Heat dissipation system and electronic device

Abstract

A heat dissipation system and an electronic device. The heat dissipation system comprises first liquid cooling plates, second liquid cooling plates, a liquid distributor, a liquid collector, liquid supply lines, liquid return lines. The first liquid cooling plates and the second liquid cooling plates are arranged spaced from each other and used for being in contact with different heating devices; the liquid distributor and the liquid collector are both located between the first liquid cooling plates and the second liquid cooling plates; the liquid supply lines are connected between the liquid distributor and the first liquid cooling plates and between the liquid distributor and the second liquid cooling plates, and are used for delivering a cooling medium in the liquid distributor to the first liquid cooling plates and the second liquid cooling plates; and the liquid return lines are connected between the liquid collector and the first liquid cooling plates and between the liquid collector and the second liquid cooling plates, and are used for recovering the cooling medium in the first liquid cooling plates and the second liquid cooling plates to the liquid collector. The present solution of the present application can enable multiple processing chips of a server to have good heat dissipation performance.

Description

Cooling systems and electronic equipment

[0001] This application claims priority to Chinese patent application No. 202410351279.1, filed on March 26, 2024, entitled “Heat dissipation system and electronic equipment,” the entire contents of which are incorporated herein by reference. Technical Field

[0002] The present application relates to the field of heat dissipation technology, and in particular to a heat dissipation system and electronic equipment. Background Art

[0003] With the rise of big data, cloud computing, and AI (artificial intelligence), the demand for electronic devices such as servers and supercomputers is increasing. To improve their competitiveness, electronic devices need to be equipped with more processing chips to meet the high computing power requirements. However, this increased computing power requirement often leads to increased power consumption. Currently, the increased number of processing chips in electronic devices can lead to heat dissipation difficulties within the device, causing localized overheating and gradually making heat dissipation a bottleneck.

[0004] Summary of the Invention

[0005] The embodiments of the present application provide a heat dissipation system and an electronic device, which can enable multiple processing chips to have good heat dissipation performance on the basis of carrying more processing chips.

[0006] In a first aspect, the present application provides a heat dissipation system, comprising:

[0007] a first liquid cooling plate and a second liquid cooling plate, wherein the first liquid cooling plate and the second liquid cooling plate are spaced apart and are used to contact different heat generating devices;

[0008] A liquid separator and a liquid collector, wherein the liquid separator and the liquid collector are both located in a gap area between the first liquid cooling plate and the second liquid cooling plate;

[0009] a liquid supply pipeline connected between the liquid separator and the first liquid cooling plate, and between the liquid separator and the second liquid cooling plate, for delivering the cooling medium in the liquid separator to the first liquid cooling plate and the second liquid cooling plate; and

[0010] A liquid return pipeline is connected between the liquid collector and the first liquid cooling plate, and between the liquid collector and the second liquid cooling plate, and is used to recover the cooling medium in the first liquid cooling plate and the second liquid cooling plate to the liquid collector.

[0011] It can be understood that the gap area between the first liquid cooling plate and the second liquid cooling plate is the idle space in the heat dissipation system. Using this part of the idle space as a storage space for accommodating the liquid distributor and the liquid collector can optimize the spatial layout of the heat dissipation system, so that the various components of the heat dissipation system can be arranged more compactly, which is conducive to improving the space utilization within the heat dissipation system.

[0012] In addition, compared to related art, where the liquid distributor and liquid collector are centrally located on the same side of multiple cold plates, the liquid flow lines from some of the multiple cold plates to the liquid distributor and liquid collector are longer, resulting in greater pressure loss and lower cold plate heat dissipation efficiency. In the embodiments of the present application, since the gap between the first and second liquid cold plates forms the central area of ​​the heat dissipation system, the liquid distributor and liquid collector are located within this space, allowing the liquid distributor and liquid collector to be centrally located in the middle area between the first and second liquid cold plates.

[0013] On the one hand, since the liquid separator and the liquid collector are centrally arranged in the middle area of ​​the first and second liquid cooling plates, the length of the liquid flow pipeline from the liquid separator to the first and second liquid cooling plates, as well as the length of the liquid flow pipeline from the liquid collector to the first and second liquid cooling plates, can be effectively shortened, reducing the pressure loss of the cooling medium and helping to improve the overall heat dissipation efficiency of the heat dissipation system. On the other hand, since the liquid separator and the liquid collector are centrally arranged in the middle area of ​​the first and second liquid cooling plates, the distance difference between the liquid supply distance between the liquid separator and the first liquid cooling plate and between the liquid separator and the second liquid cooling plate can be effectively reduced, resulting in a smaller pressure drop and better heat dissipation consistency between the liquid separator and the first and second liquid cooling plates. It can also effectively reduce the distance difference between the return liquid distance between the liquid collector and the first liquid cooling plate and between the liquid collector and the second liquid cooling plate, resulting in a smaller pressure drop and better heat dissipation consistency between the liquid collector and the first and second liquid cooling plates.

[0014] In other words, concentrating the liquid distributor and the liquid collector in the gap area between the first liquid cooling plate and the second liquid cooling plate can optimize the liquid flow pipelines from the liquid distributor and the liquid collector to the liquid cooling plates on both sides, shorten the flow length of the cooling medium, and reduce the pressure drop in the pipeline, thereby effectively improving the overall heat dissipation performance of the heat dissipation system.

[0015] In one possible embodiment, the liquid separator includes a liquid separator body, a first liquid separator joint, and a second liquid separator joint, wherein the first liquid separator joint and the second liquid separator joint are connected to the liquid separator body at intervals, the first liquid separator joint is connected to the first liquid cooling plate via the liquid supply pipeline, and the second liquid separator joint is connected to the second liquid cooling plate via the liquid supply pipeline;

[0016] The liquid collector includes a liquid collecting body, a first liquid collecting joint, and a second liquid collecting joint. The first liquid collecting joint and the second liquid collecting joint are connected to the liquid collecting body at intervals. The first liquid collecting joint is connected to the first liquid cooling plate via the liquid return pipeline, and the second liquid collecting joint is connected to the second liquid cooling plate via the liquid return pipeline.

[0017] The port of the first liquid separation joint and the port of the first liquid collection joint are both oriented toward the first liquid cooling plate, and the port of the second liquid separation joint and the port of the second liquid collection joint are both oriented toward the second liquid cooling plate.

[0018] It can be understood that since the first liquid cooling plate is located on one side of the liquid separation body, and the ports of the first liquid separation joint and the second liquid separation joint are facing the first liquid cooling plate, the length of the pipeline required to connect the first liquid separation joint with the first liquid inlet joint of the first liquid cooling plate and the second liquid separation joint with the second liquid inlet joint of the second liquid cooling plate can be shortened, and the pressure drop along the flow of the cooling medium is reduced, so that the first liquid separation joint can be docked and connected with the first liquid inlet joint of the first liquid cooling plate located on one side of the liquid separation body, and the second liquid separation joint can be docked and connected with the second liquid inlet joint of the second liquid cooling plate located on one side of the liquid separation body.

[0019] In a possible embodiment, at least one of the first liquid separation joint and the second liquid separation joint can rotate relative to the liquid separation body, and / or at least one of the first liquid collection joint and the second liquid collection joint can rotate relative to the liquid collection body.

[0020] It can be understood that since the second liquid cooling plate is located on the other side of the liquid collecting body, and the ports of the second liquid separation joint and the second liquid collecting joint are directed toward the second liquid cooling plate, the length of the pipeline required to connect the first liquid collecting joint with the first liquid outlet joint of the first liquid cooling plate, and the second liquid collecting joint with the second liquid outlet joint of the second liquid cooling plate can be shortened, and the pressure drop along the flow of the cooling medium can be reduced, so that the first liquid collecting joint can be docked and connected with the first liquid outlet joint of the first liquid cooling plate located on one side of the liquid collecting body, and the second liquid collecting joint can be docked and connected with the second liquid outlet joint of the second liquid cooling plate located on one side of the liquid collecting body.

[0021] Based on the above description, it should be understood that the port of the second liquid-distributing joint faces in the opposite direction to the port of the first liquid-distributing joint. That is, when the port of the first liquid-distributing joint faces one side of the liquid-distributing body, the port of the second liquid-distributing joint faces the other side of the liquid-distributing body. Under this arrangement, the first liquid-distributing joint and the second liquid-distributing joint can be connected to the first liquid-cooling plate and the second liquid-cooling plate respectively, effectively shortening the length of the pipeline between the liquid distributor and the first liquid-cooling plate and the second liquid-cooling plate, reducing the pressure loss during the flow of the cooling medium, and improving the heat dissipation efficiency of the heat dissipation system.

[0022] The ports of the second manifold are oriented oppositely to those of the first. That is, when the ports of the first manifold face one side of the manifold body, the ports of the second manifold face the other side. This arrangement allows the first and second manifolds to connect directly to the first and second liquid cooling plates, respectively. This effectively shortens the length of the piping between the manifold and the first and second liquid cooling plates, reduces pressure loss during coolant flow, and improves the cooling efficiency of the cooling system.

[0023] In addition, one or more of the first liquid-distributing joint of the liquid distributor, the second liquid-distributing joint of the liquid distributor, the first liquid-collecting joint of the liquid collector and the second liquid-collecting joint of the liquid collector can be rotated, and whether the first liquid-distributing joint of the liquid distributor, the second liquid-distributing joint of the liquid distributor, the first liquid-collecting joint of the liquid collector and the second liquid-collecting joint of the liquid collector can be rotated and the specific joint types that perform the rotation can be arranged and combined, which are not listed here.

[0024] In one possible embodiment, the first liquid cooling plate includes a first body, a first liquid inlet connector, and a first liquid outlet connector. The first liquid inlet connector and the first liquid outlet connector are connected to the first body at intervals. The first liquid inlet connector is connected to the liquid distributor via the liquid supply line, and the first liquid outlet connector is connected to the liquid collector via the liquid return line.

[0025] The second liquid cooling plate includes a second body, a second liquid inlet joint, and a second liquid outlet joint, wherein the second liquid inlet joint and the second liquid outlet joint are connected to the second body at intervals, the second liquid inlet joint is connected to the liquid distributor via the liquid supply line, and the second liquid outlet joint is connected to the liquid collector via the liquid return line;

[0026] At least one of the first liquid inlet connector and the first liquid outlet connector is rotatable relative to the first body, and / or at least one of the second liquid inlet connector and the second liquid outlet connector is rotatable relative to the second body.

[0027] In a possible implementation manner, in a direction from the first liquid cooling plate to the second liquid cooling plate, the liquid separation body and the liquid collection body are arranged side by side.

[0028] In a possible implementation manner, the liquid separation body and the liquid collection body are spaced apart in a direction perpendicular to the first liquid cooling plate and the second liquid cooling plate.

[0029] It can be understood that by stacking the liquid separator and the liquid collector in the vertical direction, on the one hand, the vertical space of the heat dissipation system can be fully utilized, and the horizontal surface area of ​​the main board occupied by the liquid separator and the liquid collector can be greatly reduced, and this part of the surface area can be used to layout more devices to improve the device arrangement density of the main board. On the other hand, since the liquid separator and the liquid collector are stacked in the middle area of ​​the first liquid cooling plate and the second liquid cooling plate, the liquid separator and the liquid collector do not have overlapping parts in the horizontal direction parallel to the first liquid cooling plate and the second liquid cooling plate, so that the liquid separator and the liquid collector can be arranged in the middle area between the liquid separator and the liquid collector, which is conducive to further reducing the distance difference between the liquid separator and the first liquid cooling plate and the distance between the liquid separator and the second liquid cooling plate, so that there is a smaller pressure drop and better heat dissipation consistency between the liquid separator and the first liquid cooling plate and the second liquid cooling plate. The difference in liquid return distance between the liquid collector and the first liquid cooling plate and between the liquid collector and the second liquid cooling plate can be further reduced, so that there is a smaller pressure drop and better heat dissipation consistency between the liquid collector and the first liquid cooling plate and the second liquid cooling plate.

[0030] In one possible embodiment, the liquid separator includes a liquid separator body, a first liquid separator joint, and a second liquid separator joint, wherein the first liquid separator joint and the second liquid separator joint are connected to the liquid separator body at intervals, the first liquid separator joint is connected to the first liquid cooling plate via the liquid supply pipeline, and the second liquid separator joint is connected to the second liquid cooling plate via the liquid supply pipeline;

[0031] The liquid collector includes a liquid collecting body, a first liquid collecting joint, and a second liquid collecting joint. The first liquid collecting joint and the second liquid collecting joint are connected to the liquid collecting body at intervals. The first liquid collecting joint is connected to the first liquid cooling plate via the liquid return pipeline, and the second liquid collecting joint is connected to the second liquid cooling plate via the liquid return pipeline.

[0032] The liquid separation body and the liquid collection body are spaced apart in a direction perpendicular to the first liquid cooling plate and the second liquid cooling plate, and the first liquid separation joint, the second liquid separation joint, the first liquid collection joint and the second liquid collection joint are all located in the gap area between the liquid separation body and the liquid collection body.

[0033] It is understandable that since there is a height difference between the liquid separation body of the liquid separator and the liquid collection body of the liquid collector, this height difference can be used to install the various connectors of the liquid separator and the various connectors of the liquid collector, effectively improving the space utilization in the heat dissipation system.

[0034] In one possible embodiment, the projection of at least part of the liquid collecting body along the height direction of the heat dissipation system falls within the range of the liquid separation body, and the first liquid separation joint, the second liquid separation joint, the first liquid collecting joint and the second liquid collecting joint are arranged in sequence along the width direction of the heat dissipation system.

[0035] Under this arrangement, the collector and the distributor can be arranged vertically in an overlapping vertical arrangement, which helps further reduce the horizontal space occupied by the heat dissipation system. The first liquid separation joint of the distributor, the second liquid separation joint of the distributor, the first liquid collection joint of the collector, and the second liquid collection joint of the collector are arranged sequentially along the width of the heat dissipation system, so that the joints of the distributor and the joints of the collector can be staggered in the gap between the liquid separation body of the distributor and the liquid collection body of the collector, which helps to improve the rationality of the layout of each joint.

[0036] In a possible embodiment, the port orientation of the first liquid-distributing joint and the port orientation of the first liquid-collecting joint are arranged to be inclined.

[0037] It is understandable that since the liquid separation body of the liquid separator and the liquid collection body of the liquid collector are arranged side by side in the gap area between the first liquid cooling plate and the second liquid cooling plate, and the first liquid separation joint of the liquid separator and the first liquid collection joint of the liquid collector are also arranged side by side, the first liquid separation joint of the liquid separator and the first liquid collection joint of the liquid collector will have a certain overlapping part in the direction from the first liquid cooling plate to the second liquid cooling plate. This arrangement can easily lead to the first liquid separation joint of the liquid separator and the first liquid collection joint of the liquid collector causing entanglement, knotting and other inconvenient operation problems when connected to the pipeline. By making the port directions of the two joints in the first liquid separation joint of the liquid separator and the first liquid collection joint of the liquid collector inconsistent, the pipeline connected to the first liquid separation joint of the liquid separator and the pipeline connected to the first liquid collection joint of the liquid collector are not easy to interfere with each other, and can be connected to each other independently, with better reliability.

[0038] The port direction of the second liquid-distributing joint is inclined with the port direction of the second liquid-collecting joint.

[0039] It can be understood that since the liquid separation body of the liquid separator and the liquid collection body of the liquid collector are arranged side by side in the gap area between the first liquid cooling plate and the second liquid cooling plate, and the second liquid separation joint of the liquid separator and the second liquid collection joint of the liquid collector are also arranged side by side, the second liquid separation joint of the liquid separator and the second liquid collection joint of the liquid collector will have a certain overlapping part in the direction from the first liquid cooling plate to the second liquid cooling plate. This arrangement can easily lead to the second liquid separation joint of the liquid separator and the second liquid collection joint of the liquid collector causing entanglement, knotting and other inconvenient operation problems when connected to the pipeline. By making the port directions of the two joints in the second liquid separation joint of the liquid separator and the second liquid collection joint of the liquid collector inconsistent, the pipeline connected to the second liquid separation joint of the liquid separator and the pipeline connected to the second liquid collection joint of the liquid collector are not easy to interfere with each other, and can be connected to each other independently, with better reliability.

[0040] In a possible implementation manner, an extension direction of the first liquid supply branch pipe connected between the first liquid inlet joint and the first liquid separation joint intersects with an extension direction of the first liquid return branch pipe connected between the first liquid outlet joint and the first liquid collection joint.

[0041] It is understandable that since the first liquid supply branch is connected to the first liquid cooling plate and is used to realize liquid inflow to the first liquid cooling plate, and the first liquid return branch is connected to the first liquid cooling plate and is used to realize liquid outflow from the first liquid cooling plate, and the extension directions of the first liquid supply branch and the second liquid supply branch intersect, it is possible to maximize the connection objectives of the first liquid supply branch and the first liquid return branch by changing the extension paths of the first liquid supply branch and the first liquid return branch without changing the positions of the respective joints. This is beneficial for reducing the length of the pipelines connected to the same first liquid cooling plate and realizing liquid inflow and outflow from the first liquid cooling plate, thereby improving the heat dissipation efficiency of the heat dissipation system.

[0042] An extending direction of the second liquid supply branch pipe connected between the second liquid inlet joint and the second liquid separation joint intersects with an extending direction of the second liquid return branch pipe connected between the second liquid outlet joint and the second liquid collection joint.

[0043] It is understandable that since the second liquid supply branch is connected to the second liquid cooling plate and is used to achieve liquid inflow to the second liquid cooling plate, and the second liquid return branch is connected to the second liquid cooling plate and is used to achieve liquid outflow from the second liquid cooling plate, and the extension directions of the second liquid supply branch and the second liquid return branch intersect, it is possible to maximize the connection between the second liquid supply branch and the second liquid return branch by changing the extension paths of the second liquid supply branch and the second liquid return branch without changing the positions of the respective joints. This helps to reduce the length of the pipelines connected to the same second liquid cooling plate and achieving liquid inflow and outflow from the second liquid cooling plate, thereby improving the heat dissipation efficiency of the heat dissipation system.

[0044] In one possible embodiment, the number of the first liquid cooling plates may be at least two, and the at least two first liquid cooling plates are sequentially arranged along the width direction of the heat dissipation system. The number of the first liquid distribution joints is the same as the number of the first liquid inlet joints of the first liquid cooling plates, and they are connected one-to-one. The number of the first liquid collection joints is the same as the number of the first liquid outlet joints of the first liquid cooling plates, and they are connected one-to-one.

[0045] The number of the second liquid cooling plates may be at least two, and the at least two second liquid cooling plates are sequentially arranged along the width direction of the heat dissipation system. Each second liquid cooling plate is spaced apart from one first liquid cooling plate in the length direction of the heat dissipation system. The number of the second liquid distribution joints is the same as the number of the second liquid inlet joints of the second liquid cooling plate and is connected one-to-one. The number of the second liquid collection joints is the same as the number of the second liquid outlet joints of the second liquid cooling plate and is connected one-to-one.

[0046] In a second aspect, the present application also provides an electronic device, which includes a chassis, multiple heating devices and a heat dissipation system as described above, wherein the multiple heating devices are located in the chassis, the heat dissipation system is located in the chassis, and the first liquid cooling plate and the second liquid cooling plate of the heat dissipation system are respectively in contact with different heating devices among the multiple heating devices. BRIEF DESCRIPTION OF THE DRAWINGS

[0047] FIG1 is a schematic structural diagram of an electronic device provided in an embodiment of the present application from one angle;

[0048] FIG2 is a schematic diagram showing the positions of the heating device, the heat dissipation system and the chassis of the electronic device shown in FIG1 ;

[0049] FIG3 is a schematic structural diagram of a heat dissipation system provided in a first embodiment of the present application;

[0050] FIG4 is a schematic diagram of a partial structure of the heat dissipation system shown in FIG3 at an angle;

[0051] FIG5 is a schematic structural diagram of a heat dissipation system provided in a second embodiment of the present application;

[0052] FIG6 is a schematic structural diagram of a first liquid cooling plate and a second liquid cooling plate of the heat dissipation system shown in FIG5 at an angle;

[0053] FIG7 is a schematic structural diagram of the first and second liquid cooling plates of the heat dissipation system shown in FIG5 from another angle;

[0054] FIG8 is a schematic structural diagram of a liquid separator and a liquid collector of the heat dissipation system shown in FIG5 at an angle;

[0055] FIG9 is a schematic structural diagram of a liquid separator of the heat dissipation system shown in FIG5 ;

[0056] FIG10 is a schematic structural diagram of a liquid collector of the heat dissipation system shown in FIG5 ;

[0057] FIG11 is a schematic structural diagram of the heat dissipation system shown in FIG5 at an angle;

[0058] FIG. 12 is a schematic structural diagram of a portion of the heat dissipation system shown in FIG. 5 , viewed from an angle. DETAILED DESCRIPTION

[0059] For ease of understanding, the terms involved in the embodiments of the present application are first explained.

[0060] And / or: It is just a description of the association relationship of associated objects, indicating that three relationships can exist. For example, A and / or B can mean: A exists alone, A and B exist at the same time, and B exists alone.

[0061] Multiple: refers to two or more than two.

[0062] Connection: should be understood in a broad sense. For example, A and B are connected, which can be either directly connected or indirectly connected through an intermediary.

[0063] The specific implementation of the present application will be clearly described below with reference to the accompanying drawings.

[0064] Embodiments of the present application provide a heat dissipation system and an electronic device, wherein the electronic device may be, but is not limited to, a server, a router, a switch, a supercomputer, an AI (Artificial Intelligence) device, and the like.

[0065] For ease of understanding, the following description will be given using an electronic device as a server as an example, but it should be understood that the present invention is not limited to this.

[0066] Please refer to Figures 1 and 2 in combination. Figure 1 is a schematic structural diagram of an electronic device 200 provided in an embodiment of the present application from one angle, and Figure 2 is a schematic diagram of the positions of the heating device 220, the heat dissipation system 100, and the chassis 210 of the electronic device 200 shown in Figure 1. In Figure 1, the arrow on the left indicates the liquid inlet direction of the electronic device 200, and the arrow on the right indicates the liquid outlet direction of the electronic device 200. In Figure 2, a simple block diagram is used to exemplify the positional relationship between the heating device 220, the heat dissipation system 100, and the chassis 210 in the electronic device 200, but it does not constitute a specific limitation.

[0067] For convenience of illustration, the length direction of the electronic device 200 is referred to as the X direction, the width direction of the electronic device 200 is referred to as the Y direction, and the height direction of the electronic device 200 is referred to as the Z direction. The X direction, the Y direction, and the Z direction are perpendicular to each other.

[0068] The electronic device 200 may include a chassis 210, a plurality of heating devices 220 and a heat dissipation system 100. The chassis 210 may provide a certain amount of accommodation space for the plurality of heating devices 220, the heat dissipation system 100 and other modules in the device. Among them, the other modules in the device may be a combination of one or more of a fan module, a hard disk module, a power supply module, and a network card. The plurality of heating devices 220 may be a combination of one or more of a CPU (Central Processing Unit), a GPU (Graphics Processing Unit), a TPU (Tensor Processing Unit), a DPU (Deep Learning Processing Unit), an NPU (Neural Network Processing Unit), a BPU (Brain Processing Unit), an FPGA (Field-Programmable Gate Array), and an ASIC (Application Specific Integrated Circuit). Multiple heating devices 220 are located within the chassis 210. These devices are the primary heat source within the electronic device 200, and their heat must be dissipated promptly and effectively to maintain proper cooling of the electronic device 200. The heat dissipation system 100 is located within the chassis 210 and utilizes liquid cooling. The heat dissipation system 100 can be located above the multiple heating devices 220 and, through contact with the multiple heating devices 220, removes the heat generated by the multiple heating devices 220, thereby ensuring good heat distribution within the electronic device 200 and ensuring normal operation of the electronic device 200.

[0069] It should be noted that the structures illustrated in the embodiments of the present application do not constitute a specific limitation on the electronic device 200. In other embodiments of the present application, the electronic device 200 may include more or fewer components than shown, or may combine or separate certain components, or arrange the components differently. The illustrated components may be implemented in hardware, software, or a combination of software and hardware.

[0070] In an embodiment of the present application, the chassis 210 may have a liquid inlet A1, a liquid outlet A2 and a receiving space W. The liquid inlet A1 of the chassis 210 connects the receiving space W of the chassis 210 and the external environment of the electronic device 200, and the liquid inlet A1 of the chassis 210 is an inlet for the low-temperature cooling medium outside the electronic device 200 to flow into the device. The liquid outlet A2 of the chassis 210 connects the receiving space W of the chassis 210 and the external environment of the electronic device 200, and the liquid outlet A2 of the chassis 210 is an outlet for the high-temperature cooling medium carrying the heat of the electronic device 200 to flow out of the device. The liquid inlet A1 of the chassis 210 and the liquid outlet A2 of the chassis 210 can be arranged at intervals on the chassis 210, and both are connected to the heat dissipation system 100, so as to continuously take away the heat of the heating device 220 through a liquid cooling cycle, thereby achieving good temperature uniformity performance of the electronic device 200. For example, the cooling medium may be a single-phase liquid cooling medium such as fluorinated liquid, mineral oil, synthetic oil, natural oil, etc. Alternatively, the cooling medium may be a two-phase liquid cooling medium such as silicates, aromatic compounds, silicone, etc.

[0071] 2 , the chassis 210 may further include a motherboard 230, which is located within the receiving space W of the chassis 210. The motherboard 230 may serve as a circuit board for electrically connecting the multiple heating components 220 and the various modules described above within the electronic device 200. Through the physical and electrical connections between the multiple heating components 220 and the various modules and the motherboard 230, the electronic device 200 may achieve multifunctional collaboration.

[0072] The multiple heating components 220 are all located within the receiving space W of the chassis 210 and connected to the motherboard 230. The multiple heating components 220 are spaced apart on the motherboard 230. It is understood that the electronic device 200 typically uses multiple heating components 220 to operate, and the heating components 220 generate a lot of heat when in operation. To ensure that the electronic device 200 can operate normally, the heat dissipation system 100 is required to perform a heat dissipation cycle through liquid cooling to remove the heat generated by the high-heating heating components 220, thereby improving the overall heat dissipation efficiency of the electronic device 200.

[0073] Please refer to Figure 2 and Figure 3 in combination. Figure 3 is a schematic structural diagram of a heat dissipation system 100 provided in the first embodiment of the present application. In Figure 3, the arrows point to the flow direction of the cooling medium.

[0074] The heat dissipation system 100 is located within the housing space W of the chassis 210. The heat dissipation system 100 is connected to the plurality of heat-generating components 220. At least a portion of the heat dissipation system 100 is located on a side of the plurality of heat-generating components 220 that is away from the motherboard 230. In other words, the motherboard 230 and at least a portion of the heat dissipation system 100 are located on either side of the plurality of heat-generating components 220 along the Z direction.

[0075] The heat dissipation system 100 may include a first liquid cold plate 10, a second liquid cold plate 20, a liquid separator 30, a liquid collector 40, a liquid supply line 50, and a liquid return line 60. The first liquid cold plate 10 and the second liquid cold plate 20 are spaced apart and constitute the cold plate structure in the heat dissipation system 100 that can achieve contact cooling of the heat generating device 220. The liquid separator 30 and the liquid collector 40 are both located in the gap region Q1 between the first liquid cold plate 10 and the second liquid cold plate 20 and are used to split and merge the cooling medium, respectively. The two can regulate the fluid flow in the heat dissipation system 100 and achieve flow distribution and pressure transmission of the cooling medium. The liquid supply line 50 can be connected between the liquid separator 30 and the first liquid cold plate 10, and between the liquid separator 30 and the second liquid cold plate 20, and is used to input low-temperature cooling medium into the first liquid cold plate 10 and the second liquid cold plate 20. The liquid return line 60 may be connected between the liquid collector 40 and the first liquid cooling plate 10 , and between the liquid collector 40 and the second liquid cooling plate 20 , for receiving the cooling medium heated in the first liquid cooling plate 10 and the second liquid cooling plate 20 .

[0076] When the liquid separator 30 and the liquid collector 40 are viewed as a whole, the first liquid cooling plate 10 is located on one side of the liquid separator 30 and the liquid collector 40, and the second liquid cooling plate 20 is located on the other side of the liquid separator 30 and the liquid collector 40. For example, as shown in FIG3 , the first liquid cooling plate 10 is located on the left side of the liquid separator 30 and the liquid collector 40, and the second liquid cooling plate 20 is located on the right side of the liquid separator 30 and the liquid collector 40. There can be one or more first liquid cooling plates 10. When there are multiple first liquid cooling plates 10, the multiple first liquid cooling plates 10 can be located on the same side of the liquid separator 30 and the liquid collector 40 and spaced apart in the X or Y direction. Each first liquid cooling plate 10 is used to dissipate heat from a single heat generating device 220. There can be one or more second liquid cooling plates 20. When there are multiple second liquid cooling plates 20, the multiple second liquid cooling plates 20 can be located on the same side of the liquid separator 30 and the liquid collector 40 and spaced apart in the X or Y direction. Each second liquid cooling plate 20 is used to dissipate heat for a heat generating device 220. The plurality of second liquid cooling plates 20 and the plurality of first liquid cooling plates 10 are located on both sides of the liquid distributor 30 and the liquid collector 40, respectively.

[0077] It should be noted that, in the embodiments of the present application, each first liquid cooling plate 10 is used to dissipate heat for a heat generating device 220, which means that each first liquid cooling plate 10 generally corresponds to only one heat generating device 220 listed above. However, this does not mean that each first liquid cooling plate 10 can only be used to dissipate heat for a single heat source. Each first liquid cooling plate 10 can actually be used to dissipate heat for multiple heat sources, such as simultaneously dissipating heat for a CPU and a VRD (Voltage Regulator Device) chip associated with the CPU. In the embodiments of the present application, each second liquid cooling plate 20 is used to dissipate heat for a heat generating device 220, which means that each second liquid cooling plate 20 generally corresponds to only one heat generating device 220 listed above. However, this does not mean that each second liquid cooling plate 20 can only be used to dissipate heat for a single heat source. Each second liquid cooling plate 20 can actually be used to dissipate heat for multiple heat sources, such as simultaneously dissipating heat for a CPU and a VRD chip associated with the CPU.

[0078] For example, as shown in FIG3 , four heat generating devices (not shown), two first liquid cooling plates 10, and two second liquid cooling plates 20 are provided within the housing space W of the chassis 210. The two first liquid cooling plates 10 are spaced apart along the Y direction. The two second liquid cooling plates 20 are spaced apart along the Y direction. Each first liquid cooling plate 10 is spaced apart from a second liquid cooling plate 20 along the X direction. Two of the four heat generating devices 220 are cooled by each first liquid cooling plate 10, and the remaining two heat generating devices are cooled by each second liquid cooling plate 20.

[0079] Based on the above description, it should be understood that the first liquid cooling plate 10 and the second liquid cooling plate 20 are each configured to abut against a heat generating device 220 to cool the heat generating device 220. In other words, each of the first liquid cooling plate 10 or the second liquid cooling plate 20 can be used to cool a heat generating device 220, and the total number of the first liquid cooling plates 10 and the second liquid cooling plates 20 can correspond to the total number of the heat generating devices 220.

[0080] It should be noted that any number and type of heating devices 220, as well as any number of liquid cooling plates for cooling these heating devices 220, can be installed in the receiving space W according to the actual application requirements of the electronic device 200. The embodiments of the present application do not impose strict restrictions on the number and type of heating devices 220, the number of first liquid cooling plates 10, the number of second liquid cooling plates 20, etc.

[0081] In an embodiment of the present application, the gap area Q1 between the first liquid cooling plate 10 and the second liquid cooling plate 20 is an idle space in the heat dissipation system 100. This idle space is used as a storage space for accommodating the liquid separator 30 and the liquid collector 40, which can optimize the spatial layout of the heat dissipation system 100 and enable the various components of the heat dissipation system 100 to be arranged more compactly, thereby improving the space utilization within the heat dissipation system 100.

[0082] Furthermore, compared to related art techniques in which the liquid distributors and liquid collectors are centrally located on the same side of multiple cold plates, this results in longer liquid flow lines from some of the cold plates to the liquid distributors and liquid collectors, leading to greater pressure loss and lower cold plate heat dissipation efficiency. In the embodiment of the present application, since the gap region Q1 between the first liquid cold plate 10 and the second liquid cold plate 20 is the central region of the heat dissipation system 100, the liquid distributor 30 and liquid collector 40 are located within this space, allowing the liquid distributor 30 and liquid collector 40 to be centrally located in the middle region between the first liquid cold plate 10 and the second liquid cold plate 20.

[0083] On the one hand, because the liquid separator 30 and the liquid collector 40 are centrally arranged in the middle area of ​​the first liquid cooling plate 10 and the second liquid cooling plate 20, the length of the liquid flow pipeline from the liquid separator 30 to the first liquid cooling plate 10 and the second liquid cooling plate 20, as well as the length of the liquid flow pipeline from the liquid collector 40 to the first liquid cooling plate 10 and the second liquid cooling plate 20 can be effectively shortened, so that the pressure loss of the cooling medium is small, which is conducive to improving the overall heat dissipation efficiency of the heat dissipation system 100. On the other hand, because the liquid separator 30 and the liquid collector 40 are centrally arranged in the middle area of ​​the first liquid cooling plate 10 and the second liquid cooling plate 20, the distance difference between the liquid supply distance between the liquid separator 30 and the first liquid cooling plate 10 and between the liquid separator 30 and the second liquid cooling plate 20 can be effectively reduced, so that there is a smaller pressure drop and better heat dissipation consistency between the liquid separator 30 and the first liquid cooling plate 10 and the second liquid cooling plate 20. It can also effectively reduce the difference in the return distance between the liquid collector 40 and the first liquid cooling plate 10 and between the liquid collector 40 and the second liquid cooling plate 20, so that there is a smaller pressure drop and better heat dissipation consistency between the liquid collector 40 and the first liquid cooling plate 10 and the second liquid cooling plate 20.

[0084] In other words, by centrally arranging the liquid separator 30 and the liquid collector 40 in the gap area Q1 between the first liquid cooling plate 10 and the second liquid cooling plate 20, the liquid flow pipelines from the liquid separator 30 and the liquid collector 40 to the liquid cooling plates on both sides thereof can be optimized, the flow length of the cooling medium can be shortened, and the pressure drop of the pipeline can be reduced, thereby effectively improving the overall heat dissipation performance of the heat dissipation system 100.

[0085] The following description uses a first liquid cooling plate 10 and a second liquid cooling plate 20 as examples to illustrate their structures. Unless otherwise specified, the descriptions of the first and second liquid cooling plates 10, 20 are applicable to other first and second liquid cooling plates 10, 20. Furthermore, the positional relationships of the various components of the cooling system 100 are described in detail below using two different embodiments.

[0086] First embodiment:

[0087] Referring to Figure 3 , in this embodiment, the first liquid cooling plate 10 can be connected to a heating device 220 and located on a side of the heating device 220 away from the mainboard 230. The first liquid cooling plate 10 can provide contact heat dissipation for the connected heating device 220. The first liquid cooling plate 10 can include a first body 11, a first liquid inlet connector 12, and a first liquid outlet connector 13.

[0088] The first body 11 includes a first flow channel (not shown) for the flow of a cooling medium. When the cooling medium flows through the first flow channel, it efficiently removes heat generated by the heating element 220 connected to the first liquid cooling plate 10, helping to maintain a relatively low temperature for the entire heating element 220 over a long period of time and addressing the problem of poor heat dissipation from a single high-power heating element 220.

[0089] The first liquid inlet connector 12 is connected to the first body 11 and communicates with the first flow channel in the first body 11. The first liquid inlet connector 12 can be located on a side of the first body 11 facing away from the heating element 220. The port of the first liquid inlet connector 12 can face the liquid distributor 30. The port of the first liquid inlet connector 12 refers to the connection port in the first liquid inlet connector 12 that connects to the liquid supply line 50 (such as the first liquid supply branch 51 described below). The first liquid inlet connector 12 can also communicate with the liquid distributor 30 via the liquid supply line 50, thereby allowing the low-temperature coolant in the liquid distributor 30 to enter the first flow channel of the first body 11 through the first liquid inlet connector 12.

[0090] In one possible embodiment, the first liquid inlet connector 12 is fixedly connected to the first body 11. In this arrangement, since the first liquid inlet connector 12 is relatively fixed to the first body 11, the orientation of the port of the first liquid inlet connector 12 is fixed, so that the liquid supply line 50 (such as the first liquid supply branch pipe 51 below) connected to the first liquid inlet connector 12 can bend or increase in length accordingly to adapt to the spatial layout within the chassis 210.

[0091] In another possible embodiment, the first liquid inlet connector 12 is rotatable relative to the first body 11. In other words, the first liquid inlet connector 12 is rotatably connected to the first body 11. In this arrangement, since the first liquid inlet connector 12 is rotatable relative to the first body 11, the orientation of the port of the first liquid inlet connector 12 can be adjusted accordingly based on the connection requirements of the first liquid inlet connector 12. This allows the first liquid inlet connector 12 to better adapt to the connection requirements of the liquid supply pipeline 50 (hereinafter referred to as the first liquid supply branch 51) simply through its own rotation, which is convenient, fast, and has good operability.

[0092] Please continue to refer to Figure 3. The first liquid outlet connector 13 is connected to the first body 11 and is in communication with the first flow channel in the first body 11. The first liquid outlet connector 13 can be provided on the side of the first body 11 away from the heating device 220, and is spaced apart from the first liquid inlet connector 12 on the first body 11. The port of the first liquid outlet connector 13 can face the liquid collector 40, wherein the port of the first liquid outlet connector 13 refers to the connection port in the first liquid outlet connector 13 that is connected to the return liquid pipeline 60 (such as the first return liquid branch 61 described below). The first liquid outlet connector 13 can also be in communication with the liquid collector 40 through the return liquid pipeline 60, so that the cooling medium after heating in the first body 11 can flow back to the liquid collector 40 through the first liquid outlet connector 13, thereby realizing the liquid cooling circulation in the first liquid cooling plate 10.

[0093] In one possible embodiment, the first liquid outlet connector 13 is fixedly connected to the first body 11. In this arrangement, since the first liquid outlet connector 13 is relatively fixed to the first body 11, the orientation of the port of the first liquid outlet connector 13 is fixed, so that the return liquid pipeline 60 (such as the first return liquid branch pipe 61 below) connected to the first liquid outlet connector 13 can bend or increase in length accordingly to adapt to the spatial layout within the chassis 210.

[0094] In another possible embodiment, the first liquid outlet connector 13 is rotatable relative to the first body 11. In other words, the first liquid outlet connector 13 is rotatably connected to the first body 11. In this arrangement, since the first liquid outlet connector 13 is rotatable relative to the first body 11, the orientation of the port of the first liquid outlet connector 13 can be adjusted accordingly based on the connection requirements of the first liquid outlet connector 13. This allows the connector 13 to better adapt to the connection requirements of the return liquid pipeline 60 (hereinafter referred to as the first return liquid branch 61) simply through its own rotation, resulting in convenient and efficient operation.

[0095] It should be noted that the shape, setting position, quantity, etc. of the first liquid inlet connector 12 and the first liquid outlet connector 13 can be selected according to the actual application requirements of the first liquid cooling plate 10. It is only necessary that the first liquid inlet connector 12 and the first liquid outlet connector 13 are spaced apart on the first body 11, and there is no strict restriction on this.

[0096] In a possible embodiment, please refer to Figure 4, which is a schematic diagram of a partial structure of the heat dissipation system 100 shown in Figure 3 at an angle. The heat dissipation system 100 may also include a first heat-conducting structure 70. The first heat-conducting structure 70 is connected to the side of the first body 11 away from the first liquid inlet joint 12 and the first liquid outlet joint 13. The first heat-conducting structure 70 can be connected to the heating device 220, so that the first liquid cold plate 10 is connected to the heating device 220 through the first heat-conducting structure 70. Exemplarily, the first heat-conducting structure 70 can be made of a thermal interface material (TIM). For example, it can be thermal grease, thermal gel, phase change material, thermal pad, thermal film, liquid metal, etc.

[0097] Continuing with Figures 3 and 4 , in the embodiment of the present application, the second liquid cooling plate 20 can be connected to a heating device 220 and located on a side of the heating device 220 away from the mainboard 230. The second liquid cooling plate 20 can provide contact heat dissipation for the connected heating device 220. The second liquid cooling plate 20 can include a second body 21, a second liquid inlet connector 22, and a second liquid outlet connector 23.

[0098] The second body 21 includes a second flow channel (not shown) for the flow of cooling medium. When the cooling medium flows through the second flow channel, it efficiently removes heat generated by the heating element 220 connected to the second liquid cooling plate 20, helping to maintain a relatively low temperature for the entire heating element 220 over a long period of time and solving the problem of poor heat dissipation of a single high-power heating element 220.

[0099] The second liquid inlet connector 22 is connected to the second body 21 and communicates with the second flow channel in the second body 21. The second liquid inlet connector 22 can be located on a side of the second body 21 facing away from the heating element 220, with the port of the second liquid inlet connector 22 facing the liquid distributor 30. The port of the second liquid inlet connector 22 refers to the connection port in the second liquid inlet connector 22 that connects to the liquid supply line 50 (such as the second liquid supply branch 52 referred to below). The second liquid inlet connector 22 can also communicate with the liquid distributor 30 via the liquid supply line 50, allowing the low-temperature coolant in the liquid distributor 30 to enter the second flow channel of the second body 21 through the second liquid inlet connector 22.

[0100] In one possible embodiment, the second liquid inlet connector 22 is fixedly connected to the second body 21. In this arrangement, since the second liquid inlet connector 22 is relatively fixed to the second body 21, the orientation of the port of the second liquid inlet connector 22 is fixed, so that the liquid supply line 50 (such as the second liquid supply branch pipe 52 hereinafter) connected to the second liquid inlet connector 22 can bend or increase in length accordingly to adapt to the spatial layout within the chassis 210.

[0101] In another possible embodiment, the second liquid inlet connector 22 is rotatable relative to the second body 21. In other words, the second liquid inlet connector 22 is rotatably connected to the second body 21. In this arrangement, since the second liquid inlet connector 22 can rotate relative to the second body 21, the orientation of the port of the second liquid inlet connector 22 can be adjusted accordingly based on the connection requirements of the second liquid inlet connector 22. This allows the second liquid inlet connector 22 to better adapt to the connection requirements of the liquid supply pipeline 50 (hereinafter referred to as the second liquid supply branch 52) simply through its own rotation, which is convenient, fast, and has good operability.

[0102] The second liquid outlet joint 23 is connected to the second body 21 and communicates with the second flow channel in the second body 21. The second liquid outlet joint 23 can be arranged on the side of the second body 21 away from the heating device 220, and is spaced apart from the second liquid inlet joint 22 on the second body 21. The port of the second liquid outlet joint 23 faces the liquid collector 40, wherein the port of the second liquid outlet joint 23 refers to the connection port in the second liquid outlet joint 23 that is connected to the return liquid pipeline 60 (such as the second return liquid branch 62 mentioned below). The second liquid outlet joint 23 can also be connected to the liquid collector 40 through the return liquid pipeline 60, so that the cooling medium after heating in the second body 21 can flow back to the liquid collector 40 through the second liquid outlet joint 23, thereby realizing the liquid cooling circulation in the second liquid cold plate 20.

[0103] In one possible embodiment, the second liquid outlet connector 23 is fixedly connected to the second body 21. In this arrangement, since the second liquid outlet connector 23 is relatively fixed to the second body 21, the orientation of the port of the second liquid outlet connector 23 is fixed, so that the return liquid pipeline 60 (such as the second return liquid branch pipe 62 below) connected to the second liquid outlet connector 23 can bend or increase in length accordingly to adapt to the spatial layout within the chassis 210.

[0104] In another possible embodiment, the second liquid outlet connector 23 is rotatable relative to the second body 21. In other words, the second liquid outlet connector 23 is rotatably connected to the second body 21. In this arrangement, since the second liquid outlet connector 23 can rotate relative to the second body 21, the orientation of the port of the second liquid outlet connector 23 can be adjusted accordingly based on the connection requirements of the second liquid outlet connector 23. This allows the second liquid outlet connector 23 to better adapt to the connection requirements of the return liquid pipeline 60 (hereinafter referred to as the second liquid return branch 62) simply through its own rotation, which is convenient, fast, and has good operability.

[0105] It should be noted that the shape, setting position, quantity, etc. of the second liquid inlet connector 22 and the second liquid outlet connector 23 can be selected according to the actual application needs of the second liquid cold plate 20. It is only necessary that the second liquid inlet connector 22 and the second liquid outlet connector 23 are spaced apart on the second body 21, and there is no strict restriction on this.

[0106] In one possible embodiment, as shown in FIG4 , the heat dissipation system 100 may further include a second heat-conducting structure 80. The second heat-conducting structure 80 is connected to the side of the second body 21 away from the second liquid inlet joint 22 and the second liquid outlet joint 23. The second heat-conducting structure 80 can be connected to the heating device 220, so that the second liquid cold plate 20 is connected to the heating device 220 through the second heat-conducting structure 80. Exemplarily, the second heat-conducting structure 80 can be made of a thermal interface material (TIM). For example, it can be thermal grease, thermal gel, phase change material, thermal pad, thermal film, liquid metal, etc.

[0107] Based on the above description, it should be understood that one or more of the first liquid inlet connector 12 of the first liquid cooling plate 10, the first liquid outlet connector 13 of the first liquid cooling plate 10, the second liquid inlet connector 22 of the second liquid cooling plate 20, and the second liquid outlet connector 23 of the second liquid cooling plate 20 can all be rotated, and whether the first liquid inlet connector 12 of the first liquid cooling plate 10, the first liquid outlet connector 13 of the first liquid cooling plate 10, the second liquid inlet connector 22 of the second liquid cooling plate 20, and the second liquid outlet connector 23 of the second liquid cooling plate 20 are rotated, and the specific connector types that are rotated can be arranged and combined, and are not listed here. For example, at least one of the first liquid inlet connector 12 and the first liquid outlet connector 13 can be rotated relative to the first body 11, and / or at least one of the second liquid inlet connector 22 and the second liquid outlet connector 23 can be rotated relative to the second body 21.

[0108] In the embodiment of the present application, the first liquid cooling plate 10 and the second liquid cooling plate 20 can be spaced apart along the X direction, or the first liquid cooling plate 10 and the second liquid cooling plate 20 can be spaced apart along the Y direction. The following description will take the case where the first liquid cooling plate 10 and the second liquid cooling plate 20 are spaced apart along the X direction as an example, but it should be understood that this is not a limitation.

[0109] Referring to Figures 3 and 4 , a gap region Q1 is defined between the first and second liquid cooling plates 10, 20 along the X-direction. This gap region Q1 represents the central region between the first and second liquid cooling plates 10, 20, and is therefore the central region of the heat dissipation system 100. This gap region Q1 can accommodate the liquid separator 30 and the liquid collector 40.

[0110] 3 and 4 , the liquid separator 30 is located in the gap region Q1 between the first liquid cooling plate 10 and the second liquid cooling plate 20 . The liquid separator 30 may include a liquid separator body 31 , a first liquid separator connector 32 , a second liquid separator connector 33 , and a liquid supply connector 34 .

[0111] The liquid separator body 31 includes a first cavity (not shown) that accommodates the cooling medium and provides a flow path for the cold fluid. When the cooling medium is introduced into the first cavity, it flows into the various liquid cooling plates through the connection between the first cavity and the liquid separator connectors, enabling the liquid separator 30 to control the cooling medium inflow and diversion.

[0112] The liquid supply connector 34 is connected to the liquid separation body 31 and communicates with the first cavity in the liquid separation body 31. The liquid supply connector 34 can be provided at one end of the liquid separation body 31 and is used to communicate with the liquid supply pipeline 50 (hereinafter referred to as the liquid supply main pipeline) so that a low-temperature cooling medium can be input into the first cavity of the liquid separation body 31. Exemplarily, the liquid supply method of the cooling medium connected to the liquid supply connector 34 can be a method of connecting to a built-in pump of the electronic device 200 to drive the liquid flow, or a method of connecting to an external liquid cooling pipeline system of the electronic device 200 to drive the liquid flow.

[0113] The first liquid separation joint 32 is connected to the liquid separation body 31 and is connected to the first cavity in the liquid separation body 31. The first liquid separation joint 32 can be provided on the side of the liquid separation body 31 away from the heating device 220 or on the side facing the heating device 220, and the port of the first liquid separation joint 32 faces the first liquid cooling plate 10, wherein the port of the first liquid separation joint 32 refers to the connection port in the first liquid separation joint 32 that is connected to the liquid supply line 50 (such as the first liquid supply branch 51 mentioned below). The first liquid separation joint 32 can also be connected to the first liquid inlet joint 12 of the first liquid cooling plate 10 through the liquid supply line 50, so that the low-temperature cooling medium in the liquid separator 30 can be distributed to the first liquid cooling plate 10 through the first liquid separation joint 32 and enter the first flow channel of the first body 11. The number of the first liquid separation joints 32 can be the same as the number of the first liquid inlet joints 12 of the first liquid cooling plate 10 and be connected one-to-one.

[0114] It can be understood that since the first liquid cooling plate 10 is located on one side of the liquid separation body 31, and the port of the first liquid separation joint 32 is facing the first liquid cooling plate 10, the length of the pipeline required to connect the first liquid separation joint 32 with the first liquid inlet joint 12 of the first liquid cooling plate 10 can be shortened, and the pressure drop along the flow of the cooling medium can be reduced, so that the first liquid separation joint 32 can be docked and connected with the first liquid inlet joint 12 of the first liquid cooling plate 10 located on one side of the liquid separation body 31.

[0115] In one possible embodiment, the first liquid-dispensing connector 32 is fixedly connected to the liquid-dispensing body 31. In this arrangement, since the first liquid-dispensing connector 32 is relatively fixed to the liquid-dispensing body 31, the orientation of the port of the first liquid-dispensing connector 32 is fixed, so that the liquid supply line 50 (such as the first liquid supply branch pipe 51 hereinafter) connected to the first liquid-dispensing connector 32 can bend or increase in length accordingly to adapt to the spatial layout within the chassis 210.

[0116] In another possible embodiment, the first liquid-separating connector 32 is rotatable relative to the liquid-separating body 31. In other words, the first liquid-separating connector 32 is rotatably connected to the liquid-separating body 31. In this arrangement, since the first liquid-separating connector 32 is rotatable relative to the liquid-separating body 31, the orientation of the port of the first liquid-separating connector 32 can be adjusted accordingly according to the connection requirements of the first liquid-separating connector 32. Thus, the first liquid-separating connector 32 can be better adapted to the connection requirements of the liquid supply pipeline 50 (hereinafter referred to as the first liquid supply branch 51) simply by rotating itself, which is convenient, fast, and has good operability.

[0117] Continuing with Figures 3 and 4 , the second liquid-dividing connector 33 is connected to the liquid-dividing body 31 and communicates with the first cavity in the liquid-dividing body 31. The second liquid-dividing connector 33 and the first liquid-dividing connector 32 are spaced apart and connected to the same side of the liquid-dividing body 31. Specifically, the second liquid-dividing connector 33 can be disposed on the side of the liquid-dividing body 31 facing away from the heating element 220 or on the side facing the heating element 220, and spaced apart from the second liquid-dividing connector 33 on the liquid-dividing body 31.

[0118] The port of the second liquid-distributing joint 33 faces the second liquid-cooling plate 20 , wherein the port of the second liquid-distributing joint 33 refers to the connection port in the second liquid-distributing joint 33 that is connected to the liquid supply line 50 (hereinafter referred to as the second liquid supply branch 52 ). The second liquid-distributing joint 33 can also be connected to the second liquid inlet joint 22 of the second liquid-cooling plate 20 via the liquid supply line 50 , thereby allowing the low-temperature coolant in the liquid distributor 30 to be distributed to the second liquid-cooling plate 20 through the second liquid-distributing joint 33 and enter the second flow channel of the second body 21 . The number of second liquid-distributing joints 33 can be the same as the number of second liquid inlet joints 22 of the second liquid-cooling plate 20 , and they can be connected one-to-one.

[0119] It can be understood that since the second liquid cooling plate 20 is located on the other side of the liquid separation body 31, and the port of the second liquid separation joint 33 is facing the second liquid cooling plate 20, the length of the pipeline required to connect the second liquid separation joint 33 with the second liquid inlet joint 22 of the second liquid cooling plate 20 can be shortened, and the pressure drop along the flow of the cooling medium can be reduced, so that the second liquid separation joint 33 can be docked and connected with the second liquid inlet joint 22 of the second liquid cooling plate 20 located on one side of the liquid separation body 31.

[0120] In one possible embodiment, the second liquid-distributing connector 33 is fixedly connected to the liquid-distributing body 31. In this arrangement, since the second liquid-distributing connector 33 is relatively fixed to the liquid-distributing body 31, the orientation of the port of the second liquid-distributing connector 33 is fixed, so that the return liquid line 60 (such as the first return liquid branch 61 described below) connected to the second liquid-distributing connector 33 can bend or increase in length accordingly to adapt to the spatial layout within the chassis 210.

[0121] In another possible embodiment, the second liquid-dividing connector 33 is rotatable relative to the liquid-dividing body 31. In other words, the second liquid-dividing connector 33 is rotatably connected to the liquid-dividing body 31. In this arrangement, since the second liquid-dividing connector 33 is rotatable relative to the liquid-dividing body 31, the orientation of the port of the second liquid-dividing connector 33 can be finely adjusted according to the connection requirements of the second liquid-dividing connector 33. This allows the second liquid-dividing connector 33 to better adapt to the connection requirements of the return liquid pipeline 60 (hereinafter referred to as the first liquid-dividing branch 61) simply by rotating itself, which is convenient, fast, and has good operability.

[0122] Based on the above description, it should be understood that the port orientation of the second liquid-distributing connector 33 is opposite to that of the first liquid-distributing connector 32. That is, when the port of the first liquid-distributing connector 32 faces one side of the liquid-distributing body 31, the port of the second liquid-distributing connector 33 faces the other side of the liquid-distributing body 31. With this arrangement, the first liquid-distributing connector 32 and the second liquid-distributing connector 33 can be connected to the first and second liquid-distributing plates 10, 20, respectively, in close proximity. This effectively shortens the length of the pipelines between the liquid distributor 30 and the first and second liquid-distributing plates 10, 20, and reduces pressure loss during coolant flow, thereby improving the heat dissipation efficiency of the heat dissipation system 100.

[0123] It should be noted that the shape, setting position, quantity, etc. of the first liquid separation joint 32 and the second liquid separation joint 33 can be selected according to the actual application needs of the liquid separator 30. It is only necessary to ensure that the first liquid separation joint 32 and the second liquid separation joint 33 are spaced apart on the liquid separation body 31, and there is no strict restriction on this.

[0124] 3 and 4 , the liquid collector 40 is located in the gap region Q1 between the first liquid cooling plate 10 and the second liquid cooling plate 20 and is adjacent to the liquid separator 30. The liquid collector 40 may include a liquid collector body 41, a first liquid collector joint 42, a second liquid collector joint 43, and a liquid return joint 44.

[0125] The liquid collector body 41 has a second cavity (not shown) that accommodates the coolant and provides a flow path for the hot fluid. When the coolant in the first and second liquid cold plates 10, 20 heats up, it can flow back into the second cavity through the connection between the liquid collector joints and the second cavity, enabling the liquid collector 40 to control the return flow of the coolant.

[0126] The liquid return connector 44 is connected to the liquid collection body 41 and communicates with the second cavity in the liquid collection body 41. The liquid return connector 44 can be provided at one end of the liquid collection body 41 and is used to communicate with the liquid return line 60 (hereinafter referred to as the liquid return main pipe). This allows the heated cooling medium in the second cavity of the liquid collection body 41 to be transported through the liquid return connector 44 to the heat exchange module of the liquid cooling distribution device outside the electronic device 200 for heat exchange and cooling.

[0127] The first liquid collecting joint 42 is connected to the liquid collecting body 41 and communicates with the second cavity in the liquid collecting body 41. The first liquid collecting joint 42 can be provided on the side of the liquid collecting body 41 away from the heating device 220 or on the side facing the heating device 220. The port of the first liquid collecting joint 42 faces the first liquid cooling plate 10, wherein the port of the first liquid collecting joint 42 refers to the connection port in the first liquid collecting joint 42 that is connected to the return liquid pipeline 60 (such as the first return liquid branch 61 below). The first liquid collecting joint 42 can also be connected to the first liquid outlet joint 13 of the first liquid cooling plate 10 through the return liquid pipeline 60, so that the cooling medium heated in the first body 11 of the first liquid cooling plate 10 can flow into the liquid collecting body 41 of the liquid collector 40 through the first liquid outlet joint 13 and the first liquid collecting joint 42. The number of the first liquid collecting joints 42 is the same as the number of the first liquid outlet joints 13 of the first liquid cooling plate 10 and they are connected one-to-one.

[0128] It can be understood that since the first liquid cooling plate 10 is located on one side of the liquid collecting body 41, and the port of the first liquid collecting joint 42 is facing the first liquid cooling plate 10, the length of the pipeline required to connect the first liquid collecting joint 42 with the first liquid outlet joint 13 of the first liquid cooling plate 10 can be shortened, and the pressure drop along the flow of the cooling medium can be reduced, so that the first liquid collecting joint 42 can be docked and connected with the first liquid outlet joint 13 of the first liquid cooling plate 10 located on the side of the liquid collecting body 41.

[0129] In one possible embodiment, the first liquid collection joint 42 is fixedly connected to the liquid collection body 41. In this arrangement, since the first liquid collection joint 42 is relatively fixed to the liquid collection body 41, the orientation of the port of the first liquid collection joint 42 is fixed, so that the liquid supply line 50 (such as the first liquid supply branch pipe 51 below) connected to the first liquid collection joint 42 can bend or increase in length accordingly to adapt to the spatial layout within the chassis 210.

[0130] In another possible embodiment, the first liquid collecting joint 42 is rotatable relative to the liquid collecting body 41. In other words, the first liquid collecting joint 42 is rotatably connected to the liquid collecting body 41. In this arrangement, since the first liquid collecting joint 42 is rotatable relative to the liquid collecting body 41, the orientation of the port of the first liquid collecting joint 42 can be adjusted accordingly according to the connection requirements of the first liquid collecting joint 42. Thus, the first liquid collecting joint 42 can be better adapted to the connection requirements of the liquid supply pipeline 50 (hereinafter referred to as the first liquid supply branch 51) simply by its own rotation, which is convenient, fast and has good operability.

[0131] Continuing with Figures 3 and 4 , the second liquid collection joint 43 is connected to the liquid collection body 41 and communicates with the second cavity within the liquid collection body 41. The second liquid collection joint 43 and the first liquid collection joint 42 are spaced apart and connected to the same side of the liquid collection body 41. Specifically, the second liquid collection joint 43 can be located on the side of the liquid collection body 41 facing away from the heating element 220 or on the side facing the heating element 220, and can be spaced apart from the second liquid collection joint 43 on the liquid collection body 41.

[0132] The port of the second liquid manifold 43 faces the second liquid cooling plate 20. The port of the second liquid manifold 43 refers to the connection port in the second liquid manifold 43 that connects to the return liquid pipeline 60 (hereinafter referred to as the second return liquid branch 62). The second liquid manifold 43 can also connect to the second liquid outlet connector 23 of the second liquid cooling plate 20 via the return liquid pipeline 60, thereby allowing the heated coolant in the second body 21 of the second liquid cooling plate 20 to flow through the second liquid outlet connector 23 and the second liquid manifold 43 into the liquid collecting body 41 of the manifold 40. The number of second liquid manifolds 43 can be the same as the number of second liquid outlet connectors 23 of the second liquid cooling plate 20, and they can be connected one-to-one.

[0133] It can be understood that since the second liquid cooling plate 20 is located on the other side of the liquid collecting body 41, and the port of the second liquid collecting joint 43 is facing the second liquid cooling plate 20, the length of the pipeline required to connect the second liquid collecting joint 43 with the second liquid outlet joint 23 of the second liquid cooling plate 20 can be shortened, and the pressure drop along the flow of the cooling medium can be reduced, so that the second liquid collecting joint 43 can be docked and connected with the second liquid outlet joint 23 of the second liquid cooling plate 20 located on one side of the liquid collecting body 41.

[0134] In one possible embodiment, the second liquid collection joint 43 is fixedly connected to the liquid collection body 41. In this arrangement, since the second liquid collection joint 43 is relatively fixed to the liquid collection body 41, the port orientation of the second liquid collection joint 43 is fixed, so that the return liquid pipeline 60 (such as the first return liquid branch pipe 61 below) connected to the second liquid collection joint 43 can bend or increase in length accordingly to adapt to the spatial layout within the chassis 210.

[0135] In another possible embodiment, the second liquid collection joint 43 is rotatable relative to the liquid collection body 41. In other words, the second liquid collection joint 43 is rotatably connected to the liquid collection body 41. In this arrangement, since the second liquid collection joint 43 can rotate relative to the liquid collection body 41, the orientation of the port of the second liquid collection joint 43 can be finely adjusted according to the connection requirements of the second liquid collection joint 43. This allows the second liquid collection joint 43 to better adapt to the connection requirements of the return liquid pipeline 60 (hereinafter referred to as the first liquid return branch 61) simply through its own rotation, which is convenient, fast, and has good operability.

[0136] In this embodiment, the ports of the second manifold 43 face in the opposite direction to those of the first manifold 42. That is, when the ports of the first manifold 42 face one side of the manifold body 41, the ports of the second manifold 43 face the other side of the manifold body 41. This arrangement allows the first and second manifolds 42, 43 to communicate with the first and second cold plates 10, 20, respectively, in close proximity. This effectively shortens the length of the pipelines between the manifold 40 and the first and second cold plates 10, 20, reduces pressure loss during coolant flow, and improves the heat dissipation efficiency of the cooling system 100.

[0137] It should be noted that the shape, setting position, quantity, etc. of the first liquid collecting joint 42 and the second liquid collecting joint 43 can be selected according to the actual application needs of the liquid collector 40. It is only necessary to ensure that the first liquid collecting joint 42 and the second liquid collecting joint 43 are spaced apart on the liquid collecting body 41, and there is no strict restriction on this.

[0138] Based on the above description, it should be understood that one or more of the first liquid-distributing joint 32 of the liquid distributor 30, the second liquid-distributing joint 33 of the liquid distributor 30, the first liquid-collecting joint 42 of the liquid collector 40, and the second liquid-collecting joint 43 of the liquid collector 40 can all be rotated, and whether the first liquid-distributing joint 32 of the liquid distributor 30, the second liquid-distributing joint 33 of the liquid distributor 30, the first liquid-collecting joint 42 of the liquid collector 40, and the second liquid-collecting joint 43 of the liquid collector 40 are rotated and the specific joint types that are rotated can be arranged and combined, which are not listed here. For example, at least one of the first liquid-distributing joint 32 and the second liquid-distributing joint 33 can rotate relative to the liquid-distributing body 31, and / or at least one of the first liquid-collecting joint 42 and the second liquid-collecting joint 43 can rotate relative to the liquid-collecting body 41.

[0139] Referring to Figures 3 and 4 , the liquid supply line 50 can be connected not only between the liquid separator 30 and a liquid cooling distribution device (not shown) outside the electronic device 200, thereby connecting the liquid cooling distribution device with the liquid separator 30 and forming a liquid passage between the liquid cooling distribution device and the liquid separator 30. The liquid supply line 50 can also be connected between the liquid separator 30 and the first liquid cooling plate 10, and between the liquid separator 30 and the second liquid cooling plate 20, thereby connecting the liquid separator 30 with the first liquid cooling plate 10 and the second liquid cooling plate 20, thereby forming a liquid passage between the liquid separator 30 and both the first liquid cooling plate 10 and the second liquid cooling plate 20. Thus, the low-temperature coolant in the liquid cooling distribution device outside the electronic device 200 can enter the liquid separator 30 via the liquid supply line 50 and ultimately flow into the first liquid cooling plate 10 and the second liquid cooling plate 20. Specifically, the liquid supply line 50 may include a liquid supply main (not shown), a first liquid supply branch line 51, and a second liquid supply branch line 52.

[0140] At least part of the liquid supply main pipe is located in the receiving space W of the chassis 210, one end of the liquid supply main pipe is connected to the liquid supply connector 34 of the liquid distributor 30, and the other end of the liquid supply main pipe is connected to the liquid inlet A1 of the chassis 210, and is connected to the liquid cooling distribution device located outside the electronic device 200, so that the liquid supply main pipe can be connected between the liquid distributor 30 and the liquid cooling distribution device outside the electronic device 200 and connect the two, so that the low-temperature cooling medium in the liquid cooling distribution device located outside the electronic device 200 can flow into the liquid distributor 30 through the liquid supply main pipe.

[0141] The first liquid supply branch pipe 51 is located within the housing space W of the chassis 210. One end of the first liquid supply branch pipe 51 is connected to the first liquid distribution connector 32 of the liquid distributor 30, and the other end of the first liquid supply branch pipe 51 is connected to the first liquid inlet connector 12 of the first liquid cooling plate 10. In other words, the first liquid supply branch pipe 51 is connected between the first liquid distribution connector 32 of the liquid distributor 30 and the first liquid inlet connector 12 of the first liquid cooling plate 10, and is used to transport the cooling medium in the liquid distribution body 31 of the liquid distributor 30 to the first body 11 of the first liquid cooling plate 10.

[0142] The second liquid supply branch pipe 52 is located within the housing space W of the chassis 210. One end of the second liquid supply branch pipe 52 is connected to the second liquid distribution connector 33 of the liquid distributor 30, and the other end of the second liquid supply branch pipe 52 is connected to the second liquid inlet connector 22 of the second liquid cooling plate 20. In other words, the second liquid supply branch pipe 52 is connected between the second liquid distribution connector 33 of the liquid distributor 30 and the second liquid inlet connector 22 of the second liquid cooling plate 20, and is used to transport the cooling medium in the liquid distribution body 31 of the liquid distributor 30 to the second body 21 of the second liquid cooling plate 20.

[0143] Continuing with Figures 3 and 4 , the liquid return line 60 can be connected not only between the liquid collector 40 and the liquid cooling distribution device outside the electronic device 200, thereby connecting the liquid cooling distribution device with the liquid collector 40 and forming a liquid passage between the liquid cooling distribution device and the liquid collector 40. The liquid return line 60 can also be connected between the liquid collector 40 and the first liquid cooling plate 10, and between the liquid collector 40 and the second liquid cooling plate 20, thereby connecting the liquid collector 40 with the first and second liquid cooling plates 10, 20 and forming a liquid passage between the liquid collector 40 and both the first and second liquid cooling plates 10, 20. Thus, the coolant heated in the first and second liquid cooling plates 10, 20 can enter the liquid collector 40 via the liquid return line 60 and ultimately flow into the heat exchange module in the liquid cooling distribution device outside the electronic device 200. Specifically, the liquid return line 60 may include a liquid return main pipe (not shown), a first liquid return branch pipe 61, and a second liquid return branch pipe 62.

[0144] At least part of the liquid return main pipe is located in the receiving space W of the chassis 210, one end of the liquid return main pipe is connected to the liquid return connector 44 of the liquid collector 40, and the other end of the liquid return main pipe is connected to the liquid outlet A2 of the chassis 210, and is connected to the liquid cooling distribution device located outside the electronic device 200, so that the liquid return main pipe can be connected between the liquid collector 40 and the liquid cooling distribution device outside the electronic device 200 and connect the two, so that the cooling medium heated in the liquid collector 40 can flow back to the liquid cooling module of the liquid cooling distribution device located outside the electronic device 200 through the liquid return main pipe.

[0145] The first liquid return branch pipe 61 is located within the housing space W of the chassis 210. One end of the first liquid return branch pipe 61 is connected to the first liquid collection joint 42 of the liquid collector 40, and the other end of the first liquid return branch pipe 61 is connected to the first liquid outlet joint 13 of the first liquid cold plate 10. In other words, the first liquid return branch pipe 61 is connected between the first liquid collection joint 42 of the liquid collector 40 and the first liquid outlet joint 13 of the first liquid cold plate 10, and is used to recover the coolant in the first body 11 of the first liquid cold plate 10 back to the liquid collection body 41 of the liquid collector 40.

[0146] The second liquid return branch pipe 62 is located within the receiving space W of the chassis 210. One end of the second liquid return branch pipe 62 is connected to the second liquid collection joint 43 of the liquid collector 40, and the other end of the second liquid return branch pipe 62 is connected to the second liquid outlet joint 23 of the second liquid cold plate 20. In other words, the second liquid return branch pipe 62 is connected between the second liquid collection joint 43 of the liquid collector 40 and the second liquid outlet joint 23 of the second liquid cold plate 20, and is used to recover the coolant in the second body 21 of the second liquid cold plate 20 back to the liquid collection body 41 of the liquid collector 40.

[0147] Based on the above description, it should be understood that the two ends of the liquid supply main pipe are respectively connected to the liquid cooling distribution device and the liquid distributor 30 outside the electronic device 200, the two ends of the first liquid supply branch pipe 51 are respectively connected to the liquid distributor 30 and the first liquid cooling plate 10, and the two ends of the second liquid supply branch pipe 52 are respectively connected to the liquid distributor 30 and the second liquid cooling plate 20. The two ends of the liquid return main pipe are respectively connected to the liquid cooling distribution device and the liquid collector 40 outside the electronic device 200, the two ends of the first liquid return branch pipe 61 are respectively connected to the liquid collector 40 and the first liquid cooling plate 10, and the two ends of the second liquid return branch pipe 62 are respectively connected to the liquid collector 40 and the second liquid cooling plate 20. Thus, the liquid outlet end of the liquid cooling distribution device outside the electronic device 200, the liquid supply main pipe, the liquid distributor 30, the first liquid supply branch pipe 51 and the second liquid supply branch pipe 52, the first flow channel in the first liquid cooling plate 10 and the second flow channel in the second liquid cooling plate 20, the first return liquid branch pipe 61 and the second return liquid branch pipe 62, the liquid collector 40, the return liquid main pipe, and the liquid inlet end of the liquid cooling distribution device outside the electronic device 200 can be connected end to end to form a cooling liquid circuit for the circulation of the cooling medium, thereby realizing the liquid cooling circulation of the cooling medium in the heat dissipation system 100.

[0148] In summary, in this embodiment, the liquid separator 30 and the liquid collector 40 are arranged side by side within the gap region Q1 between the first liquid cooling plate 10 and the second liquid cooling plate 20. Specifically, the liquid separator 30 and the liquid collector 40 are arranged side by side within the gap region Q1 between the first liquid cooling plate 10 and the second liquid cooling plate 20. As shown in FIG3 , in the direction from the first liquid cooling plate 10 to the second liquid cooling plate 20 (e.g., the X direction), the liquid separator body 31 of the liquid separator 30 and the liquid collector body 41 of the liquid collector 40 are arranged side by side. The first liquid separation joint 32 of the liquid separator 30 and the first liquid collection joint 42 of the liquid collector 40 are arranged in sequence (i.e., the first liquid separation joint 32 of the liquid separator 30 and the first liquid collection joint 42 of the liquid collector 40 are arranged in parallel), and the ports of the first liquid separation joint 32 of the liquid separator 30 and the ports of the first liquid collection joint 42 of the liquid collector 40 both face the first liquid cooling plate 10. The second liquid separation joint 33 of the liquid separator 30 and the second liquid collection joint 43 of the liquid collector 40 are arranged in sequence (i.e., the second liquid separation joint 33 of the liquid separator 30 and the second liquid collection joint 43 of the liquid collector 40 are arranged in parallel), and the ports of the second liquid separation joint 33 of the liquid separator 30 and the ports of the second liquid collection joint 43 of the liquid collector 40 both face the second liquid cooling plate 20.

[0149] It is understood that the first liquid-distributing joint 32 and the first liquid-collecting joint 42 are used to respectively realize liquid inlet and liquid outlet of the same first liquid-cooling plate 10. By orienting the ports of the first liquid-distributing joint 32 and the first liquid-collecting joint 42 toward the first liquid-cooling plate 10, it is possible to more conveniently and quickly connect the first liquid-distributing joint 32 to the first liquid-inlet joint 12 of the first liquid-cooling plate 10, and to connect the first liquid-collecting joint 42 to the first liquid-outlet joint 13 of the first liquid-cooling plate 10. This facilitates achieving the shortest possible connection between the first liquid-distributing joint 32 and the first liquid-inlet joint 12 of the first liquid-cooling plate 10, and between the first liquid-collecting joint 42 and the first liquid-outlet joint 13 of the first liquid-cooling plate 10, effectively reducing the length of the pipes required for connection, lowering the pressure drop in the pipes, and improving heat dissipation efficiency.

[0150] The second liquid-dividing joint 33 and the second liquid-collecting joint 43 are used to respectively realize liquid inlet and liquid outlet of the same second liquid-cooling plate 20. With the ports of the second liquid-dividing joint 33 and the second liquid-collecting joint 43 both oriented toward the second liquid-cooling plate 20, the second liquid-dividing joint 33 can be more conveniently and quickly connected to the second liquid-inlet joint 22 of the second liquid-cooling plate 20, and the second liquid-collecting joint 43 can be connected to the second liquid-outlet joint 23 of the second liquid-cooling plate 20. This facilitates achieving the shortest possible connection between the second liquid-dividing joint 33 and the second liquid-inlet joint 22 of the second liquid-cooling plate 20, and between the second liquid-collecting joint 43 and the second liquid-outlet joint 23 of the second liquid-cooling plate 20, effectively reducing the length of the pipes required for the connection, lowering the pressure drop in the pipes, and improving heat dissipation efficiency.

[0151] In this embodiment, as shown in Figure 3, the port orientation of the first liquid-distributing joint 32 is arranged at an angle to the port orientation of the first liquid-collecting joint 42. For example, in the first liquid-distributing joint 32 and the second liquid-distributing joint 33, the port orientation of one joint is arranged parallel to the X direction, and the port orientation of the other joint is arranged at an angle to the X direction.

[0152] It can be understood that since the liquid separation body 31 of the liquid separator 30 and the liquid collection body 41 of the liquid collector 40 are arranged side by side in the gap area Q1 between the first liquid cooling plate 10 and the second liquid cooling plate 20, and the first liquid separation joint 32 of the liquid separator 30 and the first liquid collection joint 42 of the liquid collector 40 are also arranged side by side, in the direction from the first liquid cooling plate 10 to the second liquid cooling plate 20, the first liquid separation joint 32 of the liquid separator 30 and the first liquid collection joint 42 of the liquid collector 40 will have a certain overlapping part. This arrangement can easily cause the first liquid separation joint 32 of the liquid separator 30 and the first liquid collection joint 42 of the liquid collector 40 to cause entanglement, knotting and other inconvenient operations when connected to the pipeline. By making the port directions of the two connectors in the first liquid separation connector 32 of the liquid distributor 30 and the first liquid collection connector 42 of the liquid collector 40 inconsistent, the pipeline connected to the first liquid separation connector 32 of the liquid distributor 30 and the pipeline connected to the first liquid collection connector 42 of the liquid collector 40 are less likely to interfere with each other, and can be connected to each other independently, with better reliability.

[0153] 3 , the port orientation of the second liquid-dividing joint 33 is tilted relative to the port orientation of the second liquid-collecting joint 43. For example, in the second liquid-dividing joint 33 and the second liquid-dividing joint 33 , the port orientation of one joint is parallel to the X direction, and the port orientation of the other joint is tilted relative to the X direction.

[0154] It can be understood that since the liquid separation body 31 of the liquid separator 30 and the liquid collection body 41 of the liquid collector 40 are arranged side by side in the gap area Q1 between the first liquid cooling plate 10 and the second liquid cooling plate 20, and the second liquid separation joint 33 of the liquid separator 30 and the second liquid collecting joint 43 of the liquid collector 40 are also arranged side by side, in the direction from the first liquid cooling plate 10 to the second liquid cooling plate 20, the second liquid separation joint 33 of the liquid separator 30 and the second liquid collecting joint 43 of the liquid collector 40 will have a certain overlapping part. This arrangement can easily cause the second liquid separation joint 33 of the liquid separator 30 and the second liquid collecting joint 43 of the liquid collector 40 to cause entanglement, knotting and other inconvenient operations when connected to the pipeline. By making the port directions of the two connectors in the second liquid separation connector 33 of the liquid distributor 30 and the second liquid collection connector 43 of the liquid collector 40 inconsistent, the pipeline connected to the second liquid separation connector 33 of the liquid distributor 30 and the pipeline connected to the second liquid collection connector 43 of the liquid collector 40 are less likely to interfere with each other, and can be connected to each other independently, with better reliability.

[0155] For example, the number of the first liquid cooling plate 10 and the second liquid cooling plate 20 can both be two, and the two first liquid cooling plates 10 are arranged at intervals along the Y direction on the left side of the liquid separator 30, and the two second liquid cooling plates 20 are arranged at intervals along the Y direction on the right side of the liquid collector 40. The number of the first liquid separation joints 32 and the second liquid separation joints 33 can both be two, and the two first liquid separation joints 32 and the two second liquid separation joints 33 can be arranged alternately in the order of one first liquid separation joint 32 and one second liquid separation joint 33. Each first liquid separation joint 32 is used to communicate with the first liquid inlet joint 12 of a first liquid cooling plate 10, and each second liquid separation joint 33 is used to communicate with the second liquid inlet joint 22 of a second liquid cooling plate 20. However, in other embodiments, the correspondence between the first liquid separation joint 32 and the first liquid inlet joint 12 and / or the second liquid separation joint 33 and the second liquid inlet joint 22 may not be one-to-one, but one-to-many. For example, the first liquid-dividing joint 32 may be directly connected to the first liquid inlet joint 12 of only one first liquid-cooling plate 10, while the first liquid inlet joints 12 of two adjacent first liquid-cooling plates 10 may be indirectly connected via an adapter joint. The second liquid-dividing joint 33 may be directly connected to the second liquid inlet joint 22 of only one second liquid-cooling plate 20, while the second liquid inlet joints 22 of two adjacent second liquid-cooling plates 20 may be indirectly connected via an adapter joint.

[0156] The number of the first liquid collecting joints 42 and the second liquid collecting joints 43 can both be two, and the two first liquid collecting joints 42 and the second liquid collecting joints 43 can be arranged alternately in the order of one first liquid collecting joint 42 and one second liquid collecting joint 43. Each first liquid collecting joint 42 is used to communicate with the first liquid outlet joint 13 of a first liquid cooling plate 10, and each second liquid collecting joint 43 is used to communicate with the second liquid outlet joint 23 of a second liquid cooling plate 20. However, in other embodiments, the correspondence between the first liquid collecting joint 42 and the first liquid outlet joint 13 and / or the second liquid collecting joint 43 and the second liquid outlet joint 23 may not be one-to-one, but one-to-many. For example, the first liquid collecting joint 42 can be directly connected to the first liquid outlet joint 13 of only one first liquid cooling plate 10, while the first liquid outlet joints 13 of two adjacent first liquid cooling plates 10 can be indirectly connected through a adapter joint. The second liquid collecting joint 43 may be directly connected to the second liquid outlet joint 23 of only one second liquid cooling plate 20 , while the second liquid outlet joints 23 of two adjacent second liquid cooling plates 20 may be indirectly connected via a transfer joint.

[0157] Second embodiment:

[0158] Please refer to Figures 5, 6 and 7 in combination. Figure 5 is a structural schematic diagram of the heat dissipation system 100 provided in the second embodiment of the present application. Figure 6 is a structural schematic diagram of the first liquid cooling plate 10 and the second liquid cooling plate 20 of the heat dissipation system 100 shown in Figure 5 at one angle. Figure 7 is a structural schematic diagram of the first liquid cooling plate 10 and the second liquid cooling plate 20 of the heat dissipation system 100 shown in Figure 5 at another angle.

[0159] In this embodiment, the contents identical to those in the first embodiment are not repeated here. The contents described in this embodiment below are applicable to the first embodiment unless they conflict. Unlike the first embodiment, the liquid separator 30 and the liquid collector 40 are stacked within the gap region Q1 between the first and second liquid cooling plates 10 and 20. Specifically, the liquid separator body 31 of the liquid separator 30 and the liquid collector body 41 of the liquid collector 40 are spaced apart in a direction perpendicular to the first and second liquid cooling plates 10 and 20 (i.e., the Z direction).

[0160] It is understood that by stacking the liquid-distributing body 31 of the liquid distributor 30 and the liquid-collecting body 41 of the liquid collector 40 in the vertical direction, the vertical space of the heat dissipation system 100 can be fully utilized, and the horizontal surface area of ​​the main board 230 occupied by the liquid-distributing body 31 of the liquid distributor 30 and the liquid-collecting body 41 of the liquid collector 40 can be greatly reduced. This surface area can be used to layout more components, thereby increasing the component arrangement density of the main board 230. On the other hand, because the liquid separator 30 and the liquid collector 40 are stacked within the gap region Q1 between the first and second liquid cooling plates 10, 20, there is no overlap between the liquid separator 30 and the liquid collector 40 in a horizontal direction parallel to the first and second liquid cooling plates 10, 20. This allows both the liquid separator 30 and the liquid collector 40 to be positioned in the intermediate region between the liquid separator 30 and the liquid collector 40. This further reduces the difference in the liquid supply distance between the liquid separator 30 and the first and second liquid cooling plates 10, respectively, and thus minimizes the pressure drop and improves heat dissipation consistency between the liquid separator 30 and the first and second liquid cooling plates 10, 20. Furthermore, the difference in the return distance between the liquid collector 40 and the first and second liquid cooling plates 10, respectively, and thus minimizes the pressure drop and improves heat dissipation consistency between the liquid collector 40 and the first and second liquid cooling plates 20.

[0161] Please refer to Figures 8, 9, and 10 in conjunction. Figure 8 is a schematic structural diagram of the liquid separator 30 and the liquid collector 40 of the heat dissipation system 100 shown in Figure 5 at an angle, Figure 9 is a schematic structural diagram of the liquid separator 30 of the heat dissipation system 100 shown in Figure 5, and Figure 10 is a schematic structural diagram of the liquid collector 40 of the heat dissipation system 100 shown in Figure 5. In this embodiment, the first liquid separation joint 32 of the liquid separator 30, the second liquid separation joint 33 of the liquid separator 30, the first liquid collection joint 42 of the liquid collector 40, and the second liquid collection joint 43 of the liquid collector 40 can all be located within the gap region Q2 between the liquid separation body 31 of the liquid separator 30 and the liquid collection body 41 of the liquid collector 40.

[0162] It can be understood that since there is a height difference between the liquid separation body 31 of the liquid separator 30 and the liquid collection body 41 of the liquid collector 40, this height difference can be used to install the various joints of the liquid separator 30 and the various joints of the liquid collector 40, thereby effectively improving the space utilization rate within the heat dissipation system 100.

[0163] In a possible application scenario, please refer to Figure 11, which is a structural diagram of the heat dissipation system 100 shown in Figure 5 at one angle. At least part of the projection of the liquid collecting body 41 along the Z direction falls within the range of the liquid separating body 31. Under this setting, the liquid collector 40 and the liquid separator 30 can achieve an upper and lower layout with overlapping positions in the vertical direction, which is beneficial to further reduce the lateral space occupied by the heat dissipation system 100. The first liquid separation joint 32 of the liquid separator 30, the second liquid separation joint 33 of the liquid separator 30, the first liquid collecting joint 42 of the liquid collector 40 and the second liquid collecting joint 43 of the liquid collector 40 are arranged in sequence along the Y direction, so that the various joints of the liquid separator 30 and the various joints of the liquid collector 40 can be staggered in the gap area Q2 between the liquid separating body 31 of the liquid separator 30 and the liquid collecting body 41 of the liquid collector 40, which is beneficial to improve the rationality of the layout of each joint.

[0164] For example, in this application scenario, the number of the first liquid-distributing joint 32, the second liquid-distributing joint 33, the first liquid-collecting joint 42, and the second liquid-collecting joint 43 can all be two. The multiple joints can be arranged alternately in the order of one first liquid-distributing joint 32, one second liquid-distributing joint 33, one first liquid-collecting joint 42, and one second liquid-collecting joint 43.

[0165] In this application scenario, the extension direction of the first liquid supply branch pipe 51, connected between the first liquid inlet connector 12 of the first liquid cooling plate 10 and the first liquid distribution connector 32 of the liquid collector 40, intersects with the extension direction of the first liquid return branch pipe 61, connected between the first liquid outlet connector 13 of the first liquid cooling plate 10 and the first liquid collection connector 42 of the liquid collector 40. For example, the extension direction of the first liquid supply branch pipe 51 can be parallel to the X-direction, and the extension direction of the first liquid return branch pipe 61 can be inclined with respect to both the X-direction and the Y-direction.

[0166] It is understood that since the first liquid supply branch 51 is connected to the first liquid cooling plate 10 and is used to realize liquid inflow to the first liquid cooling plate 10, and the first liquid return branch 61 is connected to the first liquid cooling plate 10 and is used to realize liquid outflow from the first liquid cooling plate 10, and the extension directions of the first liquid supply branch 51 and the second liquid supply branch 52 intersect, it is possible to maximize the connection between the first liquid supply branch 51 and the first liquid return branch 61 by changing the extension paths of the first liquid supply branch 51 and the first liquid return branch 61 without changing the positions of the respective joints. This helps to reduce the length of the pipelines connected to the same first liquid cooling plate 10 and realizing liquid inflow and outflow from the first liquid cooling plate 10, thereby improving the heat dissipation efficiency of the heat dissipation system 100.

[0167] The extension direction of the second liquid supply branch pipe 52, connected between the second liquid inlet connector 22 of the second liquid cooling plate 20 and the second liquid dispensing connector 33 of the liquid distributor 30, intersects the extension direction of the second liquid return branch pipe 62, connected between the second liquid outlet connector 23 of the second liquid cooling plate 20 and the second liquid collection connector 43 of the liquid collection unit 40. For example, the extension direction of the second liquid supply branch pipe 52 can be parallel to the X-direction, and the extension direction of the second liquid return branch pipe 62 can be inclined with respect to both the X-direction and the Y-direction.

[0168] It is understood that since the second liquid supply branch 52 is connected to the second liquid cooling plate 20 and is used to realize liquid inflow to the second liquid cooling plate 20, and the second liquid return branch 62 is connected to the second liquid cooling plate 20 and is used to realize liquid outflow from the second liquid cooling plate 20, and the extension directions of the second liquid supply branch 52 and the second liquid return branch 52 intersect, it is possible to maximize the connection between the second liquid supply branch 52 and the second liquid return branch 62 by changing the extension paths of the second liquid supply branch 52 and the second liquid return branch 62 without changing the positions of the respective joints. This helps to reduce the length of the pipelines connected to the same second liquid cooling plate 20 and realizing liquid inflow and outflow from the second liquid cooling plate 20, thereby improving the heat dissipation efficiency of the heat dissipation system 100.

[0169] In a possible embodiment, please refer to Figure 12, which is a structural schematic diagram of a partial structure of the heat dissipation system 100 shown in Figure 5 at one angle. The heat dissipation system 100 may also include a plurality of connectors 90. The plurality of connectors 90 can be used for three different purposes. A connector 90 can be connected between two adjacent first liquid cooling plates 10 to fix the two adjacent first liquid cooling plates 10 so that the relative position between the two adjacent first liquid cooling plates 10 can be relatively stable and not easily changed. A connector 90 can be connected between two adjacent second liquid cooling plates 20 to fix the two adjacent second liquid cooling plates 20 so that the relative position between the two adjacent second liquid cooling plates 20 can be relatively stable and not easily changed. A connector 90 can be connected between adjacent first liquid cooling plates 10 and second liquid cooling plates 20 to fix two or four adjacent first liquid cooling plates 10 and second liquid cooling plates 20.

[0170] For example, as shown in FIG12 , there may be two first liquid cooling plates 10, with the two first liquid cooling plates 10 spaced apart along the Y direction. There may be two second liquid cooling plates 20, with the two second liquid cooling plates 20 spaced apart along the Y direction. Each first liquid cooling plate 10 is spaced apart from a second liquid cooling plate 20 along the X direction. There may be five connectors 90, with one connector 90 connected between two first liquid cooling plates 10, one connector 90 connected between two second liquid cooling plates 20, one connector 90 connected between an adjacent first liquid cooling plate 10 and a second liquid cooling plate 20, one connector 90 connected between another adjacent first liquid cooling plate 10 and another adjacent second liquid cooling plate 20, and one connector 90 connected between two adjacent first liquid cooling plates 10 and two second liquid cooling plates 20.

[0171] The above is a detailed introduction to the embodiments of the present application. Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method and core idea of ​​the present application. At the same time, for those skilled in the art, according to the idea of ​​the present application, there may be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as a limitation on the present application.

Claims

1. A heat dissipation system, characterized in that: The heat dissipation system comprises: a first liquid cooling plate and a second liquid cooling plate, wherein the first liquid cooling plate and the second liquid cooling plate are spaced apart and are used to contact different heat generating devices; a liquid separator and a liquid collector, wherein the liquid separator and the liquid collector are both located between the first liquid cooling plate and the second liquid cooling plate; a liquid supply pipeline connected between the liquid separator and the first liquid cooling plate, and between the liquid separator and the second liquid cooling plate, for delivering the cooling medium in the liquid separator to the first liquid cooling plate and the second liquid cooling plate; and A liquid return pipeline is connected between the liquid collector and the first liquid cooling plate, and between the liquid collector and the second liquid cooling plate, and is used to recover the cooling medium in the first liquid cooling plate and the second liquid cooling plate to the liquid collector.

2. The heat dissipation system according to claim 1, wherein: The liquid separator includes a liquid separator body, a first liquid separator joint, and a second liquid separator joint. The first liquid separator joint and the second liquid separator joint are connected to the liquid separator body at intervals. The first liquid separator joint is connected to the first liquid cooling plate through the liquid supply pipeline, and the second liquid separator joint is connected to the second liquid cooling plate through the liquid supply pipeline. The liquid collector includes a liquid collecting body, a first liquid collecting joint and a second liquid collecting joint. The first liquid collecting joint and the second liquid collecting joint are connected to the liquid collecting body at intervals. The first liquid collecting joint is connected to the first liquid cooling plate through the return liquid pipeline, and the second liquid collecting joint is connected to the second liquid cooling plate through the return liquid pipeline.

3. The heat dissipation system according to claim 2, wherein: The port of the first liquid separation joint and the port of the first liquid collection joint are both oriented toward the first liquid cooling plate, and the port of the second liquid separation joint and the port of the second liquid collection joint are both oriented toward the second liquid cooling plate.

4. The heat dissipation system according to claim 2 or 3, characterized in that: At least one of the first liquid-distributing joint and the second liquid-distributing joint is rotatable relative to the liquid-distributing body, and / or at least one of the first liquid-collecting joint and the second liquid-collecting joint is rotatable relative to the liquid-collecting body.

5. The heat dissipation system according to any one of claims 2 to 4, characterized in that: In a direction from the first liquid cooling plate to the second liquid cooling plate, the liquid separation body and the liquid collection body are arranged side by side.

6. The heat dissipation system according to any one of claims 2 to 4, characterized in that: The liquid separation body and the liquid collection body are spaced apart in a direction perpendicular to the first liquid cooling plate and the second liquid cooling plate.

7. The heat dissipation system according to claim 6, wherein: The first liquid-separating joint, the second liquid-separating joint, the first liquid-collecting joint, and the second liquid-collecting joint are all located in a gap area between the liquid-separating body and the liquid-collecting body.

8. The heat dissipation system according to claim 7, wherein: At least part of the projection of the liquid collecting body along the height direction of the heat dissipation system falls within the range of the liquid separation body, and the first liquid separation joint, the second liquid separation joint, the first liquid collecting joint and the second liquid collecting joint are arranged in sequence along the width direction of the heat dissipation system.

9. The heat dissipation system according to any one of claims 2 to 8, wherein: The port of the first liquid-distributing joint is tilted relative to the port of the first liquid-collecting joint; The port direction of the second liquid-distributing joint is inclined with the port direction of the second liquid-collecting joint.

10. An electronic device, characterized in that: The electronic device includes a chassis, multiple heating devices and a cooling system according to any one of claims 1 to 9, the multiple heating devices are located in the chassis, the cooling system is located in the chassis, and the first liquid cooling plate and the second liquid cooling plate of the cooling system are respectively in contact with different heating devices among the multiple heating devices.

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