Heat dissipation system with Anti-permeation layer, and electronic device

Abstract

A heat dissipation system with an anti-permeation layer, and an electronic device. The heat dissipation system comprises a substrate, a housing and at least one anti-permeation layer. The substrate is provided with a heating element. The housing is connected to the substrate, an accommodating space configured to be filled with a cooling working medium is enclosed between the housing and the substrate, and the heating element is arranged in the accommodating space. At least part of the anti-permeation layer covers the surface of the substrate exposed to the accommodating space, and also covers a joint between the housing and the substrate and a joint between the heating element and the substrate. In the present application, by means of the arrangement of the anti-permeation layer, signal transmission can be prevented from being affected due to a circuit failure caused by penetration of the cooling working medium into the substrate, and the problem of a sealing failure caused by accelerated aging of an adhesive layer between the substrate and the housing due to long-term immersion in the cooling working medium can also be avoided.

Description

Heat dissipation system and electronic equipment with anti-permeability layer

[0001] This invention claims priority to a Chinese patent application filed with the State Intellectual Property Office on March 4, 2024, with application number 202410247923.0 and application name “Heat dissipation system and electronic device with anti-permeability layer”, the entire contents of which are incorporated herein by reference. Technical Field

[0002] The present application relates to the technical field of heat dissipation of electronic components, and in particular to a heat dissipation system and electronic equipment with an anti-penetration layer. Background Art

[0003] Liquid cooling technology is highly effective in dissipating heat from high-power chips. Typically, the chip is placed in a sealed chamber, with the chip's substrate serving as the chamber's floor. Coolant is injected into the chamber, allowing the coolant to contact the chip for heat exchange, thus dissipating heat and cooling the chip. However, this method can cause the coolant to penetrate the substrate, potentially leading to abnormalities in the substrate's electrical signal transmission. Summary of the Invention

[0004] In view of this, the present application provides a heat dissipation system and electronic device with an anti-penetration layer to solve the problem that the above-mentioned existing liquid cooling technology easily penetrates into the substrate and causes abnormal signal transmission.

[0005] In a first aspect, an embodiment of the present application provides a heat dissipation system with an anti-permeation layer, comprising a substrate, a housing, and at least one anti-permeation layer. A heating element is disposed on the substrate. The housing is connected to the substrate, and a housing space for filling a cooling medium is enclosed between the housing and the substrate, and the heating element is disposed in the housing space. The anti-permeation layer at least partially covers the surface of the substrate that is exposed to the housing space, and also covers the connection between the housing and the substrate and the connection between the heating element and the substrate.

[0006] In the present application, by setting the above-mentioned anti-permeation layer, it is possible to prevent the cooling medium from penetrating into the interior of the substrate and causing circuit failure, affecting signal transmission, and also to prevent the adhesive layer between the substrate and the shell from being immersed in the cooling medium for a long time and accelerating aging, resulting in sealing failure.

[0007] In one possible design, the anti-permeability layer includes a base layer and a protective layer, wherein the base layer covers the surface of the substrate that is exposed in the accommodating space, and also covers the connection position between the shell and the substrate and the connection position between the heating element and the substrate. The protective layer covers at least part of the surface of the base layer. Among them, the base layer can effectively isolate the penetration of the cooling medium, while ensuring the overall structural reliability of the anti-permeability layer and having a high service life. The protective layer has insulating properties and can isolate the cooling medium from penetrating to one side of the base layer. The protective layer also has high thermal conductivity and anti-oxidation properties, which can enable the heat generated by the heating element to be quickly transferred in the Z direction, thereby improving the heat dissipation efficiency, wherein the Z direction refers to the thickness direction of the protective layer. At the same time, the anti-oxidation property of the protective layer is also conducive to extending the service life of the anti-permeability layer.

[0008] In one possible design, the protective layer is provided with a first hollow portion, and along the thickness direction of the anti-permeation layer, the projection of the first hollow portion is at least partially aligned with the projection of the heating element. As a result, the thickness of the anti-permeation layer above the heating element is relatively reduced, which can shorten the heat transfer path of the heating element, thereby facilitating the improvement of the efficiency of heat exchange between the heating element and the cooling medium. In one embodiment, the anti-permeation layer can cover the edge area of ​​the heating element, that is, within a certain width range of the edge of the heating element, the projection of the anti-permeation layer coincides with the projection of the heating element, thereby preventing the working medium from penetrating from the edge of the heating element into the substrate.

[0009] In one possible design, the base layer is provided with a second hollow portion, and along the thickness direction of the anti-permeability layer, the projection of the second hollow portion is at least partially aligned with the projection of the first hollow portion. As a result, the anti-permeability layer can be completely hollowed out in the Z direction at the position aligned with the heating element, allowing the surface of the heating element away from the base layer to directly contact the coolant, thereby further improving heat dissipation efficiency.

[0010] In one possible design, the anti-permeability layer is a continuous layered structure, at least partially covering the surfaces of the substrate and the heating element that are exposed to the accommodating space. This ensures complete coverage of the heating element and the surface of the substrate within the accommodating space, eliminating gaps through which the cooling medium could leak, thereby ensuring reliable isolation of the cooling medium.

[0011] In one possible design, the protective layer includes at least one anti-oxidation layer and at least one thermally conductive layer, with the thermally conductive layer disposed between the anti-oxidation layer and the base layer. The anti-oxidation layer improves the overall oxidation resistance of the anti-permeability layer, thereby increasing its service life. Furthermore, the thermally conductive layer enhances the thermal conductivity of the anti-permeability layer, improving heat dissipation efficiency.

[0012] In one possible design, the protective layer is provided with one layer. The material of the protective layer can be a material with thermal conductivity, corrosion resistance, and oxidation resistance, such as oxidation-resistant nickel Ni, so that the protective layer has both high thermal conductivity and oxidation resistance.

[0013] In one possible design, the thickness of the protective layer is between 1 nm and 500 um, thereby achieving effective heat conduction and improving heat dissipation efficiency while ensuring the structural strength of the protective layer.

[0014] In a possible design, the thickness of the base layer is between 1 nm and 100 um, which can not only improve the structural strength of the base layer and ensure effective isolation of the cooling medium, but also ensure good heat dissipation effect.

[0015] In one possible design, the base layer is made of metal. A base layer made of metal can effectively isolate the cooling medium from penetrating, while ensuring the overall structural reliability of the anti-permeation layer and having a longer service life.

[0016] In one possible design, the anti-permeation layer is made of a material selected from the group consisting of metals, metal compounds, ceramics, and polymers. These materials can effectively insulate the cooling medium while also providing the anti-permeation layer with good thermal conductivity, allowing at least a portion of the heat generated by the heating element to be transferred to the cooling medium through the anti-permeation layer.

[0017] In one possible design, an adhesive layer is provided between the housing and the substrate, and the housing and the substrate are sealed and bonded together by the adhesive layer. Adhesion can facilitate assembly of the housing and the substrate while ensuring a sealing effect between the substrate and the housing.

[0018] In one possible design, the housing includes a wall panel and a cover panel. One end of the wall panel is connected to the base panel via the adhesive layer, and the other end of the wall panel is connected to the cover panel. The cover panel, the wall panel, and the base panel enclose the housing space. By using a separate connection between the cover panel and the wall panel, the cover panel and the wall panel can be manufactured separately, reducing the process difficulty. It also facilitates the separate assembly and disassembly of the cover panel and the wall panel for maintenance.

[0019] In a possible design, the cover plate and the wall plate are connected and fixed by a connector, wherein the connector can be a screw, a rivet, etc., so as to facilitate the connection and fixation of the cover plate and the wall plate.

[0020] In one possible design, the heat dissipation system further includes a seal disposed between the mating interface of the cover plate and the wall plate. The seal may be an O-ring or other sealing ring to ensure a gap-free space between the cover plate and the wall plate, thereby preventing leakage of the cooling medium.

[0021] In one possible design, the cover plate is provided with a liquid injection port that communicates with the accommodating space. A cooling medium can be injected into the accommodating space through the liquid injection port. When the heating element contacts the cooling medium, heat exchange can occur, thereby achieving rapid heat dissipation and cooling of the heating element.

[0022] In one possible design, at least a portion of the anti-permeation layer extends to the mating interface between the cover plate and the wall plate. The wall plate has a certain height in the thickness direction of the substrate, that is, the height of the wall plate limits the depth of the space used to accommodate the cooling medium. The end face of the wall plate away from the substrate is perpendicular to the thickness direction of the substrate and can be sealed with the cover plate to form a mating interface. Since the liquid level of the cooling medium can only reach a certain position in the height of the wall plate, and the inner wall surface of the wall plate in the height direction is covered by the anti-permeation layer, the cooling medium can be effectively isolated. The edge of the anti-permeation layer is located at the end of the wall plate away from the substrate, and the cooling medium cannot reach the edge of the anti-permeation layer, thereby effectively preventing the cooling medium from penetrating from the edge of the anti-permeation layer to between the anti-permeation layer and the shell and substrate.

[0023] In a possible design, the heat dissipation system further includes an insulating member, which covers the surface of the substrate that is exposed in the accommodating space, and the edges of the insulating member abut against the heating element and the inner wall of the shell respectively. At least part of the anti-permeability layer covers the surface of the insulating member that is exposed in the accommodating space, and also covers the mating position of the insulating member and the heating element, and the mating position of the insulating member and the inner wall of the shell. The insulating member can be a resin material encapsulated on at least part of the surface exposed on the substrate, as well as an adhesive layer encapsulated at the mating position of the substrate and the shell, and at the mating position of the substrate and the chip. Thus, the insulating member can isolate water vapor to protect the substrate and the adhesive layer.

[0024] In one possible design, the thickness of the insulating member is greater than that of the adhesive layer, and the side surfaces of the insulating member abut against the inner wall of the housing and the adhesive layer. Thus, the side surfaces of the insulating member completely cover the side surfaces of the adhesive layer, thereby isolating the coolant from contacting the adhesive layer and causing adhesive layer degradation.

[0025] In one possible design, the anti-permeability layer further includes an anti-scouring layer, which is disposed on the surface of the protective layer. The anti-scouring layer can enhance the anti-scouring property of the anti-permeability layer and extend its service life.

[0026] In a possible design, the material of the erosion-resistant layer is ceramic, which has good erosion-resistant properties and can meet the requirements of the heat dissipation system for the erosion-resistant layer.

[0027] In a second aspect, the present application further provides an electronic device, which includes the heat dissipation system with an anti-permeability layer provided in the first aspect of the present application.

[0028] It should be understood that the foregoing general description and the following detailed description are merely illustrative and are not restrictive of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0030] FIG1 is a schematic structural diagram of a heat dissipation system provided in a first embodiment of the present application;

[0031] FIG2 is a partial enlarged view of point A in FIG1 ;

[0032] FIG3 is a schematic structural diagram of a heat dissipation system provided in a second embodiment of the present application;

[0033] FIG4 is a partial enlarged view of point B in FIG1 ;

[0034] FIG5 is a schematic structural diagram of a heat dissipation system provided in a third embodiment of the present application;

[0035] FIG6 is a schematic structural diagram of a heat dissipation system provided in a fourth embodiment of the present application;

[0036] FIG7 is a schematic structural diagram of a heat dissipation system provided in a fifth embodiment of the present application;

[0037] FIG8 is a schematic structural diagram of a heat dissipation system provided in a sixth embodiment of the present application;

[0038] FIG9 is a schematic structural diagram of a heat dissipation system provided in a sixth embodiment of the present application;

[0039] FIG10 is a partial enlarged view of point C in FIG1 .

[0040] Figure numerals: 1-substrate; 2-shell; 21-cover plate; 211-liquid filling port; 22-wall plate; 3-anti-permeation layer; 31-protective layer; 311-first hollow portion; 312-anti-oxidation layer; 313-heat-conducting layer; 32-base layer; 321-second hollow portion; 33-erosion-resistant layer; 4-heating element; 5-accommodating space; 6-glue layer; 7-sealing member; 8-insulating member; 9-connecting member; Z-thickness direction. DETAILED DESCRIPTION

[0041] In order to better understand the technical solution of the present application, the embodiments of the present application are described in detail below with reference to the accompanying drawings.

[0042] It should be clear that the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0043] The terms used in the embodiments of the present application are for the purpose of describing specific embodiments only and are not intended to limit the present application. The singular forms "a", "an", "the" and "the" used in the embodiments of the present application and the appended claims are also intended to include plural forms unless the context clearly indicates otherwise.

[0044] It should be understood that the term "and / or" as used herein simply describes a relationship between associated objects, indicating that three possible relationships exist. For example, "A and / or B" can represent: A alone, A and B together, or B alone. Furthermore, the character " / " in this document generally indicates an "or" relationship between the associated objects.

[0045] In the description of this application, unless otherwise specified or limited, the terms "first" and "second" are used for descriptive purposes only and are not to be understood as indicating or implying relative importance; unless otherwise specified or explained, the term "plurality" refers to two or more; the terms "connected" and "fixed" should be understood in a broad sense. For example, "connected" can mean a fixed connection, a detachable connection, an integral connection, or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium. For those skilled in the art, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0046] Liquid cooling technology has a significant effect on the heat dissipation of high-power chips. Generally speaking, the chip is mounted on a substrate, and the chip needs to be placed in a closed chamber, wherein the chip substrate can serve as the bottom plate of the chamber. By injecting coolant into the chamber, the coolant is in contact with the chip for heat exchange, thereby achieving heat dissipation and cooling of the chip. However, in this way, the coolant is in direct contact with the substrate, which will cause the coolant to penetrate into the substrate, thereby causing abnormal electrical signal transmission of the substrate. In addition, when considering connecting the substrate to the bottom of the chamber through an adhesive layer, the adhesive layer will be soaked in the coolant, which will also cause the adhesive layer to age and the sealing effect of the adhesive layer to deteriorate.

[0047] To this end, an embodiment of the present application provides a heat dissipation system (hereinafter referred to as the heat dissipation system) with an anti-penetration layer. The heat dissipation system can be used in electronic devices, which may include servers, terminals and other devices. The electronic device may also include a cabinet, a frame and other complete machine structures to carry the heat dissipation system. The heat dissipation system includes a substrate 1, a shell 2 and at least one layer of an anti-penetration layer 3. Figure 1 is a structural schematic diagram of the heat dissipation system provided by an embodiment of the present application. Referring to Figure 1, a heating element 4 is provided on the substrate 1. The substrate 1 can be a printed circuit board (PCB). The substrate 1 can be a single-layer structure or a multi-layer composite structure. A wiring layer is provided in the substrate 1, which can supply power to various components connected to the substrate 1. The substrate 1 can be electrically connected to other circuit boards. For example, the heating element 4 can be a system-on-chip (SOC), a power module, etc. The heating element 4 can be electrically connected to the substrate 1. During operation, the heating element 4 will generate relatively high heat, which can be dissipated through the heat dissipation system.

[0048] 1, the housing 2 is connected to the base plate 1. The housing 2 may include a wall plate 22 and a cover plate 21. The wall plate 22 may be connected to the circumference of the cover plate 21. The end of the wall plate 22 away from the cover plate 21 may be connected to the base plate 1 by gluing or other methods. Thus, the cover plate 21, the wall plate 22 and the base plate 1 may enclose a space 5 for accommodating a cooling medium. At the same time, the heating element 4 may be placed in the space 5 enclosed between the housing 2 and the base plate 1. The housing 2 may be an integrally formed structure, that is, the wall plate 22 and the cover plate 21 may be formed at one time during the molding process of the housing 2, thereby ensuring the reliability of the housing 2 structure and facilitating manufacturing. Of course, in other embodiments, the cover plate 21 and the wall plate 22 may be separately formed. The wall plate 22 may be an integral frame structure. The cover plate 21 may be detachably mounted on the wall plate 22, for example, by fastening the cover plate 21 and the wall plate 22 to each other using a connector 9 such as a screw, thereby facilitating the extraction and replacement of the cooling medium in the housing 2.

[0049] 1 , a liquid injection port 211 may be provided on the housing 2, and a cooling medium may be injected into the accommodating space 5 through the liquid injection port 211. When the heating element 4 contacts the cooling medium, heat exchange may be performed, thereby achieving rapid heat dissipation and cooling of the heating element 4. The cooling medium may be a water medium or a non-aqueous medium. In one embodiment, the cooling medium may be sputtered onto the heating element 4 through the liquid injection port 211 under a certain pressure by sputtering, or the cooling medium may be poured into the accommodating space 5 by immersion, so that the heating element 4 is immersed in the cooling medium. All of the above methods can achieve heat dissipation and cooling of the heating element 4.

[0050] The heating element 4 that needs to dissipate heat can be covered by the housing 2 and placed in the accommodating space 5 between the housing 2 and the substrate 1. At the same time, in the accommodating space 5, the portion of the substrate 1 outside the heating element 4 will leak out of the accommodating space 5. If this exposed portion of the substrate 1 is not blocked, it will come into direct contact with the cooling medium, which will penetrate into the substrate 1 and come into contact with the wiring layer within the substrate 1, causing circuit failure. In addition, the adhesive layer 6 at the location where the substrate 1 connects to the housing 2 will also be immersed in the cooling medium, which will also cause accelerated aging of the adhesive layer 6 and cause the sealing of the adhesive layer 6 to fail.

[0051] To this end, with reference to FIG1 , the embodiment of the present application is provided with at least one layer of an anti-permeation layer 3. For example, the anti-permeation layer 3 may have only one layer or may have multiple layers. The anti-permeation layer 3 has the function of preventing the cooling medium from penetrating, that is, it can prevent the cooling medium located on one side of the anti-permeation layer 3 from penetrating to the other side of the anti-permeation layer 3. The anti-permeation layer 3 can be formed on the surface of the structure such as the housing 2, the substrate 1, the heating element 4 by processes such as physical vapor deposition (PVD), chemical vapor deposition (CVD), atomic layer deposition (ALD), electroplating, etc. In one embodiment, the material of the anti-permeation layer 3 can be a combination of one or more of metal, metal compound, ceramic or polymer, so as to achieve effective isolation of the cooling medium and enable the anti-permeation layer 3 to have good thermal conductivity, so that at least part of the heat generated by the heating element 4 can be conducted to the cooling medium through the anti-permeation layer 3.

[0052] In one embodiment, at least a portion of the anti-permeation layer 3 can cover the surface of the substrate 1 that leaks out into the accommodating space 5, and also cover the connection position between the shell 2 and the substrate 1 and the connection position between the heating element 4 and the substrate 1. That is to say, in the accommodating space 5, the leaking portion of the substrate 1 outside the heating element 4 can be covered by the anti-permeation layer 3, and the anti-permeation layer 3 can isolate the cooling medium from direct contact with the substrate 1, thereby preventing the cooling medium from penetrating into the interior of the substrate 1. The anti-permeation layer 3 can also cover the position where the shell 2 is connected to the substrate 1 to prevent the cooling medium from contacting the adhesive layer 6 between the substrate 1 and the shell 2, thereby preventing the adhesive layer 6 from being soaked by the cooling medium and aging. The anti-permeation layer 3 can also cover the connection position between the heating element 4 and the substrate 1 to prevent the cooling medium from penetrating into the interior of the substrate 1 from the connection position between the heating element 4 and the substrate 1.

[0053] Therefore, the embodiment of the present application can prevent the cooling medium from penetrating into the interior of the substrate 1 and causing circuit failure, affecting signal transmission, by providing the above-mentioned anti-permeation layer 3. It can also prevent the adhesive layer 6 between the substrate 1 and the shell 2 from being immersed in the cooling medium for a long time and accelerating aging, resulting in sealing failure.

[0054] In one embodiment, FIG2 is a partial enlarged view of point A in FIG1. ​​Referring to FIG2, the anti-permeability layer 3 includes a base layer 32 and a protective layer 31. The base layer 32 covers the surface of the substrate 1 that is exposed in the accommodating space 5, and also covers the connection position between the shell 2 and the substrate 1 and the connection position between the heating element 4 and the substrate 1. The protective layer 31 covers at least a portion of the surface of the base layer 32. Among them, the base layer 32 can be first coated on the corresponding surfaces of the shell 2, the substrate 1 and the heating element 4, and then the protective layer 31 can be coated on the base layer 32. Both the base layer 32 and the protective layer 31 can be formed by the aforementioned PVD, CVD, ALD, electroplating and other processes. The base layer 32 can be a metal layer prepared by a metal material. For example, the base layer 32 can be a metal layer prepared by a metal such as titanium Ti, Cu copper, etc. This metal layer can be provided with one or more layers. The base layer 32 made of a metal material can effectively isolate the penetration of the cooling medium, and at the same time is conducive to the subsequent growth of a protective layer on the metal layer by processes such as electroplating. In addition, the metal layer can also ensure the overall structural reliability of the anti-permeation layer 3 and has a long service life.

[0055] The protective layer 31 has insulating properties, preventing the coolant from penetrating toward one side of the base layer 32. The protective layer 31 also has high thermal conductivity and oxidation resistance, enabling rapid heat transfer from the heating element 4 in the Z direction, where the Z direction refers to the thickness of the protective layer, thereby improving heat dissipation efficiency. The oxidation resistance of the protective layer 31 also helps extend the service life of the anti-permeability layer 3.

[0056] In one embodiment, the protective layer 31 may have one layer, and the material of the protective layer 31 may be a material that is heat-conductive, corrosion-resistant, and oxidation-resistant, such as oxidation-resistant nickel Ni, so that the protective layer 31 of one layer has both high thermal conductivity and oxidation resistance. In one embodiment, Figure 3 is a structural schematic diagram of the heat dissipation system provided by the second embodiment of the present application, and Figure 4 is a partial enlarged view at B in Figure 1. Referring to Figure 4, the protective layer 31 may also have multiple layers. For example, the protective layer 31 includes at least one anti-oxidation layer 312 and at least one heat-conducting layer 313, and the heat-conducting layer 313 is arranged between the anti-oxidation layer 312 and the base layer 32. Among them, the heat-conducting layer 313 can be made of a heat-conducting material, and the anti-oxidation layer 312 is made of a material with anti-oxidation properties. For example, the heat-conducting layer 313 and the anti-oxidation layer 312 can each be provided with one layer, and the anti-oxidation layer 312, the heat-conducting layer 313 and the base layer 32 are stacked in sequence. For example, the heat-conducting layer 313 and the anti-oxidation layer 312 may each be provided with multiple layers, with at least one anti-oxidation layer 312 being the outermost layer of the anti-permeation layer 3, i.e., located on the side furthest from the base layer 32. Thus, the outermost anti-oxidation layer 312 can enhance the overall anti-oxidation properties of the anti-permeation layer 3, thereby increasing its service life. Furthermore, the heat-conducting layer 313 can enhance the thermal conductivity of the anti-permeation layer 3, thereby improving heat dissipation efficiency.

[0057] In one embodiment, referring to Figure 3, the anti-permeability layer 3 is a continuous layered structure. This continuous coating can cover the surface of the substrate 1 and the surface of the heating element 4 in the accommodating space 5, as well as at least part of the inner surface of the shell 2, thereby achieving complete coverage of the heating element 4 and the surface of the substrate 1 located in the accommodating space 5, and there is no gap through which the cooling medium can leak, thereby ensuring the reliability of isolating the cooling medium.

[0058] In one embodiment, FIG5 is a schematic structural diagram of a heat dissipation system provided by the third embodiment of the present application. Referring to FIG5 , the protective layer 31 is provided with a first hollow portion 311. Along the thickness direction of the anti-permeation layer, the projection of the first hollow portion 311 is at least partially aligned with the projection of the heating element 4. That is, the thickness of the anti-permeation layer 3 above the heating element 4 is relatively reduced, which can shorten the heat transfer path of the heating element 4, thereby helping to improve the efficiency of heat exchange between the heating element 4 and the cooling medium. In one embodiment, the anti-permeation layer 3 can cover the edge area of ​​the heating element, that is, within a certain width range of the edge of the heating element 4, the projection of the anti-permeation layer 3 coincides with the projection of the heating element 4, thereby preventing the medium from penetrating from the edge of the heating element 4 into the substrate 1.

[0059] In one embodiment, referring to Figure 5, the base layer 32 can be a continuous coating, that is, the base layer 32 can cover the surface of the heating element 4, and the protective layer 31 has the aforementioned first hollow portion 311, that is, the thickness of the anti-permeability layer 3 at the position where it is aligned with the heating element 4 is smaller than that at other positions, thereby shortening the heat conduction path on the heating element 4, so that the heat of the heating element 4 can be conducted to the cooling medium through the base layer 32, thereby accelerating the heat dissipation efficiency.

[0060] In one embodiment, Figure 6 is a structural schematic diagram of the heat dissipation system provided by the fourth embodiment of the present application. Referring to Figure 6, the base layer 32 may also be provided with a second hollow portion 321. Along the thickness direction of the anti-permeation layer 3, the projection of the second hollow portion 321 is at least partially aligned with the projection of the first hollow portion 311. That is to say, the anti-permeation layer 3 can be completely hollowed out in the Z direction at the position aligned with the heating element 4, so that the surface of the heating element 4 away from the substrate 1 can be in direct contact with the cooling medium, thereby further accelerating the heat dissipation efficiency.

[0061] In one embodiment, the thickness of the protective layer 31 needs to be within a certain range. For example, if the thickness of the protective layer 31 is greater than 500 μm, the heat dissipation path of the heating element 4 will be extended, resulting in a negative impact on the heat dissipation effect of the heating element 4. If the thickness of the protective layer 31 is less than 1 nm, the protective layer 31 is prone to local cracks, and the function of the protective layer 31 cannot be effectively exerted. Therefore, in this embodiment, the thickness of the protective layer 31 can be between 1 nm and 500 μm, so as to achieve effective heat conduction and improve heat dissipation efficiency while ensuring the structural strength of the protective layer 31.

[0062] In one embodiment, the thickness of the base layer 32 also needs to be within a certain range. For example, if the thickness of the base layer 32 is greater than 100um, the heat dissipation path of the heating element 4 will be extended, resulting in a negative impact on the heat dissipation effect of the heating element 4. If the thickness of the base layer 32 is less than 1nm, the local structural strength of the base layer 32 is weak and prone to cracking, causing the cooling medium to penetrate into the substrate 1. To this end, in this embodiment, the thickness of the base layer 32 can be between 1nm and 100um, thereby improving the structural strength of the base layer 32, ensuring effective isolation of the cooling medium, and ensuring good heat dissipation effect.

[0063] In one embodiment, as described above, the cover plate 21 and the wall plate 22 of the housing 2 can be fastened in a detachable manner, for example, by fastening the cover plate 21 and the wall plate 22 with fasteners 9 such as screws or rivets. To ensure sealing at the interface between the cover plate 21 and the wall plate 22, referring to FIG. 1 , a seal 7 can be provided at the interface between the cover plate 21 and the wall plate 22. The seal 7 can be an O-ring or other sealing ring to ensure a gap-free connection between the cover plate 21 and the wall plate 22, thereby preventing leakage of the cooling medium.

[0064] In one embodiment, referring to FIG1 , at least a portion of the anti-permeation layer 3 extends to the mating interface between the cover plate 21 and the wall plate 22. The wall plate 22 has a certain height in the thickness direction Z of the substrate 1. That is, the height of the wall plate 22 defines the depth of the space for accommodating the cooling medium. The end surface of the wall plate 22 away from the substrate 1 is perpendicular to the thickness direction Z of the substrate 1 and can be sealed with the cover plate 21 to form a mating interface. Since the liquid level of the cooling medium can only reach a certain position in the height of the wall plate 22, and the inner wall surface of the wall plate 22 in the height direction is covered by the anti-permeation layer 3, the cooling medium can be effectively isolated. The edge of the anti-permeation layer 3 is located at the end of the wall plate 22 away from the substrate 1. The cooling medium cannot reach the edge of the anti-permeation layer 3, thereby effectively preventing the cooling medium from penetrating from the edge of the anti-permeation layer 3 to between the anti-permeation layer 3 and the shell 2, i.e., the substrate 1.

[0065] In one embodiment, as described above, a seal 7 is provided between the cover plate 21 and the wall plate 22. Referring to FIG1 , the anti-permeation layer 3 can extend to a certain position on the wall plate 22 located inside the seal 7, that is, there is no anti-permeation layer 3 at the seal 7 and outside the seal 7. In one embodiment, FIG7 is a structural schematic diagram of the heat dissipation system provided by the fifth embodiment of the present application. Referring to FIG7 , the anti-permeation layer 3 can also extend to a certain position on the wall plate 22 located outside the seal 7, that is, the seal 7 abuts the anti-permeation layer 3. In one embodiment, FIG8 is a structural schematic diagram of the heat dissipation system provided by the sixth embodiment of the present application. Referring to FIG8 , the anti-permeation layer 3 includes a base layer 32 and a protective layer 31. Only the base layer 32 can extend to a certain position on the wall plate 22 located outside the seal 7, and the seal 7 abuts the base layer, while the protective layer 31 extends to a certain position on the wall plate 22 located inside the seal 7, and the protective layer 31 does not abut the seal 7. The various extension modes of the anti-permeation layer 3 can all achieve effective isolation of the cooling medium. At the same time, the cooperation between the anti-permeation layer 3 and the sealing member 7 can ensure sealing.

[0066] In one embodiment, referring to FIG1 , the heat dissipation system further comprises an insulating member 8, which covers the surface of the substrate 1 that is exposed in the accommodating space 5, and the edges of the insulating member 8 respectively abut the heating element 4 and the inner wall of the housing 2. At least a portion of the anti-permeation layer 3 covers the surface of the insulating member 8 that is exposed in the accommodating space 5, and also covers the mating position between the insulating member 8 and the heating element 4 and the mating position between the insulating member 8 and the inner wall of the housing 2. The insulating member 8 can be a resin material encapsulated on at least a portion of the surface exposed on the substrate 1, as well as the adhesive layer 6 encapsulated at the mating position between the substrate 1 and the housing 2, and the mating position between the substrate 1 and the chip. Thus, the insulating member 8 can isolate water vapor to protect the substrate 1 and the adhesive layer 6. In one embodiment, the upper surface of the insulating member 8 is flush with the upper surface of the heating element 4, so that the anti-permeation layer 3 can be easily coated on the surface of the insulating member 8 and the heating element 4, which is convenient for process processing.

[0067] In one embodiment, the thickness of the insulating member 8 is greater than the thickness of the adhesive layer 6, and the side surfaces of the insulating member 8 abut against the inner wall of the housing 2 and the adhesive layer 6. Thus, the side surfaces of the adhesive layer 6 can be completely covered by the side surfaces of the insulating member 8, thereby isolating the adhesive layer 6 from contact with the cooling medium and causing aging of the adhesive layer 6.

[0068] In one embodiment, FIG9 is a schematic structural diagram of a heat dissipation system provided in a sixth embodiment of the present application, and FIG10 is a partial enlarged view of position C in FIG1 . Referring to FIG10 , the anti-permeability layer 3 further includes an erosion-resistant layer 33, which is disposed on the surface of the protective layer 31. By providing the erosion-resistant layer 33, the erosion resistance of the anti-permeability layer 3 can be enhanced and the service life can be extended. The material of the erosion-resistant layer 33 is ceramic. For example, the material of the erosion-resistant layer 33 can be a ceramic or other type of erosion-resistant coating including SiO2, Al2O3, etc., and these materials can all achieve good erosion resistance.

[0069] The above are merely preferred embodiments of the present application and are not intended to limit the present application. Those skilled in the art will readily appreciate that various modifications and variations are possible. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present application shall be included within the scope of protection of the present application.

Claims

1. A heat dissipation system with an anti-permeation layer, characterized in that: include: a substrate, on which a heating element is disposed; a housing connected to the substrate, wherein the housing and the substrate enclose an accommodating space for filling a cooling medium, and the heating element is disposed in the accommodating space; At least one anti-permeation layer, at least part of which covers the surface of the substrate exposed in the accommodating space, and also covers the connection position between the shell and the substrate and the connection position between the heating element and the substrate.

2. The heat dissipation system with an anti-permeation layer according to claim 1, characterized in that: The anti-permeation layer includes a base layer and a protective layer, wherein the base layer covers the surface of the substrate exposed to the accommodating space, and also covers the connection position between the housing and the substrate and the connection position between the heating element and the substrate; The protective layer covers at least a portion of the surface of the base layer.

3. The heat dissipation system with an anti-permeation layer according to claim 2, characterized in that: The protective layer is provided with a first hollow portion, and along the thickness direction of the anti-permeation layer, the projection of the first hollow portion is at least partially aligned with the projection of the heating element.

4. The heat dissipation system with an anti-permeation layer according to claim 3, characterized in that: The base layer is provided with a second hollow portion, and along the thickness direction of the anti-permeation layer, the projection of the second hollow portion is at least partially aligned with the projection of the first hollow portion.

5. The heat dissipation system with an anti-permeation layer according to claim 1 or 2, characterized in that: The anti-permeability layer is a continuous layered structure, and at least a portion of the anti-permeability layer covers the surfaces of the substrate and the heating element that are exposed in the accommodating space.

6. The heat dissipation system with an anti-permeation layer according to any one of claims 2 to 5, characterized in that: The protective layer includes at least one anti-oxidation layer and at least one heat-conducting layer, and the heat-conducting layer is arranged between the anti-oxidation layer and the base layer.

7. The heat dissipation system with an anti-permeation layer according to any one of claims 2 to 5, characterized in that: The protective layer is provided with one layer.

8. The heat dissipation system with an anti-permeation layer according to any one of claims 2 to 5, characterized in that: The thickness of the protective layer is between 1 nm and 500 μm.

9. The heat dissipation system with an anti-permeation layer according to any one of claims 2 to 8, characterized in that: The thickness of the base layer is between 1 nm and 100 um.

10. The heat dissipation system with an anti-permeation layer according to any one of claims 2 to 8, characterized in that: The base layer is made of metal.

11. The heat dissipation system with an anti-permeation layer according to any one of claims 1 to 10, characterized in that: The material of the anti-permeation layer is one or more combinations of metals, metal compounds, ceramics or polymers.

12. The heat dissipation system with an anti-permeation layer according to any one of claims 1 to 11, characterized in that: An adhesive layer is provided between the shell and the substrate, and the shell and the substrate are sealed and bonded via the adhesive layer.

13. The heat dissipation system with an anti-permeation layer according to claim 12, characterized in that: The shell includes a wall plate and a cover plate, one end of the wall plate is connected to the base plate through the adhesive layer, and the other end of the wall plate is connected to the cover plate, and the cover plate, the wall plate and the base plate enclose the accommodating space.

14. The heat dissipation system with an anti-permeation layer according to claim 13, characterized in that: The cover plate and the wall plate are connected and fixed via a connecting piece.

15. The heat dissipation system with an anti-permeation layer according to claim 13 or 14, characterized in that: The invention also includes a sealing member, which is sealingly arranged between the mating interfaces of the cover plate and the wall plate.

16. The heat dissipation system with an anti-permeation layer according to any one of claims 13 to 15, characterized in that: At least a portion of the barrier layer extends between mating interfaces of the cover panel and the wall panel.

17. The heat dissipation system with an anti-permeation layer according to any one of claims 12 to 16, characterized in that: It also includes an insulating member, the insulating member covers the surface of the substrate exposed in the accommodating space, and the edges of the insulating member respectively abut against the heating element and the inner wall of the housing; At least a portion of the anti-permeability layer covers the surface of the insulating member exposed in the accommodating space, and also covers the matching position of the insulating member and the heating element and the matching position of the insulating member and the inner wall of the shell.

18. The heat dissipation system with an anti-permeation layer according to claim 17, characterized in that: The thickness of the insulating member is greater than the thickness of the adhesive layer, and the side surface of the insulating member abuts against the inner wall of the shell and the adhesive layer.

19. The heat dissipation system with an anti-permeation layer according to any one of claims 2 to 18, characterized in that: The anti-permeability layer further includes a scour-resistant layer, which is arranged on the surface of the protective layer.

20. The heat dissipation system with an anti-permeation layer according to claim 19, characterized in that: The material of the erosion-resistant layer is ceramic.

21. An electronic device, characterized in that: A heat dissipation system with an anti-permeation layer comprising the method according to any one of claims 1 to 20.

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