Method for manufacturing disk-shaped substrate, and apparatus for manufacturing disk-shaped substrate

Abstract

This method for manufacturing a disk-shaped substrate includes: a support step of supporting a disk-shaped substrate by a support part at a first position on one surface of the disk-shaped substrate; a conveyance step of adsorbing the disk-shaped substrate at a second position on the other surface of the disk-shaped substrate, which faces the first position, by an adsorption part, and conveying the disk-shaped substrate onto a table of a processing apparatus while maintaining a state in which the adsorption part adsorbs the other surface; and a processing step of processing the disk-shaped substrate conveyed onto the table.

Description

Disk-shaped substrate manufacturing method and disk-shaped substrate manufacturing device

[0001] The present disclosure relates to a method and an apparatus for manufacturing a disk-shaped substrate.

[0002] Japanese Patent Publication No. 2535089, Japanese Patent Application Publication No. 2007-283457, and Japanese Patent Application Publication No. 2013-103321 disclose polishing machines equipped with an unmachined workpiece batch transfer device that transfers each workpiece waiting in an unmachined workpiece waiting section to a polishing section in a batch. In the polishing machine of Japanese Patent Publication No. 2535089, a dish-shaped workpiece receiving section receives and positions the unmachined workpieces before transferring them in a batch. In the polishing machines of Japanese Patent Application Publication No. 2007-283457 and Japanese Patent Application Publication No. 2013-103321, a loader tray receives and positions the unmachined workpieces before transferring them in a batch.

[0003] As described above, when a dish-shaped member is used as a positioning member for a disk-shaped substrate, such as a disk-shaped unmachined workpiece, the disk-shaped substrate is supported by the positioning member at the boundary between the bottom surface and the outer periphery of the disk-shaped substrate. Depending on the shape of the positioning member, a space may be created between the disk-shaped substrate and the bottom surface of the positioning member. Therefore, when the top surface of the disk-shaped substrate is pressed with a suction member or the like for bulk transport, the disk-shaped substrate may deform in the thickness direction.

[0004] Therefore, an object of the present disclosure is to provide a method and an apparatus for manufacturing a disk-shaped substrate that suppress deformation of the disk-shaped substrate in the thickness direction.

[0005] The present disclosure includes the following aspects. <1> A method for manufacturing a disk-shaped substrate, comprising: a supporting step of supporting a disk-shaped substrate with a support portion at a first position on one surface of the disk-shaped substrate; a transporting step of suctioning the disk-shaped substrate with a suction portion at a second position on the other surface of the disk-shaped substrate opposite the first position, and transporting the disk-shaped substrate onto a table of a processing device in a state where the suction portion is suctioning the other surface; and a processing step of processing the disk-shaped substrate transported to the table. <2> A method for manufacturing a disk-shaped substrate according to <1>, wherein the support portion has a ring shape that follows a circumferential direction of the disk-shaped substrate. <3> The method for manufacturing a disk-shaped substrate according to <1> or <2>, wherein a plurality of the suction portions are arranged along the circumferential direction of the disk-shaped substrate and suction the other surface at a plurality of second positions along the circumferential direction. <4> The method for manufacturing a disk-shaped substrate according to any one of <1> to <3>, wherein the disk-shaped substrate has an inner circumference and an outer circumference, and further comprises a step of positioning the disk-shaped substrate by bringing a positioning unit into contact with the inner circumference of the disk-shaped substrate before the other surface is sucked by the suction unit. <5> An apparatus for manufacturing a disk-shaped substrate, comprising: a support device having a support unit that supports the disk-shaped substrate at a first position on one surface of the disk-shaped substrate; a transport device having a suction unit that sucks the disk-shaped substrate at a second position on the other surface of the disk-shaped substrate opposite the first position, and transporting the disk-shaped substrate onto a table of a processing device to which the disk-shaped substrate is to be transferred while the suction unit is sucking the other surface; and a processing device that processes the disk-shaped substrate transported to the table. <6> The apparatus for manufacturing a disk-shaped substrate according to <5>, wherein the support unit has a ring shape that follows the circumferential direction of the disk-shaped substrate. <7> The disk-shaped substrate manufacturing apparatus described in <5> or <6>, wherein the suction portions are arranged in multiple positions along the circumferential direction of the disk-shaped substrate and adsorb to the other surface at multiple second positions along the circumferential direction.

[0006] According to the present disclosure, it is possible to provide a method and an apparatus for manufacturing a disk-shaped substrate that suppress deformation of the disk-shaped substrate in the thickness direction when an adsorption portion comes into contact with the disk-shaped substrate.

[0007] FIG. 1 is a perspective view showing a positioning device according to an embodiment of the present disclosure. FIG. 2 is a plan view showing a positioning unit according to an embodiment of the present disclosure. FIG. 3 is a side cross-sectional view showing a positioning unit according to an embodiment of the present disclosure. Specifically, a cross-sectional view taken along line 3-3 of FIG. 2. FIG. 4 is a side cross-sectional view showing a positioning unit and a conveying device according to an embodiment of the present disclosure. FIG. 5 is a side view showing a manufacturing apparatus according to an embodiment of the present disclosure. FIG. 6 is a side view showing a state in which an adsorption unit adsorbs a disk-shaped substrate positioned by the positioning unit in the manufacturing apparatus according to an embodiment of the present disclosure. FIG. 7 is a side view showing a state in which a conveying device conveys a disk-shaped substrate from the positioning unit to a stage of a processing device in the manufacturing apparatus according to an embodiment of the present disclosure. FIG. 8 is a side view showing a state in which the conveying device has conveyed the disk-shaped substrate to the stage of the processing device in the manufacturing apparatus according to an embodiment of the present disclosure.

[0008] Embodiments of the present disclosure will be described below. However, the present disclosure is not limited to the following embodiments. In the following embodiments, components are not essential unless otherwise specified. When embodiments are described with reference to drawings in the present disclosure, the configuration of the embodiment is not limited to the configuration shown in the drawings. Furthermore, the sizes of the components in each drawing are conceptual. Therefore, the front-to-back, left-to-right, and top-to-bottom dimensional ratios of each component, and the front-to-back, left-to-right, and top-to-bottom dimensional ratios between each component, are not limited to the illustrated dimensional ratios. Furthermore, the front-to-back, left-to-right, and top-to-bottom dimensional ratios of each component may differ from the actual dimensional ratios. Furthermore, unless otherwise specified in the present disclosure, the number of each component of the present disclosure is not limited to one, and multiple components may be present. Note that in the following description of the drawings, similar parts are designated by similar symbols.

[0009] <Manufacturing Apparatus 90> Hereinafter, as an example of the disk-shaped substrate manufacturing apparatus of the present disclosure, a manufacturing apparatus 90 will be described with reference to the drawings. Note that the disk-shaped substrate manufacturing apparatus of the present disclosure is not limited to the manufacturing apparatus 90.

[0010] The manufacturing apparatus 90 is an apparatus that processes the disk-shaped substrate 100 to manufacture the disk-shaped substrate 200. In other words, the disk-shaped substrate 200 is a processed disk-shaped substrate obtained by processing the disk-shaped substrate 100. As shown in Fig. 5 , the manufacturing apparatus 90 includes a positioning device 10, a transport device 30, and a processing device 40. The disk-shaped substrate 100, each part of the manufacturing apparatus 90, and modified examples of the manufacturing apparatus 90 will be described below.

[0011] <Disc-shaped substrate 100> The disc-shaped substrate 100 is a substrate formed in a disc shape, as shown in Figures 2 and 3. Specifically, the disc-shaped substrate 100 is formed in an annular shape having an inner periphery 100A, an outer periphery 100B, and a hole 100C surrounded by the inner periphery 100A in a plan view. Note that the plan view here refers to the case where the disc-shaped substrate 100 is viewed from one side in the thickness direction of the disc-shaped substrate 100. The disc-shaped substrate 100 is a substrate before processing by a processing device 40, which will be described later.

[0012] Furthermore, the disk-shaped substrate 100 is formed in a plate shape having a first surface 100J and a second surface 100K. The second surface 100K is an example of one surface. The first surface 100J is an example of the other surface. Note that the boundary portion between the first surface 100J and the inner periphery 100A of the disk-shaped substrate 100 and the boundary portion between the second surface 100K and the inner periphery 100A of the disk-shaped substrate 100 may be considered part of the inner periphery 100A. Furthermore, the boundary portion between the first surface 100J and the outer periphery 100B of the disk-shaped substrate 100 and the boundary portion between the second surface 100K and the outer periphery 100B of the disk-shaped substrate 100 may be considered part of the outer periphery 100B. Note that the aforementioned boundary portions can also be referred to as ridge portions.

[0013] The disk-shaped substrate 100 may be, for example, a substrate for a magnetic recording medium. Furthermore, the disk-shaped substrate 100 may be a substrate formed of a metal material such as aluminum or an aluminum alloy substrate, or glass. Hereinafter, aluminum substrates, aluminum alloy substrates, and glass substrates are collectively referred to as "substrates." A plating layer may be formed on the surface of the aluminum substrate. Furthermore, the disk-shaped substrate 100 to be positioned by the positioning device 10 may be, for example, a plurality of types of disk-shaped substrates 100 having the same inner diameter but different outer diameters.

[0014] The use, material, type, etc. of the disk-shaped substrate 100 are not limited to those described above, and various disk-shaped substrates can be used as the disk-shaped substrate 100.

[0015] <Positioning Device 10> The positioning device 10 is an example of a support device of the present disclosure. The positioning device 10 is a device that supports and positions the disk-shaped substrate 100. Specifically, as shown in FIG. 1 , the positioning device 10 includes, for example, a plurality of positioning units 12 and a support body 14.

[0016] 1, the support 14 has a function of supporting the positioning portion 12. The support 14 is formed in a disk shape. Specifically, the support 14 is formed in a substantially circular shape having an outer periphery 14B in a plan view. The plan view here refers to the case where the support 14 is viewed from one side in the thickness direction of the support 14.

[0017] 2 and 3, each of the positioning portions 12 supports the disk-shaped substrate 100. Furthermore, each of the positioning portions 12 contacts the inner periphery 100A of the disk-shaped substrate 100 and positions the disk-shaped substrate 100 in a direction along the radial direction of the disk-shaped substrate 100. The direction along the radial direction of the disk-shaped substrate 100 can also be referred to as a direction along the first surface 100J or the second surface 100K of the disk-shaped substrate 100.

[0018] As shown in Fig. 1, for example, five of the positioning portions 12 are provided on the upper surface of the support body 14. As shown in Figs. 1, 2, and 3, each of the positioning portions 12 has, for example, a base 20, a plurality of contact portions 21, a plurality of spaces 22, and a support portion 23. In Fig. 1, each portion of one of the positioning portions 12 is assigned a reference symbol.

[0019] As shown in Fig. 3, a disk-shaped substrate 100 is placed on the upper surface of the base 20. The base 20 is formed, for example, in a disk shape as shown in Fig. 1. Specifically, the base 20 is formed in a circular shape having an outer periphery 20B in a plan view as shown in Fig. 2. The plan view here refers to the case where the base 20 is viewed from one side in the thickness direction of the base 20. Note that disk-shaped substrates 100 having different outer diameters can be interchangeably placed on the base 20.

[0020] The base 20 has a smaller diameter than the disk-shaped substrate 100. As shown in Figures 2 and 3, when the disk-shaped substrate 100 is placed on the base 20, the disk-shaped substrate 100 protrudes beyond an outer periphery 20B of the base 20 toward the outer periphery of the base 20.

[0021] 2 and 3, each of the plurality of contact portions 21 is provided so as to be insertable into a hole 100C of the disk-shaped substrate 100 from the base 20 side. Each of the plurality of contact portions 21 is inserted into the hole 100C and comes into contact with the inner periphery 100A of the disk-shaped substrate 100. The plurality of contact portions 21 are provided, for example, on the upper surface of the base 20, in the center of the base 20 in a plan view. Furthermore, the plurality of contact portions 21 protrude upward from the base 20. The plurality of contact portions 21 are inserted into the hole 100C of the disk-shaped substrate 100 placed on the base 20. The tips of the contact portions 21 pass from the second surface 100K side to the first surface 100J side.

[0022] The plurality of contact portions 21 are arranged along the circumferential direction of the base 20. Therefore, in the positioning portion 12, the plurality of contact portions 21 come into contact with the inner periphery of the disk-shaped substrate 100 at a plurality of positions along the circumferential direction, and position the disk-shaped substrate 100 in a direction along the radial direction of the disk-shaped substrate 100.

[0023] Specifically, three of the contact portions 21 are arranged along the circumferential direction of the base 20. Therefore, the contact portions 21 come into contact with the inner periphery 100A of the disk-shaped substrate 100 at three positions along the circumferential direction. The contact portions 21 are arranged, for example, at equal angular intervals.

[0024] As described above, the positioning unit 12 positions the disk-shaped substrate 100 in the radial direction of the disk-shaped substrate 100 by contacting the inner periphery 100A of the disk-shaped substrate 100 with the multiple contact portions 21. In other words, the positioning unit 12 restricts movement of the disk-shaped substrate 100 in the radial direction of the disk-shaped substrate 100 by contacting the inner periphery 100A of the disk-shaped substrate 100 with the contact portions 21. Specifically, the positioning unit 12 positions the disk-shaped substrate 100 in, for example, two different directions along the radial direction of the disk-shaped substrate 100. These two different directions are, specifically, two orthogonal directions. The two different directions can be understood as, for example, the Y direction and the X direction in FIG. 2. Note that the contact portions 21 may be fixed or movable relative to the base 20 as long as they can contact the inner periphery 100A and position the disk-shaped substrate 100.

[0025] Each of the plurality of contact portions 21 has an outer peripheral surface 21B formed, for example, in an arc shape along the inner periphery 100A of the disk-shaped substrate 100. In the contact portion 21, the outer peripheral surface 21B contacts a part of the inner periphery 100A of the disk-shaped substrate 100 in the circumferential direction. The outer peripheral surface 21B has a predetermined outer diameter. Specifically, the predetermined outer diameter is an outer diameter corresponding to the inner diameter of the disk-shaped substrate 100.

[0026] The positioning unit 12 positions the disk-shaped substrate 100 in the thickness direction of the disk-shaped substrate 100 by placing the disk-shaped substrate 100 on the base 20. As described above, the positioning unit 12 positions the disk-shaped substrate 100 in the radial direction and thickness direction of the disk-shaped substrate 100.

[0027] The positioning portion 12 positions the disk-shaped substrate 100 without contacting the outer periphery 100B of the disk-shaped substrate 100. That is, in this embodiment, the positioning portion 12 does not have a portion that contacts the outer periphery 100B of the disk-shaped substrate 100. Note that this does not exclude a mode in which a member other than the positioning portion 12, such as an elastic member or a movable member, contacts the outer periphery 100B of the disk-shaped substrate 100, as long as the effect of this embodiment is not impaired.

[0028] The spaces 22 are spaces for receiving holding portions 82 (described later) that hold the disk-shaped substrate 100. The spaces 22 are arranged between the plurality of contact portions 21 along the circumferential direction of the base 20.

[0029] As shown in Fig. 3, the support portion 23 has a function of supporting the second surface 100K of the disk-shaped substrate 100 placed on the base 20. Specifically, as shown in Fig. 2 and Fig. 4, the support portion 23 supports the second surface 100K at a predetermined support position on the second surface 100K of the disk-shaped substrate 100. This support position is an example of the first position.

[0030] The support portion 23 is provided, for example, on the upper surface of the base 20, on the outer periphery of the contact portion 21. In this embodiment, the support portion 23 has, for example, a circular ring shape that follows the circumferential direction of the disk-shaped substrate 100. Therefore, the support position has a circular ring shape. For example, an O-ring made of an elastically deformable material such as rubber is used as the support portion 23. The support portion 23 is attached coaxially to the base 20 in a state where it protrudes above the upper surface of the base 20 relative to a groove 25 formed in the upper surface of the base 20.

[0031] As will be described later, a plurality of suction units 33 are arranged along the circumferential direction of the disk-shaped substrate 100, and come into contact with the first surface 100J of the disk-shaped substrate 100 at a plurality of contact positions along the circumferential direction. In contrast, the support units 23 support the second surface 100K of the disk-shaped substrate 100 at opposing positions that face the plurality of contact positions. In Fig. 2, the contact positions of the suction units 33 are indicated by the two-dot chain lines denoted by the reference numeral 33.

[0032] 3, the positioning unit 12 supports, for example, the disk-shaped substrate 100 placed above the upper surface of the base 20 only by the support portion 23. That is, a gap is formed between the disk-shaped substrate 100 supported by the support portion 23 and the base 20. The support portion 23 may be considered to be a member that constitutes part of the base 20.

[0033] As described above, in the positioning unit 12, the support unit 23 supports the second surface 100K at the support position, while the contact unit 21 positions the disk-shaped substrate 100 in a direction along the radial direction of the disk-shaped substrate 100. In the positioning device 10, the contact unit 21 of each of the positioning units 12 contacts the inner periphery 100A of each of the disk-shaped substrates 100, and positions the disk-shaped substrates 100 in a direction along the radial direction of the disk-shaped substrates 100.

[0034] <Modifications of the Positioning Device 10> The positioning device 10 positions the disk-shaped substrate 100 in two perpendicular directions along the radial direction of the disk-shaped substrate 100, but is not limited to this. The positioning device 10 may, for example, position the disk-shaped substrate 100 in two directions along the radial direction of the disk-shaped substrate 100 that intersect at an angle of less than 90 degrees. Furthermore, the positioning device 10 may, for example, position the disk-shaped substrate 100 in one direction along the radial direction of the disk-shaped substrate 100. That is, the positioning device 10 may be configured to position the disk-shaped substrate 100 in any direction along the radial direction of the disk-shaped substrate 100. In other words, the positioning device 10 may be configured to position the disk-shaped substrate 100 in any direction along the first surface 100J or the second surface 100K of the disk-shaped substrate 100. Note that the one direction along the radial direction of the disk-shaped substrate 100 is, for example, the X direction or Y direction shown in FIG. 2.

[0035] Furthermore, in the positioning device 10, the contact portion 21 comes into contact with the inner circumference 100A of the disk-shaped substrate 100 at three circumferential positions to position the disk-shaped substrate 100 in a direction along the radial direction of the disk-shaped substrate 100, but this is not limited to this. In the positioning device 10, the contact portion 21 may come into contact with the inner circumference 100A of the disk-shaped substrate 100 at four or more circumferential positions to position the disk-shaped substrate 100 in a direction along the radial direction of the disk-shaped substrate 100. Furthermore, in the positioning device 10, the contact portion 21 may come into contact with the inner circumference 100A of the disk-shaped substrate 100 at one or two circumferential positions to position the disk-shaped substrate 100 in a direction along the radial direction of the disk-shaped substrate 100.

[0036] Furthermore, in the positioning device 10, the positioning unit 12 positions the disk-shaped substrate 100 in the radial direction and thickness direction of the disk-shaped substrate 100, but this is not limited to this. The positioning unit 12 only needs to position the disk-shaped substrate 100 at least in the radial direction of the disk-shaped substrate 100.

[0037] The positioning device 10 includes, but is not limited to, a plurality of positioning units 12. The positioning device 10 is only required to include at least one positioning unit 12, and the number of positioning units 12 is not limited to a plurality.

[0038] 1 illustrates one support body 14, the positioning device 10 may include a plurality of support bodies 14 each provided with one or more positioning units 12. When the positioning device 10 includes a plurality of support bodies 14, the positioning device 10 may further include a support body that supports the plurality of support bodies 14.

[0039] Although the positioning device 10 includes a support 14, the positioning device 10 does not necessarily have to include a support 14. In this case, for example, it is possible to use a single positioning device in which multiple positioning units 12 are integrally formed. In other words, the positioning device 10 may position multiple disk-shaped substrates 100 using a single positioning unit.

[0040] In the positioning device 10, the support portion 23 is formed in a circular ring shape, but is not limited to this. In the positioning device 10, the support portion 23 may be formed in a frame shape that is, for example, a polygonal shape such as a triangle or a rectangle in a plan view, and support portions 23 of various shapes can be used. Furthermore, the positioning device 10 may be configured such that a plurality of support portions 23 are arranged at support positions along the circumferential direction of the disk-shaped substrate 100. In other words, the support portion 23 is not limited to being continuous along the circumferential direction of the disk-shaped substrate 100, but may be a plurality of support portions 23 arranged at intervals along the circumferential direction of the disk-shaped substrate 100.

[0041] In the positioning device 10, the positioning portion 12 contacts the inner periphery 100A of the disk-shaped substrate 100 to position the disk-shaped substrate 100, but this is not limited to this. As a positioning device of the present disclosure, for example, the positioning portion 12 may contact the outer periphery 100B of the disk-shaped substrate 100 to position the disk-shaped substrate 100.

[0042] The positioning device 10 has, but is not limited to, a support function for supporting the second surface 100K of the disk-shaped substrate 100 and a positioning function for positioning the disk-shaped substrate 100. The positioning device of the present disclosure is only required to have at least a support function, and does not necessarily have a positioning function.

[0043] 5 , 6 , 7 , and 8 , the transfer device 30 is a device that adsorbs the disk-shaped substrate 100 with an adsorption unit 33 and transports the disk-shaped substrate 100 to a predetermined position on a table 42 of the processing device 40. Specifically, the transfer device 30 transports the disk-shaped substrate 100 to the predetermined position, which is the destination, in a state in which a portion of the first surface 100J of the disk-shaped substrate 100 is adsorbed with the adsorption unit 33 described below.

[0044] In this embodiment, the transport device 30 moves the disk-shaped substrates 100 while holding them, thereby transporting the disk-shaped substrates 100 to the predetermined position while maintaining the relative positional relationship between the disk-shaped substrates 100. Specifically, the transport device 30 has, for example, a holding unit 32 and a moving mechanism 34.

[0045] The holding unit 32 holds the disk-shaped substrate 100. Specifically, the holding unit 32 has, for example, an adsorption unit 33, and holds the disk-shaped substrate 100 by adsorbing the first surface 100J of the disk-shaped substrate 100 with the adsorption unit 33. For example, a suction cup can be used as the adsorption unit 33. Note that the adsorption unit 33 may be one that adsorbs by suction, or other adsorption units may also be used.

[0046] 2, a plurality of suction units 33 are arranged along the circumferential direction of the disk-shaped substrate 100, and suction the first surface 100J of the disk-shaped substrate 100 at suction positions on the first surface 100J. The suction positions are positions opposite the support positions. The suction positions are set at a plurality of positions along the circumferential direction of the disk-shaped substrate 100.

[0047] 2, the suction position of the suction unit 33 is indicated by a two-dot chain line denoted by reference numeral 33. The suction position is an example of a second position. The suction position can also be said to be a position that overlaps with the support position in the thickness direction of the disk-shaped substrate 100. It is sufficient that at least a portion of the suction position overlaps with the support position in the thickness direction of the disk-shaped substrate 100.

[0048] The transport device 30 transports one disk-shaped substrate 100 while holding the disk-shaped substrate 100 with a plurality of suction units 33. Note that, for example, three suction units 33 are provided.

[0049] The moving mechanism 34 is a mechanism that moves the holder 32. The moving mechanism 34 transports the disk-shaped substrate 100 by moving the holder 32 that is holding the disk-shaped substrate 100. As the moving mechanism 34, for example, a three-axis robot that can move in the front-to-back, left-to-right, and up-and-down directions can be used. Note that the moving mechanism 34 is not limited to a three-axis robot, and any mechanism that can move the holder 32 can be used.

[0050] As shown in FIG. 6 , in the transport device 30, the holding unit 32 holds the disk-shaped substrate 100 positioned by the positioning device 10 by contacting the suction unit 33 with the disk-shaped substrate 100 and adsorbing it. Next, in the transport device 30, while the holding unit 32 is holding the disk-shaped substrate 100, the moving mechanism 34 moves the holding unit 32, for example, in a predetermined movement direction as shown in FIG. 7 , thereby transporting the disk-shaped substrate 100 to a predetermined position on the table 42 of the processing device 40. The movement direction is, for example, the direction of arrow A and the direction of arrow B in FIG. 7 . Then, in the transport device 30, the adsorption by the holding unit 32 is released, thereby placing the disk-shaped substrate 100 at a predetermined position on the table 42 of the processing device 40. As a result, as shown in FIG. 8 , the transport device 30 transports the plurality of disk-shaped substrates 100 to predetermined positions on the table 42 of the processing device 40 while maintaining the relative positional relationship between the substrates.

[0051] <Modification of the Transfer Device 30> The transfer device 30 transfers the disk-shaped substrates 100 positioned by the positioning device 10 to a predetermined position on the table 42 of the processing device 40 while maintaining the relative positional relationship between the multiple disk-shaped substrates 100, but is not limited to this. The transfer device of the present disclosure may, for example, transfer the multiple disk-shaped substrates 100 while changing the relative positions of the multiple disk-shaped substrates 100. Furthermore, the transfer device of the present disclosure may, for example, transfer the multiple disk-shaped substrates 100 one by one.

[0052] <Processing Apparatus 40> The processing apparatus 40 shown in FIG. 9 is an apparatus that processes a disk-shaped substrate 100 transported onto a table 42 by the transport apparatus 30. The processing apparatus 40 processes the disk-shaped substrate 100, for example, while the disk-shaped substrate 100 is placed on the table 42. As shown in FIG. 9, for example, a polishing apparatus including a table 42 as a lower surface plate and an upper surface plate 44 can be used as the processing apparatus 40. In the polishing apparatus, for example, the disk-shaped substrate 100 is accommodated in each of a plurality of accommodation holes 48 in a plate-shaped carrier 47 disposed between the table 42 and the upper surface plate 44. Then, for example, by rotating the carrier 47, the table 42, and the upper surface plate 44, the disk-shaped substrate 100 rotates relative to the table 42 and the upper surface plate 44, and each of the first surface 100J and the second surface 100K of the disk-shaped substrate 100 is polished.

[0053] The relative positional relationship of the plurality of accommodating holes 48 in the carrier 47 is the same as the relative positional relationship of the plurality of positioning portions 12 in the support body 14. The relative positional relationship of the plurality of accommodating holes 48 and the relative positional relationship of the plurality of positioning portions 12 may be misaligned within a range in which the plurality of disk-shaped substrates 100 can be accommodated in the accommodating holes 48 while maintaining the relative positional relationship in the positioning portions 12, and is not limited to being completely identical. In this embodiment, for example, the disk-shaped substrates 100 positioned by the plurality of positioning portions 12 by the transport device 30 are accommodated in the plurality of accommodating holes 48 in the carrier 47 while maintaining the relative positional relationship.

[0054] <Modifications of Processing Apparatus 40> The processing apparatus of the present disclosure is not limited to a polishing apparatus. For example, the processing apparatus of the present disclosure may be a grinding apparatus that grinds a disk-shaped substrate. Furthermore, the processing apparatus of the present disclosure may be an apparatus that performs other processing on a table, as long as it is an apparatus that can process a disk-shaped substrate.

[0055] <Modification of Manufacturing Apparatus 90> As shown in FIG. 2 , the manufacturing apparatus 90 may include a transport device 80 that transports the disk-shaped substrate 100 to the positioning unit 12 of the positioning device 10. The transport device 80 has, for example, a plurality of holding units 82 that hold the disk-shaped substrate 100 by pressing the disk-shaped substrate 100 against the inner periphery 100A of the disk-shaped substrate 100 at a plurality of locations. For example, three holding units 82 are provided along the circumferential direction of the disk-shaped substrate 100. In this transport device 80, the disk-shaped substrate 100 is transported to the positioning unit 12 by moving the holding units 82 to the table 20 of the positioning unit 12 while the holding units 82 hold the disk-shaped substrate 100. At this time, for example, three holding units 82 are positioned in the space 22. As a result, the disk-shaped substrate 100 is positioned above the upper surface of the table 20 with the three contact units 21 inserted into the inner periphery 100A of the disk-shaped substrate 100.

[0056] According to the above-mentioned configuration in which the holding portion 82 is pressed against the inner circumference 100A of the disk-shaped substrate 100 at multiple points to hold the disk-shaped substrate 100, it is possible to hold the disk-shaped substrate 100 even if the first surface 100J and the second surface 100K of the disk-shaped substrate 100 are wet.

[0057] Furthermore, the manufacturing apparatus 90 may further include one or more other devices necessary for manufacturing the disk-shaped substrates, such as a storage rack for storing disk-shaped substrates before or after processing, a cleaning device for cleaning the disk-shaped substrates, a drying device for drying the disk-shaped substrates, etc.

[0058] <Method for manufacturing disk-shaped substrate 200> An example of a method for manufacturing a disk-shaped substrate according to the present disclosure will be described below with reference to the drawings. Note that the method for manufacturing a disk-shaped substrate according to the present disclosure is not limited to the following example.

[0059] The manufacturing method of this embodiment is a method for manufacturing a disk-shaped substrate 200. The manufacturing method of this embodiment includes a first transfer step, a supporting step, a positioning step, a second transfer step, and a processing step. The manufacturing method of this embodiment can be performed, for example, by using the above-mentioned manufacturing apparatus 90. In this case, before the first transfer step is performed, the manufacturing apparatus 90 including the positioning device 10, the transfer device 30, and the processing device 40 is prepared.

[0060] <First Conveying Step> The first conveying step is a step of conveying the disk-shaped substrate 100 to the positioning device 10. In the first conveying step, for example, the disk-shaped substrate 100 accommodated in a storage unit (not shown) is held by a holding unit, and the holding unit is moved to remove the disk-shaped substrate 100 from the storage unit.

[0061] Next, in the first conveying step, the holding unit holding the disk-shaped substrate 100 is moved to the positioning device 10, and the disk-shaped substrate 100 is conveyed to the positioning device 10. Next, in the first conveying step, the holding unit is lowered toward the positioning unit 12, and the disk-shaped substrate 100 is placed on the platform 20 while inserting the contact portion 21 into the inner periphery 100A of the disk-shaped substrate 100.

[0062] In the first transport step, transport of the disk-shaped substrates 100 is repeated until a disk-shaped substrate 100 is placed on the table 20 of all of the positioning units 12. Note that in the first transport step, for example, a predetermined number of disk-shaped substrates 100 may be removed from the storage unit and transported to the positioning device 10. The predetermined number may be, for example, multiple substrates.

[0063] 3 , in the supporting step, the second surface 100K of the disk-shaped substrate 100 placed on the table 20 is supported by the supporting portions 23 at supporting positions on the second surface 100K. In the supporting step, the disk-shaped substrate 100 is placed on the table 20, so that the supporting portions 23 come into contact with the second surface 100K of the disk-shaped substrate 100 from below, and support the second surface 100K in an annular shape along the circumferential direction of the disk-shaped substrate 100. The supporting step of this embodiment can be performed by using the positioning device 10 described above.

[0064] <Positioning Step> The positioning step is a step of positioning the disk-shaped substrate 100 by bringing the positioning portion 12 into contact with the inner periphery 100A of the disk-shaped substrate 100 before the first surface 100J of the disk-shaped substrate 100 is sucked by the suction portion 33. In the positioning step, the positioning portion 12 is brought into contact with the inner periphery 100A of each of the plurality of disk-shaped substrates 100 to position the disk-shaped substrate 100 in a direction along the radial direction of the disk-shaped substrate 100.

[0065] In this way, in the positioning step, the positioning portion 12 is brought into contact with the inner periphery 100A of the disk-shaped substrate 100, so even if the outer diameter of the disk-shaped substrate 100 to be positioned changes, the disk-shaped substrate 100 can be positioned without replacing the positioning portion 12. This prevents a decrease in the efficiency of the positioning process in the positioning step. As a result, a decrease in productivity in the manufacturing method of the disk-shaped substrate 200 is prevented.

[0066] Specifically, in the positioning step, as shown in Figures 2 and 3, for example, the disk-shaped substrate 100 is positioned in two different directions along the radial direction of the disk-shaped substrate 100. In other words, in the positioning step of this embodiment, movement of the disk-shaped substrate 100 in two different directions along the radial direction is restricted. This suppresses misalignment of the disk-shaped substrate 100 on the base 20. Note that the two different directions are, for example, two orthogonal directions. The two different directions can be understood as, for example, the Y direction and the X direction in Figure 2.

[0067] Furthermore, in the positioning step of this embodiment, the disk-shaped substrate 100 is positioned in the thickness direction of the disk-shaped substrate 100. This prevents the disk-shaped substrate 100 from being misaligned in the thickness direction.

[0068] In the positioning step of this embodiment, the positioning portion 12 is brought into contact with the inner periphery 100A of the disk-shaped substrate 100 at a plurality of positions in the circumferential direction. Specifically, in the positioning step of this embodiment, the positioning portion 12 is brought into contact with the inner periphery 100A of the disk-shaped substrate 100 at three positions in the circumferential direction. This prevents the disk-shaped substrate 100 from shifting out of position on the base 20.

[0069] In the positioning step of this embodiment, the positioning unit 12 positions the disk-shaped substrate 100 without contacting the outer periphery 100B. As a result, even if the outer diameter of the disk-shaped substrate to be positioned changes, the disk-shaped substrate 100 can be placed on the base 20, so there is no need to replace the positioning unit 12. As a result, a decrease in the efficiency of the positioning process in the positioning step is suppressed. The positioning step of this embodiment can be performed using the positioning device 10 described above.

[0070] <Modification of Positioning Step> In the positioning step of this embodiment, the disk-shaped substrate 100 is positioned in two perpendicular directions along the radial direction of the disk-shaped substrate 100, but this is not limited to this. In the positioning step of this embodiment, for example, the disk-shaped substrate 100 may be positioned in two directions along the radial direction of the disk-shaped substrate 100 that intersect at an angle of less than 90 degrees. Furthermore, in the positioning step of this embodiment, for example, the disk-shaped substrate 100 may be positioned in one direction along the radial direction of the disk-shaped substrate 100.

[0071] Furthermore, in the positioning step of this embodiment, the positioning portions 12 are brought into contact with the inner circumference 100A of the disk-shaped substrate 100 at three circumferential positions to position the disk-shaped substrate 100 in a direction along the radial direction of the disk-shaped substrate 100, but this is not limited to this. In the positioning step of this embodiment, the positioning portions 12 may be brought into contact with the inner circumference 100A of the disk-shaped substrate 100 at three or more circumferential positions to position the disk-shaped substrate 100 in a direction along the radial direction of the disk-shaped substrate 100. Furthermore, in the positioning step of this embodiment, the positioning portions 12 may be brought into contact with the inner circumference 100A of the disk-shaped substrate 100 at one or two circumferential positions to position the disk-shaped substrate 100 in a direction along the radial direction of the disk-shaped substrate 100.

[0072] In the positioning step of this embodiment, the disk-shaped substrate 100 is positioned in the radial direction and thickness direction of the disk-shaped substrate 100, but this is not limiting. In the positioning step, it is sufficient to position the disk-shaped substrate 100 at least in the radial direction of the disk-shaped substrate 100. Furthermore, the positioning step of this embodiment can be performed using the positioning device 10 described above, but may also be performed without using the positioning device 10 described above.

[0073] <Second Conveying Step> The second conveying step of this embodiment is a step of conveying the disk-shaped substrate 100 positioned in the positioning step to a predetermined position on the platform 42 while maintaining the relative positional relationship between the plurality of disk-shaped substrates 100. The second conveying step starts conveying the disk-shaped substrate 100 after, for example, preparation for execution of the processing step is completed in the processing device 40. The second conveying step of this embodiment can be performed, for example, by using the above-mentioned conveying device 30.

[0074] In the second transport step of this embodiment, for example, as shown in Fig. 6 , the suction unit 33 adsorbs the disk-shaped substrate 100, thereby causing the holder 32 to hold the disk-shaped substrate 100. The suction unit 33 adsorbs the first surface 100J of the disk-shaped substrate 100 at an adsorption position on the first surface 100J. Next, in the second transport step of this embodiment, with the suction unit 33 adsorbing the disk-shaped substrate 100, the movement mechanism 34 moves the holder 32, for example, in a predetermined movement direction, as shown in Fig. 7 , to transport the disk-shaped substrate 100 to a predetermined position on the stage 42 of the processing device 40.

[0075] Then, in the second transport step of this embodiment, the suction by the suction unit 33 is released, and the disk-shaped substrate 100 is placed at a predetermined position on the platform 42 of the processing device 40. As a result, in the second transport step of this embodiment, the plurality of disk-shaped substrates 100 are transported to predetermined positions on the platform 42 of the processing device 40 while maintaining the relative positional relationship between the plurality of disk-shaped substrates 100, as shown in FIG.

[0076] In the second conveying step, the first surface 100J is adsorbed by the adsorption portion 33 at the adsorption position opposite the support position, and therefore the contact load when the adsorption portion 33 comes into contact with the first surface 100J is supported by the support portion 23. As a result, deformation of the disk-shaped substrate 100 in the thickness direction is suppressed.

[0077] In this embodiment, as described above, the support portion 23 has a circular ring shape that follows the circumferential direction of the disk-shaped substrate 100, and therefore can support each portion of the disk-shaped substrate 100 in a balanced manner along the circumferential direction. As described above, a plurality of suction portions 33 are arranged along the circumferential direction of the disk-shaped substrate 100, and suction the second surface 100K at a plurality of suction positions along the circumferential direction. Therefore, deformation of the disk-shaped substrate 100 in the thickness direction is suppressed while increasing the holding force of the second surface 100K due to suction by the suction portions 33.

[0078] <Modification of the Second Transfer Step> In the second transfer step of the present embodiment, the disk-shaped substrate 100 positioned by the positioning device 10 is transferred to a predetermined position on the table 42 of the processing device 40 while maintaining the relative positional relationship between the plurality of disk-shaped substrates 100, but this is not limited to this. In the second transfer step of the present disclosure, for example, the plurality of disk-shaped substrates 100 may be transferred while changing the relative positions of the plurality of disk-shaped substrates 100. In addition, in the second transfer step of the present disclosure, for example, the plurality of disk-shaped substrates 100 may be transferred one by one.

[0079] In the second transport step of this embodiment, the disk-shaped substrate 100 is held by the suction unit 33, but this is not limited to this. The second transport step of the present disclosure may use, for example, a holding unit that holds the disk-shaped substrate 100 by pressing it against at least one of the inner circumference 100A and the outer circumference 100B of the disk-shaped substrate 100. Furthermore, the second transport step of this embodiment can be performed using the transport device 30 described above, but may also be performed without using the transport device 30.

[0080] <Processing Step> In the processing step of this embodiment, processing is performed on the disk-shaped substrate 100 that has been transported onto the table 42 in the second transport step. Processing is performed on the disk-shaped substrate 100 that has been transported onto the table 42 while it is placed on the table 42. Examples of such processing include polishing. This processing step can be performed, for example, by using the processing device 40 described above.

[0081] <Modification of Processing Step> The processing performed in this processing step is not limited to polishing. For example, grinding may be used. Furthermore, the processing may be other processing performed on the table 42, as long as it is processing performed on the disk-shaped substrate 100. Furthermore, this processing step can be performed using the processing device 40 described above, but may also be performed without using the processing device 40.

[0082] <Modifications of Manufacturing Method> The manufacturing method of the disk-shaped substrate of the present disclosure is not limited to the above-mentioned examples, and may be any method that includes at least a supporting step, a transporting step, and a processing step. In the present disclosure, the manufacturing method of the disk-shaped substrate 200 may include one or more other commonly known processes required for manufacturing the disk-shaped substrate 200, depending on the type of the disk-shaped substrate 200.

[0083] For example, in the case of an aluminum substrate, the manufacturing method of the disk-shaped substrate 200 includes the following steps: Blank substrate preparation step: An aluminum alloy ingot is rolled to obtain an aluminum alloy plate material with a thickness of approximately 2 mm or less, and the obtained aluminum alloy plate material is punched into a disk shape to prepare an aluminum substrate of the desired dimensions. Cutting step: The prepared aluminum alloy substrate is subjected to chamfering of the inner and outer diameters and cutting of both main surfaces. Grinding step: In order to reduce the surface roughness, waviness, etc. of the aluminum alloy substrate after cutting, both main surfaces of the aluminum alloy substrate are subjected to grinding with a grinding wheel. Plating step: The surface of the ground substrate is plated with NiP or the like to impart surface hardness and suppress surface defects. Polishing step: Both main surfaces of the aluminum alloy substrate on which the plating film has been formed are polished. In the case of an aluminum substrate, the manufacturing method according to this embodiment may be performed, for example, in either the grinding step or the polishing step, or both.

[0084] In the case of a glass substrate, the manufacturing method of the disk-shaped substrate 200 includes, for example, the following steps: Blank substrate preparation step: A glass blank serving as a material for a plate-shaped glass substrate for a magnetic recording medium having a pair of main surfaces is produced by press molding, and a circular hole is formed in the center of the produced glass blank to form an annular shape. Next, shape processing is performed to obtain a glass substrate having a chamfered surface. The inner and outer peripheral edge surfaces of the shaped glass substrate are ground and polished. Grinding step: The main surfaces of the glass substrate after edge polishing are ground using fixed abrasive grains. Polishing step: The main surfaces of the glass substrate after the grinding step are polished using a predetermined abrasive. During the polishing step, the glass substrate may be subjected to a chemical strengthening treatment. In the case of a glass substrate, the manufacturing method according to this embodiment may be performed, for example, in either the grinding step or the polishing step, or both.

[0085] The disclosure of Japanese Patent Application No. 2024-057254, filed on March 29, 2024, is incorporated herein by reference in its entirety. All documents, patent applications, and technical standards mentioned herein are incorporated herein by reference to the same extent as if each individual document, patent application, and technical standard was specifically and individually indicated to be incorporated by reference.

Claims

1. A method for manufacturing a disk-shaped substrate, comprising: a supporting step of supporting a disk-shaped substrate with a supporting portion at a first position on one surface of the disk-shaped substrate; a transporting step of suctioning the disk-shaped substrate with an adsorption portion at a second position on the other surface of the disk-shaped substrate opposite the first position, and transporting the disk-shaped substrate onto a table of a processing device while the adsorption portion is adsorbing the other surface; and a processing step of processing the disk-shaped substrate transported onto the table.

2. The method for manufacturing a disk-shaped substrate according to claim 1, wherein the support portion has a ring shape that follows the circumferential direction of the disk-shaped substrate.

3. A method for manufacturing a disk-shaped substrate according to claim 1 or claim 2, wherein the suction portions are arranged in a plurality of positions along the circumferential direction of the disk-shaped substrate and are suctioned to the other surface at a plurality of second positions along the circumferential direction.

4. The method for manufacturing a disk-shaped substrate according to claim 1, wherein the disk-shaped substrate has an inner periphery and an outer periphery, and further comprises a step of positioning the disk-shaped substrate by bringing a positioning part into contact with the inner periphery of the disk-shaped substrate before the other surface is adsorbed by the adsorption part.

5. A disk-shaped substrate manufacturing device comprising: a support device having a support part that supports the disk-shaped substrate at a first position on one side of the disk-shaped substrate; a transport device having an adsorption part that adsorbs the disk-shaped substrate at a second position on the other side of the disk-shaped substrate opposite the first position, and that transports the disk-shaped substrate onto a table of a processing device as a destination while the adsorption part adsorbs the other side; and a processing device that processes the disk-shaped substrate that has been transported onto the table.

6. The disk-shaped substrate manufacturing apparatus according to claim 5, wherein the support portion has a ring shape that follows the circumferential direction of the disk-shaped substrate.

7. The disk-shaped substrate manufacturing device according to claim 5 or claim 6, wherein the suction units are arranged in a plurality of positions along the circumferential direction of the disk-shaped substrate and suction the other surface at a plurality of second positions along the circumferential direction.

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