Production management device, production management method, and production management program

Abstract

A management computer 3 comprises: a prediction calculation unit 32 that calculates a predicted usage amount 31e for each material on the basis of information about a production plan (production plan information 31a) including the type and number of mounting boards produced in component mounting lines L1-L2; an acquisition unit 34 that acquires an actual disposal amount 31i for each material generated when the mounting boards are produced according to the production plan; and a display unit 38 that compares and displays the predicted usage amount 31e and the actual disposal amount 31i.

Description

Production management device, production management method, and production management program

[0001] The present disclosure relates to a production management device, a production management method, and a production management program that manage the production of mounted boards on a component mounting line.

[0002] In component mounting lines that produce mounted boards, materials such as solder printed on boards by a printing device and components mounted on boards by a component mounting device are used. If printing errors or component mounting errors occur during the process of producing mounted boards, materials are discarded due to repairs, retries, etc. Because an increase in discarded materials increases production costs, it is important to understand the amount of discarded materials generated on component mounting lines (see, for example, Patent Document 1). Patent Document 1 discloses a management system that acquires events that occur in manufacturing equipment, classifies the causes of the events from four perspectives: machines, people, materials, and methods, and compares and displays indicators such as operating rates and raw material yields, thereby enabling understanding of the capabilities and issues of the manufacturing line.

[0003] Japanese Patent Application Publication No. 2017-102669

[0004] Although slowing down the production speed to reduce printing errors and mounting errors can reduce the amount of material waste, it also leads to a decrease in production efficiency and an increase in production costs. Conventional technologies, including those disclosed in Patent Document 1, can identify issues from the raw material yield based on past performance, but there is still room for further improvement in order to appropriately improve the component mounting line by comprehensively considering production efficiency and other factors.

[0005] Therefore, an object of the present disclosure is to provide a production management device, a production management method, and a production management program that can appropriately grasp the waste of materials on a component mounting line.

[0006] The production management device disclosed herein includes a prediction calculation unit that calculates a predicted usage amount for each material based on information related to a production plan including the board type and production quantity of mounted boards to be produced on a component mounting line that produces mounted boards using materials; an acquisition unit that acquires the actual waste amount for each material that occurred when the mounted boards were produced in accordance with the production plan; and a display unit that compares and displays the predicted usage amount with the actual waste amount.

[0007] Another production management device of the present disclosure includes an acquisition unit that acquires actual amounts of materials used and actual amounts of materials discarded when a mounted board is produced in accordance with a production plan for producing the mounted board on a component mounting line, and a display unit that displays the actual amounts of materials used and discarded for each predetermined period.

[0008] Another production management device of the present disclosure includes a prediction calculation unit that calculates a predicted waste amount to be discarded for each material used in producing mounted boards, based on information regarding the frequency of work errors on a component mounting line that produces mounted boards and information regarding a production plan including the type of mounted board to be produced and the production quantity; an acquisition unit that acquires the actual waste amount for each material that occurred when the mounted boards were produced in accordance with the production plan; and a display unit that compares and displays the predicted waste amount and the actual waste amount.

[0009] The production management method disclosed herein calculates a predicted usage amount for each material based on information about a production plan including the board type and production quantity of mounted boards to be produced on a component mounting line that produces mounted boards using materials, obtains the actual waste amount for each material that occurred when the mounted boards were produced in accordance with the production plan, and compares the predicted usage amount with the actual waste amount and displays the result on a display unit.

[0010] The production management program of the present disclosure causes a computer to execute the production management method according to claim 13.

[0011] Another production management method disclosed herein acquires the actual amounts of materials used and the actual amounts of materials discarded when a mounted board is produced on a component mounting line in accordance with a production plan for producing the mounted board, and displays the actual amounts of materials used and the actual amounts of materials discarded for each predetermined period on a display unit.

[0012] Another production management program of the present disclosure causes a computer to execute the production management method according to claim 15.

[0013] Another production management method disclosed herein calculates a predicted waste amount for each material used in producing mounted boards based on information relating to the frequency of work errors on a component mounting line that produces mounted boards and information relating to a production plan including the type of mounted board to be produced and the number of boards to be produced, obtains the actual waste amount for each material that occurred when the mounted boards were produced in accordance with the production plan, and compares the predicted waste amount with the actual waste amount and displays the result on a display unit.

[0014] Another production management program of the present disclosure causes a computer to execute the production management method according to claim 17.

[0015] According to the present disclosure, it is possible to appropriately grasp the waste of materials in a component mounting line.

[0016] FIG. 1 is a block diagram showing the configuration of a component mounting system according to an embodiment of the present disclosure; FIG. 2 is a block diagram showing the configuration of a component mounting system according to an embodiment of the present disclosure; FIG. 3 is a diagram showing an example of a waste rate display screen displayed on a display unit provided in a management computer (production management device) according to an embodiment of the present disclosure; FIG. 4 is a diagram showing an example of a waste rate display screen displayed on a display unit provided in a management computer (production management device) according to an embodiment of the present disclosure; FIG. 5 is a flowchart showing a production management method according to an embodiment of the present disclosure;

[0017] Hereinafter, with reference to the accompanying drawings as appropriate, detailed descriptions of embodiments specifically disclosing a production management device, a production management method, and a production management program according to the present disclosure will be provided. However, more detailed descriptions than necessary may be omitted. For example, detailed descriptions of well-known matters and redundant descriptions of substantially identical configurations may be omitted. This is to avoid unnecessary redundancy in the following description and to facilitate understanding by those skilled in the art. Note that the accompanying drawings and the following description are provided to enable those skilled in the art to fully understand the present disclosure, and are not intended to limit the subject matter recited in the claims.

[0018] An embodiment of the present disclosure will be described in detail below with reference to the drawings. The configurations, shapes, and the like described below are merely examples for explanatory purposes and can be modified as appropriate depending on the specifications of the component mounting system, component mounting line, and management computer (production management device). Corresponding elements in all drawings will be denoted by the same reference numerals, and redundant description will be omitted. In FIGS. 1 and 2 , the left side of the paper is the upstream side and the right side is the downstream side in the board transport direction (the left-right direction in FIGS. 1 and 2 ). Also, in FIGS. 1 and 2 , the right side of the paper is the front side and the left side is the rear side in the direction perpendicular to the board transport direction in a horizontal plane (the up-down direction in FIGS. 1 and 2 ).

[0019] First, the configuration of a component mounting system 1 will be described with reference to Fig. 1. Fig. 1 is a diagram illustrating the configuration of a component mounting system 1 according to an embodiment of the present disclosure. The component mounting system 1 has two component mounting lines L1 and L2 connected via a communication network 2 and managed by a management computer 3. Each component mounting line L1 and L2 is configured by connecting component mounting devices and the like, as will be described later, and has the function of producing mounted boards on which components are mounted.

[0020] Each of the component mounting lines L1-L2 has component mounting lanes L1F-L2F and component mounting lanes L1R-L2R on the front and rear sides, respectively, that have the function of producing mounted boards. The two component mounting lines L1-L2 are installed in parallel on floor 4, with the component mounting lane L1F on the front side of component mounting line L1 facing the component mounting lane L2R on the rear side of component mounting line L2.

[0021] 1, the management computer 3 that manages the production of mounted boards is installed inside the floor 4 where the component mounting lines L1-L2 are installed, but the management computer 3 may also be installed outside the floor 4. Furthermore, the component mounting system 1 does not need to have two component mounting lines L1, but may have one or three or more. Furthermore, the component mounting lines L1-L2 do not need to have two component mounting lanes on the front and rear sides, but may have one on each side.

[0022] Next, the detailed configuration of component mounting lines L1-L2 will be described with reference to FIG. 2. FIG. 2 is a configuration explanatory diagram of component mounting lines L1-L2 provided in component mounting system 1 according to an embodiment of the present disclosure. Component mounting lines L1-L2 have the same configuration, and component mounting line L1 will be described below. Component mounting line L1 is configured by connecting in series, from upstream to downstream in the board transport direction, a board supply device M1, a board allocation device M2, a printing device M3, a printing inspection device M4, a board allocation device M5, component mounting devices M6-M8, a board allocation device M9, a mounting inspection device M10, a board allocation device M11, a reflow device M12, a board allocation device M13, and a board removal device M14.

[0023] Each device on component mounting lines L1-L2 is connected to management computer 3 via communication network 2. Note that component mounting line L1 is not limited to a configuration of three component mounting devices M6-M8, and may have one, two, four or more component mounting devices M6-M8. Furthermore, management computer 3 may be connected to each device on component mounting lines L1-L2 via a line computer that manages each of component mounting lines L1-L2.

[0024] 2, board supply device M1 has two conveyors 5a and 5b on the front and rear sides, which are board supply work sections (work sections), and performs a board supply operation in which boards 6A and 6B of different board types are supplied and delivered to board sorting device M2 on the downstream side. Note that boards 6A and 6B may be the same board type. Board supply device M1 transports boards 6A and 6B stored in a magazine downstream in order.

[0025] 2, board sorting devices M2, M5, M9, M11, and M13 are equipped with a conveyor movement mechanism that moves a transport conveyor, which is a board sorting work unit (working unit), between the front side and the rear side, and perform a board sorting work of sorting and delivering boards 6A and 6B received from an upstream device to a downstream device. Board sorting devices M2 and M9 receive boards 6A and 6B onto the transport conveyor from two conveyors, one on the front side and one on the rear side, connected upstream, and move the transport conveyor while holding the boards 6A and 6B, and deliver them in order to a single conveyor connected downstream.

[0026] The board sorting devices M5 and M13 receive the boards 6A and 6B from a single conveyor connected upstream onto a transport conveyor, move the transport conveyor while holding the boards 6A and 6B, and distribute and transfer them to two front and rear conveyors connected downstream. The board sorting devices M5 and M11 transport the boards 6A and 6B that are determined to be non-defective by the printing inspection device M4 and mounting inspection device M10 connected upstream to downstream devices, and collect the boards 6A and 6B that are determined to be defective into a magazine for collecting defective boards. In this way, the board sorting devices M5 and M11 function as defective collection devices that collect defective boards.

[0027] 2, the substrate recovery device M14 has two conveyors 5c and 5d on the front and rear sides, which are substrate recovery work sections (work sections), and performs a substrate recovery operation by receiving and recovering the substrates 6A and 6B, respectively, from the upstream substrate sorting device M13. The substrate recovery device M14 recovers the received substrates 6A and 6B in order into a magazine.

[0028] The printing device M3 performs a solder printing operation in which a solder printing work unit (work unit) prints (deposits) solder (material) through openings in a mask onto the boards 6A and 6B to be mounted. The printing device M3 transmits performance information, such as the number of boards 6A and 6B on which printing has been completed, to the management computer 3. Solder is the material that is printed onto the boards 6A and 6B by the printing devices M3 of the component mounting lines L1 and L2.

[0029] 2, the print inspection device M4 performs a print inspection operation in which a print inspection work unit (work unit) including a solder inspection camera inspects the state of the solder printed (deposited) on the boards 6A and 6B. Specifically, the print inspection device M4 detects solder misalignment, where the solder (material) deposited on the boards 6A and 6B by the printing device M3 deviates beyond an allowable range, or printing errors, where no solder is printed, and determines whether the solder printing operation by the printing device M3 is satisfactory.

[0030] The print quality judgment results from the print inspection device M4 are sent to the management computer 3 and the board allocation device M5. The boards 6A and 6B judged to be defective by the print inspection device M4 are collected into the magazine of the board allocation device M5. The boards 6A and 6B collected into the magazine of the board allocation device M5 are either discarded, or re-introduced into the component mounting line L1 after repair work to remove the printed solder, or re-introduced into the board allocation device M5 if an operator visually inspects them and judges that there are no problems. Information about the re-introduced boards 6A and 6B is stored in the management computer 3 as performance information.

[0031] 2, component mounting devices M6 to M8 each perform component mounting work by mounting components D (materials) on boards 6A and 6B using a component mounting work unit (work unit) that includes two conveyors on the front and rear sides, two component supply units, and two mounting heads. In component mounting devices M6 to M8, the two conveyors extending in the board transport direction are installed parallel to each other on the front and rear sides, and the two component supply units are installed on the outside (front and rear sides) of the two juxtaposed conveyors, respectively.

[0032] The component supply unit includes a plurality of tape feeders that feed carrier tapes holding components D to supply the components D, and a tray feeder that supplies the components D while switching trays holding a plurality of components D, and supplies the components D to a pickup position by the mounting head. The mounting head includes a suction nozzle that vacuum-sucks the components D, picks up the components D supplied by the component supply unit, and transfers and mounts them on the boards 6A and 6B that are held and positioned by a conveyor.

[0033] If a suction error (an error when picking up component D) occurs in component mounting devices M6-M8 during component mounting work, preventing the suction nozzle from properly picking up component D from the component supply unit, the component D held by the suction nozzle is discarded in a collection box located on component mounting device M6-M8, and component D is picked up again from the component supply unit. Performance information such as suction errors that occur during component mounting work is sent to management computer 3. In this way, component D is the material that is mounted on boards 6A and 6B by component mounting devices M6-M8 of component mounting lines L1-L2. Furthermore, boards 6A and 6B are the material on which component D is mounted.

[0034] 2, the mounting inspection device M10 performs mounting inspection work by inspecting the state of the components D mounted on the boards 6A and 6B using a mounting inspection work unit (work unit) including a component inspection camera. Specifically, the mounting inspection device M10 detects component D misalignment that exceeds an allowable range for the components D (materials) mounted on the boards 6A and 6B by the component mounting devices M6 to M8, as well as mounting errors that prevent the components D from being mounted, and judges whether the component mounting work by the component mounting devices M6 to M8 is satisfactory.

[0035] The results of the mounting quality judgment by the mounting inspection device M10 are sent to the management computer 3 and the board allocation device M11. The boards 6A and 6B judged to be defective by the mounting inspection device M10 are collected into the magazine of the board allocation device M11. The boards 6A and 6B collected into the magazine of the board allocation device M11 are either discarded, or re-introduced into the component mounting line L1 after repair work to remove the mounted components D, or re-introduced into the board allocation device M11 if an operator visually inspects them and judges that there are no problems. Information about the re-introduced boards 6A and 6B is stored in the management computer 3 as performance information.

[0036] In this way, the print inspection device M4 and the mounting inspection device M10 function as board inspection devices that determine whether the boards 6A, 6B in production on the component mounting line L1 are good or bad. The boards 6A, 6B that are determined to be defective by the board inspection devices are collected into magazines by defective collection devices (board sorting device M5 and board sorting device M11).

[0037] In FIG. 2, the reflow device M12 heats the boards 6A and 6B brought into the device using a board heating section (working section) to harden the solder on the boards 6A and 6B and perform a board heating operation to join the electrode portions of the boards 6A and 6B to the component D.

[0038] Next, the configuration of component mounting system 1 will be described with reference to FIG. 3. FIG. 3 is a block diagram showing the configuration of component mounting system 1 according to an embodiment of the present disclosure. Here, the configuration will be described mainly in relation to the function as a production management device in which management computer 3 displays on a display unit the predicted and actual amounts of materials (substrates 6A, 6B, solder, and components D) used in the production of mounted boards. Component mounting lines L1 and L2 provided in component mounting system 1 have the same configuration, and component mounting line L1 will be described below. The devices provided in component mounting line L1 have the same configuration, and component mounting device M6 will be described below.

[0039] The component mounting device M6 includes an operation control unit 20, an operation unit 21, an apparatus memory unit 22, a monitoring unit 23, and an apparatus communication unit 24. The operation control unit 20 controls the operation unit 21 based on various data stored in the apparatus memory unit 22, thereby controlling the component mounting operation by the component mounting device M6. The operation control unit 20 controls the board transport operation by the board transport devices (board supply device M1, board sorting devices M2, M5, M9, M11, M13, and board removal device M14), the solder printing operation by the printing device M3, the inspection operation by the board inspection devices (printing inspection device M4, mounting inspection device M10), and the board heating operation by the reflow device M12.

[0040] The monitoring unit 23 monitors the occurrence of events, such as pickup errors, that occur in the component mounting device M6, and when an event occurs, notifies the management computer 3. The device communication unit 24 is a communication interface, and sends and receives signals and data to and from other devices and the management computer 3 via the communication network 2.

[0041] 3, the management computer 3 includes a management control unit 30, a management storage unit 31, a prediction calculation unit 32, a collection unit 33, an acquisition unit 34, a waste rate calculation unit 35, a display processing unit 36, an input unit 37, a display unit 38, and a management communication unit 39. The input unit 37 is an input device such as a keyboard, a touch panel, or a mouse, and is used for inputting operation commands and data. The display unit 38 is a display device such as a liquid crystal panel, and displays various screens such as an operation screen for operation by the input unit 37, as well as various types of information. The management communication unit 39 is a communication interface, and transmits and receives signals and data to and from devices on the component mounting lines L1 and L2 via the communication network 2.

[0042] The management control unit 30 is a computing device such as a CPU, and manages the component mounting system 1 based on information stored in the management storage unit 31. The management storage unit 31 is a storage device, and stores, in addition to component mounting data, production plan information 31a, mounting board information 31b, occurrence frequency information 31c, cost information 31d, predicted usage amount 31e, predicted waste amount 31f, actual information 31g, actual usage amount 31h, actual waste amount 31i, waste cause information 31j, waste rate 31k, and the like.

[0043] 3, production plan information 31a includes information related to a production plan, including the board types (categories) and production quantities of mounted boards to be produced on component mounting lines L1-L2 using materials (boards 6A, 6B, solder, and components D). For example, production plan information 31a includes the board types of the mounted boards to be produced, the component mounting lanes L1F-L2F, L1R-L2R that will produce the mounted boards, the production quantities, and the scheduled production start date and time. Mounted board information 31b includes, for each board type of mounted board produced on component mounting lines L1-L2, the types of components D to be mounted on boards 6A, 6B, their mounting positions, the amount of solder printed per board 6A, 6B, and the like.

[0044] The mounting board information 31b may include information on the opening dimensions of the mask of the printing device M3 instead of the amount of solder printed per board 6A, 6B. The amount of solder printed per board 6A, 6B may also be calculated based on the opening dimension information of the mask of the printing device M3.

[0045] The occurrence frequency information 31c includes information regarding the frequency of occurrence of work errors (printing errors, pickup errors, mounting errors, etc.) on the component mounting lines L1 to L2 for each type of mounted board produced on the component mounting lines L1 to L2. The occurrence frequency is determined based on past production results, etc. The occurrence frequency is also determined for each work condition (work speed, etc.) of the equipment on the component mounting lines L1 to L2.

[0046] 3, cost information 31d includes information regarding material costs (costs) per predetermined quantity of each material (boards 6A, 6B, solder, and components D) used in the mounting boards produced on component mounting lines L1 and L2. For example, cost information 31d stores the cost per board 6A, 6B, the cost of solder printed on each board 6A, 6B, the cost per component D, etc.

[0047] The cost information 31d may be material costs that are input and set by the worker in advance. It may also be acquired from a management device other than the management computer 3. Specifically, the cost per unit may be calculated from the purchase quantity and purchase price stored in an MRP (Material Requirements Planning System). For materials whose purchase price varies depending on the time of purchase, a representative value such as an average cost may be calculated and used as the material cost. The cost information 31d may be calculated by the management computer 3, or the management computer 3 may acquire cost information 31d calculated by the MRP.

[0048] In FIG. 3 , the prediction calculation unit 32 calculates a predicted amount of material to be used 31 e and a predicted amount of material to be discarded 31 f for each material used in the production of the mounting board based on the production plan information 31 a, the mounting board information 31 b, and the occurrence frequency information 31 c, and stores these in the management memory unit 31.

[0049] Specifically, the prediction calculation unit 32 calculates the predicted usage amount 31e of solder (material) by multiplying the amount of solder printed on one board 6A, 6B by the number of mounted boards produced. The prediction calculation unit 32 also extracts the number of components (theoretical number) to be mounted on one board 6A, 6B from information related to the mounting positions on the mounted boards, and further multiplies this by the number of mounted boards produced to calculate the predicted usage amount 31e of component D (material).

[0050] The prediction calculation unit 32 also calculates the predicted number of boards 6A, 6B to be discarded due to printing errors from the production volume of mounted boards and the frequency of printing errors. The prediction calculation unit 32 then multiplies the number of discarded boards by the amount of solder printed on one board 6A, 6B to calculate the predicted discard amount 31f of solder (material) to be discarded due to printing errors.

[0051] Furthermore, the prediction calculation unit 32 calculates the predicted number of discarded boards 6A, 6B that will be discarded due to mounting errors from the production volume of mounted boards and the frequency of mounting errors. Then, the prediction calculation unit 32 multiplies the discarded number by the number of components (theoretical number) that can be mounted on one board 6A, 6B to calculate the predicted number of discarded components D (materials) that will be discarded after being mounted on the boards 6A, 6B due to mounting errors.

[0052] Furthermore, the prediction calculation unit 32 calculates a predicted number of discarded components D (materials) that will be discarded before being mounted on the boards 6A, 6B due to a pickup error, based on the production volume of mounted boards and the frequency of pickup errors.The prediction calculation unit 32 then calculates a predicted discard amount 31f of discarded components D (materials) by adding together the predicted number of discarded components D (materials) that will be discarded after mounting due to a mounting error and the predicted number of discarded components D (materials) that will be discarded before mounting due to a pickup error.Note that if an operator visually checks the components D after recovery due to a mounting error and determines that there are no problems, or if there are boards 6A, 6B that have been repaired and re-introduced into the component mounting lines L1-L2, the prediction calculation unit 32 does not add the number of components D that have not been removed from the re-introduced boards 6A, 6B to the predicted discard amount 31f of discarded components D (materials).

[0053] Furthermore, the prediction calculation unit 32 calculates the predicted discard amount 31f of the discarded boards 6A, 6B (materials) by adding up the predicted number of boards 6A, 6B to be discarded due to printing errors and the predicted number of boards 6A, 6B to be discarded due to mounting errors. Note that, if an operator visually checks the component mounting lines L1-L2 after repair and determines that there is no problem, or if there are re-input boards 6A, 6B, the prediction calculation unit 32 calculates the predicted discard amount 31f by subtracting the number of re-input boards 6A, 6B from the predicted number of boards to be discarded.

[0054] In FIG. 3 , the forecast calculation unit 32 further calculates a cost-based (amount-based) forecast usage amount 31 e and a forecast disposal amount 31 f from the calculated number-based forecast usage amount 31 e and forecast disposal amount 31 f for each material (boards 6A and 6B, solder, and component D) based on the cost information 31 d, and stores them in the management memory unit 31.

[0055] Specifically, the prediction calculation unit 32 calculates a predicted discard amount 31f of the boards 6A, 6B converted into costs by multiplying the cost of one board 6A, 6B included in the cost information 31d by the predicted number of discarded boards 6A, 6B (materials) to be discarded. The predicted discard amount 31f is calculated by multiplying the cost of solder printed on one board 6A, 6B included in the cost information 31d by the amount of discarded solder (materials). The predicted discard amount 31f is calculated by multiplying the cost of one part D included in the cost information 31d by the predicted number of discarded parts D (materials) to be discarded.

[0056] In FIG. 3, the collection unit 33 collects information about events that have occurred in each device from the monitoring unit 23 provided in each device on the component mounting lines L1 to L2, and stores the information in the management memory unit 31 as performance information 31g.

[0057] Specifically, the collection unit 33 collects information on events such as printing errors that occurred in the printing device M3 from the monitoring unit 23 of the printing device M3. The collection unit 33 also collects information on events (information on defective boards) such as misalignment of solder or misalignment of components D detected by the board inspection devices (printing inspection device M4, mounting inspection device M10) from the monitoring units 23 of the board inspection devices. The collection unit 33 also collects information on events such as pickup errors that occurred in the component mounting devices M6 to M9 from the monitoring units 23 of the component mounting devices M6 to M9. The collection unit 33 also stores, as performance information 31g, information on events that were visually confirmed by an operator and deemed to be normal among the boards 6A, 6B that were determined to be defective and collected by the defective collection device (board sorting device M5, M11), as well as information on events in which the boards were reintroduced into the component mounting lines L1 to L2 after repair.

[0058] 3 , the acquisition unit 34 acquires, for each material used in the production of a mounting board, an actual usage amount 31h of a material used when the mounting board was produced in accordance with the production plan and an actual disposal amount 31i of a material that was discarded, from the performance information 31g stored in the management storage unit 31, and stores these in the management storage unit 31. In addition, the acquisition unit 34 acquires disposal cause information 31j related to the disposal of materials from the performance information 31g stored in the management storage unit 31, and stores these in the management storage unit 31.

[0059] The discard cause information 31j includes information about printing errors in the solder deposited on the boards 6A and 6B that occur in the printing device M3. The discard cause information 31j also includes information about errors (suction errors) that occur in the component mounting devices M6 to M9 when picking up the components D and mounting errors that occur when mounting the components D on the boards 6A and 6B. The discard cause information 31j also includes information about misalignment of the solder deposited on the boards 6A and 6B or misalignment of the mounted components D that are detected by the board inspection devices (print inspection device M4, mounting inspection device M10).

[0060] 3, the waste rate calculation unit 35 calculates a waste rate 31k (waste amount / usage amount), which is the ratio of the amount of material discarded to the amount of material used in the production of the mounting board, and stores the calculated waste rate in the management storage unit 31. For example, the waste rate calculation unit 35 calculates the waste rate 31k from the predicted usage amount 31e and the predicted waste amount 31f. The waste rate calculation unit 35 also calculates the waste rate 31k from the actual usage amount 31h and the actual waste amount 31i. The waste rate calculation unit 35 also calculates the waste rate 31k from the predicted usage amount 31e and the actual waste amount 31i.

[0061] The display processing unit 36 ​​causes the display unit 38 to display a waste rate display screen that compares and displays the predicted and actual amounts of materials used and discarded in the production of the mounting boards. The display processing unit 36 ​​also causes the waste rate 31k and waste cause information 31j to be displayed on the waste rate display screen.

[0062] Next, an example of a waste rate display screen 40 displayed on the display unit 38 by the display processing unit 36 ​​will be described with reference to Fig. 4. Fig. 4 is an explanatory diagram showing an example of the waste rate display screen 40 displayed on the display unit 38 provided in the management computer 3 (production management device) according to an embodiment of the present disclosure. The waste rate display screen 40 includes a display material selection frame 41, a display item selection frame 42, a display content selection frame 43, a waste rate display frame 44, a graph display frame 45, and a waste cause list display frame 46.

[0063] The display material selection frame 41 has radio buttons for selecting whether to display the total amount of materials (material total display), only the component D (component display), only the solder (solder display), or only the boards 6A and 6B (board display) as the materials to be displayed in the graph display frame 45. In this example, "component display" has been selected.

[0064] 4, the display item selection frame 42 has radio buttons for selecting whether the usage amount and disposal amount to be displayed in the graph display frame 45 are to be displayed on a number basis (number display) or on a cost basis (cost display). In this example, "number display" is selected. The display content selection frame 43 has radio buttons for selecting whether the graph display frame 45 is to display the predicted usage amount 31e and the actual disposal amount 31i (predicted usage display), whether to display the predicted and actual usage amount and disposal amount (prediction / actual display), or whether to display the predicted and actual disposal amount only (display disposal amount only). In this example, "predicted usage display" is selected.

[0065] The waste rate display frame 44 displays a line graph of the waste rate 31k calculated from the predicted usage amount 31e and the actual waste amount 31i based on the number of units for each month from March (Mar.) to July (Jul.). The graph display frame 45 displays a bar graph in which the predicted usage amount 31e and the actual waste amount 31i based on the number of units for each month from March (Mar.) to July (Jul.) are stacked up by month.

[0066] 4, the waste cause list display frame 46 displays a list of waste cause information 31j for the material selected in the display material selection frame 41. In this example, the waste causes of component D (material) are displayed in descending order of waste occurrence rate for each component mounting line L1-L2. This allows the user to properly understand the issues that need to be improved in order to reduce waste materials for each component mounting line L1-L2.

[0067] In this way, the display unit 38 compares the predicted usage amount 31e and the actual waste amount 31i for each material within a predetermined period (March to July) and displays them (graph display frame 45). The display unit 38 also displays the waste rate 31k calculated from the actual waste amount 31i and the predicted usage amount 31e for each predetermined period (one month) (waste rate display frame 44). The display unit 38 also displays a list of waste cause information 31j for each material (waste cause list display frame 46). This allows the user to properly understand the waste of materials on the component mounting lines L1 and L2.

[0068] Next, an example of a waste rate display screen 47 displayed on the display unit 38 by the display processing unit 36 ​​will be described with reference to Fig. 5. Fig. 5 is an explanatory diagram showing an example of a waste rate display screen 47 displayed on the display unit 38 provided in the management computer 3 (production management device) according to an embodiment of the present disclosure. In this example, "Parts display" is selected in the display material selection frame 41, "Quantity display" is selected in the display item selection frame 42, and "Prediction / Actual display" is selected in the display content selection frame 43.

[0069] The discard rate display frame 48 displays, in a line graph, a discard rate 31k (predicted) calculated from the predicted usage amount 31e and predicted discard amount 31f based on the number of units for each month from May (May) to July (Jul.), and a discard rate 31k (actual) calculated from the actual usage amount 31h and actual discard amount 31i based on the number of units. The graph display frame 49 displays, side by side, a bar graph in which the predicted usage amount 31e and predicted discard amount 31f based on the number of units for the period from May (May) to July (Jul.) are stacked for each month, and a bar graph in which the actual usage amount 31h and actual discard amount 31i based on the number of units are stacked for each month.

[0070] In this way, the display unit 38 displays the predicted usage amount 31e, the predicted disposal amount 31f, and the actual usage amount 31h and the actual disposal amount for each predetermined period (one month) (graph display frame 49). This allows the waste of materials on the component mounting lines L1 and L2 to be properly understood.

[0071] Next, an example of a waste rate display screen 50 displayed on the display unit 38 by the display processing unit 36 ​​will be described with reference to Fig. 6. Fig. 6 is an explanatory diagram showing an example of a waste rate display screen 50 displayed on the display unit 38 provided in the management computer 3 (production management device) according to an embodiment of the present disclosure. In this example, "Display parts" is selected in the display material selection frame 41, "Display costs" is selected in the display item selection frame 42, and "Display only waste amount" is selected in the display content selection frame 43.

[0072] The scrap rate display frame 51 displays, as line graphs, a scrap rate 31k (forecast) calculated from the cost-based forecasted usage amount 31e and the forecasted scrap amount 31f for each month from May (May) to July (Jul.), and a scrap rate 31k (actual) calculated from the cost-based actual usage amount 31h and the actual scrap amount 31i. Note that the cost-based scrap amount (disposal cost) is calculated taking into consideration the expenses (prices) that differ for each type of part D, so the cost-based scrap rate 31k differs from the number-based scrap rate 31k. The graph display frame 52 displays, side by side, a bar graph of the cost-based forecasted scrap amount 31f and a bar graph of the cost-based actual scrap amount 31i for the period from May (May) to July (Jul.).

[0073] In this way, the display unit 38 compares and displays the predicted waste amount 31f and the actual waste amount 31i (graph display frame 52), thereby enabling the user to properly grasp the waste of materials on the component mounting lines L1 and L2.

[0074] Next, a production management method (production management program) for comparing predicted and actual amounts of materials (substrates 6A, 6B, solder, and components D) used in the production of mounted boards and discarding the materials (substrates 6A, 6B, solder, and components D) and displaying the results on a display unit will be described with reference to the flow chart of Figure 7. Figure 7 is a flowchart of the production management method according to an embodiment of the present disclosure. The following description is based on the assumption that performance information 31g on the production of mounted boards in accordance with the production plan on component mounting lines L1 and L2 is collected and stored by a collection unit 33 in a management storage unit 31 of a management computer 3 (production management device).

[0075] First, the forecast calculation unit 32 calculates, for each material, a forecast usage amount 31e of components D to be used and a forecast disposal amount 31f of components D to be discarded when producing a mounted board according to the production plan, based on the production plan information 31a, the mounted board information 31b, the occurrence frequency information 31c, and the cost information 31d (ST1: forecast calculation step). Furthermore, the acquisition unit 34 acquires, from the performance information 31g, the actual usage amount 31h, the actual disposal amount 31i, and disposal factor information 31j of each material that occurred when the mounted board was produced according to the production plan (ST2: performance acquisition step).

[0076] 7, the waste rate calculation unit 35 then calculates a waste rate 31k from the predicted usage amount 31e and predicted waste amount 31f calculated in the prediction calculation step (ST1) and the actual usage amount 31h and actual waste amount 31i acquired in the actual result acquisition step (ST2) (ST3: waste rate calculation step). Next, the display processing unit 36 ​​compares the predicted and actual usage amounts and waste amounts and displays them on the display unit 38 (ST4: display step) (FIGS. 4 to 6). This makes it possible to appropriately grasp the waste of materials on the component mounting lines L1 and L2.

[0077] As described above, the management computer 3 of this embodiment is a production management device that includes: a forecast calculation unit 32 that calculates a forecast usage amount 31e for each material based on information about the production plan (production plan information 31a) including the board types and production quantities of the mounted boards produced on the component mounting lines L1 and L2 that produce mounted boards using the materials; an acquisition unit 34 that acquires an actual waste amount 31i for each material that occurred when the mounted boards were produced in accordance with the production plan; and a display unit 38 that compares and displays the forecast usage amount 31e and the actual waste amount 31i. This makes it possible to appropriately grasp the waste of materials on the component mounting lines L1 and L2.

[0078] Although the embodiments of the present disclosure have been described above with reference to the drawings, it goes without saying that the present disclosure is not limited to such examples. It is clear that a person skilled in the art can conceive of various modifications, alterations, substitutions, additions, deletions, and equivalents within the scope of the claims, and it is understood that these also naturally fall within the technical scope of the present disclosure. Furthermore, the components of the above-described embodiments may be combined in any manner as long as they do not deviate from the spirit of the invention.

[0079] This application is based on a Japanese patent application (Patent Application No. 2024-056936) filed on March 29, 2024, the contents of which are incorporated herein by reference.

[0080] The production management device, production management method, and production management program disclosed herein have the effect of enabling appropriate understanding of material waste on a component mounting line, and are useful in the field of component mounting where components are mounted on boards.

[0081] 3 Management computer (production management device) 6A, 6B Board (material) D Parts (material) L1-L2 Parts mounting line M3 Printing device M4 Printing inspection device (board inspection device) M6-M8 Parts mounting device M10 Mounting inspection device (board inspection device)

Claims

1. A production management device comprising: a prediction calculation unit that calculates a predicted usage amount for each material based on information related to a production plan including the type and production quantity of mounted boards produced on a component mounting line that uses materials to produce mounted boards; an acquisition unit that acquires the actual waste amount for each material that occurred when the mounted boards were produced in accordance with the production plan; and a display unit that displays a comparison between the predicted usage amount and the actual waste amount.

2. The production management device according to claim 1, wherein the display unit compares and displays the predicted usage amount and the actual waste amount within a predetermined period for each material.

3. The production management device according to claim 1, wherein the acquisition unit further acquires disposal cause information related to disposal of the material, and the display unit displays a list of the disposal cause information for each of the materials.

4. The production management device according to claim 3, wherein the discard cause information includes information regarding errors that occur when picking up components in the component mounting device of the component mounting line, and mounting errors that occur when mounting the components on a board.

5. A production management device according to claim 3, wherein the waste cause information includes information relating to printing errors in the solder deposited on the board that occur in a printing device of the component mounting line.

6. The production management device according to claim 3, wherein the discard cause information includes information regarding misalignment of solder deposited on the board or misalignment of mounted components detected by a board inspection device possessed by the component mounting line.

7. The production management device according to claim 1, wherein the material is a component to be mounted on a board by a component mounting device of the component mounting line.

8. The production management device according to claim 1, wherein the material is a substrate on which components are mounted.

9. The production management device according to claim 1, wherein the material is solder printed on a circuit board by a printing device of the component mounting line.

10. The production management device according to claim 1, wherein the display unit displays the waste rate calculated from the actual waste amount and the predicted usage amount for each predetermined period.

11. A production management device comprising: an acquisition unit that acquires the actual usage amount of material used and the actual waste amount of material generated when producing a mounted board on a component mounting line in accordance with a production plan for producing the mounted board; and a display unit that displays the actual usage amount and the actual waste amount for each predetermined period.

12. A production management device comprising: a prediction calculation unit that calculates a predicted waste amount to be discarded for each material used in the production of mounted boards, based on information regarding the frequency of work errors on a component mounting line that produces the mounted boards, and information regarding a production plan including the type of mounted board to be produced and the number of boards to be produced; an acquisition unit that acquires the actual waste amount for each material that occurred when the mounted boards were produced in accordance with the production plan; and a display unit that compares and displays the predicted waste amount and the actual waste amount.

13. A production management method comprising: calculating a predicted usage amount for each material based on information regarding a production plan including the type and production volume of mounted boards produced on a component mounting line that produces mounted boards using materials; obtaining the actual waste amount for each material that occurred when the mounted boards were produced in accordance with the production plan; and comparing the predicted usage amount with the actual waste amount and displaying the result on a display unit.

14. A production management program for causing a computer to execute the production management method according to claim 13.

15. A production management method comprising: acquiring the actual amounts of materials used and the actual amounts of materials discarded when producing mounted boards on a component mounting line in accordance with a production plan for producing the boards; and displaying the actual amounts of materials used and discarded for each specified period on a display unit.

16. A production management program for causing a computer to execute the production management method according to claim 15.

17. A production management method comprising: calculating a predicted amount of waste to be discarded for each material used in the production of mounted boards based on information relating to the frequency of operational errors on a component mounting line that produces mounted boards and information relating to a production plan including the type of mounted board to be produced and the number of boards to be produced; obtaining the actual amount of waste for each material that occurred when the mounted boards were produced in accordance with the production plan; and comparing the predicted amount of waste with the actual amount of waste and displaying the result on a display unit.

18. A production management program for causing a computer to execute the production management method according to claim 17.

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