Printed circuit board having ceramic heat dissipation coating part and semiconductor package including same

Abstract

The present invention provides a printed circuit board having a ceramic heat dissipation coating part for implementing effective heat dissipation, and a semiconductor package including same. The printed circuit board according to an embodiment of the present invention includes: an insulation body; a conductive pad disposed on a surface of the insulation body; a solder resist layer disposed to cover the surface of the insulation body and exposing the conductive pad; and a ceramic heat dissipation coating part disposed to cover the solder resist layer.

Description

Printed circuit board having a ceramic heat-dissipating coating and a semiconductor package including the same

[0001] The technical idea of ​​the present invention relates to a semiconductor device, and more specifically, to a printed circuit board having a ceramic heat-dissipating coating and a semiconductor package including the same.

[0002] As the integration of semiconductor packages increases, a significant amount of heat is generated, necessitating efficient heat dissipation for the normal operation of the semiconductor package. Conventionally, heat generated from semiconductor devices is dissipated vertically by a heat spreader placed on a printed circuit board. Conventional printed circuit boards have a very poor heat dissipation capability due to the formation of a solder resist layer with a low thermal conductivity of approximately 0.3 W / mK on their surface. Consequently, heat is locally dissipated vertically by the heat spreader placed on a narrow area of ​​the printed circuit board, leaving other areas of the printed circuit board with little heat dissipation, making it difficult to effectively dissipate heat from the semiconductor package.

[0003] The technical problem to be achieved by the technical idea of ​​the present invention is to provide a printed circuit board having a ceramic heat dissipation coating that implements effective heat dissipation and a semiconductor package including the same.

[0004] However, these tasks are exemplary and the technical idea of ​​the present invention is not limited thereto.

[0005] According to one embodiment of the present invention, a printed circuit board having a ceramic heat-dissipating coating may include: an insulating body; a conductive pad disposed on a surface of the insulating body; a solder resist layer disposed to cover a surface of the insulating body and exposing the conductive pad; and a ceramic heat-dissipating coating disposed to cover the solder resist layer.

[0006] According to one embodiment of the present invention, the ceramic heat-dissipating covering may be arranged to cover the conductive pad.

[0007] According to one embodiment of the present invention, the ceramic heat-dissipating covering may be arranged to expose the conductive pad.

[0008] According to one embodiment of the present invention, the ceramic heat-dissipating covering may be disposed on the first surface of the insulating body on which the semiconductor chip is mounted.

[0009] According to one embodiment of the present invention, the ceramic heat-dissipating covering may be disposed on the second surface of the insulating body on which the solder ball is disposed.

[0010] According to one embodiment of the present invention, the ceramic heat-dissipating covering may be arranged to extend so as to cover a side surface of the insulating body.

[0011] According to one embodiment of the present invention, the ceramic heat-dissipating coating may have a thermal conductivity in the range of 1 W / m K to 300 W / m K.

[0012] According to one embodiment of the present invention, the ceramic heat-dissipating coating may have a thickness in the range of 5 nm to 50 nm.

[0013] According to one embodiment of the present invention, a ceramic heat-radiating covering may include a first ceramic layer performing a heat-radiating function; and a second ceramic layer arranged to cover the first ceramic layer and performing a passivation function.

[0014] According to one embodiment of the present invention, the conductive pad may include a copper layer.

[0015] According to one embodiment of the present invention, the conductive pad may include a copper layer and a nickel layer arranged to cover the copper layer.

[0016] According to one embodiment of the present invention, the conductive pad may include a copper layer, a nickel layer arranged to cover the copper layer, and a gold layer arranged to cover the nickel layer.

[0017] According to one embodiment of the present invention, the conductive pad may include a copper layer and an organic solderable protective layer arranged to cover the copper layer.

[0018] According to one embodiment of the present invention, the printed circuit board may further include a surface wiring layer arranged on the surface of the insulating body to be electrically connected to the conductive pad.

[0019] According to one embodiment of the present invention, the printed circuit board may further include an internal wiring layer disposed inside the insulating body; and a through conductive via penetrating the insulating body and electrically connected to the internal wiring layer.

[0020] According to one embodiment of the present invention, a printed circuit board having a ceramic heat-dissipating coating may include: an insulating body; a conductive pad disposed on a surface of the insulating body; a ceramic heat-dissipating coating disposed to cover a surface of the insulating body and exposing the conductive pad; and a solder resist layer disposed to cover a surface of the ceramic heat-dissipating coating and exposing the conductive pad.

[0021] According to one embodiment of the present invention, a semiconductor package may include a printed circuit board including an insulating body; a conductive pad; a solder resist layer; and a ceramic heat-dissipating covering; a semiconductor chip mounted on the printed circuit board so as to be electrically connected; a solder ball electrically bonded to the printed circuit board; and a molding portion arranged on the printed circuit board so as to cover the semiconductor chip.

[0022] According to one embodiment of the present invention, the semiconductor package may further include a bonding wire that electrically connects the semiconductor chip and the printed circuit board.

[0023] According to one embodiment of the present invention, the bonding wire may be positioned in a region of the printed circuit board where the bonding wire is bonded, and may include fragments made of the same material as the ceramic heat-dissipating covering, and fragments of the ceramic heat-dissipating covering destroyed during the bonding process of the bonding wire.

[0024] According to one embodiment of the present invention, the printed circuit board further includes an intermetallic compound region formed in an area where the bonding wire is bonded, and at least some of the fragments may be located within the intermetallic compound region.

[0025] In conventional printed circuit boards, only a solder resist layer with low thermal conductivity is disposed on an insulating body, so that heat transfer in a direction parallel to the surface of the printed circuit board is hardly performed, and thus the heat dissipation characteristics are very poor. On the other hand, in the printed circuit board according to the technical idea of ​​the present invention, since a ceramic heat dissipation covering with high thermal conductivity is disposed on the insulating body, heat transfer in a direction parallel to the surface of the printed circuit board is enabled, thereby improving the heat dissipation characteristics.

[0026] The effects of the present invention described above are illustrative, and the scope of the present invention is not limited by these effects.

[0027] Figures 1 to 7 are cross-sectional views illustrating a printed circuit board according to one embodiment of the present invention.

[0028] FIG. 8 is a cross-sectional view illustrating a ceramic heat-dissipating coating composed of multiple layers in a printed circuit board according to one embodiment of the present invention.

[0029] FIG. 9 is a cross-sectional view illustrating a semiconductor package according to one embodiment of the present invention.

[0030] FIGS. 10 and 11 are enlarged cross-sectional views showing an area where a bonding wire is bonded in the semiconductor package of FIG. 9 according to one embodiment of the present invention.

[0031] Fig. 12 is a graph showing the results of a heat generation test of a wireless charging module using a printed circuit board according to an embodiment of the present invention.

[0032] FIG. 13 is a block diagram of an electronic system according to one embodiment of the present invention.

[0033] Hereinafter, various preferred embodiments of the present invention will be described in detail with reference to the attached drawings. Embodiments of the present invention are provided to more completely explain the present invention to those skilled in the art, and the following embodiments may be modified in various different forms, and the scope of the present invention is not limited to the following embodiments. Rather, these embodiments are provided to more faithfully and completely explain the present disclosure and to fully convey the spirit of the present invention to those skilled in the art. Like reference numerals refer to like elements throughout the specification. In the drawings, the thickness and size of each layer are exaggerated for convenience and clarity of explanation. In addition, variations in the shapes depicted in the drawings may be expected depending on manufacturing techniques and / or tolerances. Therefore, the embodiments of the present invention should not be construed as being limited to the specific shapes of the regions illustrated in the specification, and should include, for example, shape variations resulting from manufacturing.

[0034] Throughout the specification, the term "electrically connected" includes components in direct contact with each other and components interposed therebetween, and encompasses various ways in which components are electrically connected.

[0035] According to the technical idea of ​​the present invention, a printed circuit board having a ceramic heat-dissipating coating and a semiconductor package including the same are provided.

[0036] Figures 1 to 7 are cross-sectional views illustrating a printed circuit board according to one embodiment of the present invention.

[0037] Referring to FIG. 1, a printed circuit board (100) includes an insulating body (110), a conductive pad (120), a solder resist layer (130), and a ceramic heat-dissipating coating (140).

[0038] The printed circuit board (100) may include a rigid printed circuit board, a flexible printed circuit board, a lead frame, a metal-core printed circuit board (MCPCB), or a battery module electrode. The printed circuit board (100) may be formed as a single layer or as a plurality of layers of 20 layers or less.

[0039] Additionally, the printed circuit board (100) may further include a surface wiring layer (150), an internal wiring layer (160), and a through conductive via (170).

[0040] The insulating body (110) can form the entire structure of the printed circuit board (100) and can be composed of an insulating material. The insulating body (110) can include a first surface (111), a second surface (112) positioned opposite to the first surface (111), and a side surface (113) positioned laterally of the first surface (111) and the second surface (112). The insulating body (110) can include an insulating material, and for example, it can include flame retardant 4 (FR-4) composed of glass fiber and epoxy resin, composite epoxy material-1 (CEM-1), composite epoxy material-3 (CEM-3), polyimide, and Teflon (Polytetrafluoroethylene, PTFE). However, this is an example and the technical idea of ​​the present invention is not limited thereto.

[0041] The conductive pad (120) may be placed on the surface of the insulating body (110). The conductive pad (120) may be electrically connected to a bonding wire or a solder ball. The conductive pad (120) may include a conductive material, for example, a metal material, for example, at least one of copper (Cu), aluminum (Al), tin (Sn), gold (Au), silver (Ag), nickel (Ni), zinc (Zn), palladium (Pd), antimony (Sb), bismuth (Bi), and alloys thereof. However, this is merely an example, and the technical idea of ​​the present invention is not limited thereto.

[0042] PPG resin (polyphenylene glycol resin) can be applied around the challenge pad (120) to form a protective film.

[0043] The solder resist layer (130) can be arranged to cover the surface of the insulating body (110) and expose the conductive pad (120). The solder resist layer (130) can be arranged to cover at least one of the first surface (111) and the second surface (112) of the insulating body (110) and can extend to cover the side surface (113) of the insulating body (110). The solder resist layer (130) is an insulating coating layer that can provide insulating properties to prevent high-frequency signal interference and leakage current, can prevent an electrical short caused by a soldering material spreading and connecting between adjacent surface wiring layers, can prevent oxidation, corrosion, contamination, and damage of the surface wiring layer, can induce precise soldering by exposing only the conductive pads that require soldering, and can improve the mechanical strength and durability of the printed circuit board. The solder resist layer (130) may include various insulating materials and may include a polymer material, for example, at least one of epoxy, polyimide (PI), polyurethane (PU), polyester (PE), polyvinylidene fluoride (PVDF), polyamide (PA), polyvinyl ethylene nitrate, polyester, and polyester imide. However, this is merely an example, and the technical idea of ​​the present invention is not limited thereto.

[0044] The ceramic heat-dissipating coating (140) may be arranged to cover the solder resist layer (130). The ceramic heat-dissipating coating (140) may be arranged on the first surface (111) of the insulating body (110) on which the semiconductor chip is mounted, and may be arranged to cover the solder resist layer (130) on the first surface (111) of the insulating body (110). The ceramic heat-dissipating coating (140) may be arranged on the second surface (112) of the insulating body (110) on which the solder ball is bonded, and may be arranged to cover the solder resist layer (130) on the second surface (112) of the insulating body (110). The ceramic heat-dissipating covering (140) can be arranged to cover the side surface (113) of the insulating body (110), and can also be arranged to extend to cover the side surface of the solder resist layer (130) of the insulating body (110).

[0045] In the printed circuit board (100) illustrated in Fig. 1, a ceramic heat-dissipating coating (140) is formed entirely on the outer surface of the printed circuit board (100). That is, the ceramic heat-dissipating coating (140) is arranged to cover the solder resist layer (130) and, together with it, the conductive pad (120).

[0046] The ceramic heat-dissipating coating (140) can provide both insulating properties and heat-dissipating properties. Therefore, the ceramic heat-dissipating coating (140) can insulate the insulating body (110) and simultaneously implement heat conduction in a direction parallel to the surface of the insulating body (110), thereby providing excellent heat-dissipating properties. In addition, the ceramic heat-dissipating coating (140) can perform the function of insulating the insulating body (110) and the solder resist layer (130) from the outside by covering the insulating body (110) and the solder resist layer (130) so as to block them from the outside, and can also perform a passivation function of protecting the insulating body (110) and the solder resist layer (130).

[0047] The ceramic heat-dissipating coating (140) may include a material having a higher thermal conductivity than the material constituting the insulating body (110) and the material constituting the solder resist layer (130). The ceramic heat-dissipating coating (140) may include, for example, a material having a thermal conductivity of 1 W / m K or more at 25°C, and may include, for example, a material having a thermal conductivity in the range of 1 W / m K to 300 W / m K at 25°C. For reference, epoxy, which is a material constituting the insulating body (110) or the solder resist layer (130), typically has a thermal conductivity of 0.3 W / m K.

[0048] The ceramic heat dissipation covering (140) may be composed of a ceramic material, may include a ceramic-based insulator, and may include, for example, an oxide or a nitride, and may include, for example, at least one of aluminum oxide (Al2O3), silicon oxide (SiO2), silicon carbide (SiC), titanium oxide (TiO2), zirconium oxide (ZrO2), hafnium oxide (HfO2), magnesium oxide (MgO), beryllium oxide (BeO), mullite, aluminum nitride (AlN), silicon nitride (Si3N4), and boron nitride (BN). However, this is exemplary and the technical idea of ​​the present invention is not limited thereto.

[0049] For example, when the ceramic heat-dissipating covering (140) is formed of at least one of aluminum oxide, titanium oxide, zirconium oxide, and hafnium oxide, the insulating property is excellent, the dielectric strength is excellent, and since an intermetallic compound is not formed with the material constituting the conductive pad (120), the stability is high, and the bonding property and protection with the conductive pad (120) can be improved.

[0050] Table 1 shows the thermal conductivity (unit: W / m K) at 25°C of exemplary materials constituting the ceramic heat-radiating covering (140).

[0051] MaterialAlNSiCAl2O3Si3N4ZrO2BeOBNMgOThermal Conductivity150603220328027540

[0052] The ceramic heat-dissipating coating (140) can be formed using physical vapor deposition (PVD), chemical vapor deposition (CVD), atomic layer deposition (ALD), or the like. In particular, when the ceramic heat-dissipating coating (140) is formed using atomic layer deposition, the ceramic heat-dissipating coating (140) can have a thickness on the order of nanometers, and can have a more uniform, dense, and fine quality. The ceramic heat-dissipating coating (140) can have various thicknesses, and for example, can have a thickness in the range of 5 nm to 50 nm.

[0053] However, this is exemplary and the technical idea of ​​the present invention is not limited thereto.

[0054] The ceramic heat-dissipating coating (140) may be formed as a single layer or as multiple layers composed of different materials. This will be described in detail below with reference to FIG. 8.

[0055] The ceramic heat-dissipating coating (140) can have a thickness uniformity with an error of 10% or less. Here, the thickness uniformity means that the thickness at a specific point is within a range of +10% to -10% based on the average thickness measured at 5 or more points.

[0056] The surface wiring layer (150) may be arranged on the surface of the insulating body (110) to be electrically connected to the conductive pad (120). The surface wiring layer (150) may be arranged on the lower side of the conductive pad (120) and may be in direct contact with the conductive pad (120) to be electrically connected. The surface wiring layer (150) may be arranged on at least one of the first side (111) and the second side (112) of the insulating body (110). A solder resist layer (130) may be in direct contact with the surface wiring layer (150). The surface wiring layer (150) may include a first surface wiring layer (151) arranged directly on the lower side of the conductive pad (120) and a second surface wiring layer (152) arranged spaced apart from the conductive pad (120) and electrically connected or not to the conductive pad (120). The surface wiring layer (150) may be formed in various pattern shapes.

[0057] The internal wiring layer (160) may be arranged inside the insulating body (110). The internal wiring layer (160) may be composed of one or more layers. The internal wiring layer (160) may be electrically connected to the surface wiring layer (150).

[0058] A through-conductive via (170) can penetrate the insulating body (110) and be electrically connected to the internal wiring layer (160). The through-conductive via (170) can electrically connect the internal wiring layers (160) to each other. The through-conductive via (170) can be electrically connected to the surface wiring layer (150). The through-conductive via (170) can extend to the outside of the insulating body (110). The through-conductive via (170) can be covered by a solder resist layer (130). Therefore, when the solder resist layer (130) is removed, the through-conductive via (170) can function as a conductive pad. The through-conductive via (170) can provide an electrical connection path and a heat dissipation path in a direction perpendicular to the surface of the insulating body (110).

[0059] The surface wiring layer (150), the internal wiring layer (160), and the through conductive via (170) may include a conductive material, for example, a metal material, for example, at least one of copper (Cu), aluminum (Al), tin (Sn), gold (Au), silver (Ag), nickel (Ni), zinc (Zn), palladium (Pd), antimony (Sb), bismuth (Bi), and alloys thereof. The conductive pad (120), the surface wiring layer (150), the internal wiring layer (160), and the through conductive via (170) may include the same material or different materials.

[0060] Below, various shapes of the challenge pad (120) will be described.

[0061] The conductive pad (120) included in the printed circuit board (100) of Fig. 1 may be configured as a three-layer structure including a copper layer (121), a nickel layer (122) arranged to cover the copper layer (121), and a gold layer (123) arranged to cover the nickel layer (122). The copper layer (121) can provide excellent electrical conductivity and cost-effectiveness, and the nickel layer (122) and the gold layer (123) can prevent oxidation of the copper layer (121) and also increase the bondability of a bonding wire or solder ball in a subsequent process.

[0062] The copper layer (121) may include copper (Cu) or a copper alloy. The nickel layer (122) may include nickel (Ni) or a nickel alloy. The gold layer (123) may include gold (Au) or a gold alloy.

[0063] Referring to Fig. 2, the printed circuit board (100a) has a different structure of the conductive pad (120a) compared to the printed circuit board (100) of Fig. 1, but the other features described above may be the same. The conductive pad (120a) may be configured as a two-layer structure including a copper layer (121) and a nickel layer (122) arranged to cover the copper layer (121). That is, the gold layer (123) of Fig. 1 may be omitted.

[0064] Referring to FIG. 3, the printed circuit board (100b) has a different structure of the conductive pad (120b) compared to the printed circuit board (100) of FIG. 1, but the other features described above may be the same. The conductive pad (120a) may be configured as a two-layer structure including a copper layer (121) and an organic solder-like protective layer (124) arranged to cover the copper layer (121). That is, the gold layer (123) and nickel layer (122) of FIG. 1 may be omitted.

[0065] The organic solderability preservative layer (124) reacts with the surface of the copper layer to form a thin and uniform protective layer, thereby preventing oxidation of the copper layer, and is easily removed at high temperatures during the bonding process of a bonding wire or solder ball, thereby facilitating bonding. The organic solderability preservative layer (124) may include various organic substances, and may include, for example, at least one of imidazole, benzimidazole, and benzotriazole.

[0066] Referring to FIG. 4, the printed circuit board (200) has a different arrangement of the ceramic heat-dissipating coating (240) compared to the printed circuit board (100) of FIG. 1, but the other features described above may be the same. The ceramic heat-dissipating coating (240) may be arranged to cover the solder resist layer (130) and expose the conductive pad (120). That is, the ceramic heat-dissipating coating (240) is not formed on the conductive pad (120).

[0067] Additionally, the surface of the insulating body (110) on which the challenge pad (120) is not placed and not covered by the solder resist layer (130) may be covered by the ceramic heat-dissipating coating (240), or may be exposed without being covered by the ceramic heat-dissipating coating (240).

[0068] Referring to Fig. 5, the printed circuit board (200a) has a different structure of the conductive pad (120a) compared to the printed circuit board (200) of Fig. 4, but the other features described above may be the same. The conductive pad (120a) may be configured as a two-layer structure including a copper layer (121) and a nickel layer (122) arranged to cover the copper layer (121). That is, the gold layer (123) of Fig. 4 may be omitted.

[0069] Referring to Fig. 6, the printed circuit board (200b) has a different structure of the conductive pad (120b) compared to the printed circuit board (200) of Fig. 4, but the other features described above may be the same. The conductive pad (120a) may be configured as a two-layer structure including a copper layer (121) and an organic solder-like protective layer (124) arranged to cover the copper layer (121). That is, the gold layer (123) and nickel layer (122) of Fig. 1 may be omitted.

[0070] Referring to FIG. 7, a printed circuit board (300) includes an insulating body (110); a conductive pad (120) disposed on a surface of the insulating body (110); a ceramic heat-dissipating coating (340) disposed to cover the surface of the insulating body (110) and exposing the conductive pad (120); and a solder resist layer (130) disposed to cover the surface of the ceramic heat-dissipating coating (340) and exposing the conductive pad (120).

[0071] FIG. 8 is a cross-sectional view illustrating a ceramic heat-dissipating coating composed of multiple layers in a printed circuit board according to one embodiment of the present invention.

[0072] Referring to FIG. 8, an exemplary ceramic heat-dissipating coating (140) composed of multiple layers is illustrated. The ceramic heat-dissipating coating (140) may include a first ceramic layer (141) that performs a heat-dissipating function due to high thermal conductivity, and a second ceramic layer (142) that is arranged to cover the first ceramic layer (141) and performs a passivation function. The first ceramic layer (141) may be in contact with the solder resist layer (130), and the first ceramic layer (141) may be exposed to the outside. The first ceramic layer (141) may include, for example, aluminum nitride having high thermal conductivity, and the second ceramic layer (142) may include, for example, aluminum oxide having excellent protective properties.

[0073] The printed circuit board according to the technical concept of the present invention can be applied to various electronic devices and electronic components. Below, the application of the printed circuit board to a semiconductor package will be described as an example. However, this application is merely exemplary, and the technical concept of the present invention is not limited thereto.

[0074] FIG. 9 is a cross-sectional view illustrating a semiconductor package according to one embodiment of the present invention.

[0075] Referring to FIG. 9, a semiconductor package (900) may include a printed circuit board (100), a semiconductor chip (910), a solder ball (930), and a molding part (940). The semiconductor package (900) may further include a bonding wire (920) that electrically connects the semiconductor chip (910) and the printed circuit board (100).

[0076] The semiconductor package (900) may include various semiconductor packages using a printed circuit board (100) having a ceramic heat-dissipating coating, and may include, for example, at least one of a SiP (System in Package), a BGA (Ball Grid Array) package, a CSP (Chip Scale Package), a WLP (Wafer Level Package), and a PLP (Panel Level Package). In addition, the semiconductor package may include a Small Outline Package (SOP), a Quad Flat Package (QFP), a Small Outline J-Band Package (SOJ), a Plastic Leaded Chip Carrier (PLCC), a J Leaded Chip Carrier (JLCC), a Mini Square Package (MSP), a Leadless Chip Carrier (LCC), a Dual In-Line Package (DIP), a Single In-Line Package (SILP), a Zigzag In-Line Package (ZIP), a Shrink Dual In-Line Package (S-DIP), a Skinny Dual In-Line Package (SK-DIP), a Pin Grid Array (PGA), a Ceramic Ball Grid Array (CBGA), a Ceramic Pin Grid Array (CPGA), a Tape Carrier Package (TCP), a Leadless Chip Package (LCC), a Chip On Board (COB), or a Chip On Glass (COG). However, this is merely an example, and the technical idea of ​​the present invention is not limited thereto.

[0077] A printed circuit board (100) may include an insulating body (110); a conductive pad (120) disposed on a surface of the insulating body (110); a solder resist layer (130) disposed to cover a surface of the insulating body (110) and exposing the conductive pad (120); and a ceramic heat-dissipating coating (140) disposed to cover the solder resist layer (130).

[0078] A semiconductor package to which the above-described printed circuit board (100a, 100b, 200, 200a, 200b, 300) is applied instead of the printed circuit board (100) is also included in the technical concept of the present invention.

[0079] The semiconductor chip (910) can be mounted on a printed circuit board (100) so as to be electrically connected. The mounting of the semiconductor chip (910) can be performed in various ways.

[0080] The semiconductor chip (910) may include various semiconductor chips. The semiconductor chip (910) may be, for example, a memory semiconductor chip. The memory semiconductor chip may be, for example, a volatile memory semiconductor chip such as a DRAM (Dynamic Random Access Memory) or an SRAM (Static Random Access Memory), or a non-volatile memory semiconductor chip such as a PRAM (Phase-change Random Access Memory), an MRAM (Magneto-resistive Random Access Memory), a FeRAM (Ferroelectric Random Access Memory), or an RRAM (Resistive Random Access Memory). In addition, the semiconductor chip (910) may be, for example, a logic semiconductor chip such as a central processing unit (CPU, MPU), an application processor (AP), a graphics processing semiconductor chip (GPU), an image sensor semiconductor chip, etc.

[0081] The solder ball (930) can be electrically connected to the printed circuit board (100). The solder ball (930) can be positioned opposite to the semiconductor chip (910) of the printed circuit board (100). The solder ball (930) can include at least one of lead (Pb), silver (Ag), copper (Cu), antimony (Sb), bismuth (Bi), nickel (Ni), gold (Au), aluminum (Al), palladium (Pd), and alloys thereof. The solder ball (930) may be composed of, for example, a tin-lead (Sn-Pb) alloy, a tin-silver (Sn-Ag) alloy, a tin-copper (Sn-Cu) alloy, a tin-antimony (Sn-Sb) alloy, a tin-bismuth (Sn-Bi) alloy, a tin-lead-silver (Sn-Pb-Ag) alloy, a tin-silver-copper-nickel (Sn-Ag-Cu-Ni) alloy, a tin-silver-copper-antimony (Sn-Ag-Cu-Sb) alloy, a tin-silver-copper-bismuth (Sn-Ag-Cu-Bi) alloy, etc. However, this is merely an example and the technical idea of ​​the present invention is not limited thereto.

[0082] The solder ball (930) may have flux applied to its surface to prevent oxidation. The flux can improve electrical contact and increase adhesion by changing the surface tension of the solder material melted from the solder ball (930).

[0083] The molding portion (940) may be arranged to cover the semiconductor chip (910) on the printed circuit board (100). The molding portion (940) may seal the semiconductor chip (910) to electrically insulate it from the outside and protect it from external forces. The molding portion (940) may include various materials, for example, an EMC (Epoxy Mold Compound). The EMC may improve mechanical strength and heat dissipation characteristics.

[0084] Since the ceramic heat-dissipating covering (140) is composed of ceramic, it can be strongly bonded to the solder resist layer (130) and also to the molding portion (940), thereby improving the reliability and durability of the semiconductor package (900).

[0085] The bonding wire (920) can electrically connect the semiconductor chip (910) and the printed circuit board (100). For example, the semiconductor chip pad (912) of the semiconductor chip (910) and the conductive pad (120) of the printed circuit board (100) can be electrically connected. However, this is exemplary, and a case in which the semiconductor chip (910) is electrically connected to the printed circuit board (100) through a solder ball is also included in the technical concept of the present invention.

[0086] The bonding wire (920) may have various diameters, for example, a diameter ranging from 0.1 mm to 5.0 mm. The bonding wire (920) may include a metal, for example, gold (Au), silver (Ag), copper (Cu), aluminum (Al), tin (Sn), palladium (Pd), and alloys thereof. The bonding wire (920) may have various cross-sectional shapes, for example, a circular, oval, semicircular, triangular, rectangular, etc. An insulating coating may be formed on the surface of the bonding wire (920), for example, an insulating coating formed of an oxide or nitride including at least one of aluminum oxide (Al2O3), titanium oxide (TiO2), zirconium oxide (ZrO2), and hafnium oxide (HfO2), or an insulating coating formed of a polymer. The insulating coating composed of the above oxide or nitride can be formed using physical vapor deposition (PVD), chemical vapor deposition (CVD), or atomic layer deposition (ALD).

[0087] FIGS. 10 and 11 are enlarged cross-sectional views showing an area where a bonding wire is bonded in the semiconductor package of FIG. 9 according to one embodiment of the present invention.

[0088] Referring to FIG. 10, a fragment (922) is illustrated located in an area where a bonding wire (920) is bonded to a conductive pad (120) of a printed circuit board (100). The fragment (922) may be formed when a ceramic heat-dissipating coating (140) on the conductive pad (120) is broken as the bonding wire (920) comes into contact with it. At least a portion of the fragment (922) may be located at the interface between the conductive pad (120) and the bonding wire (920). The fragment (922) may be made of the same material as the ceramic heat-dissipating coating (140). The fragment (922) may be composed of fragments of the ceramic heat-dissipating coating (140) that are broken during the process of bonding the bonding wire (920) to the conductive pad (120).

[0089] For example, when the ceramic heat-dissipating coating (140) is composed of aluminum nitride, the fragments (922) may be composed of aluminum nitride. The bonded region by the fragments (922) may contain aluminum nitride nanoparticles. The aluminum nitride nanoparticles may increase the wettability and bonding properties of the bonding wire (920) to the conductive pad (120), for example, by increasing the contact area. In addition, the aluminum oxide nanoparticles may increase the shear stress of the bonded region.

[0090] Referring to FIG. 11, the printed circuit board (100) may further include an intermetallic compound region (924) disposed in an area where a bonding wire (920) is bonded to a conductive pad (120). At least a portion of the fragment (922) may be located within the intermetallic compound region (924). At least a portion of the fragment (922) may be located at an interface between the conductive pad (120) and the bonding wire (920) within the intermetallic compound region (924). The intermetallic compound region (924) may be formed by alloying and bonding a material constituting the conductive pad (120) and a material constituting the bonding wire (920).

[0091] Since the fragment (922) is composed of the same material as the ceramic heat-dissipating covering (140), for example, including at least one of aluminum oxide (Al2O3), silicon oxide (SiO2), silicon carbide (SiC), titanium oxide (TiO2), zirconium oxide (ZrO2), hafnium oxide (HfO2), magnesium oxide (MgO), beryllium oxide (BeO), mullite, aluminum nitride (AlN), silicon nitride (Si3N4), and boron nitride (BN), the roughness of the surface of the conductive pad (120) can be increased, thereby improving the adhesion between the conductive pad (120) and the bonding wire (920). In addition, since the bonding force between the metal oxide or metal nitride and the metal is greater than the bonding force by the intermetallic oxide, the adhesion can be increased.

[0092] Fragments (922) may also be formed in the area bonded with the challenge pad (120) and the solder ball (930).

[0093] Alternatively, while the solder ball (930) is bonded to the conductive pad (120), the ceramic heat dissipation coating (140) on the conductive pad (120) is destroyed by the solder ball (930), forming fragments (922). The fragments (922) may be reduced from ceramic to metal by the pre-applied flux and may diffuse into the solder ball (930), thereby causing the fragments (922) to disappear.

[0094] Fig. 12 is a graph showing the results of a heat generation test of a wireless charging module using a printed circuit board according to an embodiment of the present invention.

[0095] Referring to Fig. 12, the embodiment is a wireless charging module formed using a printed circuit board with 20 nm thick aluminum oxide as a ceramic heat-dissipating coating, and the comparative example is a wireless charging module formed using a printed circuit board without a ceramic heat-dissipating coating. Wireless charging was performed at 20 W with a current of 1 A, and the temperature of the wireless charging module over time was measured using a thermal imaging camera.

[0096] The initial temperature is about 23 o C, and after about 600 seconds of charging, the comparative example was about 37.7 o C, and the example is 35.8 o It was measured as C. Therefore, the temperature of the example was low, which is analyzed as a result of the ceramic heat-radiating coating quickly dissipating heat in the surface direction.

[0097] FIG. 13 is a block diagram of an electronic system according to one embodiment of the present invention.

[0098] Referring to FIG. 13, the electronic system (1000) includes a controller (1010), an input / output device (I / O) (1020), a memory (1030), and an interface (1040), which are each interconnected via a bus (1050).

[0099] The controller (1010) may include at least one of a microprocessor, a digital signal processor, or a similar processing device. The input / output device (1020) may include at least one of a keypad, a keyboard, or a display. The memory (1030) may be used to store commands executed by the controller (1010). For example, the memory (1030) may be used to store user data.

[0100] The electronic system (1000) may include at least one of the semiconductor packages described above and semiconductor packages manufactured using various manufacturing methods modified and altered within the scope of the technical concept of the present invention. For example, the semiconductor package described above may be applied to a controller (1010) or a memory (1030).

[0101] It will be apparent to those skilled in the art that the technical concept of the present invention described above is not limited to the aforementioned embodiments and the attached drawings, and that various substitutions, modifications, and changes are possible without departing from the technical concept of the present invention. Therefore, the scope of the present invention should be determined by the claims set forth below.

Claims

1. Insulated body; A conductive pad arranged on the surface of the above insulating body; A solder resist layer arranged to cover the surface of the insulating body and exposing the conductive pad; and Including a ceramic heat-dissipating coating arranged to cover the solder resist layer, Printed circuit board.

2. In paragraph 1, The above ceramic heat-radiating covering part is, Positioned to cover the above challenge pad, Printed circuit board.

3. In paragraph 1, The above ceramic heat-radiating covering part is, Positioned to expose the above challenge pad, Printed circuit board.

4. In paragraph 1, The above ceramic heat-radiating covering part is, Placed on the first surface of the insulating body on which the semiconductor chip is mounted, Printed circuit board.

5. In paragraph 1, The above ceramic heat-radiating covering part is, Placed on the second surface of the insulating body on which the solder ball is placed, Printed circuit board.

6. In paragraph 1, The above ceramic heat-radiating covering part is, Extended and arranged to cover the side of the above insulating body, Printed circuit board.

7. In paragraph 1, Ceramic heat dissipation covering, Having a thermal conductivity in the range of 1 W / m K to 300 W / m K, Printed circuit board.

8. In paragraph 1, Ceramic heat dissipation covering, having a thickness in the range of 5 nm to 50 nm, Printed circuit board.

9. In paragraph 1, Ceramic heat dissipation covering, A first ceramic layer performing a heat dissipation function; and A second ceramic layer is disposed to cover the first ceramic layer and performs a passivation function. Printed circuit board.

10. In paragraph 1, The above challenge pad is, Containing a copper layer, Printed circuit board.

11. In paragraph 1, The above challenge pad is, Comprising a copper layer and a nickel layer arranged to cover the copper layer, Printed circuit board.

12. In paragraph 1, The above challenge pad is, Comprising a copper layer, a nickel layer arranged to cover the copper layer, and a gold layer arranged to cover the nickel layer, Printed circuit board.

13. In paragraph 1, The above challenge pad is, Comprising a copper layer and an organic solderable protective layer arranged to cover the copper layer, Printed circuit board.

14. In paragraph 1, The above printed circuit board, Further comprising a surface wiring layer arranged on the surface of the insulating body to be electrically connected to the conductive pad, Printed circuit board.

15. In paragraph 1, The above printed circuit board, An internal wiring layer arranged inside the above insulating body; and Further comprising a through conductive via penetrating the insulating body and electrically connected to the internal wiring layer, Printed circuit board.

16. Insulated body; A conductive pad arranged on the surface of the above insulating body; A ceramic heat-dissipating covering disposed to cover the surface of the insulating body and exposing the conductive pad; and A solder resist layer disposed to cover the surface of the ceramic heat-dissipating coating and exposing the conductive pad, Printed circuit board.

17. A printed circuit board including an insulating body; a conductive pad; a solder resist layer; and a ceramic heat-dissipating coating; A semiconductor chip mounted so as to be electrically connected on the above printed circuit board; A solder ball electrically bonded to the printed circuit board; and Including a molding part arranged to cover the semiconductor chip on the printed circuit board, Semiconductor package.

18. In paragraph 17, The above semiconductor package, Further comprising a bonding wire electrically connecting the semiconductor chip and the printed circuit board. Semiconductor package.

19. In paragraph 18, A fragment comprising a fragment of the ceramic heat-dissipating covering, which is located in an area where the bonding wire is bonded to the printed circuit board, and is made of the same material as the ceramic heat-dissipating covering, and is composed of fragments of the ceramic heat-dissipating covering that are destroyed during the bonding process of the bonding wire. Semiconductor package.

20. In paragraph 19, Further comprising an intermetallic compound region formed in the area where the bonding wire is bonded to the printed circuit board, At least some of the fragments are located within the intermetallic compound region, Semiconductor package.

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