Atomization device

Abstract

An atomization device (1). The atomization device (1) comprises a housing (10), a cooling member (20), a heat conduction member (30), a heat storage member (50) and a heating device (40). The housing (1) is internally provided with a mounting space (120). The cooling member (20) is arranged in the mounting space (120) and divides the mounting space (120) into an atomization space (121) and a heat dissipation space (122). The heat conduction member (30) is provided in the atomization space (121) and abuts against the cooling member (20), and the heat conduction member (30) is further provided with an accommodation space (32) used for accommodating at least part of a cartridge (80). The heat storage member (50) is provided in the heat dissipation space (122) and abuts against the cooling member (20). The heating device (40) is arranged in the mounting space (120) and is used for heating the cartridge (80) in the accommodation space (32).

Description

Atomization device

[0001] This application claims priority to Chinese patent application No. 2024103935796, filed on April 1, 2024, with the invention name “Atomization Device”, and incorporates it into this application by reference.

Technical field

[0002] The present application relates to the field of atomization technology, and in particular to an atomization device. [Background Technology]

[0003] Atomizers typically use heating to convert the atomized substrate into an aerosol. During the heating and atomization process, heat accumulates within the device. For example, when using a heat-not-burn atomizer to heat an aerosol substrate such as tobacco, heat accumulation within the device can lead to inaccurate control of the aerosol substrate's heating temperature. Excessive temperatures can also cause the aerosol substrate to overheat and produce harmful substances.

[0004] [Summary of the invention]

[0005] The embodiments of the present application provide an atomizing device that can effectively control the temperature inside the atomizing device.

[0006] An embodiment of the present application provides an atomization device. The atomization device includes a housing, a refrigeration element, a heat conduction element, a heat storage element, and a heating device. The housing has an installation space. The refrigeration element is disposed in the installation space and divides the installation space into an atomization space and a heat dissipation space. The heat conduction element is disposed in the atomization space and abuts the refrigeration element. The heat conduction element also forms a storage space for accommodating at least part of a cigarette cartridge. The heat storage element is disposed in the heat dissipation space and abuts the refrigeration element. The heating device is disposed in the installation space and is used to heat the cigarette cartridge in the storage space.

[0007] In one embodiment, the refrigeration component includes a cold end substrate and a hot end substrate arranged at intervals, the cold end substrate abuts the heat conductive component, and the hot end substrate abuts the heat storage component; the cold end substrate and the hot end substrate are further provided with multiple cold end electrode layers and multiple hot end electrode layers on the side facing each other, and a semiconductor array is further provided between the cold end substrate and the hot end substrate, and the semiconductor array is connected to the electrode layer to form semiconductor refrigeration.

[0008] In one embodiment, the heating device is inserted into the heat conducting member and at least partially abuts against the heat conducting member.

[0009] In one embodiment, the shell includes a first section and a second section, the first section is provided with an air outlet channel, the second section is provided with an installation space, the inner diameter of the second section is larger than the inner diameter of the first section; the wall thickness of the first section is larger than the wall thickness of the second section.

[0010] In one embodiment, the heat conducting member has a first end away from the refrigeration member and a second end close to the refrigeration member, both the first end and the second end are provided with flanges, and a heat insulation groove is formed between the two flanges; the first end is also provided with an air outlet connected to the accommodating space, and the second end is provided with an air inlet connected to the accommodating space.

[0011] In one embodiment, the heating device is a resistance heating device, an electromagnetic heating device, an infrared heating device, an air flow heating device or a microwave heating device.

[0012] In one embodiment, the heat conducting element has an air inlet and an air outlet connected to the accommodating space; the refrigeration element is arranged in a ring shape, and is surrounded by a connecting port connecting the atomization space and the heat dissipation space, and the connecting port is connected to the air inlet.

[0013] In one embodiment, the heat storage element is provided with a mounting groove, the opening of the mounting groove is facing away from the refrigeration element, and an air inlet is further provided at one end of the heat storage element close to the refrigeration element, and the air inlet is connected to the mounting groove.

[0014] In one embodiment, the heating device includes a connecting seat and a heating part. A accommodating groove is recessed at one end of the heat conductive member close to the refrigeration member. An air inlet is provided at the bottom of the accommodating groove. At least a portion of the connecting seat is accommodated in the accommodating groove. At least a portion of the connecting seat is accommodated in the connecting port. The heating part passes through the bottom of the accommodating groove and extends into the accommodating space.

[0015] In one embodiment, the connecting seat includes two mounting parts arranged symmetrically with respect to the center, the two mounting parts are provided with air passages, and an air gap is formed between the two mounting parts in the circumferential direction; at least two air inlets are provided at the bottom of the accommodating groove, some of the air inlets are connected to the air passages, and some of the air inlets are arranged corresponding to the air gaps.

[0016] The beneficial effects of this application are as follows: the heating device heats the cigarette cartridge to form an aerosol, while the heat conductor transfers the heat generated by the heating device to the cooling element. The cooling end of the cooling element faces the heat conductor, effectively controlling its temperature. The hot end of the cooling element faces the heat storage element, which stores the transferred heat and gradually releases it. This approach effectively controls the temperature within the atomizer.

Brief Description of the Drawings

[0017] FIG1 is a schematic structural diagram of an embodiment of an atomizing device of the present application;

[0018] FIG2 shows a schematic diagram of the explosion structure of an atomizing device according to an embodiment of the present application;

[0019] FIG3 is a schematic structural diagram of a heating device according to an embodiment of the present application from another perspective;

[0020] FIG4 is a schematic structural diagram of a heat conducting member according to an embodiment of the present application from another perspective;

[0021] FIG5 is a schematic cross-sectional view of an atomizing device according to an embodiment of the present application;

[0022] FIG6 is a schematic structural diagram of a refrigeration component in an atomizing device according to an embodiment of the present application;

[0023] FIG7 is a schematic structural diagram of one side of a cold end substrate of a refrigeration unit according to an embodiment of the present application;

[0024] FIG8 is a schematic structural diagram of one side of a hot end substrate of a refrigeration unit according to an embodiment of the present application;

[0025] FIG9 is a schematic structural diagram of the other side of the hot end substrate according to an embodiment of the present application. [Specific implementation method]

[0026] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0027] In conjunction with Figures 1 to 3 , an embodiment of the present application provides an atomizing device 1 . The atomizing device 1 includes a housing 10 , a cooling element 20 , a heat conducting element 30 , a heat storage element 50 , and a heating device 40 . The housing 10 defines an installation space 120 for mounting the cooling element 20 , the heat conducting element 30 , the heat storage element 50 , and the heating device 40 .

[0028] In some embodiments, referring to FIG3 , the housing 10 includes a first section 11 and a second section 12 . The first section 11 is provided with an air outlet channel 111 , and the second section 12 is provided with the aforementioned installation space 120 . The inner diameter of the second section 12 is greater than the inner diameter of the first section 11 . The wall thickness of the first section 11 is greater than the wall thickness of the second section 12 .

[0029] In some embodiments, the atomizer device 1 is a heat-not-burn atomizer device, and the cigarette cartridge 80 can be inserted into the installation space 120 through the air outlet passage 111 of the first section 11, with a portion of the cigarette cartridge 80 located within the installation space 120 and a portion located within the air outlet passage 111. When the atomizer device 1 is a heat-not-burn atomizer device, the cigarette cartridge 80 is a heat-not-burn cigarette. After the cigarette is inserted into the installation space 120, the filter tip is located outside the atomizer device 1. Alternatively, the cigarette cartridge 80 is a smoking segment without a filter tip, and the smoking segment can be a solid or gel-like aerosol-forming matrix, such as one or more of tobacco or non-tobacco plant products, or an aerosolized liquid.

[0030] It is understood that in other embodiments, the atomizing device 1 may also be an electronic atomizing device for atomizing liquid atomizing liquid, and the cartridge 80 may contain the atomizing liquid. Alternatively, the cartridge 80 may also contain both a smoking section and the atomizing liquid.

[0031] In some embodiments, the aerosolized substrate is heated and atomized into an aerosol within the installation space 120, which is then discharged through the air outlet channel 111 for inhalation by the user. The second section 12 with a larger inner diameter forms the aforementioned installation space 120, while the first section 11 with a smaller inner diameter can control the aerosol output efficiency and also secure and limit the cigarette cartridge 80.

[0032] Furthermore, since most of the heat of the atomizer 1 is generated within the installation space 120, by setting the wall thickness of the first section 11 to be greater than the wall thickness of the second section 12, a heat insulation effect can be achieved, thereby preventing burns to the user caused by the heat within the installation space 120. Optionally, the material of the housing 10 can be made of a heat-insulating material, such as alumina, zirconia, boron nitride ceramics, PP, PE, silicone rubber, etc.

[0033] In some embodiments, the atomizing device 1 further comprises a base 60, which is disposed at an end of the second section 12 away from the first section 11. The base 60 may be provided with an air inlet channel 61, so that when the atomizing device 1 is in operation, air can enter the atomizing device 1 through the air inlet channel 61.

[0034] The refrigeration element 20 is disposed within the installation space 120, dividing the installation space 120 into an atomization space 121 and a heat dissipation space 122. It will be appreciated that the refrigeration element 20 provides cooling through heat exchange, and therefore has a cooling side and a heat-generating side. The cooling side faces the atomization space 121, while the heat-generating side faces the heat dissipation space 122. The operating states of the refrigeration element 20 and the heating device 40 can be controlled in a variety of ways. For example, the atomization device 1 may also include an airflow sensing device (not shown) that can detect a user's puff. Upon detecting a puff, the heating device 40 initiates heating and atomization, while the refrigeration element 20 simultaneously activates cooling. The atomization device 1 may also include a switch on the housing 10, which the user can manually turn on and off to control whether the heating device 40 activates heating and simultaneously controls whether the refrigeration element 20 activates cooling. It will be appreciated that in other embodiments, the operating states of the refrigeration element 20 and the heating device 40 may be controlled asynchronously, but independently.

[0035] The heat conductor 30 is arranged in the atomization space 121 and abuts against the refrigeration element 20. The heat conductor 30 also forms a receiving space 32 for receiving at least part of the cigarette cartridge 80. The heating device 40 is arranged in the installation space 120 and is used to heat the cigarette cartridge 80 in the receiving space 32. The heating device 40 can heat the cigarette cartridge 80 to generate an aerosol. The excess heat generated by the heating device 40 can be conducted to the refrigeration element 20 through the heat conductor 30, and then the refrigeration element 20 performs heat exchange and conducts the heat to the heat dissipation space 122. The heat conductor 30 is made of a material with high thermal conductivity, such as copper, aluminum or thermally conductive rubber.

[0036] In some embodiments, the heating device 40 is inserted into the heat conductive member 30 and at least partially abuts the heat conductive member 30. In this way, the heat generated by the heating device 40 can be transferred to the heat conductive member 30 through the aerosol or air in the accommodating space 32, or can be transferred to the heat conductive member through direct contact.

[0037] In some embodiments, the heat conducting member 30 has a first end 301 distal from the refrigeration member 20 and a second end 302 proximate to the refrigeration member 20. Both the first end 301 and the second end 302 are provided with a flange 30A, with a heat insulating groove 31 formed between the two flanges 30A. The heat insulating groove 31 can separate the heat conducting member 30 from the housing 10, thereby preventing excess heat generated by the heating device 40 from being transferred to the housing 10 and causing the housing 10 to overheat. The first end 301 is also provided with an air outlet 35 communicating with the accommodating space 32. The air outlet 35 is connected to the air outlet channel 111. The second end 302 is provided with an air inlet 34 communicating with the accommodating space 32. The air inlet 34 is connected to the air inlet channel 61. Air can enter the accommodating space 32 through the air inlet 34, mix with the generated aerosol, and then be discharged through the air outlet 35. In this embodiment, the air inlet 34 is connected to the air inlet channel 61 through the heat dissipation space 122. In other embodiments, the air inlet channel 61 can also be set in the second section 12, and the air inlet channel 61, the atomization space 121, and the air inlet 34 are connected in sequence.

[0038] In some embodiments, the heating device 40 is any one of a resistance heating device, an electromagnetic heating device, an infrared heating device, an airflow heating device or a microwave heating device. For example, the heating device 40 can be a resistive heating device, which extends into the accommodating space 32 and can be inserted into the cigarette cartridge 80 or wrapped around the cigarette cartridge 80 to heat the cigarette cartridge 80. The heating device 40 can also be an electromagnetic heating device, which can include a heating element and an electromagnetic system. The heating element can be arranged in the accommodating space 32 for being inserted into the cigarette cartridge 80 or wrapped around the cigarette cartridge 80. The electromagnetic system can be arranged on the periphery of the accommodating space 32 to heat the heating element by eddy current heating. The heating device 40 can also be an airflow heating device, which includes a hot airflow generating device and an airflow path. The airflow path can guide the heated airflow into the accommodating space 32, thereby heating the cigarette cartridge 80.

[0039] In some embodiments, the heating device 40 may be composed of a cross-arranged pair of heating plates, with the heating plates tapered at one end near the air outlet channel 111. In other words, the cross-sectional area of ​​the heating plates gradually decreases toward the air outlet channel 111. This makes it easier to insert the heating device 40 into the cigarette cartridge 80.

[0040] The heat storage element 50 is disposed in the heat dissipation space 122 and abuts the refrigeration element 20. The heat-generating end of the refrigeration element 20 abuts the heat storage element 50, which stores heat and then gradually releases it. The heat storage element 50 can be made of materials with excellent heat storage properties, such as graphene foam and phase-change silicone. Made of a high-phase-change material, the heat storage element 50 heats up slowly after absorbing heat, preventing burns caused by excessive temperatures.

[0041] 3 to 5 , in some embodiments, the heat conducting element 30 has an air inlet 34 and an air outlet 35 that communicate with the accommodating space 32. The refrigeration element 20 is annularly arranged and defines a communication opening 25 that connects the atomizing space 121 and the heat dissipation space 122. The communication opening 25 connects to the air inlet 34, allowing air to pass through the refrigeration element 20 and into the atomizing space 121.

[0042] In some embodiments, the heat storage element 50 is provided with a mounting groove 51, the opening of which faces away from the refrigeration element 20. The mounting groove 51 can be used to install components such as a battery 70. Optionally, the inner wall of the mounting groove 51 is coated with a heat-insulating material to reduce the impact of the heat storage element 50 on the components installed in the mounting groove 51. The heat storage element 50 is also provided with an air inlet 52 at one end near the refrigeration element 20. The air inlet 52 can connect the air inlet channel 61 with the accommodating space 32 to allow air to pass through, thereby replenishing the air in the accommodating space 32.

[0043] In some embodiments, the heating device 40 includes a connecting seat 41 and a heating portion 42. A receiving groove 33 is provided at one end of the heat conducting member 30, adjacent to the refrigeration member 20. The receiving groove 33 is recessed at the second end 302 of the heat conducting member 30. The aforementioned air inlet 34 is defined at the bottom of the receiving groove 33. At least a portion of the connecting seat 41 is received within the receiving groove 33. At least a portion of the connecting seat 41 is received within the communication port 25. The heating portion 42 extends through the bottom of the receiving groove 33 and into the receiving space 32.

[0044] The connector 41 can be used to electrically connect to the electrode or battery 70. The connector 41 is at least partially accommodated in the communication port 25 to facilitate electrical connection between the connector 41 and the electrode or battery 70. Optionally, the end surface of the refrigeration element 20 having the electrode and the end surface of the connector 41 used for electrical connection can be flush, so that the parts that feed current to the refrigeration element 20 and the heating device 40 can be uniformly designed and assembled, which helps to simplify the structure and reduce costs.

[0045] At least a portion of the connector 41 is accommodated within the accommodating groove 33, enabling the connector 41 to establish a mounting fit with the heat conducting element 30. For example, the connector 41 can have an interference fit or a fixed fit with the accommodating groove 33, thereby increasing the stability of the installation of the heating device 40. Furthermore, the portion of the connector 41 accommodated within the accommodating groove 33 does not need to heat the cigarette cartridge 80, but still generates or conducts heat. Placing the connector 41 within the accommodating groove 33 allows the heat conducting element to conduct heat from the connector 41 to the refrigeration element 20.

[0046] In some embodiments, the connecting seat 41 includes two mounting portions 411 arranged symmetrically about the center, and the two mounting portions 411 are provided with an air passage 4110. The air passage 4110 is used to allow air to pass through. In the circumferential direction, an air gap 412 is formed between the two mounting portions 411. The air gap 412 can also be used to allow air to pass through. At least two air inlets 34 are provided at the bottom of the accommodating groove 33, some of which are connected to the air passage 4110, and some of which are correspondingly arranged to the air gap 412. By providing the air passage 4110 on the mounting portion 411 and connecting it to the air inlet 34, air flow can enter the accommodating space 32 through the mounting portion 411. At the same time, air flow can also enter the accommodating space 33 through the air gap 412 and the air inlet 34. In this way, sufficient channels can be provided for air flow to enter the accommodating space 33, ensuring that the accommodating space 33 has sufficient air supply when the atomizing device 1 is in operation.

[0047] 6 to 9 , the specific implementation of the refrigeration component 20 will be further introduced below.

[0048] In some embodiments, the refrigeration element 20 is a semiconductor refrigeration element. The refrigeration element 20 includes a cold-end substrate 21 and a hot-end substrate 22, which are spaced apart. The cold-end substrate 21 abuts the heat-conducting element 30, and the hot-end substrate 22 abuts the heat storage element 50. The cold-end substrate 21 and the hot-end substrate 22 are also provided with multiple cold-end electrode layers 211 and multiple hot-end electrode layers 221 on their respective sides facing each other. The electrode layers can be printed or sputtered onto the cold-end substrate 21 and the hot-end substrate 22 using metal materials such as copper and silver. A semiconductor array 23 is also provided between the cold-end substrate 21 and the hot-end substrate 22. The semiconductor array 23 is connected to the electrode layers to form a semiconductor refrigeration element. When direct current is applied to the semiconductor array 23, the cold-end substrate 21 cools due to the Peltier effect, while the hot-end substrate 22 heats. Thus, the refrigeration element 20 can cool the atomization space 121 and transfer heat to the heat storage element 50.

[0049] Furthermore, semiconductor array 23 includes multiple pairs of P-type and N-type semiconductors, which can be fabricated using bismuth-antimony compounds through semiconductor doping technology. One end of each pair of P-type and N-type semiconductors, located near the cold-end substrate 21, is connected to the same cold-end electrode layer 211, and the other end is connected to the adjacent hot-end electrode layer 221. Current in cooling element 20 flows from the N-type semiconductor to the P-type semiconductor. This method forms multiple semiconductor cooling pairs, enabling sufficient cooling of cooling element 20.

[0050] In some embodiments, the refrigeration element 20 is arranged in an annular shape and has a connecting port 25 connecting the atomization space 121 and the heat dissipation space 122. Air can enter the atomization space 121 from the heat dissipation space 122 through the connecting port 25. The cold-end electrode layer 211 and the hot-end electrode layer 221 are arranged at intervals along the circumference of the refrigeration element 20. Multiple pairs of P-type semiconductors and N-type semiconductors are arranged at intervals along the radial direction of the refrigeration element 20 to form a refrigeration group. Each pair of P-type semiconductors and N-type semiconductors in a refrigeration group is connected in parallel. Multiple refrigeration groups are arranged at intervals along the circumference of the refrigeration element 20, and the multiple refrigeration groups are connected in series. The P-type semiconductors and N-type semiconductors of adjacent refrigeration groups are connected in series via the same hot-end electrode layer 221. In this manner, the refrigeration element 20 can be provided with a larger number of semiconductor refrigeration pairs in the radial and circumferential directions of the atomization device 1, thereby efficiently and uniformly cooling the atomization space 121.

[0051] In some embodiments, the cold-end substrate 21 and the hot-end substrate 22 can be made of a highly thermally conductive insulating ceramic material such as alumina or aluminum nitride. Optionally, the cold-end substrate 21 and the hot-end substrate 22 are coated with a thermally conductive coating, such as graphene, silver paste, or other highly thermally conductive material.

[0052] In some embodiments, two electrode slots 222 are provided on the side of the hot-end substrate 22 facing the heat dissipation space 122. Electrodes are provided in the electrode slots 222 and are electrically connected to two adjacent cold-end electrode layers 211. The electrodes are used to electrically connect to the battery 70 to power the semiconductor array 23.

Claims

1. An atomizing device, characterized in that: include: a housing, wherein the housing has an installation space; A refrigeration component is arranged in the installation space and divides the installation space into an atomization space and a heat dissipation space; A heat conducting member is disposed in the atomizing space and abuts against the refrigeration member, and the heat conducting member further forms an accommodating space for accommodating at least part of the cigarette cartridge; A heat storage element is provided in the heat dissipation space and abuts against the refrigeration element; The heating device is arranged in the installation space and is used to heat the cigarette cartridge installed in the accommodating space.

2. The atomizing device according to claim 1, characterized in that: The refrigeration component includes a cold end substrate and a hot end substrate arranged at intervals, the cold end substrate abuts the heat conductive component, and the hot end substrate abuts the heat storage component; the cold end substrate and the hot end substrate are further provided with a plurality of cold end electrode layers and a plurality of hot end electrode layers on the side facing each other, respectively, and a semiconductor array is further provided between the cold end substrate and the hot end substrate, and the semiconductor array is connected to the electrode layer to form semiconductor refrigeration.

3. The atomizing device according to claim 1, characterized in that: The heating device is inserted into the heat conducting member and is at least partially in contact with the heat conducting member.

4. The atomizing device according to claim 1, characterized in that: The housing includes a first section and a second section, the first section is provided with an air outlet channel, the second section is provided with the installation space, and the inner diameter of the second section is larger than the inner diameter of the first section; The wall thickness of the first section is greater than the wall thickness of the second section.

5. The atomizing device according to claim 1, characterized in that: The heat conducting element has a first end away from the refrigeration element and a second end close to the refrigeration element. The first end and the second end are both provided with flanges, and a heat insulation groove is formed between the two flanges.

6. The atomizing device according to claim 1, characterized in that: The heating device is a resistance heating device, an electromagnetic heating device, an infrared heating device, an air flow heating device or a microwave heating device.

7. The atomizing device according to any one of claims 1 to 6, characterized in that: The heat-conducting component has an air inlet and an air outlet connected to the accommodating space; the refrigeration component is arranged in a ring shape, and is surrounded by a connecting port connected to the atomization space and the heat dissipation space, and the connecting port is connected to the air inlet.

8. The atomizing device according to claim 7, characterized in that: The heat storage element is provided with a mounting groove, the opening of the mounting groove is facing away from the refrigeration element, and the end of the heat storage element close to the refrigeration element is further provided with an air inlet hole, which connects the mounting groove and the communication port.

9. The atomizing device according to claim 7, characterized in that: The heating device includes a connecting seat and a heating part. A accommodating groove is recessed at one end of the heat-conducting member close to the refrigeration member. The air inlet is provided at the bottom of the accommodating groove. At least part of the connecting seat is accommodated in the accommodating groove. At least part of the connecting seat is accommodated in the communicating port. The heating part passes through the bottom of the accommodating groove and extends into the accommodating space.

10. The atomizing device according to claim 9, characterized in that: The connecting seat includes two mounting parts arranged symmetrically with respect to the center, and the two mounting parts are provided with air passages. In the circumferential direction, an air gap is formed between the two mounting parts; the bottom of the accommodating groove is provided with at least two air inlets, some of the air inlets are connected to the air passages, and some of the air inlets are arranged corresponding to the air gaps.

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