Coating apparatus and coating method

Abstract

The present application relates to a coating apparatus and a coating method. The coating apparatus comprises: a chamber; a carrier plate, which is located in the chamber, wherein the carrier plate is used for allowing a substrate to be placed thereon, and the carrier plate is insulated from the chamber; a bias device, which comprises a bias power supply and a detection unit, wherein the bias power supply is electrically connected to the carrier plate, so as to provide a bias voltage to the carrier plate, and the detection unit is used for measuring a current value of the carrier plate during coating; a coating device, which comprises a target and a coating power supply, wherein the coating power supply is used for applying a voltage to the target during coating; and a control unit, which is connected to the bias device and the coating power supply, and is used for synchronously turning off the output from the bias power supply and the output from the coating power supply after receiving an arc signal sent by the detection unit. When the charge accumulation between the substrate and the carrier plate meets an arc trigger condition, the current rises. When the current value measured by the detection unit exceeds a preset current value, the detection unit determines an arc signal, and sends the arc signal to the control unit, and the control unit synchronously turns off the output from the bias power supply and the output from the coating power supply.

Description

Coating equipment and coating method Technical Field

[0001] The present application relates to the field of integrated circuit technology, and in particular to a coating device and a coating method. Background Art

[0002] In the coating process chamber, the substrate is placed on a carrier plate, which is insulated from the process chamber. During the coating process, a large number of charged particles, primarily electrons, accumulate on the carrier plate. These large numbers of electrons can easily cause arcing between the carrier plate and the substrate, resulting in substrate defects.

[0003] In the related art, the carrier is usually grounded so that electrons on the carrier flow from the carrier to the ground terminal, thereby avoiding excessive electron accumulation. However, this leads to uneven potential on the substrate, affecting the coating quality. Summary of the Invention

[0004] Based on this, it is necessary to provide a coating device and a coating method for improving the coating quality. On the one hand, a coating device is provided, comprising:

[0005] cavity;

[0006] A carrier plate is located in the cavity, the carrier plate is used to place the substrate, and the carrier plate is insulated from the cavity;

[0007] A bias device, comprising a bias power supply and a detection unit, wherein the bias power supply is electrically connected to the carrier to provide a bias voltage to the carrier, and the detection unit is used to detect the current value of the bias circuit during film deposition, determine an arc signal when the current exceeds a preset current value, and send the arc signal to a control unit;

[0008] A film coating device, comprising a target material and a film coating power supply, wherein the film coating power supply is used to apply a voltage to the target material during film coating;

[0009] A control unit is connected to the bias device and the coating power supply, and is used to synchronously shut down the bias power supply and the coating power supply output after receiving the arc signal sent by the detection unit.

[0010] In one embodiment, the control unit controls the duration of shutting down the bias power supply and the coating power supply output to be between 10us and 1000us.

[0011] In one embodiment, the carrier plate is provided with a guide rail, and a plurality of bias rollers are provided at the bottom of the cavity. The bias rollers are matched with the guide rails so that the carrier plate moves on the plurality of bias rollers, and the bias rollers are connected to the bias power supply.

[0012] In one embodiment, the biasing roller comprises:

[0013] a supporting base, contacting the cavity;

[0014] A bias feed interface, located on the surface of the support base, for connecting to the bias power supply;

[0015] A transmission member is located on a side of the bias roller away from the support base and is used for overlapping the guide rail. The transmission member is electrically connected to the bias feed interface.

[0016] In one embodiment, the coating equipment includes:

[0017] A vacuum feeding electrode is electrically connected to the bias power supply and the bias feeding interface.

[0018] In one embodiment, an insulating roller is provided at the bottom of the cavity, and the insulating roller is matched with the guide rail. The coating equipment includes a transition cavity and a deposition cavity arranged alternately, and the bottom of the transition cavity is an insulating roller.

[0019] In one embodiment, the bias rollers and the insulating rollers are arranged alternately at the bottom of the deposition chamber.

[0020] In one embodiment, when the current value detected by the detection unit exceeds a preset current value, the control unit turns off the bias power supply and the coating power supply at the same time, and the control unit restores the bias power supply and coating power supply output after turning off the bias power supply for a preset time.

[0021] In one embodiment, the bias power supply can output a pulse voltage, and when the detection unit detects the on / off signal of the pulse voltage, the signal is sent to the control unit so that the control unit controls the coating power supply and the bias power supply to be turned on and off synchronously to achieve synchronous pulses.

[0022] In one embodiment, the bias power supply provides the bias voltage to the carrier, and the absolute value of the bias voltage is greater than the floating potential of the carrier.

[0023] In one aspect, a coating method is provided, which is applied to the aforementioned coating device, comprising:

[0024] Controlling the coating power supply to deliver power to the target material, ionizing the gas to generate plasma for coating, and controlling the bias device to provide a bias voltage to the carrier plate to form a bias circuit of bias power supply-carrier plate-plasma-ground;

[0025] detecting a current value of the bias circuit;

[0026] When the current value of the carrier exceeds a preset current value, an arc signal is determined and sent to the control unit, and the control unit simultaneously turns off the bias power supply and the coating power supply output;

[0027] After being turned off for a preset time, the outputs of the bias power supply and the coating power supply are restored synchronously.

[0028] The above-described coating equipment and method employ a bias power supply electrically connected to a carrier plate to provide a bias voltage to the carrier plate, while a detection unit simultaneously detects the current value on the substrate side. When the charge accumulation between the substrate and carrier plate meets the arc triggering condition, the current increases. When the current value detected by the detection unit exceeds a preset current value, an arc signal is detected and transmitted to a control unit. The control unit then simultaneously shuts down the bias power supply and coating power supply for a preset time, then restores them to their original state, suppressing the release of arc energy. This protects the substrate and improves coating quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the conventional technology, the following briefly introduces the drawings required for use in the embodiments or the conventional technology descriptions. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0030] FIG1 is a schematic diagram of the prior art;

[0031] Figure 2 is a schematic diagram of a substrate;

[0032] FIG3 , FIG4 a and FIG4 b are schematic diagrams of coating equipment provided by different embodiments;

[0033] FIG5 is a schematic diagram of a carrier board provided in one embodiment;

[0034] FIG6 is a schematic diagram of bias power supply connection according to an embodiment;

[0035] FIG7 is a flow chart of using a bias power supply according to an embodiment;

[0036] FIG8 is a schematic diagram of using a bias power supply according to an embodiment;

[0037] FIG9 is a schematic diagram of a coating device provided by another embodiment;

[0038] FIG10 is a schematic diagram of a biased roller provided in one embodiment;

[0039] FIG11 is a schematic diagram of a coating device provided in yet another embodiment;

[0040] FIG12 is a schematic diagram showing the connection between a bias device, a control unit, and a coating device according to an embodiment;

[0041] FIG13 is a flow chart of a coating method provided in one embodiment.

[0042] Explanation of the reference numerals: metal roller 10; coating device 100; chamber 110; transition chamber 111; deposition chamber 112; carrier plate 120; guide rail 121; bias device 130; coating device 140; target material 141; coating power supply 142; bias roller 150; support base 151; bias feed interface 152; transmission member 153; support member 154; bearing 155; insulating screw sleeve 156; insulating spacer 157; vacuum feed electrode 160; insulating roller 170; high temperature resistant wire 180; support 190; substrate 200; electronics 300; control unit 400. DETAILED DESCRIPTION

[0043] To facilitate understanding of the present application, the present application will be described more fully below with reference to the accompanying drawings. The accompanying drawings provide embodiments of the present application. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to make the disclosure of the present application more thorough and comprehensive.

[0044] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application pertains. The terms used herein in the specification of this application are for the purpose of describing specific embodiments only and are not intended to limit this application.

[0045] It will be understood that the terms "first", "second", etc. used in this application may be used to describe various elements in this document, but these elements are not limited by these terms. These terms are only used to distinguish a first element from another element.

[0046] In each embodiment, unless otherwise specified or limited, the terms "installed," "connected," "connected," "fixed," etc. should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection, electrical connection; direct connection, or indirect connection through an intermediate medium; internal communication between two elements, or interaction between two elements, unless otherwise specified. Those skilled in the art will understand the specific meanings of the above terms in each embodiment based on the specific circumstances.

[0047] It can be understood that the “connection” in the following embodiments should be understood as “electrical connection”, “communication connection”, etc. if there is transmission of electrical signals or data between the connected circuits, modules, units, etc.

[0048] It is understood that “at least one” refers to one or more, “a plurality” refers to two or more, and “at least a portion of an element” refers to a portion or all of an element.

[0049] As used herein, the singular forms "a," "an," and "the" may also include the plural forms, unless the context clearly indicates otherwise. It should also be understood that the terms "include," "comprising," "having," and the like specify the presence of stated features, integers, steps, operations, components, parts, or combinations thereof, but do not preclude the presence or addition of one or more other features, integers, steps, operations, components, parts, or combinations thereof. Furthermore, the term "and / or" as used in this specification includes any and all combinations of the relevant listed items.

[0050] Spatially relative terms such as "under," "beneath," "beneath," "under," "above," "above," etc., may be used herein to describe the relationship of an element or feature shown in the figures to other elements or features. It should be understood that in addition to the orientations shown in the figures, spatially relative terms also include different orientations of the device in use and operation. For example, if the device in the drawings is turned over, the element or feature described as "under" or "beneath" or "beneath" the other elements will be oriented as "above" the other elements or features. Thus, the exemplary terms "under" and "under" can include both upper and lower orientations. In addition, the device can also include alternative orientations (e.g., rotated 90 degrees or other orientations), and the spatial descriptors used herein are interpreted accordingly.

[0051] The embodiments are described herein with reference to the schematic diagrams as ideal embodiments of the present specification. Therefore, the embodiments should not be limited to the specific shapes in the schematic diagrams, but include shape deviations and do not limit the scope of the embodiments.

[0052] As discussed in the background, referring to Figures 1 and 2 , a large number of charged particles, primarily electrons, can easily generate arcs at the carrier 120, thereby affecting the quality of the substrate 200. For example, when the target 141 is a cylindrical target and physical vapor deposition (PVD) is used to deposit a transparent conductive oxide (TCO) film for a heterojunction solar cell, the substrate 120 is suspended. Due to the difference in conductivity between the substrate 200 (e.g., a silicon wafer) and the carrier 120 (e.g., a metal carrier), a potential difference exists between the two during the deposition process. When a poor path is formed between the substrate and the carrier, electrons 300 can easily migrate at the carrier 120, generating a large current and causing sparks at the edge of the substrate 200 (e.g., point A in Figure 2 ). In this case, the arc generated between the substrate 200 and the carrier 120 is sufficient to break through the substrate 200, rendering it unreworkable and scrapped. Furthermore, the arc between the substrate 200 and the carrier 120 cannot be suppressed.

[0053] In the related art, the carrier plate 120 is typically grounded so that the electrons 300 on the carrier plate 120 flow from the carrier plate 120 to the ground terminal, thereby preventing the accumulation of excessive electrons 300. Specifically, a metal roller 10 is provided below the carrier plate 120, and the carrier plate 120 is grounded via the metal roller 10. However, this can have serious negative effects. For example, this can lead to uneven potential distribution on the substrate 200, resulting in poor uniformity of the deposited film layer, which can aggravate product surface damage and affect battery conversion efficiency. In addition, it can also lead to problems such as poor target material utilization.

[0054] Based on this, in one embodiment, referring to FIG3 , a coating apparatus 100 is provided. The coating apparatus 100 includes a chamber 110 , a carrier plate 120 , a bias device 130 , a control unit 400 , and a coating device 140 .

[0055] The cavity 110 has an accommodating space. This embodiment does not impose any specific restrictions on parameters such as the size and shape of the cavity 110.

[0056] Referring to Figure 5 , carrier 120 is positioned within cavity 110. Carrier 120 is used to hold substrate 200 and is insulated from cavity 110. For example, carrier 120 may be made of a conductive material, such as copper or aluminum. Referring to Figures 4a and 4b , insulating supports 190 may be provided between carrier 120 and the bottom of cavity 110.

[0057] The bias device 130 includes a bias power supply and a detection unit. The bias device 130 can be located inside the cavity 110 or outside the cavity 110.

[0058] The control unit 400 is connected to the bias device and the coating power supply, and is used to synchronously shut down the bias power supply and the coating power supply output after receiving the arc signal sent by the detection unit.

[0059] Referring to FIG6 , a bias power supply is electrically connected to the carrier 120 to provide a bias voltage to the carrier 120. The bias power supply may be a constant voltage power supply. As an example, the bias power supply provides a negative bias voltage to the carrier 120. This embodiment does not impose any specific limitation on the voltage value of the bias power supply.

[0060] The detection unit is used to detect the current value on the substrate side during film deposition. As an example, the current value on the substrate side can be the current value of the substrate circuit on the substrate. When the sputtering end coating power supply 142 is turned on, power is output to the target 141, and the gas in the chamber 110 is ionized, generating plasma. At this time, the substrate circuit is a load circuit formed between the bias power supply, the carrier plate 120, the plasma, and the ground.

[0061] The coating device 140 includes a target 141 and a coating power supply 142 .

[0062] The target 141 may be a sputtering target. For example, the sputtering target may be a planar target. It should be noted that the sputtering target may also be a cylindrical target or other types of targets, which are not further limited herein.

[0063] The coating power supply 142 is used to apply voltage to the target 141 during coating. As an example, it is understood that the coating device 140 may further include external wiring, and the target 141 and the external wiring may together constitute a cathode.

[0064] The control unit is connected to the bias device 130 and the coating power supply 142. Furthermore, as shown in Figure 13 , when the current detected by the detection unit exceeds a preset current value, an arc signal is detected and transmitted to the control unit 400 , which then simultaneously shuts down the bias power supply and the coating power supply 142. The preset current value is the current value at which an arc is about to occur. For example, the preset current value can be between 100 mA and 20 A. Of course, the preset current value can be adjusted based on actual conditions.

[0065] Referring to Figure 7 , during film deposition, after the coating power supply 142 and the bias power supply are turned on, the gas within the chamber 110 is ionized to generate plasma. Simultaneously, a large number of electrons gradually converge on the carrier 120. In this embodiment, a bias power supply is electrically connected to the carrier 120 to provide a bias voltage to the carrier 120, while a detection unit simultaneously detects the current value on the substrate side. When the charge accumulation between the substrate and the carrier meets the arc triggering condition, the current rises. When the current value detected by the detection unit exceeds a preset current value, an arc signal is detected and sent to the control unit 400, which simultaneously shuts off the bias power supply and the coating power supply 142. At this point, referring to Figure 8 , after the coating power supply and the bias power supply are turned off, the carrier is suspended. Without a continuous supply, electrons on the carrier 120 will dissipate spontaneously, thereby reducing the possibility of arcing, eliminating the possibility of sparking between the substrate and the carrier 120, protecting the substrate, and improving the coating quality.

[0066] When the current value detected by the detection unit does not exceed the preset current value, the film deposition can continue. The above detection process can be integrated into a computer and controlled by a program.

[0067] Of course, in another embodiment, the bias power supply can be controlled to be electrically connected to the substrate to provide a bias voltage to the substrate. In this case, the detection unit detects the current value of the substrate loop on the substrate.

[0068] In one embodiment, referring to Figures 4a and 4b, the carrier plate 120 can be fixed in the chamber and fed with a bias power supply by direct or indirect wiring. In this case, the coating apparatus 100 can include multiple coating power supplies 142. Referring to Figure 4a, the bias device 130 can be connected to each coating power supply 142 through the control unit 400, or can be connected to a set coating power supply 142. At the same time, referring to Figure 4b, illustratively, during multi-cathode sputtering, one or more cathodes can be connected to the control unit 400 and the bias device 130 according to the target material type (including the same material, different materials) and current contribution, while one or more cathodes are left unconnected to the control unit 400 and the bias device 130. That is, the coating apparatus 100 is provided with an independent coating power supply 142, which is not connected to the control unit 400 and the bias device 130, and the coating process continues.

[0069] In another example, referring to Figures 9 and 11, the carrier 120 can move within the cavity 110. At this time, the bias power supply can be controlled to be directly connected to the carrier 120, or the bias power supply can be controlled to be electrically connected to the carrier 120 through a roller, thereby avoiding poor contact or friction loss between the bias power supply and the carrier 120.

[0070] For example, referring to FIG5 , the carrier 120 is provided with guide rails 121 located on opposite sides of the carrier 120. A plurality of biasing rollers 150 are provided at the bottom of the chamber 110. The biasing rollers 150 engage with the guide rails 121 to enable the carrier 120 to move along the biasing rollers 150. The biasing rollers 150 are also connected to a bias power supply.

[0071] Specifically, referring to FIG. 10 , the bias roller 150 includes a support base 151 , a bias feeding interface 152 , and a transmission member 153 .

[0072] The support base 151 contacts the cavity 110. In this case, the support base 151 can be insulated from the cavity 110, or alternatively, the support base 151 can be uninsulated from the cavity 110. For example, the material of the support base 151 can be rubber or plastic. For a schematic diagram of the support base 151, see FIG10 .

[0073] The bias feed port 152 is located on the surface of the support base 151 and is used to connect a wire to the bias power supply. For example, the bias feed port 152 can be located on the surface of the support base 151. In this case, an insulating screw sleeve 156 can be provided between the bias feed port 152 and the support base 151.

[0074] The transmission member 153 is used to overlap the guide rail 121 of the carrier plate 120. It is understood that the material of the transmission member 153 can include conductive metals such as copper, aluminum or tungsten.

[0075] In addition, the bias roller 150 may also include a metal support member 154 and a bearing 155. The support member 154 and the bearing 155 electrically connect the bias feed interface 152 and the transmission member 153. For example, the support member 154 extends from the interior of the support base 151 to the transmission member 153. In this case, an insulating spacer 157 is provided between the support member 154 and the support base 151. The bearing 155 is located on the side of the support member 154 near the transmission member 153 to facilitate the rotation of the transmission member 153.

[0076] In one example, the bias feed interface 152 is located inside the chamber 110. At this time, referring to Figure 9, the coating apparatus 100 further includes a vacuum feed electrode 160. The vacuum feed electrode 160 can be located on the chamber 110 and electrically connected to the bias power supply and the bias roller 150. Specifically, one end of the vacuum feed electrode 160 can be located outside the chamber 110 to connect to the bias power supply, and the other end can be located inside the chamber 110 to connect to the bias feed interface 152 of the bias roller 150. As an example, the vacuum feed electrode 160 can include a ceramic shell and an internal copper electrode, and the bias power supply is connected to the copper electrode of the vacuum feed electrode 160.

[0077] 9 and 11 , the vacuum feeding electrode 160 can connect a bias power source and one or more bias rollers 150. Alternatively, the vacuum feeding electrode 160 can connect multiple bias power sources and multiple bias rollers 150. For example, the vacuum feeding electrode 160 can be connected to the bias feeding interface 152 of each bias roller 150 via a high-temperature resistant wire 180.

[0078] In another example, the bias feed interface 152 is located outside the cavity 110. In this case, the bias power supply can also be supplied to the carrier 120 via the support member 154 and bearing 155 of the bias roller 150. It will be understood that the bias feed interface 152 in this embodiment is not limited to that shown in FIG10 , as long as the location where the bias power supply connects to the bias roller 150 is insulated from the cavity 110 and ensures effective electrical connection to the carrier 120.

[0079] In this embodiment, a bias roller 150 is provided to electrically connect the bias power supply and the carrier 120. Through the gravity of the carrier 120 and / or the substrate itself, the transmission member 153 of the bias roller 150 is overlapped with the carrier 120, thereby enabling the bias power supply to better supply power to the carrier 120.

[0080] In one embodiment, an insulating roller 170 may be further disposed within the cavity 110. The insulating roller 170 may be made entirely of insulating material. The shape and size of the outer shell of the insulating roller 170 may be consistent with the shape and size of the biasing roller 150, so that the insulating roller 170 also mates with the guide rail 121.

[0081] Referring to Figure 11 , the coating apparatus 100 further includes alternating transition chambers 111 and deposition chambers 112. In the direction of movement of the carrier plate 120, the length of the carrier plate 120 is shorter than the length of the transition chamber 111, preventing the carrier plate 120 from spanning the two chambers. This ensures that chambers for different target materials and processes do not interfere with each other.

[0082] The deposition chamber 112 may be the chamber 110 for depositing a film layer. In this case, the transition chamber 111 serves as a transition, and no target 141 is provided in the transition chamber 111. The transition chamber 111 may be the chamber 110 between two adjacent deposition chambers 112, or the transition chamber 111 may surround the deposition chamber 112.

[0083] The bottom of the transition chamber 111 can be entirely filled with insulating rollers 170. It will be appreciated that there is no target material 141 in the transition chamber 111, so the bottom of the transition chamber 111 can be entirely filled with insulating rollers 170. The bottom of the deposition chamber 112 can be entirely filled with bias rollers 150, or the bottom of the deposition chamber 112 can be filled with insulating rollers 170 and bias rollers 150 arranged alternately, thereby reducing costs.

[0084] In addition, in the deposition chamber 112 , the position selection for the bias roller 150 is related to the chamber width and the length of the carrier 120 , so that the carrier 120 can contact one or more bias rollers 150 in the deposition chamber 112 when it is in the deposition chamber 112 .

[0085] In one embodiment, referring to FIG8 and FIG12, the coating power supply 142 and the bias power supply can be turned on and off synchronously, that is, after the control unit 400 receives the arc extinguishing signal from the detection unit, it synchronously turns off the bias power supply and the coating power supply 142 output for a preset time and then synchronously resumes the output.

[0086] The preset time length may be in the range of 10 us to 1000 us. Of course, the preset time length may also be adjusted in real time, as long as sufficient time is required for the accumulated electrons 300 to be lost. This embodiment does not specifically limit the range of the preset time length.

[0087] As an example, the bias device 130, the coating power supply 142, and the control unit 400 can be communicatively connected (for example, a hardwired connection is provided between the bias device 130, the coating power supply 142, and the control unit 400) to exchange data. In this case, when the detection unit detects that the current value is greater than a preset current value, it determines it as an arc signal and sends this information to the control unit 400. The control unit 400 controls the coating power supply 142 to simultaneously shut down its output along with the bias power supply, thereby preventing the release of arc energy and quickly reducing the possibility of arc-induced ablation of the silicon wafer edge.

[0088] In this embodiment, the coating power supply 142 and the bias power supply may also be turned on and off asynchronously. At the same time, this embodiment does not impose any specific restrictions on the on-off sequence of the coating power supply 142 and the bias power supply.

[0089] Furthermore, the bias power supply 130 can output a pulse voltage in pulse mode, while the coating power supply 142 can optionally add a synchronization pulse based on the power supply being synchronously shut down. It is understood that, for example, when the bias power supply 130 is in pulse mode, the coating power supply 142 normally supplies power to the cathode, and the substrate 200 is normally coated. When the synchronization pulse is turned on, the detection unit receives the on / off signal of the pulse voltage of the bias power supply 130, and the control unit 400 synchronously turns the coating power supply 142 on and off after receiving the on / off signal of the pulse voltage, thereby achieving pulse synchronization. During the synchronization pulse, the number of charged particles generated by the cathode fluctuates periodically with the coating power supply 142, and the number of electrons on the surface of the substrate 200 fluctuates periodically. When the pulse is turned off, the number of charged particles decreases, making it difficult for charged particles to accumulate rapidly.

[0090] This embodiment achieves the goal of effectively reducing electrons on the carrier 120 by synchronizing the on / off switching of the coating power supply 142 and the bias power supply. Furthermore, by providing a synchronous pulse, the goal of reducing electrons on the carrier 120 can also be achieved in a timely manner. Of course, this embodiment does not impose any specific limitations on the parameters of the pulse voltage.

[0091] In one embodiment, the bias power supply provides the carrier 120 with a bias voltage whose absolute value is greater than the floating potential of the carrier 120 .

[0092] When the absolute value of the bias voltage provided by the bias power supply to the carrier 120 is smaller than the floating potential of the carrier 120, the carrier 120 is still at the floating potential. In this case, the bias power supply has little effect on the carrier 120 (or substrate).

[0093] When the absolute value of the bias voltage provided by the bias power supply to the carrier 120 is greater than the floating potential of the carrier 120, the carrier 120 is set to a negative potential. At this time, by adjusting this negative potential, it is possible to control the sheath voltage drop on the surface of the carrier 120, thereby reducing the bombardment energy of negative ions with large kinetic energy (mainly oxygen negative ions as a sputtering byproduct) on the substrate surface during the TCO thin film coating process. The negative potential carrier 120 repels negative ions, thereby effectively slowing down the negatively charged particles and reducing the number of negatively charged particles arriving, thereby reducing the damage to the product caused by the bombardment of negatively charged particles and improving the performance of the substrate device. Of course, this potential cannot be too large. If it is too large, there will be a strong bombardment of argon ions, thereby damaging the device.

[0094] It is understood that the coating device 100 can also adopt other forms, not limited to the forms mentioned in the above embodiments, as long as it can achieve the function of the coating device. At the same time, the coating device 100 in this application is not limited to magnetron sputtering, and other coating devices using charged particles can also use this method.

[0095] Based on the same inventive concept, in one embodiment, referring to FIG. 13 , a coating method is provided, which can be applied to the coating device 100 in any of the aforementioned embodiments. During coating, the coating method includes the following steps:

[0096] Step S100 : controlling the bias device 130 to provide a bias voltage to the carrier 120 .

[0097] Step S200 : Detecting the current value of the carrier 120 .

[0098] Step S300 : When the current value of the carrier 120 exceeds a preset current value, the bias power supply and the coating power supply 142 are synchronously turned off.

[0099] Step S400: When the bias power supply and the coating power supply 142 are turned off for a predetermined time, the outputs of the bias power supply and the coating power supply 142 are restored synchronously.

[0100] In step S100, the bias device includes a bias power supply and a detection unit. The bias power supply is electrically connected to the carrier 120 to provide a bias voltage to the carrier 120. The coating power supply 142 is controlled to deliver power to the target, ionizing the gas to generate plasma for coating. The bias device 130 is controlled to provide a bias voltage to the carrier 120, forming a bias circuit from the bias power supply to the carrier 120 to the plasma to the ground.

[0101] In step S200, during film deposition, the detection unit detects the current value on the carrier 120 side. For example, the current value on the carrier 120 side can be the current value of the bias circuit on the carrier 120. When the sputtering-end coating power supply 142 is turned on, the gas in the chamber is ionized and plasma is generated. At this time, a load circuit is formed between the bias power supply 120, the carrier 120, the plasma, and the ground.

[0102] In step S300 , when the current value detected by the detection unit exceeds a preset current value, an arc signal is determined and sent to the control unit 400 , which then simultaneously turns off the bias power supply and the coating power supply 142 outputs.

[0103] In step S400 , a preset off time is set in the control unit. When the off time of the bias power supply and the coating power supply 142 reaches the preset time, the control unit 400 restores the output of the bias power supply and the coating power supply 142 .

[0104] In this embodiment, when the current value detected by the detection unit exceeds the preset current value, the control unit 400 turns off the bias power supply and the coating power supply 142, and the carrier is in a suspended state, so that the electrons on the carrier 120 will diffuse and disappear due to the lack of continuous supply, thereby reducing the electrons on the carrier 120, and further reducing the possibility of arcing, eliminating the spark ratio between the substrate and the carrier 120, protecting the substrate, and improving the coating quality.

[0105] In addition, the coating power supply 142 and the bias power supply may also be turned on and off asynchronously, that is, the control unit 400 only turns off the coating power supply 142 or the bias power supply.

[0106] It should be understood that although the various steps in the flow chart of Figure 13 are shown in sequence according to the instructions of the arrows, these steps are not necessarily performed in sequence according to the order indicated by the arrows. Unless otherwise specified herein, the execution of these steps is not strictly limited in order, and these steps can be performed in other orders. Moreover, at least a portion of the steps in Figure 13 may include multiple steps or multiple stages, and these steps or stages are not necessarily performed at the same time, but can be performed at different times, and the execution order of these steps or stages is not necessarily performed in sequence, but can be performed in turn or alternately with at least a portion of the steps or stages in other steps.

[0107] The coating method of this embodiment can be applied to a terminal environment, and the terminal can be, but is not limited to, various personal computers, laptops, smart phones, and tablet computers. It is understood that all or part of the process of the coating method of this embodiment can be implemented by instructing related hardware through a computer program.

[0108] In the description of this specification, reference to the terms "some embodiments" or "other embodiments" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic descriptions of the above terms do not necessarily refer to the same embodiment or example.

[0109] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0110] The above-described embodiments merely represent several implementation methods of the present application. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the present application. It should be noted that a person of ordinary skill in the art may make various modifications and improvements without departing from the spirit of the present application, and these modifications and improvements fall within the scope of protection of the present application. Therefore, the scope of protection of the present application shall be determined by the appended claims.

Claims

1. A coating device, characterized in that: include: cavity; A carrier plate is located in the cavity, the carrier plate is used to place the substrate, and the carrier plate is insulated from the cavity; A bias device, comprising a bias power supply and a detection unit, wherein the bias power supply is electrically connected to the carrier to provide a bias voltage to the carrier, and the detection unit is used to detect the current value of the bias circuit during film deposition, determine an arc signal when the current exceeds a preset current value, and send the arc signal to a control unit; A film coating device, comprising a target material and a film coating power supply, wherein the film coating power supply is used to apply a voltage to the target material during film coating; A control unit is connected to the bias device and the coating power supply, and is used to synchronously shut down the bias power supply and the coating power supply output after receiving the arc signal sent by the detection unit.

2. The coating equipment according to claim 1, characterized in that: The control unit controls the duration of shutting down the bias power supply and the coating power supply output to be between 10us and 1000us.

3. The coating equipment according to claim 1, characterized in that: The carrier plate is provided with a guide rail, and a plurality of bias rollers are provided at the bottom of the cavity. The bias rollers are matched with the guide rails so that the carrier plate moves on the plurality of bias rollers. The bias rollers are connected to the bias power supply.

4. The coating equipment according to claim 3, characterized in that: The biasing roller comprises: a supporting base, contacting the cavity; A bias feed interface, located on the surface of the support base, for connecting to the bias power supply; A transmission member is located on a side of the bias roller away from the support base and is used for overlapping the guide rail. The transmission member is electrically connected to the bias feed interface.

5. The coating equipment according to claim 4, characterized in that: The coating equipment includes: The vacuum feeding electrode is located on the cavity and is used to electrically connect the bias power supply and the bias feeding interface.

6. The coating equipment according to claim 3, characterized in that: An insulating roller is provided at the bottom of the cavity, and the insulating roller is matched with the guide rail. The coating equipment includes a transition cavity and a deposition cavity that are alternately arranged, and the bottom of the transition cavity is provided with an insulating roller.

7. The coating equipment according to claim 6, characterized in that: At the bottom of the deposition chamber, the bias rollers and the insulating rollers are arranged alternately.

8. The coating equipment according to claim 1, characterized in that: When the current value detected by the detection unit exceeds a preset current value, the control unit turns off the bias power supply and the coating power supply at the same time. The control unit restores the bias power supply and coating power supply output after turning off the bias power supply for a preset time.

9. The coating equipment according to claim 1, characterized in that: The bias power supply can output a pulse voltage, and when the detection unit detects an on / off signal of the pulse voltage, the signal is sent to the control unit so that the control unit controls the coating power supply and the bias power supply to be turned on and off synchronously to realize a synchronous pulse.

10. The coating equipment according to claim 1, characterized in that: The bias power supply provides the carrier with a bias voltage whose absolute value is greater than the floating potential of the carrier.

11. A coating method, applied to the coating device according to any one of claims 1 to 10, characterized in that: include: Controlling the coating power supply to deliver power to the target material, ionizing the gas to generate plasma for coating, and controlling the bias device to provide a bias voltage to the carrier plate to form a bias circuit of bias power supply-carrier plate-plasma-ground; detecting a current value of the bias circuit; When the current value of the carrier exceeds a preset current value, an arc signal is determined and sent to the control unit, and the control unit simultaneously turns off the bias power supply and the coating power supply output; After being turned off for a preset time, the outputs of the bias power supply and the coating power supply are restored synchronously.

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