Inductive component

Abstract

An inductive component comprises a core element from a magnetic material, a conductor, and a mold body. The conductor is arranged at least partially around the core element. The mold body comprises metallic particles in a matrix material. The mold body surrounds the core element and the conductor at least partially.

Description

[0001] Description

[0002] Inductive component

[0003] An inductive component is speci fied .

[0004] Inductive components are used in a variety of applications such as power management integrated circuits ( PMIC ) , central processing units ( CPU) and graphics processing units ( GPU) . Since si ze-reduction is desired at all levels in many modern applications , there is a need for particularly compact inductive components with a small volume .

[0005] Furthermore , as modern applications are typically operated with comparably low voltage but high power consumption, relatively high operation currents can occur . This requires the inductive component to have a low resistance and preferably a high saturation current with a soft saturation characteristic .

[0006] Common metal composite inductors usually show a comparably high direct current resistance of 1 . 5 mQ or more . Common alternatives to metal composite inductors are ferrite inductors that show a relatively low saturation current of approximately 60 A or less and lack a soft saturation characteristic .

[0007] One obj ective to be achieved is to speci fy an improved inductive component , in particular characteri zed by an improved saturation characteristic and preferably by a reduced volume . This objective is achieved by a component comprising the features of independent patent claim 1. Advantageous embodiments and further developments are subject to the dependent patent claims.

[0008] An inductive component is suggested which comprises a core element from a magnetic material, a conductor, and a mold body. The conductor is arranged at least partially around the core element. The mold body comprises metallic particles in a matrix material. The mold body surrounds the core element and the conductor at least partially.

[0009] For example, the conductor is arranged at least partially around the core element in a contact region of the core element, wherein in the contact region the conductor is in mechanical contact with the core element. The mechanical contact between the conductor and the core element may be a direct or an indirect contact.

[0010] In particular, the conductor is arranged at the core without a complete turn. That is, the conductor may not include a complete turn around the core. For example, the conductor is formed as a strap or the like at the core. In particular, the conductor does not form a coil or any other wounded structure .

[0011] The metallic particles of the mold body comprise for example at least one of the following metals: iron (Fe) , nickel (Ni) , Chromium (Cr) , Silicon (Si) , Aluminum (Al) . The metallic particles are in particular magnetic particles and may be referred to as metal-magnetic particles. The matrix material is preferably an electric non-conducting material . For example , the matrix material comprises of silicone , an epoxy material and / or a suitable polymer .

[0012] Preferably, the metallic particles do not form a conductive path . That is in particular, i f the conductor is supplied with current during operation, the mold material does not conduct the current to an outer surface . Thus the mold body may be non-conducting in total .

[0013] Providing the mold body with metallic particles advantageously improves the magnetic properties of the inductive component .

[0014] Further preferably, the core element is formed with a magnetic material . In particular the core is non-conductive .

[0015] In particular by combining the metallic particles of the mold body with a magnetic core element , a magnetic saturation flux density of the inductive component can be increased . Thereby, losses can be reduced, in particular when the inductive component is operated with a high frequency current .

[0016] Furthermore , the increased magnetic saturation flux density of the inductive component may lead to an increased saturation current .

[0017] Furthermore , the inductive component described herein shows a particularly low direct current resistance and a so-called soft saturation characteristic . For example , the direct current resistance is 0 . 2 mQ or less or 0 . 1 mQ or less .

[0018] The inductive component advantageously also features a comparably high saturation current . The saturation current is the current at which the inductance drops to a certain percentage of its initial or nominal value . Typical speci fications are 70% or 90% of the initial value . The operational current is a current by which the inductive component is operated . The maximal value of the inductance of the inductive component is typically at an operational current of 0 A and is , for example in a range between 40 nH and 200 nH . Alternatively, the maximal value of the inductance may be 40 nH or 100 nH or 200 nH or more . That is , the inductive component shows its maximal value i f no current is applied .

[0019] Moreover, a soft saturation characteristic can mean that the inductance of the inductive component as a function of the operational current moderately decreases with increasing operational current . Preferably, the inductance shows the moderate decrease in the vicinity of the saturation current and at operational currents higher than the saturation current . In contrast , materials or components with a so- called hard saturation characteristic show an abrupt decrease in inductivity when approaching the operational current .

[0020] Preferably, the conductor comprises a comparably large width and / or thickness . In particular, the conductor comprises a material showing a comparably large electric conductivity . For example , the conductor is a broad and thick conductor comprising copper . This allows for a particular large operational current . For example , the operational current can be up to 10 A or up to 100 A or more .

[0021] Advantageously, this allows the inductive component to improve magnetic properties compared to common inductors , while keeping the volume of the inductive component the same as with common inductors , or to reduce the volume of the inductive component while keeping magnetic properties the same .

[0022] In a preferred embodiment the inductive component exclusively consists of the core element , the conductor, and the mold body . This allows for a si ze reduction and complexity reduction of the inductive component . At the same time , improved magnetic properties , like improved saturation characteristics , can be achieved due to the mold body and the core element .

[0023] Preferably, the core element has a dumbbell shape . The dumbbell shape is formed by a bar connecting two solids . Preferably, the dumbbell shape is symmetrical with respect to a plane running through the bar and perpendicular to a main extension direction of the bar . In particular, the bar and the solids are one piece . That is , the bar and the solids preferably comprise the same materials and can only be separated by destroying the core element . The solids and / or the bar have , for example , the geometric shapes of rectangular solids , cubes or cylinders . In a top view of the core element , the core element may have the shape of an H . Hence , the core element may be a so-called H-core .

[0024] The conductor is preferably arranged at the bar . Preferably but not mandatorily the conductor is arranged over the bar . For example , the conductor comprises the same width as the bar . This means that , in a top view of the core element , the conductor may completely cover the bar so that the conductor is located between the solids . Preferably, the solids are free of the conductor . For example , a front surface of the bar facing a front surface of the inductive component and side surfaces of the bar facing side surfaces of the inductive component are at least partially or fully covered by the conductor .

[0025] In particular, at least one side of the bar is free of the conductor . That is in particular that at least said side is not covered by or in contact with the conductor . For example , said side is a back side of the bar facing back side of the inductive component .

[0026] For example , the conductor forms a strap over the bar . In particular, the conductor is arranged at the bar without a complete turn .

[0027] For example , the conductor is in direct contact with the bar . It is also possible that one or more intermediate layers such as an electrically insulating layer or an airgap is arranged between the bar and the conductor . The insulating layer may be part of the conductor .

[0028] The front side of the inductive component , the side surfaces of the inductive component , and the back side of the conductive component are preferably outer surfaces of the inductive component that may be freely accessible from the outside .

[0029] Preferably a region where the conductor is arranged at the core element is arranged at a distance from outer surfaces of the inductive component . The conductor preferably extends from at least one of the outer surfaces of the inductive component to the region where the conductor is arranged at the core element . In particular, the conductor is arranged at the bar . At the region where the conductor is arranged at the core element , the conductor may be in indirect contact or preferably in direct contact with the core . The region where the conductor is arranged at the core element is in particular the contact region .

[0030] For example , the conductor is accessible from the outside . In turn, the region where the conductor is arranged at the core , for example the bar, is preferably not accessible from the outside . The distance between the region where the conductor is arranged at the core and the outer surfaces is preferably filled with the mold body .

[0031] It is possible that the mold body is a housing of the inductive component . In this case , a dedicated housing, for example made of a plastic, can be omitted . This simpli fies the construction of the inductive component and helps to reduce the volume of the conductive component .

[0032] In a preferred embodiment , or in one of the above-mentioned embodiments , the mass fraction of the metallic particles on the mold body is at least 80 wt . % or at least 85 wt . % or at least 90 wt . % or at least 95 wt . % . A comparably high magnetic saturation flux density can be achieved by a particularly high mass fraction of the metallic particles on the mold body . Thus , protected properties of the inductive components can be improved .

[0033] In a further embodiment , or in one of the above-mentioned embodiments , the conductor comprises a wire or lead- frame . The wire is preferably a flat wire . Preferably, the wire or the lead- frame are comparably thick and broad such that a comparably large current can be applied to the conductor . For example , the conductor is formed as a strap or the like .

[0034] In particular, the conductor is arranged at the core without a complete turn . It is possible that the conductor is electrically insulated from the core element and the mold body . For example , the conductor is a wire or anything comprising an electrically insulating coating . Preferably however, the core element and the mold body are of a nonconducting material .

[0035] The wire or lead- frame preferably comprises a metal with a comparably high electrical conductivity . For example , the conductor comprises copper . The insulating coating preferably comprises an electrically insulating material and comprises , for example , a polymer .

[0036] In another embodiment of the inductive component , or one of the above-mentioned embodiments , the side surface and the front surface of the inductive component and made of the mold body . That is , from the outside the mold body is directly accessible as the outer surfaces of the inductive component , i . e . , the mold body is the surface of the inductive component . This allows complexity and volume of the inductive component to be reduced .

[0037] Preferably, the back surface of the inductive component is only partially made of the mold body or is free of the mold body . This means in particular that there is at least one region at the back surface of the inductive component that is not made of the mold body . For example , the back surface is partially made of the core element and / or the conductor . That is , at the back surface the core element and / or the conductor may be freely accessible . This can increase heat dissipation from the conductor during operation .

[0038] During operation of the inductive component , the conductor is preferably supplied with current . Since the conductor preferably has the shape of a strap, a magnetic field is established by the conductor during operation . This magnetic field in particular runs through the core element and the mold body . The operational current may typically be 10 A or more . This induces a strong magnetic field in the core element and the mold body . Due to the comparably high saturation current , the current flowing through the conductor can be signi ficantly higher compared to common inductors .

[0039] According to a further embodiment or one of the above- mentioned embodiments , the inductive component comprises an electrical contact structure electrically connected to the conductor . The electrical contact structure is configured to supply the inductive component , in particular the conductor, with current during operation . Thus , the electrical contact structure is externally accessible . The electronic contact structure in particular allows to externally contact the inductor with a relatively low contact resistance , for example to a printed circuit board .

[0040] The electric contact structure comprises , for example , at least one flat contact surface . The contact surface is configured for surface mounting of the inductive component . The contact surface may be arranged at the back surface of the inductive component . For example , the inductive component may be mounted to a carrier such as a printed circuit board or a sub-mount for application . For example , the inductive component may be soldered or glued to the carrier or printed circuit board . In particular, the flat contact surface is a solderable surface . In the case that the inductive component is glued, an electrically conductive glue can be used . In an example , the electrical contact surface may have a width and a length each of between 1 mm and 2 mm . These dimensions allow for an easy assembly of the inductive component . It is also possible that the electric contact surfaces may have a smaller or greater width or length . The geometrical dimensions of the contact surface in particular depend on the application, where the inductive component may be used .

[0041] Alternatively, the electric contact structure may comprise at least one contact pin . The contact pin may be arranged at the back side of the inductive component . The pin may be plugged in a corresponding contact hole of a carrier or printed circuit board for mounting the inductive component . The hole may be a solder point of the printed circuit board . That is , the contact pin may be connected to the printed circuit board by means of soldering .

[0042] Preferably, the electric contact structure and the conductor are made as one piece . In particular, the contact structure and the conductor comprise the same materials and may be formed in a common manufacturing step . In the case that the contact structure comprises a contact surface , the contact surface may be a freely accessible surface of the conductor .

[0043] The base area of the inductive component is , for example , between 10 mm^ and 400 mm^ . For example , a length and width of the base area are each between 3 mm and 20 mm . The base area is in particular an area of the bottom surface of the inductive component . In an example the width of the base layer is about 7 mm and the length of the baser layer is about 7 mm .

[0044] For example , a height of the inductive component is in a range from 1 mm to 10 mm . For example , the height is at most 4 mm or at most 2 mm . The height is for example a dimension of the inductive component measured between the back surface and the front surface . That is , the height is measured in a direction orthogonal to the base area or the back surface or the front surface .

[0045] In particular, the geometric dimensions of the inductive component are not limited to the above-mentioned examples . The inductive component described herein advantageously allows constructing a component with a particular small , especially flat geometric dimensions .

[0046] For example , a maximal inductance of the inductive component is at least 80 nH or at least 100 nH or at least 200 nH . The maximal inductance is an inductance of the inductive component i f no current , or essentially no current , is applied to the inductive component . However, it is also possible to even achieve higher or lower maximal inductances depending on, for example , the si ze of the inductive component . In particular, the maximal inductance may be determined by the application the inductive component is used in .

[0047] The saturation current of the inductive component may be at least 40 A. For example , the saturation current is at least 50 A or at least 60 A or at least 70 A or at least 80 A or at least 100 A. For example , the saturation current is in a range between 40 A and 100 A. However, it is also possible to even achieve higher or lower saturation currents depending on, for example, the size of the inductive component. In particular, the saturation current may be determined by the application the inductive component is used in.

[0048] Hence, the inductive component can comprise a relatively large saturation current, while at the same time having a relatively small volume. For example, the inductive component may comprise a comparably small height. The relatively high saturation current is of particular advantage in modern applications that are supplied with low voltage but high current to achieve a high power for the application.

[0049] With the inductive component described herein it is advantageously possible to cover a variety of possible applications with only minor changes of the inductive component with respect to, for example size of the inductive component, maximal inductance, operational current, saturation current. This is in particular possible since the inductive component comprises comparably few elements and thus reduced complexity.

[0050] The inductive component may comprise a direct current resistance of at most 0.2 mQ. For example, the direct current resistance is at most 0.1 mQ. Losses, i.e., thermal losses, can be reduced during operation of the inductive component. The inductive component can be operated more efficiently by such a low resistance. In particular, if the inductive component is used in a high frequency application, the low resistance is of particular advantage to reduce losses.

[0051] For example, at an operational current of in a range between

[0052] 40 A and 100 A the inductive component comprises an inductance of at least 50 % of its maximum inductance . In particular, an operational current in the range between 40 A and 100 A is larger than the saturation current . It is also possible that at a current of 40 A or 100 A or even at higher currents than 100 A the inductive component comprises an inductance of at least 50 % .

[0053] In particular, as a function of the operational current the inductance does not abruptly decrease at the saturation current . In contrast , as a function of the operational current the inductance shows a moderate decrease with increasing operational current . That is , the inductive component has a soft saturation characteristic .

[0054] The core element preferably comprises iron or an iron alloy . For example , the core element comprises iron ( Fe ) and at least one of the following materials : silicon ( Si ) , nickel (Ni ) , chromium ( Cr ) , aluminum (Al ) . The core element may comprise for example of a Fe-Si alloy, a Fe-Ni alloy or a Fe- Cr-Si alloy . Losses caused by the core element can be reduced and a high magnetic saturation flux density of the inductive component can be reali zed with these materials .

[0055] It is possible that the core element comprises a metallic composite material or is made of a metallic composite material at least comprising iron . In this case the core element is also called a composite core element .

[0056] Alternatively, the core element may comprise a ferrite .

[0057] The conductor preferably comprises copper ( Cu) or aluminum (Al ) . Alternatively, the conductor may comprise an alloy comprising at least one of Cu or Al . Copper and aluminum each comprise a relatively high thermal and electrical conductivity and are therefore suitable for the conductor of the inductive component .

[0058] Further advantages and advantageous embodiments and further developments of the inductive component described herein will become apparent from the following exemplary embodiments shown in connection with schematic drawings . Identical elements , elements of the same kind or elements having the same ef fect , are provided with the same reference signs in the figures . The figures and the proportions of the elements shown in the figures are not to be regarded as true to scale . Rather, individual elements may be shown exxageratedly large for better representability and / or for better comprehensibility .

[0059] In the figures :

[0060] Figure 1 shows a perspective view of an inductive component described here according to a first exemplary embodiment .

[0061] Figure 2 shows a side view of a core element for the inductive component according to the first exemplary embodiment .

[0062] Figures 3 to 5 show di f ferent schematic sectional views of the inductive component according to the first exemplary embodiment .

[0063] Figure 6 shows a top view of the inductive component according to the first exemplary embodiment . Figure 7 shows a side view of the inductive component according to the first exemplary embodiment .

[0064] Figure 8 shows a back view of the inductive component according to the first exemplary embodiment .

[0065] Figure 9 illustrates a mold body for the inductive component according to the first exemplary embodiment .

[0066] Figure 10 shows a graphical representation of the inductive component according to the first exemplary embodiment and two comparative examples .

[0067] Figure 11 shows a schematic section view of an inductive component according to a second exemplary embodiment .

[0068] Figure 1 shows a schematic perspective view of an inductive component 1 according to a first exemplary embodiment . In Figure 1 a mold body 4 of the inductive component 1 is shown as semi-transparent for illustration purposes .

[0069] The inductive component 1 comprises a core element 2 and a conductor 3 . The conductor 3 partially surrounds the core element 2 in a contact region 5 .

[0070] The core element 2 is shown in a side view in Figure 2 . The core element 2 has the shape of a dumbbell , wherein a bar 6 connects solids 7 , 8 . The solids 7 , 8 and the bar 6 are formed in one piece . The core element 2 comprises iron or an iron alloy . Preferably the core element 2 comprises a comparatively large permeability . The contact region 5 of the core element 2 is located at the bar 6 . That is , the conductor 3 at least partially covers the bar 6 ( Figure 1 ) . In particular a front surface 61 of the bar 6 and side surfaces 62 of the bar 6 are covered by the conductor 3 . A back surface 64 of the bar 6 opposite to the front surface 61 is free of the conductor 3 . The solids 7 , 8 are also free of the conductor 3 .

[0071] The contact region 5 is spaced apart from the surfaces of the inductive component 1 . The conductor 3 extends from at least one of the surfaces of the inductive component 1 to the contact region 5 .

[0072] The conductor 3 comprises copper or a copper alloy . The conductor 3 is a flat wire with a comparably large thickness for example between 0 . 5 mm and 1 mm . A comparably large current can be applied to the conductor 3 during operation .

[0073] The conductor 3 and the core element 2 are partially surrounded by a mold body 4 . In particular, the inductive component 1 consists of the core element 2 , the conductor 3 and the mold body 4 .

[0074] Outwardly exposed surfaces of the inductive component 1 are at least partially formed by the mold body 4 . That is , the mold body 4 is a housing or at least partially forms a housing of the inductive component 1 . Thus , the inductive component 1 is simple in construction .

[0075] The mold body 4 comprises metallic particles 41 in a matrix material 42 ( Figure 9 ) . The matrix material 42 is , for example , silicone , epoxy or a polymer material and is electrically insulating . The metallic particles 41 of the mold body 4 comprise for example at least one of the following metals: iron (Fe) , nickel (Ni) , Chromium (Cr) , Silicon (Si) , Aluminum (Al) . A mass fraction of the metallic particles 41 on the mold body 4 is at least 80 wt . % .

[0076] The mold body 4 and the core element 2 are preferably electrically non-conducting.

[0077] Figure 3 shows a schematic sectional view of the inductive component 1. A sectional plane is perpendicular to a front surface 11 and a back surface 14 of the inductive component 1 and perpendicular to a side surface 12 of the inductive component 1. Moreover, the sectional plane includes a main extension direction of the conductor 3.

[0078] As can be seen from Figure 3, the contact region 5 where the conductor 3 is in mechanical contact with the core element 2 is spaced apart from all outer surfaces 11, 12, 14 of the inductive component 1. Furthermore, the conductor 3 forms a strap around the core element 2, in particular around the bar 6.

[0079] In particular, at least one side of the bar 6 is free of the conductor 3. That is in particular that at least said side is not covered by or in contact with the conductor 3. For example, said side is a back side of the bar facing back side 14 of the inductive component 1.

[0080] For example, the conductor 2 forms a strap over the bar. In particular, the conductor 3 is arranged at the bar 6 without a complete turn. The inductive component 1 comprises an electrical contact structure 9 for external electrical contacting . The contact structure 9 and the conductor 3 are formed in one piece . The contact structure 9 is freely accessible from the outside of the inductive component 1 .

[0081] The contact structure 9 comprises a flat contact surface 91 . The flat contact surface 91 allows the inductive component to be surface mounted on a carrier such as a printed circuit board with a low contact resistance . The flat contact surface 91 is arranged at the back surface 14 of the inductive component 1 .

[0082] Figure 4 shows the inductive component 1 according to the first exemplary embodiment in another sectional view, wherein the sectional plane is perpendicular to the sectional plane of Figure 3 and perpendicular to the front surface 11 .

[0083] Figure 5 shows the inductive component 1 according to the first exemplary embodiment in a further sectional view, wherein the sectional plane is perpendicular to the sectional planes of Figures 3 and 4 .

[0084] Figures 4 and 5 illustrate that the core element 2 comprises a dumbbell shape and that the contact region 5 where the conductor 3 is in mechanical contact with the core element 2 is spaced apart from outer surfaces 11 , 12 , 14 of the inductive component 1 .

[0085] Furthermore , Figure 5 shows that the core element 2 comprises the shape of an H or a bone in the sectional view of Figure 5 . Therefore , the core element 5 may also be referred to as

[0086] H-core or bone core . Figure 6 shows the inductive component 1 according to the first exemplary embodiment in a top view on the front surface 11 . Figure 7 shows a side view on a side surface 12 of the conductive component 1 according to the first exemplary embodiment . Figure 8 shows a bottom view on the back surface 14 of the inductive component 1 according to the first exemplary embodiment .

[0087] In the present exemplary embodiment , the inductive component 1 comprises a length 16 of , for example , 7 mm and a width 17 of , for example , 6 mm . That is , a base area of the inductive component is 42 mm2 . Theinductive component further comprises a height 15 of 3 . 5 mm . A volume of the inductive component 1 is therefore below 150 mm^ . Hence , the inductive component 1 is relatively small , especially in height .

[0088] As shown in Figure 8 , the contact surfaces 91 each comprise a length 93 of about 1 . 5 mm and a width 94 of about 1 mm . This allows for an easy assembly of the inductive component 1 , for example by soldering .

[0089] An operational current is applied to the conductor 3 during operation of the inductive component 1 , for example at the contact structures 9 . The operational current generates a magnetic field in the core element 2 due to the strap-shape of the conductor 3 around the bar 6 of the core element 2 .

[0090] The magnetic field can be relatively strong . Furthermore , due to a comparably large magnetic saturation flux density of the mold body 4 which results from the metallic particles 41 of the mold body 4 , and the core element 2 , the inductive component 1 has a relatively large magnetic saturation flux density and thus improved magnetic properties . For example , a saturation current can be comparably high, and a saturation characteristic can be soft .

[0091] Figure 10 illustrates saturation characteristics of the inductive component 1 and two comparative examples . The saturation characteristic is given by the inductance 21 in nH of any inductive component as a function of operational current 20 in A. In Figure 10 , the curve 101 corresponds to the inductive component 1 according to the first exemplary embodiment . The curve 102 refers to a first comparative example that is a ferrite inductor . The curve 103 refers to a second comparative example that is a metal composite inductor .

[0092] The inductive component 1 and comparative examples show its maximal inductance 22 at an operational current of zero or essentially zero . A saturation current is the operational current 20 at which the inductance 21 has 70 % of its maximal value 22 . The inductive component 1 has a saturation current of approximately 75 A and a maximal inductance of approximately 100 nH .

[0093] The inductive component 1 has a soft saturation characteristic . That is , the curve 101 moderately decreases with increasing operational current 20 . In particular, at an operational current of 100 A the inductive component 1 still has more than 50% of its maximal inductance 22 .

[0094] This contrasts with the comparative examples . The first comparative example does not show a soft saturation characteristic as the inductance 21 abruptly decreases at the saturation current ( compare curve 102 ) . The second comparative example shows a soft-like saturation characteristic, but the decrease in inductance 21 with increasing operational current 20 is larger than the decrease of the inductive component 1 ( compare curve 103 ) . That is , the curve 101 corresponding to the inductive component 1 has the lowest gradient of the curves 101 , 102 , 103 in a region around and past the saturation current .

[0095] Furthermore , the inductive component according to the first exemplary embodiment has a direct current resistance of approximately 0 . 2 mQ . Resistance losses , especially in high frequency applications , can be reduced by a low direct current resistance . The first comparative example has a direct current resistance of about 0 . 3 mQ and the second comparative example has a direct current resistance of about 1 . 5 mQ .

[0096] Hence , the inductive component 1 described herein has the lowest direct current resistance and an improved saturation characteristic compared to the comparative examples .

[0097] At the same time the inductive component 1 comprises a comparably small volume , in particular a comparably small height . The inductive component 1 according to the first exemplary embodiment comprises a volume of about 150 mm^ . The first comparative example comprises a total volume of about 200 mm^ancppesecond comparative example comprises a total volume of about 145 mm^ . That is , the inductive component 1 described herein shows improved magnetic properties at a smaller or comparable volume consumption than comparative inductors .

[0098] Figure 11 shows a schematic sectional view of an inductive component 1 according to a second exemplary embodiment . The sectional plane of Figure 11 is identical to the sectional plane of Figure 3 .

[0099] The inductive component 1 according to the second exemplary embodiment di f fers from the inductive component 1 according to the first exemplary embodiment in that the contact structure 9 comprises contact pins 92 . The contact pins 92 can be arranged in contact holes of a printed circuit board to assemble the inductive component 1 .

[0100] Furthermore , the inductive component 1 according to the second exemplary embodiment di f fers from the inductive component 1 according to the first exemplary embodiment in that , additionally to the front surface 11 , the side surfaces 12 are formed with the mold body 4 .

[0101] The invention is not restricted to the exemplary embodiments by the description on the basis of said exemplary embodiments . Rather, the invention encompasses any new feature and also any combination of features which in particular comprises any combination of features in the patent claims and any combination of features in the exemplary embodiments , even i f this feature or this combination itsel f is not explicitly speci fied in the patent claims or exemplary embodiments .

[0102] References

[0103] 1 inductive component

[0104] 2 core element

[0105] 3 conductor

[0106] 4 mold body

[0107] 5 contact region

[0108] 6 bar

[0109] 7 , 8 solids

[0110] 9 electrical contact structure

[0111] 11 front surface of inductive component

[0112] 12 side surfaces of inductive component

[0113] 14 back surface of inductive component

[0114] 15 height of the inductive component

[0115] 16 length of the base area of the inductive component

[0116] 17 width of the base area of the inductive component

[0117] 20 operational current

[0118] 21 inductance

[0119] 22 maximal inductance

[0120] 41 metallic particles

[0121] 42 matrix material

[0122] 61 front surface of bar

[0123] 62 side surfaces of bar

[0124] 64 back surface of bar

[0125] 91 contact surface

[0126] 92 contact pin

[0127] 93 length of contact surface

[0128] 94 width of contact surface

[0129] 101 curve referring to the inductive component

[0130] 102 curve referring to a first comparative example

[0131] 103 curve referring to a second comparative example

Claims

Claims1. Inductive component (1) comprising a core element (2) from a magnetic material, a conductor (3) and a mold body( 4 ) , wherein- the conductor (3) is arranged at least partially around the core element (2) ,- the mold body (4) comprises metallic particles (41) in a matrix material (42) and surrounds the core element (2) and the conductor (3) at least partially.

2. Inductive component (1) according to claim 1, wherein the inductive component (1) exclusively consists of the core element (2) , the conductor (3) , and the mold body (4) .

3. Inductive component (1) according to claim 1 or 2, wherein the core element (2) has a dumbbell shape formed by a bar (6) connecting two solids (7, 8) , wherein the conductor (3) is arranged at the bar (6) .

4. Inductive component (1) according to claim 3, wherein- a front surface of the bar (61) facing a front surface of the inductive component (11) , and side surfaces of the bar (62) facing side surfaces of the inductive component (12) are at least partially covered by the conductor (3) .

5. Inductive component (1) according to one of the preceding claims, wherein a region where the conductor (3) is arranged at the core element (2) is arranged at a distance from outer surfaces of the inductive component (11, 12, 13, 14) , and the conductor (3) extends from at least one other surface of the inductive component (11, 12, 13, 14) to theregion where the conductor (3) is arranged at the core element ( 2 ) .

6. Inductive component (1) according to one of the preceding claims, wherein a mass fraction of the metallic particles (41) on the mold body (4) is at least 80 wt . % .

7. Inductive component (1) according to one of the preceding claims, wherein the conductor (3) comprises a wire or lead-frame.

8. Inductive component (1) according to one of the preceding claims, wherein side surfaces (12, 13) and a front surface (11) of the inductive component (1) are made of the mold body ( 4 ) .

9. Inductive component (1) according to one of the preceding claims, wherein a back surface of the inductive component (14) is partially made of the mold body (4) .

10. Inductive component (1) according to one of the preceding claims, further comprising an electrical contact structure (9) electrically connecting the conductor (3) , wherein the electrical contact structure (9) is externally accessible .

11. Inductive component (1) according to claim 10, wherein the electrical contact structure (9) comprises at least one flat contact surface (91) configured for surface mounting of the inductive component (1) .

12. Inductive component (1) according to claim 10, wherein the electrical contact structure (9) comprises at least one contact pin ( 92 ) .

13. Inductive component (1) according to one of claims 10 to 12, wherein the contract structure (9) and the conductor (3) are made as one piece.

14. Inductive component (1) according to one of the preceding claims, wherein a base area of the inductive component is between 10 mm2and 400 mm2and a height (15) of the inductive component (1) is between 1 mm and 10 mm.

15. Inductive component (1) according to one of the preceding claims, wherein a direct current resistance of the inductive component (1) is at most 0.2 mQ.

16. Inductive component (1) according to one of the preceding claims, wherein at an operational current (20) in a range between 40 A and 100 A the inductive component (1) comprises an inductance (21) of at least 50% of its maximal inductance (22) .

17. Inductive component (1) according to one of the preceding claims, wherein th< core element (2) comprises iron or an iron alloy.

18. Inductive component (1) according to one of the preceding claims, wherein the conductor (3) comprises copper or aluminum or an alloy comprising at least one of copper or aluminum.

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