Wafer fork unit structure allowing for separate pickup and placement of wafers, and wafer transfer mechanism and method

Abstract

The present invention relates to the technical field of wafer transfer, and in particular, to a wafer fork unit structure allowing for separate pickup and placement of wafers, and a wafer transfer mechanism and method. The structure comprises: a fixing frame, and a wafer support tooth mechanism and a wafer fork which are fixed onto the fixing frame, wherein the wafer fork is provided with first wafer pins located at a first horizontal height and second wafer pins located at a second horizontal height, and wafer support teeth capable of moving back and forth in the direction of the wafer fork are provided on the wafer support tooth mechanism. When the wafer support teeth are located at an initial position, the first wafer pins support a wafer before cleaning; and when the wafer support teeth extend to a support position, the wafer support teeth and the second wafer pins support the wafer after cleaning. According to the present invention, during wafer pickup and placement, a dirty wafer before cleaning and the clean wafer after cleaning are picked and placed separately, so that the dirty wafer is prevented from affecting the clean wafer, thereby ensuring the wafer cleaning effect.

Description

A wafer fork unit structure, wafer transfer mechanism and method for separately placing and taking wafers Technical Field

[0001] The present invention relates to the technical field of wafer transmission, and in particular to a wafer fork unit structure for separately taking and placing wafers, a wafer transmission mechanism and a method. Background Art

[0002] At present, the fork of the wafer transfer mechanism (WTU) on the equipment front-end module (EFEM) is generally only equipped with four supporting pins (PINs) for supporting wafers. As shown in Figures 1 to 5, 61 is the supporting pin for supporting the wafer at the rear end of the fork, 62 is the wafer limiting pin, 63 is the existing fork, and 64 is the supporting pin for supporting the wafer at the front end of the fork. When the wafer transfer mechanism takes and places wafers, dirty wafers before cleaning and clean wafers after cleaning will fall on the wafer supporting surfaces of the four supporting pins on the fork, which can easily cause the clean wafers to be contaminated by pollutants left on the fork unit by the dirty wafers, thereby affecting the cleaning effect. Summary of the Invention

[0003] The purpose of the present invention is to provide a wafer fork unit structure for separately placing and picking up wafers, so as to solve the above technical problems;

[0004] The present invention also aims to provide a wafer transfer mechanism to solve the above technical problems;

[0005] Another object of the present invention is to provide a wafer transmission method to solve the above technical problems.

[0006] The technical problem solved by the present invention can be achieved by adopting the following technical solutions:

[0007] A wafer fork unit structure for separately placing and picking up wafers, comprising:

[0008] A fixed frame, and a wafer supporting tooth mechanism and a wafer fork fixed on the fixed frame;

[0009] The wafer fork is provided with a first wafer supporting column at a first level and a second wafer supporting column at a second level, and the wafer supporting tooth mechanism is provided with wafer supporting teeth that can move back and forth along the direction of the wafer fork.

[0010] in,

[0011] The wafer supporting teeth are in the initial position, and the first wafer supporting column carries the wafer before cleaning;

[0012] The wafer supporting teeth extend forward to a supporting position, and the wafer supporting teeth and the second wafer supporting column support the cleaned wafer.

[0013] Preferably, the wafer supporting gear mechanism further includes:

[0014] A first fixing plate, on a side facing the wafer fork, provided with the wafer supporting teeth;

[0015] a telescopic structure, wherein a first end of the telescopic structure is connected to a side of the first fixing plate away from the blade fork;

[0016] a second fixing plate, to which the second end of the telescopic structure is connected; and

[0017] The cylinder is connected to the second fixing plate, and drives the telescopic structure to extend and retract based on the cylinder, thereby driving the wafer supporting teeth on the wafer supporting teeth to move.

[0018] Preferably, the telescopic structure includes:

[0019] a telescopic rod, a first end of the telescopic rod being connected to a side of the first fixing plate away from the blade fork;

[0020] a linear bearing, wherein the telescopic rod is controllably capable of performing telescopic motion within the linear bearing;

[0021] An adjusting screw, wherein the first end of the adjusting screw is connected to the second end of the telescopic rod, and the second end of the adjusting screw is connected to the second fixed plate. The cylinder drives the second fixed plate to move, driving the adjusting screw and the telescopic rod to perform telescopic movement in the linear bearing.

[0022] Preferably, the telescopic structure includes a first telescopic structure located above the cylinder and a second telescopic structure located below the cylinder, the first telescopic structure and the second telescopic structure have the same structure, the first telescopic structure is arranged at the upper ends of the first fixed plate and the second fixed plate, and the second telescopic structure is arranged at the lower ends of the first fixed plate and the second fixed plate.

[0023] Preferably, it further includes a bracket, and the wafer supporting gear mechanism is arranged on the fixed frame through the bracket, the bracket is provided with a first mounting hole, the linear bearing is arranged in the first mounting hole, and the bracket is also provided with a second mounting hole, the cylinder is arranged in the second mounting hole, and the cylinder and the telescopic structure are located on the same side of the first fixed plate.

[0024] Preferably, the wafer supporting tooth is provided with a supporting surface for supporting the wafer, and there is a step between the supporting surface and the wafer supporting tooth. When the wafer supporting tooth extends forward to the supporting position, the supporting surface and the second wafer supporting column have the same second horizontal height, and the second horizontal height is greater than the first horizontal height.

[0025] Preferably, the rear end of the fork is connected to the fixed frame, the fork is H-shaped, the wafer supporting teeth are located inside the fork on a side close to the fixed frame, and the first wafer supporting column includes:

[0026] A first supporting column located in the front left side of the blade fork;

[0027] A second supporting column located in front of the right side of the fork;

[0028] a third supporting column located in the middle of the left side of the fork; and

[0029] a fourth supporting column located in the middle of the right side of the fork;

[0030] The second wafer supporting column comprises:

[0031] a fifth supporting column and a sixth supporting column located at the left front of the blade fork;

[0032] a seventh supporting column and an eighth supporting column located in the front right side of the blade fork;

[0033] The arrangement positions of the fifth supporting column and the sixth supporting column are adapted to the left curvature of the cleaned wafer, and the arrangement positions of the seventh supporting column and the eighth supporting column are adapted to the right curvature of the cleaned wafer.

[0034] Preferably, the blade fork is further provided with two first limiting pillars, which are symmetrically arranged at the oblique rear of the third supporting pillar and the fourth supporting pillar respectively;

[0035] When the wafer supporting teeth are in the initial position and the first supporting column, the second supporting column, the third supporting column and the fourth supporting column support the wafer before cleaning, the two first limiting columns limit the rear edge of the wafer before cleaning, and the fifth supporting column and the seventh supporting column are used to limit the front edge of the wafer before cleaning.

[0036] Preferably, the sixth supporting column and the eighth supporting column are both stepped columns.

[0037] A wafer transmission mechanism comprises the wafer fork unit structure.

[0038] A wafer transfer method adopts the fork unit structure for separately placing and picking up wafers to transfer wafers, comprising:

[0039] Step S1: A wafer transport mechanism drives a fork unit to extend a first distance into a wafer carrier, and carries the uncleaned wafer via the first wafer supporting column to remove the uncleaned wafer.

[0040] In step S2, the fork unit retracts and rotates toward a wafer flipping mechanism, extends a second distance forward, delivers the uncleaned wafer into the wafer flipping mechanism, and then retracts. The uncleaned wafer is transferred to a cleaning area for cleaning. After cleaning is completed, the cleaned wafer is obtained and returned to the wafer flipping mechanism.

[0041] Step S3, the fork unit extends forward a third distance into the wafer flipping mechanism, the supporting surface extends forward along the fork direction to the supporting position, the supporting surface and the second wafer supporting column support the cleaned wafer, and the cleaned wafer is taken out;

[0042] In step S4, the fork unit retreats and rotates toward the wafer carrier, extends a fourth distance forward to deliver the cleaned wafer into the wafer carrier, and the fork unit retreats to a standby position.

[0043] Beneficial effects of the present invention: Due to the adoption of the above technical solution, the present invention separately places dirty wafers before cleaning and clean wafers after cleaning when taking and placing wafers, which can avoid the influence of dirty wafers on clean wafers, thereby ensuring the cleaning effect of the wafers. BRIEF DESCRIPTION OF THE DRAWINGS

[0044] FIG1 is a schematic structural diagram of a blade fork unit in the prior art;

[0045] FIG2 is a schematic diagram of a wafer carried by a fork unit in the prior art;

[0046] FIG3 is a side view of a blade fork unit in the prior art;

[0047] FIG4 is a partial enlarged view of point m in FIG3 ;

[0048] FIG5 is a partial enlarged view of position n in FIG3;

[0049] FIG6 is a schematic structural diagram of a fork unit according to an embodiment of the present invention;

[0050] FIG7 is a schematic structural diagram of a wafer support gear mechanism according to an embodiment of the present invention;

[0051] FIG8 is a schematic structural diagram of a slice fork according to an embodiment of the present invention;

[0052] FIG9 is a top view of a slice fork according to an embodiment of the present invention;

[0053] FIG10 is a side view of a slice fork according to an embodiment of the present invention;

[0054] FIG11 is a schematic diagram of a fork unit carrying a wafer before cleaning according to an embodiment of the present invention;

[0055] FIG12 is a side view of a wafer before cleaning carried by a fork unit according to an embodiment of the present invention;

[0056] FIG13 is a partial enlarged view of point A in FIG12;

[0057] FIG14 is a partial enlarged view of point O in FIG12;

[0058] FIG15 is a schematic diagram of a fork unit carrying a cleaned wafer according to an embodiment of the present invention;

[0059] FIG16 is a side view of a fork unit carrying a cleaned wafer according to an embodiment of the present invention;

[0060] FIG17 is a partial enlarged view of point P in FIG16 ;

[0061] FIG18 is a partial enlarged view of point Q in FIG16 ;

[0062] FIG19 is a comparison diagram of the wafer prevention positions before and after cleaning according to an embodiment of the present invention;

[0063] FIG20 is a partial enlarged view of point B in FIG19;

[0064] FIG21 is a partial enlarged view of point C in FIG19;

[0065] FIG22 is a schematic diagram of the steps of a method for separating and placing wafers according to an embodiment of the present invention;

[0066] FIG23 is a schematic diagram of the distribution of wafer transfer devices according to an embodiment of the present invention;

[0067] FIG24 is a schematic diagram of a wafer transfer device in a first standby position according to an embodiment of the present invention;

[0068] FIG25 is a schematic diagram of a wafer transfer device in a second standby position according to an embodiment of the present invention;

[0069] FIG26 is a schematic diagram of a fork unit extending into a wafer carrier according to an embodiment of the present invention;

[0070] FIG27 is a schematic diagram of the wafer carrier after the fork unit exits according to an embodiment of the present invention;

[0071] FIG28 is a schematic diagram of a wafer fork unit carrying a wafer and turning it to a wafer flipping mechanism according to an embodiment of the present invention;

[0072] FIG29 is a schematic diagram of a wafer flipping mechanism in which a wafer fork unit extends forwardly into the wafer flipping mechanism according to an embodiment of the present invention;

[0073] FIG30 is a schematic diagram of a wafer flipping mechanism after the fork unit exits in an embodiment of the present invention.

[0074] In the accompanying drawings: 1. Fixed frame; 11. Bracket; 2. Wafer support gear mechanism; 21. First fixed plate; 22. Wafer support gear; 23. Support surface; 24. Second fixed plate; 25. Cylinder; 26. Telescopic structure; 261. Telescopic rod; 262. Linear bearing; 263. Adjusting screw; 3. Fork; 31. First limiting column; 32. Second limiting column; 33. First wafer supporting column; 34. Second wafer supporting column; 41. First supporting column; 42. Second supporting column; 43. Third supporting column; 44 , fourth supporting column; 45. Fifth supporting column; 46. Sixth supporting column; 47. Seventh supporting column; 48. Eighth supporting column; 51. Wafer before cleaning; 52. Wafer after cleaning; 61. Supporting column for supporting wafer at the rear end of the fork; 62. Wafer limiting column; 63. Existing fork; 64. Supporting column for supporting wafer at the front end of the fork; 71. Wafer transfer mechanism; 72. Wafer storage station; 73. Wafer carrier; 74. Wafer flipping mechanism; 75. Feed push rod; 76. Discharge push rod; 77. Robot. DETAILED DESCRIPTION

[0075] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making any creative efforts shall fall within the scope of protection of the present invention.

[0076] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features in the embodiments may be combined with each other.

[0077] The present invention will be further described below with reference to the accompanying drawings and specific embodiments, but they are not intended to limit the present invention.

[0078] A wafer fork unit structure for separately placing and picking up wafers, as shown in FIG6 to FIG30, includes:

[0079] A fixed frame 1, and a wafer support mechanism 2 and a wafer fork 3 fixed to the fixed frame 1;

[0080] The wafer fork 3 is provided with a first wafer supporting column 33 at a first level and a second wafer supporting column 34 at a second level. The wafer supporting tooth mechanism 2 is provided with a wafer supporting tooth 22 that can move back and forth along the direction of the wafer fork 3.

[0081] in,

[0082] The wafer supporting teeth 22 are at the initial position, and the first wafer supporting pillars 33 carry the wafer 51 before cleaning;

[0083] The wafer supporting teeth 22 extend forward to the supporting position, and the wafer supporting teeth 22 and the second wafer supporting pillars 34 support the cleaned wafer 52 .

[0084] Specifically, as shown in Figures 11 to 21, the fork unit of the present invention realizes the function of the wafer transfer mechanism 71 to separately place the wafer 51 before cleaning and the wafer 52 after cleaning when taking and placing the wafer. This function can avoid the influence of dirty wafers on clean wafers, thereby ensuring the cleaning effect of the wafers.

[0085] Specifically, the present invention is applied to the fork unit of the wafer transfer mechanism 71 (WTU) on the front-end module (EFEM), primarily to address the issue of contamination of pre-cleaned wafers 51 by cleaned wafers 52. By optimizing and improving the fork unit structure on the wafer transfer mechanism 71, including changes in the number, height, and position of support pins, the present invention enables the wafer transfer mechanism 71 to separate the pre-cleaned wafers 51 and the wafers 52 cleaned by the tank-type cleaning equipment during wafer transfer. This structure prevents contaminants left on the transfer mechanism fork 3 by pre-cleaned wafers 51 from affecting the cleaned wafers 52, ensuring the machine's effective wafer cleaning.

[0086] To be more specific, the present invention improves the structure of the fork unit and provides a total of 8 supporting columns for supporting wafers on the fork unit, and the heights of the 4 second wafer supporting columns 34 are different from the heights of the 4 first wafer supporting columns 33, and a wafer supporting tooth mechanism 2 is added behind the fork unit. Therefore, the supporting surface positions of the wafer 51 before cleaning and the wafer 52 after cleaning on the fork unit are different, the supporting surface of the wafer 51 before cleaning is at the back, and the supporting surface of the wafer 52 after cleaning is at the front; and they are not on the same horizontal plane, the supporting surface of the wafer 51 before cleaning is at the bottom, and the supporting surface of the wafer 52 after cleaning is at the top.

[0087] The present invention provides a wafer fork unit for the wafer transfer mechanism 71 on an EFEM. The fork unit comprises a fixed frame 1, a wafer support mechanism 2, and a fork 3. The structure of the fork unit is shown in Figures 8 to 10. The wafer support mechanism 2 and fork 3 are both fixed to the fixed frame 1.

[0088] In a preferred embodiment, as shown in FIG7 , the wafer support mechanism 2 further includes:

[0089] The first fixing plate 21 is provided with wafer supporting teeth 22 on one side facing the wafer fork 3;

[0090] a telescopic structure 26 , wherein a first end of the telescopic structure 26 is connected to a side of the first fixing plate 21 away from the blade fork 3 ;

[0091] A second fixing plate 24, a second end of the telescopic structure 26 is connected to the second fixing plate 24; and

[0092] The cylinder 25 is connected to the second fixing plate 24 , and drives the telescopic structure 26 to extend and retract based on the cylinder 25 , thereby driving the wafer supporting teeth 22 on the wafer supporting teeth 22 to move.

[0093] In a preferred embodiment, the telescopic structure 26 includes:

[0094] A telescopic rod 261, a first end of the telescopic rod 261 is connected to a side of the first fixing plate 21 away from the blade fork 3;

[0095] The linear bearing 262 and the telescopic rod 261 can be controlled to perform telescopic movement within the linear bearing 262;

[0096] Adjust the screw 263, the first end of the adjusting screw 263 is connected to the second end of the telescopic rod 261, and the second end of the adjusting screw is connected to the second fixed plate 24. The cylinder 25 drives the second fixed plate 24 to move, driving the adjusting screw 263 and the telescopic rod 261 to perform telescopic movement in the linear bearing 262.

[0097] Specifically, the wafer support mechanism 2 primarily comprises a first fixed plate 21, an adjustment screw 263, a cylinder 25, a linear bearing 262, a telescopic rod 261, a second fixed plate 24, and wafer support teeth 22. The structure of the wafer support mechanism 2 is shown in FIG7 . When the wafer transfer mechanism 71 is loading and unloading a pre-cleaned wafer 51, the cylinder 25 is inactive. When loading and unloading a cleaned wafer 52, the cylinder 25 is activated, pushing the wafer support teeth 22 forward a distance. The toothed support surfaces 23 support the cleaned wafer 52. The surface height of each support surface 23 is on the same level as the support surface formed by the corresponding second wafer support column 34 of the fork 3.

[0098] In a preferred embodiment, the telescopic structure 26 includes a first telescopic structure located above the cylinder 25 and a second telescopic structure located below the cylinder 25, respectively. The first telescopic structure and the second telescopic structure have the same structure. The first telescopic structure is arranged at the upper ends of the first fixed plate 21 and the second fixed plate 24, and the second telescopic structure is arranged at the lower ends of the first fixed plate 21 and the second fixed plate 24.

[0099] In a preferred embodiment, it also includes a bracket 11, and the wafer support mechanism 2 is arranged on the fixed frame 1 through the bracket 11. A first mounting hole is provided on the bracket 11, and the linear bearing 262 is provided in the first mounting hole. A second mounting hole is also provided on the bracket 11, and the cylinder 25 is provided in the second mounting hole. The cylinder 25 and the telescopic structure 26 are located on the same side of the first fixed plate 21.

[0100] Specifically, when the cylinder 25 contracts, the cylinder piston moves inward, pushing the second fixed plate 24 inward. The movement of the second fixed plate 24 will cause the telescopic rod 261 connected to it to move inward in the linear bearing 262. The change in the position of the telescopic rod 261 will further affect the position of the wafer support teeth 22. The wafer support teeth 22 will move inward or outward along the set direction as driven by the cylinder 25. In the present invention, the set direction is along the direction of the fork 3.

[0101] In a preferred embodiment, a supporting surface 23 for supporting the wafer is provided on the wafer supporting tooth 22, and there is a step between the supporting surface 23 and the wafer supporting tooth 22. When the wafer supporting tooth 22 extends forward to the supporting position, the supporting surface 23 and the second wafer supporting column 34 have the same second horizontal height, and the second horizontal height is greater than the first horizontal height.

[0102] Specifically, in the present invention, the second level height is 1.5 mm higher than the first level height, so that the wafer 51 before cleaning and the wafer 52 after cleaning can be separated in the height direction.

[0103] In a preferred embodiment, the rear end of the fork 3 is connected to the fixed frame 1, the fork 3 is H-shaped, the wafer supporting teeth 22 are located inside the fork 3 on the side close to the fixed frame 1, and the first wafer supporting column 33 includes:

[0104] A first supporting column 41 located on the left front of the fork 3;

[0105] A second supporting column 42 located in the front right side of the blade fork 3;

[0106] A third supporting column 43 located in the middle of the left side of the fork 3; and

[0107] A fourth supporting column 44 located in the middle of the right side of the fork 3;

[0108] The second wafer supporting column 34 includes:

[0109] The fifth supporting column 45 and the sixth supporting column 46 are located on the left front of the blade fork 3;

[0110] The seventh supporting column 47 and the eighth supporting column 48 are located in the front right side of the blade fork 3;

[0111] The fifth supporting column 45 and the sixth supporting column 46 are arranged at positions corresponding to the left curvature of the cleaned wafer 52 , and the seventh supporting column 47 and the eighth supporting column 48 are arranged at positions corresponding to the right curvature of the cleaned wafer 52 .

[0112] More specifically, the fork 3 is provided with eight supporting columns for supporting the wafers, and the structure of the fork 3 is shown in Figures 8 to 10. The fork 3 in the present invention is a bilaterally symmetrical H-shaped structure, and when showing the side view, only the supporting columns on one side are shown, while the other side is a symmetrical structure.

[0113] The first supporting column 41 located in the front left of the slice fork 3, the second supporting column 42 located in the front right of the slice fork 3, the third supporting column 43 located in the middle of the left side of the slice fork 3, and the fourth supporting column 44 located in the middle of the right side of the slice fork 3 are used to support the wafer 51 before cleaning. The supporting surfaces of the first supporting column 41, the second supporting column 42, the third supporting column 43, and the fourth supporting column 44 are on the same horizontal plane and are all at a first horizontal height.

[0114] The fifth supporting column 45 and the sixth supporting column 46 located on the left front of the fork 3 and the seventh supporting column 47 and the eighth supporting column 48 located on the right front of the fork 3 are used to support the cleaned wafer 52. The fifth supporting column 45, the sixth supporting column 46, the seventh supporting column 47, the eighth supporting column 48 and the supporting surface formed by the supporting part 23 corresponding to the fork 3 are on the same horizontal plane and are all at the second horizontal height.

[0115] In a preferred embodiment, the blade fork 3 is further provided with two first limiting posts 31, which are symmetrically arranged at the oblique rear of the third supporting post 43 and the fourth supporting post 44;

[0116] When the wafer supporting teeth 22 are in the initial position and the first supporting column 41, the second supporting column 42, the third supporting column 43 and the fourth supporting column 44 support the wafer 51 before cleaning, the two first limiting columns 31 limit the rear edge of the wafer 51 before cleaning, and the fifth supporting column 45 and the seventh supporting column 47 are used to limit the front edge of the wafer 51 before cleaning.

[0117] In a preferred embodiment, the sixth supporting column 46 and the eighth supporting column 48 are both stepped columns.

[0118] A wafer transfer mechanism includes a wafer fork unit structure as in any one of the embodiments.

[0119] A wafer transfer method, using a fork unit structure for separately placing and picking up wafers as in any embodiment, comprises:

[0120] In step S1, a wafer transfer mechanism 71 drives a fork unit to extend a first distance into a wafer carrier 73, and carries a pre-cleaned wafer 51 via a first wafer supporting column 33 to remove the pre-cleaned wafer 51;

[0121] In step S2, the fork unit retracts and rotates toward a wafer flipping mechanism 74, extends a second distance forward, and delivers the uncleaned wafer 51 into the wafer flipping mechanism 74, and then retracts. The uncleaned wafer 51 is transferred to the cleaning area for cleaning. After cleaning, the cleaned wafer 52 is obtained and returned to the wafer flipping mechanism 74.

[0122] Step S3: The wafer fork unit extends forward a third distance into the wafer flipping mechanism 74, and the supporting surface 23 extends forward along the direction of the wafer fork 3 to the supporting position. The supporting surface 23 and the second wafer supporting column 34 support the cleaned wafer 52, and the cleaned wafer 52 is taken out.

[0123] In step S4 , the fork unit retracts and rotates toward the wafer carrier 73 , extends a fourth distance forward, and delivers the cleaned wafer 52 into the wafer carrier 73 , and then retracts to the standby position.

[0124] Since the positions of the wafer 51 before cleaning and the wafer 52 after cleaning are different on the fork 3, the first distance and the fourth distance from the fork unit to the wafer carrier 73 are different. Similarly, the second distance and the third distance from the fork unit to the wafer flip mechanism 74 are also different.

[0125] Specific embodiment 1,

[0126] As shown in FIG23 , the wafer fork unit of the present invention is mainly used on the wafer transfer mechanism 71 (WTU) of the equipment front-end module (EFEM). The first standby position of the wafer transfer mechanism 71 of the present invention is shown in FIG24 . The specific workflow for placing and removing dirty and clean wafers is as follows:

[0127] Step 1, as shown in FIG25 , the wafer fork unit on the wafer transfer mechanism 71 rotates 90 degrees counterclockwise from the first standby position to the second standby position;

[0128] In step 2, as shown in FIG26 , the fork unit on the wafer transfer mechanism 71 extends a first distance to the wafer carrier 73 (FOUP) on the wafer storage station 72 (FIMS), and removes the wafer 51 before cleaning from the wafer carrier 73;

[0129] Step 3, as shown in FIG27 , the fork unit on the wafer transfer mechanism 71 returns to the second standby position with the dirty wafer taken out from the wafer carrier 73;

[0130] Step 4, as shown in FIG28 , the fork unit on the wafer transfer mechanism 71 rotates the dirty wafer taken out from the wafer carrier 73 90 degrees clockwise to the working position direction of the wafer flip mechanism 74 (a POS mechanism in this embodiment);

[0131] Step 5, as shown in FIG29 , the fork unit on the wafer transfer mechanism 71 carries the dirty wafer taken out from the wafer carrier 73 and extends a second distance to the middle of the wafer flipping mechanism 74 , and the wafer flipping mechanism 74 receives the dirty wafer on the fork unit;

[0132] Step 6, as shown in FIG30 , the wafer fork unit on the wafer transfer mechanism 71 returns to the first standby position;

[0133] Step 7: The load pusher 75 moves from the standby position to the bottom of the wafer flip mechanism 74 and receives the dirty wafer.

[0134] Step 8: The feed push rod 75 returns to the standby position with the dirty wafer;

[0135] Step 9: The robot 77 in the tank cleaning area picks up the wafer from the feed push rod 75 and sends it to the tank cleaning area for cleaning;

[0136] Step 10: After cleaning is completed, the robot 77 in the tank cleaning area places the cleaned wafer 52 on the unload pusher 76 in the standby position.

[0137] Step 11: The discharge push rod 76 moves with the cleaned wafer 52 from the standby position to the bottom of the wafer flip mechanism 74, and the wafer flip mechanism 74 receives the clean wafer on the discharge push rod 76;

[0138] Step 12, the discharge push rod 76 returns to the standby position;

[0139] In step 13, referring to FIG. 29 , the fork unit on the wafer transfer mechanism 71 extends a third distance to remove the cleaned wafer 52 from the wafer flipping mechanism 74 .

[0140] In step 14, please further refer to FIG. 28 , the fork unit on the wafer transfer mechanism 71 returns the cleaned wafer 52 taken out from the wafer flipping mechanism 74 to the standby position;

[0141] In step 15, please further refer to FIG. 27 , the fork unit on the wafer transfer mechanism 71 rotates the clean wafer taken from the wafer flip mechanism 74 90 degrees counterclockwise to the position direction of the wafer storage station 72 ;

[0142] In step 16, further referring to FIG. 26 , the fork unit on the wafer transfer mechanism 71 carries the clean wafer taken from the wafer flipping mechanism 74 and extends a fourth distance to the wafer carrier 73 on the wafer storage station 72 , and places the clean wafer in the wafer carrier 73 .

[0143] In step 17, please further refer to FIG. 25 , the wafer fork unit on the wafer transfer mechanism 71 returns to the second standby position.

[0144] In step 18, please further refer to FIG. 24 , the wafer fork unit on the wafer transfer mechanism 71 rotates 90 degrees counterclockwise from the second standby position to the first standby position.

[0145] In summary, the fork unit of the present invention realizes the function of the wafer transfer mechanism 71 to separately place the wafer 51 before cleaning and the wafer 52 after cleaning when taking and placing the wafer. This function can avoid the influence of dirty wafers on clean wafers, thereby ensuring the cleaning effect of the wafers.

[0146] The above description is only a preferred embodiment of the present invention and does not limit the implementation mode and protection scope of the present invention. For those skilled in the art, it should be aware that all solutions obtained by equivalent substitutions and obvious changes made using the description and illustrations of the present invention should be included in the protection scope of the present invention.

Claims

1. A fork unit structure for separately placing and picking up wafers, characterized in that: include: A fixed frame (1), and a wafer support mechanism (2) and a wafer fork (3) fixed on the fixed frame (1); The wafer fork (3) is provided with a first wafer supporting column (33) located at a first level and a second wafer supporting column (34) located at a second level. The wafer supporting tooth mechanism (2) is provided with a wafer supporting tooth (22) capable of reciprocating along the direction of the wafer fork (3). in, The wafer supporting teeth (22) are at an initial position, and the first wafer supporting column (33) carries the wafer (51) before cleaning; The wafer supporting teeth (22) extend forward to a supporting position, and the wafer supporting teeth (22) and the second wafer supporting column (34) carry the cleaned wafer (52).

2. The wafer fork unit structure for separating and placing wafers according to claim 1, characterized in that: The wafer supporting gear mechanism (2) further comprises: A first fixing plate (21) is provided with the wafer supporting teeth (22) on one side facing the wafer fork (3); a telescopic structure (26), wherein a first end of the telescopic structure (26) is connected to a side of the first fixing plate (21) away from the blade fork (3); a second fixing plate (24), the second end of the telescopic structure (26) being connected to the second fixing plate (24); and The cylinder (25) is connected to the second fixing plate (24), and drives the telescopic structure (26) to telescope based on the cylinder (25), thereby driving the wafer supporting teeth (22) on the wafer supporting teeth (22) to move.

3. The wafer fork unit structure for separating and placing wafers according to claim 2, characterized in that: The telescopic structure (26) comprises, a telescopic rod (261), wherein a first end of the telescopic rod (261) is connected to a side of the first fixing plate (21) away from the blade fork (3); a linear bearing (262), wherein the telescopic rod (261) can be controlled to perform telescopic movement within the linear bearing (262); An adjusting screw (263), wherein a first end of the adjusting screw (263) is connected to a second end of the telescopic rod (261), and a second end of the adjusting screw is connected to the second fixing plate (24), and the cylinder (25) drives the second fixing plate (24) to move, thereby driving the adjusting screw (263) and the telescopic rod (261) to perform telescopic movement in the linear bearing (262).

4. The wafer fork unit structure for separating and placing wafers according to claim 2, characterized in that: The telescopic structure (26) includes a first telescopic structure (26) located above the cylinder (25) and a second telescopic structure (26) located below the cylinder (25), the first telescopic structure (26) and the second telescopic structure (26) having the same structure. The first telescopic structure (26) is provided at the upper ends of the first fixed plate (21) and the second fixed plate (24), and the second telescopic structure (26) is provided at the lower ends of the first fixed plate (21) and the second fixed plate (24).

5. The wafer fork unit structure for separating and placing wafers according to claim 3, characterized in that: The invention also includes a bracket (11), wherein the wafer supporting gear mechanism (2) is arranged on the fixed frame (1) through the bracket (11), a first mounting hole is provided on the bracket (11), the linear bearing (262) is arranged in the first mounting hole, a second mounting hole is also provided on the bracket (11), the cylinder (25) is arranged in the second mounting hole, and the cylinder (25) and the telescopic structure (26) are located on the same side of the first fixed plate (21).

6. The wafer fork unit structure for separating and placing wafers according to claim 1, characterized in that: The wafer supporting tooth (22) is provided with a supporting surface (23) for supporting the wafer, and there is a step between the supporting surface (23) and the wafer supporting tooth (22). When the wafer supporting tooth (22) extends forward to the supporting position, the supporting surface (23) and the second wafer supporting column (34) have the same second horizontal height, and the second horizontal height is greater than the first horizontal height.

7. The wafer fork unit structure for separating and placing wafers according to claim 1, characterized in that: The rear end of the fork (3) is connected to the fixed frame (1), the fork (3) is H-shaped, the wafer supporting teeth (22) are located inside the fork (3) on a side close to the fixed frame (1), and the first wafer supporting column (33) includes: A first supporting column (41) located at the left front of the blade fork (3); A second supporting column (42) located in front of the right side of the blade fork (3); a third supporting column (43) located in the middle of the left side of the blade fork (3); and a fourth supporting column (44) located in the middle of the right side of the blade fork (3); The second wafer supporting column (34) comprises: A fifth supporting column (45) and a sixth supporting column (46) located at the left front of the blade fork (3); A seventh supporting column (47) and an eighth supporting column (48) located in front of the right side of the blade fork (3); The arrangement positions of the fifth supporting column (45) and the sixth supporting column (46) are adapted to the left curvature of the cleaned wafer (52), and the arrangement positions of the seventh supporting column (47) and the eighth supporting column (48) are adapted to the right curvature of the cleaned wafer (52).

8. The wafer fork unit structure for separating and placing wafers according to claim 7, characterized in that: The blade fork (3) is further provided with two first limiting columns (31), which are symmetrically arranged at the oblique rear of the third supporting column (43) and the fourth supporting column (44); When the wafer supporting teeth (22) are in the initial position and the first supporting column (41), the second supporting column (42), the third supporting column (43) and the fourth supporting column (44) support the wafer (51) before cleaning, the two first limiting columns (31) limit the rear edge of the wafer (51) before cleaning, and the fifth supporting column (45) and the seventh supporting column (47) are used to limit the front edge of the wafer (51) before cleaning.

9. The wafer fork unit structure for separating and placing wafers according to claim 7, characterized in that: The sixth supporting column (46) and the eighth supporting column (48) both have stepped cylindrical surfaces.

10. A wafer transfer mechanism, characterized in that: The invention comprises a fork unit structure as described in any one of claims 1 to 10.

11. A wafer transfer method, characterized in that: The wafer transfer is performed using a fork unit structure for separately placing and picking up wafers as claimed in any one of claims 1 to 10, comprising: In step S1, a wafer transport mechanism (71) drives a fork unit to extend a first distance into a wafer carrier (73), carries the wafer (51) before cleaning through the first wafer supporting column (33), and takes out the wafer (51) before cleaning; In step S2, the fork unit retreats and rotates toward a wafer flipping mechanism (74), extends a second distance forward to send the uncleaned wafer (51) into the wafer flipping mechanism (74), and then retreats. The uncleaned wafer (51) is transferred to the cleaning area for cleaning. After cleaning is completed, the cleaned wafer (52) is obtained and sent back to the wafer flipping mechanism (74); In step S3, the fork unit extends forward a third distance into the wafer flipping mechanism (74), the supporting surface (23) extends forward along the direction of the fork (3) to the supporting position, the supporting surface (23) and the second wafer supporting column (34) carry the cleaned wafer (52), and the cleaned wafer (52) is taken out; In step S4, the fork unit retreats and rotates toward the wafer carrier (73), extends a fourth distance forward to deliver the cleaned wafer (52) into the wafer carrier (73), and the fork unit retreats to a standby position.

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