Method for manufacturing signal transmission cable for BMS and signal transmission cable for BMS manufactured thereby

Abstract

The present invention relates to a method for manufacturing a signal transmission cable for a battery management system (BMS), the method comprising the steps of: adhering a metal substrate to the upper surface of a carrier film, cutting the metal substrate into a predetermined shape, and transferring same; forming a circuit pattern by etching the transferred metal substrate with a laser; removing a scrap area of the metal substrate other than the circuit pattern; modifying surface roughness of the upper surface of the circuit pattern; laminating a first cover layer on the upper surface of the circuit pattern; removing a carrier film adhered to the lower surface of the circuit pattern; modifying the surface roughness of the lower surface of the circuit pattern; and laminating a second cover layer on the lower surface of the circuit pattern.

Description

Method for manufacturing a signal transmission cable for BMS and a signal transmission cable for BMS according to the method

[0001] The present invention relates to a method for manufacturing a signal transmission cable for BMS and a signal transmission cable therefor, and more particularly, to a method for manufacturing a signal transmission cable for BMS and a signal transmission cable therefor, which can improve the productivity of manufacturing a signal transmission cable for BMS and reduce the defect rate by manufacturing a relay cable for BMS for electrical signal transmission using a roll-to-roll process.

[0002]

[0003] As the development of electric vehicles, energy storage batteries, robots, satellites, etc. is in full swing, research on batteries using secondary batteries that can be repeatedly charged and discharged is actively being conducted. In particular, demand for batteries for electric vehicles (EVs) or energy storage systems (ESSs) using secondary batteries is increasing due to strengthened environmental regulations and persistent high oil prices.

[0004] As demand for high-capacity batteries has increased recently, battery packs with multiple battery cells connected in series and parallel have become widely used, and a battery management system (BMS) is being utilized as a system to manage these battery packs.

[0005] In BMS, a relay cable is essential as a means of electrically connecting various components such as internal battery cells. In the past, a flexible flat cable using the FPCB (Flexible Printed Circuit Board) method was used as such a relay cable.

[0006] These FPCBs are manufactured by laminating a dry film on a copper-clad laminate formed by forming a copper foil on a polyimide film, and then forming a conductor pattern through exposure, development, and etching processes, and then bonding a cover layer and bonding the cover layer on the outermost copper foil.

[0007] This FPCB manufacturing process requires multiple steps, resulting in high manufacturing costs and low productivity. Furthermore, the etching process generates a large amount of wastewater containing chemicals, requiring additional treatment processes and costs to purify. To address these issues, Korean Patent No. 10-1377273 discloses a laser-based FPCB manufacturing system. However, this system still incurs additional costs for installing expensive laser equipment and fails to improve productivity.

[0008]

[0009] Accordingly, the technical problem of the present invention is conceived from this point, and relates to a method for manufacturing a signal transmission cable for BMS and a signal transmission cable according to the method, which can not only improve the productivity of manufacturing a signal transmission cable for BMS by manufacturing a relay cable for BMS for transmitting an electrical signal using a roll-to-roll process, but also reduce the defect rate.

[0010]

[0011] According to one embodiment of the present invention, a method for manufacturing a signal transmission cable used as a relay cable for transmitting an electrical signal in a BMS (Battery Management System) is provided, comprising: a step of attaching a metal substrate to an upper surface of a carrier film, cutting the metal substrate into a predetermined shape, and transporting the metal substrate; a step of etching the transported metal substrate with a laser to form a circuit pattern; a step of removing a scrap area of ​​the metal substrate other than the circuit pattern; a step of modifying the surface roughness of an upper surface of the circuit pattern; a step of laminating a first cover layer to an upper surface of the circuit pattern; a step of removing the carrier film attached to a lower surface of the circuit pattern; a step of modifying the surface roughness of the lower surface of the circuit pattern; and a step of laminating a second cover layer to the lower surface of the circuit pattern.

[0012] At this time, surface roughness modification of the upper surface of the circuit pattern is performed by plasma generated using a plasma generation device provided on the upper side of the circuit pattern, and surface roughness modification of the lower surface of the circuit pattern can be performed by plasma generated using a plasma generation device provided on the lower side of the circuit pattern.

[0013] At this time, the step of forming the circuit pattern by etching the metal substrate with a laser; and then, the step of washing the metal substrate may be further included.

[0014] In addition, the method may further include a step of forming the circuit pattern by etching the metal substrate with a laser; and a step of removing hydrocarbons generated on the surface of the metal substrate in the laser etching process using a laser.

[0015] At this time, the step of removing the scrap area of ​​the metal substrate can be performed by attaching an adhesive film to the upper surface of the punched metal substrate and then removing the adhesive film to which the scrap area is attached.

[0016] Additionally, prior to the step of laminating the first cover layer to the upper surface of the circuit pattern, the method may further include a step of forming an open area in the first cover layer.

[0017] At this time, a step of plating the open area formed in the first cover layer may be further included.

[0018] In addition, the step of laminating the first cover layer and the step of laminating the second cover layer may include a step of bonding the first cover layer and the second cover layer to the circuit pattern; and a step of pressing the bonded first cover layer and the second cover layer to laminate the first cover layer and the second cover layer.

[0019] Additionally, the metal substrate may be a film made of copper or aluminum.

[0020] Additionally, the metal substrate may be plated with nickel (Ni) on both sides of a film made of copper or aluminum.

[0021] According to another embodiment of the present invention, a method for manufacturing a signal transmission cable used as a relay cable for transmitting an electrical signal in a BMS (Battery Management System) comprises the steps of: attaching a first metal substrate to an upper surface of a first carrier film, cutting the first metal substrate into a predetermined shape, and transporting the first metal substrate; etching the transported first metal substrate with a laser to form a first circuit pattern; removing a scrap area of ​​the first metal substrate other than the first circuit pattern; modifying the surface roughness of the upper surface of the first circuit pattern; attaching a second metal substrate to a lower surface of a second carrier film, and transporting the second metal substrate; etching the transported second metal substrate with a laser to form a second circuit pattern; removing a scrap area of ​​the second metal substrate other than the second circuit pattern; modifying the surface roughness of the lower surface of the second circuit pattern; bonding the first circuit pattern and the second circuit pattern; laminating a first cover layer on an upper surface of the first circuit pattern; laminating a second cover layer on a lower surface of the second circuit pattern; A method for manufacturing a signal transmission cable for BMS is provided, characterized by including a step of forming a through hole penetrating the first cover layer, the first circuit pattern, the second circuit pattern, and the second cover layer; and a step of plating the through hole.

[0022] Meanwhile, according to a modified example of another embodiment of the present invention, a method for manufacturing a signal transmission cable used as a relay cable for transmitting an electrical signal in a BMS (Battery Management System), comprising: a step of adhering a first metal substrate to an upper surface of a first carrier film, cutting the first metal substrate into a predetermined shape, and transporting the same; a step of adhering a first metal substrate to an upper surface of a first carrier film, cutting the first metal substrate into a predetermined shape, and transporting the same; a step of etching the transferred first metal substrate with a laser to form a first circuit pattern; a step of removing a scrap area of ​​the first metal substrate other than the first circuit pattern; a step of modifying the surface roughness of the upper surface of the first circuit pattern; a step of adhering a second metal substrate to a lower surface of a second carrier film, and transporting the same; a step of etching the transferred second metal substrate with a laser to form a second circuit pattern; a step of removing a scrap area of ​​the second metal substrate other than the second circuit pattern; a step of modifying the surface roughness of the lower surface of the second circuit pattern; a step of bonding the first circuit pattern and the second circuit pattern; A method for manufacturing a signal transmission cable for BMS is provided, characterized by including the steps of: forming a through-hole penetrating the first circuit pattern and the second circuit pattern; plating the through-hole; laminating a first cover layer on the upper surface of the first circuit pattern; and laminating a second cover layer on the lower surface of the second circuit pattern.

[0023] At this time, before the step of laminating the first cover layer to the upper surface of the first circuit pattern, a step of forming an open area in the first cover layer may be further included.

[0024] At this time, a step of plating the open area formed in the first cover layer may be further included.

[0025] At this time, the first metal substrate and the second metal substrate may be films made of copper or aluminum.

[0026] In addition, the first metal substrate may be a film made of copper or aluminum, with nickel (Ni) plated on both sides, and the second metal substrate may be a film made of copper or aluminum.

[0027] According to another embodiment of the present invention, a signal transmission cable for BMS manufactured by the method for manufacturing a signal transmission cable for BMS described above is provided.

[0028]

[0029] According to an embodiment of the present invention, by manufacturing a relay cable for BMS for electrical signal transmission using a roll-to-roll process, it is possible to improve the productivity of manufacturing a signal transmission cable for BMS and reduce the defect rate.

[0030] In addition, by not using chemicals used in conventional etching processes in manufacturing signal transmission cables for BMS, the generation of wastewater can be minimized, thereby preventing environmental pollution.

[0031]

[0032] The effects of the present invention are not limited to the effects mentioned above, and other effects not mentioned will be clearly understood by those skilled in the art from the description of the claims.

[0033]

[0034] The above summary, as well as the detailed description of preferred embodiments of the present application described below, will be better understood when read in conjunction with the accompanying drawings. For the purpose of illustrating the present invention, preferred embodiments are depicted in the drawings. However, it should be understood that the present application is not limited to the precise arrangements and means illustrated.

[0035]

[0036] FIGS. 1 to 8 are reference drawings for explaining a method for manufacturing a signal transmission cable for BMS according to one embodiment of the present invention.

[0037] FIGS. 9 and 10 are cross-sectional views of a signal transmission cable for BMS manufactured by a method for manufacturing a signal transmission cable for BMS according to one embodiment of the present invention.

[0038] FIG. 11 is a reference diagram for explaining a method for manufacturing a signal transmission cable for BMS according to another embodiment of the present invention.

[0039] FIG. 12 and FIG. 13 are cross-sectional views of a signal transmission cable for BMS manufactured by a method for manufacturing a signal transmission cable for BMS according to another embodiment of the present invention.

[0040] FIG. 14 is a reference diagram for explaining a method for manufacturing a signal transmission cable for a BMS according to a modified example of another embodiment of the present invention.

[0041] FIG. 15 and FIG. 16 are cross-sectional views of a signal transmission cable for BMS manufactured by a method for manufacturing a signal transmission cable for BMS according to a modified example of another embodiment of the present invention.

[0042]

[0043] Hereinafter, embodiments of the present invention will be described in detail with reference to the attached drawings. However, the attached drawings are provided solely to more easily disclose the contents of the present invention, and those skilled in the art will readily understand that the scope of the present invention is not limited to the scope of the attached drawings.

[0044] In addition, in describing the embodiments of the present invention, it is to be noted in advance that although the same names and symbols are used for components having the same functions, they are not substantially completely identical to the components of the prior art.

[0045] In addition, the terminology used in this application is only used to describe specific embodiments and is not intended to limit the present invention. The singular expression includes the plural expression unless the context clearly indicates otherwise. In this application, it should be understood that the terms "comprise" or "have" are intended to specify the presence of a feature, number, step, operation, component, part, or combination thereof described in the specification, but do not preclude the possibility of the presence or addition of one or more other features, numbers, steps, operations, components, parts, or combinations thereof.

[0046]

[0047] A battery management system (BMS) is a system that checks the remaining capacity and condition of battery cells by identifying voltage, current, and temperature data of the battery cells that make up the battery pack, and manages the battery pack by controlling battery cell balancing and charge / discharge.

[0048] Such BMS can be used in electric vehicles, energy storage systems, etc., but in the case of the present invention, the BMS used in electric vehicles will be mainly described.

[0049] The present invention relates to a method for manufacturing a signal transmission cable used as a relay cable for transmitting an electrical signal in a BMS (Battery Management System) and a signal transmission cable for BMS according to the same. Hereinafter, the method for manufacturing a signal transmission cable for BMS according to the present invention and the signal transmission cable for BMS according to the same will be described in detail with reference to the attached drawings. In describing with reference to the attached drawings, identical or corresponding components are assigned the same drawing numbers and redundant descriptions thereof will be omitted.

[0050] FIGS. 1 to 8 are reference diagrams for explaining a method for manufacturing a signal transmission cable for BMS according to an embodiment of the present invention. Referring to FIGS. 1 to 8, the method for manufacturing a signal transmission cable for BMS according to the present embodiment may include a transfer step, a step of forming a circuit pattern (S100), a step of removing a scrap area (S200), a step of modifying the surface roughness of an upper surface of a circuit pattern (S210), a first cover layer lamination step (S300), a step of removing byproducts on a lower surface of a circuit pattern (S310), and a second cover layer lamination step (S400).

[0051] First, the step of forming a circuit pattern (S100) refers to a step of forming a circuit pattern by etching an incoming metal substrate with a laser. The metal substrate may be a metal film (thin film), and the metal substrate is introduced into a rotating punching mold and punched by the punching mold to form a preset circuit pattern on the metal substrate. At this time, the punching mold can form a circuit pattern on the metal substrate by pressing and punching the metal substrate introduced into the punching mold as the mold is protruded and rotated on the outer periphery of the roller.

[0052] At this time, the metal substrate can be cut into a certain shape while still adhered to the upper surface of the carrier film and then transferred to a laser-based etching process. The cutting process involves cutting the carrier film with the metal substrate adhered to a width suitable for subsequent processing equipment. The cut carrier film with the metal substrate adhered to it is then fed into the etching process.

[0053] The carrier film is a thin film that helps the circuit pattern formed by laser etching to maintain the pattern shape during the manufacturing process of the signal transmission cable for BMS, and can be formed of polyimide (PI) or PET material.

[0054] At this time, the metal substrate may be a film made of copper (Cu) or aluminum (Al), or a film made of copper (Cu) or aluminum (Al) with nickel (Ni) plated on both sides. However, the metal substrate is not limited to copper (Cu) or aluminum (Al) and may be formed of various materials having electrical conductivity.

[0055] If the metal substrate is a film in which nickel (Ni) is plated on both sides of a film made of copper (Cu) or aluminum (Al), a separate oxidation prevention process for the circuit pattern to protect the circuit pattern from oxidation by surface treatment of the circuit pattern is not required, which has the effect of improving productivity.

[0056] Next, the metal substrate is etched with a laser to form a circuit pattern, and then the scrap area is removed from the metal substrate.

[0057] The step of removing the scrap area (S200) means a step of removing the scrap area of ​​the metal substrate other than the circuit pattern formed by the punch.

[0058] When an incoming metal substrate passes through a die, a circuit pattern is formed on the metal substrate, and a scrap area is formed as an unnecessary portion outside of the circuit pattern. The step of removing the scrap area (S200) refers to the process of separating this scrap area from the circuit pattern.

[0059] The step (S200) of removing the scrap area of ​​the metal substrate can be performed by attaching an adhesive film to the upper surface of the etched metal substrate and then removing the adhesive film to which the scrap area is attached. At this time, it is also possible to remove the scrap area of ​​the metal substrate by attaching an adhesive film having the same area as the area of ​​the metal substrate to the upper surface of the metal substrate and then removing the adhesive film to which the scrap area is attached.

[0060] Specifically, when a metal substrate undergoes an etching process using a laser, the metal substrate is divided into a circuit pattern and a scrap area, and an adhesive film having an area equal to that of the metal substrate is attached to the upper surface of the metal substrate, and then the adhesive film is separated from the metal substrate, thereby removing the scrap area from the circuit pattern.

[0061] Next, the surface roughness of the upper surface of the circuit pattern is modified (S210).

[0062] After laser etching of a metal substrate, a process is performed in which a first cover layer is laminated to the upper surface of a circuit pattern. Through a surface roughness modification process of the upper surface of the circuit pattern, the surface of the etched circuit pattern is modified to remove defects and change the surface roughness, thereby strengthening the bonding strength (adhesion) between the first cover layer and the circuit pattern.

[0063] At this time, the device for modifying the roughness of the circuit pattern surface may be a plasma generating device.

[0064] Referring to Fig. 2, a plasma generating device is provided on the upper side of the circuit pattern to be transferred, and generates high-temperature plasma to modify the surface roughness of the upper surface of the circuit pattern.

[0065] At this time, the plasma generated by the plasma generation device can remove byproducts generated during the etching process of the metal substrate in addition to surface modification of the circuit pattern.

[0066] Specifically, in the process of forming a circuit pattern by etching a metal substrate using a laser, by-products such as carbon or hydrocarbons may be generated during the etching process, and these by-products are removed using plasma generated through a plasma generation device.

[0067] In addition, when laser etching a metal substrate, carbon marks may be generated on the side of the metal substrate due to the characteristics of the laser. The plasma generated by the plasma generation device can also have the function of removing the carbon generated on the side of the metal substrate.

[0068] Next, a first cover layer is laminated to the upper surface of the circuit pattern (S300).

[0069] The step of laminating the first cover layer (S300) refers to the step of attaching the first cover layer having the same area as the carrier film to the upper surface of the circuit pattern. At this time, the first cover layer may be a PI film having excellent heat resistance and warpage resistance, little dimensional change, and being suitable as an insulating film. An adhesive (or adhesive film) is applied to the lower surface of the PI film, and the PI film is adhered to the upper surface of the circuit pattern, thereby attaching the PI film, which is the first cover layer, to the upper surface of the circuit pattern.

[0070] Specifically, the first cover layer is wound in a roll type, and as the wound first cover layer is unwound to correspond to the inflow speed of the circuit pattern, the scrap area is removed so that the first cover layer is positioned on the upper surface of the inflowing circuit pattern, and the rotating roller presses the first cover layer and the circuit pattern so that the first cover layer is attached to the upper surface of the circuit pattern.

[0071] At this time, the carrier film can be removed while the first cover layer is bonded to the circuit pattern. Specifically, the carrier film can be removed by bonding the first cover layer to the upper surface of the circuit pattern and then scraping off the carrier film bonded to the lower surface of the circuit pattern using a scraper or the like, or by bonding an adhesive tape to the carrier film and then recovering the adhesive tape so that the carrier film is recovered together with the adhesive tape, thereby separating the carrier film from the circuit pattern.

[0072] Next, the surface roughness of the lower surface of the circuit pattern is modified (S310).

[0073] After laser etching of a metal substrate, a second cover layer is laminated to the bottom surface of the circuit pattern. Through a surface roughness modification process on the bottom surface of the circuit pattern, the surface of the etched circuit pattern is modified to remove defects and change the surface roughness, thereby strengthening the bonding strength (adhesion) between the second cover layer and the circuit pattern.

[0074] At this time, the device for modifying the roughness of the circuit pattern surface may be a plasma generating device.

[0075] Referring to Fig. 3, a plasma generating device is provided on the lower side of the circuit pattern to be transferred and generates high-temperature plasma to modify the surface roughness of the lower side of the circuit pattern.

[0076] At this time, the plasma generated by the plasma generation device can remove byproducts generated during the etching process of the metal substrate in addition to surface modification of the circuit pattern.

[0077] Specifically, in the process of forming a circuit pattern by etching a metal substrate using a laser, by-products such as carbon or hydrocarbons may be generated during the etching process, and these by-products are removed using plasma generated through a plasma generation device.

[0078] In addition, when laser etching a metal substrate, carbonization marks due to hydrocarbons may be generated on the side of the metal substrate due to the characteristics of the laser. Plasma generated through a plasma generation device can also have the function of removing carbonization generated on the side of the metal substrate.

[0079] Therefore, by modifying the surface of the upper and lower surfaces of the circuit pattern through the surface modification process of the circuit pattern described above, surface defects can be removed, the roughness of the surface can be changed, and the bonding strength between the cover layer and the circuit pattern can be improved. In addition, by removing byproducts generated during the laser etching process and attached to the upper and lower surfaces of the circuit pattern, the signal transmission efficiency of the circuit pattern can be improved.

[0080] Next, a second cover layer is laminated to the bottom of the circuit pattern (S400).

[0081] The step of laminating the second cover layer (S400) refers to the step of attaching a second cover layer having the same area as the carrier film to the lower surface of the circuit pattern. At this time, the second cover layer may be a PI film having excellent heat resistance and warpage resistance, little dimensional change, and being suitable as an insulating film. An adhesive (or adhesive film) is applied to the upper surface of the PI film, and the PI film is adhered to the lower surface of the circuit pattern, thereby attaching the PI film, which is the second cover layer, to the upper surface of the circuit pattern.

[0082] Specifically, the second cover layer is wound in a roll type, and as the wound second cover layer is unwound to correspond to the inflow speed of the circuit pattern, the second cover layer is positioned on the lower surface of the circuit pattern to which the first cover layer is attached, and a rotating roller presses the second cover layer and the circuit pattern, so that the second cover layer is attached to the upper surface of the circuit pattern.

[0083] Finally, the outer shape is cut to form the outer appearance of the signal transmission cable for the BMS. Specifically, the circuit pattern, which is formed by laminating the first and second cover layers, is passed through a rotating punching die to be punched, thereby cutting the circuit pattern formed by the cover layer into a predetermined shape, thereby forming the signal transmission cable for the BMS.

[0084] According to this embodiment, by manufacturing a signal transmission cable for BMS using a roll-to-roll process, not only can the productivity of manufacturing a signal transmission cable for BMS be improved, but also the defect rate can be reduced.

[0085] In addition, it is environmentally friendly as it minimizes wastewater generation and prevents environmental pollution by not using chemicals used in the etching process during the conventional FPCB manufacturing process.

[0086] Meanwhile, referring to FIG. 4, after the step (S100) of forming the circuit pattern by etching the metal substrate with a laser, a step (S150) of washing the metal substrate may be further included.

[0087] When laser etching a metal substrate, byproducts (such as carbon or hydrocarbons) may be generated during the etching process, or foreign substances may be introduced from outside during the processing. The metal substrate washing step (S150) removes these byproducts and foreign substances. At this time, the carrier film to which the metal substrate is adhered may be washed by immersing the carrier film to which the metal substrate is adhered in a weakly acidic solution, or by washing the metal substrate using ultrasonic waves.

[0088] Meanwhile, referring to FIG. 5, after the step (S100) of forming a circuit pattern by etching a metal substrate with a laser, a step (S170) of removing hydrocarbons using a laser may be further included.

[0089] When laser etching a metal substrate, carbon marks may appear on the surface of the metal substrate due to hydrocarbons as a byproduct. These hydrocarbons are removed using a laser.

[0090] If by-products generated during the circuit pattern formation step using a laser or foreign substances introduced from the outside are not removed during the process, the cover layer will be laminated while the by-products, etc., remain on the surface of the circuit pattern during the subsequent cover layer lamination step, and these by-products, etc. on the surface of the circuit pattern will reduce the signal transmission efficiency of the circuit pattern, thereby increasing the defect rate. Therefore, a process for removing by-products or foreign substances after the laser etching step is essential.

[0091] Meanwhile, referring to FIG. 6, a step (S250) of forming an open area in the first cover layer may be further included before the step (S300) of bonding the first cover layer to the upper surface of the circuit pattern. The open area of ​​the first cover layer is an area corresponding to a terminal of the circuit pattern, and an open area is formed in the first cover layer covering the upper surface of the circuit pattern to form a terminal portion for electrically connecting with the terminal of the circuit pattern. The open area formed in the first cover layer is plated with a conductive material to form a terminal portion, and the terminal portion is electrically connected to the terminal of the circuit pattern, and the electrical components outside the signal transmission cable for BMS and the circuit pattern of the signal transmission cable for BMS are electrically connected through the terminal portion.

[0092] However, in this embodiment, the step of forming an open area in the first cover layer (S250) and the step of plating the open area (S270) are described before the step of bonding the first cover layer (S300), but the plating of the open area may also be performed after the step of bonding the second cover layer (S400), which will be described later.

[0093] Meanwhile, referring to FIG. 7, the step of laminating the first cover layer (S300) may include the step of bonding the first cover layer to the circuit pattern (S330) and the step of pressing the first cover layer to laminate the first cover layer (S350), and the step of bonding the second cover layer (S400) may include the step of bonding the second cover layer to the circuit pattern (S430) and the step of pressing the second cover layer to laminate the second cover layer (S450).

[0094] Typically, in FPCB manufacturing, the process of laminating a cover layer over a circuit pattern is accomplished through a hot stamping process, which involves bonding the cover layer to the circuit pattern, cutting and processing the outer shape of the BMS signal transmission cable, and then applying high temperature and high pressure. However, this manufacturing process can compromise the continuity of BMS signal transmission cable production, as the lamination of the cover layer is performed in a separate process after the outer shape processing process.

[0095] In the present embodiment, the productivity of the signal transmission cable for BMS can be improved by performing the cover layer lamination process immediately after the cover layer welding process by using a roll-to-roll process by laminating the first cover layer and the second cover layer on the circuit pattern after laminating the first cover layer and the second cover layer on the circuit pattern by means of a press process using a rotating roller after the outer shape of the signal transmission cable for BMS is cut.

[0096] In the present embodiment, the first cover layer is laminated on the circuit pattern by pressing the first cover layer using a rotating roller after the first cover layer is bonded to the circuit pattern, and the second cover layer is laminated on the circuit pattern by pressing the second cover layer using a rotating roller after the second cover layer is bonded to the circuit pattern. Although the lamination process of the first cover layer and the second cover layer has been described separately, it is not limited thereto, and it is also possible to laminate the first cover layer and the second cover layer on the circuit pattern by simultaneously pressing the first cover layer and the second cover layer after bonding the first cover layer and the second cover layer to the circuit pattern.

[0097] Referring to Fig. 8, after the step of bonding the second cover layer (S400), a baking step of heating the bonded first cover layer and second cover layer may be further included. The baking step is a step of hardening the bonded first cover layer and second cover layer. The heating of the first cover layer and the second cover layer may be performed at an ambient temperature of 160°C for 1 hour by introducing the first cover layer and the second cover layer into a baking chamber while they are bonded.

[0098] At this time, the metal substrate may be a film made of copper (Cu) material or aluminum (Al) material.

[0099] However, the metal substrate is not limited to copper (Cu) or aluminum (Al) and can be formed of various materials having electrical conductivity.

[0100] In the following description, it is assumed that the metal substrate is formed of copper (Cu).

[0101] FIG. 9 and FIG. 10 are cross-sectional views of a BMS signal transmission cable manufactured by a method for manufacturing a BMS signal transmission cable according to an embodiment of the present invention, wherein FIG. 9 is a diagram schematically showing a cross-section of a BMS signal transmission cable manufactured by a method for manufacturing a BMS signal transmission cable according to an embodiment of the present invention when the metal substrate is a film made of copper (Cu), and FIG. 10 is a diagram schematically showing a cross-section of a BMS signal transmission cable manufactured by a method for manufacturing a BMS signal transmission cable according to an embodiment of the present invention when the metal substrate is a film made of copper (Cu) with nickel (Ni) plated on both sides.

[0102] Referring to Fig. 10, when the metal substrate is a film made of copper (Cu) material and nickel (Ni) is plated on both sides, nickel (Ni) has electrical conductivity and is applied to the surface of the copper (Cu) film, so there is an advantage of not needing to go through a process of forming a separate terminal portion corresponding to the terminal of the circuit pattern by plating an open area as shown in Fig. 4.

[0103] FIG. 11 is a reference diagram for explaining a method for manufacturing a signal transmission cable for BMS according to another embodiment of the present invention. Referring to FIG. 11, the method for manufacturing a signal transmission cable for BMS according to this embodiment may include a transfer step, a step of forming a first circuit pattern (S500), a step of removing a scrap area (S600), a step of modifying the surface roughness of the upper surface of the first circuit pattern (S610), a step of forming a second circuit pattern (S700), a step of removing a scrap area (S800), a step of modifying the surface roughness of the lower surface of the second circuit pattern (S810), a step of bonding the first circuit pattern and the second circuit pattern (S900), a first cover layer laminating step (S1000), a second cover layer laminating step (S1100), a through-hole forming step (S1200), and a through-hole plating step (S1300).

[0104] First, a first metal substrate is adhered to the upper surface of a first carrier film, cut into a certain shape, and then transported. The first metal substrate that is introduced is etched with a laser to form a first circuit pattern, and a scrap area of ​​the first metal substrate other than the first circuit pattern is removed. The second metal substrate that is introduced is etched with a laser to form a second circuit pattern, and a scrap area of ​​the second metal substrate other than the second circuit pattern is removed.

[0105] The step (S500) of forming a first circuit pattern by etching an incoming first metal substrate with a laser and the step (S700) of forming a second circuit pattern by etching an incoming second metal substrate with a laser are the same as the circuit pattern forming step (S100) of the previous embodiment except that a plurality of circuit patterns are formed using a plurality of metal substrates, and therefore, the detailed description will be replaced with the description of the previous embodiment.

[0106] At this time, the first metal substrate and the second metal substrate may be cut into a certain shape while being adhered to a carrier film and then transferred to a laser etching process. The carrier film is a thin film that helps the circuit pattern formed by laser etching maintain the pattern shape during the manufacturing process of the signal transmission cable for BMS, and may be formed of polyimide (PI) or PET material.

[0107] At this time, the first metal substrate and the second metal substrate may be films made of copper (Cu) material or aluminum (Al) material.

[0108] However, the first metal substrate and the second metal substrate are not limited to copper (Cu) material or aluminum (Al) material and may be formed of various materials having electrical conductivity.

[0109] In the following, it will be described assuming that the first metal substrate and the second metal substrate are formed of copper (Cu).

[0110] Additionally, the first metal substrate may be a copper material film plated with nickel (Ni) on both sides, and the second metal substrate may be a copper (Cu) material film.

[0111] In addition, the second metal substrate may be nickel (Ni) plated on both sides of a copper (Cu) film, similar to the first metal substrate. However, in the case of the first metal substrate, nickel (Ni) plating is required to protect the copper (Cu) film due to an open area formed in the first cover layer, which will be described later. However, in the case of the second metal substrate, nickel (Ni) plating is not necessarily required because no open area is formed in the second cover layer and the film is not exposed to the outside by the second cover layer attached to the lower surface of the second metal substrate. In addition, in terms of the increase in the production cost of a signal transmission cable for BMS due to nickel (Ni) plating, it is preferable not to nickel (Ni) plate the surface of the second metal substrate.

[0112] The step of removing a scrap area of ​​the first metal substrate other than the first circuit pattern (S600) and the step of removing a scrap area of ​​the second metal substrate other than the second circuit pattern (S800) are also the same as the step of removing a scrap area of ​​the previous embodiment (S200), so the detailed description will be replaced with the description of the previous embodiment.

[0113] Meanwhile, after the step of removing the scrap area of ​​the first metal substrate other than the first circuit pattern, the step of modifying the surface roughness of the upper surface of the first circuit pattern may be further included, and the step of modifying the surface roughness of the first circuit pattern may be performed using plasma generated by a plasma generating device provided on the upper side of the first circuit pattern. In addition, after the step of removing the scrap area of ​​the second metal substrate other than the second circuit pattern, the step of modifying the surface roughness of the lower surface of the second circuit pattern may be further included, and the step of modifying the surface roughness of the second circuit pattern may be performed using plasma generated by a plasma generating device provided on the lower side of the second circuit pattern.

[0114] After laser etching of the first metal substrate and the second metal substrate, a first cover layer is laminated on the upper surface of the first circuit pattern, and a second cover layer is laminated on the lower surface of the second circuit pattern. Through a surface modification process of the first circuit pattern and the second circuit pattern, the surfaces of the first circuit pattern and the second circuit pattern are modified to remove surface defects and change the surface roughness, thereby improving the bonding strength of the first cover layer and the first circuit pattern, and the second cover layer and the second circuit pattern when the first cover layer and the second cover layer are laminated.

[0115] At this time, the plasma generated by the plasma generation device can remove byproducts generated during the etching process of the metal substrate in addition to surface modification of the circuit pattern.

[0116] Specifically, in the process of forming a first circuit pattern and a second circuit pattern by irradiating a laser to etch a first metal substrate and a second metal substrate, by-products such as carbon or hydrocarbons may be generated during the etching process, and such by-products are removed using a plasma generating device. That is, by-products attached to the upper surface of the first circuit pattern being transferred are removed using a plasma generating device located above the first circuit pattern, and by-products attached to the lower surface of the second circuit pattern being transferred are removed using a plasma generating device located below the second circuit pattern.

[0117] In addition, when laser etching a metal substrate, carbon marks may be generated on the side of the metal substrate due to the characteristics of the laser. The plasma generated by the plasma generation device can also have the function of removing the carbon generated on the side of the metal substrate.

[0118] Next, the first circuit pattern and the second circuit pattern are bonded (S900). Specifically, the bonding of the first circuit pattern and the second circuit pattern is achieved by interposing a PI film with an adhesive (or adhesive film) applied to both sides between the first circuit pattern and the second circuit pattern, and pressing the first circuit pattern and the second circuit pattern through a rotating roller to bond the first circuit pattern and the second circuit pattern to each other.

[0119] Next, a first cover layer is laminated to the upper surface of the first circuit pattern (S1000), and a second cover layer is laminated to the lower surface of the second circuit pattern (S1100).

[0120] The first cover layer lamination step (S1000) and the second cover layer lamination step (S1100) are the same except that the first cover layer is attached to the upper surface of the first circuit pattern and the second cover layer is attached to the lower surface of the second circuit pattern. Therefore, the detailed description will be replaced with the description of the previous embodiment.

[0121] Meanwhile, a step of forming an open area in the first cover layer prior to the step (S1000) of laminating the first cover layer on the upper surface of the first circuit pattern may further include a step of forming an open area in the first cover layer. The open area of ​​the first cover layer corresponds to the terminal of the first circuit pattern, and the open area is formed in the first cover layer covering the upper surface of the circuit pattern to form a terminal portion for electrically connecting with the terminal of the first circuit pattern. The open area formed in the first cover layer is plated with a conductive material to form a terminal portion, and the terminal portion is electrically connected to the terminal of the first circuit pattern, and the electrical components outside the BMS signal transmission cable and the first circuit pattern of the BMS signal transmission cable are electrically connected through the terminal portion. At this time, the plating of the open area may not be performed as a separate process, but may be performed together with the through-hole plating described later.

[0122] Next, a through hole penetrating the first cover layer, the first circuit pattern, the second circuit pattern, and the second cover layer is formed (S1200), and the formed through hole is plated (S1300). The through hole is for electrically connecting the first circuit pattern and the second circuit pattern, and the through hole is formed on one side of the first circuit pattern and the second circuit pattern, and the through hole can be plated with copper (Cu).

[0123] At this time, the first metal substrate and the second metal substrate may be films made of copper (Cu) material or aluminum (Al) material.

[0124] In the following, it will be described assuming that the first metal substrate and the second metal substrate are formed of copper (Cu).

[0125] FIG. 12 and FIG. 13 are cross-sectional views of a BMS signal transmission cable manufactured by a method for manufacturing a BMS signal transmission cable according to another embodiment of the present invention, wherein FIG. 12 is a diagram schematically showing a cross-section of a BMS signal transmission cable manufactured by a method for manufacturing a BMS signal transmission cable according to another embodiment of the present invention when the first metal substrate and the second metal substrate are films made of copper (Cu), and FIG. 13 is a diagram schematically showing a cross-section of a BMS signal transmission cable manufactured by a method for manufacturing a BMS signal transmission cable according to another embodiment of the present invention when the first metal substrate is a film made of copper (Cu) with nickel (Ni) plated on both sides, and the second metal substrate is a film made of copper (Cu).

[0126] Meanwhile, FIG. 14 is a reference diagram for explaining a method for manufacturing a signal transmission cable for BMS according to a modified example of another embodiment of the present invention. Referring to FIG. 14, the method for manufacturing a signal transmission cable for BMS according to the present embodiment may include a transfer step, a step of forming a first circuit pattern (S500), a step of removing a scrap area (S600), a step of modifying the surface roughness of the upper surface of the first circuit pattern (S610), a step of forming a second circuit pattern (S700), a step of removing a scrap area (S800), a step of modifying the surface roughness of the lower surface of the second circuit pattern (S810), a step of bonding the first circuit pattern and the second circuit pattern (S900), a step of forming a through-hole (S1200), a step of plating a through-hole (S1300), a step of laminating a first cover layer (S1000), and a step of laminating a second cover layer (S1100).

[0127] The method for manufacturing a signal transmission cable for BMS according to the present embodiment is the same as the method for manufacturing a signal transmission cable for BMS according to the previous embodiment, except that the through-hole forming step (S1200) and the through-hole plating step (S1300) are performed before the first cover layer lamination step (S1000) and the second cover layer lamination step (S1100). Therefore, the description of the same will be replaced with the description of the previous embodiment.

[0128] A method for manufacturing a signal transmission cable for a BMS according to the present embodiment forms a through-hole after bonding a first circuit pattern and a second circuit pattern. Specifically, the bonding of the first circuit pattern and the second circuit pattern is performed by interposing a PI film having an adhesive (or adhesive film) applied to both surfaces between the first circuit pattern and the second circuit pattern, and pressing the first circuit pattern and the second circuit pattern through a rotating roller, thereby bonding the first circuit pattern and the second circuit pattern to each other.

[0129] Next, a through hole penetrating the first circuit pattern and the second circuit pattern is formed (S1200), and the formed through hole is plated (S1300). The through hole is for electrically connecting the first circuit pattern and the second circuit pattern, and the through hole is formed on one side of the first circuit pattern and the second circuit pattern, and the through hole can be plated with copper (Cu).

[0130] During through-hole plating, a metal layer made of copper (Cu) may be formed on the upper surface of the first circuit pattern and the lower surface of the second circuit pattern. The metal layer is a metal layer laminated on the upper surface of the first circuit pattern and the lower surface of the second circuit pattern during the through-hole plating process. As the metal layer is laminated, the total volume of the metal, which is a conductive material, increases, thereby lowering the resistance value of the circuit and increasing the electrical conductivity, thereby having the effect of improving signal transmission efficiency.

[0131] At this time, the first metal substrate and the second metal substrate may be films made of copper (Cu) material or aluminum (Al) material.

[0132] In the following, it will be described assuming that the first metal substrate and the second metal substrate are formed of copper (Cu).

[0133] FIG. 15 and FIG. 16 are cross-sectional views of a BMS signal transmission cable manufactured by a method for manufacturing a BMS signal transmission cable according to a modified example of another embodiment of the present invention, wherein FIG. 15 is a diagram schematically showing a cross-section of a BMS signal transmission cable manufactured by a method for manufacturing a BMS signal transmission cable according to a modified example of another embodiment of the present invention when the first metal substrate and the second metal substrate are films made of copper (Cu), and FIG. 16 is a diagram schematically showing a cross-section of a BMS signal transmission cable manufactured by a method for manufacturing a BMS signal transmission cable according to a modified example of another embodiment of the present invention when the first metal substrate is a film made of copper (Cu) with nickel (Ni) plated on both sides, and the second metal substrate is a film made of copper (Cu).

[0134] The present embodiment relates to a method for manufacturing a signal transmission cable for BMS in which circuit patterns are formed on the upper and lower portions of the signal transmission cable for BMS, and a signal transmission cable for BMS according to the method. According to the present embodiment, electric signals according to a plurality of circuit patterns can be transmitted using one signal transmission cable, thereby enabling high-density wiring and miniaturization of the signal transmission cable for BMS.

[0135] In addition, unlike the previous embodiment, in the case of this embodiment, a metal layer made of copper (Cu) is formed on the upper surface of the first circuit pattern and the lower surface of the second circuit pattern during through-hole plating, and the total volume of the metal, which is a conductive material, increases by laminating the metal layers, thereby lowering the resistance value of the circuit and increasing the electrical conductivity, thereby having the effect of improving signal transmission efficiency.

[0136]

[0137] In this way, according to the present invention, by manufacturing a relay cable for BMS for electrical signal transmission using a roll-to-roll process, not only can the productivity of manufacturing a signal transmission cable for BMS be improved, but there is also an effect of reducing the defect rate.

[0138] In addition, by not using chemicals used in conventional etching processes in manufacturing signal transmission cables for BMS, the generation of wastewater can be minimized, thereby preventing environmental pollution.

[0139]

[0140] As described above, preferred embodiments of the present invention have been described. It will be apparent to those skilled in the art that the present invention may be embodied in other specific forms, in addition to the embodiments described above, without departing from the spirit or scope thereof. Therefore, the above-described embodiments should be considered illustrative rather than restrictive, and accordingly, the present invention is not limited to the above description, but may be modified within the scope of the appended claims and their equivalents.

Claims

1. A method for manufacturing a signal transmission cable used as a relay cable for transmitting electrical signals in a BMS (Battery Management System), A step of adhering a metal substrate to the upper surface of a carrier film, cutting it into a certain shape, and transporting it; A step of forming a circuit pattern by etching the metal substrate being transferred with a laser; A step of removing a scrap area of ​​the metal substrate other than the circuit pattern; A step of modifying the surface roughness of the upper surface of the circuit pattern; A step of laminating a first cover layer on the upper surface of the circuit pattern; A step of removing the carrier film adhered to the lower surface of the circuit pattern; A step of modifying the surface roughness of the circuit pattern; and A method for manufacturing a signal transmission cable for BMS, characterized in that it includes a step of laminating a second cover layer on the lower surface of the circuit pattern.

2. In paragraph 1, Surface roughness modification of the upper surface of the above circuit pattern is It is made by plasma generated using a plasma generating device provided on the upper side of the above circuit pattern, Surface roughness modification of the above circuit pattern is as follows: A method for manufacturing a signal transmission cable for BMS, characterized in that it is produced by plasma generated using a plasma generating device provided on the lower side of the above circuit pattern.

3. In paragraph 1, A step of forming the circuit pattern by etching the metal substrate with a laser; thereafter, A method for manufacturing a signal transmission cable for BMS, characterized in that it further comprises a step of washing the metal substrate.

4. In paragraph 1, A step of forming the circuit pattern by etching the metal substrate with a laser; thereafter, A method for manufacturing a signal transmission cable for BMS, characterized in that it further includes a step of removing hydrocarbons generated on the surface of the metal substrate using a laser during a laser etching process.

5. In paragraph 1, The step of removing the scrap area of ​​the above metal substrate is: A method for manufacturing a signal transmission cable for BMS, characterized in that it is performed by attaching an adhesive film to the upper surface of the metal substrate that has been punched out and then removing the adhesive film to which the scrap area is attached.

6. In paragraph 1, Before the step of laminating the first cover layer on the upper surface of the circuit pattern, A method for manufacturing a signal transmission cable for BMS, characterized in that it further comprises a step of forming an open area in the first cover layer.

7. In paragraph 6, A method for manufacturing a signal transmission cable for BMS, characterized in that it further comprises a step of plating the open area formed in the first cover layer.

8. In paragraph 1, The step of combining the first cover layer and the step of combining the second cover layer are as follows: A step of bonding the first cover layer and the second cover layer to the circuit pattern; and A method for manufacturing a signal transmission cable for BMS, characterized in that it comprises a step of pressing the first cover layer and the second cover layer to laminate the first cover layer and the second cover layer.

9. In paragraph 1, A method for manufacturing a signal transmission cable for BMS, characterized in that the metal substrate is a film made of copper or aluminum.

10. In paragraph 1, A method for manufacturing a signal transmission cable for BMS, characterized in that the metal substrate is nickel-plated on both sides of a film made of copper or aluminum.

11. A method for manufacturing a signal transmission cable used as a relay cable for transmitting electrical signals in a BMS (Battery Management System), A step of adhering a first metal substrate to the upper surface of a first carrier film, cutting it into a certain shape, and transporting it; A step of forming a first circuit pattern by etching a first metal substrate to be transferred using a laser; A step of removing a scrap area of ​​the first metal substrate other than the first circuit pattern; A step of modifying the surface roughness of the upper surface of the first circuit pattern; A step of adhering a second metal substrate to the lower surface of a second carrier film, cutting it into a certain shape, and transporting it; A step of forming a second circuit pattern by etching the second metal substrate being transferred with a laser; A step of removing a scrap area of ​​the second metal substrate other than the second circuit pattern; A step of modifying the surface roughness of the second circuit pattern; A step of bonding the first circuit pattern and the second circuit pattern; A step of laminating a first cover layer on the upper surface of the first circuit pattern; A step of laminating a second cover layer on the lower surface of the second circuit pattern; A step of forming a through hole penetrating the first cover layer, the first circuit pattern, the second circuit pattern, and the second cover layer; and A method for manufacturing a signal transmission cable for BMS, characterized in that it comprises a step of plating the above through hole.

12. A method for manufacturing a signal transmission cable used as a relay cable for transmitting electrical signals in a BMS (Battery Management System), A step of adhering a first metal substrate to the upper surface of a first carrier film, cutting it into a certain shape, and transporting it; A step of forming a first circuit pattern by etching a first metal substrate to be transferred using a laser; A step of removing a scrap area of ​​the first metal substrate other than the first circuit pattern; A step of modifying the surface roughness of the upper surface of the first circuit pattern; A step of adhering a second metal substrate to the lower surface of a second carrier film, cutting it into a certain shape, and transporting it; A step of forming a second circuit pattern by etching the second metal substrate being transferred with a laser; A step of removing a scrap area of ​​the second metal substrate other than the second circuit pattern; A step of modifying the surface roughness of the second circuit pattern; A step of bonding the first circuit pattern and the second circuit pattern; A step of forming a through hole penetrating the first circuit pattern and the second circuit pattern; A step of plating the above through-hole; A step of laminating a first cover layer on the upper surface of the first circuit pattern; and A method for manufacturing a signal transmission cable for BMS, characterized in that it includes a step of laminating a second cover layer on the lower surface of the second circuit pattern.

13. In paragraph 11 or 12, Before the step of laminating the first cover layer on the upper surface of the first circuit pattern, A method for manufacturing a signal transmission cable for BMS, characterized in that it further comprises a step of forming an open area in the first cover layer.

14. In paragraph 13, A method for manufacturing a signal transmission cable for BMS, characterized in that it further comprises a step of plating the open area formed in the first cover layer.

15. In paragraph 11 or 12, A method for manufacturing a signal transmission cable for BMS, characterized in that the first metal substrate and the second metal substrate are films made of copper or aluminum.

16. In paragraph 9 or 10, The above first metal substrate is nickel-plated on both sides of a film made of copper or aluminum, A method for manufacturing a signal transmission cable for BMS, characterized in that the second metal substrate is a film made of copper or aluminum.

17. A signal transmission cable for BMS manufactured according to Article 1.

18. A signal transmission cable for BMS manufactured according to Article 11.

19. A signal transmission cable for BMS manufactured according to Article 12.

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