Laser, laser light source, and laser projection device

Abstract

Provided are a laser, a laser light source, and a laser projection device. The laser comprises a bottom plate, a package shell, a light-emitting part, and a temperature measuring part. An accommodating space is formed between the package shell and the bottom plate. The light-emitting part comprises at least one first light-emitting chip, and the at least one first light-emitting chip is arranged in the accommodating space and is capable of emitting light beams in at least one color. The temperature measuring part is located in the accommodating space and arranged on the bottom plate, and the temperature measuring part is capable of acquiring the temperature in the accommodating space.

Description

Lasers, laser light sources and laser projection equipment

[0001] This application claims priority to Chinese patent application No. 202410239728.3, filed on March 4, 2024, the entire contents of which are incorporated herein by reference. Technical Field

[0002] The present disclosure relates to the field of laser projection technology, and in particular to a laser, a laser light source, and a laser projection device. Background Art

[0003] The light source of a laser projection device may include a laser, which provides a laser illumination beam. The temperature of the laser's light-emitting chip rises during operation. This temperature increase can affect the chip's threshold current, wavelength, and other factors, thereby impacting the display quality of the laser projection device.

[0004] Summary of the Invention

[0005] The present disclosure provides a laser, a laser light source, and a laser projection device, which can improve the accuracy of laser temperature detection and increase the degree of integration of the laser.

[0006] In one aspect, a laser is provided. The laser includes a base plate, a housing, a light emitting portion, and a temperature measuring component. An accommodating space is formed between the housing and the base plate.

[0007] The light emitting portion includes at least one first light emitting chip, which is disposed in the accommodating space and can emit a light beam of at least one color.

[0008] The temperature measuring component is located in the accommodating space and is arranged on the bottom plate. The temperature measuring component can obtain the temperature in the accommodating space.

[0009] According to the laser of some embodiments of the present disclosure, by locating the temperature measuring component in the accommodating space, the distance between the temperature measuring component and the first light-emitting chip of the laser is shortened from being separated by components such as a tube shell and a base plate to being separated by no components such as a tube shell and a base plate, so that the temperature data obtained by the temperature measuring component can more objectively and truly reflect the temperature of the first light-emitting chip, thereby improving the accuracy of temperature detection of the laser based on the temperature measuring component and improving the degree of integration of the laser.

[0010] In another aspect, a laser light source is provided, wherein the laser light source includes at least one first laser, and the at least one first laser is the laser described above.

[0011] According to the laser light source of some embodiments of the present disclosure, the laser light source is provided with at least one first laser. In this way, a small number of temperature measuring components are provided to detect the temperature of the laser light sources of multiple lasers, thereby reducing the number of temperature measuring components that need to be configured in the laser light source, which is conducive to simplifying the structure of the laser light source.

[0012] In another aspect, a laser projection device is provided. The laser projection device includes a laser light source, a light valve assembly, a lens, and a display control device. The laser light source is the laser light source described above.

[0013] The laser light source is configured to provide light to the light valve assembly. The light valve assembly is configured to guide the light to the lens, and the lens is configured to project and display target content according to the light provided by the light valve assembly.

[0014] The display control device is configured to obtain the temperature in the accommodating space through the temperature measuring component of the laser light source, and adjust the temperature of the laser light source based on the temperature.

[0015] According to some embodiments of the laser projection device of the present disclosure, the laser projection device includes a laser light source. The structure of the laser projection device is simplified by the laser light source with high integration, which is conducive to promoting the miniaturization of the laser projection device. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] FIG1A is a structural diagram of a laser projection device according to some embodiments;

[0017] FIG1B is a schematic diagram of a laser packaging structure according to some embodiments;

[0018] FIG1C is a partially enlarged view of a laser according to some embodiments;

[0019] FIG2 is a schematic diagram of measuring laser temperature through a third resistor packaged in an aluminum plate according to some embodiments;

[0020] FIG3 is a schematic diagram of a heat dissipation method for a laser chip according to some embodiments;

[0021] FIG4 is a schematic diagram of a circuit structure for detecting laser temperature based on a third resistor in the related art;

[0022] FIG5 is a structural diagram of another laser according to some embodiments;

[0023] FIG6 is a schematic diagram of heat distribution inside a multi-color laser accommodating space according to some embodiments;

[0024] FIG7 is a schematic diagram of heat distribution inside a monochromatic laser accommodating space according to some embodiments;

[0025] FIG8 is a partial structural diagram of another laser according to some embodiments;

[0026] FIG9 is a structural diagram of yet another laser according to some embodiments;

[0027] FIG10 is a structural diagram of yet another laser according to some embodiments;

[0028] FIG11 is a cross-sectional view of yet another laser according to some embodiments;

[0029] FIG12 is another cross-sectional view of yet another laser according to some embodiments;

[0030] FIG13 is a top view of yet another laser according to some embodiments;

[0031] FIG14 is a schematic diagram of yet another laser according to some embodiments;

[0032] FIG15 is a schematic diagram of another internal wiring of a laser according to some embodiments;

[0033] FIG16 is a schematic diagram of yet another laser according to some embodiments;

[0034] FIG17A is a schematic diagram of a laser light source according to some embodiments;

[0035] FIG17B is a schematic diagram of another laser light source according to some embodiments;

[0036] FIG18 is a schematic diagram of a laser projection device according to some embodiments;

[0037] FIG19 is a schematic diagram of another laser projection device according to some embodiments;

[0038] FIG20 is a schematic diagram of yet another laser projection device according to some embodiments;

[0039] FIG21 is a schematic diagram of yet another laser projection device according to some embodiments. DETAILED DESCRIPTION

[0040] The following will be combined with the accompanying drawings to clearly and completely describe some embodiments of the present disclosure. Obviously, the embodiments described are only some embodiments of the present disclosure, rather than all embodiments. Based on the embodiments provided by the present disclosure, all other embodiments obtained by ordinary technicians in this field are within the scope of protection of the present disclosure.

[0041] Unless the context requires otherwise, throughout the specification and claims, the term "comprise" and its other forms, such as the third person singular form "comprises" and the present participle form "comprising", are to be interpreted as open and inclusive, that is, "including, but not limited to". In the description of the specification, the terms "one embodiment", "some embodiments", "exemplary embodiments", "example", "specific example" or "some examples" are intended to indicate that the particular features, structures, materials or characteristics associated with the embodiment or example are included in at least one embodiment or example of the present disclosure. The schematic representation of the above terms does not necessarily refer to the same embodiment or example. In addition, the particular features, structures, materials or characteristics may be included in any one or more embodiments or examples in any appropriate manner.

[0042] In the following, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of the technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present disclosure, unless otherwise specified, "plurality" means two or more.

[0043] When describing some embodiments, the expressions "coupled" and "connected" and their derivatives may be used. The term "connected" should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected or indirectly connected through an intermediate medium. The term "coupled" indicates that two or more components are in direct physical or electrical contact. The term "coupled" or "communicatively coupled" may also refer to two or more components that are not in direct contact with each other, but still cooperate or interact with each other. The embodiments disclosed herein are not necessarily limited to the contents of this document.

[0044] “At least one of A, B and C” has the same meaning as “at least one of A, B or C” and both include the following combinations of A, B and C: A only, B only, C only, the combination of A and B, the combination of A and C, the combination of B and C, and the combination of A, B and C.

[0045] “A and / or B” includes the following three combinations: A only, B only, and a combination of A and B.

[0046] The use of "adapted to" or "configured to" herein is intended to be open and inclusive language that does not exclude devices adapted or configured to perform additional tasks or steps.

[0047] As used herein, "about," "substantially," or "approximately" includes the stated value and an average value that is within an acceptable range of deviation from the particular value as determined by one of ordinary skill in the art taking into account the measurements in question and the errors associated with the measurement of the particular quantity (i.e., the limitations of the measurement system).

[0048] As used herein, "parallel", "perpendicular", and "equal" include the situations described and situations similar to the situations described, and the range of the similar situations is within an acceptable deviation range, wherein the acceptable deviation range is as determined by a person of ordinary skill in the art taking into account the measurement in question and the errors associated with the measurement of the specific quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, wherein the acceptable deviation range of approximate parallelism can be, for example, a deviation within 5°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, wherein the acceptable deviation range of approximate perpendicularity can also be, for example, a deviation within 5°. "Equal" includes absolute equality and approximate equality, wherein the acceptable deviation range of approximate equality can be, for example, that the difference between the two equals is less than or equal to 5% of either one.

[0049] With the development of projection technology, the application of laser projection devices such as projectors and laser TVs is increasing. As shown in Figure 1A, after disassembling the upper shell of a laser projection device, the internal structure is divided according to optical function and can include a light source 100, a light modulation device 200, and a lens 300.

[0050] The light source 100 can provide an illumination beam that is transmitted to the back-end optical modulator 200 and lens 300. The light source 100 can include a laser of at least one color, such as a blue laser. The light source 100 can also be a two-color laser, such as a blue laser and a red laser. Alternatively, the light source 100 can be a three-color laser light source, including red, green, and blue lasers, and can provide a three-color laser illumination beam.

[0051] The laser beam provided by light source 100 undergoes light combining and shaping before entering the illumination path of light modulator 200. In the digital light processing (DLP) projection architecture, the digital micromirror device (DMD) chip is the core light modulator. The DMD chip receives a drive control signal corresponding to the image signal and flips the thousands of tiny mirrors on its surface to the positive or negative angle corresponding to the drive signal, reflecting the incoming light beam into lens 300.

[0052] The lens 300 may be an ultra-short-throw projection lens, which is configured to project an image beam onto a projection screen, thereby realizing a projected image display. It should be noted that the aforementioned laser projection device may be an ultra-short-throw laser projection device.

[0053] Some embodiments of the present disclosure further provide a laser projection device. As shown in FIG18 , the laser projection device 100 may include a laser light source 101, a display control device 102, and a light valve assembly 103. The display control device 102 may be connected to the laser light source 101 and the light valve assembly 103. The laser light source 101 is configured to provide light to the light valve assembly 103.

[0054] It should be noted that the laser light source 101 in some embodiments of the present disclosure will be introduced below.

[0055] In some embodiments, the laser projection device 100 may further include a lens 300. The light valve assembly 103 may be configured to direct light to the lens 300. The lens 300 may project and display target content based on the light provided by the light valve assembly 103.

[0056] In some embodiments, as shown in FIG. 5 , the laser 10 may include a temperature measurement component 16 .

[0057] In some embodiments, the display control device 102 may use the temperature measuring component 16 to collect the temperature in the accommodation space of the laser 10 and adjust the temperature of the laser light source 101 based on the temperature.

[0058] In some embodiments, the display control device 102 may include at least one of a DLP, a system on chip (SOC), a microcontroller unit (MCU), or a field programmable gate array (FPGA). The display control device 102 may control the laser 10 to illuminate based on an input video signal. The display control device 102 may also collect the temperature within the housing space of the laser 10 via the temperature measuring component 16 and adjust the temperature of the laser light source 101 based on the temperature.

[0059] The display control device 102 may include a processor. The processor may include a central processing unit (CPU), a microprocessor, or an application-specific integrated circuit (ASIC), and may be configured to perform the corresponding operations described in the display control device 102 when the processor executes a program stored in a non-transitory computer-readable storage medium coupled to the display control device 102. The non-transitory computer-readable storage medium may include a magnetic storage device (e.g., a hard disk, a floppy disk, or a magnetic tape), a smart card, or a flash memory device (e.g., an erasable programmable read-only memory (EPROM), a card, a stick, or a keyboard drive).

[0060] In some embodiments, the display control device 102 may obtain the voltage across the temperature measuring component 16 and determine the temperature in the accommodation space of the laser 10 based on a mapping relationship between the voltage across the temperature measuring component 16 and the temperature.

[0061] In some embodiments, when the temperature in the accommodation space is too high, the temperature in the accommodation space can be adjusted by increasing heat dissipation or reducing the driving current of the laser 10 .

[0062] In some embodiments, because the position and number of the temperature measuring component 16 in the laser 10 packaging structure are optional, the position and number of the temperature measuring component 16 can be set so that the temperature measuring component 16 can obtain the temperature of the first light-emitting chip 130 of different colors, as shown in Figure 5, or the temperature measuring component 16 can obtain temperature data of different partitions in the tube shell 12.

[0063] It should be noted that the laser projection device 100 can also obtain temperature data of the first light-emitting chips 130 of different colors, or obtain different temperature data for the partitions within the tube shell 12, and perform temperature control of different colors or different partitions, etc. This improves the flexibility of the laser projection device 100 in temperature control of the laser 10.

[0064] In some embodiments, the laser projection device 100 may include a laser light source 101 with higher integration. Compared with the laser projection device 100 in the related art that requires additional deployment of a temperature measurement component 16, the laser projection device 100 in some embodiments of the present disclosure simplifies the structure of the laser projection device 100 through the laser light source 101 with higher integration, which is conducive to the miniaturization of the laser projection device 100.

[0065] In some embodiments, as shown in FIG. 1B and FIG. 1C , the laser may include a base plate 11 , a housing 12 , and a light emitting portion 13 .

[0066] The light-emitting unit 13 may include multiple first light-emitting chips 130 (also referred to as laser chips, laser ICs (Integrated Circuits, ICs), or LD chips), a reflective prism 131, and a heat dissipation substrate 132. The temperature of the first light-emitting chips 130 increases during operation. The threshold current and wavelength of the first light-emitting chips 130 are affected by the temperature of the first light-emitting chips 130. This temperature increase also affects the threshold current of the semiconductor first light-emitting chips 130.

[0067] When the drive current is stable, the output power of the first light-emitting chip 130 decreases significantly as the temperature increases, shrinking the entire color space. The laser threshold increases exponentially with temperature, exp(T / T0). T is the temperature of the first light-emitting chip 130, and T0 is the characteristic temperature of the first light-emitting chip 130 (typically 60 to 150°C). T0 is a measure of the device's temperature sensitivity; higher T0 indicates greater thermal stability. Temperature changes affect the band gap of the semiconductor junction, thereby affecting the peak wavelength of the gain curve.

[0068] Therefore, in order to ensure the stable operation of the laser, it is necessary to control the temperature of the first light emitting chip 130 so that the laser can operate within a stable working environment temperature. The temperature detection of the first light emitting chip 130 is an important basis for laser temperature control.

[0069] In the related art, the laser temperature detection sensor is mainly a third resistor 14 (such as a thermistor), such as a negative temperature coefficient thermistor (NTC) resistor. The third resistor 14 is a resistor device whose resistance value is inversely proportional to the temperature. The third resistor 14 is highly sensitive and easy to use, and is a commonly used temperature sensor. For example, the formula for the change of the third resistor 14 with temperature can be shown as formula (1):

[0070] R is the resistance value of the thermistor, R0 is the resistance value of the thermistor at the reference temperature T0, β is a constant related to the material and manufacturing process of the thermistor, and T is the current temperature.

[0071] Taking different types of third resistors 14 as an example, there are mainly the following solutions for measuring the laser temperature through a thermistor (such as an NTC resistor):

[0072] First, the third resistor 14 encapsulated in an aluminum plate. As shown in Figure 2, the third resistor 14 encapsulated in an aluminum plate is fixed to the base plate 11 of the laser using screws. However, due to the large size of the third resistor 14, this solution can often only be placed in the corners of the laser base plate 11. There are other components between the NTC resistor and the light-emitting chip. As shown in Figure 3, the temperature of the laser chip needs to pass through the tube shell where the light-emitting part 13 is located, as well as through the heat sink 15 and the base plate 11, and finally reach the third resistor 14. Therefore, the temperature measured by the third resistor 14 is significantly different from the actual temperature of the laser chip itself. In addition, the farther away from the heat source laser chip, the greater the temperature difference between the laser chip and the NTC thermistor. Therefore, this solution has low accuracy in measuring laser temperature.

[0073] Second, enameled wire thermistors. When using this enameled wire thermistor for laser temperature detection, the NTC temperature sensor head needs to be fixed to the base plate outside the laser housing with thermal grease. However, completely fixing it with thermal grease will also reduce the sensitivity of the third resistor 14. In addition, in this implementation, the temperature of the laser chip must also pass through the laser housing, the heat sink plate, and the heat dissipation substrate before finally reaching the third resistor 14, resulting in low accuracy in measuring laser temperature.

[0074] Third, chip thermistor. The heat generated by the first light-emitting chip 130 needs to pass through the laser tube shell, heat dissipation substrate and thermally conductive insulating material to be transferred to the chip third resistor 14. Therefore, the temperature measured by the third resistor 14 is still different from the actual temperature of the laser chip. In some embodiments, the surface temperature of the NTC is related to the size and thickness of the base plate 11. The thicker or larger the base plate 11, the greater the temperature difference between the surface temperature of the NTC and the first light-emitting chip 130. It also depends on the distance of the NTC from the first light-emitting chip 130. The farther the first light-emitting chip 130 is from the heat source, the greater the temperature difference between the first light-emitting chip 130 and the NTC thermistor. For thermally conductive insulating materials, such as FR4, which has a low thermal conductivity, it is difficult for the heat of the first light-emitting chip 130 to be transferred to the surrounding area, which in turn causes a temperature difference between the first light-emitting chip 130 and the NTC surface. Therefore, the accuracy of this method of measuring the temperature of the laser is also low.

[0075] In some embodiments, referring to Figure 4, the laser (Laser) can be as shown in Figures 1B and 1C, and the laser driving circuit (Driver) can drive the laser to output a light beam; the system on chip (SOC) or micro controller unit (MCU) is the display control device of the laser projection device, and the first resistor can be a voltage divider resistor.

[0076] In the related art, the third resistor 14 is disposed outside the laser packaging structure. Therefore, when the laser projection device uses the laser, in order to monitor the laser temperature, the third resistor 14 needs to be additionally deployed in space, which complicates the laser application and increases the space occupied by the laser projection device.

[0077] Taking into account the above-mentioned problems existing in the laser temperature detection method in the related art, some embodiments of the present disclosure propose a laser in which a temperature measuring component is integrated into the laser tube shell. By placing the temperature measuring component inside the tube shell, compared with the laser temperature detection method in the related art, some embodiments of the present disclosure achieve the change from placing the temperature measuring component outside the laser packaging structure to internally placing the temperature measuring component inside the laser packaging structure. Therefore, the separation between the temperature measuring component and the first light-emitting chip of the laser is shortened from being separated by components such as the tube shell and the base plate to being separated from components such as the tube shell and the base plate. The temperature data obtained by the temperature measuring component can more objectively and truly reflect the temperature of the first light-emitting chip, thereby improving the accuracy of the temperature detection of the laser based on the temperature measuring component and improving the integration of the laser.

[0078] The following describes some embodiments of the present disclosure. The following embodiments may be combined with each other, and the same or similar concepts or processes may not be described in detail in some embodiments.

[0079] In some embodiments, as shown in Figure 5, the laser 10 may include a base plate 11, a housing 12, a light-emitting unit 13, and a temperature measurement component 16. The light-emitting unit 13 may include at least one first light-emitting chip 130. A housing space may be formed between the base plate 11 and the housing 12. The first light-emitting chip 130 and the temperature measurement component 16 may be located within the housing space and disposed on the base plate 11.

[0080] The at least one first light-emitting chip 130 can emit a light beam of at least one color. When the first light-emitting chip 130 emits a light beam of a single color, the laser 10 can also be referred to as a monochromatic laser. When the at least one first light-emitting chip 130 emits light beams of multiple colors, such as red, blue, and green laser light beams, the laser 10 can be referred to as a multicolor laser 10.

[0081] When the first light emitting chip 130 emits a light beam, the temperature in the accommodation space will change. The temperature measuring component 16 can obtain the temperature in the accommodation space.

[0082] In some embodiments, the temperature measuring component 16 may be any component capable of measuring temperature, such as a thermistor. For example, if the temperature measuring component 16 is a thermistor, the resistance of the temperature measuring component 16 may be related to the temperature within the accommodating space. For example, the resistance of the thermistor may be negatively correlated with the temperature within the accommodating space.

[0083] The temperature measuring component 16 may be a third resistor 14 bonded with a gold wire. In some embodiments, the third resistor 14 bonded with a gold wire can reduce the effect of the temperature measuring component 16 on the temperature within the tube shell 12 of the laser 10. This reduces the effect of the temperature measuring component 16's own temperature on the temperature of the first light-emitting chip 130, thereby improving the accuracy of the temperature measurement component 16 in obtaining the temperature within the accommodation space.

[0084] In some embodiments, the temperature measuring component 16 may also be a copper wire, a silver wire or an NTC resistor bonded with other materials.

[0085] It should be noted that some embodiments of the present disclosure do not limit the number of first light-emitting chips 130 and the number of temperature measuring components 16 included in the laser 10 .

[0086] In some embodiments, the number of first light-emitting chips 130 included in the laser 10 may be equal to the number of temperature measuring components 16 , and one first light-emitting chip 130 corresponds to one temperature measuring component 16 .

[0087] In some embodiments, the number of first light-emitting chips 130 included in the laser 10 may not be equal to the number of temperature measuring components 16. In this case, the number of temperature measuring components 16 may be less than the number of first light-emitting chips 130. Taking multiple first light-emitting chips 130 connected in series as an example, if the current flowing through each first light-emitting chip 130 is the same and the multiple first light-emitting chips 130 are of the same model, the temperatures of the multiple first light-emitting chips 130 are similar, and the temperatures of the multiple first light-emitting chips 130 can be obtained by a single temperature measuring component 16.

[0088] It should be noted that the temperature measuring component 16 and the base plate 11 can be connected by silver paste or gold paste.

[0089] Some embodiments of the present disclosure do not limit the material of the tube shell 12 and the material of the base plate 11 .

[0090] In some embodiments, the tube shell 12 may be a ceramic tube shell 12 or other types of tube shells 12 , and the bottom plate 11 may be made of a material with good thermal conductivity such as copper.

[0091] In some embodiments, by placing the temperature measuring component 16 inside the tube shell 12 of the laser 10, the temperature measuring component 16 is placed outside the packaging structure of the laser 10, and is instead placed inside the packaging structure of the laser 10. Therefore, the distance between the temperature measuring component 16 and the first light-emitting chip 130 of the laser 10 is shortened from being separated by components such as the tube shell 12 and the base plate 11 to being free of components such as the tube shell 12 and the base plate 11. This allows the temperature data obtained by the temperature measuring component 16 to more objectively and truly reflect the temperature of the first light-emitting chip 130, thereby improving the accuracy of temperature detection of the laser based on the temperature measuring component 16.

[0092] In addition, by integrating the temperature measuring component 16 into the packaging structure of the laser 10 , the integration level of the laser 10 is improved.

[0093] Therefore, when the laser 10 is used, no space is required to be reserved for installing the temperature measuring component 16 outside the laser 10 package, which simplifies the peripheral components of the laser 10 and facilitates the simplification and miniaturization of the system when the laser projection device is used.

[0094] In addition, by integrating the temperature measuring component 16 into the packaging structure of the laser 10, the position and quantity of the temperature measuring component 16 in the structure of the laser 10 are optional. Compared with external placement, the temperature data of the first light-emitting chips 130 of different colors can be obtained, or different temperature data can be obtained for the partitions within the tube shell 12, which provides conditions for the laser projection equipment to perform temperature control of different colors or different partitions.

[0095] It should be noted that some embodiments of the present disclosure do not limit the package type of the laser 10. FIG5 is an exemplary illustration of the package type of the laser 10, taking the package type of the laser 10 as a multi-chip laser (MCL) package type as an example.

[0096] In some embodiments, the package type of the laser 10 may also be a miniaturized (NUBB (Narrow Uint Of Blue Color Beam, i.e., a small blue laser) or NUMB (Narrow Uint Of Multiple Color Beam, i.e., a small multi-color laser)) package type.

[0097] The position of the temperature measuring component 16 in the packaging structure of the laser 10 is described in detail below.

[0098] In some embodiments, the temperature measuring component 16 is not disposed on the light-emitting side of the first light-emitting chip 130. The light-emitting side of the first light-emitting chip 130 may be as shown in FIG1B and FIG1C.

[0099] In some embodiments, the light emitting portion 13 may include at least one reflective prism 131 disposed on the bottom plate 11, and the at least one reflective prism 131 may correspond to at least one first light emitting chip 130. The at least one reflective prism 131 may be located on the light emitting side of the corresponding first light emitting chip 130.

[0100] That is, the light-emitting side of the first light-emitting chip 130 faces the reflective prism, so the temperature measuring component 16 does not need to be disposed between the first light-emitting chip 130 and the corresponding reflective prism.

[0101] In some embodiments, the first light emitting chip 130 may be configured to emit light toward the corresponding reflective prism 131 , and the reflective prism 131 may emit the light emitted by the corresponding first light emitting chip 130 in a direction away from the base plate 11 .

[0102] In some embodiments, the surface of the reflective prism 131 facing the corresponding first light-emitting chip 130 may be a reflective surface, which can reflect the light emitted by the first light-emitting chip 130. It should be noted that in some embodiments of the present disclosure, the material and shape of the reflective prism 131, as well as the connection method between the reflective prism 131 and the base plate 11 are not limited.

[0103] By arranging the temperature measuring component 16 outside the light-emitting side of the first light-emitting chip 130, the light beam emitted by the first light-emitting chip 130 is prevented from irradiating the temperature measuring component 16, thereby preventing the temperature measuring component 16 from heating up due to the heat of the light beam. This reduces the interference of the heat of the light beam on the temperature detection of the first light-emitting chip 130 by the temperature measuring component 16, thereby improving the accuracy of the temperature measuring component 16 in obtaining the temperature in the above-mentioned accommodating space.

[0104] The location of the temperature measuring component 16 on the bottom plate 11 can be determined based on a heat flow simulation test within the accommodation space. As previously mentioned, the laser 10 can be a multi-color laser or a monochromatic laser. The following uses the laser 10 as an example to illustrate the heat flow simulation within the accommodation space.

[0105] Taking the laser 10 as a multi-color laser as an example, FIG6 is a schematic diagram of the heat distribution inside the multi-color laser accommodation space according to some embodiments. As shown in FIG6, the temperature of the laser 10 at different positions in the accommodation space may be different. For example, the area with a darker grayscale indicates a higher temperature. A first area 61, a second area 62, and a third area 63 are formed in the accommodation space. For example, the temperature of the first area 61 is greater than the temperature of the second area 62, and the temperature of the second area 62 is greater than the temperature of the third area 63. Taking the example of setting a temperature measuring component 16 in the laser 10, the temperature measuring component 16 can be set in the first area 61. Taking the example of setting two temperature measuring components 16 in the laser 10, one temperature measuring component 16 can be set in the first area 61, and the other temperature measuring component 16 can be used to reflect the temperatures of the second area 62 and the third area 63.

[0106] Taking the laser 10 as a monochromatic laser as an example, FIG7 is a schematic diagram illustrating the heat distribution within a monochromatic laser housing according to some embodiments. As shown in FIG7 , a fourth region 71 and a fifth region 72 are formed within the housing, and the temperature of the fourth region 71 can be greater than the temperature of the fifth region 72. For example, if the laser 10 is provided with a temperature measuring component 16, the temperature measuring component 16 can be disposed within the fourth region 71.

[0107] By determining the setting position of the temperature measuring component 16 on the base plate 11 based on the heat flow simulation test in the above-mentioned accommodation space, the temperature measuring component 16 can be set at a position on the base plate 11 that can accurately reflect the temperature in the accommodation space of the laser 10, so as to improve the accuracy of detecting the temperature in the accommodation space of the laser 10 through the temperature measuring component 16.

[0108] In some embodiments, the position of the temperature measuring component 16 in the above-mentioned accommodation space can also be a position determined based on a heat flow simulation test that can accurately reflect the temperature in the accommodation space of the laser 10 and is not on the light-emitting side of the first light-emitting chip 130.

[0109] The following describes in detail how the temperature measuring component 16 is disposed on the bottom plate 11 .

[0110] In some embodiments, the laser 10 may further include at least one heat dissipation substrate 132, at least one first light-emitting chip 130 corresponds to at least one heat dissipation substrate 132, any one of the at least one first light-emitting chip 130 can be set on the base plate 11 through the corresponding heat dissipation substrate 132, and the temperature measuring component 16 can also be set on the base plate 11 through at least one heat dissipation substrate 132.

[0111] It should be noted that some embodiments of the present disclosure do not limit the connection method between the temperature measuring component 16 and the heat dissipation substrate 132 , and the connection method between the heat dissipation substrate 132 and the first light-emitting chip 130 .

[0112] In some embodiments, the first light-emitting chip 130 can be soldered to the base plate 11 via the heat dissipation substrate 132. In addition, some embodiments of the present disclosure do not limit the number of temperature measuring components 16, the number of temperature measuring components 16 that can be set on a heat dissipation substrate 132, or which heat dissipation substrate 132 the temperature measuring component 16 is set on (for example, reference can be made to the examples of the position of the temperature measuring component 16 in the laser 10 packaging structure described in some of the aforementioned embodiments).

[0113] In some embodiments, the position of the heat dissipation substrate 132 where the temperature measuring component 16 is set can be determined based on the heat flow simulation test in the aforementioned accommodating space, such as the heat dissipation substrate 132 located at the center of the accommodating space.

[0114] 8 , the number of temperature measuring components 16 may be less than the number of first light emitting chips 130. The temperature measuring component 16 may be provided on the heat dissipation substrate 132 corresponding to any first light emitting chip 130.

[0115] In some embodiments, the temperature measuring component 16 can be disposed on a heat dissipation substrate 132 near the conductive area of ​​the housing 12. This reduces the distance between the temperature measuring component 16 and the conductive area, thereby shortening the wire bonding length. Here, "wire bonding" refers to the use of metal wire (gold wire, aluminum wire, etc.) using heat pressing or ultrasonic energy to complete the internal interconnection wiring of solid-state circuits in microelectronic devices, that is, the connection between the chip and the circuit or lead frame.

[0116] In some embodiments, the temperature measuring component 16 may also be disposed on a heat dissipation substrate 132 approximately located at the center of the tube shell 12 . This may improve the accuracy of the temperature measuring component 16 in reflecting the temperature in the accommodating space.

[0117] In some embodiments, by mounting the temperature measuring component 16 on the heat dissipation substrate 132 , the distance between the temperature measuring component 16 and the first light-emitting chip 130 is shortened.

[0118] By disposing the first light emitting chip 130 on the heat dissipation substrate 132 and the temperature measuring component 16 on the heat dissipation substrate 132 , the accuracy of the temperature measuring component 16 in measuring the actual temperature of the first light emitting chip 130 is improved.

[0119] In some embodiments, the laser 10 may further include a heat sink 15 . The first light emitting chip 130 and the temperature measuring component 16 may be disposed on the bottom plate 11 via the heat sink 15 .

[0120] In some embodiments, the heat sink 15 may be made of ceramic materials, such as aluminum oxide or silicon dioxide.

[0121] In some embodiments, the location of the temperature measuring component 16 on the heat sink 15 may refer to the examples of the location of the temperature measuring component 16 in the packaging structure of the laser 10 described in some of the aforementioned embodiments.

[0122] In some embodiments, the temperature measuring component 16 may be disposed on the heat sink 15 near the conductive area of ​​the tube shell 12 to reduce the distance between the temperature measuring component 16 and the conductive area of ​​the tube shell 12 , thereby facilitating a reduction in the wire bonding length.

[0123] Taking the MCL package type of the laser 10 as an example, as shown in FIG9 , the laser 10 may include a temperature measuring component 16 , which may be disposed on the heat sink 15 . Since only one temperature measuring component 16 is provided, this is beneficial in reducing the cost of the laser 10 .

[0124] Taking the NUBB package type of the laser 10 as an example, as shown in FIG10 , the laser 10 includes three temperature measuring components 16 , and the three temperature measuring components 16 can be respectively disposed on the heat sink 15 .

[0125] In some embodiments, if the temperature measuring component 16 is far away from the conductive area on the tube shell 12, an adapter 17 (such as a wire bonding adapter) may be further provided in the laser 10. At least one end of the temperature measuring component 16 may be connected to the conductive area of ​​the tube shell 12 via the adapter 17.

[0126] As shown in FIG. 8 and FIG. 9 , the laser 10 may include at least one adapter portion 17 , and the adapter portion 17 may also be disposed in the accommodation space formed by the base plate 11 and the tube shell 12 .

[0127] In some embodiments, as shown in FIG. 8 , the adapter portion 17 may be disposed on a heat dissipation substrate 132 and disposed on the bottom plate 11 through the heat dissipation substrate 132 .

[0128] In some embodiments, as shown in Figure 8, at least one adapter portion 17 includes multiple adapter portions 17, and at least one heat dissipation substrate 132 includes multiple heat dissipation substrates 132. The multiple adapter portions 17 can be respectively arranged on the multiple heat dissipation substrates 132 and arranged on the base plate 11 through the corresponding heat dissipation substrates 132.

[0129] In some embodiments, as shown in FIG. 9 , the adapter portion 17 may also be disposed on the heat sink 15 , and disposed on the bottom plate 11 through the heat sink 15 .

[0130] It should be noted that some embodiments of the present disclosure do not limit the location of the adapter 17. The location and number of the adapter 17 can be determined based on the bonding requirements of the temperature measuring component 16.

[0131] Taking the example of a temperature measuring component 16 disposed on the base plate 11 via a heat sink 15, as shown in Figure 11, the housing 12 may be provided with a conductive region 171 and a non-conductive region 173. The temperature measuring component 16 may be disposed on the heat sink 15 near the center of the housing 12, and may be provided with four adapters 17. The temperature measuring component 16 may be connected to the conductive region 171 on the housing 12 via metal bonding wires 170, thereby connecting the temperature measuring component 16 to the printed circuit board (PCB) on the base plate 11.

[0132] For example, as shown in FIG11 , the temperature measuring component 16 is connected to the PCB pad 172 on the base plate 11 .

[0133] Taking the example of a temperature measuring component 16 disposed on the base plate 11 via a heat dissipation substrate 132, as shown in Figures 12 and 13, the temperature measuring component 16 can be disposed on the heat dissipation substrate 132 near the center of the accommodating space, and an adapter portion 17 can be provided on each of the remaining heat dissipation substrates 132. The temperature measuring component 16 can be connected to a conductive area 171 on the tube housing 12 via metal bonding wires 170, thereby connecting the temperature measuring component 16 to a PCB pad 172 on the base plate 11.

[0134] The temperature measuring component 16 is connected to the conductive area 171 of the tube shell 12 through the above-mentioned adapter 17, which can guide and support the bonding wires (such as gold wires) between the temperature measuring component 16 and the conductive area 171 of the tube shell 12, avoiding the bonding wires from sagging, deformation and breakage, thereby improving the safety of the use of the temperature measuring component 16.

[0135] The above describes an embodiment of how the temperature measuring component 16 is disposed on the base plate 11 . The following describes in detail the electrical connection method of the temperature measuring component 16 in the tube shell 12 .

[0136] In some embodiments, as shown in FIG14 , the first end of the temperature measuring component 16 and the cathode of the light-emitting portion 13 are respectively connected to the first sub-conductive region 1711 of the housing 12. The second end of the temperature measuring component 16 is connected to the second sub-conductive region 1712 of the housing 12. The anode of the light-emitting portion 13 is connected to the third sub-conductive region 1713 of the housing 12.

[0137] For example, if the light-emitting unit 13 includes multiple first light-emitting chips 130, the multiple first light-emitting chips 130 can be connected in series. The cathode of the light-emitting unit 13 can be the cathode terminal of the multiple first light-emitting chips 130 connected in series. The anode of the light-emitting unit 13 can be the anode terminal of the multiple first light-emitting chips 130 connected in series.

[0138] In some embodiments, when the laser 10 is used in a laser projection device, the second end of the temperature measuring component 16 can be connected to the temperature acquisition terminal of the display control device of the laser projection device. The positive electrode of the light-emitting portion 13 can be connected to the drive current output terminal of the display control device. The second sub-conductive region 1712 and the third sub-conductive region 1713 can be isolated by an insulating material. By using the insulating material to isolate the second sub-conductive region 1712 from the third sub-conductive region 1713, it is achieved that the positive electrode of the temperature measuring component 16 and the light-emitting portion 13 can be connected to different interfaces of the display control device, which lays the foundation for the display control device to control the laser 10 and for the temperature measuring component 16 to obtain the temperature of the laser 10.

[0139] In some embodiments, as shown in FIG15 , the housing 12 of the laser 10 may be provided with a first sub-conductive region 1711, a second sub-conductive region 1712, and a third sub-conductive region 1713. The temperature measuring component 16 may be connected to the first sub-conductive region 1711, and the cathode of the light-emitting portion 13 may also be connected to the first sub-conductive region 1711. The third sub-conductive region 1713 may be isolated from the first sub-conductive region 1711 by an insulating material 24.

[0140] It should be noted that some embodiments of the present disclosure do not limit the type of the insulating material 24 . Furthermore, some embodiments of the present disclosure do not limit whether the first sub-conductive region 1711 , the second sub-conductive region 1712 , and the third sub-conductive region 1713 are on the same side of the housing 12 .

[0141] In this way, compared with the case where the first end of the temperature measuring component 16 and the negative electrode of the light-emitting part 13 are connected to different conductive areas of the tube shell 12, some embodiments of the present disclosure connect the first end of the temperature measuring component 16 to the first sub-conductive area 1711, and the negative electrode of the light-emitting part 13 is also connected to the first sub-conductive area 1711, so that the temperature measuring component 16 and the light-emitting part 13 share a cathode, thereby reducing the number of conductive areas of the tube shell 12 that need to be deployed, which is beneficial to improving the integration of the laser 10 and simplifying the system when the laser projection equipment is used.

[0142] In some embodiments, as shown in FIG16 , the laser 10 may further include a protection assembly 18 (temperature measurement component protection assembly). A first end of the protection assembly 18 may be connected to a first end of the temperature measurement component 16 , and a second end of the protection assembly may be connected to a second end of the temperature measurement component 16 .

[0143] It should be noted that the protection component 18 is configured to provide reverse connection protection for the temperature measuring component 16 .

[0144] In some embodiments, the protection component 18 may be a diode, etc. The present disclosure does not limit the type of the diode.

[0145] In some embodiments, different from the above embodiments, the diode of the protection component 18 may be a transient voltage suppressor (TVS) diode or the like.

[0146] Taking the protection component 18 as a TVS diode as an example, as shown in FIG16 , the anode of the TVS diode can be connected to the first end of the temperature measuring component 16 , that is, the anode of the TVS diode is connected to the cathode of the light-emitting portion 13 , and the anode of the TVS diode is connected to the first sub-conductive region 1711 of the tube case 12 . The cathode of the TVS diode can be connected to the second end of the temperature measuring component 16 , and the cathode of the TVS diode is connected to the second sub-conductive region 1712 of the tube case 12 .

[0147] It should be noted that some embodiments of the present disclosure do not limit the location of the protection component 18 in the laser 10 .

[0148] In some embodiments, the protection component 18 may also be disposed inside the tube shell 12 . Alternatively, the second protection component 18 may also be disposed outside the tube shell 12 .

[0149] With the aforementioned protection component 18, if a reverse polarity protection diode is integrated within the first light-emitting chip 130, because the power of the first light-emitting chip 130 is generally high, if the first light-emitting chip 130 is reversely connected, that is, the first light-emitting chip 130 is reversely conducting, a large voltage will be applied to the cathode of the first light-emitting chip 130. Since the cathode (i.e., the negative electrode) of the first light-emitting chip 130 is connected to the first end of the temperature measuring component 16, the large voltage at the cathode of the first light-emitting chip 130 will be applied to the temperature measuring component 16, causing the temperature measuring component 16 to burn out. The aforementioned protection component 18 can protect the temperature measuring component 16 when the first light-emitting chip 130 is mistakenly reversely connected, thereby improving the reliability of the temperature measuring component 16 and thereby improving the performance of the laser 10.

[0150] Some embodiments of the present disclosure further provide a laser light source, which may include at least one laser 10 as described in any of the aforementioned embodiments. By using the highly integrated laser 10 provided in some embodiments of the present disclosure to form a laser light source, the laser light source does not need to reserve an additional installation position for the temperature measurement component 16, thereby simplifying the structure of the laser light source.

[0151] In some embodiments, the laser light source may include at least one laser. For example, if the laser light source includes one laser, the laser may be the laser 10 described in any of the aforementioned embodiments. For example, if the laser light source includes multiple lasers, the multiple lasers may be, for example, the aforementioned laser 10, or the multiple lasers may include some of the aforementioned lasers 10 and some of the lasers described in any related art.

[0152] In some embodiments, taking the example that the laser light source includes multiple lasers, and the multiple lasers may include at least one laser in any related technology (referred to as the second laser) and at least one of the above-mentioned lasers 10 (referred to as the first laser), the second laser may not include the above-mentioned temperature measuring component 16, and the second laser may include at least one second light-emitting chip 1301.

[0153] In some embodiments, the first light-emitting chip 130 can be connected in series with the second light-emitting chip 1301 in the second laser 10 .

[0154] In some embodiments, as shown in FIG17A , the laser light source 101 includes a first laser 1001 and a second laser 1002 . The second laser 1002 may not be provided with the temperature measuring component 16 ; the temperature measuring component 16 may be provided in the first laser 1001 .

[0155] The positive electrode of the second light-emitting chip 1301 included in the second laser 1002 can be connected to the positive electrode of the second laser 1002, and connected to the display control device 102 of the laser projection device through the positive electrode of the second laser 1002. The negative electrode of the second laser 1002 can be connected to the positive electrode of the first laser 1001. The negative electrode of the first light-emitting chip 130 in the first laser 1001 is connected to the negative electrode of the first laser 1001, and the first end of the temperature measuring component 16 is connected to the negative electrode of the first laser 1001. As shown in Figure 17A, the laser 10 also includes a first power supply 111, and the second end of the temperature measuring component 16 is connected to the positive electrode interface of the first power supply 111. The rest of the content can be referred to Figure 15 and will not be repeated here. It should be noted that the temperature within the housing space containing the first light-emitting chip 130 is related to the magnitude of the drive current flowing through the first light-emitting chip 130, and the temperature within the housing space containing the second light-emitting chip 1301 is related to the magnitude of the drive current flowing through the second light-emitting chip 1301. Furthermore, by connecting the first light-emitting chip 130 and the second light-emitting chip 1301 in series, the magnitude of the drive current flowing through the first light-emitting chip 130 and the second light-emitting chip 1301 can be made equal. Therefore, connecting the first light-emitting chip 130 and the second light-emitting chip 1301 in series reduces the temperature differences between the housing spaces of the different lasers included in the laser light source. Therefore, by providing the first laser, the accuracy of the temperature measurement component 16 used to characterize the temperature within the housing space of each laser in the laser light source can be improved. Furthermore, by using a small number of temperature measurement components 16 to detect the temperature of a laser light source comprising multiple lasers, the number of temperature measurement components 16 required for the laser light source is reduced, thereby simplifying the structure of the laser light source.

[0156] It should be noted that, in some embodiments, the difference from the common connection between the first end of the temperature measuring component 16 and the negative pole of the first laser 1001 in the above embodiment is that the first end of the temperature measuring component 16 can also have an independent negative pole interface of the first power supply 111 (such as a power supply), and does not share the same conductive area with the negative pole of the first laser 1001. By setting different negative poles to reduce the distance between the first end of the temperature measuring component 16 and the negative pole of the first laser 1001, it is beneficial to shorten the wire bonding distance.

[0157] In some embodiments, the laser included in the laser light source 101 may also be the laser 10 proposed in some of the aforementioned embodiments of the present disclosure. As shown in FIG17B , the multiple lasers include a third laser 1003, and the third laser 1003 includes a third light-emitting chip 1303. The third laser 1003 includes two light-emitting chips and corresponding reflectors.

[0158] The plurality of lasers further includes a fourth laser 1004 . The fourth laser 1004 includes a fourth light emitting chip 1304 . The fourth light emitting chip 1304 includes one light emitting chip and a corresponding reflector.

[0159] The plurality of lasers further includes a fifth laser 1005 . The fifth laser 1005 is one of the lasers 10 . The fifth laser 1005 includes a fifth light-emitting chip 1305 . The fifth light-emitting chip 1305 includes three light-emitting chips and corresponding reflectors.

[0160] It should be noted that the temperature measuring component 16 and the laser 10 may share the same cathode (eg, negative electrode).

[0161] In some embodiments, the temperature measuring component 16 may not share the same cathode as the laser 10 , that is, the temperature measuring component 16 may not share the same conductive area on the tube shell 12 as the laser 10 .

[0162] As shown in FIG17B , the laser 10 further includes a second power supply 112. The second power supply 112 includes a positive electrode interface and a negative electrode interface. The positive electrode interface of the second power supply 112 can be connected to the second end of the temperature measuring component 16.

[0163] The laser 10 also includes a third power supply 113. The third power supply 113 includes a positive terminal and a negative terminal. The positive terminal of the third power supply 113 can be connected to the second end of the temperature measuring component 16. It should be noted that the first power supply 111, the second power supply 112, and the third power supply 113 can share a single power supply.

[0164] The following describes how the laser projection device 100 using the above-mentioned laser light source 101 supplies power to the temperature measuring component 16 .

[0165] As shown in FIG19 , in some embodiments, the second end of the temperature measuring component 16 may be further connected to the power input terminal via a first resistor 105. The first resistor 105 may function as a voltage divider resistor to divide the voltage applied to the temperature measuring component 16 via the power input terminal, thereby ensuring that the voltage applied to the temperature measuring component 16 is a suitable operating voltage for the temperature measuring component 16 and improving the reliability of the temperature measuring component 16.

[0166] In some embodiments, the power input terminal can be connected to the voltage output terminal of a component such as a voltage conversion module of the laser projection device 100 , and the power input terminal supplies power to the temperature measuring component 16 .

[0167] In some embodiments, the resistance of the first resistor 105 may be related to the resistance variation range of the temperature measuring component 16 and the voltage of the power input terminal.

[0168] In some embodiments, as shown in FIG20 , the laser projection device 100 may further include a second resistor (e.g., a sampling resistor), wherein the second resistor 106 is configured to collect the magnitude of the driving current flowing through the laser 10. The display control device 102 may be connected to the positive electrode of the light-emitting portion 13 via the second resistor 106, and the negative electrode of the light-emitting portion 13 and the first end of the temperature measuring component 16 may be grounded.

[0169] In some embodiments, as shown in FIG20 , the laser 10 includes two first light-emitting chips 130 and a temperature measuring component 16 . The display control device 102 collects the driving current flowing through the laser 10 through the second resistor 106 . The method can refer to some of the above embodiments and will not be repeated here.

[0170] The display control device 102 may use the voltage collected by the temperature measuring component 16 as a first target voltage, and determine the temperature in the space where the laser 10 is housed based on the first target voltage.

[0171] In some embodiments, the voltage collected by the temperature measuring component 16 may also be referred to as the voltage across the temperature measuring component 16 .

[0172] Through the above method, the temperature in the accommodation space of the laser 10 is determined by the voltage collected by the temperature measuring component 16, which lays a foundation for subsequent temperature adjustment of the laser 10 based on the temperature.

[0173] Taking the negative electrode of the above-mentioned light-emitting portion 13 being grounded, as shown in Figure 21, the first end of the temperature measuring component 16 being grounded, and the driving current feedback end of the display control device 102 being grounded through the second resistor 106 as an example, the second resistor 106 is configured to collect the magnitude of the driving current flowing through the laser 10, and the FB port (Feedback port) of the display control device 102 is the driving current feedback end of the above-mentioned display control device 102.

[0174] In some embodiments, the driving current feedback terminal of the display control device 102 may be a driving current feedback terminal of a laser 10 driving circuit of the display control device 102. The display control device 102 obtains the magnitude of the driving current flowing through the laser 10 collected by the sampling resistor through the driving current feedback terminal.

[0175] It should be noted that the display control device 102 may use the difference between the voltage collected by the temperature measuring component 16 and the set voltage of the driving current feedback terminal as the second target voltage. The display control device 102 may determine the temperature within the housing space of the laser 10 based on the second target voltage.

[0176] In some embodiments, the set voltage of the driving current feedback terminal may be pre-stored in the display control device 102. The set voltage may be related to the specifications of the driving chip in the laser 10 driving circuit included in the display control device 102.

[0177] It should be noted that the difference between the voltage collected by the temperature measuring component 16 and the set voltage of the driving current feedback end is used as the second target voltage. In this way, the accuracy of determining the voltage across the temperature measuring component 16 is improved, thereby improving the accuracy of measuring the temperature in the laser 10 accommodation space based on the temperature measuring component 16.

[0178] In addition, through the above method, only one pin needs to be added to the tube shell 12 to achieve temperature measurement through the temperature measuring component 16, thereby improving the efficiency of assembling the laser projection device 100.

[0179] It should be noted that any one of the technical solutions disclosed in the present disclosure can, to a certain extent, solve one or more of the above-mentioned technical problems and achieve certain disclosure purposes; multiple technical disclosures can also be combined into an overall solution to solve one or more of the above-mentioned technical problems and achieve certain disclosure purposes; some of the technical disclosures can also be selected to be combined into an overall solution, while adopting related technologies and inferior solutions, but the inferior trend can be compensated by the means disclosed in this technology, and the above-mentioned one or more technical problems can be solved to a certain extent as a whole and certain disclosure purposes can be achieved; each technical disclosure combined into a complete technical solution constitutes an organic and inseparable overall solution, which solves technical problems as a whole and achieves certain disclosure purposes.

[0180] Any technical disclosure in this disclosure, as well as the recombination of multiple technical disclosures, can form a complete technical solution and can solve one or more of the above-mentioned technical problems and achieve the purpose of disclosure. They all belong to the content of this disclosure and are the content that is directly and unambiguously determined based on the content of this disclosure.

[0181] Those skilled in the art will understand that the scope of the present disclosure is not limited to the above specific embodiments, and that certain elements of the embodiments may be modified and replaced without departing from the spirit of the present application. The scope of the present application is limited by the appended claims.

Claims

1. A laser comprising: base plate; a tube shell, wherein an accommodating space is formed between the tube shell and the bottom plate; a light-emitting portion, comprising at least one first light-emitting chip, wherein the at least one first light-emitting chip is disposed in the accommodating space and is capable of emitting a light beam of at least one color; as well as A temperature measuring component is located in the accommodating space and is arranged on the bottom plate. The temperature measuring component can obtain the temperature in the accommodating space.

2. The laser according to claim 1, further comprising: at least one heat dissipation substrate, wherein the at least one first light-emitting chip is arranged corresponding to the at least one heat dissipation substrate; Any one of the at least one first light-emitting chip is arranged on the bottom plate through a corresponding heat dissipation substrate; and the temperature measuring component is arranged on the bottom plate through the at least one heat dissipation substrate.

3. The laser according to claim 1 or 2, further comprising: A heat sink, wherein the first light-emitting chip and the temperature measuring component are respectively arranged on the bottom plate through the heat sink.

4. The laser according to any one of claims 1 to 3, wherein The temperature measuring component is arranged outside the light emitting side of the first light emitting chip.

5. The laser according to any one of claims 1 to 4, further comprising: At least one transition portion, at least one end of the temperature measuring component is connected to the conductive area of ​​the tube shell through the at least one transition portion.

6. The laser according to claim 5, wherein The at least one adapter portion includes a plurality of adapter portions, the at least one heat dissipation substrate includes a plurality of heat dissipation substrates, the plurality of adapter portions are correspondingly arranged on the plurality of heat dissipation substrates, and the plurality of adapter portions are arranged on the bottom plate through the plurality of heat dissipation substrates.

7. The laser according to claim 6, wherein The temperature measuring component is arranged on the heat dissipation substrate and is located at a position of the heat dissipation substrate close to the conductive area of ​​the tube shell.

8. The laser according to any one of claims 1 to 7, wherein The tube shell comprises: a first sub-conductive region, the first end of the temperature measuring component being connected to the first sub-conductive region, and the cathode of the light-emitting portion being connected to the first sub-conductive region; a second sub-conductive region, the second end of the temperature measuring component being connected to the second sub-conductive region of the housing; and The third sub-conductive region is connected to the positive electrode of the light-emitting portion.

9. The laser according to claim 8, wherein The first sub-conductive region and the third sub-conductive region are isolated from each other by an insulating material.

10. The laser according to any one of claims 3 to 9, wherein The temperature measuring component is arranged on the heat sink and is located at a position of the heat dissipation substrate close to the conductive area of ​​the tube shell.

11. The laser according to any one of claims 1 to 10, further comprising: a protection component, wherein a first end of the protection component is connected to the first end of the temperature measuring component, and a second end of the protection component is connected to the second end of the temperature measuring component; The protection component can provide reverse connection protection for the temperature measuring component.

12. The laser according to any one of claims 1 to 10, further comprising: A protection component, wherein the positive electrode of the protection component is connected to the first end of the temperature measuring component, and the positive electrode of the protection component is connected to the light emitting part Negative connection; Wherein, the positive electrode of the protection component is connected to the second end of the temperature measuring component.

13. The laser according to any one of claims 1 to 12, further comprising: A power supply, wherein the first end of the temperature measuring component is connected to the negative electrode interface of the power supply.

14. A laser light source comprising: At least one first laser, the at least one first laser being the laser according to any one of claims 1 to 13.

15. The laser light source according to claim 14, further comprising: at least one second laser; the second laser comprises at least one second light-emitting chip; The second light-emitting chip is connected in series with the first light-emitting chip in the first laser.

16. The laser light source according to claim 15, wherein: The first laser includes the positive electrode of the first light-emitting chip, the positive electrode of the first light-emitting chip is connected to the positive electrode of the first laser, and the negative electrode of the first laser is connected to the positive electrode of the second laser; the negative electrode of the second light-emitting chip of the second laser is connected to the negative electrode of the second laser, and the first end of the temperature measuring component is connected to the negative electrode of the first laser.

17. A laser projection device comprising: A laser light source, wherein the laser light source is the laser light source according to any one of claims 14 to 16; a light valve assembly, wherein the laser light source is capable of providing light to the light valve assembly; a lens, wherein the light valve assembly is capable of directing the light to the lens, and the lens is capable of projecting and displaying target content according to the light provided by the light valve assembly; as well as A display control device is provided, wherein the display control device can collect the temperature in the accommodating space through the temperature measuring component of the laser light source, and adjust the temperature of the laser light source based on the temperature.

18. The laser projection device according to claim 17, wherein: The second end of the temperature measuring component is connected to the display control device and is connected to the power input end through a first resistor.

19. The laser projection device according to claim 18, further comprising: a second resistor, wherein the second resistor is capable of collecting the magnitude of the driving current flowing through the laser; The display control device is connected to the positive electrode of the light-emitting portion through the second resistor, the negative electrode of the light-emitting portion is grounded, and the first end of the temperature measuring component is grounded.

20. The laser projection device according to claim 18, further comprising: a second resistor, wherein the second resistor is capable of collecting the magnitude of the driving current flowing through the laser; The cathode of the light emitting portion is grounded through the second resistor, the first end of the temperature measuring component is grounded through the second resistor, and the driving current feedback end of the display control device is grounded through the second resistor.

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