Imaging device

Abstract

An imaging device according to one embodiment of the present disclosure comprises: a substrate that has a first surface and a second surface on the opposite side from first surface; and an electronic component that is provided to the first surface, wherein the substrate has a first heat transfer path part that intersects the first surface, a second heat transfer path part that intersects the second surface, and a third heat transfer path part that intersects the first heat transfer path part and the second heat transfer path part.

Description

Imaging device

[0001] The present disclosure relates to an imaging device.

[0002] Typically, imaging devices such as vehicle-mounted cameras include a substrate on which electronic components such as imaging elements are mounted. For example, electronic components are heat-generating components. The amount of heat generated by these electronic components tends to increase due to increased functionality, power, and integration. This increases the heat density of the electronic components, which can cause thermal problems in imaging devices. Therefore, to dissipate heat from the electronic components, through-holes are provided, for example, directly below the electronic components (see, for example, Patent Document 1).

[0003] JP 2010-263138 A

[0004] However, due to layout constraints such as component and wiring, it is sometimes difficult to locate a through-hole directly under an electronic component, making it difficult to dissipate heat from the electronic component and resulting in an increase in the temperature of the electronic component.

[0005] Therefore, the present disclosure provides an imaging device that can suppress a rise in temperature of electronic components.

[0006] An imaging device according to one embodiment of the present disclosure comprises a substrate including a first surface and a second surface opposite the first surface, and an electronic component provided on the first surface, wherein the substrate has a first heat transfer path portion intersecting with the first surface, a second heat transfer path portion intersecting with the second surface, and a third heat transfer path portion intersecting with the first heat transfer path portion and the second heat transfer path portion.

[0007] 1 is an exploded perspective view showing a configuration example of an imaging device according to an embodiment of the present disclosure; FIG. 2 is a cross-sectional view showing a configuration example of an imaging device according to an embodiment of the present disclosure; FIG. 3 is a plan view showing a front surface of a front substrate according to an embodiment of the present disclosure; FIG. 4 is a plan view showing a rear surface of a front substrate according to an embodiment of the present disclosure; FIG. 5 is a plan view showing an assembled state of a lens unit, a front substrate, a sealing member, and a substrate spacer according to an embodiment of the present disclosure; FIG. 6 is a cross-sectional view showing a heat transfer path portion of a front substrate according to an embodiment of the present disclosure; FIG. 7 is a plan view showing an assembled state of a lens unit, a front substrate, a sealing member, a substrate spacer, and a rear substrate according to an embodiment of the present disclosure; FIG. 8 is a cross-sectional view showing a heat transfer path portion of a fifth layer of a front substrate according to an embodiment of the present disclosure; FIG. 9 is a cross-sectional view showing a configuration example of a front substrate of a first modified example according to an embodiment of the present disclosure; FIG. 10 is a cross-sectional view showing a configuration example of a front substrate of a second modified example according to an embodiment of the present disclosure; FIG. 11 is a cross-sectional view showing a configuration example of a front substrate of a third modified example according to an embodiment of the present disclosure; FIG. 12 is a block diagram showing an example of a schematic configuration of a vehicle control system; FIG. 13 is an explanatory diagram showing an example of installation positions of an outside vehicle information detection unit and an imaging unit.

[0008] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings. The embodiments include examples and modifications. Note that the devices, methods, systems, etc. according to the present disclosure are not limited to the embodiments. Furthermore, in the embodiments, essentially identical components are designated by the same reference numerals, and redundant explanations will be omitted.

[0009] The present disclosure will be described in the following order: 1. Embodiment 1-1. Configuration example of imaging device 1-2. Configuration example of front substrate 1-3. Assembly process example of imaging device 1-4. Configuration example of heat transfer path part of front substrate 1-5. Modified examples of front substrate 1-5-1. Modified example 1 1-5-2. Modified example 2 1-5-3. Modified example 3 1-6. Actions and effects 2. Other embodiments 3. Application examples 4. Supplementary notes

[0010] <1. Embodiment> <1-1. Configuration Example of Imaging Device> A configuration example of an imaging device 1 according to this embodiment will be described with reference to Fig. 1 and Fig. 2. Fig. 1 is an exploded perspective view showing the configuration example of the imaging device 1 according to this embodiment. Fig. 2 is a cross-sectional view showing the configuration example of the imaging device 1 according to this embodiment.

[0011] As shown in Figures 1 and 2, the imaging device 1 of this embodiment includes a lens unit 10, a front substrate 20, a sealing member 30, a substrate spacer 40, a rear substrate 50, a plurality of heat dissipation members 60A, 60B, a connector unit 70, and a plurality of joining members 80A, 80B.

[0012] The lens unit 10 has a lens barrel 11 and a holder 12. The lens barrel 11 houses a plurality of lenses. For example, a biconvex lens, a plano-convex lens, a biconcave lens, a plano-concave lens, or a meniscus lens is used as each lens. The holder 12 holds the lens barrel 11. For example, the holder 12 holds one end of the lens barrel 11. The one end of the lens barrel 11 is fixed in close contact with the holder 12. For example, a metal holder made of aluminum die-cast or the like is used as the holder 12. Note that the lens barrel 11 and the holder 12 are formed as separate bodies, but may also be formed as a single body.

[0013] The front substrate 20 has an imaging element 21 and a connector 22 (see FIG. 2). The front substrate 20 includes a front surface 20A and a rear surface 20B (see FIG. 2). The rear surface 20B is the surface opposite the front surface 20A, facing the front surface 20A. The imaging element 21 is provided on the front surface 20A, and the connector 22 is provided on the rear surface 20B. Note that electronic components other than the imaging element 21 and the connector 22, such as chips, resistors, and capacitors, may be mounted on the front surface 20A or the rear surface 20B. The front surface 20A functions as a first surface, and the rear surface 20B functions as a second surface.

[0014] For example, a printed circuit board is used as the front substrate 20. Furthermore, for example, a complementary metal oxide semiconductor (CMOS) image sensor, a charge coupled device (CCD) image sensor, etc. is used as the imaging element 21. For example, a board-to-board connector is used as the connector 51.

[0015] The lens unit 10 is provided on the front substrate 20 so as to cover the imaging element 21. The lens unit 10 and the front substrate 20 form an internal space 10A (see FIG. 2) that houses the imaging element 21. The end of the holder 12 of the lens unit 10 on the front substrate 20 side is fixed to the front surface 20A of the front substrate 20, for example, with an adhesive. This brings the end of the holder 12 on the front substrate 20 side into close contact with the front surface 20A of the front substrate 20. A through hole 20a (see FIG. 2) is formed in the front substrate 20. This through hole 20a connects the internal space 10A, which functions as a sealed space, to the space outside the internal space 10A.

[0016] However, the intrusion of foreign matter (e.g., several tens of μm) into the internal space 10A can lead to defects such as the foreign matter being reflected in the image pickup element 21 or causing flare. For this reason, a foreign matter intrusion prevention structure is provided on the rear surface 20B of the front substrate 20 at the through-hole 20a. For example, a breathable filter 23 (see FIG. 2) is used as the foreign matter intrusion prevention structure. The filter 23 is formed, for example, from a sealing material. The filter 23 is attached to the rear surface 20B of the front substrate 20 so as to close the through-hole 20a.

[0017] The sealing member 30 is a member that maintains airtightness and liquid tightness. The sealing member 30 is provided between the lens unit 10 and the connector unit 70. The sealing member 30 is formed, for example, in an annular shape. The sealing member 30 is provided, for example, in a groove portion 10a (see FIG. 2) formed in the lens unit 10, and is in close contact with the lens unit 10 and the connector unit 70. For example, a packing is used as the sealing member 30.

[0018] The substrate spacer 40 is a member that ensures a space (e.g., a separation distance) between the front substrate 20 and the rear substrate 50. The substrate spacer 40 is formed, for example, in a ring shape. The substrate spacer 40 is formed, for example, from a heat dissipation resin material. This substrate spacer 40 is in contact, for example, with the rear surface 20B of the front substrate 20, and functions as a heat dissipation member that dissipates heat from the front substrate 20.

[0019] The rear substrate 50 has a connector 51 and a connector 52 (see FIG. 2). The rear substrate 50 includes a front surface 50A and a rear surface 50B (see FIG. 2). The rear surface 50B is the surface opposite the front surface 50A and faces the front surface 50A. The connector 51 is provided on the front surface 50A, and the connector 52 is provided on the rear surface 50B. The rear substrate 50 is in contact with, for example, the substrate spacer 40, and functions as a heat dissipation member that dissipates heat from the substrate spacer 40. Note that, electronic components other than the connectors 51 and 52, such as chips, resistors, and capacitors, may be mounted on the front surface 50A or the rear surface 50B of the rear substrate 50.

[0020] The rear substrate 50 may be, for example, a printed circuit board. The connector 51 may be, for example, a board-to-board connector. The connector 52 may be, for example, a PCB (printed circuit board) connector.

[0021] Each of the heat dissipation members 60A, 60B is a member that dissipates heat from the rear substrate 50 and the like. Each of these heat dissipation members 60A, 60B is provided on the rear substrate 50 so as to be in contact with the connector unit 70. For example, a heat dissipation block or a heat dissipation sheet is used as each of the heat dissipation members 60A, 60B. For example, a metal plate such as a heat spreader is used as the heat dissipation sheet.

[0022] The connector unit 70 has a housing 71 and a connector portion 72. The housing 71 is a member that houses the front substrate 20, the substrate spacer 40, the rear substrate 50, the heat dissipation members 60A and 60B, etc. The housing 71 is, for example, a metal housing made of aluminum die-cast or the like. The connector portion 72 is a member that enables connection between the imaging device 1 and an external device. For example, when the imaging device 1 is connected to an external device via the connector portion 72, the imaging element 21 is electrically connected to the external device.

[0023] Each of the joining members 80A, 80B (see FIG. 1) is a member that joins the lens unit 10 and the connector unit 70. The lens unit 10 and the connector unit 70 are joined by each of the joining members 80A, 80B via the sealing member 30. For example, screws are used as each of the joining members 80A, 80B.

[0024] <1-2. Configuration Example of Front Substrate> A configuration example of the front substrate 20 according to this embodiment will be described with reference to Fig. 3 and Fig. 4. Fig. 3 is a plan view showing the front surface 20A of the front substrate 20 according to this embodiment. Fig. 4 is a plan view showing the rear surface 20B of the front substrate 20 according to this embodiment.

[0025] 3 and 4 , a ring-shaped adhesive region B1 is provided on the front surface 20A of the front substrate 20 so as to surround the imaging element 21. The adhesive region B1 is an area where an adhesive is applied to bond the lens unit 10 (e.g., the end of the holder 12 on the front substrate 20 side) and the front substrate 20. For example, a photocurable adhesive, a thermosetting adhesive, or a hybrid adhesive (photocurable and thermosetting) is used as the adhesive.

[0026] A predetermined area A1 is provided inside the annular adhesive area B1. The predetermined area A1 is an area surrounding the imaging element 21 and close to the imaging element 21. A through-hole 20a is formed in this predetermined area A1. The predetermined area A1 exists on both the front surface 20A and the rear surface 20B.

[0027] A plurality of predetermined areas A2 are provided outside the annular adhesive area B1. Each of the predetermined areas A2 is formed in the outer peripheral area of ​​the front substrate 20. The predetermined areas A2 are provided so as to face each other with the imaging element 21 in between. A plurality of through holes 20b are formed in each of the predetermined areas A2. The number of through holes in each of the predetermined areas A2 is greater than the number of through holes in the predetermined area A1. Note that each predetermined area A2 exists on both the front surface 20A and the rear surface 20B.

[0028] Each of the through holes 20a, 20b is provided so as to avoid the adhesive area B1. The through hole 20a serves to adjust the air pressure in the internal space 10A formed by the lens unit 10 and the front substrate 20. The through hole 20a and each of the through holes 20b also function as a heat transfer path for transferring heat. This heat transfer path will be described in detail later.

[0029] Although the number of through holes 20a in the predetermined area A1 is one, it may be multiple, and although the number of through holes 20b in each predetermined area A2 is multiple, it may be one. However, in order to prevent foreign matter from entering the internal space 10A, it is desirable to reduce the number of through holes 20a connected to the internal space 10A to one.

[0030] 1-3. Example of assembly process for imaging device An example of an assembly process for the imaging device 1 according to this embodiment will be described with reference to Figs. 1, 2, 5, and 6. Fig. 5 is a plan view showing the assembled state of the lens unit 10, front substrate 20, sealing member 30, and substrate spacer 40 according to this embodiment. Fig. 6 is a plan view showing the assembled state of the lens unit 10, front substrate 20, sealing member 30, substrate spacer 40, and rear substrate 50 according to this embodiment.

[0031] 1 and 2, first, the lens unit 10 and the front substrate 20 are bonded and fixed with an adhesive after the positions of the lens unit 10 and the image sensor 21 are adjusted (aligned). The sealing member 30 is inserted, for example, into the groove 10a of the lens unit 10 to which the front substrate 20 is fixed (see FIG. 5).

[0032] In the alignment process, the optical axes of the lenses in the barrel 11 of the lens unit 10 and the image sensor 21 are aligned to determine the positional relationship between the lenses and the image sensor 21. For example, six-axis alignment is performed using the MTF (Modulation Transfer Function) measurement method. The MTF measurement method is defined by ISO (International Organization for Standardization) 12233.

[0033] In the fixing process, the lens unit 10 and the front substrate 20 are placed in, for example, a heat curing oven to harden the adhesive. At this time, the through holes 20a connect the internal space 10A of the lens unit 10 and the front substrate 20 to the external space, so that the pressure increase in the internal space 10A while the adhesive is hardening is released to the outside, and the pressure in the internal space 10A is equalized with the external pressure. This makes it possible to suppress the generation of air bubbles in the adhesive, thereby suppressing misalignment between the lenses in the lens barrel 11 and the image sensor 21.

[0034] Next, the substrate spacer 40 is placed so as to overlap the front substrate 20 fixed to the lens unit 10 (see FIG. 5). Then, the rear substrate 50 is placed so as to overlap the substrate spacer 40 that is placed on the front substrate 20 (see FIG. 6). At this time, the connector 51 on the front surface 50A of the rear substrate 50 is connected to the connector 22 on the rear surface 20B of the front substrate 20.

[0035] Thereafter, each of the heat dissipation members 60A, 60B is placed on the rear surface 50B of the rear substrate 50 that is placed on the substrate spacer 40. Then, the connector unit 70 is combined with the lens unit 10 via the sealing member 30. At this time, the connector portion 72 of the connector unit 70 is connected to the connector 52 on the rear surface 50B of the rear substrate 50. Finally, the combined lens unit 10 and connector unit 70 are joined by each of the joining members 80A, 80B.

[0036] The substrate spacer 40 is formed in a shape that makes contact only with the outer peripheral region of the rear surface 20B of the front substrate 20 and the outer peripheral region of the front surface 50A of the rear substrate 50 (see FIG. 2). More specifically, the substrate spacer 40 is formed in a shape that makes surface contact with each predetermined region A2 (see FIG. 4) on the rear surface 20B of the front substrate 20, i.e., the outer peripheral region including each through-hole 20b on the rear surface 20B, and further makes surface contact with the outer peripheral region of the front surface 50A of the rear substrate 50.

[0037] In addition, the board spacer 40 is formed in a shape that is as close as possible to the inner surface of the housing 71, or in a shape that contacts the inner surface of the housing 71, so that heat can be easily transferred to the housing 71 of the connector unit 70 (see Figure 2).

[0038] 1-4. Configuration Example of Heat Transfer Path Section of Front Substrate> A configuration example of the plurality of heat transfer path sections 91, 92a, 92b, and 93a to 93d of the front substrate 20 according to this embodiment will be described with reference to Fig. 7 and Fig. 8. Fig. 7 is a cross-sectional view showing the heat transfer path sections 91, 92a, 92b, and 93a to 93d of the front substrate 20 according to this embodiment. Fig. 8 is a plan view showing the heat transfer path sections 91, 92a, 92b, 93c, and 93d of the fifth layer of the front substrate 20 according to this embodiment.

[0039] As shown in Fig. 7, the front substrate 20 has a plurality of conductor layers (electrical conductor layers) C1 to C6. In the example of Fig. 7, six conductor layers C1 to C6 are shown. The number of conductor layers (conductive layers) is not particularly limited.

[0040] The imaging element 21 is fixed to the front surface 20A of the front substrate 20, for example, by a ball grid array (BGA), i.e., by a plurality of solder balls 21a. Each solder ball 21a is a ball-shaped solder. These solder balls 21a are arranged in a grid pattern on the bottom surface of the imaging element 21 (the surface facing the front substrate 20).

[0041] The lens unit 10 is provided on the front surface 20A of the front substrate 20 so as to cover the image sensor 21 fixed to the front substrate 20. At this time, the end of the holder 12 of the lens unit 10 on the front substrate 20 side is adhered and fixed to the front surface 20A of the front substrate 20 by an annular adhesive portion (adhesive) 12a.

[0042] The through holes 20a serve to transfer heat from the imaging element 21, which is a heat-generating component, to the rear surface 20B of the front substrate 20 and to the conductor layers C1 to C6. The through holes 20a function as heat transfer path sections (first heat transfer path sections) 91. That is, the heat transfer path section 91 is formed by, for example, the through holes 20a, extends from the front surface 20A to the rear surface 20B of the front substrate 20, and intersects with both the front surface 20A and the rear surface 20B.

[0043] Each of the through holes 20b serves to transfer heat diffused from the image sensor 21 in the planar direction of the front substrate 20 through the through hole 20a and the conductor layers C1 to C6 of the front substrate 20 toward the rear surface 20B of the front substrate 20. Each of the through holes 20b functions as a heat transfer path portion (second heat transfer path portion) 92a, 92b. That is, each of the heat transfer path portions 92a, 92b is formed, for example, by the through hole 20b, extends from the front surface 20A to the rear surface 20B of the front substrate 20, and intersects with both the front surface 20A and the rear surface 20B. Each of the heat transfer path portions 92a, 92b is in contact with the substrate spacer 40, which functions as a heat dissipation member.

[0044] Of the conductor layers C1 to C6, for example, the second conductor layer C2 has multiple heat transfer path portions (third heat transfer path portions) 93a and 93b, and the fifth conductor layer C5 has multiple heat transfer path portions (third heat transfer path portions) 93c and 93d. Each of these heat transfer path portions 93a to 93d extends parallel (or approximately parallel) to the front surface 20A of the front substrate 20 along the front surface 20A. Each of the heat transfer path portions 93a and 93c intersects with the heat transfer path portion 91 and the heat transfer path portion 92a, connecting them. Each of the heat transfer path portions 93b and 93d intersects with the heat transfer path portion 91 and the heat transfer path portion 92b, connecting them. Each of the heat transfer path portions 93a to 93d is formed of, for example, a metal foil (for example, copper foil) for wiring or grounding.

[0045] Each of the conductor layers C1 to C6 has a plurality of signal lines 94a to 94f. The signal lines 94a to 94f are connected to one another to form a single signal line. These signal lines 94a to 94f function as a single signal line connected to, for example, the image sensor 21. Each of the signal lines 94a to 94f is formed, for example, from a metal foil (e.g., copper foil) for wiring or a via hole.

[0046] 8, in the fifth conductor layer C5, the heat transfer path portions 93c and 93d are formed to avoid the signal lines 94d to 94f, i.e., not to come into contact with the signal lines 94d to 94f. In other words, the heat transfer path portions 93a to 93d are formed not to come into contact with the signal lines 94a to 94f. The heat transfer path portions 91, 92a, and 92b (through holes 20a and 20b) are also formed not to come into contact with the signal lines 94a to 94f. This allows the heat transfer path extending from the front surface 20A to the rear surface 20B to be formed not to come into contact with the signal lines 94a to 94f.

[0047] 7, with the front substrate 20 configured as above, heat from the image sensor 21, which is a heat-generating component, is transferred toward the rear surface 20B of the front substrate 20 via the heat transfer path 91 (through hole 20a) and to the heat transfer path 93a-93d (metal foils). The heat diffused from the image sensor 21 toward the surface of the front substrate 20 via the heat transfer path 91 and the heat transfer path 93a-93d is transferred toward the rear surface 20B of the front substrate 20 via the heat transfer path 92a, 92b (through hole 20b). The heat transferred to the rear surface 20B of the front substrate 20 by the heat transfer path 92a, 92b is then transferred to the housing 71 and the rear substrate 50 via the substrate spacer 40, which functions as a heat dissipation member in contact with the rear surface 20B.

[0048] Each of the heat transfer path portions 91, 92a, and 92b may be formed by a through hole or a via hole other than a through hole. Each of the through holes and via holes has a metal foil (e.g., copper foil) on its inner surface. Examples of via holes include through-hole vias and interstitial vias. Examples of interstitial vias include blind vias and buried vias. If each of the heat transfer path portions 91, 92a, and 92b is a blind via, it will intersect with either the front surface 20A or the rear surface 20B of the front substrate 20.

[0049] Furthermore, each of the heat transfer path sections 91, 92a, and 92b extends perpendicularly to the front surface 20A of the front substrate 20, but, for example, any or all of the heat transfer path sections 91, 92a, and 92b may extend obliquely to the front surface 20A of the front substrate 20.

[0050] Furthermore, each of the heat transfer path sections 93a to 93d extends in a direction parallel to the front surface 20A of the front substrate 20, but for example, any or all of the heat transfer path sections 91, 92a, and 92b may extend in an oblique direction to the front surface 20A of the front substrate 20, or may extend in a stepped or broken line shape.

[0051] Furthermore, each of the heat transfer path sections 91, 92a, 92b, and 93a to 93d is arranged so as to avoid each of the signal lines 94a to 94f, but if, for example, electronic components other than each of the signal lines 94d to 94f (for example, resistors, capacitors, transistors, etc.) are arranged within the front substrate 20, any or all of the heat transfer path sections 91, 92a, 92b, and 93a to 93d may be arranged so as to avoid the aforementioned electronic components.

[0052] In addition, any or all of the heat transfer path sections 91, 92a, 92b, 93a to 93d may be provided in the ground area (area at ground potential) of the front substrate 20 to reduce electrical influences on the front substrate 20.

[0053] Furthermore, for example, an adhesive having higher thermal conductivity than the surrounding materials may be used for the adhesive portion 12a. This adhesive portion 12a serves to transfer heat from the image sensor 21, which is a heat-generating component, from the front surface 20A of the front substrate 20 to the holder 12 of the lens unit 10. This can promote heat dissipation from the front substrate 20 side to the lens unit 10 side.

[0054] Typically, the entire back surface of the imaging element 21 is bonded to the front surface 20A of the front substrate 20, so there is no metal foil on the front surface 20A in the bonded area, and the base material is exposed on the front surface 20A of the front substrate 20. For this reason, the imaging element 21 is likely to be in a thermally floating state from the perspective of heat conduction in the planar direction of the front substrate 20. Furthermore, due to constraints such as BGA pitch, it is difficult to arrange through holes 20a directly below the imaging element 21, making heat conduction to the rear surface 20B of the front substrate 20 even more difficult. For example, if the BGA pitch of the imaging element 21 is narrow and the BGA of the imaging element 21 is full grid, it is extremely difficult to arrange through holes 20a directly below the imaging element 21.

[0055] According to this embodiment, heat from the imaging element 21 is transferred directly toward the rear surface 20B of the front substrate 20 by the heat transfer path portion 91 (through hole 20a), and is also transferred to each of the heat transfer path portions 93a to 93d (for example, metal foils for wiring, grounding, etc.) of the front substrate 20, thereby diffusing the heat in the planar direction of the front substrate 20. Furthermore, the diffused heat is transferred toward the rear surface 20B of the front substrate 20 by each of the heat transfer path portions 92a, 92b connected to each of the heat transfer path portions 93a to 93d. The heat is efficiently received by the substrate spacer 40 in surface contact with each of the heat transfer path portions 92a, 92b, and is transferred to the housing 71 in contact with the substrate spacer 40, the rear substrate 50, the heat dissipation members 60A, 60B, etc.

[0056] By realizing such stepped heat conduction, the heat dissipation effect can be improved even when it is difficult to dissipate heat toward the upper surface of electronic components such as the image sensor 21 (for example, when it is physically impossible to arrange a heat conductive material, as in the case of the image sensor 21, or when the distance from the electronic component to the outer casing is great), or when it is impossible to arrange a thermal via (for example, the through hole 20a) directly below the electronic component. Furthermore, by contacting a heat dissipation member such as the board spacer 40 with each heat transfer path portion 92a, 92b, it is possible to dissipate heat to peripheral components such as the casing 71 and the rear board 50. Therefore, the temperature rise of electronic components such as the image sensor 21 can be suppressed.

[0057] <1-5. Modified Examples of Front Substrate> <1-5-1. Modified Example 1> A configuration example of the front substrate 20 of modified example 1 according to this embodiment will be described with reference to Fig. 9. Fig. 9 is a cross-sectional view showing the configuration example of the front substrate 20 of modified example 1 according to this embodiment. In the example of Fig. 9, the through-holes 20a connecting the internal space 10A and the external space are not shown.

[0058] As shown in Figure 9, in the front substrate 20 of Modification 1, the heat transfer path portion 91 is formed by a blind via 20c, and only the fifth conductor layer C5 has heat transfer path portions 93c and 93d. The blind via 20c is formed on the front surface 20A of the front substrate 20 and intersects with the front surface 20A. The other configurations are the same as those in the above-described embodiment. Even with this Modification 1, it is possible to obtain the same effects as those in the above-described embodiment.

[0059] Each of the heat transfer path portions 92a, 92b may also be formed by a blind via 20c. In this case, the blind via 20c is formed on the rear surface 20B of the front substrate 20 and intersects with the rear surface 20B. Because this blind via 20c does not extend to the front surface 20A of the front substrate 20, heat transfer to the front surface 20A can be suppressed compared to when each of the heat transfer path portions 92a, 92b is each of the through holes 20a, 20b.

[0060] <1-5-2. Modification 2> A configuration example of the front substrate 20 of Modification 2 according to this embodiment will be described with reference to Fig. 10. Fig. 10 is a cross-sectional view showing a configuration example of the front substrate 20 of Modification 2 according to this embodiment. In the example of Fig. 10, the substrate spacer 40 and the rear substrate 50 are not shown.

[0061] 10 , the front substrate 20 of the second modification has basically the same configuration as that of the first modification, but in the second modification, chip components 24 such as IC (integrated circuit) chips are provided on the rear surface 20B of the front substrate 20. Like the imaging element 21, the chip components 24 are fixed to the rear surface 20B of the front substrate 20 by a plurality of solder balls 24a (BGA). These solder balls 24a are arranged in a lattice pattern on the bottom surface (the surface facing the front substrate 20) of the chip components 24. The chip components 24 are an example of electronic components.

[0062] The same effects as those of the above-described embodiment can be obtained with this modification 2. Furthermore, according to modification 2, even if the chip component 24 is present on the rear surface 20B facing the image sensor 21 on the front surface 20A of the front substrate 20 and the through-hole 20a is not provided directly below the image sensor 21, a heat transfer path extending from the front surface 20A to the rear surface 20B is appropriately formed, so that the heat of the image sensor 21 can be transferred to the rear surface 20B of the front substrate 20.

[0063] <1-5-3. Modification 3> A configuration example of the front substrate 20 of Modification 3 according to this embodiment will be described with reference to Fig. 11. Fig. 11 is a cross-sectional view showing a configuration example of the front substrate 20 of Modification 3 according to this embodiment. In the example of Fig. 11, as in Fig. 10, the substrate spacer 40 and the rear substrate 50 are not shown.

[0064] 11 , the front substrate 20 of the third modification is basically the same as that of the second modification, but in the third modification, a thermally conductive member 25 is provided inside each of the heat transfer path portions 91, 92a, and 92b (see FIG. 10 ), i.e., inside the blind via 20c and each through hole 20b. The thermally conductive member 25 is formed by filling the inside of the blind via 20c and each through hole 20b with a thermally conductive material. For example, a resin material such as underfill is used as the thermally conductive material.

[0065] The same effects as those of the above-described embodiment can be obtained with this modification 3. Furthermore, according to modification 3, heat conduction members 25 are provided inside each of blind vias 20 c and through holes 20 b that constitute heat transfer path portions 91, 92 a, and 92 b, thereby improving the heat transfer properties of each of heat transfer path portions 91, 92 a, and 92 b.

[0066] <1-6. Actions and Effects> As described above, the imaging device 1 according to this embodiment includes the front substrate 20 including the front surface (first surface) 20A and the rear surface (second surface) 20B opposite the front surface 20A, and electronic components (e.g., the imaging element 21) provided on the front surface 20A. The front substrate 20 has a first heat transfer path portion (e.g., heat transfer path portion 91) that intersects with the front surface 20A, a second heat transfer path portion (e.g., heat transfer path portions 92a and 92b) that intersects with the rear surface 20B, and a third heat transfer path portion (e.g., heat transfer path portions 93a to 93d) that intersect with the first heat transfer path portion and the second heat transfer path portion (see FIGS. 7 to 11 ). This combines the first heat transfer path section, the second heat transfer path section, and the third heat transfer path section, and a heat transfer path extending from the front surface 20A to the rear surface 20B is appropriately formed on the front substrate 20, making it possible to reliably transfer heat from the electronic components from the front surface 20A side to the rear surface 20B side, thereby suppressing temperature rise in the electronic components.

[0067] Furthermore, the third heat transfer path portions (for example, the heat transfer path portions 93a to 93d) may extend along the front surface 20A and the rear surface 20B of the front substrate 20 (see FIGS. 7 to 11). This allows a heat transfer path extending from the front surface 20A to the rear surface 20B to be appropriately formed in the front substrate 20.

[0068] In addition, one or both of the first heat transfer path portion (e.g., heat transfer path portion 91) and the second heat transfer path portion (e.g., heat transfer path portions 92a and 92b) may be through holes, through holes 20a, or via holes (e.g., blind vias 20c) (see FIGS. 7 to 11 ), which allows one or both of the first heat transfer path portion and the second heat transfer path portion to be easily formed.

[0069] Furthermore, one or both of the first heat transfer path portion (e.g., heat transfer path portion 91) and the second heat transfer path portion (e.g., each of heat transfer path portions 92a and 92b) may have a heat conducting member 25 provided inside a through hole, a through hole, or a via hole (see FIG. 11 ). This can improve the heat transfer properties of one or both of the first heat transfer path portion and the second heat transfer path portion.

[0070] Furthermore, the first heat transfer path portion (for example, the heat transfer path portion 91) may be a blind via 20c (see FIGS. 9 to 11), which allows the first heat transfer path portion to be easily formed.

[0071] The third heat transfer path portions (for example, the heat transfer path portions 93a to 93d) may be made of metal foil (see FIGS. 7 to 11), which allows the third heat transfer path portions to be easily formed.

[0072] Furthermore, the first heat transfer path portion (for example, heat transfer path portion 91) may be formed around the electronic components on the front substrate 20, and the second heat transfer path portion (for example, heat transfer path portions 92a and 92b) may be formed in the outer peripheral region of the front substrate 20 (see FIGS. 3 and 4). This allows a heat transfer path extending from the front surface 20A to the rear surface 20B to be appropriately formed on the front substrate 20, and ensures that heat from the electronic components is transferred from the front surface 20A to the rear surface 20B.

[0073] Also, the number of first heat transfer path portions (e.g., heat transfer path portion 91) may be one, the number of second heat transfer path portions (e.g., heat transfer path portions 92a and 92b) may be multiple, and the number of third heat transfer path portions (e.g., heat transfer path portions 93a to 93d) may be multiple (see FIGS. 3 and 4). This ensures that a heat transfer path extending from the front surface 20A to the rear surface 20B is formed in the front substrate 20.

[0074] Furthermore, any one, two, or all of the first heat transfer path portion (e.g., heat transfer path portion 91), the second heat transfer path portion (e.g., heat transfer path portions 92a and 92b), and the third heat transfer path portion (e.g., heat transfer path portions 93a to 93d) may be provided in the ground region of the front substrate 20 (see FIGS. 7 to 11). This makes it possible to prevent the first heat transfer path portion, the second heat transfer path portion, and the third heat transfer path portion from being electrically affected by the front substrate 20.

[0075] The front substrate 20 may have built-in signal lines (e.g., signal lines 94a to 94f), and the first heat transfer path portion (e.g., heat transfer path portion 91), the second heat transfer path portion (e.g., heat transfer path portions 92a and 92b), and the third heat transfer path portion (e.g., heat transfer path portions 93a to 93d) may be provided so as to avoid the signal lines (see FIGS. 7 to 11). This allows a heat transfer path extending from the front surface 20A to the rear surface 20B to be appropriately formed in the front substrate 20.

[0076] Furthermore, the front substrate 20 may have the signal line (e.g., signal line 94e) and the third heat transfer path portion (e.g., heat transfer path portions 93c and 93d) in the same layer (e.g., conductor layer C5) without crossing each other (see FIG. 8 ). This allows the signal line and the heat transfer path to be appropriately formed in the same layer within the front substrate 20.

[0077] The imaging device 1 may further include a heat dissipation member (e.g., substrate spacer 40) provided on the rear surface 20B of the front substrate 20 and in contact with the second heat transfer path portions (e.g., heat transfer path portions 92a and 92b) (see FIGS. 1, 2, 7, etc.). This can reliably suppress temperature increases in the electronic components.

[0078] The imaging device 1 may further include a rear substrate 50 that is in contact with a heat dissipation member (for example, a substrate spacer 40) (see FIGS. 1, 2, 7, etc.). This makes it possible to reliably suppress temperature increases in electronic components.

[0079] The heat dissipation member may also be a substrate spacer 40 that contacts the front substrate 20 and the rear substrate 50 and secures a space between the front substrate 20 and the rear substrate 50 (see FIGS. 1, 2, 7, etc.). This makes it possible to secure a space between the front substrate 20 and the rear substrate 50 while reliably suppressing a rise in temperature of the electronic components.

[0080] The imaging device 1 may further include a housing 71 that is in contact with a heat dissipation member (e.g., the board spacer 40) and that houses the front board 20 (see FIGS. 1, 2, 7, etc.). This makes it possible to reliably suppress temperature increases in the electronic components.

[0081] Furthermore, the first heat transfer path portion (for example, the heat transfer path portion 91) may be provided so as to avoid the area of ​​the front substrate 20 where electronic components are installed (see FIGS. 3, 4, 7, etc.). This allows a heat transfer path extending from the front surface 20A to the rear surface 20B to be appropriately formed on the front substrate 20.

[0082] Furthermore, the front substrate 20 may have other electronic components (e.g., chip components 24) provided on the rear surface 20B, and the first heat transfer path portion (e.g., heat transfer path portion 91) and the second heat transfer path portion (e.g., heat transfer path portions 92a and 92b) may be provided so as to avoid the areas where the electronic components and / or the other electronic components are provided on the front substrate 20 (see FIG. 10, etc.). This allows a heat transfer path extending from the front surface 20A to the rear surface 20B to be appropriately formed on the front substrate 20.

[0083] The electronic component may be the imaging element 21 (see FIGS. 1, 2, 7, etc.). This makes it possible to suppress a rise in temperature of the imaging element 21.

[0084] The imaging device 1 may further include a lens unit 10 that is provided on the front surface 20A of the front substrate 20 and faces the imaging element 21 (see FIGS. 1, 2, 7, etc.). Even with this configuration, it is possible to suppress a rise in temperature of the imaging element 21.

[0085] Furthermore, the lens unit 10 and the front surface 20A of the front substrate 20 form an internal space 10A that houses the image sensor 21, and the first heat transfer path portion (for example, the heat transfer path portion 91) may be a through hole, a through hole 20a, or a through hole via that connects to the internal space 10A (see FIGS. 1, 2, 7, etc.). This connects the internal space 10A to the external space, and makes it possible to adjust the air pressure in the internal space 10A.

[0086] 2. Other Embodiments The configurations and processes according to the above-described embodiments (including examples and modified examples) may be implemented in various different forms other than the above-described embodiments. For example, the configurations and processes are not limited to the above-described examples and may be implemented in various forms. Furthermore, for example, the configurations, processing procedures, specific names, or information including various data and parameters shown in the above documents and drawings may be changed arbitrarily unless otherwise specified.

[0087] Furthermore, the components and processes according to the above-described embodiments (including examples and modifications) do not necessarily have to be physically configured as shown in the drawings. In other words, the specific forms of distribution and integration of the components and processes are not limited to those shown in the drawings, and all or part of them may be functionally or physically distributed or integrated in any unit depending on various loads, usage conditions, etc.

[0088] Furthermore, the configurations and processes of the above-described embodiments (including examples and modified examples) may be combined as appropriate. For example, at least a part of an embodiment may be combined as appropriate with at least a part of another embodiment. Furthermore, the effects of the embodiments are merely examples and are not intended to be limiting, and other effects may also be obtained.

[0089] 3. Application Examples The technology according to the present disclosure can be applied to various products. For example, the technology according to the present disclosure may be realized as a device (e.g., electronic device) mounted on any type of moving object, such as an automobile, an electric vehicle, a hybrid electric vehicle, a motorcycle, a bicycle, a personal mobility device, an airplane, a drone, a ship, a robot, construction machinery, or agricultural machinery (tractor). Furthermore, for example, the technology according to the present disclosure may be realized as a device (e.g., electronic device) mounted on an endoscopic surgery system, a microsurgery system, or the like.

[0090] 12 is a block diagram showing a schematic configuration example of a vehicle control system 7000, which is an example of a mobile object control system to which the technology according to the present disclosure can be applied. The vehicle control system 7000 includes a plurality of electronic control units connected via a communication network 7010. In the example shown in FIG. 12, the vehicle control system 7000 includes a drive system control unit 7100, a body system control unit 7200, a battery control unit 7300, an outside-vehicle information detection unit 7400, an inside-vehicle information detection unit 7500, and an integrated control unit 7600. The communication network 7010 connecting these multiple control units may be an in-vehicle communication network conforming to any standard, such as a Controller Area Network (CAN), a Local Interconnect Network (LIN), a Local Area Network (LAN), or FlexRay (registered trademark).

[0091] Each control unit includes a microcomputer that performs arithmetic processing according to various programs, a memory unit that stores the programs executed by the microcomputer or parameters used in various calculations, and a drive circuit that drives various devices to be controlled. Each control unit includes a network I / F for communicating with other control units via a communication network 7010, and a communication I / F for communicating with devices or sensors inside and outside the vehicle via wired or wireless communication. Figure 12 illustrates the functional configuration of the integrated control unit 7600, including a microcomputer 7610, a general-purpose communication I / F 7620, a dedicated communication I / F 7630, a positioning unit 7640, a beacon receiving unit 7650, an in-vehicle device I / F 7660, an audio / video output unit 7670, an in-vehicle network I / F 7680, and a memory unit 7690. Other control units also include a microcomputer, a communication I / F, a memory unit, and the like.

[0092] The drivetrain control unit 7100 controls the operation of devices related to the drivetrain of the vehicle in accordance with various programs. For example, the drivetrain control unit 7100 functions as a control device for a drive force generating device for generating drive force for the vehicle, such as an internal combustion engine or a drive motor, a drive force transmission mechanism for transmitting drive force to the wheels, a steering mechanism for adjusting the steering angle of the vehicle, and a braking device for generating braking force for the vehicle. The drivetrain control unit 7100 may also function as a control device for an ABS (Antilock Brake System) or an ESC (Electronic Stability Control), etc.

[0093] A vehicle state detection unit 7110 is connected to the drivetrain control unit 7100. The vehicle state detection unit 7110 includes at least one of a gyro sensor that detects the angular velocity of the axial rotational motion of the vehicle body, an acceleration sensor that detects the acceleration of the vehicle, or a sensor that detects the amount of operation of the accelerator pedal, the amount of operation of the brake pedal, the steering angle of the steering wheel, the engine rotation speed, the rotation speed of the wheels, etc. The drivetrain control unit 7100 performs arithmetic processing using signals input from the vehicle state detection unit 7110, and controls the internal combustion engine, the drive motor, the electric power steering device, the brake device, etc.

[0094] The body system control unit 7200 controls the operation of various devices equipped in the vehicle body according to various programs. For example, the body system control unit 7200 functions as a control device for a keyless entry system, a smart key system, a power window device, or various lamps such as headlamps, backup lamps, brake lamps, turn signals, and fog lamps. In this case, radio waves transmitted from a portable device that serves as a key or signals from various switches can be input to the body system control unit 7200. The body system control unit 7200 receives these radio waves or signals and controls the vehicle's door lock device, power window device, lamps, etc.

[0095] The battery control unit 7300 controls the secondary battery 7310, which is the power supply source for the drive motor, in accordance with various programs. For example, information such as battery temperature, battery output voltage, or remaining battery capacity is input to the battery control unit 7300 from a battery device equipped with the secondary battery 7310. The battery control unit 7300 performs arithmetic processing using these signals, and controls the temperature regulation of the secondary battery 7310 or a cooling device or the like equipped in the battery device.

[0096] The outside vehicle information detection unit 7400 detects information outside the vehicle equipped with the vehicle control system 7000. For example, at least one of an imaging unit 7410 and an outside vehicle information detection unit 7420 is connected to the outside vehicle information detection unit 7400. The imaging unit 7410 includes at least one of a time-of-flight (ToF) camera, a stereo camera, a monocular camera, an infrared camera, and other cameras. The outside vehicle information detection unit 7420 includes at least one of an environmental sensor for detecting the current weather or climate, or a surrounding information detection sensor for detecting other vehicles, obstacles, pedestrians, etc. around the vehicle equipped with the vehicle control system 7000.

[0097] The environmental sensor may be, for example, at least one of a raindrop sensor that detects rain, a fog sensor that detects fog, a sunshine sensor that detects the degree of sunshine, and a snow sensor that detects snowfall. The surrounding information detection sensor may be at least one of an ultrasonic sensor, a radar device, and a LIDAR (Light Detection and Ranging, Laser Imaging Detection and Ranging) device. The imaging unit 7410 and the outside vehicle information detection unit 7420 may each be provided as an independent sensor or device, or may be provided as a device in which multiple sensors or devices are integrated.

[0098] 13 shows an example of the installation positions of the imaging unit 7410 and the vehicle exterior information detection unit 7420. The imaging units 7910, 7912, 7914, 7916, and 7918 are provided, for example, at least one of the front nose, side mirrors, rear bumper, back door, and upper part of the windshield inside the vehicle cabin of the vehicle 7900. The imaging unit 7910 provided on the front nose and the imaging unit 7918 provided on the upper part of the windshield inside the vehicle cabin mainly acquire images of the front of the vehicle 7900. The imaging units 7912 and 7914 provided on the side mirrors mainly acquire images of the sides of the vehicle 7900. The imaging unit 7916 provided on the rear bumper or back door mainly acquires images of the rear of the vehicle 7900. The imaging unit 7918 provided on the upper part of the windshield inside the vehicle cabin is mainly used to detect leading vehicles, pedestrians, obstacles, traffic lights, traffic signs, lanes, etc.

[0099] 13 shows an example of the imaging ranges of the imaging units 7910, 7912, 7914, and 7916. Imaging range a indicates the imaging range of the imaging unit 7910 provided on the front nose, imaging ranges b and c indicate the imaging ranges of the imaging units 7912 and 7914 provided on the side mirrors, respectively, and imaging range d indicates the imaging range of the imaging unit 7916 provided on the rear bumper or back door. For example, by overlaying the image data captured by the imaging units 7910, 7912, 7914, and 7916, a bird's-eye view image of the vehicle 7900 viewed from above can be obtained.

[0100] The outside vehicle information detection units 7920, 7922, 7924, 7926, 7928, and 7930 provided on the front, rear, sides, corners, and above the windshield inside the vehicle cabin of the vehicle 7900 may be, for example, ultrasonic sensors or radar devices. The outside vehicle information detection units 7920, 7926, and 7930 provided on the front nose, rear bumper, back door, and above the windshield inside the vehicle cabin of the vehicle 7900 may be, for example, LIDAR devices. These outside vehicle information detection units 7920 to 7930 are mainly used to detect preceding vehicles, pedestrians, obstacles, etc.

[0101] Returning to FIG. 12 , the explanation will be continued. The outside-vehicle information detection unit 7400 causes the imaging unit 7410 to capture an image outside the vehicle and receives the captured image data. The outside-vehicle information detection unit 7400 also receives detection information from the connected outside-vehicle information detection unit 7420. If the outside-vehicle information detection unit 7420 is an ultrasonic sensor, a radar device, or a LIDAR device, the outside-vehicle information detection unit 7400 emits ultrasonic waves or electromagnetic waves and receives information on the received reflected waves. Based on the received information, the outside-vehicle information detection unit 7400 may perform object detection processing or distance detection processing for people, vehicles, obstacles, signs, text on the road, etc. Based on the received information, the outside-vehicle information detection unit 7400 may also perform environmental recognition processing for recognizing rainfall, fog, road conditions, etc. Based on the received information, the outside-vehicle information detection unit 7400 may also calculate the distance to an object outside the vehicle.

[0102] The outside vehicle information detection unit 7400 may also perform image recognition processing or distance detection processing to recognize people, vehicles, obstacles, signs, or characters on the road surface based on the received image data. The outside vehicle information detection unit 7400 may perform processing such as distortion correction or alignment on the received image data, and may also generate an overhead image or a panoramic image by combining image data captured by different image capturing units 7410. The outside vehicle information detection unit 7400 may also perform viewpoint conversion processing using image data captured by different image capturing units 7410.

[0103] The interior information detection unit 7500 detects information inside the vehicle. A driver state detection unit 7510 that detects the driver's state is connected to the interior information detection unit 7500, for example. The driver state detection unit 7510 may include a camera that captures an image of the driver, a biosensor that detects the driver's biometric information, or a microphone that collects sound from within the vehicle cabin. The biosensor is provided, for example, on the seat or steering wheel, and detects the biometric information of a passenger sitting in the seat or the driver gripping the steering wheel. The interior information detection unit 7500 may calculate the driver's level of fatigue or concentration based on the detection information input from the driver state detection unit 7510, or may determine whether the driver is dozing off. The interior information detection unit 7500 may perform processing such as noise canceling on the collected audio signal.

[0104] The integrated control unit 7600 controls the overall operation of the vehicle control system 7000 according to various programs. An input unit 7800 is connected to the integrated control unit 7600. The input unit 7800 may be implemented by a device that can be operated by a passenger, such as a touch panel, a button, a microphone, a switch, or a lever. Data obtained by voice recognition of a voice input through a microphone may be input to the integrated control unit 7600. The input unit 7800 may be, for example, a remote control device using infrared or other radio waves, or an externally connected device such as a mobile phone or a personal digital assistant (PDA) that can operate the vehicle control system 7000. The input unit 7800 may be, for example, a camera, in which case the passenger can input information using gestures. Alternatively, data obtained by detecting the movement of a wearable device worn by the passenger may be input. Furthermore, the input unit 7800 may include, for example, an input control circuit that generates an input signal based on information input by the passenger using the input unit 7800 and outputs the input signal to the integrated control unit 7600. Passengers and the like operate this input unit 7800 to input various data to the vehicle control system 7000 and to instruct processing operations.

[0105] The storage unit 7690 may include a ROM (Read Only Memory) that stores various programs executed by the microcomputer, and a RAM (Random Access Memory) that stores various parameters, calculation results, sensor values, etc. The storage unit 7690 may also be realized by a magnetic storage device such as an HDD (Hard Disc Drive), a semiconductor storage device, an optical storage device, a magneto-optical storage device, or the like.

[0106] The general-purpose communication I / F 7620 is a general-purpose communication I / F that mediates communication with various devices present in the external environment 7750. The general-purpose communication I / F 7620 may implement a cellular communication protocol such as GSM (Global System of Mobile communications), WiMAX (registered trademark), LTE (Long Term Evolution), or LTE-Advanced (LTE-A), or other wireless communication protocols such as a wireless LAN (also referred to as Wi-Fi (registered trademark)) or Bluetooth (registered trademark). The general-purpose communication I / F 7620 may connect to a device (e.g., an application server or a control server) present on an external network (e.g., the Internet, a cloud network, or an operator-specific network) via, for example, a base station or an access point. In addition, the general-purpose communication I / F 7620 may connect to a terminal located near the vehicle (e.g., a terminal of a driver, pedestrian, or store, or an MTC (Machine Type Communication) terminal) using, for example, P2P (Peer To Peer) technology.

[0107] The dedicated communication I / F 7630 is a communication I / F that supports a communication protocol designed for use in vehicles. The dedicated communication I / F 7630 may implement a standard protocol such as WAVE (Wireless Access in Vehicle Environment), which is a combination of a lower layer IEEE 802.11p and an upper layer IEEE 1609, DSRC (Dedicated Short Range Communications), or a cellular communication protocol. The dedicated communication I / F 7630 typically performs V2X communication, which is a concept including one or more of vehicle-to-vehicle communication, vehicle-to-infrastructure communication, vehicle-to-home communication, and vehicle-to-pedestrian communication.

[0108] The positioning unit 7640 performs positioning by receiving, for example, GNSS signals from GNSS (Global Navigation Satellite System) satellites (for example, GPS signals from GPS (Global Positioning System) satellites), and generates position information including the latitude, longitude, and altitude of the vehicle. Note that the positioning unit 7640 may identify the current position by exchanging signals with a wireless access point, or may obtain position information from a terminal such as a mobile phone, PHS, or smartphone that has a positioning function.

[0109] The beacon receiving unit 7650 receives, for example, radio waves or electromagnetic waves transmitted from radio stations or the like installed on the road, and acquires information such as the current location, congestion, road closures, required travel time, etc. The function of the beacon receiving unit 7650 may be included in the dedicated communication I / F 7630 described above.

[0110] The in-vehicle device I / F 7660 is a communication interface that mediates connections between the microcomputer 7610 and various in-vehicle devices 7760 present in the vehicle. The in-vehicle device I / F 7660 may establish wireless connections using wireless communication protocols such as wireless LAN, Bluetooth (registered trademark), NFC (Near Field Communication), or WUSB (Wireless USB). Furthermore, the in-vehicle device I / F 7660 may establish a wired connection such as USB (Universal Serial Bus), HDMI (High-Definition Multimedia Interface), or MHL (Mobile High-Definition Link) via a connection terminal (and a cable, if necessary) not shown. The in-vehicle device 7760 may include, for example, at least one of a mobile device or a wearable device owned by a passenger, or an information device carried into or attached to the vehicle. The in-vehicle device 7760 may also include a navigation device that searches for a route to an arbitrary destination. The in-vehicle device I / F 7660 exchanges control signals or data signals with these in-vehicle devices 7760.

[0111] The in-vehicle network I / F 7680 is an interface that mediates communication between the microcomputer 7610 and the communication network 7010. The in-vehicle network I / F 7680 transmits and receives signals in accordance with a predetermined protocol supported by the communication network 7010.

[0112] The microcomputer 7610 of the integrated control unit 7600 controls the vehicle control system 7000 in accordance with various programs based on information acquired via at least one of the general-purpose communication I / F 7620, the dedicated communication I / F 7630, the positioning unit 7640, the beacon receiving unit 7650, the in-vehicle device I / F 7660, and the in-vehicle network I / F 7680. For example, the microcomputer 7610 may calculate control target values ​​for the driving force generating device, the steering mechanism, or the braking device based on the acquired information inside and outside the vehicle, and output control commands to the drivetrain control unit 7100. For example, the microcomputer 7610 may perform cooperative control aimed at realizing functions of an Advanced Driver Assistance System (ADAS), including vehicle collision avoidance or impact mitigation, following driving based on the following distance, vehicle speed maintenance driving, vehicle collision warning, vehicle lane departure warning, etc. In addition, the microcomputer 7610 may perform cooperative control for the purpose of autonomous driving, in which the vehicle travels autonomously without relying on driver operation, by controlling a driving force generating device, a steering mechanism, a braking device, etc. based on information acquired about the vehicle's surroundings.

[0113] The microcomputer 7610 may generate three-dimensional distance information between the vehicle and objects such as surrounding structures and people, and create local map information including information about the vicinity of the vehicle's current location, based on information acquired via at least one of the general-purpose communication I / F 7620, the dedicated communication I / F 7630, the positioning unit 7640, the beacon receiving unit 7650, the in-vehicle device I / F 7660, and the in-vehicle network I / F 7680. Furthermore, the microcomputer 7610 may predict dangers, such as a vehicle collision, the approach of a pedestrian, or entry into a closed road, based on the acquired information, and generate a warning signal. The warning signal may be, for example, a signal for generating a warning sound or turning on a warning lamp.

[0114] The audio / image output unit 7670 transmits at least one audio and / or image output signal to an output device capable of visually or audibly notifying the vehicle occupants or the outside of the vehicle. In the example of FIG. 12 , an audio speaker 7710, a display unit 7720, and an instrument panel 7730 are illustrated as examples of the output devices. The display unit 7720 may include, for example, at least one of an on-board display and a head-up display. The display unit 7720 may have an AR (Augmented Reality) display function. The output device may also be other devices, such as headphones, a wearable device such as an eyeglass-type display worn by the occupant, a projector, or a lamp. When the output device is a display device, the display device visually displays results obtained by various processes performed by the microcomputer 7610 or information received from other control units in various formats, such as text, images, tables, and graphs. When the output device is an audio output device, the audio output device converts audio signals, such as reproduced audio data or acoustic data, into analog signals and audibly outputs the analog signals.

[0115] In the example shown in FIG. 12 , at least two control units connected via the communication network 7010 may be integrated into a single control unit. Alternatively, each control unit may be composed of multiple control units. Furthermore, the vehicle control system 7000 may include another control unit not shown. In the above description, some or all of the functions performed by one of the control units may be performed by another control unit. In other words, as long as information is transmitted and received via the communication network 7010, predetermined arithmetic processing may be performed by one of the control units. Similarly, a sensor or device connected to one of the control units may be connected to another control unit, and multiple control units may transmit and receive detection information to and from each other via the communication network 7010.

[0116] A computer program for realizing each function (e.g., an imaging function) of the imaging device 1 according to this embodiment described with reference to FIG. 1 can be implemented in any control unit or the like. A computer-readable recording medium storing such a computer program can also be provided. Examples of the recording medium include a magnetic disk, an optical disk, a magneto-optical disk, and a flash memory. The computer program may also be distributed, for example, via a network without using a recording medium.

[0117] In the vehicle control system 7000 described above, the imaging device 1 according to the present embodiment described using Fig. 1 can be applied to devices related to the outside-vehicle information detection unit 7400 and inside-vehicle information detection unit 7500, which are application examples shown in Fig. 12. For example, the imaging device 1 can be applied to the imaging unit 7410, the outside-vehicle information detection unit 7420, the driver state detection unit 7510, etc.

[0118] Furthermore, at least some of the components of the imaging device 1 according to the present embodiment described with reference to Fig. 1 (for example, a control unit related to the imaging element 21) may be implemented in a module (for example, an integrated circuit module configured on a single die) for the integrated control unit 7600 shown in Fig. 12. Alternatively, at least some of the components of the imaging device 1 according to the present embodiment described with reference to Fig. 1 may be implemented by a plurality of control units of the vehicle control system 7000 shown in Fig. 12.

[0119] <4. Supplementary Notes> The present technology may also have the following configurations. (1) An imaging device including: a substrate including a first surface and a second surface opposite to the first surface; and an electronic component provided on the first surface, wherein the substrate has: a first heat transfer path portion intersecting with the first surface; a second heat transfer path portion intersecting with the second surface; and a third heat transfer path portion intersecting with the first heat transfer path portion and the second heat transfer path portion. (2) The imaging device described in (1), wherein the third heat transfer path portion extends along the first surface and the second surface. (3) The imaging device described in (1) or (2), wherein one or both of the first heat transfer path portion and the second heat transfer path portion are through holes, through holes, or via holes. (4) The imaging device according to (3), wherein one or both of the first heat transfer path portion and the second heat transfer path portion have a heat conductive member provided inside the through hole, the through hole, or the via hole. (5) The imaging device according to any one of (1) to (4), wherein the first heat transfer path portion is a blind via. (6) The imaging device according to any one of (1) to (5), wherein the third heat transfer path portion is a metal foil. (7) The imaging device according to any one of (1) to (6), wherein the first heat transfer path portion is formed around the electronic component on the substrate, and the second heat transfer path portion is formed in an outer peripheral region of the substrate. (8) The imaging device according to (7), wherein the number of the first heat transfer path portion is one, the number of the second heat transfer path portion is multiple, and the number of the third heat transfer path portion is multiple. (9) The imaging device according to any one of (1) to (8), wherein any one, two, or all of the first heat transfer path portion, the second heat transfer path portion, and the third heat transfer path portion are provided in a ground region of the substrate. (10) The imaging device according to any one of (1) to (9), wherein the substrate has a built-in signal line, and the first heat transfer path portion, the second heat transfer path portion, and the third heat transfer path portion are provided so as to avoid the signal line. (11) The imaging device according to (10), wherein the substrate has the signal line and the third heat transfer path portion in the same layer.(12) The imaging device according to any one of (1) to (11), further comprising a heat dissipation member provided on the second surface and in contact with the second heat transfer path portion. (13) The imaging device according to (12), further comprising another substrate in contact with the heat dissipation member. (14) The imaging device according to (13), wherein the heat dissipation member is a substrate spacer in contact with the substrate and the other substrate and ensures a space between the substrate and the other substrate. (15) The imaging device according to any one of (12) to (14), further comprising a housing in contact with the heat dissipation member and accommodating the substrate. (16) The imaging device according to any one of (1) to (15), wherein the first heat transfer path portion is provided to avoid an area on the substrate where the electronic component is installed. (17) The imaging device according to (16), wherein the substrate has another electronic component provided on the second surface, and the first heat transfer path portion and the second heat transfer path portion are provided so as to avoid installation areas of one or both of the electronic component and the other electronic component on the substrate. (18) The imaging device according to any one of (1) to (17), wherein the electronic component is an imaging element. (19) The imaging device according to (18), further comprising a lens unit provided on the first surface and facing the imaging element. (20) The imaging device according to (19), wherein the lens unit and the first surface form an internal space that accommodates the imaging element, and the first heat transfer path portion is a through hole, a through hole, or a through hole via that leads to the internal space. (21) An electronic device comprising the imaging device according to any one of (1) to (20).

[0120] REFERENCE SIGNS LIST 1 Imaging device 10 Lens unit 10a Groove portion 10A Internal space 11 Lens barrel portion 12 Holder 12a Adhesive portion 20 Front substrate 20A Front surface 20B Rear surface 20a Through hole 20b Through hole 20c Blind via 21 Imaging element 21a Solder ball 22 Connector 23 Filter 24 Chip component 24a Solder ball 25 Heat conduction member 30 Sealing member 40 Substrate spacer 50 Rear substrate 50A Front surface 50B Rear surface 51 Connector 52 Connector 60A Heat dissipation member 60B Heat dissipation member 70 Connector unit 71 Housing 72 Connector portion 80A Joint member 80B Joint member 91 Heat transfer path portion 92a Heat transfer path portion 92b Heat transfer path portion 93a Heat transfer path portion 93b Heat transfer path portion 93c Heat transfer path portion 93d Heat transfer path portion 94a Signal line 94b Signal line 94c Signal line 94d Signal line 94e Signal line 94f Signal line A1 Predetermined region A2 Predetermined region B1 Adhesion region C1 Conductor layer C2 Conductor layer C3 Conductor layer C4 Conductor layer C5 Conductor layer C6 Conductor layer

Claims

1. An imaging device comprising: a substrate including a first surface and a second surface opposite the first surface; and an electronic component provided on the first surface, wherein the substrate has: a first heat transfer path portion intersecting with the first surface; a second heat transfer path portion intersecting with the second surface; and a third heat transfer path portion intersecting with the first heat transfer path portion and the second heat transfer path portion.

2. The imaging device according to claim 1, wherein the third heat transfer path portion extends along the first surface and the second surface.

3. The imaging device according to claim 1, wherein one or both of the first heat transfer path portion and the second heat transfer path portion are through holes, through holes or via holes.

4. The imaging device according to claim 3, wherein one or both of the first heat transfer path section and the second heat transfer path section has a heat conductive member provided inside the through hole, the through hole or the via hole.

5. The imaging device according to claim 1, wherein the first heat transfer path portion is a blind via.

6. The imaging device according to claim 1, wherein the third heat transfer path portion is a metal foil.

7. The imaging device according to claim 1, wherein the first heat transfer path portion is formed around the electronic component on the substrate, and the second heat transfer path portion is formed in the outer peripheral region of the substrate.

8. The imaging device according to claim 7, wherein the number of the first heat transfer path portions is one, the number of the second heat transfer path portions is multiple, and the number of the third heat transfer path portions is multiple.

9. The imaging device according to claim 1, wherein any one or two or all of the first heat transfer path section, the second heat transfer path section and the third heat transfer path section are provided in a ground region of the substrate.

10. The imaging device according to claim 1, wherein the substrate has a built-in signal line, and the first heat transfer path section, the second heat transfer path section, and the third heat transfer path section are arranged so as to avoid the signal line.

11. The imaging device according to claim 10, wherein the substrate has the signal line and the third heat transfer path portion in the same layer.

12. The imaging device according to claim 1, further comprising a heat dissipation member provided on the second surface and in contact with the second heat transfer path portion.

13. The imaging device according to claim 12, further comprising another substrate in contact with the heat dissipation member.

14. The imaging device according to claim 13, wherein the heat dissipation member is a substrate spacer that contacts the substrate and the other substrate and ensures a space between the substrate and the other substrate.

15. The imaging device according to claim 12, further comprising a housing that is in contact with the heat dissipation member and that houses the substrate.

16. The imaging device according to claim 1, wherein the first heat transfer path portion is provided so as to avoid an area on the substrate where the electronic components are installed.

17. The imaging device described in claim 16, wherein the substrate has another electronic component provided on the second surface, and the first heat transfer path portion and the second heat transfer path portion are provided so as to avoid the installation areas of the electronic component and / or the other electronic component on the substrate.

18. The imaging device according to claim 1, wherein the electronic component is an imaging element.

19. The imaging device according to claim 18, further comprising a lens unit provided on the first surface and facing the imaging element.

20. The imaging device according to claim 19, wherein the lens unit and the first surface form an internal space that houses the imaging element, and the first heat transfer path portion is a through hole, a through hole, or a through hole via that connects to the internal space.

Images