Circuit board assembly and electronic device

Abstract

The embodiments of the present application relate to the technical field of chips. Provided are a circuit board assembly and an electronic device. The circuit board assembly comprises a circuit board, an electronic component, a shielding structure and a heat dissipation structure, wherein the electronic component is arranged on the circuit board, and the shielding structure is arranged on the circuit board; a through opening is provided on the shielding structure at a position opposite to the circuit board, and at least part of the heat dissipation structure covers the through opening; and the heat dissipation structure and the shielding structure form a shielding cover, the shielding cover covering the electronic component. By means of the circuit board assembly provided in the present application, when the height of the electronic component is increased, there is no need to increase the height of the shielding cover; thus, the height of the shielding cover is reduced, the space occupied in the electronic devices is reduced, and thinning of the electronic device is facilitated. By integrating the heat dissipation structure as part of the shielding cover, while achieving heat dissipation of the electronic component, the heat dissipation structure can also provide electromagnetic shielding for the electronic component, thereby achieving multi-functionality of the heat dissipation structure.

Description

Circuit board assemblies and electronic devices

[0001] This application claims priority to the Chinese patent application filed with the China Patent Office on March 18, 2024, with application number 202420531926.2 and application name “Circuit Board Assembly and Electronic Device,” the entire contents of which are incorporated herein by reference. Technical Field

[0002] The present application relates to the field of chip technology, and in particular to a circuit board assembly and an electronic device. Background Art

[0003] With the continuous development of communication technology, the performance requirements for electronic equipment are getting higher and higher. The good working performance of electronic devices in electronic equipment is one of the important factors to ensure the high performance of electronic equipment. However, electronic devices will generate mutual electromagnetic interference when working, affecting the working performance of electronic devices and electronic equipment. In addition, the heat dissipation performance of electronic devices will also affect the working performance of electronic devices.

[0004] In the related art, to shield electronic devices, a shielding cover is often placed on a circuit board where the electronic devices are located. This creates a shielded space between the shielding cover and the circuit board. Electronic devices that are sensitive to electromagnetic interference are placed within this shielded space, thereby improving the anti-interference capabilities of the electronic devices within the shielded space. Furthermore, a heat sink is provided on the outside of the shielding cover to dissipate heat from the electronic devices.

[0005] However, since the shielding cover is placed on the electronic device, if the electronic device is relatively tall, the shielding cover will be relatively tall along the thickness direction of the circuit board. Combined with the thickness of the heat dissipation device, it will occupy a large space inside the electronic device, thereby restricting further thinning of the electronic device. Summary of the Invention

[0006] The embodiments of the present application provide a circuit board assembly and an electronic device, which can solve the technical problem that when the height of the electronic device is large, the height of the shielding cover along the thickness direction of the circuit board is large, and the thickness of the heat dissipation device will occupy a large space in the electronic device, thereby restricting the further thinning of the electronic device.

[0007] The first aspect of the present application provides a circuit board assembly, including a circuit board, an electronic device, a shielding structure and a heat dissipation structure; the electronic device is arranged on the circuit board; the shielding structure is arranged on the circuit board, and an opening is opened on the shielding structure at a position opposite to the circuit board; the heat dissipation structure at least partially covers the opening, the heat dissipation structure and the shielding structure form a shielding cover, and the shielding cover is arranged on the electronic device.

[0008] The circuit board assembly provided in the embodiment of the present application includes a circuit board, an electronic device arranged on the circuit board, and a shielding structure, with an opening opened on the shielding structure at a position opposite to the circuit board, and at least a portion of the heat dissipation structure covers the opening, so that the heat dissipation structure and the shielding structure together form a shielding cover to cover the electronic device, so that the part of the structure of the electronic device facing the opening can extend into the opening to occupy the height of the opening in the thickness direction of the circuit board, so that when the height of the electronic device increases, there is no need to increase the height of the shielding cover, thereby reducing the height of the shielding cover, reducing the space occupied in the electronic device, and facilitating further thinning of the electronic device.

[0009] Furthermore, by combining at least part of the heat dissipation structure with the shielding structure to form a shielding cover, the heat dissipation structure can not only dissipate heat for the electronic device, but can also form a shielding cover together with the shielding structure to realize the electromagnetic shielding function for the electronic device, thereby realizing the functional diversification of the heat dissipation structure.

[0010] In a possible implementation, the heat dissipation structure includes a metal shell and a heat dissipation medium disposed in the metal shell. At least a portion of the metal shell covers the through opening. The metal shell and the shielding structure form a shielding cover.

[0011] The heat dissipation structure comprises a metal shell and a heat dissipation medium disposed within the metal shell. Heat generated by the electronic device during operation is transferred through the metal shell to the heat dissipation medium, achieving heat exchange with the heat dissipation medium, thereby dissipating heat from the electronic device through the heat dissipation structure. Electromagnetic shielding is achieved by at least partially covering the opening with the metal shell.

[0012] In one possible implementation, the heat dissipation structure is a vapor chamber radiator or a liquid cooling radiator.

[0013] By configuring the heat dissipation structure as a vapor chamber radiator, heat exchange between the vapor chamber and the electronic device can be achieved. By configuring the heat dissipation structure as a liquid cooling radiator, liquid cooling of the electronic device can be achieved through the liquid cooling radiator.

[0014] In one possible implementation, a first gap is provided between the end of the shielding structure facing away from the circuit board and the heat dissipation structure. Providing the first gap between the end of the shielding structure facing away from the circuit board and the heat dissipation structure creates a buffer space between the shielding structure and the heat dissipation structure, preventing the heat dissipation structure from directly contacting the shielding structure when displaced toward the shielding structure by an external force. The first gap absorbs and disperses impact energy, slowing the transmission of the impact force and thereby reducing direct damage to the shielding structure from the heat dissipation structure.

[0015] When the heat dissipation structure is impacted, the spacer acts as a buffer, reducing the impact force transmitted to the shielding structure. This reduces the likelihood of damage to the shielding structure and protects the heat dissipation structure from damage. This mitigates the impact force exerted by the heat dissipation structure on the shielding structure, reducing the chance of damage and improving the stability of the circuit board assembly.

[0016] Furthermore, by providing the first gap, the heat dissipation structure is prevented from directly contacting the shielding structure, thereby reducing the possibility of heat being transferred to the surface of the shielding structure. This helps prevent the shielding structure from overheating and avoids the shielding structure from thermally impacting the electronic device or other components on the circuit board.

[0017] By setting a first gap between the heat dissipation structure and the shielding structure, a space for airflow can be provided between the heat dissipation structure and the shielding structure, so that the airflow can flow freely between the heat dissipation structure and the shielding structure, which helps to enhance the heat dissipation effect and improve the heat dissipation efficiency of electronic devices.

[0018] In one possible implementation, the first interval is greater than 0 mm and less than or equal to 0.05 mm.

[0019] By setting the spacing distance of the first interval in the thickness direction of the circuit board to be greater than 0mm and less than or equal to 0.05mm, it can ensure that a buffer space is formed between the heat dissipation structure and the shielding structure, while also avoiding the problem of poor shielding effect of the shielding cover composed of the heat dissipation structure and the shielding structure due to the first interval being too large.

[0020] In one possible implementation, the heat dissipation structure is connected to the circuit board via fasteners.

[0021] By connecting the heat dissipation structure to the circuit board through fasteners, the stability of the heat dissipation structure on the circuit board can be improved, and the connection stability between the circuit board and the heat dissipation structure can be improved, thereby improving the structural stability of the circuit board assembly.

[0022] In one possible implementation, the circuit board assembly also includes an elastic shielding member, which is arranged on the outer peripheral side of the shielding structure, one end of the elastic shielding member is connected to the circuit board or the shielding structure, and the other end of the elastic shielding member is pressed against the heat dissipation structure.

[0023] The circuit board assembly includes an elastic shielding part, and the elastic shielding part is arranged on the outer peripheral side of the shielding structure, and the end of the shielding structure facing away from the circuit board is pressed against the heat dissipation structure, so as to close the first gap between the heat dissipation structure and the shielding structure, thereby preventing the electromagnetic waves emitted by the electronic devices in the shielding structure from leaking from the first gap, thereby improving the shielding effect of the shielding cover formed by the shielding structure and the heat dissipation structure.

[0024] In a possible implementation, in the thickness direction of the circuit board, the height of the elastic shielding member is greater than the height of the shielding structure; and in the thickness direction of the circuit board, the compression amount of the elastic shielding member is greater than or equal to 40%.

[0025] By making the height of the elastic shielding part greater than the height of the shielding structure, the elastic shielding part can produce a certain amount of compression when the heat dissipation structure and the elastic shielding part are pressed together, and can make the elastic shielding part have a certain elastic restoring force after being pressed, and press the heat dissipation structure under the action of the elastic restoring force, thereby improving the contact tightness between the heat dissipation structure and the elastic shielding part, and thereby improving the shielding effect of the shielding cover.

[0026] In a possible implementation, a second interval exists between the elastic shielding component and the shielding structure.

[0027] By providing the second interval between the elastic shielding member and the shielding structure, the convenience of disassembly, assembly and maintenance of the elastic shielding member can be facilitated.

[0028] Furthermore, by setting a second interval, the probability of the elastic shielding part squeezing the shielding structure and causing deformation of the shielding structure due to tilting toward the shielding structure during the compression deformation process can be avoided, thereby further reducing the probability of damaging electronic devices or affecting the shielding effect due to deformation of the shielding structure, and improving the stability of the circuit board assembly.

[0029] In a possible implementation, the elastic shielding member is an elastic shielding member made of conductive foam.

[0030] By setting the elastic shielding member to be an elastic shielding member made of conductive foam, since the conductive foam has good electrical conductivity, it can effectively shield the electromagnetic waves at the first interval, reduce the leakage of electromagnetic waves at the first interval, and improve the anti-interference ability of the electronic device.

[0031] Furthermore, the conductive foam has a certain degree of softness and elasticity, which can provide good cushioning and protection, reducing the impact of vibration and impact generated when the heat dissipation structure is impacted on the shielding structure and electronic devices.

[0032] In addition, conductive foam has good thermal conductivity, which is beneficial to the transfer and dissipation of heat generated when electronic devices are working, and helps to maintain the working stability of electronic devices.

[0033] Conductive foam has good processability and cuttability, can be customized as needed, and is suitable for assembly requirements of various shapes and sizes. It improves the processing flexibility and practicality of elastic shielding parts and can reduce the manufacturing cost of elastic conductive parts.

[0034] In a possible implementation, the circuit board assembly further includes an insulating layer, which is disposed on a side of the heat dissipation structure facing the electronic device, and at least a portion of the insulating layer covers the through opening.

[0035] The circuit board assembly includes an insulating layer, which is arranged on the side of the heat dissipation structure facing the electronic device, and at least a portion of the insulating layer covers the through-hole, thereby avoiding electrical contact between the heat dissipation structure and the electronic device, thereby improving the working stability of the electronic device.

[0036] In a possible implementation, the insulating layer is a polyethylene terephthalate layer or a polyimide layer.

[0037] By setting the insulating layer as a polyethylene terephthalate layer or a polyimide layer, the insulation effect between the heat dissipation structure and the electronic device can be improved, electrical contact between the heat dissipation structure and the electronic device can be avoided, and the working stability of the electronic device can be improved.

[0038] In one possible implementation, the shielding structure includes a shielding frame having the through opening, the shielding frame is arranged around the outer periphery of the electronic device, the shielding frame is connected to the circuit board, and the heat dissipation structure is covered on the through opening.

[0039] The shielding structure includes a shielding frame, and the shielding frame is arranged on the outer peripheral side of the electronic device to electromagnetically shield the electronic device on the peripheral side of the electronic device, and electromagnetically shields the electronic device at the opening through a part of the heat dissipation structure.

[0040] In a possible implementation, the shielding frame has a first flange on a side facing the circuit board. The first flange is arranged around the outer periphery of the shielding frame, and the shielding frame is connected to the circuit board via the first flange.

[0041] By providing a first flange on the outer peripheral side of the shielding frame on the side of the shielding frame facing the circuit board, and connecting the shielding frame to the circuit board through the first flange, the contact area between the shielding frame and the circuit board can be increased, thereby improving the connection stability between the shielding frame and the circuit board.

[0042] In a possible implementation, a second flange is provided at one end of the shielding frame facing away from the circuit board, and an inner edge of the second flange forms the through opening.

[0043] By arranging a second flange at the end of the shielding frame facing away from the circuit board and forming a through opening through the inner edge of the second flange, the heat dissipation structure can be brought into contact with the shielding frame through the second flange when the heat dissipation structure is impacted toward the shielding structure, thereby increasing the contact area between the heat dissipation structure and the shielding frame, reducing damage to the heat dissipation structure caused by the shielding frame being too small due to the contact area between the heat dissipation structure and the shielding frame, and increasing the service life of the heat dissipation structure.

[0044] The second aspect of the present application provides an electronic device, which includes a rear shell and a circuit board assembly as described above; the circuit board assembly is arranged in the rear shell, and the heat dissipation structure in the circuit board assembly is connected to the circuit board in the circuit board assembly via a fastener; or, the heat dissipation structure is connected to the rear shell; or, the heat dissipation structure is connected to both the rear shell and the circuit board.

[0045] The electronic device provided in the embodiment of the present application arranges the circuit board assembly in the rear shell, opens a through opening on the shielding structure of the circuit board assembly at a position opposite to the circuit board, and forms a shielding cover with the heat dissipation structure and the shielding structure in the circuit board assembly to cover the electronic device. When the height of the electronic device increases, there is no need to increase the height of the shielding cover, thereby reducing the height of the shielding cover, which is conducive to the lightweight design of the electronic device.

[0046] Furthermore, by combining at least part of the heat dissipation structure with the shielding structure to form a shielding cover, the heat dissipation structure can not only dissipate heat for the electronic device, but can also form a shielding cover together with the shielding structure to realize the electromagnetic shielding function for the electronic device, thereby realizing the functional diversification of the heat dissipation structure.

[0047] The third aspect of the present application provides an electronic device, including a back shell, a circuit board, an electronic device and a shielding structure; the electronic device is arranged on the circuit board; the shielding structure is arranged on the circuit board, and an opening is opened on the shielding structure at a position opposite to the circuit board; a part of the back shell covers the opening, and a part of the back shell and the shielding structure form a shielding cover, and the shielding cover is arranged on the electronic device.

[0048] By setting a through-opening on the shielding structure at a position opposite to the circuit board, so that part of the electronic device can extend into the through-opening, when the height of the electronic device is increased, there is no need to increase the height of the shielding cover. Instead, a part of the rear shell is used to cover the through-opening on the shielding structure, so that a part of the rear shell and the shielding structure together form a shielding cover provided on the electronic device. This can avoid the use of other shielding parts to cover the through-opening, and can shorten the distance from the through-opening to the rear shell, thereby further reducing the circuit board assembly's occupation of the internal space of the electronic device, which is conducive to further thinning of the electronic device.

[0049] In one possible implementation, the circuit board assembly also includes an elastic shielding member, which is arranged on the outer peripheral side of the shielding structure, one end of the elastic shielding member is connected to the circuit board or the shielding frame, and the other end of the elastic shielding member is pressed against the inner wall of the rear shell.

[0050] By arranging an elastic shielding part on the outer peripheral side of the shielding structure, one end of the elastic shielding part is connected to the circuit board or the shielding frame, and the other end of the elastic shielding part is pressed against the inner wall of the rear shell, the electromagnetic waves leaked from the gap between the rear shell and the shielding structure can be shielded by the elastic shielding part, thereby improving the shielding performance of the shielding cover.

[0051] In a possible implementation, in the thickness direction of the circuit board, the height of the elastic shielding member is greater than the height of the shielding structure; and in the thickness direction of the circuit board, the compression amount of the elastic shielding member is greater than or equal to 40%.

[0052] By making the height of the elastic shielding part greater than the height of the shielding structure, the elastic shielding part can produce a certain amount of compression when the back shell and the elastic shielding part are pressed together, and can make the elastic shielding part have a certain elastic restoring force after being pressed, and press the back shell under the action of the elastic restoring force, thereby improving the contact tightness between the back shell and the elastic shielding part, and thereby improving the shielding effect of the shielding cover.

[0053] In a possible implementation, a second interval exists between the elastic shielding member and the shielding frame.

[0054] By providing the second interval between the elastic shielding member and the shielding structure, the convenience of disassembly, assembly and maintenance of the elastic shielding member can be facilitated.

[0055] Furthermore, by setting a second interval, the probability of the elastic shielding part squeezing the shielding structure and causing deformation of the shielding structure due to tilting toward the shielding structure during the compression deformation process can be avoided, thereby further reducing the probability of damaging electronic devices or affecting the shielding effect due to deformation of the shielding structure, and improving the stability of the use of electronic equipment.

[0056] In a possible implementation, the elastic shielding member is an elastic shielding member made of conductive foam.

[0057] By setting the elastic shielding member to be an elastic shielding member made of conductive foam, since the conductive foam has good electrical conductivity, it can effectively shield the electromagnetic waves at the first interval, reduce the leakage of electromagnetic waves at the first interval, and improve the anti-interference ability of the electronic device. BRIEF DESCRIPTION OF THE DRAWINGS

[0058] FIG1 is a schematic structural diagram of an electronic device provided in an embodiment of the present application;

[0059] FIG2 is an exploded view of an electronic device provided in an embodiment of the present application;

[0060] FIG3 is a schematic structural diagram of a circuit board assembly in the related art;

[0061] FIG4A is an exploded view of a circuit board assembly provided in an embodiment of the present application;

[0062] FIG4B is a cross-sectional schematic diagram of a circuit board assembly provided in an embodiment of the present application;

[0063] FIG5 is a cross-sectional schematic diagram of a second circuit board assembly provided in an embodiment of the present application;

[0064] FIG6 is a cross-sectional schematic diagram of a third circuit board assembly provided in an embodiment of the present application;

[0065] FIG7 is a cross-sectional schematic diagram of a fourth circuit board assembly provided in an embodiment of the present application;

[0066] FIG8 is a cross-sectional schematic diagram of a fifth circuit board assembly provided in an embodiment of the present application;

[0067] FIG9 is a cross-sectional schematic diagram of a sixth circuit board assembly provided in an embodiment of the present application;

[0068] FIG10 is a schematic cross-sectional view of the seventh circuit board assembly provided in an embodiment of the present application.

[0069] Explanation of the accompanying drawings: 10-circuit board assembly; 20-display screen; 30-back cover; 40-middle frame; 100-circuit board; 200-electronic device; 300-shielding structure; 310-through port; 320-first interval; 330-second interval; 340-shielding frame; 350-first flange; 360-second flange; 400-heat dissipation structure; 410-metal shell; 500-fastener; 600-elastic shielding member; 700-insulating layer; 10a-circuit board assembly; 100a-circuit board; 200a-electronic device; 300a-shielding cover; 400a-heat dissipation device. DETAILED DESCRIPTION

[0070] An embodiment of the present application provides an electronic device, including but not limited to a mobile phone (such as a bar phone or a foldable phone), a tablet computer, a laptop computer, an ultra-mobile personal computer (UMPC), a handheld computer, a walkie-talkie, a netbook, a POS machine, a personal digital assistant (PDA), a wearable device (such as a smart watch, a smart wristband, a pedometer), a virtual reality device, and other mobile or fixed terminals with circuit board assemblies.

[0071] Among them, in the embodiments of the present application, a mobile phone is taken as an example of the above-mentioned electronic device for description. The mobile phone can be a folding mobile phone, or a straight-screen mobile phone, or a sliding mobile phone. The following is a specific description taking a straight-screen mobile phone as an example.

[0072] FIG1 is a three-dimensional diagram of an electronic device provided in the present application, and FIG2 is an exploded diagram of an electronic device provided in the present application.

[0073] 1 and 2 , the electronic device may include a display screen 20, a rear cover 30, a middle frame 40, and a circuit board assembly 10, wherein the middle frame 40 is located between the display screen 20 and the rear cover 30. The rear cover 30 may be made of metal, such as aluminum, aluminum alloy, or aluminum-magnesium alloy.

[0074] 2 , the circuit board assembly 10 may be disposed on the display screen 20 . For example, the circuit board assembly 10 may be disposed on a side of the display screen 20 facing the rear housing 30 . The circuit board assembly 10 may also be connected to the rear housing 30 .

[0075] FIG3 is a schematic cross-sectional view of a circuit board assembly in the related art.

[0076] As electronic devices become thinner and lighter, one of the main factors limiting their thickness is the thickness of the circuit board assembly 10a, where electronic devices 200a, which are sensitive to electromagnetic interference, are located. Electronic devices 200a include, but are not limited to, motherboard system-on-a-chip (SoC). The thickness of the area where electronic devices 200a are located is relatively thick relative to other areas, hindering the overall thinning of the electronic device.

[0077] Referring to Figure 3, the main reason for this problem is that, in the prior art, electronic device 200a is disposed on circuit board 100a, shielding cover 300a is disposed over electronic device 200a, and heat sink 400a is disposed on the side of shielding cover 300a facing away from circuit board 100a, spaced apart from shielding cover 300a. Shielding cover 300a provides electromagnetic shielding for electronic device 200a, and heat sink 400a dissipates heat from electronic device 200a.

[0078] When using the shielding cover 300a and the heat dissipation device 400a in the prior art in Figure 3, as the thickness of the electronic device 200a increases, the height of the shielding cover 300a along the thickness direction also increases accordingly, so as to cover the electronic device 200a with increased thickness. Due to the increase in the thickness of the shielding cover 300a and the thickness of the heat dissipation device 400a, the thickness of the circuit board assembly 10a in the area of ​​the electronic device 200a increases, which will occupy a larger space in the thickness direction of the electronic device, thereby restricting further thinning of the electronic device.

[0079] With reference to Figures 4A and 4B , in response to the aforementioned technical issues, the present application provides a circuit board assembly 10 and an electronic device. The circuit board assembly 10 includes a circuit board 100, an electronic device 200, a shielding structure 300, and a heat dissipation structure. The electronic device 200 is disposed on the circuit board 100, and the shielding structure 300 is disposed on the circuit board 100. An opening 310 is defined in the shielding structure 300 at a position opposite the circuit board 100. The heat dissipation structure at least partially covers the opening 310. The heat dissipation structure and the shielding structure 300 form a shielding cover, which is disposed over the electronic device 200.

[0080] The circuit board assembly 10 provided in the embodiment of the present application includes a circuit board 100, an electronic device 200 arranged on the circuit board 100, and a shielding structure 300, and an opening 310 is opened on the shielding structure 300 at a position opposite to the circuit board 100, and at least a portion of the heat dissipation structure covers the opening 310, so that the heat dissipation structure and the shielding structure 300 together form a shielding cover to cover the electronic device 200, so that the part of the structure of the electronic device 200 facing the opening 310 can extend into the opening 310 to occupy the height of the opening 310 in the thickness direction of the circuit board 100, so that when the height of the electronic device 200 increases, there is no need to increase the height of the shielding cover, thereby reducing the height of the shielding cover, reducing the space occupied in the electronic device, and facilitating further thinning of the electronic device.

[0081] Furthermore, by combining at least a portion of the heat dissipation structure with the shielding structure 300 to form a shielding cover, the heat dissipation structure can not only dissipate heat for the electronic device 200, but can also form a shielding cover together with the shielding structure 300 to achieve electromagnetic shielding function for the electronic device 200, thereby realizing the functional diversification of the heat dissipation structure.

[0082] In order to make the above-mentioned purposes, features and advantages of the embodiments of the present application more obvious and easy to understand, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0083] 4A and 4B , the present application may provide a circuit board assembly, which may include a circuit board 100, an electronic device 200, a shielding structure 300, and a heat dissipation structure 400. The electronic device 200 is disposed on the circuit board 100, and the shielding structure 300 is disposed on the circuit board 100. An opening 310 is defined in the shielding structure 300 at a position opposite the circuit board 100. The heat dissipation structure 400 at least partially covers the opening 310. The heat dissipation structure 400 and the shielding structure 300 form a shielding cover, which is disposed over the electronic device 200. Based on the orientation shown in FIG. 4B , the opening 310 is located above the electronic device 200 disposed on the circuit board 100.

[0084] A circuit board assembly may include multiple electronic devices 200. Some of these devices are sensitive to electromagnetic interference (EMI), which can affect their performance. For example, these devices may be memory devices, central processing units (CPUs), or system-on-chips (SoCs). Providing a shielding cover over these electronic devices 200 effectively shields them from EMI, ensuring their performance.

[0085] Among them, in the shielding cover composed of at least part of the shielding structure 300 and the heat dissipation structure 400, the shielding structure 300 can electromagnetically shield the peripheral side of the electronic device 200, and the part of the heat dissipation structure 400 covering the opening 310 can shield the electromagnetic waves at the opening 310, thereby shielding the influence of electromagnetic interference on the electronic device 200.

[0086] In some embodiments, the shielding structure 300 can be a shielding structure 300 made of a conductive material, such as conductive ceramic or metal. In a specific implementation, the shielding structure 300 can be a shielding structure 300 made of a metal material. The shielding structure 300 can be connected to the circuit board 100 by welding or conductive adhesive bonding. Compared to bonding with conductive adhesive, connecting the shielding structure 300 to the circuit board 100 by welding can improve the connection stability between the shielding structure 300 and the circuit board 100, and can also improve the electromagnetic shielding capability of the connection between the circuit board 100 and the shielding structure 300, thereby preventing electromagnetic interference from affecting the electronic device 200 covered by the shielding structure 300 through the connection between the circuit board 100 and the shielding structure 300.

[0087] In some embodiments, at least the portion of the heat dissipation structure 400 covering the opening 310 is a conductive structure, or the side of the heat dissipation structure 400 facing the opening 310 is a conductive structure, or the entire external structure of the heat dissipation structure 400 is a conductive structure, for example, the conductive structure can also be a metal structure.

[0088] In some examples, the metal material used to make the heat dissipation structure 400 is the same as the metal material used to make the shielding structure 300. The heat dissipation structure 400 can directly cover the opening 310 and be connected to the area of ​​the shielding structure 300 near the opening 310. For example, the heat dissipation structure 400 can be connected to the shielding structure 300 via a conductive adhesive. Alternatively, the heat dissipation structure 400 and the shielding structure 300 can be spaced apart to form a buffer zone between the heat dissipation structure 400 and the shielding structure 300. This prevents the heat dissipation structure 400 from directly compressing the shielding structure 300 when impacted by an object directed toward the shielding structure 300, thereby reducing the chance of damage to the shielding structure 300.

[0089] In some embodiments, the electronic device 200 can be completely located within the shielding cover, or part of the structure of the electronic device 200 can extend into the through-opening 310, so that the electronic device 200 can utilize the height of the through-opening 310 along the thickness direction of the circuit board 100, so that when the height of the electronic device 200 does not increase beyond the height of the through-opening 310, there is no need to increase the height of the shielding structure 300 along the thickness direction of the circuit board 100.

[0090] It should be noted that the size of the through opening 310 is at least sufficient to allow the electronic device 200 to pass through, so that the portion of the electronic device 200 facing the through opening 310 can extend into the through opening 310 .

[0091] In some embodiments, the heat dissipation structure 400 can be connected to the circuit board 100, for example, by a threaded connection. The heat dissipation structure 400 can also be connected to the rear housing 30 of an electronic device using the circuit board assembly, for example, by gluing the heat dissipation structure 400 to the rear housing 30.

[0092] In some embodiments, there is a certain distance between the heat dissipation structure 400 and the electronic device 200 , thereby preventing the heat dissipation structure 400 from directly contacting the electronic device 200 and preventing the heat dissipation structure 400 from damaging the electronic device 200 .

[0093] The circuit board assembly provided in the embodiment of the present application is achieved by opening a through opening 310 at a position opposite to the circuit board 100 on the shielding structure 300, and at least partially covering the heat dissipation structure 400 at the through opening 310, so that the heat dissipation structure 400 and the shielding structure 300 together form a shielding cover to cover the electronic device 200, so that part of the structure of the electronic device 200 can be extended into the through opening 310, so that when the height of the electronic device 200 increases, there is no need to increase the height of the shielding cover, thereby reducing the height of the shielding cover and reducing the space occupied in the electronic device, which is conducive to further thinning of the electronic device.

[0094] Furthermore, by combining at least a portion of the heat dissipation structure 400 with the shielding structure 300 to form a shielding cover, the heat dissipation structure 400 can not only dissipate heat for the electronic device 200, but can also form a shielding cover together with the shielding structure 300 to achieve electromagnetic shielding function for the electronic device 200, thereby realizing the functional diversification of the heat dissipation structure 400.

[0095] 5 , in some embodiments, heat dissipation structure 400 may include a metal shell 410 and a heat dissipation medium disposed within metal shell 410. Metal shell 410 at least partially covers opening 310, and metal shell 410 and shielding structure 300 form a shielding cover. Metal shell 410 of heat dissipation structure 400 defines a cavity 420 within which the heat dissipation medium can be disposed.

[0096] The heat dissipation structure 400 may include a metal shell 410 and a heat dissipation medium disposed in the metal shell 410. The heat generated by the electronic device 200 during operation is transferred to the heat dissipation medium through the metal shell 410, realizing heat exchange with the heat dissipation medium, thereby dissipating the heat of the electronic device 200 through the heat dissipation structure 400.

[0097] By at least partially covering the through opening 310 , at least a portion of the metal shell 410 and the shielding structure 300 form a shielding cover to achieve electromagnetic shielding.

[0098] In some embodiments, the metal shell 410 can be connected to the circuit board 100 , or the metal shell 410 can be connected to the rear housing 30 of the electronic device on which the circuit board assembly is installed.

[0099] In one possible implementation, the heat dissipation structure 400 is a vapor chamber radiator or a liquid cooling radiator.

[0100] By configuring the heat dissipation structure 400 as a vapor chamber radiator, heat exchange can be achieved between the vapor chamber radiator and the electronic device 200. By configuring the heat dissipation structure 400 as a liquid cooling radiator, liquid cooling of the electronic device 200 can be achieved through the liquid cooling radiator.

[0101] In one example, a vapor chamber heat sink can utilize vapor chamber (VC) cooling technology. The heat dissipation structure 400 may include a vacuum-sealed cavity filled with a working fluid (typically liquid metal or other thermally conductive material). When a heat source acts on one side of the heat sink, the working fluid evaporates and transfers heat within the vacuum chamber. The vapor condenses into liquid in the cooling area, releasing heat that is then conducted to the external environment through the walls of the heat pipe.

[0102] Vacuum chamber vapor chamber heat sink has the advantages of high thermal conductivity, good thermal uniformity, simple structure, and high reliability. This heat dissipation technology can help electronic devices 200 maintain a stable operating temperature, improving performance and reliability.

[0103] Liquid cooling can be done with a liquid cold plate, which has cooling liquid (usually water or another coolant) flowing through pipes or channels inside the cold plate. When heat is applied to the radiator surface, the cooling liquid absorbs the heat through the pipes, then removes the heat and dissipates it through the surface of the cold plate.

[0104] 5 , in some embodiments, a first gap 320 may be provided between an end of the shielding structure 300 facing away from the circuit board 100 and the heat dissipation structure 400 .

[0105] By setting a first gap 320 between the end of the shielding structure 300 facing away from the circuit board 100 and the heat dissipation structure 400, a buffer space can be formed between the shielding structure 300 and the heat dissipation structure 400, thereby preventing the heat dissipation structure 400 from directly contacting the shielding structure 300 when it is displaced toward the shielding structure 300 by an external force. The first gap 320 can absorb and disperse the impact energy, slow down the transmission of the impact force, and thus reduce the direct damage of the heat dissipation structure 400 to the shielding structure 300.

[0106] When the heat dissipation structure 400 is impacted, the gap provides a certain degree of cushioning, allowing the heat dissipation structure 400 more distance to deform and absorb energy, thereby reducing the extent to which the impact force is transmitted to the shielding structure 300. This reduces the likelihood of damage to the shielding structure 300 and protects the heat dissipation structure 400 from damage. This mitigates the impact force exerted by the heat dissipation structure 400 on the shielding structure 300, reduces the chance of damage to the shielding structure 300, and improves the operational stability of the circuit board assembly.

[0107] Furthermore, by providing the first spacer 320, the heat dissipation structure 400 is prevented from directly contacting the shielding structure 300, thereby reducing the possibility of heat being conducted to the surface of the shielding structure 300. This helps prevent the shielding structure 300 from overheating and avoids the shielding structure 300 from thermally impacting the electronic device 200 or other components on the circuit board 100.

[0108] By setting a first gap 320 between the heat dissipation structure 400 and the shielding structure 300, a space for airflow can be provided between the heat dissipation structure 400 and the shielding structure 300, so that the airflow can flow freely between the heat dissipation structure 400 and the shielding structure 300, which helps to enhance the heat dissipation effect and improve the heat dissipation efficiency of the electronic device 200.

[0109] 5 , in an exemplary embodiment, the first interval 320 is greater than 0 mm and less than or equal to 0.05 mm. For example, the first interval 320 may be 0.01 mm, 0.02 mm, 0.03 mm, or 0.04 mm.

[0110] By setting the spacing distance of the first spacer 320 in the thickness direction of the circuit board 100 to be greater than 0 mm and less than or equal to 0.05 mm, it is possible to ensure that a buffer space is formed between the heat dissipation structure 400 and the shielding structure 300, while also avoiding the problem of poor shielding effect of the shielding cover composed of the heat dissipation structure 400 and the shielding structure 300 due to the excessive distance of the first spacer 320.

[0111] If the first interval 320 is too large, for example, the first interval 320 is 0.07 mm, the sum of the heights of the heat dissipation structure 400 , the shielding structure 300 and the electronic device 200 in the thickness direction of the circuit board 100 will be too large, which is not conducive to further thinning of the electronic device.

[0112] 6 , in some embodiments, the heat dissipation structure 400 is connected to the circuit board 100 via a fastener 500 .

[0113] By connecting the heat dissipation structure 400 and the circuit board 100 through the fastener 500, the setting stability of the heat dissipation structure 400 on the circuit board 100 can be improved, and the connection stability between the circuit board 100 and the heat dissipation structure 400 can be improved, thereby improving the structural stability of the circuit board assembly.

[0114] In some embodiments, the fastener 500 can be a long screw, which has corresponding threaded holes on the heat dissipation structure 400 and the circuit board 100. The long screw passes through the threaded holes on the heat dissipation structure 400 and the circuit board 100 at one time, so that the heat dissipation structure 400 and the circuit board 100 are fastened together by the long screw.

[0115] In some embodiments, the circuit board assembly also includes a support structure (not shown in the figure), which is arranged between the circuit board 100 and the heat dissipation structure 400. When the heat dissipation structure 400 is connected to the circuit board 100, the support structure can support the heat dissipation structure 400, further improving the connection stability between the heat dissipation structure 400 and the circuit board 100, and avoiding shaking of the heat dissipation structure 400 after being connected to the circuit board 100.

[0116] 2 and 6 , based on the above embodiments, when the circuit board assembly of the present application is disposed in an electronic device, the heat dissipation structure 400 in the circuit board assembly and the circuit board 100 in the circuit board assembly can be connected via fasteners 500. Alternatively, the heat dissipation structure 400 can be connected to the rear housing 30. Furthermore, while the heat dissipation structure 400 is connected to the rear housing 30, it can also be connected to the circuit board 100.

[0117] By connecting the heat dissipation structure 400 to the rear housing 30 and also to the circuit board 100 , the connection stability of the heat dissipation structure 400 can be improved.

[0118] Referring to Figures 7 and 8, in some embodiments, the circuit board assembly may further include an elastic shielding member 600, which is arranged on the outer peripheral side of the shielding structure 300, one end of the elastic shielding member 600 is connected to the circuit board 100 or the shielding structure 300, and the other end of the elastic shielding member 600 is pressed against the heat dissipation structure 400.

[0119] In some embodiments, one end of the elastic shielding member 600 can be connected to the shielding structure 300, and the other end of the elastic shielding member 600 can be pressed against the heat dissipation structure 400. In another implementation, one end of the elastic shielding member 600 can be connected to the circuit board 100, and the other end of the elastic shielding member 600 can be pressed against the heat dissipation structure 400.

[0120] It is understood that when the first gap 320 is provided between the heat dissipation structure 400 and the shielding structure 300, electromagnetic waves may leak from the first gap 320, thereby affecting the electromagnetic shielding performance of the shielding cover formed by the heat dissipation structure 400 and the shielding structure 300. Alternatively, if the connection between the heat dissipation structure 400 and the shielding structure 300 is improperly handled, for example, by not using conductive adhesive or welding, a certain amount of electromagnetic wave leakage may also occur, similarly affecting the electromagnetic shielding performance of the shielding cover.

[0121] The circuit board assembly can include an elastic shielding member 600, and the elastic shielding member 600 is set on the outer peripheral side of the shielding structure 300, and the end of the shielding structure 300 facing away from the circuit board 100 is pressed against the heat dissipation structure 400, so as to close the first gap 320 between the heat dissipation structure 400 and the shielding structure 300, thereby preventing the electromagnetic waves emitted by the electronic device 200 in the shielding structure 300 from leaking from the first gap 320, thereby improving the shielding effect of the shielding cover formed by the shielding structure 300 and the heat dissipation structure 400.

[0122] In some embodiments, the elastic shielding member 600 and the heat dissipation structure 400 can be connected by bonding, or the elastic shielding member 600 can be in abutment contact with the heat dissipation structure 400 by abutment.

[0123] In one possible implementation, when the heat dissipation structure 400 is pressed against the elastic shielding member 600 in the thickness direction of the circuit board 100, the height of the elastic shielding member 600 is greater than the height of the shielding structure 300, and the elastic shielding member 600 is compressed by 40% or more in the thickness direction of the circuit board 100. It is understood that during the assembly process of the heat dissipation structure 400 and the elastic shielding member 600, the heat dissipation structure 400 applies a squeezing force toward the circuit board 100 to the elastic shielding member 600, thereby enabling the elastic shielding member 600 to be compressively deformed in the thickness direction of the circuit board 100.

[0124] By making the height of the elastic shielding member 600 greater than the height of the shielding structure 300 , when the heat dissipation structure 400 and the elastic shielding member 600 are pressed tightly, the elastic shielding member 600 can generate a certain amount of compression and form the first gap 320 .

[0125] After the heat dissipation structure 400 and the elastic shielding part 600 are pressed together, the elastic shielding part 600 can have a certain elastic restoring force after being pressed, and the heat dissipation structure 400 is pressed together under the action of the elastic restoring force, thereby improving the contact tightness between the heat dissipation structure 400 and the elastic shielding part 600, and thus improving the shielding effect of the shielding cover.

[0126] If the compression amount of the elastic shielding part 600 is too small, for example, the compression amount of the elastic shielding part 600 is 30%, the elastic restoring force generated after the elastic shielding part 600 is compressed and deformed will be small, resulting in low contact tightness between the elastic shielding part 600 and the heat dissipation structure 400, and further causing electromagnetic waves to leak from the contact between the elastic shielding part 600 and the heat dissipation structure 400, thereby reducing the shielding effect of the shielding cover.

[0127] 7 , in some embodiments, a second gap 330 may be provided between the elastic shielding member 600 and the shielding structure 300 . The elastic shielding member 600 is disposed at a distance from the shielding structure 300 on an outer peripheral side of the shielding structure 300 .

[0128] By providing the second spacer 330 between the elastic shielding member 600 and the shielding structure 300 , the elastic shielding member 600 can be easily disassembled and maintained.

[0129] Furthermore, by setting a second spacer 330, the elastic shielding part 600 can be prevented from squeezing the shielding structure 300 and causing deformation of the shielding structure 300 due to tilting toward the shielding structure 300 during the compression deformation process, thereby further reducing the probability of damaging the electronic device 200 or affecting the shielding effect due to deformation of the shielding structure 300, thereby improving the stability of the circuit board assembly.

[0130] In a possible implementation, the elastic shielding member 600 is made of conductive foam. The conductive foam includes a foam body and a conductive layer coated on the outer surface of the foam body. The conductive layer can be a conductive metal layer.

[0131] By setting the elastic shielding member 600 to be an elastic shielding member 600 made of conductive foam, since the conductive foam has good electrical conductivity, it can effectively shield the electromagnetic waves at the first interval 320, reduce the leakage of electromagnetic waves at the first interval 320, and improve the anti-interference ability of the electronic device 200.

[0132] Furthermore, the conductive foam may have a certain degree of softness and elasticity, and can provide good buffering and protection, thereby reducing the impact of vibration and impact generated when the heat dissipation structure 400 is impacted on the shielding structure 300 and the electronic device 200 .

[0133] In addition, the conductive foam may have good thermal conductivity, which is beneficial to the transfer and heat dissipation of heat generated when the electronic device 200 is working, and helps to maintain the working stability of the electronic device 200.

[0134] The conductive foam has good processability and cuttability, can be customized as needed, and is suitable for assembly requirements of various shapes and sizes, thereby improving the processing flexibility and practicality of the elastic shielding component 600 and reducing the manufacturing cost of the elastic conductive component.

[0135] In some embodiments, the elastic shielding member 600 can be a frame-type elastic shielding member 600, which is sleeved on the outer peripheral side of the shielding structure 300. The frame-type elastic shielding member 600 includes a frame-type foam body and a conductive layer that completely covers the outer surface of the foam body.

[0136] In one possible implementation, the elastic shielding member 600 can be spliced ​​together by multiple strips of conductive foam, the head ends and tail ends of the multiple strips of conductive foam overlap with each other to form a frame-shaped elastic shielding member 600, and the frame-shaped elastic shielding member 600 is arranged around the outer peripheral side of the shielding structure 300.

[0137] The strips of conductive foam contain a foam body, with a conductive layer covering the outer periphery along the length of the foam body. However, the ends of the strips are not covered with the conductive layer. By overlapping and connecting the leading and trailing ends of the multiple strips of conductive foam, the electromagnetic shielding effectiveness of the elastic shielding member 600 can be reduced when forming a frame-shaped elastic shielding member 600 due to the lack of a conductive layer at the ends of the strips.

[0138] 9 , in some embodiments, the circuit board assembly may further include an insulating layer 700 . The insulating layer 700 is disposed on a side of the heat dissipation structure 400 facing the electronic device 200 , and at least a portion of the insulating layer 700 covers the through opening 310 .

[0139] The circuit board assembly may include an insulating layer 700, and the insulating layer 700 is arranged on the side of the heat dissipation structure 400 facing the electronic device 200, and at least a portion of the insulating layer 700 covers the through-hole 310, so as to avoid electrical contact between the heat dissipation structure 400 and the electronic device 200, thereby improving the working stability of the electronic device 200.

[0140] In some embodiments, the insulating layer 700 can be attached to the side of the heat dissipation structure 400 facing the through-hole 310. For example, the insulating layer 700 can be adhered to the surface of the heat dissipation structure 400 using an adhesive. The insulating layer 700 can also be sprayed onto the side of the heat dissipation structure 400 facing the through-hole 310. For example, insulating paint can be directly sprayed onto the heat dissipation structure 400 to form the insulating layer 700.

[0141] In one possible implementation, the insulating layer 700 is a polyethylene terephthalate (PET) layer or a polyimide (PI) layer.

[0142] By setting the insulating layer 700 as a polyethylene terephthalate layer or a polyimide layer, the insulation effect between the heat dissipation structure 400 and the electronic device 200 can be improved, electrical contact between the heat dissipation structure 400 and the electronic device 200 can be avoided, and the working stability of the electronic device 200 can be improved.

[0143] In a specific implementation, the insulating layer 700 may be polyimide, which has high-temperature resistance, exceeding 400°C, and a long-term operating temperature range of greater than or equal to -200°C and less than or equal to 300°C. Polyimide has high insulation performance, with a dielectric constant of 4.0 at 103 Hz. By using polyimide as the insulating layer 700, the thermal conductivity of the heat dissipation structure 400 can be improved, thereby accelerating the heat dissipation of the electronic device 200.

[0144] 7 and 9 , in some embodiments, the shielding structure 300 may include a shielding frame 340 , which may have a through opening 310 therein. The shielding frame 340 is arranged around the outer periphery of the electronic device 200 , the shielding frame 340 is connected to the circuit board 100 , and the heat dissipation structure 400 is covered on the through opening 310 .

[0145] The shielding structure 300 may include a shielding frame 340, and the shielding frame 340 is arranged on the outer peripheral side of the electronic device 200 to electromagnetically shield the electronic device 200 on the peripheral side of the electronic device 200, and electromagnetically shield the electronic device 200 at the opening 310 through a part of the heat dissipation structure 400.

[0146] Referring to Figures 7 and 9, in some embodiments, the side of the shielding frame 340 facing the circuit board 100 may have a first flange 350, and the first flange 350 is arranged around the outer peripheral side of the shielding frame 340. The shielding frame 340 is connected to the circuit board 100 through the first flange 350, and the side of the first flange 350 facing the circuit board 100 is used for connection with the circuit board 100.

[0147] By providing a first flange 350 on the outer peripheral side of the shielding frame 340 on the side of the shielding frame 340 facing the circuit board 100, and connecting the shielding frame 340 to the circuit board 100 through the first flange 350, the contact area between the shielding frame 340 and the circuit board 100 can be increased, thereby improving the connection stability between the shielding frame 340 and the circuit board 100.

[0148] In some embodiments, the first flange 350 can be connected to the circuit board 100 via a connector, or can be connected to the circuit board 100 via a conductive adhesive, or can be directly soldered to the circuit board 100 .

[0149] Compared to connecting the first flange 350 to the circuit board 100 via connectors or conductive adhesive, welding the first flange 350 to the circuit board 100 can improve the connection stability between the first flange 350 and the circuit board 100 and prevent electromagnetic waves from leaking through the connection between the first flange 350 and the circuit board 100. This improves the electromagnetic shielding performance while also improving the connection stability between the shielding frame 340 and the circuit board 100.

[0150] 7 and 9 , in some embodiments, a second flange 360 ​​is provided at one end of the shielding frame 340 facing away from the circuit board 100 , and an inner edge of the second flange 360 ​​forms a through opening 310 .

[0151] By providing a second flange 360 ​​at the end of the shielding frame 340 facing away from the circuit board 100 and forming a through opening 310 through the inner edge of the second flange 360, the heat dissipation structure 400 can be brought into contact with the shielding frame 340 through the second flange 360 ​​when the heat dissipation structure 400 is impacted toward the shielding structure 300, thereby increasing the contact area between the heat dissipation structure 400 and the shielding frame 340, reducing damage to the heat dissipation structure 400 caused by the shielding frame 340 due to excessive pressure when the shielding frame 340 contacts the heat dissipation structure due to the small contact area between the heat dissipation structure 400 and the shielding frame 340, and improving the service life of the heat dissipation structure 400.

[0152] In one possible implementation, when the heat dissipation requirement of the electronic device 200 of the electronic device is relatively low, heat can be dissipated directly through the rear shell 30 of the electronic device without the need to separately set up a heat dissipation structure 400. Since the thickness of the heat dissipation structure 400 is omitted, the thickness of the electronic device can be further reduced.

[0153] With reference to FIG10 , the present application further provides an electronic device, which may include a rear housing 30, a circuit board 100, an electronic device 200, and a shielding structure 300. The electronic device 200 is disposed on the circuit board 100, and the shielding structure 300 is disposed on the circuit board 100. A through opening 310 is formed on the shielding structure 300 at a position opposite to the circuit board 100. A portion of the rear housing 30 covers the through opening 310. A portion of the rear housing 30 and the shielding structure 300 form a shielding cover, which is disposed over the electronic device 200.

[0154] It is understandable that the rear shell 30 can be made of a conductive metal material so as to form a shielding cover together with the shielding structure 300 .

[0155] When the rear shell 30 and the shielding structure 300 form a shielding cover, the rear shell 30 can directly contact the side of the shielding structure 300 facing away from the circuit board 100, or a gap can be set between the rear shell 30 and the shielding structure 300 so that there is no direct contact between the rear shell 30 and the shielding structure 300. A buffer space is formed by the gap, and when the rear shell 30 is impacted, the impact force is directly transferred to the shielding structure 300, reducing the chance of damage to the shielding structure 300.

[0156] By setting a through opening 310 on the shielding structure 300 at a position opposite to the circuit board 100, so that part of the electronic device 200 can extend into the through opening 310, when the height of the electronic device 200 is increased, there is no need to increase the height of the shielding cover, and a part of the back shell 30 is used to cover the through opening 310 on the shielding structure 300, so that a part of the back shell 30 and the shielding structure 300 together form a shielding cover provided on the electronic device 200, which can avoid the use of other shielding parts to cover the through opening 310 and can shorten the distance from the through opening 310 to the back shell 30, thereby further reducing the internal space occupied by the circuit board 100, the electronic device 200 shielding structure 300, etc., which is conducive to further thinning of the electronic device.

[0157] Referring to Figure 10, in some embodiments, the electronic device may further include an elastic shielding member 600, which is arranged on the outer peripheral side of the shielding structure 300, one end of the elastic shielding member 600 is connected to the circuit board 100 or the shielding frame 340, and the other end of the elastic shielding member 600 is pressed against the inner wall of the rear shell 30.

[0158] By arranging an elastic shielding member 600 on the outer peripheral side of the shielding structure 300, one end of the elastic shielding member 600 is connected to the circuit board 100 or the shielding frame 340, and the other end of the elastic shielding member 600 is pressed against the inner wall of the rear shell 30, the electromagnetic waves leaked from the gap between the rear shell 30 and the shielding structure 300 can be shielded by the elastic shielding member 600, thereby improving the shielding performance of the shielding cover.

[0159] In some embodiments, in the thickness direction of the circuit board 100, when the heat dissipation structure 400 is pressed against the elastic shielding member 600, the height of the elastic shielding member 600 is greater than the height of the shielding structure 300, and in the thickness direction of the circuit board 100, the compression amount of the elastic shielding member 600 is greater than or equal to 40%.

[0160] By making the height of the elastic shielding part 600 greater than the height of the shielding structure 300, the elastic shielding part 600 can produce a certain amount of compression when the rear shell 30 and the elastic shielding part 600 are pressed together, and the elastic shielding part 600 can have a certain elastic restoring force after being pressed, and press the rear shell 30 under the action of the elastic restoring force, thereby improving the contact tightness between the rear shell 30 and the elastic shielding part 600, and thereby improving the shielding effect of the shielding cover.

[0161] 10 , in some embodiments, a second gap 330 may be provided between the elastic shield 600 and the shield frame 340 .

[0162] By providing the second spacer 330 between the elastic shielding member 600 and the shielding structure 300 , the elastic shielding member 600 can be easily disassembled and maintained.

[0163] Furthermore, by setting a second spacer 330, the elastic shielding part 600 can be prevented from squeezing the shielding structure 300 and causing deformation of the shielding structure 300 due to tilting toward the shielding structure 300 during the compression deformation process, thereby further reducing the probability of damaging the electronic device 200 or affecting the shielding effect due to deformation of the shielding structure 300, thereby improving the stability of the electronic device.

[0164] In some embodiments, the elastic shielding member 600 is an elastic shielding member 600 made of conductive foam.

[0165] By setting the elastic shielding member 600 to be an elastic shielding member 600 made of conductive foam, since the conductive foam has good electrical conductivity, it can effectively shield the electromagnetic waves at the first interval 320, reduce the leakage of electromagnetic waves at the first interval 320, and improve the anti-interference ability of the electronic device 200.

[0166] The various embodiments or implementation methods in this specification are described in a progressive manner. Each embodiment focuses on the differences from other embodiments, and the same or similar parts between the various embodiments can be referenced to each other.

[0167] Generally speaking, terms should be understood, at least in part, based on the context in which they are used. For example, as used herein, the term "one or more" can be used to describe any feature, structure, or characteristic in the singular sense, or can be used to describe a combination of features, structures, or characteristics in the plural sense, depending at least in part on the context. Similarly, terms such as "a," "an," or "the" can also be understood to convey either singular or plural usage, depending at least in part on the context.

[0168] It should be readily understood that “on,” “above,” and “over” in this disclosure should be interpreted in the broadest manner, such that “on” means not only “directly on something,” but also includes “on something” with intervening features or layers therebetween, and “above” or “over” includes not only the meaning of “above” or “over,” but also includes “above” or “over” with no intervening features or layers therebetween (i.e., directly on something).

[0169] Additionally, spatially relative terms, such as "below," "beneath," "beneath," "above," and the like, may be used herein for ease of description to describe the relationship of one element or feature relative to other elements or features as shown in the figures. Spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. The device may be in other orientations (rotated 90 degrees or at other orientations), and the spatially relative descriptors used herein should be interpreted accordingly.

[0170] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some or all of the technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A circuit board assembly, characterized in that: Including circuit boards, electronic components, shielding structures and heat dissipation structures; The electronic device is arranged on the circuit board; The shielding structure is arranged on the circuit board, and a through opening is provided on the shielding structure at a position opposite to the circuit board; At least a portion of the heat dissipation structure covers the through opening. The heat dissipation structure and the shielding structure form a shielding cover, and the shielding cover is provided on the electronic device.

2. The circuit board assembly according to claim 1, wherein: The heat dissipation structure includes a metal shell and a heat dissipation medium arranged in the metal shell. At least a portion of the metal shell covers the through opening. The metal shell and the shielding structure form a shielding cover.

3. The circuit board assembly according to claim 1, wherein: The heat dissipation structure is a vapor chamber radiator or a liquid cooling radiator.

4. The circuit board assembly according to claim 1, wherein: A first gap is formed between an end of the shielding structure facing away from the circuit board and the heat dissipation structure.

5. The circuit board assembly according to claim 4, wherein: The first interval is greater than 0 mm and less than or equal to 0.05 mm.

6. The circuit board assembly according to claim 1, wherein: The heat dissipation structure is connected to the circuit board via fasteners.

7. The circuit board assembly according to claim 1, wherein: The circuit board assembly further includes an elastic shielding member, which is arranged on the outer peripheral side of the shielding structure. One end of the elastic shielding member is connected to the circuit board or the shielding structure, and the other end of the elastic shielding member is pressed against the heat dissipation structure.

8. The circuit board assembly according to claim 7, wherein: In the thickness direction of the circuit board, the height of the elastic shielding member is greater than the height of the shielding structure; In the thickness direction of the circuit board, the compression amount of the elastic shielding component is greater than or equal to 40%.

9. The circuit board assembly according to claim 7, wherein: A second interval is defined between the elastic shielding member and the shielding structure.

10. The circuit board assembly according to claim 7, wherein: The elastic shielding member is an elastic shielding member made of conductive foam.

11. The circuit board assembly according to any one of claims 1 to 10, characterized in that: The circuit board assembly further includes an insulating layer, which is arranged on a side of the heat dissipation structure facing the electronic device, and at least a portion of the insulating layer covers the through opening.

12. The circuit board assembly according to claim 11, wherein: The insulating layer is a polyethylene terephthalate layer or a polyimide layer.

13. The circuit board assembly according to any one of claims 1 to 10, characterized in that: The shielding structure includes a shielding frame having the through opening. The shielding frame is arranged around the outer periphery of the electronic device and is connected to the circuit board. The heat dissipation structure is covered on the through opening.

14. The circuit board assembly according to claim 13, wherein: The shielding frame has a first flange on a side facing the circuit board. The first flange is arranged around the outer periphery of the shielding frame. The shielding frame is connected to the circuit board via the first flange.

15. The circuit board assembly according to claim 13, wherein: A second flange is provided on one end of the shielding frame facing away from the circuit board, and the inner edge of the second flange forms the through opening.

16. An electronic device, characterized in that: comprising a rear housing and a circuit board assembly according to any one of claims 1 to 15; The circuit board assembly is arranged in the rear housing, and the heat dissipation structure in the circuit board assembly is connected to the circuit board in the circuit board assembly via fasteners; Alternatively, the heat dissipation structure is connected to the rear housing; Alternatively, the heat dissipation structure is connected to both the rear housing and the circuit board.

17. An electronic device, characterized in that: Including back shell, circuit board, electronic components and shielding structure; The electronic device is arranged on the circuit board; The shielding structure is arranged on the circuit board, and a through opening is provided on the shielding structure at a position opposite to the circuit board; A portion of the rear shell covers the through opening, and a portion of the rear shell and the shielding structure form a shielding cover, which is arranged to cover the electronic device.

18. The electronic device according to claim 17, wherein: The electronic device also includes an elastic shielding member, which is arranged on the outer peripheral side of the shielding structure, one end of the elastic shielding member is connected to the circuit board or the shielding structure, and the other end of the elastic shielding member is pressed against the inner wall of the rear shell.

19. The electronic device according to claim 18, wherein: In the thickness direction of the circuit board, the height of the elastic shielding member is greater than the height of the shielding structure; In the thickness direction of the circuit board, the compression amount of the elastic shielding component is greater than or equal to 40%.

20. The electronic device according to claim 19, wherein A second interval is defined between the elastic shielding member and the shielding structure.

21. The electronic device according to claim 20, characterized in that The elastic shielding member is an elastic shielding member made of conductive foam.

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