Connector structure for substrate

Abstract

This connector structure for a substrate comprises a substrate (1) and a connector. The substrate (1) has: a cutout part (1a) that penetrates the substrate (1) in the plate thickness direction of the substrate (1); and a surface layer ground surface (1c). The connector has: a connector housing; a center conductor pin (2c) that protrudes from the connector housing toward the substrate (1) and is electrically connected to the substrate (1); and a shield part. The substrate (1) has a plurality of substrate-end through-holes (1i) that are provided to the inner wall of the cutout part (1a) and are disposed on both sides of a connection location between the center conductor pin (2c) and the substrate (1) in a direction orthogonal to the plate thickness direction. Each of the plurality of substrate-end through-holes (1i) includes a conductive film (1o) electrically connected to the surface layer ground surface (1c) and exposed to the cutout part (1a). A housing-side surface of the connector housing facing the inner wall of the cutout part (1a) and the conductive film (1o) of each of the substrate-end through-holes (1i) are electrically connected with a solder layer therebetween.

Description

PCB connector structure

[0001] The present disclosure relates to a board connector structure in which a connector is mounted on a board.

[0002] Conventionally, a board connector structure in which a connector is mounted on the outer peripheral edge (board edge) of a board has been known. For example, Patent Document 1 discloses a board connector structure in which a connector is disposed in a notch provided on the outer peripheral edge of the board. The notch penetrates the board in the thickness direction of the board. In the following description, the thickness direction of the board will be referred to as the board thickness direction. Furthermore, the depth direction and width direction of the notch when viewed along the board thickness direction will be referred to as the depth direction and width direction, respectively. The board thickness direction, depth direction, and width direction are directions perpendicular to each other.

[0003] The connector has a connector housing that forms the outer shell of the connector, a center conductor pin that protrudes from the connector housing toward the board, and a shield part that extends from the connector housing toward the board and covers the center conductor pin from one side in the board thickness direction. The shield part is electrically connected to a surface ground plane provided on the surface of the board.

[0004] In the circuit board connector structure disclosed in Patent Document 1, when an RF (Radio Frequency) signal is transmitted from the center conductor pin to the circuit board, the shielding portion can suppress leakage of the RF signal in one direction in the board thickness direction. Also, in the circuit board connector structure disclosed in Patent Document 1, the RF signal output from the center conductor pin is converted within the shielding portion into a mode that passes through a strip line provided within the circuit board, so that leakage of the RF signal transmitted from the center conductor pin to the circuit board outside the strip line can be suppressed.

[0005] U.S. Patent No. 7,042,318

[0006] However, in the connector structure for a board disclosed in Patent Document 1, the connector housing and the ground layer of the board are not electrically connected by the inner wall of the cutout portion, so when the RF signal is transmitted from the center conductor pin to the board, there is a problem in that the RF signal leaks in both the width direction and the other direction of the board thickness.

[0007] Furthermore, in the circuit board connector structure disclosed in Patent Document 1, when mounting the connector on the outer peripheral edge of the circuit board, unavoidable dimensional tolerances, assembly tolerances, etc. result in a gap between the connector housing and the circuit board (the inner wall of the cutout portion), which causes the problem of RF signals leaking through this gap.

[0008] The present disclosure has been made in view of the above, and has an object to provide a board connector structure that can suppress RF signal leakage more effectively than conventional connector structures.

[0009] To solve the above-mentioned problems and achieve the object, the board connector structure disclosed herein includes a board and a connector mounted on the board. The board has a cutout portion provided at the outer peripheral edge of the board and penetrating the board in the board thickness direction, and a surface ground surface provided on the surface of the board. The connector has a connector housing, a portion of which is disposed within the cutout portion, a center conductor pin protruding from the connector housing toward the board and electrically connected to the board, and a shield portion extending from the connector housing toward the board and covering the center conductor pin from one side in the board thickness direction. The board has multiple board end through holes provided on the inner wall of the cutout portion and arranged on both sides of the connection point between the center conductor pin and the board in a direction perpendicular to the board thickness direction. Each of the multiple board end through holes includes a conductive film electrically connected to the surface ground surface and exposed in the cutout portion. The side of the connector housing facing the inner wall of the cutout portion and the conductive film of each board end through hole are electrically connected via a solder layer.

[0010] The board connector structure according to the present disclosure has the effect of suppressing RF signal leakage more effectively than conventional structures.

[0011] 1A is a cross-sectional view showing the board connector structure according to the first embodiment, taken along line II-II in FIG. 1; FIG. 1B is a cross-sectional view showing the board connector structure according to the first embodiment, taken along line III-III in FIG. 1; FIG. 1C is a cross-sectional view showing the board in the first embodiment cut in a direction perpendicular to the thickness direction; FIG. 4C is a cross-sectional view taken in the direction of arrow A in FIG. 4;

[0012] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A detailed description of a board connector structure according to an embodiment will be given below with reference to the accompanying drawings.

[0013] First Embodiment. Figure 1 is a bottom view showing a board connector structure 100 according to a first embodiment. Figure 2 is a cross-sectional view showing the board connector structure 100 according to the first embodiment, taken along line II-II shown in Figure 1. Figure 3 is a cross-sectional view showing the board connector structure 100 according to the first embodiment, taken along line III-III shown in Figure 1. As shown in Figure 1, the board connector structure 100 includes a board 1 and a connector 2 mounted on the board 1.

[0014] The substrate 1 shown in Figures 2 and 3 is a multilayer resin substrate formed by stacking multiple conductor layers and multiple insulating layers. The bottom view shape of the substrate 1 is not particularly limited, but may be rectangular, for example. As shown in Figures 1 and 2, the substrate 1 has a cutout portion 1a, a signal pad 1b, a surface ground surface 1c, a signal pattern 1d, a signal through-hole 1e, multiple ground patterns 1f and 1g, and multiple ground through-holes 1h. Also, as shown in Figure 3, the substrate 1 has multiple board-end through-holes 1i (only one is shown in Figure 3), multiple lands 1j (only one is shown in Figure 3), and a back ground surface 1k.

[0015] Insulating layers are not shown in the figures. In the following description, the top conductor layer is referred to as the surface layer. The bottom conductor layer is referred to as the back layer. Each of the multiple conductor layers stacked between the top and bottom conductor layers is referred to as an inner layer. When describing the directions of each component of the board connector structure 100, the depth direction of the cutout portion 1a shown in FIG. 1 is referred to as the X-axis direction, the width direction of the cutout portion 1a is referred to as the Y-axis direction, and the thickness direction of the board 1 shown in FIGS. 2 and 3 is referred to as the Z-axis direction. The X-axis direction, Y-axis direction, and Z-axis direction are perpendicular to each other. The direction from the outer periphery of the board 1 toward the center of the board 1 is referred to as the inside, and the side opposite the inside is referred to as the outside.

[0016] As shown in FIG. 1 , the cutout portion 1a is provided at the outer peripheral edge of the substrate 1 and penetrates the substrate 1 in the Z-axis direction. The cutout portion 1a is formed by cutting a predetermined length inward from the outer peripheral edge of the substrate 1. The cutout portion 1a penetrates from the front layer to the back layer of the substrate 1. In this embodiment, the shape of the cutout portion 1a in a bottom view is rectangular, but this may be modified as appropriate. The inner wall of the cutout portion 1a has a bottom wall portion 1m, which is the bottom of the cutout portion 1a, and a pair of side wall portions 1n. The bottom wall portion 1m extends in the Y-axis direction and the Z-axis direction. The pair of side wall portions 1n extend outward from one end and the other end of the bottom wall portion 1m in the Y-axis direction. The pair of side wall portions 1n extend in the X-axis direction and the Z-axis direction. Here, the depth of the cutout portion 1a refers to the distance from the outer opening of the cutout portion 1a to the bottom wall portion 1m when viewed from the bottom of the substrate 1. Furthermore, the width of the cutout portion 1a refers to the distance between a pair of side walls 1n when viewed from the bottom of the substrate 1.

[0017] As shown in Fig. 2, signal pad 1b is provided on the surface layer of substrate 1 and is electrically connected to center conductor pin 2c, which will be described later. Fig. 4 is a cross-sectional view showing substrate 1 in embodiment 1 cut in a direction perpendicular to the thickness direction. Signal pad 1b is provided on a portion of the surface layer of substrate 1 adjacent to bottom wall portion 1m. Signal pad 1b is provided in a position facing inside cutout portion 1a. The connection point between center conductor pin 2c and substrate 1 (signal pad 1b) is adjacent to bottom wall portion 1m.

[0018] As shown in Fig. 2, the surface ground plane 1c is provided on the surface of the substrate 1. The surface ground plane 1c and the signal pad 1b are arranged on the same plane. As shown in Fig. 4, the surface ground plane 1c surrounds the signal pad 1b from one side in the X-axis direction and both sides in the Y-axis direction (three directions).

[0019] 2, the signal pattern 1d is provided on an inner layer of the substrate 1. The signal pattern 1d is provided on an inner layer of the substrate 1 that is different from the inner layer on which the ground patterns 1f and 1g are provided.

[0020] The signal through-hole 1e electrically connects the signal pad 1b and the signal pattern 1d. The signal through-hole 1e extends in the Z-axis direction. One end of the signal through-hole 1e in the Z-axis direction is electrically connected to the signal pad 1b. The other end of the signal through-hole 1e in the Z-axis direction is electrically connected to the signal pattern 1d.

[0021] A plurality of ground patterns 1f, 1g are provided on inner layers of the substrate 1 and are respectively arranged on one side and the other side of the signal pattern 1d in the Z-axis direction. The number of inner layers on which the ground patterns 1f, 1g are provided is not particularly limited, but in this embodiment, there are two. The two ground patterns 1f, 1g are provided spaced apart from each other in the Z-axis direction. The signal pattern 1d is provided between two adjacent ground patterns 1f, 1g. The two ground patterns 1f, 1g are arranged with a gap between them in the Z-axis direction. The signal pattern 1d, which is on an inner layer of the substrate 1 and arranged between the two ground patterns 1f, 1g, forms a strip line through which an RF signal passes.

[0022] Each of the multiple ground through holes 1h shown in FIG. 4 electrically connects the surface ground surface 1c and each of the multiple ground patterns 1f, 1g shown in FIG. 2. While only the ground through holes 1h electrically connecting the surface ground surface 1c and the ground pattern 1f are visible in the cross-sectional view of FIG. 2, there are also ground through holes 1h electrically connecting the surface ground surface 1c, the ground pattern 1f, and the ground pattern 1g. That is, there are also multiple ground through holes 1h electrically connecting the multiple ground patterns 1f, 1g. Each ground through hole 1h extends in the Z-axis direction. One end of each ground through hole 1h in the Z-axis direction is electrically connected to the surface ground surface 1c. The other end of each ground through hole 1h in the Z-axis direction is electrically connected to one of the multiple ground patterns 1f, 1g. The multiple ground through holes 1h shown in FIG. 4 are arranged at intervals from each other in the X-axis and Y-axis directions. Some of the ground through holes 1h are arranged so as to surround the signal pads 1b and the signal through holes 1e from one side in the X-axis direction and both sides in the Y-axis direction (three directions).

[0023] A plurality of board end through holes 1i are provided in the bottom wall 1m of the cutout portion 1a and are arranged on both sides of the connection point between the center conductor pin 2c and the board 1 (signal pad 1b) in the Y-axis direction. In FIG. 4, the center conductor pin 2c is illustrated by a dashed line for ease of understanding. Each board end through hole 1i is an end face through hole drilled in the bottom wall 1m in a semicircular or U-shape. Each board end through hole 1i extends in the Z-axis direction. The plurality of board end through holes 1i are spaced apart from one another in the Y-axis direction. In this embodiment, the number of board end through holes 1i is two. The distance between two board end through holes 1i in the Y-axis direction is set to be smaller than a length corresponding to half the wavelength of the RF signal.

[0024] FIG. 5 is a cross-sectional view taken from the direction of arrow A in FIG. 4 . Each board-end through-hole 1i includes a conductive film 1o serving as a metallized layer. The conductive film 1o is provided on the semicircular or U-shaped inner surface of each board-end through-hole 1i. The conductive film 1o extends in the Z-axis direction. One end of the conductive film 1o in the Z-axis direction is electrically connected to the surface ground surface 1c. The other end of the conductive film 1o in the Z-axis direction is electrically connected to the land 1j. As shown in FIG. 4 , the conductive film 1o is exposed within the cutout portion 1a. As shown in FIG. 3 , each ground pattern 1f, 1g is electrically connected to the conductive film 1o of each board-end through-hole 1i.

[0025] 5, each of the lands 1j is provided on the back surface of the substrate 1 and is electrically connected to the conductive film 1o of each of the substrate end through holes 1i. One land 1j is electrically connected to one conductive film 1o.

[0026] 3, the back-layer ground plane 1k is provided on the back layer of the substrate 1 and is separated from the lands 1j. The back-layer ground plane 1k is provided inside the lands 1j and separated from the lands 1j.

[0027] As shown in FIG. 2, the connector 2 has a connector housing 2a, a supporting dielectric 2b, a center conductor pin 2c, and a shield portion 2d.

[0028] A portion of the connector housing 2a is disposed within the cutout portion 1a shown in FIG. 1. The connector housing 2a constitutes the outer shell of the connector 2. FIG. 6 is a bottom view showing the connector 2 according to the first embodiment. FIG. 7 is a side view showing the connector 2 according to the first embodiment. FIG. 8 is a cross-sectional view showing the connector 2 according to the first embodiment, taken along line VIII-VIII shown in FIG. 7. As shown in FIGS. 6 and 7, the connector housing 2a includes a base portion 2e and a tip portion 2f. The base portion 2e and the tip portion 2f are aligned in the Z-axis direction. The base portion 2e is a portion disposed within the cutout portion 1a shown in FIG. 1. The tip portion 2f is a portion larger than the base portion 2e in the X-axis direction and the Y-axis direction, and is a portion disposed outside the cutout portion 1a shown in FIG. 1.

[0029] The tip portion 2f is continuous with one end of the base portion 2e in the Z-axis direction. A planar step surface 2g is formed on the end of the tip portion 2f facing the base portion 2e. The step surface 2g extends longer in the X-axis and Y-axis directions than the base portion 2e. A housing side surface 2h is formed on the base portion 2e, continuing from the step surface 2g and perpendicular to the step surface 2g. The housing side surface 2h extends in the Y-axis and Z-axis directions. The housing side surface 2h is the surface of the connector housing 2a facing the bottom wall portion 1m of the cutout portion 1a shown in Figure 1. The housing side surface 2h of the connector housing 2a is electrically connected to the conductive film 1o of the board end through-hole 1i.

[0030] As shown in Fig. 8, the support dielectric 2b is housed in the connector housing 2a and surrounds the center conductor pin 2c. In this embodiment, the support dielectric 2b has a cylindrical shape, but this may be modified as appropriate. The support dielectric 2b is made of, for example, resin or glass beads.

[0031] As shown in FIG. 2, the center conductor pin 2c protrudes from the connector housing 2a toward the substrate 1 and is electrically connected to the substrate 1. The center conductor pin 2c protrudes from its tip 2f along the surface of the substrate 1. With its base 2e positioned within the cutout 1a, the tip 2f is positioned on one side of the surface of the substrate 1 in the Z-axis direction. The center conductor pin 2c is positioned on one side of the signal pad 1b in the Z-axis direction. As shown in FIG. 8, a portion of the center conductor pin 2c is housed within the connector housing 2a and is positioned inside the support dielectric 2b. As shown in FIG. 6, the remaining portion of the center conductor pin 2c is exposed outside the connector housing 2a and the support dielectric 2b.

[0032] As shown in FIG. 2 , the shield portion 2d is a canopy-like portion that extends from the connector housing 2a toward the substrate 1 and covers the center conductor pin 2c from one side in the Z-axis direction. The shield portion 2d extends from the tip portion 2f along the surface of the substrate 1 and extends beyond the tip of the center conductor pin 2c toward one side in the X-axis direction. The shield portion 2d is located on one side in the Z-axis direction relative to the surface of the substrate 1. The shield portion 2d is a part of the tip portion 2f, and is a portion of the tip portion 2f that protrudes toward one side in the X-axis direction relative to the base portion 2e. The end of the shield portion 2d facing the base portion 2e is a part of the stepped surface 2g. The stepped surface 2g is located on one side in the Z-axis direction relative to the surface of the substrate 1. A recess 2i that accommodates the center conductor pin 2c is formed in the end of the shield portion 2d facing the base portion 2e, excluding the stepped surface 2g. The recess 2i is recessed toward one side in the Z-axis direction, away from the substrate 1. As shown in FIG. 6, the inner walls of the recess 2i surround the central conductor pin 2c from one side in the X-axis direction, both sides in the Y-axis direction, and one side in the Z-axis direction (four directions).

[0033] As shown in Fig. 2, the connector housing 2a including the shield portion 2d and the surface ground surface 1c of the substrate 1 are electrically connected via the solder layer 3. Specifically, the step surface 2g of the connector housing 2a and the surface ground surface 1c of the substrate 1 are electrically connected via the solder layer 3. The step surface 2g is disposed on the surface ground surface 1c via the solder layer 3. The center conductor pin 2c and the signal pad 1b are electrically connected via the solder layer 3. As shown in Fig. 3, the housing side surface 2h of the connector housing 2a facing the bottom wall portion 1m of the cutout portion 1a is electrically connected to the conductive film 1o of the substrate end through-hole 1i via the solder layer 3.

[0034] 2 to 4, a method for mounting the connector 2 on the outer peripheral edge of the substrate 1 will be described. First, using a solder mask (not shown), solder paste, which will form the solder layer 3 shown in FIG. 2, is applied to the surface ground surface 1c and signal pads 1b of the substrate 1. Next, using a mounter (not shown), the connector housing 2a is placed in the cutout portion 1a of the substrate 1, and the connector housing 2a is placed on the surface ground surface 1c of the substrate 1 via the solder paste. After that, the solder paste is heated to its melting temperature for a reflow process, melting and liquefying the solder paste. As the liquefied solder paste hardens, the connector 2 is mounted on the surface ground surface 1c and signal pads 1b of the substrate 1 via the solder layer 3.

[0035] When the connector housing 2a is placed in the cutout 1a of the board 1, the connector housing 2a is pressed toward the surface ground surface 1c of the board 1, which facilitates adhesion of the solder paste to the entire step surface 2g. Therefore, when the solder paste liquefies during the reflow process, it spreads along the surface ground surface 1c (shown in FIG. 3) and wets (permeates) the conductive film 1o of the board-end through-hole 1i. At this time, the surface tension of the solder paste draws the connector housing 2a toward the bottom wall 1m of the cutout 1a, filling the gap between the connector housing 2a and the conductive film 1o of the board-end through-hole 1i. The liquefied solder paste then hardens, bonding the housing side surface 2h of the connector housing 2a facing the bottom wall 1m of the cutout 1a to the conductive film 1o of the board-end through-hole 1i via the solder layer 3. 2, the stepped surface 2g of the connector housing 2a and the surface ground surface 1c of the substrate 1 are joined via a solder layer 3. The center conductor pin 2c and the signal pad 1b are also joined via the solder layer 3.

[0036] Next, the effects of the board connector structure 100 according to this embodiment will be described.

[0037] 2, an RF signal propagating in a coaxial mode between the connector housing 2a, the support dielectric 2b, and the center conductor pin 2c is transmitted from the center conductor pin 2c to the signal pad 1b and the signal through-hole 1e on the surface layer of the substrate 1, and then transmitted to the signal pattern 1d (strip line) on the inner layer of the substrate 1. Although not shown, in this embodiment, the multiple ground patterns 1f, 1g are electrically connected to each other via multiple ground through-holes 1h. This configuration can prevent the RF signal transmitted from the center conductor pin 2c to the substrate 1 from leaking outside the signal pattern 1d (outside the strip line).

[0038] 2, the connector 2 has a shield portion 2d that extends from the connector housing 2a toward the board 1 and covers the center conductor pin 2c from one side in the Z-axis direction. This configuration makes it possible to suppress leakage of the RF signal to one side in the Z-axis direction when the RF signal is transmitted from the center conductor pin 2c to the board 1.

[0039] In this embodiment, as shown in Figures 4 and 5, the board 1 has a plurality of board-end through-holes 1i provided in the bottom wall 1m of the cutout 1a and arranged on both sides of the connection point between the center conductor pin 2c and the board 1 in the Y-axis direction. In this embodiment, each of the plurality of board-end through-holes 1i includes a conductive film 1o that is electrically connected to the surface ground surface 1c and exposed within the cutout 1a. In this embodiment, as shown in Figure 1, the conductive film 1o of each board-end through-hole 1i is electrically connected to the housing side surface 2h of the connector housing 2a facing the bottom wall 1m of the cutout 1a via a solder layer 3. This configuration provides electrical continuity between the connector housing 2a and the board-end through-holes 1i of the board 1 at the bottom wall 1m. That is, the housing side surface 2h of the connector housing 2a and the conductive films 1o of the multiple board-end through-holes 1i arranged on both sides of the connection point between the center conductor pin 2c and the signal pad 1b in the Y-axis direction are joined at ground potential (the same potential as the ground potential of the surface ground plane 1c) via the solder layer 3. Therefore, as shown in Figures 4 and 5, when an RF signal is transmitted from the center conductor pin 2c to the board 1, leakage of the RF signal in both directions in the Y-axis direction and in the other direction in the Z-axis direction (in the direction of the dashed arrows shown in Figure 5) can be suppressed. Therefore, in this embodiment, a board connector structure 100 can be obtained that can suppress RF signal leakage more than conventional ones.

[0040] The board connector structure disclosed in Patent Document 1 has a problem in that, when the connector is mounted on the outer edge of the board, unavoidable dimensional tolerances, assembly tolerances, etc. result in gaps between the connector housing and the board, causing RF signal leakage through these gaps. In this regard, in this embodiment, as shown in Figures 1 and 4, the housing side surface 2h of the connector housing 2a and the conductive films 1o of two board-end through-holes 1i located on both sides of the connection point between the center conductor pin 2c and the signal pad 1b in the Y-axis direction are joined via solder layers 3. This eliminates or reduces the gap between the housing side surface 2h of the connector housing 2a and the board 1 (the bottom wall portion 1m of the cutout portion 1a). This prevents RF signals from leaking through the gaps in both the Y-axis direction and the Z-axis direction when the RF signals are transmitted from the center conductor pin 2c to the board 1.

[0041] 1, in this embodiment, the housing side surface 2h of the connector housing 2a facing the bottom wall portion 1m of the cutout portion 1a and the conductive film 1o of the board-end through-hole 1i are joined via a solder layer 3. With this configuration, the connector housing 2a is attracted to and fixed to the board 1 by the solder layer 3, thereby reducing variation in the mounting position of the connector housing 2a on the board 1. This improves the positional accuracy when mounting the connector housing 2a on the board 1 and reduces variation in RF signal transmission characteristics.

[0042] 3, the ground patterns 1f, 1g are electrically connected to the conductive film 1o of each of the substrate-end through-holes 1i. This configuration further suppresses leakage of the RF signal in both the Y-axis direction and the other Z-axis direction when the RF signal is transmitted from the center conductor pin 2c to the substrate 1.

[0043] In this embodiment, as shown in Figures 3 and 5, the substrate 1 has a plurality of lands 1j provided on the back layer and electrically connected to the conductive films 1o of the plurality of substrate-end through-holes 1i. With this configuration, by visually inspecting the lands 1j, it is easy to see that the solder layer 3 has been formed along the conductive film 1o. Also, in this embodiment, as shown in Figure 5, the substrate 1 has a back-layer ground surface 1k provided on the back layer and separated from the lands 1j. With this configuration, it is possible to prevent the solder layer 3 from leaking and spreading to the back-layer ground surface 1k.

[0044] Next, a modified example of the board connector structure 100 according to the present embodiment will be described.

[0045] In this embodiment, as shown in FIG. 3, the ground patterns 1f and 1g are electrically connected to the conductive film 1o of each of the board end through-holes 1i, but they do not have to be electrically connected.

[0046] In this embodiment, as shown in FIG. 5, the back ground plane 1k is separated from the land 1j, but it may be in contact with the land 1j.

[0047] 4, the number of board end through holes 1i is two, but if there are no dimensional constraints, the number of board end through holes 1i may be three or more. In this way, when an RF signal is transmitted from the center conductor pin 2c to the board 1, leakage of the RF signal in both the Y-axis direction and the other Z-axis direction can be further suppressed.

[0048] In this embodiment, the connector 2 is provided with the support dielectric 2b as shown in Fig. 8, but the support dielectric 2b may be omitted. In other words, the connector 2 may have an air coaxial structure without the support dielectric 2b.

[0049] The configurations shown in the above embodiments are merely examples, and may be combined with other known technologies, and parts of the configurations may be omitted or modified without departing from the spirit of the invention.

[0050] 1 Substrate, 1a Notch portion, 1b Signal pad, 1c Surface ground surface, 1d Signal pattern, 1e Signal through hole, 1f, 1g Ground pattern, 1h Ground through hole, 1i Substrate end through hole, 1j Land, 1k Back ground surface, 1m Bottom wall portion, 1n Side wall portion, 1o Conductive film, 2 Connector, 2a Connector housing, 2b Support dielectric, 2c Center conductor pin, 2d Shield portion, 2e Base portion, 2f Tip portion, 2g Step surface, 2h Housing side surface, 2i Recess, 3 Solder layer, 100 Substrate connector structure.

Claims

1. A connector structure for a board, comprising: a board; and a connector mounted on the board, wherein the board has: a cutout portion provided on an outer peripheral edge of the board and penetrating the board in a thickness direction of the board; and a surface ground surface provided on a surface layer of the board, wherein the connector has: a connector housing partly disposed within the cutout portion; a center conductor pin protruding from the connector housing toward the board and electrically connected to the board; and a shield portion extending from the connector housing toward the board and covering the center conductor pin from one side in the thickness direction, wherein the board has a plurality of board end through holes provided on an inner wall of the cutout portion and arranged on both sides of a connection point between the center conductor pin and the board in a direction perpendicular to the thickness direction, and each of the plurality of board end through holes includes a conductive film electrically connected to the surface ground surface and exposed in the cutout portion, A connector structure for a board, characterized in that the side surface of the connector housing facing the inner wall of the cutout portion and the conductive film of each of the board end through holes are electrically connected via a solder layer.

2. The connector structure for a board as described in claim 1, characterized in that the board has: a signal pad provided on the surface layer of the board and electrically connected to the center conductor pin; a signal pattern provided on an inner layer of the board; a signal through hole electrically connecting the signal pad and the signal pattern; and a plurality of ground patterns provided on the inner layer of the board and arranged on one side and the other side of the signal pattern in the board thickness direction.

3. The connector structure for a circuit board described in claim 2, characterized in that the connector housing including the shielding portion and the surface ground surface of the circuit board are electrically connected via the solder layer, and the center conductor pin and the signal pad are electrically connected via the solder layer.

4. The circuit board connector structure according to claim 2, wherein each of said ground patterns and each of said conductive films of said circuit board end through holes are electrically connected.

5. The connector structure for a board as described in claim 3, characterized in that the board has: a plurality of lands provided on the back layer of the board and electrically connected to the conductive film of each of the plurality of board end through holes; and a back layer ground plane provided on the back layer of the board and separated from the lands.

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