Work machine for substrate

Abstract

A work machine for a substrate, wherein when a pair of work heads approach each other up to a prescribed distance in a first direction due to the relative movement of a pair of first sliders, the support ranges where the wide carriages of the pair of first sliders are supported by the respective guide rails in the first direction overlap when a second slider is seen in plan view from a second direction.

Description

Substrate-related work machine

[0001] The present invention relates to a substrate-related operating machine.

[0002] A substrate-related operation machine performs a predetermined substrate-related operation on a board using a work head that is movable within the machine. A component placement machine serving as a substrate-related operation machine picks up a component using, for example, a suction nozzle and places the component at a predetermined placement position on the board. The component placement machine supports the suction nozzle by a placement head serving as the work head so that the suction nozzle can be raised, lowered, and rotated. Patent Document 1 discloses a configuration that uses multiple placement heads to improve the efficiency of the placement process.

[0003] Japanese Patent Application Laid-Open No. 2004-186391

[0004] To improve the versatility of a substrate-related operation machine, it is desirable to ensure a large range of movement for the working head within the machine. On the other hand, to increase the speed and accuracy of substrate-related operations, the working head needs to be reliably supported, and if the support structure for the working head becomes larger, the working head's range of movement may become narrower in order to avoid interference with other components.

[0005] An object of the present specification is to provide a substrate-related operating apparatus that can reliably support a plurality of operating heads while ensuring a range of movement for each of the operating heads.

[0006] This specification discloses a substrate-related operation machine comprising: a head support section that supports a work head used for substrate-related operations; a plurality of first slides each having a plurality of carriages movably supported along a pair of parallel guide rails extending in a horizontal first direction; and a second slide provided with a plurality of pairs of the guide rails, each supporting the plurality of first slides movably in the first direction independently of one another, and moving the plurality of first slides together in a horizontal second direction intersecting the first direction, wherein at least one of the plurality of carriages is a wide carriage that is supported by the guide rails with a width that is wider in the first direction than the width of the work heads supported by the first slides, and the pair of work heads supported by the plurality of first slides are arranged side by side in the first direction on the same plane perpendicular to the second direction, and when the pair of work heads approach each other to a predetermined distance in the first direction due to relative movement of the pair of first slides, the support ranges in the first direction in which the wide carriages of the pair of first slides are respectively supported by the guide rails overlap with each other when the second slide is viewed in a plane from the second direction.

[0007] This specification also discloses the technical idea of ​​changing "the substrate-related operating machine according to any one of claims 1 to 3" in claim 5 originally filed to "the substrate-related operating machine according to any one of claims 1 to 4," and the technical idea of ​​changing "the substrate-related operating machine according to any one of claims 1 to 3" in claim 6 originally filed to "the substrate-related operating machine according to any one of claims 1 to 5." This specification also discloses the technical idea of ​​changing "the substrate-related operating machine according to any one of claims 1 to 3" in claim 7 originally filed to "the substrate-related operating machine according to any one of claims 1 to 6," and the technical idea of ​​changing "the substrate-related operating machine according to any one of claims 1 to 3" in claim 8 originally filed to "the substrate-related operating machine according to any one of claims 1 to 7."

[0008] With this configuration, the support ranges of the pair of wide carriages overlap, so the working heads supported by the pair of first slides can be closer than before, ensuring a sufficient range of movement. Also, having a pair of wide carriages ensures a larger support range in the first direction, making it possible to reliably support each working head.

[0009] FIG. 1 is a perspective view showing a component mounting machine. FIG. 2 is a side view schematically showing a head moving device and a mounting head of a first embodiment. FIG. 3 is a front view schematically showing a state in which two mounting heads are closest to each other. FIG. 4 is a perspective view showing an X-slide of one of the head moving devices. FIG. 5 is a plan view schematically showing a state in which two mounting heads are closest to each other to a predetermined distance. FIG. 6 is a plan view schematically showing a state in which two mounting heads are closest to each other. FIG. 7 is a side view schematically showing a head moving device and a mounting head of a second embodiment. FIG. 8 is a plan view schematically showing a state in which two mounting heads are closest to each other to a predetermined distance. FIG. 9 is a plan view schematically showing a modified mode of the mounting head. FIG. 10 is a flowchart showing mounting processing by a component mounting machine. FIG. 11 is a top view schematically showing a multiple board made up of a plurality of unit boards.

[0010] 1. Overview of Component Mounting Machine 10 Component mounting machine 10 is a substrate-related operation machine that performs a predetermined substrate-related operation on board 90, and performs a mounting process to mount components on board 90 as the substrate-related operation. Component mounting machine 10 constitutes a production line together with a plurality of other substrate-related operation machines that are installed in the transport direction of board 90. Each of the plurality of substrate-related operation machines is communicably connected to host computer 5, which controls the production line as a whole.

[0011] In addition to component mounting machine 10, the substrate-related operating machines that make up the production line include a printer that prints solder on substrate 90, a reflow oven that heats substrate 90 with components mounted thereon to perform soldering, and an inspection machine that inspects whether the appearance or function of the product substrate is normal. The configuration of the production line can be appropriately added to or modified depending on, for example, the type of product substrate to be produced. Specifically, multiple production lines can be appropriately equipped with substrate-related operating machines such as a buffer device that temporarily holds substrate 90 being transported, a substrate supply device, a substrate inverting device, various inspection devices, a shield mounting device, an adhesive dispensing device, and an ultraviolet irradiation device.

[0012] 2. Configuration of Component Mounting Machine 10 As shown in Fig. 1 , the component mounting machine 10 includes a board transport device 20, a component supply device 30, a head moving device 40, and a control device 85. In the following description, the horizontal direction of the component mounting machine 10 (the direction from the upper left to the lower right in Fig. 1 ) is referred to as the X direction (first direction), the horizontal direction intersecting the X direction and the front-rear direction of the component mounting machine 10 (the direction from the lower left to the upper right in Fig. 1 ) is referred to as the Y direction (second direction), and the vertical direction perpendicular to the X direction and the Y direction (the up-down direction in Fig. 1 ) is referred to as the Z direction.

[0013] 2-1. Substrate Transfer Device 20 The substrate transfer device 20 has a conveyor belt 21, a pair of guide rails 22, and a backup device 23. The conveyor belt 21 is an endless belt that transfers a substrate 90 placed on its upper surface. The pair of guide rails 22 extend in the transfer direction (X direction) of the substrate 90, and support the periphery of the substrate 90 transferred by the conveyor belt 21. At least one of the pair of guide rails 22 is provided on the base 11 so as to be movable in the Y direction.

[0014] The board transport device 20 sequentially transports the boards 90 in the transport direction and positions the boards 90 at predetermined positions within the machine. As shown in Fig. 2, the backup device 23 raises the backup pins 24 using the pin lifting device 25, and clamps the boards 90 positioned at the predetermined positions in the transport direction between the pair of guide rails 22. After performing the component mounting process, the board transport device 20 transports the boards 90 out of the component mounting machine 10.

[0015] 2-2. Component Supply Device 30 The component supply device 30 supplies components to be mounted on the board 90. The component supply device 30 includes feeders 31 arranged in a predetermined arrangement direction (the X direction in this embodiment). The feeders 31 are, for example, tape feeders that feed and move a carrier tape containing components in the Y direction to supply the components so that they can be picked up. The component supply device 30 rotatably supports a reel 32 around which the carrier tape is wound.

[0016] The feeder 31 may include a stick feeder, a bulk feeder, or the like. Furthermore, the component supply device 30 may supply, for example, relatively large components arranged on a tray placed on a pallet. In the above configuration, the component supply device 30 draws a predetermined pallet from a storage device that stores multiple pallets in accordance with the mounting process and supplies the components.

[0017] 2-3. Head Moving Device 40 The head moving device 40 is an XY robot that horizontally moves a work head used for a predetermined substrate-related operation. In this embodiment, the head moving device 40 moves a mounting head 70 serving as a work head. As shown in FIG. 1 , the head moving device 40 includes an X slide 50 and a Y slide 60 that serve as moving tables to which the mounting head 70 is attached. The X slide 50 is a first slide that is moved in the X direction by the linear motion mechanism of the X drive device 41. The Y slide 60 is a second slide that supports the X slide 50 so that it can move in the X direction, and is moved in the Y direction by the linear motion mechanism of the Y drive device 46.

[0018] A mounting head 70 is replaceably fixed to the head support portion 51 (see FIG. 2) of the X-slide 50 by a clamp member (not shown). Various holding members are detachably attached to the mounting head 70. The holding members include a suction nozzle 74 that sucks and holds a component using negative pressure air, a chuck that grips the component, and a picker that holds the backup pins 24.

[0019] In this embodiment, the component mounting machine 10 includes multiple mounting heads 70. The head moving device 40 moves the multiple mounting heads 70 independently in the X direction and moves the multiple mounting heads 70 together in the Y direction. Specifically, the head moving device 40 includes multiple X slides 50 that support the respective mounting heads 70. The detailed configurations of the mounting heads 70 and the head moving device 40 will be described later.

[0020] 2, the component mounting machine 10 is equipped with a component camera 81 and a board camera 82. The component camera 81 and the board camera 82 are digital imaging devices having imaging elements such as CMOS. The component camera 81 and the board camera 82 capture images based on control signals and send image data acquired by the capture.

[0021] In this embodiment, the component camera 81 is provided on the head main body 71 of the mounting head 70. The board camera 82 is provided on the X-slide 50. With this configuration, the component camera 81 and the board camera 82 move integrally with the mounting head 70 as the X-slide 50 moves. The component camera 81 is configured to be able to capture images of a component 98 held by a suction nozzle 74 serving as a holding member from below. The board camera 82 is configured to be able to capture images of a reference mark 96 (see FIG. 11 ) attached to the board 90 from above.

[0022] In addition to the above, the component mounting machine 10 may also be equipped with a camera capable of capturing images of the components 98 held by the suction nozzles 74 from the side or above, and a camera capable of capturing images of the mounting surface of the board 90 before or after the components 98 are mounted. These cameras are used, for example, to inspect the presence and orientation of the components 98, inspect the appropriateness of the type and shape of the components 98, and inspect the appropriateness of the solder printing condition on the board 90 and the mounting condition of the components 98.

[0023] 2-5. Control Device 85 The control device 85 is primarily composed of a CPU, various memories, and control circuits. The control device 85 executes a mounting process for mounting components on the board 90. During the mounting process, the control device 85 controls the operation of the head moving device 40 based on information output from various sensors, the results of image processing, pre-stored control programs, and the like. This controls the positions and angles of the multiple suction nozzles 74 supported by the mounting head 70. The control device 85 also executes placement operations, including adding or removing backup pins 24 used by the backup device 23 to support the board 90 from below during the mounting process, and changing the position of the backup pins 24.

[0024] 3. Detailed Configuration of the Placement Head 70 As shown in FIG. 2 , the placement head 70 includes a head main body 71 that is detachably attached to the X-slide 50. The placement head 70 has a rotor 72 that is attached to the head main body 71 and is rotatable about an R-axis that extends in the vertical direction relative to the head main body 71. The rotor 72 supports multiple holders 73 arranged on a ring centered on the R-axis so that the holders 73 can move up and down and rotate about their respective central axes (Q-axes). Each of the multiple holders 73 is fitted with a suction nozzle 74 that serves as a holding member for holding a component 98. As a result, the rotor 72 supports the suction nozzles 74 via the holders 73.

[0025] The mounting head 70 has an R-axis rotation device 75 that rotates the rotor 72 about the R-axis. The R-axis rotation device 75 sets the rotor 72 at a predetermined angle about the R-axis, thereby indexing one holder 73 to an elevation position where it is raised and lowered by an elevation device 77 (described later). The mounting head 70 has a Q-axis rotation device 76 that rotates the holder 73 about the Q-axis. In this embodiment, the Q-axis rotation device 76 has a mechanism that rotates multiple holders 73 in unison, and is used to rotate the multiple holders 73. With the above configuration, when one holder 73 is set at a predetermined angle about the Q-axis, the other multiple holders 73 are also set at predetermined angles in unison.

[0026] The mounting head 70 has an elevator device 77 that raises and lowers a holder 73 among the plurality of holders 73 that has been indexed to a lift position by the rotation of the rotor 72. The elevator device 77 lowers and raises the holder 73, thereby lowering and raising the suction nozzle 74 attached to the holder 73. The mounting head 70 may be configured to have two or more lift positions and include a plurality of elevator devices that can be driven independently so as to raise and lower the holders 73 positioned at each position.

[0027] The number of holders 73 supported by the mounting head 70 configured as described above may vary depending on the type of mounting head 70. The mounting head 70 may adopt various configurations in addition to the configuration in which multiple holders 73 are supported at equal intervals in a circular ring shape as in this embodiment. For example, the mounting head 70 may adopt a configuration in which multiple holders 73 are supported arranged in a line or in a matrix.

[0028] 4. Detailed Configuration of Head Moving Device 40 4-1. Overall Structure and Driving Device of Head Moving Device 40 In this embodiment, the head moving device 40 is supported from above by a pair of columns 12 and a beam 13, as shown in FIG. 1. The pair of columns 12 are gate-shaped structures provided at the front and rear of the base 11, respectively. The beam 13 spans the pair of columns 12. The beam 13 is a strength member that supports the head moving device 40 and connects the pair of columns 12, thereby improving the rigidity of the entire machine.

[0029] As described above, head moving device 40 includes X drive device 41 (see FIG. 2) that moves X slide 50 in the X direction relative to Y slide 60, and Y drive device 46 that moves Y slide 60 in the Y direction relative to beam 13. X drive device 41 and Y drive device 46 are configured with linear motion mechanisms such as linear motors and ball screws. In this embodiment, X drive device 41 is a linear motor, and Y drive device 46 is a ball screw device.

[0030] 1, Y slide 60 has a guide block 65 slidably engaged with a pair of guide rails 47 provided on beam 13. The pair of guide rails 47 and guide block 65 function as a Y-axis guide device that guides movement of Y slide 60 in the Y direction. The Y-axis guide device is of a suspension type that supports Y slide 60 suspended from the pair of guide rails 47 so that it can move in the Y direction, and can ensure a large range of movement in the X direction.

[0031] Y drive device 46, which is a ball screw device, includes a ball screw 461 that is attached to beam 13 and extends in the Y-axis direction, a nut 462 that is threadedly engaged with ball screw 461 and is attached to Y slide 60, and a motor 463 that rotates ball screw 461. Y drive device 46 controls the power supply to motor 463 to rotate ball screw 461 by a predetermined amount in a predetermined direction, and moves Y slide 60, which is fixed to nut 462, to a predetermined position in the Y direction.

[0032] 2, the X slide 50 includes a plurality of carriages 52 movably supported along a pair of guide rails 61 provided on the Y slide 60. The pair of guide rails 61 and the carriages 52 function as an X-axis guide device that guides movement of the X slide 50 in the X direction. In this embodiment, the X drive device 41, which is a linear motor, includes a pair of stators 42, a mover 43, and a cooling device 44, as shown in FIG.

[0033] The pair of stators 42 are arranged along the X direction facing each other at a predetermined interval. Each of the pair of stators 42 includes a yoke to which multiple permanent magnets are fixed and a non-magnetic base plate that holds the yoke. The multiple permanent magnets are arranged so that the magnetic poles of two adjacent permanent magnets face in opposite directions. The mover 43 is arranged between the pair of stators 42 and is provided on the X slide 50. The mover 43 includes cores corresponding to the three phases (U, V, W) and coils wound around the cores.

[0034] The cooling device 44 cools the X drive device 41, which is a linear motor, by dissipating heat conducted by multiple heat pipes in a heat sink. The X drive device 41 generates thrust by supplying power to the coil of the mover 43. The X drive device 41 controls the power supply to the coil, thereby moving the X slide 50 fixed to the mover 43 to a predetermined position in the X direction.

[0035] 4-2. Detailed Configuration of the Head Moving Device 40 The component mounting machine 10 uses the head moving device 40 configured as described above to move the mounting head 70 horizontally. To shorten the time required for component mounting, it is conceivable to provide the mounting head 70 with multiple lifting devices 77, for example, so that the pickup operation for two components can be performed simultaneously. However, this configuration imposes various constraints, such as the requirement that the two components to be picked must be supplied at a distance roughly equal to the distance between the liftable suction nozzles 74.

[0036] Therefore, the component mounting machine 10 of this embodiment employs a suspension system that can ensure a wide range of movement in the X direction, and employs a configuration that includes multiple (two in this embodiment) mounting heads 70 that can move independently in the X direction (the conveyance direction of the board 90, the arrangement direction of the feeder 31). In the following description, when distinguishing between the upstream side and downstream side in the board conveyance direction, such as the multiple X slides 50 and the multiple mounting heads 70, the symbols of the members arranged on the upstream side in the board conveyance direction (upper left side in FIG. 1) will be appended with 'L', and the symbols of the members arranged on the downstream side in the board conveyance direction (lower right side in FIG. 1) will be appended with 'R'.

[0037] Head moving device 40 includes two X slides 50L, 50R that support two mounting heads 70L, 70R so that they can move independently in the X direction. Note that Y slide 60 supports each of the two X slides 50L, 50R so that they can move in the X direction, and moves the two X slides 50L, 50R together in the Y direction. In this embodiment, Y slide 60 supports each of the two X slides 50L, 50R so that they can move in the X direction in the same plane (XZ plane) perpendicular to the Y direction, using a pair of upper and lower guide rails 61 provided along the X direction.

[0038] Here, there is a demand for improved productivity relative to the area occupied by the component mounting machine 10 in a factory or the like where the component mounting machine 10 is installed. To this end, the component mounting machine 10 of this embodiment employs a suspended head moving device 40 to ensure a large movable range Mr of the mounting head 70 relative to the width of the device in the X direction, as shown in Figures 5 and 6. Furthermore, by reducing the width Hw of the mounting head 70 compared to conventional mounting heads, the movable ranges MrL and MrR of the two mounting heads 70L and 70R are expanded, respectively.

[0039] Furthermore, there is a demand for the component mounting machine 10 to shorten the time required for the mounting process, and therefore, efficient movement and improved movement speed of the mounting head 70 are required. However, if the width Hw of the mounting head 70 is reduced, for example, by reducing the width of the X slide 50 that supports the mounting head 70, there is a concern that the support force of the Y slide 60 relative to the X slide 50 will decrease. Increasing the maximum speed or maximum acceleration of the X-direction movement of the mounting head 70 in this situation could generate vibrations, which could affect mounting accuracy. Therefore, in this embodiment, the following configuration of the head moving device 40 is adopted to ensure the movable range Mr of multiple mounting heads 70 while reliably supporting each of the mounting heads 70.

[0040] 4-2-1. First Aspect of Head Moving Device 40 The first aspect of the head moving device 40 includes a wide carriage 52W that is applied to at least a portion of the carriage 52 supported by a pair of guide rails 61. The support range Cr in the X direction in which the wide carriages 52W of the pair of X slides 50 are supported by the guide rails 61 is set so that when the pair of mounting heads 70 approach each other to a predetermined distance in the X direction due to relative movement of the pair of X slides 50, the support ranges Cr overlap with each other when the Y slide 60 is viewed from above in the Y direction (see FIG. 3). Note that in FIG. 3, the head support portion 51 is indicated by a dashed line, and the head support portion 51 of the right X slide 50R before movement is indicated by a solid line.

[0041] 3 and 4, the pair of guide rails 61L supporting the left-side (upstream side in the board transport direction) X-slide 50L are disposed above the pair of guide rails 61R supporting the right-side (downstream side in the board transport direction) X-slide 50R. In this embodiment, each of the two carriages 52 is a wide carriage 52W that is supported by the guide rails 61 with a width that is wider than the X-direction width Hw of the mounting head 70 supported by the X-slide 50, as shown in FIG.

[0042] More specifically, each of the two wide carriages 52W of the left X-slide 50L protrudes from the X-direction end of the head support part 51 of the X-slide 50L toward the right X-slide 50R, as shown in Fig. 5. Similarly, each of the two wide carriages 52W of the right X-slide 50R protrudes from the X-direction end of the head support part 51 of the X-slide 50R toward the left X-slide 50L.

[0043] 3 and 4, each of the pair of X slides 50 has a housing section 55 that houses the wide carriage 52W of the adjacent X slide 50. Specifically, the head support section 51 of the left X slide 50L is formed with two housing sections 55L that house the upper wide carriage 52W1 and the lower wide carriage 52W2 of the right X slide 50R. The head support section 51 of the right X slide 50R is formed with a housing section 55R that houses the lower wide carriage 52W2 of the left X slide 50L.

[0044] The accommodation section 55 extends in the X direction parallel to the guide rail 61 and is formed in a groove shape to avoid interference with the carriage 52. With the above-described configuration, as shown in Fig. 5, when the two mounting heads 70L, 70R approach each other to a predetermined distance in the X direction due to relative movement of the two X slides 50L, 50R, a portion of the wide carriage 52W of one of the two X slides 50L, 50R is accommodated in the accommodation section 55 provided on the other of the pair of X slides 50. As a result, the support ranges CrL, CrR in the X direction of the wide carriages 52W of the two X slides 50L, 50R, which are supported by the guide rail 61, overlap each other.

[0045] Here, the two X slides 50L, 50R are moved in the X direction by an X drive device 41, which is a linear motor. As described above, the two X slides 50L, 50R are individually supported by two pairs of guide rails 61, while sharing a pair of stators 42 of the X drive device 41. The X drive device 41 controls the power supply to a plurality of movers 43 provided on each of the two X slides 50L, 50R, to move the X slides 50.

[0046] Furthermore, the two mounting heads 70L, 70R are allowed to approach each other at a minimum distance Dc, taking into account their respective widths Hw in the X direction and the distance required to prevent interference. Figure 6 shows the two mounting heads 70L, 70R at their closest position. In the first mode of the head moving device 40, the two mounting heads 70 are of the same type and are compatible with each other. In other words, the two X-slides 50L, 50R each support a different type of mounting head 70, but both are of the same type.

[0047] As described above, the pair of mounting heads 70L, 70R supported by the two X-slides 50L, 50R are aligned in the X-direction on the same plane (XZ plane) perpendicular to the Y-direction. That is, the Y-direction positions of the suction nozzles 74 that each of the pair of mounting heads 70L, 70R can raise and lower are the same. Furthermore, as shown in FIG. 6 , the same type of mounting heads 70L, 70R have a length Hn in the Y-direction that is greater than their width Hw in the X-direction. When the pair of X-slides 50L, 50R move relative to each other and the pair of mounting heads 70L, 70R approach each other most closely in the X-direction, the width Ws occupied by the pair of X-slides 50L, 50R in the X-direction is smaller than the width Wh occupied by the pair of mounting heads 70L, 70R.

[0048] Here, one way to shorten the time required for the mounting process is to reduce the number of pick-and-place cycles (hereinafter referred to as "PP cycles"). Therefore, it is effective to increase the number of components that the mounting head 70 can hold in one PP cycle. However, increasing the number of suction nozzles 74 supported by the mounting head 70 increases the size of the mounting head 70, which can result in a reduction in the range of movement of the mounting head 70.

[0049] In contrast, in a configuration with multiple mounting heads 70 as in this embodiment, when the same number of suction nozzles 74 are supported overall, the number supported by each mounting head 70 can be reduced, thereby making it possible to miniaturize the mounting head 70. In the first mode of the head moving device 40, the width Hw in the X direction of the two mounting heads 70 is set to be 20% or less of the movable range Mr of the mounting heads 70, which is set based on the minimum distance Dc at which the two mounting heads 70 are allowed to approach each other. This allows a larger number of suction nozzles 74 to be used overall, while also increasing the movable range Mr of the mounting heads 70.

[0050] With this configuration of the first aspect of the head movement device 40, compared to when the carriage 52 is set to a length approximately the same as the width Hw of the mounting head 70, the X slide 50 is supported by the support range Cr of the wide carriage 52W, thereby improving the support force of the Y slide 60 and suppressing the generation of vibrations due to the operation of the X slide 50. This makes it possible to increase the maximum speed and maximum acceleration of movement of the mounting head 70 in the X direction, and as a result, the time required for the mounting process can be reduced.

[0051] Furthermore, compared to a configuration in which wide carriages are simply used and the movable range is reduced to prevent interference, the support ranges CrL and CrR of the pair of wide carriages 52W in the left and right directions overlap with each other in the first mode of the head moving device 40. This allows the mounting heads 70 supported by the pair of X slides 50 to be closer together than before, ensuring a large movable ranges MrL and MrR.

[0052] 4-2-2. Second Aspect of Head Moving Device 40 The second aspect of head moving device 40 includes three parallel guide rails 61 that support two X slides 50L, 50R. The three guide rails 61 provided on Y slide 60 support X slide 50 movably in the X direction at three or more different support positions Ps in a plane (YZ plane) that includes the up-down direction (Z direction) and the Y direction.

[0053] 7 , the Y-slide 60 has a first support surface 62 and a second support surface 63. The first support surface 62 is a plane (XZ plane) perpendicular to the Y direction, and at least two guide rails 61 are provided parallel to each other along the X direction. The second support surface 63 is a plane different from the first support surface 62, and at least one guide rail 61 is provided parallel to the multiple guide rails 61 attached to the first support surface 62.

[0054] The second support surface 63 may be a non-parallel surface rotated about the X-axis with respect to the first support surface 62, as long as a third guide rail 613 is provided parallel to the two guide rails 611, 612 provided on the first support surface 62. In this embodiment, the second support surface 63 is a surface parallel to the first support surface 62. The second support surface 63 is also formed at a distance from the first support surface 62 in the Y direction by approximately half the length Hn of the mounting head 70 (Dh ≈ Hn / 2).

[0055] Furthermore, support position Ps3 by guide rail 613 provided on second support surface 63 is set at the same height Sh as support position Ps1 by upper guide rail 611 provided on first support surface 62 and support position Ps2 by lower guide rail 612. In this way, in the second mode of head moving device 40, the three carriages 52 of X slide 50 engage with the three guide rails 611, 612, 613 when viewed in the X direction, thereby supporting X slide 50 at three points.

[0056] Here, in the first mode of the head moving device 40, the two X slides 50L, 50R are individually supported by two pairs of guide rails 61. In contrast to this, in the second mode of the head moving device 40, the two X slides 50L, 50R are each arranged so as to share at least one (two in this embodiment) guide rail 611, 612 on the first support surface 62 (corresponding carriages 52 engage with the same guide rail 61). Furthermore, in this embodiment, the two X slides 50L, 50R also share a guide rail 613 provided on the second support surface 63.

[0057] According to the configuration of the second aspect of the head moving device 40, the X slide 50 is supported at three or more different support positions Ps, and therefore, as shown in Figure 8, it is possible to improve the supporting force of the Y slide 60 without employing a wide carriage 52W in which the carriage 52 is wider in the X direction than the head support part 51. This makes it possible to reliably support the mounting head 70 while ensuring the movable range Mr of the mounting head 70.

[0058] Furthermore, by setting the support positions Ps2, Ps3 by the lower guide rails 612, 613 at the same height Sh, it is possible to improve the support force at a location closer to the suction nozzle 74 and reduce the effects of vibrations that may be generated by movement of the mounting head 70 in the X direction. Furthermore, by sharing the three guide rails 61 and not adopting the wide carriage 52W, it is possible to make the two X slides 50L, 50R the same type, thereby ensuring interchangeability.

[0059] 4-3. Other Aspects of the Head Moving Device 40 In addition to the first and second aspects exemplified above, various other aspects can be applied to the head moving device 40. For example, the head moving device 40 may be configured to combine the first and second aspects. Specifically, as in the second aspect, the X-slide 50 may be supported by three guide rails 61, and at least a portion of the carriage 52 that engages with the three guide rails 61 may be a wide carriage 52W.

[0060] This further improves the supporting force of the Y-slide 60. This makes it possible to increase the maximum speed and maximum acceleration of movement of the mounting head 70 in the X direction. Alternatively, the width of the mounting head 70 and the X-slide 50 can be reduced to achieve miniaturization and to expand the movable range Mr of the mounting head 70.

[0061] Furthermore, in the first and second aspects of the head moving device 40, the two mounting heads 70 are of the same type and are compatible with each other. This improves the versatility of the mounting head 70. As shown in FIGS. 5 and 8 , in this type of mounting head 70, the elevator device 77 that raises and lowers the suction nozzle 74 is located at the center of the width direction (X direction) of the mounting head 70. Therefore, when the mounting head 70 has moved to one end of the movable range Mr in the X direction, even if a board 90 is present in the range from the edge of the mounting head 70 in the X direction to the center of the width direction where the elevator device 77 is located, the suction nozzle 74 cannot be used to perform work on that range.

[0062] In contrast to this, the head moving device 40 may have at least one of the two mounting heads 70 mounted on an X-slide 50 located at one end in the X direction, with the lifting device 77 positioned offset toward one end from the center in the width direction of the mounting head 70. Specifically, as shown in Fig. 9, the two mounting heads 70 are of different shapes, with the left mounting head 70L having a lifting device 77L disposed on its left side (one end in the X direction) and the right mounting head 70R having a lifting device 77R disposed on its right side (the other end in the X direction).

[0063] With this configuration, the two mounting heads 70 can raise and lower the suction nozzles 74 located at the ends of the mounting heads 70, rather than the suction nozzles 74 angled at the center in the width direction by rotation of the rotor 72. As a result, although the movable ranges MrL and MrR of the two mounting heads 70L and 70R remain unchanged, it is possible to substantially expand the area in which work can be performed using the suction nozzles 74 when the two mounting heads 70 have each moved to the ends of their movable ranges Mr.

[0064] Additionally, the mounting head 70 may be equipped with a picker that holds the backup pins 24 instead of the suction nozzle 74, and may perform the task of placing the backup pins 24. In such a case, by applying the above-described embodiment, the area in which the backup pins 24 can be placed can be substantially expanded. This improves the degree of freedom in placing the backup pins 24, and makes it possible to place the backup pins 24 corresponding to the components 98 already placed on the board 90, for example, thereby more reliably supporting the board 90.

[0065] The above-described aspect can also be similarly applied to the board camera 82. That is, each of the two board cameras 82 of the head moving device 40 may be disposed offset in the X direction with respect to the center in the width direction of the X slide 50, similar to the lifting device 77. Specifically, the board camera 82L provided on the X slide 50L located on the left side (one end side in the X direction) of the two X slides 50 is configured to be able to capture an image of the board 90 to the left (one end side in the X direction) of the center in the width direction of the mounting head 70L supported by the X slide 50L.

[0066] Similarly, the board camera 82R provided on the X-slide 50R located on the right side (the other end in the X direction) of the two X-slides 50 is configured to be able to capture images of the board 90 to the right (the other end in the X direction) of the center in the width direction of the mounting head 70R supported by the X-slide 50R. This configuration substantially expands the area that can be captured by the two board cameras 82L, 82R. This is particularly useful when capturing images of a board 90 that has a reference mark 96 or a barcode 97 (see FIG. 11 ) attached to its end in the X direction, as it can accommodate even boards with a large dimension in the X direction.

[0067] 5. Mounting Process by Component Mounting Machine 10 5-1. Overview of Mounting Process The mounting process by the component mounting machine 10 will be described with reference to Fig. 10. Here, it is assumed that the component supply device 30 is equipped with a plurality of feeders 31. In the mounting process, first, the board transport device 20 of the component mounting machine 10 executes a board 90 loading process (S11), as shown in Fig. 10. As a result, the board 90 is loaded into the machine and positioned at a predetermined position within the machine.

[0068] Next, the control device 85 executes a preparation process (S12). The preparation process includes recognizing the reference mark 96 to acquire the position of the positioned substrate 90 and reading the barcode 97 indicating the substrate ID of the substrate 90. Specifically, the control device 85 controls the operation of the head moving device 40 to perform an imaging operation in which the substrate camera 82 is moved above an imaging target such as the reference mark 96 to capture an image. The control device 85 recognizes the reference mark 96 and reads the barcode 97 by performing image processing on the image data acquired by imaging.

[0069] The preparation process may also include processes for obtaining information such as whether or not the board 90 is warped, the state of the components 98 already mounted, and the state of the printed solder. The control device 85 controls the operation of the head moving device 40 so as to move the board camera 82 to a predetermined position according to the content of the necessary preparation process. The control device 85 also obtains the type of board 90 (normal / multiple board, etc.) by, for example, sending the board ID of the board 90 to the host computer 5, and sets the type of mounting process to be performed on the board 90.

[0070] In the PP cycle, the control device 85 executes a pickup cycle in which the pickup operation of picking up components 98 using the multiple suction nozzles 74 is repeated (S13). At this time, the control device 85 controls the operation of the head moving device 40 in the pickup operation so as to sequentially position the mounting head 70 according to the positions of the pickable components 98. In this embodiment, in parallel with the pickup cycle, the control device 85 executes a process of recognizing the holding states of the components 98 held by the multiple suction nozzles 74 (S14).

[0071] More specifically, when the rotor 72 rotates about the R axis as the pickup cycle is executed and the suction nozzle 74 holding the component 98 is positioned above the component camera 81, the control device 85 sends an image capture command to the component camera 81. The control device 85 processes the image data acquired by the component camera 81, and recognizes the attitude (position and angle) of the component 98 held by the suction nozzle 74.

[0072] After the picking cycle (S13) is completed, the control device 85 executes a placement cycle (S15) in which the placement operation of placing components 98 using the multiple suction nozzles 74 is repeated. In this placement operation of the placement cycle (S15), the control device 85 controls the operation of the placement head 70 so that each component 98 is placed at a placement position specified by the control program. Furthermore, based on the results of the recognition process (S14), the control device 85 controls the operation of the placement head 70 so that each component 98 assumes a predetermined orientation relative to its placement position.

[0073] The control device 85 determines whether all PP cycles have been completed based on the control program (S16). If all PP cycles have not been completed (S16: No), the control device 85 executes the PP cycles (S13-S15). If all PP cycles have been completed (S16: Yes), the control device 85 executes the unloading process of the board 90 (S17). In the unloading process of the board 90, the board transport device 20 unclamps the positioned board 90 and unloads the board 90 from the component mounting machine 10.

[0074] 5-2. Control of head moving device 40 during imaging operation In the preparation process for the mounting process (S12), as described above, imaging of the reference marks 96 and barcodes 97 is performed using the board camera 82. In particular, as shown in FIG. 11 , when the board 90 is a multiple board 90A, the number of reference marks 96 to be imaged may be greater than that of a normal board 90. Here, the multiple board 90A is configured by arranging a plurality of unit boards 91, each having the same wiring pattern 92, in the X and Y directions. Furthermore, in accordance with the arrangement of the plurality of unit boards 91, a plurality of reference marks 96 are provided in a matrix along the X and Y directions on the multiple boards 90A.

[0075] In this embodiment, in order to improve the efficiency of the imaging operation targeting the above-described reference marks 96 and the like, a preparatory process is performed using two board cameras 82. Specifically, in the imaging operation of imaging each of the plurality of reference marks 96, while the imaging operation is being performed by one of the two board cameras 82 (e.g., the left board camera 82L), the control device 85 performs a positioning operation to an X-direction position among the imaging positions corresponding to the imaging operation by the other one of the plurality of board cameras 82 (e.g., the right board camera 82R).

[0076] Then, after the imaging operation by the left board camera 82L is completed, a positioning operation is performed to a Y-direction position among the imaging positions corresponding to the imaging operation by the right board camera 82R. This makes it possible to perform imaging operations using the two board cameras 82 (at least the XY movement and imaging process of the left board camera 82L and the X movement of the right board camera 82R) in parallel. Note that in the above example, if the imaging position corresponding to the imaging operation of the right board camera 82R falls within the camera field of view of the board camera 82R, the control device 85 moves the multiple board cameras 82 so that a pair of reference marks 96 spaced apart in the X direction can be simultaneously imaged by the two board cameras 82L, 82R.

[0077] This makes it possible to efficiently capture images of the multiple reference marks 96 arranged in a matrix, thereby reducing the time required to recognize the reference marks 96. The above-described imaging operation can also be applied to processes such as reading the barcode 97, determining whether or not the board 90 is warped, the state of the components 98 already mounted, and the state of the printed solder. This reduces the time required for the preparation process (S12).

[0078] 5-3. Control of head moving device 40 during pickup operation In the pickup cycle (S13) of the mounting process, as described above, the pickup operation of components 98 is performed using multiple suction nozzles 74. In this embodiment, to improve the efficiency of the pickup cycle of components 98, the pickup operation is performed using two mounting heads 70. The pickup operation is an operation of picking up components 98 supplied by multiple feeders 31 arranged at a predetermined interval in the X direction. The control device 85 performs an operation of positioning the suction nozzles 74 in the X direction so that the separation distance in the X direction between the suction nozzles 74 supported by each of the two mounting heads 70 is an integer multiple of the above-mentioned predetermined interval.

[0079] Specifically, while one of the two mounting heads 70 (e.g., the left mounting head 70L) is performing a collection operation, the control device 85 performs a positioning operation of the suction nozzle 74 to a position in the X direction among the collection positions corresponding to the collection operation by the other of the two mounting heads 70 (e.g., the right mounting head 70R). Then, after the collection operation by the left mounting head 70L is completed, the control device 85 performs a positioning operation to a position in the Y direction among the collection positions corresponding to the collection operation by the right mounting head 70R. This allows the collection operations using the two mounting heads 70 (at least the XY movement and collection process of the left mounting head 70L and the X movement of the right mounting head 70R) to be performed in parallel.

[0080] When multiple feeders 31 are installed in the component supply device 30, individual placement errors may occur in the feeders 31 due to individual differences in the feeders 31 and slots. After the feeders 31 are installed, the control device 85 can recognize the placement errors by, for example, acquiring reference marks attached to the top surfaces of the feeders 31. In the above example, the picking position corresponding to the picking operation of the right-side mounting head 70R may fall within the allowable range for the picking operation by the suction nozzle 74 of the right-side mounting head 70R, even when taking into account the placement errors of the feeders 31.

[0081] At this time, the control device 85 may perform the picking operation by positioning the multiple placement heads 70L, 70R so that two components 98 spaced apart in the X direction can be simultaneously picked by the two placement heads 70L, 70R. Also, even if the placement error of the feeder 31 is not within the tolerance range, the X-direction position of the right placement head 70R can be adjusted and the Y-direction position of the component 98 can be adjusted by transporting the carrier tape by the feeder 31, thereby bringing the supply position of the component 98 within the tolerance range and allowing the two placement heads 70L, 70R to simultaneously pick up the component.

[0082] 5-4. Control of head moving device 40 during mounting operation In the mounting cycle (S15) of the mounting process, as described above, the mounting operation of components 98 is performed using multiple suction nozzles 74. In this embodiment, the mounting operation is performed using two mounting heads 70 to improve the efficiency of the mounting cycle of components 98. Here, as shown in FIG. 11, the substrate 90 is a multiple substrate 90A, with multiple unit substrates 91 arranged side by side in the X direction.

[0083] The control device 85 performs positioning operations of the suction nozzles 74 in the X direction so that the separation distance in the X direction between the suction nozzles 74 supported by each of the two mounting heads 70 is an integer multiple of the distance between a pair of adjacent unit substrates 91 in the X direction. The control device 85 then controls the two mounting heads 70 to perform mounting operations once each in turn on the target substrates set as the mounting targets for the current PP cycle from among the multiple unit substrates 91.

[0084] Specifically, while one of the two mounting heads 70 (e.g., the left mounting head 70L) is performing a mounting operation, the control device 85 performs a positioning operation of the suction nozzle 74 to a position in the X direction among the mounting positions corresponding to the mounting operation by the other of the two mounting heads 70 (e.g., the right mounting head 70R). Then, after the mounting operation by the left mounting head 70L is completed, the control device 85 performs a positioning operation of the suction nozzle 74 to a position in the Y direction among the mounting positions corresponding to the mounting operation by the right mounting head 70R.

[0085] This allows the placement operations (at least the XY movement of the left placement head 70L and the X movement of the right placement head 70R) to be performed in parallel using the two placement heads 70. After the placement cycle for a predetermined target substrate among the plurality of unit substrates 91 is completed, the control device 85 sequentially executes the placement cycle for another target substrate. By repeating this process, the placement process for the multiple substrate 90A is completed.

[0086] 6. Effects of the Configuration of the Embodiment According to the configuration of the embodiment, the suspension structure in which the Y slide 60 is supported below the beam 13 ensures a relatively large range of movement Mr of the X slide 50 relative to the X-direction dimension of the component mounting machine 10. Furthermore, the configuration in which multiple X slides 50 can move independently in the X direction makes it possible to vary the separation distance between multiple mounting heads 70 to accommodate various production modes.

[0087] This allows for greater flexibility in the placement of feeders 31 that supply components 98, for example, in processes that perform simultaneous picking operations. Furthermore, since errors in the supply positions of components 98 in feeders 31 can be absorbed, conditions such as the size of components 98 to which the above process can be applied can be relaxed. As a result, production efficiency can be improved.

[0088] Furthermore, in the first aspect of the head moving device 40, the support ranges Cr of the pair of wide carriages 52W overlap each other, so the mounting heads 70 supported by the pair of X slides 50 can be closer together than before, ensuring a sufficient range of movement Mr. Also, by having a pair of wide carriages 52W, a larger support range Cr can be ensured in the X direction, making it possible to reliably support each mounting head 70.

[0089] Furthermore, in the second aspect of the head moving device 40, the X slide 50 is supported at three or more different support positions Ps, making it possible to reliably support the mounting head 70 while ensuring the movable range Mr of the mounting head 70. Furthermore, a configuration that combines the first and second aspects of the head moving device 40 can further improve the supporting force provided by the Y slide 60. This makes it possible to increase the maximum speed and maximum acceleration of the movement of the mounting head 70 in the X direction.

[0090] 7. Modifications of the Embodiment In the embodiment, the head moving device 40 is configured to include two X slides 50, each of which moves a mounting head 70 attached thereto. However, the head moving device 40 may also be configured to include three or more X slides 50 and three or more mounting heads 70 attached thereto. Even in such a configuration, by making it possible to independently move three or more mounting heads 70 in the X direction, it is possible to apply control similar to that in the embodiment and improve production efficiency.

[0091] In the embodiment, the component mounting machine 10 employs a suspended head moving device 40. However, the first characteristic feature (wide carriage) and the second characteristic feature (three or more guide rails) of the head moving device 40 can be applied to structures other than the suspended type. Furthermore, since the multiple X slides 50 are supported by the Y slides 60 at the same Y-direction position, the head moving device 40 is configured to share the stator 42 of the X drive device 41, which is a linear motor. However, the X drive device 41 may be configured to have a direct-acting mechanism other than a linear motor for each of the multiple X slides 50.

[0092] In the embodiment, the substrate-related operation machine is a component mounting machine 10 that performs a mounting process. However, the substrate-related operation machine may be an apparatus other than a component mounting machine, as long as it is configured to perform various substrate-related operations by moving a work head in the XY direction. Specifically, the substrate-related operation machine may be a solder printer, a bonding material application device, or an inspection device that inspects a substrate 90 on which components 98 are mounted, which may be part of a production line together with the component mounting machine 10.

[0093] 5: Host computer, 10: Component mounting machine (substrate-related operation machine), 11: Base, 12: Pair of columns, 13: Beam, 20: Substrate transport device, 30: Component supply device, 31: Feeder, 40: Head moving device, 41: X drive device, 46: Y drive device, 47: Guide rail, 50, 50L, 50R: X slide (first slide), 51: Head support section, 52: Carriage, 52W, 52W1, 52W2: Wide carriage, 55, 55L, 55R: Storage section, 60: Y slide (second slide), 61: Guide rail, 62: First support surface, 63: Second support surface, 70, 70L, 70R: Mounting head (operation head), 71: Head body, 72: Rotating body, 74: Suction nozzle (holding member), 77, 77L, 77R: lifting device, 81: component camera, 82, 82L, 82R: board camera, 85: control device, 90: board, 90A: multiple board, 91: unit board, 92: wiring pattern, 96: reference mark, 97: bar code, 98: component

Claims

1. A substrate-related operation machine comprising: a head support section that supports a working head used for substrate-related operations; and a plurality of first slides each having a plurality of carriages movably supported along a pair of parallel guide rails that extend in a horizontal first direction; and a second slide that is provided with a plurality of pairs of guide rails, each supporting the plurality of first slides so that they are movably independent of each other in the first direction, and moving the plurality of first slides together in a horizontal second direction that intersects the first direction; at least one of the plurality of carriages is a wide carriage that is supported by the guide rails with a width that is wider in the first direction than the width in the first direction of the working heads supported by the first slides; the working heads that are supported by the plurality of first slides and form a pair are arranged side by side in the first direction on the same plane that is perpendicular to the second direction; and when the pair of working heads approach each other to a predetermined distance in the first direction due to relative movement of the pair of first slides, the support ranges in the first direction in which the wide carriages of the pair of first slides are respectively supported by the guide rails overlap with each other when the second slide is viewed in a plane from the second direction.

2. A substrate-related work machine as described in claim 1, wherein when the pair of work heads approach each other to the specified distance in the first direction due to relative movement of the pair of first slides, a portion of the wide carriage of one of the pair of first slides is accommodated in an accommodating portion provided on the other of the pair of first slides, so that the support ranges in the first direction in which the wide carriages of the multiple first slides are respectively supported by the guide rails overlap each other.

3. The substrate-related operating machine according to claim 2, wherein each of the pair of first slides has the accommodating portion for accommodating the wide carriage of the adjacent first slide.

4. A substrate-related operating machine as described in any one of claims 1 to 3, wherein the wide carriage of one of the pair of first slides protrudes from the end of the head support portion of the first slide in the first direction toward the other of the pair of first slides.

5. A substrate-related operating machine as described in any one of claims 1 to 3, wherein when the pair of first slides move relative to each other and the pair of working heads come closest to each other in the first direction, the width occupied by the pair of first slides in the first direction is smaller than the width occupied by the pair of working heads.

6. A substrate-related operating machine according to any one of claims 1 to 3, wherein the plurality of operating heads are of the same type and are interchangeable with one another.

7. The substrate-related operating machine according to any one of claims 1 to 3, wherein the operating head has a shape such that its length in the second direction is greater than its width in the first direction.

8. A substrate-related operation machine as claimed in any one of claims 1 to 3, wherein the operation head is a mounting head that supports a plurality of holding members that hold components so that they can be raised and lowered, and is used in a mounting process to mount the components on a substrate as the substrate-related operation.

Images