Die bonding apparatus

Abstract

The present invention relates to a die bonding apparatus, which may comprise a fume discharge pipe member provided in a manifold block of a bonding tool for die bonding, and provided to suction flux fumes generated when heat is conducted from a heater, that is provided on one surface of the manifold block, up to a die through an attachment, thereby discharging the flux fumes to the outside of the manifold block.

Description

Die bonding device

[0001] The present invention relates to a semiconductor die bonding device, and more particularly, to a semiconductor die bonding device capable of preventing contamination of a bond head module by discharging smoke generated from a bond tool when bonding a die to a substrate.

[0002] Typically, the process of attaching semiconductor chips to a circuit board is performed with great precision, and multiple mounting areas are provided on the board where the semiconductor chips are fixed.

[0003] Meanwhile, the semiconductor chip mounting process, which mounts semiconductor chips in precise locations in the mounting area to reduce defect rates, is very important because precise electrical connections must be made between the semiconductor chip and the circuit board.

[0004] The semiconductor chip mounting process is usually called a bonding process, and depending on the specificity of the process that requires precise work, after the overall location of the circuit board and the location of the semiconductor chip fixing part of the circuit board (mounting area) are inspected, the semiconductor chip is mounted directly on the circuit board.

[0005] A thermocompression bonding device that performs this semiconductor chip mounting process is a device that separates individual semiconductor chips from a wafer, picks them up with a bonding picker so that the bottom surface of the semiconductor chip, i.e. the bottom surface of the semiconductor chip where the bump is formed, faces downwards, and bonds the semiconductor chip to the target substrate.

[0006] Methods for bonding semiconductor chips include a method of applying flux to a bump and attaching the bump to a connection terminal of a substrate, and a method of applying flux to the substrate and attaching the connection terminal to the substrate.

[0007] At this time, the semiconductor chip is attached to the substrate while being compressed in a heated state, and the method of attaching the semiconductor chip to the substrate after heating it in this way is called the thermal compression method.

[0008] FIG. 1 is a drawing showing a die bonding device according to a conventional thermocompression bonding method, specifically, a thermocompression bonding tool.

[0009] Referring to Fig. 1, a thermocompression bonding tool (10) for attaching a conductive connection means of a semiconductor chip to a substrate according to a thermocompression bonding method has a structure in which a manifold block (11) connected to a vacuum supply means and a cooling air supply means, a heater (12), and an attach (15) for adsorbing and fixing a chip are sequentially stacked and assembled from top to bottom.

[0010] At this time, an attachment vacuum hole (16) is formed through the manifold block (11) and heater (12) to hold the attachment (15) in a vacuum, and a chip suction vacuum hole (17) is formed through the attachment (15) to suction the chip in a vacuum.

[0011] Additionally, a cooling air blower hole (18) for cooling down the ceramic heater (14) is formed through the manifold block (11) and heater (12).

[0012] We can examine bonding methods using these thermocompression bonding tools.

[0013] First, the bonding tool (10) is transferred to a semiconductor chip aligned with the chip supply section, and then lowered until the bottom surface of the attach (15) touches the top surface of the semiconductor chip.

[0014] Next, the semiconductor chip is absorbed and fixed to the attach (15) by vacuum supplied from the vacuum supply means to the vacuum hole (17) for chip absorption.

[0015] A bonding tool (10) that has a semiconductor chip fixed by suction is lowered while being transferred to a location where the substrate is aligned, and a non-conductive paste (NCP: Non-Conductive Paste) is applied in advance to the upper surface of the substrate.

[0016] As the bonding tool descends, the non-conductive paste is pressed against the bottom surface of the semiconductor chip, causing the non-conductive paste to spread across the upper surface of the substrate, and at the same time, the solder of the conductive bump penetrates the non-conductive paste and contacts the conductive layer of the substrate.

[0017] At this time, when the semiconductor chip presses the non-conductive paste by the downward pressure of the bonding tool (10), if the heater (12) in the bonding tool (10) is heated up to a temperature (about 300°C) for fusing the conductive bump, the non-conductive paste hardens before it is evenly spread on the upper surface of the substrate. Therefore, the heater (12) must be maintained in a cooled-down state of about 150°C until the bonding tool (10) presses the non-conductive paste and it is evenly spread on the substrate.

[0018] The pressure from the lowering of the bonding tool (10) presses the non-conductive paste on the lower surface of the semiconductor chip so that the non-conductive paste is evenly spread across the upper surface of the substrate, and then the heater (12) in the bonding tool (10) is heated up to a temperature (approximately 300°C) for fusing the conductive bump.

[0019] As the solder of the conductive bump of the semiconductor chip melts, it is fused to the conductive pattern of the substrate and interconnected, and at the same time, the non-conductive paste hardens.

[0020] After completing the above process, the heater (12) is cooled down again to bond the next semiconductor chip to the substrate.

[0021] However, these thermocompression bonding tools inevitably generate fumes when bonding the die to the substrate.

[0022] Smoke generated during bonding may enter the attachment vacuum hole or / and the vacuum hole for chip absorption for absorbing the die or chip. Smoke entering the attachment vacuum hole or the vacuum hole for chip absorption is deposited inside the attachment vacuum hole or / and the vacuum hole for chip absorption, and the deposition of smoke may contaminate or block the internal conduits of the attachment vacuum hole or / and the vacuum hole for chip absorption, which inevitably causes defects during operation.

[0023] In addition, when cleaning contaminants deposited inside the attachment vacuum hole or / and the vacuum hole for chip adsorption, the frequency of damage to the internal conduit of the attachment vacuum hole or / and the vacuum hole for chip adsorption increases.

[0024] Accordingly, there is a need for a die bonding device having a bonding tool that can prevent smoke generated during a thermocompression bonding process, such as bonding a die to a substrate, from flowing into an attachment vacuum hole or / and a chip suction vacuum hole.

[0025] (Prior art literature)

[0026] U.S. Patent No. US 9620476B2 (April 11, 2017)

[0027] The problem to be solved by the present invention is to provide a die bonding device that can prevent smoke generated during a thermocompression bonding operation, such as bonding a die to a substrate, from flowing into an attachment vacuum hole or / and a vacuum hole for chip absorption and being absorbed and solidified by providing a fume exhaust pipe capable of inhaling and discharging smoke in a bonding tool, and can prevent fume from being absorbed into the attachment vacuum hole or / and the vacuum hole for chip absorption and causing the pipe to be clogged or the pipe to be damaged during cleaning of the absorbed fume.

[0028] The tasks of the present invention are not limited to the tasks mentioned above, and other tasks not mentioned will be clearly understood by those skilled in the art from the description below.

[0029] A die bonding device according to an embodiment of the present invention for solving a problem,

[0030] A fume exhaust conduit member may be provided in a manifold block of a bonding tool for die bonding, and is provided so that heat is conducted to the die through an attach from a heater provided on one surface of the manifold block, and flux fume generated is sucked in and discharged to the outside of the manifold block.

[0031] The above fume exhaust pipe member,

[0032] A suction module formed along the periphery of the heater between the above attachment and one side of the manifold block, and sucking the flux fume from the periphery of the front surface of the die; and

[0033] It may include an exhaust pipe provided inside the manifold block and connected to the suction module so that the flux fume introduced through the suction module is discharged to the outside of the manifold block.

[0034] The above suction module,

[0035] A suction coupling member provided at least one at the periphery of the heater, forming a hollow space for sucking the flux fume, and connecting the suction module so as to be interlocked with the exhaust pipe;

[0036] A cover member attached to one side of the manifold block through the suction coupling member and forming a common fume flow path to one side of the manifold block by combining with the exhaust pipe; and

[0037] The heater may include a support member that is provided around one end of the heater, fixes and supports the suction coupling member and the cover member to one side of the manifold block by combining the suction coupling member, and is provided so that an end of the suction coupling member is connected to the exhaust pipe.

[0038] The above support member is,

[0039] A coupling guide provided along the periphery of one side of the heater and penetrating and coupling the suction coupling member; and

[0040] A spacer may be included to support between the above-mentioned coupling guide and the cover member and to allow the suction coupling member to penetrate the inside thereof.

[0041] A linkage hole is formed on one side of the cover member to link with the hollow portion of the suction coupling member, and the suction coupling member can be linked with the exhaust pipe through the linkage hole.

[0042] The above exhaust pipe is,

[0043] An inlet passage provided on one side of the manifold block and interlocked with the cover member to form a flow path for the flux fume;

[0044] An exhaust path formed to penetrate the outer surface of the manifold block at a predetermined position inside the manifold block and provided to discharge the flux fume to the outside of the manifold; and

[0045] The inlet path and the outlet path may include at least one connecting path connecting the inlet path and the outlet path.

[0046] Other specific details of the present invention are included in the detailed description and drawings.

[0047] According to embodiments of the present invention, at least the following effects are achieved.

[0048] There is an advantage in that the bonding tool is provided with a fume exhaust duct member that can suck in the smoke generated during die bonding and exhaust it to the outside, thereby preventing the smoke generated during bonding from entering the attachment vacuum hole or / and the vacuum hole for chip absorption.

[0049] In addition, it is possible to prevent smoke generated during the thermocompression bonding process from being absorbed and solidified inside the attachment vacuum hole or / and the chip absorption vacuum hole, and it is also possible to prevent blockage of the internal duct of the attachment vacuum hole or / and the chip absorption vacuum hole.

[0050] In addition, since the smoke generated during the thermocompression bonding process does not flow into the interior of the attachment vacuum hole or / and the vacuum hole for chip absorption, it does not solidify by being absorbed into the internal conduit of the attachment vacuum hole or / and the vacuum hole for chip absorption, and thus there is an advantage in that there is no need to perform additional work to clean the interior of the attachment vacuum hole or / and the vacuum hole for chip absorption.

[0051] The effects according to the present invention are not limited to those exemplified above, and more diverse effects are included in this specification.

[0052] FIG. 1 is a drawing showing a die bonding device according to a conventional thermocompression bonding method, specifically, a thermocompression bonding tool.

[0053] FIG. 2 is an internal configuration diagram schematically illustrating the internal structure of a die bonding device according to one embodiment of the present invention.

[0054] FIG. 3 is a schematic exploded perspective view of a die bonding device according to one embodiment of the present invention.

[0055] FIG. 4 is a perspective view schematically showing the internal mounting structure of a manifold block of a die bonding device according to one embodiment of the present invention.

[0056] FIG. 5 is a schematic drawing comparing flux fume according to the presence or absence of a fume exhaust conduit member when a bonding tool picks up a die, applies heat, and generates flux fume in a die bonding device according to one embodiment of the present invention.

[0057] The advantages and features of the present invention, and the methods for achieving them, will become clearer with reference to the embodiments described in detail below together with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below and may be implemented in various different forms. These embodiments are provided only to ensure that the disclosure of the present invention is complete and to fully inform those skilled in the art of the scope of the invention, and the present invention is defined only by the scope of the claims. Like reference numerals designate like elements throughout the specification.

[0058] Accordingly, in some embodiments, well-known process steps, well-known structures, and well-known techniques are not specifically described to avoid obscuring the present invention.

[0059] The terminology used herein is for the purpose of describing embodiments only and is not intended to be limiting of the present invention. In this specification, the singular also includes the plural unless specifically stated otherwise. As used herein, the terms "comprises" and / or "comprising" are used to mean that they do not exclude the presence or addition of one or more other components, steps, operations, and / or elements other than the mentioned components, steps, operations, and / or elements. In addition, "and / or" includes each and every combination of one or more of the mentioned items.

[0060] In addition, the embodiments described in this specification will be described with reference to cross-sectional drawings and / or schematic drawings, which are ideal examples of the present invention. Accordingly, the form of the examples may be modified due to manufacturing technology and / or tolerances, etc. Accordingly, the embodiments of the present invention are not limited to the specific forms illustrated, but also include changes in form resulting from the manufacturing process. In addition, each component in each drawing illustrated in the present invention may be illustrated to some extent enlarged or reduced for convenience of explanation. Like reference numerals refer to like components throughout the specification.

[0061] Hereinafter, the present invention will be described with reference to drawings for explaining a die bonding device (100) according to embodiments of the present invention.

[0062] FIG. 2 is an internal configuration diagram schematically illustrating the internal structure of a die bonding device (100) according to one embodiment of the present invention.

[0063] FIG. 3 is a schematic exploded perspective view of a die bonding device (100) according to one embodiment of the present invention.

[0064] FIG. 4 is a perspective view schematically showing the internal mounting structure of a manifold block (11) of a die bonding device (100) according to one embodiment of the present invention.

[0065] Referring to FIGS. 2 to 4, a die bonding device (100) according to one embodiment of the present invention includes a bonding tool (10), and the bonding tool (10) may include a manifold block (11), a heater (12), an attach (13), a die (14), and a fume exhaust pipe member (110, 120).

[0066] First, as described above, the manifold block (11), heater (12), attach (13) and die (14) have a structure in which they are sequentially assembled in layers from top to bottom.

[0067] The manifold block (11) and the heater (12) may be formed with attachment vacuum holes (16) extending in both vertical and vertical directions in a connected manner to vacuum grip an attachment (13) attached to one side of the heater (12).

[0068] In addition, a vacuum hole (17) for chip suction can be formed through the manifold block (11) and the heater (12) to suction the chip by vacuum by forming an attachment (13) attached to one side of the heater (12).

[0069] Additionally, a cooling air blower hole (18) for cooling down the heater (12) can be formed through the manifold block (11) and the heater (12).

[0070] In addition, the bonding tool (10), specifically the manifold block (11) and the heater (12), can be described as being provided in a roughly hexahedral shape, for example. However, the shape of the bonding tool (10) is not limited thereto, and its shape can be changed or modified in any way.

[0071] According to one embodiment of the present invention, a bonding tool (10) having the above-described configuration and laminated structure may be provided with a fume exhaust conduit member (110, 120) so that smoke, specifically flux fume, which may be generated by applying heat during die bonding can be exhausted to the outside of the bonding tool (10), specifically to the outside of the die bonding device (100).

[0072] As described above, the fume exhaust conduit member (110, 120) may be provided in the manifold block (11) of the bonding tool (10) for die bonding. In addition, the fume exhaust conduit member (110, 120) may be provided so that heat is conducted from a heater (12) provided on one surface of the manifold block (11) to a die (14) through an attach (13), and flux fume generated is sucked in and discharged to the outside of the manifold block (11).

[0073] The fume exhaust pipe member (110, 120) may include an intake module (110) and an exhaust pipe (120).

[0074] The suction module (110) may be provided to be exposed on one surface of the manifold block (11) so as to suck in and flow flux fume. The exhaust pipe (120) may be provided inside the manifold block (11) and may be connected to the suction module (110) so as to discharge the flux fume sucked in the suction module (110) to the outside of the manifold block (11), specifically, to the outside of the bonding tool (10).

[0075] The suction module (110) is configured to be exposed on one side of the manifold block (11) as described above, and may be provided along the periphery of the heater (12) between the attach (13) and one side of the manifold block (11), and may be provided to suck flux fume from the periphery of the front surface of the die (14).

[0076] The exhaust pipe (120) is a flow path for receiving flux fume sucked in from the suction module (110) and discharging it to the outside of the manifold block (11). That is, the exhaust pipe (120) is a fume flow path provided inside the manifold block (11), and may be provided in conjunction with the suction module (110) exposed on one surface of the manifold block (11) so that flux fume introduced through the suction module (110) is discharged to the outside of the manifold block (11).

[0077] Specifically, the suction module (110) may include a suction coupling member (111), a cover member (112), and a support member (113).

[0078] At least one suction coupling member (111) is provided at the periphery of the heater (12), and can form a hollow (111a) for sucking flux fume in the axial direction of the center thereof. In addition, at least one suction coupling member (111) can be provided in the direction (vertical direction) of the manifold block (11) from the attachment. Since four suction coupling members (111) are individually provided on the front of the manifold block (11), a cover member (112) and a support member (113) can be provided to support and fix the suction coupling members (111). Accordingly, the suction coupling members (111) can be provided so as to be connected to the exhaust pipe (120) by being coupled to the suction module (110), specifically, the cover member (112) and the support member (113) described below.

[0079] According to one embodiment of the present invention, the suction coupling member (111) may be described as a bolt (hereinafter referred to as a “hollow bolt”) having a hollow space (111a) formed in the center. As described above, the suction coupling member (111), specifically the hollow bolt, may be individually provided at four portions corresponding to the corners of the heater (12). The hollow bolt can suck in flux fume generated from the periphery of the die (14), and, while the cover member (112) and the support member (113) described below are coupled to the manifold block (11) at the periphery of the heater (12) through the hollow bolt, each individually provided hollow bolt may have a structure in which the cover member (112) and the support member (113) are coupled to the manifold block (11) through the hollow bolt while being fixedly supported by the cover member (112) and the support member (113).

[0080] The cover member (112) is attached in close contact with one surface of the manifold block (11), and may be attached to one surface of the manifold block (11) through the suction coupling member (111). When the cover member (112) is attached to one surface of the manifold block (11), the cover member (112) may be formed in a 'ㅁ' shape so as to be positioned at the center of the heater (12), specifically, at the outer periphery of the other end of the heater (12), and to be engaged with the periphery of the heater (12). In addition, a first flow groove (1211) that is recessed inward may be formed on one surface of the cover member (112) that is engaged with one surface of the manifold block (11) so as to form a common fume flow path (corresponding to the 'inlet path (121)' described later). The cover member (112) may be provided to be engaged with an exhaust pipe (120) that is formed to be open on one surface of the manifold block (11). In addition, the first flow groove (1211) is opened toward the cover member (112) in the exhaust pipe (120) and can be interlocked with a groove formed inside thereof ('second flow groove' described later) to form a common fume flow path (corresponding to the 'inlet path (121)' described later).

[0081] A linkage hole (112a) penetrating the front and rear surfaces of the cover member (112) may be formed in the cover member (112) so as to be connected to the first flow groove (1211) by linking with the hollow portion of the suction coupling member (111). A portion surrounding the linkage hole (112a) may be provided with a portion (hereinafter referred to as a “contact surface”) where the tile end of the suction coupling member (111) is in contact.

[0082] The support member (113) is provided to face the cover member (112) and may be provided around one end of the heater (12). The support member (113) may be provided to fix and support the suction coupling member (111) and the cover member (112) to one side of the manifold block (11) by coupling the suction coupling member (111). In addition, the support member (113) may be provided so that when the suction coupling member (111) is coupled, its end is connected to the exhaust pipe (120).

[0083] A support member (113) according to one embodiment of the present invention may include a coupling guide (1131) and a spacer (1132).

[0084] The coupling guide (1131) is provided along the periphery of one side of the heater (12) at a predetermined distance from the cover member (112), and may be provided to penetrate and couple the suction coupling member (111). As the suction coupling member (111) is coupled to the coupling guide (1131), the position of the individually provided suction coupling member (111) can be fixedly supported. The coupling guide (1131) may be positioned at the center of the outer periphery of one end of the heater (12), and may be formed in a ‘ㅁ’ shape to engage with the periphery of the heater (12). Accordingly, the coupling guide (1131) may be positioned at one end of the heater (12), and the cover member (112) described above may be positioned at the other end of the heater (12) to face each other. A coupling hole (1131a) may be formed in the coupling guide (1131) to penetrate and couple the above-described suction coupling member (111). According to one embodiment of the present invention, the coupling hole (1131a) may be formed at each of the four corners of the coupling guide (1131). In addition, as described above, the coupling guide (1131) may be positioned around the periphery of one side of the heater (12), and the other side of the coupling guide (1131) may be positioned to face the support member (113) described later at a predetermined distance therefrom. As described below, a spacer (1132) may be positioned between the coupling guide (1131) and the cover member (112) so that the coupling guide (1131) is positioned around the periphery of one side of the heater (12) at a predetermined distance from the cover member (112). The suction coupling member (111) described above may have a structure in which it is coupled to the cover member (112) through the coupling hole (1131a), and is coupled to the support member (113) by penetrating through the spacer (1132).

[0085] A spacer (1132) may be provided between the coupling guide (1131) and the cover member (112) to support the coupling guide (1121) at a predetermined distance from the cover member (112). The spacer (1132) may be provided to be mounted at each of four corners of the heater (12). A through hole (1132a) penetrating the inner center of the spacer (1132) may be formed. A suction coupling member (111) may be inserted and coupled into the through hole (1132a) of the spacer (1132). One end of the spacer (1132) may be in close contact with the coupling guide (1131), and the tile end of the spacer (1132) may be in close contact with the cover member (112), specifically, with the contact surface.

[0086] When the tile end of the spacer (1132) is in close contact with the contact surface, the through hole (1132a) of the spacer (1132) can be linked with the linkage hole (112a). Accordingly, when the suction coupling member (111), i.e., the hollow bolt, is inserted and connected to the spacer (1132), the suction coupling member (111) covers the periphery of the linkage hole (112a), and the hollow part (111a) is linked with the linkage hole (112a) so that it can be linked to the first flow groove (1211) of the exhaust pipe (120) through the linkage hole (112a).

[0087] As described above, the exhaust pipe (120) is configured for the flow and discharge of flux fume formed on the inside of the manifold block (11).

[0088] An exhaust pipe (120) according to one embodiment of the present invention may include an inlet passage (121), an exhaust passage (122), and a connection passage (123).

[0089] The inlet flow path (121) may be provided on one surface of the manifold block (11) and may be interlocked with the cover member (112) to form a common flow path for flux fume. That is, the inlet flow path (121) is a common flow path for flux fume formed by combining the cover member (112) with the manifold block (11). The inlet flow path (121) may include the first flow groove (1211) and the second flow groove (1212) described above. Specifically, the first flow groove (1211) may be provided on one surface of the cover member (112). The second flow groove (1212) may be provided on one surface of the manifold block (11) so as to be symmetrical to the first flow groove (1211) of the cover member (112) and to be interlocked with the first flow groove (1211) and introduced into the inside of the manifold block (11). When the cover member (112) covers one surface of the manifold block (11) and is coupled, the cover member (112) closely covers one surface of the manifold block (11), and the first flow groove (1211) of the cover member (112) and the second flow groove (1212) of the manifold block (11) are interlocked with each other to form one inlet passage (121). In an embodiment of the present invention, the inlet passage (121) may be provided so as to have a 'ㅁ' shape while being horizontal to one surface of the manifold block (11). Additionally, as hollow bolts are formed in four places around the heater (12), flux fume can be introduced through each corner of the inlet path (121).

[0090] At least one transfer hole (1212a) can be formed at a predetermined position in the second flow groove (1212) to transfer the flux fume introduced into the inlet path (121) to the connection path (123) described later. In one embodiment of the present invention, the flux fume sucked through the hollow portions of the four suction coupling members (111) can be introduced into the inlet path (121) through four interconnecting holes (112a). In one embodiment of the present invention, it can be explained by way of example that two transfer holes (1212a) are formed in the second flow groove (1212) so as to be connected to two connection paths described later.

[0091] The discharge path (122) may be formed to penetrate the outer surface of the manifold block (11) at a predetermined position inside the manifold block (11) so as to discharge flux fume to the outside of the manifold block (11).

[0092] According to one embodiment of the present invention, the exhaust passage (122) may have a structure that is adjacent to one of the outer surfaces of the manifold block (11) and extends horizontally to the exhaust port (122a) on the adjacent outer surface. That is, the exhaust passage (122) may be formed on the inside of the manifold block (11) in the shape of a '-', and one end thereof is provided to communicate with the outside through one side of the manifold block (11). In one embodiment of the present invention, it may be described by way of example that one exhaust port (122a) is provided. That is, in one embodiment of the present invention, flux fumes introduced through four suction coupling members (111) may have a structure in which they are exhausted to one exhaust port (122a) through two transfer holes (1212a). A connection fitting module (130) may be further provided at the end of the discharge path (122), i.e., the discharge port (122a) formed on one side of the manifold block (11), so as to be connected to a hose connected to discharge flux fumes to the outside.

[0093] At least one connecting passage (123) may be provided between the inlet passage (121) and the discharge passage (122) to connect the inlet passage (121) and the discharge passage (122). According to one embodiment of the present invention, the connecting passage may be formed in a position close to two adjacent corners or two corners among the four corners of the discharge passage (122) in the shape of the letter 'ㅣ'.

[0094] FIG. 5 is a schematic drawing comparing flux fume according to the presence or absence of a fume discharge conduit member (110, 120) when a bonding tool (10) picks up a die (14), applies heat, and flux fume is generated in a die bonding device (100) according to one embodiment of the present invention.

[0095] Figure 5 (a) shows a case where a fume discharge conduit member (110, 120) is present in the bonding tool (10), and Figure 5 (b) shows a case where a fume discharge conduit member is not present in the bonding tool (10), and the inhalation of flux fume can be confirmed.

[0096] Referring to Fig. 5, the bonding tool (10) can implement heating of the heater (12) after picking up the die (14), dipping the flux therein, and then heating the heater (12). At this time, if heating is implemented with the heater (12), the attach (13), and the die (14), flux fume is inevitably generated.

[0097] If the fume exhaust pipe member (110, 120) is not provided, the generated flux fume will inevitably be convected from the lower part of the bonding tool (10) and will inevitably flow into the attachment (13) vacuum hole or / and the chip suction vacuum hole.

[0098] However, if a fume exhaust conduit member (110, 120) is provided, the generated flux fume is introduced through the hollow of the suction coupling member (111) provided around the heater (12) at the bottom of the bonding tool (10), moves to the inlet passage (121), the connection passage (123), and the discharge passage (122), and is discharged through the discharge port to the connected hose, and is discharged to the outside of the bonding tool (10) through the hose, thereby preventing the flux fume from remaining in the bonding tool (10).

[0099] Those skilled in the art will appreciate that the present invention can be implemented in other specific forms without altering its technical spirit or essential characteristics. Therefore, the embodiments described above should be understood as illustrative in all respects and not restrictive. The scope of the present invention is defined by the claims below rather than the detailed description, and all changes or modifications derived from the meaning and scope of the claims and their equivalents should be construed as being included within the scope of the present invention.

[0100]

[0101] (Explanation of symbols)

[0102] 10: Bonding tool

[0103] 11: Manifold block

[0104] 12: Heater

[0105] 13: Attach

[0106] 14: Die

[0107] 100: Die bonding device

[0108] 110, 120: No fume exhaust pipe

[0109] 110: Suction module

[0110] 111: Suction coupling member

[0111] 111a: Hollow

[0112] 112: Cover absence

[0113] 112a: Linkage Hall

[0114] 113: Absence of support

[0115] 1131: Combination Guide

[0116] 1131a: Combination hole

[0117] 1132: Spacer

[0118] 1132a: Through hole

[0119] 120: Exhaust pipe

[0120] 121: Incoming Euro

[0121] 1211: 1st mobile home

[0122] 1212: 2nd floating home

[0123] 122: Emission Euro

[0124] 122a: exhaust port

[0125] 123: Connecting Euro

[0126] 130: Connection fitting module

Claims

1. A bonding tool for die bonding is provided with a manifold block, and a fume exhaust conduit member is provided to suck up flux fume generated by heat being conducted to the die through an attach from a heater provided on one side of the manifold block and discharge it to the outside of the manifold block. Die bonding device.

2. In the first paragraph, the fume exhaust pipe member, A suction module provided between the above attachment and the manifold block, which sucks the flux fume from the periphery of the front surface of the die; and An exhaust pipe is provided inside the manifold block and is connected to the suction module to discharge the flux fume introduced through the suction module to the outside of the manifold block. Die bonding device.

3. In the first paragraph, the suction module, A suction coupling member provided in the direction of the manifold block in the above attachment, at least one of which is provided on the periphery of the heater, and which forms a hollow space inside the member for sucking the flux fume and is connected to the exhaust pipe so as to be interlocked; and A support member is provided around one end of the heater and fixes and supports the suction coupling member to one side of the manifold block, and is provided so that the end of the suction coupling member is connected to the exhaust pipe. Die bonding device.

4. In paragraph 3, Further comprising a cover member that is coupled to one side of the manifold block to cover the manifold block and forms a common fume flow path that introduces the flux fume into one side of the manifold block by coupling an end of the suction coupling member. Die bonding device.

5. In paragraph 4, A first flow groove is formed on one side of the cover member, which faces one side of the manifold block and forms the common fume flow path. Die bonding device.

6. In paragraph 5, The cover member is closely coupled to the tile end of the suction coupling member, and a linkage hole is formed through the front and rear of the cover member to link the hollow portion of the suction coupling member and the first flow groove to implement the flow of the flux fume. Die bonding device.

7. In the fifth paragraph, the support member, A coupling guide provided along the periphery of one side of the heater at a predetermined distance from the cover member, and through which the suction coupling member is penetrated to fix the position of the suction coupling member; and A spacer positioned between the above-mentioned coupling guide and the cover member, fixing and supporting the coupling guide so that the coupling guide and the cover member are spaced apart by a predetermined distance, and provided so that the suction coupling member penetrates the inside thereof. Die bonding device.

8. In paragraph 7, The above-mentioned joining guide is formed in a ‘ㅁ’ shape, The above coupling guide has a coupling hole formed through which the suction coupling member is penetrated and coupled. Die bonding device.

9. In paragraph 8, One end of the spacer is in close contact with the coupling guide, and the tile end of the spacer is in close contact with the cover member. The above spacer has a through hole formed therein to penetrate and connect the suction coupling member that has penetrated the above coupling hole. Die bonding device.

10. In the 7th paragraph, the exhaust pipe, An inlet path provided on one side of the manifold block and interlocked with the cover member to implement the common fume flow path of the flux fume; An exhaust path formed to penetrate the outer surface of the manifold block at a predetermined position inside the manifold block and provided to discharge the flux fume to the outside of the manifold; and At least one connecting passage connecting the inlet passage and the outlet passage between the inlet passage and the outlet passage, Die bonding device.

11. In the 10th paragraph, the inlet flow path is The above inlet flow path is provided with the first flow groove on one side of the cover member, A second flow groove is provided on one side of the manifold block and is interlocked with the first flow groove to form the common fume flow path as the inlet flow path. Die bonding device.

12. In paragraph 11, At least one transfer hole is formed at a predetermined position of the second flow groove to transfer the flux fume introduced into the inlet path to the connecting path. Die bonding device.

13. In paragraph 11, The above connecting euro is provided in a vertical direction from one side of the manifold block to a predetermined position of the manifold block, The above exhaust path is provided so as to be connected to the outside through one side of the manifold block in a horizontal direction at a predetermined position of the manifold block. Die bonding device.

14. In paragraph 13, An exhaust port is formed on one side of the above manifold block, The above discharge port is provided with a connecting fitting module for discharging the flux fume, and the end of the discharge path is connected to the connecting fitting module. Die bonding device.

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