of the component D picked up by the nozzle 15, and a control unit (control device 30) that controls the head 13, the head moving mechanism 16, and the pick-up position detection means 39, and sets parameters (a moving speed parameter 46, a moving acceleration parameter 47) related to at least one of the moving speed or moving acceleration of the nozzle 15 that has picked up the component D.

[0065] The control unit then causes the nozzle 15 to pick up the component D in a state that is different from the ideal suction state, moves the nozzle 15 that has picked up the component D at multiple speeds or multiple accelerations, and sets parameters based on the pickup position Q of the component D after movement. This makes it possible to appropriately set the speed and acceleration of movement of the nozzle 15, taking into account variations in the suction state of the nozzle 15.

[0066] Although the above description has been given of an example in which the component mounting device 2 sets the movement speed parameter 46 and the movement acceleration parameter 47 included in the component data 36 based on the pickup position data 38, the present embodiment is not limited to this. For example, the component mounting device 2 may transmit the acquired pickup position data 38 to the management computer 4, and the management computer 4 may set the movement speed parameter 46 and the movement acceleration parameter 47 included in the component data 36 and transmit them to the component mounting device 2.

[0067] Although the embodiments of the present disclosure have been described above with reference to the drawings, it goes without saying that the present disclosure is not limited to such examples. It is clear that a person skilled in the art can conceive of various modifications, alterations, substitutions, additions, deletions, and equivalents within the scope of the claims, and it is understood that these also naturally fall within the technical scope of the present disclosure. Furthermore, the components of the above-described embodiments may be combined in any manner as long as they do not deviate from the spirit of the invention.

[0068] The component mounting device and component mounting method disclosed herein have the advantage of being able to appropriately set the nozzle movement speed and movement acceleration taking into account variations in the nozzle suction state, and are useful in fields where components are mounted on substrates.

[0069] 2 Component mounting device 13 Head 15 Nozzle 16 Head moving mechanism 17 Component recognition camera (imaging unit) 22 Touch panel (notification unit) 39 Pickup position detection means D Component P Board Q Pickup position Q0 Ideal pickup position Vx1 to Vx7 Movement speed ΔQ Pickup position difference (difference)

Claims

1. A component mounting device comprising: a head that picks up a component with a nozzle and moves the nozzle to mount the component on a board; a head movement mechanism that moves the head; a pickup position detection means that detects the pickup position of the component picked up by the nozzle; and a control unit that controls the head, the head movement mechanism, and the pickup position detection means, and sets parameters related to at least one of the movement speed or movement acceleration of the nozzle that has picked up the component, wherein the control unit causes the nozzle to pick up the component by shifting it from an ideal pickup state, moves the nozzle that has picked up the component at multiple movement speeds or multiple movement accelerations, and sets the parameters based on the pickup position of the component after the movement.

2. The component mounting device according to claim 1, wherein the ideal suction state is a state in which the nozzle picks up the component at an ideal suction position with an initially set suction force.

3. The component mounting device according to claim 1 or 2, wherein the control unit: moves the nozzle that has picked up the component at a position deviated from the ideal pickup state at the plurality of movement speeds or the plurality of movement accelerations; causes the pickup position detection means to detect the pickup position after the movement at each of the plurality of movement speeds or each of the plurality of movement accelerations; calculates the difference between the pickup position after the movement and the initial pickup position; determines whether the difference is equal to or greater than a predetermined value; and sets the parameter based on the maximum movement speed or maximum movement acceleration among the plurality of movement speeds or the plurality of movement accelerations at which it is determined that the difference is not equal to or greater than the predetermined value.

4. The component mounting device described in claim 3, wherein the control unit moves the nozzle at a first speed among the plurality of movement speeds or a first acceleration among the plurality of movement accelerations, and when it determines that the difference is not greater than the predetermined value, moves the nozzle at a second speed among the plurality of movement speeds that is greater than the first speed or a second acceleration among the plurality of movement accelerations that is greater than the first acceleration.

5. A component mounting device as described in claim 3, further comprising an alarm unit that issues an alarm if the difference when the nozzle is moved at the smallest speed among the plurality of movement speeds or the smallest acceleration among the plurality of movement accelerations is equal to or greater than the predetermined value.

6. The component mounting device according to claim 3, wherein the control unit calculates the difference by moving the nozzle that has adsorbed the component at the moving speed or the moving acceleration in either a horizontal direction, a vertical direction, or a rotational direction around the axis of the nozzle.

7. The component mounting device of claim 3, wherein the predetermined value is the maximum range within which the mounting position of the component mounted by the nozzle on the board is allowed to deviate from the ideal mounting position when the component is picked up by the nozzle and mounted on the board.

8. A component mounting device as described in claim 1, wherein the suction position detection means includes an imaging unit that images the component picked up by the nozzle, and the control unit moves the nozzle that has picked up the component at a position away from the imaging unit at each of the plurality of movement speeds or each of the plurality of movement accelerations, and moves the nozzle between the imaging unit and the position away from the component at a speed smaller than the movement speed or at an acceleration smaller than the movement acceleration.

9. The component mounting device according to claim 1, wherein the control unit causes the head to perform the operation of picking up the component with the nozzle and mounting it on the board based on the set parameters.

10. The component mounting device of claim 2, wherein the control unit controls the head moving mechanism to have the nozzle pick up the component at a target pick-up position that is shifted from the ideal pick-up position within an allowable range, thereby causing the nozzle to pick up the component in a state that is shifted from the ideal pick-up state.

11. A component mounting device as described in claim 2, further comprising an adsorption force changing unit controlled by the control unit to change the adsorption force with which the nozzle adsorbs the component, wherein the control unit controls the adsorption force changing unit to reduce the adsorption force from the initially set adsorption force within an allowable range and cause the nozzle to adsorb the component, thereby causing the nozzle to adsorb the component in a state that is different from the ideal adsorption state.

12. A component mounting device as described in claim 2, further comprising an adsorption force changing unit controlled by the control unit to change the adsorption force with which the nozzle adsorbs the component, wherein the control unit controls the adsorption force changing unit to reduce the adsorption force within an allowable range from the initially set adsorption force, and controls the head moving mechanism to have the nozzle adsorb the component at a target adsorption position that is shifted from the ideal adsorption position within an allowable range, thereby causing the nozzle to adsorb the component in a state that is shifted from the ideal adsorption position.

13. A component mounting method using a component mounting device that moves a nozzle that has picked up a component to mount the component on a board, comprising: picking up the component to the nozzle in a state that is deviated from the ideal pickup state; moving the nozzle that has picked up the component at multiple movement speeds or multiple movement accelerations; detecting the pickup position of the component after the movement; and setting parameters related to at least one of the movement speed or movement acceleration of the nozzle that has picked up the component based on the pickup position of the component after the movement.

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