Separation device

Abstract

Provided is a separation device capable of generating a sufficient wedge effect even in a central region of a plate member. The separation device according to an embodiment comprises: a first holding part for holding one surface of a plate member; a second holding part for holding the other surface of the plate member; a drive part for rotating the first holding part and the second holding part; and a nozzle for injecting a liquid to a side surface of the plate member. At least one of the first holding part and the second holding part includes a plurality of suction parts for sucking the plate member, and a biasing part provided in each of the plurality of suction parts and biasing the suction part in a direction separating from the plate member.

Description

Separation device

[0001] SUMMARY OF THE INVENTION An embodiment of the present invention relates to a separation device.

[0002] A technology for separating plate members may be required. For example, a separation device has been proposed that uses a water jet to separate a bonded substrate (an example of a plate member) formed by bonding a pair of substrates into two separate substrates (see Patent Document 1). In this type of separation device, a pair of block-shaped holders is used to grip the central region of the bonded substrate. The pair of holders are then rotated to rotate the bonded substrates gripped by the pair of holders. Furthermore, high-pressure liquid is sprayed from the water jet nozzle toward the sides of the rotated bonded substrates. The sprayed liquid penetrates between the substrates, creating a wedge effect and separating the bonded substrate into two substrates.

[0003] However, since the central region of the bonded substrates is held by the block-shaped holding portion, it is difficult to generate a wedge effect, and therefore separation of the pair of substrates may be insufficient in the central region of the bonded substrates, which are plate members.

[0004] Therefore, there has been a demand for the development of a separation device that can generate a sufficient wedge effect even in the central region of the plate member.

[0005] Japanese Patent Application Publication No. 11-5064

[0006] The problem to be solved by the present invention is to provide a separating device that can generate a sufficient wedge effect even in the central region of the plate member.

[0007] The separation device according to the embodiment includes a first holding unit that holds one side of a plate member, a second holding unit that holds the other side of the plate member, a drive unit that rotates the first holding unit and the second holding unit, and a nozzle that sprays a liquid onto the side of the plate member. At least one of the first holding unit and the second holding unit has a plurality of suction units that suction the plate member, and a biasing unit that is provided on each of the plurality of suction units and biases the suction unit in a direction away from the plate member.

[0008] According to an embodiment of the present invention, a separating device is provided that can generate a sufficient wedge effect even in the central region of the plate member.

[0009] 1 is a schematic diagram illustrating a separation device according to the present embodiment; FIG. 2 is a schematic enlarged view of part A of the separation device in FIG. 1; FIG. 3 is a schematic plan view of the holding part of the rotary holding part when viewed from a direction along the central axis of rotation of the separation device; FIG. 4 is a schematic diagram illustrating the separation of bonded substrates; FIG. 5 is a schematic diagram illustrating the separation of bonded substrates; FIG. 6 is a schematic diagram illustrating the separation of bonded substrates; FIG. 7 is a schematic diagram illustrating the biasing part according to another embodiment; (a) and (b) are schematic diagrams illustrating the action and effect of the biasing part; and FIG. 8 is a schematic enlarged view illustrating the part of the holding part in a separation device according to another embodiment.

[0010] Hereinafter, embodiments will be illustrated with reference to the drawings. In the drawings, like components are designated by like reference numerals and detailed descriptions thereof will be omitted where appropriate.

[0011] The plate member separated by the separating apparatus 1 according to this embodiment is a bonded substrate 100. The bonded substrate 100 has, for example, a substrate 101 and a substrate 102 bonded to one side of the substrate 101. There are no particular limitations on the substrates 101 and 102 as long as they are plate-shaped. The substrates 101 and 102 can be, for example, semiconductor wafers, substrates containing inorganic materials such as quartz or ceramics, or substrates containing metal.

[0012] In the following, as an example, a case will be described in which the substrates 101 and 102 are semiconductor wafers. For example, a porous layer is provided on one surface of the substrate 101, and a single-crystal Si layer is provided on the porous layer. For example, a single-crystal Si layer is provided on one surface of the substrate 102. Furthermore, for example, an insulating layer is provided on the single-crystal Si layer of the substrate 101 or on the single-crystal Si layer of the substrate 102. Then, for example, the substrates 101 and 102 are bonded together via the insulating layer. However, the bonded substrate 100 is not limited to the example shown. The bonded substrate 100 may be any substrate in which the substrate 101 and the substrate 102 are bonded together. Furthermore, the plate member may be two plates bonded together and separated by the separation device 1, or an integral plate that is separated (divided) into two pieces by the separation device 1.

[0013] Fig. 1 is a schematic diagram illustrating a separation device 1 according to this embodiment. Fig. 2 is a schematic enlarged view of part A of the separation device 1 in Fig. 1. Fig. 3 is a schematic plan view of the holding unit 23 of the rotation holding unit 20 when viewed from a direction along the rotation central axis 1a of the separation device 1.

[0014] As shown in FIG. 1, the separation device 1 includes, for example, a base 10, a rotation holding unit 20, a positioning unit 30, a separation unit 40, and a controller 50.

[0015] The base 10 can be provided, for example, at the installation location of the separation device 1. A rotation holding unit 20, a positioning unit 30, and a separation unit 40 can be provided on one side of the base 10. In addition, a base 10a can be provided opposite the base 10. A holding unit 21 (corresponding to an example of a first holding unit), a support unit 22, a holding unit 23 (corresponding to an example of a second holding unit), a drive unit 24, and a movement unit 25, which will be described later, are provided between the base 10a and the base 10. The base 10a can be integrated with the base 10, for example, via a stand (not shown).

[0016] The rotary holder 20 holds and rotates a bonded substrate 100 in which a pair of substrates 101 and 102 are bonded together.

[0017] The rotation holding unit 20 includes, for example, a holding unit 21 , a support unit 22 , a holding unit 23 , a driving unit 24 , a moving unit 25 , and an exhaust unit 26 .

[0018] The holding units 21 and 23 are provided opposite each other so as to be able to hold both sides of the bonded substrate 100. The holding unit 21 is provided on the substrate 101 side of the bonded substrate 100. The holding unit 21 suction-holds one side of the bonded substrate 100 (the side facing the substrate 101). The holding unit 21 can be, for example, a vacuum chuck. For example, a suction hole is opened in the surface of the holding unit 21 facing the bonded substrate 100. An exhaust unit 26 is connected to the suction hole.

[0019] The support portion 22 rotatably supports the holding portion 21. The support portion 22 is provided on, for example, the base 10a. The support portion 22 has, for example, a rotation shaft 22a and a rotation mechanism 22b.

[0020] The rotating shaft 22a extends along the central rotation axis 1a of the separation device 1. A holding portion 21 is provided on one end side of the rotating shaft 22a. The other end side of the rotating shaft 22a is connected to a rotation mechanism 22b.

[0021] The rotation mechanism 22b rotates the holding unit 21 in synchronization with the holding unit 23, which will be described later. The rotation mechanism 22b has a synchronous transmission member such as a timing belt or a timing pulley. The synchronous transmission member is connected to the rotation shaft 22a on which the holding unit 21 is provided and to the drive unit 24, which will be described later. In this manner, the drive unit 24 can rotate the holding unit 21 simultaneously with the holding unit 23, which will be described later, and at the same rotation speed. This makes it possible to simplify the configuration of the rotation mechanism 22b and the control program, and ultimately to reduce the manufacturing cost of the separation device 1.

[0022] The holding portion 23 is provided on the substrate 102 side of the bonded substrate 100. The holding portion 23 suction-holds the other surface (the surface on the substrate 102 side) of the bonded substrate 100. As shown in Figures 1 to 3, the holding portion 23 has, for example, a base portion 23a, a suction portion 23b, and a biasing portion 23c.

[0023] The base 23 a has, for example, a disk shape and is provided at the end of the rotation shaft 24 a of the drive unit 24 on the support unit 22 side.

[0024] The suction portion 23b is provided on the base portion 23a on the support portion 22 side. The suction portion 23b suctions the other surface (surface on the substrate 102 side) of the bonded substrate 100. The suction portion 23b is, for example, a vacuum pad.

[0025] A plurality of adsorption units 23b may be provided. For example, one adsorption unit 23b (corresponding to an example of a first adsorption unit) may be provided at the position of the central rotation axis 1a of the separation device 1 (the central rotation axis of the base 23a). For example, a plurality of adsorption units 23b (corresponding to an example of a second adsorption unit) may be arranged on a circumference centered on the central rotation axis 1a of the separation device 1 (the central rotation axis of the base 23a). For example, a plurality of adsorption units 23b may be arranged near the periphery of the base 23a and along the periphery of the base 23a.

[0026] Furthermore, a plurality of suction portions 23b may be arranged in a region between the periphery of the base portion 23a and the central axis of rotation of the base portion 23a. In this case, as shown in Fig. 3, the plurality of suction portions 23b may be arranged in a line on the circumference of a concentric circle centered on the central axis of rotation of the base portion 23a. The plurality of suction portions 23b may also be arranged radially from the central axis of rotation of the base portion 23a.

[0027] The suction portions 23b may be provided at least at the position of the central axis of the base portion 23a and near the periphery of the base portion 23a. The arrangement and number of the suction portions 23b may be changed as appropriate depending on the size of the bonded substrate 100, etc.

[0028] A hole 23a1 is provided inside the base 23a. The hole 23a1 is in communication with the plurality of suction units 23b. The hole 23a1 is also in communication with the exhaust unit 26 via a piping member such as a rotary joint provided in the drive unit 24. In other words, the hole 23a1 serves as an exhaust flow path.

[0029] 3 is connected to the plurality of adsorption sections 23b. In this way, the exhaust paths of the plurality of adsorption sections 23b can be simplified, which simplifies the configuration of the holding section 23 and ultimately reduces the manufacturing cost of the separation device 1.

[0030] Alternatively, a hole 23a1 may be provided for each of the plurality of suction portions 23b. Alternatively, the plurality of suction portions 23b may be divided into a plurality of groups, and a hole 23a1 may be provided for each of the plurality of groups so that the holes 23a1 are in communication with each other. For example, in the arrangement of the plurality of suction portions 23b illustrated in FIG. 3, the plurality of suction portions 23b may be divided into groups: a suction portion 23b provided at the center axis of the base 23a, a suction portion 23b provided near the periphery of the base 23a, and a suction portion 23b provided in the region between these groups, and the holes 23a1 may be provided for each of the groups so that the holes 23a1 are in communication with each other.

[0031] If a hole 23a1 is provided for each of the plurality of suction portions 23b, it is possible to prevent leakage from one suction portion 23b from affecting the suction of the other suction portions 23b. If a hole 23a1 is provided for each of the plurality of groups, it is possible to prevent leakage from a suction portion 23b in one group from affecting the suction of the suction portions 23b in the other groups. This improves the reliability of suction.

[0032] The biasing portion 23c is provided between the suction portion 23b and the base portion 23a. For example, the biasing portion 23c can be provided for each of the plurality of suction portions 23b. Note that the suction portion 23b at the position of the central axis of the base portion 23a may or may not be provided with the biasing portion 23c.

[0033] The biasing portion 23c biases the suction portion 23b in a direction (toward the base portion 23a) away from the laminated substrate 100. A hole is provided inside the biasing portion 23c, and the suction portion 23b and the hole 23a1 of the base portion 23a communicate with each other through the hole of the biasing portion 23c.

[0034] 2, the suction portion 23b can be integrally formed with the biasing portion 23c. For example, a bellows pad (e.g., a so-called bellows vacuum pad) can be formed having the suction portion 23b and the biasing portion 23c. The effect of the biasing portion 23c will be described in detail later.

[0035] The drive unit 24 rotates the holding unit 23 and also rotates the holding unit 21 in synchronization with the holding unit 23 via the rotation mechanism 22b and the rotation shaft 22a. Therefore, the drive unit 24 can rotate the bonded substrate 100 held by the holding unit 23 and the holding unit 21. The drive unit 24 can also control the number of rotations of the bonded substrate 100 and control the start and stop of rotation. The drive unit 24 can include, for example, a control motor such as a servo motor and a rotation shaft 24a. The rotation shaft 24a is connected to the control motor via a transmission member or the like.

[0036] 1, the rotation center axis of the rotation shaft 22a, the rotation center axis of the holding unit 21, the rotation center axis of the holding unit 23, and the rotation center axis of the rotation shaft 24a overlap with the rotation center axis 1a. That is, these rotation center axes are arranged coaxially. Therefore, when the bonded substrate 100 is rotated, it is possible to prevent the relative positions of the holding unit 21 and the holding unit 23 from shifting in the direction perpendicular to the rotation center axis 1a.

[0037] The moving unit 25 moves the driving unit 24 in a direction along the rotation central axis 1a. The moving unit 25, for example, raises and lowers the driving unit 24. Since the driving unit 24 (rotation axis 24a) is provided with the holding unit 23, the distance between the holding unit 23 and the holding unit 21 in the direction along the rotation central axis 1a can be changed by moving the driving unit 24 with the moving unit 25. Therefore, the moving unit 25 can hold and release the bonded substrate 100 by the holding unit 23 and the holding unit 21. The moving unit 25 can have, for example, a driving mechanism such as an air cylinder or a hydraulic cylinder, and a guide mechanism for moving the driving unit 24 linearly.

[0038] The exhaust unit 26 is connected to the holding unit 21 via a piping member such as a rotary joint provided on the support unit 22. The exhaust unit 26 sucks gas between the holding unit 21 and the bonded substrate 100 (substrate 101) so that the pressure between the holding unit 21 and the bonded substrate 100 (substrate 101) becomes negative. The exhaust unit 26 is also connected to the holding unit 23 (suction unit 23b) via a piping member such as a rotary joint provided on the drive unit 24. The exhaust unit 26 sucks gas between the holding unit 23 (suction unit 23b) and the bonded substrate 100 (substrate 102) so that the pressure between the holding unit 23 (suction unit 23b) and the bonded substrate 100 (substrate 102) becomes negative. The exhaust unit 26 has an exhaust device such as a vacuum pump.

[0039] Furthermore, a gas-liquid separator can be provided between the holding unit 21 and the holding unit 23 and an exhaust device such as a vacuum pump.

[0040] Furthermore, a pressure control device can be provided at least either between the holding unit 21 and the gas-liquid separator or between the holding unit 23 and the gas-liquid separator. If a pressure control device is provided, it becomes possible to control the suction force in the holding unit 21 and the holding unit 23.

[0041] The positioning unit 30 positions the bonded substrate 100 in a direction perpendicular to the rotation center axis 1a. The positioning unit 30 aligns the position of the bonded substrate 100 so that the rotation center axis of the bonded substrate 100 overlaps with the rotation center axis 1a of the separation device 1 in a plan view. Therefore, the rotation center axis of the bonded substrate 100 after positioning can be the rotation center axis 1a.

[0042] The positioning portion 30 has, for example, a pin 31, an arm 32, a moving portion 33, a moving portion 34, a guide 35, and an absorbing portion 36. A plurality of sets of the pin 31, the arm 32, the moving portion 33, the guide 35, and the absorbing portion 36 can be provided.

[0043] The pin 31 has, for example, a columnar shape and extends in a direction along the rotation central axis 1a. The side surface of the pin 31 contacts the side surface of the laminated substrate 100. The pin 31 can be provided, for example, at the upper end of the arm 32. When viewed from the direction along the rotation central axis 1a, the multiple pins 31 can be provided at positions that are rotationally symmetric with respect to the rotation central axis 1a.

[0044] The arm 32 is plate-shaped and extends in a direction along the rotational axis 1a. The moving unit 33 moves the arm 32 in the direction along the rotational axis 1a. For example, the moving unit 33 raises and lowers the arm 32. The moving unit 33 has a driving mechanism such as an air cylinder or a hydraulic cylinder.

[0045] One moving unit 34 can be provided for each of the multiple arms 32. The moving unit 34 has, for example, a link mechanism or a cam mechanism, and simultaneously changes the positions of the multiple arms 32 in a direction perpendicular to the rotation center axis 1a. For example, the moving unit 34 moves the multiple arms 32 toward the rotation center axis 1a, causing the multiple pins 31 to press the side surfaces of the bonded substrate 100 toward the rotation center axis 1a. The multiple pins 31 press the side surfaces of the bonded substrate 100 toward the rotation center axis 1a, causing the rotation center axis of the bonded substrate 100 to overlap with the rotation center axis 1a in a planar view. In other words, the bonded substrate 100 is positioned. Furthermore, for example, the moving unit 34 moves the multiple arms 32 in a direction away from the rotation center axis 1a, thereby separating the multiple pins 31 from the side surfaces of the bonded substrate 100.

[0046] The guides 35 are provided between each of the multiple arms 32 and the moving unit 34. The guides 35 guide the movement of the arms 32 in the direction along the rotation central axis 1a. The guides 35 may be, for example, linear guides. If the guides 35 are provided, the relative positions between the arms 32 and the moving unit 34 in the direction along the rotation central axis 1a can be changed as desired.

[0047] The absorbing portion 36 is provided between the arm 32 and the moving portion 33. The absorbing portion 36 absorbs changes in position between the arm 32 and the moving portion 33 in a direction perpendicular to the rotation center axis 1 a. The absorbing portion 36 may include an elastic body such as rubber or a spring. If the absorbing portion 36 is provided, the moving portion 34 can absorb the amount of misalignment even if the position between the moving portion 33 and the arm 32 is misaligned in the direction perpendicular to the rotation center axis 1 a.

[0048] The separating unit 40 sprays a high-pressure liquid 40a onto the side surface of the rotating bonded substrate 100 to separate the bonded substrate 100 into the substrate 101 and the substrate 102. The liquid 40a is sprayed toward a layer (e.g., a porous layer or a single-crystal Si layer) provided between the substrate 101 and the substrate 102. The liquid 40a can be, for example, water such as ultrapure water. When the liquid 40a is water, the separating unit 40 can be a so-called water jet device.

[0049] The separation unit 40 includes, for example, a nozzle 41, a supply unit 42, and a movement unit 43. The nozzle 41 sprays the liquid 40a onto the side surface of the rotating bonded substrate 100. The nozzle 41 is cylindrical and has an injection port 41a at one end. The diameter of the injection port 41a is, for example, about 0.1 mm to 1 mm. The radial width (thickness) of the end of the nozzle 41 where the injection port 41a is provided is, for example, about 1 cm to 5 cm. By setting the thickness of the end of the nozzle 41 in this manner, damage to the nozzle 41 can be suppressed even when the liquid 40a is sprayed at high pressure. In the direction along the rotation center axis 1a, the central axis of the injection port 41a of the nozzle 41 is located between the substrate 101 and the substrate 102. Furthermore, the central axis of the injection port 41a of the nozzle 41 can be, for example, approximately parallel to the surface of the holding unit 21 facing the bonded substrate 100.

[0050] The supply unit 42 supplies high-pressure liquid 40a to the nozzle 41. The pressure of the liquid 40a sprayed from the nozzle 41 is, for example, about 15 MPa to 90 MPa. The flow rate of the liquid 40a is about 60 mL / min to 150 mL / min.

[0051] The supply unit 42 is connected, for example, via a high-pressure pipe, to the end of the nozzle 41 opposite to the end where the injection port 41 a is provided. The supply unit 42 may be provided with, for example, a tank for storing the liquid 40 a, a high-pressure pump for supplying the liquid 40 a stored in the tank to the nozzle 41, a control valve for controlling the flow rate and pressure of the liquid 40 a supplied to the nozzle 41, and a switching valve for switching between supplying and stopping the supply of the liquid 40 a.

[0052] The moving unit 43 moves the position of the nozzle 41 (ejection port 41a) in a plane perpendicular to the rotation center axis 1a. The moving unit 43 moves the position of the nozzle 41 (ejection port 41a), for example, between a direction along a tangent to the periphery of the bonded substrate 100 and a direction toward the rotation center axis (for example, the rotation center axis 1a) of the bonded substrate 100. The moving unit 43 can be, for example, an XY table or a robot capable of control on two or more axes. The moving unit 43 can be provided on the base 10 via, for example, a stand 43a.

[0053] The controller 50 includes, for example, a calculation unit such as a CPU (Central Processing Unit) and a storage unit such as a memory. The controller 50 is, for example, a computer. The controller 50 controls the operation of each element provided in the separation device 1 based on a control program stored in the storage unit.

[0054] Next, the operation of the separating device 1, that is, the separation of the bonded substrate 100, which is an example of a plate member, will be described, along with the effect of the above-mentioned biasing portion 23c.

[0055] 4 to 7 are schematic diagrams illustrating the separation of the bonded substrate 100. The shaded areas in Fig. 4, Fig. 5, and Fig. 7 represent the separated regions. Fig. 6 is a cross-sectional view taken along line BB in Fig. 5.

[0056] In the separation step of the bonded substrate 100, the rotating holding unit 20 holds the bonded substrate 100. As described above, the holding unit 21 adsorbs one surface of the bonded substrate 100 (the surface facing the substrate 101). Furthermore, the adsorption unit 23b of the holding unit 23 adsorbs the other surface of the bonded substrate 100 (the surface facing the substrate 102). In the case of a bellows pad having the adsorption unit 23b and the biasing unit 23c, when the adsorption unit 23b adsorbs the bonded substrate 100, the biasing unit 23c contracts and biases the substrate 102 in a direction to peel it off from the substrate 101. Then, by rotating the holding unit 21 and the holding unit 23, the bonded substrate 100 adsorbed and held by the holding unit 21 and the holding unit 23 is rotated.

[0057] Next, as shown by the solid line nozzle 41 in FIG. 4 , the nozzle 41, which was located at the standby position [a], is moved to the vicinity of the periphery of the bonded substrate 100 and positioned at the separation start position [b]. The separation start position [b] is a predetermined position on the side surface of the bonded substrate 100 from the nozzle 41, where the central axis of the ejection port 41a of the nozzle 41 overlaps with a tangent to the periphery of the bonded substrate 100. The nozzle 41 positioned at the separation start position [b] ejects the liquid 40a between the substrates 101 and 102. At this time, since the bonded substrate 100 is rotating, the liquid 40a can be ejected between the substrates 101 and 102 over the entire periphery of the bonded substrate 100. Therefore, separation can be performed over the entire periphery of the bonded substrate 100.

[0058] Then, for example, as shown in FIG. 4, the nozzle 41 is moved to follow the separated region, and the substrates 101 and 102 are separated by spraying the liquid 40a in the region between the periphery of the bonded substrate 100 and the center of rotation.

[0059] 4 , in the separation process of the bonded substrate 100, the nozzle 41 is moved in an arc-shaped trajectory from a separation start position [b] to a separation position [c] at the center of rotation of the bonded substrate 100. The nozzle 41 is also moved so that the distance d between the nozzle 41 and the bonded substrate 100 is kept substantially constant. By moving the nozzle 41 so that the distance d is kept substantially constant, the ejection port 41 a of the nozzle 41 can be brought as close as possible to the side surface of the bonded substrate 100.

[0060] Furthermore, since the liquid 40a is sprayed while the nozzle 41 is moved along such an arc-shaped trajectory, the liquid 40a is sprayed toward a partial region Ra of the periphery of the bonded substrate 100. Note that the region Ra is a region that includes an arc with a central angle of 90 degrees on the periphery of the bonded substrate 100. Even if the liquid 40a is sprayed toward such a partial region Ra of the circumference, since the bonded substrate 100 is rotating, the liquid 40a is sprayed over the entire circumference of the bonded substrate 100, and separation can be performed in the entire region of the bonded substrate 100.

[0061] 5 is a schematic diagram illustrating the separation of the bonded substrates, illustrating the separation state while the nozzle 41 is moving from the separation start position [b] to the separation position [c] at the center of rotation of the bonded substrate 100. As shown in FIG. 5, when viewed from the direction along the rotation center axis 1a of the separation device 1, separation is performed up to the region inside the suction portion 23b provided near the periphery of the holding portion 23 (base portion 23a). As described above, the biasing portion 23c biases the substrate 102 in the direction of peeling it off from the substrate 101.

[0062] Therefore, when separation reaches an area inside the suction portion 23b provided near the periphery of the holding portion 23 (base portion 23a), the biasing portion 23c contracts, causing the substrate 102 to bend in a direction away from the substrate 101, as shown in Figure 6. When the substrate 102 bends in a direction away from the substrate 101, the distance between the peripheral edge of the substrate 101 and the peripheral edge of the substrate 102 increases in the direction along the central axis 1a of rotation of the separation device 1. In addition, a wedge-shaped gap is formed between the substrates 101 and 102. This makes it easier for the sprayed liquid 40a to enter between the substrates 101 and 102, creating a sufficient wedge effect and allowing separation to proceed efficiently.

[0063] As the separated region advances further toward the central axis of rotation of the bonded substrate 100, the biasing portion 23c provided in the separated region causes the substrate 102 to bend in a direction away from the substrate 101. This maintains a wedge-shaped gap between the substrates 101 and 102, making it easier for the ejected liquid 40a to enter the gap. As a result, a sufficient wedge effect can be maintained up to the central region near the central axis of rotation of the bonded substrate 100.

[0064] As shown in Figure 7, when separation has progressed to the position of the central axis of rotation of the bonded substrate 100, spraying of the liquid 40a from the nozzle 41 is stopped. After separation of the bonded substrate 100 is completed, the nozzle 41 moves to a standby position [a] separated from the bonded substrate 100 (see Figure 4). Then, by stopping the rotation of the holding unit 21 and the holding unit 23, the rotation of the bonded substrate 100 that has now been separated is stopped. In this manner, separation of the bonded substrate 100 can be performed.

[0065] 8 is a schematic diagram illustrating a biasing portion 123c according to another embodiment. As shown in FIG. 8, the holding portion 123 has, for example, a base portion 123a, a suction portion 123b, a biasing portion 123c, and a pipe 123d.

[0066] The base 123a may be, for example, a disk. The suction portion 123b may be, for example, a vacuum pad. The pipe 123d may be slidably provided in a hole penetrating the base 123a in the thickness direction. One end of the pipe 123d is exposed on one side of the base 123a. The other end of the pipe 123d is exposed on the other side of the base 123a. The suction portion 123b may be provided at one end of the pipe 123d. The other end of the pipe 123d may be connected to the exhaust unit 26 via a piping member such as a rotary joint provided in the drive unit 24.

[0067] The biasing portion 123c biases the suction portion 123b in a direction toward the base 123a. The biasing portion 123c can be, for example, a compression spring. The biasing portion 123c is provided, for example, on the side of the base 123a opposite the suction portion 123b. The pipe 123d can be inserted inside the biasing portion 123c, which is a compression spring. One end of the biasing portion 123c can be in contact with the base 123a. The other end of the biasing portion 123c can be in contact with a flange member 123d1, such as a retaining ring, provided on the pipe 123d. A flange member 123d2, such as a retaining ring, is provided near the end of the pipe 123d on the suction portion 123b side. The flange member 123d2 can be brought into contact with the base 123a by the biasing force of the biasing portion 123c.

[0068] 9A and 9B are schematic diagrams illustrating the effect of the biasing portion 123c. First, as shown in Fig. 9A, the suction portion 123b suction-holds the other surface (the surface on the substrate 102 side) of the bonded substrate 100. At this time, the position of the base 123a is controlled by the moving portion 25 so that a gap is provided between the flange member 123d2 and the base 123a.

[0069] Next, in the same manner as described above, the holding units 21 and 123 are rotated to rotate the bonded substrate 100 held by suction on the holding units 21 and 123. Then, the liquid 40a is sprayed between the substrates 101 and 102 to separate the substrates 101 and 102.

[0070] As described above, as separation of the substrates 101 and 102 progresses due to the spraying of the liquid 40a, the biasing portion 123c bends the substrate 102 in a direction away from the substrate 101, as shown in Fig. 9B. Therefore, as described above, a wedge-shaped gap is formed between the substrates 101 and 102. As a result, the sprayed liquid 40a can easily enter between the substrates 101 and 102, creating a sufficient wedge effect and allowing separation to progress efficiently up to the central region of the bonded substrate 100.

[0071] Although a compression spring is given as an example of the biasing portion 123c, a tension spring, a coil spring, rubber, or other elastic body may also be used. In other words, the biasing portion may be any member that can bias the substrate 102 in the direction of peeling it off from the substrate 101.

[0072] Furthermore, the biasing portions 23c, 123c provided on the circumference centered on the rotational axis may be more easily deformed than the biasing portions 23c, 123c provided at the rotational axis position. In this way, the substrate 102 is more likely to bend in the direction away from the substrate 101, making it easier for the wedge effect described above to occur. For example, the elastic modulus of the material of the biasing portions 23c provided on the circumference centered on the rotational axis may be set to be smaller than the elastic modulus of the material of the biasing portions 23c provided at the rotational axis position. For example, the spring constant of the biasing portions 123c provided on the circumference centered on the rotational axis may be set to be smaller than the spring constant of the material of the biasing portions 23c provided at the rotational axis position.

[0073] Furthermore, the holes 23a1 communicating with the urging portions 23c, 123c provided on the circumference centered on the rotation central axis may be separated and the suction force acting on each may be changed so that the urging portions 23c, 123c provided on the circumference centered on the rotation central axis are deformed more than the urging portions 23c, 123c provided on the circumference centered on the rotation central axis. For example, the exhaust volume of the exhaust unit 26 may be controlled so that the suction force acting on the holes 23a1 communicating with the urging portions 23c, 123c provided at the position of the rotation central axis is greater than that on the holes 23a1 communicating with the urging portions 23c, 123c provided on the circumference centered on the rotation central axis.

[0074] In the above, the case where the suction portion 23b and the urging portion 23c, or the suction portion 123b and the urging portion 123c, are provided on the substrate 102 side of the bonded substrate 100 has been exemplified, but these can also be provided on the substrate 101 side of the bonded substrate 100. Furthermore, these can also be provided on the substrate 101 side and the substrate 102 side of the bonded substrate 100. In other words, the suction portion 23b and the urging portion 23c, or the suction portion 123b and the urging portion 123c can be provided on at least one of the substrate 101 side and the substrate 102 side of the bonded substrate 100.

[0075] In this case, if the suction unit 23b and the urging unit 23c, or the suction unit 123b and the urging unit 123c, are provided on the substrate 101 side and the substrate 102 side of the bonded substrate 100, the position of the peripheral edge of the bonded substrate 100 may vary in the direction along the rotation center axis 1a of the separation device 1. If the position of the peripheral edge of the bonded substrate 100 varies, there is a risk that the liquid 40a will not be sprayed at an appropriate position. Therefore, when the suction unit 23b and the urging unit 23c, or the suction unit 123b and the urging unit 123c are provided on the substrate 101 side and the substrate 102 side of the bonded substrate 100, it is preferable to provide an image sensor that detects the position of the peripheral edge of the bonded substrate 100 and a moving unit that moves the position of the nozzle 41 based on an image captured by the image sensor.

[0076] 10 is a schematic enlarged view illustrating the holding unit 23 in a separation device 11 according to another embodiment. The separation device 11 is the separation device 1 described above, further provided with an imaging unit 60, with other elements being similar to those of the separation device 1. The imaging unit 60 is electrically connected to the controller 50. The imaging unit 60 is, for example, a camera that captures an image of the urging unit 23c. The image of the urging unit 23c captured by the imaging unit 60 includes a speckle pattern generated on the surface of the urging unit 23c. The speckle pattern can be, for example, a pattern of multiple dots generated on the surface by painting or spraying a fine substance on the surface of the urging unit 23c.

[0077] The controller 50 can analyze and process the image data of the speckle pattern acquired by the imaging unit 60. For example, the controller 50 can use the digital image correlation (DIC) method on the image data of the speckle pattern to set a minute analysis region called a subset in the image before the start of separation (before the deformation), and perform a matching process or the like to determine the position of the subset in the image after the start of separation (after the deformation), thereby calculating the amount of displacement at any location of the urging unit 23 c before and after the deformation.

[0078] In this way, it is possible to detect the change in shape of the urging portion 23c and determine the separation status of the bonded substrate 100. More specifically, the separation status of the bonded substrate 100 can be determined by calculating the displacement amount (deformation amount) of the urging portion 23c before and after the start of separation based on the speckle pattern generated on the surface of the urging portion 23c as described above.

[0079] For example, when determining the separation status of the outer peripheral region of the bonded substrate 100, an image of the speckle pattern of the urging portion 23c provided on the suction portion 23b near the periphery of the holding portion 23 is captured, and the amount of displacement at any point of the urging portion 23c is calculated from the acquired image data. When the amount of displacement reaches a predetermined amount that would be required for a separated state, it can be determined that separation in the outer peripheral region is complete.

[0080] Furthermore, for example, when determining the separation status of the central region of the bonded substrate 100 (the region near the central axis of rotation of the bonded substrate 100), an image of the speckle pattern of the urging unit 23 c provided at the position of the central axis of rotation is captured, and the amount of displacement at any point of the urging unit 23 c is calculated from the acquired image data. When the amount of displacement reaches the predetermined amount of displacement when a separated state is reached, it can be determined that separation in the central region is complete.

[0081] Based on the separation state as described above, it is also possible to control the movement unit 25 to move the nozzle 41 from the outer periphery toward the center.

[0082] In addition, by simultaneously capturing images of multiple biasing portions 23c arranged on a circumference centered on the rotation center axis 1a and comparing the amount of displacement of each, it is possible to determine whether separation is progressing uniformly.

[0083] Note that the separation status can be determined by detecting a change in the shape of the urging portion 23c. For example, the imaging unit 60 may capture an image of the urging portion 23c, not just a speckle pattern. The controller 50 then obtains the amount of displacement by comparing the changes in the axial length and outer shape of the urging portion 23c before and after separation, and can determine the separation status and completion.

[0084] Although the separation devices 1 and 11 in which the rotation axis 1a extends in a substantially vertical direction have been exemplified above, the present invention can also be applied to a separation device in which the rotation axis 1a extends in a substantially horizontal direction.

[0085] The above are examples of the embodiments. However, the present invention is not limited to these descriptions. Regarding the above-described embodiments, those skilled in the art may add, delete, or modify components, or add, omit, or modify processes as appropriate, and such modifications are also within the scope of the present invention as long as they incorporate the features of the present invention. For example, the shape, dimensions, materials, and arrangement of each element of the separation device 1 are not limited to those illustrated and can be modified as appropriate. Furthermore, the elements of the above-described embodiments can be combined to the greatest extent possible, and such combinations are also within the scope of the present invention as long as they incorporate the features of the present invention.

[0086] DESCRIPTION OF SYMBOLS 1 Separation device, 1a Rotation central axis, 20 Rotation holding part, 21 Holding part, 23 Holding part, 23a Base part, 23b Suction part, 23c Forcing part, 24 Driving part, 26 Exhaust part, 40 Separation part, 40a Liquid, 41 Nozzle, 50 Controller, 60 Imaging part, 100 Bonded substrate, 101 Substrate, 102 Substrate, 123 Holding part, 123a Base part, 123b Suction part, 123c Forcing part, 123d Pipe

Claims

1. A separation device comprising: a first holding section that holds one surface of a plate member; a second holding section that holds the other surface of the plate member; a drive section that rotates the first holding section and the second holding section; and a nozzle that sprays liquid onto the side surface of the plate member, wherein at least one of the first holding section and the second holding section has a plurality of suction sections that suction the plate member, and a biasing section that is provided on each of the plurality of suction sections and biases the suction section in a direction away from the plate member.

2. The separation device according to claim 1, wherein said suction portion and said biasing portion are integrally formed.

3. A separation device as described in claim 1 or 2, wherein the plurality of adsorption sections include a first adsorption section provided at the position of the central axis of rotation of the first holding section and the second holding section, and a plurality of second adsorption sections provided on a circumference centered on the central axis of rotation.

4. A separation device according to claim 3, wherein the plurality of second adsorption portions are provided on the circumference of concentric circles centered on the central axis of rotation.

5. A separation device according to claim 3, wherein the second biasing portion provided on the second suction portion is more easily deformed than the first biasing portion provided on the first suction portion.

6. The separation device according to claim 1, further comprising an imaging unit that images the urging unit, and a controller that calculates the amount of displacement of the urging unit from the image captured by the imaging unit and determines the separation status of the plate member based on the amount of displacement.

Images