Thermal pad and electronic device

Abstract

A thermal pad and an electronic device. The thermal pad comprises a thermally conductive pad and a protective layer. The protective layer is connected to the side surface of the thermally conductive pad, and hollowed-out portions are provided in the protective layer. In the present application, the protective layer is only connected to the side surface of the thermally conductive pad, so that complete packaging of the side surface of the thermally conductive pad can be achieved, and the edge structure of the thermally conductive pad is reinforced, effectively preventing debris from detaching at the edge positions of the thermally conductive pad; and the heat dissipation area on the thermally conductive pad would not be reduced, facilitating the thermally conductive pad achieving a normal heat dissipation effect. In addition, by providing the hollowed-out portions in the protective layer, the protective layer can achieve good compressibility and resilience, and have low compressive stress; and under the condition that 50% of compressive strain is generated on the protective layer, the corresponding compressive stress is not greater than 40 psi, and the thermal resistance can reach 0.080℃*cm2 / W or below, facilitating reducing thermal resistance, and improving the heat dissipation efficiency.

Description

Thermal pads and electronic equipment

[0001] This invention claims priority to a Chinese patent application filed with the State Intellectual Property Office on March 26, 2024, with application number 202420609397.3 and application name “Thermal Gasket and Electronic Device,” the entire contents of which are incorporated herein by reference. Technical Field

[0002] The present application relates to the field of heat dissipation technology, and in particular to a thermally conductive gasket and an electronic device. Background Art

[0003] High-heat-generating components like chips typically require thermal pads for heat dissipation. Thermal pads are inherently brittle, and cutting can result in looser edges. When the pad is under pressure and used for extended periods, debris can fall from its edges, causing short circuits on the circuit board.

[0004] In the existing technology, solid glue is generally coated on the edge of the thermal pad. The glue will have a certain extension on the upper and lower surfaces of the thermal pad, resulting in a reduction in the heat dissipation area of ​​the thermal pad. In addition, the glue after molding and curing has a high compression modulus, poor compressibility, and large rebound force, which is not suitable for low-stress scenarios. Summary of the Invention

[0005] In view of this, the present application provides a thermally conductive gasket and an electronic device to solve the problem in the above-mentioned prior art that when solid glue is used to encapsulate the edge of the thermally conductive gasket, the glue will have a certain extension on the upper and lower surfaces of the thermal pad, resulting in a reduction in the heat dissipation area of ​​the thermal pad, and the glue after molding and curing has a high compression modulus, poor compressibility, and a large rebound force, making it unsuitable for low-stress scenarios.

[0006] In a first aspect, the present application provides a thermally conductive gasket, comprising: a thermally conductive pad and a protective layer. The protective layer is connected to a side surface of the thermally conductive pad, and a hollow portion is provided in the protective layer.

[0007] In this application, the protective layer can be connected to the side surface of the thermal pad, so as to achieve a complete encapsulation of the side surface of the thermal pad, reinforce the edge structure of the thermal pad, and effectively avoid the falling of debris at the edge position of the thermal pad. Among them, the protective layer is only provided on the side surface of the thermal pad, and will not be provided on the upper and lower surfaces of the thermal pad, so that it will not block the upper and lower surfaces of the thermal pad and reduce the heat dissipation area on the thermal pad, which is beneficial to the thermal pad to exert its normal heat dissipation effect. In addition, by providing a hollow portion in the protective layer, the protective layer can obtain good compressibility and resilience, and the compression stress is very low. When the protective layer generates a 50% compressive strain, the corresponding compression stress is not greater than 40 psi, and the thermal resistance can reach below 0.080 °C*cm2 / W. That is to say, when the thermal pad is pressed against a high-heat-generating device such as a chip by an external pressure, the protective layer only needs a small compression stress to generate a large elastic deformation, which is beneficial to achieving that under the condition of applying a small external pressure to the thermal pad, the protective layer will not generate a large elastic resistance, so as to ensure the reliable fitting of the thermal pad and the high-heat-generating device such as the chip, maximize the fitting area, and at the same time is beneficial to reducing the thermal resistance and improving the heat dissipation efficiency.

[0008] In a possible design, the protective layer is a closed ring, and the protective layer is connected to the side surface of the thermal pad along the circumferential direction of the thermal pad. Thus, the protective layer can completely cover and encapsulate all the side surfaces of the thermal pad in the circumferential direction, so as to effectively avoid the falling of debris at the edge of the thermal pad.

[0009] In a possible design, the shape of the protective layer is a circular ring or a square ring, and the shape of the protective layer can match the contour shape of the heat-generating device. Exemplarily, when the shape of the thermal pad is square, the shape of the protective layer is a square ring, specifically it can be a "square" shape. Exemplarily, when the shape of the thermal pad is circular, the shape of the protective layer is a circular ring. Thus, by making the shapes of the protective layer and the thermal pad match, it can be realized that all positions on the side surface of the thermal pad are reliably encapsulated and covered by the protective layer.

[0010] In a possible design, the hollow portion is provided inside the protective layer, and the hollow portion includes closed bubbles. Among them, by forming bubbles in the protective layer, it is beneficial to make the protective layer generate a large deformation under a small compression stress, so as to be beneficial to the reliable fitting of the thermal pad and the high-heat-generating device such as the chip in the scenario of low compression stress and ensure efficient heat dissipation.

[0011] In a possible design, the inner diameter of the hollow portion is between 5 and 500 μm, so that the protective layer can generate a large deformation under a small compression stress, which is beneficial to the reliable fitting of the thermal pad and the high-heat-generating device such as the chip in the scenario of low compression stress and ensure efficient heat dissipation.

[0012] In one possible design, the hollow portion includes a through hole and / or a blind hole. The through hole and the blind hole can be understood as the aforementioned hollow portion. The centerline direction of the through hole and the blind hole can be in any direction, and multiple through holes or blind holes can be provided, so that the foam can be compressed more easily. That is to say, by forming through holes or blind holes in the protective layer, it is beneficial for the protective layer to produce a larger deformation under a smaller compressive stress, which is beneficial for the thermal pad to be able to reliably fit with high-heat-generating devices such as chips under low compressive stress scenarios, thereby ensuring efficient heat dissipation.

[0013] In one possible design, the inner diameter of the through hole or the blind hole is between 5 and 500 μm, so that the protective layer can produce a larger deformation under a smaller compressive stress, which is conducive to the thermal pad being able to reliably fit with high-heat-generating devices such as chips under low compressive stress scenarios, thereby ensuring efficient heat dissipation.

[0014] In one possible design, the thickness of the protective layer is greater than or equal to the thickness of the thermal pad, thereby ensuring that the protective layer completely covers the side of the thermal pad and effectively preventing debris from falling from the edge of the thermal pad.

[0015] In one possible design, the upper surface of the protective layer is flush with the upper surface of the thermal pad. When external pressure is applied to the thermal pad, the protective layer and the thermal pad can be deformed at the same time, which can ensure that the thermal pad and the protective layer are subjected to balanced pressure at the same time, which is conducive to the reliable fitting of the thermal pad and high-heat-generating devices such as chips, thereby improving the thermal conductivity effect.

[0016] In one possible design, the width of the protective layer is between 30 and 1000 μm. Within this width range, the protective layer can be prevented from occupying too much space, which helps improve space utilization. At the same time, it can ensure a reliable bond between the protective layer and the thermal pad, and is also suitable for low compressive stress scenarios.

[0017] In one possible design, the protective layer includes a foam layer and an adhesive layer, and the foam layer is connected to the side of the thermal pad through the adhesive layer. The foam layer can be a separately processed part, and the adhesive layer is sticky. The adhesive layer can be used to connect and fix the foam layer to the thermal pad, which is convenient for operation. For example, the adhesive layer can be a double-sided tape or adhesive, which can ensure a reliable connection between the foam layer and the thermal pad and enhance the reinforcement effect of the structure at the edge of the thermal pad. The foam layer can be provided with through holes or blind holes. The through holes and blind holes can be understood as the aforementioned hollow parts. The centerline direction of the through holes and blind holes can be in any direction, and multiple through holes or blind holes can be provided, so that the foam can be compressed more easily. That is to say, by forming through holes or blind holes in the protective layer, it is beneficial for the protective layer to produce larger deformation under smaller compressive stress, which is beneficial for the thermal pad to be able to reliably fit with high-heat-generating devices such as chips under low compressive stress scenarios, ensuring efficient heat dissipation.

[0018] In a possible design, the bonding layer is a double-sided tape or adhesive, thereby ensuring a reliable connection between the foam layer and the thermal pad and improving the reinforcement effect of the structure at the edge of the thermal pad.

[0019] In one possible design, the foam layer is made of one of polyurethane, polyolefin, low-density polyethylene, ethylene-vinyl acetate copolymer, and synthetic rubber. A foam layer made of these materials can achieve excellent compressibility and resilience, facilitating greater deformation of the protective layer under relatively low compressive stress. This allows the thermal pad to reliably adhere to high-heat-generating devices such as chips under low compressive stress, ensuring efficient heat dissipation.

[0020] In one possible design, the material of the protective layer is one of silicone, polyurethane, acrylic resin, and polyolefin elastomer.

[0021] In a possible design, the material of the protective layer is an adhesive, the viscosity of the adhesive is 8000-150000 mPa*s, and the thixotropic index is greater than 1.5.

[0022] In one possible design, the thermal pad is made of one of carbon fiber, graphene, carbon nanotubes, and flaky silver. A protective layer made of these materials can reliably bond to the thermal pad and, at the same time, can form hollow portions within the protective layer, enabling a relatively small compressive stress to be applied to the protective layer to produce a relatively large deformation.

[0023] In one possible design, the thickness of the thermal pad is between 200 and 1500 μm. Within this range, the heat dissipation requirements of most high-heat-generating devices can be met while avoiding excessive space occupation, which is conducive to achieving a thin design.

[0024] In a second aspect, the present application further provides an electronic device comprising a high-heat-generating device and the thermally conductive gasket provided in the first aspect of the present application, wherein the thermally conductive gasket is connected to the high-heat-generating device. The electronic device comprising the thermally conductive gasket provided in the first aspect of the present application has similar technical effects as the aforementioned thermally conductive gasket, and will not be further described here.

[0025] It should be understood that the foregoing general description and the following detailed description are merely illustrative and are not restrictive of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0027] FIG1 is a top view of a thermally conductive gasket provided in an embodiment of the present application;

[0028] FIG2 is a side view of a thermally conductive gasket provided in one embodiment of the present application;

[0029] FIG3 is a schematic diagram of the present application using a dispensing tool to dispense glue on the side of the thermal pad;

[0030] FIG4 is a scanned image of the protective layer provided in an embodiment of the present application;

[0031] FIG5 is a side view of a thermally conductive pad provided in another embodiment of the present application;

[0032] FIG6 is a side view of a thermally conductive gasket provided in yet another embodiment of the present application;

[0033] FIG7 is a side view of a thermally conductive gasket provided in yet another embodiment of the present application.

[0034] Reference numerals: 1-thermal pad; 11-upper surface; 2-protective layer; 21-hollow portion; 22-protruding portion; 23-foam layer; 24-adhesive layer; 3-glue dispensing tool; 4-platform; Z-thickness direction. DETAILED DESCRIPTION

[0035] In order to better understand the technical solution of the present application, the embodiments of the present application are described in detail below with reference to the accompanying drawings.

[0036] It should be clear that the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0037] The terms used in the embodiments of the present application are for the purpose of describing specific embodiments only and are not intended to limit the present application. The singular forms "a", "an", "the" and "the" used in the embodiments of the present application and the appended claims are also intended to include plural forms unless the context clearly indicates otherwise.

[0038] It should be understood that the term "and / or" as used herein simply describes a relationship between associated objects, indicating that three possible relationships exist. For example, "A and / or B" can represent: A alone, A and B together, or B alone. Furthermore, the character " / " in this document generally indicates an "or" relationship between the associated objects.

[0039] In the description of this application, unless otherwise specified or limited, the terms "first" and "second" are used for descriptive purposes only and are not to be understood as indicating or implying relative importance; unless otherwise specified or explained, the term "plurality" refers to two or more; the terms "connected" and "fixed" should be understood in a broad sense. For example, "connected" can mean a fixed connection, a detachable connection, an integral connection, or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium. For those skilled in the art, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0040] Electronic devices often contain high-heat generating components such as chips, which typically require heat dissipation through thermal pads. Thermal pads are inherently brittle, and cutting can result in loose edges. Over time, pressure and long-term use can cause debris to fall from the edges, potentially causing short circuits on the circuit board.

[0041] In the prior art, solid glue is generally applied to the edge of the thermal pad. The glue will extend to a certain extent on both the upper and lower surfaces of the thermal pad, resulting in a reduction in the heat dissipation area of ​​the thermal pad and reduced heat dissipation efficiency. In addition, the compression modulus of the glue after molding and curing is high. The solid structure formed by the curing of the glue has a compressive stress of up to 95psi at 50% compression strain. It has poor compressibility and a large rebound force, making it difficult to ensure reliable contact between the thermal pad and high-heat-generating devices such as chips. In addition, this solid structure formed by the curing of the glue will also cause a large thermal resistance. The thermal resistance of the overall structure of the thermal pad with solid glue is as high as 0.102℃*cm 2 / W, therefore, this thermal pad coated with solid glue is not suitable for low stress scenarios.

[0042] The embodiments of the present application provide a thermally conductive gasket that can be used in electronic devices. The electronic devices can be provided with high-heat-generating devices such as chips. The thermally conductive gasket can be attached to the high-heat-generating devices to achieve heat dissipation for the high-heat-generating devices. The electronic devices can be mobile phones, computers, mobile internet devices (MIDs), wearable devices, virtual reality (VR) devices, augmented reality (AR) devices, robotic arms, cameras, robots, or smart home devices (such as TVs, air conditioners, sweepers, speakers, set-top boxes), relays, customer premise equipment (CPE), etc. The embodiments of the present application do not limit the specific technology and specific device form used by the electronic devices.

[0043] Figure 1 is a schematic structural diagram of a thermal pad provided in an embodiment of the present application. Referring to Figure 1 , the thermal pad may include a thermal pad 1 and a protective layer 2, wherein the thermal pad 1 includes an upper surface 11, a lower surface and a side surface, the upper surface 11 and the lower surface are surfaces on both sides of the thermal pad 1 in the thickness direction Z, and the side surface is a surface on the thermal pad 1 perpendicular to the thickness direction Z. The lower surface of the thermal pad 1 is used to contact high-heat-generating devices such as chips, and the heat generated by the high-heat-generating devices can be conducted to the air through heat conductors to achieve heat dissipation. The protective layer 2 can be connected to the side of the thermal pad 1, specifically, it can be bonded to the side of the thermal pad 1 by bonding, so as to achieve complete encapsulation of the side of the thermal pad 1, achieve reinforcement of the edge structure of the thermal pad 1, and effectively prevent debris from falling from the edge of the thermal pad 1. Among them, the protective layer 2 is only arranged on the side of the thermal pad 1, and is not arranged on the upper surface 11 and the lower surface of the thermal pad 1. Therefore, it will not block the upper surface 11 and the lower surface of the thermal pad 1 and reduce the heat dissipation area on the thermal pad 1, which is conducive to the thermal pad 1 to exert a normal heat dissipation effect.

[0044] In this embodiment, referring to FIG1 , the protective layer 2 may be provided with a hollow portion 21, which may be filled with air and is not a solid structure. The protective layer 2 may have multiple such hollow portions 21, and the protective layer 2 may have excellent compressibility and resilience, with very low compressive stress. When the protective layer 2 generates a 50% compressive strain, the corresponding compressive stress is no more than 40 psi, and the thermal resistance may be less than 0.080°C*cm2 / W. In other words, when the thermal pad is pressed against a high-heat-generating device such as a chip by external pressure, the protective layer 2 only requires a small compressive stress to generate a large elastic deformation. This facilitates the protection layer 2 not generating a large elastic resistance when a small external pressure is applied to the thermal pad, thereby ensuring that the thermal pad 1 is reliably bonded to a high-heat-generating device such as a chip, maximizing the bonding area, and at the same time helping to reduce thermal resistance and improve heat dissipation efficiency.

[0045] In one implementation, referring to Figure 1 , the protective layer 2 can be in a closed annular shape, circumferentially surrounding the thermal pad 1 and connected to the side surfaces of the thermal pad 1. In other words, the protective layer 2 can completely cover and encapsulate all circumferential sides of the thermal pad 1, thereby effectively preventing debris from falling from the edges of the thermal pad 1.

[0046] Among them, the shape of the protective layer 2 can be a circular ring or a square ring, and the shape of the protective layer 2 can match the contour shape of the heating device. For example, when the shape of the thermal pad 1 is square (refer to Figure 1), the shape of the protective layer 2 is a square ring, specifically a "mouth" shape. For example, when the shape of the thermal pad 1 is circular, the shape of the protective layer 2 is a circular ring. Therefore, by matching the shapes of the protective layer 2 and the thermal pad 1, it is possible to reliably encapsulate and cover various positions on the side of the thermal pad 1 through the protective layer 2.

[0047] In one implementation, the width of the protective layer 2 can be between 30 and 1000 μm. The width of the protective layer 2 refers to its dimension perpendicular to the thickness direction Z of the thermal pad. Within this width range, the protective layer 2 can be prevented from occupying too much space, which helps improve space utilization. At the same time, it can ensure reliable bonding between the protective layer 2 and the thermal pad 1, and is also suitable for low compressive stress scenarios.

[0048] In one implementation, the thermal pad 1 can be made of conductive materials such as carbon fiber, graphene, carbon nanotubes, or silver flakes, resulting in a higher thermal conductivity and improved heat dissipation for high-heat-generating devices. Furthermore, in one embodiment, the thickness of the thermal pad 1 can be between 200 and 1500 μm. This range satisfies the heat dissipation requirements of most high-heat-generating devices while avoiding excessive space occupation and facilitating a thin design.

[0049] In one implementation, Figure 2 is a side view of a thermal pad provided by an embodiment of the present application. Referring to Figure 2, in the thickness direction Z perpendicular to the thermal pad, the protective layer 2 may have only one layer, that is, the protective layer 2 is a single-layer structure. The material of the protective layer 2 may be an adhesive, and may be formed by processes such as dispensing, silk screen printing, or spraying. For example, Figure 3 is a schematic diagram of the present application using a dispensing tool 3 to dispense glue on the side of the thermal pad 1. Referring to Figure 3, during the specific operation of the dispensing process, the thermal pad 1 may be pre-placed on a platform 4, which may be a structure such as a table or a stand. The platform 4 has a flat surface, and the thermal pad 1 may be placed flat on the plane. After the thermal pad 1 is placed, a dispensing tool 3 such as a dispensing tube may be used to dispense glue on the edge area of ​​the thermal pad 1. The dispensing tool 3 such as a dispensing tube may be installed on an automated device. The automated device may accurately identify the edge of the thermal pad 1 and generate a dispensing track, thereby enabling the glue to be accurately coated on the side of the thermal pad 1. The fluidity of the adhesive and the intermolecular adsorption forces allow the adhesive to coat the sides of the thermal pad 1. After the adhesive solidifies, the protective layer 2 formed by the adhesive can reliably bond to the thermal pad 1. The bonding force between the protective layer 2 and the thermal pad 1 can be greater than the cohesive force of the thermal pad 1, and the bonding strength between the protective layer 2 and the thermal pad 1 can be greater than or equal to 0.1 MPa. This effectively prevents debris from falling from the edge of the thermal pad 1, and helps to improve the overall tensile strength and crack resistance of the thermal pad 1. At the same time, because the protective layer 2 is not provided on the upper surface 11 of the thermal pad 1, the space occupied by the thermal pad in the thickness direction Z can be reduced, which is conducive to achieving a thin design.

[0050] In addition, solidifying the glue into the protective layer 2 and forming the hollow portion 21 in the protective layer 2 can be achieved by heating or the like. For example, 4 is a scan of the protective layer 2 provided in an embodiment of the present application. Referring to FIG4 , when the glue is foamed by heating or the like, a large number of closed bubbles can be formed in the glue. The bubbles can be understood as the aforementioned hollow portions 21, and the bubbles are filled with air. The bubbles can make the protective pad easier to compress. That is, by forming bubbles in the protective layer 2, it is beneficial for the protective layer 2 to produce a larger deformation under a smaller compressive stress, thereby facilitating the thermal pad 1 to reliably fit with high-heat-generating devices such as chips under low compressive stress scenarios, thereby ensuring efficient heat dissipation.

[0051] In one embodiment, the bubbles can be of regular shape, for example, the bubbles can be spherical or ellipsoidal. Of course, the bubbles can also be of irregular shape. The shape of the bubbles can be naturally formed during the foaming process of the glue, but the volume of the bubbles can be achieved by controlling the selection of adhesive materials, the process parameters of curing and foaming, etc. For example, the volume of the bubbles can be achieved by controlling the inner diameter of the bubbles. For example, the inner diameter of the bubbles can be controlled to be between 5 and 500 μm, so that the protective layer 2 can produce a larger deformation under a smaller compressive stress, which is beneficial for the thermal pad 1 to be able to reliably fit with high-heating devices such as chips under low compressive stress scenarios, thereby ensuring efficient heat dissipation.

[0052] In one implementation, as described above, the material of the protective layer 2 can be an adhesive, and the viscosity of the adhesive can be 8000 to 150000 mPa*s, and the thixotropic index can be greater than 1.5. Among them, the viscosity of the adhesive within the above range can ensure that the protective layer 2 formed by curing the adhesive can be reliably bonded and fixed to the thermal pad 1, and can effectively prevent debris from falling from the edge of the thermal pad 1. At the same time, by making the thixotropic index of the adhesive greater than 1.5, it can be ensured that the adhesive can have a certain three-dimensional shape when applied to the side of the thermal pad 1, reducing fluidity, and facilitating the curing of the adhesive into a protective layer 2 with a preset shape. For example, when the protective layer 2 is made of silicone foam, the viscosity of the silicone foam can be 150000 mPa*s, the thixotropic index can be 2.5, the maximum width of the adhesive after curing and foaming can reach about 150 μm, and the stress of the protective layer 2 at 50% compressive strain can be 20 psi.

[0053] In one implementation, the material of the protective layer 2 can be a combination of one or more of silicone, polyurethane, acrylic resin, and polyolefin elastomer. The protective layer 2 prepared from these materials can be reliably combined with the thermal pad 1. At the same time, a hollow portion 21 can be formed in the protective layer 2, which can achieve a larger deformation by applying a smaller compressive stress to the protective layer 2.

[0054] In one implementation, FIG5 is a side view of a thermal pad provided in another embodiment of the present application. Referring to FIG5 , the protective layer 2 may include a foam layer 23 and an adhesive layer 24, wherein the foam layer 23 is connected to the side of the thermal pad 1 via the adhesive layer 24. The foam layer 23 may be a separately processed part, and the adhesive layer 24 is sticky, and the foam layer 23 and the thermal pad 1 may be connected and fixed via the adhesive layer 24, facilitating operation. For example, the adhesive layer 24 may be a double-sided tape or adhesive, which can ensure a reliable connection between the foam layer 23 and the thermal pad 1 and enhance the structural reinforcement effect at the edge of the thermal pad 1.

[0055] Among them, the foam layer 23 can be provided with through holes or blind holes, and the through holes and blind holes can be understood as the aforementioned hollow part 21. The center line direction of the through holes and blind holes can be in any direction, and there can be multiple through holes or blind holes, so that the foam can be compressed more easily. That is to say, by forming through holes or blind holes in the protective layer 2, it is beneficial for the protective layer 2 to produce a larger deformation under a smaller compressive stress, which is beneficial for the thermal pad 1 to be able to reliably fit with high-heating devices such as chips under low compressive stress scenarios, thereby ensuring efficient heat dissipation.

[0056] In one embodiment, the foam layer 23 is made of one or more of polyurethane (PU), polyolefins (PO), expandable polyethylene (EPE), ethylene vinyl acetate copolymer (EVA), and synthetic rubber (EPDM). The foam layer 23 made of these materials can achieve excellent compressibility and resilience, which helps the protective layer 2 to deform significantly under relatively low compressive stress. This helps the thermal pad 1 to reliably adhere to high-heat-generating devices such as chips under low compressive stress, ensuring efficient heat dissipation.

[0057] In one implementation, the inner diameter of the through-holes or blind holes can be between 5 and 500 μm. This allows the protective layer 2 to deform significantly under relatively low compressive stress, facilitating reliable adhesion of the thermal pad 1 to high-heat-generating components such as chips under low compressive stress conditions, ensuring efficient heat dissipation. For example, the diameter of the through-holes or blind holes in the foam can be 100 μm, resulting in a stress of 25 psi under 50% compressive strain on the protective layer 2.

[0058] In one implementation, the thickness of the protective layer 2 may be greater than or equal to the thickness of the thermal pad 1 , thereby ensuring that the protective layer 2 completely covers the side of the thermal pad 1 and effectively preventing debris from falling from the edge of the thermal pad 1 .

[0059] In one implementation, referring to Figure 5, when the protective layer 2 includes a separately manufactured foam layer 23, the thickness of the foam layer 23 can be the same as the thickness of the thermal pad 1, that is, after the foam layer 23 is connected and fixed to the thermal pad 1 through the adhesive layer 24, the foam layer 23 is flush with the upper surface 11 of the thermal pad 1. In the process of applying pressure to the thermal pad through external pressure, the foam layer 23 and the thermal pad 1 can be compressed and deformed at the same time, which can ensure that the thermal pad 1 and the foam layer 23 are subjected to balanced pressure at the same time, which is conducive to the reliable fitting of the thermal pad 1 and high-heat-generating devices such as chips, thereby improving the thermal conductivity effect.

[0060] In one implementation, FIG6 is a side view of a thermal pad provided in another embodiment of the present application. Referring to FIG6 , when the protective layer 2 is a single-layer structure formed by curing an adhesive, for example, when applying the adhesive using a dispensing process, the adhesive can be made to completely cover the side surfaces of the thermal pad 1 by controlling process parameters such as the amount of adhesive dispensed per unit time by the dispensing tool 3 and the movement speed of the dispensing tool 3. However, since the dispensing tool 3 generally moves continuously during dispensing, affected by factors such as the movement speed and the viscosity of the adhesive, as the dispensing tool 3 moves from one dispensing position to the next, a portion of the adhesive at the dispensing outlet of the dispensing tool 3 may be pulled, resulting in a protrusion 22 at the top of the adhesive at a given dispensing position. The width of the protrusion 22 gradually decreases from the bottom surface to the top surface 11 of the thermal pad 1. The protrusion 22 may protrude beyond the top surface 11 of the thermal pad 1, and the protrusion 22 does not contact the side surfaces of the thermal pad 1 or extend to the top surface 11 of the thermal pad 1. The height of the protrusion 22 can be the distance between the plane where the upper surface 11 of the thermal pad 1 is located and the end of the protrusion 22 away from the thermal pad 1. In order to avoid the protrusion 22 being squeezed to the upper surface 11 of the thermal pad 1 when subjected to external pressure, thereby reducing the heat dissipation area of ​​the thermal pad 1, the height H of the protrusion 22 can be less than or equal to 50 μm. The height H of the protrusion 22 can be controlled by controlling parameters such as the moving speed and output of the dispensing tool 3, and can also be comprehensively considered in combination with the viscosity and thixotropic index of the glue liquid.

[0061] As described above, with reference to Figures 2 and 6, the protective layer 2 connected to the side of the thermal pad 1 can have a uniform width. In addition, in some other embodiments, for different gluing processes, the protective layer 2 connected to the side of the thermal pad 1 can also have different widths in the thickness direction Z of the thermal pad 1. Figure 7 is a side view of a thermal gasket provided in another embodiment of the present application. Referring to Figure 7, the width of the protective layer 2 formed by curing the glue gradually decreases from bottom to top, so that the outer surface of the protective layer 2 away from the thermal pad 1 is formed into a slope. This shape of the protective layer 2 can also achieve reliable connection and fixation with the thermal pad 1, and is also suitable for scenarios where effective heat dissipation is performed under low compressive stress.

[0062] The above are merely preferred embodiments of the present application and are not intended to limit the present application. Those skilled in the art will readily appreciate that various modifications and variations are possible. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present application shall be included within the scope of protection of the present application.

Claims

1. A thermally conductive pad, characterized in that: include: Thermal pad; A protective layer is connected to the side of the thermal pad, and a hollow portion is provided in the protective layer.

2. The thermally conductive pad according to claim 1, wherein: The protective layer is in a closed ring shape and is connected to the side surface of the thermal pad along the circumference of the thermal pad.

3. The thermally conductive pad according to claim 2, wherein: The shape of the protective layer is circular or square.

4. The thermally conductive pad according to any one of claims 1 to 3, characterized in that: The hollow portion is arranged inside the protective layer, and the hollow portion includes closed bubbles.

5. The thermally conductive pad according to claim 4, wherein: The inner diameter of the hollow portion is between 5 μm and 500 μm.

6. The thermally conductive pad according to any one of claims 1 to 3, characterized in that: The hollow portion includes a through hole and / or a blind hole.

7. The thermally conductive pad according to claim 6, wherein: The inner diameter of the through hole or the blind hole is between 5 μm and 500 μm.

8. The thermally conductive pad according to claim 1, wherein: The thickness of the protective layer is greater than or equal to the thickness of the thermal pad.

9. The thermally conductive pad according to claim 1, wherein: The upper surface of the protective layer is flush with the upper surface of the thermal pad.

10. The thermally conductive pad according to claim 1, wherein: The width of the protective layer is between 30 and 1000 μm.

11. The thermally conductive pad according to any one of claims 1 to 10, characterized in that: The protective layer includes a foam layer and an adhesive layer, and the foam layer is connected to the side surface of the thermal pad through the adhesive layer.

12. The thermally conductive pad according to claim 11, wherein: The bonding layer is a double-sided tape or adhesive.

13. The thermally conductive pad according to claim 11, wherein: The material of the foam layer is one of polyurethane, polyolefin, low-density polyethylene, ethylene-vinyl acetate copolymer, and synthetic rubber material.

14. The thermally conductive pad according to any one of claims 1 to 10, characterized in that: The material of the protective layer is one of silicone, polyurethane, acrylic resin and polyolefin elastomer.

15. The thermally conductive pad according to claim 14, wherein: The material of the protective layer is an adhesive, the viscosity of the adhesive is 8000-150000 mPa*s, and the thixotropic index is greater than 1.

5.

16. The thermally conductive pad according to claim 1, wherein: The material of the thermal pad is one of carbon fiber, graphene, carbon nanotube, and flaky silver.

17. The thermally conductive pad according to claim 16, wherein: The thickness of the thermal pad is between 200 μm and 1500 μm.

18. An electronic device, characterized in that: The invention comprises a high-heat-generating device and the thermally conductive gasket according to any one of claims 1 to 17, wherein the thermally conductive gasket is connected to the high-heat-generating device.

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